WO2017173676A1 - Cof结构、驱动电路及显示装置 - Google Patents

Cof结构、驱动电路及显示装置 Download PDF

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Publication number
WO2017173676A1
WO2017173676A1 PCT/CN2016/080034 CN2016080034W WO2017173676A1 WO 2017173676 A1 WO2017173676 A1 WO 2017173676A1 CN 2016080034 W CN2016080034 W CN 2016080034W WO 2017173676 A1 WO2017173676 A1 WO 2017173676A1
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Prior art keywords
film body
bonding
driving
disposed
cof
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English (en)
French (fr)
Inventor
赵锋
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TCL China Star Optoelectronics Technology Co Ltd
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Shenzhen China Star Optoelectronics Technology Co Ltd
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Priority to US15/119,130 priority Critical patent/US20170287380A1/en
Publication of WO2017173676A1 publication Critical patent/WO2017173676A1/zh
Anticipated expiration legal-status Critical
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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters

Definitions

  • the present invention relates to the field of display, and in particular to a COF structure, a driving circuit, and a display device.
  • FIG. 1 is a schematic structural view of a conventional COF structure
  • FIG. 2 is a schematic diagram of an arrangement structure of a plurality of COF structures.
  • the existing COF structure 10 generally includes only one driving chip 11, and each COF structure is provided with a bonding lead 12 and a bonding mark 13 for bonding with the peripheral data line, and the bonding mark 13 is used to locate the bonding operation of the COF structure.
  • a certain gap needs to be reserved between the bonding lead 12 and the bonding mark 13, and a certain gap needs to be reserved between the bonding mark 13 and the edge of the COF structure 10 to ensure the COF operation. stability. At the same time, a safe distance should be reserved between adjacent COF structures 10 to avoid the mutual influence of adjacent COFs.
  • the spacing between the existing adjacent COF structures 10 is large, and it is unable to meet the requirements of the small-pitch driving chips of the existing high-resolution display panels.
  • the object of the present invention is to provide a COF structure, a driving circuit and a display device which are required to have a large pitch between COFs and can be adapted to a small-pitch driving chip of an existing high-resolution display panel to solve the existing COF structure.
  • the spacing between adjacent COFs of the driving circuit and the display device is large, and it cannot meet the technical problems required by the small-pitch driving chip of the existing high-resolution display panel.
  • An embodiment of the present invention provides a COF structure, including:
  • a bonding lead disposed on an upper side or a lower side of the film body for bonding an external signal line to a lead of the driving chip
  • a bonding mark is disposed on a side of the film body for performing a positioning operation on the film body of the bonding operation.
  • the distance between two of the driving chips on the same film body is smaller than the distance between adjacent COF structures.
  • the number of the bonding leads corresponding to the two driving chips on the same film body is the same.
  • the number of the bonding leads corresponding to the two driving chips on the same film body is different.
  • the bonding mark is disposed on the left side of the film body.
  • the bonding mark is disposed on the right side of the film body.
  • the bonding marks are disposed on the left and right sides of the film body.
  • the embodiment of the invention further provides a driving circuit for driving a display panel, which comprises a COF structure, comprising:
  • a bonding lead disposed on an upper side or a lower side of the film body for bonding an external signal line to a lead of the driving chip
  • a bonding mark is disposed on a side of the film body for performing a positioning operation on the film body of the bonding operation.
  • the distance between two of the driving chips on the same film body is smaller than the distance between adjacent COF structures.
  • the number of the bonding leads corresponding to the two driving chips on the same film body is the same.
  • the number of the bonding leads corresponding to the two driving chips on the same film body is different.
  • the bonding mark is disposed on the left side of the film body.
  • the bonding mark is disposed on the right side of the film body.
  • the bonding marks are disposed on the left and right sides of the film body.
  • the embodiment of the present invention further provides a display device, including a display panel and a driving circuit, wherein the driving circuit includes: a COF structure, including:
  • a bonding lead disposed on an upper side or a lower side of the film body for bonding an external signal line to a lead of the driving chip
  • a bonding mark is disposed on a side of the film body for performing a positioning operation on the film body of the bonding operation.
  • the number of the bonding leads corresponding to the two driving chips on the same film body is the same.
  • the number of the bonding leads corresponding to the two driving chips on the same film body is different.
  • the bonding marks are disposed on the left side and/or the right side of the film body.
  • the display panel is a curved display panel.
  • the driving circuit and the display device are provided with at least two driving chips on the same film body, which reduces the spacing between the COFs, and can be adapted to the present
  • Some high-resolution display panels have small pitch drive chip requirements; solve the gap between adjacent COFs of existing COF structures, drive circuits and display devices, and cannot adapt to existing high-resolution displays.
  • the small pitch of the panel drives the technical issues required by the chip.
  • FIG. 1 is a schematic structural view of a conventional COF structure
  • FIG. 2 is a schematic view showing an arrangement structure of a plurality of COF structures
  • FIG. 3 is a schematic structural view of a preferred embodiment of a COF structure of the present invention.
  • FIG. 4 is a schematic view showing the arrangement structure of a plurality of COF structures of the present invention.
  • FIG. 3 is a schematic structural view of a preferred embodiment of a COF structure according to the present invention
  • FIG. 4 is a schematic view showing an arrangement structure of a plurality of COF structures according to the present invention.
  • the COF structure 20 of the preferred embodiment includes a film body 21, at least two drive chips 22, bonding leads 23, and bonding marks 24.
  • At least two driving chips 22 are disposed on the same film body 21 for generating driving signals; the bonding wires 23 are disposed on the upper side or the lower side of the film body 21 for bonding the external signal lines and the leads of the driving chip 22
  • the bonding mark 24 is disposed on the side of the film body 21 for positioning the film body 21 of the bonding operation.
  • the distance between the two drive chips 22 on the same film body 21 is smaller than the distance between adjacent COF structures 20.
  • Such a same area can be provided with more drive chips 22.
  • the number of bonding leads 23 corresponding to the two driving chips 22 on the same film body of the COF structure 20 of the preferred embodiment may be the same or different. Specifically, it can be set according to the requirements of the user.
  • the COF structure 20 of the preferred embodiment may also be provided with a bonding mark 24 on the left and/or right side of the film body 21 for subsequent bonding operation of the external signal lines.
  • the film body 21 of the COF structure 20 can be positioned by the bonding mark 24, and then the external signal line and the bonding wire 23 are directly used for bonding operation to realize the external signal line and The lead wires of the driving chip 22 are connected.
  • the length a1 of the existing COF structure 10 in FIG. 2 is 42000 um
  • the distance b1 of the adjacent COF structure 10 is 51040 um
  • the adjacent edge distance c1 of the adjacent COF structure 10 is 9040 um. Therefore, the adjacent edges of adjacent COF structures 10 are closer together.
  • the length a2 of the COF structure 20 of the preferred embodiment in FIG. 4 is 63660um
  • the distance b2 of the adjacent COF structure 20 is 102080um
  • the adjacent edge distance c2 of the adjacent COF structure 20 is 38420um.
  • the adjacent edge distance c2 of the adjacent COF structure 20 is much larger than the adjacent edge distance c1 of the adjacent COF structure 10. If the COF structure 20 of the preferred embodiment is set at a safe distance of 9040 um, more COF structures 20 may be provided in the same area or set length. Therefore, the COF structure 20 of the preferred embodiment has better stability and can better meet the requirements of the small-pitch driver chip of the existing high-resolution display panel.
  • the COF structure of the preferred embodiment has at least two driving chips disposed on the same film body, which reduces the spacing between the COFs, and can adapt to the requirements of the small-pitch driving chips of the existing high-resolution display panels.
  • the present invention also provides a driving circuit for driving a display panel including a COF structure including a film body, at least two driving chips, bonding leads, and bonding marks.
  • At least two driving chips are disposed on the same film body for generating a driving signal; the bonding wires are disposed on an upper side or a lower side of the film body for bonding the external signal lines to the leads of the driving chip; Markers are provided on the sides of the film body for positioning operations on the film body of the bonding operation.
  • the distance between two of the driving chips on the same film body is smaller than the distance between adjacent COF structures.
  • the number of the bonding leads corresponding to the two driving chips on the same film body is the same or different.
  • the bonding marks are disposed on the left side and/or the right side of the film body.
  • the present invention also provides a display device comprising a display panel and a driving circuit, the driving circuit comprising a COF structure comprising a film body, at least two driving chips, bonding leads and bonding marks.
  • At least two driving chips are disposed on the same film body for generating a driving signal; the bonding wires are disposed on an upper side or a lower side of the film body for bonding the external signal lines to the leads of the driving chip; Markers are provided on the sides of the film body for positioning operations on the film body of the bonding operation.
  • the display device of the present invention is preferably a curved display device. Since the display device of the present invention uses a small number of COF structures at the same resolution, and the adjacent pitch of the COF structure is large, the curved display panel can be preferably avoided. The technical problem of COF structure damage caused by the excessively small COF structure spacing greatly improves the product yield of the display device.
  • the COF structure, the driving circuit and the display device of the invention are provided with at least two driving chips on the same film body, which reduces the spacing between the COFs, and can adapt to the requirements of the small-pitch driving chip of the existing high-resolution display panel;
  • the existing COF structure, the driving circuit and the adjacent COF of the display device have a large spacing, and cannot meet the technical requirements of the small-pitch driving chip of the existing high-resolution display panel.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Liquid Crystal (AREA)

Abstract

一种COF结构（20），其包括薄膜本体（21）、至少两个驱动芯片（22）、邦定引线（23）以及邦定标记（24）；至少两个驱动芯片（22）设置在同一薄膜本体（21）上，用于生成驱动信号；邦定引线（23）设置在薄膜本体（21）的上侧或下侧，用于将外部信号线与驱动芯片（22）的引线进行邦定连接；邦定标记（24）设置在薄膜本体（21）的侧边，用于对邦定操作的薄膜本体（21）进行定位操作。

Description

COF结构、驱动电路及显示装置 技术领域
本发明涉及显示领域，特别是涉及一种COF结构、驱动电路及显示装置。
 背景技术
随着科技的发展，人们对显示面板的设计要求也越来越高。现有的显示面板一般使用COF（Chip On Film，覆晶薄膜）进行驱动。
请参照图1和图2，图1为现有的COF结构的结构示意图，图2为多个COF结构的排列结构示意图。现有的COF结构10上一般只包括一个驱动芯片11，同时每个COF结构上均设置有邦定引线12以及邦定标记13，邦定引线12用于与外围数据线进行连接，邦定标记13用于对COF结构进行邦定操作的定位。
在同一COF结构10上，邦定引线12和邦定标记13之间需要预留一定的间隙，邦定标记13和COF结构10的边缘之间也需要预留一定的间隙，以保证COF工作的稳定性。同时相邻的不同COF结构10之间也应预留一安全距离，避免相邻的COF相互影响。
因此现有的相邻的COF结构10之间的间距较大，无法适应现有的高分辨率的显示面板的小间距驱动芯片的要求。
故，有必要提供一种COF结构、驱动电路及显示装置，以解决现有技术所存在的问题。
 技术问题
本发明的目的在于提供一种COF之间的间距较大，可适应现有的高分辨率的显示面板的小间距驱动芯片要求的COF结构、驱动电路及显示装置；以解决现有的COF结构、驱动电路及显示装置的相邻的COF之间的间距较大，无法适应现有的高分辨率的显示面板的小间距驱动芯片要求的技术问题。
 技术解决方案
本发明实施例提供一种COF结构，其包括：
薄膜本体；
至少两个驱动芯片，设置在同一所述薄膜本体上，用于生成驱动信号；
邦定引线，设置在所述薄膜本体的上侧或下侧，用于将外部信号线与所述驱动芯片的引线进行邦定连接；以及
邦定标记，设置在所述薄膜本体的侧边，用于对邦定操作的薄膜本体进行定位操作。
在本发明所述的COF结构中，同一所述薄膜本体上的两个所述驱动芯片之间的距离小于相邻的所述COF结构之间的距离。
在本发明所述的COF结构中，所述同一所述薄膜本体上的两个所述驱动芯片对应的所述邦定引线的数量相同。
在本发明所述的COF结构中，所述同一所述薄膜本体上的两个所述驱动芯片对应的所述邦定引线的数量不同。
在本发明所述的COF结构中，所述邦定标记设置在所述薄膜本体的左侧。
在本发明所述的COF结构中，所述邦定标记设置在所述薄膜本体的右侧。
在本发明所述的COF结构中，所述邦定标记设置在所述薄膜本体的左侧和右侧。
本发明实施例还提供一种驱动电路，用于驱动显示面板，其包括COF结构，包括：
薄膜本体；
至少两个驱动芯片，设置在同一所述薄膜本体上，用于生成驱动信号；
邦定引线，设置在所述薄膜本体的上侧或下侧，用于将外部信号线与所述驱动芯片的引线进行邦定连接；以及
邦定标记，设置在所述薄膜本体的侧边，用于对邦定操作的薄膜本体进行定位操作。
在本发明所述的驱动电路中，同一所述薄膜本体上的两个所述驱动芯片之间的距离小于相邻的所述COF结构之间的距离。
在本发明所述的驱动电路中，所述同一所述薄膜本体上的两个所述驱动芯片对应的所述邦定引线的数量相同。
在本发明所述的驱动电路中，所述同一所述薄膜本体上的两个所述驱动芯片对应的所述邦定引线的数量不同。
在本发明所述的驱动电路中，所述邦定标记设置在所述薄膜本体的左侧。
在本发明所述的驱动电路中，所述邦定标记设置在所述薄膜本体的右侧。
在本发明所述的驱动电路中，所述邦定标记设置在所述薄膜本体的左侧和右侧。
本发明实施例还提供一种显示装置，其包括显示面板以及驱动电路，其中所述驱动电路包括：COF结构，包括：
薄膜本体；
至少两个驱动芯片，设置在同一所述薄膜本体上，用于生成驱动信号；
邦定引线，设置在所述薄膜本体的上侧或下侧，用于将外部信号线与所述驱动芯片的引线进行邦定连接；以及
邦定标记，设置在所述薄膜本体的侧边，用于对邦定操作的薄膜本体进行定位操作。
在本发明所述的显示装置中，所述同一所述薄膜本体上的两个所述驱动芯片对应的所述邦定引线的数量相同。
在本发明所述的显示装置中，所述同一所述薄膜本体上的两个所述驱动芯片对应的所述邦定引线的数量不同。
在本发明所述的显示装置中，所述邦定标记设置在所述薄膜本体的左侧和/或右侧。
在本发明所述的显示装置中，所述显示面板为曲面显示面板。
 有益效果
相较于现有的COF结构、驱动电路及显示装置，本发明的COF结构、驱动电路及显示装置在同一薄膜本体上设置至少两个驱动芯片，减小了COF之间的间距，可适应现有的高分辨率的显示面板的小间距驱动芯片要求；解决了现有的COF结构、驱动电路及显示装置的相邻的COF之间的间距较大，无法适应现有的高分辨率的显示面板的小间距驱动芯片要求的技术问题。
 附图说明
图1为现有的COF结构的结构示意图；
图2为多个COF结构的排列结构示意图；
图3为本发明的COF结构的优选实施例的结构示意图；
图4为本发明的多个COF结构的排列结构示意图。
 本发明的最佳实施方式
以下各实施例的说明是参考附加的图式，用以例示本发明可用以实施的特定实施例。本发明所提到的方向用语，例如「上」、「下」、「前」、「后」、「左」、「右」、「内」、「外」、「侧面」等，仅是参考附加图式的方向。因此，使用的方向用语是用以说明及理解本发明，而非用以限制本发明。
在图中，结构相似的单元是以相同标号表示。
请参照图3和图4，图3为本发明的COF结构的优选实施例的结构示意图；图4为本发明的多个COF结构的排列结构示意图。本优选实施例的COF结构20包括薄膜本体21、至少两个驱动芯片22、邦定引线23以及邦定标记24。
至少两个驱动芯片22设置在同一薄膜本体21上，用于生成驱动信号；邦定引线23设置在薄膜本体21的上侧或下侧，用于将外部信号线与驱动芯片22的引线进行邦定连接；邦定标记24设置在薄膜本体21的侧边，用于对邦定操作的薄膜本体21进行定位操作。
如图4所示，同一薄膜本体21上的两个驱动芯片22之间的距离小于相邻的COF结构20之间的距离。这样同样的面积可以设置更多的驱动芯片22。
本优选实施例的COF结构20的同一薄膜本体上的两个驱动芯片22对应的邦定引线23的数量可以相同或不同。具体可以根据用户的要求进行设定。
本优选实施例的COF结构20还可在薄膜本体21的左侧和/或右侧设置邦定标记24，以便后续进行外部信号线的邦定操作。
本优选实施例的COF结构20使用时，可通过邦定标记24对COF结构20的薄膜本体21进行定位操作，然后直接使用外部信号线与邦定引线23进行邦定操作，实现外部信号线与驱动芯片22的引线连接。
请参照图2和图4，如图2中的现有COF结构10的长度a1为42000um，相邻COF结构10的距离b1为51040um，相邻COF结构10的相邻边缘距离c1为9040um。因此相邻COF结构10的相邻边缘距离较近。
而图4中的本优选实施例的COF结构20的长度a2为63660um，相邻的COF结构20的距离b2为102080um，相邻COF结构20的相邻边缘距离c2为38420um。在单位数量的驱动芯片22对应的COF结构20的距离相等的情况下，相邻COF结构20的相邻边缘距离c2远大于相邻COF结构10的相邻边缘距离c1。如以安全距离9040um设置本优选实施例的COF结构20，则在相同的面积或设置长度中可以设置更多的COF结构20。因此本优选实施例的COF结构20的稳定性更好，以及可以更好的适应现有的高分辨率的显示面板的小间距驱动芯片的要求。
因此本优选实施例的COF结构在同一薄膜本体上设置至少两个驱动芯片，减小了COF之间的间距，可适应现有的高分辨率的显示面板的小间距驱动芯片要求。
本发明还提供一种驱动电路，用于驱动显示面板，其包括COF结构，该COF结构包括薄膜本体、至少两个驱动芯片、邦定引线以及邦定标记。
至少两个驱动芯片设置在同一薄膜本体上，用于生成驱动信号；邦定引线设置在薄膜本体的上侧或下侧，用于将外部信号线与驱动芯片的引线进行邦定连接；邦定标记设置在薄膜本体的侧边，用于对邦定操作的薄膜本体进行定位操作。
优选的，同一所述薄膜本体上的两个所述驱动芯片之间的距离小于相邻的所述COF结构之间的距离。
优选的，所述同一所述薄膜本体上的两个所述驱动芯片对应的所述邦定引线的数量相同或不同。
优选的，所述邦定标记设置在所述薄膜本体的左侧和/或右侧。
本发明的驱动电路的具体工作原理与上述的COF结构的优选实施例中的描述相同或相似，具体请参见上述COF结构的优选实施例中的相关描述。
本发明还提供一种显示装置，其包括显示面板以及驱动电路，该驱动电路包括COF结构，该COF结构包括薄膜本体、至少两个驱动芯片、邦定引线以及邦定标记。
至少两个驱动芯片设置在同一薄膜本体上，用于生成驱动信号；邦定引线设置在薄膜本体的上侧或下侧，用于将外部信号线与驱动芯片的引线进行邦定连接；邦定标记设置在薄膜本体的侧边，用于对邦定操作的薄膜本体进行定位操作。
本发明的显示装置的具体工作原理与上述的COF结构的优选实施例中的描述相同或相似，具体请参见上述COF结构的优选实施例中的相关描述。
本发明的显示装置优选为曲面显示装置，由于在相同分辨率下，本发明的显示装置使用的COF结构的数量较少，且COF结构的相邻间距较大，可以较好的避免曲面显示面板中的COF结构间距过小带来的COF结构损伤的技术问题，大大提高显示装置的产品良率。
本发明的COF结构、驱动电路及显示装置在同一薄膜本体上设置至少两个驱动芯片，减小了COF之间的间距，可适应现有的高分辨率的显示面板的小间距驱动芯片要求；解决了现有的COF结构、驱动电路及显示装置的相邻的COF之间的间距较大，无法适应现有的高分辨率的显示面板的小间距驱动芯片要求的技术问题。
综上所述，虽然本发明已以优选实施例揭露如上，但上述优选实施例并非用以限制本发明，本领域的普通技术人员，在不脱离本发明的精神和范围内，均可作各种更动与润饰，因此本发明的保护范围以权利要求界定的范围为准。

Claims (19)

  1. 一种COF结构，其包括：
    薄膜本体；
    至少两个驱动芯片，设置在同一所述薄膜本体上，用于生成驱动信号；
    邦定引线，设置在所述薄膜本体的上侧或下侧，用于将外部信号线与所述驱动芯片的引线进行邦定连接；以及
    邦定标记，设置在所述薄膜本体的侧边，用于对邦定操作的薄膜本体进行定位操作。
  2. 根据权利要求1所述的COF结构，其中同一所述薄膜本体上的两个所述驱动芯片之间的距离小于相邻的所述COF结构之间的距离。
  3. 根据权利要求1所述的COF结构，其中所述同一所述薄膜本体上的两个所述驱动芯片对应的所述邦定引线的数量相同。
  4. 根据权利要求1所述的COF结构，其中所述同一所述薄膜本体上的两个所述驱动芯片对应的所述邦定引线的数量不同。
  5. 根据权利要求1所述的COF结构，其中所述邦定标记设置在所述薄膜本体的左侧。
  6. 根据权利要求1所述的COF结构，其中所述邦定标记设置在所述薄膜本体的右侧。
  7. 根据权利要求1所述的COF结构，其中所述邦定标记设置在所述薄膜本体的左侧和右侧。
  8. 一种驱动电路，用于驱动显示面板，其包括COF结构，包括：
    薄膜本体；
    至少两个驱动芯片，设置在同一所述薄膜本体上，用于生成驱动信号；
    邦定引线，设置在所述薄膜本体的上侧或下侧，用于将外部信号线与所述驱动芯片的引线进行邦定连接；以及
    邦定标记，设置在所述薄膜本体的侧边，用于对邦定操作的薄膜本体进行定位操作。
  9. 根据权利要求8所述驱动电路，其中同一所述薄膜本体上的两个所述驱动芯片之间的距离小于相邻的所述COF结构之间的距离。
  10. 根据权利要求8所述驱动电路，其中所述同一所述薄膜本体上的两个所述驱动芯片对应的所述邦定引线的数量相同。
  11. 根据权利要求8所述驱动电路，其中所述同一所述薄膜本体上的两个所述驱动芯片对应的所述邦定引线的数量不同。
  12. 根据权利要求8所述驱动电路，其中所述邦定标记设置在所述薄膜本体的左侧。
  13. 根据权利要求8所述驱动电路，其中所述邦定标记设置在所述薄膜本体的右侧。
  14. 根据权利要求8所述驱动电路，其中所述邦定标记设置在所述薄膜本体的左侧和右侧。
  15. 一种显示装置，其包括显示面板以及驱动电路，其中所述驱动电路包括：COF结构，包括：
    薄膜本体；
    至少两个驱动芯片，设置在同一所述薄膜本体上，用于生成驱动信号；
    邦定引线，设置在所述薄膜本体的上侧或下侧，用于将外部信号线与所述驱动芯片的引线进行邦定连接；以及
    邦定标记，设置在所述薄膜本体的侧边，用于对邦定操作的薄膜本体进行定位操作。
  16. 根据权利要求15所述的显示装置，其中所述同一所述薄膜本体上的两个所述驱动芯片对应的所述邦定引线的数量相同。
  17. 根据权利要求15所述的显示装置，其中所述同一所述薄膜本体上的两个所述驱动芯片对应的所述邦定引线的数量不同。
  18. 根据权利要求15所述的显示装置，其中所述邦定标记设置在所述薄膜本体的左侧和/或右侧。
  19. 根据权利要求15所述的显示装置，其中所述显示面板为曲面显示面板。
PCT/CN2016/080034 2016-04-05 2016-04-22 Cof结构、驱动电路及显示装置 Ceased WO2017173676A1 (zh)

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CN107958637B (zh) * 2017-11-30 2020-02-14 武汉华星光电半导体显示技术有限公司 柔性显示面板及其下边框结构
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