WO2017169243A1 - Miroir ec à semi-conducteur et son procédé de fabrication - Google Patents

Miroir ec à semi-conducteur et son procédé de fabrication Download PDF

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Publication number
WO2017169243A1
WO2017169243A1 PCT/JP2017/005655 JP2017005655W WO2017169243A1 WO 2017169243 A1 WO2017169243 A1 WO 2017169243A1 JP 2017005655 W JP2017005655 W JP 2017005655W WO 2017169243 A1 WO2017169243 A1 WO 2017169243A1
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Prior art keywords
film
region
transparent conductive
mirror
laminated
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PCT/JP2017/005655
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English (en)
Japanese (ja)
Inventor
聖斗 増田
正俊 中村
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株式会社 村上開明堂
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Priority to JP2018508555A priority Critical patent/JPWO2017169243A1/ja
Publication of WO2017169243A1 publication Critical patent/WO2017169243A1/fr

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/15—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on an electrochromic effect
    • G02F1/153—Constructional details
    • G02F1/157—Structural association of cells with optical devices, e.g. reflectors or illuminating devices
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/15—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on an electrochromic effect
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/15—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on an electrochromic effect
    • G02F1/153—Constructional details
    • G02F1/155—Electrodes

Definitions

  • the present invention relates to a mirror using solid-state EC (electrochromic) (hereinafter sometimes abbreviated as "EC mirror").
  • EC mirror solid-state EC
  • the metal reflection film constituting the reflection surface of the EC mirror is formed up to the electrode extraction region of the transparent conductive film so that a mirror surface can be formed in the electrode extraction region.
  • a conventional solid-type EC mirror having a structure in which a transparent conductive film, a solid-type EC film, and a metal reflection film that doubles as an electrode are sequentially laminated on the back surface of the transparent substrate (surface opposite to the side where the viewpoint is disposed) is there.
  • the EC mirror applies a voltage between the transparent conductive film and the metal reflection film to change the transmittance of the EC film, thereby the transparent substrate, the transparent conductive film, and the EC film from the front surface side of the transparent substrate. Changes the reflectance of the metal reflection film seen through it.
  • the metal reflection film is an electrode extraction region of the transparent conductive film so that the transparent conductive film and the metal reflection film do not contact (short circuit) in the electrode extraction region of the transparent conductive film.
  • Film formation except for see, for example, FIG. 2 of Patent Document 1 below. Therefore, a large mirror surface area was not obtained. Therefore, as a conventional solid-type EC mirror having a mirror surface configured to obtain a large mirror surface area also in the electrode extraction region of a transparent conductive film, the one proposed in the following Patent Document 2 according to the application of the present applicant there were.
  • a solder layer is spread in a planar shape and applied to the electrode extraction region of the transparent conductive film.
  • the solder layer is electrically connected to the transparent conductive film to form a feed path for feeding power to the transparent conductive film.
  • the solder layer passes through the electrode extraction region and is viewed from the front side of the EC mirror, and constitutes a part of the mirror surface of the EC mirror in the normal use state of the EC mirror. As a result, a large mirror surface area is obtained, and the field of view is wide.
  • a solder material is required to form a mirror surface in the electrode extraction region of the transparent conductive film. Also, when applying the solder layer to the electrode extraction region of the transparent conductive film, a relatively wide gap is provided between the solder layer and the metal reflection film so that the solder layer does not contact (short circuit) with the metal reflection film. It had to be provided. As a result, the joint (gap) between the solder layer and the metal reflection film is visually noticeable, and a sense of continuity between the mirror surface by the metal reflection film and the mirror surface by the solder layer can not be obtained, and the designability is low.
  • the present invention solves the problems in the above-mentioned prior art, can form a metal reflection film constituting the reflection surface of the EC mirror to the electrode extraction region of the transparent conductive film, and can form a mirror surface in the electrode extraction region
  • the present invention provides a solid-state EC mirror and a method of manufacturing the same.
  • the solid-state EC mirror of the present invention has a structure in which a transparent conductive film, a solid-type EC film, and a metal reflection film are laminated on the back surface of a transparent substrate, and a voltage is applied between the transparent conductive film and the metal reflection film.
  • the transparent conductive film has an EC film laminated region in which the EC film is laminated, and an EC film non-stacked region in which the EC film is not laminated,
  • the film lamination region and the EC film non-stacking region are electrically connected to each other, the metal reflection film is formed over the region of the EC film and the EC film non-stacking region, and the metal reflection film is the EC At a dividing line passing through the membrane area
  • a dividing line passing through the membrane area Such as having a split first region and a second region, the first region conducting to the EC film non-stacking region and the second region non-conducting to the EC film non-stacking region It is.
  • the reflectance of the EC mirror can be changed by applying a voltage between the first region and the second region of the metal reflective film.
  • the electrode extraction region of the transparent conductive film is EC in the normal use state of the EC mirror. It can constitute part of the mirror surface of the mirror. As a result, a large mirror surface area is obtained, and the field of view is wide.
  • the transparent conductive film is formed on the entire surface of the back surface of the transparent substrate, and the EC film has an entire periphery or a region forming the electrode extraction region of the second region. Almost the entire circumference except for the film is formed in a region offset from the outer peripheral edge of the transparent substrate, the metal reflection film is formed on the entire surface of the back surface of the transparent substrate, and the dividing line is the entire periphery Alternatively, substantially the entire periphery of the second region excluding the region for forming the electrode lead-out region may be formed at a position offset from the outer peripheral end of the EC film. According to this, it is possible to form a mirror surface on the entire surface of the metal reflection film.
  • the transparent conductive film and the metal reflection film are formed on the entire surface of the transparent substrate, when forming the transparent conductive film and the metal reflection film, there is no need to use a masking jig for setting a region where film formation is not performed. Can.
  • the EC film has an EC film extending portion formed by reaching the outer peripheral end of the transparent substrate from a part of the offset region, and both ends of the dividing line are the above It can enter into the EC film extending portion and be open at the outer peripheral end of the transparent substrate in the EC film extending portion.
  • the metal reflection disposed at the position where both ends of the dividing line are open to the outer peripheral end of the transparent substrate is sandwiched by the dividing line at the open position and reaches the outer peripheral end of the transparent substrate
  • the area of the membrane can constitute the electrode removal area of the second area.
  • the transparent conductive film has a transparent conductive film separation region separated from another region by a separation line in a part of the outer peripheral portion, and the EC film has the entire region of the outer periphery of the transparent substrate.
  • the film is formed in a region offset from the end, and a partial region of the EC film overlaps the transparent conductive film separation region, and both ends of the dividing line are the region of the EC film from the EC film and the transparent conductive It is possible for the membrane separation region to enter the overlapping region and be open at the outer peripheral end of the transparent substrate in the transparent conductive film separation region.
  • the area of the membrane can constitute the electrode removal area of the second area. Further, since the entire area of the EC film can be disposed at a position offset from the outer peripheral end of the transparent substrate, the EC film can be shielded from the outside air to prevent deterioration of the EC film.
  • the transparent conductive film on the transparent substrate, the solid state EC film, and the laminated film by the metal reflection film are laminated in a part of the outer peripheral portion and separated from other regions by separation lines.
  • a film separation region is formed, and the EC film is deposited on the entire region offset from the outer peripheral edge of the transparent substrate, and both ends of the dividing line are connected to the dividing line, and the second region.
  • the metal reflective film of the laminated film separation area can constitute the electrode extraction area of the second area.
  • the entire area of the EC film can be disposed at a position offset from the outer peripheral end of the transparent substrate.
  • the separation line and the dividing line can be formed after the laminated film is formed, the separation line and the dividing line can be formed in a continuous process.
  • the first terminal may be connected to the first area, and the second terminal may be connected to the second area. According to this, a drive voltage can be applied to the EC film through the first terminal and the second terminal.
  • the metal reflection film is laser cut to form the dividing line. According to this, it is possible to easily divide the first region and the second region from the metal reflection film. Further, the dividing line can be formed to be narrow so that the boundary between the first region and the second region can be made less visible visually, and the design can be improved.
  • the transparent conductive film is laser cut to separate the transparent conductive film separation region from the transparent conductive film. According to this, the transparent conductive film separation area can be easily separated from the transparent conductive film.
  • the laminated film is laser cut to separate the laminated film separation area from the laminated film. According to this, the laminated film separation area can be easily separated from the laminated film.
  • FIG. 2C is a schematic cross-sectional view taken along the line CC in FIG. 2A.
  • FIG. 3B is a schematic cross-sectional view taken along the line DD in FIG. 3A.
  • FIG. 4A It is a top view which shows the masking jig
  • FIG. 6B is a schematic sectional view taken along the line GG in FIG. 6A. It is a top view which shows the manufacturing process 6 (post process 1) of the EC mirror of FIG. It is the HH arrow typical cross section figure of FIG. 7A.
  • FIG. 7B is a schematic cross-sectional view taken along the line II in FIG. 7A.
  • FIG. 10B is a schematic cross-sectional view taken along the line K-K in FIG. 10A.
  • FIG. 10B is a schematic cross-sectional view taken along the line LL in FIG. 10A. It is a top view which shows Embodiment 3 of the solid-type EC mirror of this invention.
  • FIG. 11B is a schematic cross-sectional view taken along the line MM in FIG. 11A.
  • 11B is a schematic cross-sectional view taken along the line NN in FIG. 11A.
  • Embodiment 1 of the solid state EC mirror of the present invention is shown in FIG. 1 (A, B, C).
  • the EC mirror 10 constitutes, for example, an EC mirror for a vehicle.
  • the EC mirror 10 has a structure in which a laminated film 19 is formed on the back surface of a transparent substrate 12 such as a glass plate (that is, the surface opposite to the side on which a viewpoint is disposed).
  • the laminated film 19 is configured by sequentially laminating a transparent conductive film 14, a solid EC film 16, and a metal reflection film 18 which also serves as an electrode on the back surface of the transparent substrate 12.
  • the EC mirror 10 is used in a posture in which the transparent film 12 is seen through the transparent substrate 12.
  • the transparent conductive film 14 is made of ITO (indium tin oxide), FTO (fluorine-doped tin oxide), tin oxide or the like.
  • the solid type EC film 16 is formed of an all solid laminated film in which three layers of a counter electrode layer, a solid electrolyte layer, and a reduction coloring layer are sequentially laminated.
  • the counter electrode layer is made of Ir-SnO x (iridium-tin oxide), NiO (nickel oxide), CoO (cobalt oxide) or the like.
  • the solid electrolyte layer is composed of Ta 2 O 5 , ZrO 2 , Nb 2 O 5 or the like.
  • the reduced coloring layer is composed of WO 3 or the like.
  • the metal reflection film 18 is made of Al (aluminum), Ag (silver) alloy, Rh (rhodium) or the like.
  • the transparent conductive film 14 is formed on the entire surface of the transparent substrate 12.
  • the EC film 16 is formed in a region offset by a predetermined distance from the outer peripheral end of the transparent substrate 12 to the inner peripheral side except for a partial region of the EC film 16 (an EC film extended portion 16a described later).
  • the transparent conductive film 14 the EC film non-stacking region 14 a in which the EC film 16 is not stacked and the EC film stacking region 14 b in which the EC film 16 is stacked are formed.
  • the EC film non-stacked region 14a and the EC film stacked region 14b are electrically connected to each other.
  • the metal reflection film 18 is formed on the entire surface of the transparent substrate 12 so as to cover the entire surface of the EC film 16. That is, the metal reflection film 18 is formed over the entire region of the EC film 16 and the entire region of the EC film non-laminated region 14 a of the transparent conductive film 14.
  • the metal reflection film 18 is divided into a first region 18 a and a second region 18 b at a dividing line 20 which passes through the region of the EC film 16 and does not pass outside the region of the EC film 16.
  • the dividing line 20 is continuously formed, for example, by laser cutting by scanning of a laser beam.
  • the first region 18a is joined to the EC film non-stacked region 14a and is conducted to the EC film non-stacked region 14a to form a feed path to the EC film stacked region 14b.
  • the second region 18 b faces the EC film laminated region 14 b with the EC film 16 interposed therebetween.
  • the second region 18 b is nonconductive to the EC film non-laminated region 14 a.
  • a partial region of the entire circumference of the EC film 16 is formed to reach the outer peripheral end of the transparent substrate 12.
  • the partial region constitutes an EC film extending portion 16a.
  • the dividing line 20 enters the EC film extending portion 16a from the general area of the EC film 16 (that is, the region excluding the EC film extending portion 16a).
  • both ends of the dividing line 20 reach the outer peripheral end of the transparent substrate 12 in the EC film extending portion 16 a and are opened. That is, the dividing line 20 is formed in the region of the EC film 16 over the entire length thereof.
  • the region 18 b ′ of the metal reflective film 18 is sandwiched by the parting line 20 at the open position at a position where both ends of the parting line 20 are open to the outer peripheral end of the transparent substrate 12 and the outer peripheral end of the transparent substrate 12 It is an area which is arranged to reach.
  • This region 18 b ′ constitutes an electrode lead-out region of the metal reflection film 18 (second region 18 b).
  • the terminal 30 (FIGS. 7A and 7B) is connected to the area 18b '.
  • the width (length in the circumferential direction of the transparent substrate 12) of the electrode lead-out area 18b ' is about several mm.
  • the first region 18 a constitutes an electrode lead-out region of the transparent conductive film 14.
  • the terminal 28 (FIGS. 7A and 7C) is connected to the first region 18a.
  • a coloring voltage is applied between both terminals 28 and 30. That is, with the terminal 28 on the opposite electrode layer side as the positive electrode and the terminal 30 on the reduction coloring layer side as the negative electrode, a voltage is applied between the two terminals 28 and 30.
  • the area facing the second area 18b of the entire area of the EC film 16 is colored, and the transmittance of the area is reduced.
  • the metal reflection film 18 (second region 18 b) seen through the transparent substrate 12, the transparent conductive film 14, and the EC film 16 from the front surface (the surface on which the viewpoint is arranged) side of the transparent substrate 12.
  • the reflectance of decreases.
  • a decoloring voltage is applied between the terminals 28 and 30 this time. That is, with the terminal 28 on the opposite electrode layer side as the negative electrode and the terminal 30 on the reducing color layer side as the positive electrode, a voltage is applied between the two terminals 28 and 30. Or short circuit between both terminals 28 and 30. As a result, the area that has been colored disappears, and the transmittance of that area is increased.
  • the reflectance of the metal reflection film 18 (second region 18 b) seen through the transparent substrate 12 and the transparent conductive film 14 and the EC film 16 from the front surface side of the transparent substrate 12 is increased, and the reflection is The rate is close to the reflectance of the first region 18a.
  • the first region 18a does not change the reflectance, it constitutes a part of the mirror surface. Therefore, the entire surface of the EC mirror 10 constitutes a mirror surface, so a wide field of view can be obtained. Since the dividing line 20 is formed by a thin line (for example, a line with a width of 0.1 mm) which is not easily visible by laser cutting, the joint (that is, dividing line 20) of the first region 18a and the second region 18b is Not visually noticeable.
  • the continuity of the mirror surface by the 1st field 18a and the mirror surface by the 2nd field 18b is good, EC mirror 10 with high designability is obtained.
  • the metal reflection film 18 (first region 18a) having a low resistance value is connected to substantially the entire periphery of the transparent conductive film 14 having a high resistance value (that is, the EC film non-laminated region 14a), the EC film lamination is performed. Electricity is supplied to the region 14b simultaneously from substantially the entire periphery of the EC film laminated region 14b. Therefore, the response of coloring / decoloring of the EC mirror 10 is improved.
  • the contact time (irradiation time) of the laser beam to the EC film 16 at the time of forming the dividing line 20 is short, as in the technique described in Patent Document 2, the solder is applied on the transparent conductive film As compared with the case of forming the film, the damage to the EC film 16 due to heat is less, and the quality of the EC film 16 is stabilized. Further, the formation of the dividing line 20 by the laser beam has a faster processing speed than that of the formation of the solder layer by the application of the solder, and the productivity is improved.
  • a masking jig is not necessary for forming the transparent conductive film 14 and the metal reflection film 18 in the manufacturing process.
  • a general-purpose jig such as a claw jig (a jig for holding and holding the transparent substrate 12 with claws from both sides of the outer periphery) can be used. Therefore, when manufacturing a plurality of types of EC mirrors having different outer shapes, it is sufficient to individually prepare only the film forming masking jig for the EC film 16 as a film forming masking jig.
  • the manufacturing process of the EC mirror 10 of FIG. 1 described above will be described.
  • [Step 1] (FIG. 2A, B)
  • the transparent substrate (glass substrate) 12 is cut into a surface shape of the EC mirror 10, chamfered, and cleaned.
  • [Step 2] (FIG. 3A, B)
  • the transparent conductive film 14 is formed on the entire back surface of the transparent substrate 12. Since the transparent conductive film 14 may be formed on the entire surface of the transparent substrate 12, no masking jig is necessary for forming the transparent conductive film 14. Therefore, the film formation of the transparent conductive film 14 can be performed by vapor deposition using a claw jig, flat placement sputtering, or the like.
  • the transparent conductive film 14 can be formed in advance on the entire surface of the transparent substrate 12 before cutting, and then the transparent substrate 12 can be cut into the surface shape of the EC mirror 10.
  • Step 3 (FIG. 4A, B) Three layers (a counter electrode layer, a solid electrolyte layer, and a reduction coloring layer) constituting the EC film 16 are sequentially formed on the transparent conductive film 14 by vapor deposition.
  • the masking jig 22 of FIG. 5A and 5B is used for this film-forming.
  • the masking jig 22 has a recess 24 and an opening 26 in the recess 24.
  • the transparent substrate 12 is held in the recess 24 with the surface on which the EC film 16 is formed facing the opening 26 without looseness.
  • the opening 26 is formed on the inner peripheral side from a position offset to the inner peripheral side by a predetermined width from the outer peripheral end of the recess 24.
  • a partial area 26 a of the outer peripheral portion of the opening 26 is formed to reach the outer peripheral end of the recess 24.
  • the transparent conductive film 14 is divided into an EC film non-stacking region 14 a where the EC film 16 is not stacked and an EC film stacking region 14 b where the EC film 16 is stacked.
  • Step 4 (FIG. 6A, B)
  • the metal reflection film 18 is formed on the entire surface of the transparent substrate 12.
  • the metal reflection film 18 is stacked on the EC film 16, and the entire surface of the EC film 16 is covered with the metal reflection film 18.
  • An outer peripheral portion of the metal reflection film 18 (that is, a region where the EC film 16 is not formed) is stacked on the EC film non-laminated region 14 a of the transparent conductive film 14.
  • the metal reflection film 18 may be formed on the entire surface of the transparent substrate 12, a masking jig is unnecessary. Therefore, the film formation of the metal reflection film 18 can be performed by vapor deposition using a claw jig, flat placement sputtering, or the like.
  • the metal reflection film 18 is formed on the entire surface of the transparent substrate 12 without the masking jig, in the EC film extended portion 16a, a part of the evaporated metal generated at the time of film formation corresponds to the end face of the EC film extended portion 16a. There is a possibility that the light may reach the transparent conductive film 14 and short circuit between the metal reflective film 18 and the transparent conductive film 14.
  • Step 5 (FIGS. 1A, B, C)
  • the metal reflection film 18 is laser cut to form a continuous dividing line 20.
  • the dividing line 20 is formed in the region of the EC film 16. Thereby, the metal reflection film 18 is divided into the first region 18a and the second region 18b.
  • An electrode lead-out area 18b 'of the metal reflection film 18 (second area 18b) is formed in a part of the second area 18b.
  • the laser output is adjusted so that the transparent conductive film 14 is not cut by the laser. Even if the EC film 16 is cut or not cut, the performance of the EC mirror 10 is not affected. Thus, the EC mirror 10 shown in FIG. 1 is obtained.
  • the metal reflection film 18 has large reflection and absorption with respect to the laser, so most of the laser energy is absorbed or reflected by the metal reflection film 18 and the absorbed energy is used for cutting the metal reflection film 18. Also, the laser remaining without being absorbed or reflected by the metal reflection film 18 reaches the EC film 16 and the transparent conductive film 14.
  • Step 6 (Post-step 1)
  • the metal terminal 30 is joined with the solder 31 to the area 18 b ′ which constitutes the electrode extraction area of the metal reflection film 18 (second area 18 b).
  • Step 7 (Post-Step 2)] (FIGS. 8A and 8B)
  • a sealing glass 36 is joined with a sealing resin 34 to the surface on which the laminated film 19 (transparent conductive film 14, solid EC film 16, metal reflective film 18) of the EC mirror 10 is formed. Seal. In the normal use state, the edge of the mirror holder does not cover the periphery of the EC mirror 10, and the entire surface of the EC mirror 10 constitutes a mirror surface. Therefore, a large mirror surface area can be obtained.
  • a mirror surface is configured by a solder layer in a partial region in the circumferential direction of the transparent substrate.
  • the transparent substrate and the sealing glass are joined by the sealing resin in a non-parallel posture by the thickness obtained by adding the terminal thickness and the solder layer thickness.
  • the thickness of the sealing resin layer becomes uneven in the circumferential direction of the EC mirror.
  • the thickness of the sealing resin layer can be made uniform in the circumferential direction of the EC mirror 10 due to the absence of the solder layer.
  • Transparent substrate 12 Flat glass
  • Transparent conductive film 14 ITO
  • Solid EC film 16 The counter electrode layer is Ir-SnO x
  • the solid electrolyte layer is Ta 2 O 5
  • the reduction coloring layer is WO 3 .
  • the overall film thickness of the solid EC film 16 is 1.2 ⁇ m
  • Metal reflective film 18 Al
  • the maximum output of laser 25 W ⁇
  • Moving speed of laser 400 mm / s
  • the horizontal axis indicates the laser output in proportion to the maximum output (25 W)
  • the vertical axis indicates the removal width of the laminated film 19. According to FIG.
  • the sample ⁇ obtained by cutting the laminated film 19 by setting the laser output to about 20% of the maximum output is completely cut by the metal reflection film 18 and divided into the first region 18a and the second region 18b, and a transparent conductive film It is presumed that 14 was processed into a partially cut state. Therefore, it can be seen that it can function to some extent as an EC mirror.
  • the sample X obtained by laser cutting the laminated film 19 with the laser output set at 25% or more of the maximum output is processed so that not only the metal reflective film 18 and the EC film 16 but also the transparent conductive film 14 is completely cut. It is guessed. Therefore, it turns out that it can not function as an EC mirror.
  • the EC mirror 10 with sufficient performance according to the present invention can be obtained.
  • a laser with a wavelength of 1064 nm was used in the above experiment, a wavelength such as a green laser with a wavelength of 532 nm, which has higher transmittance to the transparent conductive film 14 and the EC film 16 and larger reflection and absorption to the metal reflective film 18 is used. If so, it can be expected that the processing state in which only the metal reflection film 18 is cut can be obtained more easily.
  • FIGS. 10A, 10B, and 10C Second Embodiment Embodiment 2 of the solid-state EC mirror of the present invention is shown in FIGS. 10A, 10B, and 10C.
  • the EC mirror 40 is different from the EC mirror 10 of the first embodiment in the structure for forming an electrode lead-out area 18b 'of the metal reflection film 18 (second area 18b).
  • the remaining structure of the EC mirror 40 is the same as that of the EC mirror 10 of the first embodiment.
  • the same reference numerals as those used in the first embodiment are used for the portions common to the EC mirror 10 of the first embodiment, and the description thereof is omitted.
  • the transparent conductive film 14 is separated by the separation line 42 into a partial region of the outer peripheral portion (that is, a region including the electrode extraction region 18b 'to be formed). It has a transparent conductive film separation region 14c.
  • the separation line 42 is formed by laser cutting the transparent conductive film 14 into a U shape from one end position of the outer periphery of the transparent conductive film 14 (that is, the outer periphery of the transparent substrate 12) to another end position. It is done.
  • the EC film 16 is formed in a region whose entire area is offset from the outer peripheral end of the transparent substrate 12. In addition, a part of the EC film 16 overlaps the transparent conductive film separation region 14 c.
  • the area 44 is the overlapping area.
  • the dividing line 20 enters from a region of the EC film 16 into a region 44 where the EC film 16 and the transparent conductive film separation region 14 c overlap. Then, both ends of the dividing line 20 are open at the outer peripheral end of the transparent substrate 12 in the transparent conductive film separation area 14 c without passing through the other area (area other than the transparent conductive film separation area 14 c).
  • the electrode extraction area 18b 'of the metal reflection film 18 (second area 18b) is connected to the transparent conductive film separation area 14c.
  • the transparent conductive film separation region 14 c is separated from the other region of the transparent conductive film 14 (the region other than the transparent conductive film separation region 14 c) by the separation line 42.
  • the second region 18 b and the region of the transparent conductive film 14 other than the transparent conductive film separation region 14 c are not conductive.
  • the entire surface (entire area) of the EC film 16 is disposed at a position offset from the outer peripheral end of the transparent substrate 12.
  • the terminals 28, 30 are joined to the EC mirror 40 of FIG. 10 as in FIG. That is, the terminal 30 is joined by the solder 31 to the region 18 b ′ that constitutes the electrode extraction region of the metal reflection film 18 (second region 18 b). Further, the terminal 28 is joined with the solder 29 to the first region 18 a constituting the electrode lead-out region of the transparent conductive film 14.
  • the sealing glass 36 is bonded to the surface of the EC mirror 40 on which the laminated film 19 is formed by the sealing resin 34, and the laminated film 19 is sealed.
  • the manufacturing process of the EC mirror 40 having the configuration of the second embodiment is the manufacturing process of the EC mirror 10 described in the first embodiment (FIGS. 2, 3, 4, 1, 6, 7, 8 and 9).
  • the following points differ with respect to the order.
  • the transparent conductive film 14 is laser cut to form continuous separation lines 42, thereby forming the transparent conductive film separation region 14c.
  • the area 26a is removed from the opening 26 of the masking jig 22 of FIG. 5 as a masking jig (ie, the entire circumference of the opening 26 is a recess Use the offset from the outer edge of 24).
  • the EC film 16 without the EC film extended portion 16a of FIG. 1 is formed.
  • the EC film 16 is formed on the transparent conductive film 14 so as to straddle the separation line 42 (that is, to form a region 44 where the EC film 16 and the transparent conductive film separation region 14c overlap).
  • Third Embodiment 11A, B, and C show Embodiment 3 of the solid-state EC mirror of the present invention.
  • the EC mirror 50 is different from the EC mirror 10 of the first embodiment and the EC mirror 40 of the second embodiment in the structure for forming the electrode extraction region of the metal reflection film 18 (second region 18b). It is.
  • the remaining structure of the EC mirror 50 is the same as that of the EC mirror 10 of the first embodiment and the EC mirror 40 of the second embodiment.
  • parts common to the EC mirror 10 of the first embodiment and the EC mirror 40 of the second embodiment use the same reference numerals as those used in the first and second embodiments. The explanation is omitted.
  • the laminated film 19 of the transparent conductive film 14, the solid EC film 16, and the metal reflection film 18 on the transparent substrate 12 It has a laminated membrane separation region 19 a separated by a separation line 52.
  • the separation line 52 is formed by laser cutting the laminated film 19 into a U shape from one end position of the outer periphery of the laminated film 19 (that is, the outer periphery of the transparent substrate 12) to another end position. There is. The separation line 52 is formed over the entire thickness of the laminated film 19.
  • the laminated film separation region 19a is a lamination of the separation regions 14c, 16b, and 18c obtained by separating the transparent conductive film 14, the solid EC film 16, and the metal reflection film 18 constituting the laminated film 19 by the separation line 52. Composed of a membrane.
  • the EC film 16 is formed in a region whose entire area is offset from the outer peripheral end of the transparent substrate 12.
  • the dividing line 20 is connected to the separating line 52. Thereby, the first region 18a, the second region 18b, and the laminated film separation region 19a become nonconductive to each other.
  • a conductive member 54 is joined to the second region 18b of the metal reflection film 18 and the metal reflection film separation region 18c of the laminated film separation region 19a so as to connect the two regions 18b and 18c. As a result, the two regions 18b and 18c conduct each other.
  • the metal reflection film separation area 18c of the laminated film separation area 19a constitutes an electrode extraction area of the metal reflection film 18 (second area 18b).
  • the conductive member 54 constitutes a terminal of the metal reflection film 18 (second region 18 b).
  • the conductive member 56 is also bonded to the first region 18 a constituting the electrode lead-out region of the transparent conductive film 14.
  • the conductive member 56 constitutes a terminal of the transparent conductive film 14.
  • the conductive members 54 and 56 are made of, for example, a conductive metal foil adhesive tape.
  • the conductive metal foil pressure-sensitive adhesive tape has a structure in which a conductive pressure-sensitive adhesive is applied to one surface of a metal foil such as copper to form a conductive pressure-sensitive adhesive layer. Thereby, the conductive metal foil adhesive tape has conductivity in the surface direction and the thickness direction.
  • the conductive metal foil pressure-sensitive adhesive tape can be attached to the bonding site at normal temperature.
  • the conductive metal foil adhesive tape is electrically connected to the bonding site (conductive) by the attachment.
  • a commercially available conductive metal foil adhesive tape for example, there is a conductive copper foil adhesive tape No. 8323 manufactured by Teraoka Seisakusho Co., Ltd.
  • the metal reflective film separation area 18c of the laminated film separation area 19a is connected to the transparent conductive film separation area 14c of the laminated film separation area 19a, but the transparent conductive film separation area 14c is another separation line 52 of the transparent conductive film 14 It is separated from the region (region other than the transparent conductive film separation region 14c). Therefore, the second region 18 b and the region of the transparent conductive film 14 other than the transparent conductive film separation region 14 c are not conductive.
  • the entire surface of the EC film 16 is disposed at a position offset from the outer peripheral end of the transparent substrate 12. Further, after forming the laminated film 19, the separation line 52 and the dividing line 20 can be formed in a continuous process.
  • the sealing glass 36 is bonded to the surface of the EC mirror 50 on which the laminated film 19 is formed with the sealing resin 34, as in FIG. 8, and the laminated film 19 is sealed.
  • conductive metallic foil adhesive tape is used for the terminal, conductive metallic foil adhesive tape is thin (for example, metallic metallic terminal is 0.1 mm thick or more, conductive metallic foil adhesive tape is 0.07 mm thick or less Therefore, the transparent substrate 12 and the sealing glass 36 are joined approximately in parallel by the sealing resin 34. As a result, the layer thickness of the sealing resin 34 becomes substantially uniform all around the EC mirror 50.
  • the conductive metal foil adhesive tape is thin, the difference in level between the conductive metal foil adhesive tape and the periphery thereof is small, the wraparound of the sealing resin 34 is good, and the sealing failure hardly occurs.
  • soldering metal terminals it is necessary at about 200 degrees Celsius, but since the conductive metal foil adhesive tape can be attached at room temperature, the degradation of the EC film 16 is suppressed when the conductive metal foil adhesive tape is used An effect is also obtained.
  • the manufacturing process of the EC mirror 50 of the configuration of the third embodiment is the manufacturing process of the EC mirror 10 described in the first embodiment (FIGS. 2, 3, 4, 1, 6, 7, 8 and 9).
  • the following points differ with respect to the order.
  • the step of FIG. 4 deposition of the EC film 16
  • the masking jig one in which the area 26a is removed from the opening 26 of the masking jig 22 of FIG. 5 is used.
  • the EC film 16 without the EC film extended portion 16a of FIG. 1 is formed.
  • the laminated film 19 is laser cut to form continuous separation lines 52, and the laminated film separation region 19a is formed.
  • the laser output is lowered and the metal reflection film 18 is laser cut to form a continuous dividing line 20.
  • the electrode extraction region of the metal reflection film (second region) is drawn to the outer peripheral end of the transparent substrate, but this is not necessarily required. That is, for example, it can be configured as follows. The entire area of the second area is surrounded to form a first area. A part of the circumferential direction of the first region is coated with an insulating resin. The conductive metal foil adhesive tape is pulled from the second area through the insulating coated top of the first area to the outside of the EC mirror. In this state, the conductive metal foil adhesive tape is attached to an EC mirror. Thereby, the conductive metal foil adhesive tape can be used as a terminal of the second region.
  • the dividing lines are formed using a laser beam in the above embodiment, the dividing lines may be formed using an electron beam, plasma, chemical etching or the like.
  • EC film extending portion 18: metal reflection film, 18a: first region, 18b: second region, 18b ': electrode extraction region of metal reflection film second region, 19: laminated film, 19a: laminated film separation region, Reference Signs List 20 dividing line 22 masking jig 24 recess of masking jig 26 opening of masking jig 26a area forming EC film extension of opening 28 terminal 29 Solder 30 terminal 31 solder 34 sealing resin 36 sealing glass 40 solid EC mirror 42 separation line 44 area where EC film and transparent conductive film separation region overlap 50. Solid EC mirror, 52 ... Contact break, 54, 56 ... conductive member

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electrochromic Elements, Electrophoresis, Or Variable Reflection Or Absorption Elements (AREA)
  • Optical Elements Other Than Lenses (AREA)

Abstract

[Problème] Constituer une surface de miroir dans une région de sortie d'électrode par formation d'un film métallique réfléchissant constituant la surface de réflexion d'un miroir EC à semi-conducteur jusqu'à la région de sortie d'électrode d'un film conducteur transparent. [Solution] La présente invention concerne un miroir EC à semi-conducteur 10 qui présente une structure dans laquelle un film conducteur transparent 14, un film EC à semi-conducteur 16 et un film métallique réfléchissant 18 sont stratifiés sur la surface arrière d'un substrat transparent 12. Le film conducteur transparent 14 comprend une région stratifiée de film EC 14b ayant le film EC 16 stratifié sur celle-ci et une région stratifiée de film non-EC 14a ne comportant aucun film EC 16 stratifié sur celle-ci. La région stratifiée de film EC 14b et la région stratifiée de film non-EC 14a sont électriquement connectées l'une à l'autre. Le film métallique réfléchissant 18 est formé sur la région du film EC 16 et la région stratifiée de film non-EC 14a. Le film métallique réfléchissant 18 comprend une première région 18a et une deuxième région 18b divisées par une ligne de division 20 traversant la région du film EC 16. La première région 18a est électriquement connectée à la région stratifiée de film non-EC 14a. La deuxième région 18b n'est pas électriquement connectée à la région stratifiée de film non-EC 14a.
PCT/JP2017/005655 2016-03-31 2017-02-16 Miroir ec à semi-conducteur et son procédé de fabrication WO2017169243A1 (fr)

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JP2018508555A JPWO2017169243A1 (ja) 2016-03-31 2017-02-16 固体型ｅｃミラーおよびその製造方法

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JP2016070526 2016-03-31

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Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS634521U (fr) * 1986-06-25 1988-01-13
JPS63306429A (ja) * 1987-06-09 1988-12-14 Ichikoh Ind Ltd 自動車用ｅｃ防眩ミラ−の製造方法
JP2006501524A (ja) * 2002-09-30 2006-01-12 ジェンテックス コーポレイション 基板間に位置オフセットのないエレクトロクロミック装置
JP2012524290A (ja) * 2009-04-16 2012-10-11 セイジ・エレクトロクロミクス，インコーポレイテッド 透明度制御エレクトロクロミック素子
WO2014013759A1 (fr) * 2012-07-17 2014-01-23 株式会社ホンダロック Miroir antireflet, véhicule et procédé de production de miroir antireflet
JP2014081566A (ja) * 2012-10-18 2014-05-08 Honda Lock Mfg Co Ltd エレクトロクロミックミラー
US20140340731A1 (en) * 2011-12-12 2014-11-20 View, Inc. Thin-film devices and fabrication

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS634521U (fr) * 1986-06-25 1988-01-13
JPS63306429A (ja) * 1987-06-09 1988-12-14 Ichikoh Ind Ltd 自動車用ｅｃ防眩ミラ−の製造方法
JP2006501524A (ja) * 2002-09-30 2006-01-12 ジェンテックス コーポレイション 基板間に位置オフセットのないエレクトロクロミック装置
JP2012524290A (ja) * 2009-04-16 2012-10-11 セイジ・エレクトロクロミクス，インコーポレイテッド 透明度制御エレクトロクロミック素子
US20140340731A1 (en) * 2011-12-12 2014-11-20 View, Inc. Thin-film devices and fabrication
WO2014013759A1 (fr) * 2012-07-17 2014-01-23 株式会社ホンダロック Miroir antireflet, véhicule et procédé de production de miroir antireflet
JP2014081566A (ja) * 2012-10-18 2014-05-08 Honda Lock Mfg Co Ltd エレクトロクロミックミラー

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