WO2017167333A1 - Module de communication pour véhicule - Google Patents

Module de communication pour véhicule Download PDF

Info

Publication number
WO2017167333A1
WO2017167333A1 PCT/DE2017/200027 DE2017200027W WO2017167333A1 WO 2017167333 A1 WO2017167333 A1 WO 2017167333A1 DE 2017200027 W DE2017200027 W DE 2017200027W WO 2017167333 A1 WO2017167333 A1 WO 2017167333A1
Authority
WO
WIPO (PCT)
Prior art keywords
communication module
vehicle communication
circuit board
plastic body
vehicle
Prior art date
Application number
PCT/DE2017/200027
Other languages
German (de)
English (en)
Inventor
Jakob Schillinger
Svenja Raukopf
Dietmar Huber
Original Assignee
Continental Teves Ag & Co. Ohg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Continental Teves Ag & Co. Ohg filed Critical Continental Teves Ag & Co. Ohg
Priority to DE112017000404.7T priority Critical patent/DE112017000404A5/de
Publication of WO2017167333A1 publication Critical patent/WO2017167333A1/fr

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • H05K3/284Applying non-metallic protective coatings for encapsulating mounted components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0271Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01Dielectrics
    • H05K2201/0104Properties and characteristics in general
    • H05K2201/0129Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07Electric details
    • H05K2201/0707Shielding
    • H05K2201/0715Shielding provided by an outer layer of PCB
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/09Treatments involving charged particles
    • H05K2203/095Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305Moulding and encapsulation
    • H05K2203/1316Moulded encapsulation of mounted components

Definitions

  • the invention relates to a vehicle communication module having a printed circuit board assembly having a printed circuit board, wherein the printed circuit board assembly is configured to communicate with other vehicle components and to communicate with external radio stations via radio.
  • Such vehicle communication modules are used, for example, in motor vehicles to provide various communication options with other vehicles, with infrastructure or with other units.
  • a vehicle communication module can be used for vehicle-to-X communication.
  • the vehicle communication module can be designed, for example, to receive and transmit the radio-frequency signals required for this purpose.
  • it can for example provide an Internet application, which can be done in particular via a communication with a mobile network.
  • the invention relates to a vehicle communication module.
  • the vehicle communication module has a printed circuit board assembly.
  • the printed circuit board assembly has a printed circuit board.
  • the circuit board assembly is configured to communicate with other vehicle components and to communicate with external radio stations.
  • the circuit board can be designed accordingly.
  • the printed circuit board assembly is coated with a first plastic body.
  • the circuit board assembly for example, protected against mechanical damage or moisture or similar effects. Furthermore, this also ensures that the circuit board assembly is no longer directly accessible, so that would have to be broken or removed before a possible manipulation of the first plastic body. This makes it much more difficult that improper interventions are made to the Lei ⁇ terplattenan Aunt, for example, by unauthorized repairers, hobbyists or by criminals who deliberately interfere with radio communications between vehicles or the vehicle electronics and thus provoke accidents. Overall, therefore, the security is significantly increased by the inventive design ⁇ .
  • the printed circuit board assembly may comprise a printed circuit board, two Lei ⁇ terplatten, three printed circuit boards or any plurality of printed circuit boards.
  • the printed circuit board arrangement can in particular be configured to communicate with the other vehicle components via radio, in particular via WLAN or Bluetooth.
  • radio links are typically built towards the vehicle interior or to areas with corresponding vehicle components. Accordingly, antennas used for this purpose can be arranged. It should be understood, however, that in principle a wired communication with other vehicle ⁇ components or a combination of wireless communication and wired communication with such vehicle components is possible.
  • the vehicle communication module may in particular have an internal antenna for communication with the other vehicle components.
  • the internal antenna may be directed toward the vehicle interior.
  • a Wi-Fi based ⁇ In ternetzugang be provided or it may be a control of vehicle functions by means of mobile phones or other units, for example the Bluetooth, are provided in the interior of the vehicle.
  • the vehicle communication module preferably has a connection for connection to an external antenna for communication with the radio stations. This allows the connection of a corresponding external antenna. Again, however, an antenna can be used, which is fixedly mounted in or on the Fahr ⁇ zeugkommunikationsmodul.
  • the first plastic body is at least partially or completely surrounded by a conductive, in particular metallic, sheath.
  • a metallic sheath can further improve both the mechanical protection as well as improved protection against electromagnetic radiation or other electrical and / or may ⁇ genetic influences offer.
  • a conductive cladding can be used in addition to heat dissipation and as an adhesive adhesion layer for further plastic bodies to be applied to the conductive cladding.
  • the internal antenna may in particular be formed as part of the conductive enclosure. This allows a particularly simple design.
  • the conductive sheath can for this purpose be structured accordingly, so that it forms the internal antenna at one point.
  • the conductive sheath may be formed, for example, flat and / or structured accordingly.
  • a number of switches are formed in the conductive sheath. These may be, for example, capacitive switches or other switches. This allows operation of functions of the vehicle communication module.
  • the first plastic body is preferably formed from a thermoset material. This has proven to be advantageous in terms of durability and protective function.
  • the vehicle communication module is encased on the outside with a second plastic body according to a preferred embodiment. If the already mentioned conductive cladding is present, the second plastic body can be arranged in particular outside the conductive cladding. By the second plastic body can be made even further improved protection as already described above.
  • the second plastic body can be formed in particular from a thermoplastic material. This has proven to be before ⁇ geous.
  • the combination has proven to be advantageous that the first plastic body is formed of a thermoset material and the second plastic ⁇ body is formed of a thermoplastic material.
  • the circuit board assembly further comprises a number of electrical or electronic components, which are applied to the circuit board.
  • these may be, for example, components such as transistors, capacitors, coils, diodes, resistors, processors, other programmable components or other types of components. These can provide appropriate functionalities.
  • one, some or all of the components are encased directly by means of a respective further plastic body.
  • This respective other art ⁇ material body is preferably mounted within the first plastic ⁇ material body, so that the respective further plastic body is completely or partially surrounded by the first plastic body.
  • a further improved protection of the respective components can be achieved.
  • the further plastic bodies may be formed in particular from a thermoset material. This has proved to be advantageous for typical applications.
  • one, some or all of the components with one, in particular closed or perforated, housing covered.
  • This housing is typically located inside the first plastic body.
  • the housing may in particular be formed from a conductive material, in particular metal, or else from a plastic material.
  • the first plastic ⁇ body get an additional functionality, namely the fixing of the plug, which is thereby securely and reliably fixed.
  • FIG. 1 shows a vehicle communication module according to a first
  • FIG. 2 shows a vehicle communication module according to a second
  • FIG. 3 shows a vehicle communication module according to a third
  • Fig. 4 shows a typical installation situation of affykommu ⁇ nikationsmoduls.
  • Fig. 1 shows a vehicle communication module 30 according to a first embodiment of the invention.
  • the vehicle communication module 30 has a circuit board ⁇ arrangement 35.
  • the printed circuit board arrangement 35 has a printed circuit board 1 on which various functions are implemented, in particular for communication with other components a motor vehicle, in which the vehicle communication ⁇ module 30 is installed, and with external radio stations.
  • different components are applied to the circuit board 1, which are shown here by way of example schematically.
  • the printed circuit board assembly 35 is encased with a first plastic body 2. This consists in the present case of a thermoset material. Thus, the circuit board assembly 35 is protected against mechanical influences and against the ingress of corrosive liquids. Furthermore, the printed ⁇ tenan Aunt 35 is thus sealed off so that it is no longer accessible without destruction or damage of the first plastic body. 2 As a result, manipulations or manipulation attempts can be reliably detected.
  • a conductive sheath 3 is attached, which is presently designed as a metal layer. This serves to further shield against electrical or electromagnetic interference.
  • the BGA component 6 is shielded in the present case by means of a surrounding shield 4.
  • This is also formed of metal and forms in the present case a closed housing for separate shielding of the component 6. It is surrounded by the first plastic body 2 or embedded in this. It should be noted that a perforated design of the shield 4 would be possible.
  • the vehicle communication module 30 further comprises a formant ⁇ nenstecker 5, which enables connection of an external antenna.
  • This may in particular be a typical communications antenna for motor vehicles, which can for example be designed for the reception of Satellitennavigationssig ⁇ dimensional as well as for sending and receiving wireless signals.
  • the antenna connector 5 as shown with the circuit board 1 is connected so that signals through the antenna At ⁇ plug 5 can be transmitted and received.
  • the vehicle communication module 30 further includes a plug 9. This is sprayed separately in the present case, wherein it consists in particular of a thermoplastic.
  • a connector terminal 10 is formed, which serves to connect the circuit board 1 by means of wired connections. So that the vehicle communication module 30 may be connected to other driving ⁇ compelling components wired. Even with such vehicle components thus communication is possible. Moreover, a power supply of the vehicle communication module 30 can thereby be achieved.
  • the conductive sheath 3 is connected by means of a connection 11 with the printed circuit board 1. As a result, a potential equalization can be achieved.
  • two stress decoupling structures 12 in the form of beads are embodied in the conductive sheath 3. This can compensate for stresses that can arise due to thermal expansion or other influences.
  • the vehicle communication module 30 further includes a 3D interior antenna 13. This has a form that meets the requirements of high-frequency technology and is compatible with the terplatte 1 electrically connected. Furthermore, it is covered by the first plastic body 2 and thereby mechanically protects ⁇ ge. In particular, it serves for the wireless connection setup with other vehicle components or also with devices which are kept ready by users or occupants of the vehicle.
  • connection 16 of the conductive sheath 2 to the printed circuit board 1 is provided. This has the same function as described above for the connection 11.
  • a contact switch 17 is formed in the conductive sheath 3. This is realized by a delimited and to the rest of the conductive sheath 2 electrically insulated part of the conductive sheath 2. It is connected to the circuit board 1. It can then be evaluated by the printed circuit board 1 or components applied thereto, if an object or, for example, a human hand is contacted with the contact switch 17 and the remainder of the conductive sheath 2. In this case, a certain, measurable current flow can flow through the contact switch 17, which can be detected accordingly. For this purpose, in particular a voltage can be applied.
  • a planar inner antenna 18 is formed in the conductive sheath 2, which is also formed as part electrically insulated from the rest of the conductive sheath 2 and structured to function as an antenna.
  • This can also be used to establish radio links to other vehicle components or devices in the passenger compartment. For example, this can be done using technologies such as WLAN or Bluetooth.
  • the vehicle communication module 30 also has an LED 20, with which an operating state can be displayed. As shown, this is mounted in a region in which the circuit board 1 is not surrounded by the first plastic body 2. However, it should be understood that such an LED can be arranged at ⁇ example, also spaced from the circuit board 1, so that the circuit board 1 can be completely surrounded by the first plastic body 2. Furthermore, the vehicle communication module 30 has a socket 21, by means of which the vehicle communication module 30 can be mounted in a vehicle. For this purpose, a rod through the sleeve 21 can be passed in ⁇ play, so that the vehicle communication module can be fixed 30th
  • Fig. 2 shows a vehicle communication module 30 according to a second embodiment of the invention.
  • further plastic bodies 22 are provided, which additionally encase components 6, 14. These are also formed of a thermoset material and are embedded in the first plastic body 2.
  • an underfiller you can fulfill special requirements. For example, they can provide additional mechanical protection. For cost reasons, they are typically used only for critical components.
  • the conductive sheath 3 is again enveloped, namely by a second plastic body 23.
  • the second plastic body 23 is formed in this case from a thermoplastic.
  • additional protection in particular mechanical protection, can be achieved.
  • a thermoset material for the first plastic body 2 and a thermoplastic material for the second plastic body 23 particularly advantageous properties are achieved, since the respective advantages of the different materials are combined.
  • Fig. 4 shows a vehicle communication module 30 in a ty ⁇ European installation situation.
  • all embodiments or other exporting ⁇ conclusions described herein can be used in particular.
  • the vehicle communication module 30 is embedded between a vehicle roof 40 and an inner lining 45. Immediately above the vehicle communication module 30 be ⁇ there is an external antenna 50 which is connected via a ⁇ transformants nenelektronik 55 and a connector 37 to the vehicle communication module 30th For this purpose, in particular the already mentioned above antenna connector 5 can be used.
  • the vehicle communication module 30 communicates via the external antenna 50 with external radio stations such as other vehicles, mobile masts or mobile networks or other radio stations or receives signals from external radio stations as in ⁇ example of navigation satellites or radio stations .
  • external radio stations such as other vehicles, mobile masts or mobile networks or other radio stations or receives signals from external radio stations as in ⁇ example of navigation satellites or radio stations .
  • All features described below can be combined with each other and with all features described above in any combinations and sub-combinations.
  • the disclosure of this application also includes any selection, combination or sub-combination of features described above, wherein one or more of the features described below are explicitly excluded from protection.
  • the following statements may, for example, be understood as an independent description of an invention or as a specification of the invention already described above.
  • a circuit board 1 is provided, which is equipped with the necessary components, such as electronic components.
  • an electrical and mechanical protection is preferably a sheath 2 of a thermoset material, which is surrounded by a conductive layer 3.
  • This conductive layer advantageously protects the electronic components against ESD or EMC damage and can be suitably structured so that antennas and / or switches can be realized.
  • This layer can also be used as an adhesive adhesion layer in addition to heat dissipation.
  • Fig. 2 The embodiment of FIG. 2, in comparison to the embodiment of FIG. 1 preferably additionally partially gemmedged Underfiiier 22 on.
  • thermoset material advantageously serves for a better mechanical connection, for example of the BGA (Ball Grid Array) ICs to the Ladder lath, for better heat dissipation and protection of the solder joints against environmental influences and mechanical stress (alternating stress).
  • BGA Ball Grid Array
  • the underfillers 22 can be basically partially or fully gemoldet.
  • Fig. 3 The embodiment of FIG. 3, in comparison to the embodiments of Figures 1 and 2, preferably in addition to an at least partial encapsulation of the thermoset 2 with a thermoplastic 23.
  • Fig. 4 An embodiment of an electronic device according to an embodiment of the invention in a vehicle.
  • the design of the outer contour of the communication module can be customized to the shape / contour of the installation site. For this purpose, a sectional view of the roof ⁇ area of a passenger compartment of a car is sketched in Fig. 4.
  • thermosetting material Through the casing of an IC with a further thermosetting material it is ensured that the IC can not be unsoldered without cerium ⁇ interference of the assembly and / or replaced. This property is of the highest priority in safety-relevant applications, as planned for direct access to the internal communication of a vehicle. As a result, assemblies that are equipped with custom-coded ICs, protected against tampering. Also, manipulation can be safely detected.
  • Circuit board 1 For example, PCB FR4 / FR5 for SMD assembly. Preference is given to a moldable base material with a separate surface finish and treatment (plasma).
  • Duroplast Mold 2 Duroplast material with adapted thermal, mechanical and electrical (damping) properties, which is processed, for example, by means of transfer, injection or compression molding.
  • Metal layer 3 prepared by sputtering, chemical deposition, gal ⁇ vanisches coating, dip coating, dispensing, spraying, vapor deposition, plasma coating, or combinations thereof conductive layer. Preference is given to metal. By plasma treatment the adhesion can be improved.
  • the surface can be structured by suitable methods so that functional elements such as planar antennas and / or switches arise.
  • the structuring takes place during the coating or is carried out subsequently (for example by means of a laser).
  • the conductive layer may be low impedance or magnetic or a combination thereof.
  • Shield 4 Preferably closed or perforated housing for separate shielding of ICs or sensors. Is electrically connected in particular directly to the circuit board.
  • Antenna plug 5 Preferably direct and separate connection of the external antenna to the communication module. No Jardinan ⁇ binding required as a connection element, whereby a very good RF technical connection is achieved.
  • the external antenna can preferably also be connected via terminal plug, similar to connector terminal 10.
  • IC 6 Preferably designed as a shielded BGA-IC or sensor with bottom-mounted solder joints.
  • Heatsink 7 Preferably ceramic or metal body, which serves for heat absorption and heat conduction of the heat generated in the IC. In particular, thermally and mechanically strong connection to the IC.
  • SMD component 8 Preferably use of standard SMD components.
  • Plug 9 Preferably separately molded plug, preferably made of thermoplastic.
  • Connector terminal 10 Preferably forms the connection of the communication module to other electronic components of the vehicle, such as the central electronics. Includes in particular the connection to the power supply and sig ⁇ nalkanäle. Conveniently, electrically connected directly to the Lei ⁇ terplatte. The mechanical fixation is preferably carried out in the mold body 2.
  • the connector terminals can in particular additionally serve as transport and / or handling assistance.
  • Connection 11 Metal layer to printed circuit board Preferably forms an electrical connection between the metal layer 3 and the printed circuit board by means of the through-hole method.
  • Inner antenna 13 Preferably the requirements of RF technology corresponding 3D shape, which is electrically connected to the circuit board and is mechanically protected by the mold body.
  • power device fourteenth Heat sink 15 Like 7.
  • Connection 16 metal layer to circuit board Like 11.
  • Contact switch 17 preferably to a changed resistance, e.g. Skin resistance, or an altered capacity, reactive switching device.
  • Planar inner antenna 18 Preferably, metal layer 3 is patterned in such a way that forms an RF antenna.
  • a means for internal communication in the passenger compartment e.g. WLAN, Bluetooth realized.
  • the antenna plug 5 is preferably designed as one or more press-in pins.
  • the mechanical fixation of the individual press-in pins preferably takes place via the molded spacers. Additional pre-molded pins can hold the printed circuit board in the specified horizontal position during molding.
  • LED 20 Preferably display or communication element for defined operating conditions or for IR communication in the passenger compartment. Can be additionally protected with a transparent gel. Socket 21: is preferably used for fixing the Kommunikati ⁇ onsmoduls.
  • Partial Premold 22 Preferably thermoset material that meets the specific requirements as an Underfiiier. There are enveloped in particular for cost reasons only selected, example ⁇ as critical components.
  • the communication module is preferably additionally enveloped at least partially with a thermoplastic.
  • the invention also relates to an electronic device for forming a transceiver module for connection to at least one antenna comprising at least one connecting means for contacting the at least one antenna, at least one printed circuit board, which is connectable by means of the connecting means with the at least one antenna, at least one the printed circuit board at least partially enclosing enclosure, which is formed in particular of a thermoset material, wherein the enclosure is at least partially surrounded by a conductive layer.
  • the invention relates to the use of such a device or any device described herein.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Fittings On The Vehicle Exterior For Carrying Loads, And Devices For Holding Or Mounting Articles (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

L'invention concerne un module de communication pour véhicule comprenant un ensemble carte de circuit imprimé entouré d'au moins un premier corps en matière plastique.
PCT/DE2017/200027 2016-03-29 2017-03-27 Module de communication pour véhicule WO2017167333A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE112017000404.7T DE112017000404A5 (de) 2016-03-29 2017-03-27 Fahrzeugkommunikationsmodul

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DE102016205133.4 2016-03-29
DE102016205133 2016-03-29
DE102016216997.1 2016-09-07
DE102016216997.1A DE102016216997A1 (de) 2016-03-29 2016-09-07 Fahrzeugkommunikationsmodul

Publications (1)

Publication Number Publication Date
WO2017167333A1 true WO2017167333A1 (fr) 2017-10-05

Family

ID=59885281

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2017/200027 WO2017167333A1 (fr) 2016-03-29 2017-03-27 Module de communication pour véhicule

Country Status (2)

Country Link
DE (2) DE102016216997A1 (fr)
WO (1) WO2017167333A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102018221971A1 (de) * 2018-12-17 2020-06-18 Psa Automobiles Sa Kraftfahrzeug Sende- und/oder Empfangseinheit
EP3879561A1 (fr) * 2020-03-10 2021-09-15 Sensirion AG Procédé de fabrication d'un dispositif électronique

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009019369A1 (de) * 2008-05-05 2009-12-10 GM Global Technology Operations, Inc., Detroit System und Verfahren zur Initialisierung einer sicheren drahtlosen Kommunikation
US20140277234A1 (en) * 2013-03-12 2014-09-18 Cardiac Pacemakers, Inc. Implantable medical device and assmebly thereof
US20150116955A1 (en) * 2012-05-31 2015-04-30 Mikuni Corporation Engine control unit

Family Cites Families (3)

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Publication number Priority date Publication date Assignee Title
DE102009051605B4 (de) * 2009-11-02 2022-08-18 Continental Automotive Gmbh Hochintegrierte Multiband-Finnenantenne für ein Fahrzeug
DE102012208303B4 (de) * 2012-05-16 2014-05-15 Continental Automotive Gmbh Antennenmodul mit Sende- und Empfangsantennenelement
DE102013218022A1 (de) * 2013-09-10 2015-03-12 Continental Automotive Gmbh Antennenmodul für ein Kraftfahrzeug mit mindestens einem Funkantennenelement sowie einem zugehörigen Kommunikationsmodul

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009019369A1 (de) * 2008-05-05 2009-12-10 GM Global Technology Operations, Inc., Detroit System und Verfahren zur Initialisierung einer sicheren drahtlosen Kommunikation
US20150116955A1 (en) * 2012-05-31 2015-04-30 Mikuni Corporation Engine control unit
US20140277234A1 (en) * 2013-03-12 2014-09-18 Cardiac Pacemakers, Inc. Implantable medical device and assmebly thereof

Also Published As

Publication number Publication date
DE112017000404A5 (de) 2018-09-20
DE102016216997A1 (de) 2017-10-05

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