WO2017162821A3 - Filament mit lichtemittierenden halbleiterchips, leuchtmittel damit, und verfahren zur herstellung eines solchen filaments - Google Patents

Filament mit lichtemittierenden halbleiterchips, leuchtmittel damit, und verfahren zur herstellung eines solchen filaments Download PDF

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Publication number
WO2017162821A3
WO2017162821A3 PCT/EP2017/056985 EP2017056985W WO2017162821A3 WO 2017162821 A3 WO2017162821 A3 WO 2017162821A3 EP 2017056985 W EP2017056985 W EP 2017056985W WO 2017162821 A3 WO2017162821 A3 WO 2017162821A3
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WO
WIPO (PCT)
Prior art keywords
filament
light
producing
semiconductor chips
emitting semiconductor
Prior art date
Application number
PCT/EP2017/056985
Other languages
English (en)
French (fr)
Other versions
WO2017162821A2 (de
Inventor
Thomas Schlereth
Elena RACHKOVA
Michael Bestele
Ivar Tangring
Original Assignee
Osram Opto Semiconductors Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors Gmbh filed Critical Osram Opto Semiconductors Gmbh
Priority to CN201780019584.9A priority Critical patent/CN109073165B/zh
Priority to DE112017001510.3T priority patent/DE112017001510B4/de
Priority to US16/087,949 priority patent/US10731797B2/en
Publication of WO2017162821A2 publication Critical patent/WO2017162821A2/de
Publication of WO2017162821A3 publication Critical patent/WO2017162821A3/de

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/27—Retrofit light sources for lighting devices with two fittings for each light source, e.g. for substitution of fluorescent tubes
    • F21K9/275—Details of bases or housings, i.e. the parts between the light-generating element and the end caps; Arrangement of components within bases or housings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0091—Scattering means in or on the semiconductor body or semiconductor body package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Optics & Photonics (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Led Device Packages (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

Die Erfindung betrifft ein Filament (100) mit einer Mehrzahl von lichtemittierenden Halbleiterchips (110), die auf einem Träger (130) angeordnet und elektrisch kontaktiert sind. Es ist eine Streustruktur (105) vorgesehen, die eingerichtet ist, Licht der lichtemittierenden Halbleiterchips (110) zu streuen, und die mittels einer Strukturierung einer Oberfläche des Filaments (100) ausgeführt ist. Außerdem betrifft die Erfindung ein Leuchtmittel (200) mit einem solchen Filament (100), einem Kolben (210) aus einem transparenten Material und einer elektrischen Kontaktierung (220), die mit dem Filament (100) elektrisch leitfähig verbunden ist. Der Kolben (210) ist mit einem Gas gefüllt. Ferner betrifft die Erfindung ein Verfahren zur Herstellung eines solchen Filaments (100), bei dem ein Konverter (140) durch einen Spritzgussprozess mittels eines Spritzgusswerkzeugs erzeugt wird und eine Strukturierung einer Oberfläche (141) des Konverters (140) durch die Form des Spritzgusswerkzeugs erzielt wird. Außerdem betrifft die Erfindung ein Verfahren zur Herstellung eines solchen Filaments (100), bei dem eine Strukturierung einer Unterseite (131) des Trägers (130) durch einen Säge-, Schleif-, Ätz- oder Laserstrukturierungsprozess erzeugt wird.
PCT/EP2017/056985 2016-03-24 2017-03-23 Filament mit lichtemittierenden halbleiterchips, leuchtmittel und verfahren zur herstellung eines filaments WO2017162821A2 (de)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN201780019584.9A CN109073165B (zh) 2016-03-24 2017-03-23 具有发光半导体芯片的灯丝、照明装置和用于制造灯丝的方法
DE112017001510.3T DE112017001510B4 (de) 2016-03-24 2017-03-23 Filament mit lichtemittierenden halbleiterchips, leuchtmittel und verfahren zur herstellung eines filaments
US16/087,949 US10731797B2 (en) 2016-03-24 2017-03-23 Filament with light-emitting semiconductor chips, lighting means and method of producing a filament

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102016105537.9A DE102016105537A1 (de) 2016-03-24 2016-03-24 Filament mit lichtemittierenden halbleiterchips, leuchtmittel und verfahren zur herstellung eines filaments
DE102016105537.9 2016-03-24

Publications (2)

Publication Number Publication Date
WO2017162821A2 WO2017162821A2 (de) 2017-09-28
WO2017162821A3 true WO2017162821A3 (de) 2017-11-30

Family

ID=58410329

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2017/056985 WO2017162821A2 (de) 2016-03-24 2017-03-23 Filament mit lichtemittierenden halbleiterchips, leuchtmittel und verfahren zur herstellung eines filaments

Country Status (4)

Country Link
US (1) US10731797B2 (de)
CN (1) CN109073165B (de)
DE (2) DE102016105537A1 (de)
WO (1) WO2017162821A2 (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102018118822A1 (de) * 2018-08-02 2020-02-06 Osram Opto Semiconductors Gmbh Leuchtfadenvorrichtung und verfahren zur herstellung einer leuchtfadenvorrichtung
JP2022524356A (ja) 2019-03-14 2022-05-02 シグニファイ ホールディング ビー ヴィ Ｌｅｄフィラメント構成
CN114423988B (zh) 2019-09-18 2024-03-29 昕诺飞控股有限公司 Led灯丝灯
EP4038310A1 (de) 2019-10-03 2022-08-10 Signify Holding B.V. Led-filament-beleuchtungsvorrichtung
WO2021099262A1 (en) 2019-11-18 2021-05-27 Signify Holding B.V. A led filament lamp
CN115698582A (zh) 2020-06-08 2023-02-03 昕诺飞控股有限公司 具有闪烁效果的发光设备
CN114659044A (zh) * 2022-05-06 2022-06-24 杭州杭科光电集团股份有限公司 一种led灯丝的制作方法、led灯丝支架、led灯丝、灯泡以及灯泡的制作方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090321759A1 (en) * 2008-06-27 2009-12-31 Tao Xu Surface-textured encapsulations for use with light emitting diodes
US20110058372A1 (en) * 2010-08-27 2011-03-10 Quarkstar, Llc Solid State Bidirectional Light Sheet for General Illumination
CN203273326U (zh) * 2013-01-22 2013-11-06 浙江中宙照明科技有限公司 一种led照明装置
CN203895450U (zh) * 2014-04-11 2014-10-22 临安市新三联照明电器有限公司 一种360度发光的柱状led灯丝
US20140369036A1 (en) * 2013-06-17 2014-12-18 Shenzhen Runlite Technology Co.,Ltd. Led light and filament thereof
DE102014100584A1 (de) * 2014-01-20 2015-07-23 Osram Gmbh Verfahren zum Herstellen von optoelektronischen Halbleiterbauteilen und optoelektronisches Halbleiterbauteil
EP2911194A1 (de) * 2014-02-21 2015-08-26 Dongguan Meisheng Electrical Products Co., Ltd. Leuchtdioden (LED) Lichtquellenmodul und Herstellungsverfahren dafür

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Publication number Priority date Publication date Assignee Title
JP4986735B2 (ja) * 2007-06-25 2012-07-25 京セラ株式会社 照明用光源
US8198109B2 (en) 2010-08-27 2012-06-12 Quarkstar Llc Manufacturing methods for solid state light sheet or strip with LEDs connected in series for general illumination
JP2012146738A (ja) * 2011-01-07 2012-08-02 Stanley Electric Co Ltd Ｌｅｄモジュール及びｌｅｄランプ
US9166116B2 (en) * 2012-05-29 2015-10-20 Formosa Epitaxy Incorporation Light emitting device
US9353932B2 (en) * 2013-03-13 2016-05-31 Palo Alto Research Center Incorporated LED light bulb with structural support
DE102016105211A1 (de) 2016-03-21 2017-09-21 Osram Opto Semiconductors Gmbh Filament und dessen Herstellung sowie Leuchtmittel mit Filamenten

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090321759A1 (en) * 2008-06-27 2009-12-31 Tao Xu Surface-textured encapsulations for use with light emitting diodes
US20110058372A1 (en) * 2010-08-27 2011-03-10 Quarkstar, Llc Solid State Bidirectional Light Sheet for General Illumination
CN203273326U (zh) * 2013-01-22 2013-11-06 浙江中宙照明科技有限公司 一种led照明装置
US20140369036A1 (en) * 2013-06-17 2014-12-18 Shenzhen Runlite Technology Co.,Ltd. Led light and filament thereof
DE102014100584A1 (de) * 2014-01-20 2015-07-23 Osram Gmbh Verfahren zum Herstellen von optoelektronischen Halbleiterbauteilen und optoelektronisches Halbleiterbauteil
EP2911194A1 (de) * 2014-02-21 2015-08-26 Dongguan Meisheng Electrical Products Co., Ltd. Leuchtdioden (LED) Lichtquellenmodul und Herstellungsverfahren dafür
CN203895450U (zh) * 2014-04-11 2014-10-22 临安市新三联照明电器有限公司 一种360度发光的柱状led灯丝

Also Published As

Publication number Publication date
US20190113181A1 (en) 2019-04-18
DE102016105537A1 (de) 2017-09-28
WO2017162821A2 (de) 2017-09-28
DE112017001510A5 (de) 2019-01-17
US10731797B2 (en) 2020-08-04
CN109073165A (zh) 2018-12-21
DE112017001510B4 (de) 2023-02-16
CN109073165B (zh) 2021-03-30

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