WO2017145936A1 - Method for manufacturing wiring board or wiring board material - Google Patents

Method for manufacturing wiring board or wiring board material Download PDF

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Publication number
WO2017145936A1
WO2017145936A1 PCT/JP2017/005924 JP2017005924W WO2017145936A1 WO 2017145936 A1 WO2017145936 A1 WO 2017145936A1 JP 2017005924 W JP2017005924 W JP 2017005924W WO 2017145936 A1 WO2017145936 A1 WO 2017145936A1
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WO
WIPO (PCT)
Prior art keywords
wiring board
columnar metal
prepreg
metal
thermosetting resin
Prior art date
Application number
PCT/JP2017/005924
Other languages
French (fr)
Japanese (ja)
Inventor
吉村 栄二
Original Assignee
株式会社Daiwa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2016031180 priority Critical
Priority to JP2016-031180 priority
Priority to JP2016090098 priority
Priority to JP2016-090098 priority
Priority to JP2016223970A priority patent/JP2017201679A/en
Priority to JP2016-223970 priority
Application filed by 株式会社Daiwa filed Critical 株式会社Daiwa
Priority claimed from KR1020187027262A external-priority patent/KR20180116349A/en
Publication of WO2017145936A1 publication Critical patent/WO2017145936A1/en

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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/12Mountings, e.g. non-detachable insulating substrates
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/11Printed elements for providing electric connections to or between printed circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits

Abstract

Provided are a method for manufacturing a wiring board or a wiring board material, and a resultant wiring board. The method allows columnar metal members to be inserted into the wiring board at once using a simple operation, enables alignment without requiring strict accuracy, can handle columnar metal members of different shapes, and imparts sufficiently high adhesive strength to the columnar metal members. The method comprises: a step in which a support sheet 10 on which columnar metal members 14 have been formed, and a laminate material LM including a wiring board WB or a wiring board material WB' having a plurality of openings in portions corresponding to the columnar metal members 14, and a prepreg 16' having a plurality of openings and containing a thermosetting resin are laminated such that the columnar metal members 14 are positioned in the respective openings; a step of obtaining a laminate LB by integrating the laminate material LM by heating and pressing, the laminate LB having a thermosetting resin 17 filling gaps between an inner surface of the openings of the wiring board WB or the wiring board material WB' and the columnar metal members 14; and a step of peeling at least the support sheet 10 from the laminate LB.

Description

Manufacturing method of wiring board or wiring board material

The present invention relates to a method of manufacturing a wiring board or wiring board material in which a columnar metal body is embedded in a wiring board, and a wiring board obtained thereby, as a board having good heat dissipation characteristics used for an inverter device, an LED board, and the like. Useful.

There is known a method of dissipating heat from the back surface of the wiring board in order to suitably cool heat-generating parts such as LEDs and QFN (Quad For Non-Lead Package) mounted on the wiring board. For example, a heat dissipating structure is known in which a metal plate (heat dissipating terminal) provided on the lower surface of a heat generating component is soldered to a land on the mounting surface of the wiring board, and heat is dissipated to the back side of the wiring board through this land and plated through hole. Yes. Furthermore, in order to improve the heat dissipation to the back surface side, a method of adopting coin-shaped copper (copper inlay) instead of the plated through hole and soldering the heat radiating terminal of the heat generating component on the copper inlay is known.

As a technique related to a wiring board provided with such a copper inlay, a wiring board disclosed in the following Patent Document 1 is known. In this wiring board, a heat transfer member is press-fitted into a portion where a heat generating component is mounted, and a large-diameter portion is formed on the press-fitting side periphery of a fitting hole into which the heat transfer member is fitted. And the flange part engaged with a large diameter part in the said press-fit state is formed in the heat-transfer member. Accordingly, the insertion depth of the heat transfer member can be easily made constant without strictly controlling the pressure input of the heat transfer member to the insertion hole, and the press-fitting accuracy of the heat transfer member and the press-fitting work thereof. Improves sex.

Further, Patent Document 2 below proposes a soldering material in which a heat transfer member corresponding to a copper inlay is covered with solder and inserted into a plated through hole. In this manner, by using solder bonding, a structure in which the heat transfer member is difficult to drop off can be obtained.

JP 2009-170493 A Japanese Patent Laying-Open No. 2015-133373

However, in both of the substrate structures described in Patent Documents 1 and 2, since the copper inlay is inserted into the through hole, high accuracy is required for alignment, and the insertion process becomes complicated. There is. Moreover, since the press-fitting device for automation is used when inserting the copper inlay, the copper inlay needs to have the same shape, and the degree of freedom in designing the copper inlay is small.

Further, in the structure of Patent Document 2, although the bonding strength of the heat transfer member is increased, it is necessary to coat each heat transfer member with solder or the like, and it is also necessary to increase the accuracy of the thickness to be covered. It was not expensive.

Therefore, an object of the present invention is to enable the columnar metal bodies to be inserted into the wiring board all at once with a simple operation, and the alignment accuracy is not strictly required, and can be applied to columnar metal bodies of different shapes. It is an object of the present invention to provide a method of manufacturing a wiring board or wiring board material having a sufficiently high adhesive strength, and a wiring board obtained thereby.

The above object of the present invention can be achieved by the present invention as follows.
That is, the method for manufacturing a wiring board or a wiring board material according to the present invention includes a support sheet having a plurality of columnar metal bodies and a wiring board or wiring board material having a plurality of openings in portions corresponding to the columnar metal bodies. Including a step of preparing a laminated material in which the columnar metal body is positioned inside the opening, and a thermosetting resin is filled between the inner surface of the opening of the wiring board or the wiring board material and the columnar metal body. A step of obtaining a cured laminate, and a step of peeling at least the support sheet from the laminate.

According to the method for manufacturing a wiring board or a wiring board material of the present invention, a laminate material in which the columnar metal body is located inside an opening of the wiring board or the wiring board material is used, and the gap between the inner surface of the opening and the columnar metal body. Since the thermosetting resin is filled and cured, the columnar metal bodies can be collectively inserted into the wiring board by a simple operation, and a wiring board or wiring board material having a sufficiently high adhesion strength of the columnar metal bodies can be obtained. At that time, since there is a gap between the inner surface of the opening and the columnar metal body, alignment accuracy is not strictly required, and the planar view shape of the opening and the columnar metal body can be freely determined. It is possible to deal with cases where the columnar metal bodies have different shapes.

Moreover, another method for manufacturing a wiring board or wiring board material according to the present invention includes a step of forming a plurality of columnar metal bodies on a support sheet, a support sheet on which the columnar metal bodies are formed, and the columnar metal body. A wiring board or wiring board material having a plurality of openings in a corresponding portion, and a laminate material including a prepreg having a plurality of openings in a portion corresponding to the columnar metal body and containing a thermosetting resin, each opening. The step of laminating the columnar metal body inside the substrate and the laminated material are integrated by heating and pressurizing, and heat is generated between the inner surface of the opening of the wiring board or the wiring substrate material and the columnar metal body. The method includes a step of obtaining a laminate filled with a curable resin and a step of peeling at least the support sheet from the laminate.

According to the method for manufacturing a wiring board or wiring board material of the present invention, a wiring board or wiring board material having a plurality of openings in a portion corresponding to the columnar metal body is used to integrate with the support sheet on which the columnar metal body is formed. The columnar metal bodies can be collectively inserted into the wiring board by a simple operation. At this time, since an opening having a space filled with a thermosetting resin is formed later, alignment accuracy is not strictly required, and an opening corresponding to the shape of the columnar metal body can be formed. Can also be supported. In addition, since the thermosetting resin is filled between the inner surface of the opening and the columnar metal body by integration by heating and pressing, a wiring board having a sufficiently high adhesive strength of the columnar metal body is obtained.

In the above, the step of forming the columnar metal body preferably forms a plurality of columnar metal bodies by etching the metal plate attached to the support sheet. When etching a metal plate attached to a support sheet, an etching pattern (position of a mask or the like) can be determined in accordance with a position where a columnar metal body is inserted based on design information of a wiring board. It can flexibly cope with columnar metal bodies of different shapes. Moreover, since the columnar metal body formed by etching has a peripheral wall that is curved in the longitudinal cross-sectional shape (peripheral peripheral wall, etc.), the contact area is increased as compared with the one having a straight peripheral wall in the longitudinal cross-sectional shape, and the columnar metal body The adhesive strength between the metal body and the thermosetting resin can be further increased.

Moreover, it is preferable that the laminated material includes a plurality of the wiring boards or wiring board materials and the prepreg interposed therebetween. Thus, by interposing a prepreg inside, it can be used as it is without peeling off the prepreg. Moreover, since it is integrated with the thermosetting resin from which the prepreg starts to spread, the adhesive strength by the thermosetting resin can be further increased.

At that time, the laminate material includes the prepreg and a single-sided metal-clad laminate having a plurality of openings in portions corresponding to the columnar metal bodies, which are arranged on both sides of the prepreg with the metal layer facing outside. Is preferred. A single-sided metal-clad laminate as a wiring board material is a widely used material, has high adhesion to a prepreg, and can provide a double-sided metal-clad laminate in which a columnar metal body is inserted. Further, this can be further plated with a metal or patterned to produce a wiring board.

Alternatively, the laminated material includes the prepreg interposed between the wiring board or the wiring board material and the support sheet, and may include a step of peeling the prepreg from the laminated body. . Even with such a laminated material, since the thermosetting resin is filled between the inner surface of the opening and the columnar metal body by integration by heating and pressing, a wiring board having a sufficiently high adhesion strength of the columnar metal body is obtained. can get.

Furthermore, the laminated material includes the prepreg on the wiring board or the wiring board material, and may include a step of peeling the prepreg from the laminated body. Even with such a laminated material, since the thermosetting resin is filled between the inner surface of the opening and the columnar metal body by integration by heating and pressing, a wiring board having a sufficiently high adhesion strength of the columnar metal body is obtained. can get.

Further, the laminated material includes a resin film that adheres to the surface of the wiring board or the wiring board material and has a plurality of openings in a portion corresponding to the columnar metal body, and the resin film is removed from the laminated body. It is preferable to include a peeling step. By using such a resin film, it is possible to prevent the prepreg from adhering to the surface of the wiring board and becoming difficult to peel off.

Furthermore, it is preferable to include a step of chemically and / or physically surface-treating the columnar metal body using a support sheet on which the columnar metal body is formed. By such a surface treatment, it becomes possible to further increase the adhesive force between the periphery of the columnar metal body and the thermosetting resin.

Note that a plated through hole may be formed in the opening of the wiring board or wiring board material. In this case, a cured product obtained by filling a thermosetting resin between the inner surface of the plated through hole and the columnar metal body is obtained.

On the other hand, the wiring board of the present invention includes a wiring board having an opening, a columnar metal body located inside the opening, and a thermosetting resin that is filled and cured between the inner surface of the opening and the columnar metal body. It is characterized by including these. According to the wiring board of the present invention, since the thermosetting resin is filled and cured between the inner surface of the opening of the wiring board and the columnar metal body, the columnar metal bodies are collectively packaged with a simple operation. In addition, the alignment accuracy is not strictly required, it can be applied to columnar metal bodies having different shapes, and the adhesion strength of the columnar metal bodies is sufficiently high.

In the above, a plated through hole may be formed in the opening of the wiring board. In this case, a cured product obtained by filling a thermosetting resin between the inner surface of the plated through hole and the columnar metal body is obtained.

Another wiring board of the present invention has an insulating layer, a columnar metal body embedded in the insulating layer, and a wiring layer, and the insulating layer contains a cured product of the prepreg and oozes from the prepreg. The periphery of the columnar metal body is bonded to the insulating layer by the thermosetting resin that has been taken out.

According to the wiring board of the present invention, since the periphery of the columnar metal body is bonded to the insulating layer by the thermosetting resin that has oozed from the prepreg, the columnar metal bodies can be inserted into the wiring board in a simple operation. In addition, the alignment accuracy is not strictly required, it can be applied to columnar metal bodies having different shapes, and the adhesive strength of the columnar metal bodies is sufficiently high.

Another wiring board of the present invention has an insulating layer, a columnar metal body embedded in the insulating layer, and a wiring layer, and the thermosetting resin different from the resin component of the insulating layer, The periphery of the columnar metal body is bonded to the insulating layer. As described above, since the periphery of the columnar metal body is bonded to the insulating layer by a thermosetting resin different from the resin component of the insulating layer, which is derived from the prepreg, the columnar metal bodies can be collected together by a simple operation. Therefore, the alignment accuracy is not strictly required, it can be applied to columnar metal bodies having different shapes, and the adhesion strength of the columnar metal bodies is sufficiently high.

In the above, it is preferable that the columnar metal body has a peripheral wall that is curved in a longitudinal sectional shape. By having such a peripheral wall, the contact area is increased as compared with the one having a straight peripheral wall in the longitudinal cross-sectional shape, and the adhesive strength between the columnar metal body and the thermosetting resin can be further increased.

The wiring layer preferably has a pattern portion extending on at least one surface of the columnar metal body. With such a pattern portion, the columnar metal bodies embedded in the insulating layer can be bonded more firmly.

Sectional drawing which shows an example of 1st Embodiment in the manufacturing method of the wiring board or wiring board material of this invention Sectional drawing which shows an example of 1st Embodiment in the manufacturing method of the wiring board or wiring board material of this invention Sectional drawing which shows an example of 2nd Embodiment in the manufacturing method of the wiring board or wiring board material of this invention Sectional drawing which shows an example of 3rd Embodiment in the manufacturing method of the wiring board or wiring board material of this invention Sectional drawing which shows an example of another embodiment in the manufacturing method of the wiring board or wiring board material of this invention Sectional drawing which shows an example of another embodiment in the manufacturing method of the wiring board or wiring board material of this invention Sectional drawing which shows an example of the columnar metal body in this invention It is a figure which shows an example of the formation method of the columnar metal body in this invention, (a) is a perspective view which shows the shape of the metal plate after an etching, (b) is a perspective view which shows the state which peeled the metal plate, c) is a cross-sectional view showing the obtained columnar metal body Sectional drawing which shows an example of the process of another embodiment for manufacturing the wiring board of this invention. Sectional drawing which shows an example of the process of 4th Embodiment for manufacturing the wiring board of this invention. Sectional drawing which shows an example of the process of another embodiment for manufacturing the wiring board of this invention. Sectional drawing which shows an example of the process of another embodiment for manufacturing the wiring board of this invention.

Embodiments of the present invention will be described with reference to the drawings. The method for manufacturing a wiring board or wiring board material according to the present invention includes a first embodiment in which a prepreg is interposed between a plurality of wiring boards or wiring board materials, and a first embodiment in which a prepreg is laminated below the wiring board or wiring board material. There are two embodiments, a third embodiment in which a prepreg is laminated above a wiring board or wiring board material, and a fourth embodiment in which no prepreg is used.

In the first to third embodiments, for example, as shown in FIGS. 1 and 2, etc., a step of forming a plurality of columnar metal bodies 14 on the support sheet 10 and a support sheet on which the columnar metal bodies 14 are formed. 10, a wiring board WB or wiring board material WB ′ having a plurality of openings in a portion corresponding to the columnar metal body 14, and a prepreg having a plurality of openings in a portion corresponding to the columnar metal body 14 and containing a thermosetting resin And laminating the laminated material LM containing 16 'so that the columnar metal bodies 14 are positioned inside the respective openings, and the laminated material LM are integrated by heating and pressing to form the wiring board WB or the wiring board material WB. Including a step of obtaining a laminate LB filled with the thermosetting resin 17 between the inner surface of the opening of 'and the columnar metal body 14, and a step of peeling at least the support sheet 10 from the laminate LB. And

On the other hand, in the fourth embodiment, for example, as shown in FIG. 10, a support sheet 10 in which a plurality of columnar metal bodies 14 are formed, and a wiring board WB or wiring having a plurality of openings in portions corresponding to the columnar metal bodies 14. It is only necessary to have a step of preparing a laminated material LM including the substrate material WB ′ and in which the columnar metal body 14 is located inside the opening, and the lamination of the prepreg 16 ′ is not essential. Each embodiment will be described below.

(First embodiment)
The present invention includes a step of forming a plurality of columnar metal bodies 14 on a support sheet 10 as shown in FIGS. 1 (a) to 1 (d), for example. In this embodiment, the process of forming the columnar metal body 14 shows an example in which the metal plate 4 attached to the support sheet 10 via the adhesive layer 2 is etched to form a plurality of columnar metal bodies 14.

As shown in FIGS. 7A to 7B, the columnar metal body 14 formed by etching has a peripheral wall 14a that is curved in the longitudinal sectional shape. FIG. 7A shows a case where the etching time is relatively short, and FIG. 7B shows a case where the etching time is relatively long.

When etching is performed, it is possible to perform etching using the etching resist M only at the formation position of the columnar metal body 14 (see FIG. 1C), but as shown in FIG. It is preferable to perform etching using an etching resist M in which only the periphery of the formation position is exposed.

That is, as shown in FIGS. 8A to 8B, after etching only the periphery of the formation position of the columnar metal body 14 in the metal plate 4, the remaining metal plate 4 other than the columnar metal body 14 remains. A plurality of columnar metal bodies 14 can be formed on the support sheet 10 by peeling off the portion 4a.

In this way, by using the etching resist M in which only the periphery of the formation position of the columnar metal body 14 is exposed, the amount of etching solution used can be reduced and deterioration can be prevented, and the peeled metal plate 4 can be removed. It can be easily recycled. In addition, as shown in FIG. 8C, a portion having the smallest diameter or outer peripheral length (undercut) is formed at an intermediate portion (the center of the height or a position above and below the height) of the columnar metal body 14. be able to. Thereby, the drop prevention effect of the columnar metal body 14 can be further enhanced.

In the present invention, it is preferable to include a step of chemically and / or physically surface-treating the columnar metal body 14 using the support sheet 10 on which the columnar metal body 14 is formed. Examples of such surface treatment include chemical treatment called blackening treatment and physical treatment such as sandblasting.

The metal constituting the metal plate 4 may be any metal, such as copper, copper alloy, aluminum, stainless steel, nickel, iron, and other alloys. Of these, copper or a copper alloy is preferable from the viewpoints of thermal conductivity and solderability.

As the support sheet 10, a resin sheet, a rubber sheet, a metal sheet, or the like can be used, but a resin sheet such as polyester, polyamide, or polyimide is preferable. In particular, polyesters such as polyethylene terephthalate and polyethylene naphthalate, which have heat resistance and low cost, are preferable.

The adhesive layer 2 may be any material as long as a metal and a resin can be bonded to each other. Examples of the adhesive layer 2 include a reaction curing type, a thermosetting type, a pressure-sensitive adhesive type (adhesive), and a hot melt type. Can be used. As the adhesive, a rubber adhesive, an acrylic adhesive, a silicone adhesive, or the like can be used. In addition, the metal plate 4 and the support sheet 10 are directly heat-bonded without interposing the adhesive layer 2, the metal plate 4 is formed on the support sheet 10 by plating, or a resin is applied to the metal plate 4. It is also possible.

Regarding the thickness of each layer, for example, the thickness of the support sheet 10 is 30 to 1000 μm, the thickness of the adhesive layer 2 is 1 to 30 μm, and the thickness of the metal plate 4 is 100 to 2000 μm.

Using such a laminate, the metal plate 4 is etched to form a plurality of columnar metal bodies 14 on the support sheet 10. The columnar metal body 14 can be formed at a position where a semiconductor element or the like is mounted by etching.

Etching can be performed by selective etching of the metal plate 4 using an etching resist M as shown in FIGS. 1B to 1C, for example. The size of the columnar metal body 14 can be made smaller than the size of the semiconductor element to be mounted. For example, the diameter of the upper surface is 0.3 to 10 mm. The shape of the upper surface of the columnar metal body 14 may be any shape such as a quadrangle or a circle.

Etching resist M can be a photosensitive resin or a dry film resist (photoresist). Examples of the etching method include etching methods using various etching solutions according to the type of metal constituting the metal plate 4. For example, when the metal plate 4 is copper, a commercially available alkaline etching solution, ammonium persulfate, hydrogen peroxide / sulfuric acid, or the like can be used.

As shown in FIG. 1D, the etching resist M is removed after the etching. The etching resist M can be removed by chemical or mechanical peeling.

Next, as shown in FIGS. 1 (e) to 2 (f), a support sheet 10 on which a columnar metal body 14 is formed, and a wiring board having a plurality of openings 19a and 20a in portions corresponding to the columnar metal body 14 A laminated material LM including a WB or a wiring board material WB ′ and a prepreg 16 ′ having a plurality of openings 16 a in a portion corresponding to the columnar metal body 14 and including a thermosetting resin 17 is formed into each of the openings 19 a, 20 a, A step of laminating is performed so that the columnar metal body 14 is positioned inside 16a. In the first embodiment, an example in which the laminated material LM includes a plurality of wiring boards WB or wiring board materials WB 'and a prepreg 16' interposed therebetween.

In particular, in the illustrated example, the laminated material LM has a plurality of openings 19a and 20a in a portion corresponding to the columnar metal body 14 arranged with the prepreg 16 ′ and the metal layer 20 ′ on both sides of the prepreg ′. An example in which the metal layer 20 ′ of the upper single-sided metal-clad laminate is covered with a mask material 21 is shown. In this example, the mask material 21 has a plurality of openings 21 a in portions corresponding to the columnar metal bodies 14.

The opening 16a of the prepreg 16 'can be formed by a drill or a punch. The size of the opening 16 a is preferably slightly larger than the upper surface of the columnar metal body 14. The shape of the upper surface of the columnar metal body 14 and the shape of the opening 16a and the like do not necessarily match, and both may be the same shape or different shapes (the same applies to other openings).

The prepreg 16 ′ may be any material as long as it contains a thermosetting resin, and any material can be used as long as it is deformed when heated and pressurized and solidified by heating or the like and has heat resistance required for the wiring board. Good. Specific examples include composites of various thermosetting resins such as epoxy resin, phenol resin, and polyimide resin, and reinforcing fibers such as glass fiber, ceramic fiber, aramid fiber, and paper.

Further, the prepreg 16 ′ is preferably made of a material having high heat conductivity, and examples thereof include a resin containing a heat conductive filler.

As the resin constituting the prepreg 16 ′, a resin that is excellent in adhesive strength with the columnar metal body 14 and that does not impair withstand voltage characteristics or the like is preferable. As such a resin, an epoxy resin, a phenol resin, a polyimide resin, and various engineering plastics can be used singly or as a mixture of two or more, and among them, an epoxy resin is excellent in bonding strength between metals. preferable. In particular, among epoxy resins, bisphenol A type epoxy resins, bisphenol F type epoxy resins, hydrogenated bisphenol A type epoxy resins, and hydrogenated bisphenols that have high fluidity and excellent mixing properties with metal oxides and metal nitrides. F type epoxy resins, triblock polymers having bisphenol A type epoxy resin structures at both ends, and triblock polymers having bisphenol F type epoxy resin structures at both ends are more preferred resins.

The wiring board WB or the wiring board material WB 'has a plurality of openings 19a and 20a in portions corresponding to the columnar metal bodies 14, as shown in FIG. The openings 19a and 20a can be formed by a drill or a punch. The sizes of the openings 19 a and 20 a are preferably slightly larger than the upper surface of the columnar metal body 14.

A single-sided metal-clad laminate such as a copper-clad laminate usually has a cured insulating layer 19 ′ adhered to the metal layer 20 ′. In the present invention, however, the prepreg 16 ′ allows the wiring substrate WB or the wiring substrate material WB. It is possible to use a pre-cured insulating layer since it can be bonded to each other. Further, a patterned metal layer 20 ′ may be provided on the surface of the cured insulating layer 19 ′.

As the material of the cured insulating layer 19 ′, a material hardened by using the same material as the prepreg 16 ′ as described above can be used. Note that the metal layer 20 ′ and the insulating layer 19 ′ may be stacked as an integrated unit or may be stacked separately.

Also, the metal layer 20 'may be any metal, such as copper, copper alloy, aluminum, stainless steel, nickel, iron, and other alloys. Of these, copper and aluminum are preferable from the viewpoint of thermal conductivity and electrical conductivity.

In this embodiment, as shown in FIG. 1E, a mask material having a third opening 21a in the same portion as the openings 19a and 20a and pasted on the wiring board WB or the wiring board material WB ′. The example which prepares 21 and prepares the laminated body LB using the mask material 21 is shown.

The mask material 21 may be affixed on the wiring board WB or the wiring board material WB ', or may be disposed only on the wiring board WB or the forming material WB'. Moreover, as the mask material 21, it is also possible to use a material that does not have the third opening 21a.

In the present invention, it is preferable to form the openings 19a, 20a and the third opening 21a at the same time in a state where the mask material 21 is pasted on the wiring board WB or the wiring board material WB ′, but these are formed separately. It is also possible to do.

The mask material 21 is preferably a resin film, and any of polyesters such as polyethylene terephthalate, polyolefins such as polyethylene and polypropylene, and polyamides can be used. However, polyesters such as polyethylene terephthalate are preferable from the viewpoint of heat resistance.

Further, when the mask material 21 is attached, it is preferable to provide an adhesive layer on the mask material 21. As the adhesive, a rubber adhesive, an acrylic adhesive, a silicone adhesive, or the like can be used. Instead of providing the pressure-sensitive adhesive layer on the mask material 21, a pressure-sensitive adhesive layer can be separately applied and formed.

Next, as shown in FIG. 2G, the laminated material LM is integrated by heating and pressurization, and between the inner surfaces of the openings 19a and 20a of the wiring board WB or the wiring board material WB ′ and the columnar metal body 14. The process of obtaining the laminated body LB filled with the thermosetting resin 17 is implemented. Thereby, it is possible to form a stacked body in which the height of the columnar metal body 14 is the same as or higher than the surface of the wiring board WB or the wiring board material WB ′.

2 (g), the prepreg 16 'becomes a cured product 16, and the upper surface of the columnar metal body 14 is covered with the thermosetting resin 17 of the prepreg 16' so that the projection A is provided. In addition, a part of the thermosetting resin 17 of the prepreg 16 ′ may cover the periphery of the third opening 21 a, but due to the presence of the mask material 21, the prepreg is formed on the surface of the wiring board WB or the wiring board material WB ′. It is possible to effectively prevent the 16 ′ thermosetting resin 17 from adhering. That is, even if the periphery of the third opening 21 a of the mask material 21 is covered with the thermosetting resin 17 of the prepreg 16 ′, the thermosetting resin 17 of the prepreg 16 ′ is removed only by removing the mask material 21. Is possible.

For the heating and pressing, a method of heating and pressing with a pressing surface can be adopted, and at least a concave deformation is formed between the pressing surface and the laminated body so that the protrusion A can be easily formed at a position corresponding to the columnar metal body 14. It is preferable to arrange a sheet material that permits the above. When the sheet material is not disposed, the height of the convex portion A is the same position as the upper surface of the mask material 21. Moreover, you may use the press surface which has a recessed part in the position corresponding to the columnar metal body 14. FIG.

As a heating press method, a heating / pressurizing device (thermal laminator, heating press) or the like may be used, and in this case, the atmosphere may be set to a vacuum (vacuum laminator or the like) in order to avoid air contamination. Conditions such as heating temperature and pressure may be appropriately set according to the material and thickness of the prepreg and the metal layer forming material, but the pressure is preferably 0.5 to 30 MPa.

The sheet material may be any material that allows concave deformation at the time of heating press, such as cushion paper, rubber sheet, elastomer sheet, nonwoven fabric, woven fabric, porous sheet, foam sheet, metal foil, and composites thereof. Can be mentioned. In particular, those that can be elastically deformed, such as cushion paper, rubber sheets, elastomer sheets, foam sheets, and composites thereof, are preferable.

Next, as shown in FIG. 2 (h), at least the thermosetting resin 17 covering the columnar metal body 14 is removed. That is, the convex part A above the columnar metal body 14 is removed, and the upper surface of the columnar metal body 14 is exposed. When removing the projection A, it is preferable to remove and flatten the upper surface of the metal layer 20 ′ and the height of the columnar metal body 14. However, in order to easily remove the thermosetting resin 17, it is ideal that the columnar metal body 14 is higher than the upper surface of the metal layer 20 '.

In the present embodiment, the mask material 21 is removed prior to the removal of the protrusions A. However, the mask material 21 can be removed at the same time as the thermosetting resin 17 is removed.

As a method for removing the convex portion A, a method by grinding or polishing is preferable. A method using a grinding device having a hard rotating blade in which a plurality of hard blades made of diamond or the like are arranged in the radial direction of the rotating plate, a sander, a belt sander , A method using a grinder, a surface grinder, a hard abrasive molded article, or the like. When the grinding apparatus is used, the upper surface can be flattened by moving the hard rotary blade along the upper surface of the fixedly supported wiring board while rotating the hard rotary blade. Moreover, as a grinding | polishing method, the method of lightly grind | polishing by a belt sander, buff grinding | polishing, etc. is mentioned.

Next, as shown in FIG. 2 (i), a step of peeling at least the support sheet 10 from the laminate LB is performed. Thereby, the wiring board material before pattern formation can be obtained. In this embodiment, the support sheet 10 to which the adhesive layer 2 is attached is peeled together with the adhesive layer 2. At this time, the adhesive force between the columnar metal body 14 and the adhesive layer 2 is set to be smaller than the adhesive force between the columnar metal body 14 and the thermosetting resin 17. With such an adhesive force, the adhesive layer 2 can be easily peeled from the metal layer 20 ′ of a single-sided metal-clad laminate such as a copper-clad laminate.

When the wiring board material WB ′ is laminated and integrated as in the present embodiment, the metal layer 20 ′ is patterned as necessary. Prior to this, as shown in FIG. 2 (j), the exposed columnar metal body 14 and the metal layer 20 'can be metal-plated to form a metal plating layer 18'. Thereby, a wiring substrate having a pattern portion extending on at least one surface of the columnar metal body 14 can be obtained. As the metal species for metal plating, for example, copper, silver, Ni and the like are preferable. Examples of the method for forming the metal plating layer 18 ′ include a combination of an electroless plating method and electrolytic plating.

The pattern formation of the metal plating layer 18 'and the metal layer 20' as shown in FIG. 2 (k) can be performed as follows. For example, the patterned wiring layer 18 can be formed by etching the metal plating layer 18 ′ and the metal layer 20 ′ with a predetermined pattern using an etching resist.

Etching resist removal may be selected as appropriate according to the type of etching resist, such as chemical removal and stripping removal. For example, in the case of photosensitive ink formed by screen printing, it is removed with chemicals such as alkali.

As described above, as shown in FIG. 2K, the insulating layer IL, the columnar metal body 14 embedded in the insulating layer IL, and the wiring layer 18 are provided. It is possible to obtain a wiring board that includes the cured product 16 and has the periphery of the columnar metal body 14 bonded to the insulating layer IL by the thermosetting resin 17 exuded from the prepreg.

The wiring board of the present invention is useful as a substrate for mounting semiconductor elements, and particularly useful as a substrate for mounting power semiconductor elements and light emitting elements. Here, the semiconductor element includes a semiconductor bare chip, a chip component, and a semiconductor package, and the power semiconductor element includes semiconductor elements such as various transistors and various diodes used in an inverter device, a voltage conversion device, and the like.

These power semiconductor element packages generally include a metal heat sink in addition to the leads. For example, the heat sink is equipotential with the cathode in a diode, and an electrode with the same potential as the heat sink is determined according to the package form.

Examples of the semiconductor element 30 include bipolar power transistors, MOSFETs, IGBTs, and FWDs (free wheeling diodes). In addition to a conventional semiconductor element using Si, a semiconductor element using SiC (silicon carbide) or GaN (gallium nitride) can be used.

(Second Embodiment)
The second embodiment of the present invention will be described with respect to differences from the first embodiment. The second embodiment also includes a step of forming a plurality of columnar metal bodies 14 on the support sheet 10, but for example, as shown in FIGS. 1 (a) to 1 (d), as in the first embodiment. Can be implemented.

In the second embodiment, as shown in FIGS. 3E to 3F, the laminated material LM includes a prepreg 16 ′ interposed between the wiring board WB or the wiring board material WB ′ and the support sheet 10. It is out. In the present embodiment, an example is shown in which the lower side of the wiring board WB or the wiring board material WB ′ is covered with a mask material 21 such as a resin film. Thereby, when the prepreg 16 ′ is peeled from the wiring board WB or the wiring board material WB ′, it can be easily peeled off. As the mask material 21, the same material as in the first embodiment can be used.

Next, as shown in FIG. 3G, the laminated material LM is integrated by heating and pressurization, and between the inner surfaces of the openings 19a and 20a of the wiring board WB or the wiring board material WB ′ and the columnar metal body 14. The process of obtaining the laminated body LB filled with the thermosetting resin 17 is implemented. Thereby, it is possible to form the stacked body LB in which the height of the columnar metal body 14 is equal to or higher than the surface of the wiring board WB or the wiring board material WB ′.

Thereafter, as shown in FIG. 3H, the thermosetting resin (convex portion A) covering the upper surface of the columnar metal body 14 is removed in the same manner as in the first embodiment. When the upper surface of the columnar metal body 14 is higher than the surface of the wiring board WB or the wiring board material WB ′, the columnar metal body 14 can be removed as much as necessary.

In the second embodiment, as shown in FIGS. 3 (i) to 3 (j), after the support sheet 10 is peeled from the laminate LB, a step of peeling the cured product 16 of the prepreg 16 ′ is performed. Thereby, the cured product 16 of the prepreg 16 ′ can be broken at the boundary with the thermosetting resin 17 covering the periphery of the columnar metal body 14, and the cured product 16 of the prepreg 16 ′ can be peeled from the laminate LB. . At this time, it is also possible to peel the support sheet 10 and the prepreg 16 'simultaneously. In this embodiment, the example which peels the lower mask material 21 further is shown.

As a result, as shown in FIG. 3 (j), a laminated body LB in which the columnar metal body 14 protruding downward and the thermosetting resin 17 covering the periphery thereof is obtained. Although it is possible to use this as it is, it is preferable that the lower surface of the stacked body LB is flat.

For this reason, as shown in FIG. 3 (k), a laminated body LB having a flat bottom surface can be obtained by cutting the columnar metal body 14 and the thermosetting resin 17 or the like. Such a cutting process can be performed in the same manner as the cutting of the upper surface of the columnar metal body 14 in the first embodiment. Thereby, the wiring board material before pattern formation can be obtained.

Furthermore, as in the first embodiment, a wiring board having a wiring layer can be obtained by forming a metal plating layer or patterning the metal plating layer.

(Third embodiment)
The third embodiment of the present invention will be described with respect to differences from the first embodiment. The third embodiment also includes a step of forming a plurality of columnar metal bodies 14 on the support sheet 10, but for example, as shown in FIGS. 1 (a) to 1 (d), as in the first embodiment. Can be implemented.

In the third embodiment, as shown in FIGS. 4E to 4F, the laminated material LM includes the prepreg 16 'on the wiring board WB or the wiring board material WB'. In the present embodiment, an example is shown in which the upper and lower sides of the wiring board WB or the wiring board material WB ′ are covered with a mask material 21 such as a resin film. Accordingly, when the cured product 16 of the prepreg 16 ′ is peeled from the wiring board WB or the wiring board material WB ′, it can be easily peeled off. As the mask material 21, the same material as in the first embodiment can be used.

Next, as shown in FIG. 4G, the laminated material LM is integrated by heating and pressurization, and between the inner surfaces of the openings 19 a and 20 a of the wiring board WB or the wiring board material WB ′ and the columnar metal body 14. The process of obtaining the laminated body LB filled with the thermosetting resin 17 is implemented. Accordingly, it is possible to form the stacked body LB in which the height of the columnar metal body 14 is higher than the surface of the wiring board WB or the wiring board material WB ′.

Thereafter, as shown in FIG. 4 (h), a step of peeling the cured product 16 of the prepreg 16 'from the laminate LB is performed. Thereby, the cured product 16 of the prepreg 16 ′ can be broken at the boundary with the thermosetting resin 17 covering the periphery of the columnar metal body 14, and the cured product 16 of the prepreg 16 ′ can be peeled from the laminate LB. .

Next, as shown in FIG. 4I, in the same manner as in the first embodiment, after the mask material 21 is peeled off, the thermosetting resin (convex portion A) covering the upper surface of the columnar metal body 14 is removed. . In addition, since the upper surface of the columnar metal body 14 is higher than the surface of the wiring board WB or the wiring board material WB ′, it is preferable to remove the columnar metal body 14 by cutting or the like.

In the third embodiment, as shown in FIG. 4 (j), the support sheet 10 is peeled from the laminate LB. Although it is possible to peel the support sheet 10 and the mask material 21 at the same time, in this embodiment, an example in which the lower mask material 21 is separately peeled is shown.

Thereby, a laminated body LB in which the columnar metal body 14 protruding downward by the thickness of the mask material 21 and the thermosetting resin 17 covering the periphery thereof is obtained. Although it is possible to use this as it is, it is preferable that the lower surface of the stacked body LB is flat.

For this reason, as shown in FIG. 4 (k), by cutting the lower surface of the columnar metal body 14, a laminate LB having a flat lower surface can be obtained. Such a cutting process can be performed in the same manner as the cutting of the upper surface of the columnar metal body 14 in the first embodiment. Thereby, the wiring board material before pattern formation can be obtained.

Furthermore, as in the first embodiment, a wiring board having a wiring layer can be obtained by forming a metal plating layer or patterning the metal plating layer.

(Fourth embodiment)
The fourth embodiment of the present invention will be described with respect to differences from the first embodiment. In the fourth embodiment, for example, as shown in FIG. 10 (f), the support sheet 10 having a plurality of columnar metal bodies 14 and a wiring board WB having a plurality of openings in portions corresponding to the columnar metal bodies 14 or Including a wiring board material WB ′, and a step of preparing a laminated material LM in which the columnar metal body 14 is located inside the opening.

This step may include a step of forming a plurality of columnar metal bodies 14 on the support sheet 10, in which case, for example, as shown in FIGS. 1 (a) to 1 (d), It can be implemented in the same way.

Further, as shown in FIGS. 10E to 10F, the support sheet 10 having the adhesive layer 2, the wiring board WB having the plurality of openings 19a and 20a, and the openings 19a and 20a overlap each other. The columnar metal bodies 14 may be arranged so as to be stacked and located inside the opening. Instead of the support sheet 10 having the adhesive layer 2, a support sheet 10 having no adhesive layer 2 can be used. Further, as illustrated, the upper and lower sides of the wiring board WB may be covered with a mask material 21 such as a resin film.

In the fourth embodiment, as shown in FIGS. 10E to 10F, the laminated material LM does not include the prepreg 16 '. In the present embodiment, an example is shown in which the upper and lower sides of the wiring board WB are covered with a mask material 21 such as a resin film. Thereby, when peeling the hardened | cured material of the thermosetting resin 17 from the wiring board WB, it becomes possible to peel easily. As the mask material 21, the same material as in the first embodiment can be used.

Next, as illustrated in FIG. 10G, a laminate LB is obtained in which the thermosetting resin 17 is filled between the inner surface of the opening of the wiring board WB or the wiring board material WB ′ and the columnar metal body 14 and cured. Perform the process. Accordingly, it is possible to form the stacked body LB in which the height of the columnar metal body 14 is higher than the surface of the wiring board WB or the wiring board material WB ′.

The method of filling the thermosetting resin 17 may be any of various printing using an ink jet printer, partial application using a dispenser, partial filling using a squeegee, spraying, application using a curtain coater, or the like. Among these, an ink jet printer is preferably used from the viewpoint of efficiently filling. In addition, when performing the whole application | coating, it is preferable to remove the excess thermosetting resin 17 by the method of peeling the mask material 21, the method of grind | polishing, etc.

In addition, when the thermosetting resin 17 is filled, the atmosphere is under reduced pressure, so that the gap between the inner surface of the opening and the columnar metal body 14 can be more reliably filled with the thermosetting resin 17. Become. That is, even when voids or voids are generated in the thermosetting resin 17 filled in a reduced-pressure atmosphere, the voids and voids can be reduced or eliminated by returning to atmospheric pressure after filling.

In addition, the thermosetting resin 17 may be a resin that cures at room temperature after filling (reaction curing type), but a resin that cures by heating may be used and a heating process may be employed for curing. . In the heating step, it is possible to use not only a heating device equipped with a heater but also a hot press device capable of simultaneously pressing.

Thereafter, as shown in FIG. 10 (j), after the mask material 21 is peeled in the same manner as in the first embodiment, the thermosetting resin that covers the upper surface of the columnar metal body 14 is removed as necessary. . Further, when the upper surface of the columnar metal body 14 is higher than the surface of the wiring board WB or the wiring board material WB ', it is preferable to remove the columnar metal body 14 by cutting or the like.

Furthermore, in the fourth embodiment, as shown in FIGS. 10J to 10K, the support sheet 10 is peeled from the laminate LB. Although it is possible to peel the support sheet 10 and the mask material 21 at the same time, in this embodiment, an example in which the lower mask material 21 is separately peeled is shown.

Thereby, a laminated body LB in which the columnar metal body 14 protruding downward by the thickness of the mask material 21 and the thermosetting resin 17 covering the periphery thereof is obtained. Although it is possible to use this as it is, it is preferable that the lower surface of the stacked body LB is flat.

For this reason, as shown in FIG. 10 (k), by cutting the lower surface of the columnar metal body 14, a laminated body LB having a flat lower surface can be obtained. Such a cutting process can be performed in the same manner as the cutting of the upper surface of the columnar metal body 14 in the first embodiment. Thereby, the wiring board material before pattern formation can be obtained.

Instead of the wiring board WB, it is also possible to use a wiring board material WB 'that is not patterned. In that case, the wiring board which has a wiring layer can be obtained by forming a metal plating layer or patterning a metal plating layer like 1st Embodiment.

That is, according to the fourth embodiment, as shown in FIG. 10 (k), the wiring board WB having an opening, the columnar metal body 14 located inside the opening, the inner surface of the opening, and the columnar metal body 14 And a thermosetting resin 17 filled and cured between the wiring board and the wiring board can be manufactured.

(Another embodiment)
(1) In the above-described embodiment, an example in which the metal plate attached to the support sheet is etched to form a plurality of columnar metal bodies has been shown. However, a plurality of columnar metal bodies previously formed by etching or other methods are used. It is also possible to adhere to the support sheet. In that case, it is also possible to transfer and attach a plurality of columnar metal bodies to a support sheet from a transfer sheet in which a plurality of columnar metal bodies are positioned in advance, or to sequentially attach individual columnar metal bodies to a support sheet using a mounting device or the like. . Examples of the columnar metal body formed by a method other than etching include metal pins and metal plates manufactured by stamping and molding. Such a columnar metal body can have a three-dimensional shape in which the cross-sectional shape does not change in the thickness direction.

(2) In the above-described embodiment, the example in which the wiring board or the like is manufactured using the wiring board material WB ′ before forming the wiring pattern is shown. However, as shown in FIG. It is also possible to use a wiring board WB having 19. The illustrated example corresponds to the second embodiment in which the prepreg 16 ′ is laminated below the wiring board WB or the wiring board material WB ′, but the wiring board is also used in the first embodiment and the third embodiment. A wiring board or the like can be manufactured using the material WB ′.

First, as shown in FIG. 5 (e), the support sheet 10 on which the columnar metal body 14 is formed, the wiring board WB having a plurality of openings 19 a and 20 a in portions corresponding to the columnar metal body 14, and the columnar metal body 14. Is laminated so that the columnar metal body 14 is located inside each of the openings 19a, 20a, 16a. To do. At this time, it is preferable that both surfaces of the wiring board WB are covered with the mask material 21, and it is more preferable that the mask material 21 has a plurality of openings 21 a in portions corresponding to the columnar metal bodies 14.

Next, as shown in FIG. 5G, the laminated material LM is integrated by heating and pressing, and a thermosetting resin 17 is provided between the inner surfaces of the openings 19 a and 20 a of the wiring board WB and the columnar metal body 14. A step of obtaining the filled laminate LB is performed. Thereby, the stacked body LB in which the height of the columnar metal body 14 is the same as or higher than the upper surface of the wiring board WB can be formed.

Thereafter, as shown in FIG. 5 (j), in the same manner as in the first embodiment, the mask material 21 on the upper surface is peeled off, and the thermosetting resin (convex portion A) covering the upper surface of the columnar metal body 14 is removed. To do. When the upper surface of the columnar metal body 14 is higher than the upper surface of the wiring board WB, the columnar metal body 14 can be removed as much as necessary.

In the second embodiment, as shown in FIG. 5 (j), after the support sheet 10 is peeled from the laminate LB, a step of peeling the cured product 16 of the prepreg 16 'is performed. Thereby, the cured product 16 of the prepreg 16 ′ can be broken at the boundary with the thermosetting resin 17 covering the periphery of the columnar metal body 14, and the cured product 16 of the prepreg 16 ′ can be peeled from the laminate LB. . At this time, it is also possible to peel the support sheet 10 and the prepreg 16 'simultaneously. In this embodiment, the example which peels the lower mask material 21 further is shown. Thereby, the laminated body LB in which the columnar metal body 14 protruding downward and the thermosetting resin 17 covering the periphery thereof is obtained. Although it is possible to use this as it is, it is preferable that the lower surface of the stacked body LB is flat.

For this reason, as shown in FIG. 5 (k), by cutting the lower surface of the columnar metal body 14 and the thermosetting resin 17, a laminated body LB having a flat lower surface can be obtained. Such a cutting process can be performed in the same manner as the cutting of the upper surface of the columnar metal body 14 in the first embodiment.

Thus, the insulating layer IL, the columnar metal body 14 embedded in the insulating layer IL, and the wiring layer (wiring pattern 20) are included. The insulating layer IL includes the cured product 16 of the prepreg 16 ′, and is insulated. A wiring board in which the periphery of the columnar metal body 14 is bonded to the insulating layer IL by the thermosetting resin 17 different from the resin component of the layer IL can be obtained.

As shown in the example, when a double-sided wiring board is used, it is preferable to have an interlayer connection structure such as a plated through hole, a metal bump, a filled via, or a plated via.

(3) In the above-described embodiment, the example in which the first embodiment is implemented using the wiring board material WB ′ before forming the wiring pattern is shown. However, as shown in FIG. It is also possible to implement the first embodiment using the wiring board WB having the layer 19.

First, as shown in FIG. 6E, the support sheet 10 in which the columnar metal body 14 is formed, the two wiring boards WB having a plurality of openings 19a and 20a in portions corresponding to the columnar metal body 14, A laminated material LM including a prepreg 16 ′ having a plurality of openings 16 a in a portion corresponding to the columnar metal body 14 and including the thermosetting resin 17 is disposed inside the openings 19 a, 20 a, and 16 a. Laminate so that the body 14 is located. At this time, it is preferable that the upper surface of the upper wiring substrate WB and the lower surface of the lower wiring substrate WB are covered with the mask material 21, and the mask material 21 has a plurality of portions corresponding to the columnar metal bodies 14. More preferably, it has an opening 21a.

Next, as shown in FIG. 6G, the laminated material LM is integrated by heating and pressing, and a thermosetting resin 17 is provided between the inner surfaces of the openings 19 a and 20 a of the wiring board WB and the columnar metal body 14. A step of obtaining the filled laminate LB is performed. Thereby, the stacked body LB in which the height of the columnar metal body 14 is the same as or higher than the upper surface of the wiring board WB can be formed.

Thereafter, as shown in FIG. 6 (j), in the same manner as in the first embodiment, the mask material 21 on the upper surface is peeled off, and the thermosetting resin (convex portion A) covering the upper surface of the columnar metal body 14 is removed. To do. When the upper surface of the columnar metal body 14 is higher than the upper surface of the wiring board WB, the columnar metal body 14 can be removed as much as necessary.

Next, as shown in FIG. 6 (k), the support sheet 10 is peeled from the laminate LB.

Further, as shown in FIG. 6 (l), the mask material 21 is peeled from the laminated body LB. Thereby, the laminated body LB in which the columnar metal body 14 protruding downward and the thermosetting resin 17 covering the periphery thereof is obtained. Although it is possible to use this as it is, it is preferable that the lower surface of the stacked body LB is flat.

For this reason, as shown in FIG. 6 (m), by cutting the lower surface of the columnar metal body 14 and the thermosetting resin 17, a laminated body LB having a flat lower surface can be obtained. Such a cutting process can be performed in the same manner as the cutting of the upper surface of the columnar metal body 14 in the first embodiment.

Thus, the insulating layer IL, the columnar metal body 14 embedded in the insulating layer IL, and the wiring layer (wiring pattern 20) are included. The insulating layer IL includes the cured product 16 of the prepreg 16 ′, and A wiring board in which the periphery of the columnar metal body 14 is bonded to the insulating layer IL by the thermosetting resin 17 that has oozed out of the prepreg can be obtained.

As shown in the example, when a double-sided wiring board is used, it is preferable to have an interlayer connection structure such as a plated through hole, a metal bump, a filled via, or a plated via.

(4) In the above-described embodiment, an example in which a laminated body is formed using a mask material has been described. However, in the present invention, a wiring board or a material for forming the laminated body is laminated without using a mask material, and the laminated body is formed. It is also possible to form. In that case, there are cases where the thermosetting resin of the prepreg is coated around the opening of the wiring board or its forming material, but this can be removed in a later step.

(5) In the above-described embodiment, the example in which the thickness of the wiring layer of the wiring board WB to be used is normal, but in the present invention, a thicker wiring layer (for example, more than half the thickness of the insulating layer) is used. It is also possible to use a wiring board WB having the same. Also, a structure in which the columnar metal bodies 14 are connected with the same thickness pattern, or a structure in which a wiring pattern with the same thickness as the columnar metal bodies 14 is embedded in the insulating layer independently of the columnar metal bodies 14 may be used. Is possible.

(6) The wiring board of the present invention can be manufactured by a method other than the manufacturing method of the present invention described above. An example of such a manufacturing method is a manufacturing method according to the process shown in FIG.

First, as shown in FIGS. 9E to 9F, a support sheet 10 having an adhesive layer 2, a wiring board WB having a plurality of openings 19a and 20a, and a thermosetting having a plurality of openings 16a. A prepreg 16 ′ including the resin 17 is laminated so that the openings 19 a, 20 a, and 16 a overlap each other, and the columnar metal body 14 is disposed so as to be positioned inside the openings. Instead of the support sheet 10 having the adhesive layer 2, a support sheet 10 having no adhesive layer 2 can be used.

In other words, the openings 19a, 20a, and 16a are provided at portions corresponding to positions where the columnar metal bodies 14 are provided. In addition, it is preferable that both surfaces of the wiring board WB are covered with the mask material 21, and it is more preferable that the mask material 21 has a plurality of openings 21 a in portions corresponding to the columnar metal bodies 14.

Next, as shown in FIG. 9G, the laminated material LM is integrated by heating and pressing, and a thermosetting resin 17 is provided between the inner surfaces of the openings 19a and 20a of the wiring board WB and the columnar metal body 14. A step of obtaining the filled laminate LB is performed. Thereby, the stacked body LB in which the height of the columnar metal body 14 is the same as or higher than the upper surface of the wiring board WB can be formed.

Thereafter, as shown in FIG. 9 (j), after the support sheet 10 having the adhesive layer 2 is peeled from the laminate LB, the cured product 16 of the prepreg 16 'and the mask material 21 on the upper surface are peeled off. As a result, the cured product 16 of the prepreg 16 ′ breaks at the boundary with the thermosetting resin 17 existing around the columnar metal body 14, and together with the thermosetting resin 17 covering the upper surface of the columnar metal body 14, the prepreg 16 'hardened | cured material 16 can be peeled from the laminated body LB. When the upper surface of the columnar metal body 14 is higher than the upper surface of the wiring board WB, the columnar metal body 14 can be removed as much as necessary.

In this example, as shown in FIG. 9 (j), a laminated body LB in which a columnar metal body 14 protruding downward and a thermosetting resin 17 covering the periphery thereof is obtained is used as it is. Although it is possible, it is preferable that the lower surface of the laminated body LB is flat.

For this reason, as shown in FIG. 9 (k), it is preferable to cut the lower surface of the columnar metal body 14 and the thermosetting resin 17, so that a laminated body LB having a flat lower surface can be obtained. Such a cutting process can be performed in the same manner as the cutting of the upper surface of the columnar metal body 14 in the first embodiment.

Thus, the insulating layer IL, the columnar metal body 14 embedded in the insulating layer IL, and the wiring layer (wiring pattern 20) are included. The insulating layer IL includes the cured product 16 of the prepreg 16 ′, and is insulated. A wiring board in which the periphery of the columnar metal body 14 is bonded to the insulating layer IL by the thermosetting resin 17 different from the resin component of the layer IL can be obtained.

(7) In the above-described embodiment, the example in which the plated through hole 30 is not formed in the opening of the wiring board WB or the wiring board material WB ′ is shown. However, as shown in FIG. It may be formed. In the second to fourth embodiments, the plated through hole 30 can be formed in the opening of the wiring board WB or the wiring board material WB ′.

In that case, for example, as shown in FIG. 11 (f), the support sheet 10 having a plurality of columnar metal bodies 14 and a plurality of openings corresponding to the columnar metal bodies 14 have a plurality of openings, and the openings are plated. A step of preparing a laminated material LM including the wiring board WB or the wiring board material WB ′ in which the through hole 30 is formed and in which the columnar metal body 14 is located inside the opening is performed.

Next, as shown in FIG. 11G, for example, a thermosetting resin 17 is filled between the inner surface of the plated through hole 30 in the opening of the wiring board WB or the wiring board material WB ′ and the columnar metal body 14 and cured. A step of obtaining the laminated body LB is performed.

In the illustrated example, the heights of the upper and lower surfaces of the columnar metal body 14 coincide with the upper and lower surfaces of the wiring board WB or the wiring board material WB '. For this reason, as shown in FIG. 11 (j), the wiring board WB having an opening, the columnar metal body 14 located inside the opening, and the opening can be obtained simply by peeling the support sheet 10 from the laminate LB. And a thermosetting resin 17 filled and cured between the inner surface of the substrate and the columnar metal body 14 can be manufactured.

Further, by using the wiring board WB or the wiring board material WB ′ in which the plated through hole 30 is formed, a wiring board in which the plated through hole is formed in the opening can be manufactured.

(8) In the fourth embodiment described above, the example in which the patterned wiring board WB is used has been described. However, as shown in FIG. 12, it is also possible to use the wiring board material WB ′ before pattern formation. . In the illustrated example, a plurality of columnar metal bodies 14 made of pins are used instead of etching.

In the above case, for example, as shown in FIG. 12 (f), the support sheet 10 in which a plurality of pins that are columnar metal bodies 14 are formed, and a wiring board material having a plurality of openings in portions corresponding to the columnar metal bodies 14. A step of preparing a laminated material LM including WB ′ and in which the columnar metal body 14 is located inside the opening is performed. As the wiring board material WB ′, a material in which a metal layer 20 ′ is formed on both surfaces of the insulating layer 19 can be used.

Next, for example, as shown in FIG. 12G, a thermosetting resin 17 is filled between the inner surface of the plated through hole 30 in the opening of the wiring board material WB ′ and the columnar metal body 14 by printing or the like. At this time, the vicinity of the upper surface of the thermosetting resin 17 after filling is convex, and is cured by heating or the like.

Next, as shown in FIG. 12 (j), the convex portions near the upper surface of the cured thermosetting resin 17 are removed to obtain a laminate LB having a flat upper surface and cured thermosetting resin 17. In the illustrated example, the height of the upper surface of the columnar metal body 14 coincides with the upper surface of the wiring board material WB '. For this reason, as shown in FIG. 12 (k), the heights of the upper surface and the lower surface of the columnar metal body 14 are reduced by simply peeling the support sheet 10 from the laminate LB. Can be produced.

Next, as shown in FIG. 12 (l), another metal layer 20 'is provided on the upper and lower surfaces by plating or the like. By patterning this by etching or the like, as shown in FIG. 12 (m), a wiring board WB having a wiring pattern, a columnar metal body 14 located inside the opening, an inner surface of the opening, and the columnar shape A wiring board including the thermosetting resin 17 filled and cured between the metal bodies 14 can be manufactured.

2 Adhesive layer 10 Metal plate 14 Columnar metal body 16 Insulating layer 16 'Prepreg 16a Opening 17 Thermosetting resin 19 Insulating layer 19' Insulating layer (wiring board material)
19a opening 20 wiring pattern 20 'metal layer (wiring board material)
20a Opening 21 Mask material 21a Opening 30 Plating through hole A Protruding part WB Wiring board WB 'Wiring board material LM Laminating material LB Laminating body

Claims (17)

  1. A laminated sheet including a support sheet on which a plurality of columnar metal bodies are formed and a wiring board or a wiring board material having a plurality of openings in a portion corresponding to the columnar metal bodies, and the columnar metal bodies are located inside the openings. The process of preparing
    A step of obtaining a cured body filled with a thermosetting resin between the inner surface of the opening of the wiring board or the wiring board material and the columnar metal body and cured;
    Peeling the at least the support sheet from the laminate,
    A method of manufacturing a wiring board or wiring board material comprising:
  2. Forming a plurality of columnar metal bodies on the support sheet;
    The support sheet on which the columnar metal body is formed, a wiring board or wiring board material having a plurality of openings in a portion corresponding to the columnar metal body, and a thermosetting having a plurality of openings in a portion corresponding to the columnar metal body. Laminating a laminate material containing a prepreg containing a conductive resin so that the columnar metal body is positioned inside each opening;
    Integrating the laminate material by heating and pressing to obtain a laminate in which a thermosetting resin is filled between the inner surface of the wiring substrate or the opening of the wiring substrate material and the columnar metal body;
    Peeling the at least the support sheet from the laminate,
    A method of manufacturing a wiring board or wiring board material comprising:
  3. 3. The method of manufacturing a wiring board or a wiring board material according to claim 2, wherein the step of forming the columnar metal body comprises etching a metal plate attached to a support sheet to form a plurality of columnar metal bodies.
  4. 4. The method of manufacturing a wiring board or a wiring board material according to claim 2, wherein the laminated material includes a plurality of the wiring boards or wiring board materials and the prepreg interposed therebetween.
  5. 5. The laminate material includes the prepreg and a single-sided metal-clad laminate having a plurality of openings in portions corresponding to the columnar metal bodies, the metal layers being disposed on both sides of the prepreg. The manufacturing method of the wiring board or wiring board material of description.
  6. The laminated material includes the prepreg interposed between the wiring board or the wiring board material and the support sheet,
    The manufacturing method of the wiring board or wiring board material of Claim 2 or 3 including the process of peeling the said prepreg from the said laminated body.
  7. The laminated material includes the prepreg on the wiring board or the wiring board material.
    The manufacturing method of the wiring board or wiring board material of Claim 2 or 3 including the process of peeling the said prepreg from the said laminated body.
  8. The method for manufacturing a wiring board or a wiring board material according to claim 6 or 7, comprising a step of polishing a columnar metal body protruding from the laminate from which the prepreg has been peeled off.
  9. The laminated material includes a resin film that adheres to the surface of the wiring board or the wiring board material and has a plurality of openings in a portion corresponding to the columnar metal body,
    The method for manufacturing a wiring board or a wiring board material according to any one of claims 2 to 8, further comprising a step of peeling the resin film from the laminate.
  10. The production of a wiring board or a wiring board material according to any one of claims 1 to 9, further comprising a step of chemically and / or physically surface-treating the columnar metal body using a support sheet on which the columnar metal body is formed. Method.
  11. The method for manufacturing a wiring board or wiring board material according to claim 1, wherein a plated through hole is formed in the opening of the wiring board or wiring board material.
  12. A wiring board including a wiring board having an opening, a columnar metal body located inside the opening, and a thermosetting resin that is filled and cured between the inner surface of the opening and the columnar metal body.
  13. The wiring board according to claim 12, wherein a plated through hole is formed in an opening of the wiring board.
  14. Having an insulating layer, a columnar metal body embedded in the insulating layer, and a wiring layer;
    The insulating layer includes a cured product of prepreg,
    A wiring board in which a periphery of the columnar metal body is bonded to the insulating layer by a thermosetting resin that has oozed from the prepreg.
  15. Having an insulating layer, a columnar metal body embedded in the insulating layer, and a wiring layer;
    A wiring board in which a periphery of the columnar metal body is bonded to the insulating layer by a thermosetting resin different from the resin component of the insulating layer.
  16. The wiring board according to claim 14 or 15, wherein the columnar metal body has a peripheral wall that is curved in a longitudinal sectional shape.
  17. The wiring board according to any one of claims 14 to 16, wherein the wiring layer has a pattern portion extending on at least one surface of the columnar metal body.
PCT/JP2017/005924 2016-02-22 2017-02-17 Method for manufacturing wiring board or wiring board material WO2017145936A1 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2016031180 2016-02-22
JP2016-031180 2016-02-22
JP2016090098 2016-04-28
JP2016-090098 2016-04-28
JP2016-223970 2016-11-17
JP2016223970A JP2017201679A (en) 2016-02-22 2016-11-17 Method for manufacturing wiring board or wiring board material

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020187027262A KR20180116349A (en) 2016-02-22 2017-02-17 Method for manufacturing wiring board or wiring board material
EP17756375.6A EP3422829A4 (en) 2016-02-22 2017-02-17 Method for manufacturing wiring board or wiring board material

Publications (1)

Publication Number Publication Date
WO2017145936A1 true WO2017145936A1 (en) 2017-08-31

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PCT/JP2017/005924 WO2017145936A1 (en) 2016-02-22 2017-02-17 Method for manufacturing wiring board or wiring board material

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Country Link
WO (1) WO2017145936A1 (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004179309A (en) * 2002-11-26 2004-06-24 New Japan Radio Co Ltd Heat dissipating structure for printed circuit board and method for manufacturing the same
JP2005051088A (en) * 2003-07-30 2005-02-24 Japan Radio Co Ltd Printed circuit board with heat conductive member, and method for manufacturing the same
JP2006156610A (en) * 2004-11-29 2006-06-15 Nidec Copal Electronics Corp Circuit board
JP2010062199A (en) * 2008-09-01 2010-03-18 Hitachi Kokusai Electric Inc Circuit board
JP2011159727A (en) * 2010-01-29 2011-08-18 Toyota Motor Corp Printed board

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004179309A (en) * 2002-11-26 2004-06-24 New Japan Radio Co Ltd Heat dissipating structure for printed circuit board and method for manufacturing the same
JP2005051088A (en) * 2003-07-30 2005-02-24 Japan Radio Co Ltd Printed circuit board with heat conductive member, and method for manufacturing the same
JP2006156610A (en) * 2004-11-29 2006-06-15 Nidec Copal Electronics Corp Circuit board
JP2010062199A (en) * 2008-09-01 2010-03-18 Hitachi Kokusai Electric Inc Circuit board
JP2011159727A (en) * 2010-01-29 2011-08-18 Toyota Motor Corp Printed board

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP3422829A4 *

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