WO2017130306A1 - Chip fuse and chip fuse production method - Google Patents

Chip fuse and chip fuse production method Download PDF

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Publication number
WO2017130306A1
WO2017130306A1 PCT/JP2016/052241 JP2016052241W WO2017130306A1 WO 2017130306 A1 WO2017130306 A1 WO 2017130306A1 JP 2016052241 W JP2016052241 W JP 2016052241W WO 2017130306 A1 WO2017130306 A1 WO 2017130306A1
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WO
WIPO (PCT)
Prior art keywords
case
metal plate
case member
fusible body
terminals
Prior art date
Application number
PCT/JP2016/052241
Other languages
French (fr)
Japanese (ja)
Inventor
蟻川 浩雄
俊孝 小川
有希 小宮山
ちひろ 浅井
将雄 山本
Original Assignee
エス・オー・シー株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by エス・オー・シー株式会社 filed Critical エス・オー・シー株式会社
Priority to PCT/JP2016/052241 priority Critical patent/WO2017130306A1/en
Priority to JP2016540708A priority patent/JP6231218B1/en
Publication of WO2017130306A1 publication Critical patent/WO2017130306A1/en

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H69/00Apparatus or processes for the manufacture of emergency protective devices
    • H01H69/02Manufacture of fuses
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02Details
    • H01H85/04Fuses, i.e. expendable parts of the protective device, e.g. cartridges
    • H01H85/05Component parts thereof
    • H01H85/165Casings
    • H01H85/175Casings characterised by the casing shape or form

Definitions

  • the present invention relates to a chip fuse having a fusible body that is supported aerial between terminals, and a method for manufacturing the chip fuse.
  • fuses are used to prevent circuit breakdown due to inflow of overcurrent caused by failure.
  • the fuse has a fusible body, and when an abnormal current flows through the circuit on which the fuse is mounted, the fusible body melts and interrupts the current to prevent circuit destruction.
  • a fusible body that is supported aerial inside the case is fixed to terminals provided at both ends of the case with solder.
  • the solder also has a function of closing the opening of the terminal for inserting the fusible body.
  • the present invention has been made in view of these points, and an object thereof is to improve the airtightness of the fuse case and improve the assemblability.
  • the housing includes an insulating resin as a base material and forms a sealed space, and is provided in an aerial support state in the sealed space, and the base material may include nickel.
  • a chip fuse comprising: a solution; and a pair of terminals that are integrated with the housing such that a part of the solution is exposed from the housing and electrically connected to both ends of the fusible body. provide.
  • the housing includes a case member integrated with the terminal, and a lid member joined to the opposing case member and forming the sealed space with the case member. It is good as well.
  • the case member has a case-side joining surface formed in an annular shape along an outer edge, and the lid member is formed in an annular shape along the outer edge and joined to the case-side joining surface. It is good also as having a surface.
  • one of the case member and the lid member has a convex portion
  • the other of the case member and the lid member has a concave portion that is fitted to the convex portion, and the top surface of the convex portion.
  • the bottom surface of the recess may be joined.
  • case member and the lid member may be made of the same thermoplastic resin.
  • the terminal may have a holding portion that is provided in the sealed space and holds an end portion in the longitudinal direction of the fusible body.
  • the sandwiching portion includes a support portion that supports the end portion of the fusible body, and a pressing portion that faces the support portion and presses the end portion supported by the support portion.
  • the support portion may be provided to the end side of the pressing portion.
  • the upper surface of the support portion may be located at the same height as the upper surface of the case member.
  • the casing may have a groove portion that is formed between the fusing space in which the fusible body is melted in the sealed space and the clamping portion, and through which the fusible body passes.
  • the terminal includes a terminal portion that is exposed to the outside in a state of being integrated with the sandwiching portion, a through portion that penetrates the wall of the housing and connects the sandwiching portion and the terminal portion, It is good also as having.
  • the terminal may be made of a metal plate, and the penetrating portion may have a shape obtained by bending the metal plate a plurality of times.
  • the terminal portion may include a side terminal portion located on a side surface of the case member, and an outer surface of the side terminal portion may be located at the same position as the side surface of the case member.
  • the terminal portion includes a bottom surface terminal portion positioned on the bottom surface of the case member, and the bottom surface of the bottom surface terminal portion protrudes smaller than a thickness of the bottom surface terminal portion with respect to the bottom surface of the case member. It is good as well.
  • the fusible body has a fusible body plating layer on which metal plating is applied
  • the terminal has a terminal plating layer on which a metal plating is applied on the surface of the metal plate
  • the terminal plating layer is It is good also as joining and electrically connecting with the said soluble body plating layer.
  • a case assembly in which a case member including an insulating resin as a base material and a pair of metal terminals are integrally formed, and a part of the terminals are exposed from the case member.
  • a method for manufacturing a chip fuse comprising: joining the case member of the case assembly to seal the fusible body in a sealed space.
  • the step of manufacturing the case assembly includes processing a long first metal plate and forming a plurality of the terminals at predetermined intervals on the first metal plate, and each of the plurality of terminals. And injecting an insulating resin into the first metal plate so as to be integrated with the first metal plate, and molding the plurality of case members supported by the first metal plate at the predetermined interval. It is good as well.
  • an insulating resin is injection-molded with respect to the long second metal plate, and the plurality of lid members supported by the second metal plate at the predetermined interval are formed. Joining the case member of the case assembly supported by the first metal plate and the lid member supported by the second metal plate, the first metal plate and the second metal plate. And a step of producing a fuse assembly supported on the metal plate.
  • the method for manufacturing a chip fuse includes the steps of separating the fuse assembly from the first metal plate, and measuring a resistance value between the terminals of the fuse assembly separated from the first metal plate; And determining whether to separate the fuse assembly from the second metal plate based on the measurement result of the resistance value.
  • the present invention it is possible to improve the hermeticity of the fuse case and improve the assemblability.
  • FIG. 1 is a perspective view showing a schematic configuration of a chip fuse 1 according to an embodiment of the present invention.
  • 2 is a perspective view showing a schematic configuration of the chip fuse 1 in a state where a lid member 20 and a case member 10 are separated.
  • FIG. 1 is a front view of a chip fuse 1.
  • 2 is a side view of the chip fuse 1.
  • FIG. 3B is a cross-sectional view taken along line AA in FIG. 3B.
  • FIG. 5 is a sectional view taken along line BB in FIG. 4. It is a top view of case member 10
  • FIG. 7 is a cross-sectional view taken along the line CC of FIG.
  • FIG. 3 is a plan view of a lid member 20.
  • FIG. FIG. 9 is a sectional view taken along the line DD of FIG. 4 is a flowchart showing manufacturing steps of the chip fuse 1. It is a top view of the metal plate 600 for cases where the terminals 40 and 50 are shape
  • FIG. 10 is a plan view showing a state in which a long elongate fusible body 660 is disposed on a plurality of case assemblies 650. It is a longitudinal cross-sectional view of the case assembly 650 of FIG.
  • FIG. 18 is a cross-sectional view taken along line EE in FIG. 17. It is a top view of the metal plate 700 for lid
  • FIG. 23 is a cross-sectional view taken along line FF in FIG. 22.
  • Comparative Example 1-1 Configuration of fuse according to comparative example 1-2.
  • FIG. 1 is a schematic diagram illustrating a configuration of a fuse 900 according to a comparative example.
  • the fuse 900 includes a tube 901, a fusible body 902, and a pair of terminals 903 and 904.
  • the fuse 900 is a tubular fuse and supports the fusible body 902 in an aerial manner.
  • the tube 901 is made of alumina (aluminum oxide) and has a cylindrical shape.
  • the fusible body 902 is a linear fuse element, and is supported in an aerial manner in the tube 901.
  • the fusible body 902 is made of copper here.
  • Terminals 903 and 904 are connected to the longitudinal ends of the fusible body 902, respectively.
  • the terminals 903 and 904 are made of brass and have a cylindrical shape.
  • the terminals 903 and 904 are bonded to the outer peripheral surface of the tube 901 with an adhesive 920.
  • the terminals 903 and 904 are provided with openings 903a and 904a, and the end of the fusible body 902 is located in a state of being inserted through the openings 903a and 904a.
  • the end of the fusible body 902 is fixed to the terminals 903 and 904 with solder 910.
  • the solder 910 is provided so as to close the openings 903a and 904a. That is, the solder 910 has a function of fixing the fusible body 902 to the terminals 903 and 904 and a function of sealing the openings 903a and 904a.
  • the fuse 900 is assembled as follows. First, terminals 903 and 904 are bonded to both ends of the tube 901 with an adhesive 920 to manufacture a tube assembly. Next, the fusible body 902 is inserted from the opening 903 a of the terminal 903 or the opening 904 a of the terminal 904, and the end of the fusible body 902 is held at a position to be fixed to the terminals 903 and 904. Next, the openings 903a and 904a are filled with solder, and the ends of the fusible body 902 are fixed to the terminals 903 and 904. At this time, the inside of the tube 901 is hermetically sealed by filling solder so as to seal the openings 903a and 904a.
  • the fuse 900 according to the comparative example has the following problems with respect to hermeticity and assemblability.
  • the solder 910 that fixes the fusible body 902 to the terminals 903 and 904 may melt and the airtightness may be reduced. Specifically, the heat of the fusible body 902 generated during the operation of the fuse 900 is transmitted to the solder 910 connecting the end of the fusible body 902 and the terminals 903 and 904, so that the solder 910 is melted or melted. Soften. In such a case, the solder 910 cannot withstand the pressure in the tube 901 and is ejected from the openings 903a and 904a of the terminals 903 and 904, and the airtightness of the tube 901 is reduced.
  • the length between the terminals 903 and 904 of the fusible body 902 (the length Le shown in FIG. 1) has been reduced.
  • the fuse 900 when the fuse 900 is operated, the amount of heat transferred from the heat generating fusible body 902 to the solder 910 increases, so that the solder 910 is easily melted and the airtightness of the tube 901 is likely to be lowered.
  • the airtightness of the bonded portion where the terminals 903 and 904 and the tube 901 are bonded with the adhesive 920 may be lowered.
  • the fuse 900 has been used for a long time.
  • a phenomenon occurs in which the terminals 903 and 904 are displaced in the direction in which they are removed from the tube 901 during the operation of the fuse 900, and the airtightness is lowered.
  • the pressure in the tube 901 decreases, and the interruption of the circuit current due to the melting of the fuse 900 cannot be completed within a predetermined time.
  • the linear expansion coefficients of the tube 901, the terminals 903 and 904, and the adhesive 920 are different. Specifically, the linear expansion coefficient of the alumina tube 901 is about 8.5 ⁇ 10 ⁇ 6 (/ K), and the linear expansion coefficients of the brass terminals 903 and 904 are about 19 ⁇ 10 ⁇ 6. (/ K), and the linear expansion coefficient of the adhesive 920 is about 30 ⁇ 10 ⁇ 6 (/ K).
  • the stress caused by the difference in coefficient of linear expansion between the tube 901, the terminals 903 and 904, and the adhesive 920 causes the adhesive interface between the adhesive 920 and the tube 901, the adhesive 920 and the terminal 903, Occurs at the adhesive interface with 904.
  • the stress repeatedly acts on the adhesive interface so that the adhesive force of the adhesive 920 is reduced.
  • the terminals 903 and 904 cannot withstand the increase in internal pressure of the tube 901 that occurs during the operation of the fuse 900, and shift in the direction in which the terminals 903 and 904 come out of the tube 901.
  • a high temperature atmosphere (gas) in the tube 901 is ejected from the adhesive interface between the adhesive 920 and the tube 901 or the adhesive interface between the adhesive 920 and the terminals 903 and 904. Has been confirmed to occur.
  • the yield is poor.
  • the adhesive 920 is applied to the end of the cylindrical tube 901 in advance, the adhesive 920 is placed between the tube 901 and the terminals 903 and 904 by covering the tube 901 with the terminals 903 and 904. Is supposed to be filled.
  • the yield is poor in terms of maintaining the sealing property of the tube 901.
  • the work of sealing the openings 903a and 904a with the solder 910 while fixing the ends of the fusible body 902 to the terminals 903 and 904 with the solder 910 requires skill. That is, since it is necessary to simultaneously perform the work of fixing the fusible body 902 to the terminals 903 and 904 and the work of sealing the openings 903a and 904a with the solder 910, a normal worker who is not skilled in the work performs the work. It will take a lot of time.
  • FIG. 2A is a perspective view showing a schematic configuration of the chip fuse 1 according to the embodiment.
  • FIG. 2B is a perspective view showing a schematic configuration of the chip fuse 1 in a state where the lid member 20 and the case member 10 are separated.
  • FIG. 3A is a front view of the chip fuse 1.
  • FIG. 3B is a side view of the chip fuse 1.
  • 4 is a cross-sectional view taken along line AA in FIG. 3B.
  • 5 is a cross-sectional view taken along the line BB of FIG.
  • FIG. 6 is a plan view of the case member 10.
  • 7 is a cross-sectional view taken along the line CC of FIG.
  • FIG. 8 is a plan view of the lid member 20.
  • 9 is a cross-sectional view taken along the line DD of FIG.
  • the chip fuse 1 is surface-mounted on a circuit board or the like of an electronic device and is blown when an abnormal current flows through the circuit.
  • the chip fuse 1 is a small fuse.
  • the length L1 (FIG. 2A) of the chip fuse 1 is about 2.5 (mm)
  • the width L2 (FIG. 2A) is about 1.5 (mm).
  • the thickness L3 (FIG. 2A) is about 1.3 (mm).
  • the chip fuse 1 has a housing 5 whose outer shape is box-shaped.
  • the housing 5 is made of an insulating resin, specifically, a liquid crystal polymer.
  • the liquid crystal polymer has excellent heat resistance and high fluidity during injection molding.
  • a sealed space (a sealed space 6 shown in FIG. 4) is formed in the housing 5.
  • casing 5 is not limited to the above, You may contain another material in the insulating resin which is a base material.
  • the chip fuse 1 includes a case member 10, a lid member 20, a fusible body 30, and a pair of terminals 40 and 50 as shown in FIG. 2B and the like.
  • the chip fuse 1 is electrically connected to the circuit board through terminals 40 and 50, and current is supplied from the circuit board to the fusible body 30 through the terminals 40 and 50.
  • the case member 10 and the lid member 20 constitute the housing 5.
  • the case member 10 is a base portion of the housing 5 and houses the fusible body 30 and the terminals 40 and 50 as shown in FIG. 2B.
  • the case member 10 is made of a liquid crystal polymer that is a thermoplastic resin.
  • the case member 10 has a rectangular parallelepiped shape as shown in FIG. 2B.
  • the case member 10 includes a fusible member accommodating portion 11, a terminal accommodating portion 12, a case side joining surface 13, a fitting convex portion 14, and a positioning groove portion 15.
  • the fusible body accommodating portion 11 is a concave portion that accommodates the fusible body 30. As shown in FIG. 2B, the fusible body accommodating portion 11 is surrounded by a wall 11a. The fusible body accommodating portion 11 is provided at the center of the case member 10. The soluble body accommodating part 11 is also a fusing space in which the fusible body 30 is fused.
  • the terminal accommodating portion 12 is a recess that accommodates the pair of terminals 40 and 50.
  • the terminal accommodating part 12 is provided on both sides of the fusible substance accommodating part 11.
  • the terminal accommodating portion 12 is in close contact with the terminals 40 and 50. For this reason, no gap is formed between the terminal accommodating portion 12 and the terminals 40 and 50.
  • the case side joining surface 13 is joined to the lid side joining surface 22 of the lid member 20, as shown in FIG. As shown in FIG. 2B, the case side joining surface 13 is formed in an annular shape along the outer edge of the upper surface of the case member 10 so as to surround the fusible body housing portion 11 and the terminal housing portion 12.
  • the case side joining surface 13 is a surface having high flatness.
  • the upper surface of the wall 11a of the fusible body housing portion 11 protrudes from the case side joining surface 13.
  • the fitting convex part 14 is fitting with the fitting concave part 23 of the lid member 20 as shown in FIG. 3A.
  • the fitting convex part 14 protrudes from the case side joining surface 13. 2B, the fitting convex part 14 is provided in the center of the longitudinal direction (X direction) of the case member 10, and the edge of the both sides of the width direction (Y direction).
  • the positioning groove part 15 is a groove part formed along the longitudinal direction on the wall 11a of the fusible body accommodating part 11, as shown in FIG. 2B.
  • the positioning groove 15 has a function for positioning when the fusible body 30 is accommodated in the case member 10.
  • the positioning groove portion 15 is provided between the fusible body housing portion 11 and the terminal housing portion 12, and both end portions of the fusible body 30 pass through the positioning groove portion 15.
  • the lid member 20 is a lid portion of the housing 5 and has a rectangular shape similar to the case member 10 as shown in FIG. 2B.
  • the lid member 20 is made of a liquid crystal polymer that is the same thermoplastic resin as the case member 10.
  • the lid member 20 is joined to the opposing case member 10 and forms a sealed space 6 with the case member 10 as shown in FIG.
  • the lid member 20 includes a central recess 21, a lid-side joining surface 22, and a fitting recess 23.
  • the central recess 21 is provided in the center of the lid member 20. Specifically, the central concave portion 21 is provided in a portion of the case member 10 that faces the fusible member accommodating portion 11, the terminal accommodating portion 12, and the positioning groove portion 15.
  • the lid side joint surface 22 is joined to the case side joint surface 13 of the case member 10 as shown in FIG.
  • the lid-side joining surface 22 is formed in an annular shape along the outer edge of the bottom surface of the lid member 20 so as to surround the central recess 21.
  • the lid-side bonding surface 22 is bonded to the case-side bonding surface 13 with an epoxy-based adhesive to ensure airtightness.
  • the fitting recess 23 is fitted with the fitting protrusion 14 of the case member 10 as shown in FIG. 3A.
  • the fitting recess 23 is formed by cutting out the side surface of the lid member 20 as shown in FIG.
  • the fitting recess 23 is joined to the fitting projection 14 with an adhesive.
  • the bottom surface 23 a (FIG. 9) of the fitting concave portion 23 is joined to the top surface 14 a (FIG. 7) of the fitting convex portion 14.
  • the bottom surface 23a is joined to the top surface 14a with an epoxy adhesive.
  • the side surface 14b (FIG. 7) of the fitting convex portion 14 is also joined to the side surface 23b (FIG. 9) of the fitting concave portion 23 with an epoxy adhesive.
  • the case member 10 has the fitting convex portion 14 and the lid member 20 has the fitting concave portion 23.
  • the present invention is not limited to this.
  • the case member 10 has the fitting concave portion.
  • the cover member 20 having a fitting convex part. That is, one of the case member 10 and the lid member 20 has a fitting convex portion, and the other has a fitting concave portion.
  • the fusible body 30 is a linear fuse element as shown in FIG. 2B.
  • the fusible body 30 is provided in an aerial support state in the sealed space 6 in the housing 5. As shown in FIG. 4, the fusible body 30 is supported aerial in the sealed space 6 by being sandwiched between a pair of terminals 40 and 50 at both ends.
  • the fusible body 30 is made of nickel having a low thermal conductivity in this embodiment. However, it is not limited to this, The soluble body 30 may contain another metal which has nickel as a main component. That is, the soluble body 30 should just contain nickel as a base material. In such a case, even if the fusible body 30 generates heat during the operation of the chip fuse 1, the amount of heat transmitted to the terminals 40 and 50 is suppressed.
  • the fusible body 30 has a fusible body plating layer whose surface is metal-plated.
  • the soluble body plating layer is a portion where the nickel surface of the soluble body 30 is tin-plated.
  • Terminals 40, 50 The pair of terminals 40 and 50 are provided on both ends in the longitudinal direction of the case member 10 as shown in FIG. 2B, and are connected to both ends of the fusible body 30.
  • the terminals 40 and 50 are made of a copper metal plate.
  • the terminals 40 and 50 have a terminal plating layer in which metal plating (specifically, tin plating) is applied to the surface of the metal plate.
  • the terminals 40 and 50 are electrically connected to the fusible body 30 by welding with the fusible body 30.
  • the terminals 40 and 50 are electrically connected to the fusible body 30 by melting and joining the terminal plating layers of the terminals 40 and 50 and the fusible body plating layer of the fusible body 30 by welding. Yes.
  • the terminals 40 and 50 have an integrated structure with the housing 5 so that a part thereof is exposed from the housing 5. Specifically, the terminals 40 and 50 have an integral structure with the case member 10 by performing insert molding when the resin case member 10 is injection molded.
  • the terminals 40 and 50 have clamping parts 41 and 51, through parts 42 and 52, and terminal parts 43 and 53. Since the configuration of the terminals 40 and 50 is the same, the detailed configuration of the terminal 50 will be described below.
  • the sandwiching portion 51 sandwiches the end of the fusible body 30 in the longitudinal direction.
  • the clamping part 51 is accommodated in the terminal accommodating part 12 of the case member 10.
  • the sandwiching part 51 includes a support part 511 and a pressing part 512.
  • the support portion 511 supports the end of the fusible body 30 in the longitudinal direction. Specifically, the support portion 511 supports the end of the fusible body 30 that is in contact with the upper surface of the support portion 511 (see FIG. 5). As shown in FIG. 5, the upper surface of the support portion 511 is located at the same height as the upper surface of the case member 10 (case-side bonding surface 13).
  • the pressing part 512 is opposed to the support part 511 and presses the end part supported by the support part 511 (see FIG. 5).
  • the pressing part 512 is connected to the support part 511 and faces the support part 511 by bending a metal plate.
  • the width W2 of the pressing portion 512 is smaller than the width W1 of the support portion 511.
  • the support part 511 is provided in the longitudinal direction (X direction of FIG. 6) of the fusible body 30 to the end side rather than the holding
  • the position of the end surface 511 a of the support portion 511 is located on the outer side in the longitudinal direction than the position of the end surface 512 a of the pressing portion 512.
  • the end of the fusible body 30 is cut off along the end surface 512a of the pressing portion 512 so that the end after cutting is located closer to the center than the end surface 511a of the support portion 511.
  • the penetrating part 52 penetrates the wall of the case member 10 and connects the clamping part 51 and the terminal part 53.
  • the penetrating part 52 is joined to the penetrating wall, and the penetrating part 52 and the case member 10 are in close contact with each other.
  • the penetration part 52 becomes the shape which bent the metal plate several times.
  • the penetrating portion 52 has a shape bent in a staircase shape.
  • the surface of the penetrating part 52 may be roughened by subjecting the surface of the penetrating part 52 that is in close contact with the case member 10 to a surface treatment. In such a case, since the penetrating part 52 and the case member 10 can be more closely attached, airtightness can be improved.
  • the terminal portion 53 is provided below the case member 10 so that a part thereof is exposed to the outside.
  • the terminal portion 53 is connected to the circuit board when the chip fuse 1 is mounted on the circuit.
  • the terminal portion 53 is formed in an L shape, and includes a side terminal portion 531 and a bottom terminal portion 532.
  • the side terminal portion 531 is provided on the side surface of the case member 10 so as to be exposed to the outside. Specifically, as shown in FIG. 4, the outer surface of the side terminal portion 531 is located at the same position as the side surface of the case member 10. In such a case, when the chip fuse 1 is soldered to the circuit board, a solder fillet can also be formed on the side terminal portion 531, so that the terminal 50 can be reliably brought into contact with the circuit board. .
  • the bottom terminal portion 532 is located on the bottom surface of the case member 10. As shown in FIG. 4, the bottom surface of the bottom terminal portion 532 protrudes smaller than the thickness of the bottom terminal portion 532 with respect to the bottom surface of the case member 10. In such a case, when the chip fuse 1 is mounted on the circuit board, the bottom terminal portion 532 can reliably contact the circuit board. Further, since the portion of the bottom terminal portion 532 that does not protrude from the bottom surface of the case member 10 is integrated with the case member 10, the connection between the terminal 50 and the case member 10 becomes stronger.
  • chip fuse 1 having the above-described configuration is a highly reliable chip fuse that ensures airtightness. This will be described in detail below.
  • case member 10 and the lid member 20 are formed of the same liquid crystal polymer
  • the case member 10 and the lid member 20 are joined by selecting an adhesive that is compatible with the liquid crystal polymer and joining the case member 10 and the lid member 20.
  • the adhesive strength of the lid member 20 can be increased.
  • the epoxy adhesive used in the present embodiment can increase the adhesive strength between the case member 10 and the lid member 20 made of a liquid crystal polymer.
  • the epoxy adhesive was cured at a temperature of about 130 ° C. for 30 minutes.
  • case member 10 and the lid member 20 are formed of the same material (liquid crystal polymer), it is possible to suppress the generation of thermal stress at the joint interface caused by the difference in linear expansion coefficient that occurs when different materials are used. . As a result, a decrease in bonding strength due to the generation of thermal stress can be suppressed. Further, by selecting an adhesive that matches the linear expansion coefficient of the liquid crystal polymer with that of the liquid crystal polymer, the bonding surface is peeled off due to temperature changes that occur repeatedly when the chip fuse 1 is used over a long period of time. Can be prevented.
  • the terminals 40 and 50 have the through portions 42 and 52 penetrating in a state where the terminals 40 and 50 are joined to the case member 10 between the sandwiching portions 41 and 51 and the terminal portions 43 and 53.
  • the through portions 42 and 52 are formed in a staircase shape by bending the metal plates of the terminals 40 and 50, the joint area with the case member 10 can be widened. As a result, the airtightness can be sufficiently secured by joining the through portions 42 and 52 and the case member 10.
  • the liquid crystal polymer that is a material of the case member 10 has excellent fluidity, the liquid crystal polymer is formed through the through portions 42 and 52 when the case member 10 in which the through portions 42 and 52 are inserted is formed by insert molding. Therefore, the degree of close contact between the case member 10 and the through portions 42 and 52 can be increased.
  • the temperature rise of the terminals 40 and 50 (specifically, the sandwiching portions 41 and 51) electrically connected to the fusible body 30 can be suppressed by making the fusible body 30 made of nickel.
  • the soluble body 902 (FIG. 1) made from copper demonstrated in the comparative example.
  • the soluble body 30 and the soluble body 902 will be simply referred to as a soluble body.
  • the amount of heat Q (W) transferred from the fusible body to the terminal per unit time is represented by the following equation (1).
  • lambda represents the thermal conductivity of the fusible element (W / m ⁇ K)
  • a represents the current cross-sectional area of the fusible (m 2)
  • L e is the length of the fusible element (m)
  • ⁇ m represents the melting point (K) of the soluble material
  • ⁇ o represents the temperature of the terminal.
  • the amount of heat Q transferred from the nickel fusible body to the terminal is about 1/3 of the amount of heat transferred from the copper fusible body to the terminal when the temperature of the terminal is the same. I understand that In other words, when the fusible body is made of nickel, the amount of heat transferred to the terminal is small, so the temperature rise of the terminal is small.
  • the length L e of the fusible element is reduced, the amount of heat Q that is transferred from the fusible element to the terminals is increased. Therefore, in the length L e is less fine chip fuse 1 of fusible 30 as in this embodiment, since the fusible element 30 is made of small nickel thermal conductivity, the terminal 40 from the fusible element 30, The amount of heat Q transmitted to 50 can be suppressed, and the temperature rise of terminals 40 and 50 can be suppressed. As a result, it is possible to suppress the influence of the heat generated from the fusible body 30 on the terminals 40 and 50 and the case member 10 that are integrated to improve airtightness.
  • the holding portions 41 and 51 of the terminals 40 and 50 hold and fix the fusible body 30, while the case-side joining surface 13 of the case member 10 and the lid-side joining surface of the lid member 20. 22 is joined to form a sealed space 6.
  • the heat of the fusible body 30 is not transmitted to the case-side joining surface 13 or the lid-side joining surface 22 even if it is transmitted to the sandwiching portions 41, 51. It can suppress that the joint strength of 13 and the lid side joint surface 22 falls. As a result, a decrease in the airtightness of the housing 5 can be suppressed.
  • the base material of the case member 10 a liquid crystal polymer having excellent fluidity at the time of molding, adhesion between the terminals 40 and 50 and the case member 10 can be enhanced. Moreover, it becomes easy to perform joining by an adhesive agent effectively by making the case member 10 and the cover member 20 into the same material. Furthermore, the material of the fusible body 30 is made of nickel having a low thermal conductivity, so that the temperature rise of the sandwiching portions 41 and 51 of the terminals 40 and 50 can be suppressed during the operation of the chip fuse 1. As a result of an experiment using the above-described chip fuse 1, it was confirmed that a current of 50 (A) can be cut off at a rated current of 250 (mA) and a rated voltage of 72 (V). In addition, it was confirmed that the same interruption was possible after repeated temperature cycle tests.
  • FIG. 10 is a flowchart showing the manufacturing process of the chip fuse 1. Below, it demonstrates in detail for every process.
  • FIG. 11 is a plan view of the case metal plate 600 in which the terminals 40 and 50 are formed.
  • 12 is a view of the case metal plate 600 shown in FIG. 11 as viewed from the front side.
  • FIG. 13 is a perspective view showing the terminals 40, 50 formed on the case metal plate 600.
  • step S102 the case metal plate 600, which is a long first metal plate, is processed, and the pair of terminals 40, 50 are continuously formed on the case metal plate 600 at predetermined intervals.
  • the case metal plate 600 is a copper plate having a thickness of about 0.15 (mm), and the surface thereof is tin-plated.
  • the case metal plate 600 is transported in a predetermined transport direction.
  • the case metal plate 600 is provided with a conveying guide hole 602 at a predetermined pitch Lp in the longitudinal direction of the metal plate. As the conveying member rotates while sequentially meshing with the guide holes 602, the case metal plate 600 is conveyed in the conveying direction.
  • the terminals 40 and 50 are formed by press forming the case metal plate 600.
  • the pair of terminals 40 and 50 are formed with the same pitch Lp as the pitch of the guide holes 602.
  • the holding portions 4112 and 512 of the holding portions 41 and 51 of the terminals 40 and 50 stand perpendicular to the support portions 411 and 511 as shown in FIG.
  • the holding parts 412 and 512 are bent and face the support parts 411 and 511 when fixing the fusible body 30 to the terminals 40 and 50.
  • the positional relationship between the guide hole 602 and the terminals 40 and 50 is determined in advance. For this reason, the position of the terminals 40 and 50 can also be managed by managing the position of the guide hole 602 of the case metal plate 600 being conveyed in the conveyance direction.
  • FIG. 14 is a plan view of the case metal plate 600 in which the case assembly 650 is manufactured.
  • FIG. 15 is a view of the case metal plate 600 shown in FIG. 14 as viewed from the front side.
  • step S104 the case member 10 and the terminals 40, 50 are integrated by injection molding the thermoplastic resin, which is the material of the case member 10, onto the case metal plate 600 on which the terminals 40, 50 are formed.
  • a case assembly 650 is produced.
  • the case assembly 650 is produced by injecting a liquid crystal polymer around the terminals 40 and 50 (so-called insert molding).
  • the case metal plate 600 in which the terminals 40 and 50 are continuously formed is conveyed, and the conveyance stops when the terminals 40 and 50 are positioned in the mold (cavity or core) for the injection mold in the opened state. . Thereafter, the mold is closed and the liquid crystal polymer is injected into the mold to mold the case member 10 integrated with the terminals 40 and 50. That is, one case assembly 650 is manufactured. Then, the mold is opened again, and the case metal plate 600 is conveyed by a predetermined pitch, and the next case assembly 650 is manufactured. By repeating such a cycle, a large number of case assemblies 650 can be manufactured in a short time, and productivity can be improved.
  • the plurality of case assemblies 650 are supported by the support portion 604 of the case metal plate 600 at a predetermined interval.
  • a part of the terminals 40 and 50 (specifically, the pressing portions 412 and 512 of the clamping portions 41 and 51) are exposed from the case member 10 without being covered with resin as shown in FIG. is doing.
  • the side surface terminal portions 431 and 531 of the terminal portions 43 and 53 of the terminals 40 and 50 are flush with the side surface of the case member 10 (see FIG. 4).
  • the side terminal portions 431 and 531 come into contact with the inner surface of the injection mold and become stable. Can be performed with high accuracy.
  • FIG. 16 is a plan view showing a state in which a long elongate fusible body 660 is disposed on a plurality of case assemblies 650.
  • FIG. 17 is a longitudinal sectional view of the case assembly 650 of FIG. 18 is a cross-sectional view taken along line EE in FIG.
  • step S106 the long fusible body 660 is disposed on the case member 10 of the case assembly 650, and the long fusible body 660 is fixed to the terminals 40 and 50. And after fixing the long soluble body 660, the long soluble body 660 and the terminals 40 and 50 are electrically connected.
  • the long soluble body 660 and the terminals 40 and 50 are electrically connected.
  • positions the elongate soluble body 660 to the predetermined position of the case member 10 is demonstrated.
  • the pressing portions 412 and 512 of the holding portions 41 and 51 stand vertically with respect to the support portions 411 and 511.
  • the long fusible body 660 is moved from the upper side to the lower side of the sandwiching parts 41 and 51 to bring the long fusible body 660 into contact with the support parts 411 and 511.
  • the long fusible body 660 can move and the position of the long fusible body 660 can be easily adjusted.
  • by applying a predetermined tension to the long fusible body 660 supported at both ends the linear long fusible body 660 with suppressed bending can be accurately positioned with respect to the support portions 411 and 511.
  • the long fusible body 660 is arranged on each case member 10 of the plurality of case assemblies 650 so as to straddle the plurality of case assemblies 650 supported by the case metal plate 600.
  • the support parts 411 and 511 with which the long fusible body 660 contacts and the case side joining surface 13 of the case member 10 are the same surface, the long fusible body 660 is positioned in the Z-axis direction. It becomes easy.
  • the long fusible body 660 is disposed so as to pass through the positioning groove 15 of the case member 10, that is, the positioning groove 15 is also used as a guide, so that the long fusible body 660 can be easily positioned in the Y-axis direction. Become.
  • positioned on the support parts 411 and 511 is demonstrated.
  • the holding portions 412 and 512 standing perpendicular to the support portions 411 and 511 are bent in the direction of the arrow shown in FIG.
  • the holding portions 412 and 512 are bent by about 90 degrees so that the holding portions 412 and 512 are opposed to the support portions 411 and 511 with the long fusible body 660 interposed therebetween.
  • suppressing parts 412 and 512 pinch the long soluble body 660.
  • the long fusible body 660 positioned at a predetermined position is fixed to the holding portions 41 and 51.
  • the long soluble body 660 and the clamping parts 41 and 51 are electrically connected.
  • the fusible body plating layer of the long fusible body 660 and the terminal plating layer of the sandwiching portions 41 and 51 are melted, so that the electrical connection between the long fusible body 660 and the terminals 40 and 50 is achieved. Connection can be realized reliably.
  • the long soluble body 660 is cut.
  • the long fusible body 660 is cut with a cutter at the positions of the end faces 412a and 512a (FIG. 6) of the holding portions 412 and 512.
  • the long fusible body 660 cut is the fusible body 30 of the chip fuse 1.
  • the cutting position of the long fusible body 660 is temporarily shifted and the end portions are temporarily shifted. Even if it remains uncut, it is possible to prevent the fusible body 30 from protruding to the case-side joining surface 13 of the case member 10.
  • FIG. 19 is a plan view of a lid metal plate 700 on which the lid member 20 is formed.
  • FIG. 20 is a view of the lid metal plate 700 shown in FIG. 19 as viewed from the front side.
  • the thermoplastic resin which is the material of the lid member 20
  • the lid metal plate 700 is, for example, a copper plate having a thickness of about 0.15 (mm), and the surface thereof is tin-plated.
  • the guide metal plate 700 is provided with guide holes 702 at a pitch Lp.
  • the lid member 20 is formed at the same pitch as the pitch of the guide holes 702.
  • the formed plurality of lid members 20 are supported by the support portion 704 of the lid metal plate 700.
  • the positional relationship between the guide hole 702 and the lid member 20 is determined in advance. For this reason, the position of the lid member 20 can also be managed by managing the position of the guide hole 702 of the lid metal plate 700 being conveyed in the conveyance direction.
  • the lid member is formed after the fusible body 30 is fixed.
  • the present invention is not limited to this.
  • the lid member may be molded in parallel with the steps S104 and S106.
  • FIG. 21 is a longitudinal sectional view of a fuse assembly 800 in which the lid member 20 is joined to the case member 10 of the case assembly 650.
  • FIG. 22 is a view showing a state where the fuse assembly 850 is supported by the case metal plate 600 and the lid metal plate 700.
  • step S110 the case assembly 10 of the case assembly 650 supported by the case metal plate 600 and the lid member 20 supported by the lid metal plate 700 are combined to produce the fuse assembly 800.
  • the case metal plate 600 and the cover metal plate 700 are conveyed so that the case member 10 of the case assembly 650 is covered with the case member 10, and the case member 10 is assembled with the case member 10.
  • the conveyance of the case metal plate 600 and the lid metal plate 700 is controlled using the guide holes 602 of the case metal plate 600 and the guide holes 702 of the lid metal plate 700.
  • the case metal plate 600 and the lid metal plate 700 are conveyed so that the guide hole 602 and the guide hole 702 coincide with each other.
  • the case member 10 and the lid member 20 are joined. Specifically, an epoxy-based adhesive is applied to the case-side joining surface 13 of the case member 10 in advance. Thereafter, the case member 10 is covered with the lid member 20 and the case member 10 and the lid member 20 are pressurized and heated, so that the case side joining surface 13 of the case member 10 and the lid side joining surface 22 of the lid member 20 are formed. Join. Thereby, the fuse assembly 800 in which the fusible body 30 is sealed in the internal sealed space 6 can be manufactured.
  • an epoxy adhesive is applied in advance to the fitting convex portion 14 of the case member 10.
  • the fitting convex portion 14 and the fitting concave portion 23 are joined with an adhesive. Thereby, the joint strength between the case member 10 and the lid member 20 can be increased.
  • the case assembly 650 is supported by the support portion 604 of the case metal plate 600, and the lid member 20 is supported by the support portion 704 of the lid metal plate 700. Therefore, the fuse assembly 800 obtained by combining the case member 10 and the lid member 20 of the case assembly 650 is also supported by the case metal plate 600 and the lid metal plate 700 as shown in FIG. . Note that, as illustrated in FIG. 22, the support portion 604 and the support portion 704 are located apart in the transport direction.
  • step S112 fuse assembly 800 is separated from case metal plate 600.
  • the terminals 40 and 50 of the separated fuse assembly 800 are insulated from the case metal plate 600.
  • the support portion 604 of the case metal plate 600 that supports the fuse assembly 800 is cut by, for example, a cutter, and the fuse assembly 800 is separated from the case metal plate 600.
  • the support portion 604 and the support portion 704 are separated from each other, for example, only the support portion 604 can be cut by a vertically moving cutter. At this time, the plurality of support portions 604 that support the fuse assembly 800 are simultaneously cut.
  • step S114 the resistance value between terminal 40 and terminal 50 of fuse assembly 800 separated from case metal plate 600 is measured. Although the fuse assembly 800 is supported by the lid metal plate 700, the terminals 40 and 50 are not electrically connected to the lid metal plate 700, so that they are insulated from the lid metal plate 700. State.
  • step S116 it is determined whether or not the fuse assembly 800 is separated from the lid metal plate 700 based on the measurement result of the resistance value between the terminals 40 and 50. Specifically, when the resistance value between the terminals 40 and 50 is within a predetermined range, it is determined that the fuse assembly 800 is a non-defective product, and the fuse assembly 800 whose resistance value is measured is used as the metal plate 700 for the lid. Separate from. That is, since the lid member 20 of the fuse assembly 800 is supported by the support portion 704 of the lid metal plate 700, the lid member 20 is separated from the lid metal plate 700.
  • FIG. 23 is a cross-sectional view taken along line FF in FIG.
  • the tip 704a of the support portion 704 is fitted with the side recess 26 provided on the side surface of the lid member 20.
  • the fitting length between the tip 704a of the support portion 704 and the side recess 26 is small (for example, 0.1 mm), for example, when the operator pushes the tip 704a side of the support portion 704 by hand, the tip 704a And the fitting state of the side recess 26 is released. Thereby, even if it does not cut
  • the fuse assembly 800 is defective and the fuse assembly 800 whose measured value is measured is not separated from the lid metal plate 700.
  • the fuse assembly 800 that has been determined to be non-defective is separated from the lid metal plate 700, so that it is possible to prevent a defective product from being mixed with a non-defective product.
  • the state in which the fuse assembly 800 determined to be defective is supported by the lid metal plate 700 is maintained.
  • the present invention is not limited to this.
  • the fuse determined to be defective in another process is used.
  • the assembly 800 may be separated from the lid metal plate 700.
  • the fuse assembly 800 is separated from the case metal plate 600 and the lid metal plate 700 in separate steps, but the present invention is not limited to this.
  • the separation from the case metal plate 600 and the separation from the lid metal plate 700 may be performed together in one step.
  • the fuse assembly 800 may be separated from the case metal plate 600 after being separated from the lid metal plate 700.
  • the resistance value between the terminals 40 and 50 is measured after the fuse assembly 800 is separated from the case metal plate 600.
  • the fuse assembly 800 is separated from the lid metal plate 700 by manually pushing the tip 704a side of the support portion 704.
  • the present invention is not limited to this.
  • the tip 704a side may be cut and separated by a cutter.
  • the fusible body 30 is disposed on the case member 10 with the upper portion of the case member 10 open, so that the workability of fixing the fusible body 30 is greatly improved. Also, by separating the work for fixing the fusible body 30 and the work for electrically connecting the fusible body 30 and the terminals 40, 50, the workability of each work is improved compared to the case where two works are performed simultaneously. Greatly improved. Moreover, since the case member 10 and the terminals 40 and 50 are integrated by insert molding, the sealing performance is deteriorated even when used for a long period of time compared to the case member 10 and the terminals 40 and 50 fixed with an adhesive. Can be suppressed. Further, the case member 10 is continuously formed on the case metal plate 600, and the case member 10 and the lid member 20 are combined after the plurality of cover members 20 are continuously formed on the lid metal plate 700. As a result, assembly and productivity are improved.
  • the housing 5 is made of a liquid crystal polymer, but is not limited thereto.
  • the housing 5 may be made of another thermoplastic resin.
  • the housing 5 may be made of a thermosetting resin.
  • case member 10 and the lid member 20 are joined with the epoxy adhesive, but the present invention is not limited to this.
  • the case member 10 and the lid member 20 may be joined with another adhesive.
  • the case member 10 and the lid member 20 may be joined by heat melting joining or ultrasonic joining instead of joining by an adhesive.
  • the fusible body 30 and the terminals 40 and 50 are joined by welding the plating layers, but the invention is not limited to this.
  • nickel which is the base material of the fusible body 30 and copper which is the base material of the terminals 40 and 50 may be melt-bonded.
  • the width W1 of the support portions 411 and 511 is larger than the width W2 of the holding portions 412 and 512.
  • the present invention is not limited to this.
  • the support portions 411 and 511 and the pressing portions 412 and 512 may have the same width, while the end portions 412a and 512a of the pressing portions 412 and 512 may be provided with notches. In such a case, the long soluble body 660 may be cut at the notch.

Abstract

A chip fuse (1) is provided with: a casing (5) which includes an insulating resin as a base material and which forms a sealed space (6); a fusible body (30) which is provided in the sealed space (6) in a state of being hanged and supported in the air and which includes nickel as the base material; and a pair of terminals (40, 50) which have a structure that is integrated with the casing (5) so that a portion of the terminals is exposed from the casing (5), and which are electrically connected to both end sections of the fusible body (30).

Description

チップヒューズ、及びチップヒューズの製造方法Chip fuse and manufacturing method of chip fuse
 本発明は、端子間に架空支持されている可溶体を有するチップヒューズ、及びチップヒューズの製造方法に関する。 The present invention relates to a chip fuse having a fusible body that is supported aerial between terminals, and a method for manufacturing the chip fuse.
 電子機器においては、故障等で生じた過電流の流入により回路破壊が発生することを防止するために、ヒューズが利用されている。ヒューズは可溶体を有しており、ヒューズが実装された回路に異常な電流が流れた場合に、可溶体が溶断して電流を遮断することで回路破壊を防止している。 In electronic equipment, fuses are used to prevent circuit breakdown due to inflow of overcurrent caused by failure. The fuse has a fusible body, and when an abnormal current flows through the circuit on which the fuse is mounted, the fusible body melts and interrupts the current to prevent circuit destruction.
 下記の特許文献1のヒューズにおいては、ケースの内部に架空支持されている可溶体が、ケースの両端に設けられた端子に半田で固定されている。ここで、半田は、可溶体を挿通するための端子の開口を塞ぐ機能も有している。 In the fuse of Patent Document 1 below, a fusible body that is supported aerial inside the case is fixed to terminals provided at both ends of the case with solder. Here, the solder also has a function of closing the opening of the terminal for inserting the fusible body.
特開2002-50274号公報JP 2002-50274 A
 一般のヒューズにおいては、可溶体の溶断時に発生する火花が外気に触れると爆発に繋がる恐れがあるため、可溶体を収容するケースの気密性を高めることが望ましい。また、ヒューズによる電流の遮断性能は、ヒューズが動作する際の可溶体を取り巻く雰囲気(気体)の圧力に大きく依存することが知られており、前記圧力を高めるためにケースの気密性を高めることが重要である。しかし、特許文献1のように可溶体が半田で端子に固定されている場合には、例えば可溶体の発熱時に端子の開口を塞ぐ半田が溶融してしまい、ケースの気密性が低下する恐れがある。 In general fuses, it is desirable to increase the airtightness of the case that contains the fusible body, because the spark generated when the fusible body melts may cause an explosion if it touches the outside air. In addition, it is known that the current interruption performance by the fuse is greatly dependent on the pressure of the atmosphere (gas) surrounding the fusible body when the fuse operates, and in order to increase the pressure, increase the airtightness of the case is important. However, when the fusible body is fixed to the terminal with solder as in Patent Document 1, for example, the solder that closes the opening of the terminal melts when the fusible body generates heat, and the airtightness of the case may be reduced. is there.
 また、特許文献1のヒューズの場合には、ヒューズを組み立てる際に、線状の可溶体を端子の開口に挿通して所定の位置に保持した状態で、可溶体を端子に半田で固定する必要がある。しかし、かかる一連の組立作業は熟練を要するため、通常の作業者が組立作業を行うと作業に多大な時間を要してしまう。 In addition, in the case of the fuse of Patent Document 1, when assembling the fuse, it is necessary to fix the fusible body to the terminal with solder while the linear fusible body is inserted into the opening of the terminal and held at a predetermined position. There is. However, since such a series of assembling operations requires skill, if an ordinary worker performs the assembling operations, a great amount of time is required for the operations.
 そこで、本発明はこれらの点に鑑みてなされたものであり、ヒューズのケースの気密性を高めると共に組立性を向上させることを目的とする。 Therefore, the present invention has been made in view of these points, and an object thereof is to improve the airtightness of the fuse case and improve the assemblability.
 本発明の第1の態様においては、母材として絶縁性樹脂を含み、密閉空間を形成している筐体と、前記密閉空間に架空支持された状態で設けられ、母材としてニッケルを含む可溶体と、一部が前記筐体から露出するように前記筐体と一体構造となっており、前記可溶体の両端部と電気的に接続している一対の端子と、を備える、チップヒューズを提供する。 In the first aspect of the present invention, the housing includes an insulating resin as a base material and forms a sealed space, and is provided in an aerial support state in the sealed space, and the base material may include nickel. A chip fuse comprising: a solution; and a pair of terminals that are integrated with the housing such that a part of the solution is exposed from the housing and electrically connected to both ends of the fusible body. provide.
 また、前記筐体は、前記端子と一体構造になっているケース部材と、対向する前記ケース部材と接合しており、前記ケース部材とで前記密閉空間を形成している蓋部材と、を有することとしてもよい。 The housing includes a case member integrated with the terminal, and a lid member joined to the opposing case member and forming the sealed space with the case member. It is good as well.
 また、前記ケース部材は、外縁に沿って環状に形成されたケース側接合面を有し、前記蓋部材は、外縁に沿って環状に形成され前記ケース側接合面と接合している蓋側接合面を有することとしてもよい。 The case member has a case-side joining surface formed in an annular shape along an outer edge, and the lid member is formed in an annular shape along the outer edge and joined to the case-side joining surface. It is good also as having a surface.
 また、前記ケース部材及び前記蓋部材の一方は、凸部を有し、前記ケース部材及び前記蓋部材の他方は、前記凸部と嵌合している凹部を有し、前記凸部の頂面と前記凹部の底面とが、接合していることとしてもよい。 In addition, one of the case member and the lid member has a convex portion, and the other of the case member and the lid member has a concave portion that is fitted to the convex portion, and the top surface of the convex portion. The bottom surface of the recess may be joined.
 また、前記ケース部材及び前記蓋部材は、同一の熱可塑性樹脂から成ることとしてもよい。 Further, the case member and the lid member may be made of the same thermoplastic resin.
 また、前記端子は、前記密閉空間に設けられ前記可溶体の長手方向の端部を挟持する挟持部を有することとしてもよい。 Further, the terminal may have a holding portion that is provided in the sealed space and holds an end portion in the longitudinal direction of the fusible body.
 また、前記挟持部は、前記可溶体の前記端部を支える支え部と、前記支え部に対向し、前記支え部に支えられた前記端部を押さえる押さえ部と、を有し、前記可溶体の長手方向において、前記支え部は、前記押さえ部よりも端側まで設けられていることとしてもよい。 The sandwiching portion includes a support portion that supports the end portion of the fusible body, and a pressing portion that faces the support portion and presses the end portion supported by the support portion. In the longitudinal direction, the support portion may be provided to the end side of the pressing portion.
 また、前記支え部の上面は、前記ケース部材の上面と同じ高さに位置していることとしてもよい。 Further, the upper surface of the support portion may be located at the same height as the upper surface of the case member.
 また、前記筐体は、前記密閉空間において前記可溶体が溶断される溶断空間と前記挟持部との間に形成され、前記可溶体が通過している溝部を有することとしてもよい。 Further, the casing may have a groove portion that is formed between the fusing space in which the fusible body is melted in the sealed space and the clamping portion, and through which the fusible body passes.
 また、前記端子は、前記挟持部と一体構造の状態で外部に露出している端子部と、前記筐体の壁を貫通し、前記挟持部と前記端子部を接続している貫通部と、を更に有することとしてもよい。 The terminal includes a terminal portion that is exposed to the outside in a state of being integrated with the sandwiching portion, a through portion that penetrates the wall of the housing and connects the sandwiching portion and the terminal portion, It is good also as having.
 また、前記端子は、金属板から成り、前記貫通部は、前記金属板を複数回折り曲げた形状となっていることとしてもよい。 Further, the terminal may be made of a metal plate, and the penetrating portion may have a shape obtained by bending the metal plate a plurality of times.
 また、前記端子部は、前記ケース部材の側面に位置する側面端子部を有し、前記側面端子部の外面は、前記ケース部材の側面と同じ位置に位置していることとしてもよい。 Further, the terminal portion may include a side terminal portion located on a side surface of the case member, and an outer surface of the side terminal portion may be located at the same position as the side surface of the case member.
 また、前記端子部は、前記ケース部材の底面に位置する底面端子部を有し、前記底面端子部の底面は、前記ケース部材の底面に対して前記底面端子部の厚さよりも小さく突出していることとしてもよい。 The terminal portion includes a bottom surface terminal portion positioned on the bottom surface of the case member, and the bottom surface of the bottom surface terminal portion protrudes smaller than a thickness of the bottom surface terminal portion with respect to the bottom surface of the case member. It is good as well.
 また、前記可溶体は、金属メッキが施されている可溶体メッキ層を有し、前記端子は、金属板の表面に金属メッキが施されている端子メッキ層を有し、前記端子メッキ層は、前記可溶体メッキ層と接合して電気的に接続していることとしてもよい。 Further, the fusible body has a fusible body plating layer on which metal plating is applied, the terminal has a terminal plating layer on which a metal plating is applied on the surface of the metal plate, and the terminal plating layer is It is good also as joining and electrically connecting with the said soluble body plating layer.
 本発明の第2の態様においては、母材として絶縁性樹脂を含むケース部材と金属製の一対の端子とを一体成形して、前記端子の一部が前記ケース部材から露出しているケース組立体を作製するステップと、少なくともニッケルを含む可溶体を前記ケース組立体の前記ケース部材に配置して、前記端子に前記可溶体を固定するステップと、母材として絶縁性樹脂を含む蓋部材と前記ケース組立体の前記ケース部材とを接合して、密閉空間に前記可溶体を密閉するステップと、を有する、チップヒューズの製造方法を提供する。 In the second aspect of the present invention, a case assembly in which a case member including an insulating resin as a base material and a pair of metal terminals are integrally formed, and a part of the terminals are exposed from the case member. A step of producing a solid, a step of disposing a soluble body containing at least nickel on the case member of the case assembly, and fixing the soluble body to the terminal; and a lid member containing an insulating resin as a base material; There is provided a method for manufacturing a chip fuse, comprising: joining the case member of the case assembly to seal the fusible body in a sealed space.
 また、前記ケース組立体を作製するステップは、長尺状の第1金属板を加工して、前記第1金属板に所定間隔で複数の前記端子を成形するステップと、前記複数の端子の各々と一体構造となるように前記第1金属板に対して絶縁性樹脂を射出成形して、前記第1金属板に前記所定間隔で支持される複数の前記ケース部材を成形するステップと、を含むこととしてもよい。 Further, the step of manufacturing the case assembly includes processing a long first metal plate and forming a plurality of the terminals at predetermined intervals on the first metal plate, and each of the plurality of terminals. And injecting an insulating resin into the first metal plate so as to be integrated with the first metal plate, and molding the plurality of case members supported by the first metal plate at the predetermined interval. It is good as well.
 また、前記チップヒューズの製造方法は、長尺状の第2金属板に対して絶縁性樹脂を射出成形して、前記第2金属板に前記所定間隔で支持される複数の前記蓋部材を成形するステップと、前記第1金属板に支持された前記ケース組立体の前記ケース部材と、前記第2金属板に支持された前記蓋部材とを接合して、前記第1金属板及び前記第2金属板に支持されたヒューズ組立体を作製するステップと、を更に有することとしてもよい。 Further, in the manufacturing method of the chip fuse, an insulating resin is injection-molded with respect to the long second metal plate, and the plurality of lid members supported by the second metal plate at the predetermined interval are formed. Joining the case member of the case assembly supported by the first metal plate and the lid member supported by the second metal plate, the first metal plate and the second metal plate. And a step of producing a fuse assembly supported on the metal plate.
 また、前記チップヒューズの製造方法は、前記ヒューズ組立体を前記第1金属板から分離するステップと、前記第1金属板から分離した前記ヒューズ組立体の前記端子間の抵抗値を測定するステップと、前記抵抗値の測定結果に基づいて、前記ヒューズ組立体を前記第2金属板から分離するか否かを判定するステップと、を更に有することとしてもよい。 The method for manufacturing a chip fuse includes the steps of separating the fuse assembly from the first metal plate, and measuring a resistance value between the terminals of the fuse assembly separated from the first metal plate; And determining whether to separate the fuse assembly from the second metal plate based on the measurement result of the resistance value.
 本発明によれば、ヒューズのケースの気密性を高めると共に組立性を向上させることができるという効果を奏する。 According to the present invention, it is possible to improve the hermeticity of the fuse case and improve the assemblability.
比較例に係るヒューズ900の構成を示す模式図である。It is a schematic diagram which shows the structure of the fuse 900 which concerns on a comparative example. 本発明の一実施形態に係るチップヒューズ1の概略構成を示す斜視図である。1 is a perspective view showing a schematic configuration of a chip fuse 1 according to an embodiment of the present invention. 蓋部材20とケース部材10を分離した状態のチップヒューズ1の概略構成を示す斜視図である。2 is a perspective view showing a schematic configuration of the chip fuse 1 in a state where a lid member 20 and a case member 10 are separated. FIG. チップヒューズ1の正面図である。1 is a front view of a chip fuse 1. チップヒューズ1の側面図である。2 is a side view of the chip fuse 1. FIG. 図3BのA-A断面図である。FIG. 3B is a cross-sectional view taken along line AA in FIG. 3B. 図4のB-B断面図である。FIG. 5 is a sectional view taken along line BB in FIG. 4. ケース部材10の平面図であるIt is a top view of case member 10 図6のC-C断面図である。FIG. 7 is a cross-sectional view taken along the line CC of FIG. 蓋部材20の平面図である。3 is a plan view of a lid member 20. FIG. 図8のD-D断面図である。FIG. 9 is a sectional view taken along the line DD of FIG. チップヒューズ1の製造工程を示すフローチャートである。4 is a flowchart showing manufacturing steps of the chip fuse 1. 端子40、50が成形されているケース用金属板600の平面図である。It is a top view of the metal plate 600 for cases where the terminals 40 and 50 are shape | molded. 図11に示すケース用金属板600を正面側から見た図である。It is the figure which looked at the metal plate 600 for cases shown in FIG. 11 from the front side. ケース用金属板600に成形された端子40、50を示す斜視図である。It is a perspective view which shows the terminals 40 and 50 shape | molded by the metal plate 600 for cases. ケース組立体650が作製されているケース用金属板600の平面図である。It is a top view of the metal plate 600 for cases in which the case assembly 650 is produced. 図14に示すケース用金属板600を正面側から見た図である。It is the figure which looked at the metal plate 600 for cases shown in FIG. 14 from the front side. 複数のケース組立体650上に長尺の長尺可溶体660が配置された状態を示す平面図である。FIG. 10 is a plan view showing a state in which a long elongate fusible body 660 is disposed on a plurality of case assemblies 650. 図16のケース組立体650の縦断面図である。It is a longitudinal cross-sectional view of the case assembly 650 of FIG. 図17のE-E断面図である。FIG. 18 is a cross-sectional view taken along line EE in FIG. 17. 蓋部材20が成形されている蓋用金属板700の平面図である。It is a top view of the metal plate 700 for lid | covers with which the lid member 20 is shape | molded. 図19に示す蓋用金属板700を正面側から見た図である。It is the figure which looked at the metal plate 700 for lids shown in FIG. 19 from the front side. ケース組立体650のケース部材10に蓋部材20を接合したヒューズ組立体800の縦断面図を示す。A longitudinal sectional view of a fuse assembly 800 in which the lid member 20 is joined to the case member 10 of the case assembly 650 is shown. ヒューズ組立体850がケース用金属板600及び蓋用金属板700に支持されている状態を示す図である。It is a figure which shows the state by which the fuse assembly 850 is supported by the metal plate 600 for cases, and the metal plate 700 for lid | covers. 図22のF-F断面図である。FIG. 23 is a cross-sectional view taken along line FF in FIG. 22.
 以下では、下記に示す順序で説明を行う。
 1.比較例
  1-1.比較例に係るヒューズの構成
  1-2.比較例に係るヒューズにおける問題点
 2.本実施形態
  2-1.チップヒューズの構成
  2-2.チップヒューズの特性
  2-3.チップヒューズの製造方法
  2-4.本製造方法による効果
  2-5.変形例
Below, it demonstrates in the order shown below.
1. Comparative Example 1-1. Configuration of fuse according to comparative example 1-2. 1. Problems with fuses according to comparative examples Embodiment 2-1. Configuration of chip fuse 2-2. Characteristics of chip fuse 2-3. Manufacturing method of chip fuse 2-4. Effects of this manufacturing method 2-5. Modified example
 <1.比較例>
 本発明に係るヒューズについて説明する前に、比較例に係るヒューズについて説明する。以下においては、比較例に係るヒューズの構成について説明した後に、比較例に係るヒューズにおいて発生する問題点について説明する。
<1. Comparative Example>
Before describing the fuse according to the present invention, a fuse according to a comparative example will be described. In the following, after describing the configuration of the fuse according to the comparative example, problems that occur in the fuse according to the comparative example will be described.
 (1-1.比較例に係るヒューズの構成)
 図1は、比較例に係るヒューズ900の構成を示す模式図である。図1に示すように、ヒューズ900は、チューブ901と、可溶体902と、一対の端子903、904とを有する。ヒューズ900は、管形ヒューズであり、可溶体902を架空支持する。
(1-1. Configuration of fuse according to comparative example)
FIG. 1 is a schematic diagram illustrating a configuration of a fuse 900 according to a comparative example. As shown in FIG. 1, the fuse 900 includes a tube 901, a fusible body 902, and a pair of terminals 903 and 904. The fuse 900 is a tubular fuse and supports the fusible body 902 in an aerial manner.
 チューブ901は、アルミナ(酸化アルミニウム)製であり、円筒状の形状を成している。可溶体902は、線状のヒューズエレメントであり、チューブ901内に架空支持されている。可溶体902は、ここでは銅製である。 The tube 901 is made of alumina (aluminum oxide) and has a cylindrical shape. The fusible body 902 is a linear fuse element, and is supported in an aerial manner in the tube 901. The fusible body 902 is made of copper here.
 端子903、904は、可溶体902の長手方向の端部とそれぞれ接続している。端子903、904は、真鍮製であり、円筒状の形状を成している。端子903、904は、接着剤920によってチューブ901の外周面と接着されている。 Terminals 903 and 904 are connected to the longitudinal ends of the fusible body 902, respectively. The terminals 903 and 904 are made of brass and have a cylindrical shape. The terminals 903 and 904 are bonded to the outer peripheral surface of the tube 901 with an adhesive 920.
 端子903、904には、開口903a、904aが設けられており、可溶体902の端部は、開口903a、904aに挿通した状態で位置している。そして、可溶体902の端部は、半田910によって端子903、904に固定されている。なお、半田910は、開口903a、904aを塞ぐように設けられている。すなわち、半田910は、可溶体902を端子903、904に固定させる機能と、開口903a、904aをシールする機能とを有する。 The terminals 903 and 904 are provided with openings 903a and 904a, and the end of the fusible body 902 is located in a state of being inserted through the openings 903a and 904a. The end of the fusible body 902 is fixed to the terminals 903 and 904 with solder 910. Note that the solder 910 is provided so as to close the openings 903a and 904a. That is, the solder 910 has a function of fixing the fusible body 902 to the terminals 903 and 904 and a function of sealing the openings 903a and 904a.
 上記のヒューズ900は、以下のように組み立てられる。
 まず、チューブ901の両端部に接着剤920で端子903、904を接着して、チューブ組立体を製作する。次に、端子903の開口903a又は端子904の開口904aから可溶体902を挿入して、可溶体902の端部を端子903、904に固定させる位置に保持する。次に、開口903a、904aに半田を充填して、可溶体902の端部を端子903、904に固定させる。この際、開口903a、904aを密閉するように半田を充填することで、チューブ901内が気密状態になる。
The fuse 900 is assembled as follows.
First, terminals 903 and 904 are bonded to both ends of the tube 901 with an adhesive 920 to manufacture a tube assembly. Next, the fusible body 902 is inserted from the opening 903 a of the terminal 903 or the opening 904 a of the terminal 904, and the end of the fusible body 902 is held at a position to be fixed to the terminals 903 and 904. Next, the openings 903a and 904a are filled with solder, and the ends of the fusible body 902 are fixed to the terminals 903 and 904. At this time, the inside of the tube 901 is hermetically sealed by filling solder so as to seal the openings 903a and 904a.
 (1-2.比較例に係るヒューズにおける問題点)
 比較例に係るヒューズ900においては、気密性及び組立性に関して以下のような問題点がある。
(1-2. Problems with fuses according to comparative examples)
The fuse 900 according to the comparative example has the following problems with respect to hermeticity and assemblability.
 (気密性における問題点)
 ヒューズ900においては、可溶体902を端子903、904に固定する半田910が溶融して、気密性が低下する場合がある。
 具体的には、ヒューズ900の動作時に、発熱した可溶体902の熱が、可溶体902の端部と端子903、904を接続している半田910に伝達されることで、半田910が溶融又は軟化する。かかる場合には、半田910が、チューブ901内の圧力に耐え切れずに端子903、904の開口903a、904aから噴き出してしまい、チューブ901の気密性が低下する。これにより、チューブ901内の圧力が低下して、ヒューズ900の溶断による回路の電流の遮断が所定時間内に完了することができない。この結果、可溶体902の溶断の際に発生する火花が外気に触れて爆発に繋がる恐れがある。
(Problems in airtightness)
In the fuse 900, the solder 910 that fixes the fusible body 902 to the terminals 903 and 904 may melt and the airtightness may be reduced.
Specifically, the heat of the fusible body 902 generated during the operation of the fuse 900 is transmitted to the solder 910 connecting the end of the fusible body 902 and the terminals 903 and 904, so that the solder 910 is melted or melted. Soften. In such a case, the solder 910 cannot withstand the pressure in the tube 901 and is ejected from the openings 903a and 904a of the terminals 903 and 904, and the airtightness of the tube 901 is reduced. As a result, the pressure in the tube 901 decreases, and the circuit current interruption due to the melting of the fuse 900 cannot be completed within a predetermined time. As a result, there is a risk that a spark generated when the fusible body 902 is melted may touch the outside air and lead to an explosion.
 特に、近年、ヒューズ900の微細化に伴い、可溶体902の端子903、904間の長さ(図1に示す長さLe)が小さくなっている。かかる場合には、ヒューズ900の動作時に、発熱した可溶体902から半田910へ伝達される熱量が増大するため、半田910が溶融しやすくなり、チューブ901の気密性が低下しやすい。 In particular, with the recent miniaturization of the fuse 900, the length between the terminals 903 and 904 of the fusible body 902 (the length Le shown in FIG. 1) has been reduced. In such a case, when the fuse 900 is operated, the amount of heat transferred from the heat generating fusible body 902 to the solder 910 increases, so that the solder 910 is easily melted and the airtightness of the tube 901 is likely to be lowered.
 また、ヒューズ900においては、端子903、904とチューブ901を接着剤920で接着している接着部分の気密性が低下する場合がある。
 ここでは、ヒューズ900が長期間使用されたものとする。長期間使用されたヒューズ900においては、ヒューズ900の動作時に端子903、904がチューブ901から抜ける方向にずれる現象が発生してしまい、気密性が低下する。かかる場合にも、チューブ901内の圧力が低下して、ヒューズ900の溶断による回路の電流の遮断が所定時間内に完了することができない。
Further, in the fuse 900, the airtightness of the bonded portion where the terminals 903 and 904 and the tube 901 are bonded with the adhesive 920 may be lowered.
Here, it is assumed that the fuse 900 has been used for a long time. In the fuse 900 that has been used for a long period of time, a phenomenon occurs in which the terminals 903 and 904 are displaced in the direction in which they are removed from the tube 901 during the operation of the fuse 900, and the airtightness is lowered. Even in such a case, the pressure in the tube 901 decreases, and the interruption of the circuit current due to the melting of the fuse 900 cannot be completed within a predetermined time.
 ここで、端子903、904がチューブ901から抜ける方向にずれる理由を説明する。
 ヒューズ900においては、チューブ901、端子903、904及び接着剤920の線膨張係数が、異なる。具体的には、アルミナ製のチューブ901の線膨張係数は、約8.5×10-6(/K)であり、真鍮製の端子903、904の線膨張係数は、約19×10-6(/K)であり、接着剤920の線膨張係数は、約30×10-6(/K)である。このため、温度変化が生じると、チューブ901、端子903、904及び接着剤920の線膨張係数の差異に起因した応力が、接着剤920とチューブ901との接着界面や接着剤920と端子903、904との接着界面に発生する。そして、ヒューズ900の使用期間が長くなり、温度変化が繰り返されると、上記の応力が接着界面に繰り返し作用するため、接着剤920の接着力が低下する。この結果、端子903、904は、ヒューズ900の動作時に発生するチューブ901の内圧上昇に耐えられず、チューブ901から抜ける方向にずれる。
Here, the reason why the terminals 903 and 904 are shifted in the direction of coming out of the tube 901 will be described.
In the fuse 900, the linear expansion coefficients of the tube 901, the terminals 903 and 904, and the adhesive 920 are different. Specifically, the linear expansion coefficient of the alumina tube 901 is about 8.5 × 10 −6 (/ K), and the linear expansion coefficients of the brass terminals 903 and 904 are about 19 × 10 −6. (/ K), and the linear expansion coefficient of the adhesive 920 is about 30 × 10 −6 (/ K). For this reason, when a temperature change occurs, the stress caused by the difference in coefficient of linear expansion between the tube 901, the terminals 903 and 904, and the adhesive 920 causes the adhesive interface between the adhesive 920 and the tube 901, the adhesive 920 and the terminal 903, Occurs at the adhesive interface with 904. When the use period of the fuse 900 becomes long and the temperature change is repeated, the stress repeatedly acts on the adhesive interface, so that the adhesive force of the adhesive 920 is reduced. As a result, the terminals 903 and 904 cannot withstand the increase in internal pressure of the tube 901 that occurs during the operation of the fuse 900, and shift in the direction in which the terminals 903 and 904 come out of the tube 901.
 なお、ヒューズ900が長期間使用されると、接着剤920とチューブ901との接着界面、又は接着剤920と端子903、904との接着界面から、チューブ901内の高温雰囲気(気体)が噴き出す現象が発生することが確認されている。 When the fuse 900 is used for a long period of time, a high temperature atmosphere (gas) in the tube 901 is ejected from the adhesive interface between the adhesive 920 and the tube 901 or the adhesive interface between the adhesive 920 and the terminals 903 and 904. Has been confirmed to occur.
 (組立性における問題点)
 次に、ヒューズ900の組立性における3つの問題点について説明する。
(Problems in assembly)
Next, three problems in assembly of the fuse 900 will be described.
 1点目として、ヒューズ900においては、チューブ901の気密性を確保できるように接着剤920でチューブ901の両端部に端子903、904を接着する作業が難しいため、歩留まりが悪い。具体的には、円筒状のチューブ901の端部に予め接着剤920を塗布した後に、チューブ901に対して端子903、904を被せることにより、接着剤920をチューブ901と端子903、904の間に充填することになっている。しかし、接着剤をチューブ901と端子903、904の間に隙間無く充填することが極めて難しく、特にチューブ901の密閉性を保つ点において歩留まりが悪い。 First, in the fuse 900, since it is difficult to bond the terminals 903 and 904 to both ends of the tube 901 with the adhesive 920 so as to ensure the airtightness of the tube 901, the yield is poor. Specifically, after the adhesive 920 is applied to the end of the cylindrical tube 901 in advance, the adhesive 920 is placed between the tube 901 and the terminals 903 and 904 by covering the tube 901 with the terminals 903 and 904. Is supposed to be filled. However, it is extremely difficult to fill the adhesive without any gap between the tube 901 and the terminals 903 and 904, and in particular, the yield is poor in terms of maintaining the sealing property of the tube 901.
 2点目として、端子903の開口903a又は端子904の開口904aから可溶体902をチューブ901内に挿入して、可溶体902の端部を端子903、904に固定させる位置に保持する作業が難しい。すなわち、可溶体902を狭い開口903a、904aからチューブ901の閉ざされた空間に装填する必要があるため、作業性が悪く、作業に長い時間を要する。また、可溶体902が細い場合には、可溶体902の剛性が小さいことで可溶体902が撓みやすくなり、作業性が更に悪くなる。 Second, it is difficult to insert the fusible body 902 into the tube 901 from the opening 903a of the terminal 903 or the opening 904a of the terminal 904 and hold the end of the fusible body 902 at a position to fix the terminal to the terminals 903 and 904. . That is, since it is necessary to load the fusible body 902 into the closed space of the tube 901 from the narrow openings 903a and 904a, the workability is poor and the work takes a long time. Further, when the fusible body 902 is thin, the fusible body 902 is easily bent due to the low rigidity of the fusible body 902, and the workability is further deteriorated.
 3点目として、半田910で可溶体902の端部を端子903、904に固定させつつ、半田910で開口903a、904aを密閉する作業は、熟練を要する。すなわち、可溶体902を端子903、904に固定させる作業と、半田910で開口903a、904aを密閉する作業とを同時に行う必要があるため、作業に熟練していない通常の作業者が作業を行うと、多大な時間を要することになる。 As a third point, the work of sealing the openings 903a and 904a with the solder 910 while fixing the ends of the fusible body 902 to the terminals 903 and 904 with the solder 910 requires skill. That is, since it is necessary to simultaneously perform the work of fixing the fusible body 902 to the terminals 903 and 904 and the work of sealing the openings 903a and 904a with the solder 910, a normal worker who is not skilled in the work performs the work. It will take a lot of time.
 <2.本実施形態>
 (2-1.チップヒューズの構成)
 図2A、図2B、図3A、図3B、図4~図9を参照しながら、本発明の一実施形態に係るチップヒューズ1の構成について説明する。
<2. This embodiment>
(2-1. Configuration of chip fuse)
The configuration of the chip fuse 1 according to an embodiment of the present invention will be described with reference to FIGS. 2A, 2B, 3A, 3B, and 4 to 9. FIG.
 図2Aは、一実施形態に係るチップヒューズ1の概略構成を示す斜視図である。図2Bは、蓋部材20とケース部材10を分離した状態のチップヒューズ1の概略構成を示す斜視図である。図3Aは、チップヒューズ1の正面図である。図3Bは、チップヒューズ1の側面図である。図4は、図3BのA-A断面図である。図5は、図4のB-B断面図である。図6は、ケース部材10の平面図である。図7は、図6のC-C断面図である。図8は、蓋部材20の平面図である。図9は、図8のD-D断面図である。 FIG. 2A is a perspective view showing a schematic configuration of the chip fuse 1 according to the embodiment. FIG. 2B is a perspective view showing a schematic configuration of the chip fuse 1 in a state where the lid member 20 and the case member 10 are separated. FIG. 3A is a front view of the chip fuse 1. FIG. 3B is a side view of the chip fuse 1. 4 is a cross-sectional view taken along line AA in FIG. 3B. 5 is a cross-sectional view taken along the line BB of FIG. FIG. 6 is a plan view of the case member 10. 7 is a cross-sectional view taken along the line CC of FIG. FIG. 8 is a plan view of the lid member 20. 9 is a cross-sectional view taken along the line DD of FIG.
 チップヒューズ1は、電子機器の回路基板等に表面実装され、回路に異常な電流が流れた際に溶断する。チップヒューズ1は、小型のヒューズであり、ここでは、チップヒューズ1の長さL1(図2A)は約2.5(mm)であり、幅L2(図2A)は約1.5(mm)であり、厚さL3(図2A)は約1.3(mm)である。 The chip fuse 1 is surface-mounted on a circuit board or the like of an electronic device and is blown when an abnormal current flows through the circuit. The chip fuse 1 is a small fuse. Here, the length L1 (FIG. 2A) of the chip fuse 1 is about 2.5 (mm), and the width L2 (FIG. 2A) is about 1.5 (mm). The thickness L3 (FIG. 2A) is about 1.3 (mm).
 チップヒューズ1は、図2Aに示すように、外観形状が箱状を成している筐体5を有する。筐体5は、絶縁性樹脂から成り、具体的には液晶ポリマーから成る。液晶ポリマーは、耐熱性に優れると共に、射出成形時の流動性が高い特性を有する。また、筐体5内には、密閉空間(図4に示す密閉空間6)が形成されている。なお、筐体5は、上記に限定されず、母材である絶縁性樹脂に他の材料を含んでもよい。 As shown in FIG. 2A, the chip fuse 1 has a housing 5 whose outer shape is box-shaped. The housing 5 is made of an insulating resin, specifically, a liquid crystal polymer. The liquid crystal polymer has excellent heat resistance and high fluidity during injection molding. A sealed space (a sealed space 6 shown in FIG. 4) is formed in the housing 5. In addition, the housing | casing 5 is not limited to the above, You may contain another material in the insulating resin which is a base material.
 チップヒューズ1は、図2B等に示すように、ケース部材10と、蓋部材20と、可溶体30と、一対の端子40、50とを有する。チップヒューズ1は、端子40、50を介して回路基板と電気的に接続されており、回路基板から端子40、50を介して可溶体30へ電流が供給される。本実施形態では、ケース部材10及び蓋部材20が、筐体5を構成している。 The chip fuse 1 includes a case member 10, a lid member 20, a fusible body 30, and a pair of terminals 40 and 50 as shown in FIG. 2B and the like. The chip fuse 1 is electrically connected to the circuit board through terminals 40 and 50, and current is supplied from the circuit board to the fusible body 30 through the terminals 40 and 50. In the present embodiment, the case member 10 and the lid member 20 constitute the housing 5.
  (ケース部材10)
 ケース部材10は、筐体5のベース部分であり、図2Bに示すように可溶体30と端子40、50を収容している。ケース部材10は、熱可塑性樹脂である液晶ポリマーから成る。ケース部材10は、図2Bに示すように長方体形状を成している。ケース部材10は、可溶体収容部11と、端子収容部12と、ケース側接合面13と、嵌合凸部14と、位置決め溝部15とを有する。
(Case member 10)
The case member 10 is a base portion of the housing 5 and houses the fusible body 30 and the terminals 40 and 50 as shown in FIG. 2B. The case member 10 is made of a liquid crystal polymer that is a thermoplastic resin. The case member 10 has a rectangular parallelepiped shape as shown in FIG. 2B. The case member 10 includes a fusible member accommodating portion 11, a terminal accommodating portion 12, a case side joining surface 13, a fitting convex portion 14, and a positioning groove portion 15.
 可溶体収容部11は、可溶体30を収容している凹部である。可溶体収容部11は、図2Bに示すように、壁11aによって囲まれている。可溶体収容部11は、ケース部材10の中央に設けられている。可溶体収容部11は、可溶体30が溶断する溶断空間でもある。 The fusible body accommodating portion 11 is a concave portion that accommodates the fusible body 30. As shown in FIG. 2B, the fusible body accommodating portion 11 is surrounded by a wall 11a. The fusible body accommodating portion 11 is provided at the center of the case member 10. The soluble body accommodating part 11 is also a fusing space in which the fusible body 30 is fused.
 端子収容部12は、一対の端子40、50を収容している凹部である。端子収容部12は、可溶体収容部11の両側に設けられている。端子収容部12は、端子40、50と密着している。このため、端子収容部12と端子40、50との間に隙間が形成されていない。 The terminal accommodating portion 12 is a recess that accommodates the pair of terminals 40 and 50. The terminal accommodating part 12 is provided on both sides of the fusible substance accommodating part 11. The terminal accommodating portion 12 is in close contact with the terminals 40 and 50. For this reason, no gap is formed between the terminal accommodating portion 12 and the terminals 40 and 50.
 ケース側接合面13は、図4に示すように、蓋部材20の蓋側接合面22と接合している。ケース側接合面13は、図2Bに示すように、可溶体収容部11及び端子収容部12を囲むように、ケース部材10の上面の外縁に沿って環状に形成されている。ケース側接合面13は、平面度が高い面となっている。なお、可溶体収容部11の壁11aの上面は、ケース側接合面13よりも突出している。 The case side joining surface 13 is joined to the lid side joining surface 22 of the lid member 20, as shown in FIG. As shown in FIG. 2B, the case side joining surface 13 is formed in an annular shape along the outer edge of the upper surface of the case member 10 so as to surround the fusible body housing portion 11 and the terminal housing portion 12. The case side joining surface 13 is a surface having high flatness. In addition, the upper surface of the wall 11a of the fusible body housing portion 11 protrudes from the case side joining surface 13.
 嵌合凸部14は、図3Aに示すように蓋部材20の嵌合凹部23と嵌合している。嵌合凸部14は、ケース側接合面13から突出している。嵌合凸部14は、図2Bに示すように、ケース部材10の長手方向(X方向)の中央、かつ幅方向(Y方向)の両側の縁に設けられている。 The fitting convex part 14 is fitting with the fitting concave part 23 of the lid member 20 as shown in FIG. 3A. The fitting convex part 14 protrudes from the case side joining surface 13. 2B, the fitting convex part 14 is provided in the center of the longitudinal direction (X direction) of the case member 10, and the edge of the both sides of the width direction (Y direction).
 位置決め溝部15は、図2Bに示すように、可溶体収容部11の壁11aに長手方向に沿って形成された溝部である。位置決め溝部15は、可溶体30をケース部材10に収容する際の位置決め用の機能を有する。位置決め溝部15は、可溶体収容部11と端子収容部12の間に設けられており、可溶体30の両端部が、位置決め溝部15を通過している。 The positioning groove part 15 is a groove part formed along the longitudinal direction on the wall 11a of the fusible body accommodating part 11, as shown in FIG. 2B. The positioning groove 15 has a function for positioning when the fusible body 30 is accommodated in the case member 10. The positioning groove portion 15 is provided between the fusible body housing portion 11 and the terminal housing portion 12, and both end portions of the fusible body 30 pass through the positioning groove portion 15.
  (蓋部材20)
 蓋部材20は、筐体5の蓋部分であり、図2Bに示すようにケース部材10と同様に長方体形状を成している。蓋部材20は、ケース部材10と同一の熱可塑性樹脂である液晶ポリマーから成る。蓋部材20は、対向するケース部材10と接合しており、図4に示すようにケース部材10とで密閉空間6を形成している。蓋部材20は、図8に示すように、中央凹部21と、蓋側接合面22と、嵌合凹部23とを有する。
(Cover member 20)
The lid member 20 is a lid portion of the housing 5 and has a rectangular shape similar to the case member 10 as shown in FIG. 2B. The lid member 20 is made of a liquid crystal polymer that is the same thermoplastic resin as the case member 10. The lid member 20 is joined to the opposing case member 10 and forms a sealed space 6 with the case member 10 as shown in FIG. As shown in FIG. 8, the lid member 20 includes a central recess 21, a lid-side joining surface 22, and a fitting recess 23.
 中央凹部21は、蓋部材20の中央に設けられている。具体的には、中央凹部21は、ケース部材10の可溶体収容部11、端子収容部12及び位置決め溝部15に対向する部分に設けられている。 The central recess 21 is provided in the center of the lid member 20. Specifically, the central concave portion 21 is provided in a portion of the case member 10 that faces the fusible member accommodating portion 11, the terminal accommodating portion 12, and the positioning groove portion 15.
 蓋側接合面22は、図4に示すように、ケース部材10のケース側接合面13と接合している。蓋側接合面22は、中央凹部21を囲むように、蓋部材20の底面の外縁に沿って環状に形成されている。蓋側接合面22は、ここではエポキシ系接着剤でケース側接合面13と接合していることで、気密性を確保している。 The lid side joint surface 22 is joined to the case side joint surface 13 of the case member 10 as shown in FIG. The lid-side joining surface 22 is formed in an annular shape along the outer edge of the bottom surface of the lid member 20 so as to surround the central recess 21. Here, the lid-side bonding surface 22 is bonded to the case-side bonding surface 13 with an epoxy-based adhesive to ensure airtightness.
 嵌合凹部23は、図3Aに示すように、ケース部材10の嵌合凸部14と嵌合している。嵌合凹部23は、図9に示すように蓋部材20の側面を切り欠いて形成されている。嵌合凹部23が嵌合凸部14と嵌合する構成にすることで、ケース部材10に蓋部材20を被せる際に、ケース部材10に対して蓋部材20を位置決めしやすくなるので、チップヒューズ1の組立性が向上する。 The fitting recess 23 is fitted with the fitting protrusion 14 of the case member 10 as shown in FIG. 3A. The fitting recess 23 is formed by cutting out the side surface of the lid member 20 as shown in FIG. By adopting a configuration in which the fitting concave portion 23 is fitted with the fitting convex portion 14, the lid member 20 can be easily positioned with respect to the case member 10 when the case member 10 is covered with the lid member 20. 1 is improved.
 また、嵌合凹部23は、嵌合凸部14と接着剤で接合している。具体的には、嵌合凹部23の底面23a(図9)は、嵌合凸部14の頂面14a(図7)と接合している。例えば、底面23aは、エポキシ系接着剤で頂面14aと接合している。また、嵌合凸部14の側面14b(図7)も、嵌合凹部23の側面23b(図9)とエポキシ系接着剤で接合している。このように嵌合凹部23と嵌合凸部14を接合することで、ケース部材10と蓋部材20の接合強度をより高めることができる。この結果、圧力が増大する密閉空間6が内部に形成された筐体5の耐圧を高めることができる。 The fitting recess 23 is joined to the fitting projection 14 with an adhesive. Specifically, the bottom surface 23 a (FIG. 9) of the fitting concave portion 23 is joined to the top surface 14 a (FIG. 7) of the fitting convex portion 14. For example, the bottom surface 23a is joined to the top surface 14a with an epoxy adhesive. Further, the side surface 14b (FIG. 7) of the fitting convex portion 14 is also joined to the side surface 23b (FIG. 9) of the fitting concave portion 23 with an epoxy adhesive. Thus, joining strength of case member 10 and lid member 20 can be raised more by joining fitting crevice 23 and fitting projection 14. As a result, the pressure resistance of the housing 5 in which the sealed space 6 in which the pressure increases is formed can be increased.
 なお、上記では、ケース部材10が嵌合凸部14を有し、蓋部材20が嵌合凹部23を有することとしたが、これに限定されず、例えば、ケース部材10が嵌合凹部を有し、蓋部材20が嵌合凸部を有することとしてもよい。すなわち、ケース部材10及び蓋部材20の一方が嵌合凸部を有し、他方が嵌合凹部を有する。 In the above description, the case member 10 has the fitting convex portion 14 and the lid member 20 has the fitting concave portion 23. However, the present invention is not limited to this. For example, the case member 10 has the fitting concave portion. And it is good also as the cover member 20 having a fitting convex part. That is, one of the case member 10 and the lid member 20 has a fitting convex portion, and the other has a fitting concave portion.
  (可溶体30)
 可溶体30は、図2Bに示すように線状のヒューズエレメントである。可溶体30は、筐体5内の密閉空間6内に架空支持された状態で設けられている。可溶体30は、図4に示すように両端部が一対の端子40、50に挟持されていることで、密閉空間6内に架空支持されている。
(Soluble body 30)
The fusible body 30 is a linear fuse element as shown in FIG. 2B. The fusible body 30 is provided in an aerial support state in the sealed space 6 in the housing 5. As shown in FIG. 4, the fusible body 30 is supported aerial in the sealed space 6 by being sandwiched between a pair of terminals 40 and 50 at both ends.
 可溶体30は、本実施形態では熱伝導率が低いニッケルから成る。ただし、これに限定されず、可溶体30は、ニッケルを主成分として他の金属を含んでもよい。すなわち、可溶体30は、母材としてニッケルを含めばよい。かかる場合には、チップヒューズ1の動作時に可溶体30が発熱しても、端子40、50に伝達される熱量が抑制される。 The fusible body 30 is made of nickel having a low thermal conductivity in this embodiment. However, it is not limited to this, The soluble body 30 may contain another metal which has nickel as a main component. That is, the soluble body 30 should just contain nickel as a base material. In such a case, even if the fusible body 30 generates heat during the operation of the chip fuse 1, the amount of heat transmitted to the terminals 40 and 50 is suppressed.
 また、可溶体30は、表面に金属メッキが施されている可溶体メッキ層を有する。例えば、可溶体メッキ層は、可溶体30のニッケルの表面に錫メッキを施されている部分である。 Further, the fusible body 30 has a fusible body plating layer whose surface is metal-plated. For example, the soluble body plating layer is a portion where the nickel surface of the soluble body 30 is tin-plated.
  (端子40、50)
 一対の端子40、50は、図2Bに示すようにケース部材10の長手方向の両端側にそれぞれ設けられ、可溶体30の両端部と接続している。端子40、50は、ここでは銅の金属板から成る。端子40、50は、金属板の表面に金属メッキ(具体的には、錫メッキ)が施されている端子メッキ層を有する。端子40、50は、可溶体30との間で溶接されることで、可溶体30と電気的に接続している。具体的には、端子40、50は、溶接によって端子40、50の端子メッキ層と可溶体30の可溶体メッキ層とが溶融して接合することで、可溶体30と電気的に接続している。
(Terminals 40, 50)
The pair of terminals 40 and 50 are provided on both ends in the longitudinal direction of the case member 10 as shown in FIG. 2B, and are connected to both ends of the fusible body 30. Here, the terminals 40 and 50 are made of a copper metal plate. The terminals 40 and 50 have a terminal plating layer in which metal plating (specifically, tin plating) is applied to the surface of the metal plate. The terminals 40 and 50 are electrically connected to the fusible body 30 by welding with the fusible body 30. Specifically, the terminals 40 and 50 are electrically connected to the fusible body 30 by melting and joining the terminal plating layers of the terminals 40 and 50 and the fusible body plating layer of the fusible body 30 by welding. Yes.
 また、端子40、50は、一部が筐体5から露出するように筐体5と一体構造となっている。具体的には、端子40、50は、樹脂製のケース部材10を射出成形する際にインサート成形を行うことで、ケース部材10と一体構造となっている。 Further, the terminals 40 and 50 have an integrated structure with the housing 5 so that a part thereof is exposed from the housing 5. Specifically, the terminals 40 and 50 have an integral structure with the case member 10 by performing insert molding when the resin case member 10 is injection molded.
 端子40、50は、図4に示すように、挟持部41、51と、貫通部42、52と、端子部43、53とを有する。端子40、50の構成は同様であるので、以下では端子50の詳細構成について説明する。 As shown in FIG. 4, the terminals 40 and 50 have clamping parts 41 and 51, through parts 42 and 52, and terminal parts 43 and 53. Since the configuration of the terminals 40 and 50 is the same, the detailed configuration of the terminal 50 will be described below.
 挟持部51は、可溶体30の長手方向の端部を挟持している。挟持部51は、ケース部材10の端子収容部12に収容されている。挟持部51は、支え部511と、押さえ部512とを有する。 The sandwiching portion 51 sandwiches the end of the fusible body 30 in the longitudinal direction. The clamping part 51 is accommodated in the terminal accommodating part 12 of the case member 10. The sandwiching part 51 includes a support part 511 and a pressing part 512.
 支え部511は、可溶体30の長手方向の端部を支えている。具体的には、支え部511は、支え部511の上面に接触している可溶体30の端部を支えている(図5参照)。支え部511の上面は、図5に示すように、ケース部材10の上面(ケース側接合面13)と同じ高さに位置している。 The support portion 511 supports the end of the fusible body 30 in the longitudinal direction. Specifically, the support portion 511 supports the end of the fusible body 30 that is in contact with the upper surface of the support portion 511 (see FIG. 5). As shown in FIG. 5, the upper surface of the support portion 511 is located at the same height as the upper surface of the case member 10 (case-side bonding surface 13).
 押さえ部512は、支え部511に対向しており、支え部511に支えられた端部を押さえている(図5参照)。押さえ部512は、支え部511と繋がっており、金属板を折り曲げることで支え部511と対向している。 The pressing part 512 is opposed to the support part 511 and presses the end part supported by the support part 511 (see FIG. 5). The pressing part 512 is connected to the support part 511 and faces the support part 511 by bending a metal plate.
 なお、図6に示すように、押さえ部512の幅W2は、支え部511の幅W1よりも小さくなっている。そして、支え部511は、可溶体30の長手方向(図6のX方向)において、押さえ部512よりも端側まで設けられている。すなわち、支え部511の端面511aの位置は、押さえ部512の端面512aの位置よりも、長手方向の外側に位置している。かかる場合には、チップヒューズ1の組立時に、押さえ部512の端面512aに沿って可溶体30の端部を切り取ることで、切り取り後の端部は支え部511の端面511aよりも中央側に位置するので、可溶体30の端部がケース側接合面13へはみ出すことを防止できる。この結果、ケース側接合面13と蓋側接合面22との間に可溶体30の端部が挟まって気密性が低下することを防止できる。 In addition, as shown in FIG. 6, the width W2 of the pressing portion 512 is smaller than the width W1 of the support portion 511. And the support part 511 is provided in the longitudinal direction (X direction of FIG. 6) of the fusible body 30 to the end side rather than the holding | suppressing part 512. As shown in FIG. That is, the position of the end surface 511 a of the support portion 511 is located on the outer side in the longitudinal direction than the position of the end surface 512 a of the pressing portion 512. In such a case, when the chip fuse 1 is assembled, the end of the fusible body 30 is cut off along the end surface 512a of the pressing portion 512 so that the end after cutting is located closer to the center than the end surface 511a of the support portion 511. Therefore, it is possible to prevent the end of the fusible body 30 from protruding to the case-side joining surface 13. As a result, it is possible to prevent the end of the fusible body 30 from being sandwiched between the case-side joining surface 13 and the lid-side joining surface 22 to reduce the airtightness.
 貫通部52は、図4に示すようにケース部材10の壁を貫通しており、挟持部51と端子部53を接続している。貫通部52は、貫通している壁と接合しており、貫通部52とケース部材10が密着している。また、貫通部52は、金属板を複数回折り曲げた形状となっている。具体的には、貫通部52は、階段状に折り曲げた形状となっている。なお、貫通部52のケース部材10と密着している表面に表面処理を施して、貫通部52の表面を荒らしてもよい。かかる場合には、貫通部52とケース部材10とをより密着させることができるので、気密性を向上させることできる。 As shown in FIG. 4, the penetrating part 52 penetrates the wall of the case member 10 and connects the clamping part 51 and the terminal part 53. The penetrating part 52 is joined to the penetrating wall, and the penetrating part 52 and the case member 10 are in close contact with each other. Moreover, the penetration part 52 becomes the shape which bent the metal plate several times. Specifically, the penetrating portion 52 has a shape bent in a staircase shape. The surface of the penetrating part 52 may be roughened by subjecting the surface of the penetrating part 52 that is in close contact with the case member 10 to a surface treatment. In such a case, since the penetrating part 52 and the case member 10 can be more closely attached, airtightness can be improved.
 端子部53は、ケース部材10の下方にて、一部が外部に露出するように設けられている。端子部53は、チップヒューズ1が回路に実装された際に、回路基板と接続される。端子部53は、図4に示すようにL字状に形成されており、側面端子部531と、底面端子部532とを有する。 The terminal portion 53 is provided below the case member 10 so that a part thereof is exposed to the outside. The terminal portion 53 is connected to the circuit board when the chip fuse 1 is mounted on the circuit. As shown in FIG. 4, the terminal portion 53 is formed in an L shape, and includes a side terminal portion 531 and a bottom terminal portion 532.
 側面端子部531は、ケース部材10の側面に外部に露出するように設けられている。具体的には、図4に示すように、側面端子部531の外面は、ケース部材10の側面と同じ位置に位置している。かかる場合には、チップヒューズ1の回路基板への実装時の半田付けの際に、側面端子部531にも半田フィレットを形成できるので、端子50を回路基板に確実に接触させることが可能となる。 The side terminal portion 531 is provided on the side surface of the case member 10 so as to be exposed to the outside. Specifically, as shown in FIG. 4, the outer surface of the side terminal portion 531 is located at the same position as the side surface of the case member 10. In such a case, when the chip fuse 1 is soldered to the circuit board, a solder fillet can also be formed on the side terminal portion 531, so that the terminal 50 can be reliably brought into contact with the circuit board. .
 底面端子部532は、ケース部材10の底面に位置している。底面端子部532の底面は、図4に示すように、ケース部材10の底面に対して底面端子部532の厚さよりも小さく突出している。かかる場合には、チップヒューズ1を回路基板へ実装する際に、底面端子部532が回路基板に確実に接触できる。また、底面端子部532のケース部材10の底面から突出していない部分がケース部材10と一体となっていることで、端子50とケース部材10の接合がより強固になる。 The bottom terminal portion 532 is located on the bottom surface of the case member 10. As shown in FIG. 4, the bottom surface of the bottom terminal portion 532 protrudes smaller than the thickness of the bottom terminal portion 532 with respect to the bottom surface of the case member 10. In such a case, when the chip fuse 1 is mounted on the circuit board, the bottom terminal portion 532 can reliably contact the circuit board. Further, since the portion of the bottom terminal portion 532 that does not protrude from the bottom surface of the case member 10 is integrated with the case member 10, the connection between the terminal 50 and the case member 10 becomes stronger.
 (2-2.チップヒューズ1の特性)
 上述した構成のチップヒューズ1は、気密性を確保した信頼性の高いチップヒューズとなっている。以下において詳細に説明する。
(2-2. Characteristics of chip fuse 1)
The chip fuse 1 having the above-described configuration is a highly reliable chip fuse that ensures airtightness. This will be described in detail below.
 (チップヒューズ1の気密性について)
 前述したように、チップヒューズ1においては、密閉空間6を形成するケース部材10と蓋部材20が接合することで、気密性を安定して確保できる。また、ケース部材10及び蓋部材20は、射出成形時の流動性に優れた液晶ポリマーで形成されているため、ケース側接合面13及び蓋側接合面22の平面度が、高くなっている。このため、ケース側接合面13と蓋側接合面22が、より密着しやすくなるので、気密性を高めることができる。
(About airtightness of chip fuse 1)
As described above, in the chip fuse 1, the case member 10 and the lid member 20 that form the sealed space 6 are bonded to each other, so that airtightness can be stably secured. Further, since the case member 10 and the lid member 20 are formed of a liquid crystal polymer having excellent fluidity at the time of injection molding, the flatness of the case side joining surface 13 and the lid side joining surface 22 is high. For this reason, since the case-side joining surface 13 and the lid-side joining surface 22 are more likely to be in close contact with each other, the airtightness can be improved.
 また、平面であるケース側接合面13及び蓋側接合面22の面全体に接着剤を塗布しやすくなるので、従来発生していた接着剤の塗布不良に起因する気密性の低下を抑制できると共に、接着剤塗布の作業性が向上する。 Moreover, since it becomes easy to apply | coat an adhesive agent to the whole surface of the case side joining surface 13 and the lid | cover side joining surface 22 which is a plane, while being able to suppress the fall of the airtightness resulting from the application | coating defect of the adhesive agent which generate | occur | produced conventionally, The workability of adhesive application is improved.
 さらに、ケース部材10及び蓋部材20が同一の液晶ポリマーから形成されているので、液晶ポリマーと相性の良い接着剤を選定してケース部材10及び蓋部材20を接合することで、ケース部材10と蓋部材20の接着強度を高くできる。特に、本実施形態で用いるエポキシ系接着剤は、実験結果から、液晶ポリマーから成るケース部材10及び蓋部材20の接着強度を高められることが確認できた。なお、実験の際には、エポキシ系接着剤を約130℃の温度で30分硬化させている。 Further, since the case member 10 and the lid member 20 are formed of the same liquid crystal polymer, the case member 10 and the lid member 20 are joined by selecting an adhesive that is compatible with the liquid crystal polymer and joining the case member 10 and the lid member 20. The adhesive strength of the lid member 20 can be increased. In particular, it was confirmed from the experimental results that the epoxy adhesive used in the present embodiment can increase the adhesive strength between the case member 10 and the lid member 20 made of a liquid crystal polymer. In the experiment, the epoxy adhesive was cured at a temperature of about 130 ° C. for 30 minutes.
 また、ケース部材10及び蓋部材20が同一材料(液晶ポリマー)から形成されている場合には、異なる材料の場合に発生する線膨張係数の違いによる起因する接合界面における熱応力の発生を抑制できる。この結果、熱応力の発生による接合強度の低下も抑制できる。また、接着剤の線膨張係数が液晶ポリマーの線膨張係数と整合するような接着剤を選定することで、チップヒューズ1を長期にわたって使用した際に繰り返し発生する温度変化によって接合面が剥がれることを防止できる。 In addition, when the case member 10 and the lid member 20 are formed of the same material (liquid crystal polymer), it is possible to suppress the generation of thermal stress at the joint interface caused by the difference in linear expansion coefficient that occurs when different materials are used. . As a result, a decrease in bonding strength due to the generation of thermal stress can be suppressed. Further, by selecting an adhesive that matches the linear expansion coefficient of the liquid crystal polymer with that of the liquid crystal polymer, the bonding surface is peeled off due to temperature changes that occur repeatedly when the chip fuse 1 is used over a long period of time. Can be prevented.
 次に、一体構造となっているケース部材10と端子40、50の密着による気密性について説明する。
 前述したように、端子40、50は、挟持部41、51と端子部43、53との間に、ケース部材10に接合した状態で貫通している貫通部42、52を有する。ここで、貫通部42、52が端子40、50の金属板を折り曲げて階段状に形成されているため、ケース部材10との接合面積を広くできる。この結果、貫通部42、52とケース部材10の接合によって、気密性を十分に確保できる。
Next, the airtightness due to the close contact between the case member 10 and the terminals 40 and 50 having an integral structure will be described.
As described above, the terminals 40 and 50 have the through portions 42 and 52 penetrating in a state where the terminals 40 and 50 are joined to the case member 10 between the sandwiching portions 41 and 51 and the terminal portions 43 and 53. Here, since the through portions 42 and 52 are formed in a staircase shape by bending the metal plates of the terminals 40 and 50, the joint area with the case member 10 can be widened. As a result, the airtightness can be sufficiently secured by joining the through portions 42 and 52 and the case member 10.
 また、ケース部材10の材料である液晶ポリマーは流動性が優れているため、インサート成形によって貫通部42、52が貫通しているケース部材10を成形する際に、液晶ポリマーが貫通部42、52の表面に十分になじむため、ケース部材10と貫通部42、52の密着度合いを高められる。 Further, since the liquid crystal polymer that is a material of the case member 10 has excellent fluidity, the liquid crystal polymer is formed through the through portions 42 and 52 when the case member 10 in which the through portions 42 and 52 are inserted is formed by insert molding. Therefore, the degree of close contact between the case member 10 and the through portions 42 and 52 can be increased.
 (可溶体の発熱時の端子への影響について)
 本実施形態では、可溶体30をニッケル製にすることで、可溶体30と電気的に接続している端子40、50(具体的には、挟持部41、51)の温度上昇を抑制できる。以下では、比較例で説明した銅製の可溶体902(図1)と対比して説明する。
(About the influence on the terminal when the fusible body generates heat)
In the present embodiment, the temperature rise of the terminals 40 and 50 (specifically, the sandwiching portions 41 and 51) electrically connected to the fusible body 30 can be suppressed by making the fusible body 30 made of nickel. Below, it demonstrates in contrast with the soluble body 902 (FIG. 1) made from copper demonstrated in the comparative example.
 以下では、説明の便宜上、可溶体30及び可溶体902を、単に可溶体と総称して説明する。一般に、可溶体から端子へ単位時間に伝達する熱量Q(W)は、下記の式(1)のように示される。 Hereinafter, for convenience of explanation, the soluble body 30 and the soluble body 902 will be simply referred to as a soluble body. In general, the amount of heat Q (W) transferred from the fusible body to the terminal per unit time is represented by the following equation (1).
Figure JPOXMLDOC01-appb-M000001
 ここで、λは可溶体の熱伝導率(W/m・K)を示し、aは可溶体の通電断面積(m)を示し、Lは可溶体の長さ(m)を示し、θは可溶体の融点(K)を示し、θは端子の温度を示す。
Figure JPOXMLDOC01-appb-M000001
Here, lambda represents the thermal conductivity of the fusible element (W / m · K), a represents the current cross-sectional area of the fusible (m 2), L e is the length of the fusible element (m), θ m represents the melting point (K) of the soluble material, and θ o represents the temperature of the terminal.
 次に、式(1)において、通電断面積a、長さL、及び温度θを一定にして、可溶体が銅製である場合とニッケル製である場合の熱量Qを比較した結果を、表1に示す。なお、ここでは、a=8.0×10-9(m)とし、L=0.0015(m)として、λは常温における値とした。 Next, in Formula (1), with the current cross-sectional area a, the length L e , and the temperature θ o being constant, the results of comparing the amount of heat Q when the fusible body is made of copper and when made of nickel are Table 1 shows. Here, a = 8.0 × 10 −9 (m 2 ), L e = 0.0015 (m), and λ was a value at room temperature.
Figure JPOXMLDOC01-appb-T000002
 表1から、ニッケル製の可溶体から端子へ伝達する熱量Qは、端子の温度が同一の場合には、銅製の可溶体から端子へ伝達する熱量の約1/3であり、非常に小さくなっていることが分かる。換言すれば、可溶体がニッケル製の場合には、端子へ伝達される熱量が小さいため、端子の温度上昇が小さい。
Figure JPOXMLDOC01-appb-T000002
From Table 1, the amount of heat Q transferred from the nickel fusible body to the terminal is about 1/3 of the amount of heat transferred from the copper fusible body to the terminal when the temperature of the terminal is the same. I understand that In other words, when the fusible body is made of nickel, the amount of heat transferred to the terminal is small, so the temperature rise of the terminal is small.
 また、式(1)からも分かるように、可溶体の長さLが小さくなると、可溶体から端子へ伝達される熱量Qは増大する。
 このため、本実施形態のように可溶体30の長さLが小さい微細なチップヒューズ1においては、可溶体30を熱伝導率の小さいニッケル製とすることにより、可溶体30から端子40、50へ伝達される熱量Qを抑制して端子40、50の温度上昇を抑制できる。この結果、可溶体30から発生する熱の影響が、気密性を高めるために一体構造となっている端子40、50及びケース部材10に及ぼす影響を抑制できる。
Moreover, as can be seen from equation (1), the length L e of the fusible element is reduced, the amount of heat Q that is transferred from the fusible element to the terminals is increased.
Therefore, in the length L e is less fine chip fuse 1 of fusible 30 as in this embodiment, since the fusible element 30 is made of small nickel thermal conductivity, the terminal 40 from the fusible element 30, The amount of heat Q transmitted to 50 can be suppressed, and the temperature rise of terminals 40 and 50 can be suppressed. As a result, it is possible to suppress the influence of the heat generated from the fusible body 30 on the terminals 40 and 50 and the case member 10 that are integrated to improve airtightness.
 上述したチップヒューズ1によれば、端子40、50の挟持部41、51が可溶体30を挟持して固定する一方で、ケース部材10のケース側接合面13と蓋部材20の蓋側接合面22とが接合して密閉空間6を形成する。かかる場合には、チップヒューズ1の動作時に、可溶体30の熱は挟持部41、51に伝達されても、ケース側接合面13や蓋側接合面22に伝達され難いので、ケース側接合面13や蓋側接合面22の接合強度が低下することを抑制できる。この結果、筐体5の気密性の低下を抑制できる。 According to the above-described chip fuse 1, the holding portions 41 and 51 of the terminals 40 and 50 hold and fix the fusible body 30, while the case-side joining surface 13 of the case member 10 and the lid-side joining surface of the lid member 20. 22 is joined to form a sealed space 6. In such a case, when the chip fuse 1 is operated, the heat of the fusible body 30 is not transmitted to the case-side joining surface 13 or the lid-side joining surface 22 even if it is transmitted to the sandwiching portions 41, 51. It can suppress that the joint strength of 13 and the lid side joint surface 22 falls. As a result, a decrease in the airtightness of the housing 5 can be suppressed.
 また、ケース部材10の母材を成形時の流動性に優れた液晶ポリマーにすることで、端子40、50とケース部材10に密着性を高めることができる。また、ケース部材10と蓋部材20を同一材料にすることで、接着剤による接合を効果的に行いやすくなる。さらに、可溶体30の材質を熱伝導率が小さいニッケルにすることで、チップヒューズ1の動作時に端子40、50の挟持部41、51の温度上昇を抑制できる。
 なお、上述したチップヒューズ1を用いて実験した結果、定格電流250(mA)、定格電圧72(V)で、50(A)の電流を遮断できることが確認できた。また、繰り返し温度サイクル試験を実施した後、同様の遮断を行えることを確認できた。
Further, by making the base material of the case member 10 a liquid crystal polymer having excellent fluidity at the time of molding, adhesion between the terminals 40 and 50 and the case member 10 can be enhanced. Moreover, it becomes easy to perform joining by an adhesive agent effectively by making the case member 10 and the cover member 20 into the same material. Furthermore, the material of the fusible body 30 is made of nickel having a low thermal conductivity, so that the temperature rise of the sandwiching portions 41 and 51 of the terminals 40 and 50 can be suppressed during the operation of the chip fuse 1.
As a result of an experiment using the above-described chip fuse 1, it was confirmed that a current of 50 (A) can be cut off at a rated current of 250 (mA) and a rated voltage of 72 (V). In addition, it was confirmed that the same interruption was possible after repeated temperature cycle tests.
 (2-3.チップヒューズの製造方法)
 図10を参照しながら、上述した構成のチップヒューズ1の製造方法の一例について説明する。
 図10は、チップヒューズ1の製造工程を示すフローチャートである。以下では、工程毎に詳細に説明する。
(2-3. Chip fuse manufacturing method)
An example of a method for manufacturing the chip fuse 1 having the above-described configuration will be described with reference to FIG.
FIG. 10 is a flowchart showing the manufacturing process of the chip fuse 1. Below, it demonstrates in detail for every process.
  (端子40、50の成形:S102)
 図11は、端子40、50が成形されているケース用金属板600の平面図である。図12は、図11に示すケース用金属板600を正面側から見た図である。図13は、ケース用金属板600に成形された端子40、50を示す斜視図である。
(Formation of terminals 40 and 50: S102)
FIG. 11 is a plan view of the case metal plate 600 in which the terminals 40 and 50 are formed. 12 is a view of the case metal plate 600 shown in FIG. 11 as viewed from the front side. FIG. 13 is a perspective view showing the terminals 40, 50 formed on the case metal plate 600.
 ステップS102においては、長尺状の第1金属板であるケース用金属板600を加工して、ケース用金属板600に所定間隔で一対の端子40、50を連続成形する。
 ケース用金属板600は、厚さが約0.15(mm)の銅製の板であり、表面に錫メッキが施されている。ケース用金属板600は、所定の搬送方向に搬送される。ケース用金属板600には、搬送用のガイド穴602が金属板の長手方向に所定のピッチLpで設けられている。搬送部材が、ガイド穴602に順次噛み合いながら回転することで、ケース用金属板600が搬送方向に搬送される。
In step S102, the case metal plate 600, which is a long first metal plate, is processed, and the pair of terminals 40, 50 are continuously formed on the case metal plate 600 at predetermined intervals.
The case metal plate 600 is a copper plate having a thickness of about 0.15 (mm), and the surface thereof is tin-plated. The case metal plate 600 is transported in a predetermined transport direction. The case metal plate 600 is provided with a conveying guide hole 602 at a predetermined pitch Lp in the longitudinal direction of the metal plate. As the conveying member rotates while sequentially meshing with the guide holes 602, the case metal plate 600 is conveyed in the conveying direction.
 端子40、50は、ケース用金属板600に対してプレス成形を行うことで成形される。一対の端子40、50は、ガイド穴602のピッチと同じピッチLpで成形されている。
また、端子40、50の挟持部41、51の押さえ部412、512は、図13に示すように支え部411、511に対して垂直に立っている。押さえ部412、512は、端子40、50に可溶体30を固定する際に、曲げられて支え部411、511に対向することになる。
The terminals 40 and 50 are formed by press forming the case metal plate 600. The pair of terminals 40 and 50 are formed with the same pitch Lp as the pitch of the guide holes 602.
Further, the holding portions 4112 and 512 of the holding portions 41 and 51 of the terminals 40 and 50 stand perpendicular to the support portions 411 and 511 as shown in FIG. The holding parts 412 and 512 are bent and face the support parts 411 and 511 when fixing the fusible body 30 to the terminals 40 and 50.
 ガイド穴602と端子40、50との位置関係は、予め定められている。このため、搬送中のケース用金属板600のガイド穴602の搬送方向における位置を管理することで、端子40、50の位置も管理できる。 The positional relationship between the guide hole 602 and the terminals 40 and 50 is determined in advance. For this reason, the position of the terminals 40 and 50 can also be managed by managing the position of the guide hole 602 of the case metal plate 600 being conveyed in the conveyance direction.
  (ケース組立体の作製:S104)
 図14は、ケース組立体650が作製されているケース用金属板600の平面図である。図15は、図14に示すケース用金属板600を正面側から見た図である。
(Production of case assembly: S104)
FIG. 14 is a plan view of the case metal plate 600 in which the case assembly 650 is manufactured. FIG. 15 is a view of the case metal plate 600 shown in FIG. 14 as viewed from the front side.
 ステップS104においては、ケース部材10の材料である熱可塑性樹脂を、端子40、50が成形されたケース用金属板600に対して射出成形することで、ケース部材10と端子40、50が一体化しているケース組立体650を作製する。本実施形態では、射出成形用の金型にケース用金属板600をセットした後に、端子40、50の周囲に液晶ポリマーを射出することで、ケース組立体650を作製する(所謂インサート成形)。 In step S104, the case member 10 and the terminals 40, 50 are integrated by injection molding the thermoplastic resin, which is the material of the case member 10, onto the case metal plate 600 on which the terminals 40, 50 are formed. A case assembly 650 is produced. In the present embodiment, after the case metal plate 600 is set in an injection mold, the case assembly 650 is produced by injecting a liquid crystal polymer around the terminals 40 and 50 (so-called insert molding).
 より具体的に説明する。まず、端子40、50が連続して形成されたケース用金属板600が搬送され、開いた状態の射出金型用の金型(キャビティ又はコア)に端子40、50が位置すると搬送が停止する。その後、金型を閉じて液晶ポリマーを金型内に射出して、端子40、50と一体化したケース部材10を成形する。すなわち、一のケース組立体650を作製する。そして、金型を再度開いて、所定ピッチだけケース用金属板600を搬送して、次のケース組立体650を作製する。このようなサイクルを繰り返すことで、ケース組立体650を短時間に大量に作製でき、生産性を向上できる。 More specific explanation. First, the case metal plate 600 in which the terminals 40 and 50 are continuously formed is conveyed, and the conveyance stops when the terminals 40 and 50 are positioned in the mold (cavity or core) for the injection mold in the opened state. . Thereafter, the mold is closed and the liquid crystal polymer is injected into the mold to mold the case member 10 integrated with the terminals 40 and 50. That is, one case assembly 650 is manufactured. Then, the mold is opened again, and the case metal plate 600 is conveyed by a predetermined pitch, and the next case assembly 650 is manufactured. By repeating such a cycle, a large number of case assemblies 650 can be manufactured in a short time, and productivity can be improved.
 図14に示すように、複数のケース組立体650は、ケース用金属板600の支持部604に所定間隔で支持されている。ケース組立体650において端子40、50の一部(具体的には、挟持部41、51の押さえ部412、512)は、図15に示すように、樹脂に覆われることなくケース部材10から露出している。 As shown in FIG. 14, the plurality of case assemblies 650 are supported by the support portion 604 of the case metal plate 600 at a predetermined interval. In the case assembly 650, a part of the terminals 40 and 50 (specifically, the pressing portions 412 and 512 of the clamping portions 41 and 51) are exposed from the case member 10 without being covered with resin as shown in FIG. is doing.
 前述したように、端子40、50の端子部43、53の側面端子部431、531は、ケース部材10の側面と同一面となっている(図4参照)。かかる場合には、インサート成形によって端子40、50とケース部材10を一体化する際に、側面端子部431、531が射出成形の金型の内面に当接して安定した状態となるので、インサート成形を精度良く行うことができる。 As described above, the side surface terminal portions 431 and 531 of the terminal portions 43 and 53 of the terminals 40 and 50 are flush with the side surface of the case member 10 (see FIG. 4). In such a case, when the terminals 40 and 50 and the case member 10 are integrated by insert molding, the side terminal portions 431 and 531 come into contact with the inner surface of the injection mold and become stable. Can be performed with high accuracy.
  (可溶体の固定:S106)
 図16は、複数のケース組立体650上に長尺の長尺可溶体660が配置された状態を示す平面図である。図17は、図16のケース組立体650の縦断面図である。図18は、図17のE-E断面図である。
(Fusion of soluble body: S106)
FIG. 16 is a plan view showing a state in which a long elongate fusible body 660 is disposed on a plurality of case assemblies 650. FIG. 17 is a longitudinal sectional view of the case assembly 650 of FIG. 18 is a cross-sectional view taken along line EE in FIG.
 ステップS106においては、長尺可溶体660をケース組立体650のケース部材10上に配置して、端子40、50に長尺可溶体660を固定する。そして、長尺可溶体660を固定した後に、長尺可溶体660と端子40、50とを電気的に接続する。以下では、この一連の作業の詳細について説明する。 In step S106, the long fusible body 660 is disposed on the case member 10 of the case assembly 650, and the long fusible body 660 is fixed to the terminals 40 and 50. And after fixing the long soluble body 660, the long soluble body 660 and the terminals 40 and 50 are electrically connected. Hereinafter, details of this series of operations will be described.
 まず、長尺可溶体660をケース部材10の所定位置へ配置させる作業について説明する。
 前述したように、挟持部41、51の押さえ部412、512は、支え部411、511に対して垂直に立っている。そして、長尺可溶体660を挟持部41、51の上方から下方へ移動させて、支え部411、511に長尺可溶体660を接触させる。この際、支え部411、511の上方の空間は開放されているので、長尺可溶体660が移動自在となり、長尺可溶体660の位置を容易に調整できる。特に、両端が支持された長尺可溶体660に対して所定のテンションを加えることで、撓みが抑制された直線状の長尺可溶体660を支え部411、511に対して精度良く位置決めできる。
First, the operation | work which arrange | positions the elongate soluble body 660 to the predetermined position of the case member 10 is demonstrated.
As described above, the pressing portions 412 and 512 of the holding portions 41 and 51 stand vertically with respect to the support portions 411 and 511. Then, the long fusible body 660 is moved from the upper side to the lower side of the sandwiching parts 41 and 51 to bring the long fusible body 660 into contact with the support parts 411 and 511. At this time, since the space above the support portions 411 and 511 is open, the long fusible body 660 can move and the position of the long fusible body 660 can be easily adjusted. In particular, by applying a predetermined tension to the long fusible body 660 supported at both ends, the linear long fusible body 660 with suppressed bending can be accurately positioned with respect to the support portions 411 and 511.
 本実施形態では、ケース用金属板600に支持された複数のケース組立体650に跨るように、長尺可溶体660を複数のケース組立体650の各々のケース部材10上に配置させる。ここで、長尺可溶体660が接触する支え部411、511と、ケース部材10のケース側接合面13とが同一面となっているので、長尺可溶体660のZ軸方向における位置決めを行いやすくなる。また、長尺可溶体660をケース部材10の位置決め溝部15を通過させるように配置させるので、すなわち、位置決め溝部15をガイドとしても用いるので、長尺可溶体660のY軸方向における位置決めを行いやすくなる。 In this embodiment, the long fusible body 660 is arranged on each case member 10 of the plurality of case assemblies 650 so as to straddle the plurality of case assemblies 650 supported by the case metal plate 600. Here, since the support parts 411 and 511 with which the long fusible body 660 contacts and the case side joining surface 13 of the case member 10 are the same surface, the long fusible body 660 is positioned in the Z-axis direction. It becomes easy. Further, since the long fusible body 660 is disposed so as to pass through the positioning groove 15 of the case member 10, that is, the positioning groove 15 is also used as a guide, so that the long fusible body 660 can be easily positioned in the Y-axis direction. Become.
 次に、支え部411、511上に配置された長尺可溶体660を固定する作業について説明する。
 支え部411、511に長尺可溶体660が配置された状態で、支え部411、511に対して垂直に立っている押さえ部412、512を、図18に示す矢印の方向に折り曲げる。具体的には、押さえ部412、512が長尺可溶体660を挟んで支え部411、511に対向するように、押さえ部412、512を約90度折り曲げる。これにより、支え部411、511と押さえ部412、512が、長尺可溶体660を挟持する。この結果、所定位置に位置決めされた長尺可溶体660が、挟持部41、51に固定される。
Next, the operation | work which fixes the elongate soluble body 660 arrange | positioned on the support parts 411 and 511 is demonstrated.
In a state in which the long fusible body 660 is disposed on the support portions 411 and 511, the holding portions 412 and 512 standing perpendicular to the support portions 411 and 511 are bent in the direction of the arrow shown in FIG. Specifically, the holding portions 412 and 512 are bent by about 90 degrees so that the holding portions 412 and 512 are opposed to the support portions 411 and 511 with the long fusible body 660 interposed therebetween. Thereby, the support parts 411 and 511 and the holding | suppressing parts 412 and 512 pinch the long soluble body 660. As a result, the long fusible body 660 positioned at a predetermined position is fixed to the holding portions 41 and 51.
 次に、挟持部41、51に固定された長尺可溶体660の両端と端子40、50とを電気的に接続する作業について説明する。
 長尺可溶体660が挟持部41、51に固定された状態で、挟持部41の押さえ部412の上面から長尺可溶体660を挟んで支え部411へ向かって電流を流して、長尺可溶体660の一端と挟持部41を溶接する。同様に、挟持部51の押さえ部512の上面から長尺可溶体660を挟んで支え部511へ向かって電流を流して、長尺可溶体660の他端と挟持部51を溶接する。これにより、長尺可溶体660と挟持部41、51とが、電気的に接続される。特に、溶接の際に、長尺可溶体660の可溶体メッキ層と挟持部41、51の端子メッキ層とが溶融することで、長尺可溶体660と端子40、50との間の電気的接続を確実に実現できる。なお、長尺可溶体660の両端と挟持部41、51を同時に溶接してもよい。
Next, the operation | work which electrically connects both ends of the long soluble body 660 fixed to the clamping parts 41 and 51 and the terminals 40 and 50 is demonstrated.
In a state in which the long fusible body 660 is fixed to the sandwiching portions 41 and 51, a current is allowed to flow from the upper surface of the pressing portion 412 of the sandwiching portion 41 toward the support portion 411 with the long fusible body 660 interposed therebetween. One end of the solution 660 and the clamping part 41 are welded. Similarly, an electric current is passed from the upper surface of the pressing part 512 of the clamping part 51 toward the support part 511 with the long fusible body 660 interposed therebetween, and the other end of the long fusible body 660 and the clamping part 51 are welded. Thereby, the long soluble body 660 and the clamping parts 41 and 51 are electrically connected. In particular, during welding, the fusible body plating layer of the long fusible body 660 and the terminal plating layer of the sandwiching portions 41 and 51 are melted, so that the electrical connection between the long fusible body 660 and the terminals 40 and 50 is achieved. Connection can be realized reliably. In addition, you may weld the both ends of the elongate soluble body 660, and the clamping parts 41 and 51 simultaneously.
 長尺可溶体660と端子40、50とを接続した後に、長尺可溶体660を切断する。例えば、押さえ部412、512の端面412a、512a(図6)の位置で、長尺可溶体660をカッターで切断する。長尺可溶体660を切断したものが、チップヒューズ1の可溶体30となる。前述したように、支え部411、511の端面411a、511aは、押さえ部412、512の端面412a、512aよりも外側に位置するので、仮に長尺可溶体660の切断位置がずれて端部が切れ残っていても、可溶体30がケース部材10のケース側接合面13まではみ出ることを防止できる。 After connecting the long soluble body 660 and the terminals 40 and 50, the long soluble body 660 is cut. For example, the long fusible body 660 is cut with a cutter at the positions of the end faces 412a and 512a (FIG. 6) of the holding portions 412 and 512. The long fusible body 660 cut is the fusible body 30 of the chip fuse 1. As described above, since the end surfaces 411a and 511a of the support portions 411 and 511 are located outside the end surfaces 412a and 512a of the holding portions 412 and 512, the cutting position of the long fusible body 660 is temporarily shifted and the end portions are temporarily shifted. Even if it remains uncut, it is possible to prevent the fusible body 30 from protruding to the case-side joining surface 13 of the case member 10.
  (蓋部材の成形:S108)
 図19は、蓋部材20が成形されている蓋用金属板700の平面図である。図20は、図19に示す蓋用金属板700を正面側から見た図である。
(Cover member molding: S108)
FIG. 19 is a plan view of a lid metal plate 700 on which the lid member 20 is formed. FIG. 20 is a view of the lid metal plate 700 shown in FIG. 19 as viewed from the front side.
 ステップS108においては、蓋部材20の材料である熱可塑性樹脂を、長尺状の蓋用金属板700に対して射出成形することで、蓋用金属板700に所定間隔で支持されている蓋部材20を複数成形する。蓋用金属板700は、例えば厚さが約0.15(mm)の銅製の板であり、表面に錫メッキが施されている。蓋用金属板700にも、ケース用金属板600と同様に、ガイド穴702がピッチLpで設けられている。蓋部材20は、ガイド穴702のピッチと同じピッチで成形されている。 In step S108, the thermoplastic resin, which is the material of the lid member 20, is injection-molded onto the long lid metal plate 700, so that the lid member is supported on the lid metal plate 700 at a predetermined interval. A plurality of 20 are molded. The lid metal plate 700 is, for example, a copper plate having a thickness of about 0.15 (mm), and the surface thereof is tin-plated. Similarly to the case metal plate 600, the guide metal plate 700 is provided with guide holes 702 at a pitch Lp. The lid member 20 is formed at the same pitch as the pitch of the guide holes 702.
 成形された複数の蓋部材20は、蓋用金属板700の支持部704に支持されている。また、ガイド穴702と蓋部材20との位置関係は、予め定められている。このため、搬送中の蓋用金属板700のガイド穴702の搬送方向における位置を管理することで、蓋部材20の位置も管理できる。 The formed plurality of lid members 20 are supported by the support portion 704 of the lid metal plate 700. The positional relationship between the guide hole 702 and the lid member 20 is determined in advance. For this reason, the position of the lid member 20 can also be managed by managing the position of the guide hole 702 of the lid metal plate 700 being conveyed in the conveyance direction.
 上記では、蓋部材の成形が、可溶体30の固定後に行うこととしたが、これに限定されない。例えば、蓋部材の成形が、ステップS104、S106の工程と並行して行われてもよい。 In the above description, the lid member is formed after the fusible body 30 is fixed. However, the present invention is not limited to this. For example, the lid member may be molded in parallel with the steps S104 and S106.
  (ヒューズ組立体の作製:S110)
 図21は、ケース組立体650のケース部材10に蓋部材20を接合したヒューズ組立体800の縦断面図を示す。図22は、ヒューズ組立体850がケース用金属板600及び蓋用金属板700に支持されている状態を示す図である。
(Fuse assembly production: S110)
FIG. 21 is a longitudinal sectional view of a fuse assembly 800 in which the lid member 20 is joined to the case member 10 of the case assembly 650. FIG. 22 is a view showing a state where the fuse assembly 850 is supported by the case metal plate 600 and the lid metal plate 700.
 ステップS110においては、ケース用金属板600に支持されたケース組立体650のケース部材10と、蓋用金属板700に支持された蓋部材20とを組み合わせて、ヒューズ組立体800を作製する。具体的には、ケース組立体650のケース部材10に対して蓋部材20を被せるようにケース用金属板600及び蓋用金属板700を搬送して、ケース部材10に蓋部材20を組み付ける。この際、ケース用金属板600のガイド穴602と、蓋用金属板700のガイド穴702とを用いて、ケース用金属板600及び蓋用金属板700の搬送を制御する。例えば、ガイド穴602とガイド穴702が一致するように、ケース用金属板600と蓋用金属板700を搬送する。 In step S110, the case assembly 10 of the case assembly 650 supported by the case metal plate 600 and the lid member 20 supported by the lid metal plate 700 are combined to produce the fuse assembly 800. Specifically, the case metal plate 600 and the cover metal plate 700 are conveyed so that the case member 10 of the case assembly 650 is covered with the case member 10, and the case member 10 is assembled with the case member 10. At this time, the conveyance of the case metal plate 600 and the lid metal plate 700 is controlled using the guide holes 602 of the case metal plate 600 and the guide holes 702 of the lid metal plate 700. For example, the case metal plate 600 and the lid metal plate 700 are conveyed so that the guide hole 602 and the guide hole 702 coincide with each other.
 また、ケース部材10と蓋部材20を組み合わせる際には、嵌合凸部14と嵌合凹部23とが嵌合する。これにより、ケース部材10に対して蓋部材20を所望の位置に組み付けやすくなる。 Further, when the case member 10 and the lid member 20 are combined, the fitting convex portion 14 and the fitting concave portion 23 are fitted. Thereby, it becomes easy to assemble the lid member 20 at a desired position with respect to the case member 10.
 ケース部材10に蓋部材20を組み付ける際には、ケース部材10と蓋部材20を接合する。具体的には、予めケース部材10のケース側接合面13にエポキシ系接着剤を塗布しておく。その後、蓋部材20をケース部材10に被せて、ケース部材10及び蓋部材20を加圧・加熱することで、ケース部材10のケース側接合面13と蓋部材20の蓋側接合面22とが接合する。これにより、内部の密閉空間6に可溶体30が密閉されたヒューズ組立体800を作製できる。 When the lid member 20 is assembled to the case member 10, the case member 10 and the lid member 20 are joined. Specifically, an epoxy-based adhesive is applied to the case-side joining surface 13 of the case member 10 in advance. Thereafter, the case member 10 is covered with the lid member 20 and the case member 10 and the lid member 20 are pressurized and heated, so that the case side joining surface 13 of the case member 10 and the lid side joining surface 22 of the lid member 20 are formed. Join. Thereby, the fuse assembly 800 in which the fusible body 30 is sealed in the internal sealed space 6 can be manufactured.
 なお、ケース側接合面13に加えて、ケース部材10の嵌合凸部14にもエポキシ系接着剤を予め塗布している。そして、ケース部材10に蓋部材20を組み付ける際に、嵌合凸部14と嵌合凹部23が接着剤で接合される。これにより、ケース部材10と蓋部材20の接合強度を高めることができる。 In addition to the case-side joining surface 13, an epoxy adhesive is applied in advance to the fitting convex portion 14 of the case member 10. When the lid member 20 is assembled to the case member 10, the fitting convex portion 14 and the fitting concave portion 23 are joined with an adhesive. Thereby, the joint strength between the case member 10 and the lid member 20 can be increased.
 前述したように、ケース組立体650がケース用金属板600の支持部604に支持されており、蓋部材20が蓋用金属板700の支持部704に支持されている。このため、ケース組立体650のケース部材10と蓋部材20を組み合わせたヒューズ組立体800も、図22に示すようにケース用金属板600及び蓋用金属板700に支持された状態となっている。なお、図22に示すように、支持部604及び支持部704は、搬送方向において離れて位置している。 As described above, the case assembly 650 is supported by the support portion 604 of the case metal plate 600, and the lid member 20 is supported by the support portion 704 of the lid metal plate 700. Therefore, the fuse assembly 800 obtained by combining the case member 10 and the lid member 20 of the case assembly 650 is also supported by the case metal plate 600 and the lid metal plate 700 as shown in FIG. . Note that, as illustrated in FIG. 22, the support portion 604 and the support portion 704 are located apart in the transport direction.
  (ケース用金属板の分離:S112)
 ステップS112においては、ヒューズ組立体800をケース用金属板600から分離する。これにより、分離後のヒューズ組立体800の端子40、50は、ケース用金属板600に対して絶縁状態となる。具体的には、ヒューズ組立体800を支持するケース用金属板600の支持部604を例えばカッターで切断して、ヒューズ組立体800をケース用金属板600から切り離す。前述したように支持部604及び支持部704が離れているので、例えば上下動するカッターによって支持部604のみを切断できる。この際、ヒューズ組立体800を支持する複数の支持部604を同時に切断する。
(Separation of metal plate for case: S112)
In step S112, fuse assembly 800 is separated from case metal plate 600. As a result, the terminals 40 and 50 of the separated fuse assembly 800 are insulated from the case metal plate 600. Specifically, the support portion 604 of the case metal plate 600 that supports the fuse assembly 800 is cut by, for example, a cutter, and the fuse assembly 800 is separated from the case metal plate 600. As described above, since the support portion 604 and the support portion 704 are separated from each other, for example, only the support portion 604 can be cut by a vertically moving cutter. At this time, the plurality of support portions 604 that support the fuse assembly 800 are simultaneously cut.
  (端子間の抵抗値の測定:S114)
 ステップS114においては、ケース用金属板600から分離したヒューズ組立体800の端子40と端子50の間の抵抗値を測定する。なお、ヒューズ組立体800は蓋用金属板700に支持されているが、端子40、50は、蓋用金属板700とは電気的に接続されていないので、蓋用金属板700に対して絶縁状態である。
(Measurement of resistance value between terminals: S114)
In step S114, the resistance value between terminal 40 and terminal 50 of fuse assembly 800 separated from case metal plate 600 is measured. Although the fuse assembly 800 is supported by the lid metal plate 700, the terminals 40 and 50 are not electrically connected to the lid metal plate 700, so that they are insulated from the lid metal plate 700. State.
  (蓋用金属板からの分離の要否判定:S116)
 ステップS116においては、端子40、50間の抵抗値の測定結果に基づいて、ヒューズ組立体800を蓋用金属板700から分離するか否かを判定する。具体的には、端子40、50間の抵抗値が所定範囲内である場合には、ヒューズ組立体800が良品であると判断し、抵抗値を測定したヒューズ組立体800を蓋用金属板700から分離させる。すなわち、蓋用金属板700の支持部704にヒューズ組立体800の蓋部材20が支持されているので、蓋部材20を蓋用金属板700から分離させる。
(Necessity determination of separation from metal plate for lid: S116)
In step S116, it is determined whether or not the fuse assembly 800 is separated from the lid metal plate 700 based on the measurement result of the resistance value between the terminals 40 and 50. Specifically, when the resistance value between the terminals 40 and 50 is within a predetermined range, it is determined that the fuse assembly 800 is a non-defective product, and the fuse assembly 800 whose resistance value is measured is used as the metal plate 700 for the lid. Separate from. That is, since the lid member 20 of the fuse assembly 800 is supported by the support portion 704 of the lid metal plate 700, the lid member 20 is separated from the lid metal plate 700.
 ここで、蓋部材20の蓋用金属板700からの分離方法について、図23を参照しながら説明する。
 図23は、図22のF-F断面図である。図23に示すように、蓋部材20が蓋用金属板700の支持部704に支持されている状態では、支持部704の先端704aが、蓋部材20の側面に設けられた側面凹部26と嵌合している。ここで、支持部704の先端704aと側面凹部26との嵌合長さは小さい(例えば、0.1mm)ため、例えば作業者が支持部704の先端704a側を手で押すことで、先端704aと側面凹部26の嵌合状態が解除される。これにより、カッターで切断しなくても、蓋部材20を蓋用金属板700から分離できる。
Here, a method of separating the lid member 20 from the lid metal plate 700 will be described with reference to FIG.
23 is a cross-sectional view taken along line FF in FIG. As shown in FIG. 23, when the lid member 20 is supported by the support portion 704 of the lid metal plate 700, the tip 704a of the support portion 704 is fitted with the side recess 26 provided on the side surface of the lid member 20. Match. Here, since the fitting length between the tip 704a of the support portion 704 and the side recess 26 is small (for example, 0.1 mm), for example, when the operator pushes the tip 704a side of the support portion 704 by hand, the tip 704a And the fitting state of the side recess 26 is released. Thereby, even if it does not cut | disconnect with a cutter, the cover member 20 can be isolate | separated from the metal plate 700 for lid | covers.
 一方で、測定した抵抗値が所定範囲外である場合には、ヒューズ組立体800が不良品であると判定し、測定値を測定したヒューズ組立体800を蓋用金属板700から分離させない。これにより、良品と判断されたヒューズ組立体800のみが蓋用金属板700から分離されるので、不良品と良品が混在することを防止できる。
 なお、不良品と判断されたヒューズ組立体800を蓋用金属板700に支持させた状態を維持させることとしたが、これに限定されず、例えば別の工程で、不良品と判断されたヒューズ組立体800を蓋用金属板700から分離させてもよい。
On the other hand, if the measured resistance value is outside the predetermined range, it is determined that the fuse assembly 800 is defective and the fuse assembly 800 whose measured value is measured is not separated from the lid metal plate 700. As a result, only the fuse assembly 800 that has been determined to be non-defective is separated from the lid metal plate 700, so that it is possible to prevent a defective product from being mixed with a non-defective product.
Note that the state in which the fuse assembly 800 determined to be defective is supported by the lid metal plate 700 is maintained. However, the present invention is not limited to this. For example, the fuse determined to be defective in another process is used. The assembly 800 may be separated from the lid metal plate 700.
 上記では、ヒューズ組立体800のケース用金属板600からの分離と蓋用金属板700からの分離とを、それぞれ別々の工程で行うこととしたが、これに限定されない。例えば、ケース用金属板600からの分離と蓋用金属板700からの分離とを、一つの工程で一緒に行ってもよい。 In the above description, the fuse assembly 800 is separated from the case metal plate 600 and the lid metal plate 700 in separate steps, but the present invention is not limited to this. For example, the separation from the case metal plate 600 and the separation from the lid metal plate 700 may be performed together in one step.
 また、ヒューズ組立体800を蓋用金属板700から分離した後に、ケース用金属板600から分離してもよい。かかる場合には、端子40、50間の抵抗値の測定は、ケース用金属板600からヒューズ組立体800を分離した後に行われる。
 さらに、上記では、支持部704の先端704a側を手で押すことで、ヒューズ組立体800を蓋用金属板700から分離させることとしたが、これに限定されない。例えば、先端704aと側面凹部26との嵌合長さが大きい場合には、先端704a側をカッターで切断して分離してもよい。
Alternatively, the fuse assembly 800 may be separated from the case metal plate 600 after being separated from the lid metal plate 700. In such a case, the resistance value between the terminals 40 and 50 is measured after the fuse assembly 800 is separated from the case metal plate 600.
Furthermore, in the above description, the fuse assembly 800 is separated from the lid metal plate 700 by manually pushing the tip 704a side of the support portion 704. However, the present invention is not limited to this. For example, when the fitting length between the tip 704a and the side recess 26 is large, the tip 704a side may be cut and separated by a cutter.
 (2-4.本製造方法による効果)
 上述したチップヒューズ1の製造方法によれば、ケース部材10の上方が開放された状態でケース部材10に可溶体30を固定した後に、可溶体30と端子40、50を電気的に接続している。そして、ケース部材10と蓋部材20とを接合して可溶体30を密閉する密閉空間6が形成されたチップヒューズ1を製造している。
(2-4. Effects of this manufacturing method)
According to the manufacturing method of the chip fuse 1 described above, the fusible body 30 and the terminals 40 and 50 are electrically connected after fixing the fusible body 30 to the case member 10 with the upper portion of the case member 10 opened. Yes. And the chip fuse 1 in which the sealed space 6 in which the case member 10 and the lid member 20 are joined to seal the fusible body 30 is formed is manufactured.
 かかる場合には、ケース部材10の上方が開放された状態で可溶体30をケース部材10に配置させるので、可溶体30を固定する作業性が大幅に向上する。また、可溶体30を固定する作業と、可溶体30と端子40、50を電気的に接続する作業とを分離することで、2つの作業を同時に行う場合に比べて、各作業の作業性が大幅に向上する。また、インサート成形によりケース部材10と端子40、50を一体化しているので、ケース部材10と端子40、50を接着剤で固定する場合に比べて、長期間使用しても密閉性の低下を抑制できる。さらに、ケース用金属板600に複数のケース部材10を連続して形成すると共に、蓋用金属板700に複数の蓋部材20を連続して形成した後に、ケース部材10と蓋部材20を組み合わせることで、組立性や生産性が向上する。 In such a case, the fusible body 30 is disposed on the case member 10 with the upper portion of the case member 10 open, so that the workability of fixing the fusible body 30 is greatly improved. Also, by separating the work for fixing the fusible body 30 and the work for electrically connecting the fusible body 30 and the terminals 40, 50, the workability of each work is improved compared to the case where two works are performed simultaneously. Greatly improved. Moreover, since the case member 10 and the terminals 40 and 50 are integrated by insert molding, the sealing performance is deteriorated even when used for a long period of time compared to the case member 10 and the terminals 40 and 50 fixed with an adhesive. Can be suppressed. Further, the case member 10 is continuously formed on the case metal plate 600, and the case member 10 and the lid member 20 are combined after the plurality of cover members 20 are continuously formed on the lid metal plate 700. As a result, assembly and productivity are improved.
 (2-5.変形例)
 上記では、筐体5が液晶ポリマーから成ることとしたが、これに限定されない。例えば、筐体5は他の熱可塑性樹脂から成ってもよい。また、筐体5が熱硬化性樹脂から成ってもよい。
(2-5. Modifications)
In the above description, the housing 5 is made of a liquid crystal polymer, but is not limited thereto. For example, the housing 5 may be made of another thermoplastic resin. Further, the housing 5 may be made of a thermosetting resin.
 上記では、ケース部材10と蓋部材20の接合をエポキシ系接着剤で行うこととしたが、これに限定されない。例えば、ケース部材10と蓋部材20の接合を他の接着剤で行ってもよい。また、接着剤による接合に代えて、加熱溶融接合や超音波接合によってケース部材10と蓋部材20を接合してもよい。 In the above description, the case member 10 and the lid member 20 are joined with the epoxy adhesive, but the present invention is not limited to this. For example, the case member 10 and the lid member 20 may be joined with another adhesive. Further, the case member 10 and the lid member 20 may be joined by heat melting joining or ultrasonic joining instead of joining by an adhesive.
 上記では、可溶体30と端子40、50が、メッキ層同士が溶接されることで接合されることとしたが、これに限定されない。例えば、可溶体30の母材であるニッケルと、端子40、50の母材である銅とを、溶融接合してもよい。 In the above, the fusible body 30 and the terminals 40 and 50 are joined by welding the plating layers, but the invention is not limited to this. For example, nickel which is the base material of the fusible body 30 and copper which is the base material of the terminals 40 and 50 may be melt-bonded.
 上記では、支え部411、511の幅W1が押さえ部412、512の幅W2よりも大きいこととしたが、これに限定されない。例えば、支え部411、511と押さえ部412、512の幅を同じ大きさにする一方で、押さえ部412、512の端面412a、512a側に切り欠きを設けてもよい。かかる場合には、切り欠きの部分で、長尺可溶体660を切断すればよい。 In the above description, the width W1 of the support portions 411 and 511 is larger than the width W2 of the holding portions 412 and 512. However, the present invention is not limited to this. For example, the support portions 411 and 511 and the pressing portions 412 and 512 may have the same width, while the end portions 412a and 512a of the pressing portions 412 and 512 may be provided with notches. In such a case, the long soluble body 660 may be cut at the notch.
 以上、本発明を実施の形態を用いて説明したが、本発明の技術的範囲は上記実施の形態に記載の範囲には限定されない。上記実施の形態に、多様な変更又は改良を加えることが可能であることが当業者に明らかである。そのような変更又は改良を加えた形態も本発明の技術的範囲に含まれ得ることが、特許請求の範囲の記載から明らかである。 As mentioned above, although this invention was demonstrated using embodiment, the technical scope of this invention is not limited to the range as described in the said embodiment. It will be apparent to those skilled in the art that various modifications or improvements can be added to the above embodiment. It is apparent from the scope of the claims that the embodiments added with such changes or improvements can be included in the technical scope of the present invention.
 1  チップヒューズ
 5  筐体
 6  密閉空間
 10  ケース部材
 13  ケース側接合面
 14  嵌合凸部
 15  位置決め溝部
 20  蓋部材
 22  蓋側接合面
 23  嵌合凹部
 30  可溶体
 40、50  端子
 41、51  挟持部
 42、52  貫通部
 43、53  端子部
 411、511  支え部
 412、512  押さえ部
 431、531  側面端子部
 432、532  底面端子部
 600  ケース用金属板
 650  ケース組立体
 700  蓋用金属板
 800  ヒューズ組立体
 
DESCRIPTION OF SYMBOLS 1 Chip fuse 5 Case 6 Sealed space 10 Case member 13 Case side joint surface 14 Fitting convex part 15 Positioning groove part 20 Lid member 22 Lid side joint surface 23 Fitting concave part 30 Soluble body 40, 50 Terminal 41, 51 Holding part 42 , 52 Through part 43, 53 Terminal part 411, 511 Support part 412, 512 Holding part 431, 531 Side terminal part 432, 532 Bottom terminal part 600 Metal plate for case 650 Case assembly 700 Metal plate for lid 800 Fuse assembly

Claims (18)

  1.  母材として絶縁性樹脂を含み、密閉空間を形成している筐体と、
     前記密閉空間に架空支持された状態で設けられ、母材としてニッケルを含む可溶体と、
     一部が前記筐体から露出するように前記筐体と一体構造となっており、前記可溶体の両端部と電気的に接続している一対の端子と、
     を備える、チップヒューズ。
    A housing containing an insulating resin as a base material and forming a sealed space;
    A fusible body that is provided in an aerial support state in the sealed space and contains nickel as a base material;
    A pair of terminals electrically connected to both ends of the fusible body; and a structure that is integral with the housing such that a portion is exposed from the housing;
    A chip fuse.
  2.  前記筐体は、
     前記端子と一体構造になっているケース部材と、
     対向する前記ケース部材と接合しており、前記ケース部材とで前記密閉空間を形成している蓋部材と、を有する、
     請求項1に記載のチップヒューズ。
    The housing is
    A case member integrated with the terminal;
    A lid member that is joined to the facing case member and forms the sealed space with the case member;
    The chip fuse according to claim 1.
  3.  前記ケース部材は、外縁に沿って環状に形成されたケース側接合面を有し、
     前記蓋部材は、外縁に沿って環状に形成され前記ケース側接合面と接合している蓋側接合面を有する、
     請求項2に記載のチップヒューズ。
    The case member has a case-side joint surface formed in an annular shape along the outer edge,
    The lid member has a lid side joining surface that is formed in an annular shape along an outer edge and joined to the case side joining surface,
    The chip fuse according to claim 2.
  4.  前記ケース部材及び前記蓋部材の一方は、凸部を有し、
     前記ケース部材及び前記蓋部材の他方は、前記凸部と嵌合している凹部を有し、
     前記凸部の頂面と前記凹部の底面とが、接合している、
     請求項2又は3に記載のチップヒューズ。
    One of the case member and the lid member has a convex portion,
    The other of the case member and the lid member has a concave portion that is fitted to the convex portion,
    The top surface of the convex part and the bottom surface of the concave part are joined,
    The chip fuse according to claim 2 or 3.
  5.  前記ケース部材及び前記蓋部材は、同一の熱可塑性樹脂から成る、
     請求項2から4のいずれか1項に記載のチップヒューズ。
    The case member and the lid member are made of the same thermoplastic resin.
    The chip fuse according to any one of claims 2 to 4.
  6.  前記端子は、前記密閉空間に設けられ前記可溶体の長手方向の端部を挟持する挟持部を有する、
     請求項2から5のいずれか1項に記載のチップヒューズ。
    The terminal has a sandwiching portion that is provided in the sealed space and sandwiches an end portion in the longitudinal direction of the fusible body.
    The chip fuse according to any one of claims 2 to 5.
  7.  前記挟持部は、
     前記可溶体の前記端部を支える支え部と、
     前記支え部に対向し、前記支え部に支えられた前記端部を押さえる押さえ部と、を有し、
     前記可溶体の長手方向において、前記支え部は、前記押さえ部よりも端側まで設けられている、
     請求項6に記載のチップヒューズ。
    The clamping part is
    A support for supporting the end of the fusible body;
    A pressing part that faces the support part and presses the end part supported by the support part,
    In the longitudinal direction of the fusible body, the support portion is provided to the end side of the pressing portion,
    The chip fuse according to claim 6.
  8.  前記支え部の上面は、前記ケース部材の上面と同じ高さに位置している、
     請求項6又は7に記載のチップヒューズ。
    The upper surface of the support portion is located at the same height as the upper surface of the case member.
    The chip fuse according to claim 6 or 7.
  9.  前記筐体は、前記密閉空間において前記可溶体が溶断される溶断空間と前記挟持部との間に形成され、前記可溶体が通過している溝部を有する、
     請求項6から8のいずれか1項に記載のチップヒューズ。
    The housing is formed between a fusing space where the fusible body is melted in the sealed space and the sandwiching portion, and has a groove part through which the fusible body passes.
    The chip fuse according to any one of claims 6 to 8.
  10.  前記端子は、
     前記挟持部と一体構造の状態で外部に露出している端子部と、
     前記筐体の壁を貫通し、前記挟持部と前記端子部を接続している貫通部と、を更に有する、
     請求項6から9のいずれか1項に記載のチップヒューズ。
    The terminal is
    A terminal portion exposed to the outside in a state of being integrated with the sandwiching portion;
    A penetrating portion that penetrates the wall of the housing and connects the pinching portion and the terminal portion;
    The chip fuse according to any one of claims 6 to 9.
  11.  前記端子は、金属板から成り、
     前記貫通部は、前記金属板を複数回折り曲げた形状となっている、
     請求項10に記載のチップヒューズ。
    The terminal is made of a metal plate,
    The penetrating portion has a shape obtained by bending the metal plate a plurality of times.
    The chip fuse according to claim 10.
  12.  前記端子部は、前記ケース部材の側面に位置する側面端子部を有し、
     前記側面端子部の外面は、前記ケース部材の側面と同じ位置に位置している、
     請求項10又は11に記載のチップヒューズ。
    The terminal portion has a side terminal portion located on a side surface of the case member,
    The outer surface of the side terminal portion is located at the same position as the side surface of the case member.
    The chip fuse according to claim 10 or 11.
  13.  前記端子部は、前記ケース部材の底面に位置する底面端子部を有し、
     前記底面端子部の底面は、前記ケース部材に対して前記底面端子部の厚さよりも小さく突出している、
     請求項10から12のいずれか1項に記載のチップヒューズ。
    The terminal portion has a bottom terminal portion located on the bottom surface of the case member,
    The bottom surface of the bottom terminal portion protrudes smaller than the thickness of the bottom terminal portion with respect to the case member.
    The chip fuse according to any one of claims 10 to 12.
  14.  前記可溶体は、金属メッキが施されている可溶体メッキ層を有し、
     前記端子は、金属板の表面に金属メッキが施されている端子メッキ層を有し、
     前記端子メッキ層は、前記可溶体メッキ層と接合して電気的に接続している、
     請求項1から13のいずれか1項に記載のチップヒューズ。
    The fusible body has a fusible body plating layer to which metal plating is applied,
    The terminal has a terminal plating layer in which metal plating is applied to the surface of the metal plate,
    The terminal plating layer is joined and electrically connected to the fusible plating layer.
    The chip fuse according to claim 1.
  15.  母材として絶縁性樹脂を含むケース部材と金属製の一対の端子とを一体成形して、前記端子の一部が前記ケース部材から露出しているケース組立体を作製するステップと、
     少なくともニッケルを含む可溶体を前記ケース組立体の前記ケース部材に配置して、前記端子に前記可溶体を固定するステップと、
     母材として絶縁性樹脂を含む蓋部材と前記ケース組立体の前記ケース部材とを接合して、密閉空間に前記可溶体を密閉するステップと、
     を有する、チップヒューズの製造方法。
    Forming a case member including an insulating resin as a base material and a pair of metal terminals to produce a case assembly in which a part of the terminals are exposed from the case member;
    Arranging a fusible body containing at least nickel on the case member of the case assembly, and fixing the fusible body to the terminal;
    Bonding the lid member containing an insulating resin as a base material and the case member of the case assembly, and sealing the fusible body in a sealed space;
    A method of manufacturing a chip fuse.
  16.  前記ケース組立体を作製するステップは、
     長尺状の第1金属板を加工して、前記第1金属板に所定間隔で複数の前記端子を成形するステップと、
     前記複数の端子の各々と一体構造となるように前記第1金属板に対して絶縁性樹脂を射出成形して、前記第1金属板に前記所定間隔で支持される複数の前記ケース部材を成形するステップと、を含む、
     請求項15に記載のチップヒューズの製造方法。
    The step of producing the case assembly includes:
    Processing a long first metal plate, and forming a plurality of the terminals at a predetermined interval on the first metal plate;
    Insulating resin is injection-molded with respect to the first metal plate so as to have an integral structure with each of the plurality of terminals, and the plurality of case members supported by the first metal plate at the predetermined interval are formed. Including the steps of:
    The method for manufacturing a chip fuse according to claim 15.
  17.  長尺状の第2金属板に対して絶縁性樹脂を射出成形して、前記第2金属板に前記所定間隔で支持される複数の前記蓋部材を成形するステップと、
     前記第1金属板に支持された前記ケース組立体の前記ケース部材と、前記第2金属板に支持された前記蓋部材とを接合して、前記第1金属板及び前記第2金属板に支持されたヒューズ組立体を作製するステップと、を更に有する、
     請求項16に記載のチップヒューズの製造方法。
    Injecting an insulating resin to the long second metal plate, and molding the plurality of lid members supported by the second metal plate at the predetermined interval;
    The case member of the case assembly supported by the first metal plate and the lid member supported by the second metal plate are joined and supported by the first metal plate and the second metal plate. Further comprising the steps of:
    The method for manufacturing a chip fuse according to claim 16.
  18.  前記ヒューズ組立体を前記第1金属板から分離するステップと、
     前記第1金属板から分離した前記ヒューズ組立体の前記端子間の抵抗値を測定するステップと、
     前記抵抗値の測定結果に基づいて、前記ヒューズ組立体を前記第2金属板から分離するか否かを判定するステップと、
     を更に有する、
     請求項17に記載のチップヒューズの製造方法。
     
    Separating the fuse assembly from the first metal plate;
    Measuring a resistance value between the terminals of the fuse assembly separated from the first metal plate;
    Determining whether to separate the fuse assembly from the second metal plate based on the measurement result of the resistance value;
    Further having
    The method for manufacturing a chip fuse according to claim 17.
PCT/JP2016/052241 2016-01-27 2016-01-27 Chip fuse and chip fuse production method WO2017130306A1 (en)

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