JP4073821B2 - Communication device package and manufacturing method thereof - Google Patents

Communication device package and manufacturing method thereof Download PDF

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Publication number
JP4073821B2
JP4073821B2 JP2003127887A JP2003127887A JP4073821B2 JP 4073821 B2 JP4073821 B2 JP 4073821B2 JP 2003127887 A JP2003127887 A JP 2003127887A JP 2003127887 A JP2003127887 A JP 2003127887A JP 4073821 B2 JP4073821 B2 JP 4073821B2
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communication device
frame member
base member
device package
conductive terminal
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JP2004335638A (en
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浩信 伊藤
豊 巻島
英晴 小野寺
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Seiko Instruments Inc
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Seiko Instruments Inc
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

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  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)

Description

【０００１】
【発明が属する技術分野】
本発明は半導体素子や水晶振動子、弾性表面波素子、磁気素子、キャパシタ等の通信用デバイスを収納するための通信用デバイスパッケージおよびその製造方法に関する。
【０００２】
【従来の技術】
従来、半導体素子や水晶振動子、弾性表面波素子、等を収納するための通信用デバイスパッケージは、一般にセラミックスがベース部材として用いられていた。図６に従来の通信デバイスパッケージを説明する断面図を示す。通信デバイスを収納するための上面側が開口した凹部６１ａを有するセラミックスベース部材６１と、セラミックスベース部材６１上端面に積層されるセラミックス枠部材６２ｂと、セラミックス枠部材６２ｂにロー付けされる金属枠部材６２ａと、金属枠部材６２ａに溶接されるカバー部材６３で構成されている。また、通信用デバイス６７は、端子６５ａに配置固定されているとともに、配線６４を介して６５ｂと導通する。ここで、端子６５ａ、６５ｂに用いられる導電材料はタングステンＷ、モリブデンＭｏなどの高融点の金属が用いられている。また、セラミックス枠部材６２ｂと金属枠部材６２ａとをロー付けするため、セラミックス枠部材６２ｂはニッケルＮｉ、金Ａｕでメタライズされている。また、金属枠部材６２ａとしては、セラミックスベース部材６１と熱膨張をあわせるため、低熱膨張の金属が用いられる。また、金属枠部材６２ａと溶接されるカバー部材６３に熱膨張の大きい金属材料を用いるとセラミックスベース部材６１のクラックなどの不具合が生じるため、低熱膨張の金属材料のコバールが一般的に用いられている。これら構成の通信用デバイスパッケージは、セラミックスベース部材６１とセラミックス枠部材６２ｂとは２０００℃に近い温度での積層焼結が必要であり、セラミックス枠部材６２ｂと金属枠部材６２ａとは１０００℃に近い温度でのロー付けが必要である。このような高温で各部材を接合し、金属枠部材６２ａとカバー部材６３とを溶接することで気密封止がなされていた。
【０００３】
【特許文献】
特開平１１−６７９５０
【０００４】
【発明が解決しようとする課題】
しかしながら、従来の構造および製造方法において、ベース部材に配置される通信用デバイスに通電するための端子は、セラミックスの成形、導電性金属の印刷の繰り返しと焼成のプロセスが必要であるため、加工費、設備費が高価である。また、セラミックスのグリーンシートに端子を形成する導電性金属（Ｗ、Ｍｏなど高融点の金属）を高精度に印刷するためには治具費も高価となる。また、金属枠部材はセラミックスとロー付けをするため、熱膨張率差の少ない金属であることが望ましい。また、カバー部材にコバールを用いることが一般におこなわれているが、コバールは磁性をもつため、通信用デバイスパッケージに磁気素子を内装する際にはコバールの枠部材からの距離を離す必要があり、パッケージサイズを小型に出来ない弊害が生じる。また、ロー付けする際にセラミックス枠部材と金属枠部材にはＡｕめっきが必要となるため、材料費も高価となる。また、キャパシタを内装する場合、端子や金属枠部材、カバー部材には電解液と反応しない金属材料を用いる必要があるが、従来の通信用デバイスパッケージの構成では、Ｗ、Ｍｏ、コバール以外の金属材料を選択すると、熱膨張差が大きい不具合が生じ、充分な気密性が確保できない課題を有していた。
【０００５】
したがって、セラミックスをベース部材とする通信用デバイスパッケージは、加工費、設備費、治具費、材料費ともに高価なものとなっていた。また、磁気素子を内装する場合には、パッケージの小型化を困難にしていた。また、キャパシタを内装する場合には、充分な気密性を確保できなかった。
【０００６】
本発明の目的は、安価で気密性が高い通信用デバイスパッケージおよびその製造方法を提供することにある。
【０００７】
【課題を解決するための手段】
本発明の通信用デバイスパッケージは、凹部を有する箱状に形成された樹脂材料からなるベース部材と、ベース部材の凹部の内側から外側に貫通する導電性端子と、ベース部材と接合された金属材料からなる枠部材と、枠部材と重なる金属材料からなるカバー部材とを有することを特徴とする。
【０００８】
すなわち、ベース部材に樹脂材料を用いることでベース部材の成形を容易とし、金属材用の導電性端子と枠部材を型内で組み立てることを可能とした。ここで、予めプレス、切削などの機械加工をした導電性端子と枠部材を型内に配置した後に樹脂材料を注入する方法で簡便に、いわゆるインサート成形することが含まれる。また、導電性端子は、ステンレス、鉄合金、銅、銅合金、アルミニウムなどの金属材料が用いられる。また、枠部材およびカバー部材は、ステンレス、鉄合金、銅、銅合金、アルミニウムなどの金属材料が用いられる。従来の通信用デバイスパッケージでは導電性端子をタングステン粉末に有機溶剤を混合して作製した金属ペーストをセラミックスグリーンシートに印刷した後に２０００℃に近い高温で焼結して形成していたのに対し、導電性端子をプレス成形することで安価に製作することが可能となる。
【０００９】
また本発明の通信デバイスパッケージは、前記ベース部材が開口する凹部の上端面から前記枠部材１２の全周が突出し、ベース部材の底部から枠部材のすくなくとも一部が突出することを特徴とする。
【００１０】
ここで、ベース部材の底部から枠部材の全周を突出させることも可能であるが、ベース部材から外部に導出される導電性端子との干渉を回避するため、枠部材の所定箇所を切り取り、ベース部材の底部から枠部材の一部を突出される構造が含まれる。
【００１１】
すなわち、樹脂材料のベース部材は枠部材によっても剛性が高められ、ベース部材の側壁の薄肉化が可能となり、小型の通信用デバイスパッケージが構成できる。また、枠部材とカバー部材との接合にかかる荷重に対しては、ベース部材の底部から突出させた枠部材を保持することで、枠部材とカバー部材に充分な接合荷重を掛けることができるため、樹脂材料のベース部材の変形を防ぐことができる。
【００１２】
また本発明の通信用デバイスパッケージは、前記ベース部材がエポキシ系、ポリイミド系、ポリフェニレンサルファイド系、ポリエステル系、ポリアミド系、ポリエーテル系の何れかからなる材料で構成されていることを特徴とする。
すなわち、これらの樹脂を用いることで、導電性端子に通信デバイスからの配線をワイヤーボンド、はんだ接合、抵抗溶接、導電接着剤の加熱接着、等を可能とする剛性と耐熱性を有し、通信デバイスパッケージと実装ボードとの接合の際の加熱においても充分な耐熱性が確保できる。
【００１３】
また本発明の通信用デバイスパッケージは、前記カバー部材と前記枠部材とが溶接されていることを特徴とする。
【００１４】
すなわち、また、ベース部材と金属材料からなる枠部材とを接合することで、カバー部材は気密性良く枠部材と溶接することができる。
【００１５】
また本発明の通信用デバイスパッケージの製造方法は、金属材料からなる導電性端子と枠部材とをベース部材成形型内に配置する工程と、ベース部材成形型内に樹脂材料を注入して凹部を有する箱状にベース部材を成形するとともに導電性端子と枠部材とを組み立てる工程と、通信用デバイスをベース部材に配置する工程と、枠部材とカバー部材とを重ね合わせ、加熱手段を用いて枠部材とカバー部材とを溶接する工程とを有することを特徴とする。
【００１６】
ここで、予めプレス、切削などの機械加工をした導電性端子と枠部材を型内に配置した後に樹脂材料を注入する方法でベース部材と導電性端子、および、ベース部材と枠部材とを接合し、ベース部材１１が硬化した際には充分な封止がなされる。また、導電性端子は、ステンレス、鉄合金、銅、銅合金、アルミニウムなどの金属材料が用いられる。また、枠部材およびカバー部材は、ステンレス、鉄合金、銅、銅合金、アルミニウムなどの金属材料が用いられる。また、加熱手段としては、ＹＡＧレーザの基本波長、第２高調波、第３高調波や、半導体レーザなどの光吸熱を用いる、圧電振動子で発振される超音波振動で各々の部材の摩擦熱を用いる、各々の部材に通電する抵抗加熱、カバー部材に通電して加熱する、等が含まれる。
【００１７】
すなわち、導電性端子と枠部材とをベース部材成形型内に配置し、いわゆるインサート成形することで、枠部材１２と導電性端子１５とベース部材１１は簡便に組み立てられるとともに、パッケージとしての気密性も充分に確保される。
【００１８】
従来の通信用デバイスパッケージでは導電性端子としてタングステン粉末に有機溶剤を混合して作製した金属ペーストをセラミックスグリーンシートに印刷した後に２０００℃に近い高温での焼結を必要としていたこと、セラミックスベース部材と枠部材とのロー付けに１０００℃に近い高温でのロー付けを必要としていたことに比べ、低温で安価にパッケージを作製することが可能となる。また、通信用デバイスをベース部材内に配置固定した後に加熱手段を用いて枠部材とカバー部材とを溶接することで気密性の高い通信用デバイスパッケージが実現できる。また、ベース部材の成形が低温であるため、導電性端子と枠部材は低熱膨張の材料に限定されない。したがって、加工費、設備費、治具費、材料費ともに安価で通信用デバイスパッケージを製作することが可能となる。
【００１９】
また本発明の通信用デバイスパッケージの製造方法は、前記導電性端子もしくは前記枠部材の少なくとも一方が金属箔に複数個連続して成形され、金属箔のフレームと該導電性端子もしくは該枠部材の一部がブリッジを有し、枠部材とカバー部材とを重ね合わせ、加熱手段を用いて枠部材とカバー部材とを溶接する工程の後に、金属箔のフレームからブリッジを切り離すことを特徴とする。
【００２０】
ここで、導電性端子もしくは枠部材が金属箔に複数個連続して成形される構成とする、いわゆるフープ成形が含まれる。
【００２１】
すなわち、ベース部材の成形後の通信デバイスを配置固定する工程、カバー部材と枠部材との溶接工程まで、フープで組み立てることによって、フープのフレームに設けたガイド穴を使うことができるため、小型の通信デバイスパッケージの位置決めを容易にできる。
【００２２】
【発明の実施の形態】
図１に本発明の通信用デバイスパッケージの第１の実施形態の構成を示す。また、図２に本発明の通信用デバイスパッケージの第１の実施形態の断面図を示す。
【００２３】
本発明の通信用デバイスパッケージは、通信用デバイス１７を収納するための樹脂材料から成るベース部材１１と、ベース部材１１に接合され、金属材料から成る枠部材１２と、枠部材１２に重ね合わせて溶接される金属材料から成るカバー部材１３で構成される。ベース部材１１は通信用デバイス１７を収納するための上面側が開口した凹部１１ａが設けられ、凹部１１ａの上端面から全周が突出する枠部材１２がベース部材１１と接合される。また、ベース部材１１内に配置される通信デバイス１７とベース部材１１外部との導通をとるための導電性端子１５は、ベース部材１１の凹部１１ａの底面に露出し、通信用デバイス１７を配置固定する導電性端子１５ａと通信用デバイス１７と配線１４を介して導通する導電性端子１５ｂを構成し、ベース部材１１の凹部１１ａ内から側壁を貫通して外部に導出した。導電性端子１５ａと１５ｂはベース部材１１の側壁と充分に接合され、これら接合部からの外気、湿気の進入はない。ここで、ベース部材１１の材質としては、絶縁性の樹脂であれば適用できるが、エポキシ系、ポリイミド系の耐熱性を有する熱硬化性樹脂や、ポリフェニレンサルファイド系、ポリエステル系、ポリアミド系、ポリエーテル系の熱可塑性樹脂が、剛性、耐熱性の面から適している。ここで、ポリスチレン系としてはシンジオタクチックポリスチレン、ポリフェニレンサルファイド系としてはリニア型および架橋型ポリフェニレンサルファイド、ポリエステル系としては液晶ポリマーの呼称の全芳香族ポリエステル、ポリアミド系としてはナイロン、ポリエーテル系としてはポリエーテルエーテルケトン、ポリエーテルサルホン、ポリエーテルイミド、などが含まれる。また、導電性端子１５の材質としては、ステンレス、鉄合金、銅、銅合金、アルミニウムなどの金属材料が用いられる。また、表面処理として、ニッケル、金、銅、錫などを施してもよい。また、枠部材１２およびカバー部材１３の材質としては、ステンレス、鉄合金、銅、銅合金、アルミニウムなどの金属材料が用いられる。
【００２４】
本実施形態では、ベース部材１１はエポキシを、導電性端子１５は銅を、枠部材１２とカバー部材１３はステンレスを用いた。
【００２５】
導電性端子１５と枠部材１２は金属箔で連続的に形成する、いわゆるフープ成形を適用し、ベース部材１１の成形型内に配置し、型内に樹脂を注入する、いわゆるインサート成形によりベース部材１１に一体的に固定されている。具体的には、送りガイド穴を有する銅箔にプレス機で導電性端子１５を成形したフープと、送りガイド穴を有するステンレス箔にプレス機で枠部材１２を成形したフープとを用意した。導電性端子１５は送りガイド穴があるフレームと１体でベース部材１１の成形型内に配置し、枠部材１２は送り穴ガイドがあるフレームからインサート成形型内に配置する直前で切断してベース部材１１の成形型内に配置し、エポキシをインサート成形して複数個のベース部材１１を連続して作製した。この後、送りガイド穴があるフレームと導電性端子１５を切り離した。これらの手段で構成したベース部材１１内に通信用デバイス１７を収納した。通信用デバイス１７を導電性接着剤で導電性端子１５ａに配置固定した後、ワイヤーボンドを用いて通信用デバイス１７と導電性端子１５ｂとを配線１４で接続した。この時点で、通信用デバイス１７の特性を測定したうえで、枠部材１２と予めステンレス箔からプレス成形で切り離したカバー部材１３とを重ね合わせて基本波長のＹＡＧレーザを用いてシーム溶接し、通信用デバイスパッケージを作製した。
【００２６】
通信用デバイスパッケージの気密性を評価するため、フッ素系液体に浸漬してリークテストをおこなったところ、１０−５atm・cc/sec以上の気密性であった。また、カバー部材１３の溶接前と溶接後において、通信用デバイス１７の特性に変化はなかった。
【００２７】
また、通信用デバイス１７として磁気素子を内装する場合、ベース部材１１に用いたエポキシ、導電性端子１５の銅、枠部材１２とカバー部材１３のステンレスは磁性を持たないため、磁気素子の駆動に障害は生じなかった。
【００２８】
また、通信用デバイス１７としてキャパシタを内装する場合、バース部材１１にエポキシ、導電性端子１５と枠部材１２、カバー部材にステンレスを用いたところ、電解液に反応することなく、充分な封止性が確保できた。
【００２９】
図３に本発明の通信用デバイスパッケージの第２の実施形態の構成を示す。図３の３１０は通信用デバイスパッケージの側面図、３２０は、３１０に記したＡ−Ａ'位置で切り取った断面図を表しており、ベース部材３１が開口する凹部３１ａの上端面から枠部材３２の全周が突出し、ベース部材３１の底部３１ｂから枠部材３２の少なくとも一部が突出する構造である。また、通信用デバイス３７が配置固定される導電性端子３５ａと通信用デバイス３７から配線３４で接続される導電性端子３５ｂとをベース部材３１から導出するため、枠部材３２は導電性端子３５ａ、３５ｂとの干渉を回避する窓３２ａ、３２ｂを有する。窓３２ａはベース部材３１内部にあるため、側面図３１０では破線で示した。窓３２ｂと導電性端子３５ｂは接することなく、ベース部材３１の樹脂材料で絶縁性が確保できていることを断面図３２０で示した。
【００３０】
本実施形態では、ベース部材３１はエポキシを、導電性端子３５ａ、３５ｂは銅を、枠部材３２とカバー部材３３はステンレスを用いた。第１の実施形態と同様に導電性端子３５ａ、３５ｂおよび枠部材３２をプレス成形し、ベース部材３１の成形型内に配置してベース部材３１をインサート成形した。
【００３１】
これらの手段で作製したベース部材３１内に通信用デバイス３７を収納した。通信用デバイス３７を導電性接着剤で導電性端子３５ａに配置固定した後、ワイヤーボンドを用いて通信用デバイス３７と導電性端子３５ｂとを配線３４で接続した。この時点で、通信用デバイス３７の特性を測定したうえで、枠部材３２と予めステンレス箔からプレス成形で切り離したカバー部材３３とを重ね合わせて基本波長のＹＡＧレーザを用いてシーム溶接し、通信用デバイスパッケージを作製した。
【００３２】
また、別の溶接方法として、枠部材３２とカバー部材３３とを溶接電極で挟み込み抵抗加熱で接合した。この際、枠部材３２とカバー部材３３との間に隙間が無くなるまで荷重をかける必要があるが、ベース部材１１は変形することなく溶接することができた。
【００３３】
これらの方法で溶接した通信用デバイスパッケージの気密性を評価するため、フッ素系液体に浸漬してリークテストをおこなったところ、１０−５atm・cc/sec以上の気密性であった。また、カバー部材１３の溶接前と溶接後において、通信用デバイス１７の特性に変化はなかった。
【００３４】
図４に本発明の通信用デバイスパッケージの製造方法を説明するフロー図を示す。銅箔をプレス成形した導電性端子１５とステンレス箔をプレス成形した枠部材１２とをベース部材１１の成形型内に配置する（工程４０１）。次にベース部材１１の成形型内にエポキシ樹脂を注入して冷却硬化する（工程４０２）。次に通信用デバイス１７を導電性端子１５ａに導電性接着剤で固定するとともに、通信用デバイス１７と導電性端子１５ｂとを導通するため、ワイヤーボンダで配線１４を接続する（工程４０３）。その後、カバー部材１３と枠部材１２とを重ね合わせ、全周を基本波長のＹＡＧレーザで溶接する（工程４０４）。
【００３５】
カバー部材１３と枠部材１２とを溶接する方法としては、基本波長のＹＡＧレーザの他に、第二高調波、第三高調波のＹＡＧレーザ、半導体レーザ、などの光吸熱を用いる方法、カバー部材１３に超音波振動子を押し当てて枠部材１２との間を擦り合わせる摩擦熱を用いる方法、カバー部材１３もしくはカバー部材１３と枠部材１２に通電して加熱する抵抗加熱を用いる方法が用いられる。
【００３６】
この工程で作製した通信用デバイスパッケージの封止状態を確認するため、フッ素系液体に浸漬してリークテストをおこなったところ、１０−５atm・cc/sec以上の気密性であった。また、カバー部材１３の溶接前と溶接後において、通信用デバイス１７の特性に変化はなかった。このほか、ベース部材にポリフェニレンサルファイドを用いて導電性端子と枠部材をインサート成形したところ、導電性端子および枠部材とベース部材の封止性、および、基本波長のＹＡＧレーザで溶接した枠部材とカバー部材との封止性を確認できた。
【００３７】
図５に本発明の通信用デバイスパッケージの製造方法を説明する外観図を示す。
【００３８】
ここで、導電性端子５５ａ、５５ｂはフープにブリッジ５８ａ、５８ｂでつながっている。フープで連続した複数個の導電性端子５５ａ、５５ｂと枠部材５２をベース部材成形型内に配置し、ベース部材５１を成形して作製した。通信用デバイス５７は導電性端子５５ａに配置固定され、通信用デバイスと導電性端子５５ｂとはワイヤーボンド配線５４を施した。この後に図示しないカバー部材を枠部材５２に重ね合わせて溶接した。これらの工程を経て、ブリッジ５８ａ、５８ｂを切り離した。通信用デバイスの配置固定、および、カバー部材と枠部材５２との重ね合わせ、カバー部材の溶接は、すべてフープのフレームに設けたガイド穴５９にガイドピンを挿入して位置決めし、組み立てをおこなった。この結果、ベース部材５１に位置決め用のガイド穴を設ける必要がないこと、ベース部材５１の外形形状にばらつきがあった場合でも導電性端子５５ａ、５５ｂとフープのフレームに設けたガイド穴の位置が精度良く加工されているため、通信用デバイス５７と導電性端子５５ａの配置固定、および、通信用デバイス５７と導電性端子５５ｂとの配線５４が高精度に組み立てることができる。この方法は、通信デバイスや通信デバイスパッケージを小型化する際に有効であることが確認できた。
【００３９】
【発明の効果】
以上のように、樹脂材料からなり箱状に形成されたベース部材と、金属材料からなりベース部材の内部から外部に貫通固定される導電性端子と、金属材料からなりベース部材に固定される枠部材と、枠部材に溶接されるカバー部材で通信用デバイスパッケージ構成した。導電性端子と枠部材はベース部材の成形とともに組み立てられ、生産性が高められる。また、枠部材とカバー部材とを溶接することで内部への外気や湿度の侵入を防ぐことができ、高気密・高信頼性の通信用デバイスパッケージおよびその製造方法を得ることができた。
【図面の簡単な説明】
【図１】本発明の通信用デバイスパッケージの構成図である。
【図２】本発明の通信用デバイスパッケージの断面図である。
【図３】本発明の通信用デバイスパッケージの第２の実施形態の側面図および断面図である。
【図４】本発明の通信用デバイスパッケージの製造方法を説明するフロー図である。
【図５】本発明の通信用デバイスパッケージの製造方法を説明する外観図である。
【図６】従来の通信用デバイスパッケージの断面図である。
【符号の説明】
１１、３１、５１ ベース部材
１２、３２、５２ 枠部材
１３、３３、５３ カバー部材
１５、１５ａ、１５ｂ 導電性端子
３５、３５ａ、３５ｂ 導電性端子
５５ａ、５５ｂ 導電性端子
５８ａ、５８ｂ ブリッジ[0001]
[Technical field to which the invention belongs]
The present invention relates to a communication device package for housing communication devices such as a semiconductor element, a crystal resonator, a surface acoustic wave element, a magnetic element, and a capacitor, and a method for manufacturing the same.
[0002]
[Prior art]
Conventionally, ceramics are generally used as a base member in a communication device package for housing a semiconductor element, a crystal resonator, a surface acoustic wave element, and the like. FIG. 6 is a sectional view for explaining a conventional communication device package. A ceramic base member 61 having a recess 61a having an open upper surface for housing a communication device, a ceramic frame member 62b laminated on the upper end surface of the ceramic base member 61, and a metal frame member 62a brazed to the ceramic frame member 62b And a cover member 63 welded to the metal frame member 62a. Further, the communication device 67 is disposed and fixed to the terminal 65 a and is electrically connected to 65 b through the wiring 64. Here, a metal having a high melting point such as tungsten W or molybdenum Mo is used as the conductive material used for the terminals 65a and 65b. In order to braze the ceramic frame member 62b and the metal frame member 62a, the ceramic frame member 62b is metallized with nickel Ni and gold Au. Further, as the metal frame member 62a, a low thermal expansion metal is used in order to match thermal expansion with the ceramic base member 61. Further, if a metal material having a large thermal expansion is used for the cover member 63 to be welded to the metal frame member 62a, a defect such as a crack in the ceramic base member 61 is generated. Therefore, a kovar of a low thermal expansion metal material is generally used. Yes. In the communication device package having these configurations, the ceramic base member 61 and the ceramic frame member 62b need to be laminated and sintered at a temperature close to 2000 ° C., and the ceramic frame member 62b and the metal frame member 62a are close to 1000 ° C. Brazing at temperature is necessary. Each member is joined at such a high temperature, and the metal frame member 62a and the cover member 63 are welded to achieve hermetic sealing.
[0003]
[Patent Literature]
JP-A-11-67950
[0004]
[Problems to be solved by the invention]
However, in the conventional structure and manufacturing method, the terminal for energizing the communication device arranged on the base member requires a process of molding of ceramics, repeated printing of conductive metal, and firing process. The equipment cost is expensive. In addition, jig costs are also expensive for printing a conductive metal (a metal having a high melting point such as W or Mo) forming a terminal on a ceramic green sheet with high accuracy. In addition, since the metal frame member is brazed with ceramics, it is desirable that the metal frame member be a metal having a small difference in thermal expansion coefficient. Also, Kovar is generally used for the cover member, but since Kovar has magnetism, it is necessary to keep a distance from the Kovar frame member when installing a magnetic element in the communication device package, There is a negative effect that the package size cannot be reduced. Moreover, since Au plating is required for the ceramic frame member and the metal frame member when brazing, the material cost becomes high. In addition, when a capacitor is built in, it is necessary to use a metal material that does not react with the electrolyte for the terminal, metal frame member, and cover member. However, in the conventional communication device package configuration, metals other than W, Mo, and Kovar are used. When a material is selected, there is a problem that a large difference in thermal expansion occurs, and there is a problem that sufficient airtightness cannot be secured.
[0005]
Therefore, a communication device package using ceramics as a base member is expensive in terms of processing cost, facility cost, jig cost, and material cost. In addition, when the magnetic element is built in, it is difficult to reduce the size of the package. In addition, when the capacitor is built in, sufficient airtightness cannot be secured.
[0006]
An object of the present invention is to provide an inexpensive and highly airtight communication device package and a method for manufacturing the same.
[0007]
[Means for Solving the Problems]
The communication device package of the present invention includes a base member made of a resin material formed in a box shape having a recess, a conductive terminal penetrating from the inside to the outside of the recess of the base member, and a metal material joined to the base member And a cover member made of a metal material overlapping the frame member.
[0008]
That is, by using a resin material for the base member, the base member can be easily molded, and the conductive terminal for metal material and the frame member can be assembled in the mold. Here, so-called insert molding is simply performed by a method in which a resin material is injected after a conductive terminal and a frame member that have been previously machined such as pressing and cutting are placed in a mold. The conductive terminal is made of a metal material such as stainless steel, iron alloy, copper, copper alloy, or aluminum. The frame member and the cover member are made of metal materials such as stainless steel, iron alloy, copper, copper alloy, and aluminum. In the conventional communication device package, the conductive terminal was formed by mixing a tungsten powder with an organic solvent and printing it on a ceramic green sheet and then sintering it at a high temperature close to 2000 ° C. It becomes possible to manufacture the conductive terminal at low cost by press molding.
[0009]
Further, the communication device package of the present invention is characterized in that the entire circumference of the frame member 12 protrudes from the upper end surface of the recess where the base member opens, and at least a part of the frame member protrudes from the bottom of the base member.
[0010]
Here, it is possible to project the entire circumference of the frame member from the bottom of the base member, but in order to avoid interference with the conductive terminal led out from the base member, a predetermined portion of the frame member is cut off, A structure in which a part of the frame member protrudes from the bottom of the base member is included.
[0011]
That is, the rigidity of the base member made of the resin material can be increased by the frame member, the thickness of the side wall of the base member can be reduced, and a small communication device package can be configured. In addition, with respect to the load applied to the joining of the frame member and the cover member, a sufficient joining load can be applied to the frame member and the cover member by holding the frame member protruding from the bottom of the base member. The deformation of the resin material base member can be prevented.
[0012]
The communication device package according to the present invention is characterized in that the base member is made of a material made of any one of epoxy, polyimide, polyphenylene sulfide, polyester, polyamide, and polyether.
That is, by using these resins, it has rigidity and heat resistance that enables wire bonding, solder bonding, resistance welding, heat bonding of conductive adhesive, etc. to wiring from a communication device to conductive terminals, and communication. Sufficient heat resistance can be ensured even during heating when the device package and the mounting board are joined.
[0013]
In the communication device package of the present invention, the cover member and the frame member are welded.
[0014]
That is, the cover member can be welded to the frame member with good airtightness by joining the base member and the frame member made of a metal material.
[0015]
The method for manufacturing a communication device package according to the present invention includes a step of disposing a conductive terminal made of a metal material and a frame member in a base member mold, and a resin material is injected into the base member mold to form a recess. Forming the base member into a box shape and assembling the conductive terminals and the frame member, placing the communication device on the base member, and superimposing the frame member and the cover member on the frame using the heating means And a step of welding the member and the cover member.
[0016]
Here, the base member and the conductive terminal, and the base member and the frame member are joined by a method in which the resin material is injected after the conductive terminal and the frame member that have been previously machined such as pressing and cutting are placed in the mold. When the base member 11 is cured, sufficient sealing is performed. The conductive terminal is made of a metal material such as stainless steel, iron alloy, copper, copper alloy, or aluminum. The frame member and the cover member are made of metal materials such as stainless steel, iron alloy, copper, copper alloy, and aluminum. Also, as the heating means, the frictional heat of each member is generated by ultrasonic vibration oscillated by a piezoelectric vibrator using light absorption such as the fundamental wavelength of the YAG laser, the second harmonic, the third harmonic, or a semiconductor laser. , Resistance heating for energizing each member, energizing and heating the cover member, and the like.
[0017]
That is, by arranging the conductive terminal and the frame member in the base member molding die and so-called insert molding, the frame member 12, the conductive terminal 15 and the base member 11 can be easily assembled, and the airtightness as a package. Is also adequately secured.
[0018]
In the conventional communication device package, a metal paste made by mixing an organic solvent with tungsten powder as a conductive terminal had to be printed on a ceramic green sheet and then sintered at a high temperature close to 2000 ° C., a ceramic base member Compared to the fact that brazing at a high temperature close to 1000 ° C. is required for brazing between the frame member and the frame member, a package can be manufactured at a low temperature and at a low cost. Further, a communication device package with high airtightness can be realized by welding the frame member and the cover member using a heating means after the communication device is arranged and fixed in the base member. Further, since the base member is molded at a low temperature, the conductive terminal and the frame member are not limited to materials having low thermal expansion. Therefore, it is possible to manufacture a communication device package with low processing costs, equipment costs, jig costs, and material costs.
[0019]
In the method for manufacturing a communication device package according to the present invention, at least one of the conductive terminal or the frame member is continuously formed on a metal foil, and the metal foil frame and the conductive terminal or the frame member are formed. A part has a bridge, and after the step of overlapping the frame member and the cover member and welding the frame member and the cover member using the heating means, the bridge is separated from the frame of the metal foil.
[0020]
Here, so-called hoop molding is used in which a plurality of conductive terminals or frame members are continuously formed on a metal foil.
[0021]
That is, since the guide hole provided in the frame of the hoop can be used by assembling with the hoop until the process of arranging and fixing the communication device after the molding of the base member and the welding process of the cover member and the frame member, The communication device package can be easily positioned.
[0022]
DETAILED DESCRIPTION OF THE INVENTION
FIG. 1 shows the configuration of a first embodiment of a communication device package of the present invention. FIG. 2 shows a cross-sectional view of the first embodiment of the communication device package of the present invention.
[0023]
The communication device package of the present invention includes a base member 11 made of a resin material for housing the communication device 17, a frame member 12 joined to the base member 11 and made of a metal material, and a frame member 12 that overlaps the frame member 12. The cover member 13 is made of a metal material to be welded. The base member 11 is provided with a concave portion 11 a having an open upper surface for housing the communication device 17, and a frame member 12 whose entire circumference protrudes from the upper end surface of the concave portion 11 a is joined to the base member 11. Further, the conductive terminal 15 for establishing electrical connection between the communication device 17 arranged in the base member 11 and the outside of the base member 11 is exposed on the bottom surface of the recess 11a of the base member 11, and the communication device 17 is arranged and fixed. The conductive terminal 15 a that conducts through the communication device 17 and the wiring 14 is configured, and is led out from the inside of the recess 11 a of the base member 11 through the side wall. The conductive terminals 15a and 15b are sufficiently joined to the side wall of the base member 11, and there is no entry of outside air and moisture from these joints. Here, the material of the base member 11 can be applied as long as it is an insulating resin. However, it can be applied to a thermosetting resin having heat resistance such as epoxy or polyimide, polyphenylene sulfide, polyester, polyamide, or polyether. The thermoplastic resin is suitable from the viewpoint of rigidity and heat resistance. Here, syndiotactic polystyrene is used as polystyrene, linear and cross-linked polyphenylene sulfide is used as polyphenylene sulfide, fully aromatic polyester is called liquid crystal polymer as polyester, nylon is used as polyamide, and polyether is used as polyamide. Polyetheretherketone, polyethersulfone, polyetherimide, and the like are included. In addition, as the material of the conductive terminal 15, a metal material such as stainless steel, iron alloy, copper, copper alloy, or aluminum is used. Further, nickel, gold, copper, tin or the like may be applied as the surface treatment. Moreover, as a material of the frame member 12 and the cover member 13, metal materials, such as stainless steel, an iron alloy, copper, a copper alloy, and aluminum, are used.
[0024]
In the present embodiment, the base member 11 is made of epoxy, the conductive terminal 15 is made of copper, and the frame member 12 and the cover member 13 are made of stainless steel.
[0025]
The conductive member 15 and the frame member 12 are continuously formed of a metal foil, so-called hoop molding is applied, the base member 11 is placed in a molding die of the base member 11 and resin is injected into the die, so-called insert molding. 11 is integrally fixed. Specifically, a hoop in which the conductive terminal 15 was formed on a copper foil having a feed guide hole by a press and a hoop in which a frame member 12 was formed by a press on a stainless foil having a feed guide hole were prepared. The conductive terminal 15 and a frame having a feed guide hole are arranged in the mold of the base member 11, and the frame member 12 is cut from the frame having the feed hole guide immediately before being placed in the insert mold. A plurality of base members 11 were continuously formed by placing in a mold of the member 11 and insert molding epoxy. Thereafter, the frame having the feed guide hole and the conductive terminal 15 were separated. The communication device 17 was accommodated in the base member 11 constituted by these means. After the communication device 17 was arranged and fixed on the conductive terminal 15a with a conductive adhesive, the communication device 17 and the conductive terminal 15b were connected by the wiring 14 using a wire bond. At this point, after measuring the characteristics of the communication device 17, the frame member 12 and the cover member 13 previously cut from the stainless steel foil by press molding are overlapped, and seam welding is performed using a YAG laser having a fundamental wavelength. A device package was prepared.
[0026]
In order to evaluate the airtightness of the communication device package, a leak test was conducted by dipping in a fluorine-based liquid. As a result, the airtightness was 10 −5 atm · cc / sec or more. In addition, the characteristics of the communication device 17 did not change before and after the cover member 13 was welded.
[0027]
Further, when a magnetic element is installed as the communication device 17, the epoxy used for the base member 11, the copper of the conductive terminal 15, and the stainless steel of the frame member 12 and the cover member 13 do not have magnetism. There was no failure.
[0028]
Further, when a capacitor is built in as the communication device 17, epoxy is used for the berth member 11, the conductive terminal 15 and the frame member 12, and stainless steel is used for the cover member. Was secured.
[0029]
FIG. 3 shows the configuration of the second embodiment of the communication device package of the present invention. 3 in FIG. 3 is a side view of the communication device package, and 320 is a cross-sectional view taken along the line AA ′ described in 310. The frame member 32 extends from the upper end surface of the recess 31a in which the base member 31 opens. The entire circumference of the frame member 32 protrudes, and at least a part of the frame member 32 protrudes from the bottom 31b of the base member 31. Further, since the conductive terminal 35a where the communication device 37 is arranged and fixed and the conductive terminal 35b connected from the communication device 37 by the wiring 34 are led out from the base member 31, the frame member 32 is formed of the conductive terminal 35a, Windows 32a and 32b for avoiding interference with 35b are provided. Since the window 32a is inside the base member 31, it is indicated by a broken line in the side view 310. The cross-sectional view 320 shows that the insulating property can be secured by the resin material of the base member 31 without contacting the window 32b and the conductive terminal 35b.
[0030]
In the present embodiment, the base member 31 is made of epoxy, the conductive terminals 35a and 35b are made of copper, and the frame member 32 and the cover member 33 are made of stainless steel. As in the first embodiment, the conductive terminals 35a and 35b and the frame member 32 were press-molded, placed in a mold for the base member 31, and the base member 31 was insert-molded.
[0031]
The communication device 37 was accommodated in the base member 31 produced by these means. After the communication device 37 was placed and fixed on the conductive terminal 35a with a conductive adhesive, the communication device 37 and the conductive terminal 35b were connected by a wire 34 using a wire bond. At this time, after measuring the characteristics of the communication device 37, the frame member 32 and the cover member 33 previously cut from the stainless steel foil by press molding are overlapped, and seam welding is performed using a YAG laser having a fundamental wavelength, and communication is performed. A device package was prepared.
[0032]
As another welding method, the frame member 32 and the cover member 33 are sandwiched between welding electrodes and joined by resistance heating. At this time, it is necessary to apply a load until there is no gap between the frame member 32 and the cover member 33, but the base member 11 could be welded without deformation.
[0033]
In order to evaluate the airtightness of the communication device package welded by these methods, a leak test was conducted by dipping in a fluorine-based liquid. As a result, the airtightness was 10 −5 atm · cc / sec or more. In addition, the characteristics of the communication device 17 did not change before and after the cover member 13 was welded.
[0034]
FIG. 4 is a flowchart for explaining a method for manufacturing a communication device package according to the present invention. The conductive terminal 15 formed by press-molding the copper foil and the frame member 12 formed by press-molding the stainless steel foil are placed in the mold of the base member 11 (step 401). Next, an epoxy resin is injected into the molding die of the base member 11 and cooled and cured (step 402). Next, the communication device 17 is fixed to the conductive terminal 15a with a conductive adhesive, and the wiring 14 is connected with a wire bonder in order to connect the communication device 17 and the conductive terminal 15b (step 403). Thereafter, the cover member 13 and the frame member 12 are overlapped, and the entire circumference is welded with a YAG laser having a fundamental wavelength (step 404).
[0035]
As a method of welding the cover member 13 and the frame member 12, in addition to the YAG laser of the fundamental wavelength, a method using light absorption such as a second harmonic, a third harmonic YAG laser, or a semiconductor laser, a cover member A method using frictional heat that presses an ultrasonic transducer 13 and rubs between the frame member 12 and a method using resistance heating that energizes and heats the cover member 13 or the cover member 13 and the frame member 12 are used. .
[0036]
In order to confirm the sealing state of the communication device package produced in this step, a leak test was conducted by immersing in a fluorinated liquid. As a result, the airtightness was 10 −5 atm · cc / sec or more. In addition, the characteristics of the communication device 17 did not change before and after the cover member 13 was welded. In addition, when a conductive terminal and a frame member are insert-molded using polyphenylene sulfide as a base member, the conductive terminal and the sealing performance of the frame member and the base member, and a frame member welded with a YAG laser having a fundamental wavelength, The sealing property with the cover member could be confirmed.
[0037]
FIG. 5 is an external view for explaining a method for manufacturing a communication device package according to the present invention.
[0038]
Here, the conductive terminals 55a and 55b are connected to the hoop by bridges 58a and 58b. A plurality of conductive terminals 55a and 55b continuous with a hoop and a frame member 52 were arranged in a base member mold, and the base member 51 was formed. The communication device 57 is disposed and fixed to the conductive terminal 55a, and the wire bond wiring 54 is provided between the communication device and the conductive terminal 55b. Thereafter, a cover member (not shown) was overlapped with the frame member 52 and welded. Through these steps, the bridges 58a and 58b were separated. The placement and fixing of the communication device, the overlapping of the cover member and the frame member 52, and the welding of the cover member were all performed by inserting guide pins into the guide holes 59 provided in the frame of the hoop and positioning them. . As a result, there is no need to provide positioning guide holes in the base member 51, and the positions of the guide holes provided in the frames of the conductive terminals 55a and 55b and the hoop even when the outer shape of the base member 51 varies. Since it is processed with high accuracy, the arrangement and fixing of the communication device 57 and the conductive terminal 55a and the wiring 54 between the communication device 57 and the conductive terminal 55b can be assembled with high accuracy. This method has been confirmed to be effective when miniaturizing a communication device or a communication device package.
[0039]
【The invention's effect】
As described above, a base member made of a resin material and formed in a box shape, a conductive terminal made of a metal material and fixed to the outside from the inside of the base member, and a frame made of a metal material and fixed to the base member The device package for communication was comprised with the member and the cover member welded to a frame member. The conductive terminal and the frame member are assembled together with the base member to increase productivity. Further, by welding the frame member and the cover member, it is possible to prevent the intrusion of outside air and humidity into the inside, and it is possible to obtain a highly airtight and highly reliable communication device package and a manufacturing method thereof.
[Brief description of the drawings]
FIG. 1 is a configuration diagram of a communication device package of the present invention.
FIG. 2 is a cross-sectional view of the communication device package of the present invention.
FIG. 3 is a side view and a cross-sectional view of a second embodiment of a communication device package of the present invention.
FIG. 4 is a flowchart illustrating a method for manufacturing a communication device package according to the present invention.
FIG. 5 is an external view illustrating a method for manufacturing a communication device package according to the present invention.
FIG. 6 is a cross-sectional view of a conventional communication device package.
[Explanation of symbols]
11, 31, 51 Base member 12, 32, 52 Frame member 13, 33, 53 Cover member 15, 15a, 15b Conductive terminal 35, 35a, 35b Conductive terminal 55a, 55b Conductive terminal 58a, 58b Bridge

Claims (3)

凹部を有する箱状に形成された樹脂材料からなるベース部材と、
前記ベース部材の前記凹部の内側から外側に貫通する導電性端子と、
前記ベース部材と接合された金属材料からなる枠部材と、
当該枠部材と重なる金属材料からなるカバー部材と
を有し、
前記ベース部材が開口する前記凹部の上端面から前記枠部材の全周が突出し、前記ベース部材の底部から前記枠部材の少なくとも一部が突出することを特徴とする通信用デバイスパッケージ。A base member made of a resin material formed in a box shape having a recess,
A conductive terminal penetrating from the inside to the outside of the recess of the base member;
A frame member made of a metal material joined to the base member;
A cover member made of a metal material overlapping the frame member;
A device package for communication, wherein an entire circumference of the frame member protrudes from an upper end surface of the recess where the base member opens, and at least a part of the frame member protrudes from a bottom portion of the base member. 前記ベース部材がエポキシ系、ポリイミド系、ポリフェニレンサルファイド系、ポリエステル系、ポリアミド系、ポリエーテル系の何れかからなる材料で構成されていることを特徴とする請求項１記載の通信用デバイスパッケージ。Said base member is an epoxy, polyimide, polyphenylene sulfide, polyester, polyamide, communication device package according to claim 1, characterized in that it is composed of a material consisting of either a polyether. 前記カバー部材と前記枠部材とが溶接されていることを特徴とする請求項１または２記載の通信用デバイスパッケージ。Communication device package of claim 1 or 2, wherein the said frame member and said cover member is welded.
JP2003127887A 2003-05-06 2003-05-06 Communication device package and manufacturing method thereof Expired - Fee Related JP4073821B2 (en)

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US10/834,636 US7023078B2 (en) 2003-05-06 2004-04-29 Packages for communication devices

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Publication number Priority date Publication date Assignee Title
CN105977213A (en) * 2015-03-11 2016-09-28 日本特殊陶业株式会社 Ceramic package, electronic component device, and method for manufacturing same

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JP5052822B2 (en) * 2006-05-31 2012-10-17 京セラクリスタルデバイス株式会社 Method for manufacturing piezoelectric vibrator container member
JP5904957B2 (en) 2013-02-28 2016-04-20 キヤノン株式会社 Electronic components and electronic equipment.

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105977213A (en) * 2015-03-11 2016-09-28 日本特殊陶业株式会社 Ceramic package, electronic component device, and method for manufacturing same
CN105977213B (en) * 2015-03-11 2018-09-14 日本特殊陶业株式会社 Ceramic package, electronic component device and its manufacturing method

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