JP2005110325A - Non-reciprocal circuit element and communication device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To obtain a non-reciprocal circuit element capable of preventing part of a resin from flowing into a notch at a joint of lead frames in insert-molding. <P>SOLUTION: The non-reciprocal circuit element is insert-molded so that an input/output external terminal 5 and a ground external terminal 6 protrude from the bottom of a resin case 1 when the case 1 is molded. The lead frame including the external terminals 5, 6 and the joint 21 is insert-molded with the resin case 1. A notch 21a is formed on the joint 21. In addition, opposite recesses 32 are formed on both sides of the notch 21a on the bottom of the resin case 1, so as to absorb part of the resin into a recess 3 in insert-molding. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to an irreversible circuit element such as an isolator or a circulator used in a microwave band, and a communication apparatus including the element.

  Conventionally, a lumped constant type isolator (non-reciprocal circuit element) employed in a mobile communication device such as a cellular phone is composed of a resin case 1, a ferrite 11 and a plurality of center electrodes 12a, 12b, as shown in FIGS. The center electrode assembly 10 is composed of 12c, a permanent magnet 15, a resistor 16, a matching capacitor 17, and metal cases 18 and 19. As shown in FIG. 12, input / output external terminals 5 and ground external terminals 6 are molded in the resin case 1 in advance as insert fittings (lead frames) at the time of molding the resin case 1 on both sides of the bottom surface of the case 1. .

  By the way, the protrusion amount Y (see FIG. 12B) of the external terminals 5 and 6 of the nonreciprocal circuit element used in the mobile communication device from the bottom surface of the case 1 is reduced in size and height of the nonreciprocal circuit element. In recent years, it tends to be small, and is about 0 to 100 μm in recent years.

  In the non-reciprocal circuit element, when the external terminals 5 and 6 are insert-molded into the case 1, when the resin flows into the cutting notch provided in the connecting portion and the connecting portion is cut. There was a problem that the burr | flash of resin generate | occur | produced and the mounting property was impaired.

  Further, as the protruding amount Y of the external terminal becomes small, a phenomenon has occurred in which the resin partially covers the external terminal due to a mismatch between the lead frame and the mold. FIG. 12 shows a state where a resin fog 1a is generated at the input / output external terminal 5 shown on the right side of FIG.

  If the protruding amount Y is large, the cover 1a does not reach the bottom surface of the external terminal 5 and does not adversely affect the mountability of the nonreciprocal circuit element. However, if the protruding amount Y is small, the cover 1a reaches the bottom surface of the external terminal 5 and adversely affects the mountability. That is, the soldering between the external terminal 5 and the electrode on the circuit board becomes defective at the time of mounting, and the electrical connection becomes open. Even if the soldering can be performed, the bonding strength is weak and the reliability is poor. Such a problem can be solved by increasing the protruding amount Y, but this is not practical at the cost of downsizing and low profile.

  Accordingly, an object of the present invention is to prevent a part of the resin from flowing into the notch of the connecting portion of the lead frame at the time of insert molding, and thus a non-reciprocal circuit element having good reliability at the time of mounting, and a communication including the element To provide an apparatus.

  Another object of the present invention is to achieve the above-mentioned object, and to prevent a part of the resin from covering the bottom surface of the external terminal during insert molding without impairing downsizing and low profile. An object of the present invention is to provide a nonreciprocal circuit element having good performance and a communication device including the element.

  In order to achieve the above object, the present invention provides a nonreciprocal circuit element in which an external terminal and a connecting portion formed on a lead frame are insert-molded when a resin case is molded, and is provided on the connecting portion on the bottom surface of the resin case. A concave portion adjacent to the notch is formed.

  In the nonreciprocal circuit device according to the present invention having the above-described configuration, when the connecting portion of the lead frame is insert-molded into the resin case, the resin that flows into the notch provided in the connecting portion is formed on the bottom surface of the case. It is absorbed in the concave portion and does not flow into the notch, and it is possible to prevent the occurrence of resin burrs when the connecting portion is cut with the notch.

  In the non-reciprocal circuit device according to the present invention, the external terminal is insert-molded when the resin case is molded so as to protrude from the bottom surface of the resin case, and is adjacent to the protruding portion of the external terminal on the bottom surface of the resin case. A recess may be formed. According to such a configuration, when the external terminal is insert-molded into the resin case, even if a resin cover is generated, the cover is absorbed by the recess formed on the bottom surface of the case and wraps around the bottom surface of the external terminal. Even if the protruding amount of the external terminal is set small for miniaturization and low profile, it does not cause poor soldering or insufficient bonding strength. Furthermore, the formation of solder fillets is improved. Moreover, since the external terminal and the electrode of the mounting substrate can be brought into contact with each other reliably, insertion loss can be reduced. In addition, when it does not contact, since it becomes a connection only with a solder with high resistivity, insertion loss worsens.

  In the nonreciprocal circuit device according to the present invention, the depth of the recess formed on the bottom surface of the resin case is preferably 0.01 to 0.1 mm. If it is too deep, the bonding strength between the terminal and the connecting portion and the resin case will be weak, and if it is too shallow, the wraparound of the resin cannot be sufficiently absorbed.

  The resin case can be molded from various materials, but it is preferable to use any one of liquid crystal polymer, polyphenylene sulfide, or polyether ether ketone, which is a heat-resistant and low-loss material. The external terminal is preferably made of a material mainly composed of iron, brass, or phosphor bronze that can be easily bent.

  According to the non-reciprocal circuit device according to the present invention, since the concave portion adjacent to the protruding portion of the external terminal is formed on the bottom surface of the resin case, the concave portion adjacent to the notch of the connecting portion formed in the lead frame is provided. Since they are formed, these recesses absorb the flow of the resin during molding, so that the resin does not cover the bottom surface of the external terminal or flow into the notch at the connecting portion.

  Therefore, the amount of protrusion of the external terminal is increased and the size reduction and the height reduction are not impaired, and the solderability for mounting the external terminal and the bonding strength can be improved. Further, even when the connecting portion of the lead frame is cut based on the notch, no resin burr is generated, and good mountability can be ensured.

  In addition, the reliability of the communication apparatus including the nonreciprocal circuit element having the above advantages is improved.

  Embodiments of a nonreciprocal circuit device and a communication device according to the present invention will be described below with reference to the accompanying drawings.

(See the first embodiment, FIGS. 1 and 2)
FIG. 1A shows a bottom surface of the nonreciprocal circuit device (lumped constant type isolator) according to the first embodiment, and FIG. 1B shows a cross section taken along line X1-X1. Each component is the same as the conventional non-reciprocal circuit device shown in FIGS. 10 to 12, and the same components are denoted by the same reference numerals and the description thereof is omitted. In addition, the same code | symbol is attached | subjected also in 2nd-4th embodiment demonstrated below.

  In the first embodiment, the concave portion 2 surrounding each protruding portion of the external terminals 5 and 6 is formed on the bottom surface of the resin case 1. The external terminals 5 and 6 are insert-molded so as to protrude from the resin case 1 when the resin case 1 is molded, and the recesses 2 are formed simultaneously with this insert molding.

  The material of case 1 is preferably a heat-resistant and low-loss material, and liquid crystal polymer, polyphenylene sulfide or polyether ether ketone is suitable. The role of the recess 2 is to prevent the resin from covering the bottom surfaces of the external terminals 5 and 6 during insert molding. Even if the cover 1a (see FIG. 1 (B)) occurs, the cover 1a is a recess. 2 does not reach the bottom surfaces of the external terminals 5 and 6.

  The depth of the recess 2 is in a relative relationship with the protruding amount Y, but if it is too deep, the bonding strength between the external terminals 5 and 6 and the resin case 1 will be weak, and if it is too shallow, it will be on the bottom surface of the terminals 5 and 6. Since the resin is covered, 0.01 to 0.1 mm is desirable. In the first embodiment, the depth D of the recess 2 is set to 0.05 mm while the protruding amount Y of the external terminals 5 and 6 is 0.02 mm.

  As a material for the external terminals 5 and 6, a material mainly composed of iron, brass, or phosphor bronze that can be easily bent is suitable. The external terminals 5 and 6 are usually subjected to silver plating of about 1 to 10 μm for the purpose of improving insertion loss and solderability. In order to improve the plating strength, copper or nickel is plated as a base between the base material and the silver plating.

  In the first embodiment, since the recess 2 is formed around the external terminals 5 and 6 on the bottom surface of the resin case 1, even if resin fog occurs during insert molding, the fog remains in the recess 2. As a result, the resin does not reach the bottom surfaces of the terminals 5 and 6. Therefore, when this nonreciprocal circuit element is mounted on the circuit board 30 (see FIG. 2), the soldering between the terminals 5 and 6 and the electrode 31 on the board 30 is poor, and the electrical connection becomes open, and the bonding strength Can solve the problem of deterioration. Furthermore, as shown in FIG. 2, since the solder fillet 32a is satisfactorily formed, the mounting strength is improved.

  Moreover, when there are too many solders 32, the recessed part 2 becomes an absorption destination of the solder 32, and what is called a solder ball can be prevented. In other words, since the management range of the solder amount at the time of mounting can be set large, the mounting work becomes easy.

(See the second embodiment, FIG. 3)
FIG. 3 shows the bottom surface of the nonreciprocal circuit device (lumped constant type isolator) according to the second embodiment, and the cross section thereof is the same as FIG.

  In the second embodiment, the recess 2 is formed only at a location facing the end surfaces of the external terminals 5 and 6. The concave portion 2 is not necessarily formed so as to surround the entire periphery of the terminals 5 and 6, and the resin mold such as the round portion of the terminals 5 and 6 and the lead frame can be matched as in the second embodiment. What is necessary is just to form in a difficult location, and the same effect as the said 1st Embodiment is exhibited.

(Refer 3rd Embodiment and FIGS. 4-7)
4 and 5 show the process of manufacturing the non-reciprocal circuit device (lumped constant type isolator) according to the third embodiment. Sometimes insert molded. The lead frame 20 is a well-known one for intermittently feeding the resin case 1 step by step in order to automatically assemble non-reciprocal circuit elements, and has a pilot hole 22 for controlling the feeding.

  The external terminals 5 and 6 are separated from the lead frame 20 after the insert molding, and the connecting portion 21 is separated from the lead frame 20 after each component is incorporated in the resin case 1. The material of the lead frame 20 is the same as the preferable material of the external terminals 5 and 6 described in the first embodiment.

  A notch 21 a shown in FIG. 5 is formed on the bottom surface of the connecting portion 21 of the lead frame 20. This notch 21a is a reference when the connecting portion 21 is bent and cut after the non-reciprocal circuit element is assembled and the upper and lower surfaces of the resin case 1 are held by the pressing bars 35, 35 as shown in FIG. Become.

  In the third embodiment, as shown in FIG. 7, the recesses 3, 3 facing both sides of the notch 21 a of the connecting portion 21 are formed at the bottom of the resin case 1 at the time of insert molding.

  The role of the recess 3 is to absorb the resin flowing into the notch 21a during insert molding. By preventing the resin from flowing into the notches 21a, it is possible to prevent the occurrence of resin burrs when the connecting portion 21 is cut based on the notches 21a. Since resin burrs do not occur, when mounting a non-reciprocal circuit element on a circuit board, the element floats off the board, causing an electrical connection failure, or a problem such as deterioration of the soldering joint strength is solved. The

(Refer to the fourth embodiment and FIG. 8)
FIG. 8 shows a bottom surface of a non-reciprocal circuit device (lumped constant type isolator) according to the fourth embodiment, and the cross section thereof is the same as FIGS. 7B and 7C.

  In the fourth embodiment, the concave portion 3 is formed so that the connecting portion 21 surrounds the portion that is drawn from the bottom surface of the case 1. The function and effect are the same as in the third embodiment.

(Communication device, see FIG. 9)
Next, a mobile phone will be described as an example of a communication apparatus according to the present invention. FIG. 9 shows an electric circuit 120 of an RF part of a cellular phone, 122 is an antenna element, 123 is a duplexer, 131 is a transmission side isolator, 132 is a transmission side amplifier, 133 is a band pass filter for transmission side stages, and 134 is a transmission A side mixer, 135 is a reception side amplifier, 136 is a band pass filter for reception side stages, 137 is a reception side mixer, 138 is a voltage controlled oscillator (VCO), and 139 is a band pass filter for local use.

  Here, the non-reciprocal circuit element (lumped constant type isolator) shown in the first to fourth embodiments can be used as the transmission-side isolator 131. By mounting such a nonreciprocal circuit element, it is possible to realize a mobile phone including a nonreciprocal circuit element having good solderability and sufficient bonding strength.

(Other embodiments)
The nonreciprocal circuit device and the communication device according to the present invention are not limited to the above-described embodiments, and can be variously modified within the scope of the gist.

  In particular, various parts such as a center electrode assembly, a permanent magnet, and a case constituting the non-reciprocal circuit element can be of any shape and configuration. Further, it may be a circulator.

The nonreciprocal circuit device which is 1st Embodiment of this invention is shown, (A) is a bottom view, (B) is X1-X1 sectional drawing. The partial expanded sectional view which shows the time of mounting of the nonreciprocal circuit device which is the said 1st Embodiment. The bottom view which shows the nonreciprocal circuit device which is 2nd Embodiment of this invention. The perspective view which shows the manufacturing process of the nonreciprocal circuit device which is 3rd Embodiment of this invention. The bottom view which shows the manufacturing process of the nonreciprocal circuit device which is the said 3rd Embodiment. Explanatory drawing which shows a mode that the connection part of a lead frame is cut | disconnected in the manufacturing process of the nonreciprocal circuit device which is the said 3rd Embodiment. The nonreciprocal circuit device which is the said 3rd Embodiment is shown, (A) is a bottom view, (B) is X2-X2 sectional drawing, (C) is X3-X3 sectional drawing. The bottom view which shows the nonreciprocal circuit device which is 4th Embodiment of this invention. The block diagram which shows the electric circuit of the communication apparatus (mobile telephone) which concerns on this invention. The disassembled perspective view which shows the conventional nonreciprocal circuit device. The perspective view which shows the external appearance of the conventional nonreciprocal circuit element. The conventional nonreciprocal circuit element is shown, (A) is a bottom view, (B) is X4-X4 sectional drawing.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Resin case 2, 3 ... Recessed part 5, 6 ... External terminal 20 ... Lead frame 21 ... Connection part 21a ... Notch 120 ... Electric circuit of mobile phone

Claims (6)

  In the nonreciprocal circuit element in which the external terminal and the connecting portion formed on the lead frame are insert-molded at the time of molding the resin case, a recess adjacent to the notch provided in the connecting portion is formed on the bottom surface of the resin case. A nonreciprocal circuit device characterized by the above.   The external terminal is insert-molded when the resin case is molded so as to protrude from the bottom surface of the resin case, and a recess adjacent to the protruding portion of the external terminal is formed on the bottom surface of the resin case. The nonreciprocal circuit device according to claim 1.   The nonreciprocal circuit device according to claim 1, wherein a depth of the concave portion is 0.01 to 0.1 mm.   4. The nonreciprocal circuit device according to claim 1, wherein the material of the resin case is any one of a liquid crystal polymer, polyphenylene sulfide, or polyether ether ketone.   5. The nonreciprocal circuit device according to claim 1, wherein the external terminal is made of a material mainly composed of iron, brass, or phosphor bronze. A communication apparatus comprising the nonreciprocal circuit device according to claim 1, 2, 3, 4, or 5.

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