CN114464971A

CN114464971A - Dielectric filter and electronic device

Info

Publication number: CN114464971A
Application number: CN202210187310.3A
Authority: CN
Inventors: 毛积闯; 黄晓俊; 冒晨阳
Original assignee: Huawei Technologies Co Ltd
Current assignee: Huawei Technologies Co Ltd
Priority date: 2022-02-28
Filing date: 2022-02-28
Publication date: 2022-05-10
Also published as: WO2023160549A1

Abstract

The embodiment of the application provides a dielectric filter and an electronic device. The dielectric filter includes a filter portion made of a high dielectric material and having a plurality of coupling holes provided at predetermined positions of an interface surface and a ground port; and a plurality of input/output pins each including a coupling portion and an interface portion, the coupling portion being press-fitted into the corresponding coupling hole by interference fit, wherein the ground port and the interface portion are coupled to a circuit board of the electronic device by solder. By press-fitting the input/output pins into the coupling holes in an interference fit manner, it is no longer necessary to use a carrier plate to indirectly mount the filter portion onto the circuit board of the electronic apparatus, thereby effectively promoting miniaturization and weight saving of the electronic apparatus and enabling further cost reduction.

Description

Dielectric filter and electronic device

Technical Field

Embodiments of the present application relate generally to the field of filters. More particularly, embodiments of the present application relate to a dielectric filter and an electronic device including the same.

Background

A filter is a frequency-selective device that passes certain frequency components of a signal while significantly attenuating other frequency components. By using the frequency selection function of the filter, interference noise can be filtered out or spectrum analysis can be carried out. The filter is of various kinds, and different kinds of filters are applied in different frequency ranges and different occasions. The dielectric filter is constructed by coupling between dielectric resonators. Dielectric resonator filters have high Q-values, low insertion losses, small dimensions, and light weight, and are widely used in wireless base stations, satellite communications, navigation systems, electronic countermeasure systems, and the like.

A dielectric filter is a filter using dielectric resonators. The dielectric resonator is formed by the electromagnetic wave repeatedly totally reflecting inside the dielectric. Because the wavelength of the electromagnetic wave can be shortened when the electromagnetic wave propagates in a substance with a high dielectric constant, the microwave resonator can be formed by utilizing the characteristic. The dielectric resonator may be formed of ceramic. Thus, the dielectric filter can be made smaller than conventional cavity resonators.

With the development of 5G technology, ceramic dielectric filters are widely applied to multiple-input multiple-output (MIMO) base station platforms. The existing dielectric filter board level connection technology adopts a welding mode with a carrier plate to realize the connection of electrical performance, but the reliability problem of the application of the filter board level is increasingly prominent because the ceramic dielectric and a circuit board have larger thermal expansion coefficient mismatch in the application process, and the main problem is the temperature cycle cracking of pins of the dielectric filter and the ceramic dielectric and welding spots of the ceramic dielectric and the carrier plate. In addition, the cost of the circuit board and the surface mounting technology accounts for up to 25%, and the product line has strong appeal on cost reduction.

Disclosure of Invention

Embodiments of the present application provide a dielectric filter and a related electronic device that can effectively enhance reliability and can promote miniaturization and weight reduction of the electronic device.

In a first aspect of the present application, a dielectric filter is provided. The dielectric filter includes a filter portion made of a high dielectric material and having a plurality of coupling holes provided at predetermined positions of an interface surface and a ground port; and a plurality of input/output pins each including a coupling portion and an interface portion, the coupling portion being press-fitted into the corresponding coupling hole by interference fit, wherein the ground port and the interface portion are coupled to a circuit board of the electronic device by solder.

Because the coupling part is press-fitted into the coupling hole in an interference fit manner, certain tolerance absorption capacity exists between the input/output pin and the filtering part, and micro deformation and thermal stress caused by mismatch of thermal expansion coefficients between the coupling part and the input/output pin can be absorbed, so that the connection reliability between the coupling part and the input/output pin is effectively enhanced, and the reliability of the dielectric filter is further improved. In this way, it is no longer necessary to use a carrier board to indirectly mount the filter portion to the circuit board of the electronic apparatus, so that the miniaturization and the weight saving of the electronic apparatus are effectively promoted, and the cost can be further reduced.

In one embodiment, the coupling part comprises at least two plug members arranged uniformly in the circumferential direction and spaced apart by a predetermined distance, which plug members are adapted to be at least partially deformed during insertion into the coupling bore. In this way, the insertion of the coupling portion in the coupling hole in an interference fit manner can be further facilitated, and the slight deformation and thermal stress caused by the mismatch of the thermal expansion coefficients between the coupling portion and the input/output pin can be further absorbed, so that the reliability of the connection between the coupling portion and the input/output pin can be further effectively enhanced.

In one implementation, the height of the coupling portion in the insertion direction is between 0.7mm and 1.4 mm. The arrangement can effectively ensure the reliability of the coupling between the input/output pin and the filtering part.

In one implementation, the coupling is chamfered at the ends. This arrangement facilitates alignment of the input and output pins when they are inserted into the coupling holes, and thus facilitates coupling therebetween.

In one implementation, the material composition of the solder includes tin, silver, copper, bismuth, and nickel. By adding bismuth and nickel elements on the basis of the solder paste, a net structure can be formed in the solder after welding, so that the alloy strength at a welding point is improved in a dispersion strengthening and solid solution strengthening mode, the problems of welding point cracking and the like are further effectively solved, the high-reliability board-level connection of the dielectric filter is realized, and the application requirements of an energy-saving and emission-reducing scene are met.

In one implementation, the content of bismuth is between 2.5% and 3.5% by weight, and/or the content of nickel is between 0.04% and 0.06% by weight. By controlling the amounts of bismuth and nickel, the connection performance can be further precisely improved, thereby improving reliability.

In one implementation, the input/output pin further includes a stopper portion disposed between the coupling portion and the interface portion, and a size of the stopper portion is larger than a size of the coupling hole. In this way, the length of insertion of the coupling portion into the coupling hole can be ensured in an effective and simple manner, thereby reducing the difficulty of assembly while ensuring reliability.

In one implementation, the interface surface is located at a distance of 0.15mm to 0.5mm from the circuit board. The significantly reduced distance between the interface surface and the circuit board further promotes miniaturization and weight reduction of the electronic device.

In one implementation, the input-output pin is made of one of the following materials: phosphor bronze, brass, free-cutting iron, and stainless steel. In this way, the flexibility of input-output pin manufacture can be improved.

In one implementation, the surface of the input-output pin is treated with one of: silver plating, nickel and gold plating and high-temperature tin plating.

In one implementation, the high dielectric material includes a ceramic. The use of ceramics as the material of the filter portion can promote the filter portion to have a smaller size, and further promote miniaturization of the electronic apparatus.

According to a second aspect of the present application, an electronic device is provided. The electronic apparatus includes a circuit board including solder having a predetermined thickness arranged at a predetermined position; and the dielectric filter according to the foregoing first aspect, arranged at the predetermined position of the circuit board via the solder. By using the dielectric filter according to the first aspect of the present application, it is possible to effectively improve the reliability of the electronic device, and to promote the miniaturization, weight saving, and low cost of the electronic device.

In one implementation, the predetermined thickness of solder is between 0.15mm and 0.5 mm.

According to a third aspect of the present application, there is provided a method of assembling a dielectric filter onto an electronic device. The method comprises providing a plurality of input/output pins, each including a coupling portion and an interface portion; press-fitting the coupling parts of the plurality of input and output pins into the coupling holes of the filter part by means of interference fit; the ground port and the interface portion are coupled to a circuit board of an electronic device by solder.

In one implementation, coupling the ground port and the interface portion to a circuit board of an electronic device with solder includes printing the solder having a predetermined thickness at a predetermined location on the circuit board; disposing the ground port and the interface portion at the predetermined position via the solder by surface mounting.

Drawings

The above and other features, advantages and aspects of various embodiments of the present application will become more apparent by referring to the following detailed description when taken in conjunction with the accompanying drawings. In the drawings, like or similar reference characters designate like or similar elements, and wherein:

fig. 1 shows a simplified cross-sectional view of a conventional dielectric filter mounted on a circuit board;

fig. 2 shows a simplified cross-sectional view of a dielectric filter according to an embodiment of the application mounted on a circuit board;

FIG. 3 illustrates a perspective view of an input-output pin according to various embodiments of the present application;

FIG. 4 shows a flow diagram of a method of assembling a dielectric filter onto a circuit board of an electronic device according to an embodiment of the application; and

figure 5 shows simplified cross-sectional views of various stages of assembly of a dielectric filter onto a circuit board according to an embodiment of the application.

Detailed Description

Embodiments of the present application will be described in more detail below with reference to the accompanying drawings. While certain embodiments of the present application are shown in the drawings, it should be understood that the present application may be embodied in various forms and should not be construed as limited to the embodiments set forth herein, but rather are provided for a more thorough and complete understanding of the present application. It should be understood that the drawings and embodiments of the present application are for illustration purposes only and are not intended to limit the scope of the present application.

In describing embodiments of the present application, the terms "include" and "comprise," and similar language, are to be construed as open-ended, i.e., "including, but not limited to. The term "based on" should be understood as "based at least in part on". The term "one embodiment" or "the embodiment" should be understood as "at least one embodiment". The terms "first," "second," and the like may refer to different or the same object. Other explicit and implicit definitions are also possible below.

It is to be understood that in the present application, "coupled" can be understood as directly coupled and/or indirectly coupled. Direct coupling, which may also be referred to as "electrically connecting," means that the components are in physical and electrical contact; it can also be understood that different components in the circuit structure are connected by physical circuits such as Printed Circuit Board (PCB) copper foil or lead wire capable of transmitting electrical signals; "indirectly coupled" is to be understood as meaning that two conductors are electrically connected in an isolated/contactless manner. In one embodiment, indirect coupling may also be referred to as capacitive coupling, for example, where signal transmission is achieved by coupling between a gap between two conductive elements to form an equivalent capacitance.

The technical scheme provided by the application is suitable for the electronic equipment adopting one or more of the following communication technologies: bluetooth (BT) communication technology, Global Positioning System (GPS) communication technology, wireless fidelity (WiFi) communication technology, global system for mobile communications (GSM) communication technology, Wideband Code Division Multiple Access (WCDMA) communication technology, Long Term Evolution (LTE) communication technology, 5G communication technology, and other future communication technologies. The electronic device in the embodiment of the present application may include a device in which the user front end directly interfaces with the operator network, including but not limited to: the system comprises base station equipment, a telephone, a wireless router, a firewall, a computer, a modem, a 4G-to-WiFi wireless router and the like. The electronic device in the embodiment of the application can also comprise a mobile phone, a tablet computer, a notebook computer, an intelligent home, an intelligent bracelet, an intelligent watch, an intelligent helmet, intelligent glasses and the like. The electronic device may also be a handheld device with a wireless communication function, a computing device or other processing device connected to a wireless modem, a vehicle-mounted device, an electronic device in a 5G network or an electronic device in a Public Land Mobile Network (PLMN) for future evolution, and the like, which is not limited in this embodiment.

With the continuous evolution and development of the 5G technology, the base station antenna, as a key technology for making 5G large-scale application, faces a new technical adjustment and development trend. According to different application scenarios, the 5G base station antenna has two forms of a passive base station antenna and an active antenna unit. An active antenna based on a Massive multiple input multiple output (Massive MIMO) technology has a more accurate and higher-degree-of-freedom beam forming capability, so that the frequency spectrum efficiency of a Massive MIMO system can be remarkably improved, the network capacity is improved, and the active antenna is a typical product of a 5G-era antenna. The dramatic increase in the number of radio frequency channels and the activation not only put higher design requirements on the volume, weight, power consumption and cost of the 5G base station antenna. At present, in order to realize miniaturization, light weight and integration of a base station antenna, a technology of integrating a dielectric filter and an antenna is proposed in a conventional scheme.

The dielectric filter is welded on a circuit board of the electronic equipment in a welding mode. Because of the problem of large thermal expansion coefficient mismatch between the ceramic dielectric used in the dielectric filter and the circuit board, the conventional dielectric filter usually needs to use a carrier plate technology to solder the ceramic dielectric indirectly on the circuit board. The carrier is a printed circuit board, which generally has a thermal expansion coefficient between the ceramic dielectric and the circuit board. Fig. 1 shows a schematic cross-sectional view of a conventional dielectric filter soldered to a circuit board.

As shown in fig. 1, in the conventional scheme, a dielectric filter includes a filter portion 501 made of ceramic and a lead portion 504. The filter unit 501 includes an input/output interface unit and a ground unit. The lead portion 504 and the input/output interface portion are solder-coupled by solder 505 for inputting and outputting signals. The grounding portion is transitionally connected to the circuit board 502 through the carrier plate 503. Specifically, the ground portion is soldered to the carrier board by solder paste 506 to establish a connection therebetween, and then the carrier board is further soldered to the circuit board 502 by solder paste again, thereby solving the problem of the mismatch of the thermal expansion coefficients between the ceramic dielectric and the circuit board 502.

However, various problems also exist with this approach. On the one hand, there are different materials, and there is also thermal expansion coefficient mismatch between the ceramic dielectric and the carrier 503 and between the carrier 503 and the circuit board 502. During warm-cycle testing or long-term use, there is still a high possibility that the solder paste between the ceramic dielectric and the carrier plate 503 and between the carrier plate 503 and the circuit board 502 may crack, thereby directly affecting the use of the dielectric filter. On the other hand, the use of a carrier plate can significantly increase the cost, especially in the case of large-scale array deployment of dielectric filters.

Furthermore, as for the distance between the ceramic dielectric and the circuit board 502, the height of the carrier plate 503 is about 1mm due to the presence of the carrier plate 503. In addition, at least 0.1mm of solder paste is required between the ceramic dielectric and the carrier 503, and at least 0.3mm of solder paste is required between the carrier 503 and the circuit board 502, so as to meet the requirement of soldering strength. This results in the dielectric filter being at least about 1.2mm to 1.5mm away from the circuit board, which hinders miniaturization and weight reduction of the electronic equipment.

To address or at least partially address the above and other potential problems of conventional dielectric filters, embodiments of the present disclosure provide a dielectric filter 100. Fig. 2 shows a schematic cross-sectional view of a dielectric filter 100 according to an embodiment of the present disclosure mounted on a circuit board 201. As shown in fig. 2, in general, a dielectric filter 100 according to an embodiment of the present disclosure includes a filtering part 101 and a plurality of input-output pins 102. The filter part 101 is made of a high dielectric material such as ceramic, and may have any suitable shape, including, but not limited to, a cylindrical shape, a square shape, a cylindrical block shape, and the like, for example. The size of the filter portion 101 may be such that the operating band of the dielectric filter 100 is around one medium wavelength in the medium. The filter portion 101 includes a plurality of coupling holes 1011 and ground ports 1012 provided at predetermined positions of the interface surface.

The input/output pin 102 includes a coupling part 1021 and an interface part 1022 which are respectively disposed at both ends. Unlike the conventional solution, the coupling portion 1021 of the input/output pin 102 of the dielectric filter 100 according to the embodiment of the disclosure is press-fitted into the corresponding coupling hole 1011 of the filter portion 101 by interference fit. Since the coupling portion 1021 is press-fitted into the coupling hole 1011 in an interference fit manner, a certain tolerance absorption capacity exists between the input/output pin 102 and the filter portion 101, and a small deformation and a thermal stress caused by a mismatch of thermal expansion coefficients between the coupling portion 1021 and the input/output pin 102 can be absorbed, so that the reliability of the connection between the coupling portion 1021 and the input/output pin 102 is effectively enhanced, and the reliability of the dielectric filter 100 is further improved.

In this way, it may no longer be necessary to use a carrier board for indirectly mounting the filter part 101 to the circuit board 201 of the electronic device. Specifically, the ground port 1012 and the coupling portion 1021 of the input/output pin 102 may be directly coupled to corresponding locations on the circuit board 201 through the solder 103. On the one hand, this can effectively reduce the distance H2 between the interface surface of the filter portion 101 and the circuit board 201. For example, in some embodiments, the height of the solder 103 between the ground port 1012 of the filtering portion 101 and the circuit board 201 may be between 0.15mm and 0.5mm, so that the distance H2 between the interface surface and the circuit board 201 is also greatly reduced, and can be controlled to be between 0.15mm and 0.5mm or less. For example, in some embodiments, the distance H2 between the interface surface and the circuit board 201 may be on the order of 0.25mm, thereby effectively facilitating miniaturization and weight reduction of the electronic device. On the other hand, the carrier plate is not used any more, so that the cost is obviously reduced.

For some cases where the connection performance is not required to be high, SAC305 solder paste or multi-component solder paste may be used as the solder 103 between the filter portion 101 and the circuit board 201. SAC305 solder paste represents a solder paste having a tin content of 96.5%, a silver content of 3% and a copper content of 0.5%. The multi-element solder paste is a solder paste containing a plurality of alloy elements. In some embodiments, in order to improve the reliability of soldering between the filter portion 101 and the circuit board 201, the solder 103 used may contain elements of bismuth and nickel in addition to elements of tin, copper, and silver. For example, in some embodiments, the bismuth is present in an amount between 2.5% and 3.5% by weight and/or the nickel is present in an amount between 0.04% and 0.06% by weight. In this way, a mesh structure can be formed in the solder 103 after welding, so that the alloy strength at the welding point is improved in a dispersion strengthening and solid solution strengthening manner, and thus the problems of welding point cracking and the like are further effectively solved, so that the high-reliability board-level connection of the dielectric filter 100 is realized, and the application requirements of an energy-saving and emission-reducing scene are met.

For a connection between the coupling portion 1021 and the coupling aperture 1011, in some embodiments, the coupling aperture 1011 may have a size slightly smaller than the corresponding coupling portion 1021, thereby facilitating an interference fit therebetween. For example, in some embodiments, the coupling aperture 1011 may be a circular aperture and have a diameter of about 1.2 mm. The coupling part 1021 may have a corresponding cylindrical shape and have a diameter slightly larger than the size of the coupling hole 1011, for example, about 1.24mm to 1.3 mm. To facilitate insertion of the coupling part 1021 into the coupling hole 1011 during assembly, in some embodiments, the coupling part 1021 may have a chamfer, for example, a round chamfer or a beveled chamfer. The chamfer facilitates alignment of the coupling part 1021 with the coupling hole 1011 during assembly of the coupling part 1021 to the coupling hole 1011, thereby facilitating assembly. In some alternative embodiments, the coupling portion 1021 may also have a reduced dimension in a direction from the interface portion 1022 to the coupling portion 1021, and the maximum dimension is greater than the dimension of the coupling hole 1011, thereby facilitating insertion of the coupling portion 1021 into the coupling hole 1011 while also promoting a tight fit therebetween.

Further, in some embodiments, the height H1 of the coupling portion 1021 in the insertion direction may be between 0.7mm and 1.4 mm. For example, in some embodiments, the height H1 of the coupling portion 1021 in the insertion direction may be on the order of 0.8mm or 1.2 mm. That is, the dimension of the portion of the input/output pin 102 located in the coupling hole 1011 in the insertion direction is about 0.8mm or 1.2 mm. In this way, a reliable connection between the input-output pin 102 and the filter section 101 can be ensured.

In some embodiments, the coupling portion 1021 may take a multi-lobed configuration. Fig. 3(a), (b) and (c) show that the coupling part 1021 may have a two-lobe structure, a three-lobe structure and a four-lobe structure, respectively, in which each lobe corresponds to one insert member 1023. That is, the coupling part 1021 may include a plurality of insert members 1023 arranged uniformly in the circumferential direction and spaced apart by a predetermined distance. The predetermined distance between these plug members 1023 may be between 0.3mm and 0.4mm, for example, may be around 0.35 mm. Due to the plurality of insert members 1023 spaced apart by the predetermined distance, deformation of the coupling part 1021 upon insertion into the coupling hole 1011 is further allowed, so that stress due to mismatch of thermal expansion coefficients can be further absorbed to further ensure reliability of connection.

In some embodiments, the plurality of plug members 1023 may be manufactured in a slotted manner after the cylindrical or frusto-conical coupling portion 1021 is formed. For example, in manufacturing the two-lobe structure as shown in fig. 3(a), the structure of the two insert members 1023 may be implemented by being laterally slotted after the cylindrical coupling part 1021 is formed. Similarly, in manufacturing the three-lobed structure as shown in fig. 3(b), the structure of the three plug members 1023 may be realized by opening three over-center grooves after the columnar coupling portion 1021 is formed. In manufacturing the four-lobed structure as shown in fig. 3(c), the structure of the four insertion members 1023 may be realized by opening two over-center crossing grooves after the columnar coupling portion 1021 is formed.

It should be understood that the embodiments regarding the number and manufacturing manner of the plurality of the plugging members 1023 described above are merely illustrative and are not intended to limit the scope of the present disclosure. Any other suitable number or intended manner is also possible. For example, in some embodiments, the plurality of plug members 1023 may also be manufactured by die-casting or the like.

Further, each of the plug members 1023 shown in fig. 3 has a cross section substantially in the shape of a sector having a certain angular range. It should be understood that this is illustrative only and is not intended to limit the scope of the present disclosure. In alternative embodiments, the insert member 1023 may also take an arc shape with a certain radial thickness or any other suitable shape.

To ensure that the input/output pin 102 can be inserted into the coupling hole 1011 with the effective length mentioned above, in some embodiments, the input/output pin 102 may further include a stopping portion 1024 disposed between the coupling portion 1021 and the interface portion 1022. The stopper 1024 has a diameter larger than the diameter of the coupling hole 1011 and the diameter of the coupling part 1021, so that it can be stopped outside the interface surface of the filter part 101, and thereby ensure the length of the input/output pin 102 inserted into the coupling hole 1011, and thereby further improve the reliability of the dielectric filter 100.

In some embodiments, the input-output pin 102 may be made of one of the following materials: phosphor bronze, brass, free-cutting iron, and stainless steel. Phosphor bronze is an alloy of copper, tin and phosphor, has hard texture, and can be made into springs. Phosphorus is used to purify copper and bronze (Cu-Sn) from oxygen, so that a small amount of phosphorus remains, and a copper alloy to which 1% of phosphorus is added for improving mechanical properties (toughness, elasticity, wear resistance, corrosion resistance) and the like is obtained. The wear-resistant part is mainly used as a wear-resistant part, an elastic element, a computer connector, a mobile phone connector, a high-tech connector and the like. Brass is an alloy composed of copper and zinc, and brass composed of copper and zinc is called general brass, and if it is a plurality of alloys composed of two or more elements, it is called special brass. Free-cutting iron, also called "free-cutting steel", is an alloy steel with a certain amount of one or more free-cutting elements such as sulfur, phosphorus, lead, calcium, selenium, tellurium, etc. added to the steel to improve its performance.

In some embodiments, the surface of the input/output pin 102 may be treated with silver plating to further improve the electrical connection performance. Embodiments of the present application are not so limited. For example, in some alternative embodiments, the surface of the input/output pin 102 may also be plated with gold or high temperature tin. In this way, the flexibility of surface treatment of the input-output pins 102 is improved while ensuring the electrical connection performance.

The embodiment of the application also provides the electronic equipment. The electronic device may be, for example, a base station device. The electronic device comprises a circuit board 201 and a dielectric filter 100 according to the preamble. The electronic device may comprise any other suitable devices or units, such as an antenna array, a radiator power distribution network, a coupling calibration network device, etc., among others. The circuit board 201 has solder paste printed thereon at predetermined positions with a predetermined thickness. The dielectric filter 100 is directly soldered at a predetermined position of the circuit board 201 by solder paste. By using the low-cost and high-reliability dielectric filter 100 mentioned hereinbefore, the reliability of the electronic device according to the embodiment of the present application can also be higher and can be further miniaturized and light-weighted.

Embodiments of the present application also provide a method of assembling the dielectric filter 100 onto a circuit board 201 of an electronic device. Fig. 4 shows a flow diagram of the method, and fig. 5 shows a schematic diagram of the dielectric filter 100 and the circuit board 201 during the assembly process. As shown in fig. 4, in the method, at 410, a plurality of input-output pins 102 are provided, each input-output pin 102 including a coupling portion 1021 and an interfacing portion 1022. The input-output pins 102 may be manufactured by the aforementioned method. At 420, the plurality of input and output pins 102 are press-fitted into the coupling holes 1011 of the filtering part 101 by interference fit, as shown in fig. 5. Meanwhile, in some embodiments, the solder 103 having a predetermined thickness may also be printed at a predetermined position of the circuit board 201 to which the dielectric filter 100 is to be mounted. The solder 103 may have different thicknesses at positions corresponding to the ground port 1012 and the interface part 1022 of the filter part 101 to accommodate a difference in height between the input and output pins 102 and the interface surface of the filter part 101, as shown in fig. 5. The printing of different heights of the solder 103 may be achieved by screen printing or the like. Next, at 430, the ground port 1012 and the interface part 1022 are coupled at a predetermined position of the circuit board 201 by a predetermined solder 103. In this way, it is realized to assemble the dielectric filter 100 according to the embodiment of the present application in a surface mount manner.

Because the coupling portion 1021 of the input/output pin 102 is press-fitted into the coupling hole 1011 in an interference fit manner, a certain tolerance absorption capacity exists between the input/output pin 102 and the filter portion 101, and a small deformation and a thermal stress caused by a mismatch of thermal expansion coefficients between the coupling portion 1021 and the input/output pin 102 can be absorbed, so that the reliability of the connection between the coupling portion 1021 and the input/output pin 102 is effectively enhanced, and the reliability of the dielectric filter 100 is further improved. The electronic apparatus assembled in this way can also have higher reliability, and can be further miniaturized and light-weighted.

Of course, it should be understood that the above-described method of assembling the dielectric filter 100 is merely illustrative and is not intended to limit the scope of the present disclosure. The dielectric filter 100 according to the embodiment of the present application may be mounted on the circuit board 201 by any suitable means. For example, in some embodiments, the method is described only in relation to the present application, and the assembly of the dielectric filter 100 to the circuit board 201 may include other necessary steps, including, but not limited to, reflow soldering, cleaning, etc.

Although the subject matter has been described in language specific to structural features and/or methodological acts, it is to be understood that the subject matter defined in the appended claims is not necessarily limited to the specific features or acts described above. Rather, the specific features and acts described above are disclosed as example forms of implementing the claims.

Claims

1. A dielectric filter comprising:

a filter portion (101) made of a high dielectric material and having a plurality of coupling holes (1011) provided at predetermined positions of an interface surface and a ground port (1012); and

a plurality of input/output pins (102) each including a coupling portion (1021) and an interface portion (1022), the coupling portion (1021) being press-fitted into a corresponding coupling hole (1011) by interference fit,

wherein the ground port (1012) and the interface portion (1022) are coupled to a circuit board (201) of an electronic device (200) by solder (103).

2. The dielectric filter according to claim 1, wherein the coupling portion (1021) comprises at least two plug-in members (1023) arranged circumferentially uniformly and spaced apart by a predetermined distance, the plug-in members (1023) being adapted to be at least partially deformed during insertion into the coupling hole (1011).

3. The dielectric filter according to claim 1, wherein a height (H1) of the coupling section (1021) in the insertion direction is between 0.7mm and 1.4 mm.

4. The dielectric filter of claim 1, wherein the coupling section (1021) is chamfered at an end.

5. The dielectric filter according to any of claims 1-4, wherein the material composition of the solder (103) comprises tin, silver, copper, bismuth and nickel.

6. The dielectric filter of claim 5, wherein the bismuth content is between 2.5% and 3.5% by weight, and/or

The weight percentage of the content of the nickel is between 0.04 and 0.06 percent.

7. The dielectric filter of any of claims 1-4 and 6, wherein the input-output pin (102) further comprises:

a stopper part (1024) disposed between the coupling part (1021) and the interface part (1022), and a size of the stopper part (1024) is larger than a size of the coupling hole (1011).

8. The dielectric filter according to any of claims 1-4 and 6, wherein the interface surface is at a distance (H2) of between 0.15mm and 0.5mm from the circuit board (201).

9. The dielectric filter of any of claims 1-4 and 6, wherein the input-output pin (102) is made of one of the following materials: phosphor bronze, brass, free-cutting iron, and stainless steel.

10. The dielectric filter of any of claims 1-4 and 6, wherein a surface of the input-output pin (102) is treated with one of: silver plating, nickel and gold plating and high-temperature tin plating.

11. The dielectric filter of any of claims 1-4 and 6, wherein the high dielectric material comprises a ceramic.

12. An electronic device, comprising:

a circuit board including solder (103) having a predetermined thickness arranged at a predetermined position; and

the dielectric filter according to any of claims 1-11, arranged at the predetermined position of the circuit board via the solder (103).

13. The electronic device of claim 12, wherein the predetermined thickness of the solder (103) is between 0.15mm and 0.5 mm.

14. A method of assembling a dielectric filter onto an electronic device, comprising:

providing a plurality of input/output pins (102), each of which comprises a coupling part (1021) and an interface part (1022);

press-fitting the coupling parts (1021) of the plurality of input/output pins (102) into the coupling holes (1011) of the filter part (101) by means of interference fit;

coupling the ground port (1012) and the interface portion (1022) to a circuit board of an electronic device via solder (103).

15. The method of claim 14, wherein coupling the ground port (1012) and the interface portion (1022) to a circuit board of an electronic device with solder (103) comprises:

printing the solder (103) with a predetermined thickness at a predetermined position on a circuit board;

disposing the ground port (1012) and the interface portion (1022) at the predetermined position via the solder (103) by surface mounting.