WO2023160549A1

WO2023160549A1 - Dielectric filter and electronic device

Info

Publication number: WO2023160549A1
Application number: PCT/CN2023/077446
Authority: WO
Inventors: 毛积闯; 黄晓俊; 冒晨阳
Original assignee: 华为技术有限公司
Priority date: 2022-02-28
Filing date: 2023-02-21
Publication date: 2023-08-31
Also published as: CN114464971A

Abstract

Provided in the embodiments of the present application are a dielectric filter and an electronic device. The dielectric filter comprises: a filtering portion, which is made of a high-dielectric material and has a plurality of coupling holes and a grounding port that are provided at predetermined positions of an interface surface; and a plurality of input/output pins, each of which comprises a coupling portion and an interface portion, wherein the coupling portion is press-fitted into a corresponding coupling hole by means of an interference fit, and the grounding port and the interface portion are coupled to a circuit board of an electronic device by means of solder. The input/output pins are press-fitted into the coupling holes by means of an interference fit, such that it is no longer necessary to use a carrier plate to indirectly assemble the filtering portion onto the circuit board of the electronic device, thereby effectively promoting the miniaturization and weight lightening of the electronic device, and making it possible to further reduce costs.

Description

Dielectric Filters and Electronics

technical field

Embodiments of the present application generally relate to the field of filters. More specifically, the embodiments of the present application relate to a dielectric filter and electronic equipment including the dielectric filter.

Background technique

A filter is a frequency-selective device that allows specific frequency components in a signal to pass while greatly attenuating other frequency components. Utilizing this frequency selection function of the filter, it is possible to filter out interference noise or perform spectrum analysis. There are many types of filters, and different types of filters have different frequency ranges and occasions. Dielectric filters are formed by coupling between dielectric resonators. Dielectric resonator filters have high Q value, low insertion loss, small size and light weight, and are widely used in wireless base stations, satellite communications, navigation systems, electronic countermeasures and other systems.

A dielectric filter is a filter using a dielectric resonator. The dielectric resonator is formed by repeated total reflection of electromagnetic waves inside the medium. Because the wavelength of the electromagnetic wave can be shortened when propagating in a material with a high dielectric constant, it is precisely this feature that can be used to form a microwave resonator. Dielectric resonators can be made of ceramics. Therefore, the dielectric filter can be miniaturized compared with conventional cavity resonators.

With the development of 5G technology, ceramic dielectric filters are widely used in multiple-input multiple-output (MIMO) base station platforms. The existing dielectric filter board-level connection technology uses the welding method with a carrier board to realize the connection of electrical performance. However, due to the large thermal expansion coefficient mismatch between the ceramic dielectric and the circuit board during the application process, the board-level application of the filter Reliability problems are becoming more and more prominent. The main problem is that the solder joints between the pins of the dielectric filter and the ceramic dielectric, and the ceramic dielectric and the carrier board are cracked in temperature cycles. In addition, the cost of circuit board and surface mount technology accounts for as high as 25%, and the product line has a strong demand for cost reduction.

Contents of the invention

Embodiments of the present application provide a dielectric filter and related electronic equipment that can effectively enhance reliability and promote miniaturization and weight reduction of electronic equipment.

In a first aspect of the present application, a dielectric filter is provided. The dielectric filter includes a filter part made of a high dielectric material, and has a plurality of coupling holes and ground ports arranged at predetermined positions on the interface surface; and a plurality of input and output pins, each including a coupling part and an interface part , the coupling portion is press-fitted into the corresponding coupling hole through interference fit, wherein the ground port and the interface portion are coupled to the circuit board of the electronic device through solder.

Since the coupling part is press-fitted into the coupling hole in the form of interference fit, there is a certain tolerance absorption capacity between the input and output pins and the filter part, which can absorb the thermal expansion coefficient mismatch between the coupling part and the input and output pins. The resulting micro deformation and thermal stress effectively enhance the reliability of the connection between the coupling part and the input and output pins, thereby improving the reliability of the dielectric filter. In this way, it is no longer necessary to use a carrier board to indirectly assemble the filter part on the circuit board of the electronic device, thereby effectively promoting the miniaturization and weight reduction of the electronic device, and further reducing the cost.

In one implementation manner, the coupling portion includes at least two plug members uniformly arranged in the circumferential direction and spaced apart by a predetermined distance, and the plug members are adapted to be at least partially inserted into the coupling hole out of shape. In this way, it is possible to further facilitate the insertion of the coupling part into the coupling hole in an interference fit manner, and further absorb the slight deformation and thermal stress caused by the thermal expansion coefficient mismatch between the coupling part and the input and output pins, thereby further Effectively enhance coupling section and input Reliability of connections between output pins.

In an implementation manner, the height of the coupling portion in the insertion direction is between 0.7 mm and 1.4 mm. This arrangement can effectively ensure the reliability of the coupling between the input and output pins and the filtering part.

In one implementation, the coupling portion is chamfered at the ends. This arrangement facilitates the alignment of the input and output pins when inserted into the coupling hole, and thus facilitates the coupling between the two.

In one implementation, the material composition of the solder includes tin, silver, copper, bismuth and nickel. By adding bismuth and nickel elements on the basis of solder paste, a network structure can be formed in the solder after soldering, thereby improving the alloy strength at the solder joint by means of dispersion strengthening and solid solution strengthening, and thus further effectively solving the problem. Solder joint cracking and other problems, so as to realize the high-reliability board-level connection of the dielectric filter, so as to meet the application requirements of energy-saving and emission-reduction scenarios.

In an implementation manner, the content of bismuth is between 2.5% and 3.5% by weight, and/or the content of nickel is between 0.04% and 0.06% by weight. By controlling the amounts of bismuth and nickel, it is possible to further precisely improve connection performance, thereby improving reliability.

In an implementation manner, the input and output pins further include a stopper arranged between the coupling part and the interface part, and a size of the stopper is larger than a size of the coupling hole. In this way, it is possible to ensure the length of the coupling portion inserted into the coupling hole in an effective and simple manner, thereby reducing assembly difficulty while ensuring reliability.

In an implementation manner, the distance between the interface surface and the circuit board is between 0.15 mm and 0.5 mm. The significantly reduced distance between the interface surface and the circuit board further contributes to the miniaturization and weight reduction of electronic equipment.

In one implementation, the input and output pins are made of one of the following materials: phosphor bronze, brass, free-cutting iron, and stainless steel. In this way, the flexibility of manufacturing the input and output pins can be improved.

In one implementation, the surfaces of the input and output pins are treated with one of the following: silver plating, nickel gold plating, and high temperature tin plating.

In one implementation, the high dielectric material includes ceramic. Using ceramics as the material of the filter part can promote the size of the filter part to be smaller, and further promote the miniaturization of electronic equipment.

According to the second aspect of the present application, an electronic device is provided. The electronic device includes a circuit board, including solder having a predetermined thickness arranged at a predetermined position; and the dielectric filter according to the first aspect above, arranged at the predetermined position of the circuit board via the solder place. By using the dielectric filter according to the first aspect of the present application, the reliability of electronic equipment can be effectively improved, and the miniaturization, weight reduction and low cost of electronic equipment can be promoted.

In an implementation manner, the predetermined thickness of the solder is between 0.15 mm and 0.5 mm.

According to a third aspect of the present application, a method for assembling a dielectric filter on an electronic device is provided. The method includes providing a plurality of input and output pins, each including a coupling part and an interface part; press-fitting the coupling parts of the plurality of input and output pins into the coupling hole of the filter part through an interference fit; The ground port and the interface part are coupled to the circuit board of the electronic device through solder.

In one implementation manner, coupling the ground port and the interface portion to the circuit board of the electronic device through solder includes printing the solder with a predetermined thickness at a predetermined position on the circuit board; A ground port and the interface portion are arranged at the predetermined position via the solder by surface mounting.

Description of drawings

The above and other features, advantages and aspects of the various embodiments of the present application will become more apparent with reference to the following detailed description when taken in conjunction with the accompanying drawings. In the drawings, the same or similar reference numerals indicate the same or similar elements, wherein:

Fig. 1 shows a simplified cross-sectional view of a conventional dielectric filter assembled on a circuit board;

Fig. 2 shows a simplified cross-sectional view of a dielectric filter assembled on a circuit board according to an embodiment of the present application;

FIG. 3 shows a perspective view of input and output pins according to different embodiments of the present application;

FIG. 4 shows a flow chart of a method for assembling a dielectric filter onto a circuit board of an electronic device according to an embodiment of the present application; and

FIG. 5 shows simplified cross-sectional views of different stages of assembling a dielectric filter on a circuit board according to an embodiment of the present application.

Detailed ways

Embodiments of the present application will be described in more detail below with reference to the accompanying drawings. Although certain embodiments of the present application are shown in the drawings, it should be understood that the application may be embodied in various forms and should not be construed as limited to the embodiments set forth herein; A more thorough and complete understanding of the application. It should be understood that the drawings and embodiments of the present application are for exemplary purposes only, and are not intended to limit the protection scope of the present application.

In the description of the embodiments of the present application, the term "comprising" and its similar expressions should be interpreted as an open inclusion, that is, "including but not limited to". The term "based on" should be understood as "based at least in part on". The term "one embodiment" or "the embodiment" should be read as "at least one embodiment". The terms "first", "second", etc. may refer to different or the same object. Other definitions, both express and implied, may also be included below.

It should be understood that in this application, "coupled" can be understood as direct coupling and/or indirect coupling. Direct coupling can also be called "electrical connection", which is understood as the physical contact and electrical conduction of components; it can also be understood as the connection between different components in the circuit structure through printed circuit board (PCB) copper foil or wires, etc. The form of connection between physical lines that can transmit electrical signals; "indirect coupling" can be understood as the electrical conduction of two conductors through a space/non-contact method. In an embodiment, the indirect coupling may also be called capacitive coupling, for example, the equivalent capacitance is formed through the coupling between the gaps between two conductive elements to realize signal transmission.

The technical solution provided by this application is applicable to electronic equipment using one or more of the following communication technologies: Bluetooth (blue-tooth, BT) communication technology, global positioning system (global positioning system, GPS) communication technology, wireless fidelity (wireless Fidelity, WiFi) communication technology, global system for mobile communications (GSM) communication technology, wideband code division multiple access (WCDMA) communication technology, long term evolution (LTE) communication technology, 5G communication technology and other communication technologies in the future. The electronic equipment in the embodiment of this application may include equipment directly connected to the operator's network at the user end, including but not limited to: base station equipment, telephones, wireless routers, firewalls, computers, optical modems, 4G-to-WiFi wireless routers, etc. The electronic devices in the embodiments of the present application may also include mobile phones, tablet computers, notebook computers, smart homes, smart bracelets, smart watches, smart helmets, smart glasses, and the like. The electronic device can also be a handheld device with wireless communication function, a computing device or other processing device connected to a wireless modem, a vehicle device, an electronic device in a 5G network, or a public land mobile network (PLMN) that will evolve in the future. ) in the electronic equipment, etc., which are not limited in this embodiment of the present application.

With the continuous evolution and development of 5G technology, base station antennas, as the key technology for making 5G large-scale applications, are facing new technological adjustments and development trends. According to different application scenarios, 5G base station antennas will exist in two forms: passive base station antennas and active antenna units. Active antennas based on Massive MIMO technology can significantly improve the spectral efficiency of massive MIMO systems due to their more accurate and higher degree of freedom beamforming capabilities, thereby increasing network capacity , will be a typical product of the antenna in the 5G era. The sharp increase in the number of radio frequency channels and the activeization not only put forward higher design requirements for the size, weight, power consumption, and cost of 5G base station antennas. At present, in order to realize the miniaturization, light weight and integration of the base station antenna, the technology of integrating the dielectric filter with the antenna is proposed in the traditional solution.

The dielectric filter is welded on the circuit board of the electronic device by welding. Due to the large thermal expansion coefficient mismatch between the ceramic dielectric used in the dielectric filter and the circuit board, at present, the traditional dielectric filter usually needs to use the carrier board technology to indirectly solder the ceramic dielectric to the circuit board. A carrier is a printed circuit board that generally has a coefficient of thermal expansion between that of the ceramic dielectric and the circuit board. FIG. 1 shows a schematic cross-sectional view of a traditional dielectric filter welded to a circuit board.

As shown in FIG. 1 , in a conventional solution, a dielectric filter includes a filter part 501 and a lead part 504 made of ceramics. The filter unit 501 includes an input/output interface unit and a ground unit. The pin portion 504 and the input/output interface portion are soldered and coupled together by solder 505 for inputting and outputting signals. The ground part is transitionally connected to the circuit board 502 through the carrier board 503 . Specifically, the grounding part is welded on the carrier board through solder paste 506 to establish a connection between the two, and then the carrier board is further soldered to the circuit board 502 through solder paste, so as to solve the problem of the ceramic medium and the circuit. The problem of thermal expansion coefficient mismatch between plates 502 .

However, this approach also has various problems. On the one hand, after all, they are composed of different materials, and there is also a thermal expansion coefficient mismatch between the ceramic dielectric and the carrier 503 and between the carrier 503 and the circuit board 502 . During the temperature cycle test or long-term use, there is still a greater possibility of cracking of the solder paste between the ceramic dielectric and the carrier 503 and between the carrier 503 and the circuit board 502, which directly affects the performance of the dielectric filter. use. On the other hand, the use of a carrier board will significantly increase the cost, especially in the case of large-scale array deployment of dielectric filters.

In addition, as for the distance between the ceramic medium and the circuit board 502 , since the carrier 503 exists in both, the height of the carrier 503 is about 1 mm. In addition, a solder paste with a thickness of at least 0.1 mm is required between the ceramic medium and the carrier board 503 , and a solder paste with a thickness of at least 0.3 mm is required between the carrier board 503 and the circuit board 502 to meet the requirements of soldering strength. This results in a distance of at least about 1.2 mm to 1.5 mm between the dielectric filter and the circuit board, which hinders the miniaturization and weight reduction of electronic equipment.

In order to solve or at least partly solve the above-mentioned or other potential problems of conventional dielectric filters, an embodiment of the present disclosure provides a dielectric filter 100 . FIG. 2 shows a schematic cross-sectional view of a dielectric filter 100 assembled on a circuit board 201 according to an embodiment of the present disclosure. As shown in FIG. 2 , generally, a dielectric filter 100 according to an embodiment of the present disclosure includes a filter part 101 and a plurality of input and output pins 102 . The filter part 101 is made of a high dielectric material such as ceramics, and may have any suitable shape, including but not limited to a cylinder, a square, a cylindrical block, and the like. The size of the filter part 101 may be about one medium wavelength in the medium in which the working frequency band of the dielectric filter 100 is. The filter part 101 includes a plurality of coupling holes 1011 and a ground port 1012 provided at predetermined positions on the interface surface.

The input and output pin 102 includes a coupling part 1021 and an interface part 1022 respectively arranged at both ends. Different from the traditional technical solution, the coupling part 1021 of the input and output pin 102 of the dielectric filter 100 according to the embodiment of the present disclosure is press-fitted into the corresponding coupling hole 1011 of the filter part 101 by way of interference fit. Since the coupling part 1021 is press-fitted into the coupling hole 1011 in the form of an interference fit, there is a certain tolerance absorption capacity between the input and output pins 102 and the filter part 101, which can absorb the difference between the coupling part 1021 and the input and output pins 102. The slight deformation and thermal stress caused by the mismatch of thermal expansion coefficients between them can effectively enhance the reliability of the connection between the coupling part 1021 and the input and output pins 102 , thereby improving the reliability of the dielectric filter 100 .

In this way, it is no longer necessary to use a carrier board to indirectly mount the filter part 101 on the circuit board 201 of the electronic device. Specifically, the ground port 1012 and the coupling portion 1021 of the I/O pin 102 can be directly coupled to corresponding positions on the circuit board 201 through the solder 103 . On the one hand, this can effectively reduce the distance H2 between the interface surface of the filter unit 101 and the circuit board 201 . For example, in some embodiments, the height of the solder 103 between the ground port 1012 of the filter part 101 and the circuit board 201 can be between 0.15 mm and 0.5 mm, so that the interface surface and the connection between the circuit board 201 The distance H2 is also greatly reduced, and can be controlled within a range of 0.15 mm to 0.5 mm or lower. For example, in some embodiments, the distance H2 between the interface surface and the circuit board 201 may be about 0.25mm, thereby effectively promoting the miniaturization and weight reduction of electronic devices. On the other hand, the cost is significantly reduced due to the elimination of the carrier board.

For occasions where the connection performance is not very high, the solder 103 between the filter part 101 and the circuit board 201 can be SAC305 solder paste or multi-component solder paste. SAC305 solder paste refers to a solder paste with a tin content of 96.5%, a silver content of 3% and a copper content of 0.5%. Multi-component solder paste is a solder paste that contains multiple alloying elements. In some embodiments, in order to improve the reliability of soldering between the filter part 101 and the circuit board 201 , besides tin, copper and silver elements, the solder 103 used may also contain bismuth and nickel elements. For example, in some embodiments, the content of bismuth is between 2.5% and 3.5% by weight and/or the content of nickel is between 0.04% and 0.06% by weight. In this way, a network structure can be formed in the solder 103 after welding, thereby improving the strength of the alloy at the solder joint by means of dispersion strengthening and solid solution strengthening, and thereby further effectively solving problems such as solder joint cracking, thereby realizing The high-reliability board-level connection of the dielectric filter 100 meets the application requirements of energy saving and emission reduction scenarios.

Regarding the connection between the coupling portion 1021 and the coupling hole 1011 , in some embodiments, the coupling hole 1011 may have a size slightly smaller than that of the corresponding coupling portion 1021 so as to facilitate an interference fit therebetween. For example, in some embodiments, the coupling hole 1011 may be a circular hole and have a diameter of about 1.2 mm. The coupling part 1021 may have a corresponding cylindrical shape, and have a size slightly larger than the coupling hole 1011, for example, a diameter of about 1.24mm˜1.3mm. In order to facilitate the insertion of the coupling part 1021 into the coupling hole 1011 during the assembly process, in some embodiments, the coupling part 1021 may have chamfers, for example, round chamfers or oblique chamfers. The chamfer facilitates the alignment of the coupling portion 1021 and the coupling hole 1011 during the assembly of the coupling portion 1021 into the coupling hole 1011 , thereby facilitating assembly. In some alternative embodiments, the coupling part 1021 may also have a reduced size along the direction from the interface part 1022 to the coupling part 1021, and the maximum size is greater than the size of the coupling hole 1011, thereby facilitating the insertion of the coupling part 1021 into the coupling hole 1011. It also promotes a tight fit between the two.

In addition, in some embodiments, the height H1 of the coupling portion 1021 in the insertion direction may be between 0.7mm˜1.4mm. For example, in some embodiments, the height H1 of the coupling portion 1021 in the insertion direction may be around 0.8mm or 1.2mm. That is to say, the dimension of the part of the input-output pin 102 located in the coupling hole 1011 in the insertion direction is about 0.8mm or 1.2mm. In this way, a reliable connection between the input and output pins 102 and the filter section 101 can be ensured.

In some embodiments, the coupling part 1021 may adopt a multi-lobe structure. (a), (b) and (c) in FIG. 3 respectively show that the coupling part 1021 can have a two-lobed structure, a three-lobed structure and a four-lobed structure, wherein each petal corresponds to a plug member 1023 . That is, the coupling part 1021 may include a plurality of plug members 1023 uniformly arranged in a circumferential direction and spaced apart by a predetermined distance. The predetermined distance between these inserting members 1023 may be between 0.3mm˜0.4mm, for example, may be around 0.35mm. Due to the plurality of plug members 1023 spaced apart by a predetermined distance, the deformation of the coupling part 1021 when inserted into the coupling hole 1011 is further allowed, so that the stress caused by the mismatch of thermal expansion coefficients can be further absorbed to further ensure the reliability of the connection sex.

In some embodiments, the plurality of plug members 1023 can be manufactured by slotting after forming the cylindrical or frusto-conical coupling portion 1021 . For example, when manufacturing the two-lobed structure as shown in FIG. 3( a ), the structure of two plug members 1023 can be realized by laterally slotting after forming the columnar coupling portion 1021 . Similarly, when manufacturing the three-lobe structure as shown in FIG. 3( b ), the structure of three inserting members 1023 can be realized by opening three slots through the center after forming the columnar coupling portion 1021 . When manufacturing the four-lobe structure as shown in FIG. 3( c ), the structure of four plug-in members 1023 can be realized by opening two intersecting grooves through the center after forming the columnar coupling portion 1021 .

It should be understood that, the above-mentioned embodiments regarding the number and manufacturing method of the plurality of inserting members 1023 are only illustrative, and are not intended to limit the protection scope of the present disclosure. Any other suitable number or aim is also possible. For example, In some embodiments, the plurality of inserting members 1023 can also be manufactured by means of mold manufacturing and the like.

In addition, the cross-section of each plug member 1023 shown in FIG. 3 is substantially fan-shaped with a certain range of angles. It should be understood that this is only illustrative and not intended to limit the protection scope of the present disclosure. In some alternative embodiments, the inserting member 1023 may also adopt an arc shape with a certain radial thickness or any other appropriate shape.

In order to ensure that the input and output pins 102 can be inserted into the coupling hole 1011 with the effective length mentioned above, in some embodiments, the input and output pins 102 may also include a stopper arranged between the coupling part 1021 and the interface part 1022 Section 1024. The diameter of the stopper part 1024 is larger than the diameter of the coupling hole 1011 and the diameter of the coupling part 1021, so that it can be stopped outside the interface surface of the filter part 101, thereby ensuring that the input and output pins 102 are inserted into the coupling hole 1011 length, and thus further improve the reliability of the dielectric filter 100.

In some embodiments, the input and output pins 102 can be made of one of the following materials: phosphor bronze, brass, free-cutting iron and stainless steel. Phosphor bronze is an alloy of copper, tin, and phosphorus. It is hard and can be used to make springs. A copper alloy in which 1% phosphorus is added to improve mechanical properties (toughness, elasticity, wear resistance, corrosion resistance) by removing oxygen from pure copper and bronze (Cu-Sn) with phosphorus and leaving a small amount of phosphorus. Mainly used as wear-resistant parts, elastic components, computer connectors, mobile phone connectors, high-tech industry connectors, etc. Brass is an alloy composed of copper and zinc. Brass composed of copper and zinc is called ordinary brass. If it is composed of two or more elements, it is called special brass. Free-cutting iron, also known as "free-cutting steel", is an alloy steel that adds a certain amount of one or more free-cutting elements such as sulfur, phosphorus, lead, calcium, selenium, and tellurium to steel to improve its performance. .

In some embodiments, the surfaces of the input and output pins 102 may be treated with silver plating to further improve electrical connection performance. However, the embodiments of the present application are not limited thereto. For example, in some alternative embodiments, the surface of the input and output pins 102 may also be treated with gold plating or high temperature tin plating. In this way, the flexibility of the surface treatment of the input and output pins 102 is improved while ensuring the electrical connection performance.

The embodiment of the present application also provides an electronic device. The electronic device may be, for example, a base station device. The electronic device includes a circuit board 201 and the dielectric filter 100 mentioned above. In addition, the electronic device may further include any other appropriate device or unit, such as an antenna array, a radiator power distribution network, a coupling calibration network device, and the like. Solder paste with a predetermined thickness is printed on the circuit board 201 at a predetermined position. The dielectric filter 100 is directly soldered at a predetermined position of the circuit board 201 by solder paste. By using the low-cost and high-reliability dielectric filter 100 mentioned above, the reliability of the electronic device according to the embodiment of the present application can also be higher and can be further miniaturized and lightened.

The embodiment of the present application also provides a method for assembling the dielectric filter 100 on the circuit board 201 of the electronic device. FIG. 4 shows a schematic flowchart of the method, and FIG. 5 shows a schematic diagram of the dielectric filter 100 and the circuit board 201 during the assembly process. As shown in FIG. 4 , in this method, at 410 , a plurality of input and output pins 102 are provided, and each input and output pin 102 includes a coupling part 1021 and an interface part 1022 . The input and output pins 102 can be manufactured by the methods mentioned above. At 420 , the plurality of input and output pins 102 are press-fitted into the coupling hole 1011 of the filter part 101 by way of interference fit, as shown in FIG. 5 . Meanwhile, in some embodiments, solder 103 with a predetermined thickness may also be printed on a predetermined position of the circuit board 201 where the dielectric filter 100 is to be assembled. The solder 103 may have different thicknesses at positions corresponding to the ground port 1012 and the interface portion 1022 of the filter unit 101 to accommodate height differences between the input and output pins 102 and the interface surface of the filter unit 101 , as shown in FIG. 5 . The printing of the solder 103 at different heights can be realized by screen printing or the like. Next, at 430 , the ground port 1012 and the interface part 1022 are coupled at predetermined positions of the circuit board 201 through the predetermined solder 103 . In this way, it is realized to assemble the dielectric filter 100 according to the embodiment of the present application in a surface mount manner.

Since the coupling part 1021 of the input and output pin 102 is press-fitted into the coupling hole 1011 in the form of an interference fit, there is a certain tolerance absorption capacity between the input and output pin 102 and the filter part 101, which can absorb the coupling part 1021 and The slight deformation and thermal stress caused by the thermal expansion coefficient mismatch between the input and output pins 102 effectively strengthen the coupling part 1021 and the reliability of the connection between the input and output pins 102, thereby improving the reliability of the dielectric filter 100. Electronic devices assembled in this way can also have higher reliability, and can be further miniaturized and lightened.

Of course, it should be understood that the above-mentioned assembling method of the dielectric filter 100 is only illustrative, and is not intended to limit the protection scope of the present disclosure. The dielectric filter 100 according to the embodiment of the present application can be assembled on the circuit board 201 by any suitable means. For example, in some embodiments, in addition to this, the method only describes the main steps related to the present application, and assembling the dielectric filter 100 on the circuit board 201 may also include other necessary steps, for example including but not limited to Reflow soldering, cleaning and other steps.

Although the subject matter has been described in language specific to structural features and/or methodological acts, it is to be understood that the subject matter defined in the appended claims is not necessarily limited to the specific features or acts described above. Rather, the specific features and acts described above are merely example forms of implementing the claims.

Claims

A dielectric filter, comprising:

The filter part (101) is made of a high dielectric material, and has a plurality of coupling holes (1011) and a ground port (1012) arranged at predetermined positions on the interface surface; and

A plurality of input and output pins (102), each including a coupling portion (1021) and an interface portion (1022), the coupling portion (1021) is press-fitted into a corresponding coupling hole (1011) by way of interference fit,

Wherein the ground port (1012) and the interface part (1022) are coupled to the circuit board (201) of the electronic device (200) through solder (103).
The dielectric filter according to claim 1, wherein the coupling part (1021) comprises at least two plug-in members (1023) uniformly arranged in the circumferential direction and spaced apart by a predetermined distance, the plug-in members (1023) adapted to be at least partially deformed during insertion into said coupling hole (1011).
The dielectric filter according to claim 1, wherein the height (H1) of the coupling part (1021) in the insertion direction is between 0.7 mm and 1.4 mm.
The dielectric filter according to claim 1, wherein the coupling portion (1021) is chamfered at an end.
The dielectric filter according to any one of claims 1-4, wherein the material components of the solder (103) include tin, silver, copper, bismuth and nickel.
The dielectric filter according to claim 5, wherein the weight percentage of the bismuth content is between 2.5% and 3.5%, and/or

The weight percentage of the nickel content is between 0.04% and 0.06%.
The dielectric filter according to any one of claims 1-4 and 6, wherein said input and output pin (102) also comprises:

The stop part (1024) is arranged between the coupling part (1021) and the interface part (1022), and the size of the stop part (1024) is larger than the size of the coupling hole (1011).
The dielectric filter according to any one of claims 1-4 and 6, wherein the distance (H2) between the interface surface and the circuit board (201) is between 0.15 mm and 0.5 mm.
The dielectric filter according to any one of claims 1-4 and 6, wherein the input and output pins (102) are made of one of the following materials: phosphor bronze, brass, free-cutting iron and stainless steel .
The dielectric filter according to any one of claims 1-4 and 6, wherein the surface of the input and output pins (102) is processed by one of the following: silver plating, nickel gold plating and gold plating High temperature tin treatment.
The dielectric filter according to any one of claims 1-4 and 6, wherein said high dielectric material comprises ceramics.
An electronic device comprising:

a circuit board comprising solder (103) having a predetermined thickness arranged at a predetermined position; and

The dielectric filter according to any one of claims 1-11, arranged at the predetermined position of the circuit board via the solder (103).
The electronic device according to claim 12, wherein the predetermined thickness of the solder (103) is between 0.15 mm and 0.5 mm.
A method of assembling a dielectric filter on an electronic device, comprising:

Provide a plurality of input and output pins (102), each including a coupling part (1021) and an interface part (1022);

Press-fit the coupling parts (1021) of the plurality of input and output pins (102) into the coupling holes (1011) of the filter part (101) by way of interference fit;

The ground port (1012) and the interface portion (1022) are coupled to a circuit board of an electronic device through solder (103).
The method according to claim 14, wherein coupling the ground port (1012) and the interface portion (1022) to a circuit board of an electronic device through solder (103) comprises:

printing said solder (103) having a predetermined thickness at a predetermined position on the circuit board;

The ground port (1012) and the interface part (1022) are arranged at the predetermined position via the solder (103) by surface mounting.