TWI419185B - Electronic parts and their wires, and the manufacturing methods thereof - Google Patents

Description

Electronic component and its lead, and the manufacturing method thereof Field of invention

The present invention relates to an electronic component and a wire used therefor, a method of manufacturing the same, and a method of manufacturing the electronic component using the wire. In particular, there is a capacitor comprising a sealing body having a through hole through which a wire is inserted.

Background of the invention

Fig. 17 is a cross-sectional view showing an aluminum electrolytic capacitor of an electronic component, Fig. 18 is a perspective view of a wire used for the aluminum electrolytic capacitor, and Fig. 19 is a sectional view of the wire.

As shown in Fig. 17, the aluminum electrolytic capacitor includes a capacitor element 6, which is a functional element, a lead wire 1, a casing 7, and a sealing body 8. The lead wire 1 is drawn from the capacitor element 6, and the bottomed cylindrical case 7 houses the capacitor element 6, and the sealing body 8 is provided with a through hole 8a through which the lead wire 1 is inserted. The sealing member 8 is disposed in the opening of the casing 7, and is extended by the extension processing portion 7a provided on the outer peripheral surface of the casing 7, thereby closing the opening of the casing 7.

As shown in Fig. 8, the lead wire 1 has a lead electrode 2 composed of an aluminum wire round bar, a cap 4, and a flat portion 2e. As shown in Fig. 19, the cap 4 covers the end portion 2a before the end of the lead electrode 2. The flat portion 2e is connected to the capacitor element 6. The cap 4 covering the front end portion 2a functions as a connection with the circuit board 10. The cap 4 is selected to use a material that is easy to weld.

As described above, the aluminum electrolytic capacitor is used to cover the front end portion 2a. The cap 4 serves as the wire 1 of the terminal structure. The shape of the joint portion between the distal end portion 2a and the terminal can be reduced as compared with the manner in which the linear terminal is melt-bonded directly to the distal end portion 2a. Therefore, the quality control is easy, the joint quality is stable, and the aluminum electrolytic capacitor with high reliability can be provided. Such an aluminum electrolytic capacitor is disclosed, for example, in Japanese Laid-Open Patent Publication No. Sho 63-178318.

However, in the conventional aluminum electrolytic capacitor, when the cap 4 is covered and fitted to the distal end portion 2a by a method such as press-fitting, the appearance of the cap 4 is often deformed, and burrs are generated at the end of the opening. Then, when the lead wire 1 is inserted into the through hole 8a of the sealing body 8, a gap is formed between the outer circumferential surface of the cap 4 and the inner surface of the through hole 8a. Moreover, the burrs generated by the wires 1 cause scratches in the through holes 8a, and the electrolyte is easily leaked to cause poor sealing reliability. Further, when the wire 1 is inserted through the through hole 8a, the burr generated at the wire 1 falls off and falls beside the capacitor element 6, causing a short circuit problem.

Invention

The present invention provides an electronic component and a wire for use thereof, and the manufacturing method of the electronic component, which prevents the appearance of the cap from being deformed and burrs by the fitting between the front end of the electrode and the cap. Sealing air tightness and short circuit resistance.

The wire of the present invention comprises a metal extraction electrode and a cap. The cap is made of a metal that is harder than the lead electrode and covers the front end of the lead electrode. Moreover, the electronic component of the present invention includes the functional component and the lead wire. The extraction electrode is taken from the functional element. According to the foregoing configuration, it is possible to prevent the cap from being deformed when the cap is covered at the end portion before the electrode is taken out.

Moreover, the outer diameter of the front end portion of the lead-out electrode before covering the cap is smaller than the inner diameter of the cap. And the cap is covered on the front end of the lead electrode, and then pressed from the outer surface of the cap, whereby the cap is not deformed, and the front end of the lead end made of the soft material of the cap is Deformation. Then, the outer surface of the front end of one end of the extraction electrode can be crimped to the inner surface of the cap. Therefore, when the cap is placed over the end portion of the lead electrode, the inner peripheral edge portion of the open end portion of the cap does not bite the outer peripheral edge portion of the tip end portion of the lead end. As a result, the crucible can suppress the occurrence of burrs at the open end of the cap.

Simple illustration

Fig. 1 is a cross-sectional view showing an aluminum electrolytic capacitor which is an example of an electronic component according to Embodiment 1 of the present invention.

Fig. 2 is a perspective view showing an expanded portion of a capacitor element of the aluminum electrolytic capacitor shown in Fig. 1.

Fig. 3A is a cross-sectional view showing a manufacturing step of a wire used in the aluminum electrolytic capacitor shown in Fig. 1.

Fig. 3B is a cross-sectional view showing the manufacturing steps of the wire after the third drawing.

Figure 3C is a cross-sectional view showing the manufacturing steps of the wire following the 3B drawing.

Figure 3D is a cross-sectional view showing the manufacturing steps of the wire following the 3C figure.

Fig. 3E is a cross-sectional view showing the manufacturing steps of the wire after the 3D drawing.

Fig. 4A is a cross-sectional view showing the manufacturing steps of the wire which is carried out before the 3A drawing.

Fig. 4B is a cross-sectional view showing the manufacturing steps of the wire after Fig. 4A.

Fig. 5 is a cross-sectional view showing an aluminum electrolytic capacitor which is an example of an electronic component according to a second embodiment of the present invention.

Fig. 6 is a perspective view showing the expanded portion of the capacitor element of the aluminum electrolytic capacitor shown in Fig. 5.

Fig. 7A is a cross-sectional view showing a manufacturing step of a wire used for the aluminum electrolytic capacitor shown in Fig. 5.

Fig. 7B is a cross-sectional view showing the manufacturing steps of the wire after the Fig. 7A.

Figure 7C is a cross-sectional view showing the manufacturing steps of the wire after the 7B.

Fig. 7D is a cross-sectional view showing the manufacturing steps of the wire after the 7Cth drawing.

Figure 7E is a cross-sectional view showing the manufacturing steps of the wire after the 7D.

Figure 7F is a cross-sectional view showing the manufacturing steps of the wire after the 7E drawing.

Figure 7G is a cross-sectional view showing the manufacturing steps of the wire after the 7F.

Fig. 8A is a cross-sectional view showing another manufacturing step of the wire used for the aluminum electrolytic capacitor shown in Fig. 5.

Figure 8B is a cross-sectional view of the wire fabrication step following Figure 8A.

Fig. 9 is a cross-sectional view showing a film capacitor of an example of an electronic component according to a third embodiment of the present invention.

Fig. 10 is a developed perspective view showing a capacitor element of the film capacitor shown in Fig. 9.

Fig. 11A is a cross-sectional view showing a manufacturing step of a wire used for the film capacitor shown in Fig. 9.

Figure 11B is a cross-sectional view showing the manufacturing steps of the wire after the 11A.

Figure 11C is a cross-sectional view showing the manufacturing steps of the wire after the 11B.

Figure 11D is a cross-sectional view showing the manufacturing steps of the wire after the 11C chart.

Figure 11E is a cross-sectional view showing the manufacturing steps of the wire after the 11D.

Figure 11F is a cross-sectional view showing the manufacturing steps of the wire after the 11E.

Figure 11G is a cross-sectional view showing the manufacturing steps of the wire after the 11F.

Fig. 12 is a cross-sectional view showing an aluminum electrolytic capacitor which is an example of an electronic component according to a fourth embodiment of the present invention.

Fig. 13 is a perspective view showing the expanded portion of the capacitor element of the aluminum electrolytic capacitor shown in Fig. 12.

Fig. 14 is a cross-sectional view showing an aluminum electrolytic capacitor which is an example of an electronic component according to a fifth embodiment of the present invention.

Fig. 15 is a perspective view showing the expanded portion of the capacitor element of the aluminum electrolytic capacitor shown in Fig. 14.

Fig. 16A is a cross-sectional view showing the manufacturing steps of the wires used in the aluminum electrolytic capacitor shown in Fig. 14.

Figure 16B is a cross-sectional view showing the manufacturing steps of the wire after the 16A.

Figure 16C is a cross-sectional view showing the manufacturing steps of the wire after the 16B.

Figure 16D is a cross-sectional view showing the manufacturing steps of the wire after the 16Cth drawing.

Figure 16E is a cross-sectional view showing the manufacturing steps of the wire after the 16D.

Figure 16F is a cross-sectional view showing the manufacturing steps of the wire after the 16E drawing.

Figure 17 is a cross-sectional view of a conventional aluminum electrolytic capacitor.

Figure 18 is a perspective view of the wire used in the aluminum electrolytic capacitor shown in Figure 17.

Figure 19 is a cross-sectional view of the wire shown in Figure 18.

Form for implementing the invention

Hereinafter, various embodiments of the present invention will be described with reference to the drawings. another, In the respective embodiments, the same components as those in the previous embodiment are denoted by the same reference numerals, and the description thereof will be omitted, and only the different portions will be described.

(Embodiment 1)

Fig. 1 is a cross-sectional view showing the structure of an aluminum electrolytic capacitor which is an example of an electronic component according to Embodiment 1 of the present invention. Fig. 2 is a perspective view showing an expanded portion of a capacitor element of a functional element of the aluminum electrolytic capacitor. 3A to 3E are cross-sectional views showing respective manufacturing steps of the wires used in the aluminum electrolytic capacitor.

First, the structure of the aluminum electrolytic capacitor of the present embodiment and the wire used therefor will be described with reference to Figs. 1 and 2 . As shown in Fig. 1, the aluminum electrolytic capacitor includes a capacitor element 16, which is a functional element, a case 17, a sealing body 18, and an insulating terminal plate 19. The capacitor element 16 is connected to a pair of wires 11. The bottomed cylindrical casing 17 houses the capacitor element 16. The sealing body 18 is provided with a through hole 18a through which the wire is inserted. The sealing body 18 blocks the opening of the housing 17. The insulating terminal plate 19 is provided with a through hole 19a, and the outer surface of the insulating terminal plate 19 is provided with a groove portion 19b. The through hole 19a accommodates the terminal 15 of the lead wire 11 led out from the sealing body 18. The groove portion 19b accommodates the terminal 15 that is inserted through the through hole 19a and bent in a direction slightly orthogonal. The insulating terminal plate 19 is disposed to be connected to the opening of the casing 17.

The lead wire 11 has a cylindrical metal lead electrode 12, a metal cap 14 and a linear terminal 15. The cap 14 is formed of a material harder than the lead electrode 12, and covers the tip end portion 12c of one end of the lead electrode 12. The terminal 15 is welded to the outer surface of the cap 14. The outer surface of the front end portion 12c is pressed against the inner surface of the cap 14, and at least a part of the crimping interface is formed with a metal diffusion layer 12d to join the two. The tip end portion of the other end of the extraction electrode 12 connected to the capacitor element 16 is processed into a flat shape to constitute a flat portion 12e.

Further, the cap 14 is formed of a material harder than the lead-out electrode 12, and it is shown here that the cap 14 is relatively larger in durability against the shape deformation than the front end portion 12c. Further, when an aluminum wire round bar is used as the material of the extraction electrode 12, the material of the base material of the cap 14 may be selected from aluminum hard iron, nickel, iron-nickel alloy or the like. Further, in addition to the material type of the base material of the cap 14, the elements related to the strength such as the thickness of each portion of the cap 14 should be appropriately considered.

Further, the inner surface of the cap 14 may be provided with a plating layer to make the joint with the front end portion 12c stronger. As the plating layer, for example, tin, nickel, copper, or the like can be used. For example, when the lead electrode 12 uses an aluminum wire round bar and the base of the cap 14 uses iron, a tin or nickel plating layer using copper as a bottom layer may be provided on the surface of the iron base material. Preferably, such a plating layer is provided on at least the inner surface of the cap 14.

The terminal 15 is made of a metal plate or a wire made of a metal substrate such as iron, nickel, copper, iron alloy or copper alloy. Further, a plating layer may be formed on the outer surface of the terminal 15. For example, in order to connect to the circuit board 20, a tin alloy such as tin, antimony, indium or lead may be added to the plating layer or tin, and the like.

Further, as shown in Fig. 2, the lead electrode 12 is bonded to the flat portion 12e by an ultrasonic foil welding or a pressure bonding or the like, and the anode foil 16a and the cathode foil 16b are bonded to each other. The anode foil 16a and the cathode foil 16b are each formed of a valve action metal such as aluminum. The capacitor element 16 which is a functional element is formed by separating the anode foil 16a and the cathode foil 16b from the separator 16c and winding them together. Here, the functional element refers to the active and passive components that control the electrical function as a whole. For example, if it is a capacitor, it is a capacitor element, if it is a battery, it is a battery element or an electrode group, and if it is a semiconductor, it is a semiconductor element.

The casing 17 is made of a metal such as aluminum or aluminum alloy. The casing 17 houses an electrolyte (not shown) such as a capacitor element 16, an electrolytic solution, and/or a solid conductive polymer. The opening of the casing 17 is sealed by a sealing body 18 which is formed of an elastic body inside the opening by a stress generated in the extending portion 17a provided on one of the outer peripheral surfaces of the casing 17.

Further, the through hole 18a of the sealing body 18, the terminal 15, the cap 14, and the extraction electrode 12 of the lead wire 11 are inserted in this order. Further, the extraction electrode 12 is in a state of abutting against the inner surface of the through hole 18a, and the terminal 15 is led out from the sealing body 18 to the outside. Further, the diameter of the through hole 18a is set to be the same as or slightly smaller than the outer diameter of the extraction electrode 12. Further, the stress generated by the extension processing portion 17a in the sealing member 18 is sealed between the sealing member 18 and the extraction electrode 12.

The insulating terminal plate 19 abuts against the opening of the casing 17. Further, the terminal 15 is inserted through the through hole 19a of the insulating terminal plate 19 and bent in a direction perpendicular to the direction. Further, the front end portion of the terminal 15 is housed in the groove portion 19b provided on the surface of the insulating terminal plate 19. The insulating terminal plate 19 is formed of a thermoplastic resin such as polyethylene, polypropylene, polyethylene terephthalate or a liquid crystal polymer, or a thermosetting resin such as a phenol resin or an epoxy resin.

Further, in order to facilitate the formation of the soldering angle when the terminal 15 is attached to the circuit board 20 by soldering, the portion of the terminal 15 accommodated in the groove portion 19b may be processed into a flat shape by press working or the like.

Next, a method of manufacturing the wire 11 will be described with reference to FIGS. 3A to 3E. First, as shown in FIG. 3A, the outer peripheral surface of the extraction electrode 12 is held by the clamp jig 13a, and the front end portion 12a before the deformation of one end of the extraction electrode 12 is exposed. The cap 14 is then covered on the front end portion 12a (step A). Lead out The pole 12 is composed of a cylindrical wire. The cap 14 is formed by a metal plate having a material harder than the lead electrode 12 to have an opening shape by press working. The inner diameter of the opening of the cap 14 is set to be larger than the outer diameter of the front end portion 12a. Therefore, at this stage, the outer surface of the front end portion 12a and the inner surface of the cap 14 are not yet crimped, and a state in which there is a gap therebetween is exhibited.

Next, as shown in FIG. 3B, the front end portion 12a is deformed by the inner side of the cap 14 to form the deformed front end portion 12c. Then, the outer surface of the front end portion 12c and the inner surface of the cap 14 are crimped (step B). The specific implementation of the B step is as follows. First, the inner bottom surface of the cap 14 covering the front end portion 12a is brought into contact with the upper surface of the front end portion 12a, and then the outer bottom surface of the cap 14 is mechanically pressurized. By this pressurizing operation, the cap 14 is not deformed, but the outer shape of the end portion 12a is greatly deformed by the material which is softer than the cap 14. As a result, the front end portion 12c is formed, and the outer surface of the front end portion 12c and the inner surface of the cap 14 are in contact with each other.

Further, since the distal end portion 12a is deformed by the pressurization and becomes the distal end portion 12c and is pressed against the cap 14, the gap between the outer diameter of the main body portion of the lead electrode 12 and the outer diameter of the distal end portion 12c is generated.

Further, when the outer surface of the cap 14 is mechanically pressurized, for example, the following method can be applied. For example, there is a method in which the pin member is placed on the outer surface of the cap 14 and pressed, and a method of applying an instantaneous impact to the outer surface of the cap 14 by a tool such as a hammer is used. To apply these methods, a portion of the outer bottom surface of the cap 14 is preferably provided with a flat portion.

Further, it is preferable to provide a guiding member that is coupled to the outer peripheral surface of the cap 14 in the direction in which the cap 14 is pressed. Thereby, when the outer surface of the cap 14 is mechanically pressurized, the central axis of the cap 14 and the central axis of the extraction electrode 12 can be easily made. Consistent.

Then, as shown in FIG. 3C, the welding electrode 13b is connected to the outer bottom of the cap 14 and the extraction electrode 12, respectively. Then, heat treatment is applied to the cap 14 and the extraction electrode 12 by an electric fusion bonding method such as arc welding or electric resistance welding (step C). In addition to this, heat treatment may be applied from the outside of the cap 14 by a gas burner, laser, electromagnetic induction or the like. By this heat treatment, the cap 14 and the extraction electrode 12 are melted at the interface of the crimping. And at least a portion of the interface forms a metal diffusion layer 12d doped with a metal material constituting the cap 14 and the extraction electrode 12.

Next, as shown in FIG. 3D, the terminal 15 is attached to the outer surface of the cap 14 (step D). Specifically, the linear terminal 15 is first attached to the outer surface of the cap 14. Then, the welding electrode 13c is connected to the main body of the terminal 15 and the extraction electrode 12, respectively. Further, the terminal 15 and the cap 14 are joined by a method such as resistance welding by the welding electrode 13c. Further, the shape of the terminal 15 may be a plate shape or the like in addition to a line shape.

Thereafter, as shown in Fig. 3E, the other end end portion 12b of the lead electrode 12 which is not covered with the cap 14 is deformed to form the flat portion 12e (step E). As shown in Fig. 2, the flat portion 12e is connected to the anode foil 16a and the cathode foil 16b by caulking and ultrasonic waves when the capacitor element 16 and the extraction electrode 12 are connected. The E step is specifically carried out in the following manner. The outer surface of the distal end portion 12b is clamped and pressed, and rolled into a plate shape parallel to the axial direction of the extraction electrode 12, and the flat portion 12e is formed by cutting the circumference to a predetermined width and length. Further, the front end portion 12b may be other than a flat shape, and may be deformed and processed into a shape suitable for forming an electrode of a functional element to be connected, or the like. As above As described, the wires 11 can be made by the steps A, B, C, D, and E.

Next, a method for manufacturing an aluminum electrolytic capacitor which is an example of the electronic component of the embodiment using the lead wire 11 will be described.

First, as shown in Fig. 2, the anode foil 16a, the cathode foil 16b, and the separator 16c are cut into a predetermined width and length. The surface of the anode foil 16a has a dielectric layer of an oxidized film. Next, a pair of wires 11 made by the steps A to E are connected to the anode foil 16a and the cathode foil 16b by the flat portion 12e by caulking and ultrasonic waves, respectively. Thereafter, the anode foil 16a and the cathode foil 16b are separated by a separator 16c and wound into a roll shape to have a substantially cylindrical shape. The outer peripheral side surface is then wound and fixed by an insulating tape or the like (not shown), thereby forming the capacitor element 16.

Further, the electrode for constituting the functional element may be formed by laminating a plurality of foil-like members, a sintered body, or the like, in addition to the winding of the anode foil 16a and the cathode foil 16b.

Next, as shown in FIG. 1, the capacitor element 16 is housed in the casing 17 together with the electrolyte containing the electrolyte. Then, one of the pair of lead wires 11 drawn from the capacitor element 16 is inserted into one of the pair of through holes 18a of the sealing body 18. In this state, the sealing body 18 is placed in the opening of the casing 17. Further, a solid electrolyte such as a conductive polymer represented by polypyrrole or polycetin may be used instead of the electrolytic solution, and both of them may be used.

Thereafter, the outer peripheral side surface of the casing 17 is contracted to form the extension processed portion 17a, and the opening of the casing 17 is closed. Thereafter, the insulating terminal plate 19 is disposed to be connected to the opening of the casing 17. Then, the terminal 15 of the pair of wires 11 is led out from the outside of the sealing body 18, and is inserted into one of the pair of through-holes 19a of the insulating terminal plate 19.

Thereafter, the terminals 15 projecting from the through holes 19a are bent at right angles to each other and are accommodated in the groove portion 19b provided on the outer surface of the insulating terminal plate 19. In this way, a surface mount type aluminum electrolytic capacitor was fabricated.

When the distal end portion of the terminal 15 accommodated in the groove portion 19b of the insulating terminal plate 19 is formed into a flat plate shape, the terminal 15 is processed into a plate shape by press working or the like before the terminal 15 is inserted into the through hole 19a.

In addition, when the electrolyte contained in the capacitor element 16 is a solid electrolyte such as a conductive polymer, an insulating outer resin formed of an epoxy resin or the like may be used as the exterior material instead of the casing 17 and the sealing body 18. At this time, the exterior resin covers the capacitor element 16 and leads the terminal 15 of the wire 11 to the outside of the exterior resin.

Further, after the opening of the casing 17 is sealed, or after the insulating terminal plate 19 is mounted, a voltage is appropriately applied between the terminals 15 to re-form.

As described above, in the lead wire 11 of the present embodiment and the method of manufacturing the same, the cap 14 is formed of a material that is harder than the lead electrode 12. Thereby, it is possible to prevent the appearance of the cap 14 from being deformed when the cap 14 is covered by the front end portion 12a.

In addition, the outer diameter of the front end portion 12a before the cover cap 14 is smaller than the inner diameter of the cap 14. After the cap 14 is covered by the distal end portion 12a, the outer surface of the cap 14 is pressurized, and the cap 14 is not deformed, but the distal end portion 12a is deformed into the distal end portion 12c. Thus, the outer surface of the front end portion 12c can be crimped to the inner surface of the cap 14. Therefore, when the cap 14 is covered by the distal end portion 12a, the inner peripheral edge portion of the opening end portion of the cap 14 does not bite the outer peripheral edge portion of the distal end portion 12a. As a result, the burrs generated at the open end of the cap 14 due to such bite marks can be suppressed.

Since the generation of the burrs of the wires 11 can be suppressed as such, the wires can be prevented from being made. When the through hole 18a is inserted into the through hole 18a, the burr is short-circuited by the capacitor element 16. Further, it is possible to suppress the occurrence of scratches in the sealing body 18 in the through hole 18a due to the burrs, so that the sealing airtightness can be improved and the reliability of the electronic component can be improved.

Further, before the lead wire 11 and the lead electrode 12 are formed, the end portion 12a and the cap 14 covering the distal end portion 12a are joined by a mechanical pressure bonding method, and a metal diffusion layer 12d is formed at the interface of the pressure bonding. Thereby, the joint strength can be increased, thereby improving the joint reliability. Therefore, the use of the electronic component of the wire 11 can prevent the open defect caused by the breakage of the wire 11 even in an environment where a severe vibration load is applied.

Further, the melting point of the material used for the base material of the lead wire 11 and the cap 14 is preferably higher than the melting point of the material used for the lead electrode 12. For example, when the lead electrode 12 is made of aluminum, the base material of the cap 14 is made of a metal having a higher melting point than aluminum. If so, it is possible to prevent the cap 14 from being excessively melted at the time of the heat treatment of the C step, so that the outer surface of the cap 14 is deformed in a shape such as a burr and a projection.

Further, when the lead electrode 12 is made of aluminum, the metal used for the base material of the cap 14 is preferably made of a metal single body of copper, nickel or iron, an alloy containing copper, nickel or iron. When the metals are below the melting point of aluminum, an alloy in a liquid phase state can be formed. Therefore, by the heat treatment, the metal diffusion layer 12d is easily formed at the interface where the end portion 12c and the cap 14 are pressed before the extraction electrode 12 formed of the aluminum wire round bar, and the joint strength can be improved. Further, in order to easily form the metal diffusion layer 12d, the metal having a higher melting point than aluminum should be provided at least on the inner side of the cap 14, or may be provided in the form of a base material or a plating layer of the cap 14.

In this way, the electronic components of the wire 11 are used, even when applied In the environment of severe vibration load, the open circuit defect caused by the breakage of the wire 11 can be prevented, and the short circuit caused by the burrs and protrusions of the outer surface of the cap 14 and the airtightness of the seal can be prevented.

Further, when the interface between the bonding cap 14 and the front end portion 12c of the extraction electrode 12 is crimped by heat treatment, it is preferable to adjust the thickness of the cap 14, the material, and the extent of covering the extraction electrode 12. Thereby, not only the shape of the cap 14 caused by excessive melting can be prevented, but also the joint strength can be improved. In order to uniformly melt the interface where the cap 14 and the front end portion 12c are crimped, the thickness of the bottom surface and the outer side surface of the cap 14 to be heat-treated is preferably in a uniform state.

Further, when tin plating is applied to the surface of the cap 14, and the aluminum wire round bar is used for the extraction electrode 12, the metal diffusion layer 12d exhibits a state in which aluminum and tin are diffused. The state in which the aluminum and the tin are diffused is generally liable to produce tin whiskers when placed in an environment of high temperature, high humidity or thermal cycling. When the diffusion of aluminum and tin exposes the outer surface of the electronic component, the growth of the tin whisker sometimes causes a short circuit problem. However, in the lead wire 11, since the metal diffusion layer 12d is housed inside the cap 14 and is not exposed to the outside, even if the metal diffusion layer 12d contains aluminum and tin, the tin whisker does not grow outside. Thus, the use of the electronic components of the wires 11 can suppress the short circuit caused by the tin whiskers. Further, the metal mixed in the metal diffusion layer 12d may be a combination of other metals other than aluminum and tin, and the same effect can be obtained as long as it is easy to generate whiskers.

Further, in the lead wire 11, the outer diameter of the cap 14 is larger than the outer diameter of the lead electrode 12, so that a step portion is formed (not shown). By this step, the wire 11 of the through hole 18a of the insertion sealing body 18 can be strongly engaged. In this way, the wire 11 can be prevented from being displaced toward the inside of the casing 17 and between the wire 11 and the capacitor element 16 The connection creates a disadvantage of the load. Therefore, by using the electronic component of the wire 11, it is possible to prevent a disconnection or short circuit, an increase in leakage current, and the like due to an abnormality in the connection portion between the wire 11 and the capacitor element 16.

Further, the through hole 18a of the sealing body 18 has an aperture, and it is preferable to set only a portion of the position where the cap 14 of the insertion wire 11 is placed to be large. Thereby, the step formed by the difference in outer diameter between the cap 14 and the extraction electrode 12 can reduce the gap generated between the wire 11 and the through hole 18a, and improve the airtightness of the seal.

Further, it is preferable that the entire outer circumference or a part of the outer periphery of the cap 14 has a curved surface whose outer diameter is enlarged along the direction from the outer bottom portion of the cap 14 toward the opening end side. When the wire 11 is inserted into the through hole 18a, at least the portion of the cap 14 that is in contact with the inner surface of the through hole 18a may have such a curved surface. For example, it may be a dome, a cone, a truncated cone, or the like. If the cap 14 has such a curved surface, the load acting on the wire 11 when the wire 11 is inserted into the through hole 18a can be reduced. Therefore, it is possible to prevent the wire 11 from being deformed, or a case where the pair of wires 11 are displaced from each other to cause a load to be generated at the connection portion between the wire 11 and the capacitor element 16. Therefore, by using the electronic component of the wire 11, it is possible to prevent a disconnection or short circuit caused by an abnormality in the connection portion between the wire 11 and the capacitor element 16, and an increase in leakage current.

Further, when the material constituting the terminal 15 of the wire 11 is, for example, an iron-based substrate, the cap 14 is preferably made of an iron, nickel or iron-nickel alloy substrate. Further, if the terminal 15 is a copper-based substrate, the cap 14 is preferably a copper or copper alloy substrate. That is, if the difference in electric resistance between the terminal 15 and the cap 14 is made small, the joint strength between the terminal 15 and the cap 14 can be maintained when the resistance is welded, and the occurrence of a shape defect such as a burr can be suppressed.

Moreover, even if the thermal energy of the outer surface of the cap 14 and the terminal 15 is engaged, When the interface between the cap 14 and the tip end portion 12c is melted, the burrs, projections, and the like which are generated by the melting at the interface are not exposed to the outside. This is because the front end portion 12c is covered by the cap 14. Therefore, by using the electronic component of the wire 11, it is possible to suppress a short circuit caused by a burr or the like when the wire 11 is inserted into the through hole 18a of the sealing body 18, and to improve the sealing airtightness and reliability.

Further, the terminal 15 is connected to the extraction electrode 12 by a cap 14. Therefore, the material of the terminal 15 and the material of the cap 14 can be selectively combined to use a metal material which is fused to each other. For example, when the terminal 15 and the cap 14 are joined by laser welding or the like, the melting point or thermal conductivity of the material constituting the terminal 15 is preferably the same as or similar to that of the cap 14. Thereby, the joint strength can be stabilized, and the shape of the joint portion between the terminal 15 and the cap 14 due to excessive melting of one of them can be prevented. Therefore, by using the electronic component of the wire 11, it is possible to suppress the short-circuiting of the terminal 15 caused by the severe vibration and the short-circuit and electrolyte leakage caused by the shape of the burr or the protrusion of the connection portion between the terminal 15 and the cap 14. .

Next, a description will be given of a manufacturing step which is preferably performed before the step A described in Fig. 3A. 4A and 4B are cross-sectional views showing respective manufacturing steps of the aforementioned wires 11.

As shown in Fig. 4A, it is preferable to add a step of forming the planar chamfered portion 22f to the outer peripheral portion of the end portion 12a before the extraction electrode 12 before the step A (step F). When the F step is added, when the cap 14 is covered by the distal end portion 12a, the inner peripheral edge portion of the open end portion of the cap 14 is less likely to contact the outer peripheral edge portion of the distal end portion 12a. Therefore, it is possible to suppress the occurrence of burrs at the open end of the cap 14.

Furthermore, in the step A shown in FIG. 4B, it is preferable to also open the cap 14 A corner portion 24a is provided on the inner peripheral portion of the end portion. As a result, the inner peripheral edge portion of the open end portion of the cap 14 is less likely to contact the outer peripheral edge portion of the tip end portion 12a of the one end of the lead electrode 12. Therefore, it can suppress the situation of the burrs. Further, the shape of the corner portions 22f and 24a may be curved, and the same effect as that of the planar shape can be obtained.

Therefore, by using the electronic component of the wire 11, it is possible to suppress a short circuit caused by a burr or the like when the through hole 18a through which the wire 11 is inserted, and to improve the airtightness and reliability of the seal.

(Embodiment 2)

Fig. 5 is a cross-sectional view showing the structure of an aluminum electrolytic capacitor which is an example of an electronic component according to a second embodiment of the present invention. Fig. 6 is a perspective view showing an expanded portion of a capacitor element of a functional element of the aluminum electrolytic capacitor. 7A to 7G are cross-sectional views showing respective manufacturing steps of the wires used in the aluminum electrolytic capacitor. First, the structure of an aluminum electrolytic capacitor and an electric wire used in an example of the electronic component of the present embodiment will be described with reference to FIGS. 5 and 6.

In the fifth embodiment, the difference from the aluminum electrolytic capacitor of the first embodiment shown in Fig. 1 is that the tip end portion 32c (after deformation) of the lead electrode 12 constituting the lead wire 31 is thinner than the body portion of the lead electrode 12. Further, the difference in outer diameter between the cap 34 covering the distal end portion 32c and the main portion of the extraction electrode 12 is smaller than that of the aluminum electrolytic capacitor of the first embodiment.

Next, a method of manufacturing the wire 31 of the present embodiment having the above configuration will be described with reference to FIGS. 7A to 7G. The difference from the first embodiment shown in FIGS. 3A to 3E is that before the step A shown in FIG. 7C, the front end portion 32a of the lead electrode 12 is deformed as shown in FIG. 7A. The first step of processing to make it thin (G step). In the G step, the tip end portion 32a can be processed to be thinner than the body portion of the lead electrode 12 by a method of applying a mold and applying pressure.

Further, at the step A after the G step, the cap 34 is covered on the front end portion 32a. In the subsequent step B shown in Fig. 7D, the outer bottom surface of the cap 34 is mechanically pressurized until the outer surface of the end portion 32c contacts the inner surface of the cap 34 and is crimped together after the extraction electrode 12 is deformed. . Therefore, in order to prevent the opening end portion of the cap 34 from coming into contact with the difference between the outer diameter of the main portion of the lead electrode 12 and the outer diameter of the front end portion 32a during the pressurization of the step B, it is necessary to first set The processing size of the front end portion 32a.

Further, at the same time as or after the G step, as shown in Fig. 7B, it is preferable to form the planar chamfered portion 32f at the outer peripheral portion of the distal end portion 32a (step F). Further, it is preferable that the outer peripheral edge portion of the step portion which is formed by the difference between the outer diameter of the main portion of the lead electrode 12 and the outer diameter of the distal end portion 32a is formed to form the planar chamfered portion 32g (step H).

The 7E to 7G drawings are the same as the steps C, D, and E of the first embodiment, and the description thereof is the same as the descriptions of the third, third, and third embodiments, and therefore will be omitted. Thus, the wires 31 can be formed by the steps G, F, H, A, B, C, D, and E.

Further, the method of manufacturing the aluminum electrolytic capacitor using the wire 31 is the same as that of the first embodiment.

As described above, in the lead wire 31 of the present embodiment, the tip end portion 32a of the lead electrode 12 is processed to be thinner than the body portion of the lead electrode 12. Thereby, the difference between the outer diameter of the cap 34 that is covered by the distal end portion 32a and crimped to the extraction electrode 12 and the outer diameter of the body portion of the extraction electrode 12 can be reduced. Therefore, with the implementation In the same state 1, the short circuit caused by the burrs or the like when the wire 31 is inserted into the through hole 18a of the sealing body 18 can be suppressed. Further, when the thickness of the sealing body 18 is thin, a gap can be prevented between the through hole 18a and the wire 31, and the sealing airtightness can be improved.

Further, when the lead wire 31 formed by adding the H step is used for the aluminum electrolytic capacitor, the edge of the outer peripheral edge portion of the step portion which is generated by the difference between the outer diameter of the main portion of the lead electrode 12 and the outer diameter of the distal end portion 32a is not It is an acute angle. Therefore, it is possible to prevent the sealing body 18 on the inner surface of the through hole 18a from being scratched when the lead wire 31 is inserted into the through hole 18a. Thus, leakage of the electrolyte can be suppressed, and the hermeticity of the seal can be improved. In addition, the H step may be additionally performed, either simultaneously with or after the G step, or at the same time as or before the F step.

Further, as shown in Fig. 7C, it is preferable to provide the corner portion 34a at the inner peripheral portion of the open end portion of the cap 34. Thereby, the inner peripheral edge portion of the open end portion of the cap 34 is less likely to contact the outer peripheral edge portion of the distal end portion 32a, and the occurrence of burrs at the opening end portion of the cap 34 can be suppressed.

Further, the shapes of the chamfered portions 32f, 32g, and 34a shown in Figs. 7B and 7C may be curved, and the same effect as that of the planar shape can be obtained.

Next, different G steps will be described with reference to FIGS. 8A and 8B. 8A and 8B are cross-sectional views showing respective manufacturing steps of another example of the wire 31.

Further, in the G step shown in Fig. 8A, the front end portion 42a before the deformation of one end of the extraction electrode 12 is processed into a trapezoidal shape (frustum taper). That is, the outer diameter of the foremost end portion of the distal end portion 42a is made smaller. In the case of such a shape, when the cap 34 is covered by the front end portion 42a, the inner peripheral portion of the open end portion of the cap 34 It is difficult to contact the outer peripheral portion of the front end portion 42a. Therefore, it is possible to further suppress the occurrence of hair on the open end of the cap 34.

Hereinafter, the effects of the present embodiment will be described with reference to specific examples. First, when the wire 31 was produced, an aluminum wire round bar having a diameter of 1.3 mm and a purity of 99.99% was used as the body member of the extraction electrode 12.

The cap 34 is formed by press-working a plate-shaped base material of iron. The size of the opening of the cap 34 is set to an outer diameter of 1.6 mm, an inner diameter of 1.3 mm, and a length of 0.8 mm to 1.0 mm. Further, the shape of the bottom side of the cap 34 has a curved surface on the outer peripheral edge portion and a circular flat portion having a diameter of about 0.3 mm to 1.0 mm on the bottom surface. Further, a nickel plating layer having a thickness of 2 μm to 10 μm using copper as a bottom layer is formed on the surface of the cap 34. Further, the inner peripheral edge portion of the open end portion of the cap 34 is provided with a planar chamfered portion 34a.

The terminal 15 is made of an iron wire having an outer diameter of 0.6 mm, and a nickel plating layer having a thickness of 2 μm to 10 μm using copper as a bottom layer is formed on the surface.

First, at the G step shown in Fig. 7A, the tip end portion 32a of the lead electrode 12 is processed to be thinner than the body portion of the lead electrode 12 by the mold and pre-pressurized, and is smaller than the inner diameter of the cap 34. small. Specifically, the outer diameter of the front end portion 32a is made 1.10 mm.

Further, the dimension of the longitudinal direction of the distal end portion 32a (the axial direction of the extraction electrode 12) is set to be 1.3 mm longer than the length dimension of the cap 34.

Further, at the step F shown in Fig. 7B at the same time as the G step, a planar deangular portion 32f is formed on the outer peripheral portion of the distal end portion 32a using a mold. Further, in the H step, the planar deangular portion 32g is formed on the outer peripheral edge portion of the step portion which is caused by the difference between the outer diameter of the main portion of the lead electrode 12 and the outer diameter of the distal end portion 32a.

Next, in the step A shown in Fig. 7C, the outer peripheral surface of the main body portion of the extraction electrode 12 is held by the clamp jig 13a, and the front end portion 32a is exposed. Then, the cap 34 is covered on the front end portion 32a, and the inner bottom surface of the cap 34 is brought into contact with the end surface of the front end portion 32a.

Thereafter, at the step B shown in Fig. 7D, the outer bottom surface of the cap 14 is mechanically pressurized. At this time, the front end portion 32a is deformed and the outer diameter is increased by the inside of the cap cover 34, and the outer surface of the front end portion 32c and the inner surface of the cap 34 are pressed into contact with each other after the deformation of the lead electrode 12.

Next, in the step C shown in Fig. 7E, the welding electrodes 13b are respectively connected to the outer bottom portion of the cap 34 and the main body portion of the extraction electrode 12. Then, heat treatment is applied to the cap 34 and the front end portion 32c by a resistance welding method. At this time, the temperature is raised to the vicinity of the melting point of the metal material for the cap 34 and the extraction electrode 12, and the interface where the cap 34 and the tip end portion 32c are pressed is melted. After that, a metal diffusion layer 32d is formed at the interface, and the metal diffusion layer 32d is doped with a metal material constituting the cap 34 and the front end portion 32c.

Next, in the step D shown in FIG. 7F, the linear terminal 15 is attached to the outer surface of the cap 34, and the welding electrode 13c is respectively connected to the main portion of the terminal 15 and the extraction electrode 12 to be welded by resistance. Method bonding.

Thereafter, in the step E shown in Fig. 7G, the outer surface of the tip end portion 12b of the other end of the extraction electrode 12 is pressed, rolled to form a plate parallel to the axial direction of the extraction electrode 12, and the periphery thereof is cut to form a flat shape. Part 12e. As described above, the wires 31 can be formed by the steps of G, F, H, A, B, C, D, and E.

On the other hand, in order to be used with the wire 31 thus produced and to use the wire 31 The aluminum electrolytic capacitors were compared, and the following wires were fabricated as comparative samples. The material is the same as the lead electrode 12, the cap 34, and the terminal 15 of the wire 31. Then, in the step G shown in Fig. 7A, when the tip end portion 32a of one end of the lead electrode 12 is made thinner, the outer diameter thereof is made 1.4 mm larger than the inner diameter of the cap 34. Therefore, in the step A shown in Fig. 7C, in order to cover the front end portion 32a with the cap 34, the outer bottom surface of the cap 34 is mechanically pressed, so that the inner bottom surface of the cap 34 contacts the end surface of the front end portion 32a. . As a result, in the step A, the cylindrical surface of the distal end portion 32a and the cap 34 are crimped, so the step B is omitted. The steps other than this are performed in the same manner as when the wire 31 is produced. As described above, the wires of the comparative sample can be made by the steps G, F, H, A, C, D, and E.

An aluminum electrolytic capacitor was fabricated using the wire 31 prepared as described above and the wire of the comparative sample. When the wire 31 is used, the steps will be described with reference to FIGS. 5 and 6 . First, an aluminum foil is subjected to an etching treatment, and a chemical conversion treatment is performed in an aqueous solution of ammonium borate, and an oxide film is formed on the aluminum foil to form an anode foil 16a. On the other hand, the aluminum foil is subjected to an etching treatment to form a cathode foil 16b.

Next, the flat portion 12e of the wire 31 is pressure-bonded to the anode foil 16a and the cathode foil 16b. The separator 16c of the Manila paper is further interposed between the anode foil 16a and the cathode foil 16b, and wound around the anode foil 16a and the cathode foil 16b to form the capacitor element 16.

Next, after the capacitor element 16 is impregnated with the electrolytic solution, it is housed in a bottomed cylindrical case 17 made of aluminum. Thereafter, the sealing member 18 whose main component is butyl rubber is attached to the opening of the casing 17. At this time, the self-capacitor element The pair of lead wires 31 that have been led out 16 are inserted into the through holes 18a provided in the sealing body 18, and the terminals 15 are led out to the outside of the sealing body 18.

Then, from the outer peripheral surface of the casing 17, the casing 17 and the sealing body 18 are subjected to an extension process, and the open end of the casing 17 is closed. Thereafter, the insulating terminal plate 19 is brought into contact with the opening of the casing 17. Further, the terminal 15 led to the outside of the sealing member 18 is inserted into the through hole 19a of the insulating terminal plate 19. Finally, the terminal 15 is bent in a substantially right-angle direction and housed in the groove portion 19b provided on the surface of the insulating terminal plate 19. Through the above steps, a 6.3V, 1500μF surface mount type aluminum electrolytic capacitor is fabricated.

Each of the 1000 wires 31 and the comparative sample wires was produced, and the number of defective articles caused by the burrs generated at the open end portions of the caps 34 joined to the lead electrodes 12 was examined. Further, the number of defective products of the tensile strength test of the lead electrode 12 and the cap 34 was also investigated.

As a result, the wire 31 had no defective appearance and no defective product of the tensile strength test. On the other hand, 200 sample defects were found in the comparative sample wires, and there was no defective product in the tensile strength test. Thus, it is known that the wire 31 can secure the joint strength between the lead electrode 12 and the cap 34, and the blunt edge of the open end of the cap 34 can be prevented as compared with the comparative sample lead.

Next, 1000 aluminum electrolytic capacitors using the lead wires 31 and the comparative sample wires were produced, and the number of short-circuit defective products occurred in the reflow test was investigated.

As a result, the aluminum electrolytic capacitor using the wire 31 did not cause a short-circuit defective product. On the other hand, five aluminum electrolytic capacitors using comparative sample wires were found to have five short-circuit defective products. Thus, it is known that the use of the wire 31 can prevent short-circuit defects after reflow and improve the reliability of the aluminum electrolytic capacitor.

(Embodiment 3)

Fig. 9 is a cross-sectional view showing the structure of a film capacitor which is an example of an electronic component according to a third embodiment of the present invention. Fig. 10 is a perspective view showing an expanded portion of a capacitor element of a functional element of the film capacitor. 11A to 11G are cross-sectional views showing respective manufacturing steps of the wires used for the film capacitor. First, the structure of the film capacitor of the present embodiment and the wire used therefor will be described using Figs. 9 and 10 .

In Fig. 9, the difference from the aluminum electrolytic capacitor of the second embodiment shown in Fig. 5 is that the functional element is a capacitor element 56 using a metallized film. The difference is also that the flat portions 52e and 62e of the wires 51 and 61 are bent, and the front end portions are respectively connected to the collectors 56g and 56h provided on both end faces of the capacitor element 56.

As shown in FIG. 9, the film capacitor includes a capacitor element 56, a case 17, a sealing body 18, and an insulating terminal plate 19. The capacitor element 56 is wound into a substantially cylindrical shape by a pair of metallized films. Collector electrodes 56g and 56h are provided on both end faces of the capacitor element 56. The collectors 56g and 56h are connected to the wires 51 and 61, respectively. In detail, the flat portions 52e, 62e of the wires 51, 61 are bent, and the front end portions are respectively joined to the collectors 56g, 56h. Further, the lead electrodes 52 and 62 are led out in pairs on the end face side of one end of the capacitor element 56.

The bottomed cylindrical casing 17 is made of metal such as aluminum or aluminum alloy, and has a capacitor element 56 housed inside. A gap is provided between the outer surface of the capacitor element 56 and the inner surface of the casing 17, and is not in contact.

The sealing body 18 blocks the opening of the housing 17. The sealing body 18 is provided with a pair of through holes 18a through which the wires 51, 61 are inserted. Insulated terminal block 19 is configured to be connected to the case The opening of the body 17. The insulating terminal plate 19 is provided with a through hole 19a through which one of the terminals 15 is led out from the through hole 18a. Further, the outer surface of the insulating terminal plate 19 is provided with a groove portion 19b that accommodates the terminal 15 that is inserted through the through hole 19a and bent in a substantially right-angle direction. The terminal 15 accommodated in the groove portion 19b can be connected to the circuit board 20.

Further, as shown in Fig. 10, each of the pair of metallized films constituting the capacitor element 56 has a dielectric film, vapor-deposited electrodes 56c and 56d and a fuse 56e and 56f formed by vapor-depositing a metal such as aluminum on the surface thereof. . The dielectric film is provided with non-vapor-deposited portions 56a, 56b at one end of the width direction. The dielectric film is formed of any of polyethylene terephthalate, polypropylene, polyethylene naphthalate, or polyphenylene sulfide. The fuses 56e and 56f have a self-protection function of the cutoff circuit in which the vapor deposition portion is scattered when an abnormal current flows. The capacitor element 56 is formed by winding a pair of metallized films into a substantially cylindrical shape in a state where the vapor deposition electrodes 56c and 56d are not in contact with each other. Further, as shown in Fig. 9, a pair of collector electrodes 56g and 56h are provided on both end faces of the capacitor element 56, and the vapor deposition electrodes 56c and 56d are connected, respectively.

Further, a pair of metallized films may be laminated to form a capacitor element of the laminate.

Next, a method of manufacturing the wires 51 and 61 will be described with reference to FIGS. 11A to 11G.

11A to 11G are different from the manufacturing methods shown in Figs. 7A to 7G of the second embodiment in that the ends of one lead electrode 12 are processed and cut to form a pair of wires. 51, 61. That is, at the steps G, F, and H shown in Fig. 11A, both ends of the extraction electrode 12 are processed to form the front end portions 52a and 62a before the deformation having a smaller outer diameter than the main portion. Again, each before The end portions and the step portions are machined to form chamfered portions 52g, 52f, 62g, 62f. Then, in the step A shown in Fig. 11B, the caps 34 are respectively covered at the front end portion 52a and the front end portion 62a. Next, in the step B shown in FIG. 11C, the cap 34 is pressed against the extraction electrode 12 to form the distal end portion 52c and the distal end portion 62c, and the extraction electrode 12 and the cap 34 are crimped. Further, at the step C shown in Fig. 11D, metal diffusion layers 52d and 62d are formed. Thereafter, at the step D shown in Fig. 11E, the terminals 15 are respectively connected to the cap 34.

Then, after the step D shown in Fig. 11E, in the step I shown in Fig. 11F, the extraction electrode 12 is cut in two in a direction perpendicular to the axial direction. In the first step, the vicinity of the center of the extraction electrode 12 is cut by the cutter 33d. As shown in Fig. 9, when the lengths of the flat portions 52e and 62e of the wires 51 and 61 are different, the cutting position can be adjusted in accordance with the ratio. Finally, at the step E shown in Fig. 11G, flat portions 52e, 62e are formed. Thus, the wires 51, 61 can be made by the steps G, F, H, A, B, C, D, I, E.

Alternatively, the I step can also be after step B or step C. The E step can also be before the I step.

Next, a method of manufacturing a film capacitor which is an example of the electronic component of the embodiment using the wires 51 and 61 will be described.

The difference from the method of manufacturing the aluminum electrolytic capacitor of the second embodiment shown in Fig. 9 is that the capacitor element 56 is formed in a different method and that an electrolyte such as an electrolyte is not required. The rest are the same as in the second embodiment.

First, a method of manufacturing the capacitor element 56 will be described. As shown in Fig. 10, vapor deposition electrodes 56c and 56d are provided on one surface of the dielectric film, one of the predetermined widths, and a non-vapor deposition portion 56a is provided at one end portion in the longitudinal direction. 56b.

Then, the film is placed in a layer so that the vapor deposition electrode 56c and the vapor deposition electrode 56d are not in contact with each other, and the non-vapor-deposited portion 56a at one end faces the non-vapor-deposited portion 56b. In this state, a pair of metallized films are wound to form a substantially cylindrical winding body. At this time, the vapor deposition electrodes 56c and 56d are exposed from the respective end faces of the wound body.

Thereafter, the collector electrodes 56g and 56h are formed by melting or blowing a metal such as aluminum, tin or copper by melting and blowing the both end faces of the metallized film. Further, the collector electrodes 56g and 56h are connected to the vapor deposition electrodes 56c and 56d, respectively.

Next, the flat portions 52e and 62e of the wires 51 and 61 are bent, and the leading end portions thereof are connected to the collectors 56g and 56h by means of spot welding or the like, respectively. Then, the extraction electrodes 52, 62 are taken out in the same direction from the winding body to form the capacitor element 56.

Next, the capacitor element 56 is housed in the casing 17. At this time, a gap is provided between the capacitor element 56 and the casing 17, or an insulating material is disposed on the inner surface of the casing 17. By these methods, the outer surface of the capacitor element 56 is not in contact with the inner surface of the casing 17.

Then, in the same manner as in the second embodiment, the opening portion of the casing 17 is closed by the sealing member 18, and a shape capable of surface mounting is formed.

As described above, when the capacitor element 56 composed of the metallized film exposed from the end faces by the vapor deposition electrodes 56c and 56d is used, the wires 51 and 61 can be used. That is, the bendable flat portions 52e, 62e are reconnected to constitute a film capacitor. When the wires 51 and 61 are used, in the same manner as in the second embodiment, it is possible to suppress a short circuit caused by a burr or the like when the wires 51 and 61 are inserted into the through hole 18a of the sealing member 18, and to improve the sealing airtightness of the film capacitor. .

Further, in the method of manufacturing the lead wire of the present embodiment, the two lead wires 51 and 61 can be efficiently produced from one lead electrode 12. In other words, productivity is greatly improved.

(Embodiment 4)

Fig. 12 is a cross-sectional view showing the structure of an aluminum electrolytic capacitor which is an example of an electronic component according to a fourth embodiment of the present invention. Fig. 13 is a perspective view showing an expanded portion of a capacitor element of a functional element of the aluminum electrolytic capacitor.

First, the structure of the aluminum electrolytic capacitor of an example of the electronic component of the present embodiment and the wire used for the aluminum electrolytic capacitor will be described with reference to Figs. 12 and 13 . As shown in Fig. 12, the aluminum electrolytic capacitor of the present embodiment differs from the aluminum electrolytic capacitor of the second embodiment shown in Fig. 5 in that the lead wire 71 does not have the terminal 75 in advance. In other words, the terminal 75 is provided in the insulating terminal plate 79 that is connected to the opening of the casing 17 by an insert molding method or the like. And the terminal 75 is connected to the cap 34 of the wire 71.

The aluminum electrolytic capacitor includes a capacitor element 16, a case 17, a sealing body 18, and an insulating terminal plate 79. A pair of wires 71 are connected to the capacitor element 16. The wire 71 has an extraction electrode 12 and a cap 34. The cap 34 is joined to the end portion 32c before the end of the extraction electrode 12. The other end portion of the lead electrode 12 is processed into a flat portion 12e. Accordingly, the wire 71 has a structure other than the terminal 15 except for the wire 31 of the second embodiment. The insulating terminal plate 79 has a pair of terminals that are disposed to be connected to the opening of the casing 17. The outer bottom of the cap 34 of the wire 71 is exposed to the outside of the through hole 18a of the sealing body 18. The outer bottom surface of the pair of caps 34 is joined to the terminal 75 provided on the insulating terminal plate 79. The terminal 75 can be connected to the circuit substrate 20.

The method of manufacturing the wire 71 is the same as that of the wire 31 except that the step D of the connection terminal 15 shown in Fig. 7F is not carried out in the method of manufacturing the wire 31 of the second embodiment.

Next, a method of manufacturing the aluminum electrolytic capacitor of the embodiment using the lead wire 71 will be described. First, as shown in Fig. 13, the anode foil 16a, the cathode foil 16b, and the separator 16c are cut into a predetermined width and length. The flat portions 12e of the wires 71 are connected to the anode foil 16a and the cathode foil 16b, respectively, by caulking and ultrasonic waves. Thereafter, the separator 16c is interposed between the anode foil 16a and the cathode foil 16b and wound into a roll shape to have a substantially cylindrical shape. The outer peripheral side surface is then wound and fixed by an insulating tape or the like (not shown), thereby forming the capacitor element 16.

Further, the capacitor element 16 of the functional element may be formed by laminating a plurality of anode foils 16a and cathode foils 16b. A sintered body may be used instead of the anode foil 16a and the cathode foil 16b.

Next, as shown in Fig. 12, the capacitor element 16 is housed in the casing 17 together with the electrolyte containing the electrolyte. Then, one of the pair of lead wires 71 drawn from the capacitor element 16 is inserted into one of the pair of through holes 18a of the sealing body 18. In this state, the sealing body 18 is placed in the opening of the casing 17. Further, a solid electrolyte such as a conductive polymer represented by polypyrrole or polycetin may be used instead of the electrolytic solution, and both of them may be used.

Thereafter, the outer peripheral side surface of the casing 17 is contracted to form the extension processed portion 17a, and the opening of the casing 17 is closed. At this time, the outer surface of the cap 34 is exposed from the through hole 18a of the sealing body 18.

Thereafter, the insulating terminal plate 79 is configured to be connected to the opening of the housing 17. unit. Moreover, the one end portion of one of the terminals 75 of the insulating terminal plate 79 is placed by the insert molding method or the like, and the outer surface of the outer cap 34 is exposed by the through hole 18a contacting the self-sealing body 18, and joined by welding or the like.

In addition, when the electrolyte contained in the capacitor element 16 is a solid electrolyte such as a conductive polymer, an insulating outer resin formed of an epoxy resin or the like may be used as the exterior material instead of the casing 17 and the sealing body 18. At this time, the exterior resin covers the capacitor element 16 and the outer surface of the cap 34 of the wire 71 is led to the outside of the exterior resin.

Further, after the opening of the casing 17 is sealed, or after the insulating terminal plate 79 is attached, a voltage is appropriately applied between the terminals 75 to re-form.

According to the above configuration, since the joint between the cap 34 covering the distal end portion 32c and the terminal 75 is good, the cap 34 may not be previously joined to the terminal 75. The terminal 75 can be joined after the lead wire 71 is inserted into the through hole 18a and the outer surface of the cap 34 is exposed to the outside. Then, similarly to the second embodiment, it is possible to suppress a short circuit caused by a burr or the like when the wire 71 is inserted into the through hole 18a. Moreover, since the terminal 75 can be previously provided in the insulating terminal plate 79 by the insert molding method or the like, it is possible to prevent the position of the terminal 75 from being uneven during the bending process.

(Embodiment 5)

Fig. 14 is a cross-sectional view showing the structure of an aluminum electrolytic capacitor which is an example of an electronic component according to a fifth embodiment of the present invention. Fig. 15 is a perspective view showing an expanded portion of a capacitor element of a functional element of the aluminum electrolytic capacitor. Figs. 16A to 16F are cross-sectional views showing respective manufacturing steps of the wires used in the aluminum electrolytic capacitor.

First, the aluminum battery of this embodiment will be described using FIG. 14 and FIG. The structure of the capacitor and the wire used. As shown in Fig. 14, the present embodiment differs from the aluminum electrolytic capacitor of the second embodiment shown in Fig. 5 in that a wire 81 is used instead of the wire 31. The terminal 85 constituting the wire 81 is not integrally connected to the outer surface of the cap 84 by welding, but is integrally formed with the cap 84.

Next, a method of manufacturing a lead wire for an aluminum electrolytic capacitor according to an example of the electronic component of the fifth embodiment of the above configuration will be described with reference to FIGS. 16A to 16F.

In the 16A to 16F drawings, the following two points are different from the manufacturing steps of the second embodiment shown in Figs. 7A to 7G. The steps shown in FIG. 16A are performed before or after the steps G, F, and H shown in FIG. 16B for processing the deformed front end portion 32a of the one end of the lead electrode 12, as shown in FIG. 16A. A cap 84 having a terminal 85 integrally formed on the outer surface is formed (J step). The second step is the D step of not welding the terminal 85 to the cap 84.

In the step J, the mold is applied to the base material such as the bulk iron by a die, and the terminal 85 is integrally formed on the outer surface of the cap 84. At this time, it is preferable to form the chamfered portion 84a at the open end.

Then, using the cap 84, the lead wires 81 for the aluminum electrolytic capacitor of an example of the electronic component of the fifth embodiment are produced by the steps of G, F, H, A, B, C, and E. The 16C, 16D, 16E, and 16F graphs show the steps A, B, C, and E, respectively.

At the step B shown in Fig. 16D, the inner end portion 12a of the lead electrode 12 is deformed by the inner side of the cap 84 to form the front end portion 12c, and then the outer surface of the front end portion 12c and the inner surface of the cap 84 are crimped. At this time, the outer bottom surface of the cap 84 is mechanically pressurized, and the terminal 85 is avoided.

At the step C shown in Fig. 16E, the cap 84 and the extraction electrode 12 are subjected to heat treatment. At this time, it is preferable to connect the welding electrode 13b to the outer surface of the cap 84 other than the position of the terminal 85. Thereby, the metal diffusion layer 32d can be formed efficiently.

Then, the wire 31 was replaced with the wire 81, and the aluminum electrolytic capacitor was produced in the same manner as in the second embodiment.

As described above, since the terminal is integrally formed on the outer surface of the cap 84, the step of welding the connection terminal 85 and the cap 84 can be omitted, and productivity can be improved. Moreover, the unevenness of the shape and strength of the joint between the terminal 85 and the cap 84 can be minimized to improve the connection quality.

Further, since the shape of the joint between the integrally formed terminal 85 and the cap 84 is extremely stable, it is possible to suppress a gap between the sealing body 18 and the lead wire 81 in the through hole 18a, thereby improving the hermetic airtightness. In addition, the vibration resistance of electronic components can be improved even for severe vibration loads. Therefore, it is possible to manufacture electronic parts with high reliability.

As described above, in the electronic component of the present invention, since the cap is formed by a material which is harder than the lead electrode, it is possible to prevent the cap from being deformed when the cap is covered at the tip end portion of one end of the lead electrode.

When the cap is covered on the front end portion of one end of the lead-out electrode, when the outer bottom surface of the cap is pressurized, the cap does not deform, but the end portion of the electrode is deformed before the electrode is taken out. In addition, the outer surface of the front end of the lead electrode can be crimped to the inner surface of the cap. Therefore, when the cap is covered on the end portion before the extraction electrode, the inner peripheral edge of the open end portion of the cap can be prevented from being bitten and the outer peripheral edge portion of the tip end portion of the electrode end portion can be drawn. That is, it is possible to suppress the occurrence of burrs at the open end of the cap.

Thus, deformation due to the appearance of the cap and the open end of the cap can be suppressed. Low sealing air tightness and short circuit caused by burrs caused by bite marks. Therefore, the present invention is applicable to high reliability electronic parts requiring high sealing air tightness and short circuit resistance.

11,31,51,61,71,81‧‧‧ wires

12‧‧‧ lead electrode

12a, 32a, 42a, 52a, 62a‧‧‧ front end

12c, 32c, 52c, 62c‧‧‧ front end (after deformation)

12d, 32d, 52d, 62d‧‧‧ metal diffusion layer

12e, 52e, 62e‧‧‧ flat section

13a‧‧‧Clamping fixture

13b, 13c‧‧‧ welding electrode

14,34,84‧‧‧ caps

15,75,85‧‧‧ terminals

16,56‧‧‧ capacitor components

16a‧‧‧Anode foil

16b‧‧‧Cathode foil

16c‧‧‧Separate parts

17‧‧‧Shell

17a‧‧‧Extension Processing Department

18‧‧‧ Sealing body

18a, 19a‧‧‧through holes

19,79‧‧‧Insulated terminal block

19b‧‧‧Slots

20‧‧‧ circuit board

22f, 24a, 32d, 32f, 32g, 52g, 52f, 62g, 62f, 84a‧‧‧Decoction

33d‧‧‧Cuts

56a, 56b‧‧‧ non-vaported parts

56c, 56d‧‧‧ evaporated electrode

56e, 56f‧‧‧Fuse

56g, 56h‧‧‧ collector

Fig. 1 is a cross-sectional view showing an aluminum electrolytic capacitor which is an example of an electronic component according to Embodiment 1 of the present invention.

Fig. 2 is a perspective view showing an expanded portion of a capacitor element of the aluminum electrolytic capacitor shown in Fig. 1.

Fig. 3A is a cross-sectional view showing a manufacturing step of a wire used in the aluminum electrolytic capacitor shown in Fig. 1.

Fig. 3B is a cross-sectional view showing the manufacturing steps of the wire after the third drawing.

Figure 3C is a cross-sectional view showing the manufacturing steps of the wire following the 3B drawing.

Figure 3D is a cross-sectional view showing the manufacturing steps of the wire following the 3C figure.

Fig. 3E is a cross-sectional view showing the manufacturing steps of the wire after the 3D drawing.

Fig. 4A is a cross-sectional view showing the manufacturing steps of the wire which is carried out before the 3A drawing.

Fig. 4B is a cross-sectional view showing the manufacturing steps of the wire after Fig. 4A.

Fig. 5 is a cross-sectional view showing an aluminum electrolytic capacitor which is an example of an electronic component according to a second embodiment of the present invention.

Fig. 6 is a perspective view showing the expanded portion of the capacitor element of the aluminum electrolytic capacitor shown in Fig. 5.

Fig. 7A is a cross-sectional view showing a manufacturing step of a wire used for the aluminum electrolytic capacitor shown in Fig. 5.

Fig. 7B is a cross-sectional view showing the manufacturing steps of the wire after the Fig. 7A.

Figure 7C is a cross-sectional view showing the manufacturing steps of the wire after the 7B.

Fig. 7D is a cross-sectional view showing the manufacturing steps of the wire after the 7Cth drawing.

Figure 7E is a cross-sectional view showing the manufacturing steps of the wire after the 7D.

Figure 7F is a cross-sectional view showing the manufacturing steps of the wire after the 7E drawing.

Figure 7G is a cross-sectional view showing the manufacturing steps of the wire after the 7F.

Fig. 8A is a cross-sectional view showing another manufacturing step of the wire used for the aluminum electrolytic capacitor shown in Fig. 5.

Figure 8B is a cross-sectional view of the wire fabrication step following Figure 8A.

Fig. 9 is a cross-sectional view showing a film capacitor of an example of an electronic component according to a third embodiment of the present invention.

Fig. 10 is a developed perspective view showing a capacitor element of the film capacitor shown in Fig. 9.

Fig. 11A is a cross-sectional view showing a manufacturing step of a wire used for the film capacitor shown in Fig. 9.

Figure 11B is a cross-sectional view showing the manufacturing steps of the wire after the 11A.

Figure 11C is a cross-sectional view showing the manufacturing steps of the wire after the 11B.

Figure 11D is a cross-sectional view showing the manufacturing steps of the wire after the 11C chart.

Figure 11E is a cross-sectional view showing the manufacturing steps of the wire after the 11D.

Figure 11F is a cross-sectional view showing the manufacturing steps of the wire after the 11E.

Figure 11G is a cross-sectional view showing the manufacturing steps of the wire after the 11F.

Fig. 12 is a cross-sectional view showing an aluminum electrolytic capacitor which is an example of an electronic component according to a fourth embodiment of the present invention.

Fig. 13 is a perspective view showing the expanded portion of the capacitor element of the aluminum electrolytic capacitor shown in Fig. 12.

Fig. 14 is a cross-sectional view showing an aluminum electrolytic capacitor which is an example of an electronic component according to a fifth embodiment of the present invention.

Fig. 15 is a perspective view showing the expanded portion of the capacitor element of the aluminum electrolytic capacitor shown in Fig. 14.

Fig. 16A is a cross-sectional view showing the manufacturing steps of the wires used in the aluminum electrolytic capacitor shown in Fig. 14.

Figure 16B is a cross-sectional view showing the manufacturing steps of the wire after the 16A.

Figure 16C is a cross-sectional view showing the manufacturing steps of the wire after the 16B.

Figure 16D is a cross-sectional view showing the manufacturing steps of the wire after the 16Cth drawing.

Figure 16E is a cross-sectional view showing the manufacturing steps of the wire after the 16D.

Figure 16F is a cross-sectional view showing the manufacturing steps of the wire after the 16E drawing.

Figure 17 is a cross-sectional view of a conventional aluminum electrolytic capacitor.

Figure 18 is a perspective view of the wire used in the aluminum electrolytic capacitor shown in Figure 17.

Figure 19 is a cross-sectional view of the wire shown in Figure 18.

11‧‧‧Wire

12‧‧‧ lead electrode

12c‧‧‧ front end

12d‧‧‧Metal diffusion layer

12e‧‧‧flat section

14‧‧‧ Cap

15‧‧‧terminal

16‧‧‧ capacitor components

17‧‧‧Shell

17a‧‧‧Extension Processing Department

18‧‧‧ Sealing body

18a‧‧‧through hole

19‧‧‧Insulated terminal block

19a‧‧‧through hole

19b‧‧‧Slots

20‧‧‧ circuit board

Claims (18)

An electronic component comprising: a functional component; an extraction electrode, which is made of aluminum and is drawn from the functional component; and a cap, which is made of a metal which is harder than the aforementioned extraction electrode and is mainly made of iron. At the end of the aforementioned lead electrode. The electronic component of claim 1, wherein the material of the cap has a melting point higher than a melting point of the material of the lead electrode. The electronic component of claim 1, wherein the cap is formed by plating at least one of nickel, copper and tin on the surface of the iron. The electronic component of claim 1 further includes a terminal, and the terminal is welded to the outer surface of the cap. The electronic component of claim 1 further includes a terminal, and the terminal is integrally formed on the outer surface of the cap. A wire comprising: an extraction electrode made of aluminum; and a cap made of a metal which is harder than the aforementioned extraction electrode and is mainly made of iron and covers the front end of the extraction electrode. The wire of claim 6 wherein the material of the cap is higher than the melting point of the material of the lead electrode. The lead wire according to claim 6, wherein the cap is formed by plating at least one of nickel, copper and tin on the surface of the iron material. The wire of claim 6 further includes a terminal that is welded to the outer surface of the cap. The wire of claim 6, further comprising a terminal integrally formed on the outer surface of the cap. A lead wire according to claim 6, wherein a metal diffusion layer is formed between the cap and the front end portion, and the metal diffusion layer is composed of a metal constituting the cap and a metal constituting the extraction electrode. A lead wire according to claim 6, wherein the opposite end side of the front end portion of the lead electrode has a flat portion. A method for manufacturing a wire, comprising: A step of capping an inner diameter larger than an outer diameter of a front end portion of a metal lead-out electrode, and a cap made of a metal harder than the lead-out electrode, covering the front end of the lead-out electrode And the step B, wherein the front end portion of the lead electrode is deformed by the inner side of the cap, and the front end portion and the cap are crimped. The method for manufacturing a lead wire according to claim 13, wherein in the step A, the inner bottom surface of the cap is brought into contact with an end surface of the front end portion of the lead electrode, and the step B has a step B1 of holding the foregoing Extending the outer peripheral surface of the electrode to expose the front end portion of the extraction electrode; and step B2, pressing the outer surface of the cap to deform the front end portion of the extraction electrode by the inner side of the cap The outer diameter becomes larger. The method for manufacturing a lead wire according to claim 13 further includes a step C of welding the front end portion of the lead electrode after pressing the outer surface of the front end portion of the lead electrode and the inner surface of the cap Outside with the inner face of the aforementioned cap. The method for manufacturing a wire according to claim 13 further includes a step of fusing the terminal to the outer surface of the cap. The manufacturing method of the wire of claim 13 of the patent application is as described above. The terminal is integrally formed on the bottom surface of the cover. A method for manufacturing an electronic component, comprising: step A, wherein a cap having an inner diameter larger than an outer diameter of a front end portion of the metal lead-out electrode and a hard metal other than the lead-out electrode is covered by the lead electrode The front end portion; in the step B, the front end portion of the lead electrode is deformed by the inner side of the cap, and the front end portion and the cap are crimped to form a lead wire; and the E step is to connect the lead wire to the functional element .