WO2017128822A1 - Pcba板的封胶方法 - Google Patents

Pcba板的封胶方法 Download PDF

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Publication number
WO2017128822A1
WO2017128822A1 PCT/CN2016/107192 CN2016107192W WO2017128822A1 WO 2017128822 A1 WO2017128822 A1 WO 2017128822A1 CN 2016107192 W CN2016107192 W CN 2016107192W WO 2017128822 A1 WO2017128822 A1 WO 2017128822A1
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Prior art keywords
pcba board
pcba
region
nozzle
glue
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PCT/CN2016/107192
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English (en)
French (fr)
Inventor
朱建晓
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苏州康尼格电子科技股份有限公司
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Publication of WO2017128822A1 publication Critical patent/WO2017128822A1/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/02—Processes for applying liquids or other fluent materials performed by spraying

Definitions

  • the present invention relates to the field of electronic component packaging, and in particular to a method of sealing a PCBA board.
  • PCBA printed Circuit Board+Assembly
  • PCBA Printed Circuit Board+Assembly
  • PCBA Printed Circuit Board+Assembly
  • potting and low-pressure injection molding methods on the surface of the board.
  • Each of the above methods has its own advantages and disadvantages: direct spraying of three anti-paint, although the operation is simple, convenient and easy to implement, but can not really protect the circuit board, can not achieve waterproof, shockproof, for a long time, the package may be invalid; Potting, cumbersome operation, low efficiency, high cost and poor reliability; low-pressure injection molding, using low-pressure injection molding equipment, through the special mold, adjust the corresponding injection pressure and time to complete the circuit board packaging, the method of mold design and production cost High, the characteristics of the glue itself have a great influence on the package.
  • a low-voltage injection molding method is generally used to package a circuit board to achieve a waterproof seal, an insulation flame retardant effect.
  • the required size of the packaged circuit board is getting larger and larger, and the thickness of the product is getting thinner and thinner.
  • Low-voltage injection molding methods have been unable to meet the packaging requirements of such boards.
  • the present application provides a new method for sealing a PCBA board, so that the circuit board can be packaged conveniently and quickly to meet the increasing packaging requirements.
  • the present application provides a method for sealing a PCBA board, including:
  • the nozzle moves to a preset position of the PCBA board to start the dispensing position
  • the nozzle is sprayed onto the PCBA board according to a predetermined rule.
  • the method further includes:
  • the spraying the nozzle to the PCBA board according to a predetermined rule comprises: The positional relationship between the shot coordinates and the 3D model and the corresponding relationship are sprayed onto the PCBA board according to a predetermined rule.
  • the constructing a three-dimensional coordinate system having a mapping coordinate of the nozzle and a 3D model of the PCBA board includes:
  • a 3D model of the PCBA board is input into the three-dimensional coordinate system.
  • the PCBA board has a first area that is less than a preset height from a bottom surface of the PCBA board and a second area that is greater than a preset height from a bottom surface of the PCBA board;
  • the method further includes:
  • the nozzle is sprayed to the first region or the second region in accordance with a predetermined rule.
  • the predetermined rule includes:
  • the showerhead is located at a predetermined distance of the PCBA board during the dispensing process.
  • the predetermined rule includes:
  • the spray direction of the spray head is always perpendicular to the sprayed surface of the PCBA board during the glue spraying process.
  • the predetermined rule includes:
  • the spray head is always located above the gravure surface of the PCBA plate in the direction of gravity during the glue dispensing process.
  • the predetermined rule includes:
  • the spray head performs a fill-in coating onto the first region when the first region is sprayed.
  • the predetermined rule includes:
  • the spray head performs a coating spray to the second region when the second region is sprayed.
  • the predetermined rule includes:
  • a predetermined distance is maintained between the showerhead and the bottom surface of the PCBA panel when the first region is sprayed.
  • the predetermined rule includes:
  • the spray head maintains a predetermined distance from the sprayed surface of the PCBA sheet when the second region is sprayed.
  • the showerhead and the PCBA board each have six degrees of freedom.
  • the method further includes:
  • the step of moving the nozzle to the preset starting glue position of the PCBA board comprises: moving the nozzle to a preset starting glue position of the sealing area.
  • the preset starting glue position is located at a boundary position of the sealing area.
  • the method further includes:
  • the spray head begins to dispense.
  • the present application provides a new method for sealing a PCBA board by providing a PCBA board to a preset area of the sealing equipment workbench, and then moving the nozzle to a preset start of the PCBA board.
  • the glue position finally controls the nozzle to spray the PCBA board according to a predetermined rule, and the mold sealing method of the PCBA board of the present application can conveniently and quickly package the circuit board to meet the increasing packaging requirements.
  • FIG. 1 is a flow chart of a method for sealing a PCBA board provided by an embodiment of the present application
  • FIG. 2 is a schematic flow chart of constructing a three-dimensional coordinate system having a mapping coordinate of the nozzle and a 3D model of the PCBA board according to an embodiment of the present application.
  • an embodiment of the present application provides a method for sealing a PCBA board, which is applied to a glue sealing operation to a PCBA board.
  • the sealing method of the PCBA board includes the following steps:
  • the workbench of the sealing device is used to receive or place the PCBA board, and the sealing operation can be performed when the PCBA board is located in the preset area.
  • the preset area may be a receiving surface or a space of the workbench, or may be a partial surface of the workbench, and the shape may be a rectangular area, a square area or other regular shapes. Of course, the irregular shape may also be applied, and the present application is not limited thereto.
  • the shape of the preset area can also be matched with the shape of the PCBA board, so that the PCBA board is just matched and snapped when placed in the preset area, which is convenient for the nozzle to spray the glue.
  • a single PCBA board can be placed at the same time in the same glue area, or multiple PCBA boards can be placed. In the case where a plurality of PCBA boards are placed at the same time, they may be placed in a predetermined area in a tiled manner.
  • the PCBA board can be transferred by the robot and the conveyor belt of the sealing device, for example, the PCBA board is transported to the workbench in the form of a production line by the conveyor belt, or the conveyor belt carrying the PCBA board is moved to a predetermined position for spraying.
  • the conveyor belt is also used as a workbench).
  • the PCBA board can also be placed in the preset area by manual placement.
  • the workbench can be set in the real environment, and then the glue sealing operation can be directly performed under normal temperature and normal pressure; the worktable can also be set in a closed environment, thereby completing Sealing operation required for high sealing high quality sealing.
  • the nozzle moves to a preset position of the PCBA board to start the glue position.
  • the nozzle can be moved to a preset starting position of the PCBA board by a predetermined manner.
  • the predetermined manner may be manual movement to the preset starting glue spraying position, or may be determined for the sealing device itself.
  • the spray head is at the preset start spray position, the glue head is started to be sprayed to the spray head to start the glue spray.
  • the preset starting position of the glue can be any position at a certain distance above the surface of the glue on the PCBA board, and the application does not impose any limitation.
  • the preset start position may be set.
  • the first area is preferred.
  • the movement of the nozzle can be translational and rotational, and the nozzle can be provided with an adjustment mechanism such as a telescopic arm and a universal joint.
  • the sealing device itself may have a virtual three-dimensional coordinate system corresponding to the real coordinate system in which the nozzle is located, and the nozzle has corresponding mapping coordinates in the three-dimensional coordinate system, and the mapping coordinates and three-dimensional The correspondence between the coordinate system and the real coordinate system can adjust the position (degree of freedom) of the nozzle by moving and/or rotating.
  • the nozzle When the nozzle sprays the PCBA board, the nozzle itself needs to maintain the temperature equal to or close to the temperature of the glue, thereby preventing the glue from solidifying or carbonizing in the nozzle and preventing the nozzle from being blocked.
  • the predetermined rule may be a predetermined spraying route of the nozzle, and the nozzle sprays the PCBA board according to the predetermined spraying route, and the predetermined spraying route may be an “S” or “N”-shaped route, or may be The center of the PCBA board is sprayed in a circular path and gradually increases the radius of the circular track. Of course, it can also be sprayed in the form of a broken line. It can be seen that the predetermined spray route can have various forms, and it is only necessary to complete the seal in the present embodiment.
  • the predetermined rule may include: the showerhead is located at a preset distance of the PCBA board during the glue spraying process.
  • the preset distance may be the distance from the glue outlet of the nozzle to the PCBA board, thereby preventing the PCBA board from blocking the glue outlet of the nozzle, and failing to smoothly discharge the glue.
  • the preset distance may be the distance from the spray head to the spray surface or the distance from the spray head to the bottom surface of the PCBA board (the surface of the PCB). By providing the preset distance, the nozzle can be smoothly dispensed.
  • the PCBA board includes the PCB board and the electronic components mounted on the PCB board, some electronic components except the patch electronic components have a higher height on the PCB board, and if all are filled with the flat coating, the glue is made. If the thickness of the film is too large, the amount of glue used is too large, resulting in an excessive cost.
  • the PCBA board may be divided into a first area from the bottom surface of the PCBA board (the surface of the PCB board) having a height less than a preset height and a second area having a height from the bottom surface of the PCBA board being greater than a preset height. .
  • the distribution is patch electronic components, such as chip resistors, chip capacitors, and gaps between electronic components.
  • a predetermined distance may be maintained between the showerhead and the bottom surface of the PCBA board when the first area is sprayed.
  • the nozzles still need to be higher than the highest electronic components in the first area.
  • the electronic components on the second area have a large volume, and most of them are electronic components that cannot be patched.
  • the second region needs to be separately sprayed, and the filling can not be performed in a flat manner.
  • Spray glue When the second region is separately sprayed, it can also be understood that the electronic component of the second region is separately sprayed, and the object of the glue is the surface of the electronic component.
  • the sprayed surface of the PCBA board in the second region That is, the surface of the electronic component on the second region, and therefore, when the second region is sprayed, a predetermined distance can be maintained between the showerhead and the sprayed surface of the PCBA board.
  • the preset distance between the nozzle and the PCBA board may be a range value or a specific value.
  • the preset distance can be a range value
  • the nozzle can be sprayed in the first area.
  • the undulations occur as the surface of the PCBA board changes; when the preset distance is a specific value, the nozzle can move in a horizontal plane during the spraying process.
  • the setting of the preset distance needs to be set according to the type of the glue, the temperature, the speed at which the nozzle travels, the type of the PCBA board, and the thickness of the sealant. In practice, it can be specifically set according to the actual situation. Not limited.
  • the predetermined rule may include that the spray direction of the spray head is always perpendicular to the sprayed surface of the PCBA board during the glue spraying process. With this setting, a better sealing effect can be ensured.
  • the glue outlet of the nozzle can be disposed opposite the spray surface of the PCBA board. According to the above description, when the PCBA board has the first area and the second area, the nozzle sprays the glue vertically when spraying the first area, and maintains the vertical glue when transferring to the second area.
  • the predetermined rule may include that the nozzle is always located above the direction of gravity of the glue surface of the PCBA board during the glue spraying process.
  • the nozzle is always located above the direction of gravity of the glue surface of the PCBA board during the glue spraying process.
  • the present embodiment provides a new method for sealing a PCBA board, by providing a PCBA board to a preset area of the sealing equipment workbench, and then moving the nozzle to a preset of the PCBA board.
  • the sealing method of the PCBA board of the present embodiment can conveniently and quickly package the circuit board to meet the increasing packaging requirements. .
  • the sealing method of the PCBA board may further include the following steps:
  • the spraying the nozzle to the PCBA board according to a predetermined rule comprises: S300, determining a positional relationship between the mapping coordinates based on the nozzle and the 3D model, and the corresponding relationship is predetermined
  • the nozzle is regularly sprayed onto the PCBA board.
  • step S10 the execution sequence of the step S12 and the step S10 is not fixed, and the step S10 may be performed first or the step S12 may be performed first, and the present application is not limited thereto.
  • step S10 can be performed first as a preferred solution.
  • the constructing the mapping coordinate with the nozzle and the three-dimensional coordinate system of the 3D model of the PCBA board may include the following steps:
  • the three-dimensional coordinate system nozzle and the PCBA board are located in a real coordinate system
  • the coordinate system of the PCBA board may be a coordinate system established by the preset area of the worktable, the predetermined position point of the preset area and the Corresponding to the origin of the three-dimensional coordinate system, a realistic coordinate system is constructed, and the real coordinate system has a preset correspondence relationship with the three-dimensional coordinate system.
  • the coordinate system where the PCBA board is located and the three-dimensional coordinate system may also have a non-preset correspondence relationship.
  • the position of the corner of the PCBA board is obtained by scanning, and the real coordinate system is established with the corner position as the origin, and then the correspondence between the PCB and the three-dimensional coordinate system is obtained. relationship.
  • a certain coordinate point in the three-dimensional coordinate system may find a corresponding mapping coordinate, that is, a corresponding real position, in a coordinate system in which the PCBA board is located.
  • the position of the nozzle in reality can be moved.
  • the PCBA board is reflected into a 3D model in a three-dimensional coordinate system, and the positional relationship between the mapping coordinates of the 3D model and the nozzle in the three-dimensional coordinate system is the positional relationship between the PCBA board and the nozzle in reality, and the corresponding relationship is correspond.
  • the 3D model of the PCBA board may be input into the three-dimensional coordinate system by inputting a drawing, or the PCBA may be input into the three-dimensional coordinate system by directly drawing and constructing in a three-dimensional coordinate system.
  • a 3D model of the board of course, the PCBA can also be input into the three-dimensional coordinate system by scanning 3D model of the board.
  • the PCBA board includes the PCB board and the electronic components mounted on the PCB board, and some of the electronic components except the patch electronic components are higher on the PCB board, if all are filled and filled
  • the PCBA board may be divided into a first area from the bottom surface of the PCBA board (the surface of the PCB board) having a height less than a preset height and a second area having a height from the bottom surface of the PCBA board being greater than a preset height.
  • the method may further comprise the following steps:
  • the PCBA board is such that the head sprays the first area or the second area according to a predetermined rule.
  • the spray head performs a fill-in coating onto the first region when the first region is sprayed.
  • the gap between the electronic components in the first region can be filled until the electronic component is covered (also understood as covering), thereby completing the sealing.
  • the electronic components on the second area have a large volume, and most of them are electronic components that cannot be patched.
  • the second region needs to be separately sprayed, and the filling can not be performed in a flat manner.
  • Spray glue When the second region is separately sprayed, it can also be understood that the electronic component of the second region is separately sprayed, and the object of the glue is the surface of the electronic component.
  • the sprayed surface of the PCBA board in the second region That is, the surface of the electronic component on the second region, and therefore, when the second region is sprayed, a predetermined distance can be maintained between the showerhead and the sprayed surface of the PCBA board.
  • the spray head performs a coating spray to the second region when the second region is sprayed.
  • the glue spray only needs to cover the surface of the second area electronic component.
  • the nozzle and/or the PCBA may be moved and/or rotated according to a positional relationship between the mapping coordinates of the nozzle and the 3D model and the corresponding relationship.
  • the showerhead and the PCBA board may each have six degrees of freedom.
  • the sealing method of the PCBA board may further include the following steps:
  • moving the nozzle to a preset starting glue position of the PCBA board comprises: moving the nozzle to a preset starting glue position of the sealing area.
  • the sealing area can be specified in step S15, and the nozzle can only perform the spraying operation on the sealing area after the sealing area is divided by the PCBA board.
  • the sealing area can be selected by the selected method, and the sealing device can obtain the sealing area by receiving the selected information, which is very convenient.
  • the preset start glue position may be located at a boundary position of the sealant area.
  • the sealing method of the PCBA board may further include the following steps:
  • steps S40, S50 and other steps have no obvious execution sequence.
  • step S40 may be performed before sealing, and for the same type of PCBA board, the required amount of glue is required. basically the same.
  • the amount of the glue can be set according to the amount required for a single injection. For example, if a single injection requires about 10 g, then 10 g of the glue or a glue of slightly more than 10 g can be used.
  • the amount of the molten glue can be controlled according to the demand of the injection product, and the amount of the glue produced by the melt at one time is substantially equal to the amount of one injection or the amount of a PCBA plate, and the melt is obtained. Use to meet the continuous production requirements of the production line.
  • any numerical value recited herein includes all values of the lower and upper values in increments of one unit from the lower limit to the upper limit, and at least two unit intervals between any lower value and any higher value. Just fine. For example, if the number of components or process variables (eg, temperature, pressure, time, etc.) is stated to be from 1 to 90, preferably from 20 to 80, more preferably from 30 to 70, the purpose is to illustrate Values such as 15 to 85, 22 to 68, 43 to 51, 30 to 32 are also explicitly recited in the specification. For values less than 1, one unit is appropriately considered to be 0.0001, 0.001, 0.01, 0.1. These are merely examples that are intended to be expressly stated, and all possible combinations of numerical values recited between the minimum and maximum values are considered to be explicitly described in this specification in a similar manner.
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Abstract

PCBA板的封胶方法，包括：向封胶设备工作台的预设区域提供PCBA板(S10)；喷头移动至PCBA板的预设开始喷胶位置(S20)；按照预定规则，喷头向PCBA板喷胶(S30)。该PCBA板的封胶方法进一步包括：构建具有喷头的映射坐标及PCBA板的3D模型的三维坐标系；基于喷头的映射坐标与3D模型的位置及对应关系；按照预定规则，喷头向PCBA板喷胶。

Description

PCBA板的封胶方法
交叉参考相关引用
本申请要求2016年1月28日递交的申请号为201610061036.X、发明名称为“PCBA板的封胶方法”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本发明涉及电子元件封装领域，尤其涉及一种PCBA板的封胶方法。
背景技术
PCBA(Printed Circuit Board+Assembly)板的封装方法很多，如在电路板表层涂三防漆、灌封和低压注塑等封装方法。上述每种方法都有各自的优缺点：直接喷涂三防漆，虽然操作简单、方便、易实现，但不能对电路板进行真正的防护，不能实现防水、防震，时间久了，封装可能失效；灌封，操作繁琐、效率低、成本高且可靠性差；低压注塑，利用低压注塑设备，通过专用的模具、调整相应的注胶压力和时间完成对电路板封装，该方法模具设计和制作成本较高，胶本身的特性对封装影响较大。
现有技术中，普遍采用低压注塑方法封装电路板以达到防水密封、绝缘阻燃的效果。但由于科技水平的不断提高，所要求包封的电路板规格尺寸越来越大，产品的厚度越来越薄。低压注塑方法已不能满足此类电路板的封装要求。
发明内容
鉴于现有技术的不足，本申请提供一种新的PCBA板的封胶方法，以能够方便快捷的封装电路板，满足日益增长的封装要求。
为达到上述目的，本申请提供一种PCBA板的封胶方法，包括：
向封胶设备工作台的预设区域提供PCBA板；
喷头移动至所述PCBA板的预设开始喷胶位置；
按照预定规则所述喷头向所述PCBA板喷胶。
作为一种优选的实施方式，还包括：
构建具有所述喷头的映射坐标及所述PCBA板的3D模型的三维坐标系；所述三维坐标系与所述PCBA板所在的坐标系具有对应关系；
相应的，所述按照预定规则所述喷头向所述PCBA板喷胶包括：基于所述喷头的映 射坐标与所述3D模型的位置关系以及所述对应关系按照预定规则所述喷头向所述PCBA板喷胶。
作为一种优选的实施方式，所述构建具有所述喷头的映射坐标及所述PCBA板的3D模型的三维坐标系包括：
构建三维坐标系，所述三维坐标系中具有所述喷头的映射坐标；
获取所述PCBA板所在的坐标系与所述三维坐标系的对应关系；
向所述三维坐标系中输入所述PCBA板的3D模型。
作为一种优选的实施方式，所述PCBA板具有距离所述PCBA板底面的高度小于预设高度的第一区域和距离所述PCBA板底面的高度大于预设高度的第二区域；
所述方法还包括：
在所述喷头由所述第一区域移至所述第二区域或由所述第二区域移至所述第一区域喷胶时，移动和/或旋转所述喷头和/或所述PCBA板以使所述喷头按照预定规则向所述第一区域或所述第二区域喷胶。
作为一种优选的实施方式，所述预定规则包括：
在喷胶过程中所述喷头位于所述PCBA板的预设距离处。
作为一种优选的实施方式，所述预定规则包括：
在喷胶过程中所述喷头的喷胶方向与所述PCBA板的喷涂表面始终垂直。
作为一种优选的实施方式，所述预定规则包括：
在喷胶过程中所述喷头始终位于所述PCBA板的喷胶表面的沿重力方向的上方。
作为一种优选的实施方式，所述预定规则包括：
在喷涂所述第一区域时，所述喷头向所述第一区域执行填平包覆喷胶。
作为一种优选的实施方式，所述预定规则包括：
在喷涂所述第二区域时，所述喷头向所述第二区域执行包覆喷胶。
作为一种优选的实施方式，所述预定规则包括：
在喷涂所述第一区域时，所述喷头与所述PCBA板的底面之间保持预设距离。
作为一种优选的实施方式，所述预定规则包括：
在喷涂所述第二区域时，所述喷头与所述PCBA板的喷涂表面之间保持预设距离。
作为一种优选的实施方式，所述喷头与所述PCBA板均具有六个自由度。
作为一种优选的实施方式，还包括：
获取所述PCBA板的封胶区域；
相应的，所述喷头移动至所述PCBA板的预设开始喷胶位置包括：喷头移动至所述封胶区域的预设开始喷胶位置。
作为一种优选的实施方式，所述预设开始喷胶位置位于所述封胶区域的边界位置。
作为一种优选的实施方式，还包括：
获取封装所述PCBA板所需的胶液量；
在熔胶产生与所述胶液量相匹配的胶液时，所述喷头开始喷胶。
通过以上描述可以看出，本申请提供一种新的PCBA板的封胶方法，通过向封胶设备工作台的预设区域提供PCBA板，再将喷头移动至所述PCBA板的预设开始喷胶位置，最后按照预定规则控制所述喷头向所述PCBA板喷胶，无须提供模具，所以本申请的PCBA板的封胶方法能够方便快捷的封装电路板，满足日益增长的封装要求。
参照后文的说明和附图，详细公开了本发明的特定实施方式，指明了本发明的原理可以被采用的方式。应该理解，本发明的实施方式在范围上并不因而受到限制。在所附权利要求的精神和条款的范围内，本发明的实施方式包括许多改变、修改和等同。
针对一种实施方式描述和/或示出的特征可以以相同或类似的方式在一个或更多个其它实施方式中使用，与其它实施方式中的特征相组合，或替代其它实施方式中的特征。
应该强调，术语“包括/包含”在本文使用时指特征、整件、步骤或组件的存在，但并不排除一个或更多个其它特征、整件、步骤或组件的存在或附加。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域技术人员来讲，在不付出创造性劳动性的前提下，还可以根据这些附图获得其他的附图。
图1是本申请一种实施方式所提供的PCBA板的封胶方法的流程图；
图2是本申请一种实施方式所提供的构建具有所述喷头的映射坐标及所述PCBA板的3D模型的三维坐标系的流程示意图。
具体实施方式
为了使本技术领域的人员更好地理解本申请中的技术方案，下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实 施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有做出创造性劳动的前提下所获得的所有其他实施例，都应当属于本发明保护的范围。
需要说明的是，当元件被称为“设置于”另一个元件，它可以直接在另一个元件上或者也可以存在居中的元件。当一个元件被认为是“连接”另一个元件，它可以是直接连接到另一个元件或者可能同时存在居中元件。本文所使用的术语“垂直的”、“水平的”、“左”、“右”以及类似的表述只是为了说明的目的，并不表示是唯一的实施方式。
除非另有定义，本文所使用的所有的技术和科学术语与属于本发明的技术领域的技术人员通常理解的含义相同。本文中在本发明的说明书中所使用的术语只是为了描述具体的实施方式的目的，不是旨在于限制本发明。本文所使用的术语“和/或”包括一个或多个相关的所列项目的任意的和所有的组合。
请参考图1，本申请一种实施方式提供一种PCBA板的封胶方法，该方法应用于向PCBA板喷胶封胶作业。在本实施方式中，所述PCBA板的封胶方法包括以下步骤：
S10、向封胶设备工作台的预设区域提供PCBA板。
在本步骤中，封胶设备的工作台用于承接或放置PCBA板，当PCBA板位于预设区域时才可进行封胶作业。预设区域可以为工作台的承接表面或空间，也可以为工作台的部分表面，其形状可以为矩形区域、方形区域或其他规则形状，当然不规则形状也可以适用，本申请并不作限制。预设区域的形状也可以与PCBA板的形状相匹配，进而将PCBA板放置于预设区域时正好匹配卡合，便于喷头喷胶作业。同一喷胶区域可以一次放置单个PCBA板，也可以放置多个PCBA板。在多个PCBA板同时放置的情况下，可以以平铺的形式在预设区域进行放置。
在本步骤中，可以采用封胶设备的机械手、传送带传递PCBA板，比如，通过传送带按照生产线的形式将PCBA板传送至工作台上，或者传送带承载PCBA板移动到预定位置进行喷胶(此时，传送带同时也作为工作台)。当然，在本步骤中也可以采用人工放置的形式向预设区域内放置PCBA板。
本实施方式中，对于封胶环境并无过多要求，工作台可以设置于现实环境中，进而直接在常温常压下进行喷胶封胶作业；工作台也可以设置于封闭环境中，进而完成高密封高质量封胶要求的封胶作业。
S20、喷头移动至所述PCBA板的预设开始喷胶位置。
在本步骤中，喷头可以通过预定方式移动至所述PCBA板的预设开始喷胶位置。预定方式可以为人工移动至预设开始喷胶位置，也可以为封胶设备自身判别选取。当喷头位于预设开始喷胶位置时，开始向喷头进行输送胶液喷头开始喷胶。
预设开始喷胶位置可以为位于PCBA板的喷胶表面上方一定距离的任一位置，本申请并不作任何限制。作为优选的，在PCBA板具有距离所述PCBA板底面的高度小于预设高度的第一区域和距离所述PCBA板底面的高度大于预设高度的第二区域时，可以将预设开始位置设置于第一区域作为较佳的方案。
在本实施方式中，喷头的移动可以为平移、旋转，喷头可以带有调节机构，比如伸缩臂、万向节。具体的，封胶设备自身可以具有虚拟的三维坐标系，该三维坐标系与喷头所在的现实坐标系相对应，喷头在所述三维坐标系中具有对应的映射坐标，通过所述映射坐标及三维坐标系与现实坐标系的对应关系即可通过移动和/或旋转调整喷头的位置(自由度)。
S30、按照预定规则所述喷头向所述PCBA板喷胶。
喷头向PCBA板喷胶时，喷头自身需要保持和胶液温度相等或相近的温度，进而避免胶液在喷头凝固或碳化，防止堵塞喷头。
在本实施方式中，预定规则可以为喷头的预定喷胶路线，喷头按照预定喷胶路线对PCBA板进行喷胶，预定喷胶路线可以为“S”或“N”形路线、也可以为在PCBA板的中心以圆形轨迹路线进行喷胶并逐步增大圆形轨迹的半径，当然，还可以按照折线形式进行喷胶。可以看出，所述预定喷胶路线可以具有多种形式，只需在本实施方式中能够完成封胶即可。
另外的，在本实施方式中，所述预定规则可以包括：在喷胶过程中所述喷头位于所述PCBA板的预设距离处。其中，预设距离可以为喷头的出胶口距离PCBA板的距离，进而避免PCBA板堵塞喷头的出胶口，无法顺畅出胶。该预设距离可以为喷头距离喷涂表面的距离，也可以为喷头距离PCBA板的底面(PCB板的表面)的距离。通过设有该预设距离，可以保证喷头顺利出胶。
考虑到PCBA板包括有PCB板及安装在PCB板上的电子元件，而除去贴片电子元件外有些电子元件在PCB板上的高度较高，如果全部采用填平包覆喷胶，则使得胶膜的厚度过大，使用胶量过多，导致成本过大。为避免这种情况，PCBA板可以分为距离所述PCBA板底面(PCB板的表面)的高度小于预设高度的第一区域和距离所述PCBA板底面的高度大于预设高度的第二区域。
在第一区域上，大多分布的为贴片电子元件，比如贴片电阻、贴片电容，以及电子元件之间的间隙。在喷涂第一区域时，所述喷头与所述PCBA板的底面之间可以保持预设距离。当然，在第一区域上喷头依然需要高于最高的电子元件。
在第二区域上的电子元件体积高度较大，多为一些无法进行贴片的电子元件，此时，为避免附壁效应，需要对第二区域单独进行喷胶，无法再按照填平方式进行喷胶。对第二区域单独喷胶时，也可以理解为对第二区域的电子元件进行单独喷胶，喷胶的对象为电子元件的表面，此时，在第二区域中所述PCBA板的喷涂表面即为第二区域上的电子元件的表面，因此，在喷涂所述第二区域时，所述喷头与所述PCBA板的喷涂表面之间可以保持预设距离。
需要说明的是，所述喷头与所述PCBA板之间的预设距离可以为一范围值也可以为一具体数值，比如：在预设距离可以为一范围值时喷头可以在喷涂第一区域时随着PCBA板表面的高低变化进行起伏；在预设距离为具体数值时，喷头在喷涂过程中可以在一水平面内移动。
当然，预设距离的设置还需要按照胶液的种类、温度、喷头行进的速度、PCBA板的种类样式、封胶的厚度等参数进行设置，实际中可以根据实际情况具体设定，本申请并不作限定。
可行的，所述预定规则可以包括：在喷胶过程中所述喷头的喷胶方向与所述PCBA板的喷涂表面始终垂直。通过此种设置，可以保证较好的封胶效果。在实际中，可以将喷头的出胶口与所述PCBA板的喷涂表面相正对设置。承接上文描述，在PCBA板具有第一区域及第二区域时，喷头在喷涂第一区域时垂直喷胶，当转移至第二区域喷胶时依然保持垂直喷胶。
较佳的，所述预定规则可以包括：在喷胶过程中所述喷头始终位于所述PCBA板的喷胶表面的沿重力方向的上方。通过此种设置，可以最大限度地减少喷胶时胶液的喷胶方向受到的重力影响。承接上文描述，在PCBA板具有第一区域及第二区域时，喷头在喷涂第一区域时位于第一区域的上方，当转移至第二区域喷胶时喷头位于第二区域的上方。
通过以上描述可以看出，本实施方式提供一种新的PCBA板的封胶方法，通过向封胶设备工作台的预设区域提供PCBA板，再将喷头移动至所述PCBA板的预设开始喷胶位置，最后按照预定规则控制所述喷头向所述PCBA板喷胶，无须提供模具，所以，本实施方式的PCBA板的封胶方法能够方便快捷的封装电路板，满足日益增长的封装要求。
在一个实施方式中，所述PCBA板的封胶方法还可以包括以下步骤：
S12、构建具有所述喷头的映射坐标及所述PCBA板的3D模型的三维坐标系；所述三维坐标系与所述PCBA板所在的坐标系具有对应关系；
相应的，所述按照预定规则所述喷头向所述PCBA板喷胶(所述步骤320)包括：S300、基于所述喷头的映射坐标与所述3D模型的位置关系以及所述对应关系按照预定规则所述喷头向所述PCBA板喷胶。
在本实施方式中，步骤S12与步骤S10的执行顺序并不固定，可以先执行步骤S10也可以先执行步骤S12，本申请并不作限定。当然，可以以先执行步骤S10作为优选的方案。
请参考图2，在本实施方式中，所述构建具有所述喷头的映射坐标及所述PCBA板的3D模型的三维坐标系(所述步骤S12)可以包括以下步骤：
S121、构建三维坐标系，所述三维坐标系中具有所述喷头的映射坐标；
S122、获取所述PCBA板所在的坐标系与所述三维坐标系的对应关系；
S123、向所述三维坐标系中输入所述PCBA板的3D模型。
其中，所述三维坐标系喷头与PCBA板位于现实坐标系中，所述PCBA板所在的坐标系可以为工作台的上述预设区域所建立的坐标系，预设区域的预定位置点与所述三维坐标系的原点相对应进而构建现实坐标系，该现实坐标系与所述三维坐标系具有预设的对应关系。当PCBA板位于预设区域内时，可以通过扫描获取PCBA板的3D模型以及获取PCBA板在预设区域的位置，进而在所述三维坐标系中将PCBA板反映出来。
当然，所述PCBA板所在的坐标系与所述三维坐标系之间也可以为非预设的对应关系。当PCBA板放置于工作台的预设区域时，通过扫描获取PCBA板的边角位置，以该边角位置为原点建立现实坐标系，此时再获取其与所述三维坐标系之间的对应关系。
通过所述对应关系，所述三维坐标系中的某一坐标点可以在所述PCBA板所在的坐标系中找到所对应的映射坐标，即所对应的现实位置。基于该对应关系及所述喷头的映射坐标，可以移动喷头在现实中的位置。同时，所述PCBA板反映到三维坐标系中为3D模型，3D模型与喷头的映射坐标在三维坐标系中的位置关系即为现实中PCBA板与喷头的位置关系，并通过所述对应关系相对应。
在步骤S123中，可以通过输入图纸的方式向所述三维坐标系中输入所述PCBA板的3D模型，也可以在三维坐标系中直接绘制构建的方式向所述三维坐标系中输入所述PCBA板的3D模型，当然，还可以通过扫描的方式向所述三维坐标系中输入所述PCBA 板的3D模型。
在一个实施方式中，考虑到PCBA板包括有PCB板及安装在PCB板上的电子元件，而除去贴片电子元件外有些电子元件在PCB板上的高度较高，如果全部采用填平包覆喷胶，则使得胶膜的厚度过大，使用胶量过多，导致成本过大。为避免这种情况，PCBA板可以分为距离所述PCBA板底面(PCB板的表面)的高度小于预设高度的第一区域和距离所述PCBA板底面的高度大于预设高度的第二区域。基于此考虑，所述方法还可以包括以下步骤：
S30、在所述喷头由所述第一区域移至所述第二区域或由所述第二区域移至所述第一区域喷胶时，移动和/或旋转所述喷头和/或所述PCBA板以使所述喷头按照预定规则向所述第一区域或所述第二区域喷胶。
在第一区域上，大多分布的为贴片电子元件，比如贴片电阻、贴片电容，以及电子元件之间的间隙。在喷涂第一区域时，所述喷头与所述PCBA板的底面之间可以保持预设距离。当然，在第一区域上喷头依然需要高于最高的电子元件。另外，在喷涂所述第一区域时，所述喷头向所述第一区域执行填平包覆喷胶。填平包覆喷胶时，可以将第一区域中电子元件之间的缝隙填平直至将电子元件包覆(也可以理解为覆盖)，进而完成封胶。
在第二区域上的电子元件体积高度较大，多为一些无法进行贴片的电子元件，此时，为避免附壁效应，需要对第二区域单独进行喷胶，无法再按照填平方式进行喷胶。对第二区域单独喷胶时，也可以理解为对第二区域的电子元件进行单独喷胶，喷胶的对象为电子元件的表面，此时，在第二区域中所述PCBA板的喷涂表面即为第二区域上的电子元件的表面，因此，在喷涂所述第二区域时，所述喷头与所述PCBA板的喷涂表面之间可以保持预设距离。另外，在喷涂所述第二区域时，所述喷头向所述第二区域执行包覆喷胶。包覆喷胶时，所喷胶液只需将第二区域电子元件的表面覆盖即可。
具体的，在构建有上述三维坐标系的基础上，可以根据所述喷头的映射坐标与所述3D模型的位置关系以及所述对应关系来移动和/或旋转所述喷头和/或所述PCBA板，实现自动控制。所述喷头与所述PCBA板可以均可以具有六个自由度。
在一个实施方式中，所述PCBA板的封胶方法还可以包括以下步骤：
S15、获取所述PCBA板的封胶区域。
相应的，所述喷头移动至所述PCBA板的预设开始喷胶位置(所述步骤20)包括：喷头移动至所述封胶区域的预设开始喷胶位置。
在本申请中，当PCBA板放置于预设区域中，可以默认全部表面进行封胶或者上表面进行封胶。而在本实施方式中，为满足日益增长的封胶位置区域需求，可以通过步骤S15指定封胶区域，在PCBA板划分出封胶区域后喷头仅对封胶区域进行喷胶作业。
承接上一实施方式描述，在具有3D模型的三维坐标系中可以通过选定的方式进行选取封胶区域，封胶设备通过接收选取的信息进而获取封胶区域，十分便捷。具体的，所述预设开始喷胶位置可以位于所述封胶区域的边界位置。
在一个实施方式中，所述PCBA板的封胶方法还可以包括以下步骤：
S40、获取封装所述PCBA板所需的胶液量；
S50、在熔胶产生与所述胶液量相匹配的胶液时，所述喷头开始喷胶。
在本实施方式中，步骤S40、S50与其他步骤并无明显的执行先后顺序，为便于流水线作业，可以在封胶前执行步骤S40，而对于同一类型的PCBA板，其所需的胶液量基本相同。
所述胶液量可以根据单次注胶所需量进行设定，比如一次注胶大致需要10g，则熔胶10g或稍大于10g的胶液即可。在本实施方式中，可以根据注胶产品的需求来控制熔化胶液的量，熔胶一次制造出的胶液量，大致等于一次注胶的量或封装一个PCBA板的量，达到即熔即用，满足生产线的连续生产要求。
本文引用的任何数字值都包括从下限值到上限值之间以一个单位递增的下值和上值的所有值，在任何下值和任何更高值之间存在至少两个单位的间隔即可。举例来说，如果阐述了一个部件的数量或过程变量(例如温度、压力、时间等)的值是从1到90，优选从20到80，更优选从30到70，则目的是为了说明该说明书中也明确地列举了诸如15到85、22到68、43到51、30到32等值。对于小于1的值，适当地认为一个单位是0.0001、0.001、0.01、0.1。这些仅仅是想要明确表达的示例，可以认为在最低值和最高值之间列举的数值的所有可能组合都是以类似方式在该说明书明确地阐述了的。
除非另有说明，所有范围都包括端点以及端点之间的所有数字。与范围一起使用的“大约”或“近似”适合于该范围的两个端点。因而，“大约20到30”旨在覆盖“大约20到大约30”，至少包括指明的端点。
披露的所有文章和参考资料，包括专利申请和出版物，出于各种目的通过援引结合于此。描述组合的术语“基本由…构成”应该包括所确定的元件、成分、部件或步骤以及实质上没有影响该组合的基本新颖特征的其他元件、成分、部件或步骤。使用术语“包含”或“包括”来描述这里的元件、成分、部件或步骤的组合也想到了基本由这些元件、 成分、部件或步骤构成的实施方式。这里通过使用术语“可以”，旨在说明“可以”包括的所描述的任何属性都是可选的。
多个元件、成分、部件或步骤能够由单个集成元件、成分、部件或步骤来提供。另选地，单个集成元件、成分、部件或步骤可以被分成分离的多个元件、成分、部件或步骤。用来描述元件、成分、部件或步骤的公开“一”或“一个”并不说为了排除其他的元件、成分、部件或步骤。
应该理解，以上描述是为了进行图示说明而不是为了进行限制。通过阅读上述描述，在所提供的示例之外的许多实施方式和许多应用对本领域技术人员来说都将是显而易见的。因此，本教导的范围不应该参照上述描述来确定，而是应该参照所附权利要求以及这些权利要求所拥有的等价物的全部范围来确定。出于全面之目的，所有文章和参考包括专利申请和公告的公开都通过参考结合在本文中。在前述权利要求中省略这里公开的主题的任何方面并不是为了放弃该主体内容，也不应该认为发明人没有将该主题考虑为所公开的发明主题的一部分。

Claims (15)

  1. 一种PCBA板的封胶方法，其特征在于，包括：
    向封胶设备工作台的预设区域提供PCBA板；
    喷头移动至所述PCBA板的预设开始喷胶位置；
    按照预定规则所述喷头向所述PCBA板喷胶。
  2. 如权利要求1所述的方法，其特征在于，还包括：
    构建具有所述喷头的映射坐标及所述PCBA板的3D模型的三维坐标系；所述三维坐标系与所述PCBA板所在的坐标系具有对应关系；
    相应的，所述按照预定规则所述喷头向所述PCBA板喷胶包括：基于所述喷头的映射坐标与所述3D模型的位置关系以及所述对应关系按照预定规则所述喷头向所述PCBA板喷胶。
  3. 如权利要求2所述的方法，其特征在于，所述构建具有所述喷头的映射坐标及所述PCBA板的3D模型的三维坐标系包括：
    构建三维坐标系，所述三维坐标系中具有所述喷头的映射坐标；
    获取所述PCBA板所在的坐标系与所述三维坐标系的对应关系；
    向所述三维坐标系中输入所述PCBA板的3D模型。
  4. 如权利要求1所述的方法，其特征在于：所述PCBA板具有距离所述PCBA板底面的高度小于预设高度的第一区域和距离所述PCBA板底面的高度大于预设高度的第二区域；
    所述方法还包括：
    在所述喷头由所述第一区域移至所述第二区域或由所述第二区域移至所述第一区域喷胶时，移动和/或旋转所述喷头和/或所述PCBA板以使所述喷头按照预定规则向所述第一区域或所述第二区域喷胶。
  5. 如权利要求1至4任一所述的方法，其特征在于，所述预定规则包括：
    在喷胶过程中所述喷头位于所述PCBA板的预设距离处。
  6. 如权利要求1至4任一所述的方法，其特征在于，所述预定规则包括：
    在喷胶过程中所述喷头的喷胶方向与所述PCBA板的喷涂表面始终垂直。
  7. 如权利要求1至4任一所述的方法，其特征在于，所述预定规则包括：
    在喷胶过程中所述喷头始终位于所述PCBA板的喷胶表面的沿重力方向的上方。
  8. 如权利要求4所述的方法，其特征在于，所述预定规则包括：
    在喷涂所述第一区域时，所述喷头向所述第一区域执行填平包覆喷胶。
  9. 如权利要求4所述的方法，其特征在于，所述预定规则包括：
    在喷涂所述第二区域时，所述喷头向所述第二区域执行包覆喷胶。
  10. 如权利要求4所述的方法，其特征在于，所述预定规则包括：
    在喷涂所述第一区域时，所述喷头与所述PCBA板的底面之间保持预设距离。
  11. 如权利要求4所述的方法，其特征在于，所述预定规则包括：
    在喷涂所述第二区域时，所述喷头与所述PCBA板的喷涂表面之间保持预设距离。
  12. 如权利要求4所述的方法，其特征在于，所述喷头与所述PCBA板均具有六个自由度。
  13. 如权利要求1所述的方法，其特征在于，还包括：
    获取所述PCBA板的封胶区域；
    相应的，所述喷头移动至所述PCBA板的预设开始喷胶位置包括：喷头移动至所述封胶区域的预设开始喷胶位置。
  14. 如权利要求13所述的方法，其特征在于，所述预设开始喷胶位置位于所述封胶区域的边界位置。
  15. 如权利要求1所述的方法，其特征在于，还包括：
    获取封装所述PCBA板所需的胶液量；
    在熔胶产生与所述胶液量相匹配的胶液时，所述喷头开始喷胶。
PCT/CN2016/107192 2016-01-28 2016-11-25 Pcba板的封胶方法 WO2017128822A1 (zh)

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