WO2017113799A1 - 柔性电路板及移动终端 - Google Patents

柔性电路板及移动终端 Download PDF

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Publication number
WO2017113799A1
WO2017113799A1 PCT/CN2016/093915 CN2016093915W WO2017113799A1 WO 2017113799 A1 WO2017113799 A1 WO 2017113799A1 CN 2016093915 W CN2016093915 W CN 2016093915W WO 2017113799 A1 WO2017113799 A1 WO 2017113799A1
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WO
WIPO (PCT)
Prior art keywords
exposed copper
region
grounding
circuit board
flexible circuit
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PCT/CN2016/093915
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English (en)
French (fr)
Inventor
曾元清
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广东欧珀移动通信有限公司
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Application filed by 广东欧珀移动通信有限公司 filed Critical 广东欧珀移动通信有限公司
Publication of WO2017113799A1 publication Critical patent/WO2017113799A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details

Definitions

  • the present invention relates to the field of circuit boards, and in particular, to a flexible circuit board and a mobile terminal.
  • the present invention provides a flexible circuit board capable of introducing electrostatic interference into a ground plane in time, thereby effectively preventing electrostatic interference, thereby ensuring that the signal circuit can operate normally.
  • the present invention also provides a mobile terminal to which the flexible circuit board is applied.
  • the present invention provides a flexible circuit board including a first surface and a second surface disposed opposite to each other, the first surface including a first ground region, and the first ground region a first exposed copper region of the peripheral side edge, wherein the first exposed copper region is provided with a plurality of grounding holes, and the plurality of the grounding holes are respectively arranged along the extending direction of the first exposed copper region, and the plurality of The grounding holes are all penetrated from the first exposed copper region to the second surface to be grounded.
  • the present invention further provides a mobile terminal, comprising: a body, a main board disposed inside the body, and a flexible circuit board, wherein the flexible circuit board is disposed inside the body, and is The main board is electrically connected, the flexible circuit board includes a first surface and a second surface disposed opposite to each other, the first surface includes a first grounding area, and a first surface disposed at a peripheral side edge of the first grounding area a copper exposed area, wherein the first exposed copper area is provided with a plurality of grounding holes, and the plurality of the grounding holes are respectively arranged along the extending direction of the first exposed copper area, and the plurality of the grounding holes are all The first exposed copper region penetrates to the second surface to be grounded.
  • a plurality of grounding holes are formed in the first exposed copper region on the circumferential side of the first grounding region, and the plurality of grounding holes are penetrated from the first surface to the first On the two sides, the grounding characteristics of the grounding hole can be utilized to timely introduce an electrostatic interference signal outside or around the flexible circuit board to the ground plane, thereby reducing or even avoiding the electrostatic interference being transmitted to the electronic circuit board.
  • Components or snubbers are routed to other trace circuits to ensure proper operation of electronic components, signal lines, and other trace circuits.
  • the use of the antistatic interference component in the functional circuit in the flexible circuit board can be reduced, and the component cost can be saved.
  • the flexible circuit board reduces the use of the anti-static interference component, not only the space on the flexible circuit board can be saved, but also the signal line can be better isolated, so that the interference between the signal lines can be reduced, and the signal is improved. the quality of.
  • FIG. 1 is a schematic structural view of a first surface of a flexible circuit board according to an embodiment of the present invention
  • FIG. 2 is a schematic structural view of a second surface of a flexible circuit board according to an embodiment of the present invention.
  • FIG. 3 is a structural block diagram of a mobile terminal according to an embodiment of the present invention.
  • a flexible circuit board including a first surface and a second surface disposed opposite to each other, the first surface including a first grounding region, and a first exposed surface disposed on a peripheral side edge of the first grounding region a copper region, wherein the first exposed copper region is provided with a plurality of grounding holes, wherein the plurality of the grounding holes are respectively arranged along the extending direction of the first exposed copper region, and the plurality of the grounding holes are all from the The first exposed copper region penetrates to the second surface to be grounded.
  • the first exposed copper region is provided with a plurality of first spacer regions, and the plurality of the first spacer regions are respectively arranged along the extending direction of the first exposed copper region to be the first exposed copper
  • the region is divided into a plurality of spaced-apart first wiring regions, and the plurality of the ground holes are disposed on the plurality of the first wiring regions and the first spacer regions.
  • the plurality of the first spacers are in communication with the first ground region.
  • the center distance between two adjacent grounding holes is greater than or equal to 2 mm and less than or equal to 3 mm.
  • the center distance between two adjacent grounding holes is 2 mm or 3 mm.
  • the second surface is provided with a second grounding region and a second exposed copper region disposed at a peripheral edge of the second grounding region, and the plurality of grounding holes penetrate from the first exposed copper region to The second exposed copper region.
  • the second exposed copper area is provided with a plurality of second spaced regions, and the plurality of the second intervals
  • the regions are respectively arranged along the extending direction of the second exposed copper region to divide the second exposed copper region into a plurality of spaced second wiring regions, and the plurality of grounding holes are from the first exposed copper
  • the region extends through the plurality of the second wiring regions and the second spacer regions.
  • the plurality of the second spacers are in communication with the second ground region.
  • the edge of the plurality of grounding holes is 1 mm from the edge of the first exposed copper region.
  • the apertures of the plurality of grounding holes are less than or equal to 0.3 mm.
  • a mobile terminal includes a main body, a main board disposed inside the main body, and a flexible circuit board.
  • the flexible circuit board is disposed inside the main body and electrically connected to the main board, the flexible circuit board.
  • the first surface and the second surface are oppositely disposed, the first surface includes a first grounding region, and a first exposed copper region disposed on a peripheral side edge of the first grounding region, where the first exposed copper region a plurality of grounding holes are disposed, the plurality of the grounding holes are respectively arranged along the extending direction of the first exposed copper region, and the plurality of the grounding holes are respectively penetrated from the first exposed copper region to the second The ground is grounded.
  • the first exposed copper region is provided with a plurality of first spacer regions, and the plurality of the first spacer regions are respectively arranged along the extending direction of the first exposed copper region to be the first exposed copper
  • the region is divided into a plurality of spaced-apart first wiring regions, and the plurality of the ground holes are disposed on the plurality of the first wiring regions and the first spacer regions.
  • the plurality of the first spacers are in communication with the first ground region.
  • the center distance between two adjacent grounding holes is greater than or equal to 2 mm and less than or equal to 3 mm.
  • the center distance between two adjacent grounding holes is 2 mm or 3 mm.
  • the second surface is provided with a second grounding region and a second exposed copper region disposed at a peripheral edge of the second grounding region, and the plurality of grounding holes penetrate from the first exposed copper region to The second exposed copper region.
  • the second exposed copper region is provided with a plurality of second spacer regions, and the plurality of the second spacer regions are respectively arranged along the extending direction of the second exposed copper region to remove the second exposed copper
  • the region is divided into a plurality of spaced second routing regions, and the plurality of ground vias extend from the first exposed copper region to the plurality of the second routing regions and the second spacer region.
  • the plurality of the second spacers are in communication with the second ground region.
  • the edge of the plurality of grounding holes is 1 mm from the edge of the first exposed copper region.
  • the apertures of the plurality of grounding holes are less than or equal to 0.3 mm.
  • a mobile terminal 1 includes a main body 110 as shown in FIG. 3, a main board 120 disposed inside the main body, and a flexible printed circuit (FPC). ) 100.
  • the flexible circuit board 100 is disposed inside the body 110 and electrically connected to the main board 120.
  • the mobile terminal 1 may be, but is not limited to, a smart mobile terminal such as a mobile phone, a notebook computer, a tablet computer, a handheld game console, or a media player.
  • the mobile terminal 1 is used as a mobile phone as an example for description.
  • the flexible circuit board 100 includes a first surface 10 and a second surface 20 that are oppositely disposed.
  • the first surface 10 includes a first grounding region 11 and a first exposed surface disposed on a peripheral side edge of the first grounding region 11. Copper area 12.
  • a plurality of grounding holes 121 are defined in the first exposed copper region 12, and the plurality of the grounding holes 121 are respectively arranged along the extending direction of the first exposed copper region 12, and the plurality of the grounding holes 121 are all
  • the first face 10 extends through the second face 20 .
  • the flexible circuit board 100 provided by the embodiment of the present invention has a plurality of grounding holes 121 disposed on the first exposed copper region 12 of the first surface 10, and a plurality of the grounding holes 121 are penetrated to the second On the face 20, the grounding hole 121 is grounded.
  • a plurality of the grounding holes 121 are formed in the edge of the flexible circuit board 100, so that external or peripheral electrostatic interference signals can be introduced to the grounding surface through the plurality of the grounding holes 121.
  • the electrostatic interference signal is prevented from affecting the electronic components and signal lines on the flexible circuit board 100 to ensure proper operation of the electronic components on the flexible circuit board 100 and normal transmission of signals.
  • the flexible circuit board 100 may be a regular plate structure or an irregular plate structure.
  • the first surface 10 can be a top surface or a bottom surface of the flexible circuit board 100.
  • the first exposed copper region 12 is disposed at a peripheral side edge of the first ground region 11 .
  • the first exposed copper region 12 is provided with a plurality of first spacers 122, and the plurality of first spacers 122 are respectively arranged along the extending direction of the first exposed copper regions 12,
  • the first exposed copper region 12 is divided into a plurality of spaced-apart first wiring regions 123.
  • the plurality of first spacers 122 are a plurality of square notches provided on the first exposed copper region 12 , and a plurality of the first spacers 122 are in communication with the first ground region 11 . That is, a plurality of the first spacers 122 are also connected regions, and no copper foil is laid thereon.
  • the first exposed copper region 12 is divided into a plurality of the first wiring regions 123, thereby preventing the plurality of the first wiring regions 123 from being connected when the wiring is disposed on the first exposed copper regions 12 Causes a short circuit.
  • the first spacers 122 are in communication with the first grounding region 11, the first spacers 122 are also connected regions, and thus the first regions on the first exposed copper regions 12 are The distance between the grounding hole 121 and the first grounding region 11 is the shortest. Therefore, when an electrostatic interference signal appears on the flexible circuit board 100, the grounding hole 121 can introduce the electrostatic interference into the shortest distance.
  • the first grounding region 11 is on, thereby reducing the probability that the electrostatic interference signal is disturbed to other signal circuits.
  • a plurality of the grounding holes 121 are disposed on the plurality of the first spacers 122 and the first wiring regions 123.
  • the plurality of grounding holes 121 are all through holes, and the plurality of the grounding holes 121 are all circular holes.
  • the apertures of the plurality of the grounding holes 121 are less than or equal to 0.3 mm, so that the grounding holes 121 can allow the wires on the flexible circuit board 100 to pass through, and the grounding holes 121 can also be avoided.
  • the aperture is too large to occupy a large amount of space of the flexible circuit board 100.
  • the grounding hole 121 may also be a through hole of other shapes, such as a U-shaped hole, a square hole or an elliptical hole or the like.
  • the aperture of the grounding hole 121 can also be adjusted according to actual processing conditions, and details are not described herein again.
  • the center distance between the two adjacent grounding holes 121 is 2 mm or more and 3 mm or less, or 2 mm or 3 mm, so that the spacing between the plurality of the grounding holes 121 can be prevented.
  • the dense structure causes damage to the overall structure of the flexible circuit board 100, and also prevents the antistatic interference effect of the flexible circuit board 100 from being poor due to the excessively loose spacing between the plurality of the grounding holes 121.
  • the overall anti-interference ability of the flexible circuit board 100 is affected.
  • the center distance between two adjacent grounding holes 121 is 3 mm. It can be understood that, in other embodiments, the center distance between the two adjacent grounding holes 121 can also be adjusted according to actual processing conditions, and details are not described herein again.
  • an edge of the plurality of the grounding holes 121 is 1 mm away from an edge of the first exposed copper region 12, so that it is possible to prevent the plurality of the grounding holes 121 from being too close to the edge of the first exposed copper region 12.
  • the edge of the first exposed copper region 12 is broken through, thereby causing damage to the overall structure of the flexible circuit board 100.
  • the plurality of the grounding holes 121 are 1 mm away from the edge of the first exposed copper region 12, and the electrostatic interference signal can be further prevented from entering the first exposed copper region 12, thereby achieving the effect of eliminating the static interference signal in time. It can be understood that in other embodiments
  • the distance between the plurality of the grounding holes 121 and the edge of the first exposed copper region 12 can also be adjusted according to actual processing conditions.
  • a second grounding region 21 and a second exposed copper region 22 disposed on a peripheral side edge of the second grounding region 21 are disposed on the second surface 20 corresponding to the first surface 10 .
  • a plurality of the ground holes 121 penetrate from the first exposed copper region 12 to the second exposed copper region 22 .
  • the second exposed copper region 22 is provided with a plurality of second spacer regions 221, and the plurality of the second spacer regions 221 are respectively arranged along the extending direction of the second exposed copper regions 22, Dividing the second exposed copper region 22 into a plurality of spaced second routing regions 222, and a plurality of the ground vias 121 extending from the first spacer region 122 to the second spacer region 221, The first wiring region 123 penetrates to the second wiring region 222.
  • the plurality of the grounding holes 121 can timely introduce the electrostatic interference signal onto the second grounding region 21, thereby eliminating the electrostatic interference signal.
  • the grounding hole 121 directly penetrates to the second wiring region 222, there is no need to additionally provide a grounding hole on the second exposed copper region 22, which reduces the process steps of the flexible circuit board and reduces The manufacturing cost of the flexible circuit board.
  • the plurality of the second spacers 221 are in communication with the second grounding region 21 such that the second spacers 221 are also connected regions, so that the grounding holes 121 are away from the second grounding region.
  • the distance of 21 is the shortest because the grounding hole 121 can transmit the static interference signal to the second grounding area 21 within the shortest distance when electrostatic signal interference occurs on the flexible circuit board 100, thereby reducing the The probability that the electrostatic interference signal is disturbed to other signal circuits.
  • a plurality of grounding holes are formed in the first exposed copper region on the circumferential side of the first grounding region, and the plurality of grounding holes are penetrated from the first surface to the first On the two sides, the grounding characteristics of the grounding hole can be utilized to timely introduce an electrostatic interference signal outside or around the flexible circuit board to the ground plane, thereby reducing or even avoiding the electrostatic interference being transmitted to the electronic circuit board.
  • Components or snubbers are routed to other trace circuits to ensure proper operation of electronic components, signal lines, and other trace circuits.
  • the use of the antistatic interference component in the functional circuit in the flexible circuit board can be reduced, and the component cost can be saved.
  • the flexible circuit board reduces the use of the anti-static interference component, not only the space on the flexible circuit board can be saved, but also the signal line can be better isolated, so that the interference between the signal lines can be reduced, and the letter is improved. The quality of the number.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Structure Of Printed Boards (AREA)
  • Elimination Of Static Electricity (AREA)

Abstract

一种柔性电路板(100)，包括相对设置的第一面(10)和第二面(20)，第一面(10)包括第一接地区域(11)、及设于第一接地区域(11)周侧边缘的第一露铜区域(12)，第一露铜区域(12)上设多个接地孔(121)，多个接地孔(121)分别沿第一露铜区域(12)的延伸方向排列设置，并且多个接地孔(121)均从第一露铜区域(12)贯穿至第二面(20)以接地。通过上述结构，在安装时，利用该接地孔(121)的接地特性，从而能及时将柔性电路板(100)外部或者周边的静电干扰导入到接地面上，防止该静电干扰带入到内部信号线或者窜扰到其他走线电路上，保证了信号线及其他走线电路的正常运行。还提供了一种具有该柔性电路板(100)的移动终端(1)。

Description

柔性电路板及移动终端 技术领域
本发明涉及电路板领域，尤其涉及一种柔性电路板及移动终端。
背景技术
目前在安装柔性电路板(Flexible Printed Circuit，FPC)时，往往需要通过人工的方式进行安装，由于人工操作容易带入静电干扰，或者柔性电路板的一些元器件如连接座在装配、焊接、拔插等操作时均容易带来静电干扰。当上述静电干扰无法及时被导入到地进行消除时，静电干扰信号就会传播到柔性电路板上的信号线上，对柔性电路板上的电子元器件(例如主芯片)和信号线造成干扰，导致影响该柔性电路板的信号正常运行。此外，由于柔性电路板上还设置有其他走线电路，当静电干扰信号窜扰到其他走线电路上时，也会对该走线电路造成干扰，进而导致该走线电路正常运行
发明内容
鉴于现有技术中存在的上述问题，本发明提供一种柔性电路板，其能够及时将静电干扰导入到接地面，有效地防止静电干扰，从而可以保证信号电路能够正常工作。
另外，本发明还提供一种应用所述柔性电路板的移动终端。
为了实现上述目的，本发明实施方式提供如下技术方案：
第一方面，本发明提供一种柔性电路板，所述柔性电路板包括相对设置的第一面和第二面，所述第一面包括第一接地区域、以及设置于所述第一接地区域周侧边缘的第一露铜区域，所述第一露铜区域上设置有多个接地孔，多个所述接地孔分别沿所述第一露铜区域的延伸方向排列设置，并且多个所述接地孔均从所述第一露铜区域贯穿至所述第二面以接地。
第二方面，本发明还提供了一种移动终端，所述移动终端包括本体、设于所述本体内部的主板以及柔性电路板，所述柔性电路板设于所述本体内部，并与所述主板电连接，所述柔性电路板包括相对设置的第一面和第二面，所述第一面包括第一接地区域、以及设置于所述第一接地区域周侧边缘的第 一露铜区域，所述第一露铜区域上设置有多个接地孔，多个所述接地孔分别沿所述第一露铜区域的延伸方向排列设置，并且多个所述接地孔均从所述第一露铜区域贯穿至所述第二面以接地。
综上所述，在本发明提供的柔性电路板中，通过在位于第一接地区域周侧的第一露铜区域上开设多个接地孔，并且多个接地孔均从第一面贯穿至第二面上，故而能利用该接地孔的接地特性，及时将柔性电路板外部或者周边的静电干扰信号导入到接地面上，减少甚至避免了该静电干扰被传输至所述柔性电路板上的电子元件或者窜扰到其他走线电路上，进而保证了电子元件、信号线以及其他走线电路的正常运行。此外，通过在接地区域周侧的露铜区域上开设接地孔，且该接地孔与接地区域连通，可以减少柔性电路板中功能电路中防静电干扰元件的使用，节省了元件成本。另外，由于柔性电路板减少了防静电干扰元件的使用，不但可以节省该柔性电路板上的空间，而且信号线可以做到较好的隔离，如此可以减少信号线之间的窜扰，提高了信号的质量。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是本发明实施例提供的柔性电路板第一面的结构示意图；
图2是本发明实施例提供的柔性电路板第二面的结构示意图；
图3是本发明一实施例提供的移动终端的结构框图。
具体实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
为便于描述，这里可以使用诸如“在…之下”、“在…下面”、“下”、 “在…之上”、“上”等空间相对性术语来描述如图中所示的一个元件或特征与另一个(些)元件或特征的关系。可以理解，当一个元件或层被称为在另一元件或层“上”、“连接到”或“耦接到”另一元件或层时，它可以直接在另一元件或层上、直接连接到或耦接到另一元件或层，或者可以存在居间元件或层。
可以理解，这里所用的术语仅是为了描述特定实施例，并非要限制本发明。在这里使用时，除非上下文另有明确表述，否则单数形式“一”和“该”也旨在包括复数形式。进一步地，当在本说明书中使用时，术语“包括”和/或“包含”表明所述特征、整体、步骤、元件和/或组件的存在，但不排除一个或多个其他特征、整体、步骤、元件、组件和/或其组合的存在或增加。说明书后续描述为实施本发明的较佳实施方式，然所述描述乃以说明本发明的一般原则为目的，并非用以限定本发明的范围。本发明的保护范围当视所附权利要求所界定者为准。
一种柔性电路板，所述柔性电路板包括相对设置的第一面和第二面，所述第一面包括第一接地区域、以及设置于所述第一接地区域周侧边缘的第一露铜区域，所述第一露铜区域上设置有多个接地孔，多个所述接地孔分别沿所述第一露铜区域的延伸方向排列设置，并且多个所述接地孔均从所述第一露铜区域贯穿至所述第二面以接地。
其中，所述第一露铜区域上设置有多个第一间隔区，多个所述第一间隔区分别沿所述第一露铜区域的延伸方向排列设置，以将所述第一露铜区域分割成多个间隔设置的第一布线区，多个所述接地孔设置于多个所述第一布线区以及所述第一间隔区上。
其中，多个所述第一间隔区与所述第一接地区域连通。
其中，相邻的两个所述接地孔之间的中心距为大于等于2mm且小于等于3mm。
其中，相邻的两个所述接地孔之间的中心距为2mm或3mm。
其中，所述第二面上设置有第二接地区域、以及设置于所述第二接地区域周侧边缘的第二露铜区域，多个所述接地孔从所述第一露铜区域贯穿至所述第二露铜区域。
其中，所述第二露铜区域上设置有多个第二间隔区，多个所述第二间隔 区分别沿所述第二露铜区域的延伸方向排列设置，以将所述第二露铜区域分割成多个间隔设置的第二布线区，多个所述接地孔从所述第一露铜区域贯穿至多个所述第二布线区以及第二间隔区。
其中，多个所述第二间隔区与所述第二接地区域连通。
其中，多个所述接地孔的边缘距离所述第一露铜区域的边缘为1mm。
其中，多个所述接地孔的孔径小于或等于0.3mm。
一种移动终端，所述移动终端包括本体、设于所述本体内部的主板以及柔性电路板，所述柔性电路板设于所述本体内部，并与所述主板电连接，所述柔性电路板包括相对设置的第一面和第二面，所述第一面包括第一接地区域、以及设置于所述第一接地区域周侧边缘的第一露铜区域，所述第一露铜区域上设置有多个接地孔，多个所述接地孔分别沿所述第一露铜区域的延伸方向排列设置，并且多个所述接地孔均从所述第一露铜区域贯穿至所述第二面以接地。
其中，所述第一露铜区域上设置有多个第一间隔区，多个所述第一间隔区分别沿所述第一露铜区域的延伸方向排列设置，以将所述第一露铜区域分割成多个间隔设置的第一布线区，多个所述接地孔设置于多个所述第一布线区以及所述第一间隔区上。
其中，多个所述第一间隔区与所述第一接地区域连通。
其中，相邻的两个所述接地孔之间的中心距为大于等于2mm且小于等于3mm。
其中，相邻的两个所述接地孔之间的中心距为2mm或3mm。
其中，所述第二面上设置有第二接地区域、以及设置于所述第二接地区域周侧边缘的第二露铜区域，多个所述接地孔从所述第一露铜区域贯穿至所述第二露铜区域。
其中，所述第二露铜区域上设置有多个第二间隔区，多个所述第二间隔区分别沿所述第二露铜区域的延伸方向排列设置，以将所述第二露铜区域分割成多个间隔设置的第二布线区，多个所述接地孔从所述第一露铜区域贯穿至多个所述第二布线区以及第二间隔区。
其中，多个所述第二间隔区与所述第二接地区域连通。
其中，多个所述接地孔的边缘距离所述第一露铜区域的边缘为1mm。
其中，多个所述接地孔的孔径小于或等于0.3mm。
请一并参阅图1-3，本发明实施例提供的一种移动终端1，包括如图3所示的本体110、设于所述本体内部的主板120以及柔性电路板(Flexible Printed Circuit，FPC)100。其中，所述柔性电路板100设于所述本体110内部，并与所述主板120电连接。
在本发明的实施例中，所述移动终端1可为但并不局限于手机、笔记本电脑、平板电脑、掌上游戏机或媒体播放器等智能移动终端。本实施例中，以所述移动终端1为手机为例进行说明。
请一并参阅图1以及图2，为本发明实施例提供的柔性电路板100。所述柔性电路板100包括相对设置的第一面10以及第二面20，所述第一面10包括第一接地区域11、以及设置于所述第一接地区域11周侧边缘的第一露铜区域12。所述第一露铜区域12上开设有多个接地孔121，多个所述接地孔121分别沿所述第一露铜区域12的延伸方向排列设置，并且多个所述接地孔121均从所述第一面10贯穿至所述第二面20。
本发明实施例提供的柔性电路板100，通过在所述第一面10的第一露铜区域12上设置多个接地孔121，并且使得多个所述接地孔121均贯穿至所述第二面20上，从而使得所述接地孔121实现接地。在安装所述柔性电路板100时，由于所述柔性电路板100的边缘开设有多个所述接地孔121，故而外部或者周边的静电干扰信号可以通过多个所述接地孔121导入到接地面，从而防止静电干扰信号影响到所述柔性电路板100上的电子元件和信号线路，以保证柔性电路板100上的电子元件正常运行和信号的正常传输。
具体地，所述柔性电路板100可为一规则的板状结构或者不规则的板状结构。所述第一面10可为所述柔性电路板100的顶面或者底面。
所述第一露铜区域12设置于所述第一接地区域11的周侧边缘处。本实施例中，所述第一露铜区域12上开设有多个第一间隔区122，多个所述第一间隔区122分别沿所述第一露铜区域12的延伸方向排列设置，以将所述第一露铜区域12分割成多个间隔设置的第一布线区123。具体地，多个所述第一间隔区122为设于所述第一露铜区域12上的多个方形缺口，并且多个所述第一间隔区122与所述第一接地区域11连通。即，多个所述第一间隔区122也为接地区，其上并未铺设有铜箔。通过多个所述第一间隔区122可将 所述第一露铜区域12分割成多个所述第一布线区123，从而防止所述第一露铜区域12上在设置走线时，由于多个所述第一布线区123相连接而导致出现短路现象。同时，由于多个所述第一间隔区122与所述第一接地区域11连通，从而使得所述第一间隔区122也为接地区，进而使得所述第一露铜区域12上的所述接地孔121距离所述第一接地区域11的距离最短，因此，当所述柔性电路板100上出现静电干扰信号时，所述接地孔121能够在最短距离内将所述静电干扰导入到所述第一接地区域11上，从而降低了所述静电干扰信号窜扰至其他信号电路上的几率。
多个所述接地孔121设置于多个所述第一间隔区122以及第一布线区123上。本实施例中，多个所述接地孔121均为通孔，并且多个所述接地孔121均为圆孔。优选地，多个所述接地孔121的孔径小于或等于0.3mm，从而使得所述接地孔121能够允许所述柔性电路板100上的走线通过的同时，也可以避免所述接地孔121的孔径太大而占据所述柔性电路板100的大量空间。可以理解的是，在其他实施例中，所述接地孔121还可为其他形状的通孔，如U形孔，方形孔或者椭圆形孔等。所述接地孔121的孔径还可根据实际的加工情况调整设置，在此不再赘述。
进一步地，相邻的两个所述接地孔121之间的中心距为大于等于2mm且小于等于3mm，或者为2mm或3mm，从而能够防止由于多个所述接地孔121之间的间距太过密集而使得所述柔性电路板100的整体结构造成损坏，同时也能够防止由于多个所述接地孔121之间的间距太过疏松而导致所述柔性电路板100的抗静电干扰效果不佳，影响所述柔性电路板100的整体抗干扰能力。优选地，相邻的两个所述接地孔121之间的中心距为3mm。可以理解的是，在其他实施例中，相邻的两个所述接地孔121之间的中心距还可根据实际加工情况调整设置，此处不再赘述。
更进一步地，多个所述接地孔121的边缘距离所述第一露铜区域12的边缘为1mm，从而能够防止由于多个所述接地孔121太接近所述第一露铜区域12的边缘而将所述第一露铜区域12的边缘打穿，进而对所述柔性电路板100的整体结构造成损坏。此外，多个所述接地孔121距离所述第一露铜区域12的边缘为1mm，还可进一步防止静电干扰信号进入所述第一露铜区域12，实现及时将静电干扰信号消除的效果。可以理解的是，在其他实施例 中，多个所述接地孔121距离所述第一露铜区域12的边缘距离还可根据实际加工情况调整设置。
所述第二面20上相对应所述第一面10设置有第二接地区域21、以及设置于所述第二接地区域21周侧边缘的第二露铜区域22。多个所述接地孔121从所述第一露铜区域12贯穿至所述第二露铜区域22。在本实施例中，所述第二露铜区域22上设置有多个第二间隔区221，多个所述第二间隔区221分别沿所述第二露铜区域22的延伸方向排列设置，以将所述第二露铜区域22分割成多个间隔设置的第二布线区222，并且多个所述接地孔121从所述第一间隔区122贯穿至所述第二间隔区221、从所述第一布线区123贯穿至所述第二布线区222。通过上述方式，能够使得当有静电干扰信号时，多个所述接地孔121能够及时地将静电干扰信号导入到所述第二接地区域21上，从而消除所述静电干扰信号。此外，由于所述接地孔121直接贯穿至所述第二布线区222，因而无需在所述第二露铜区域22上再额外开设接地孔，减少了所述柔性电路板的工艺步骤，并降低了柔性电路板的制造成本。
进一步地，多个所述第二间隔区221与所述第二接地区域21连通，从而使得所述第二间隔区221也为接地区，进而使得所述接地孔121距离所述第二接地区域21的距离最短，因为当所述柔性电路板100上出现静电信号干扰时，所述接地孔121能够在最短距离内将所述静电干扰信号传输至所述第二接地区域21上，从而降低了所述静电干扰信号窜扰至其他信号电路上的几率。
综上所述，在本发明提供的柔性电路板中，通过在位于第一接地区域周侧的第一露铜区域上开设多个接地孔，并且多个接地孔均从第一面贯穿至第二面上，故而能利用该接地孔的接地特性，及时将柔性电路板外部或者周边的静电干扰信号导入到接地面上，减少甚至避免了该静电干扰被传输至所述柔性电路板上的电子元件或者窜扰到其他走线电路上，进而保证了电子元件、信号线以及其他走线电路的正常运行。此外，通过在接地区域周侧的露铜区域上开设接地孔，且该接地孔与接地区域连通，可以减少柔性电路板中功能电路中防静电干扰元件的使用，节省了元件成本。另外，由于柔性电路板减少了防静电干扰元件的使用，不但可以节省该柔性电路板上的空间，而且信号线可以做到较好的隔离，如此可以减少信号线之间的窜扰，提高了信 号的质量。
在本说明书的描述中，参考术语“一个实施例”、“一些实施例”、“示例”、“具体示例”、“一些示例”或类似“第一实施例”等的描述意指结合该实施例或示例描述的具体特征、结构、材料或者特点包含于本发明的至少一个实施例或示例中。在本说明书中，对上述术语的示意性表述不一定指的是相同的实施例或示例。而且，描述的具体特征、结构、材料或特点可以在任何的一个或多个实施例或示例中以合适的方式结合。
以上所述的实施方式，并不构成对该技术方案保护范围的限定。任何在上述实施方式的精神和原则之内所作的修改、等同替换和改进等，均应包含在该技术方案的保护范围之内。

Claims (20)

  1. 一种柔性电路板，其特征在于，所述柔性电路板包括相对设置的第一面和第二面，所述第一面包括第一接地区域、以及设置于所述第一接地区域周侧边缘的第一露铜区域，所述第一露铜区域上设置有多个接地孔，多个所述接地孔分别沿所述第一露铜区域的延伸方向排列设置，并且多个所述接地孔均从所述第一露铜区域贯穿至所述第二面以接地。
  2. 如权利要求1所述的柔性电路板，其特征在于，所述第一露铜区域上设置有多个第一间隔区，多个所述第一间隔区分别沿所述第一露铜区域的延伸方向排列设置，以将所述第一露铜区域分割成多个间隔设置的第一布线区，多个所述接地孔设置于多个所述第一布线区以及所述第一间隔区上。
  3. 如权利要求2所述的柔性电路板，其特征在于，多个所述第一间隔区与所述第一接地区域连通。
  4. 如权利要求1所述的柔性电路板，其特征在于，相邻的两个所述接地孔之间的中心距为大于等于2mm且小于等于3mm。
  5. 如权利要求1所述的柔性电路板，其特征在于，相邻的两个所述接地孔之间的中心距为2mm或3mm。
  6. 如权利要求1所述的柔性电路板，其特征在于，所述第二面上设置有第二接地区域、以及设置于所述第二接地区域周侧边缘的第二露铜区域，多个所述接地孔从所述第一露铜区域贯穿至所述第二露铜区域。
  7. 如权利要求6所述的柔性电路板，其特征在于，所述第二露铜区域上设置有多个第二间隔区，多个所述第二间隔区分别沿所述第二露铜区域的延伸方向排列设置，以将所述第二露铜区域分割成多个间隔设置的第二布线区，多个所述接地孔从所述第一露铜区域贯穿至多个所述第二布线区以及第二间隔区。
  8. 如权利要求7所述的柔性电路板，其特征在于，多个所述第二间隔区与所述第二接地区域连通。
  9. 如权利要求1所述的柔性电路板，其特征在于，多个所述接地孔的边缘距离所述第一露铜区域的边缘为1mm。
  10. 如权利要求1所述的柔性电路板，其特征在于，多个所述接地孔的孔径小于或等于0.3mm。
  11. 一种移动终端，其特征在于，所述移动终端包括本体、设于所述本体内部的主板以及柔性电路板，所述柔性电路板设于所述本体内部，并与所述主板电连接，所述柔性电路板包括相对设置的第一面和第二面，所述第一面包括第一接地区域、以及设置于所述第一接地区域周侧边缘的第一露铜区域，所述第一露铜区域上设置有多个接地孔，多个所述接地孔分别沿所述第一露铜区域的延伸方向排列设置，并且多个所述接地孔均从所述第一露铜区域贯穿至所述第二面以接地。
  12. 如权利要求11所述的移动终端，其特征在于，所述第一露铜区域上设置有多个第一间隔区，多个所述第一间隔区分别沿所述第一露铜区域的延伸方向排列设置，以将所述第一露铜区域分割成多个间隔设置的第一布线区，多个所述接地孔设置于多个所述第一布线区以及所述第一间隔区上。
  13. 如权利要求12所述的移动终端，其特征在于，多个所述第一间隔区与所述第一接地区域连通。
  14. 如权利要求11所述的移动终端，其特征在于，相邻的两个所述接地孔之间的中心距为大于等于2mm且小于等于3mm。
  15. 如权利要求11所述的移动终端，其特征在于，相邻的两个所述接地 孔之间的中心距为2mm或3mm。
  16. 如权利要求11所述的移动终端，其特征在于，所述第二面上设置有第二接地区域、以及设置于所述第二接地区域周侧边缘的第二露铜区域，多个所述接地孔从所述第一露铜区域贯穿至所述第二露铜区域。
  17. 如权利要求16所述的移动终端，其特征在于，所述第二露铜区域上设置有多个第二间隔区，多个所述第二间隔区分别沿所述第二露铜区域的延伸方向排列设置，以将所述第二露铜区域分割成多个间隔设置的第二布线区，多个所述接地孔从所述第一露铜区域贯穿至多个所述第二布线区以及第二间隔区。
  18. 如权利要求17所述的移动终端，其特征在于，多个所述第二间隔区与所述第二接地区域连通。
  19. 如权利要求11所述的移动终端，其特征在于，多个所述接地孔的边缘距离所述第一露铜区域的边缘为1mm。
  20. 如权利要求11所述的移动终端，其特征在于，多个所述接地孔的孔径小于或等于0.3mm。
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