WO2017113190A1 - 生物打印机温控系统和生物打印机 - Google Patents

生物打印机温控系统和生物打印机 Download PDF

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Publication number
WO2017113190A1
WO2017113190A1 PCT/CN2015/099870 CN2015099870W WO2017113190A1 WO 2017113190 A1 WO2017113190 A1 WO 2017113190A1 CN 2015099870 W CN2015099870 W CN 2015099870W WO 2017113190 A1 WO2017113190 A1 WO 2017113190A1
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WIPO (PCT)
Prior art keywords
heat
control system
temperature control
temperature
bioprinter
Prior art date
Application number
PCT/CN2015/099870
Other languages
English (en)
French (fr)
Inventor
王德明
温学敏
李意军
张乐庆
Original Assignee
四川蓝光英诺生物科技股份有限公司
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Application filed by 四川蓝光英诺生物科技股份有限公司 filed Critical 四川蓝光英诺生物科技股份有限公司
Priority to JP2018534104A priority Critical patent/JP6717949B2/ja
Priority to PCT/CN2015/099870 priority patent/WO2017113190A1/zh
Priority to EP15911819.9A priority patent/EP3398780A4/en
Priority to US16/067,563 priority patent/US11220060B2/en
Publication of WO2017113190A1 publication Critical patent/WO2017113190A1/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/30—Auxiliary operations or equipment
    • B29C64/386—Data acquisition or data processing for additive manufacturing
    • B29C64/393—Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/0288—Controlling heating or curing of polymers during moulding, e.g. by measuring temperatures or properties of the polymer and regulating the process
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/20—Apparatus for additive manufacturing; Details thereof or accessories therefor
    • B29C64/205—Means for applying layers
    • B29C64/209—Heads; Nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/20—Apparatus for additive manufacturing; Details thereof or accessories therefor
    • B29C64/255—Enclosures for the building material, e.g. powder containers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/20—Apparatus for additive manufacturing; Details thereof or accessories therefor
    • B29C64/295—Heating elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/30—Auxiliary operations or equipment
    • B29C64/307—Handling of material to be used in additive manufacturing
    • B29C64/321—Feeding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y30/00—Apparatus for additive manufacturing; Details thereof or accessories therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y50/00—Data acquisition or data processing for additive manufacturing
    • B33Y50/02—Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
    • C—CHEMISTRY; METALLURGY
    • C12—BIOCHEMISTRY; BEER; SPIRITS; WINE; VINEGAR; MICROBIOLOGY; ENZYMOLOGY; MUTATION OR GENETIC ENGINEERING
    • C12M—APPARATUS FOR ENZYMOLOGY OR MICROBIOLOGY; APPARATUS FOR CULTURING MICROORGANISMS FOR PRODUCING BIOMASS, FOR GROWING CELLS OR FOR OBTAINING FERMENTATION OR METABOLIC PRODUCTS, i.e. BIOREACTORS OR FERMENTERS
    • C12M33/00—Means for introduction, transport, positioning, extraction, harvesting, peeling or sampling of biological material in or from the apparatus
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00—Control of temperature
    • G05D23/19—Control of temperature characterised by the use of electric means
    • G05D23/30—Automatic controllers with an auxiliary heating device affecting the sensing element, e.g. for anticipating change of temperature
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • F25B21/04—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect reversible

Definitions

  • the present invention relates to the field of bio-printer technology, and in particular to a bio-printer temperature control system and a bio-printer.
  • Bio 3D printing refers to the technique of printing biological materials (including natural biological materials and synthetic biological materials or cell solutions) into a designed three-dimensional structure by the principle and method of 3D printing. Since bio 3D printed printed materials are biomaterials, compared with ordinary 3D printing technology, one of the characteristics of bio-printers is that they need to provide suitable conditions for the survival, growth and good biological functions of the printed materials, and the temperature is among them. An important control indicator.
  • bioprinters are typically provided with a temperature control system for temperature control of a bioprintable material container, which typically includes a heat exchange component and a heat sink, wherein the heat exchange component is used to pass the thermally conductive sleeve to the bioprintable material container The heat exchange is performed, and the heat sink is used to exchange heat between the heat exchange component and the environment.
  • the existing bioprinter temperature control system has the following problems:
  • biomaterials are prone to clogging.
  • the bio-printer temperature control system can only control the temperature of the bio-printing material container, but can not control the temperature of the nozzle part and the flow path part, and because the biological material has a certain viscosity, the printing material is easy to be at the temperature.
  • the nozzles that are not effectively controlled and the clogging in the flow path portion become more and more obvious as the viscosity of the printed material increases, thereby affecting the printing efficiency of the entire bio-printer, especially when the printing plane is non-planar, in order to The problem is even more pronounced when using longer nozzles to suit printing needs.
  • the existing bio-printer temperature control system is difficult to apply to printing materials whose flow characteristics change with temperature changes, and the existing bio-printers have a large limitation in the selection of printing materials.
  • One technical problem to be solved by the present invention is that the existing bio-printer temperature control system does not temperature control the biological material in the flow path from the biological printing container to the nozzle, resulting in poor flow of biological material in the flow channel.
  • the present invention provides a bioprinter temperature control system including a flow channel temperature control system for controlling an outlet of a bioprinting material container of a bioprinter and a nozzle of a bioprinter
  • the temperature of the flow path is such that the temperature of the flow path coincides with the temperature required for the bioprinted material.
  • the bioprinter temperature control system includes a container temperature control system, and the container temperature control system includes a heat exchange device for performing heat exchange with the bioprint material container to control the bioprint material container.
  • the temperature is consistent with the temperature required for the bioprinting material contained therein, the bioprinter temperature control system further comprising a first soaking plate disposed between the bioprinting material container and the heat exchange device, the A soaking plate is used to achieve uniform heat transfer between the heat exchange device and the bioprinting material container.
  • the heat exchange device includes a heat exchange member capable of heating and cooling the bio-printing material container, and a heat-dissipating plate disposed in the bio-printing material container and Between the first sides of the heat exchange component, a second side of the heat exchange component is coupled to the heat sink, the heat dissipation The device is used to effect heat transfer between the heat exchange component and the environment.
  • the container temperature control system further includes a second heat equalizing plate disposed between the second side of the heat exchange component and the heat sink for implementing the heat exchange Uniform heat transfer between the component and the heat sink.
  • the heat dissipating device includes a heat sink group and a heat dissipating fan, and the heat sink group is connected to a second side of the heat exchange component, and the heat dissipating fan is configured to implement heat between the heat sink group and the environment
  • the second heat equalizing plate is disposed between the second side of the heat exchange component and the heat sink group for achieving uniform heat transfer between the heat exchange component and the heat sink group.
  • the air outlet of the heat dissipation fan is disposed away from the printing platform of the bioprinter.
  • the heat dissipation fan is a speed control fan
  • the container temperature control system further includes a heat dissipation temperature detection control device, wherein the heat dissipation temperature detection control device is configured to detect a temperature of the heat sink group and can be based on the heat sink The difference between the temperature of the group and the ambient temperature controls whether the cooling fan is turned on and adjusts the rotational speed of the cooling fan.
  • the container temperature control system further includes a container temperature detecting control device for detecting a temperature of the bio-printing material container and feeding back to the heat exchange device to form a bio-printing Closed loop control of material vessel temperature.
  • the bioprinter temperature control system further includes a nozzle temperature control system for controlling a temperature of a nozzle of the bioprinter to make a temperature of the nozzle and a temperature required by the bioprinting material Consistent.
  • the nozzle temperature control system includes a nozzle heat transfer block, and the nozzle heat transfer block is disposed at an outer circumference of the nozzle.
  • the flow channel temperature control system includes a flow path heat conducting block disposed at an outer circumference of the flow path between the outlet of the bioprinting material container and the nozzle.
  • the bioprinter temperature control system comprises two independent container temperature control systems, wherein a container temperature control system is used for temperature control of the first material container of the bioprint material container, wherein the other container a temperature control system for the The second material container of the bioprinting material container is temperature controlled.
  • the heat exchange component comprises a semiconductor refrigeration sheet.
  • the invention also provides a bioprinter comprising the aforementioned bioprinter temperature control system.
  • a bio-printing material container including a first material container and a second material container, a nozzle of the bio-printer and an outlet of one of the first material container and the second material container
  • a flow path heat conducting block is disposed on the outer circumference of the flow path by communicating through the flow path.
  • a nozzle heat conducting block is disposed on an outer circumference of the nozzle, and the flow path sequentially passes through the flow path heat conducting block and the nozzle heat conducting block from the outlet to communicate with the nozzle.
  • a heat insulating layer is disposed on an outer circumference of the flow path in the heat transfer block of the nozzle for isolating heat from the heat transfer block of the nozzle.
  • the heat insulation layer is disposed between the flow channel and the heat transfer block of the nozzle.
  • the biological printer temperature control system provided by the invention can realize the temperature control of the flow channel between the bio-printing material container and the nozzle by setting the flow channel temperature control system, thereby effectively solving the current printing material easily occurring in the flow channel. Blocking problems effectively improve the printing efficiency of bio-printers.
  • the bio-printing material container by providing a soaking plate between the bio-printing material container and the heat exchange device, uniform temperature control of the bio-printing material container can be achieved, thereby improving the survival rate of the printing material and ensuring the biological function of the printed material;
  • the heat exchange components are all covered on the bioprinting material container to achieve uniform control of the temperature of the entire bioprinting material container, thereby facilitating the layout of the heat dissipating device, and making the overall structure more compact and beautiful.
  • the invention can realize the temperature control of the nozzle by setting the nozzle temperature control system, thereby effectively solving the problem that the current printing material is easily blocked at the nozzle, especially when the printing plane is non-planar, in order to better adapt to printing.
  • the effect is more obvious, and the printing efficiency of the bio-printer is effectively improved.
  • the invention provides a temperature control system for the bio-printer for controlling the temperature of the bio-printer, and the temperature control makes the temperature of the bio-printer more uniform, helps to provide cell survival rate and biological function, and can make the printing target more ideal.
  • FIG. 1 is a schematic view showing the structure of a biological printer temperature control system mounted on a bioprinter according to an embodiment of the present invention.
  • Figure 2 shows a front view of the embodiment shown in Figure 1.
  • Figure 3 shows a side view of Figure 2.
  • Fig. 4 is a cross-sectional view taken along line A-A of Fig. 3.
  • a bioprinting material container 41, a first material container; 42, a second material container;
  • orientations such as “front, back, up, down, left, right", “horizontal, vertical, vertical, horizontal” and “top, bottom” and the like are indicated. Or the positional relationship is generally based on the orientation or positional relationship shown in the drawings, and is merely for the convenience of the description of the invention and the simplification of the description, which are not intended to indicate or imply the indicated device or component. It must be constructed and operated in a specific orientation or in a specific orientation, and thus is not to be construed as limiting the scope of the invention; the orientations “inside and outside” refer to the inside and outside of the contour of the components themselves.
  • FIGS. 1-4 are schematic diagrams showing the structure of the biological printer temperature control system according to an embodiment of the present invention, and the biological printer of the present invention.
  • the temperature control system includes a flow channel temperature control system 3, and the flow channel temperature control system 3 is used to control the temperature of the flow path between the outlet of the bio-printing material container 4 and the nozzle 5, so that the temperature of the flow channel and the printing material are required.
  • the temperature is consistent, and the flow path herein should not be understood to include any flow path inside the nozzle 5.
  • the temperature control system of the bio-printer of the invention can ensure that the temperature of the flow channel also satisfies the requirement of the printing material, thereby ensuring the smoothness of the flow of the printing material and improving the printing efficiency of the bio-printer.
  • the biological printer temperature control system of the present invention comprises a container temperature control system 1 which comprises a heat exchange device for feeding with a biological printing material container 4 Performing heat exchange to control the temperature of the bioprinting material container 4 to be consistent with the temperature required for the printing material contained therein, and further comprising a first heat equalizing plate 14 disposed between the bioprinting material container 4 and the heat exchange device, A soaking plate 14 is used to achieve uniform heat transfer between the heat exchange device and the bioprinting material container 4.
  • the bioprinter temperature control system provided by the present invention can realize uniform temperature control of the bioprinting material container 4 by providing the first heat equalizing plate 14 between the bioprinting material container 4 and the heat exchange device, thereby improving the printing material.
  • the survival rate ensures the biological function of the printed material, and also prevents the printing material from being clogged at the bioprinting material container 4, thereby improving the operational reliability of the bioprinter.
  • the heat exchange device may include a heat exchange member capable of heating and cooling the bioprinting material container 4, and a heat dissipating device 13 for realizing the heat exchange member and Heat transfer between the environments such that when the temperature of the bioprintable material container 4 is higher than the temperature required for the printed material, the heat exchange member can absorb heat from the bioprinted material container 4, cooling the bioprinted material container 4 to the printed material. The required temperature; and when the temperature of the bioprinting material container 4 is lower than the temperature required for the printing material, the heat exchange member can transfer heat to the bioprinting material container 4 to heat the bioprinting material container 4 to the temperature required for printing the material. .
  • the heat exchange device of the embodiment has more flexible temperature control mode for the bio-printing material container 4, and can heat or cool the bio-printing material container 4 according to actual conditions, the control precision is higher, and the temperature of different printing materials can be satisfied. demand.
  • a second heat equalizing plate 15 may be disposed between the second side of the heat exchange component and the heat sink 13 , based on the second heat spreader 15 .
  • the heat in the environment can be more uniformly transferred between the heat sink 13 and the second side of the heat exchange member, reducing the temperature difference between the two sides of the heat exchange member, and further improving the heat transfer effect of the heat exchange member.
  • Such a structure is also advantageous for the overall structural arrangement.
  • the heat dissipation fan of the heat sink 13 is attached.
  • the entire structure is externally exposed to make the structure convex.
  • the heat exchange dead zone on the heat exchange member can be reduced and the heat is dissipated.
  • the fan provides assembly space to avoid the overall structure being convex. .
  • the biological printer temperature control system of the present invention may further include a nozzle temperature control system 2, wherein the nozzle temperature control system 2 is used to control the biological printer.
  • the temperature of the nozzle 5 is such that the temperature of the nozzle 5 coincides with the temperature required for the printed material.
  • the temperature control system of the bio-printer of the present invention not only ensures that the temperature at the flow path satisfies the demand of the printing material, but also ensures that the temperature at the nozzle 5 and the bio-printing material container 4 satisfies the demand of the printing material, thereby ensuring
  • the smooth flow of printed materials improves the printing efficiency of bio-printers, and because the printed materials can be placed in a suitable temperature environment throughout the printing process, it can also ensure that the printed materials always have good biological properties, thereby improving bio-printing. Product performance.
  • the bioprinter container 4 to which the bioprinter temperature control system is applied includes a first material container 41 and a second material container 42, and the first material container 41 and the second material container 42 are insulated.
  • the plate 7 is attached to the mounting plate 6 of the bio-printer, the nozzle 5 of the bio-printer is connected to the outlet of the first material container 4, and the outlet of the second material container 42 is communicated with the nozzle 5 through the auxiliary material flow path 421.
  • the first material container 41 can serve as a main material container for containing a main material (also referred to as bio-ink), and the second material container 42 can serve as a auxiliary material container for containing an auxiliary material (for example, a hydrogel), for example, an auxiliary material can be used. It is used to form a package for the main material to prevent the main material from being damaged by mechanical damage during printing.
  • the main material and the auxiliary material can also be combined in other ways, such as mixing.
  • the bioprinter temperature control system comprises two independent container temperature control systems 1, a set of nozzle temperature control system 2 and a set of flow channel temperature control system 3, wherein one
  • the container temperature control system 1 is used for temperature control of the first material container 41
  • the other container temperature control system 1 is used for temperature control of the second material container 42.
  • the nozzle temperature control system 2 is used for temperature control of the nozzle 5
  • the flow channel temperature control system 3 is used for temperature control of the auxiliary material flow path 421.
  • the temperature control of the first material container 41 and the second material container 42 by separately providing two independent container temperature control systems can meet the different temperature requirements of the main material and the auxiliary material with different characteristics.
  • the container temperature control system 1 is next taken only by taking the container temperature control system 1 disposed at the second material container 42 as an example. Description.
  • the container temperature control system 1 includes a heat conductive sleeve 11, a semiconductor refrigeration system serving as a heat exchange device, a first heat equalizing plate 14, and a second heat equalizing plate 15.
  • the semiconductor refrigeration system includes a semiconductor refrigerating device 12 and a heat dissipating device 13.
  • the heat conducting sleeve 11 is sleeved on the outer circumference of the second material container 42, and the first side of the semiconductor refrigerating device 12 is connected to the heat conducting sleeve 14 through the first heat equalizing plate 14.
  • the second side of the semiconductor refrigerating device 12 is connected to the heat sink 13 via the second heat equalizing plate 15.
  • a semiconductor refrigeration system can be used both as a heat source and as a cold source. According to the semiconductor refrigeration theory, applying a DC voltage across the semiconductor refrigerating sheet of a semiconductor refrigeration system produces a DC current, which causes the semiconductor cooling fin to heat up on one side and the other side to cool.
  • the side that generates heat is usually referred to as the "hot side” and the side that is cooled is referred to as the "cold side”.
  • the semiconductor refrigerating sheet has a control end, and after transmitting a command to the control end, the polarity of the voltage on both sides of the semiconductor refrigerating sheet can be reversed, and the current flows in the opposite direction, thereby realizing mutual conversion between the cold surface and the hot surface of the semiconductor refrigerating sheet, that is, capable of To realize the mutual conversion of the refrigeration and heating functions of the semiconductor refrigeration system, in addition to the hot and cold surface exchange, accurate temperature control (accuracy of 0.01 degrees) can be realized according to requirements. It can be seen that the use of a semiconductor refrigeration system as the heat exchange device of the present invention can conveniently and efficiently achieve heating or cooling of the second material container 42 to meet different temperature requirements of various bioprint materials.
  • the container temperature control system 1 may be provided with a container temperature detecting control means, and the container temperature detecting control means controls the semiconductor refrigeration system to switch between the heating operation state and the cooling operation state.
  • the container temperature detecting control device includes a control system (not shown) and a first temperature sensor 18 disposed on the heat conducting sleeve 11, the first temperature sensor 18 for detecting Thermal conduction The temperature of the sleeve 11 is transferred to the control system. Since the temperature of the thermal sleeve 11 coincides with the temperature of the corresponding second material container 42, the first temperature sensor 18 can detect the temperature of the second material container 42 and transfer it to the control system.
  • the control system then controls the operating state of the semiconductor refrigeration system by comparing the temperature of the second material container 42 with the temperature required by the auxiliary material (usually preset in the control system) to achieve a closed loop of the temperature of the second material container 42. Control to improve temperature control accuracy.
  • the first temperature sensor 18 detects that the temperatures of the first material container 41 and the second material container 42 reach the temperature required for the biological material, it is possible to control the respective materials to be added to the first material container 41 and the second material container 42, respectively. .
  • the first heat equalizing plate 14 disposed on the first side of the semiconductor refrigerating device 12 can realize uniform heat transfer through mutual gas-liquid two-phase conversion, thereby causing the semiconductor refrigerating device 12 and the second material container 42 to be interposed therebetween.
  • the heat transfer is more uniform and efficient, thereby effectively preventing the uneven heat transfer caused by the semiconductor refrigeration device 12 failing to completely cover the heat conductive sleeve 11, and since the semiconductor refrigeration sheet is not required to cover the entire heat conductive sleeve 11, the structural design and The spatial layout is also simpler and more compact; and the second heat equalizing plate 15 disposed on the second side of the semiconductor refrigerating device 12 can make the heat transfer between the semiconductor refrigerating device 12 and the environment more uniform, reducing the first side of the semiconductor refrigerating device 12 and The temperature difference on the second side, due to the reverse heat transfer process between the cold surface and the hot surface of the semiconductor refrigeration device, and the greater the temperature difference between the hot and cold surfaces, the more obvious the reverse heat transfer effect, and once transmitted by the forward
  • the cooling or heating action of the device 12 therefore, by providing the second heat equalizing plate 15 to reduce the temperature difference between the first side and the second side of the semiconductor refrigeration device 12, the reverse heat transfer effect can be attenuated, and the refrigeration or heating of the semiconductor refrigeration device 12 can be fully utilized. effect.
  • the conventional semiconductor refrigerating apparatus 12 generally includes only one semiconductor refrigerating sheet.
  • the semiconductor refrigerating apparatus 12 of the present invention may include at least two semiconductor refrigerating sheets.
  • the semiconductor refrigerating apparatus 12 includes three semiconductor refrigerating sheets, and the arrangement is advantageous in that, on the one hand, since the number of semiconductor refrigerating sheets is increased, it can be effectively increased. Large heating or cooling power to improve heat transfer; on the other hand, three semiconductor cooling sheets can be placed in parallel, which can improve the reliability of operation, even if one of the semiconductor cooling sheets fails, the remaining semiconductor cooling sheets still It can work normally to ensure the normal heating or cooling process.
  • a certain gap is provided between the three semiconductor refrigerating sheets of this embodiment, which facilitates the connection and installation of the lines.
  • the heat sink 13 may be a water-cooling heat sink or an air-cooling heat sink. As shown in FIG. 2-4, in this embodiment, the heat dissipating device 13 adopts an air-cooling heat dissipating device, which includes a heat sink group 131 and a heat dissipating fan 132. The heat sink group 131 is connected to the mounting board 6 through the first bracket 16.
  • the heat dissipating fan 132 Up, and connected to the second side of the semiconductor refrigerating device 12 through the second heat equalizing plate 15, the heat dissipating fan 132 is disposed at the lower portion of the fin group 131 through the second bracket 17, such that the fin group 131 and the semiconductor refrigerating device 12
  • the heat dissipation fan 132 can realize heat transfer between the heat sink group 131 and the environment, and the heat sink 13 can realize the semiconductor refrigeration device and the environment. Heat transfer between.
  • an opening (not shown) extending through the heat sink may be disposed on the heat sink of the heat sink group 131 to increase the heat dissipation area and improve heat dissipation efficiency.
  • the air outlet of the heat dissipation fan 132 faces away from the printing platform of the bioprinter.
  • the air outlet of the heat dissipation fan 132 faces upward, which can prevent the heat dissipation fan 132 from guiding the heat of the heat sink group 131.
  • the printing platform prevents the effects on the properties of the biomaterial on the printing platform.
  • the cooling fan 132 of the present invention may adopt a speed regulating fan, and according to the difference between the temperature of the heat sink group 131 and the ambient temperature, whether the cooling fan 132 is turned on or the cooling fan 132 is adjusted.
  • the speed can make the working state of the cooling fan 132 conform to the actual needs, avoiding waste of energy.
  • the container temperature control system 1 of the present invention may further include a heat dissipation temperature detecting control device for detecting the temperature of the heat sink group 131 and depending on the difference between the temperature of the heat sink group 131 and the ambient temperature. The value controls whether the cooling fan 132 is turned on and adjusts the rotational speed of the cooling fan 132.
  • the heat dissipation temperature detecting control device includes a second temperature sensor 19 disposed on the heat sink group 131 and a control system, and the second temperature sensor 19 can detect the temperature of the heat sink group 131 and feed back to the control system, and the control system Comparing the temperature of the heat sink group 131 with the ambient temperature, controlling whether the heat dissipation fan 132 operates and the rotational speed during operation according to the difference between the two, for example, can operate in the container temperature control system 1, and the temperature of the heat sink group 131
  • the heat radiation fan 132 can be controlled not to be activated.
  • the working process of the container temperature control system 1 of this embodiment is as follows:
  • the semiconductor refrigeration system When the temperature of the second material container 42 is lower than the temperature required for the auxiliary material, the semiconductor refrigeration system is in a heated state, and the first side of the semiconductor refrigeration device 12 adjacent to the second material container 42 is a hot surface, and is close to heat dissipation.
  • the second side of the semiconductor refrigerating apparatus 12 of the sheet group 131 is a cold surface.
  • the first side of the semiconductor refrigerating device 12 transfers heat to the second material container 42 through the first heat equalizing plate 14 and the heat conducting sleeve 11 to achieve the purpose of heating the second material container 42 for the purpose of heating the second material container 42.
  • the temperature is raised to the temperature required for the auxiliary material; at the same time, the heat in the environment can be transferred to the second side of the semiconductor refrigeration device 12 through the heat sink group 131 and the second heat equalizing plate 15, and the second side of the semiconductor refrigeration device 12 is raised.
  • the temperature is such that the temperature difference between the first side and the second side of the semiconductor refrigerating apparatus 12 can be reduced, that is, the temperature difference between the cold and hot surfaces of the semiconductor refrigerating apparatus 12 can be reduced, and the upper limit of heating of the semiconductor refrigerating apparatus 12 can be increased.
  • One side that is, the first side of the semiconductor refrigeration device 12 absorbs heat from the second material container 42 to achieve the purpose of lowering the temperature of the second material container 42 to lower the temperature of the second material container 42 to the temperature required for the auxiliary material;
  • the second side of the semiconductor refrigeration device 12 transfers heat to the heat sink group 131 through the second heat equalizing plate 15, and finally releases heat to the environment under the action of the heat radiating fan 132, and reduces the cold and hot surface of the semiconductor refrigeration device 12.
  • the temperature difference improves the cooling effect of the semiconductor refrigeration unit 12.
  • the container temperature control system 1 of this embodiment has the characteristics of small volume, fast response, and good control characteristics. Since a set of container temperature control system 1 is respectively disposed at the first material container 41 and the second material container 42, the biological printer temperature control system of the embodiment can respectively control the temperature of the main material and the auxiliary material to satisfy the main material and the auxiliary material. Different temperature requirements enable the main material and auxiliary materials to maintain better biological properties. In addition, due to the combined structure of the semiconductor refrigeration system and the soaking plate, the heat transfer efficiency is higher, the heat transfer process is more uniform, and the control precision is higher. It can reach 0.01 degrees, and heating and cooling can be selected in both directions. It can adapt to a variety of biological materials and different working environments, so that the same bio-printer has a wider range of printing materials.
  • the nozzle temperature control system 2 includes a nozzle heat transfer block 21, and the flow path temperature control system 3 includes a flow path heat transfer block 31, wherein the nozzle heat transfer block 21 is disposed in the first material container.
  • the flow path heat conducting block 31 is disposed below the second material container 42 and located at the outer periphery of the auxiliary material flow path 421, the first side of the nozzle heat conducting block 21 and the first material container 41
  • the first heat equalizing plate 14 of the container temperature control system 1 is connected, the second side of the nozzle heat conducting block 21 is connected to the first side of the flow channel heat conducting block 31, and the second side of the flow channel heat conducting block 31 is located at the second side.
  • the first heat equalizing plate 14 of the container temperature control system 1 at the material container 42 is connected, so that the semiconductor refrigerating device 12 on the side of the first material container 41 can be passed through the first heat equalizing plate 14 and the nozzle heat conducting block 21 and the nozzle 5.
  • the heat exchange realizes the temperature control of the nozzle 5, and the semiconductor refrigerating device 12 on the side of the second material container 42 can exchange heat with the auxiliary material flow path 421 through the first heat equalizing plate 14 and the flow path heat conducting block 31, thereby realizing The temperature control of the auxiliary material flow path 421.
  • this embodiment can adapt the temperature of the nozzle 5 and the auxiliary material flow path 421 to the requirements of the printing material, and avoid printing materials, especially high-viscosity printing materials.
  • the clogging occurs at the nozzle 5 and the auxiliary material flow path 421, and is advantageous in maintaining the biological activity of the printing material.
  • the auxiliary material flow path 421 is directly disposed in the flow path heat transfer block 31, and the auxiliary material is discharged from the second material container 42 and then flows into the nozzle 5 through the auxiliary material flow path.
  • the auxiliary material flow path 421 is directly disposed in the flow path heat transfer block 31, and the flow path of the auxiliary material can be adjusted as needed to guide the auxiliary material to a desired position.
  • a part of the auxiliary material flow path 421 needs to pass through the nozzle thermal block 21 before being introduced into the nozzle 5.
  • the thermal block 21 is located at the nozzle.
  • a heat insulating layer (not shown) is disposed around the auxiliary material flow path 421, and the heat insulating layer can ensure the temperature inside the auxiliary material flow path 21 from the temperature of the nozzle thermal block 21 through which it flows.
  • the manner of setting the temperature control system of the bio-printer of the present invention is not limited to the manner shown in this embodiment, and can be adapted according to the specific structural relationship of the bio-printing material container 4, the nozzle 5 and the flow path of the bio-printer, for example, If the bioprinter includes only one bioprinting material container 4, the bioprinter temperature control system may include only one container temperature control system 1 if the bioprinter is further provided between the outlet of the first material container 1 and the nozzle 5.
  • the main material flow path, the flow path temperature control system 3 can also be used for temperature control of the main material flow path, etc., which are all within the protection scope of the present invention.
  • the bioprinter provided by the present invention comprises a bioprinting material container 4 and a bioprinter temperature control system of the present invention, and a heat conducting sleeve 11 of the container temperature control system 1 of the bioprinter temperature control system is disposed on the outer periphery of the bioprinting material container 4.

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Abstract

提供了一种生物打印机温控系统和生物打印机，其中生物打印机温控系统包括流道温控系统（3），流道温控系统用于控制生物打印机的生物打印材料容器（4）的出口与生物打印机的喷嘴（5）之间的流道的温度，以使流道的温度与打印材料所需要的温度相一致。这种温控系统能够实现对生物打印材料的温控，提高打印材料的存活率，保证打印材料的生物功能。

Description

生物打印机温控系统和生物打印机 技术领域
本发明涉及生物打印机技术领域，特别涉及一种生物打印机温控系统和生物打印机。
背景技术
生物3D打印是指通过3D打印的原理和方法，将生物材料(包括天然生物材料和合成生物材料或细胞溶液)打印成为设计的三维结构体的技术。由于生物3D打印的打印材料为生物材料，与普通的3D打印技术相比，生物打印机的一个特点在于其需要为打印材料提供适宜其生存、生长以及具有良好生物学功能的条件，而温度是其中一项重要的控制指标。
目前，生物打印机通常设有温控系统，该温控系统用于对生物打印材料容器进行温度控制，其通常包括热交换部件和散热装置，其中热交换部件用于通过导热套与生物打印材料容器进行热交换，散热装置则用于实现热交换部件与环境之间的热交换。然而，现有的生物打印机温控系统具有以下几方面的问题：
(1)对于现有的生物打印机温控系统，生物材料容易出现堵塞现象。原因之一在于生物打印机温控系统只能够对生物打印材料容器进行温度控制，而无法对喷嘴部分以及流道部分进行温控，同时由于生物材料均具有一定的粘性，因此，打印材料容易在温度得不到有效控制的喷嘴及流道部分中发生堵塞，这种现象随着打印材料黏度的增加而愈加明显，从而影响整个生物打印机的打印效率，尤其是当打印平面为非平面时，为了更好适应打印需求而采用较长喷嘴时，问题更明显。另外，现有的生物打印机温控系统难以适用于流动特性随着温度变化而变化的打印材料，导致现有的生物打印机在打印材料的选择上存在较大的限制。
(2)现有的生物打印机温控系统难以实现对生物打印容器的 均匀温控。在现有技术中，由于空间限制等原因，热交换部件无法全面地覆盖导热套，在导热套上容易出现热交换部件覆盖不到的盲区，这样的结构容易造成对生物打印材料容器加热不均，导致生物材料受热不均匀等问题，导致生物材料存活率下降、生物功能下降等的风险增大；而若将热交换部件全部覆盖于导热套上，则热交换部件上的散热装置难以布局，通常情况下只能附着于整个结构的外部，使得结构整体外凸、不利于整体结构布置。
发明内容
本发明所要解决的一个技术问题是：现有的生物打印机温控系统没有对从生物打印容器到喷嘴之间的流道中的生物材料进行温控，导致生物材料在流道中流动性不好而出现堵塞的问题，并且由于生物材料在流道中的温度没有得到控制，以致出现生物材料的存活率较低、生物功能下降等的风险。
为了解决上述技术问题，本发明提供一种生物打印机温控系统，包括流道温控系统，所述流道温控系统用于控制生物打印机的生物打印材料容器的出口与生物打印机的喷嘴之间的流道的温度，以使所述流道的温度与生物打印材料所需要的温度相一致。
进一步地，所述生物打印机温控系统包括容器温控系统，所述容器温控系统包括热交换装置，所述热交换装置用于与生物打印材料容器进行热交换，以控制生物打印材料容器的温度与其所盛装的生物打印材料所需要的温度相一致，所述生物打印机温控系统还包括设置在所述生物打印材料容器与所述热交换装置之间的第一均热板，所述第一均热板用于实现所述热交换装置与所述生物打印材料容器之间的均匀热传递。
进一步地，所述热交换装置包括热交换部件和散热装置，所述热交换部件能够对所述生物打印材料容器进行加热和制冷，所述第一均热板设置在所述生物打印材料容器与所述热交换部件的第一侧之间，所述热交换部件的第二侧与所述散热装置连接，所述散热 装置用于实现所述热交换部件与环境之间的热传递。
进一步地，所述容器温控系统还包括第二均热板，所述第二均热板设置在所述热交换部件的第二侧与所述散热装置之间，用于实现所述热交换部件与所述散热装置之间的均匀热传递。
进一步地，所述散热装置包括散热片组和散热风扇，所述散热片组与所述热交换部件的第二侧连接，所述散热风扇用于实现所述散热片组与环境之间的热传递，所述第二均热板设置在所述热交换部件的第二侧与所述散热片组之间，用于实现所述热交换部件与所述散热片组之间的均匀热传递。
进一步地，所述散热风扇的出风口背离所述生物打印机的打印平台设置。
进一步地，所述散热风扇为调速风扇，所述容器温控系统还包括散热温度检测控制装置，所述散热温度检测控制装置用于检测所述散热片组的温度并能够依据所述散热片组的温度与环境温度的差值来控制所述散热风扇是否开启以及调节所述散热风扇的转速。
进一步地，所述容器温控系统还包括容器温度检测控制装置，所述容器温度检测控制装置用于检测所述生物打印材料容器的温度并反馈给所述热交换装置以形成对所述生物打印材料容器温度的闭环控制。
进一步地，所述生物打印机温控系统还包括喷嘴温控系统，所述喷嘴温控系统用于控制生物打印机的喷嘴的温度，以使所述喷嘴的温度与所述生物打印材料所需要的温度相一致。
进一步地，所述喷嘴温控系统包括喷嘴导热块，所述喷嘴导热块设置在所述喷嘴的外周。
进一步地，所述流道温控系统包括流道导热块，所述流道导热块设置在生物打印材料容器的出口与喷嘴之间的流道的外周。
进一步地，所述生物打印机温控系统包括两个独立的所述容器温控系统，其中一个容器温控系统用于对所述生物打印材料容器的第一材料容器进行温度控制，其中另一个容器温控系统用于对所述 生物打印材料容器的第二材料容器进行温度控制。
进一步地，所述热交换部件包括半导体制冷片。
本发明还提供一种生物打印机，包括前述的生物打印机温控系统。
进一步地，包括生物打印材料容器，所述生物打印材料容器包括第一材料容器和第二材料容器，所述生物打印机的喷嘴与所述第一材料容器和所述第二材料容器之一的出口通过所述流道连通，在所述流道外周设有流道导热块。
进一步地，在所述喷嘴的外周上设有喷嘴导热块，所述流道从所述出口依次穿过所述流道导热块和所述喷嘴导热块与所述喷嘴连通。
进一步地，在所述喷嘴导热块中的所述流道的外周上设有隔热层，用于隔离来自所述喷嘴导热块的热量。
进一步地，所述隔热层设置于所述流道与所述喷嘴导热块之间。
本发明所提供的生物打印机温控系统，通过设置流道温控系统，能够实现对生物打印材料容器到喷嘴之间的流道的温度控制，从而可以有效解决目前打印材料容易在流道处发生堵塞的问题，有效提高生物打印机的打印效率。
另外，通过在生物打印材料容器和热交换装置之间设置均热板，能够实现对生物打印材料容器的均匀温控，从而提高打印材料的存活率，保证打印材料的生物功能；并且由于无须将热交换部件全部覆盖于生物打印材料容器上即可实现对整个生物打印材料容器温度的均匀控制，从而能够方便散热装置的布局设置，使得整体结构更加紧凑美观。
此外，本发明通过设置喷嘴温控系统，能够实现对喷嘴的温度控制，从而可以有效解决目前打印材料容易在喷嘴处发生堵塞的问题，尤其是当打印平面为非平面时，为了更好适应打印需求而采用较长喷嘴时，效果更明显，有效提高生物打印机的打印效率。
本发明为生物打印机提供了温控系统，用于控制生物打印机的温度，温控使生物打印机的温度更均匀，有助于提供细胞的存活率和生物功能，可以使得打印目标实现的更理想。
通过以下参照附图对本发明的示例性实施例进行详细描述，本发明的其它特征及其优点将会变得清楚。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动性的前提下，还可以根据这些附图获得其他的附图。
图1示出本发明一实施例的生物打印机温控系统的安装于生物打印机上的结构示意图。
图2示出图1所示实施例的主视图。
图3示出图2的侧视图。
图4示出图3的A-A剖面图。
图中：
1、容器温控系统；11、导热套；12、半导体制冷装置；13、散热装置；131、散热片组；132、散热风扇；14、第一均热板；15、第二均热板；16、第一连接架；17、第二连接架；18、第一温度传感器；19、第二温度传感器；
2、喷嘴温控系统；21、喷嘴导热块；
3、流道温控系统；31、流道导热块；
4、生物打印材料容器；41、第一材料容器；42、第二材料容器；
5、喷嘴；6、安装板；7、隔热板。
具体实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。以下对至少一个示例性实施例的描述实际上仅仅是说明性的，决不作为对本发明及其应用或使用的任何限制。基于本发明中的实施例，本领域普通技术人员在没有开展创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
在本发明的描述中，需要理解的是，方位词如“前、后、上、下、左、右”、“横向、竖向、垂直、水平”和“顶、底”等所指示的方位或位置关系通常是基于附图所示的方位或位置关系，仅是为了便于描述本发明和简化描述，在未作相反说明的情况下，这些方位词并不指示和暗示所指的装置或元件必须具有特定的方位或者以特定的方位构造和操作，因此不能理解为对本发明保护范围的限制；方位词“内、外”是指相对于各部件本身的轮廓的内外。
在本发明的描述中，需要理解的是，使用“第一”、“第二”等词语来限定零部件，仅仅是为了便于对相应零部件进行区别，如没有另行声明，上述词语并没有特殊含义，因此不能理解为对本发明保护范围的限制。
为了解决现有技术中打印材料在喷嘴处和流道处容易发生堵塞现象的技术问题，图1-4示出了本发明一实施例的生物打印机温控系统的结构示意图，本发明的生物打印机温控系统包括流道温控系统3，流道温控系统3则用于控制生物打印材料容器4的出口与喷嘴5之间的流道的温度，使流道的温度与打印材料所需要的温度相一致，这里的流道不应该理解为包括喷嘴5内部的任何流道。这样，本发明的生物打印机温控系统能够保证流道的温度也满足打印材料的需求，从而能够保证打印材料流动的畅通性，提高生物打印机的打印效率
本发明的生物打印机温控系统包括容器温控系统1，容器温控系统1包括热交换装置，热交换装置用于与生物打印材料容器4进 行热交换，以控制生物打印材料容器4的温度与其所盛装的打印材料所需要的温度相一致，还包括设置在生物打印材料容器4与热交换装置之间的第一均热板14，第一均热板14用于实现热交换装置与生物打印材料容器4之间的均匀热传递。
本发明所提供的生物打印机温控系统，通过在生物打印材料容器4和热交换装置之间设置第一均热板14，能够实现对生物打印材料容器4的均匀温控，从而提高打印材料的存活率，保证打印材料的生物功能，也能够防止打印材料在生物打印材料容器4处发生堵塞，提高生物打印机的工作可靠性。
作为热交换装置的一种实施方式，热交换装置可以包括热交换部件和散热装置13，其中，热交换部件能够对生物打印材料容器4进行加热和制冷，散热装置13用于实现热交换部件与环境之间的热传递，这样当生物打印材料容器4的温度高于打印材料所需要的温度时，热交换部件可以从生物打印材料容器4吸收热量，将生物打印材料容器4冷却至打印材料所需要的温度；而当生物打印材料容器4的温度低于打印材料所需要的温度时，热交换部件可以向生物打印材料容器4传递热量，将生物打印材料容器4加热至打印材料所需要的温度。可见，该实施方式的热交换装置对生物打印材料容器4温度控制方式更加灵活，其能够根据实际情况对生物打印材料容器4进行加热或制冷，控制精度更高，且能够满足不同打印材料的温度需求。
为了进一步实现热交换部件与散热装置13之间更加均匀的热传递，还可以在热交换部件的第二侧与散热装置13之间设置第二均热板15，基于该第二均热板15，环境中的热量可以通过散热装置13与热交换部件的第二侧之间进行更加均匀地热传递，缩小热交换部件两侧之间的温度差，进一步改善热交换部件的热传递效果。
这样的结构还有利于整体结构布置，通常情况下，若将散热装置13全部覆盖于热交换部件上，散热装置13的散热风扇则会附着 于整个结构的外部，而使得结构整体外凸；本实施例通过在散热装置13与热交换部件之间设置第二均热板15，能够减小热交换部件上的热交换盲区，并为散热风扇提供装配空间，以避免整体结构外凸。。
此外，为了进一步解决现有技术中打印材料在喷嘴处容易发生堵塞现象的技术问题，本发明的生物打印机温控系统还可以包括喷嘴温控系统2，其中喷嘴温控系统2用于控制生物打印机的喷嘴5的温度，使喷嘴5的温度与打印材料所需要的温度相一致。
这样，本发明的生物打印机温控系统，不仅保证了在流道处的温度满足打印材料的需求，还保证了在喷嘴5以及生物打印材料容器4处的温度满足打印材料的需求，从而能够保证打印材料流动的畅通性，提高生物打印机的打印效率，且由于打印材料在整个打印过程中均能够处于适宜的温度环境之中，因此还能够保证打印材料始终具有良好的生物性能，从而提高生物打印产品的性能。
下面结合图1-4所述的实施例对本发明的生物打印机温控系统进行进一步地说明。在该实施例中，生物打印机温控系统所应用的生物打印机，其生物打印材料容器4包括第一材料容器41和第二材料容器42，第一材料容器41和第二材料容器42通过隔热板7连接于生物打印机的安装板6上，生物打印机的喷嘴5连接于第一材料容器4的出口处，而第二材料容器42的出口则通过辅材流道421与喷嘴5连通。第一材料容器41可以作为用于盛装主材(又称生物墨汁)的主材容器，第二材料容器42可以作为用于盛装辅材(例如水凝胶)的辅材容器，例如辅材可以用于对主材形成包裹，以避免生主材在打印过程中受到机械力的破坏而损伤。当然主材和辅材也可以以其他方式组合在一起，例如混合等。
如图1-4所示，在该实施例中，生物打印机温控系统包括两个独立的容器温控系统1、一套喷嘴温控系统2和一套流道温控系统3，其中，一个容器温控系统1用于对第一材料容器41进行温度控制，另一个容器温控系统1则用于对第二材料容器42进行温度控 制，喷嘴温控系统2用于对喷嘴5进行温度控制，流道温度控制系统3则用于对辅材流道421进行温度控制。通过设置两个独立的容器温控系统分别对第一材料容器41和第二材料容器42进行温控，可以满足不同特性的主材和辅材对温度的不同需求。
由于在该实施例中，两套容器温控系统1的结构基本相同，因此，接下来仅以其中设在第二材料容器42处的容器温控系统1为例来对容器温控系统1进行说明。
如图2和图4所示，在该实施例中，容器温控系统1包括导热套11、用作热交换装置的半导体制冷系统、第一均热板14以及第二均热板15。其中，半导体制冷系统包括半导体制冷装置12和散热装置13，导热套11套设在第二材料容器42的外周，半导体制冷装置12的第一侧通过第一均热板14与导热套14连接，半导体制冷装置12的第二侧通过第二均热板15与散热装置13连接。
半导体制冷系统既可以用作热源，又可以用作冷源。依据半导体制冷理论，在半导体制冷系统的半导体制冷片两侧施加一个直流电压就会产生一个直流电流，这会使半导体制冷片一侧发热且另一侧制冷。通常将发热的一侧称为“热面”，而制冷的一侧称为“冷面”。半导体制冷片具有控制端，向控制端发送指令后，能够对调半导体制冷片两侧的电压极性，使电流反向流动，从而实现半导体制冷片的冷面和热面的相互转换，也即能够实现半导体制冷系统制冷和制热功能的相互转换，除了冷热面交换，还可以根据需求实现精确的温度控制(精度0.01度)。可见，采用半导体制冷系统作为本发明的热交换装置，可以方便有效地实现对第二材料容器42的加热或制冷，以满足各种生物打印材料的不同温度需求。
在该实施例中，容器温控系统1中可以设置容器温度检测控制装置，并通过该容器温度检测控制装置控制半导体制冷系统在加热工作状态和制冷工作状态之间切换。如图4所示，在该实施例中，容器温度检测控制装置包括控制系统(图中未示出)和设置在导热套11上的第一温度传感器18，该第一温度传感器18用于检测导热 套11的温度并传递至控制系统，由于导热套11的温度与对应的第二材料容器42的温度一致，因此，第一温度传感器18能够检测第二材料容器42的温度并传递至控制系统，控制系统则通过比较第二材料容器42的温度与辅材所需要的温度(通常预设在控制系统中)的差值控制半导体制冷系统的工作状态，从而实现对第二材料容器42温度的闭环控制，提高温控精度。当第一温度传感器18检测到第一材料容器41和第二材料容器42的温度达到生物材料所需要的温度后，可以控制分别向第一材料容器41和第二材料容器42内加入相应的材料。
设置在半导体制冷装置12第一侧的第一均热板14，能够通过其内部的气液两相相互转换的方式实现热量的均匀传递，从而使得半导体制冷装置12与第二材料容器42之间的热传递更加均匀高效，进而有效防止因半导体制冷装置12无法全面覆盖导热套11所造成的传热不均的现象，并且由于无须将半导体制冷片覆盖于整个导热套11上，使得结构设计和空间布局也更加简单紧凑；而设置在半导体制冷装置12第二侧的第二均热板15则能够使得半导体制冷装置12与环境之间的热传递更加均匀，缩小半导体制冷装置12第一侧和第二侧的温差，由于半导体制冷装置的冷面和热面之间存在逆向热传递过程，且冷热面的温差越大，这种逆向热传递作用越明显，而一旦正向热传递所传递的热量与逆向热传递所传递的热量相等时，冷面和热面的温度就不再发生变化，影响半导体制冷装置12的制冷或加热作用，因此，通过设置第二均热板15缩小半导体制冷装置12第一侧和第二侧的温差，能够减弱逆向热传递效应，充分发挥半导体制冷装置12的制冷或加热作用。
现有的半导体制冷装置12通常只包括一块半导体制冷片，为了使半导体制冷装置12具有更高的热传递功率，本发明的半导体制冷装置12可以包括至少两块半导体制冷片。如图4所示，在该实施例中，半导体制冷装置12包括三块半导体制冷片，这样设置的好处在于，一方面由于增加了半导体制冷片的数量，能够有效增 大加热或制冷的功率，改善热传递效果；另一方面，三块半导体制冷片之间可以并联设置，这样可以提高其工作可靠性，即使其中一块半导体制冷片发生故障，剩余的半导体制冷片仍能够正常工作，保证加热或制冷过程的正常进行。此外，由图4可知，该实施例的三块半导体制冷片之间均设有一定的间隙，这样能够便于线路的连接与安装。
散热装置13可以采用水冷散热装置，也可以采用风冷散热装置。如图2-4所示，在该实施例中，散热装置13采用风冷散热装置，其包括散热片组131和散热风扇132，其中，散热片组131通过第一支架16连接于安装板6上，且其通过第二均热板15与半导体制冷装置12的第二侧连接，散热风扇132则通过第二支架17设置在散热片组131的下部，这样散热片组131与半导体制冷装置12的第二侧之间可以通过第二均热板15进行均匀地热传递，而散热风扇132可以实现散热片组131与环境之间的热传递，进而使得散热装置13能够实现半导体制冷装置与环境之间的热传递。此外，可以在散热片组131的散热片上设置横向贯穿散热片的开孔(图中未示出)，以增大散热面积，提升散热效率。
在该实施例中，散热风扇132的出风口背离生物打印机的打印平台，在图1-4中即散热风扇132的出风口朝向上方，这样能够避免散热风扇132将散热片组131的热量引导向打印平台，从而可以防止对打印平台上面的生物材料的特性产生影响。
进一步地，为了节约能源以及实现精确温控，本发明的散热风扇132可以采用调速风扇，依据散热片组131的温度与环境温度的差值来控制散热风扇132是否开启以及调节散热风扇132的转速，即可使散热风扇132的工作状态与实际需要相符合，避免能量的浪费。为了实现该目的，本发明的容器温控系统1还可以包括散热温度检测控制装置，该散热温度检测控制装置用于检测散热片组131的温度并依据散热片组131的温度与环境温度的差值来控制散热风扇132是否开启以及调节散热风扇132的转速。在如图4所示的实 施例中，散热温度检测控制装置包括设置于散热片组131上的第二温度传感器19及控制系统，该第二温度传感器19可以检测散热片组131的温度并反馈至控制系统，控制系统则将散热片组131的温度与环境温度进行比较，依据二者的差值来控制散热风扇132是否工作以及工作时的转速，例如，可以在容器温控系统1工作，且散热片组131的温度与环境温度的温差ΔT大于设定值T0时，启动散热风扇132，并使其以R＝(ΔT/30)×R0的转速运转，其中R0为风扇额定转速；而在容器温控系统1不工作或在散热片组131的温度与环境温度的温差ΔT小于设定值T0时，则可以控制散热风扇132不启动。此处的控制系统可以与容器温度检测控制装置的控制系统为同一控制系统，例如可以利用生物打印机已有的控制系统来实现相应的功能。
该实施例的容器温控系统1的工作过程如下：
(1)当第二材料容器42的温度低于辅材所需要的温度时，半导体制冷系统处于加热状态，靠近第二材料容器42的半导体制冷装置12的第一侧为热面，而靠近散热片组131的半导体制冷装置12的第二侧为冷面。此时，半导体制冷装置12的第一侧通过第一均热板14和导热套11将热量传递给第二材料容器42，实现对第二材料容器42加热的目的，将第二材料容器42的温度升高至辅材所需要的温度；同时，环境中的热量能够通过散热片组131及第二均热板15传递给半导体制冷装置12的第二侧，升高半导体制冷装置12第二侧的温度，从而能够缩小半导体制冷装置12的第一侧与第二侧之间的温差，也即能够缩小半导体制冷装置12冷热面之间的温差，增大半导体制冷装置12的加热上限。
(2)反之，当第二材料容器42的温度高于辅材所需要的温度时，半导体制冷系统处于制冷状态，靠近第二材料容器42的半导体制冷装置12的第一侧变为冷面，而靠近散热装置13的半导体制冷装置12的第二侧则变为热面。此时，第二材料容器42的热量通过第一导热套11和第一均热板14传递给半导体制冷装置12的第 一侧，也即半导体制冷装置12的第一侧从第二材料容器42吸收热量，实现对第二材料容器42降温的目的，使第二材料容器42的温度降低至辅材所需要的温度；同时，半导体制冷装置12的第二侧将热量通过第二均热板15传递给散热片组131，并在散热风扇132的作用下最终将热量释放至环境中，缩小半导体制冷装置12冷热面的温差，改善半导体制冷装置12的制冷效果。
该实施例的容器温控系统1具有体积小、响应快、控制特性好等特点。由于在第一材料容器41和第二材料容器42处分别设有一套容器温控系统1，该实施例的生物打印机温控系统能够分别控制主材和辅材的温度，满足主材和辅材不同的温度需求，使主材和辅材能够保持更加优良的生物性能，此外，由于采用半导体制冷系统和均热板的组合结构，传热效率较高，传热过程较均匀，控制精度较高，可以达到0.01度，并且加热和制冷可双向选择，能够适应多种生物材料以及不同工作环境的需求，使得同一生物打印机具有更宽的打印材料的选择范围。
如图1-4所示，在该实施例中，喷嘴温控系统2包括喷嘴导热块21，流道温控系统3包括流道导热块31，其中，喷嘴导热块21设置在第一材料容器41下方，并位于喷嘴5的外周，流道导热块31设置在第二材料容器42下方，并位于辅材流道421的外周，喷嘴导热块21的第一侧与位于第一材料容器41处的容器温控系统1的第一均热板14连接，喷嘴导热块21的第二侧与流道导热块31的第一侧连接，而流道导热块31的第二侧则与位于第二材料容器42处的容器温控系统1的第一均热板14连接，这样，第一材料容器41一侧的半导体制冷装置12可以通过第一均热板14和喷嘴导热块21与喷嘴5进行热交换，实现对喷嘴5的温度控制，而第二材料容器42一侧的半导体制冷装置12可以通过第一均热板14和流道导热块31与辅材流道421进行热交换，实现对辅材流道421的温度控制。可见，该实施例能够使喷嘴5和辅材流道421的温度均与打印材料的需求相适应，避免打印材料，尤其是高黏度打印材 料，在喷嘴5和辅材流道421处发生堵塞，且有利于保持打印材料的生物活性。
如图4所示，在该实施例中，辅材流道421直接设置于流道导热块31中，辅材由第二材料容器42出口出来后，经由该辅材流道流入喷嘴5内。将辅材流道421直接设置于流道导热块31中，能够按需调整辅材的流动路径，将辅材导流至需要的位置。
如图4所示，在该实施例中，有一部分辅材流道421在汇入喷嘴5之前需要经过喷嘴导热块21，为了实现主材和辅材的独立精准温控，位于喷嘴导热块21内的辅材流道421的四周设置有隔热层(图未示出)，该隔热层能够保证辅材流道21内部的温度免受其流经的喷嘴导热块21的温度的影响。
本发明的生物打印机温控系统的设置方式并不局限于该实施例所示的方式，其可以根据生物打印机的生物打印材料容器4、喷嘴5和流道的具体结构关系进行相适应设置，例如，若生物打印机只包括一个生物打印材料容器4，则生物打印机温控系统可以只包括一个容器温控系统1，若生物打印机在第一材料容器1的出口至喷嘴5之间还设有较长的主材流道，则流道温控系统3也可以用于对主材流道进行温控等等，这些设置方式都在本发明的保护范围之内。
本发明所提供的生物打印机，包括生物打印材料容器4和本发明的生物打印机温控系统，生物打印机温控系统的容器温控系统1的导热套11设置于生物打印材料容器4的外周。
以上所述仅为本发明的示例性实施例，并不用以限制本发明，凡在本发明的精神和原则之内，所作的任何修改、等同替换、改进等，均应包含在本发明的保护范围之内。

Claims (18)

  1. 一种生物打印机温控系统，其特征在于，包括流道温控系统(3)，所述流道温控系统(3)用于控制生物打印机的生物打印材料容器(4)的出口与生物打印机的喷嘴(5)之间的流道的温度，以使所述流道的温度与生物打印材料所需要的温度相一致。
  2. 根据权利要求1所述的生物打印机温控系统，其特征在于，所述生物打印机温控系统包括容器温控系统(1)，所述容器温控系统(1)包括热交换装置，所述热交换装置用于与生物打印材料容器(4)进行热交换，以控制生物打印材料容器(4)的温度与其所盛装的生物打印材料所需要的温度相一致，所述生物打印机温控系统还包括设置在所述生物打印材料容器(4)与所述热交换装置之间的第一均热板(14)，所述第一均热板(14)用于实现所述热交换装置与所述生物打印材料容器(4)之间的均匀热传递。
  3. 根据权利要求2所述的生物打印机温控系统，其特征在于，所述热交换装置包括热交换部件(12)和散热装置(13)，所述热交换部件(12)能够对所述生物打印材料容器(4)进行加热和制冷，所述第一均热板(14)设置在所述生物打印材料容器(4)与所述热交换部件(12)的第一侧之间，所述热交换部件(12)的第二侧与所述散热装置(13)连接，所述散热装置(13)用于实现所述热交换部件(12)与环境之间的热传递。
  4. 根据权利要求3所述的生物打印机温控系统，其特征在于，所述容器温控系统(1)还包括第二均热板(15)，所述第二均热板(15)设置在所述热交换部件(12)的第二侧与所述散热装置(13)之间，用于实现所述热交换部件(12)与所述散热装置(13)之间的均匀热传递。
  5. 根据权利要求4所述的生物打印机温控系统，其特征在于，所述散热装置(13)包括散热片组(131)和散热风扇(132)，所述散热片组(131)与所述热交换部件(12)的第二侧连接，所述 散热风扇(132)用于实现所述散热片组(131)与环境之间的热传递，所述第二均热板(15)设置在所述热交换部件(12)的第二侧与所述散热片组(131)之间，用于实现所述热交换部件(12)与所述散热片组(131)之间的均匀热传递。
  6. 根据权利要求5所述的生物打印机温控系统，其特征在于，所述散热风扇(132)的出风口背离所述生物打印机的打印平台设置。
  7. 根据权利要求5所述的生物打印机温控系统，其特征在于，所述散热风扇(132)为调速风扇，所述容器温控系统(1)还包括散热温度检测控制装置，所述散热温度检测控制装置用于检测所述散热片组(131)的温度并能够依据所述散热片组(131)的温度与环境温度的差值来控制所述散热风扇(132)是否开启以及调节所述散热风扇(132)的转速。
  8. 根据权利要求2所述的生物打印机温控系统，其特征在于，所述容器温控系统(1)还包括容器温度检测控制装置，所述容器温度检测控制装置用于检测所述生物打印材料容器(4)的温度并反馈给所述热交换装置以形成对所述生物打印材料容器(4)温度的闭环控制。
  9. 根据权利要求1所述的生物打印机温控系统，其特征在于，所述生物打印机温控系统还包括喷嘴温控系统(2)，所述喷嘴温控系统(2)用于控制生物打印机的喷嘴(5)的温度，以使所述喷嘴(5)的温度与所述生物打印材料所需要的温度相一致。
  10. 根据权利要求9所述的生物打印机温控系统，其特征在于，所述喷嘴温控系统(2)包括喷嘴导热块(21)，所述喷嘴导热块(21)设置在所述喷嘴(5)的外周。
  11. 根据权利要求1所述的生物打印机温控系统，其特征在于，所述流道温控系统包括流道导热块(31)，所述流道导热块(31)设置在生物打印材料容器(4)的出口与喷嘴(5)之间的流道的外周。
  12. 根据权利要求1所述的生物打印机温控系统，其特征在于，所述生物打印机温控系统包括两个独立的所述容器温控系统(1)，其中一个容器温控系统(1)用于对所述生物打印材料容器(4)的第一材料容器(41)进行温度控制，其中另一个容器温控系统(1)用于对所述生物打印材料容器(4)的第二材料容器(42)进行温度控制。
  13. 根据权利要求3所述的生物打印机温控系统，其特征在于，所述热交换部件(12)包括半导体制冷片。
  14. 一种生物打印机，其特征在于，包括如权利要求1所述的生物打印机温控系统。
  15. 根据权利要求14所述的生物打印机，其特征在于，包括生物打印材料容器(4)，所述生物打印材料容器(4)包括第一材料容器(41)和第二材料容器(42)，所述生物打印机的喷嘴与所述第一材料容器(41)和所述第二材料容器(42)之一的出口通过所述流道连通，在所述流道外周设有流道导热块。
  16. 根据权利要求15所述的生物打印机，其特征在于，在所述喷嘴的外周上设有喷嘴导热块(21)，所述流道从所述出口依次穿过所述流道导热块和所述喷嘴导热块与所述喷嘴连通。
  17. 根据权利要求16所述的生物打印机，其特征在于，在所述喷嘴导热块(21)中的所述流道的外周上设有隔热层，用于隔离来自所述喷嘴导热块(21)的热量。
  18. 根据权利要求17所述的生物打印机，其特征在于，所述隔热层设置于所述流道与所述喷嘴导热块之间。
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