WO2017110738A1

WO2017110738A1 - Multilayer capacitor and package structure of same

Info

Publication number: WO2017110738A1
Application number: PCT/JP2016/087771
Authority: WO
Inventors: 岩下　英史; 畠中　英文
Original assignee: 京セラ株式会社
Priority date: 2015-12-24
Filing date: 2016-12-19
Publication date: 2017-06-29
Also published as: JP6643358B2; JPWO2017110738A1

Abstract

This multilayer capacitor is provided with: a laminate which has first and second surfaces, first and second end faces, and first and second lateral surfaces; a plurality of internal electrodes; first and second external electrodes which are respectively arranged on the pair of lateral surfaces; and a first external terminal connected to the first external electrode and a second external terminal connected to the second external electrode. The first external terminal comprises: a plate-like first substrate connection part that is arranged above the first surface with a space therebetween; and a first electrode connection part which extends from the first substrate connection part toward the second end face and has a front end portion that is connected to the first external electrode. The second external terminal comprises: a plate-like second substrate connection part that is arranged above the first surface with a space therebetween; and a second electrode connection part which extends from the second substrate connection part toward the first end face and has a front end portion that is connected to the second external electrode.

Description

Multilayer capacitor and its mounting structure

The present invention relates to a multilayer capacitor in which a pair of external electrodes are provided on a multilayer body in which a plurality of dielectric layers and internal electrodes are alternately stacked, and a mounting structure thereof.

In a multilayer capacitor, dielectric layers and internal electrodes are alternately laminated. As a ceramic material constituting the dielectric layer, a ferroelectric material such as barium titanate having a relatively high dielectric constant is generally used. It is used. For example, when an AC voltage is applied to such a multilayer capacitor, the dielectric layer is distorted by an electrostrictive effect caused by the voltage and vibrates. The multilayer capacitor is mounted on the substrate via solder or the like, and propagates vibration to the substrate via the solder joint. Furthermore, the multilayer capacitor resonates the substrate by vibration and amplifies the vibration to generate vibration sound on the substrate. Therefore, the substrate generates an audible sound when resonating at a resonance frequency in the audible range, and a so-called sounding phenomenon occurs. Thus, in the multilayer capacitor, the pair of external electrodes and the substrate electrode are mounted via the solder, and the vibration causes the substrate to be deformed via the solder joint. Become. For example, Patent Document 1 discloses a multilayer capacitor in which a pair of external electrodes is provided at the center of a pair of side surfaces along the longitudinal direction of a multilayer body.

JP 2007-194312 A

The multilayer capacitor of the present disclosure includes a pair of first surfaces and second surfaces, a pair of first end surfaces and second end surfaces, and a pair of first side surfaces on which a plurality of dielectric layers are stacked. And a rectangular parallelepiped laminate having a second side surface, a plurality of internal electrodes arranged in the stacking direction between the plurality of dielectric layers, the first side surface and the second side surface A first external electrode and a second external electrode electrically connected to the different internal electrodes, which are respectively disposed on the side surfaces; a first external terminal joined to the first external electrode; and the first external electrode And a second external terminal joined to the two external electrodes. The first external electrode and the second external electrode include a side surface portion disposed so as to include a central portion of the side surface, and a first surface extension extending from the side surface portion to the first surface. And a second surface extending portion extending on the second surface. The first external terminal includes a first substrate connecting portion of a plate-like body and the first substrate which are arranged to face each other with a gap between the first surface adjacent to the first end surface. It extended toward the direction of the said 2nd end surface from the connection part along the longitudinal direction of the said laminated body, and the edge part of the extended part was joined to the said 1st surface extension part of the said 1st external electrode. The first electrode connection portion is included. The second external terminal includes a second substrate connecting portion of the plate-like body and the second substrate, which are arranged to face each other with a gap between the first surface adjacent to the second end surface. Extending from the connecting portion along the longitudinal direction of the laminate toward the first end surface, the end of the extended portion is joined to the first surface extending portion of the second external electrode. 2 electrode connections.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic perspective view showing a multilayer capacitor according to a first embodiment, where (a) is a schematic perspective view seen from the upper surface side, and (b) is a schematic perspective view seen from the lower surface side. It is. 1A is a plan view of the multilayer capacitor shown in FIG. 1 as viewed from above, and FIG. 1B is a plan view of the multilayer capacitor shown in FIG. 1 as viewed from below. FIG. 2 (a) is an end view of a cut portion taken along line AA of the multilayer capacitor shown in FIG. 2 (a), and FIG. 2 (b) is a BB line of the multilayer capacitor shown in FIG. 2 (a). FIG. (A)-(c) is a top view for demonstrating an internal electrode. (A) is a schematic perspective view showing a state in which the multilayer capacitor shown in FIG. 1 is mounted on a substrate, and (b) is a multilayer type in a state where the multilayer capacitor shown in FIG. 1 is mounted on a substrate. It is the schematic side view seen from the direction perpendicular | vertical to the longitudinal direction of a capacitor | condenser. (A)-(d) is explanatory drawing for demonstrating the manufacturing method of the multilayer capacitor shown in FIG. FIG. 3 is a schematic perspective view illustrating a multilayer capacitor according to a second embodiment, where (a) is a schematic perspective view viewed from the upper surface side, and (b) is a schematic perspective view viewed from the lower surface side. It is. (A) is the top view which planarly viewed the multilayer capacitor shown in FIG. 7 from the upper surface side, (b) is the top view which planarly viewed the multilayer capacitor shown in FIG. FIG. 8A is an end view of the multilayer capacitor shown in FIG. 8A cut along line AA. FIG. 8B is a cross-sectional view taken along line BB of the multilayer capacitor shown in FIG. FIG. (A) is a schematic perspective view showing a state in which the multilayer capacitor shown in FIG. 7 is mounted on a substrate, and (b) is a multilayer type in a state where the multilayer capacitor shown in FIG. 7 is mounted on a substrate. It is the schematic side view seen from the direction perpendicular | vertical to the longitudinal direction of a capacitor | condenser. FIGS. 8A to 8D are explanatory views for explaining a method of manufacturing the multilayer capacitor shown in FIG. FIG. 6 is another example of the multilayer capacitor shown in FIG. 1, and is a side view seen from a direction perpendicular to the longitudinal direction of the multilayer capacitor. It is explanatory drawing for demonstrating the external terminal used for the multilayer capacitor | condenser shown in FIG. 12, Comprising: (a) is the top view which planarly viewed the multilayer capacitor | condenser shown in FIG. FIG. 13B is a plan view of the external terminal used in the multilayer capacitor shown in FIG. 12 as viewed from the upper surface side, and FIG. 10C is a cut end surface cut along the line EE of the external terminal shown in FIG. FIG. FIG. 8 is another example of the multilayer capacitor shown in FIG. 7, and is a side view seen from a direction perpendicular to the longitudinal direction of the multilayer capacitor.

A conventional multilayer capacitor has a pair of external electrodes on a pair of end faces. The substrate electrode is provided on the substrate in alignment with the pair of external electrodes provided on the pair of end faces, and is disposed at a position in the longitudinal direction of the multilayer body of the multilayer capacitor. In the multilayer capacitor disclosed in Patent Document 1, a pair of external electrodes is provided at the center of a pair of side surfaces, and a substrate electrode disposed at a position in the longitudinal direction cannot be employed. As a result, in the multilayer capacitor disclosed in Patent Document 1, the arrangement of the substrate electrodes must be changed to the position in the short direction of the multilayer capacitor multilayer body in accordance with the pair of external electrodes provided on the pair of side surfaces. I must.

In the multilayer capacitor of the present disclosure, it is not necessary to change the arrangement of the substrate electrodes in accordance with the pair of external electrodes by providing the pair of external terminals on the pair of external electrodes. Hereinafter, the multilayer capacitor of the present disclosure will be described in detail.

<Embodiment 1>
The multilayer capacitor 10 according to the first embodiment of the present disclosure will be described with reference to the drawings. In addition, for convenience, the multilayer capacitor 10 defines an orthogonal coordinate system XYZ, and uses the terms “upper surface” or “lower surface” with the positive side in the Z direction as the upper side. In the present embodiment, the lower surface of the pair of surfaces is the first surface 4a, and the upper surface is the second surface 4b. In addition, in each drawing, the same code | symbol is used about the same member and the same part, and the overlapping description is abbreviate | omitted. For convenience, the term “multilayer capacitor body” may be used for the multilayer capacitor 10 excluding the pair of external terminals 7.

FIG. 1A is a schematic perspective view of the multilayer capacitor 10 according to the first embodiment of the present disclosure with the top surface thereof facing upward, and FIG. 1B is the bottom surface of the multilayer capacitor 10. FIG.

The multilayer capacitor 10 includes a multilayer body 1, a pair of external electrodes 3, and a pair of external terminals 7. The laminated body 1 has a rectangular parallelepiped shape, a pair of first surfaces 4a and second surfaces 4b, a pair of first end surfaces 4c and second end surfaces 4d, a pair of first side surfaces 4e and second. Side surface 4f. In the multilayer body 1, first internal electrodes 2a and second internal electrodes 2b are alternately stacked via dielectric layers 1a. The pair of external electrodes 3 (the first external electrode 3a and the second external electrode 3b) are provided so as to include the central part of the pair of side surfaces (the first side surface 4e and the second side surface 4f) of the multilayer body 1. Are electrically connected to different internal electrodes 2. The pair of external terminals 7 (first external terminal 7a and second external terminal 7b) are joined to the pair of external electrodes 3 (first external electrode 3a and second external electrode 3b).

The laminated body 1 has a rectangular first surface 4a and a second surface 4b facing each other positioned in the stacking direction. A pair of end surfaces (a first end surface 4c and a second end surface 4d) facing each other are located between the first surface 4a and the second surface 4b, and the first surface 4a and the second surface 4b. Adjacent to the short side. A pair of side surfaces (the first side surface 4e and the second side surface 4f) facing each other are located between the first surface 4a and the second surface 4b, and the first surface 4a and the second surface 4b. Adjacent to the long side of the surface 4b. The pair of side surfaces (the first side surface 4e and the second side surface 4f) are positioned along the longitudinal direction (X direction) of the stacked body 1. Further, the pair of end faces (first end face 4 c and second end face 4 d) are located along the short direction (Y direction) of the stacked body 1.

Thus, in the laminated body 1, the pair of end faces are positioned between the pair of faces and are orthogonal to the pair of faces. Moreover, as for the laminated body 1, a pair of side surface is located between a pair of surface, and is orthogonal to a pair of surface. Furthermore, as for the laminated body 1, a pair of end surface and a pair of side surface are orthogonally crossed. The rectangular parallelepiped shape includes not only a cubic shape or a rectangular parallelepiped shape, but also includes, for example, a shape in which a ridge line portion of a cube or a rectangular parallelepiped is chamfered and the ridge line portion has an R shape.

The laminate 1 is a sintered body obtained by laminating and firing a plurality of ceramic green sheets in which the internal electrode 2 is formed on the surface of the dielectric layer 1a. In the multilayer capacitor 10, each ridge line portion of the multilayer body 1 may be rounded.

As shown in FIGS. 1 and 2, the pair of external electrodes 3 is provided on a pair of side surfaces, and includes a first external electrode 3a and a second external electrode 3b.

As shown in FIG. 3, the first external electrode 3a has a side surface portion 3a1, a first surface extension portion 3a2, and a second surface extension portion 3a3. The side surface portion 3a1 is provided on the first side surface 4e so as to include the central portion of the first side surface 4e. The first surface extending portion 3a2 extends on the first surface 4a from the side surface portion 3a1 toward the center portion in the short side direction (Y direction) of the multilayer body 1. The second surface extending portion 3a3 extends on the second surface 4b from the side surface portion 3a1 toward the center portion in the short direction (Y direction) of the stacked body 1.

Further, as shown in FIG. 3, the second external electrode 3b has a side surface portion 3b1, a first surface extension portion 3b2, and a second surface extension portion 3b3. The side surface portion 3b1 is provided on the second side surface 4f so as to include the central portion of the second side surface 4f. The first surface extending portion 3b2 extends on the first surface 4a from the side surface portion 3b1 toward the center portion in the short direction (Y direction) of the stacked body 1. The second surface extension portion 3b3 extends on the second surface 4b from the side surface portion 3b1 toward the central portion in the short side direction (Y direction) of the stacked body 1.

As shown in FIG. 1, the first surface extension portion 3a2 (first surface extension portion 3b2) and the second surface extension portion 3a3 (second surface extension portion 3b3) are formed on the first surface. 4a and the 2nd surface 4b are convexly curved toward the center part, for example, are provided in circular arc shape toward the center part. Thus, the 1st surface extension part 3a2 (1st surface extension part 3b2) and the 2nd surface extension part 3a3 (2nd surface extension part 3b3) protrude toward the center part side. A curved portion that curves in a shape. The bending portion has, for example, an arc shape, a semicircular shape, or a semi-elliptical shape that is curved in a convex shape. The multilayer capacitor 10 includes a first surface extension portion 3a2 (first surface extension portion 3b2) and a second surface extension portion 3a3 (second surface extension portion 3b3). Since it extends in a convex shape toward the center of the second surface 4 b, the external electrode 3 is difficult to peel off from the laminate 1.

The internal electrode 2 includes a first internal electrode 2a and a second internal electrode 2b as shown in FIG. The first internal electrode 2a and the second internal electrode 2b are arranged opposite to each other with a predetermined interval in the stacking direction between the plurality of dielectric layers 1a. The internal electrode 2 is provided so as to be substantially parallel to the first surface 4 a and the second surface 4 b of the multilayer body 1.

As shown in FIGS. 1 to 4, the first external electrode 3a is arranged such that the side surface portion 3a1 includes the central portion of the first side surface 4e, and the first external electrode 3a is drawn to the first side surface 4e. The internal electrode 2a is electrically connected. The second external electrode 3b is disposed such that the side surface portion 3b1 includes the central portion of the second side surface 4f, and electrically connected to the second internal electrode 2b drawn out to the second side surface 4f. It is connected.

As shown in FIG. 4B, the first internal electrode 2a has a lead-out portion 2aa to the first side surface 4e at the center on the first side surface 4e side. The lead-out portion 2aa is arranged so as to be drawn out to the first side surface 4e and exposed to the first side surface 4e. Further, as shown in FIG. 4C, the second internal electrode 2b has a lead-out portion 2ba to the second side surface 4f at the central portion on the second side surface 4f side. The lead-out portion 2ba is arranged so as to be drawn out to the second side face 4f facing the first side face 4e and exposed to the second side face 4f. The first internal electrode 2a and the second internal electrode 2b are not exposed on the first end surface 4c and the second end surface 4d. In FIG. 4A, the first internal electrode 2a exposed on the first side face 4e is shown by a solid line, and the second internal electrode 2b exposed on the second side face 4f is shown by a broken line.

As shown in FIG. 4B, the first external electrode 3a is provided so that the side surface portion 3a1 covers the extraction portion 2aa of the first internal electrode 2a extracted to the first side surface 4e. The internal electrode 2a is electrically connected. Further, as shown in FIG. 4C, the second external electrode 3b is provided so that the side surface portion 3b1 covers the extraction portion 2ba of the second internal electrode 2b extracted to the second side surface 4f. It is electrically connected to the second internal electrode 2b.

The central portion of the first side surface 4e is a region including a bisector L that bisects the first side surface 4e vertically, and the side portion 3a1 of the first external electrode 3a has this region. It is provided including. Further, the central portion of the second side surface 4f is a region including a bisector L that bisects the second side surface 4f vertically, and the side portion 3b1 of the second external electrode 3b is defined by this region. It is provided including. FIG. 4 shows the bisector L as a long chain line.

Thus, in the multilayer capacitor 10, the internal electrodes 2 are electrically connected to different external electrodes 3 for each layer, and when a voltage is applied to the pair of external electrodes 3, the first internal electrodes 2a And a capacitance is generated in the dielectric layer 1a sandwiched between the second internal electrodes 2b.

The length of the multilayer capacitor body in the longitudinal direction (X direction) is, for example, 0.6 (mm) to 2.2 (mm), and the length in the lateral direction (Y direction) is, for example, 0. 3 (mm) to 1.5 (mm), and the length in the height direction (Z direction) is, for example, 0.3 (mm) to 1.2 (mm).

The dielectric layer 1a is rectangular in a plan view from the stacking direction (Z direction), and the thickness per layer is, for example, 0.2 (μm) to 3 (μm). In the laminated body 1, for example, a plurality of dielectric layers 1a of 10 (layers) to 1000 (layers) and a plurality of internal electrodes 2 are laminated in the Z direction. Further, the number of internal electrodes 2 in the multilayer body 1 is appropriately set according to the characteristics of the multilayer capacitor 10.

The dielectric layer 1a is, for example, barium titanate (BaTiO ₃ ), calcium titanate (CaTiO ₃ ), strontium titanate (SrTiO ₃ ), or calcium zirconate (CaZrO ₃ ). In addition, the dielectric layer 1a may use barium titanate as a ferroelectric material having a high dielectric constant from the viewpoint of a high dielectric constant.

As shown in FIG. 4, the lead-out part 2aa and the lead-out part 2ba are provided so that the lengths along the longitudinal direction (X direction) of the laminate 1 are substantially the same. Not only this but the drawer part 2aa and the drawer part 2ba may mutually differ in the length along the longitudinal direction (X direction) of the laminated body 1. FIG.

In addition, in the drawing portion 2aa (drawing portion 2ba), the exposed portion on the first side face 4e (second side face 4f) is the first in order to maintain the symmetry of vibration and reduce elements that vibrate the substrate 9. You may provide so that the bisector L of the side surface 4e (2nd side surface 4f) may be included.

The conductive material of the internal electrode 2 is a metal material such as nickel (Ni), copper (Cu), silver (Ag), palladium (Pd), or gold (Au). Alternatively, the conductive material of the internal electrode 2 is an alloy material such as an Ag—Pd alloy including one or more of these metal materials. The thicknesses of the first internal electrode 2a and the second internal electrode 2b are, for example, 0.2 (μm) to 2 (μm), and may be set appropriately depending on the application. The first internal electrode 2a and the second internal electrode 2b may use the same metal material or alloy material.

The pair of external electrodes 3 includes a base electrode 5 and a plating layer 6 as shown in FIG. The pair of base electrodes 5 is electrically connected to the internal electrode 2 drawn out to the first side face 4e or the second side face 4f. The plating layer 6 is provided on the surface of the base electrode 5 so as to cover the base electrode 5. The plating layer 6 is provided to protect the base electrode 5. In addition, the plating layer 6 can improve the bondability between the external electrode 3 and the external terminal 7 when welding is used for bonding the pair of external terminals 7. The external electrode 3 is not limited to the plating layer 6, and any metal layer that can be bonded to the external terminal 7 may be provided so as to cover the base electrode 5. In particular, the external electrode 3 only needs to be provided with a metal layer that can be joined to the external terminal 7 by welding so as to cover the base electrode 5.

The conductive material of the base electrode 5 is a metal material such as nickel (Ni), copper (Cu), silver (Ag), palladium (Pd), or gold (Au). Alternatively, the conductive material of the base electrode 5 is an alloy material such as an Ag—Pd alloy including one or more of these metal materials. The pair of base electrodes 5 may use the same metal material or alloy material.

The base electrode 5 has a thickness on the first surface 4a and the second surface 4b of, for example, 4 (μm) to 10 (μm), and a thickness on the first side surface 4e and the second side surface 4f, for example. 10 (μm) to 25 (μm).

The base electrode 5 is provided so that the first base electrode extends from the first side surface 4e to the first surface 4a and the second surface 4b, and the second base electrode is the second base electrode. It is provided to extend from the side surface 4f to the first surface 4a and the second surface 4b. The plating layer 6 is provided on the surface of the base electrode 5 so as to cover the base electrode 5 formed on the surface of the multilayer body 1. The plating layer 6 is, for example, a nickel (Ni) plating layer, a copper (Cu) plating layer, a gold (Au) plating layer, a tin (Sn) plating layer, or the like. The plating layer 6 is formed using, for example, an electrolytic plating method.

The plating layer 6 may be provided as a single plating layer on the surface of the base electrode 5. As shown in FIG. 3, the multilayer capacitor 10 includes a plurality of plating layers 6 and includes a first plating layer 6a and a second plating layer 6b. Thus, the plating layer 6 is a laminated body of the first plating layer 6a and the second plating layer 6b formed on the surfaces of the first plating layer 6a. The plating layer 6 is, for example, a nickel (Ni) plating layer, a copper (Cu) plating layer, a gold (Au) plating layer, a tin (Sn) plating layer, or the like.

In the multilayer capacitor 10, for example, the first plating layer 6a is a nickel (Ni) plating layer, the second plating layer 6b is a tin (Sn) plating layer, and the second plating layer 6b is a first plating layer. It is provided so as to cover the plating layer 6a. The first plating layer 6a has a plating layer thickness of, for example, 5 (μm) to 10 (μm), and the second plating layer 6b has a plating layer thickness of, for example, 3 (μm) to 5 (μm). (Μm).

Here, the pair of external terminals 7 (first external terminal 7a and second external terminal 7b) will be described with reference to the drawings.

As shown in FIGS. 1 and 2, the pair of external terminals 7 includes a first external terminal 7a and a second external terminal 7b. The first external terminal 7a is joined to the first surface extending portion 3a2 of the first external electrode 3a. The second external terminal 7b is joined to the first surface extending portion 3b2 of the second external electrode 3b.

The first external terminal 7a includes a first substrate connection portion 7a1 and a first electrode connection portion 7a2 as shown in FIGS. The first substrate connection portion 7a1 is opposed to the portion of the first surface 4a that is close to the first end surface 4c, and overlaps the end portion on the first end surface 4c side of the stacked body 1 in plan view. Is provided. In this way, the first substrate connection portion 7a1 is opposed to the first end surface 4c side (negative side in the X direction) in the longitudinal direction of the multilayer body 1 with the gap of the first surface 4a. It is a rectangular plate-shaped body. The first electrode connection portion 7a2 extends from the first substrate connection portion 7a1 along the longitudinal direction of the multilayer body 1 toward the first surface extension portion 3a2 of the first external electrode 3a. The end of the portion is joined to the first surface extension 3a2 of the first external electrode 3a. Thus, the first electrode connection portion 7a2 extends toward the second end face 4d so as to overlap the first surface extension portion 3a2 of the first external electrode 3a, and the first external electrode 3a. The first surface extending portion 3a2 is joined.

The second external terminal 7b includes a second substrate connection portion 7b1 and a second electrode connection portion 7b2, as shown in FIGS. The second substrate connection portion 7b1 faces the portion of the first surface 4a that is close to the second end surface 4d, and overlaps the end portion of the stacked body 1 on the second end surface 4d side in plan view. Is provided. In this way, the second substrate connection portion 7b1 is opposed to the portion of the first surface 4a on the second end surface 4d side (the positive side in the X direction) in the longitudinal direction of the multilayer body 1 via the gap. It is a rectangular plate-shaped body. The second electrode connection portion 7b2 extends from the second substrate connection portion 7b1 along the longitudinal direction of the stacked body 1 toward the first surface extension portion 3b2 of the second external electrode 3b. The end of the portion is joined to the first surface extension 3b2 of the second external electrode 3b. Thus, the second electrode connection portion 7b2 extends toward the first end surface 4c so as to overlap the first surface extension portion 3b2 of the second external electrode 3b, and the second external electrode 3b. The first surface extending portion 3b2 is joined.

In the first external terminal 7a, the first electrode connection portion 7a2 is joined to the first surface extension portion 3a2 of the first external electrode 3a by using, for example, soldering or welding. In the second external terminal 7b, for example, the second electrode connection portion 7b2 is joined to the first surface extension portion 3b2 of the second external electrode 3b by soldering or welding. In the present embodiment, the first external terminal 7a and the second external terminal 7b are joined to the first external electrode 3a and the second external electrode 3b by welding.

As shown in FIG. 1 to FIG. 3, the first external terminal 7a is welded to the first external electrode 3a and the first electrode connecting portion 7a2 by using, for example, spot welding. A circular weld 7a3 is formed. Accordingly, the first electrode connection portion 7a2 of the first external terminal 7a is joined to the first surface extension portion 3a2 of the first external electrode 3a by the circular weld portion 7a3. The first external terminal 7a is joined to the first surface extending portion 3a2 of the first external electrode 3a only by the welded portion 7a3.

Further, as shown in FIGS. 1 to 3, the second external terminal 7b is welded to the second external electrode 3b and the second electrode connection portion 7b2 by using, for example, spot welding. A circular weld 7b3 is formed at the joint. Therefore, the second electrode connection portion 7b2 of the second external terminal 7b is joined to the first surface extension portion 3b2 of the second external electrode 3b by the circular weld portion 7b3. The second external terminal 7b is joined to the first surface extending portion 3b2 of the second external electrode 3b only by the welded portion 7b3. Thus, in the multilayer capacitor 10, the external electrode 3 and the external terminal 7 are joined by the circular welded portion 7a3 and welded portion 7b3.

As shown in FIGS. 1 and 2, the multilayer capacitor 10 includes two welded portions 7a3 provided on the first electrode connecting portion 7a2 and two welded portions 7b3 provided on the second electrode connecting portion 7b2. Yes. The number of the welds 7a3 and the welds 7b3 is not limited to these numbers, and may be one or three or more depending on the size of the multilayer capacitor 10 or the bonding strength.

As shown in FIG. 1 and FIG. 2, the first external terminal 7a has a first board connecting portion 7a1 that is a rectangular plate-like body, and is provided substantially parallel to the first surface 4a. Further, as shown in FIGS. 1 and 2, the second external terminal 7b has a second board connection portion 7b1 that is a rectangular plate-like body, and is provided substantially parallel to the first surface 4a. . Moreover, the shape of the 1st board | substrate connection part 7a1 and the 2nd board | substrate connection part 7b1 is set suitably not only in a rectangular plate-shaped body.

In the multilayer capacitor 10, for example, a pair of external electrodes 3 and a pair of external terminals 7 are joined together by welding. The joint portion between the first electrode connection portion 7a2 and the first surface extension portion 3a2 of the first external electrode 3a is in point contact and becomes a welded portion 7a3. Further, the joint portion between the second electrode connection portion 7b2 and the first surface extension portion 3b2 of the second external electrode 3b is in point contact and becomes a welded portion 7b3. The point contact makes it difficult for the multilayer capacitor 10 to propagate vibrations to the pair of external terminals 7. In this case, the point contact portion is a circular joint and has a diameter of 30 (μm) to 50 (μm).

Thus, the first external terminal 7a is joined to the first surface extending portion 3a2 of the first external electrode 3a by point contact, and is not easily restrained by the first external electrode 3a. The second external terminal 7b is joined to the first surface extension 3b2 of the second external electrode 3b by point contact, and is not easily restrained by the second external electrode 3b. Therefore, in the multilayer capacitor 10, vibration due to strain is easily absorbed by the first external terminal 7a and the second external terminal 7b.

Moreover, the external terminal 7 is joined to the external electrode 3 by welding, and the joining area of the welded portion 7a3 and the welded portion 7b3 can be reduced. Therefore, in the multilayer capacitor 10, the external terminal 7 is not easily restrained by the external electrode 3, and vibration due to distortion is easily absorbed. Note that the sizes of the welded portion 7a3 and the welded portion 7b3 can be adjusted by, for example, the beam diameter of laser light to be irradiated or the output of laser light emission when laser spot welding is used.

The material of the external terminal 7 is, for example, a metal material such as iron (Fe), nickel (Ni), chromium (Cr), copper (Cu), silver (Ag), or cobalt (Co). Alternatively, the material of the external terminal 7 is an alloy material including one or more of these metal materials, such as a stainless alloy or a copper alloy. The first external terminal 7a and the second external terminal 7b may use the same metal material or alloy material.

The pair of external terminals 7 has a plating layer formed on the surface for solder bonding to the substrate electrode 9a and the substrate electrode 9b, and includes a plating layer formed on the surface. Further, the plating layer is formed, for example, by performing a masking process on a region of the pair of external terminals 7 where the plating layer is unnecessary. The masking treatment can be performed using, for example, a low hardness rubber sheet.

The plating layer is formed in a region including the first substrate connection portion 7a1 and the second substrate connection portion 7b1 by using, for example, an electrolytic plating method. The first substrate connection portion 7a1 and the second substrate connection portion 7b1 are provided with a plating layer at least on the substrate electrode 9a (substrate electrode 9b) side. The external terminal 7 is provided with plating layers for the entire first substrate connection portion 7a1 and the first electrode connection portion 7a2, and the second substrate connection portion 7b1 and the second electrode connection portion 7b2. It may be provided for the whole. Note that the plating layer may be provided not only on both surfaces of the external terminal 7 but also on the side surface located between both surfaces.

Further, in the external terminal 7, for example, the plating layer has a first plating layer and a second plating layer formed on the surface of the first plating layer. The first plating layer covers the surfaces of the first external terminal 7a and the second external terminal 7b. The second plating layer is formed on the surface of the first plating layer and covers the surface of the first plating layer. Each of the first plating layer and the second plating layer may be composed of a plurality of plating layers.

The first plating layer and the second plating layer are, for example, metal materials such as nickel (Ni), silver (Ag), or tin (Sn). Alternatively, the first plating layer and the second plating layer are alloy materials including one or more of these metal materials, for example, Sn—Ag alloy. The first plating layer is, for example, a nickel (Ni) metal material or an alloy material containing nickel (Ni) as a main component. The thickness of the first plating layer is, for example, 1 (μm) to 2 (μm). Further, the second plating layer is, for example, a tin (Sn) metal material or an alloy material containing tin (Sn) as a main component. The thickness of the second plating layer is, for example, 1 (μm) to 2 (μm).

The thickness of the external terminal 7 is, for example, 0.1 (mm) to 0.15 (mm). The thickness is appropriately set according to the size or application of the multilayer capacitor 10 so that vibration noise is reduced.

For example, if the thickness of the external terminal 7 is thinner than 0.1 (mm), the rigidity is reduced and vibration due to distortion generated in the multilayer capacitor body is easily absorbed. Mounting stability is deteriorated. In the external terminal 7, a portion not joined to the external electrode 3 absorbs vibration due to distortion.

Conversely, when the thickness of the external terminal 7 is greater than 0.15 (mm), the rigidity is increased and it is difficult to absorb vibration due to distortion generated in the multilayer capacitor body. As described above, in the multilayer capacitor 10, the thickness of the external terminal 7 is set in consideration of reduction of vibration noise and mounting stability.

Here, the mounting structure of the multilayer capacitor 10 according to the present embodiment will be described.

5A shows a state in which the multilayer capacitor 10 is mounted on the substrate 9, and FIG. 5B is a side view of the state in which the multilayer capacitor 10 is mounted on the substrate 9, as viewed from the side. .

The multilayer capacitor 10 is mounted on a circuit board (hereinafter, referred to as a board 9) via a conductive bonding material, for example, a solder 11. The board | substrate 9 is used for a notebook personal computer, a smart phone, a mobile phone, etc., for example. The substrate 9 has, for example, an electric circuit on the surface where the multilayer capacitor 10 is electrically connected. The substrate 9 is shown with the insulating layer on the surface omitted.

In addition, as shown in FIG. 5, the substrate 9 is provided with, for example, a substrate electrode 9a and a substrate electrode 9b on the mounting surface of the multilayer capacitor 10, and wiring (not shown) extends from the substrate electrode 9a. Further, wiring (not shown) extends from the substrate electrode 9b.

In the multilayer capacitor 10, the first external terminal 7 a is soldered to the substrate electrode 9 a, for example, via solder 11, and the second external terminal 7 b is connected to the substrate electrode 9 b, for example, via solder 11. Soldered. The multilayer capacitor 10 is arranged such that the first surface 4 a faces the mounting surface of the substrate 9. Solder joining is performed by, for example, a solder material printed on the substrate electrode 9a and the substrate electrode 9b.

As shown in FIG. 5, the first external terminal 7a and the substrate electrode 9a are joined via the solder 11 disposed on the lower surface of the first substrate connection portion 7a1, and the second external terminal 7b The substrate electrode 9b is joined via the solder 11 disposed on the lower surface of the second substrate connection portion 7b1.

Also, the solder material to be used is not particularly limited as long as it has good wettability with the external terminal 7. As the solder material, for example, Sn—Ag—Cu-based or Sn—Sb-based solder can be used.

For example, a multilayer capacitor uses barium titanate (BaTiO ₃ ) or the like as a main component as a dielectric layer. When an AC voltage is applied, a dielectric is formed according to the magnitude of the AC voltage due to an electrostrictive effect. The layer is distorted and vibrates. In the multilayer capacitor, vibration propagates to the substrate, and vibration noise is generated by the propagated vibration. When the vibration frequency of the substrate is in an audible frequency band, an audible sound is generated from the substrate.

A conventional multilayer capacitor has a pair of external electrodes on a pair of end faces. Moreover, the substrate electrode of the conventional board | substrate is arrange | positioned in the position of the longitudinal direction of the laminated body of a multilayer capacitor according to a pair of external electrode provided in a pair of end surface. On the other hand, in the multilayer capacitor, a pair of external electrodes may be provided at the center of a pair of side surfaces of the multilayer body in order to reduce vibration noise. In such a multilayer capacitor, although a pair of external electrodes are provided at the center of a pair of side surfaces to reduce noise, the substrate electrode is aligned with the pair of external electrodes and the short side of the multilayer capacitor multilayer body. It must be arranged at a position in the direction, and the conventional arrangement of the substrate electrode of the substrate cannot be adopted. Therefore, the arrangement of the substrate electrodes must be changed to the position in the short direction of the multilayer capacitor multilayer body in accordance with the pair of external electrodes.

However, the multilayer capacitor 10 is provided with a pair of external electrodes 3 on a pair of side surfaces. In the first external terminal 7a, the first substrate connecting portion 7a1 is disposed on the first end surface 4c side in the longitudinal direction of the multilayer body 1 so as to face the first surface 4a via a gap. In addition, the second external terminal 7 b is arranged such that the second substrate connecting portion 7 b 1 is opposed to the first surface 4 a with a gap on the second end surface 4 d side in the longitudinal direction of the multilayer body 1.

As described above, in the multilayer capacitor 10, the first substrate connection portion 7a1 and the second substrate connection portion 7b1 are arranged in the longitudinal direction of the multilayer body 1, and the substrate electrode 9a and the first substrate connection portion 7a1 are joined. Then, the substrate electrode 9b and the second substrate connecting portion 7b1 are joined. Therefore, the multilayer capacitor 10 can employ the same substrate electrode arrangement as a conventional multilayer capacitor having a pair of external electrodes on a pair of end faces. Thus, the multilayer capacitor 10 can reduce noise without changing the arrangement of the substrate electrodes of the substrate.

Here, an example of a method for manufacturing the multilayer capacitor 10 shown in FIG. 1 will be described.

Prepare a plurality of first and second ceramic green sheets. The first ceramic green sheet forms the first internal electrode 2a. The second ceramic green sheet forms the second internal electrode 2b.

The plurality of first ceramic green sheets are formed on the ceramic green sheet by using the conductive paste layer for the first internal electrode 2a as the conductive paste layer for the first internal electrode 2a. In the first ceramic green sheet, in order to obtain a large number of multilayer capacitor bodies, a plurality of first internal electrodes 2a are formed in one ceramic green sheet.

Further, the plurality of second ceramic green sheets are formed on the ceramic green sheet by using the conductive paste layer for the second internal electrode 2b using the conductive paste for the second internal electrode 2b. In the second ceramic green sheet, in order to obtain a large number of multilayer capacitor bodies, a plurality of second internal electrodes 2b are formed in one ceramic green sheet.

The conductive paste layers of the first internal electrode 2a and the second internal electrode 2b described above are formed on the ceramic green sheet, for example, using a screen printing method or the like in a predetermined pattern shape for each conductive paste.

The material of the ceramic green sheet is mainly composed of dielectric ceramics such as barium titanate (BaTiO ₃ ), calcium titanate (CaTiO ₃ ), strontium titanate (SrTiO ₃ ), or calcium zirconate (CaZrO ₃ ). Is. For example, a Mn compound, Fe compound, Cr compound, Co compound, or Ni compound may be added as the accessory component.

The first and second ceramic green sheets are produced by adding a suitable organic solvent or the like to the dielectric ceramic raw material powder and the organic binder and mixing them, and using a doctor blade method or the like. Obtained by forming a ceramic slurry.

The conductive paste for the first internal electrode 2a and the second internal electrode 2b is formed by adding an additive (dielectric material), binder, solvent, dispersion to the above-described conductive material (metal material) powder of the internal electrode 2. It is prepared by adding an agent and kneading.

The laminated body 1 of ceramic materials is formed by alternately laminating first ceramic green sheets and second ceramic green sheets, and laminating ceramic green sheets not forming the internal electrodes 2 on the outermost layer in the laminating direction. To make.

As described above, a laminated body in which a plurality of first and second ceramic green sheets are laminated becomes a large-sized raw laminated body including a large number of raw laminated bodies by pressing and integrating them. By cutting this large green laminate, a green laminate that becomes the multilayer body 1 of the multilayer capacitor body shown in FIG. 1 can be obtained. The large green laminate can be cut using, for example, a dicing blade.

The laminate 1 can be obtained by firing the green laminate at, for example, 800 (° C.) to 1300 (° C.). By firing, the plurality of first and second ceramic green sheets become the dielectric layer 1a. The conductor paste layer of the first internal electrode 2a becomes the first internal electrode 2a. The conductor paste layer of the second internal electrode 2b becomes the second internal electrode 2b. Moreover, the laminated body 1 is rounded a corner | angular part or a side part (ridgeline part) using grinding | polishing means, such as barrel grinding | polishing, for example. The laminated body 1 is less likely to lack corners or sides by rounding the corners or sides.

Here, an example of a method for manufacturing the pair of external electrodes 3 (the first external electrode 3a and the second external electrode 3b) will be described.

In the pair of base electrodes 5, the conductive paste to be the base electrode 5 is provided on the first side surface 4e (second side surface 4f), the first surface 4a, and the second surface 4b, respectively.

Specifically, the conductive paste to be the base electrode 5 is transferred to the first side face 4e and the second side face 4f by using a roller transfer method. The conductive paste is provided on the first side surface 4e (second side surface 4f) and is provided so as to extend to the first surface 4a and the second surface 4b. The first surface extension portion 3a2 (first surface extension portion 3b2) and the second surface extension portion 3b3 (second surface extension portion 3b3) have the shape of the transferred base electrode 5 Will be reflected.

The transferred conductive paste becomes the base electrode 5 by sintering. Further, the plating layer 6 is provided on the surface of the base electrode 5 so as to cover the base electrode 5. The plating layer 6 is formed on the surface of the base electrode 5 using, for example, an electrolytic plating method. In addition, the conductive paste for the base electrode 5 is prepared by adding a binder, a solvent, a dispersant and the like to the powder of the metal material of the base electrode 5 described above and kneading.

Next, an example of a manufacturing method of the pair of external terminals 7 (first external terminal 7a and second external terminal 7b) will be described.

The external terminal 7 is manufactured using a strip metal plate. The thickness of the band-shaped metal plate is, for example, 0.1 (mm) to 0.15 (mm), and the length is 100 (mm) to 250 (mm). The strip metal plate is, for example, a stainless alloy.

As shown in FIG. 6A, the first external terminal 7aa to be the first external terminal 7a and the second external terminal 7bb to be the second external terminal 7b are formed on the belt-shaped metal plate so as to face each other. Be placed. The first external terminal 7aa and the second external terminal 7bb are punched by using, for example, a press punching method in accordance with the pattern shape of the band-shaped metal plate.

As shown in FIG. 6A, a plurality of external terminal pairs 12a of the first external terminal 7aa and the second external terminal 7bb are provided on the belt-shaped metal plate by press punching. The lead frame 12 is a strip-shaped metal plate provided with a plurality of external terminal pairs 12a. Thus, the multilayer capacitor 10 can be efficiently manufactured by using the lead frame 12.

The lead frame 12 forms a plating layer on the plurality of external terminal pairs 12a using, for example, a plating method.

Further, as described above, the lead frame 12 is plated after being punched. However, the lead frame 12 may be punched after plating. In the lead frame 12, the processing order is appropriately set in consideration of the shape of the pair of external terminals 7 and the like.

Next, as shown in FIG. 6B, the multilayer capacitor body is mounted on the first external terminal 7aa and the second external terminal 7bb using, for example, an automatic mounting machine equipped with a suction nozzle. The

After mounting the multilayer capacitor body, as shown in FIG. 6C, the first external terminal 7aa is joined to the first external electrode 3a by using, for example, laser spot welding, The external terminal 7bb is joined to the second external electrode 3b. Thus, by using welding for joining the pair of external electrodes 3 and the pair of external terminals 7, the joining process is greatly simplified and the process is excellent in mass productivity.

The multilayer capacitor 10 is mounted on the substrate 9 via solder. When the external electrode 3 and the external terminal 7 are joined together by welding, the joint between the external electrode 3 and the external terminal 7 is soldered. It is less susceptible to the temperature applied. Therefore, in the multilayer capacitor 10, the reliability of the joint is improved.

In the multilayer capacitor 10, for example, when the first electrode connection portion 7a2 and the second electrode connection portion 7b2 are joined to the pair of external electrodes 3 via solder, the solder easily flows downward, It becomes easy to fall. On the other hand, by joining the first electrode connecting portion 7a2 and the first external electrode 3a using welding, and joining the second electrode connecting portion 7b2 and the second external electrode 3b using welding, The multilayer capacitor 10 can improve the bondability between the external electrode 3 and the external terminal 7.

Further, for the joining using welding, for example, spot welding such as arc spot welding or laser spot welding can be used. In laser spot welding, for example, an energy beam such as a YAG laser is spot-irradiated to the first electrode connection portion 7a2 and the second electrode connection portion 7b2. The first electrode connection portion 7a2 is joined to the first external electrode 3a by laser spot welding. The second electrode connection portion 7b2 is joined to the second external electrode 3b. The first electrode connecting portion 7a2 and the second electrode connecting portion 7b2 are locally heated when the energy beam is applied in a spot manner. For example, when the melting temperature of the stainless alloy of the external terminal 7 reaches 1400 (° C.) to 1450 (° C.), the first electrode connecting portion 7a2 and the second electrode connecting portion 7b2 are partially melted, It joins with the external electrode 3.

In the multilayer capacitor 10, when a nickel (Ni) plating layer formed by an electrolytic plating method is used for the plating layer 6 and a stainless alloy is used for the external terminal 7, the nickel (Ni) plating layer and the stainless alloy are melted. The temperatures are similar, and the bondability between the external terminal 7 and the external electrode 3 can be improved. As described above, the multilayer capacitor 10 uses the material having a similar melting temperature to the plating layer 6 and the external terminal 7 in joining the external electrode 3 and the external terminal 7, so that the welded portion 7 a 3 and the welded portion 7 are welded. It becomes easy to control the joining region of the portion 7b3.

The multilayer capacitor body has the first external terminal 7aa attached to the first external electrode 3a and the second external terminal 7bb attached to the second external electrode 3b by welding.

Next, as shown in FIG. 6C, the lead frame 12 sets the first cutting line S1 and the second cutting line S2, and with respect to the first cutting line S1 and the second cutting line S2. Cutting. The external terminal pair 12a is separated from the lead frame 12 using, for example, a cutting die. As a result, a plurality of multilayer capacitors 10 are obtained from the lead frame 12 as shown in FIG. In FIG. 6C, the first cutting line S1 and the second cutting line S2 are indicated by dotted lines.

As described above, the multilayer capacitor 10 can be efficiently manufactured by using the lead frame 12.

In the multilayer capacitor 10, the external terminals 7 are joined to the external electrodes 3 by welding. Even if the external terminals 7 are soldered onto the substrate 9, the external terminals 7 are externally connected by heating of the soldering. Difficult to leave 3

In addition, as shown in FIGS. 12 and 13, the multilayer capacitor 10 </ b> B has a protruding portion 8 that protrudes toward the first surface 4 a side (positive side in the Z direction) on the first substrate connecting portion 7 a 1. The second substrate connecting portion 7b1 has a protruding portion 8 that protrudes toward the first surface 4a side (the positive side in the Z direction).

For example, the end portion of the first surface 4a may be inclined toward the first substrate connecting portion 7a1 and come into contact with the first substrate connecting portion 7a1. Further, the first board connecting portion 7a1 may be inclined toward the first surface 4a and come into contact with the first surface 4a. The end portion of the first surface 4a may be inclined toward the second substrate connection portion 7b1 and come into contact with the second substrate connection portion 7b1. Further, the second board connecting portion 7b1 may be inclined toward the first surface 4a and come into contact with the first surface 4a. As described above, when the first surface 4a and the first substrate connecting portion 7a1 are in contact with each other, or when the first surface 4a and the second substrate connecting portion 7b1 are in contact with each other, the multilayer capacitor is The vibration is directly transmitted to the substrate 9 and it is easy for noise to occur.

However, even if the end portion of the first surface 4a is inclined toward the first substrate connection portion 7a1 or the first substrate connection portion 7a1 is inclined toward the first surface 4a, the multilayer capacitor 10 does not protrude. The first surface 4a is in point contact with the first substrate connecting portion 7a1, and the contact area with the first substrate connecting portion 7a1 is small. Further, even if the end of the first surface 4a is inclined toward the second substrate connecting portion 7b1 or the second substrate connecting portion 7b1 is inclined toward the first surface 4a, the multilayer capacitor 10 does not protrude. The first surface 4a is in point contact with the second substrate connecting portion 7b1, and the contact area with the second substrate connecting portion 7b1 is small. Therefore, the multilayer capacitor 10B is less likely to transmit vibration directly to the substrate 9.

In the multilayer capacitor 10B, two protruding portions 8 are provided on each of the first substrate connecting portion 7a1 and the second substrate connecting portion 7b1. However, the number of the protrusions 8 may be one or three or more according to the size of the first substrate connection portion 7a1 and the second substrate connection portion 7b1.

The present disclosure is not limited to the multilayer capacitor 10 and the multilayer capacitor 10B described above, and various modifications and improvements can be made without departing from the gist of the present disclosure. Other embodiments will be described below. Note that, among the multilayer capacitors according to other embodiments, the same portions as those of the multilayer capacitor 10 according to the first embodiment are denoted by the same reference numerals, and description thereof will be omitted as appropriate.

<Embodiment 2>
A multilayer capacitor 10A according to Embodiment 2 of the present disclosure will be described with reference to the drawings.

In the multilayer capacitor 10A, a pair of external terminals 70 includes a first external terminal 7A and a second external terminal 7B. Although the shape is different from the pair of external terminals 7 of the multilayer capacitor 10, the materials and the like are The same thing is used. The multilayer capacitor 10A is the same as the multilayer capacitor 10 except for the shape of the pair of external terminals 70.

As shown in FIGS. 7 and 8, the first external terminal 7A includes a first substrate connecting portion 7A1 and a first electrode connecting portion 7A2. The first substrate connection portion 7A1 is a rectangular shape disposed on the first end surface 4c side (negative side in the X direction) in the longitudinal direction of the multilayer body 1 so as to face the first surface 4a via a gap. It is a plate-like body. The first electrode connection portion 7A2 extends from the first substrate connection portion 7A1 along the longitudinal direction of the multilayer body 1 toward the first surface extension portion 3a2 of the first external electrode 3a. The end of the portion is joined to the first surface extension 3a2 of the first external electrode 3a. Thus, the first electrode connection portion 7A2 extends toward the second end surface 4d so as to overlap the first surface extension portion 3a2 of the first external electrode 3a, and the first external electrode 3a. The first surface extending portion 3a2 is joined.

Further, as shown in FIGS. 7 and 8, the second external terminal 7B includes a second substrate connecting portion 7B1 and a second electrode connecting portion 7B2. The second substrate connection portion 7B1 is disposed on the second end face 4d side in the longitudinal direction (positive side in the X direction) of the multilayer body 1 of the multilayer capacitor 10A so as to face the first face 4a via a gap. A rectangular plate-shaped body. The second electrode connection portion 7B2 extends from the second substrate connection portion 7B1 along the longitudinal direction of the stacked body 1 toward the first surface extension portion 3b2 of the second external electrode 3b. The end of the portion is joined to the first surface extension 3b2 of the second external electrode 3b. Thus, the second electrode connection portion 7B2 extends toward the first end surface 4c so as to overlap the first surface extension portion 3b2 of the second external electrode 3b, and the second external electrode 3b. The first surface extending portion 3b2 is joined.

As shown in FIGS. 9 and 10, the first electrode connecting portion 7A2 is a first surface extending portion of the first external electrode 3a whose bonding portion is bonded to the first surface extending portion 3a2 at the end. It protrudes upward (the positive side in the Z direction) from the surface on the first surface 4a side of the first substrate connecting portion 7A1 toward the 3a2 side. Furthermore, the first electrode connection portion 7A2 has a space portion 7A4 in a lower portion opposite to the first surface extension portion 3a2. Further, as shown in FIGS. 9 and 10, the second electrode connection portion 7B2 is formed such that the joint portion joined to the first surface extension portion 3b2 at the end is the first surface extension of the second external electrode 3b. It protrudes upward (the positive side in the Z direction) from the surface on the first surface 4a side of the second substrate connection portion 7B1 toward the existing portion 3b2. Further, the second electrode connection portion 7B2 has a space portion 7B4 in a lower portion opposite to the first surface extension portion 3b2.

In the multilayer capacitor 10A, as in the multilayer capacitor 10, the first external terminal 7A is connected to the first external electrode 3a at the first electrode connection portion 7A2 by using, for example, soldering or welding. 1 surface extension part 3a2. The second external terminal 7B is joined to the first surface extension portion 3b2 of the second external electrode 3b by the second electrode connection portion 7B2 by using, for example, solder joining or welding. In the present embodiment, the first external terminal 7A and the second external terminal 7B are joined to the first external electrode 3a and the second external electrode 3b by welding.

The first electrode connection portion 7A2 is provided with a protruding portion and a space portion 7A4 in a region corresponding to the joint portion with the first surface extension portion 3a2, for example, by deep drawing using press working. be able to. Further, the second electrode connection portion 7B2 is a portion that protrudes into a region corresponding to a joint portion with the first surface extension portion 3b2 and a space portion 7B4 by deep drawing using, for example, pressing. Can be provided.

Thus, in the first electrode connection portion 7A2 and the second electrode connection portion 7B2, the space portion 7A4 and the space portion 7B4 are formed by the side wall portion 7A5 and the side wall portion 7B5.

In the multilayer capacitor 10A, as shown in FIG. 10, the first substrate connecting portion 7A1 is bonded to the substrate electrode 9a, and the second substrate connecting portion 7B1 is bonded to the substrate electrode 9b. The first electrode connection portion 7A2 extends from the longitudinal end portion of the first substrate connection portion 7A1 toward the first surface extension portion 3a2 of the first external electrode 3a. The second electrode connection portion 7B2 extends from the longitudinal end portion of the second substrate connection portion 7B1 toward the first surface extension portion 3b2 of the second external electrode 3b.

The joint part where the first surface extension part 3a2 and the first electrode connection part 7A2 are joined and the joint part where the first surface extension part 3b2 and the second electrode connection part 7B2 are joined are the first part. The board connecting portion 7A1 and the second board connecting portion 7B1 are joined to the board electrode 9a and the board electrode 9b, respectively, and stress toward the inside of the first surface 4a is likely to occur. That is, a stress that rotates around the central portion of the first surface 4a is likely to occur in the welded portion 7A3 and the welded portion 7B3.

However, the first electrode connection portion 7A2 is such that the joint portion that joins the first surface extension portion 3a2 faces the first surface extension portion 3a2, and the first surface connection portion 7A1 has the first surface 4a side. And a space 7A4 on the side opposite to the first surface extension 3a2. In addition, the second electrode connection portion 7B2 is such that the joint portion that joins the first surface extension portion 3b2 faces the first surface extension portion 3b2 and the first surface 4a side of the second substrate connection portion 7B1. And a space 7B4 on the side opposite to the first surface extension 3b2.

Therefore, as shown in FIG. 7, the multilayer capacitor 10A can relieve the stress that rotates around the central portion of the first surface 4a at the drawn side wall portions 7A5 and 7B5. Thus, in the multilayer capacitor 10A, twisting stress is less likely to occur with respect to the welded portion 7A3 and the welded portion 7B3, and the reliability of the joint portion is improved.

The multilayer capacitor 10 </ b> A can be manufactured in the same manner as the multilayer capacitor 10. As shown in FIG. 11A, the first external terminal 7Aa to be the first external terminal 7A and the second external terminal 7Bb to be the second external terminal 7B are formed on the band-shaped metal plate so as to face each other. Be placed. The first external terminal 7Aa and the second external terminal 7Bb are punched using, for example, a press punching method in accordance with the pattern shape of the band-shaped metal plate.

For example, by deep drawing using press processing, the first electrode connection portion 7A2 can be provided with a space portion 7A4 below by projecting the joint portion with the first surface extension portion 3a2. In addition, the second electrode connection portion 7B2 can be provided with a space portion 7B4 below by projecting a joint portion with the first surface extension portion 3b2.

As shown in FIG. 11A, a plurality of pairs of external terminals 12A of the first external terminals 7Aa and the second external terminals 7Bb are provided on the belt-shaped metal plate by punching and pressing.

Further, as described above, the lead frame 12 is subjected to plating after punching and pressing. Without being limited thereto, the lead frame 12 may be punched and pressed after plating. In the lead frame 12, the processing order is appropriately set in consideration of the shape of the pair of external terminals 7 and the like.

Next, as shown in FIG. 11B, the multilayer capacitor body is mounted on the first external terminal 7Aa and the second external terminal 7Bb by using, for example, an automatic mounting machine having a suction nozzle. The

After mounting the multilayer capacitor main body, as shown in FIG. 11C, the first external terminal 7Aa is joined to the first external electrode 3a by using, for example, laser spot welding, The external terminal 7Bb is joined to the second external electrode 3b.

Next, as shown in FIG. 11C, the lead frame 12 sets the first cutting line S1 and the second cutting line S2, and with respect to the first cutting line S1 and the second cutting line S2. Cutting. The external terminal pair 12A is separated from the lead frame 12 using, for example, a cutting die. As a result, as shown in FIG. 11 (d), a plurality of multilayer capacitors 10 A are obtained from the lead frame 12.

Further, as shown in FIG. 14, the multilayer capacitor 10C has a protruding portion 8A protruding toward the first surface 4a side (positive side in the Z direction) in the region of the first substrate connecting portion 7a1. Moreover, you may have the protrusion part 8A which protrudes toward the 1st surface 4a side (positive side of a Z direction) in the area | region of the 2nd board | substrate connection part 7b1.

As described above, even when the end of the first surface 4a is inclined toward the first substrate connecting portion 7A1 or the first substrate connecting portion 7A1 is inclined toward the first surface 4a, the multilayer capacitor 10C is The first surface 4a is in point contact with the first substrate connecting portion 7A1, and the contact area with the first substrate connecting portion 7A1 is small.

Further, even if the end portion of the first surface 4a is inclined toward the second substrate connecting portion 7B1 or the second substrate connecting portion 7B1 is inclined toward the first surface 4a, the multilayer capacitor 10C is protruded. The first surface 4a is in point contact with the second substrate connecting portion 7B1, and the contact area with the second substrate connecting portion 7B1 is small. As a result, the multilayer capacitor 10 </ b> C is less likely to transmit vibration directly to the substrate 9.

The present disclosure is not limited to the above-described multilayer capacitors 10 to 10C, and various changes and improvements can be made without departing from the gist of the present disclosure.

DESCRIPTION OF SYMBOLS 1 Laminated body 1a Dielectric layer 2 Internal electrode 2a 1st internal electrode 2b 2nd internal electrode 3 External electrode 3a 1st external electrode 3b 2nd external electrode 4a 1st surface 4b 2nd surface 4c 1st End face 4d second end face 4e first side face 4f second side face 5 ground electrode 6 plating layer 6a first plating layer 6b

second plating layer

7, 70

external terminal

7a, 7A first

external terminal

7b, 7B Second external terminals 7a1, 7A1 First substrate connecting portions 7a2, 7A2 First electrode connecting portions 7b1, 7B1 Second substrate connecting portions 7b2, 7B2 Second electrode connecting portions 7a3, 7b3, 7A3, 7B3 Welding Part 7A4, 7B4 Space part 7A5, 7B5

Side wall part

8, 8A Projection part 9

Substrate

9a, 9b Substrate electrode 10-10C Multilayer capacitor 11 Solder 12

Lead frame

12a, 12A External terminal pair S1, S2 Cutting line

Claims

A pair of first and second surfaces, a pair of first end surfaces and second end surfaces, and a pair of first side surfaces and second side surfaces on which a plurality of dielectric layers are stacked. A rectangular parallelepiped laminate, a plurality of internal electrodes arranged in the stacking direction between the plurality of dielectric layers, and the first side surface and the second side surface, respectively. The first external electrode and the second external electrode that are electrically connected to the different internal electrodes, and the first external terminal and the second external electrode that are bonded to the first external electrode A second external terminal,
The first external electrode and the second external electrode include a side surface portion disposed so as to include a central portion of the side surface, and a first surface extension extending from the side surface portion to the first surface. And a second surface extending portion extending to the second surface,
The first external terminal includes a first substrate connecting portion of a plate-like body and the first substrate which are arranged to face each other with a gap between the first surface adjacent to the first end surface. It extended toward the direction of the said 2nd end surface from the connection part along the longitudinal direction of the said laminated body, and the edge part of the extended part was joined to the said 1st surface extension part of the said 1st external electrode. Having a first electrode connection;
The second external terminal includes a second substrate connecting portion of the plate-like body and the second substrate, which are arranged to face each other with a gap between the first surface adjacent to the second end surface. Extending from the connecting portion along the longitudinal direction of the laminate toward the first end surface, the end of the extended portion is joined to the first surface extending portion of the second external electrode. 2. A multilayer capacitor comprising two electrode connection portions.
The first electrode connection portion has a space in a portion opposite to the first surface extension portion of the first external electrode, and the second electrode connection portion is formed of the second external electrode. The multilayer capacitor according to claim 1, wherein a space portion is provided in a portion opposite to the first surface extending portion of the electrode.
3. The stack according to claim 1, wherein each of the first substrate connecting portion and the second substrate connecting portion has a protruding portion that protrudes toward the first surface. Type capacitor.
The first electrode connection portion is joined to the first surface extension portion of the first external electrode by a welding portion, and the second electrode connection portion is the first electrode of the second external electrode. The multilayer capacitor according to claim 1, wherein the multilayer capacitor is joined by a surface extension portion and a welding portion.
5. The multilayer capacitor according to claim 1 and a substrate including a substrate electrode on which the multilayer capacitor is mounted are disposed with the first surface and the substrate electrode facing each other. The mounting structure, wherein the first substrate connecting portion, the second substrate connecting portion, and the substrate electrode are bonded via a conductive bonding material.