WO2017104868A1 - Appareil destiné au thermoformage sous vide de panneau tactile semi-sphérique - Google Patents

Appareil destiné au thermoformage sous vide de panneau tactile semi-sphérique Download PDF

Info

Publication number
WO2017104868A1
WO2017104868A1 PCT/KR2015/013884 KR2015013884W WO2017104868A1 WO 2017104868 A1 WO2017104868 A1 WO 2017104868A1 KR 2015013884 W KR2015013884 W KR 2015013884W WO 2017104868 A1 WO2017104868 A1 WO 2017104868A1
Authority
WO
WIPO (PCT)
Prior art keywords
touch sensor
vacuum
sensor panel
heater
hemispherical
Prior art date
Application number
PCT/KR2015/013884
Other languages
English (en)
Korean (ko)
Inventor
김순완
이수재
김홍채
Original Assignee
주식회사 트레이스
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 트레이스 filed Critical 주식회사 트레이스
Publication of WO2017104868A1 publication Critical patent/WO2017104868A1/fr

Links

Images

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means

Definitions

  • the present invention relates to a vacuum thermoforming apparatus for a hemispherical touch sensor panel, and more particularly, to a vacuum thermoforming apparatus for a hemispherical touch sensor panel for molding a touch sensor panel into a hemispherical shape.
  • the touch sensor panel is an input device for inputting a user's command by converting a contact position contacted by a person's hand or an object into an electrical signal.
  • a touch sensor panel has been used in automobiles as well as mobile phones and tablet PCs. .
  • the touch sensor panel has been developed to perform various touch functions according to the motion of a human finger or an object. Recently, a part of the touch sensor panel has a curvature in particular in consideration of ease of use and design factors. Is commercialized.
  • a touch sensor panel applied to an automobile has a flat shape, which causes inconvenience.
  • the touch sensor panel which is widely applied to an electric vehicle in the related art, has a large screen, but has a flat shape, and thus, a driver has to bend the body forward or extend his arm for manipulating the device.
  • the conventional method of molding the touch sensor panel to have a curvature was a method of forming by applying heat and pressure directly to the portion to be molded of the flat shape of the touch sensor panel. Therefore, it is difficult to always apply the same pressure to the same position depending on the product, there is a problem that it is difficult to produce a product of uniform quality.
  • the present invention has been made in an effort to provide a vacuum thermoforming apparatus for a hemispherical touch sensor panel for molding a flat touch sensor panel into a hemispherical shape.
  • an embodiment of the present invention is a fixing unit provided to fix the touch sensor panel; A vacuum unit coupled to the fixed unit; And a heater part provided to move to an upper portion of the touch sensor panel to apply heat to the touch sensor panel, wherein the vacuum part has the same shape as the inner surface of the vacuum part as the inside of the vacuum part becomes a vacuum state. It provides a vacuum thermoforming device of the hemispherical touch sensor panel to be formed as.
  • the fixing portion, the lower fixing plate is formed with a lower through hole in the center;
  • it may be characterized in that it comprises a toggle clamp for fixing the fixing plate in a closed state.
  • the vacuum unit, the heater block is coupled to the lower through hole, the concave surface is provided in the center of the upper surface; And a vacuum pump connected to a vacuum hole provided in the concave surface, wherein the vacuum pump discharges air located between the concave surface and the touch sensor panel through the vacuum hole to the outside.
  • the concave surface of the heater block may be characterized in that hemispherical.
  • At least one vacuum hole is formed in the outermost of the concave surface, the air suction pressure of the plurality of vacuum holes may be characterized in that it is maintained evenly.
  • the outermost portion of the concave surface may be characterized in that the curved surface.
  • the heater unit a heater module having a heating function; And a transfer module provided at one side of the heater module, wherein the transfer module moves the heater module to the left or the right.
  • the heater module and the heater block may be further characterized in that it further comprises a control unit for adjusting the temperature and heating time, and the vacuum pressure and time of the vacuum pump.
  • the touch sensor panel may be characterized in that it comprises a base plate and a transparent conductive layer formed on the upper surface of the base plate.
  • the flat shape of the touch sensor panel can be molded into a hemispherical shape.
  • the touch sensor panel can be formed into a hemispherical shape according to the material of the touch sensor panel. Can be.
  • the present invention it is possible to manufacture a hemispherical touch sensor panel of uniform quality. Specifically, since the conventional product is locally subjected to heat deformation and pressurization to obtain a curvature, the bending deviation may occur according to the heat deformation position in the manufacturing process. However, the present invention can obtain a touch sensor panel having the same shape as the concave surface of the vacuum portion while the heated touch sensor panel contacts the concave surface as the inside of the vacuum portion becomes a vacuum state.
  • FIG. 1 is a perspective view of a vacuum thermoforming apparatus of a hemispherical touch sensor panel according to an embodiment of the present invention.
  • FIG. 2 is a perspective view illustrating a state in which a touch sensor panel is mounted on a vacuum thermoforming apparatus of a hemispherical touch sensor panel according to an exemplary embodiment of the present invention.
  • Figure 3 is a perspective view showing a state in which the heater portion of the vacuum thermoforming apparatus of the hemispherical touch sensor panel according to an embodiment of the present invention is located on the touch sensor panel.
  • Figure 4 is a front view of the vacuum thermoforming apparatus of the hemispherical touch sensor panel according to an embodiment of the present invention.
  • FIG. 5 is a cross-sectional view showing a vacuum unit and a touch sensor panel of the vacuum thermoforming apparatus of the hemispherical touch sensor panel according to an embodiment of the present invention.
  • FIG. 6 is an enlarged view illustrating a perspective view of a vacuum thermoforming apparatus of a hemispherical touch sensor panel and a hemispherical touch sensor panel according to an embodiment of the present invention.
  • FIG. 1 is a perspective view of a vacuum thermoforming apparatus of a hemispherical touch sensor panel according to an embodiment of the present invention
  • Figure 2 is a touch sensor panel mounted on the vacuum thermoforming apparatus of a hemispherical touch sensor panel according to an embodiment of the present invention
  • 3 is a perspective view showing a state
  • Figure 3 is a perspective view showing a state in which the heater portion of the vacuum thermoforming apparatus of the hemispherical touch sensor panel according to an embodiment of the present invention located on the touch sensor panel.
  • the vacuum thermoforming apparatus 100 of the hemispherical touch sensor panel is provided with a case 110 forming a body and a wheel 120 provided under the case 110.
  • the fixing part 200, the heater part 300, and the vacuum part 400 are included.
  • the fixing part 200 has circular through holes 215 and 225 formed in the center thereof, and is provided to be able to fix the touch sensor panel P inside.
  • the heater unit 300 is provided to move to the upper portion of the touch sensor panel (P) to apply heat to the touch sensor panel (P).
  • the vacuum unit 400 is disposed below the touch sensor panel P and is coupled to the fixing unit 200 so that the inside of the vacuum unit 400 is in a vacuum state, so that the vacuum unit 400 has the same shape as the inner surface of the vacuum unit 400.
  • the touch sensor panel P is provided to be molded.
  • the fixing part 200 includes a lower fixing plate 210, an upper fixing plate 220, and a toggle clamp 240.
  • the lower fixing plate 210 is provided on one side of the upper surface of the case 110 forming the body of the vacuum thermoforming apparatus 100 of the hemispherical touch sensor panel.
  • the lower fixing plate 210 has a lower through hole 215 into which the vacuum part 400 can be inserted.
  • the size of the lower through hole 215 is preferably formed to a size that can be fixed by inserting the heater block 410 to be described later.
  • the lower through hole 215 penetrates through the case 110 at a position in contact with the lower surface of the lower through hole 215.
  • the upper surface of the lower fixing plate 210 and the heater block 410 provided as described above are combined to have a smooth surface without a step.
  • the upper fixing plate 220 is provided above the lower fixing plate 210, and the upper fixing plate 220 and the lower fixing plate 210 are hinged by hinge parts 230 provided at both sides.
  • the upper fixing plate 220 has a circular upper through hole 225 formed in the center, and in this case, the shape of the upper through hole 225 is a circular shape having the same diameter as the diameter of the concave surface 415 to be described later. It is preferable to provide.
  • a handle 222 may be provided on the front surface of the upper fixing plate 220.
  • Toggle clamp 240 may be provided in a pair on the front of the upper fixing plate 220, the toggle clamp 240 is a touch sensor panel (P) is inserted between the upper fixing plate 220 and the lower fixing plate (210).
  • the upper fixing plate 220 may be fixed so as not to move.
  • the touch sensor panel (P) may include a flat base plate and the transparent conductive layer formed on the upper surface of the base plate deformation is made by heat.
  • the transparent conductive layer is preferably made of a material that detects capacitance change due to external contact, such as carbon nanobud, and has no sheet resistance and characteristic change due to thermal deformation.
  • a touch sensing film of polycarbonate (PC), PET, and acrylic material may be further formed.
  • the touch sensor panel P may be a semi-finished product in which a base plate, a transparent conductive layer, and a film for touch sensing are laminated and bonded to each other.
  • the heater unit 300 includes a heater module 310 and the transfer module 320.
  • the heater module 310 has a heating function, and the transfer module 320 may be provided at the rear of the heater module 310 to move the heater module 310 to the left or the right.
  • the heater module 310 includes a heater 311, a handle 312, and a connection member 313.
  • the heater 311 has a built-in heating means and is provided on the case 110.
  • a handle 312 may protrude from an upper surface of the heater 311, and a connection member 313 is provided at one side of the heater 311.
  • connection member 313 is formed to extend upward from a side of the heater 311 by a predetermined length, and may be provided in a form in which one end is vertically extended to the rear.
  • the transfer module 320 includes a support member 321, a guide rail 322, and a block 323.
  • the support member 321 is located behind the heater 311 and is fixed to the upper surface of the case 110.
  • the guide rail 322 is provided on the front surface of the support member 321 and extends in the longitudinal direction of the support member 321. And, the guide rail 322 is coupled to the coupling member (not shown) provided on the back of the heater 311. That is, the heater module 310 is movable in a straight line as the coupling member and the guide rail 322 slide and move with each other.
  • Block 323 is made of a chain (Chain) shape of one side is open, one surface is seated on the upper portion of the support member 321.
  • the block 323 extends in the longitudinal direction of the supporting member 321, and one end thereof is fixed to the upper surface of the connecting member 313.
  • Block 323 has a variable area in contact with the support member 321 according to the movement of the heater module 310.
  • both ends of the support member 321 may be further formed a departure prevention portion (not shown) protruding forward.
  • the departure prevention part may be provided to prevent the heater module 310 moving along the guide rail 322 from being separated from the guide rail 322.
  • the heater module 310 is preferably provided so as to be positioned above the fixing part 200 or the auxiliary plate 330 when the heater module 310 is in contact with the separation prevention parts located on both sides of the support member 321.
  • the transfer module 320 provided as described above is not limited to one embodiment, and is provided in the form of a linear motion guide and both the heater module 310 and the heater module 310 are provided to move in a straight line to the left or the right. It may include.
  • the auxiliary plate 330 is provided on the other side of the upper surface of the case 110, and in particular, when the heater module 310 is completed to move to the right side, the auxiliary plate 330 is provided to be located under the heater module 310. It is preferable. In this case, the auxiliary plate 330 may protect the case 110 from the residual heat generated from the heater 311 is completed.
  • Figure 4 is a front view of the vacuum thermoforming apparatus of the hemispherical touch sensor panel according to an embodiment of the present invention.
  • the vacuum unit 400 includes a heater block 410 and a vacuum pump 420.
  • the heater block 410 may be generally formed in a rectangular box shape, and the heater block 410 is coupled to and fixed to the lower through hole 215 of the lower fixing plate 210.
  • a concave surface 415 is formed at the center of the upper surface of the heater block 410. At this time, the concave surface 415 is provided in the same shape as the shape of the touch sensor panel (P) to be molded.
  • the concave surface 415 may be provided in a concave hemispherical shape.
  • At least one vacuum hole 416 is formed at the outermost side of the upper surface of the concave surface 415.
  • the outermost part of the concave surface 415 refers to a portion where the concave surface 415 starts on the upper surface of the heater block 410 in contact with the upper fixing plate 220.
  • the vacuum hole 416 is located at the outermost top of the concave surface 415, so that the protruding portion generated in the touch sensor panel P by the vacuum hole 416 in the process of forming the touch sensor panel P into a hemispherical shape. This can be minimized.
  • one or more vacuum holes 416 may be provided, but the size and number of the vacuum holes 416 may be minimized.
  • the outermost portion of the concave surface 415 may be curved to prevent damage to the outer edge of the hemispherical shape when heat and pressure is applied to the touch sensor panel P to become hemispherical.
  • the plurality of vacuum holes 416 provided on the concave surface 415 may be provided at positions symmetrical with each other, and each vacuum hole 416 may have an air suction pressure equal to each other.
  • the number of the vacuum holes 416 is illustrated as four, but the number of the vacuum holes 416 is not limited thereto, and the positions of the vacuum holes 416 are equal to each vacuum hole 416. If provided in positions symmetrical with each other to maintain the pressure, all are included in one embodiment.
  • the concave surface 415 is made of a metal material having excellent thermal conductivity, and the portion of the heater block 410 except for the concave surface 415 is preferably made of a material having low thermal conductivity.
  • the lower fixing plate 210 and the upper fixing plate 220 may also be made of a metal material having low thermal conductivity.
  • the vacuum pump 420 may be connected to the vacuum hole 416 of the heater block 410 and may be provided below the heater block 410.
  • the vacuum pump 420 discharges the air located between the concave surface 415 and the touch sensor panel P to the outside through the control unit 500 and the vacuum hole 416.
  • the vacuum pump 420 sucks air between the concave surface 415 and the touch sensor panel P through the vacuum hole 416 to make a vacuum state.
  • a heating means (not shown) may be provided inside the heater block 410, and the concave surface 415 may be heated. In the heating means, the temperature and the heating time are controlled by the controller 500.
  • the vacuum thermoforming apparatus 100 of the hemispherical touch sensor panel further includes a controller 500.
  • the controller 500 may be provided at the upper front of the case 110, and the controller 500 may individually adjust the temperature and the heating time of the heater module 310 and the heater block 410.
  • the controller 500 may adjust the temperature at which the heater module 310 and the heater block 410 apply heat to the touch sensor panel P and the time for applying heat.
  • the controller 500 may adjust the vacuum pressure and time of the vacuum pump 420. Specifically, the controller 500 may adjust the pressure and time for the vacuum pump 420 to discharge the air located between the concave surface 415 and the touch sensor panel P through the vacuum hole 416.
  • FIG. 5 is a cross-sectional view showing a vacuum unit and a touch sensor panel of the vacuum thermoforming apparatus of the hemispherical touch sensor panel according to an embodiment of the present invention
  • Figure 6 is a vacuum column of the hemispherical touch sensor panel according to an embodiment of the present invention An enlarged view showing a perspective view of a molding apparatus and a hemispherical touch sensor panel.
  • the temperature and heating time to be applied to the touch sensor panel P by the heater module 310 and the heater block 410 are set using the controller 500, and the vacuum pressure and the required time of the vacuum pump 420 are set. do. Then, the heater module 310 and the heater block 410 waits until the set temperature is maintained. In this case, the touch sensor panel P can accurately calculate the amount of heat input from the heater module 310 and the heater block 410.
  • the upper fixing plate 220 is lifted upward by using the handle 222.
  • the upper fixing plate 220 is moved downward so that the upper fixing plate 220 contacts the lower fixing plate 210. do. Then, the toggle clamp 240 is rotated forward to apply pressure to the upper fixing plate 220 to be fixed.
  • the heater module 310 is moved to the upper portion of the fixing part 200 by using the transfer module 320.
  • control unit 500 is operated to apply heat to the touch sensor panel P by a predetermined temperature and heating time by the heater module 310 and the heater block 410.
  • control unit 500 may be provided to automatically operate from the moment the heater module 310 moves to the upper portion of the touch sensor panel (P) to apply heat to the touch sensor panel (P).
  • the touch sensor panel (P) is heated only the portion exposed by the upper through hole 225, it is preferable that the heating is performed only enough to make a deformation when a pressure is applied.
  • the touch sensor panel is provided through the vacuum hole 416 according to a preset vacuum pressure and a required time from the controller 500. Air existing between P and the concave surface 415 is discharged to the outside. That is, the space between the touch sensor panel P and the concave surface 415 changes to a vacuum state. Then, the touch sensor panel (P) is in contact with the inner surface of the concave surface 415 as the air escapes through the vacuum hole (416). That is, the heated portion of the touch sensor panel P is formed into a concave hemispherical shape which is in contact with the inner surface of the concave surface 415 in the same shape as the concave surface 415.
  • the heater module 310 is moved to the upper portion of the auxiliary plate 330 by using the transfer module 320.
  • the auxiliary plate 330 protects the residual heat generated from the heater module 310 from damaging the case 110 and a device provided inside the case 110.
  • the handle of the toggle clamp 240 is rotated upward to release the upper fixing plate 220 and open, and then the molded touch sensor panel P is detached.
  • the touch sensor panel P detached from the vacuum thermoforming apparatus 100 of the hemispherical touch sensor panel forms a hemispherical shape having the same shape as the concave surface 415.
  • the vacuum thermoforming apparatus 100 of the provided hemispherical touch sensor panel is easy to mold the touch sensor panel P into a hemispherical shape.
  • the hemispherical touch sensor panel is automatically set. Since (P) is molded, even a beginner can easily manufacture a hemispherical touch sensor panel (P).
  • controller 500 may individually control the heater module 310 and the heater block 410, and may perform work in consideration of the material of the touch sensor panel P.
  • FIG. 1
  • the vacuum thermoforming apparatus 100 of the hemispherical touch sensor panel can manufacture a product of the same shape with a uniform quality.
  • the conventional thermoforming device of the touch sensor panel is difficult to produce a uniform quality because the curvature should be made by applying heat and pressure locally to the touch sensor panel, the vacuum thermoforming device 100 of the hemispherical touch sensor panel is always a heater
  • the touch sensor panel P having the same shape as the concave surface 415 of the block 410 may be manufactured to obtain a product having a uniform quality.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Blow-Moulding Or Thermoforming Of Plastics Or The Like (AREA)

Abstract

La présente invention concerne un appareil destiné au thermoformage sous vide d'un panneau tactile semi-sphérique et plus particulièrement, un appareil destiné au thermoformage sous vide d'un panneau tactile semi-sphérique de manière à façonner un panneau tactile de forme semi-sphérique. L'invention concerne un appareil destiné au thermoformage sous vide d'un panneau tactile semi-sphérique, l'appareil comprenant : une partie fixation prévue pour la fixation d'un panneau tactile; une partie vide accouplée à la partie fixation; et une partie chauffage prévue pour l'application de la chaleur sur le panneau tactile en se déplaçant vers la partie supérieure du panneau tactile, la partie sous vide étant façonnée de manière à ce que, étant donné que l'intérieur se retrouve dans un état sous vide, le panneau tactile soit façonné dans la même forme que la surface intérieure de la partie sous vide.
PCT/KR2015/013884 2015-12-16 2015-12-17 Appareil destiné au thermoformage sous vide de panneau tactile semi-sphérique WO2017104868A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020150179867A KR20170071779A (ko) 2015-12-16 2015-12-16 반구형 터치센서 판넬의 진공 열성형 장치
KR10-2015-0179867 2015-12-16

Publications (1)

Publication Number Publication Date
WO2017104868A1 true WO2017104868A1 (fr) 2017-06-22

Family

ID=59056862

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2015/013884 WO2017104868A1 (fr) 2015-12-16 2015-12-17 Appareil destiné au thermoformage sous vide de panneau tactile semi-sphérique

Country Status (2)

Country Link
KR (1) KR20170071779A (fr)
WO (1) WO2017104868A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101865021B1 (ko) 2018-03-07 2018-06-05 곽현욱 가상현실체험용 탑승구체의 제조방법

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110068492A1 (en) * 2009-09-22 2011-03-24 Industrial Technology Research Institute 3d curved display devices, fabrication methods thereof and plastic display panels
EP2560459A2 (fr) * 2007-02-21 2013-02-20 Ulvac, Inc. Dispositif d'affichage, appareil pour fabriquer le dispositif d'affichage et méthode de fabrication du dispositif d'affichage
US20130221698A1 (en) * 2010-04-20 2013-08-29 Faurecia Interior Systems, Inc. Negative thermoforming process for vehicle interior coverings
US20140373573A1 (en) * 2013-06-25 2014-12-25 Samsung Display Co., Ltd. Apparatus and method for manufacturing 3d glass
WO2015068902A1 (fr) * 2013-11-11 2015-05-14 (주)아이씨디 Appareil de fabrication de verre bombé de type à transfert de moule

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2560459A2 (fr) * 2007-02-21 2013-02-20 Ulvac, Inc. Dispositif d'affichage, appareil pour fabriquer le dispositif d'affichage et méthode de fabrication du dispositif d'affichage
US20110068492A1 (en) * 2009-09-22 2011-03-24 Industrial Technology Research Institute 3d curved display devices, fabrication methods thereof and plastic display panels
US20130221698A1 (en) * 2010-04-20 2013-08-29 Faurecia Interior Systems, Inc. Negative thermoforming process for vehicle interior coverings
US20140373573A1 (en) * 2013-06-25 2014-12-25 Samsung Display Co., Ltd. Apparatus and method for manufacturing 3d glass
WO2015068902A1 (fr) * 2013-11-11 2015-05-14 (주)아이씨디 Appareil de fabrication de verre bombé de type à transfert de moule

Also Published As

Publication number Publication date
KR20170071779A (ko) 2017-06-26

Similar Documents

Publication Publication Date Title
WO2011071231A2 (fr) Dispositif d'adhésion de film et procédé d'adhésion
WO2014133265A1 (fr) Appareil d'affichage
WO2015064882A1 (fr) Procédé de fabrication d'un verre de fenêtre incurvé pour dispositif mobile
WO2017094950A1 (fr) Appareil de thermoformage de panneau à capteur de toucher hémisphérique
WO2017104868A1 (fr) Appareil destiné au thermoformage sous vide de panneau tactile semi-sphérique
WO2010079865A1 (fr) Appareil de mise à plat et de formage de pré-imprégnés et procédé de formage des pré-imprégnés
WO2015076636A1 (fr) Dispositif et procédé permettant de plier un fil chauffant électrique de type bande et corps de production de chaleur formé à l'aide d'un fil chauffant électrique sous forme de bande
WO2014109470A1 (fr) Appareil pour fabriquer une bride à long col par application de fluotournage et procédé correspondant
WO2014168294A1 (fr) Appareil de combinaison de panneaux
KR20010067149A (ko) 양면 점착시트에 고정된 물품의 박리방법 및 박리장치
WO2016098974A1 (fr) Dispositif de moulage d'une surface incurvée en verre et procédé de moulage d'une surface incurvée en verre l'utilisant
WO2011142629A2 (fr) Dispositif de stratification avec pliage utilisable dans la fabrication d'un capteur d'écran tactile
WO2018190472A1 (fr) Dispositif de séparation de papier anti-adhésif de bande pour dispositif de montage de composant et son procédé de séparation
WO2019045388A1 (fr) Appareil de transfert thermique et procédé pour verre de couverture plié à l'aide d'un pressage de résine
WO2021034119A1 (fr) Appareil de formation de verre de prtoection de terminal mobile
WO2018016824A1 (fr) Dispositif de moulage de matériau
JP3742320B2 (ja) プレス成形装置
WO2018128331A1 (fr) Appareil de formage de verre
WO2015099290A1 (fr) Appareil et procédé de production de film pour lentille polarisée
WO2020004960A1 (fr) Dispositif de massage capable de réguler la température
WO2010013880A1 (fr) Procédé et appareil d'affichage de motifs sur un boîtier tridimensionnel d'un appareil électronique par le biais d'un procédé de transfert
KR20220000151A (ko) 보호 필름 부착 장치
WO2015069088A1 (fr) Système et procédé pour la fabrication de verre bombé
WO2018124722A1 (fr) Appareil de façonnage
WO2021066228A1 (fr) Dispositif de moule d'injection

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 15910791

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

32PN Ep: public notification in the ep bulletin as address of the adressee cannot be established

Free format text: NOTING OF LOSS OF RIGHTS PURSUANT TO RULE 112(1) EPC (EPO FORM 1205A DATED 251018)

122 Ep: pct application non-entry in european phase

Ref document number: 15910791

Country of ref document: EP

Kind code of ref document: A1