WO2017104868A1 - Apparatus for vacuum thermoforming semi-spherical touch sensor panel - Google Patents

Apparatus for vacuum thermoforming semi-spherical touch sensor panel Download PDF

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Publication number
WO2017104868A1
WO2017104868A1 PCT/KR2015/013884 KR2015013884W WO2017104868A1 WO 2017104868 A1 WO2017104868 A1 WO 2017104868A1 KR 2015013884 W KR2015013884 W KR 2015013884W WO 2017104868 A1 WO2017104868 A1 WO 2017104868A1
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Prior art keywords
touch sensor
vacuum
sensor panel
heater
hemispherical
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PCT/KR2015/013884
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French (fr)
Korean (ko)
Inventor
김순완
이수재
김홍채
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주식회사 트레이스
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Publication of WO2017104868A1 publication Critical patent/WO2017104868A1/en

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means

Definitions

  • the present invention relates to a vacuum thermoforming apparatus for a hemispherical touch sensor panel, and more particularly, to a vacuum thermoforming apparatus for a hemispherical touch sensor panel for molding a touch sensor panel into a hemispherical shape.
  • the touch sensor panel is an input device for inputting a user's command by converting a contact position contacted by a person's hand or an object into an electrical signal.
  • a touch sensor panel has been used in automobiles as well as mobile phones and tablet PCs. .
  • the touch sensor panel has been developed to perform various touch functions according to the motion of a human finger or an object. Recently, a part of the touch sensor panel has a curvature in particular in consideration of ease of use and design factors. Is commercialized.
  • a touch sensor panel applied to an automobile has a flat shape, which causes inconvenience.
  • the touch sensor panel which is widely applied to an electric vehicle in the related art, has a large screen, but has a flat shape, and thus, a driver has to bend the body forward or extend his arm for manipulating the device.
  • the conventional method of molding the touch sensor panel to have a curvature was a method of forming by applying heat and pressure directly to the portion to be molded of the flat shape of the touch sensor panel. Therefore, it is difficult to always apply the same pressure to the same position depending on the product, there is a problem that it is difficult to produce a product of uniform quality.
  • the present invention has been made in an effort to provide a vacuum thermoforming apparatus for a hemispherical touch sensor panel for molding a flat touch sensor panel into a hemispherical shape.
  • an embodiment of the present invention is a fixing unit provided to fix the touch sensor panel; A vacuum unit coupled to the fixed unit; And a heater part provided to move to an upper portion of the touch sensor panel to apply heat to the touch sensor panel, wherein the vacuum part has the same shape as the inner surface of the vacuum part as the inside of the vacuum part becomes a vacuum state. It provides a vacuum thermoforming device of the hemispherical touch sensor panel to be formed as.
  • the fixing portion, the lower fixing plate is formed with a lower through hole in the center;
  • it may be characterized in that it comprises a toggle clamp for fixing the fixing plate in a closed state.
  • the vacuum unit, the heater block is coupled to the lower through hole, the concave surface is provided in the center of the upper surface; And a vacuum pump connected to a vacuum hole provided in the concave surface, wherein the vacuum pump discharges air located between the concave surface and the touch sensor panel through the vacuum hole to the outside.
  • the concave surface of the heater block may be characterized in that hemispherical.
  • At least one vacuum hole is formed in the outermost of the concave surface, the air suction pressure of the plurality of vacuum holes may be characterized in that it is maintained evenly.
  • the outermost portion of the concave surface may be characterized in that the curved surface.
  • the heater unit a heater module having a heating function; And a transfer module provided at one side of the heater module, wherein the transfer module moves the heater module to the left or the right.
  • the heater module and the heater block may be further characterized in that it further comprises a control unit for adjusting the temperature and heating time, and the vacuum pressure and time of the vacuum pump.
  • the touch sensor panel may be characterized in that it comprises a base plate and a transparent conductive layer formed on the upper surface of the base plate.
  • the flat shape of the touch sensor panel can be molded into a hemispherical shape.
  • the touch sensor panel can be formed into a hemispherical shape according to the material of the touch sensor panel. Can be.
  • the present invention it is possible to manufacture a hemispherical touch sensor panel of uniform quality. Specifically, since the conventional product is locally subjected to heat deformation and pressurization to obtain a curvature, the bending deviation may occur according to the heat deformation position in the manufacturing process. However, the present invention can obtain a touch sensor panel having the same shape as the concave surface of the vacuum portion while the heated touch sensor panel contacts the concave surface as the inside of the vacuum portion becomes a vacuum state.
  • FIG. 1 is a perspective view of a vacuum thermoforming apparatus of a hemispherical touch sensor panel according to an embodiment of the present invention.
  • FIG. 2 is a perspective view illustrating a state in which a touch sensor panel is mounted on a vacuum thermoforming apparatus of a hemispherical touch sensor panel according to an exemplary embodiment of the present invention.
  • Figure 3 is a perspective view showing a state in which the heater portion of the vacuum thermoforming apparatus of the hemispherical touch sensor panel according to an embodiment of the present invention is located on the touch sensor panel.
  • Figure 4 is a front view of the vacuum thermoforming apparatus of the hemispherical touch sensor panel according to an embodiment of the present invention.
  • FIG. 5 is a cross-sectional view showing a vacuum unit and a touch sensor panel of the vacuum thermoforming apparatus of the hemispherical touch sensor panel according to an embodiment of the present invention.
  • FIG. 6 is an enlarged view illustrating a perspective view of a vacuum thermoforming apparatus of a hemispherical touch sensor panel and a hemispherical touch sensor panel according to an embodiment of the present invention.
  • FIG. 1 is a perspective view of a vacuum thermoforming apparatus of a hemispherical touch sensor panel according to an embodiment of the present invention
  • Figure 2 is a touch sensor panel mounted on the vacuum thermoforming apparatus of a hemispherical touch sensor panel according to an embodiment of the present invention
  • 3 is a perspective view showing a state
  • Figure 3 is a perspective view showing a state in which the heater portion of the vacuum thermoforming apparatus of the hemispherical touch sensor panel according to an embodiment of the present invention located on the touch sensor panel.
  • the vacuum thermoforming apparatus 100 of the hemispherical touch sensor panel is provided with a case 110 forming a body and a wheel 120 provided under the case 110.
  • the fixing part 200, the heater part 300, and the vacuum part 400 are included.
  • the fixing part 200 has circular through holes 215 and 225 formed in the center thereof, and is provided to be able to fix the touch sensor panel P inside.
  • the heater unit 300 is provided to move to the upper portion of the touch sensor panel (P) to apply heat to the touch sensor panel (P).
  • the vacuum unit 400 is disposed below the touch sensor panel P and is coupled to the fixing unit 200 so that the inside of the vacuum unit 400 is in a vacuum state, so that the vacuum unit 400 has the same shape as the inner surface of the vacuum unit 400.
  • the touch sensor panel P is provided to be molded.
  • the fixing part 200 includes a lower fixing plate 210, an upper fixing plate 220, and a toggle clamp 240.
  • the lower fixing plate 210 is provided on one side of the upper surface of the case 110 forming the body of the vacuum thermoforming apparatus 100 of the hemispherical touch sensor panel.
  • the lower fixing plate 210 has a lower through hole 215 into which the vacuum part 400 can be inserted.
  • the size of the lower through hole 215 is preferably formed to a size that can be fixed by inserting the heater block 410 to be described later.
  • the lower through hole 215 penetrates through the case 110 at a position in contact with the lower surface of the lower through hole 215.
  • the upper surface of the lower fixing plate 210 and the heater block 410 provided as described above are combined to have a smooth surface without a step.
  • the upper fixing plate 220 is provided above the lower fixing plate 210, and the upper fixing plate 220 and the lower fixing plate 210 are hinged by hinge parts 230 provided at both sides.
  • the upper fixing plate 220 has a circular upper through hole 225 formed in the center, and in this case, the shape of the upper through hole 225 is a circular shape having the same diameter as the diameter of the concave surface 415 to be described later. It is preferable to provide.
  • a handle 222 may be provided on the front surface of the upper fixing plate 220.
  • Toggle clamp 240 may be provided in a pair on the front of the upper fixing plate 220, the toggle clamp 240 is a touch sensor panel (P) is inserted between the upper fixing plate 220 and the lower fixing plate (210).
  • the upper fixing plate 220 may be fixed so as not to move.
  • the touch sensor panel (P) may include a flat base plate and the transparent conductive layer formed on the upper surface of the base plate deformation is made by heat.
  • the transparent conductive layer is preferably made of a material that detects capacitance change due to external contact, such as carbon nanobud, and has no sheet resistance and characteristic change due to thermal deformation.
  • a touch sensing film of polycarbonate (PC), PET, and acrylic material may be further formed.
  • the touch sensor panel P may be a semi-finished product in which a base plate, a transparent conductive layer, and a film for touch sensing are laminated and bonded to each other.
  • the heater unit 300 includes a heater module 310 and the transfer module 320.
  • the heater module 310 has a heating function, and the transfer module 320 may be provided at the rear of the heater module 310 to move the heater module 310 to the left or the right.
  • the heater module 310 includes a heater 311, a handle 312, and a connection member 313.
  • the heater 311 has a built-in heating means and is provided on the case 110.
  • a handle 312 may protrude from an upper surface of the heater 311, and a connection member 313 is provided at one side of the heater 311.
  • connection member 313 is formed to extend upward from a side of the heater 311 by a predetermined length, and may be provided in a form in which one end is vertically extended to the rear.
  • the transfer module 320 includes a support member 321, a guide rail 322, and a block 323.
  • the support member 321 is located behind the heater 311 and is fixed to the upper surface of the case 110.
  • the guide rail 322 is provided on the front surface of the support member 321 and extends in the longitudinal direction of the support member 321. And, the guide rail 322 is coupled to the coupling member (not shown) provided on the back of the heater 311. That is, the heater module 310 is movable in a straight line as the coupling member and the guide rail 322 slide and move with each other.
  • Block 323 is made of a chain (Chain) shape of one side is open, one surface is seated on the upper portion of the support member 321.
  • the block 323 extends in the longitudinal direction of the supporting member 321, and one end thereof is fixed to the upper surface of the connecting member 313.
  • Block 323 has a variable area in contact with the support member 321 according to the movement of the heater module 310.
  • both ends of the support member 321 may be further formed a departure prevention portion (not shown) protruding forward.
  • the departure prevention part may be provided to prevent the heater module 310 moving along the guide rail 322 from being separated from the guide rail 322.
  • the heater module 310 is preferably provided so as to be positioned above the fixing part 200 or the auxiliary plate 330 when the heater module 310 is in contact with the separation prevention parts located on both sides of the support member 321.
  • the transfer module 320 provided as described above is not limited to one embodiment, and is provided in the form of a linear motion guide and both the heater module 310 and the heater module 310 are provided to move in a straight line to the left or the right. It may include.
  • the auxiliary plate 330 is provided on the other side of the upper surface of the case 110, and in particular, when the heater module 310 is completed to move to the right side, the auxiliary plate 330 is provided to be located under the heater module 310. It is preferable. In this case, the auxiliary plate 330 may protect the case 110 from the residual heat generated from the heater 311 is completed.
  • Figure 4 is a front view of the vacuum thermoforming apparatus of the hemispherical touch sensor panel according to an embodiment of the present invention.
  • the vacuum unit 400 includes a heater block 410 and a vacuum pump 420.
  • the heater block 410 may be generally formed in a rectangular box shape, and the heater block 410 is coupled to and fixed to the lower through hole 215 of the lower fixing plate 210.
  • a concave surface 415 is formed at the center of the upper surface of the heater block 410. At this time, the concave surface 415 is provided in the same shape as the shape of the touch sensor panel (P) to be molded.
  • the concave surface 415 may be provided in a concave hemispherical shape.
  • At least one vacuum hole 416 is formed at the outermost side of the upper surface of the concave surface 415.
  • the outermost part of the concave surface 415 refers to a portion where the concave surface 415 starts on the upper surface of the heater block 410 in contact with the upper fixing plate 220.
  • the vacuum hole 416 is located at the outermost top of the concave surface 415, so that the protruding portion generated in the touch sensor panel P by the vacuum hole 416 in the process of forming the touch sensor panel P into a hemispherical shape. This can be minimized.
  • one or more vacuum holes 416 may be provided, but the size and number of the vacuum holes 416 may be minimized.
  • the outermost portion of the concave surface 415 may be curved to prevent damage to the outer edge of the hemispherical shape when heat and pressure is applied to the touch sensor panel P to become hemispherical.
  • the plurality of vacuum holes 416 provided on the concave surface 415 may be provided at positions symmetrical with each other, and each vacuum hole 416 may have an air suction pressure equal to each other.
  • the number of the vacuum holes 416 is illustrated as four, but the number of the vacuum holes 416 is not limited thereto, and the positions of the vacuum holes 416 are equal to each vacuum hole 416. If provided in positions symmetrical with each other to maintain the pressure, all are included in one embodiment.
  • the concave surface 415 is made of a metal material having excellent thermal conductivity, and the portion of the heater block 410 except for the concave surface 415 is preferably made of a material having low thermal conductivity.
  • the lower fixing plate 210 and the upper fixing plate 220 may also be made of a metal material having low thermal conductivity.
  • the vacuum pump 420 may be connected to the vacuum hole 416 of the heater block 410 and may be provided below the heater block 410.
  • the vacuum pump 420 discharges the air located between the concave surface 415 and the touch sensor panel P to the outside through the control unit 500 and the vacuum hole 416.
  • the vacuum pump 420 sucks air between the concave surface 415 and the touch sensor panel P through the vacuum hole 416 to make a vacuum state.
  • a heating means (not shown) may be provided inside the heater block 410, and the concave surface 415 may be heated. In the heating means, the temperature and the heating time are controlled by the controller 500.
  • the vacuum thermoforming apparatus 100 of the hemispherical touch sensor panel further includes a controller 500.
  • the controller 500 may be provided at the upper front of the case 110, and the controller 500 may individually adjust the temperature and the heating time of the heater module 310 and the heater block 410.
  • the controller 500 may adjust the temperature at which the heater module 310 and the heater block 410 apply heat to the touch sensor panel P and the time for applying heat.
  • the controller 500 may adjust the vacuum pressure and time of the vacuum pump 420. Specifically, the controller 500 may adjust the pressure and time for the vacuum pump 420 to discharge the air located between the concave surface 415 and the touch sensor panel P through the vacuum hole 416.
  • FIG. 5 is a cross-sectional view showing a vacuum unit and a touch sensor panel of the vacuum thermoforming apparatus of the hemispherical touch sensor panel according to an embodiment of the present invention
  • Figure 6 is a vacuum column of the hemispherical touch sensor panel according to an embodiment of the present invention An enlarged view showing a perspective view of a molding apparatus and a hemispherical touch sensor panel.
  • the temperature and heating time to be applied to the touch sensor panel P by the heater module 310 and the heater block 410 are set using the controller 500, and the vacuum pressure and the required time of the vacuum pump 420 are set. do. Then, the heater module 310 and the heater block 410 waits until the set temperature is maintained. In this case, the touch sensor panel P can accurately calculate the amount of heat input from the heater module 310 and the heater block 410.
  • the upper fixing plate 220 is lifted upward by using the handle 222.
  • the upper fixing plate 220 is moved downward so that the upper fixing plate 220 contacts the lower fixing plate 210. do. Then, the toggle clamp 240 is rotated forward to apply pressure to the upper fixing plate 220 to be fixed.
  • the heater module 310 is moved to the upper portion of the fixing part 200 by using the transfer module 320.
  • control unit 500 is operated to apply heat to the touch sensor panel P by a predetermined temperature and heating time by the heater module 310 and the heater block 410.
  • control unit 500 may be provided to automatically operate from the moment the heater module 310 moves to the upper portion of the touch sensor panel (P) to apply heat to the touch sensor panel (P).
  • the touch sensor panel (P) is heated only the portion exposed by the upper through hole 225, it is preferable that the heating is performed only enough to make a deformation when a pressure is applied.
  • the touch sensor panel is provided through the vacuum hole 416 according to a preset vacuum pressure and a required time from the controller 500. Air existing between P and the concave surface 415 is discharged to the outside. That is, the space between the touch sensor panel P and the concave surface 415 changes to a vacuum state. Then, the touch sensor panel (P) is in contact with the inner surface of the concave surface 415 as the air escapes through the vacuum hole (416). That is, the heated portion of the touch sensor panel P is formed into a concave hemispherical shape which is in contact with the inner surface of the concave surface 415 in the same shape as the concave surface 415.
  • the heater module 310 is moved to the upper portion of the auxiliary plate 330 by using the transfer module 320.
  • the auxiliary plate 330 protects the residual heat generated from the heater module 310 from damaging the case 110 and a device provided inside the case 110.
  • the handle of the toggle clamp 240 is rotated upward to release the upper fixing plate 220 and open, and then the molded touch sensor panel P is detached.
  • the touch sensor panel P detached from the vacuum thermoforming apparatus 100 of the hemispherical touch sensor panel forms a hemispherical shape having the same shape as the concave surface 415.
  • the vacuum thermoforming apparatus 100 of the provided hemispherical touch sensor panel is easy to mold the touch sensor panel P into a hemispherical shape.
  • the hemispherical touch sensor panel is automatically set. Since (P) is molded, even a beginner can easily manufacture a hemispherical touch sensor panel (P).
  • controller 500 may individually control the heater module 310 and the heater block 410, and may perform work in consideration of the material of the touch sensor panel P.
  • FIG. 1
  • the vacuum thermoforming apparatus 100 of the hemispherical touch sensor panel can manufacture a product of the same shape with a uniform quality.
  • the conventional thermoforming device of the touch sensor panel is difficult to produce a uniform quality because the curvature should be made by applying heat and pressure locally to the touch sensor panel, the vacuum thermoforming device 100 of the hemispherical touch sensor panel is always a heater
  • the touch sensor panel P having the same shape as the concave surface 415 of the block 410 may be manufactured to obtain a product having a uniform quality.

Abstract

The present invention relates to an apparatus for vacuum thermoforming a semi-spherical touch sensor panel, and more specifically, to an apparatus for vacuum thermoforming a semi-spherical touch sensor panel so as to form a touch sensor panel into a semi-spherical shape. Provided is an apparatus for vacuum thermoforming a semi-spherical touch sensor panel, the apparatus comprising: a fixing part provided for fixing a touch sensor panel; a vacuum part coupling to the fixing part; and a heater part provided for applying heat to the touch sensor panel by moving to the upper part of the touch sensor panel, wherein the vacuum part is formed so that, as the inside thereof becomes a vacuum state, the touch sensor panel is formed into the same shape as the inside surface of the vacuum part.

Description

반구형 터치센서 판넬의 진공 열성형 장치Vacuum thermoforming device of hemispherical touch sensor panel
본 발명은 반구형 터치센서 판넬의 진공 열성형 장치에 관한 것으로, 보다 상세하게는 터치센서 판넬을 반구형으로 성형하기 위한 반구형 터치센서 판넬의 진공 열성형 장치에 관한 것이다.The present invention relates to a vacuum thermoforming apparatus for a hemispherical touch sensor panel, and more particularly, to a vacuum thermoforming apparatus for a hemispherical touch sensor panel for molding a touch sensor panel into a hemispherical shape.
일반적으로, 터치센서 판넬은 사람의 손 또는 물체로부터 접촉된 접촉 위치를 전기적 신호로 변환하여 사용자의 명령을 입력할 수 있도록 한 입력장치로서, 휴대폰, 태블릿 PC에 이어 최근에는 자동차에도 장착되어 사용되고 있다.In general, the touch sensor panel is an input device for inputting a user's command by converting a contact position contacted by a person's hand or an object into an electrical signal. Recently, a touch sensor panel has been used in automobiles as well as mobile phones and tablet PCs. .
이러한, 터치센서 판넬은 사람의 손가락이나 물체의 모션에 따라 다양한 터치 기능을 수행하도록 개발되고 있으며, 최근에는 특히, 사용상의 편의 및 디자인적인 요소를 고려하여 터치센서 판넬의 일부분이 곡률을 갖도록 한 제품이 상용화되고 있다.The touch sensor panel has been developed to perform various touch functions according to the motion of a human finger or an object. Recently, a part of the touch sensor panel has a curvature in particular in consideration of ease of use and design factors. Is commercialized.
그러나, 종래의 터치센서 판넬은 터치센서 판넬 전체가 곡률을 갖는 형상이 구현되지 못하였기 때문에, 사용상 불편한 점이 다수 존재하였다.However, in the conventional touch sensor panel, since the shape of the entire touch sensor panel is not realized, there are many inconveniences in use.
일 예로, 최근에는 자동차 분야에서 스마트카 시장이 확대됨에 따라, 스마트카에 적용 가능한 터치센서 판넬에 대한 연구가 활발히 진행되고 있다. For example, recently, as the smart car market is expanding in the automobile field, research on a touch sensor panel applicable to the smart car has been actively conducted.
그러나, 종래에는 자동차에 적용되는 터치센서 판넬이 플랫(flat)한 형상으로 이루어져 불편함이 있었다.However, in the related art, a touch sensor panel applied to an automobile has a flat shape, which causes inconvenience.
보다 구체적으로, 종래에 전기차에 널리 적용되고 있는 터치센서 판넬은 대화면으로 이루어져 있으나, 플랫한 형상이어서, 운전자가 기기 조작을 위해서 몸을 앞으로 구부리거나 팔을 길게 뻗어 조작해야만 하는 문제가 있었다.More specifically, the touch sensor panel, which is widely applied to an electric vehicle in the related art, has a large screen, but has a flat shape, and thus, a driver has to bend the body forward or extend his arm for manipulating the device.
이와 같이, 운전자가 운전 중에 몸을 움직여 터치센서 판넬을 조작할 경우, 운전자가 도로 상황을 안정적으로 확인하는 것이 어려워 안전 운전에 방해가 된다는 문제점이 있었다.As such, when the driver operates the touch sensor panel by moving his or her body during driving, it is difficult for the driver to stably check the road situation, which hinders safe driving.
따라서, 터치센서 판넬의 곡률을 크게할 경우, 운전자가 몸을 앞으로 기울이지 않아도 손쉽게 터치센서 판넬을 터치할 수 있어 이러한 문제를 해결할 수 있다.Therefore, when the curvature of the touch sensor panel is increased, the driver can easily touch the touch sensor panel without tilting the body forward to solve this problem.
그러나, 종래에는 플랫한 형상의 터치센서 판넬과 동일한 터치 기능을 수행하면서도 큰 곡률을 갖는 터치센서 판넬을 성형하는 방법이 없어 상기와 같은 기술을 적용하는 데에 어려움이 있었다.However, in the related art, there is no method of forming a touch sensor panel having a large curvature while performing the same touch function as a flat touch sensor panel, and thus there is a difficulty in applying the above technique.
또한, 종래의 터치센서 판넬이 곡률을 갖도록 성형하는 방법은 플랫한 형상의 터치센서 판넬 중 성형을 할 부분에 직접적으로 열과 압력을 가하여 성형을 하는 방법뿐이었다. 따라서, 제품에 따라 항상 동일한 위치에 동일한 압력을 가하는 것이 어려워 균일한 품질의 제품을 생산하는 것이 어렵다는 문제점이 있었다.In addition, the conventional method of molding the touch sensor panel to have a curvature was a method of forming by applying heat and pressure directly to the portion to be molded of the flat shape of the touch sensor panel. Therefore, it is difficult to always apply the same pressure to the same position depending on the product, there is a problem that it is difficult to produce a product of uniform quality.
따라서, 터치센서 판넬을 반구형으로 성형할 수 있는 반구형 터치센서 판넬의 진공 열성형 장치가 필요하다.Accordingly, there is a need for a vacuum thermoforming apparatus for a hemispherical touch sensor panel capable of molding the touch sensor panel into a hemispherical shape.
상기와 같은 문제점을 해결하기 위한 본 발명의 기술적 과제는 플랫형의 터치센서 판넬을 반구형으로 성형하기 위한 반구형 터치센서 판넬의 진공 열성형 장치를 제공하는 것이다. SUMMARY OF THE INVENTION The present invention has been made in an effort to provide a vacuum thermoforming apparatus for a hemispherical touch sensor panel for molding a flat touch sensor panel into a hemispherical shape.
상기 기술적 과제를 달성하기 위하여, 본 발명의 일실시예는 터치센서 판넬을 고정하도록 마련된 고정부; 상기 고정부에 결합되는 진공부; 및 상기 터치센서 판넬의 상부로 이동하여 상기 터치센서 판넬에 열을 가하도록 마련되는 히터부를 포함하며, 상기 진공부는 내측이 진공상태가 됨에 따라 상기 터치센서 판넬이 상기 진공부의 내측면과 동일한 형상으로 형성되도록 이루어지는 것인 반구형 터치센서 판넬의 진공 열성형 장치를 제공한다.In order to achieve the above technical problem, an embodiment of the present invention is a fixing unit provided to fix the touch sensor panel; A vacuum unit coupled to the fixed unit; And a heater part provided to move to an upper portion of the touch sensor panel to apply heat to the touch sensor panel, wherein the vacuum part has the same shape as the inner surface of the vacuum part as the inside of the vacuum part becomes a vacuum state. It provides a vacuum thermoforming device of the hemispherical touch sensor panel to be formed as.
본 발명의 일실시예에 있어서, 상기 고정부는, 중앙에 하부 관통공이 형성되는 하부 고정판; 상기 하부 고정판의 상부에 힌지 결합되며, 상부 관통공을 갖는 상부 고정판; 및 상기 고정판을 폐쇄된 상태로 고정하는 토글 클램프를 포함하는 것을 특징으로 할 수 있다.In one embodiment of the present invention, the fixing portion, the lower fixing plate is formed with a lower through hole in the center; An upper fixing plate hinged to an upper portion of the lower fixing plate and having an upper through hole; And it may be characterized in that it comprises a toggle clamp for fixing the fixing plate in a closed state.
본 발명의 일실시예에 있어서, 상기 진공부는, 상기 하부 관통공에 결합되며, 상면 중앙에 오목면이 마련되는 히터블록; 및 상기 오목면에 마련된 진공홀과 연결된 진공 펌프를 포함하며, 상기 진공 펌프는 상기 진공홀을 통해 상기 오목면과 상기 터치센서 판넬 사이에 위치한 공기를 외부로 배출시키는 것을 특징으로 할 수 있다.In one embodiment of the present invention, the vacuum unit, the heater block is coupled to the lower through hole, the concave surface is provided in the center of the upper surface; And a vacuum pump connected to a vacuum hole provided in the concave surface, wherein the vacuum pump discharges air located between the concave surface and the touch sensor panel through the vacuum hole to the outside.
본 발명의 일실시예에 있어서, 상기 히터블록의 오목면은 반구형인 것을 특징으로 할 수 있다.In one embodiment of the present invention, the concave surface of the heater block may be characterized in that hemispherical.
본 발명의 일실시예에 있어서, 상기 진공홀은 상기 오목면의 최외곽에 하나 이상 형성되며, 복수의 상기 진공홀의 공기 흡입압은 균등하게 유지되는 것을 특징으로 할 수 있다.In one embodiment of the present invention, at least one vacuum hole is formed in the outermost of the concave surface, the air suction pressure of the plurality of vacuum holes may be characterized in that it is maintained evenly.
본 발명의 일실시예에 있어서, 상기 오목면의 최외곽은 곡면 처리되는 것을 특징으로 할 수 있다.In one embodiment of the present invention, the outermost portion of the concave surface may be characterized in that the curved surface.
본 발명의 일실시예에 있어서, 상기 히터부는, 가열 기능을 갖는 히터모듈; 및 상기 히터모듈의 일측에 마련되는 이송모듈을 포함하며, 상기 이송모듈은 상기 히터모듈을 좌측 또는 우측으로 이동시키는 것을 특징으로 할 수 있다.In one embodiment of the present invention, the heater unit, a heater module having a heating function; And a transfer module provided at one side of the heater module, wherein the transfer module moves the heater module to the left or the right.
본 발명의 일실시예에 있어서, 상기 히터모듈 및 상기 히터블록의 온도 및 가열 시간을 개별적으로 조절하고, 상기 진공 펌프의 진공 압력 및 시간을 조절하는 제어부를 더 포함하는 것을 특징으로 할 수 있다.In one embodiment of the present invention, the heater module and the heater block may be further characterized in that it further comprises a control unit for adjusting the temperature and heating time, and the vacuum pressure and time of the vacuum pump.
본 발명의 일실시예에 있어서, 상기 터치센서 판넬은 베이스 판재 및 상기 베이스 판재의 상면에 형성되는 투명도전층을 포함하는 것을 특징으로 할 수 있다.In one embodiment of the present invention, the touch sensor panel may be characterized in that it comprises a base plate and a transparent conductive layer formed on the upper surface of the base plate.
상기에서 설명한 본 발명에 따른 반구형 터치센서 판넬의 진공 열성형 장치의 효과를 설명하면 다음과 같다.The effect of the vacuum thermoforming apparatus of the hemispherical touch sensor panel according to the present invention described above is as follows.
본 발명에 따르면, 플랫한 형상의 터치센서 판넬을 반구형으로 성형할 수 있다.According to the present invention, the flat shape of the touch sensor panel can be molded into a hemispherical shape.
그리고, 초보자도 제어부를 이용하여 손쉽게 터치센서 판넬을 반구형으로 성형할 수 있다.In addition, even a beginner can easily form a hemispherical touch sensor panel using a control unit.
또한, 본 발명에 따르면, 제어부에 의해 히터블록 및 히터의 가열 온도 그리고, 진공 펌프의 진공 압력 및 시간을 개별적으로 제어하는 것이 가능하여, 터치센서 판넬의 재질에 맞춰 터치센서 판넬을 반구형으로 성형할 수 있다. In addition, according to the present invention, it is possible to individually control the heating temperature of the heater block and the heater, and the vacuum pressure and time of the vacuum pump by the control unit, so that the touch sensor panel can be formed into a hemispherical shape according to the material of the touch sensor panel. Can be.
또한, 본 발명에 따르면, 균일한 품질의 반구형 터치센서 판넬을 제조할 수 있다. 구체적으로, 종래의 제품은 국부적으로 열변형을 가하고 가압하여 곡률을 얻기 때문에 제조 공정 상 열변형 위치에 따라 굴곡 편차가 발생할 수 있었다. 그러나, 본 발명은 진공부의 내측이 진공 상태가 됨에 따라 가열된 터치센서 판넬이 오목면에 접하면서 진공부의 오목면과 동일한 형상의 터치센서 판넬을 얻을 수 있다.In addition, according to the present invention, it is possible to manufacture a hemispherical touch sensor panel of uniform quality. Specifically, since the conventional product is locally subjected to heat deformation and pressurization to obtain a curvature, the bending deviation may occur according to the heat deformation position in the manufacturing process. However, the present invention can obtain a touch sensor panel having the same shape as the concave surface of the vacuum portion while the heated touch sensor panel contacts the concave surface as the inside of the vacuum portion becomes a vacuum state.
본 발명의 효과는 상기한 효과로 한정되는 것은 아니며, 본 발명의 상세한 설명 또는 특허청구범위에 기재된 발명의 구성으로부터 추론 가능한 모든 효과를 포함하는 것으로 이해되어야 한다.The effects of the present invention are not limited to the above-described effects, but should be understood to include all the effects deduced from the configuration of the invention described in the detailed description or claims of the present invention.
도 1은 본 발명의 일실시예에 따른 반구형 터치센서 판넬의 진공 열성형 장치의 사시도이다.1 is a perspective view of a vacuum thermoforming apparatus of a hemispherical touch sensor panel according to an embodiment of the present invention.
도 2는 본 발명의 일실시예에 따른 반구형 터치센서 판넬의 진공 열성형 장치에 터치센서 판넬을 장착한 상태를 나타낸 사시도이다.2 is a perspective view illustrating a state in which a touch sensor panel is mounted on a vacuum thermoforming apparatus of a hemispherical touch sensor panel according to an exemplary embodiment of the present invention.
도 3은 본 발명의 일실시예에 따른 반구형 터치센서 판넬의 진공 열성형 장치의 히터부를 터치센서 판넬의 상부에 위치시킨 상태를 나타낸 사시도이다.Figure 3 is a perspective view showing a state in which the heater portion of the vacuum thermoforming apparatus of the hemispherical touch sensor panel according to an embodiment of the present invention is located on the touch sensor panel.
도 4는 본 발명의 일실시예에 따른 반구형 터치센서 판넬의 진공 열성형 장치의 정면도이다.Figure 4 is a front view of the vacuum thermoforming apparatus of the hemispherical touch sensor panel according to an embodiment of the present invention.
도 5는 본 발명의 일실시예에 따른 반구형 터치센서 판넬의 진공 열성형 장치의 진공부와 터치센서 판넬을 나타낸 단면도이다.5 is a cross-sectional view showing a vacuum unit and a touch sensor panel of the vacuum thermoforming apparatus of the hemispherical touch sensor panel according to an embodiment of the present invention.
도 6은 본 발명의 일실시예에 따른 반구형 터치센서 판넬의 진공 열성형 장치의 사시도와 반구형의 터치센서 판넬을 나타낸 확대도이다.6 is an enlarged view illustrating a perspective view of a vacuum thermoforming apparatus of a hemispherical touch sensor panel and a hemispherical touch sensor panel according to an embodiment of the present invention.
이하에서는 첨부한 도면을 참조하여 본 발명을 설명하기로 한다. 그러나 본 발명은 여러 가지 상이한 형태로 구현될 수 있으며, 따라서 여기에서 설명하는 실시예로 한정되는 것은 아니다. 그리고 도면에서 본 발명을 명확하게 설명하기 위해서 설명과 관계없는 부분은 생략하였으며, 명세서 전체를 통하여 유사한 부분에 대해서는 유사한 도면 부호를 붙였다.Hereinafter, with reference to the accompanying drawings will be described the present invention. As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention. In the drawings, parts irrelevant to the description are omitted in order to clearly describe the present invention, and like reference numerals designate like parts throughout the specification.
명세서 전체에서, 어떤 부분이 다른 부분과 "연결"되어 있다고 할 때, 이는 "직접적으로 연결"되어 있는 경우뿐 아니라, 그 중간에 다른 부재를 사이에 두고 "간접적으로 연결"되어 있는 경우도 포함한다. 또한, 어떤 부분이 어떤 구성요소를 "포함"한다고 할 때, 이는 특별히 반대되는 기재가 없는 한 다른 구성요소를 제외하는 것이 아니라 다른 구성요소를 더 구비할 수 있다는 것을 의미한다.Throughout the specification, when a part is "connected" to another part, it includes not only "directly connected" but also "indirectly connected" with another member in between. . In addition, when a part is said to "include" a certain component, this means that unless otherwise stated, it may further include other components rather than excluding the other components.
이하 첨부된 도면을 참고하여 본 발명의 실시예를 상세히 설명하기로 한다.Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.
도 1은 본 발명의 일실시예에 따른 반구형 터치센서 판넬의 진공 열성형 장치의 사시도이고, 도 2는 본 발명의 일실시예에 따른 반구형 터치센서 판넬의 진공 열성형 장치에 터치센서 판넬을 장착한 상태를 나타낸 사시도이며, 도 3은 본 발명의 일실시예에 따른 반구형 터치센서 판넬의 진공 열성형 장치의 히터부를 터치센서 판넬의 상부에 위치시킨 상태를 나타낸 사시도이다.1 is a perspective view of a vacuum thermoforming apparatus of a hemispherical touch sensor panel according to an embodiment of the present invention, Figure 2 is a touch sensor panel mounted on the vacuum thermoforming apparatus of a hemispherical touch sensor panel according to an embodiment of the present invention. 3 is a perspective view showing a state, Figure 3 is a perspective view showing a state in which the heater portion of the vacuum thermoforming apparatus of the hemispherical touch sensor panel according to an embodiment of the present invention located on the touch sensor panel.
도 1 내지 도 3에 도시된 바와 같이, 반구형 터치센서 판넬의 진공 열성형 장치(100)에는 몸체를 형성하는 케이스(110)와 케이스(110)의 하부에 마련되는 바퀴(120)가 구비되며, 고정부(200), 히터부(300) 및 진공부(400)를 포함한다.1 to 3, the vacuum thermoforming apparatus 100 of the hemispherical touch sensor panel is provided with a case 110 forming a body and a wheel 120 provided under the case 110. The fixing part 200, the heater part 300, and the vacuum part 400 are included.
고정부(200)는 중앙에 원형의 관통공(215,225)이 형성되며, 내측에 터치센서 판넬(P)이 고정 가능하도록 마련된다.The fixing part 200 has circular through holes 215 and 225 formed in the center thereof, and is provided to be able to fix the touch sensor panel P inside.
히터부(300)는 터치센서 판넬(P)의 상부로 이동되어 터치센서 판넬(P)에 열을 가하도록 마련된다.The heater unit 300 is provided to move to the upper portion of the touch sensor panel (P) to apply heat to the touch sensor panel (P).
진공부(400)는 터치센서 판넬(P)의 하부에 배치되되 고정부(200)에 결합되어 진공부(400)의 내측이 진공상태가 됨에 따라 진공부(400)의 내측면과 동일한 형상으로 터치센서 판넬(P)이 성형되도록 마련된다.The vacuum unit 400 is disposed below the touch sensor panel P and is coupled to the fixing unit 200 so that the inside of the vacuum unit 400 is in a vacuum state, so that the vacuum unit 400 has the same shape as the inner surface of the vacuum unit 400. The touch sensor panel P is provided to be molded.
이하, 각 구성을 구체적으로 설명하도록 한다.Hereinafter, each configuration will be described in detail.
먼저, 고정부(200)는 하부 고정판(210), 상부 고정판(220) 및 토글 클램프(240)를 포함한다.First, the fixing part 200 includes a lower fixing plate 210, an upper fixing plate 220, and a toggle clamp 240.
하부 고정판(210)은 반구형 터치센서 판넬의 진공 열성형 장치(100)의 몸체를 형성하는 케이스(110)의 상면 일측에 마련된다.The lower fixing plate 210 is provided on one side of the upper surface of the case 110 forming the body of the vacuum thermoforming apparatus 100 of the hemispherical touch sensor panel.
그리고, 하부 고정판(210)은 중앙에 진공부(400)가 삽입 가능한 하부 관통공(215)이 형성된다. 이 때, 하부 관통공(215)의 크기는 후술할 히터블록(410)이 삽입되어 고정될 수 있는 크기로 형성되는 것이 바람직하다. 또한, 하부 관통공(215)은 하부 관통공(215)의 하면과 접하는 위치에 있는 케이스(110)를 관통하여 형성된다. 이처럼 마련된 하부 고정판(210)의 상면과 히터블록(410)의 상면은 단차가 없이 매끄러운 표면을 갖도록 결합된다.The lower fixing plate 210 has a lower through hole 215 into which the vacuum part 400 can be inserted. At this time, the size of the lower through hole 215 is preferably formed to a size that can be fixed by inserting the heater block 410 to be described later. In addition, the lower through hole 215 penetrates through the case 110 at a position in contact with the lower surface of the lower through hole 215. The upper surface of the lower fixing plate 210 and the heater block 410 provided as described above are combined to have a smooth surface without a step.
상부 고정판(220)은 하부 고정판(210)의 상부에 마련되며, 상부 고정판(220)과 하부 고정판(210)은 양측에 마련된 힌지부(230)에 의해 힌지 결합된다. The upper fixing plate 220 is provided above the lower fixing plate 210, and the upper fixing plate 220 and the lower fixing plate 210 are hinged by hinge parts 230 provided at both sides.
그리고, 상부 고정판(220)은 중앙에 원형의 상부 관통공(225)이 형성되며, 이 때, 상부 관통공(225)의 형상은 후술할 오목면(415)의 직경과 동일한 직경을 갖는 원형으로 마련됨이 바람직하다.In addition, the upper fixing plate 220 has a circular upper through hole 225 formed in the center, and in this case, the shape of the upper through hole 225 is a circular shape having the same diameter as the diameter of the concave surface 415 to be described later. It is preferable to provide.
또한, 상부 고정판(220)의 전면에는 손잡이(222)가 마련될 수 있다.In addition, a handle 222 may be provided on the front surface of the upper fixing plate 220.
토글 클램프(240)는 상부 고정판(220)의 전면에 한 쌍으로 마련될 수 있으며, 토글 클램프(240)는 상부 고정판(220)과 하부 고정판(210)의 사이에 터치센서 판넬(P)이 삽입된 상태에서 상부 고정판(220)이 움직이지 못하도록 고정할 수 있다. Toggle clamp 240 may be provided in a pair on the front of the upper fixing plate 220, the toggle clamp 240 is a touch sensor panel (P) is inserted between the upper fixing plate 220 and the lower fixing plate (210). The upper fixing plate 220 may be fixed so as not to move.
한편, 터치센서 판넬(P)은 열에 의한 변형이 이루어지는 플랫 형상의 베이스 판재와 베이스 판재의 상면에 형성되는 투명도전층을 포함할 수 있다.On the other hand, the touch sensor panel (P) may include a flat base plate and the transparent conductive layer formed on the upper surface of the base plate deformation is made by heat.
그리고, 투명도전층은 탄소 나노버드(Carbon NanoBud)와 같이, 외부 접촉에 의한 정전용량 변화를 감지함과 동시에, 열 변형에 의한 면저항 및 특성변화가 없는 소재로 구성되는 것이 바람직하다.In addition, the transparent conductive layer is preferably made of a material that detects capacitance change due to external contact, such as carbon nanobud, and has no sheet resistance and characteristic change due to thermal deformation.
또한, 터치센서 판넬(P)의 투명도전층 상에는 PC(polycarbonate), PET 및 아크릴 소재의 터치센싱용 필름이 더 형성될 수 있다. In addition, on the transparent conductive layer of the touch sensor panel P, a touch sensing film of polycarbonate (PC), PET, and acrylic material may be further formed.
터치센서 판넬(P)은 상기와 같이, 베이스 판재, 투명도전층 및 터치센싱용 필름이 적층되어 본딩이 완료된 상태의 반제품일 수 있다.As described above, the touch sensor panel P may be a semi-finished product in which a base plate, a transparent conductive layer, and a film for touch sensing are laminated and bonded to each other.
한편, 히터부(300)는 히터모듈(310) 및 이송모듈(320)을 포함한다.On the other hand, the heater unit 300 includes a heater module 310 and the transfer module 320.
히터모듈(310)은 가열 기능을 갖으며, 이송모듈(320)은 히터모듈(310)의 후방에 마련되어 히터모듈(310)을 좌측 또는 우측으로 이동시킬 수 있다. The heater module 310 has a heating function, and the transfer module 320 may be provided at the rear of the heater module 310 to move the heater module 310 to the left or the right.
이하, 구체적으로 각 구성을 설명하도록 한다.Hereinafter, each configuration will be described in detail.
먼저, 히터모듈(310)은 히터(311), 손잡이(312) 및 연결부재(313)를 포함한다.First, the heater module 310 includes a heater 311, a handle 312, and a connection member 313.
히터(311)에는 가열 수단이 내장되며, 케이스(110)의 상부에 마련된다. 그리고, 히터(311)의 상면에는 손잡이(312)가 돌출 형성될 수 있으며, 히터(311)의 일측에는 연결부재(313)가 마련된다.The heater 311 has a built-in heating means and is provided on the case 110. In addition, a handle 312 may protrude from an upper surface of the heater 311, and a connection member 313 is provided at one side of the heater 311.
연결부재(313)는 히터(311)의 일측에서 상방으로 소정의 길이만큼 연장 형성되고, 일단이 후방으로 수직 연장된 형태로 마련될 수 있다.The connection member 313 is formed to extend upward from a side of the heater 311 by a predetermined length, and may be provided in a form in which one end is vertically extended to the rear.
이송모듈(320)은 지지부재(321), 가이드레일(322) 및 블록(323)을 포함한다.The transfer module 320 includes a support member 321, a guide rail 322, and a block 323.
지지부재(321)는 히터(311)의 후방에 위치하며, 케이스(110)의 상면에 고정되어 마련된다. The support member 321 is located behind the heater 311 and is fixed to the upper surface of the case 110.
가이드레일(322)은 지지부재(321)의 전면에 마련되되, 지지부재(321)의 길이 방향으로 연장되어 형성된다. 그리고, 가이드레일(322)은 히터(311)의 후면에 마련된 결합부재(미도시)와 결합된다. 즉, 히터모듈(310)은 결합부재와 가이드레일(322)이 서로 슬라이딩되며 이동됨으로 일직선상에서 이동이 가능하다.The guide rail 322 is provided on the front surface of the support member 321 and extends in the longitudinal direction of the support member 321. And, the guide rail 322 is coupled to the coupling member (not shown) provided on the back of the heater 311. That is, the heater module 310 is movable in a straight line as the coupling member and the guide rail 322 slide and move with each other.
블록(323)은 일측이 개방된 체인(Chain) 형상으로 이루어지며, 일면이 지지부재(321)의 상부에 안착된다. 그리고, 블록(323)은 지지부재(321)의 길이 방향으로 연장되며, 일단부가 연결부재(313)의 상면에 고정된다. 블록(323)은 히터모듈(310)의 움직임에 따라, 지지부재(321)에 접하는 면적이 가변한다. Block 323 is made of a chain (Chain) shape of one side is open, one surface is seated on the upper portion of the support member 321. The block 323 extends in the longitudinal direction of the supporting member 321, and one end thereof is fixed to the upper surface of the connecting member 313. Block 323 has a variable area in contact with the support member 321 according to the movement of the heater module 310.
일 예로, 도 3에 도시된 바와 같이, 히터모듈(310)이 좌측으로 움직이면, 연결부재(313)에 고정된 블록(323)의 일단이 좌측으로 이동하며 체인 형상의 블록(323)을 좌측으로 회전시키듯이 이동시킨다. 이에 따라, 지지부재(321)에 블록(323)이 접하는 면적이 순차적으로 증가하게 된다.For example, as shown in FIG. 3, when the heater module 310 moves to the left side, one end of the block 323 fixed to the connecting member 313 moves to the left side and the chain-shaped block 323 moves to the left side. Move it as you rotate it. Accordingly, the area where the block 323 is in contact with the support member 321 is increased sequentially.
또한, 지지부재(321)의 양단에는 전방으로 돌출되어 형성되는 이탈 방지부(미도시)가 더 형성될 수 있다. 이러한 이탈 방지부는 가이드레일(322)을 따라 이동하는 히터모듈(310)이 가이드레일(322)로부터 이탈하는 것을 방지하도록 마련될 수 있다. 그리고, 히터모듈(310)은 지지부재(321)의 양측에 위치한 이탈 방지부에 접하였을 때, 각각 고정부(200) 또는 보조판(330)의 상부에 위치하도록 마련되는 것이 바람직하다.In addition, both ends of the support member 321 may be further formed a departure prevention portion (not shown) protruding forward. The departure prevention part may be provided to prevent the heater module 310 moving along the guide rail 322 from being separated from the guide rail 322. In addition, the heater module 310 is preferably provided so as to be positioned above the fixing part 200 or the auxiliary plate 330 when the heater module 310 is in contact with the separation prevention parts located on both sides of the support member 321.
상술한 바와 같이 마련된 이송모듈(320)은 일실시예에 한정되지 않고, 리니어 모션 가이드(Linear Motion Guide)의 형태로 마련되는 것과 히터모듈(310)을 좌측 또는 우측으로 일직선상에서 이동하도록 마련된 것을 모두 포함할 수 있다.The transfer module 320 provided as described above is not limited to one embodiment, and is provided in the form of a linear motion guide and both the heater module 310 and the heater module 310 are provided to move in a straight line to the left or the right. It may include.
보조판(330)은 케이스(110)의 상면 타측에 마련되며, 특히, 작업이 완료된 히터모듈(310)이 우측으로 이동하였을 때, 히터모듈(310)의 하부에 보조판(330)이 위치하도록 마련되는 것이 바람직하다. 이 때, 보조판(330)은 작업이 완료된 히터(311)로부터 발생하는 잔열이 케이스(110)에 손상을 주지 않도록 보호할 수 있다.The auxiliary plate 330 is provided on the other side of the upper surface of the case 110, and in particular, when the heater module 310 is completed to move to the right side, the auxiliary plate 330 is provided to be located under the heater module 310. It is preferable. In this case, the auxiliary plate 330 may protect the case 110 from the residual heat generated from the heater 311 is completed.
한편, 도 4는 본 발명의 일실시예에 따른 반구형 터치센서 판넬의 진공 열성형 장치의 정면도이다.On the other hand, Figure 4 is a front view of the vacuum thermoforming apparatus of the hemispherical touch sensor panel according to an embodiment of the present invention.
도 4를 참조하여 구체적으로 설명하면, 진공부(400)는 히터블록(410) 및 진공 펌프(420)를 포함한다.Specifically, referring to FIG. 4, the vacuum unit 400 includes a heater block 410 and a vacuum pump 420.
히터블록(410)은 전체적으로, 사각의 박스 형상으로 이루어질 수 있으며, 히터블록(410)은 하부 고정판(210)의 하부 관통공(215)에 결합되어 고정된다. The heater block 410 may be generally formed in a rectangular box shape, and the heater block 410 is coupled to and fixed to the lower through hole 215 of the lower fixing plate 210.
그리고, 히터블록(410)의 상면 중앙에는 오목면(415)이 형성된다. 이 때, 오목면(415)은 성형하고자 하는 터치센서 판넬(P)의 형상과 동일하게 마련된다. A concave surface 415 is formed at the center of the upper surface of the heater block 410. At this time, the concave surface 415 is provided in the same shape as the shape of the touch sensor panel (P) to be molded.
일 예로 일실시예에서는 터치센서 판넬(P)을 반구형으로 성형하기 위해서 오목면(415)을 오목한 반구형으로 마련할 수 있다.For example, in one embodiment, in order to form the touch sensor panel P into a hemispherical shape, the concave surface 415 may be provided in a concave hemispherical shape.
그리고, 오목면(415)의 상면의 최외곽에는 하나 이상의 진공홀(416)이 형성된다. 여기서 오목면(415)의 최외곽이란, 상부 고정판(220)과 접하는 히터블록(410)의 상면에서 오목면(415)이 시작되는 부분을 지칭한다.At least one vacuum hole 416 is formed at the outermost side of the upper surface of the concave surface 415. Here, the outermost part of the concave surface 415 refers to a portion where the concave surface 415 starts on the upper surface of the heater block 410 in contact with the upper fixing plate 220.
진공홀(416)은 오목면(415)의 상면 최외곽에 위치시킴으로써, 터치센서 판넬(P)을 반구형으로 성형하는 과정에서 진공홀(416)에 의해 터치센서 판넬(P)에 발생하는 돌출 부분이 최소화되도록 할 수 있다. 그리고, 진공홀(416)은 하나 이상으로 마련되되 진공홀(416)의 크기 및 개수는 최소로 하는 것이 바람직하다.The vacuum hole 416 is located at the outermost top of the concave surface 415, so that the protruding portion generated in the touch sensor panel P by the vacuum hole 416 in the process of forming the touch sensor panel P into a hemispherical shape. This can be minimized. In addition, one or more vacuum holes 416 may be provided, but the size and number of the vacuum holes 416 may be minimized.
또한, 오목면(415)의 최외곽은 터치센서 판넬(P)에 열과 압력이 가해져 반구형이 될 때, 반구형의 외곽에 손상이 가지 않도록 곡면 처리될 수 있다.In addition, the outermost portion of the concave surface 415 may be curved to prevent damage to the outer edge of the hemispherical shape when heat and pressure is applied to the touch sensor panel P to become hemispherical.
그리고, 오목면(415)에 마련되는 복수의 진공홀(416)은 서로 대칭되는 위치에 마련되는 것이 바람직하며, 각 진공홀(416)은 서로 균등한 공기 흡입압을 갖도록 한다.In addition, the plurality of vacuum holes 416 provided on the concave surface 415 may be provided at positions symmetrical with each other, and each vacuum hole 416 may have an air suction pressure equal to each other.
일실시예에서는 진공홀(416)의 개수를 네 개로 도시 하였으나, 진공홀(416)의 개수는 이에 한정되지 않으며, 각 진공홀(416)의 위치는 각 진공홀(416)이 균등한 공기 흡입압을 유지할 수 있도록 서로 대칭되는 위치에 마련된다면, 모두 일실시예에 포함된다.In one embodiment, the number of the vacuum holes 416 is illustrated as four, but the number of the vacuum holes 416 is not limited thereto, and the positions of the vacuum holes 416 are equal to each vacuum hole 416. If provided in positions symmetrical with each other to maintain the pressure, all are included in one embodiment.
또한, 오목면(415)은 열전도율이 우수한 금속 재질로 구성되고, 히터블록(410) 중 오목면(415)을 제외한 부분은 열전도율이 낮은 재질로 구성되는 것이 바람직하다. 그리고, 하부 고정판(210) 및 상부 고정판(220) 역시, 열전도율이 낮은 금속 재질로 이루어지는 것이 바람직하다.In addition, the concave surface 415 is made of a metal material having excellent thermal conductivity, and the portion of the heater block 410 except for the concave surface 415 is preferably made of a material having low thermal conductivity. In addition, the lower fixing plate 210 and the upper fixing plate 220 may also be made of a metal material having low thermal conductivity.
즉, 터치센서 판넬(P)은 히터부(300) 및 히터블록(410)에 의해 가열 시, 히터부(300)와 히터블록(410)에 직접적으로 노출되는 원형 부분만 가열 및 성형되도록 마련된다.That is, when the touch sensor panel P is heated by the heater 300 and the heater block 410, only the circular portion directly exposed to the heater 300 and the heater block 410 is provided to be heated and molded. .
진공 펌프(420)는 히터블록(410)의 진공홀(416)과 연결되며, 히터블록(410)의 하부에 마련될 수 있다.The vacuum pump 420 may be connected to the vacuum hole 416 of the heater block 410 and may be provided below the heater block 410.
진공 펌프(420)는 제어부(500)와 진공홀(416)을 통해 오목면(415)과 터치센서 판넬(P) 사이에 위치한 공기를 외부로 배출시킨다.The vacuum pump 420 discharges the air located between the concave surface 415 and the touch sensor panel P to the outside through the control unit 500 and the vacuum hole 416.
구체적으로, 사용자가 제어부(500)에 진공홀(416)의 공기 흡입압인 진공 압력을 입력하고, 오목면(415)과 터치센서 판넬(P) 사이의 공간을 진공으로 만드는 소요 시간을 입력하면, 진공 펌프(420)는 제어부(500)에 입력된 바에 따라, 진공홀(416)을 통해 오목면(415)과 터치센서 판넬(P) 사이의 공기를 흡입하여 진공상태로 만든다.Specifically, when the user inputs the vacuum pressure which is the air suction pressure of the vacuum hole 416 into the control unit 500, and inputs the time required to make the space between the concave surface 415 and the touch sensor panel P into a vacuum, As the vacuum pump 420 is input to the controller 500, the vacuum pump 420 sucks air between the concave surface 415 and the touch sensor panel P through the vacuum hole 416 to make a vacuum state.
부가적으로, 히터블록(410)의 내부에는 가열 수단(미도시)이 마련될 수 있으며, 오목면(415)을 가열할 수 있다. 그리고, 가열 수단은 제어부(500)에 의해 온도 및 가열시간이 제어된다.In addition, a heating means (not shown) may be provided inside the heater block 410, and the concave surface 415 may be heated. In the heating means, the temperature and the heating time are controlled by the controller 500.
한편, 반구형 터치센서 판넬의 진공 열성형 장치(100)는 제어부(500)를 더 포함한다.Meanwhile, the vacuum thermoforming apparatus 100 of the hemispherical touch sensor panel further includes a controller 500.
제어부(500)는 케이스(110)의 전면 상부에 마련될 수 있으며, 제어부(500)는 히터모듈(310) 및 히터블록(410)의 온도 및 가열 시간을 개별적으로 조절할 수 있다.The controller 500 may be provided at the upper front of the case 110, and the controller 500 may individually adjust the temperature and the heating time of the heater module 310 and the heater block 410.
즉, 제어부(500)는 히터모듈(310)과 히터블록(410)이 터치센서 판넬(P)에 열을 가할 온도 및 열을 가하는 시간을 조절할 수 있다.That is, the controller 500 may adjust the temperature at which the heater module 310 and the heater block 410 apply heat to the touch sensor panel P and the time for applying heat.
또한, 제어부(500)는 진공 펌프(420)의 진공 압력 및 시간을 조절하는 것이 가능하다. 구체적으로, 제어부(500)는 진공 펌프(420)가 오목면(415)과 터치센서 판넬(P) 사이에 위치하는 공기를 진공홀(416)을 통해서 배출하는 압력 및 시간을 조절할 수 있다.In addition, the controller 500 may adjust the vacuum pressure and time of the vacuum pump 420. Specifically, the controller 500 may adjust the pressure and time for the vacuum pump 420 to discharge the air located between the concave surface 415 and the touch sensor panel P through the vacuum hole 416.
도 5는 본 발명의 일실시예에 따른 반구형 터치센서 판넬의 진공 열성형 장치의 진공부와 터치센서 판넬을 나타낸 단면도이고, 도 6은 본 발명의 일실시예에 따른 반구형 터치센서 판넬의 진공 열성형 장치의 사시도와 반구형의 터치센서 판넬을 나타낸 확대도이다.5 is a cross-sectional view showing a vacuum unit and a touch sensor panel of the vacuum thermoforming apparatus of the hemispherical touch sensor panel according to an embodiment of the present invention, Figure 6 is a vacuum column of the hemispherical touch sensor panel according to an embodiment of the present invention An enlarged view showing a perspective view of a molding apparatus and a hemispherical touch sensor panel.
이하, 도 1 내지 도 6을 순서대로 참조하여 전술한 구성의 작동관계를 설명하도록 한다.Hereinafter, the operation relationship of the above-described configuration will be described with reference to FIGS. 1 to 6.
먼저, 제어부(500)를 이용하여 히터모듈(310)과 히터블록(410)이 터치센서 판넬(P)에 가할 온도 및 가열 시간을 설정하고, 진공 펌프(420)의 진공 압력 및 소요 시간을 설정한다. 그리고, 히터모듈(310)과 히터블록(410)이 설정된 온도에 도달하여 유지될 때까지 대기한다. 이처럼 할 경우, 터치센서 판넬(P)이 히터모듈(310)과 히터블록(410)로부터 가해지는 입열량을 정확하게 계산할 수 있다. First, the temperature and heating time to be applied to the touch sensor panel P by the heater module 310 and the heater block 410 are set using the controller 500, and the vacuum pressure and the required time of the vacuum pump 420 are set. do. Then, the heater module 310 and the heater block 410 waits until the set temperature is maintained. In this case, the touch sensor panel P can accurately calculate the amount of heat input from the heater module 310 and the heater block 410.
다음, 도 1에 도시된 바와 같이, 손잡이(222)를 이용하여 상부 고정판(220)을 상부로 들어 올린다.Next, as shown in FIG. 1, the upper fixing plate 220 is lifted upward by using the handle 222.
다음, 도 2에 도시된 바와 같이, 터치센서 판넬(P)을 하부 고정판(210)에 안착한 후에, 상부 고정판(220)을 아래로 이동시켜 상부 고정판(220)이 하부 고정판(210)에 접하도록 한다. 그리고, 토글 클램프(240)를 전방으로 회전시켜 상부 고정판(220)에 압력을 가해 고정시킨다.Next, as shown in FIG. 2, after seating the touch sensor panel P on the lower fixing plate 210, the upper fixing plate 220 is moved downward so that the upper fixing plate 220 contacts the lower fixing plate 210. do. Then, the toggle clamp 240 is rotated forward to apply pressure to the upper fixing plate 220 to be fixed.
다음, 도 3 에 도시된 바와 같이, 이송모듈(320)을 이용하여 히터모듈(310)을 고정부(200)의 상부로 이동시킨다. Next, as shown in FIG. 3, the heater module 310 is moved to the upper portion of the fixing part 200 by using the transfer module 320.
다음, 제어부(500)를 작동시켜 히터모듈(310)과 히터블록(410) 기설정된 온도와 가열 시간만큼 터치센서 판넬(P)에 열을 가하도록 한다. 이 때, 제어부(500)는 히터모듈(310)이 터치센서 판넬(P)의 상부로 이동하여 터치센서 판넬(P)에 열을 가하는 순간부터 자동으로 작동하도록 구비될 수도 있다.Next, the control unit 500 is operated to apply heat to the touch sensor panel P by a predetermined temperature and heating time by the heater module 310 and the heater block 410. At this time, the control unit 500 may be provided to automatically operate from the moment the heater module 310 moves to the upper portion of the touch sensor panel (P) to apply heat to the touch sensor panel (P).
또한, 터치센서 판넬(P)은 상부 관통공(225)에 의해 노출된 부분만 가열이 이루어지며, 압력이 가해졌을 때 변형이 이루어질 만큼만 가열이 이루어지는 것이 바람직하다.In addition, the touch sensor panel (P) is heated only the portion exposed by the upper through hole 225, it is preferable that the heating is performed only enough to make a deformation when a pressure is applied.
이처럼, 터치센서 판넬(P)에 대한 가열이 완료되면, 도 4 및 도 5에 도시된 바와 같이, 제어부(500)로부터 기설정된 진공 압력 및 소요 시간에 따라 진공홀(416)을 통해 터치센서 판넬(P)과 오목면(415) 사이에 존재하는 공기가 외부로 배출된다. 즉, 터치센서 판넬(P)과 오목면(415) 사이의 공간이 진공 상태로 변화한다. 그리고, 터치센서 판넬(P)은 진공홀(416)을 통해 공기가 빠져나감에 따라 오목면(415)의 내측면에 접하게 된다. 즉, 터치센서 판넬(P) 중 가열된 부분이 오목면(415)의 내측면에 접하여 오목면(415)의 형상과 동일한 오목한 반구 형상으로 성형된다.As such, when the heating of the touch sensor panel P is completed, as shown in FIGS. 4 and 5, the touch sensor panel is provided through the vacuum hole 416 according to a preset vacuum pressure and a required time from the controller 500. Air existing between P and the concave surface 415 is discharged to the outside. That is, the space between the touch sensor panel P and the concave surface 415 changes to a vacuum state. Then, the touch sensor panel (P) is in contact with the inner surface of the concave surface 415 as the air escapes through the vacuum hole (416). That is, the heated portion of the touch sensor panel P is formed into a concave hemispherical shape which is in contact with the inner surface of the concave surface 415 in the same shape as the concave surface 415.
다음, 이송모듈(320)을 이용하여 히터모듈(310)을 보조판(330)의 상부로 이동시킨다. 보조판(330)은 히터모듈(310)에서 발생하는 잔열이 케이스(110)와 케이스(110)의 내부에 마련된 장치에 손상을 주지 않도록 보호한다.Next, the heater module 310 is moved to the upper portion of the auxiliary plate 330 by using the transfer module 320. The auxiliary plate 330 protects the residual heat generated from the heater module 310 from damaging the case 110 and a device provided inside the case 110.
다음, 토글 클램프(240)의 손잡이를 상방으로 회전시켜 상부 고정판(220)의 고정을 해제하여 개방한 후에, 성형된 터치센서 판넬(P)을 탈착한다.Next, the handle of the toggle clamp 240 is rotated upward to release the upper fixing plate 220 and open, and then the molded touch sensor panel P is detached.
이러한 과정을 통해, 도 6에 도시된 바와 같이, 반구형 터치센서 판넬의 진공 열성형 장치(100)로부터 탈착된 터치센서 판넬(P)은 오목면(415)과 동일한 형상의 반구형을 이룬다.Through this process, as shown in FIG. 6, the touch sensor panel P detached from the vacuum thermoforming apparatus 100 of the hemispherical touch sensor panel forms a hemispherical shape having the same shape as the concave surface 415.
전술한 바와 같이, 마련된 반구형 터치센서 판넬의 진공 열성형 장치(100)는 터치센서 판넬(P)을 반구형으로 성형하기 용이하다.As described above, the vacuum thermoforming apparatus 100 of the provided hemispherical touch sensor panel is easy to mold the touch sensor panel P into a hemispherical shape.
구체적으로, 제어부(500)에 히터모듈(310)과 히터블록(410)의 가열 온도와 가열 시간 및 진공 펌프(420)의 진공 압력, 및 소요 시간 등을 설정하면, 자동으로 반구형의 터치센서 판넬(P)이 성형되므로 초보자도 용이하게 반구형의 터치센서 판넬(P)을 제조할 수 있다.Specifically, when the heating temperature and heating time of the heater module 310 and the heater block 410, the vacuum pressure of the vacuum pump 420, and the required time are set in the control unit 500, the hemispherical touch sensor panel is automatically set. Since (P) is molded, even a beginner can easily manufacture a hemispherical touch sensor panel (P).
그리고, 제어부(500)는 히터모듈(310)과 히터블록(410)을 각각 개별적으로 제어하는 것이 가능하여, 터치센서 판넬(P)의 재질을 고려하여 작업을 실시하는 것 이 가능하다.In addition, the controller 500 may individually control the heater module 310 and the heater block 410, and may perform work in consideration of the material of the touch sensor panel P. FIG.
또한, 반구형 터치센서 판넬의 진공 열성형 장치(100)는 동일한 형상의 제품을 균일한 품질로 제조할 수 있다. 구체적으로, 종래의 터치센서 판넬의 열성형 장치는 터치센서 판넬에 국부적으로 열과 압력을 가하여 곡률을 만들어야 했기 때문에 균일한 품질이 나오기 어려우나, 반구형 터치센서 판넬의 진공 열성형 장치(100)는 항상 히터블록(410)의 오목면(415)과 동일한 형상의 터치센서 판넬(P)을 제조할 수 있어 균일한 품질의 제품을 얻을 수 있다.In addition, the vacuum thermoforming apparatus 100 of the hemispherical touch sensor panel can manufacture a product of the same shape with a uniform quality. Specifically, the conventional thermoforming device of the touch sensor panel is difficult to produce a uniform quality because the curvature should be made by applying heat and pressure locally to the touch sensor panel, the vacuum thermoforming device 100 of the hemispherical touch sensor panel is always a heater The touch sensor panel P having the same shape as the concave surface 415 of the block 410 may be manufactured to obtain a product having a uniform quality.
전술한 본 발명의 설명은 예시를 위한 것이며, 본 발명이 속하는 기술분야의 통상의 지식을 가진 자는 본 발명의 기술적 사상이나 필수적인 특징을 변경하지 않고서 다른 구체적인 형태로 쉽게 변형이 가능하다는 것을 이해할 수 있을 것이다. 그러므로 이상에서 기술한 실시예들은 모든 면에서 예시적인 것이며 한정적이 아닌 것으로 이해해야만 한다. 예를 들어, 단일형으로 설명되어 있는 각 구성 요소는 분산되어 실시될 수도 있으며, 마찬가지로 분산된 것으로 설명되어 있는 구성 요소들도 결합된 형태로 실시될 수 있다.The foregoing description of the present invention is intended for illustration, and it will be understood by those skilled in the art that the present invention may be easily modified in other specific forms without changing the technical spirit or essential features of the present invention. will be. Therefore, it should be understood that the embodiments described above are exemplary in all respects and not restrictive. For example, each component described as a single type may be implemented in a distributed manner, and similarly, components described as distributed may be implemented in a combined form.
본 발명의 범위는 후술하는 특허청구범위에 의하여 나타내어지며, 특허청구범위의 의미 및 범위 그리고 그 균등 개념으로부터 도출되는 모든 변경 또는 변형된 형태가 본 발명의 범위에 포함되는 것으로 해석되어야 한다.The scope of the present invention is represented by the following claims, and it should be construed that all changes or modifications derived from the meaning and scope of the claims and their equivalents are included in the scope of the present invention.

Claims (9)

  1. 터치센서 판넬을 고정하도록 마련된 고정부;A fixing part provided to fix the touch sensor panel;
    상기 고정부에 결합되는 진공부; 및A vacuum unit coupled to the fixed unit; And
    상기 터치센서 판넬의 상부로 이동하여 상기 터치센서 판넬에 열을 가하도록 마련되는 히터부를 포함하며,A heater unit provided to move to an upper portion of the touch sensor panel to apply heat to the touch sensor panel,
    상기 진공부는 내측이 진공상태가 됨에 따라 상기 터치센서 판넬이 상기 진공부의 내측면과 동일한 형상으로 형성되도록 이루어지는 것인 반구형 터치센서 판넬의 진공 열성형 장치.The vacuum thermoforming apparatus of the hemispherical touch sensor panel, wherein the vacuum part is formed such that the touch sensor panel is formed in the same shape as the inner surface of the vacuum part as the inside of the vacuum part becomes in a vacuum state.
  2. 제 1 항에 있어서, The method of claim 1,
    상기 고정부는,The fixing portion,
    중앙에 하부 관통공이 형성되는 하부 고정판;A lower fixing plate having a lower through hole formed in the center thereof;
    상기 하부 고정판의 상부에 힌지 결합되며, 상부 관통공을 갖는 상부 고정판; 및An upper fixing plate hinged to an upper portion of the lower fixing plate and having an upper through hole; And
    상기 고정판을 폐쇄된 상태로 고정하는 토글 클램프를 포함하는 것을 특징으로 하는 것인 반구형 터치센선 판넬의 열성형 장치.And a toggle clamp for fixing the fixing plate in a closed state.
  3. 제 2 항에 있어서, The method of claim 2,
    상기 진공부는,The vacuum unit,
    상기 하부 관통공에 결합되며, 상면 중앙에 오목면이 마련되는 히터블록; 및A heater block coupled to the lower through hole and having a concave surface in a center of an upper surface thereof; And
    상기 오목면에 마련된 진공홀과 연결된 진공 펌프를 포함하며,It includes a vacuum pump connected to the vacuum hole provided in the concave surface,
    상기 진공 펌프는 상기 진공홀을 통해 상기 오목면과 상기 터치센서 판넬 사이에 위치한 공기를 외부로 배출시키는 것을 특징으로 하는 것인 반구형 터치센서 판넬의 진공 열성형 장치.The vacuum pump is a vacuum thermoforming device of the hemispherical touch sensor panel, characterized in that for discharging the air located between the concave surface and the touch sensor panel to the outside through the vacuum hole.
  4. 제 3 항에 있어서, The method of claim 3, wherein
    상기 히터블록의 오목면은 반구형인 것을 특징으로 하는 것인 반구형 터치센서 판넬의 진공 열성형 장치.Concave surface of the heater block is a vacuum thermoforming device of the hemispherical touch sensor panel, characterized in that hemispherical.
  5. 제 3 항에 있어서, The method of claim 3, wherein
    상기 진공홀은 상기 오목면의 최외곽에 하나 이상 형성되며, 복수의 상기 진공홀의 공기 흡입압은 균등하게 유지되는 것을 특징으로 하는 것인 반구형 터치센서 판넬의 진공 열성형 장치.One or more vacuum holes are formed at the outermost side of the concave surface, and the vacuum suction device of the hemispherical touch sensor panel is characterized in that the air suction pressure of the plurality of vacuum holes is maintained evenly.
  6. 제 3 항에 있어서, The method of claim 3, wherein
    상기 오목면의 최외곽은 곡면 처리되는 것을 특징으로 하는 것인 반구형 터치센서 판넬의 진공 열성형 장치.The outermost portion of the concave surface is a vacuum thermoforming device of the hemispherical touch sensor panel, characterized in that the curved surface treatment.
  7. 제 1 항에 있어서, The method of claim 1,
    상기 히터부는,The heater unit,
    가열 기능을 갖는 히터모듈; 및A heater module having a heating function; And
    상기 히터모듈의 일측에 마련되는 이송모듈을 포함하며,It includes a transfer module provided on one side of the heater module,
    상기 이송모듈은 상기 히터모듈을 좌측 또는 우측으로 이동시키는 것을 특징으로 하는 것인 반구형 터치센서 판넬의 진공 열성형 장치.The transfer module is a vacuum thermoforming device of the hemispherical touch sensor panel, characterized in that for moving the heater module to the left or right.
  8. 제 3 항 또는 제 7 항에 있어서, The method according to claim 3 or 7,
    상기 히터모듈 및 상기 히터블록의 온도 및 가열 시간을 개별적으로 조절하고, 상기 진공 펌프의 진공 압력 및 시간을 조절하는 제어부를 더 포함하는 것을 특징으로 하는 것인 반구형 터치센서 판넬의 진공 열성형 장치.And a control unit for individually adjusting the temperature and the heating time of the heater module and the heater block, and controlling the vacuum pressure and time of the vacuum pump.
  9. 제 1 항에 있어서,The method of claim 1,
    상기 터치센서 판넬은 베이스 판재 및 상기 베이스 판재의 상면에 형성되는 투명도전층을 포함하는 것을 특징으로 하는 것인 반구형 터치센서 판넬의 진공 열성형 장치.The touch sensor panel is a vacuum thermoforming device of a hemispherical touch sensor panel, characterized in that it comprises a base plate and a transparent conductive layer formed on the upper surface of the base plate.
PCT/KR2015/013884 2015-12-16 2015-12-17 Apparatus for vacuum thermoforming semi-spherical touch sensor panel WO2017104868A1 (en)

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