WO2017101792A1 - 相变复合材料及电子设备 - Google Patents

相变复合材料及电子设备 Download PDF

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Publication number
WO2017101792A1
WO2017101792A1 PCT/CN2016/109962 CN2016109962W WO2017101792A1 WO 2017101792 A1 WO2017101792 A1 WO 2017101792A1 CN 2016109962 W CN2016109962 W CN 2016109962W WO 2017101792 A1 WO2017101792 A1 WO 2017101792A1
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WIPO (PCT)
Prior art keywords
phase change
change composite
composite material
heat
resin
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PCT/CN2016/109962
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English (en)
French (fr)
Inventor
崔静娜
罗文海
Original Assignee
比亚迪股份有限公司
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Publication of WO2017101792A1 publication Critical patent/WO2017101792A1/zh

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/02—Materials undergoing a change of physical state when used
    • C09K5/06—Materials undergoing a change of physical state when used the change of state being from liquid to solid or vice versa
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/02—Materials undergoing a change of physical state when used
    • C09K5/06—Materials undergoing a change of physical state when used the change of state being from liquid to solid or vice versa
    • C09K5/066—Cooling mixtures; De-icing compositions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H01L23/4275—Cooling by change of state, e.g. use of heat pipes by melting or evaporation of solids

Definitions

  • the present invention relates to the field of materials, and in particular, to phase change composite materials and electronic devices.
  • the present invention aims to solve at least one of the technical problems in the related art to some extent.
  • the invention proposes a phase change composite.
  • the phase change composite material is coated on a surface of an object to be heat-dissipated, and includes: a binder resin, a phase change heat storage material, and a phase change temperature of the phase change heat storage material is 20 ⁇ 70 ° C.
  • the phase change composite material can be directly coated on the surface of the object to be heat-dissipated, and a uniform heat conduction and heat storage film is formed on the surface of the object to be heat-dissipated, and the heat can be directly transferred to the phase change composite material.
  • phase change composite material is gradually converted from a solid state to a liquid state by heat, thereby absorbing heat from the object to be heat dissipated to the phase change composite material, and at the same time, since the phase change composite material has good heat storage properties, heat is slowly from the phase change composite material. Released, the phase change composite material changes from a liquid state to a solid state. Therefore, the phase change composite material of the embodiment of the present invention absorbs heat from a solid state to a liquid state, and the heat release changes from a liquid state to a solid state, thereby avoiding a temperature caused by an increase in heat.
  • phase change composite material is applied to heat dissipation of an object to be heat-dissipated, and can be directly coated, compared to heat conduction of the metal back plate, heat conduction of the graphite heat sink, heat dissipation of the heat-conductive gel, and heat dissipation of the ice nest.
  • the surface of the heat dissipating object so that it is in direct contact with the object to be dissipated, and there is no air gap between the object to be dissipated,
  • the heat can be directly transmitted from the object to be heat-dissipated to the phase change composite material of the embodiment of the invention, and the heat conduction efficiency is significantly improved; compared with the heat dissipation of the heat pipe, the phase change composite material is applied to the heat dissipation of the object to be heat-dissipated, and the container is not required to be carried.
  • the space is small; compared with the ice nest heat dissipation, the phase change composite material is applied to the heat dissipation of the object to be heat-dissipated, and can realize the rapid heat dissipation of the object to be heat-dissipated.
  • the invention proposes an electronic device.
  • the electronic device comprises: a housing; and at least one of a processor or a battery, the processor or battery being disposed in the housing; wherein the surface of the processor or battery
  • the phase change composite material described above is coated.
  • the phase change composite material of the embodiment of the present invention can be directly coated on the surface of an object to be heat-dissipated, such as the surface of an electronic device processor or a battery, between the object to be heat-dissipated and the phase change composite material of the embodiment of the present invention.
  • the heat can be directly transmitted to the phase change composite material of the embodiment of the invention directly by the object to be dissipated, and the heat conduction efficiency is high, and the phase change composite material of the embodiment of the invention has the advantages of good heat storage performance, and can pass
  • a processor or a battery of an electronic device according to an embodiment of the present invention is coated with the phase change composite material of the embodiment of the present invention, and the processor or battery can operate at a substantially constant temperature to avoid
  • the electronic device has a problem that the battery power of the device is degraded too fast, the dead time is restarted, and the components are deteriorated due to the long-term operation of the electronic device. Therefore, the electronic device of the embodiment of the invention has the advantage of long service life.
  • the invention proposes a processor.
  • the surface of the processor is coated with the phase change composite described above.
  • the phase change composite material of the embodiment of the present invention can be directly coated on the surface of the object to be heat-dissipated, and there is no air gap between the object to be heat-dissipated and the phase change composite material of the embodiment of the present invention, and the heat can be directly radiated.
  • the object is directly transferred to the phase change composite material of the embodiment of the invention, and the heat conduction efficiency is high.
  • the phase change composite material of the embodiment of the invention since the phase change composite material of the embodiment of the invention has the advantages of good heat storage performance, the solid phase can be converted into a liquid state by heat absorption, and the heat is released. The transition from a liquid state to a solid state avoids a sharp rise in temperature due to an increase in heat. Therefore, according to an embodiment of the present invention, the processor of the embodiment of the present invention is coated with the phase change composite material of the embodiment of the present invention, and the processor can operate at a substantially constant temperature, thereby preventing the processor from working for a long time. The device caused by the heat generation causes the device to restart, and the components are deteriorated. Therefore, the processor of the embodiment of the invention has the advantage of long service life.
  • the invention proposes a battery.
  • the surface of the battery is coated with the phase change composite described above.
  • the phase change composite material of the embodiment of the present invention can be directly coated on the surface of the object to be heat-dissipated, and there is no air gap between the object to be heat-dissipated and the phase change composite material of the embodiment of the present invention, and the heat can be directly radiated.
  • the object is directly transferred to the phase change composite material of the embodiment of the invention, and the heat conduction efficiency is high.
  • the phase change composite material of the embodiment of the invention since the phase change composite material of the embodiment of the invention has the advantages of good heat storage performance, the solid phase can be converted into a liquid state by heat absorption, and the heat is released. The transition from a liquid state to a solid state avoids a sharp rise in temperature due to an increase in heat. Therefore, according to an embodiment of the present invention, the battery of the embodiment of the present invention is coated with the phase change composite material of the embodiment of the present invention, and the battery can be based on The operation at the constant temperature avoids the problem that the battery is degraded too fast due to the long-term operation of the battery, and thus the battery of the embodiment of the invention has the advantage of long service life.
  • the invention proposes a phase change composite.
  • a phase change composite material according to an embodiment of the present invention is used for coating a surface of an object to be heat-dissipated, and includes: a binder resin, a phase change heat storage material, and a phase change heat storage material phase used.
  • the temperature is changed from 20 to 70 °C.
  • the heat dissipating object may be a processor or a battery of the electronic device.
  • the phase change composite material can be directly coated on a surface of a processor or a battery to be heat-dissipated, such as an electronic device, and a uniform heat conduction and heat storage film is formed on the surface of the object to be heat-dissipated, and the heat can be directly Rapidly transferred to the phase change composite material, the phase change composite material is gradually transformed into a liquid state by heat, thereby absorbing heat from the object to be heat dissipated to the phase change composite material, and at the same time, since the phase change composite material has good heat storage performance, The heat is slowly released from the phase change composite material, and the phase change composite material changes from a liquid state to a solid state.
  • the phase change composite material of the embodiment of the present invention absorbs heat from a solid state to a liquid state, and the heat release changes from a liquid state to a solid state. It avoids the sudden increase of temperature caused by the increase of heat, completes an endothermic and exothermic cycle with the state change of the phase change composite material, effectively absorbs the heat of the object to be dissipated, and effectively realizes the heat dissipation of the object to be dissipated, and at the same time It does not cause excessive temperature rise due to heat absorption.
  • the phase change composite material is applied to heat dissipation of an object to be heat-dissipated, and can be directly coated, compared to heat conduction of the metal back plate, heat conduction of the graphite heat sink, heat dissipation of the heat-conductive gel, and heat dissipation of the ice nest.
  • the surface of the heat dissipating object is in direct contact with the object to be dissipated, and there is no air gap between the object to be dissipated, and the heat can be directly transmitted from the object to be dissipated to the phase change composite material of the embodiment of the invention, and the heat conduction efficiency is significantly improved;
  • the heat pipe heat dissipation, the phase change composite material is applied to the heat dissipation of the object to be heat-dissipated, and the space required for the container is not required to be carried, and the space required is small; compared with the heat dissipation of the ice nest, the phase change composite material is applied to the heat dissipation of the object to be heat-dissipated, and can be realized Rapid heat dissipation of heat sinking objects.
  • the inventors found that the content of the binder resin is 10 to 50 parts by weight, the content of the phase change heat storage material is 25 to 70 parts by weight, and the molding of the binder resin is carried out through a large number of screening experiments.
  • the supporting effect can better match the performance of the endothermic/exothermic phase change of the phase change heat storage material, so that the film forming effect of the phase change composite material of the embodiment of the invention is remarkably improved, thereby further facilitating the present invention.
  • the phase change composite of the embodiment is directly applied to the surface of the object to be heat-dissipated, and the heat conduction and heat storage efficiency are further improved.
  • the phase change heat storage material used may be selected from at least one of paraffin wax, alcohol, and fatty acid, and the phase transition temperature of paraffin, alcohol, and fatty acid is 20 to 70 ° C.
  • paraffin wax, alcohol, and fatty acid In between, paraffin, alcohols, fatty acids It has a good heat absorption and heat release function between 20 and 70 ° C. It can effectively dissipate heat from the object to be dissipated through the endothermic and exothermic cycles without causing a sudden temperature rise.
  • the binder resin used may be selected from at least one of a thermosetting resin and a thermoplastic resin, wherein the thermoplastic resin includes a hydrophilic thermoplastic resin and a lipophilic thermoplastic resin.
  • the type of the thermosetting resin is not particularly limited, and according to an embodiment of the present invention, the thermosetting resin may be selected from at least one of an epoxy resin, an alkyd resin, a polyurethane resin, and a polyester resin.
  • the phase change composite material of the embodiment of the present invention may further include a curing agent when the binder resin is a thermosetting plastic resin, and the curing agent is selected from the group consisting of polyamide, according to an embodiment of the present invention.
  • thermoplastic resin may be selected from, but not limited to, a thermoplastic acrylic resin, a thermoplastic polyurethane resin, a polycarbonate, a methacrylic acid. At least one of ester, polyethylene, cellulose, chlorinated rubber, perchloroethylene, and novolac resin.
  • the phase change composite material of the embodiment of the present invention may further include a film forming aid, according to still other embodiments of the present invention
  • the film-forming auxiliary agent is at least one of the alcohol ester 12, ethylene glycol butyl ether, diethylene glycol butyl ether, dipropylene glycol butyl ether, and propylene glycol butyl ether.
  • a film-forming auxiliary agent such as the alcohol ester 12 can significantly promote the film formation of the hydrophilic thermoplastic resin, and is further advantageous in the embodiment of the present invention.
  • the phase change composite is applied directly to the surface of the object to be cooled.
  • the phase change composite material of the embodiment of the present invention may further comprise: 0.1 to 5 parts by weight of a tackifier, and the inventors have found that 0.1 to 5 parts by weight of a tackifier can be implemented by the present invention.
  • the viscosity of the phase change composite material is improved, thereby facilitating the application viscosity, and is more advantageous for film formation of the phase change composite material of the embodiment of the present invention, and is more convenient for directly coating the phase change composite material of the embodiment of the present invention.
  • the surface of the heat sinking object is improved, thereby facilitating the application viscosity, and is more advantageous for film formation of the phase change composite material of the embodiment of the present invention, and is more convenient for directly coating the phase change composite material of the embodiment of the present invention.
  • the inventors have unexpectedly discovered that the phase change composite material of the embodiment of the present invention may further comprise: 5 to 60 parts by weight of a diluent, and the inventors have found that 5 to 60 parts by weight.
  • the diluent will also be more advantageous for the construction of the phase change composite of the embodiments of the invention, i.e., spraying, printing or brushing.
  • the type of the diluent is not particularly limited, and according to an embodiment of the present invention, the diluent may be selected from, but not limited to, acetone, methyl ethyl ketone, cyclohexanone, benzene, toluene, xylene, n-butanol, styrene, At least one of the deionized water, the phase change composite material of the embodiment of the invention adopts the above diluent, and the construction thereof is more convenient.
  • the phase change conforming material of the embodiment of the invention is more convenient to be directly coated by spraying, printing or brushing. The surface of the object to be cooled.
  • the method comprises: mixing a binder resin, a phase change heat storage material to obtain a phase change composite.
  • the method for preparing a phase change composite material according to an embodiment of the present invention further includes a binder resin, a phase change heat storage material, a tackifier, a diluent, and/or a curing agent, and a film forming aid. Mixing at least one of the agents, In order to obtain a phase change composite.
  • the phase change composite material described above can be efficiently prepared by the method for preparing a phase change composite material according to the embodiment of the present invention, and the binder resin, phase change heat storage material, and tackifier are used.
  • the diluent, the diluent and/or the curing agent and the film-forming auxiliary agent are materials well known to those skilled in the art, and are convenient to take.
  • the method of the embodiment of the present invention only needs to be mixed by stirring.
  • the phase change composite material of the embodiment of the invention can be obtained, and the operation is simple.
  • the phase change composite material prepared by the preparation method of the embodiment of the present invention can be directly coated on the surface of the object to be heat-dissipated, and a uniform heat conduction and heat storage film is formed on the surface of the object to be heat-dissipated.
  • a uniform heat conduction and heat storage film is formed on the surface of the object to be heat-dissipated.
  • the heat dissipating object is absorbed into the phase change composite material, and at the same time, since the obtained phase change composite material has good heat storage performance, heat is slowly released from the phase change composite material, and the phase change composite material changes from a liquid state to a solid state.
  • the phase change composite material prepared by the preparation method of the invention has the endothermic transition from a solid state to a liquid state, and the exothermic change from a liquid state to a solid state, thereby avoiding a sharp rise in temperature due to an increase in heat, and a phase change composite material.
  • the state change completes an endothermic and exothermic cycle, effectively absorbing the heat of the object to be dissipated, and effectively realizing the object to be dissipated Heat, while not caused due to the heat absorption caused by excessive temperature rise of the phenomenon.
  • the mixing in the preparation method of the embodiment of the present invention is carried out under the agitation of a high-speed disperser, and the rotation speed of the high-speed disperser is 500-2500 r/min, preferably 800 r/min. Under the conditions, carry out for 15 to 30 minutes.
  • other substances not including the phase change heat storage material may be first stirred and mixed, and the speed of the high speed mixer is rotated at a high speed, such as 1500 r/min, and stirred for 15 minutes, and then the phase change is continued.
  • the heat storage material can be reduced in speed, for example, to 800 r/min, and stirring is continued for 15 minutes.
  • various substances in the phase change composite material prepared under the above mixing conditions can be sufficiently mixed, and the obtained phase change composite material has uniform texture, heat conduction and heat storage effect.
  • the method for preparing a phase change composite material according to an embodiment of the present invention may further include: preliminarily performing ball milling treatment on the phase change heat storage material used, and phase change heat storage material obtained after ball milling treatment.
  • the diameter is less than 100 microns and the diameter is preferably less than 10 microns.
  • the inventors have found that the phase change heat storage material used in the prior art is ball-milled into particles having a diameter of less than 10 micrometers, which is beneficial to the subsequent mixing operation, and the texture uniformity of the obtained phase change composite material is further improved, and the phase change composite at different positions is further improved. The endothermic synchronism of the material is improved, and the heat dissipation function of the phase change composite material is more effectively realized.
  • the phase change composite material prepared by the preparation method of the embodiment of the present invention can be directly coated on the surface of the object to be heat-dissipated, and dried and cured at normal temperature for 24 hours to form a heat-dissipating film on the surface of the object to be heat-dissipated.
  • the phase change composite material prepared by the preparation method of the embodiment of the invention can be directly applied to the surface of the object to be dispersed when applied, and the object to be heat-dissipated is directly in contact with the phase change composite material of the embodiment of the invention, and there is no air gap between the heat.
  • the invention provides the use of the phase change composite described above for heat dissipation in electronic devices.
  • the phase change composite material of the embodiment of the present invention can be directly coated on the surface of the electronic device to be heat sink, and a uniform heat conduction and heat storage film can be formed on the surface of the electronic device to be heat sink, and the heat sink member and There is no air gap between the phase change composite materials, and the heat can be directly transferred to the phase change composite material.
  • the phase change composite material is gradually transformed into a liquid state from the solid state, and then the heat is absorbed from the electronic device to the heat sink member to the phase change composite material.
  • phase change composite material has good heat storage properties, heat is slowly released from the phase change composite material, and the phase change composite material changes from a liquid state to a solid state. Therefore, the phase change composite material of the embodiment of the present invention is sucked.
  • the heat changes from a solid state to a liquid state, and the exotherm changes from a liquid state to a solid state, which can effectively avoid a sharp rise in temperature due to an increase in heat, and complete an endothermic and exothermic cycle by changing the state of the phase change composite material, thereby effectively Absorbing the heat of the electronic device to be heat-sinked, effectively achieving heat dissipation of the electronic device to be heat-sinked, and at the same time Cause electronic equipment due to heat absorption caused by excessive temperature rise of the phenomenon. Therefore, the phase change composite material of the embodiment of the invention can be used for effective heat dissipation of electronic devices, and has the use in heat dissipation of electronic devices.
  • the invention provides an electronic device.
  • the electronic device comprises a housing; and a processor or battery, the processor or battery being disposed in the housing, wherein the surface of the processor or battery is coated with the phase change composite of the embodiment of the invention .
  • the phase change composite material of the embodiment of the invention can be directly coated on the surface of the object to be heat-dissipated, and has the advantages of high heat conduction efficiency and good heat storage performance, which can be converted from a solid state to a liquid state by heat absorption, and the heat release is changed from a liquid state to a solid state. It can avoid a sharp rise in temperature due to an increase in heat.
  • a processor or a battery of an electronic device according to an embodiment of the present invention is coated with the phase change composite material of the embodiment of the present invention, and the processor or the battery can operate at a substantially constant temperature.
  • the problem that the battery power of the device is reduced too fast, the restart of the device, and the components are deteriorated due to the heat generated by the electronic device for a long time is avoided, and thus the electronic device of the embodiment of the invention has a significant advantage of long service life.
  • the invention proposes a processor.
  • the surface of the processor is coated with a phase change composite of an embodiment of the invention.
  • the phase change composite material of the embodiment of the invention can be directly coated on the surface of the object to be heat-dissipated, and has the advantages of high heat conduction efficiency and good heat storage performance, which can be converted from a solid state to a liquid state by heat absorption, and the heat release is changed from a liquid state to a solid state. It can avoid a sharp rise in temperature due to an increase in heat.
  • the processor of the embodiment of the present invention is coated with the phase change composite material of the embodiment of the present invention, and the processor can operate at a substantially constant temperature to prevent the processor from working for a long time.
  • the problem of dead restart caused by heat generation and aging of components, and thus, the processor of the embodiment of the present invention has a significant advantage of long service life.
  • the invention provides a battery.
  • the surface of the battery is coated with the phase change composite of the embodiment of the invention.
  • the phase change composite material of the embodiment of the invention can be directly coated on the surface of the object to be heat-dissipated, and has the advantages of high heat conduction efficiency and good heat storage performance, which can be converted from a solid state to a liquid state by heat absorption, and the heat release is changed from a liquid state to a solid state. It can avoid a sharp rise in temperature due to an increase in heat.
  • the battery of the embodiment of the present invention is coated with the phase change composite material of the embodiment of the present invention, and the battery can operate at a substantially constant temperature to prevent the battery from generating heat for a long time.
  • the resulting battery power drops too fast, and thus, the battery of the embodiment of the present invention has a significant advantage in that it has a long service life.
  • phase change composite was prepared according to the following procedure:
  • phase change heat storage material is ball-milled using a planetary high-energy ball mill (Model DECO-SG100, Deco), and ball-milled into particles having a diameter of less than 10 ⁇ m.
  • phase change composite material other than the phase change heat storage material was mixed into a mixed solution, and stirred at a speed of 1500 r/min for 15 minutes in a high speed disperser, and after thorough mixing, a solution X was obtained.
  • phase change heat storage material particles obtained in the step (1) were added to the solution X, and stirred at a speed of 800 r/min for 15 minutes in a high-speed disperser, and after thorough mixing, a phase change composite material was obtained.
  • phase change composites were prepared according to the procedures described in the general methods, wherein the components of the phase change composites prepared in Examples 1-3 and their amounts are shown in Table 1.
  • phase change composite materials obtained in Examples 1 to 3 were directly coated on the surface of the object to be heat-dissipated, and left to stand at room temperature for 24 hours to be dried and solidified to form a heat-dissipating film on the surface of the object to be heat-dissipated.
  • Example 4 a phase change composite material was prepared according to the procedure described in the general method, wherein the composition and amount of the phase change composite material prepared in this example were the same as those of the phase change composite material prepared in Example 1. The composition and amount are the same.
  • phase change composite material prepared in this example was encapsulated in an aluminum plate having a wall thickness of 0.1 mm.
  • Example 5 a phase change composite material was prepared according to the procedure described in the general method, wherein the composition and amount of the phase change composite material prepared in this example were the same as those of the phase change composite material prepared in Example 1. The composition and amount are the same.
  • phase change composite material prepared in this example was filled in foamed aluminum having through holes.
  • phase change composite prepared in Example 4 was packaged in an aluminum plate having a wall thickness of 0.1 mm, wherein the phase change composite test piece had a thickness of 50 ⁇ m and an area of 25 mm*25 mm and was placed on the metal foil;
  • the phase change composite prepared in Example 5 was filled with a through hole having a thickness of 50 ⁇ m and an area of 25 mm*25 mm. In the foam aluminum and placed on the metal foil;
  • phase change composite test piece was kept at 70 ° C for 7 days, and the area change of the phase change composite before and after the test was measured.
  • the test results are shown in Table 2.
  • the Qualcomm Qualcomm Qualcomm Snapdragon 810 processor uses the Qualcomm iOS 810 processor to make the test board and make it overclocked.
  • the Qualcomm Qualcomm Snapdragon 810 processor was externally used for testing. Temperature monitoring cameras are used to monitor the temperature.
  • the single-sided Qualcomm Snapdragon 810 processor was coated with a phase change composite of Examples 1-3 having a thickness of 100 ⁇ m. Start the start work button, 15min test processor surface temperature A table , phase change composite surface temperature A phase . The test results are listed in Table 2.
  • phase change composite of Example 4 was packaged in an aluminum plate having a wall thickness of 0.1 mm, wherein the thickness of the phase change composite was 100 ⁇ m, and it was placed on the surface of the processor, and the start work button was started, and the surface temperature of the test machine was tested for 15 minutes.
  • Table A phase change composite surface temperature A phase , the results are listed in Table 2.
  • Example 5 phase change composite material is filled in the through-holes having a thickness of 100 microns aluminum foam, and placed on the surface of the processor, to work start button, the surface temperature of the test processor 15min Table A, the phase change composite material The surface temperature was phase A and the results are shown in Table 2.
  • phase change composite materials obtained in Examples 1 to 5 have no fluidity below 70 ° C and can be effectively attached to the surface of the object to be heat-dissipated (such as metal foil, Qualcomm Qualcomm Snapdragon 810 processor), phase change composite material. It has the characteristics of phase change under the heat absorption/exothermic temperature below 70 °C, so that it has good heat dissipation effect, and the surface temperature of the object to be heat-dissipated and the surface temperature of the phase change composite material are not excessively increased.
  • phase change composite material of the embodiment of the invention is more suitable for directly coating the surface of the object to be heat-dissipated for effective heat dissipation of the object to be heat-dissipated.

Abstract

本发明提出了一种相变复合材料及其制备方法和用途，该相变复合材料用于涂覆在待散热物体的表面，并且包括粘结树脂、相变储热材料，所采用的相变储热材料的相变温度是20～70℃。本发明实施例的相变复合材料可有效用于电子设备发热器件的散热。

Description

相变复合材料及电子设备
优先权信息
本申请请求2015年12月17日向中国国家知识产权局提交的、专利申请号为201510952935.4的专利申请的优先权和权益，并且通过参照将其全文并入此处。
技术领域
本发明涉及材料领域，具体地，本发明涉及相变复合材料及电子设备。
背景技术
电子产品的更新换代越来越快，功能也越来越强，但除了功能性的大大丰富以满足人们越来越多的需求之外，也额外带来了一个问题，就是“热”，“热”虽然看上去只是稍微影响用户体验，但是一旦控制不好变成了“烫”的话，对于使用者来说就感觉非常不好了，严重影响用户的体验；并且对电子产品而言，长时间在高温下工作，可能出现电池电量下降过快，死机重启，元器件老化等各种各样的问题。
因此，如何解决电子产品发热，是电子产品开发过程中迫切需要解决的问题。
发明内容
本发明旨在至少在一定程度上解决相关技术中的技术问题之一。
为此，在本发明的第一方面，本发明提出了一种相变复合材料。根据本发明的实施例，所述相变复合材料用于涂覆在待散热物体的表面，并且包括：粘结树脂，相变储热材料，所述相变储热材料的相变温度是20～70℃。根据本发明的实施例，该相变复合材料可直接涂覆在待散热物体的表面，在待散热物体的表面形成均匀的导热和储热膜，热量可直接快速传递到该相变复合材料，相变复合材料受热从固态逐渐转变成液态，进而将热量从待散热物体吸收到该相变复合材料，同时由于该相变复合材料具有良好的储热性能，热量缓慢地从该相变复合材料释放出去，相变复合材料从液态转变为固态，因此，通过本发明实施例的相变复合材料吸热由固态转变为液态，放热由液态转变为固态，避免了由于热量的增多而引起温度的急剧升高，以相变复合材料的状态变化完成一次吸热和放热循环，有效地吸收待散热物体的的热量，有效地实现待散热物体的的散热，同时又不会引起由于吸热而导致温度过分升高的现象。另外，根据本发明的实施例，相比于金属背板导热、石墨散热片导热、导热凝胶散热、冰巢散热，该相变复合材料应用于待散热物体的散热，可直接涂覆在待散热物体的表面，从而与待散热物体直接接触，与待散热物体之间没有空气间隔， 热量可直接从待散热物体传递到本发明实施例的相变复合材料，导热效率显著提高；相比于热管散热，该相变复合材料应用于待散热物体的散热，不需要容器承载，所需空间较小；相比于冰巢散热，该相变复合材料应用于待散热物体的散热，能够实现待散热物体的快速散热。
在本发明的第二方面，本发明提出了一种电子设备。根据本发明的实施例，所述电子设备包括：壳体；以及处理器或电池的至少之一，所述处理器或电池设置在所述壳体中；其中，所述处理器或电池的表面涂覆有前面所述的相变复合材料。如前所述，本发明实施例的相变复合材料可直接涂覆在待散热物体的表面，如电子设备处理器或电池的表面，待散热物体与本发明实施例的相变复合材料之间没有空气间隔，热量可直接由待散热物体直接传递到本发明实施例的相变复合材料，导热效率高，同时由于本发明实施例的相变复合材料具有储热性能好的优势，其可通过吸热由固态转变为液态，放热由液态转变为固态，可避免由于热量的增多而引起温度的急剧升高。因此，根据本发明的实施例，本发明实施例的电子设备的处理器或电池上涂覆有本发明实施例的相变复合材料，该处理器或电池可在基本恒定的温度下工作，避免了该电子设备长时间工作而产热导致的设备电池电量下降过快、死机重启、元器件老化的问题，从而，本发明实施例的电子设备具有使用寿命长的优势。
在本发明的第三方面，本发明提出了一种处理器。根据本发明的实施例，所述处理器的表面涂覆有前面所述的相变复合材料。如前所述，本发明实施例的相变复合材料可直接涂覆在待散热物体的表面，待散热物体与本发明实施例的相变复合材料之间没有空气间隔，热量可直接由待散热物体直接传递到本发明实施例的相变复合材料，导热效率高，同时由于本发明实施例的相变复合材料具有储热性能好的优势，其可通过吸热由固态转变为液态，放热由液态转变为固态，可避免由于热量的增多而引起温度的急剧升高。因此，根据本发明的实施例，本发明实施例的处理器上涂覆有本发明实施例的相变复合材料，该处理器可在基本恒定的温度下工作，避免了该处理器长时间工作而产热导致的设备死机重启、元器件老化的问题，从而，本发明实施例的处理器具有使用寿命长的优势。
在本发明的第四方面，本发明提出了一种电池。根据本发明的实施例，所述电池的表面涂覆有前面所述的相变复合材料。如前所述，本发明实施例的相变复合材料可直接涂覆在待散热物体的表面，待散热物体与本发明实施例的相变复合材料之间没有空气间隔，热量可直接由待散热物体直接传递到本发明实施例的相变复合材料，导热效率高，同时由于本发明实施例的相变复合材料具有储热性能好的优势，其可通过吸热由固态转变为液态，放热由液态转变为固态，可避免由于热量的增多而引起温度的急剧升高。因此，根据本发明的实施例，本发明实施例的电池上涂覆有本发明实施例的相变复合材料，该电池可在基 本恒定的温度下工作，避免了该电池长时间工作而产热导致的电池电量下降过快的问题，从而，本发明实施例的电池具有使用寿命长的优势。
具体实施方式
下面详细描述本发明的实施例。下面描述的实施例是示例性的，旨在用于解释本发明，而不能理解为对本发明的限制。
相变复合材料
在本发明的第一方面，本发明提出了一种相变复合材料。根据本发明的实施例，本发明实施例的相变复合材料用于涂覆在待散热物体的表面，并且包括：粘结树脂，相变储热材料，所采用的相变储热材料的相变温度是20～70℃。根据本发明的实施例，上述散热物体可为电子设备的处理器或电池。根据本发明的实施例，该相变复合材料可直接涂覆在待散热物体，如电子设备的处理器或电池的表面，在待散热物体的表面形成均匀的导热和储热膜，热量可直接快速传递到该相变复合材料，相变复合材料受热从固态逐渐转变成液态，进而将热量从待散热物体吸收到该相变复合材料，同时由于该相变复合材料具有良好的储热性能，热量缓慢地从该相变复合材料释放出去，相变复合材料从液态转变为固态，因此，通过本发明实施例的相变复合材料吸热由固态转变为液态，放热由液态转变为固态，避免了由于热量的增多而引起温度的急剧升高，以相变复合材料的状态变化完成一次吸热和放热循环，有效地吸收待散热物体的热量，有效地实现待散热物体的散热，同时又不会引起由于吸热而导致温度过分升高的现象。另外，根据本发明的实施例，相比于金属背板导热、石墨散热片导热、导热凝胶散热、冰巢散热，该相变复合材料应用于待散热物体的散热，可直接涂覆在待散热物体的表面，从而与待散热物体直接接触，与待散热物体之间没有空气间隔，热量可直接从待散热物体传递到本发明实施例的相变复合材料，导热效率显著提高；相比于热管散热，该相变复合材料应用于待散热物体的散热，不需要容器承载，所需空间较小；相比于冰巢散热，该相变复合材料应用于待散热物体的散热，能够实现待散热物体的快速散热。
另外，根据本发明的实施例，发明人通过大量的筛选实验，发现粘结树脂的含量在10～50重量份，相变储热材料的含量在25～70重量份，粘结树脂的成型和支撑功效可更好地与相变储热材料的吸热/放热发生相变的性能相匹配，从而，本发明实施例的相变复合材料的成膜效果显著提高，进而更加有利于本发明实施例的相变复合材料直接涂覆于待散热物体的表面，导热和储热效能也进一步提高。
具体的，根据本发明的实施例，采用的相变储热材料可选自石蜡类、醇类和脂肪酸类的至少之一，石蜡、醇类、脂肪酸类的相变温度在20～70℃之间，石蜡、醇类、脂肪酸类 在20～70℃之间具有良好的吸热和放热功能，能通过吸热和放热循环更有效实现待散热物体的散热，且不会造成温度骤升。
根据本发明的一些实施例，所采用的粘结树脂可选自热固性树脂、热塑性树脂的至少之一，其中，热塑性树脂包括亲水性热塑性树脂和亲油性热塑性树脂。热固性树脂的类型不受特别限制，根据本发明的实施例，热固性树脂可选自环氧树脂、醇酸树脂、聚氨酯树脂、聚酯树脂的至少之一。根据本发明的另外一些实施例，当粘结树脂采用热固性塑脂时，本发明实施例的相变复合材料可进一步包括固化剂，根据本发明的实施例，该固化剂为选自聚酰胺、多异氰酸酯的至少之一。另外，根据本发明的实施例，采用热塑性树脂的类型也不受特别限制，根据本发明的实施例，热塑性树脂可选自但不限于热塑性丙烯酸树脂、热塑性聚氨酯树脂、聚碳酸酯、甲基丙烯酸酯、聚乙烯、纤维素、氯化橡胶、过氯乙烯、线性酚醛树脂的至少之一。根据本发明的实施例，当粘结树脂采用热塑性树脂中的亲水性热塑性树脂时，本发明实施例的相变复合材料可进一步包括成膜助剂，根据本发明的另外一些实施例，该成膜助剂采用醇酯十二、乙二醇丁醚、二乙二醇丁醚、二丙二醇丁醚、丙二醇丁醚的至少之一。发明人发现，由于亲水性热塑性树脂的含水量高，不利于成膜，成膜助剂如醇脂十二等可显著促进亲水性热塑性树脂的成膜，进而更加有利于本发明实施例的相变复合材料直接涂覆于待散热物体的表面。
另外，根据本发明的实施例，本发明实施例的相变复合材料可进一步包括：0.1～5重量份的增粘剂，发明人发现，0.1～5重量份的增粘剂可使本发明实施例的相变复合材料的粘度提高，从而有利于达到施工粘度，更加有利于本发明实施例的相变复合材料的成膜，更加便于将本发明实施例的相变复合材料直接涂覆于待散热物体的表面。
同时，根据本发明的另外一些实施例，发明人也意外地发现，本发明实施例的相变复合材料还可以进一步包括：5～60重量份的稀释剂，发明人发现，5～60重量份的稀释剂也会更有利于本发明实施例的相变复合材料的施工，即喷涂、印刷或刷涂。具体地，稀释剂的类型不受特别限制，根据本发明的实施例，该稀释剂可选自但不限于丙酮、甲乙酮、环己酮、苯、甲苯、二甲苯、正丁醇、苯乙烯、去离子水的至少之一，本发明实施例的相变复合材料采用上述稀释剂，其施工更加方便，通过喷涂、印刷或刷涂，本发明实施例的相变符合材料更加便于直接涂覆在待散热物体的表面。
制备相变复合材料的方法
为了方便理解，下面对可以用于制备上述相变复合材料的方法进行描述。根据本发明的实施例，该方法包括：将粘结树脂、相变储热材料进行混合，以便获得相变复合材料。具体地，根据本发明的实施例，本发明实施例的制备相变复合材料的方法进一步包括将粘结树脂、相变储热材料、增粘剂、稀释剂和/或固化剂、成膜助剂的至少之一进行搅拌混匀， 以便得到相变复合材料。根据本发明的实施例，利用本发明实施例的制备相变复合材料的方法，可高效地制备前面所述的相变复合材料，所采用的粘结树脂、相变储热材料、增粘剂、稀释剂和/或固化剂、成膜助剂为本领域技术人员所熟知的材料，取材方便，另外，根据本发明的实施例，本发明实施例的方法仅需通过搅拌即可完成混匀，即可获得本发明实施例的相变复合材料，操作简便。同时，如前所述，利用本发明实施例的制备方法制备的相变复合材料，其可直接涂覆在待散热物体的表面，在待散热物体的表面形成均匀的导热和储热膜，待散热物体与本发明实施例的方法制备的相变复合材料之间没有空气间隔，热量可直接快速传递到该相变复合材料，相变复合材料受热从固态逐渐转变成液态，进而将热量从待散热物体吸收到该相变复合材料，同时由于所得相变复合材料具有良好的储热性能，热量缓慢地从该相变复合材料释放出去，相变复合材料从液态转变为固态，因此，通过本发明实施例的制备方法制备的相变复合材料，其吸热由固态转变为液态，放热由液态转变为固态，避免了由于热量的增多而引起温度的急剧升高，以相变复合材料的状态变化完成一次吸热和放热循环，有效地吸收待散热物体的热量，有效地实现待散热物体的散热，同时又不会引起由于吸热而导致温度过分升高的现象。
另外，根据本发明的实施例，本发明实施例的制备方法中的混合是在高速分散机的搅拌下进行的，高速分散机的转速采用的是500-2500r/min，优选采用800r/min的条件下，进行15～30分钟。根据本发明的具体实施例，可先将不包括相变储热材料的其它物质进行搅拌混匀，高速搅拌机的速度采用较高转速，如1500r/min，并搅拌15分钟，然后继续添加相变储热材料，此时可将转速降低，如降至800r/min，并继续搅拌15分钟。根据本发明的实施例，在上述混匀条件下所制备的相变复合材料中各种物质能够得到充分混匀，所得相变复合材料的质地均匀、导热和储热功效进一步增强。
另外，根据本发明的一些实施例，本发明实施例的制备相变复合材料的方法还可以进一步包括：将采用的相变储热材料预先进行球磨处理，球磨处理后得到的相变储热材料的直径小于100微米，直径优选小于10微米。发明人发现，将采用的相变储热材料预先球磨成直径小于10微米的微粒，有利于后续的混匀操作，所得到的相变复合材料的质地均匀性进一步提高，不同位置处相变复合材料的吸热同步性提高，进而更加有效地实现相变复合材料的散热功能。
根据本发明的实施例，本发明实施例的制备方法制备的相变复合材料可直接涂覆在待散热物体的表面，并在常温下干燥固化24小时，以便在待散热物体的表面形成散热膜。本发明实施例的制备方法制备的相变复合材料，应用时可直接涂覆在待散物体的表面，待散热物体与本发明实施例的相变复合材料直接接触，之间没有空气间隔，热量可直接由待散热物体传递到该相变复合材料，避开了空气导热效率低的问题，本发明实施例的制备方法 制备的相变复合材料的导热效率显著提高。
相变复合材料在电子设备散热中的用途
在本发明的另一方面，本发明提出了前面所描述的相变复合材料在电子设备散热中的用途。根据本发明的实施例，本发明实施例的相变复合材料可直接涂覆在电子设备待散热器件的表面，在电子设备待散热器件表面可形成均匀的导热和储热膜，待散热器件和相变复合材料之间没有空气间隔，热量可直接快速传递到该相变复合材料，相变复合材料受热从固态逐渐转变成液态，进而将热量从电子设备待散热器件吸收到该相变复合材料，同时由于该相变复合材料具有良好的储热性能，热量缓慢地从该相变复合材料释放出去，相变复合材料从液态转变为固态，因此，通过本发明实施例的相变复合材料吸热由固态转变为液态，放热由液态转变为固态，可有效避免由于热量的增多而引起温度的急剧升高，以相变复合材料的状态变化完成一次吸热和放热循环，从而有效地吸收电子设备待散热器件的热量，有效地实现电子设备待散热器件的散热，同时又不会引起电子设备由于吸热而导致温度过分升高的现象。因此，本发明实施例的相变复合材料可用于电子设备的有效散热，具有在电子设备散热中的用途。
电子设备
在本发明的另一方面，本发明提出了一种电子设备。根据本发明的实施例，该电子设备包括壳体；以及处理器或电池，处理器或电池设置在壳体中，其中，处理器或电池的表面涂覆有本发明实施例的相变复合材料。本发明实施例的相变复合材料可直接涂覆在待散热物体的表面，具有导热效率高、储热性能好的优势，其可通过吸热由固态转变为液态，放热由液态转变为固态，可避免由于热量的增多而引起温度的急剧升高。因此，根据本发明的实施例，本发明实施例的电子设备的处理器或电池上涂覆有本发明实施例的相变复合材料，该处理器或电池可在基本恒定的温度下工作，可避免该电子设备长时间工作而产热导致的设备电池电量下降过快、死机重启、元器件老化的问题，从而，本发明实施例的电子设备具有使用寿命长的显著优势。
处理器
在本发明的另一方面，本发明提出了一种处理器。根据本发明的实施例，该处理器的表面涂覆有本发明实施例的相变复合材料。本发明实施例的相变复合材料可直接涂覆在待散热物体的表面，具有导热效率高、储热性能好的优势，其可通过吸热由固态转变为液态，放热由液态转变为固态，可避免由于热量的增多而引起温度的急剧升高。因此，根据本发明的实施例，本发明实施例的处理器上涂覆有本发明实施例的相变复合材料，该处理器可在基本恒定的温度下工作，可避免该处理器长时间工作而产热导致的死机重启、元器件老化的问题，从而，本发明实施例的处理器具有使用寿命长的显著优势。
电池
在本发明的另一方面，本发明提出了一种电池。根据本发明的实施例，该电池的表面涂覆有本发明实施例的相变复合材料。本发明实施例的相变复合材料可直接涂覆在待散热物体的表面，具有导热效率高、储热性能好的优势，其可通过吸热由固态转变为液态，放热由液态转变为固态，可避免由于热量的增多而引起温度的急剧升高。因此，根据本发明的实施例，本发明实施例的电池上涂覆有本发明实施例的相变复合材料，该电池可在基本恒定的温度下工作，可避免该电池长时间工作而产热导致的电池电量下降过快的问题，从而，本发明实施例的电池具有使用寿命长的显著优势。
下面将结合实施例对本发明的方案进行解释。本领域技术人员将会理解，下面的实施例仅用于说明本发明，而不应视为限定本发明的范围。实施例中未注明具体技术或条件的，按照本领域内的文献所描述的技术或条件或者按照产品说明书进行。所用试剂或仪器未注明生产厂商者，均为可以通过市购获得的常规产品。
一般方法
在下面的实施例中，如果没有明确指出，则按照下面的步骤制备相变复合材料：
(1)将相变储热材料采用行星式高能球磨机(型号为DECO-SG100，德科)进行球磨，球磨成直径小于10微米的颗粒。
(2)将除相变储热材料以外的制备相变复合材料的成分配制成混合溶液，在高速分散机中以1500r/min的转速搅拌15分钟，充分混合后，得到溶液X。
(3)在溶液X中加入步骤(1)得到的相变储热材料颗粒，在高速分散机中以800r/min的转速搅拌15分钟，充分混合后，得到相变复合材料。
实施例1～3
在这些实施例中，按照一般方法所描述的步骤，制备相变复合材料，其中，实施例1～3中制备相变复合材料的各成分及其用量如表1所示，
表1
Figure PCTCN2016109962-appb-000001
Figure PCTCN2016109962-appb-000002
实施例1～3所得相变复合材料直接涂布在待散热物体的表面，并在常温下放置24小时干燥固化，以便在待散热物体的表面形成散热膜。
实施例4
在实施例4中，按照一般方法所描述的步骤，制备相变复合材料，其中，在本实施例中制备相变复合材料的所采用的成分和用量同实施例1中制备相变复合材料的成分和用量一致。
本实施例中制得的相变复合材料封装在壁厚为0.1mm的铝板中。
实施例5
在实施例5中，按照一般方法所描述的步骤，制备相变复合材料，其中，在本实施例中制备相变复合材料的所采用的成分和用量同实施例1中制备相变复合材料的成分和用量一致。
本实施例中制得的相变复合材料填充于具有通孔的泡沫铝中。
实施例6
在本实施例中，按照如下描述对实施例1～5制得的相变复合材料进行流动性测试和散热效果测试：
(1)流动性测试
在金属薄片上涂覆面积为25mm*25mm，厚度为50微米的实施例1～3的相变复合材料测试样块；
实施例4中制备的相变复合材料封装在壁厚为0.1mm的铝板中，其中相变复合材料测试样块的厚度为50微米、面积为25mm*25mm，并放在金属薄片上；
实施例5中制备的相变复合材料填充于具有通孔的厚度为50微米、面积为25mm*25mm 的泡沫铝中，并放在金属薄片上；
将上述相变复合材料测试样块在70℃下保持7天，测量测试前后相变复合材料的面积变化，测试结果列于表2中。
(2)散热效果
利用高通骁龙810处理器制作测试板，并使其处于超频工作状态。制作时将高通骁龙810处理器外置，用于测试。采用温度监控摄像机监测温度。
将高通骁龙810处理器的单面涂覆厚度为100微米的实施例1～3的相变复合材料。启动开始工作按钮，15min测试处理器表面温度A表，相变复合材料表面温度A相。并将测试结果列于表2中。
实施例4中相变复合材料封装在壁厚为0.1mm的铝板中，其中相变复合材料的厚度为100微米，并将其放置在处理器表面，启动开始工作按钮，15min测试处理器表面温度A表，相变复合材料表面温度A相，结果列于表2中。
实施例5中相变复合材料填充于具有通孔的厚度为100微米的泡沫铝中，并将其放置在处理器表面，启动开始工作按钮，15min测试处理器表面温度A表，相变复合材料表面温度A相，结果列于表2中。
表2
Figure PCTCN2016109962-appb-000003
由表2可以看出，实施例1～5所得相变复合材料在70℃以下没有流动性，可有效附着在待散热物体表面(如金属薄片、高通骁龙810处理器)，相变复合材料在70℃以下具有吸热/放热而产生相变的特性，使其具有良好的散热功效，待散热物体表面温度和相变复合材料表面温度不会过分升高。然而，如果将相变复合材料封装在铝板中或填充于泡沫铝中(如实施例4和5所示)，其散热效果反而没有将相变复合材料直接涂覆在待散热物体的表面好。因此，本发明实施例的相变复合材料更加适合直接涂覆在待散热物体的表面进行待散热物体的有效散热。
在本说明书的描述中，参考术语“一个实施例”、“一些实施例”、“示例”、“具体示 例”、或“一些示例”等的描述意指结合该实施例或示例描述的具体特征、结构、材料或者特点包含于本发明的至少一个实施例或示例中。在本说明书中，对上述术语的示意性表述不必须针对的是相同的实施例或示例。而且，描述的具体特征、结构、材料或者特点可以在任一个或多个实施例或示例中以合适的方式结合。此外，在不相互矛盾的情况下，本领域的技术人员可以将本说明书中描述的不同实施例或示例以及不同实施例或示例的特征进行结合和组合。
尽管上面已经示出和描述了本发明的实施例，可以理解的是，上述实施例是示例性的，不能理解为对本发明的限制，本领域的普通技术人员在本发明的范围内可以对上述实施例进行变化、修改、替换和变型。

Claims (17)

  1. 一种相变复合材料，其特征在于，所述相变复合材料用于涂覆在待散热物体的表面，并且包括：
    粘结树脂，
    相变储热材料，所述相变储热材料的相变温度是20～70℃。
  2. 根据权利要求1所述的相变复合材料，其特征在于，所述粘结树脂的含量是10～50重量份，所述相变储热材料的含量是25～70重量份。
  3. 根据权利要求1或2所述的相变复合材料，其特征在于，所述相变复合材料进一步包括：0.1～5重量份的增粘剂。
  4. 根据权利要求1～3任一项所述的相变复合材料，其特征在于，所述相变复合材料进一步包括：5～60重量份的稀释剂。
  5. 根据权利要求1～4任一项所述的相变复合材料，其特征在于，所述粘结树脂包括选自热固性树脂、热塑性树脂的至少之一，
    其中，所述热塑性树脂包括亲水性热塑性树脂和亲油性热塑性树脂。
  6. 根据权利要求5所述的相变复合材料，其特征在于，所述热固性树脂包括选自环氧树脂、醇酸树脂、聚氨酯树脂、聚酯树脂的至少之一。
  7. 根据权利要求5或6所述的相变复合材料，其特征在于，所述热塑性树脂包括选自热塑性丙烯酸树脂、热塑性聚氨酯树脂、聚碳酸酯、甲基丙烯酸酯、聚乙烯、纤维素、氯化橡胶、过氯乙烯、线性酚醛树脂的至少之一。
  8. 根据权利要求5所述的相变复合材料，其特征在于，所述粘结树脂为热固性树脂时，所述相变复合材料进一步包括固化剂。
  9. 根据权利要求5所述的相变复合材料，其特征在于，所述粘结树脂为热塑性树脂，所述热塑性树脂为亲水性热塑性树脂时，所述相变复合材料进一步包括成膜助剂。
  10. 根据权利要求8所述的相变复合材料，其特征在于，所述固化剂为选自聚酰胺、多异氰酸酯的至少之一。
  11. 根据权利要求9所述的相变复合材料，其特征在于，所述成膜助剂为选自醇酯十二、乙二醇丁醚、二乙二醇丁醚、二丙二醇丁醚、丙二醇丁醚的至少之一。
  12. 根据权利要求1～11任一项所述的相变复合材料，其特征在于，所述相变储热材料包括选自石蜡类、醇类、脂肪酸类的至少之一。
  13. 根据权利要求4～12任一项所述的相变复合材料，其特征在于，所述稀释剂包括选自丙酮、甲乙酮、环己酮、苯、甲苯、二甲苯、正丁醇、苯乙烯、去离子水的至少之一。
  14. 根据权利要求1～13任一项所述的相变复合材料，其特征在于，所述待散热的物体为电子设备的处理器或电池。
  15. 一种电子设备，其特征在于，包括：
    壳体；以及
    处理器或电池的至少之一，所述处理器或电池设置在所述壳体中，
    其中，所述处理器或电池的表面涂覆有权利要求1～13任一项所述的相变复合材料。
  16. 一种处理器，其特征在于，所述处理器的表面涂覆有权利要求1～13任一项所述的相变复合材料。
  17. 一种电池，其特征在于，所述电池的表面涂覆有权利要求1～13任一项所述的相变复合材料。
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