WO2017099356A1 - Method for preparing epoxy resin, epoxy resin, epoxy resin composition for encapsulating semiconductor device, containing same, and molded product molded using same - Google Patents

Abstract

The present invention relates to: a method for preparing an epoxy resin; an epoxy resin prepared by the method; an epoxy resin composition for encapsulating a semiconductor device, containing the same; and a molded product, the method comprising the steps of: melting a difunctional monomolecular epoxy compound containing a polycyclic structure, by heating the same at the melting temperature or higher; and cooling the molten epoxy compound.

Description

Manufacturing method of epoxy resin, epoxy resin, epoxy resin composition for sealing semiconductor element comprising the same and molded article molded using the same

The present invention relates to a method for producing an epoxy resin, an epoxy resin produced using the same, an epoxy resin composition for sealing a semiconductor device comprising the same, and a molded article molded using the same. More specifically, the present invention relates to a method for producing an epoxy resin having low shrinkage and low elastic properties, an epoxy resin produced by the above production method, an epoxy resin composition and a molded article including the same.

As a method of packaging semiconductor devices such as IC and LSI and obtaining a semiconductor device, transfer molding of an epoxy resin composition is widely used in view of low cost and high volume production.

Conventionally, aliphatic or aromatic epoxy resins having a softening point of 50 ° C. to 140 ° C. have been mainly used due to the characteristics of the semiconductor packaging process. This is because when the softening point of the epoxy resin is out of the above range, molding is difficult and defects are likely to occur.

However, with the trend toward miniaturization, light weight, and high performance of electronic products, as semiconductor chips become thinner, and high integration and / or surface mounting increase, problems that cannot be solved with conventional epoxy resin compositions are occurring. In particular, as the semiconductor device becomes thin, problems such as thermal expansion between the substrate and the sealing layer and warpage of the package due to heat shrinkage are likely to occur, and the sealing layer has high elasticity characteristics, resulting in damage or breakage of the chip by the sealing layer. .

In order to solve the above problems, development of an epoxy resin having low shrinkage and low elastic properties has been attempted. For example, a method of lowering shrinkage and elastic modulus by applying a polycyclic crystalline epoxy resin to an epoxy resin composition has been attempted. However, when the crystalline epoxy resin of the polycyclic structure as described above has a high melting point, when used alone, a softening point temperature suitable for molding cannot be realized. Therefore, a method of mixing and using a polycyclic epoxy resin and another epoxy resin composition having a low softening point has been studied. However, when using a mixture of heterogeneous epoxy resin composition in this way, the weight ratio that can be mixed is limited due to compatibility problems between the epoxy resin, there is a problem that a sufficient low shrinkage, low elasticity effect is not obtained.

Therefore, development of an epoxy resin excellent in low shrinkage and low elastic properties while having a softening point suitable for a semiconductor packaging process is required.

An object of the present invention is to provide an epoxy resin having a softening point suitable for a semiconductor packaging process and excellent in low shrinkage and low elastic properties.

Another object of the present invention is to provide a method for producing an epoxy resin having the above characteristics.

Still another object of the present invention is to provide an epoxy resin composition and a molded article containing the epoxy resin.

In one aspect, the present invention comprises the steps of melting a bifunctional monomolecular epoxy compound comprising a polycyclic structure by heating above the melting temperature; And it provides a method for producing an epoxy resin comprising the step of cooling the molten epoxy compound.

The polycyclic structure may include one or more selected from the group consisting of fluorene, anthracene, naphthalene and biphenyl.

Specifically, the bifunctional monomolecular epoxy compound including the polycyclic structure may be a compound represented by the following Formula (1).

[Formula 1]

In Formula 1, X and Y are each independently hydrogen or an alkyl group having 1 to 10, n is an integer of 1 to 5, m is an integer of 1 to 5.

The melting may be performed by heating the bifunctional monomolecular epoxy compound including the polycyclic structure to about 150 ° C to about 250 ° C.

The cooling may be cooling the molten epoxy compound to about 20 ℃ to about 30 ℃.

In another aspect, the present invention provides an epoxy resin prepared according to the method and having a softening point of about 50 ° C to about 140 ° C.

The epoxy resin may have a viscosity deviation of about 5% or less at 120 ° C.

In still another aspect, the present invention provides an epoxy resin composition for sealing a semiconductor device comprising the epoxy resin, the curing agent, and the inorganic filler according to the present invention, and a molded article molded using the same.

The epoxy resin prepared according to the present invention may have a softening point of about 50 ° C. to about 140 ° C., and thus may be usefully applied to a semiconductor packaging process without being used in combination with other epoxy resins.

In addition, the epoxy resin prepared according to the present invention has a low shrinkage and low elastic properties after molding, including a polycyclic structure.

1 is a view showing a differential scanning calorimeter graph of Example 1.

2 is a view showing a differential scanning calorimeter graph of Example 4. FIG.

3 is a view showing a differential scanning calorimeter graph of Comparative Example 1. FIG.

4 is a view showing a differential scanning calorimeter graph of Comparative Example 4.

EMBODIMENT OF THE INVENTION Hereinafter, this invention is demonstrated more concretely.

The present inventors have studied to develop an epoxy resin having low shrinkage and low elasticity and having a softening point suitable for a semiconductor packaging process. As a result, the bifunctional monomolecular epoxy compound containing a polycyclic structure is melted and then cooled. When manufacturing an epoxy resin by the method, it turned out that the above object can be achieved and completed this invention.

First, the manufacturing method of the epoxy resin which concerns on this invention is demonstrated.

Method for producing an epoxy resin according to the present invention comprises the steps of melting the bifunctional mono-molecular epoxy compound containing a polycyclic structure above the melting temperature of the bi-functional monomolecular epoxy compound, and cooling the molten epoxy compound It includes.

In this case, the polycyclic structure contained in the bifunctional monomolecular epoxy compound is not limited thereto, but may include, for example, one or more selected from the group consisting of fluorene, anthracene, naphthalene, and biphenyl. According to the researches of the present inventors, when using an epoxy resin prepared by melting and cooling the bifunctional monomolecular epoxy compound including the polycyclic structure as described above, low shrinkage, low elastic properties can be realized.

Specifically, the bifunctional monomolecular epoxy compound including the polycyclic structure may be a compound represented by the following Formula (1).

[Formula 1]

In Formula 1, X and Y are each independently hydrogen or an alkyl group having 1 to 10, n is an integer of 1 to 5, m is an integer of 1 to 5.

For example, the compound represented by Chemical Formula 1 may be a compound represented by Chemical Formulas 1-1 to 1-3, but is not limited thereto.

[Formula 1-1]

[Formula 1-2]

[Formula 1-3]

According to the production method of the present invention, the bifunctional monomolecular epoxy compound including the polycyclic structure as described above is heated to melt above the melting temperature of the compound. The heating temperature may vary depending on the type of bifunctional monomolecular epoxy compound used, for example, about 150 ° C to about 250 ° C, and preferably about 180 ° C to about 200 ° C. When the bifunctional monomolecular epoxy compound is heated above the melting temperature as described above, as the compounds are melted, the orientation and arrangement of the molecules are lost and a homogenous molten state is obtained.

Once the bifunctional monomolecular epoxy compounds are fully melted, the molten compounds are cooled. In this case, the cooling may be performed by cooling the molten compounds to room temperature, for example, cooling to a temperature range of about 20 ℃ to about 30 ℃. Through this process, the molten bifunctional monomolecular epoxy compounds are transformed into an amorphous solid epoxy resin.

In general, most epoxy resins including polycyclic structures such as fluorene, anthracene, naphthalene, biphenyl, etc. have the advantage of low shrinkage and elastic modulus, but are mixed in the kneading process because they form a crystalline resin having a high melting point. It is difficult to apply to the resin composition for sealing a semiconductor device because there is such a problem that the particles can be discharged, and the mold inlet during the transfer molding or the appearance defect is generated during transfer molding. However, when the bifunctional epoxy compound having a polycyclic structure is melted and then cooled to prepare an epoxy resin as in the present invention, an amorphous epoxy resin composition having a polycyclic structure can be prepared.

According to the study of the inventors, the epoxy resin of the present invention prepared by the above method shows a peak in the temperature range of about 50 ℃ to about 130 ℃ in the graph measured by differential scanning calorimetry, and from about 130 ℃ It has a characteristic that no significant peak appears in the temperature range of about 250 ° C. This is because crystalline epoxy resins including polycyclic structures such as fluorene, anthracene, naphthalene, biphenyl, etc., show peaks only in the temperature range of about 130 ° C to about 250 ° C, or about 50 ° C to about 130 ° C and about 130 ° C. It is a characteristic different from that at which peaks all appear at from about 250 ° C., showing that the epoxy resin prepared according to the present invention has an amorphous structure. In this case, the differential scanning calorimetry is to heat the epoxy resin to 200 ℃ at a heating rate of 10 ℃ / min, cooled to 0 ℃ at a cooling rate of 10 ℃ / min, and then to 200 ℃ at a temperature rising rate of 10 ℃ / min Was performed.

As described above, the epoxy resin of the present invention has an amorphous structure, and thus has a low softening point and a viscosity deviation, and thus can be applied alone to a semiconductor packaging process. Specifically, the epoxy resin of the present invention prepared by the above method has a softening point of about 50 ℃ to about 140 ℃, the viscosity deviation at 120 ℃ is about 5% or less. In the present specification, the viscosity deviation means a value calculated by multiplying 100 by measuring the viscosity of the epoxy resin five times at 120 ° C., then dividing the difference between the maximum value and the minimum value of the measured viscosity by the viscosity average value.

On the other hand, since the epoxy resin of the present invention includes a bulky polycyclic structure, it has low shrinkage and low elasticity.

Next, the epoxy resin composition for semiconductor element sealing of this invention is demonstrated. The epoxy resin composition for semiconductor element sealing of this invention contains the above-mentioned epoxy resin, hardening | curing agent, and inorganic filler of this invention.

(A) epoxy resin

The epoxy resin is a manufacturing method of the present invention described above, that is, the step of melting a bifunctional monomolecular epoxy compound containing a polycyclic structure by heating above the melting temperature of the bifunctional monomolecular epoxy compound, and the molten epoxy compound An epoxy resin prepared by a manufacturing method comprising the step of cooling the epoxy resin, wherein the softening point is about 50 ° C to about 140 ° C, and the viscosity variation at 120 ° C is about 5% or less. Specific contents of the epoxy resin are the same as described above.

The epoxy resin may be included in about 0.5% to about 20% by weight of the epoxy resin composition for sealing semiconductor devices. Specifically, about 1% to about 12% by weight may be included. More specifically, it may be included in an amount of about 3% by weight to about 15% by weight.

(B) curing agent

As the curing agent, curing agents generally used for sealing semiconductor devices may be used without limitation. Preferably, the curing agent is a phenol aralkyl type phenol resin, a phenol phenol novolak type phenol resin, a xylok type phenol resin, a cresol novolak type phenol resin, a naphthol type phenol resin, a terpene type phenol resin, a polyfunctional type phenol resin. Phenol resins such as dicyclopentadiene-based phenol resins, and novolak-type phenol resins synthesized from bisphenol A and resol may be used.

Specifically, the curing agent may include one or more of phenol novolak-type phenol resin, xylox phenol resin, phenol aralkyl type phenol resin, and polyfunctional phenol resin.

The phenol novolak type phenol resin may be, for example, a phenol novolak type phenol resin represented by the following [Formula 2], and the phenol aralkyl type phenol resin is, for example, represented by the following [Formula 3] It may be a phenol aralkyl type phenol resin having a novolak structure containing a biphenyl derivative in a molecule thereof. In addition, the xylol-type phenolic resin may be, for example, a xyloxyl-phenolic resin represented by the following [Formula 4], and the polyfunctional phenolic resin is, for example, represented by the following [Formula 5] It may be a polyfunctional phenol resin containing the repeating unit represented.

[Formula 2]

In Formula 2, d is 1 to 7.

[Formula 3]

In [Formula 3], the average value of e is 1 to 7.

[Formula 4]

In [Formula 4], the average value of f is 0 to 7.

[Formula 5]

The average value of g in [Formula 5] is 1 to 7.

The phenol novolak-type phenolic resin represented by Chemical Formula 2 has a short crosslinking point spacing, and when reacted with an epoxy resin, the crosslinking density becomes high, thereby increasing the glass transition temperature of the cured product, thereby lowering the coefficient of linear expansion of the cured product. The curvature of a package can be suppressed. The phenol aralkyl type phenol resin represented by Chemical Formula 3 forms a carbon layer (char) by reacting with an epoxy resin to block the transfer of heat and oxygen in the surroundings to achieve flame retardancy. The xylox phenol resin represented by the formula (4) is preferable in view of fluidity and reliability strengthening of the resin composition. The polyfunctional phenol resin containing the repeating unit represented by the formula (5) is preferable in view of enhancing the high temperature bending characteristics of the epoxy resin composition.

These curing agents may be used alone or in combination, and may also be used as an addition compound made by performing a linear reaction such as a melt master batch with other components such as an epoxy resin, a curing accelerator, a releasing agent, a coupling agent, and a stress relaxation agent.

The curing agent may be included in about 0.1% to about 13% by weight of the epoxy resin composition. Preferably from about 0.1% to about 10% by weight may be included. More preferably from about 0.1% to about 8% by weight.

The mixing ratio of the epoxy resin and the curing agent may be appropriately adjusted according to the required physical properties of the package. For example, the chemical equivalent ratio of the epoxy resin to the curing agent may be about 0.95 to about 3. Specifically, about 1 to about 2. More specifically, it may be about 1 to about 1.75.

(C) inorganic filler

As the inorganic filler, general inorganic fillers used in semiconductor sealing materials may be used without limitation, and are not particularly limited. For example, as the inorganic filler, fused silica, crystalline silica, calcium carbonate, magnesium carbonate, alumina, magnesia, clay, talc, calcium silicate, titanium oxide, antimony oxide, glass fiber, etc. may be used. Can be. These may be used alone or in combination.

Preferably, molten silica having a low coefficient of linear expansion is used to reduce stress. Fused silica refers to amorphous silica having a specific gravity of 2.3 or less, and also includes amorphous silica made by melting crystalline silica or synthesized from various raw materials. The shape and particle size of the molten silica are not particularly limited, but the spherical molten silica having a spherical molten silica having an average particle diameter of about 5 μm to about 30 μm and a spherical molten silica having an average particle diameter of about 0.001 μm to about 1 μm It is preferred to include a molten silica mixture comprising about 1% to about 50% by weight to about 40% to about 100% by weight of the total filler. Moreover, according to a use, the maximum particle diameter can be adjusted to any one of about 45 micrometers, about 55 micrometers, and about 75 micrometers, and can be used. In the spherical molten silica, conductive carbon may be included as a foreign material on the silica surface, but it is also important to select a material containing less polar foreign matter.

The amount of the inorganic filler used depends on the required physical properties such as formability, low stress, and high temperature strength. In embodiments, the inorganic filler may include about 70% to about 95% by weight, for example about 80% to about 90% by weight of the epoxy resin composition. For example from about 83% to about 87% by weight. Within this range, flame retardancy, fluidity and reliability of the epoxy resin composition can be ensured.

(D) other components

In addition to the above components, the epoxy resin composition may further include one or more of a curing accelerator, a coupling agent, and a colorant, as necessary.

A hardening accelerator is a substance which accelerates reaction of an epoxy resin and a hardening | curing agent. As said hardening accelerator, a tertiary amine, an organometallic compound, an organophosphorus compound, an imidazole, a boron compound, etc. can be used, for example. Tertiary amines include benzyldimethylamine, triethanolamine, triethylenediamine, diethylaminoethanol, tri (dimethylaminomethyl) phenol, 2-2- (dimethylaminomethyl) phenol, 2,4,6-tris (diaminomethyl ) Phenol and tri-2-ethylhexyl acid salt.

Specific examples of the organometallic compound include chromium acetylacetonate, zinc acetylacetonate, nickel acetylacetonate, and the like. Organophosphorus compounds include tris-4-methoxyphosphine, tetrabutylphosphonium bromide, tetraphenylphosphonium bromide, phenylphosphine, diphenylphosphine, triphenylphosphine, triphenylphosphine triphenylborane, triphenylphosphate And pin-1,4-benzoquinones adducts. The imidazoles include 2-phenyl-4methylimidazole, 2-methylimidazole, # 2-phenylimidazole, # 2-aminoimidazole, 2-methyl-1-vinylimidazole, and 2-ethyl-4. -Methylimidazole, 2-heptadecylimidazole, and the like, but are not limited thereto. Specific examples of the boron compound include tetraphenylphosphonium-tetraphenylborate, triphenylphosphine tetraphenylborate, tetraphenylboron salt, trifluoroborane-n-hexylamine, trifluoroborane monoethylamine, tetrafluoro Roboranetriethylamine, tetrafluoroboraneamine, and the like. In addition, 1, 5- diazabicyclo [4.3.0] non-5-ene (1, 5- diazabicyclo [4.3.0] non-5-ene: DBN), 1, 8- diazabicyclo [5.4. 0] undec-7-ene (1,8-diazabicyclo [5.4.0] undec-7-ene: DBU) and phenol novolak resin salts, and the like.

More specifically, an organophosphorus compound, a boron compound, an amine type, or an imidazole series hardening accelerator can be used individually or in mixture as said hardening accelerator. The curing accelerator may also use an epoxy resin or an adduct made by preliminary reaction with a curing agent.

In the present invention, the amount of the curing accelerator may be included in an amount of about 0.01 wt% to about 2 wt% based on the total weight of the epoxy resin composition. Specifically, about 0.02 wt% to about 1.5 wt% may be included. More specifically, about 0.05% to about 1% by weight may be included. In the above range, there is an advantage that the curing of the epoxy resin composition is promoted and the degree of curing is also good.

The coupling agent may be a silane coupling agent. The said silane coupling agent may react between an epoxy resin and an inorganic filler, and what is necessary is just to improve the interface strength of an epoxy resin and an inorganic filler, The kind is not specifically limited. Specific examples of the silane coupling agent include epoxysilane, aminosilane, ureidosilane, mercaptosilane, and the like. The coupling agents may be used alone or in combination.

The coupling agent may be included in an amount of about 0.01 wt% to about 5 wt% based on the total weight of the epoxy resin composition. Preferably from about 0.05% to about 3% by weight. More preferably about 0.1% to about 2% by weight. In the above range, the strength of the cured epoxy resin composition is improved.

The colorant is for laser marking of the semiconductor device encapsulant, and may include, for example, carbon black, titanium nitride, titanium black, or a mixture thereof.

The colorant may be included in about 0.05% to about 4% by weight of the epoxy resin composition. Within this range, incomplete marking of the epoxy resin composition can be prevented from occurring, soot can be prevented from occurring due to sooting during marking, and electrical insulation of the resin composition can be prevented from deteriorating.

In addition, the epoxy resin composition is higher fatty acid in the range that does not impair the object of the present invention; Higher fatty acid metal salts; And release agents such as ester waxes and carnauba waxes; Stress relieving agents such as modified silicone oil, silicone powder, and silicone resin; Antioxidants such as Tetrakis [methylene-3- (3,5-di-tertbutyl-4-hydroxyphenyl) propionate] methane; And the like may be further added as necessary.

On the other hand, the epoxy resin composition is uniformly sufficiently mixed with the above components at a predetermined mixing ratio using a Henschel mixer or Lodige mixer, and then roll-mill or kneader ( kneader), and then cooled and milled to obtain a final powder product.

The epoxy resin composition of the present invention as described above can be usefully applied to semiconductor devices, especially thin film type semiconductor devices that require low shrinkage and low elastic properties. As a method of sealing a semiconductor element using the epoxy resin composition obtained in the present invention, a low pressure transfer molding method can be generally used. However, molding may also be performed by injection molding or casting.

Hereinafter, the configuration and operation of the present invention through the preferred embodiment of the present invention will be described in more detail. However, this is presented as a preferred example of the present invention and in no sense can be construed as limiting the present invention.

Details that are not described herein will be omitted since those skilled in the art can sufficiently infer technically.

Example

Hereinafter, the present invention will be described in detail through specific examples.

Example  One

The bifunctional monomolecular epoxy compound represented by the following Chemical Formula 1-1 was melted by applying heat in an oven at 200 ° C. for 1 hour, cooled at room temperature, and then ground to prepare an epoxy resin.

[Formula 1-1]

Example  2

An epoxy resin was prepared in the same manner as in Example 1 except for using a bifunctional monomolecular epoxy compound represented by Chemical Formula 1-2.

[Formula 1-2]

Example  3

An epoxy resin was prepared in the same manner as in Example 1 except for using a bifunctional monomolecular epoxy compound represented by Chemical Formula 1-3.

[Formula 1-3]

Example  4

An epoxy resin was prepared in the same manner as in Example 1, except that SE-250 (Shin-a T & C), a commercially available fluorene-based monofunctional epoxy compound, was used.

Comparative example  One

The bifunctional monomolecular epoxy compound represented by Chemical Formula 1-1 was used as an epoxy resin without melting and cooling treatment.

Comparative example  2

The bifunctional monomolecular epoxy compound represented by Chemical Formula 1-2 was used as an epoxy resin without melting and cooling treatment.

Comparative example  3

The bifunctional monomolecular epoxy compound represented by Chemical Formula 1-3 was used as an epoxy resin without melting and cooling treatment.

Comparative example  4

A commercial fluorene-based bifunctional monomolecular epoxy compound SE-250 (Shin-a T & C) was used as the epoxy resin without melting and cooling treatment.

The epoxy equivalent, softening point, glass transition temperature, viscosity, and viscosity deviation of the epoxy resins of Examples 1 to 4 and Comparative Examples 1 to 4 were measured according to the following measuring methods. The measurement results are shown in the following [Table 1].

In addition, the graphs measured according to the differential scanning calorimetry of the epoxy resins of Examples 1 and 4 and Comparative Examples 1 and 4 are shown in FIGS. 1 and 2.

Property Measurement Method

(1) Epoxy equivalent: Weigh 0.200 g of the epoxy resin to be measured and place it in a 100 mL Erlenmeyer flask, add 15 mL of methylene chloride to dissolve all solids, and 3 drops of crystal violet indicator solution, TBAB ( 5 mL of a tetrabutyl ammonium bromide solution and a magnetic stirring bar were added and stirred. The titration was performed by slowly injecting a perchloric acid solution into a Erlenmeyer flask using a burette or dropping funnel, and the volume of the perchloric acid solution was measured at the time of purple to green color on the solution. Then, the epoxy equivalent of the epoxy resin was calculated according to the following formula.

Epoxy equivalent (EEQ) = (1000 × We) / (N × V)

We = weight of measured epoxy resin

N = concentration of perchloric acid solution used

V = volume of perchloric acid used for titration

(2) Softening point: The epoxy resin sample is placed in the guide and then connected with the sample kit. After setting the FP-90 Central Processor and FP-83HT to the start temperature, the measurement part was combined with the sample kit and the run was pressed to proceed with the measurement. Two measurements were made for one sample, and the average value of the measured values was described as the softening point.

(3) Glass Transition Temperature (Tg) and Differential Scanning Calorimetry: Using a DSC (Discovery, TA Instrument) equipment, put a 10mg epoxy resin sample in a 6mm Al pan, place a reference pan and sample pan in the DSC cell and measure it. It was. After stabilization at 40 ° C. under nitrogen gas, the temperature was raised to 200 ° C. at a heating rate of 10 ° C./min, followed by primary heating, and then cooled to 0 ° C. at the same rate. Thereafter, the epoxy resin sample was heated to 200 ° C. at a temperature increase rate of 10 ° C./min.

(4) Viscosity and Viscosity Deviation: After stabilizing the viscometer (CAP-2000 + H) at 120 ° C, 300 mg of the epoxy resin sample was added to the measuring unit and the spindle was lowered. After pressing the Run button to measure the viscosity value, acetone is used to clean the sample and spindle, and then stabilize the temperature. The procedure was repeated five times for one sample to obtain five measurements and to average the measurements. The difference between the maximum and minimum values of the measurements was then divided by the average of the measurements and multiplied by 100 to represent the viscosity deviation.

As shown in Table 1, the epoxy resins of Examples 1 to 4 melted and cooled according to the production method of the present invention had a softening point of 88 ° C to 131 ° C, and had a low viscosity deviation of 5% or less. On the other hand, it can be confirmed that the epoxy resins of Comparative Examples 1 to 4 have a relatively high softening point. In addition, in Comparative Examples 1 to 3, it had a softening point higher than 120 ° C., so that viscosity measurement at 120 ° C. was impossible, and in Comparative Example 4, high viscosity and viscosity deviation were compared to Example 4 made of the same compound. It can be seen that.

On the other hand, through Table 1, it can be seen that Examples 1 to 4 have the same epoxy equivalent as Comparative Examples 1 to 4, respectively. This means that the composition of the epoxy compound was not changed by the production method of the present invention.

In addition, in the case of the epoxy resin prepared according to the manufacturing method of the present invention through FIGS. 1 and 2, in the graph measured by the differential scanning calorimetry has a peak in the temperature range of 50 ℃ to 130 ℃, 130 ℃ It can be seen that the temperature does not have a peak in the range of 250 ° C. 3 and 4, in comparison, the epoxy resin of 1 shows a peak only in the temperature range of 130 ° C to 250 ° C, and the epoxy resin of Comparative Example 4 has a temperature range of 50 ° C to 75 ° C and 130 ° C. The peaks appeared in the temperature range of 175 캜. This shows that the change in the physical properties of the epoxy resin through the melting and cooling treatment.

Although the embodiments of the present invention have been described above, the present invention is not limited to the above embodiments and can be manufactured in various forms, and a person of ordinary skill in the art to which the present invention pertains has the technical spirit of the present invention. However, it will be understood that other specific forms may be practiced without changing the essential features. Therefore, it should be understood that the embodiments described above are exemplary in all respects and not restrictive.

Claims (9)

1. Heating and melting the bifunctional monomolecular epoxy compound including the polycyclic structure above the melting temperature; And

   Method for producing an epoxy resin comprising the step of cooling the molten epoxy compound.
2. The method of claim 1,

   The polycyclic structure is a method for producing an epoxy resin comprising at least one selected from the group consisting of fluorene, anthracene, naphthalene and biphenyl.
3. The method of claim 1,

   The bifunctional monomolecular epoxy compound containing the polycyclic structure in the polycyclic structure is a compound represented by the following general formula (1).

   [Formula 1]

   

   In Formula 1, X and Y are each independently hydrogen or an alkyl group having 1 to 10, n is an integer of 1 to 5, m is an integer of 1 to 5.
4. The method of claim 1,

   The melting step is a method of producing an epoxy resin is carried out by heating the bifunctional monomolecular epoxy compound comprising a polycyclic structure to about 150 ℃ to about 250 ℃.
5. The method of claim 1,

   Wherein the cooling step cools the molten epoxy compound to about 20 ° C to about 30 ° C.
6. It is an epoxy resin manufactured by the manufacturing method of the epoxy resin in any one of Claims 1-5,

   Epoxy resin having a softening point of about 50 ° C to about 140 ° C.
7. The method of claim 6,

   The epoxy resin is an epoxy resin having a viscosity deviation of about 5% or less at 120 ℃.
8. The epoxy resin composition for semiconductor element sealing containing the epoxy resin of Claim 6, a hardening | curing agent, and an inorganic filler.
9. A molded article molded using the epoxy resin composition for sealing a semiconductor element of claim 8.

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