CN114276651A - Epoxy resin composition suitable for low-voltage packaging and preparation method thereof - Google Patents
Epoxy resin composition suitable for low-voltage packaging and preparation method thereof Download PDFInfo
- Publication number
- CN114276651A CN114276651A CN202111608458.1A CN202111608458A CN114276651A CN 114276651 A CN114276651 A CN 114276651A CN 202111608458 A CN202111608458 A CN 202111608458A CN 114276651 A CN114276651 A CN 114276651A
- Authority
- CN
- China
- Prior art keywords
- epoxy resin
- resin composition
- formula
- low
- micropowder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Abstract
The invention relates to an epoxy resin composition suitable for low-pressure packaging, which mainly comprises epoxy resin, phenolic resin, inorganic filler, reinforcing material and curing accelerator. The epoxy resin comprises epoxy resin represented by formula (1) and/or formula (2). The reinforcing material can be a fiber material or nano-scale and submicron-scale micro-powder with high specific surface area. The invention also discloses a preparation method of the epoxy resin composition suitable for low-voltage packaging. The epoxy resin composition can meet the requirement of low-pressure packaging and rapid curing, and has the advantages of high-temperature bending strength, low stress, good moisture resistance, strong cracking resistance, high reliability and the like. The method is particularly suitable for products with low-voltage packaging and curing requirements, such as packaging of various capacitors.
Description
Technical Field
The invention relates to an epoxy resin composition, in particular to an epoxy resin composition suitable for low-voltage encapsulation, and also discloses a preparation method of the epoxy resin composition. The invention belongs to the technical field of electronic packaging materials, and can be used as an electronic packaging material special for low-voltage packaging.
Background
The epoxy plastic package material mainly comprises epoxy resin, a curing agent, a curing accelerator and various additives. The epoxy molding compound has many excellent properties, such as better thermal stability, insulativity, good thermodynamic property and lower cost, and is widely applied to the packaging of electronic components. When the traditional epoxy plastic packaging material is used for packaging a capacitor, particularly for packaging a solid laminated aluminum capacitor and a chip tantalum capacitor, because a manufacturer of the capacitor generally adopts lower injection molding pressure in a packaging process, the influence on the electrical property of an internal device is reduced to the maximum extent, the common epoxy plastic packaging material has many defects, such as leakage, air holes and the like, and the common epoxy plastic packaging material is easy to crack after moisture absorption and backflow. This puts higher demands on the epoxy molding compound.
For example, patent publication CN 102898786a discloses an epoxy resin molding compound for tantalum capacitor encapsulation and a preparation method thereof, which utilizes multifunctional epoxy resin, multifunctional phenolic resin, reactive diluent, stress releasing agent, accelerator, and inorganic filler. Adding the components of the epoxy molding compound into a mixer, uniformly mixing, extruding by a double-screw extruder at the temperature of 100-150 ℃, cooling, crushing, and pre-pressing for molding to obtain the epoxy molding compound for packaging the tantalum capacitor.
Disclosure of Invention
The invention aims to overcome the defects in the prior art and provide the epoxy resin composition which can meet the requirement of low-pressure packaging and has the advantages of low stress, good moisture resistance, strong cracking resistance, high reliability and the like and is suitable for low-pressure packaging.
Another object of the present invention is to provide a process for producing the aforementioned epoxy resin composition.
The invention is realized by the following technical scheme. The invention relates to an epoxy resin composition suitable for low-pressure packaging, which mainly comprises epoxy resin, phenolic resin, inorganic filler, reinforcing material and curing accelerator; the content of the epoxy resin accounts for 1-15% of the total content of the epoxy resin composition, and the content of the epoxy resin is further preferably 2-10%; the epoxy resin comprises epoxy resin shown in a formula (1) and/or a formula (2), and the content of the epoxy resin shown in the formula (1) and/or the formula (2) accounts for at least 50% of the total content of the epoxy resin;
formula (1), n is 1-5, n is an integer;
in the formula (2), R can be any one of the following structures a), b), c) and d):
the phenolic resin used in the present invention may comprise a phenolic resin having a structure of the formula [ 3 ]. The phenolic resin can also comprise one or a mixture of several of linear type, polyfunctional type, new phenol type, polycyclic aromatic type and the like, and the content of the phenolic resin accounts for 1-15 percent of the total content of the epoxy resin composition, and is more preferably 2-8 percent.
In the formula [ 3 ], n is 0 to 10.
In the invention:
the structural compound products in the formulas (1), (2) and (3) can be products with the structural formulas (1), (2) and (3) disclosed in the prior art or sold in the market. Among them, the product of the formula [ 1 ] is preferably a product having a product name of HP5000, which is commercially available from DIC (DIC corporation, Dainippon ink chemical Co.). In the formula [ 2 ], when R is a) structure, the product of the formula [ 2 ] is preferably a product which is produced by DIC company and sold under the product name HP 4770; when R is the structure of c), the product of the formula [ 2 ] is preferably a product manufactured and sold by Nippon Chemicals (Nippon Chemicals Co., Ltd.) under the product name NC 7000L; when R is the structure of c), the product of the formula [ 2 ] is preferably a product which is manufactured by chemical drugs of Japan and sold under the product name NC 7300L; when R is d), the product of formula [ 2 ] is preferably a product having the name HP6000, which is manufactured and marketed by DIC. The product of the formula [ 3 ] is preferably a product produced by Nippon Ming & Kogyo (Ming & Kogyo Co., Ltd.) and sold under the product name MEH-7851 SS.
The inorganic filler used in the invention is usually silica micropowder filler, and can be one or more of fused spherical silica micropowder, fused angular silica micropowder and crystalline silica micropowder, preferably the fused spherical silica micropowder or the fused spherical silica micropowder and the fused angular silica micropowder are mixed for use, and the content of the silica micropowder accounts for 65-85% of the content of the epoxy resin composition.
The reinforcing material used in the present invention may be a fibrous material. The fiber material may be, but is not limited to, glass fiber, carbon fiber. The form of the alkali-free glass fiber may be various forms such as fiber bundles, fiber yarns, fiber powder and the like, and alkali-free glass fiber yarns with the diameter of 2um to 10um are preferred.
The reinforcing material of the present invention may be a nano-sized or submicron-sized fine powder having a high specific surface area. Can be various micro powders which can be used as filling materials, such as nano-scale and submicron-scale silicon dioxide micro powder, alumina micro powder, titanium dioxide micro powder, calcium carbonate micro powder, calcium oxide micro powder, talcum powder, mica powder and the like.
The reinforcing material used in the invention can be independently used as a fiber filler, can also be independently used as nano-grade and submicron-grade micro-powder with high specific surface area, and can also be used in a compounding way. The content of the reinforcing material is 1 to 30% of the total content of the epoxy resin composition, and the content is more preferably 3 to 15%. The curing accelerator used in the present invention contains a condensate of an epoxy resin and an amine, and the curing accelerator accounts for 0.01 to 3% of the content of the epoxy resin composition.
The epoxy resin composition of the present invention may further contain a release agent, a colorant, a coupling agent, a stress releasing agent, and an ion scavenger. The release agent may be ester wax and polyethylene wax, preferably a wax of small polarity or non-polar nature, and is contained in an amount of 0.01 to 0.5%, preferably 0.01 to 0.3%, based on the total content of the epoxy resin composition. The coupling agent may be a silane coupling agent or a phthalate coupling agent, preferably a silane coupling agent containing a mercapto group, an amino group, a benzene ring, and an epoxy group, and more preferably a silane coupling agent containing an epoxy group. The content of the coupling agent is 0.01 to 1.5%, preferably 0.1 to 0.5%, based on the total content of the epoxy resin composition.
The technical problem to be solved by the invention can be further realized by the following technical scheme. The invention also discloses a preparation method of the composition, which comprises the following steps:
(1) preparation of an intermediate: heating and melting the epoxy resin and the release agent, fully and uniformly mixing at the temperature of 100-150 ℃, discharging in a hot state, cooling and then crushing for later use;
(2) preparation of primary extrudate: the intermediate of epoxy resin and release agent in the epoxy resin composition, phenolic resin, reinforced filler, part of silica micropowder filler (60-80% of the total content in the formula), coloring agent, coupling agent, stress releasing agent and ion trapping agent are weighed, stirred and mixed according to a certain proportion, extruded by a double screw, tableted, cooled and crushed to obtain the primary extruded material. Wherein the twin-screw extrusion temperature is controlled between 80 and 110 ℃.
(3) Preparation of epoxy resin composition by two-shot extrusion: weighing a certain amount of primary extrusion material, adding the rest of the silicon micropowder and the curing accelerator according to the formula proportion, stirring and mixing, extruding by a double screw (the mixing temperature is 90-130 ℃), tabletting, cooling and crushing to obtain the epoxy resin composition, thus obtaining powder. And prepressing and molding the powder to obtain the epoxy resin composition cake material.
Compared with the prior art, the invention has the following beneficial effects:
1. the epoxy resin composition is prepared by using epoxy resin with a specific structure, phenolic resin, silicon micropowder filler and reinforcing filler, and a condensate of epoxy resin and amine as a curing accelerator, can meet the requirement of low-pressure packaging, and has the advantages of low stress, good moisture resistance, strong cracking resistance, high reliability and the like.
2. The composition of the invention can realize excellent cracking resistance under low packaging pressure (30-40 kg). Can meet the requirements of the epoxy resin composition for low-stress packaging, and is particularly suitable for packaging solid laminated aluminum capacitors and chip tantalum capacitors and special production process.
3. The method effectively ensures the excellent performance of the product through a secondary extrusion process.
Detailed Description
In order to further understand the summary, inventive features and effects of the present invention, the following examples are given and described in detail, but the present invention is not limited to these examples.
In the following examples, the epoxy resin and the release agent were prepared as intermediates, and then the epoxy resin composition was prepared by a secondary extrusion process according to the method disclosed in the present disclosure.
Example 1, a low pressure encapsulated epoxy resin composition:
the components were weighed in the proportions described in example 1 of table 1, wherein the epoxy resin of formula [ 1 ] and the release agent were previously made into intermediates, the epoxy resin of formula [ 1 ], the phenol resin of formula [ 3 ], the fused spherical silica micropowder filler (60% of the total content in the formula), the fiber filler (glass fiber yarn, diameter 5um, length 3mm), the epoxy silane coupling agent, the release agent, and the colorant were added in the proportions, weighed and mixed uniformly, the mixed materials were melt-kneaded at 80 ℃ in a twin-screw extruder, and the pellets were pulverized after cooling. Weighing a certain amount of the primary extrusion material, adding the rest fused spherical silica micropowder and the curing accelerator according to the proportion of the example 1 in the table 1, fusing and mixing the mixed material in a double-screw extruder at 100 ℃, tabletting, cooling, crushing, performing pre-pressing molding by a cake making machine, and testing the performance index of the product.
Example 2, a low-pressure encapsulated epoxy resin composition,
the components are weighed according to the proportion of example 2 in Table 1, wherein the epoxy resin with the formula [ 2 ] and the release agent are prepared into an intermediate in advance, the epoxy resin with the formula [ 2 ], the phenolic resin with the formula [ 3 ], the inorganic filler (wherein the proportion of the fused spherical silicon micropowder to the fused angular silicon micropowder is 8: 1, the inorganic filler is added in 80% by first mixing and extrusion), the fiber filler (glass fiber yarn, the diameter of 10 microns and the length of 3mm), the epoxy silane coupling agent, the release agent and the coloring agent are weighed according to a certain proportion and uniformly mixed, the mixed materials are melted and mixed in a twin-screw extruder at 80 ℃, and are crushed after tabletting and cooling. Weighing a certain amount of the primary extrusion material, adding the rest inorganic filler and the curing accelerator according to the proportion of example 2 in the table 1, melting and mixing the mixed material in a double-screw extruder at 100 ℃, tabletting, cooling, crushing, performing pre-pressing molding by a cake making machine, and testing the performance index of the product.
Example 3, a low-pressure encapsulated epoxy resin composition,
the components are weighed according to the proportion of example 3 in the table 1, wherein the formula [ 1 ] and the formula [ 2 ] epoxy resin and the release agent are prepared into an intermediate in advance, the formula [ 1 ] and the formula [ 2 ] epoxy resin, the formula [ 3 ] phenolic resin, the fused spherical silicon micropowder (80% of the total content in the formula), the fiber filler (glass fiber, 10 mu m in diameter and 3mm in length), the epoxy silane coupling agent, the release agent and the coloring agent are added according to the proportion of the formula, the materials are weighed and uniformly mixed according to a certain proportion, the mixed materials are melted and mixed at the temperature of 80 ℃ in a double-screw extruder, and the materials are crushed after tabletting and cooling. Weighing a certain amount of the primary extrusion material, adding the rest fused spherical silica micropowder and the curing accelerator according to the proportion of example 3 in the table 1, melting and mixing the mixed material in a double-screw extruder at 100 ℃, tabletting, cooling, crushing, performing pre-pressing molding by a cake making machine, and testing the performance index of the product.
Example 4, a low-pressure encapsulated epoxy resin composition,
the components are weighed according to the proportion of example 4 in table 1, wherein the formula [ 1 ] epoxy resin and the release agent are prepared into an intermediate in advance, the formula [ 1 ] epoxy resin, the formula [ 3 ] phenolic resin, the fused spherical silicon micropowder (80 percent of the total content in the formula), the submicron silica micropowder (the average particle size is 0.2um and the maximum particle size is 1um), the epoxy silane coupling agent, the release agent and the colorant are added according to the formula proportion, the materials are weighed according to a certain proportion and mixed uniformly, the mixed materials are melted and mixed in a double screw extruder at 80 ℃, and the materials are crushed after tabletting and cooling. Weighing a certain amount of the primary extrusion material, adding the rest fused spherical silica micropowder and the curing accelerator according to the proportion of example 4 in the table 1, melting and mixing the mixed material in a double-screw extruder at 100 ℃, tabletting, cooling, crushing, performing pre-pressing molding by a cake making machine, and testing the performance index of the product.
Example 5, a low-pressure encapsulated epoxy resin composition,
the components are weighed according to the proportion of example 5 in the table 1, wherein the formula [ 2 ] epoxy resin and the release agent are prepared into an intermediate in advance, the formula [ 2 ] epoxy resin, the formula [ 3 ] phenolic resin, the fused spherical silicon micropowder (80 percent of the total content in the formula), the submicron-grade alumina micropowder (average particle size of 0.2um and maximum particle size of 1um), the epoxy silane coupling agent, the release agent and the colorant are added according to the formula proportion, the materials are weighed according to a certain proportion and mixed uniformly, the mixed materials are melted and mixed in a double-screw extruder at 80 ℃, and the materials are crushed after tabletting and cooling. Weighing a certain amount of the primary extrusion material, adding the rest fused spherical silica micropowder and the curing accelerator according to the proportion of example 5 in the table 1, melting and mixing the mixed material in a double-screw extruder at 100 ℃, tabletting, cooling, crushing, performing pre-pressing molding by a cake making machine, and testing the performance index of the product.
Example 6, a low-pressure encapsulated epoxy resin composition, the components are weighed according to the proportion of example 6 in table 1, wherein the formula [ 1 ]/formula [ 2 ] epoxy resin and the release agent are prepared into an intermediate in advance, the formula [ 1 ]/formula [ 2 ] epoxy resin, the formula [ 3 ] phenolic resin, the fused spherical silica powder (80% of the total content in the formula), the submicron silica powder (average particle size of 0.2um, maximum particle size of 1um) and the fiber filler (glass fiber, diameter of 10um, length of 3mm), the epoxy silane coupling agent, the release agent and the colorant are added according to the formula proportion, weighed and mixed uniformly, the mixed materials are melted and mixed in a twin-screw extruder at 80 ℃, and are crushed after tabletting and cooling. Weighing a certain amount of the primary extrusion material, adding the rest fused spherical silica micropowder and the curing accelerator according to the proportion of example 6 in the table 1, melting and mixing the mixed material in a double-screw extruder at 100 ℃, tabletting, cooling, crushing, performing pre-pressing molding by a cake making machine, and testing the performance index of the product.
Comparative example 1 except that general epoxy resin was used, the proportions of the other components were the same as those in example 1 of table 1, and the components were weighed in accordance with the proportions of comparative example 1 of table 1, wherein general epoxy resin and release agent were previously prepared into intermediates, formula general epoxy resin, general phenolic resin, molten spherical silica powder filler (60% of the total content in the formula), fiber filler (glass fiber yarn, diameter 5 μm, length 3mm), epoxy silane coupling agent, release agent, and coloring agent were added in accordance with the formulation proportions, weighed and mixed uniformly, and the mixed materials were melt-kneaded at 80 ℃ in a twin-screw extruder, tableted and cooled, and pulverized. Weighing a certain amount of the primary extrusion material, adding the rest fused spherical silica micropowder and the curing accelerator according to the proportion of comparative example 1 in the table 1, melting and mixing the mixed material in a double-screw extruder at 100 ℃, tabletting, cooling, crushing, performing pre-pressing molding by a cake making machine, and testing the performance index of the product.
Comparative example 2
Except that ordinary phenolic resin is used, the proportion of other components is the same as that of the components in the example 4 in the table 1, the components are weighed according to the proportion of the comparative example 2 in the table 1, wherein the epoxy resin in the formula [ 1 ] and the release agent are prepared into intermediates in advance, the epoxy resin in the formula [ 1 ], the phenolic resin in the formula [ 3 ], fused spherical silicon micropowder (80 percent of the total content in the formula), submicron silicon dioxide micropowder (average particle size of 0.2um and maximum particle size of 1um), an epoxy silane coupling agent, the release agent and a coloring agent are added according to the formula proportion, the materials are weighed and mixed uniformly, the mixed materials are fused and mixed in a double-screw extruder at the temperature of 80 ℃, and the materials are crushed after tabletting and cooling. Weighing a certain amount of the primary extrusion material, adding the rest fused spherical silica micropowder and the curing accelerator according to the proportion of comparative example 2 in the table 1, melting and mixing the mixed material in a double-screw extruder at 100 ℃, tabletting, cooling, crushing, performing pre-pressing molding by a cake making machine, and testing the performance index of the product.
Comparative example 3
Except that no reinforcing filler (fiber filler and submicron reinforcing filler) is used, the proportion of other components is the same as that of the components in the example 6 in the table 1, the components are weighed according to the proportion of the comparative example 6 in the table 1, the components are weighed according to the proportion of the example 6 in the table 1, wherein the formula [ 1 ] or the formula [ 2 ] epoxy resin and the release agent are prepared into an intermediate in advance, the formula [ 1 ] or the formula [ 2 ] epoxy resin, the formula [ 3 ] phenolic resin, the fused spherical silicon powder (80 percent of the total content in the formula), the epoxy silane coupling agent, the release agent and the coloring agent are added according to the formula proportion, the materials are weighed and mixed uniformly, the mixed materials are melted and mixed in a double-screw extruder at the temperature of 80 ℃, and are tableted, cooled and crushed. Weighing a certain amount of the primary extrusion material, adding the rest fused spherical silica micropowder and the curing accelerator according to the proportion of comparative example 6 in the table 1, melting and mixing the mixed material in a double-screw extruder at 100 ℃, tabletting, cooling, crushing, performing pre-pressing molding by a cake making machine, and testing the performance index of the product.
Comparative example 4
Except for using a one-time extrusion process, the components are in the same proportion as the components in example 6 in table 1, and the components are weighed according to the proportion in comparative example 4 in table 1, wherein the formula [ 1 ] or the formula [ 2 ] epoxy resin and the release agent are prepared into intermediates in advance, and the formula [ 1 ] or the formula [ 2 ] epoxy resin, the formula [ 3 ] phenolic resin, fused spherical silicon micropowder, submicron silica micropowder (average particle diameter of 0.2um, maximum particle diameter of 1um) and fiber filler (glass fiber filament, diameter of 10um, length of 3mm), epoxy silane coupling agent, release agent and coloring agent are added according to the formula proportion to be uniformly mixed. And then, melting and mixing the mixed materials in a double-screw extruder at 100 ℃, tabletting, cooling, crushing, performing pre-pressing molding by a cake making machine, and testing the performance index of the product.
The following epoxy resins were used:
epoxy resin with a structure represented by a formula (1) and/or a formula (2), wherein the epoxy resin with the structure represented by the formula (1) is HP5000 of DIC company, the epoxy resin with the structure represented by the formula (2) is HP6000 of DIC company when R is the structure d); ordinary epoxy resins: the o-cresol novolac epoxy resin, CNE-195LL, uses the following phenolic resins: phenolic resin with a structure of a formula (3) is prepared by using Japanese amine and MEH-7851 SS; ordinary phenol resin: phenol novolac resin, Japanese amine and HF-1M;
the following silica micropowder filler was used:
the maximum grain size of the fused spherical silicon micro powder filler is not more than 75um, and the median grain size is 10-20 um.
Melting angular silicon micropowder, the maximum grain diameter is 30um, and the median grain diameter is 5 um.
The following glass fiber fillers were used:
alkali-free glass fiber (diameter 3-10um, length 3mm)
The following micron and submicron fillers were used:
fine silica powder or fine alumina powder having an average particle diameter of 0.2um and a maximum particle diameter of 1um
Curing accelerator: condensates of epoxy resins and amines;
releasing agent: petrolite E2020;
coupling agent: an epoxy silane coupling agent KH 560;
colorant: mitsubishi chemical MA 600;
TABLE 1
The evaluation in the examples was carried out according to the following method:
(1) gelation time
The gelation time(s) was determined as set forth in item 5.3 of SJ/T11197-1999 epoxy Molding Compound.
(2) Flow length:
the flow distance (cm) was determined as the 5.2 spiral flow length of SJ/T11197-1999 epoxy Molding Compound.
(3) And (3) testing the client performance:
and (3) appearance detection: at 175 ℃ and 35kg/cm2And (3) injection molding, pressure packaging the 20V150uf organic sheet type tantalum capacitor, inspecting the appearance of the product after packaging, and curing for 4h at 175 ℃. And after printing and sand blasting are finished, the appearance of the product is checked again. And the appearance is qualified if the filling is poor and no air holes or sand holes exist.
Cracking resistance: after printing and sand blasting are finished, the qualified product absorbs moisture in a moisture box with the temperature of 85 ℃ and the humidity of 85% for 7 days, is directly subjected to reflow soldering for 3 times (wherein the highest set temperature is 255 ℃), is observed whether a cracked product exists by a microscope, and the cracking condition of the product is recorded. The cracking rate of the product is less than or equal to 0.5 percent, and the product is qualified.
Evaluation of electrical properties: the moisture-absorbing reflow-welded product has qualified cracking resistance, and whether the product has short circuit or overlarge current is detected, and the electrical property is judged to be unqualified if the product has short circuit or overlarge current. The electrical property passing rate is 100%, and the product is qualified. The test results are shown in table 2:
TABLE 2 Properties of the examples
Claims (10)
1. An epoxy resin composition suitable for low voltage encapsulation, characterized by: the main components of the material comprise epoxy resin, phenolic resin, inorganic filler, reinforcing material and curing accelerator;
the content of the epoxy resin accounts for 1-15% of the total content of the epoxy resin composition, the epoxy resin comprises epoxy resin shown in a formula (1) and/or a formula (2), and the content of the epoxy resin shown in the formula (1) and/or the formula (2) accounts for at least 50% of the total content of the epoxy resin;
in the formula (1): n is 1-5, n is an integer;
r in the formula [ 2 ] is selected from one of the following a), b), c) and d):
2. the epoxy resin composition suitable for low voltage encapsulation according to claim 1, wherein: the phenolic resin comprises a phenolic resin with a structure shown in a formula (3):
in the formula [ 3 ]: n is 0 to 10.
3. The epoxy resin composition suitable for low-voltage encapsulation according to claim 1 or 2, characterized in that: the phenolic resin also comprises one or a mixture of more of linear, polyfunctional, novel phenolic and polycyclic aromatic phenolic resins, and the content of the phenolic resin accounts for 1-15% of the total content of the epoxy resin composition.
4. The epoxy resin composition suitable for low-voltage encapsulation according to claim 1 or 2, characterized in that: the inorganic filler is silicon micropowder, the silicon micropowder is selected from one or more of fused spherical silicon micropowder, fused angular silicon micropowder and crystalline silicon micropowder, and the content of the silicon micropowder accounts for 65-85% of the content of the epoxy resin composition.
5. The epoxy resin composition suitable for low-voltage encapsulation according to claim 1 or 2, characterized in that: the reinforcing material is a fiber material; the fiber material is selected from glass fiber or carbon fiber, and the form of the fiber material is selected from fiber bundle, fiber filament or fiber powder; the content of the reinforcing material accounts for 1-30% of the content of the epoxy resin composition.
6. The epoxy resin composition suitable for low-voltage encapsulation according to claim 1 or 2, characterized in that: the reinforcing material is nano-scale and submicron-scale micro powder; selected from nano-scale or submicron-scale silicon dioxide micropowder, alumina micropowder, titanium dioxide micropowder, calcium carbonate micropowder, calcium oxide micropowder, talcum powder or mica powder; the content of the reinforcing material accounts for 1-30% of the content of the epoxy resin composition.
7. The epoxy resin composition suitable for low-voltage encapsulation according to claim 1 or 2, characterized in that: the curing accelerator contains a condensate of epoxy resin and amine, and accounts for 0.01-1% of the content of the epoxy resin composition.
8. The epoxy resin composition suitable for low-voltage encapsulation according to claim 1 or 2, characterized in that: the epoxy resin composition also contains one or more of a release agent, a coloring agent, a coupling agent, a stress releasing agent and an ion trapping agent.
9. The epoxy resin composition suitable for low-voltage encapsulation according to claim 1 or 2, characterized in that: epoxy resin composition for low-pressure packaging injection moldingWhen the injection pressure is less than 60kg/cm2Preferably, the injection pressure is 30 to 40kg/cm2。
10. A process for preparing an epoxy resin composition suitable for low-voltage encapsulation according to any one of claims 1 to 9, comprising the steps of:
(1) preparation of an intermediate: heating and melting the epoxy resin and the release agent, fully and uniformly mixing at the temperature of 100-150 ℃, discharging in a hot state, cooling and then crushing for later use;
(2) preparation of primary extrudate: stirring and mixing the intermediate prepared in the step (1), phenolic resin, a reinforcing filler, a silica micropowder filler with the silica micropowder filler content of 60-80% in the composition, a coloring agent, a coupling agent, a stress releasing agent and an ion capturing agent in proportion, extruding by a double screw, tabletting, cooling and crushing to obtain a primary extruded material; wherein the twin-screw extrusion temperature is controlled between 80 ℃ and 110 ℃;
(3) preparation of epoxy resin composition by two-shot extrusion: and taking the primary extruded material, adding the rest part of the silica micropowder filler and the curing accelerator in proportion, stirring, mixing, extruding by a double screw, mixing at the temperature of 90-130 ℃, tabletting, cooling and crushing to obtain the epoxy resin composition powder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111608458.1A CN114276651B (en) | 2021-12-24 | 2021-12-24 | Epoxy resin composition suitable for low-pressure encapsulation and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111608458.1A CN114276651B (en) | 2021-12-24 | 2021-12-24 | Epoxy resin composition suitable for low-pressure encapsulation and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114276651A true CN114276651A (en) | 2022-04-05 |
| CN114276651B CN114276651B (en) | 2023-06-23 |
Family
ID=80875805
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111608458.1A Active CN114276651B (en) | 2021-12-24 | 2021-12-24 | Epoxy resin composition suitable for low-pressure encapsulation and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114276651B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117511475A (en) * | 2022-07-29 | 2024-02-06 | 比亚迪股份有限公司 | Double-component pouring sealant, application thereof and sealant sealing method |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003292734A (en) * | 2002-04-03 | 2003-10-15 | Mitsui Chemicals Inc | Epoxy resin composition and optical part produced by using the same |
| CN102504493A (en) * | 2011-11-18 | 2012-06-20 | 江苏华海诚科新材料有限公司 | Epoxy resin composition applicable to pre-encapsulation of inner interconnection framework system |
| CN105385110A (en) * | 2015-12-25 | 2016-03-09 | 科化新材料泰州有限公司 | Environment-friendly epoxy resin composition and preparing method thereof |
| WO2017099356A1 (en) * | 2015-12-09 | 2017-06-15 | 삼성에스디아이 주식회사 | Method for preparing epoxy resin, epoxy resin, epoxy resin composition for encapsulating semiconductor device, containing same, and molded product molded using same |
| CN107216614A (en) * | 2017-07-10 | 2017-09-29 | 江苏华海诚科新材料股份有限公司 | A kind of composition epoxy resin suitable for fan-out-type wafer-level packaging |
| CN109651762A (en) * | 2018-12-20 | 2019-04-19 | 江苏华海诚科新材料股份有限公司 | High-pressure-resistant epoxy resin composition and preparation method thereof |
| CN113831878A (en) * | 2021-10-22 | 2021-12-24 | 长兴电子材料（昆山）有限公司 | Epoxy resin composition and application thereof |
-
2021
- 2021-12-24 CN CN202111608458.1A patent/CN114276651B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003292734A (en) * | 2002-04-03 | 2003-10-15 | Mitsui Chemicals Inc | Epoxy resin composition and optical part produced by using the same |
| CN102504493A (en) * | 2011-11-18 | 2012-06-20 | 江苏华海诚科新材料有限公司 | Epoxy resin composition applicable to pre-encapsulation of inner interconnection framework system |
| WO2017099356A1 (en) * | 2015-12-09 | 2017-06-15 | 삼성에스디아이 주식회사 | Method for preparing epoxy resin, epoxy resin, epoxy resin composition for encapsulating semiconductor device, containing same, and molded product molded using same |
| CN105385110A (en) * | 2015-12-25 | 2016-03-09 | 科化新材料泰州有限公司 | Environment-friendly epoxy resin composition and preparing method thereof |
| CN107216614A (en) * | 2017-07-10 | 2017-09-29 | 江苏华海诚科新材料股份有限公司 | A kind of composition epoxy resin suitable for fan-out-type wafer-level packaging |
| CN109651762A (en) * | 2018-12-20 | 2019-04-19 | 江苏华海诚科新材料股份有限公司 | High-pressure-resistant epoxy resin composition and preparation method thereof |
| CN113831878A (en) * | 2021-10-22 | 2021-12-24 | 长兴电子材料（昆山）有限公司 | Epoxy resin composition and application thereof |
Non-Patent Citations (1)
| Title |
|---|
| 李宝莲: "溴代环氧树脂在印制线路板和封装材料中的应用", 化工新型材料, no. 11 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117511475A (en) * | 2022-07-29 | 2024-02-06 | 比亚迪股份有限公司 | Double-component pouring sealant, application thereof and sealant sealing method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN114276651B (en) | 2023-06-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP1176171B1 (en) | Electric insulating material and method of manufacture thereof | |
| US6437026B1 (en) | Hardener for epoxy molding compounds | |
| US5827908A (en) | Naphthalene and or biphenyl skeleton containing epoxy resin composition | |
| CN114276651B (en) | Epoxy resin composition suitable for low-pressure encapsulation and preparation method thereof | |
| CN114644810B (en) | High-temperature fast-curing low-stress epoxy resin composition and preparation method thereof | |
| US4804697A (en) | Thermoplastic resin composition having an improved chemical resistance | |
| EP0321236A2 (en) | Production of composite resins | |
| CN112724599A (en) | Epoxy resin composition for flip chip packaging | |
| CN115418082A (en) | High-self-release composition for tantalum capacitor packaging and preparation method thereof | |
| US20020146565A1 (en) | Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same | |
| CN102321340B (en) | High-strength halogen-free epoxy molding compound, and preparation method thereof | |
| CN112724597A (en) | Nano-whisker modified epoxy resin composition | |
| CN102898786B (en) | Epoxy molding compound for packaging tantalum capacitor and manufacturing method for epoxy molding compound | |
| CN109651762B (en) | High-pressure-resistant epoxy resin composition and preparation method thereof | |
| CN112724897B (en) | Light epoxy resin composition for semiconductor packaging | |
| JP2002348439A (en) | Epoxy resin composition and semiconductor device | |
| CN114276650A (en) | Epoxy resin composition and preparation method thereof | |
| CN111117158A (en) | Low-cost low-stress epoxy composition and preparation method thereof | |
| CN111253746A (en) | Electrical insulation thermoplastic resin composition and preparation method and application thereof | |
| CN114213979B (en) | Electronic material glue solution and preparation method thereof | |
| CN117264367A (en) | Epoxy resin material and preparation method and application thereof | |
| Chin et al. | Thermo-mechanical and light transmittance of silica diffusant filled epoxy composites | |
| CN114437511A (en) | Epoxy resin composition and application thereof, epoxy resin molding material and preparation method and application thereof | |
| JPS62112622A (en) | Sealing resin composition | |
| CN113174133A (en) | High-frequency dielectric composite material used in communication technology and preparation method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |