WO2017098922A1

WO2017098922A1 - Resonator device and method for manufacturing resonator device

Info

Publication number: WO2017098922A1
Application number: PCT/JP2016/084700
Authority: WO
Inventors: 誠之菊田; 多田　斉
Original assignee: 株式会社村田製作所
Priority date: 2015-12-08
Filing date: 2016-11-24
Publication date: 2017-06-15

Abstract

Provided are a resonator device with which excellent connection reliability is stably obtained, and a method for manufacturing said device. A resonator device (10) is provided with dielectric resonators (1), terminals (3), and a combined substrate (4). The dielectric resonator (1) includes a dielectric block (21) in which a hole (24) is formed, an external conductor (22) formed on the outer surface of the dielectric block (21), and an internal conductor (23) formed on the inner surface of the hole (24). The terminal (3) includes an insertion part (31) inserted into the hole (24) and a projecting part (32) projecting from the hole (24). An upper surface electrode (42) to which the projecting part (32) is soldered is formed on the combined substrate (4). A channel (45) is provided on the joined substrate (4) between the upper surface electrodes (42) and the dielectric resonators (1).

Description

Resonator device and method for manufacturing resonator device

The present invention relates to a resonator device configured by soldering a dielectric resonator to another component, and a manufacturing method thereof.

A dielectric resonator is generally configured by providing an inner conductor and an outer conductor on a dielectric block provided with a through hole. Such a resonator is used by inserting one end of a rod-like or cylindrical terminal into a through hole of a dielectric block and soldering the tip of the terminal protruding from the dielectric block to another component (for example, Patent Document 1). The flux that is melted before the solder when soldering the terminal to another component removes the surface oxide film of the terminal and the electrode of the other component and improves the wettability of the solder.

Japanese Utility Model Laid-Open No. 4-135001

In the configuration described in Patent Document 1, the flux that has been melted during soldering travels through the terminal by the action of capillary action between the terminal and other components, and the terminal and inner conductor in the through hole of the dielectric block. Try to get into the gap between. As a result, the solder melted during soldering also enters the gap through the flux, and sometimes the solder gets wet between the terminal in the through hole of the dielectric block and the inner conductor. Due to this phenomenon, for example, deformation and breakage of each part of the periphery due to stress concentration that occurs when the flux or solder is cooled, leading to poor contact between the inner conductor and the terminal, reducing the connection reliability of the terminal to the inner conductor. There was a case.

Therefore, an object of the present invention is to provide a resonator device capable of stably realizing good connection reliability and a manufacturing method thereof.

A resonator device according to the present invention includes a dielectric resonator including a dielectric block having a hole formed therein, an outer conductor formed on an outer surface of the dielectric block, and an inner conductor formed on an inner surface of the hole; A connection including one end inserted into the hole and in contact with the inner conductor, the other end protruding from the hole, and an electrode soldered to a part of the region protruding from the hole of the terminal A gap portion that is opened between the electrode and the dielectric resonator is formed in the coupling substrate. The air gap here is a space formed by providing a step, a groove, a hole, a notch, a dent, etc. in the coupling substrate so as to open between the electrode of the coupling substrate and the dielectric resonator. The void portion may penetrate the coupling substrate or may not penetrate the coupling substrate.

In the above configuration, when the terminal attached to the dielectric resonator is soldered to the coupling substrate, the flux tends to be transmitted from the electrode of the coupling substrate to the dielectric resonator side along the terminal. Stay. This makes it easy to prevent the solder from getting wet into the dielectric resonator, and it is possible to stably realize good connection reliability in the resonator device.

The coupling substrate may be in contact with the dielectric resonator. Thereby, the position shift of the coupling substrate with respect to the dielectric resonator can be reduced. Then, it is possible to reduce manufacturing variations that occur in the distance (hereinafter referred to as terminal connection length) where the electrode of the coupling substrate and the inner conductor of the dielectric resonator are connected by the terminal. Therefore, it is possible to reduce variations in parasitic inductance generated at the terminals, and it is possible to stably realize good high frequency characteristics in the resonator device.

It is preferable that the terminal protrudes linearly from the hole. Thereby, the terminal connection length can be further shortened. Therefore, the parasitic inductance generated at the terminal can be reduced, and the high frequency characteristics of the resonator device can be improved.

The gap may extend in a groove shape in a direction intersecting the protruding direction of the terminal. Thereby, even if a large amount of flux is transmitted from the electrode of the coupling substrate to the dielectric resonator side along the terminal, the flux flows out along the groove. For this reason, it becomes easier to prevent the solder from getting wet into the dielectric resonator.

It is preferable that a plurality of the gaps are provided side by side in the protruding direction of the terminals. Providing the plurality of gaps in the groove shape in this way can also more reliably prevent the solder from getting wet into the dielectric resonator. Furthermore, it is preferable that the space farthest from the electrode is shallower than the space closest to the electrode. Thus, the processing time can be shortened by making some of the gaps shallow. And even if the gap part farthest from the electrode of the coupling substrate is shallow, the flux hardly reaches this gap part, so that wetting of the solder into the dielectric resonator can be sufficiently prevented.

The gap may be a hole. As a result, even if the bonded substrate is thin and small, the bonded substrate is not easily damaged. In addition, this hole may penetrate a coupling substrate and does not need to penetrate a coupling substrate. When the hole penetrates the coupling substrate, it is easy to prevent solder from getting wet into the dielectric resonator. If the holes do not penetrate the bonded substrate, the processing time can be shortened.

The length of the terminal (terminal connection length) between the electrode and the dielectric resonator is preferably 0.6 mm or more and 1.0 mm or less as a median of manufacturing variation. If the terminal connection length is too short, the gap of the coupling substrate needs to be remarkably narrowed. Then, a sufficient amount of solder or flux cannot be captured in the gap, and it becomes difficult to sufficiently prevent the solder from getting wet into the dielectric resonator. On the other hand, if the terminal connection length is longer than this, it is difficult for the solder to get wet in the dielectric resonator even if the gap portion is not provided, so that the utility by providing the gap portion is reduced.

The depth of the gap is preferably ¼ or more and ¾ or less of the thickness of the combined substrate. If the depth is too shallow, a sufficient amount of solder cannot be captured in the gap, and it becomes difficult to prevent the solder from getting wet into the dielectric resonator. On the other hand, when the depth is too deep, the combined substrate is likely to be damaged due to the reduced thickness of the combined substrate.

The method for manufacturing a resonator device according to the present invention includes a dielectric block in which holes are formed, an outer conductor formed on an outer surface of the dielectric block, and an inner conductor formed on an inner surface of the holes. , And a terminal is inserted into the hole so that one end side protrudes from the hole, and an electrode and a gap that opens between the electrode and the end are provided. A coupling substrate is prepared, and the dielectric resonator and the coupling substrate are disposed so that a portion of the terminal protruding from the hole extends along the electrode beyond the gap, and the terminal is soldered to the electrode. Attach. Thereby, it becomes easy to prevent the solder from getting wet into the dielectric resonator, and it becomes possible to stably realize good connection reliability.

It is preferable that when the resonator and the coupling substrate are arranged, the coupling substrate is brought into contact with the dielectric resonator. As a result, manufacturing variations occurring in the terminal connection length can be reduced, and good high frequency characteristics can be stably realized in the resonator device.

When preparing the bonded substrate, it is preferable to provide the gap in a groove shape by dicing. Thereby, a space | gap part can be formed efficiently.

According to the present invention, the coupling substrate to which the terminal is soldered is provided with the gap for retaining the flux, so that it is easy to prevent the solder from getting wet into the dielectric resonator along the terminal. . Therefore, good connection reliability can be stably realized in the resonator device.

FIG. 1 is an exploded perspective view of the resonator device according to the first embodiment. FIG. 2 is a hexahedral view of the coupling substrate provided in the resonator device according to the first embodiment. FIG. 3 is an equivalent circuit diagram of the resonator device according to the first embodiment. FIG. 4A is a flowchart showing a method for manufacturing the resonator device according to the first embodiment. FIG. 4B is a flowchart showing a process related to soldering in the manufacturing process of the resonator device according to the first embodiment. FIG. 5A is a cross-sectional view of the resonator device according to the first embodiment. FIG. 5B is a cross-sectional view of the resonator device according to the first comparative example. FIG. 5C is a cross-sectional view of the resonator device according to the second comparative example. FIG. 6A and FIG. 6B are diagrams for explaining manufacturing variations between the resonator device according to the first embodiment and the resonator device according to the second comparative example. FIG. 7 is a cross-sectional view of the resonator device according to the second embodiment. FIG. 8 is a six-sided view of the coupling substrate provided in the resonator device according to the third embodiment. FIG. 9 is a six-sided view of the coupling substrate provided in the resonator device according to the fourth embodiment.

Hereinafter, a mode for implementing the resonator device will be described by taking a case of configuring a filter device as an example. In addition, each embodiment shown below is an illustration to the last, and the partial substitution or combination of the structure shown in different embodiment is possible.

<< First Embodiment >>
FIG. 1 is an exploded perspective view of the filter device 10 according to the first embodiment viewed in an exploded state. Hereinafter, the left front surface in FIG. 1 of the filter device 10 is referred to as a front surface, and the opposite surface of the filter device 10 is referred to as a back surface. Further, the right front surface in FIG. 1 of the filter device 10 is referred to as a right side surface, and the opposite surface of the filter device 10 is referred to as a left side surface. Further, the upper surface in FIG. 1 of the filter device 10 is referred to as an upper surface, and the opposite surface of the filter device 10 is referred to as a lower surface.

First, a schematic configuration of the filter device 10 will be described. The filter device 10 includes a dielectric resonator 1, a terminal 3, and a coupling substrate 4.

The dielectric resonator 1 includes a dielectric block 21, an outer conductor 22, and an inner conductor 23. The dielectric block 21 is formed with holes 24 so as to open to the front side. The outer conductor 22 is formed on the outer surface of the dielectric block 21. The inner conductor 23 is formed on the inner surface of the hole 24.

The terminal 3 is configured as a protruding portion 32 whose front side (one end side) protrudes from the hole 24. The terminal 3 is configured as an insertion portion 31 whose back side (the other end side) is inserted into the hole 24. The protruding portion 32 protrudes linearly from the hole 24 in the front direction of the dielectric block 21. The terminal 3 may have any shape as long as at least a part is inserted into the hole 24 and at least another part protrudes from the hole 24. For example, the protrusion 32 may be curved or bent and extend.

The coupling substrate 4 is disposed on the front side of the dielectric block 21. The back surface of the coupling substrate 4 is in contact with the front surface of the dielectric block 21. The coupling substrate 4 includes an upper surface electrode 42 on the upper surface. The upper surface electrode 42 is soldered to a part of the region protruding from the hole 24 of the terminal 3, specifically, the distal end side of the protruding portion 32. In addition, the coupling substrate 4 has a groove 45 so as to open at a position sandwiched between the upper surface electrode 42 and the dielectric resonator 1, that is, a position between the upper surface electrode 42 and the rear side end portion of the coupling substrate 4. Is formed. The groove 45 corresponds to a gap described in the claims. When the terminal 3 is soldered, the groove 45 retains a flux that is transmitted along the terminal 3 from the upper surface electrode 42 of the coupling substrate 4 to the hole 24 of the dielectric resonator 1. Therefore, providing the groove 45 makes it easy to prevent solder from getting wet into the dielectric resonator 1.

Next, details of the filter device 10 according to the present embodiment will be described. Seven dielectric resonators 1 and seven terminals 3 are provided. The filter device 10 further includes a substrate 5 and a pedestal 6. The seven dielectric resonators 1 and the pedestal 6 are respectively mounted on the upper surface of the substrate 5. The coupling substrate 4 is mounted on the upper surface of the base 6. The seven dielectric resonators 1 are arranged in order from the left side surface to the right side surface of the substrate 5. The coupling substrate 4 and the base 6 are disposed on the front side of the seven dielectric resonators 1. Note that the number of dielectric resonators 1 in the filter device 10 is not limited to seven, and may be any number including a single.

The dielectric block 21 is made of a dielectric material such as LTCC (low temperature co-sintered ceramics). The dielectric block 21 is a rectangular parallelepiped having a square front and back and a length between the front and back. For example, the size of the front and back surfaces of the dielectric block 21 is 7 mm × 7 mm. The length between the front surface and the back surface of the dielectric block 21 is set so that each has a desired resonator length. Further, the hole 24 penetrates between the front surface and the back surface of the dielectric block 21. For example, the diameter of the hole 24 is about φ2.6 mm. The outer conductor 22 is provided so as to cover the entire surface of the other five surfaces except the front surface of the outer surface of the dielectric block 21. The inner conductor 23 is provided so as to cover the inner surface of the hole 24, and the back side is connected to the outer conductor 22. With such a configuration, the dielectric resonator 1 constitutes a quarter wavelength dielectric coaxial resonator.

The dielectric resonator 1 is not necessarily limited to the one constituting the quarter wavelength dielectric coaxial resonator, and may be any configuration as long as the terminal 3 protrudes from the dielectric block 21. . For example, the inner conductor 23 can be configured as a half-wavelength dielectric coaxial resonator in which both ends of the inner conductor 23 are not connected to the outer conductor 22 but are open ends.

The terminal 3 is composed of an integral metal plate made of a material such as copper or aluminum. The insertion portion 31 is formed in a cylindrical shape having a cut in the axial direction by curving both sides on one end side of the metal plate. The protruding portion 32 is configured in a tongue shape extending from the metal plate in the axial direction of the insertion portion 31. The insertion portion 31 is fitted into the hole 24 of the dielectric block 21 and elastically contacts the inner conductor 23 provided inside the hole 24.

In addition, the insertion part 31 of the terminal 3 is not necessarily limited to a cylindrical shape, and may have an arbitrary shape such as a rod shape or a wire shape. However, in order to improve the connection reliability between the terminal 3 and the inner conductor 23, it is preferable that the insertion portion 31 of the terminal 3 has a shape that is elastically in contact with the inner conductor 23, such as a cylindrical shape.

The coupling substrate 4 is provided with a groove 45 extending in a direction intersecting the protruding direction of the terminal 3 adjacent to the dielectric resonator 1 side, that is, the back surface side from the upper surface electrode 42. The groove 45 can be easily formed by dicing the coupling substrate 4 or the like.

FIG. 2 is a six-sided view of the combined substrate 4. The coupling substrate 4 shown here includes a plate material 41, an upper surface electrode 42, and a lower surface electrode 43. The plate 41 is made of a dielectric material such as LTCC or glass epoxy. The plate member 41 has a plate shape having a length between the left side surface and the right side surface as viewed in plan, and is configured by a groove 45 in a two-step shape having a high front side on the top surface and a low back side on the top surface. That is, the groove 45 extends from the left side surface to the right side surface of the plate material 41 and opens on the back surface and the top surface of the plate material 41. Here, since the groove 45 has a shape extending from the left side surface to the right side surface of the plate material 41, even if a large amount of flux is transmitted through the terminal 3, when the flux 45 reaches the groove 45, the groove 45 extends along the groove 45. leak. Thereby, the solder which is going to propagate through the terminal 3 stays in the vicinity of the groove 45 reliably. Therefore, it becomes easy to prevent the solder from getting wet into the dielectric resonator 1. Further, since the groove 45 is also opened on the back surface of the plate member 41, the volume of the groove 45 can be maximized, and this also makes it easier to prevent the solder from getting wet into the dielectric resonator 1. Become.

The upper surface electrode 42 is arranged in order from the left side surface side to the right side surface side in a total of seven on the upper portion of the upper surface of the plate member 41. Each upper surface electrode 42 corresponds to one of the seven dielectric resonators 1 and the terminal 3, and the corresponding terminal 3 is soldered. A total of two lower surface electrodes 43 are provided on the lower surface of the plate member 41 and face one or the other of the upper surface electrodes 42 at both ends. The two lower surface electrodes 43 are capacitively coupled by facing one or the other of the upper surface electrodes 42 at both ends via the plate material 41. The upper surface electrodes 42 are capacitively coupled by being adjacent to each other with a space therebetween. Thereby, the coupling substrate 4 is configured as a capacitive element.

Here, the pedestal 6 shown in FIG. 1 is provided so that the height of the combined substrate 4 from the substrate 5 and the arrangement of the front and rear can be adjusted. The pedestal 6 is not essential and may not be provided. That is, the combined substrate 4 may be directly mounted on the substrate 5. The pedestal 6 includes a plate material 61, two upper surface electrodes 62, and two lower surface electrodes 63. The plate member 61 is made of an insulator such as LTCC or glass epoxy. The plate member 61 is a rectangular flat plate having a length between the left side surface and the right side surface in plan view. The two upper surface electrodes 62 are provided on the upper surface of the plate material 61, are arranged at positions corresponding to one or the other of the two lower surface electrodes 43 of the coupling substrate 4, and either one of the two lower surface electrodes 43 of the coupling substrate 4 or It is joined to the other. The two lower surface electrodes 63 are provided on the lower surface of the plate member 61 and are arranged at positions corresponding to one or the other of the two upper surface electrodes 62, and through one or the other of the two upper surface electrodes 62 via a through hole or the like. Conducted. The pedestal 6 may be configured separately for each of the two lower surface electrodes 43 of the coupling substrate 4, and a total of two pedestals 6 may be provided. In such a case, the pedestal 6 may be entirely made of a metal material.

The substrate 5 includes a plate material 51, two connection electrodes 52, and a ground electrode 53. The plate material 51 is a substantially square flat plate made of glass epoxy or the like. For example, the size of the plate material 51 is about 52 × 17 × 0.8 mm. The two connection electrodes 52 are provided on the upper surface of the substrate 5, arranged at positions corresponding to one or the other of the two lower surface electrodes 63 of the pedestal 6, and disposed on one or the other of the two lower surface electrodes 63 of the pedestal 6. It is joined. The ground electrode 53 is provided on the upper surface of the substrate 5, arranged at a position corresponding to the outer conductor 22 of each of the seven dielectric resonators 1, and joined to the outer conductor 22 of each of the seven dielectric resonators 1. ing.

Here, each member such as the dielectric resonator 1, the coupling substrate 4, and the pedestal 6 is surface-mounted on the substrate 5. However, in the present invention, at least the terminals of the dielectric resonator 1 are soldered to other members. The filter device 10 is not limited to this configuration. For example, the substrate 5 and the pedestal 6 may not be provided. Also, some members may be built in the substrate 5, or some members may be constituted by lead insertion type components.

The filter device 10 according to the first embodiment has the above-described configuration and forms a band-pass filter circuit. FIG. 3 is an equivalent circuit diagram of the filter device 10.

Each of the seven resonators Re shown in FIG. 3 is the dielectric resonator 1, that is, a quarter wavelength dielectric coaxial resonator. The six capacitors Ck are capacitors generated between the adjacent upper surface electrodes 42 of the coupling substrate 4. The capacitance Ce is a capacitance generated between the upper surface electrode 42 and the lower surface electrode 43 of the coupling substrate 4. For this reason, the filter device is configured as a seven-stage resonator circuit. The resonator circuit is connected to the connection electrode 52 (external connection end) of the substrate 5 through two capacitors Ce.

Here, the band pass filter circuit is configured by the filter device 10, but the resonator device according to the present invention is not limited to the band pass filter circuit, but other filter circuits such as a band rejection filter circuit (BEF). Can also be configured. In addition, the resonator device according to the present invention may constitute other circuits using the resonator such as an oscillation circuit in addition to the filter circuit.

Further, the filter device 10 according to the first embodiment can be manufactured by a manufacturing method as exemplified below.

FIG. 4A is a flowchart illustrating an example of a method for manufacturing the filter device 10. In the manufacturing process of the filter device 10, a preparation process S1 and a mounting process S2 are performed. The preparation step S1 is a step of preparing the dielectric resonator 1, the terminal 3, the coupling substrate 4, the substrate 5, and the pedestal 6 in a single member state. In the mounting step S2, the terminal 3 is inserted into the hole 24 of the dielectric resonator 1, the terminal 3 is soldered to the coupling substrate 4, the base 6 and the coupling substrate 4 are joined, and the seven dielectric resonators 1, In this step, the base 6 and the coupling substrate 4 are mounted on the substrate 5.

In the preparation step S1, it is preferable to form the groove 45 by dicing the flat plate material 41 when preparing the bonding substrate 4. However, the method for forming the groove 45 is not limited to dicing, and other methods such as forming the groove 45 by stacking a plurality of sheets having different widths may be adopted. Further, in the mounting step S2, it is preferable to join the members by heating the solder paste in a reflow furnace or the like. However, the joining between the members is not limited to the heating of the solder paste, but can be realized by heating with a soldering iron. Further, if the terminal 3 and the coupling substrate 4 are soldered, the other members may be joined in any manner. For example, the joining between the other members may be realized by a conductive adhesive. It may be. Further, the soldering between the terminal 3 and the coupling substrate 4 may be realized simultaneously with the joining between the other members, or may be realized as a subsequent process of the joining between the other members, or between the other members. It may be realized as a pre-process of bonding.

FIG. 4B is a flowchart for explaining in more detail the process of soldering the terminal 3 to the coupling substrate 4.

In the mounting process S2, the first to fourth steps are sequentially performed. In the first step S21, a solder paste containing a flux for connecting the terminal 3 and the upper surface electrode 42 of the coupling substrate 4 is prepared. For example, a solder paste containing flux is applied to the upper surface electrode 42 of the combined substrate 4. In the second step S22, the front surface of the dielectric resonator 1 is brought into contact with the surface of the coupling substrate 4 on which the groove 45 is provided, that is, the back surface, and the terminal 3 extends along the upper surface electrode 42 beyond the groove 45. As described above, the dielectric resonator 1 and the coupling substrate 4 are arranged. In the third step S23, the terminal 3 and the upper surface electrode 42 are joined by melting and solidifying the solder by heating and cooling. In the fourth step S24, the flux is washed.

Here, in the third step S23, the front surface of the dielectric resonator 1 is brought into contact with the back surface of the coupling substrate 4, but the coupling substrate 4 and the dielectric resonator 1 are arranged so as to be spaced apart from each other. May be. Further, the fourth step S24 is not necessarily performed.

In the course of these first to fourth steps S21 to S24, the solder and flux are in the following states.

FIG. 5A is a cross-sectional view schematically showing a state in which the terminal 3 is soldered to the coupling substrate 4 when the filter device 10 is manufactured. In the filter device 10, the front surface of the dielectric resonator 1 is in contact with the back surface of the coupling substrate 4. The coupling substrate 4 is provided with a groove 45 on the back side.

When the terminal 3 is soldered to the upper surface electrode 42 provided on the upper surface of the coupling substrate 4, the solder paste containing the flux applied to the upper surface electrode 42 of the coupling substrate 4 is made of the solder material by reflow or the like. Heated to a temperature above the melting temperature. Thereby, the solder 47 and the flux 46 contained in the solder paste are melted, and the melted flux 46 removes the oxide film on the upper surface electrode 42. For this reason, the melted solder 47 wets and spreads on the surface of the upper surface electrode 42 and becomes a shape that rises gently from the upper surface electrode 42. The melted flux 46 covers the surface of the solder 47 and surrounds the periphery of the solder 47 and the upper surface electrode 42.

In a state in which the solder 47 and the flux 46 are melted, the melted flux 46 is transmitted along the terminal 3 to the dielectric resonator 1 side by capillarity in a minute gap portion where the coupling substrate 4 and the terminal 3 face each other. To do. However, when the melted flux 46 reaches the groove 45 of the bonded substrate 4, it becomes granular or fillet-like due to surface tension and tends to stay in the groove 45. As a result, the melted flux 46 is hardly transmitted to the dielectric resonator 1 side along the terminals 3, and the melted solder 47 gets wet into the dielectric resonator 1 through the flux 46. It becomes difficult.

As a result, it becomes easy to prevent a decrease in connection reliability caused by the molten solder 47 getting wet into the dielectric resonator 1.

Here, the phenomenon that the connection reliability of the terminal 3 is lowered will be described with reference to the first comparative example. FIG. 5B is a cross-sectional view schematically showing the filter device 110 according to the first comparative example. The filter device 110 includes a coupling substrate 104 as a configuration different from the filter device 10 according to the present embodiment. The coupling substrate 104 has a flat plate structure in which no groove is formed. The coupling substrate 104 is disposed so as to be close to the dielectric resonator 1.

In this configuration, when the terminal 3 is soldered to the flat coupling substrate 104 having no grooves, the melted flux is caused by the capillary phenomenon in the minute gap portion where the coupling substrate 104 and the terminal 3 face each other. 46 transmits the terminal 3 to the dielectric resonator 1 side. As a result, the molten solder 47 is easily wetted into the dielectric resonator 1 via the flux 46.

Since the flux 46 normally has an insulating property, when the flux 46 reaches the dielectric resonator 1, the connection reliability between the inner conductor 23 of the dielectric resonator 1 and the terminal 3 is reduced. Further, when the solder 47 reaches the dielectric resonator 1, the terminal 3 is deformed by the stress concentration generated when the solder 47 is cooled, and the terminal 3 contacts the inner conductor 23 of the dielectric resonator 1 only locally. There is a risk that it will not. Furthermore, since the solder 47 is transmitted to the dielectric resonator 1, the amount of the solder 47 adhering to the upper surface electrode 42 of the coupling substrate 104 is reduced, and the bonding failure of the terminal 3 to the coupling substrate 104 is likely to occur.

Due to the occurrence of these phenomena, in the coupling substrate 104 not provided with the groove, the connection failure of the terminal 3 sometimes occurs, and it has been difficult to stably realize good connection reliability. Therefore, as in the filter device 10 according to the first embodiment shown in FIG. 5A, the first comparison shown in FIG. As compared with the filter device 110 according to the example, it is possible to make it difficult for the solder 47 to wet into the dielectric resonator 1 along the terminal 3, and to achieve good connection reliability stably in the filter device 10.

Further, in the filter device 10 according to the first embodiment, the solder 47 can be prevented from getting wet into the dielectric resonator 1 along the terminal 3 by the groove 45, so that the coupling substrate 4 is dielectrically resonant. It is possible to arrange them close to each other so as to contact the container 1. As a result, in the filter device 10 according to the first embodiment, it is possible to suppress the displacement of the coupling substrate 4 with respect to the dielectric resonator 1, and to stably realize better high-frequency characteristics. Become.

Hereinafter, the phenomenon in which the high frequency characteristics deteriorate in the filter device will be described with reference to a second comparative example. FIG. 5C is a cross-sectional view schematically showing the filter device 210 according to the second comparative example. The filter device 210 includes a coupling substrate 204 as a configuration different from the filter device 10 according to the present embodiment. The coupling substrate 204 has a flat plate structure in which no groove is formed. Then, the coupling substrate 204 is arranged far away from the dielectric resonator 1.

In this configuration, even if it is a flat plate-like coupling substrate 204 that is not provided with a groove, it is disposed sufficiently away from the dielectric resonator 1, so that the flux 46 that has been melted during soldering is bonded to the coupling substrate 204. It remains in a granular or fillet shape due to surface tension in the vicinity of the side surface. Therefore, similarly to the filter device 10 according to the first embodiment, in the filter device 210 according to the second comparative example, the molten solder 47 wets up to the dielectric resonator 1 along the terminal 3. Risk is low.

However, if the coupling substrate 204 is arranged at a large distance from the dielectric resonator 1 as described above, the coupling substrate 204 is likely to be displaced. For this reason, in the filter device 210 according to the second comparative example, the manufacturing variation of the distance (terminal connection length) for connecting the inner conductor 23 to the upper surface electrode 42 of the coupling substrate 204 by the terminal 3 increases. Thus, in order to reliably prevent the molten solder 47 from getting wet into the dielectric resonator 1, it is necessary to make the terminal connection length larger than that of the filter device 10 according to the first embodiment. This time, there arises a problem that the manufacturing variation of the terminal connection length becomes large.

For this reason, in the filter device 210 according to the second comparative example, the parasitic inductance generated at the terminal 3 and the variation thereof are increased, and the high frequency characteristics of the filter device 210 are deteriorated and easily varied.

FIG. 6A is a diagram for explaining the variation in terminal connection length, which is confirmed between the sample of the filter device 10 according to the first embodiment and the sample of the filter device 210 according to the second comparative example. In the sample test, the number of samples was about 50.

In the filter device 10 according to the first embodiment, the set value (median value) of the terminal connection length, that is, the width of the groove 45 is set to about 0.6 mm, so that all the samples are connected to the dielectric resonator 1. It was confirmed that flux and solder do not wet up. Also, with this setting, the terminal connection length in each sample varied within a narrower range (approximately -0.04 mm to +0.12 mm). This is because, in the filter device 10 according to the first embodiment, the coupling substrate 4 is arranged so as to be in contact with the dielectric resonator 1, so that the positional displacement of the coupling substrate 4 with respect to the dielectric resonator 1 is unlikely to occur. It is considered that the variation according to the processing accuracy of the grooves and the like mainly occurs.

On the other hand, in the filter device 210 according to the second comparative example, the set value (median value) of the terminal connection length is set to about 1.0 mm, so that flux and solder to the dielectric resonator 1 in all samples are set. It was confirmed that wetting did not occur. In this setting, the terminal connection length in each sample varied in a wider range (approximately −0.16 mm to +0.16 mm). This is because, in the filter device 210 according to the second comparative example, the coupling substrate 204 is arranged at a large distance from the dielectric resonator 1, so that the positional displacement of the coupling substrate 204 with respect to the dielectric resonator 1 is likely to occur. This is probably because of this.

Thus, in the sample test, it was confirmed that the filter device 10 according to the first embodiment is less likely to cause variations in terminal connection length than the filter device 210 according to the second comparative example. The filter device 10 according to the first embodiment is less likely to cause solder wetting to the dielectric resonator 1 even if the terminal connection length is shorter than that of the filter device 210 according to the second comparative example. Was confirmed.

FIG. 6B shows the median value of the insertion loss (IL) and the median value at the above setting in the filter device 10 according to the first embodiment and the filter device according to the second comparative example. It is a figure explaining by comparing with the value of the insertion loss (IL) in the sample with the largest variation (difference).

As described above, the filter device 10 according to the first embodiment has a smaller terminal connection length setting value (median value) than the filter device 210 according to the second comparative example. For this reason, the filter device 10 according to the first embodiment has a smaller parasitic inductance at the terminal 3 than the filter device 210 according to the second comparative example. Therefore, in the filter device 10 according to the first embodiment, the insertion loss (IL) is about 0.71 dB as a median value, and the median value of the insertion loss (IL) in the filter device 210 according to the second comparative example is about 0. There was an improvement in insertion loss (IL) by about 0.1 dB over .81 dB.

Moreover, as described above, the filter device 10 according to the first embodiment has a smaller manufacturing variation in the terminal connection length than the filter device 210 according to the second comparative example. For this reason, the filter device 10 according to the first embodiment has less variation in parasitic inductance generated at the terminal 3 than the filter device 210 according to the second comparative example. Therefore, in the filter device 10 according to the first embodiment, the difference from the median value of the insertion loss (IL) is about ± 0.01 dB even in the sample having the largest variation (difference) from the median value. The variation was improved more than the equivalent difference of about ± 0.03 dB in the filter device 210 according to the second comparative example.

Thus, also from the sample test, it can be seen that the filter device 10 according to the first embodiment can reduce the manufacturing variation of the terminal connection length due to the terminal 3 and can stably realize a good high-frequency characteristic.

Note that, from the above sample test, it is also understood that the numerical range of the terminal connection length is preferably 0.6 mm or more and 1.0 mm or less in the median value of variation. The smaller the terminal connection length (median), the narrower the width required for the groove 45, and the flux 46 and solder 47 are more likely to exceed the groove 45. This is because it has been confirmed that the flux 46 and the solder 47 do not exceed the groove 45 if the diameter is larger than 0.6 mm. Further, if the terminal connection length (median value) is larger than 1.0 mm, the terminal connection length is the same as that of the second comparative example, and the utility of improving the high frequency characteristics is diminished.

In consideration of the manufacturing variation (0.12 mm in the first embodiment) occurring in the terminal connection length confirmed in the sample test, the above numerical range is the terminal connection length in the individual filter device 10. This corresponds to a range of 0.48 mm to 0.88 mm. Furthermore, considering that the manufacturing variation in the terminal connection length is 0.16 mm in the second comparative example, the terminal connection length is almost certainly shorter in the individual filter device 10 than in the second comparative example. The numerical range is 0.48 mm or more and 0.84 mm or less.

Further, in the filter device 10 according to the first embodiment, it is preferable that the depth of the groove 45 is in a range of 1/4 or more and 3/4 or less with respect to the thickness of the combined substrate 4. If the depth is less than ¼ of the thickness of the coupling substrate 4, a sufficient amount of solder cannot be captured at the opening, and the solder travels along the terminals and gets wet with the dielectric resonator 1. The risk of going up increases. On the other hand, if the depth exceeds 3/4 of the thickness of the bonded substrate 4, the bonded substrate becomes too thin and the bonded substrate is easily damaged.

Therefore, by configuring the coupling substrate 4 of the filter device 10 according to the first embodiment so as to fall within these numerical ranges, it is possible to stably realize both good connection reliability and good high frequency characteristics. it can.

In the above description, the configuration in which the terminal 3 projects linearly from the dielectric resonator 1 has been described, but the projecting portion of the terminal 3 may be bent or curved in the middle. However, from the viewpoint of improving the high-frequency characteristics, it is preferable to shorten the terminal connection length, and the terminal 3 projects linearly from the dielectric resonator 1 as in the configuration shown in the first embodiment. Configuration is desirable.

<< Second Embodiment >>
Next, the filter device 10A according to the second embodiment will be described. FIG. 7 is a cross-sectional view of the filter device 10A.

10A of filter apparatuses are comprised from the completely same member as the structure which concerns on 1st Embodiment, and are provided with the dielectric resonator 1, the terminal 3, the coupling substrate 4, the board | substrate 5, and the base 6. FIG. However, here, the arrangement of the coupling substrate 4 is different from that of the first embodiment, and the coupling substrate 4 is arranged far away from the front surface of the dielectric resonator 1.

The resonator device according to the present invention may have such a configuration. In this case, the flux 46 and the solder 47 can be fastened by the groove 45 of the coupling substrate 4, and the coupling substrate 4 and the dielectric resonator 1 are largely separated from each other. Even near the side surface, the flux 46 and the solder 47 can be fastened. Therefore, according to this filter device 10A, it becomes easier to more reliably prevent solder from getting wet to the dielectric resonator 1.

<< Third Embodiment >>
Next, a filter device according to a third embodiment will be described. FIG. 8 is a hexahedral view of the coupling substrate 4B provided in the filter device according to the third embodiment.

The coupling substrate 4B includes a plate material 41, an upper surface electrode 42, and a lower surface electrode 43, similarly to the configuration according to the first embodiment. The combined substrate 4B includes

grooves

45B and 46B as a configuration different from that of the first embodiment. Each of the

grooves

45B and 46B is opened to the back side with respect to the upper surface electrode 42. The

grooves

45B and 46B extend from the left side surface to the right side surface of the plate material 41. Of the

grooves

45B and 46B, the groove 45B is disposed on the front side, and the groove 46B is disposed on the back side. The groove 45B and the groove 46B have the same length dimension and width dimension, differ only in the depth dimension, and the groove 46B is shallower.

The resonator device according to the present invention may have such a configuration. In this case, the groove 46B, which is located farther from the upper surface electrode 42 and is difficult for flux and solder to reach, is made shallower than the groove 45B located closer to the upper surface electrode 42, thereby reducing the processing time of the groove 45B. While shortening, it becomes easy to sufficiently prevent the solder from getting wet to the dielectric resonator 1.

<< Fourth Embodiment >>
Next, a filter device according to a fourth embodiment will be described. FIG. 9 is a six-sided view of a coupling substrate 4C included in the filter device according to the fourth embodiment.

The coupling substrate 4 </ b> C includes a plate material 41, an upper surface electrode 42, and a lower surface electrode 43, similarly to the configuration according to the first embodiment. The combined substrate 4C includes a hole 45C as a configuration different from that of the first embodiment. The hole 45C is a non-through hole that opens to the back side of the upper surface electrode 42 on the upper surface of the coupling substrate 4c. The hole 45C corresponds to the gap described in the claims.

The resonator device according to the present invention may have such a configuration. In this case, the formation of the hole 45C makes it difficult for the bonding substrate 4C to be damaged even if the bonding substrate 4C is thin and small. In addition, since the hole 45C is configured as a non-through hole, the processing time of the hole 45C can be shortened.

As shown in each of the above embodiments, the resonator device of the present invention can be implemented, but the description in each embodiment is an example in all respects and is not restrictive. Should be done. The scope of the present invention is shown not by the above embodiments but by the claims. Furthermore, the scope of the present invention is intended to include all modifications within the meaning and scope equivalent to the scope of the claims.

DESCRIPTION OF SYMBOLS 1 ... Dielectric resonator 21 ... Dielectric block 22 ... Outer conductor 23 ... Inner conductor 24 ... Through-hole 3 ... Terminal 31 ... Insertion part 32 ...

Projection part

4, 4B ... Coupling substrate 41 ... Plate material 42 ... Upper surface electrode 43 ...

Lower surface Electrode

45, 45B, 46B ... groove 46 ... flux 47 ... solder 5 ... substrate 51 ... plate material 52 ... connection electrode 53 ... ground electrode 6 ... pedestal 61 ... plate material 62 ... upper surface electrode 63 ...

lower surface electrode

10, 10A, 10B ... filter device

Claims

A dielectric resonator including a dielectric block in which holes are formed, an outer conductor formed on an outer surface of the dielectric block, and an inner conductor formed on an inner surface of the holes;
One end side is inserted into the hole and is in contact with the inner conductor, and the other end side protrudes from the hole, and
A bonding substrate including an electrode soldered to a part of a region protruding from the hole of the terminal;
In the coupling substrate, a gap is formed between the electrode and the dielectric block.
Resonator device.
The coupling substrate is in contact with the dielectric block;
The resonator device according to claim 1.
The terminal protrudes linearly from the hole,
The resonator device according to claim 1.
The gap portion extends in a groove shape in a direction intersecting the protruding direction of the terminal.
The resonator device according to claim 1.
A plurality of the gaps are provided side by side in the protruding direction of the terminals,
The resonator device according to claim 4.
The gap farthest from the electrode is shallower than the gap closest to the electrode,
The resonator device according to claim 5.
The gap is a hole.
The resonator device according to claim 1.
The length of the terminal between the electrode and the dielectric resonator is not less than 0.6 mm and not more than 1.0 mm in the median of manufacturing variation.
The resonator device according to claim 1.
The depth of the void is 1/4 or more and 3/4 or less with respect to the thickness of the combined substrate.
The resonator device according to claim 1.
Preparing a dielectric resonator including a dielectric block in which holes are formed, an outer conductor formed on an outer surface of the dielectric block, and an inner conductor formed on an inner surface of the holes;
Insert the terminal into the hole so that one end side protrudes from the hole,
Prepare a bonding substrate provided with an electrode and a gap that opens between the electrode and the end,
The dielectric resonator and the coupling substrate are arranged so that a portion protruding from the hole of the terminal extends along the electrode beyond the gap,
Soldering the terminals to the electrodes;
A method for manufacturing a resonator device.
When arranging the dielectric resonator and the coupling substrate, the coupling substrate is brought into contact with the dielectric block;
A method for manufacturing the resonator device according to claim 10.
When preparing the bonded substrate, the gap is provided in a groove shape by dicing,
A method for manufacturing the resonator device according to claim 10 or 11.