WO2017097478A1 - Ensemble transducteur acoustique comprenant une couche métallique structurée et procédé de fabrication d'un ensemble transducteur acoustique comprenant une couche métallique structurée - Google Patents

Ensemble transducteur acoustique comprenant une couche métallique structurée et procédé de fabrication d'un ensemble transducteur acoustique comprenant une couche métallique structurée Download PDF

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Publication number
WO2017097478A1
WO2017097478A1 PCT/EP2016/074858 EP2016074858W WO2017097478A1 WO 2017097478 A1 WO2017097478 A1 WO 2017097478A1 EP 2016074858 W EP2016074858 W EP 2016074858W WO 2017097478 A1 WO2017097478 A1 WO 2017097478A1
Authority
WO
WIPO (PCT)
Prior art keywords
layer
recess
plate carrier
perforated plate
sound transducer
Prior art date
Application number
PCT/EP2016/074858
Other languages
German (de)
English (en)
Inventor
Bernd SCHEUFELE
Andre Gerlach
Original Assignee
Robert Bosch Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch Gmbh filed Critical Robert Bosch Gmbh
Priority to CN201680071570.7A priority Critical patent/CN108290183A/zh
Priority to EP16782063.8A priority patent/EP3386649A1/fr
Publication of WO2017097478A1 publication Critical patent/WO2017097478A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
    • B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface
    • G—PHYSICS
    • G10—MUSICAL INSTRUMENTS; ACOUSTICS
    • G10K—SOUND-PRODUCING DEVICES; METHODS OR DEVICES FOR PROTECTING AGAINST, OR FOR DAMPING, NOISE OR OTHER ACOUSTIC WAVES IN GENERAL; ACOUSTICS NOT OTHERWISE PROVIDED FOR
    • G10K11/00—Methods or devices for transmitting, conducting or directing sound in general; Methods or devices for protecting against, or for damping, noise or other acoustic waves in general
    • G10K11/004—Mounting transducers, e.g. provided with mechanical moving or orienting device

Definitions

  • the invention relates to a sound transducer arrangement with a perforated plate carrier and a plurality of piezo elements and a method for producing such a sound transducer arrangement.
  • Document DE 39 20 872 A1 discloses a method for the production of ultrasound layer transducers in which the piezoceramic and thermoplastic plastic material of the layer converter are connected to one another by heat bonding. To generate the heat necessary for bonding, heat loss is produced in the piezoceramic by applying electrical signals.
  • Document DE 10 2004 047 814 A1 describes a focusing micromachined ultrasound transducer array which can be used as a focusing clinically usable ultrasound probe. Lateral side by side trained transducer cells are partially wired together electrically to achieve the desired focus of the ultrasonic conversion.
  • the object of the invention is to protect the individual layer converter against external influences.
  • the acoustic transducer assembly comprises a perforated plate carrier having horizontally spaced first recesses and horizontally spaced second recesses.
  • a first recess and a second recess are arranged adjacent to each other.
  • a horizontal extension of the second recess is larger than a horizontal extension of the first recess, so that form support surfaces within the perforated plate carrier.
  • each second recess has a piezoelectric element, wherein the piezoelectric elements are partially arranged on the bearing surfaces.
  • the term second recess is understood here to mean a specific type of recess and not a number of recesses.
  • Each piezoelectric element has a horizontal extent which is greater than the horizontal extent of the first recess and smaller than the horizontal extent of the second recess, so that cavities form in the horizontal direction between the hole plate carrier and the piezo elements.
  • the terminating layer is arranged on the hole plate carrier and the piezoelectric elements, wherein the terminating layer has a first structured metal layer, which is arranged above the piezoelectric elements and acts as a membrane.
  • Covering layer to be covered or covered.
  • each piezo element has a first electrode, wherein a first connection layer is arranged between the support surfaces and the first electrodes.
  • This first connection layer is electrically conductive.
  • it comprises a conductive first adhesive layer.
  • each piezoelectric element has a second electrode, the second electrode lying opposite the first electrode, and a second connecting layer being arranged in a horizontal direction between the first structured metal layer and the second electrodes.
  • Connection layer is electrically conductive.
  • it comprises a conductive second adhesive layer.
  • an electrically insulating layer is arranged on the perforated plate carrier, wherein the electrically insulating layer is connected directly to the terminating layer.
  • the advantage here is that crosstalk of the individual converter is low.
  • the electrically insulating layer has a greater thickness than the second connection layer.
  • the terminating layer has a second continuous metal layer, wherein the second continuous metal layer is opposite to the first structured metal layer.
  • the advantage here is that the piezoelectric elements both undergo a continuous EMC shielding and are protected against moisture, liquids and UV influences, since the final layer is robust and recoatable by the continuous metal layer.
  • the first recesses are at least partially filled with a damping material.
  • the damping material has in particular silicone. It is advantageous here that the sound transducer assembly is mechanically stabilized rearward.
  • the perforated plate carrier is electrically conductive. It has in particular a metal or a metallized ceramic.
  • the advantage here is that a simple way of providing an electrical ground for the sound transducer arrangement, which is connectable to the amplifier electronics.
  • conductor tracks are arranged within the terminating layer, which contact the second electrodes.
  • the method according to the invention for producing a sound transducer arrangement comprises connecting a plurality of piezo elements to a terminating layer, in particular by means of an electrically conductive first connecting layer, connecting a perforated plate carrier to the terminating layer and
  • first recesses and horizontally spaced second recesses, wherein each a first recess and a second recess are arranged adjacent to each other, wherein a horizontal extent of the second recess is greater than a horizontal extent of the first recess, so that within the
  • Aperture plate support surfaces form, so that the perforated plate carrier is connected by means of an electrically insulating adhesive layer with the terminating layer and the bearing surfaces are connected to the piezoelectric elements by means of an electrically conductive second connecting layer and at least a partial filling of the first recesses of the perforated plate carrier with a damping material.
  • Figure 1 shows a transducer assembly with a hole plate carrier, a plurality of piezo elements and a top layer and
  • FIG. 2 shows a process for the production of a novel composition
  • FIG. 1 shows a sound transducer arrangement 100 which has a hole plate carrier 101, a plurality of piezo elements 105 and a terminating layer 108.
  • the hole plate carrier 101 has first recesses 102 and second recesses
  • the horizontal extent of the second recess 102 is greater than the horizontal extent of the second recess 103, so that bearing surfaces within the perforated plate carrier
  • Each second recess 103 takes a single piezoelectric element
  • each piezoelectric element 105 at least partially on the
  • the piezoelectric elements 105 each have a first electrode 106 and a second electrode 107, wherein the first electrode
  • the second electrodes 107 are electrically conductively connected at the edge to the perforated plate carrier 101.
  • a second connection layer 112 is arranged on the bearing surfaces 104, which contacts the second electrodes 107.
  • the second connection layer 112 is in particular a conductive adhesive layer.
  • Hole plate carrier 101 with the end layer 108 an electrically insulating adhesive connection 115.
  • the hole plate carrier 101 is electrically non-conductive horizontally connected between the piezoelectric elements 105 with the terminating layer 108.
  • the insulating adhesive connection or Adhesive layer 115 has a thickness of 10 to 80 ⁇ and includes, for example, silicone-based or epoxy resin-based adhesive. This insulating
  • Adhesive bond 115 simultaneously acts as a tolerance compensation between the terminating layer 108 and the piezoelectric elements 105, so that the vibration generated by the piezoelectric elements 105 is not disturbed or changed.
  • the first electrodes 106 are by means of an electrically conductive first
  • the first recesses 102 are at least partially filled with a damping material 114.
  • the damping material 114 includes silicone, e.g. B. Fermasil.
  • the piezoelectric elements 105 have a thickness of 150-750 ⁇ m, preferably 200-500 ⁇ m.
  • the cover layer 108 comprises, for example, a flex foil comprising a polymer.
  • the end layer 108 comprises a flexible material such that the end layer 108 above the piezo elements 105 acts as a membrane.
  • the final layer 108 has a thickness of 50-750 ⁇ m.
  • Conductor tracks 113 which connect the second electrodes 107 of the piezoelectric elements 105 electrically to an amplifier electronics, are arranged within the terminating layer 108.
  • the hole plate carrier 101 is mechanically stiff and comprises electrically conductive material, for. As aluminum or a metallized ceramic.
  • the hole plate carrier 101 has a thickness of 1 - 10 mm and is electrically connected to the electrical ground of the amplifier electronics
  • the hole plate carrier 101 additionally ensures a mechanical decoupling of the piezoelectric elements 105th
  • Piezo elements 105 a lateral distance which is less than half the airborne sound wavelength of an operating frequency of the sound transducer assembly.
  • the operating frequency is in the range of 20 kHz to 150 kHz, preferably 50 kHz.
  • the acoustic transducer arrangement comprises between two and fifty piezoelectric elements 105, preferably two to twelve.
  • the piezo elements 105 are arranged in the form of an array.
  • the array may be linear, matrix-like, oval or circular.
  • the Schallwanlderanssen is in motor vehicles, moving or stationary
  • Machines for example robots, driverless transport systems,
  • FIG. 2 shows a method 200 for producing a sound transducer arrangement.
  • the method 200 starts by connecting 210 a plurality of piezoelectric elements and a terminating layer.
  • an electrically conductive first connecting layer in particular an adhesive layer, by means of dispensing or screen printing on the
  • Piezo elements applied and then applied with the first bonding layer on the final layer.
  • a following step 220 a
  • Punch plate carrier mechanically connected to the top layer.
  • the perforated plate carrier is electrically connected to the piezo elements.
  • an electrically insulating adhesive layer is applied in regions to the perforated plate carrier and used for connecting the
  • Piezo elements is an electrically conductive second connection layer, also preferably an adhesive layer, applied to the bearing surfaces.
  • first recesses of the perforated plate carrier are at least partially filled with a damping material.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Piezo-Electric Transducers For Audible Bands (AREA)

Abstract

Ensemble transducteur acoustique (100) comprenant : un support en plaque perforée (101) présentant des premiers évidements (102) agencés de manière espacée horizontalement et des deuxièmes évidements agencés de manière espacée horizontalement, un premier évidement (102) et un deuxième évidement (103) étant dans chaque cas agencés de manière adjacente l'un au-dessus de l'autre, l'étendue horizontale du deuxième évidement (103) étant supérieure à l'étendue horizontale du premier évidement (102) de sorte que des surfaces d'appui (104) sont formées à l'intérieur du support en plaque perforée (101) ; plusieurs éléments piézoélectriques (105) ; et une couche de recouvrement (108). L'invention se caractérise en ce que chaque deuxième évidement (103) présente un élément piézoélectrique (105) et les éléments piézoélectriques (105) sont disposés en partie sur les surfaces d'appui (104), chaque élément piézoélectrique (105) présentant une étendue horizontale qui est supérieure à celle du premier évidement (102) et inférieure à celle du deuxième évidement (103) de sorte que des cavités sont formées entre le support en plaque perforée (101) et les éléments piézoélectriques (105) dans la direction horizontale. L'invention se caractérise par ailleurs en ce que la couche de recouvrement (108) est disposée sur le support en plaque perforée (101) et les éléments piézoélectriques (105), la couche de recouvrement (108) présentant une première couche métallique structurée (109) qui est disposée au-dessus des éléments piézoélectriques (105) et qui fait fonction de membrane.
PCT/EP2016/074858 2015-12-10 2016-10-17 Ensemble transducteur acoustique comprenant une couche métallique structurée et procédé de fabrication d'un ensemble transducteur acoustique comprenant une couche métallique structurée WO2017097478A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201680071570.7A CN108290183A (zh) 2015-12-10 2016-10-17 具有结构化的金属层的声换能器组件和用于制造具有结构化金属层的声换能器组件的方法
EP16782063.8A EP3386649A1 (fr) 2015-12-10 2016-10-17 Ensemble transducteur acoustique comprenant une couche métallique structurée et procédé de fabrication d'un ensemble transducteur acoustique comprenant une couche métallique structurée

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102015224763.5A DE102015224763A1 (de) 2015-12-10 2015-12-10 Schallwandleranordnung und Verfahren zur Herstellung einer Schallwandleranordnung
DE102015224763.5 2015-12-10

Publications (1)

Publication Number Publication Date
WO2017097478A1 true WO2017097478A1 (fr) 2017-06-15

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2016/074858 WO2017097478A1 (fr) 2015-12-10 2016-10-17 Ensemble transducteur acoustique comprenant une couche métallique structurée et procédé de fabrication d'un ensemble transducteur acoustique comprenant une couche métallique structurée

Country Status (4)

Country Link
EP (1) EP3386649A1 (fr)
CN (1) CN108290183A (fr)
DE (1) DE102015224763A1 (fr)
WO (1) WO2017097478A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10888084B2 (en) 2015-07-15 2021-01-12 Nrg Systems, Inc. Ultrasonic bat deterrent system
US11399534B2 (en) 2015-11-03 2022-08-02 Nrg Systems, Inc. Techniques for providing a broad-band ultrasonic transducer device using a plurality of narrow-band transducer arrays and a method of wildlife deterrence using same

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114367431B (zh) * 2022-01-10 2023-05-23 京东方科技集团股份有限公司 一种换能器及其制备方法

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US4754440A (en) * 1985-12-27 1988-06-28 Aisin Seiki Kabushikikaisha Ultrasonic transducer
DE3920872A1 (de) 1989-06-26 1991-01-03 Siemens Ag Verfahren zur herstellung von ultraschall-wandlern, insbesondere von schichtwandlern, die ausser piezoelektrischem material auch kunststoffmaterial umfassen
DE102004047814A1 (de) 2003-10-01 2005-04-21 Gen Electric Fokussierende mikrobearbeitete Ultraschalltransducerarrays und diesbezügliche Herstellungsverfahren
US20080184802A1 (en) * 2007-02-05 2008-08-07 Denso Corporation Mount structure for sensor device
GB2493101A (en) * 2011-07-22 2013-01-23 Bosch Gmbh Robert An ultrasound sensor device and an array of such devices

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JPS6129596U (ja) * 1984-07-24 1986-02-22 谷口 義晴 超音波送受信具の構造
US5174926A (en) * 1988-04-07 1992-12-29 Sahagen Armen N Compositions for piezoresistive and superconductive application
US6058782A (en) * 1998-09-25 2000-05-09 Kulite Semiconductor Products Hermetically sealed ultra high temperature silicon carbide pressure transducers and method for fabricating same
JP3770114B2 (ja) * 2001-07-11 2006-04-26 株式会社村田製作所 圧電型電気音響変換器およびその製造方法
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JP6135088B2 (ja) * 2012-10-12 2017-05-31 セイコーエプソン株式会社 超音波トランスデューサーデバイス、プローブヘッド、超音波プローブ、電子機器及び超音波診断装置
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Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4754440A (en) * 1985-12-27 1988-06-28 Aisin Seiki Kabushikikaisha Ultrasonic transducer
DE3920872A1 (de) 1989-06-26 1991-01-03 Siemens Ag Verfahren zur herstellung von ultraschall-wandlern, insbesondere von schichtwandlern, die ausser piezoelektrischem material auch kunststoffmaterial umfassen
DE102004047814A1 (de) 2003-10-01 2005-04-21 Gen Electric Fokussierende mikrobearbeitete Ultraschalltransducerarrays und diesbezügliche Herstellungsverfahren
US20080184802A1 (en) * 2007-02-05 2008-08-07 Denso Corporation Mount structure for sensor device
GB2493101A (en) * 2011-07-22 2013-01-23 Bosch Gmbh Robert An ultrasound sensor device and an array of such devices

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10888084B2 (en) 2015-07-15 2021-01-12 Nrg Systems, Inc. Ultrasonic bat deterrent system
US11399534B2 (en) 2015-11-03 2022-08-02 Nrg Systems, Inc. Techniques for providing a broad-band ultrasonic transducer device using a plurality of narrow-band transducer arrays and a method of wildlife deterrence using same

Also Published As

Publication number Publication date
EP3386649A1 (fr) 2018-10-17
CN108290183A (zh) 2018-07-17
DE102015224763A1 (de) 2017-06-14

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