EP3386650B1 - Ensemble transducteur acoustique comprenant deux éléments de jonction disposés parallèlement et procédé de fabrication d'un ensemble transducteur acoustique comprenant deux éléments de jonction disposés parallèlement - Google Patents

Ensemble transducteur acoustique comprenant deux éléments de jonction disposés parallèlement et procédé de fabrication d'un ensemble transducteur acoustique comprenant deux éléments de jonction disposés parallèlement Download PDF

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Publication number
EP3386650B1
EP3386650B1 EP16788685.2A EP16788685A EP3386650B1 EP 3386650 B1 EP3386650 B1 EP 3386650B1 EP 16788685 A EP16788685 A EP 16788685A EP 3386650 B1 EP3386650 B1 EP 3386650B1
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EP
European Patent Office
Prior art keywords
transducer arrangement
sound transducer
termination layer
webs
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP16788685.2A
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German (de)
English (en)
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EP3386650A1 (fr
Inventor
Bernd SCHEUFELE
Andre Gerlach
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
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Robert Bosch GmbH
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
    • B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface
    • G—PHYSICS
    • G10—MUSICAL INSTRUMENTS; ACOUSTICS
    • G10K—SOUND-PRODUCING DEVICES; METHODS OR DEVICES FOR PROTECTING AGAINST, OR FOR DAMPING, NOISE OR OTHER ACOUSTIC WAVES IN GENERAL; ACOUSTICS NOT OTHERWISE PROVIDED FOR
    • G10K11/00—Methods or devices for transmitting, conducting or directing sound in general; Methods or devices for protecting against, or for damping, noise or other acoustic waves in general
    • G10K11/004—Mounting transducers, e.g. provided with mechanical moving or orienting device
    • G—PHYSICS
    • G10—MUSICAL INSTRUMENTS; ACOUSTICS
    • G10K—SOUND-PRODUCING DEVICES; METHODS OR DEVICES FOR PROTECTING AGAINST, OR FOR DAMPING, NOISE OR OTHER ACOUSTIC WAVES IN GENERAL; ACOUSTICS NOT OTHERWISE PROVIDED FOR
    • G10K9/00—Devices in which sound is produced by vibrating a diaphragm or analogous element, e.g. fog horns, vehicle hooters or buzzers
    • G10K9/18—Details, e.g. bulbs, pumps, pistons, switches or casings
    • G10K9/22—Mountings; Casings

Definitions

  • the invention relates to a sound transducer arrangement according to the preamble of claim 1 and a method for producing such a sound transducer arrangement.
  • the document DE 39 20 872 A1 discloses a method for the production of ultrasonic layer transducers in which the piezoceramic and thermoplastic plastic material of the layer transducer are connected to one another by hot glueing. To generate the heat required for bonding, heat loss is produced in the piezoceramic by applying electrical signals
  • the font DE102008007042 A1 discloses a mounting structure for a sensor device with an ultrasonic transducer.
  • the disadvantage here is that the individual ultrasonic transducers are exposed to external influences, both mechanical and electrical.
  • the sound transducer arrangement comprises a perforated plate carrier with several through openings, several piezo elements and a cover layer.
  • Each piezo element has a first electrode and a second electrode. The first electrode is opposite the second electrode.
  • a piezo element is arranged within each passage opening.
  • the closing layer is arranged above the perforated plate carrier and the piezo elements, the second electrodes of the piezo elements being connected to the closing layer in an electrically conductive manner.
  • the perforated plate carrier has laterally between two through openings at least two webs arranged parallel to one another and spaced apart from one another.
  • the final layer has first connection areas with the webs that directly adjoin the through opening.
  • the advantage here is that successive bending transducers are decoupled from one another.
  • the terminating layer has a second connection area in each case with the web which follows the web directly adjoining the through opening.
  • the advantage here is that the decoupling between the individual bending transducers is more efficient.
  • the first connection area comprises a weld seam or an adhesive layer.
  • the second connection layer comprises a weld seam or adhesive layer.
  • the closing layer is formed in one piece.
  • the advantage here is that the assembly of bending transducer elements is completely protected from external influences.
  • the end layer has two slits each, which are arranged symmetrically with respect to a piezo element, the ends of the slits being connected to the first connection areas.
  • the slots are rectangular.
  • the slots are arcuate.
  • the method according to the invention for producing a sound transducer arrangement with a plurality of through openings and at least two parallel webs, a plurality of piezo elements and a cover layer which has a plurality of slots comprises the connection of second electrodes of the piezo elements to the connection layer. Furthermore, the method comprises the contacting of first electrodes of the piezo elements by means of wire bonding, the first electrodes being arranged opposite the second electrodes. Furthermore, the method comprises connecting the slot ends of the closing layer to the webs of the perforated plate carrier that directly adjoin the through openings, in particular by means of weld seams, and partially filling the through openings with a damping material.
  • a plastic film is glued onto the top layer.
  • the advantage here is that the transducer arrangement is sealed.
  • Figure 1 shows a sectional illustration in the xz plane of a sound transducer arrangement 100.
  • the sound transducer arrangement 100 shows, by way of example, three sound transducer elements or bending transducer elements 115, which are arranged parallel to one another and spaced apart.
  • a bending transducer element 115 comprises a piezo element 104, a membrane 114 which is formed with the aid of a closing layer 103, a perforated plate carrier 101 and damping material.
  • the perforated plate carrier 101 comprises a plurality of through openings 111 or holes and has an upper side and a lower side, which are arranged opposite one another. On the upper side, webs 102 are arranged, which are arranged parallel to one another.
  • These webs 102 are at a minimum distance from one another, the minimum distance corresponding to the size of the through opening 111. This means that the webs 102 directly adjoin the through openings 111.
  • the piezo elements 104 are arranged within the through openings 111, each through opening 111 receiving a piezo element 104 which is introduced into the through opening 111 from the top or is flush with the top.
  • the piezo elements 104 have smaller dimensions than the through openings 111.
  • the terminating layer 103 has slots which are arranged parallel to one another at a distance from one another and are connected by the first connecting regions 108. This means that if the slots are rectangular, the membrane is rectangular. In the case of arcuate slots, the membrane is designed to be undulating.
  • Each piezo element 104 has a first electrode 105 and a second electrode 106.
  • the first electrode 105 is connected, for example, to an amplifier circuit by means of a wire connection 112 and functions as a signal line or signal contact.
  • the second electrode 106 is electrically conductively connected to the closing layer 103 by means of an adhesive layer 107.
  • the termination layer 103 is connected to an electrical ground, for example the amplifier circuit ground. This means that the second electrode 105 is grounded, as a result of which EMC shielding takes place.
  • the piezo elements 104 can be connected in an electrically conductive manner to the electrical ground and the amplifier circuit via two wire connections.
  • the second electrode 106 is recontacted over the edge of the piezo element 104, so that on the side of the first electrode 105 there are two electrode areas that are separate from one another and can be contacted separately from one another.
  • the piezo elements 104 can be connected to the closing layer 103 with an electrically non-conductive adhesive layer.
  • Each flexural transducer element 115 has a first connecting region 108 which sets or ensures the edge restraint of the flexural transducer element 115 or of the membrane 114.
  • the term first connection area 108 is understood to mean the areas in which there is a mechanical connection between the closing layer 103 and the webs 102 of the perforated plate carrier 101, which directly adjoins the through opening 111.
  • the first connecting areas 103 are arranged at a distance from the through openings 111 in parallel. This means that the lateral distance between the first connection regions 108 is greater than the dimensions of the through opening 111.
  • further webs 117 are arranged laterally spaced apart, ie at least one further web 117. That means, the further webs 117 run parallel to webs 102. webs 102 and further webs 117 are separated by recesses 116 in the top of perforated plate carrier 101.
  • the recesses 116 are at a distance of 0.1 mm-1 mm from the weld seams of the first connection regions 108.
  • the lateral distance between the webs 102 and the further webs is 0.1 mm-2 mm.
  • the depth of the recesses 116 is at least 0.1 mm. Areas of the closing layer 103 that are capable of local oscillation are produced by the cutouts 116, so that the membranes 114 can absorb and dissipate oscillation energy.
  • second connection areas 109 are arranged laterally spaced apart. The distance is formed by the recess 116 between the webs 102 and 117.
  • the second connection areas 109 are arranged on the further webs 117 and also include weld seams.
  • further connection areas can be present around the second connection areas 109, which likewise have weld seams.
  • the number of connection areas corresponds to the number of webs which run parallel to the through openings 111. In other words, a plurality of webs 117 and a plurality of recesses 116 are alternately arranged laterally next to one another around the through openings 111. This serves to improve the decoupling between two sound transducer elements.
  • the recesses 102 can optionally be filled, for example, with a silicone-containing damping material.
  • the piezo elements 104 have a thickness of 100 ⁇ m-750 ⁇ m, and 150 ⁇ m-500 ⁇ m.
  • the perforated plate carrier 101 has a thickness of 0.5 mm-15 mm, preferably 1 mm-10 mm.
  • FIG. 2 shows a plan view of the first embodiment of the closing layer 203.
  • Three bending transducer elements are shown by way of example, which are arranged parallel or in a line to one another.
  • the rectangular closing layer 203 is shown, which covers the three piezo elements 204.
  • the first connection area 208 which is the edge tension of the sets the respective bending transducer and the second connection area 209, which serves as a decoupling between the bending transducers, is shown.
  • Slits 213 are arranged at right angles to the first connecting regions 208.
  • the slots 213 are mechanically connected to the first connection areas. This means that the slots 213 and the first connecting areas 208 form the membrane of the respective bending transducer element.
  • the piezo elements are designed to be rectangular or square.
  • FIG. 6 shows a top view of the second embodiment of the final layer 303.
  • FIG. 6 shows a top view of the second embodiment of the final layer 303.
  • FIG. 3 that have the same characteristics as in Figure 2 represent, have identical trailing positions of the reference numerals such as Figure 2 on.
  • the slots are arcuate and the piezo elements 304 are round.
  • Figure 4 shows the method for producing a sound transducer arrangement which has a perforated plate carrier with a plurality of through openings at least two parallel webs, a plurality of piezo elements and a cover layer.
  • the method 400 starts with a step 410, in which second electrodes of the piezo elements are connected to the final layer.
  • first electrodes of the piezo elements are electrically connected or contacted by means of wire bonding.
  • the first electrode is opposite the second electrode.
  • the slot ends of the closing layer and the webs which directly adjoin the through openings are connected by means of first connection areas, for example with weld seams.
  • the through openings are at least partially filled with a damping material, in particular from the side which is arranged facing away from the closing layer, ie the rear side of the perforated plate carrier.
  • a plastic film is glued to the top layer.
  • the sound transducer arrangement 100 is used in motor vehicles, moving or stationary machines, such as robots, driverless transport systems, logistics systems in warehouses, vacuum cleaners, lawnmowers. Of Furthermore, the sound transducer arrangement 100 can be used in e-bikes, electric wheelchairs and in aids to support physically handicapped people.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Piezo-Electric Transducers For Audible Bands (AREA)
  • Ultra Sonic Daignosis Equipment (AREA)

Claims (10)

  1. Ensemble transducteur acoustique (100), comprenant
    • un support de plaque perforée (101) doté de plusieurs ouvertures de passage (111),
    • plusieurs éléments piézoélectriques (104), chaque élément piézoélectrique (104) présentant une première électrode (105) et une deuxième électrode (106), la première électrode (105) étant opposée à la deuxième électrode (106), et respectivement un élément piézoélectrique (104) étant disposé à l'intérieur d'une ouverture de passage (111), et
    • une couche de recouvrement (103), la couche de recouvrement (103) étant disposée au-dessus du support de plaque perforée (101) et des éléments piézoélectriques (104), les deuxièmes électrodes (106) des éléments piézoélectriques (104) étant reliées de manière électriquement conductrice à la couche de recouvrement (103),
    caractérisé en ce que le support de plaque perforée (101) présente latéralement entre deux ouvertures de passage (111) au moins deux entretoises (102, 117) disposées parallèlement à distance l'une de l'autre, et la couche de recouvrement (103) présente des premières zones de liaison (108) respectivement avec les entretoises (102) qui sont directement adjacentes à l'ouverture de passage (111).
  2. Ensemble transducteur acoustique (100) selon la revendication 1, caractérisé en ce que la couche de recouvrement (103) présente une deuxième zone de liaison (109) respectivement avec l'entretoise (117) qui suit l'entretoise (102) directement adjacente à l'ouverture de passage.
  3. Ensemble transducteur acoustique (100) selon l'une quelconque des revendications précédentes, caractérisé en ce que la première zone de liaison (108) comprend une soudure ou une couche adhésive.
  4. Ensemble transducteur acoustique (100) selon l'une quelconque des revendications 2 ou 3, caractérisé en ce que la deuxième zone de liaison (109) comprend une soudure ou une couche adhésive.
  5. Ensemble transducteur acoustique (100) selon l'une quelconque des revendications précédentes, caractérisé en ce que la couche de recouvrement (103) est réalisée d'un seul tenant.
  6. Ensemble transducteur acoustique (100) selon l'une quelconque des revendications précédentes, caractérisé en ce que la couche de recouvrement (103) présente respectivement deux encoches (213, 313) qui sont disposées à distance en symétrie par rapport à un élément piézoélectrique (104), les extrémités d'encoche étant reliées à la première zone de liaison (108).
  7. Ensemble transducteur acoustique selon la revendication 6, caractérisé en ce que les encoches (213, 313) sont rectangulaires.
  8. Ensemble transducteur acoustique selon la revendication 6, caractérisé en ce que les encoches (213, 313) sont configurées en forme d'arc.
  9. Procédé (300) de fabrication d'un ensemble transducteur acoustique comprenant un support de plaque perforée doté de plusieurs ouvertures de passage et d'au moins deux entretoises parallèles, plusieurs éléments piézoélectriques et une couche de recouvrement qui présente des encoches, comprenant les étapes consistant à :
    • relier (310) des deuxièmes électrodes des éléments piézoélectriques à la couche de recouvrement,
    • mettre en contact (320) des premières électrodes des éléments piézoélectriques par soudage des connexions, les premières électrodes étant disposées à l'opposé des deuxièmes électrodes,
    • relier (330) au moyen d'une soudure les extrémités d'encoche de la couche de recouvrement et les entretoises du support de plaque perforée qui sont directement adjacentes aux ouvertures de passage, et
    • combler partiellement (340) les ouvertures de passage avec un matériau amortissant.
  10. Procédé (300) selon la revendication 9, caractérisé en ce qu'une feuille de plastique est collée sur la couche de recouvrement.
EP16788685.2A 2015-12-10 2016-10-28 Ensemble transducteur acoustique comprenant deux éléments de jonction disposés parallèlement et procédé de fabrication d'un ensemble transducteur acoustique comprenant deux éléments de jonction disposés parallèlement Active EP3386650B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102015224773.2A DE102015224773A1 (de) 2015-12-10 2015-12-10 Schallwandleranordnung mit zwei parallel angeordneten Stegen und Verfahren zur Herstellung einer Schallwandleranordnung mit zwei parallel angeordneten Stegen
PCT/EP2016/076078 WO2017097496A1 (fr) 2015-12-10 2016-10-28 Ensemble transducteur acoustique comprenant deux éléments de jonction disposés parallèlement et procédé de fabrication d'un ensemble transducteur acoustique comprenant deux éléments de jonction disposés parallèlement

Publications (2)

Publication Number Publication Date
EP3386650A1 EP3386650A1 (fr) 2018-10-17
EP3386650B1 true EP3386650B1 (fr) 2021-04-14

Family

ID=57218891

Family Applications (1)

Application Number Title Priority Date Filing Date
EP16788685.2A Active EP3386650B1 (fr) 2015-12-10 2016-10-28 Ensemble transducteur acoustique comprenant deux éléments de jonction disposés parallèlement et procédé de fabrication d'un ensemble transducteur acoustique comprenant deux éléments de jonction disposés parallèlement

Country Status (4)

Country Link
EP (1) EP3386650B1 (fr)
CN (1) CN108367315B (fr)
DE (1) DE102015224773A1 (fr)
WO (1) WO2017097496A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102022124937A1 (de) 2022-09-28 2024-03-28 Valeo Schalter Und Sensoren Gmbh Ultraschallsensor für ein kraftfahrzeug, kraftfahrzeug und herstellungsverfahren für einen ultraschallsensor

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4754440A (en) * 1985-12-27 1988-06-28 Aisin Seiki Kabushikikaisha Ultrasonic transducer
DE3920872A1 (de) 1989-06-26 1991-01-03 Siemens Ag Verfahren zur herstellung von ultraschall-wandlern, insbesondere von schichtwandlern, die ausser piezoelektrischem material auch kunststoffmaterial umfassen
US20050075572A1 (en) 2003-10-01 2005-04-07 Mills David M. Focusing micromachined ultrasonic transducer arrays and related methods of manufacture
JP2008191007A (ja) * 2007-02-05 2008-08-21 Denso Corp センサ装置の取り付け構造
DE102014207681A1 (de) * 2014-04-24 2015-10-29 Robert Bosch Gmbh Membran für einen Ultraschallwandler und Ultraschallwandler

Also Published As

Publication number Publication date
CN108367315B (zh) 2020-09-25
CN108367315A (zh) 2018-08-03
EP3386650A1 (fr) 2018-10-17
WO2017097496A1 (fr) 2017-06-15
DE102015224773A1 (de) 2017-06-14

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