WO2017097473A1 - Ensemble transducteur acoustique comprenant des éléments de jonction concentriques et procédé de fabrication d'un ensemble transducteur acoustique comprenant des éléments de jonction concentriques - Google Patents

Ensemble transducteur acoustique comprenant des éléments de jonction concentriques et procédé de fabrication d'un ensemble transducteur acoustique comprenant des éléments de jonction concentriques Download PDF

Info

Publication number
WO2017097473A1
WO2017097473A1 PCT/EP2016/074679 EP2016074679W WO2017097473A1 WO 2017097473 A1 WO2017097473 A1 WO 2017097473A1 EP 2016074679 W EP2016074679 W EP 2016074679W WO 2017097473 A1 WO2017097473 A1 WO 2017097473A1
Authority
WO
WIPO (PCT)
Prior art keywords
layer
plate carrier
sound transducer
perforated plate
electrode
Prior art date
Application number
PCT/EP2016/074679
Other languages
German (de)
English (en)
Inventor
Bernd SCHEUFELE
Andre Gerlach
Original Assignee
Robert Bosch Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch Gmbh filed Critical Robert Bosch Gmbh
Priority to EP16781791.5A priority Critical patent/EP3386647A1/fr
Priority to CN201680072499.4A priority patent/CN108367314A/zh
Publication of WO2017097473A1 publication Critical patent/WO2017097473A1/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
    • B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface
    • G—PHYSICS
    • G10—MUSICAL INSTRUMENTS; ACOUSTICS
    • G10K—SOUND-PRODUCING DEVICES; METHODS OR DEVICES FOR PROTECTING AGAINST, OR FOR DAMPING, NOISE OR OTHER ACOUSTIC WAVES IN GENERAL; ACOUSTICS NOT OTHERWISE PROVIDED FOR
    • G10K11/00—Methods or devices for transmitting, conducting or directing sound in general; Methods or devices for protecting against, or for damping, noise or other acoustic waves in general
    • G10K11/004—Mounting transducers, e.g. provided with mechanical moving or orienting device

Definitions

  • the invention relates to a sound transducer assembly according to the preamble of claim 1 and a method for producing such
  • Document DE 39 20 872 A1 discloses a method for the production of ultrasound layer transducers in which the piezoceramic and thermoplastic plastic material of the layer converter are connected to one another by heat bonding. To generate the heat necessary for bonding, heat loss is produced in the piezoceramic by applying electrical signals.
  • Document DE 10 2004 047 814 A1 describes a focusing micromachined ultrasound transducer array which can be used as a focusing clinically usable ultrasound probe. Lateral side by side trained transducer cells are partially wired together electrically to achieve the desired focus of the ultrasonic conversion.
  • the sound transducer assembly comprises a hole plate carrier with a plurality of through holes, a plurality of piezoelectric elements and a terminating layer
  • Each piezoelectric element in this case has a first electrode and a second electrode. The first electrode faces the second electrode. Within a passage opening, a piezoelectric element is arranged in each case.
  • Finishing layer is disposed above the perforated plate carrier and the piezoelectric elements, wherein the second electrodes of the piezoelectric elements with the
  • the hole plate carrier laterally between two passage openings at least two concentric webs, which have a common center with one of the two passage openings.
  • the terminating layer has a first connection region with the web, which directly adjoins the respective through-opening.
  • Biewandlerium is provided in a simple manner.
  • the finishing layer has a second connection region, in each case with the web, which follows the web directly adjoining the through-opening.
  • the first connection region comprises a weld seam or an adhesive layer
  • the second connection region comprises a weld seam or adhesive layer
  • finishing layer is designed in one piece.
  • the outer layer and the perforated plate carrier have a third connection region.
  • the third connection region connects an edge region of the terminating layer to an edge region of the
  • connection region as a seal of the entire sound transducer arrangement with respect to z. As moisture and liquids acts.
  • the third connection layer comprises a weld seam.
  • Sound transducer assembly comprising a perforated plate carrier with several
  • the method further comprises contacting first electrodes of the
  • Piezo elements by wire bonding wherein the first electrodes are arranged opposite to the second electrodes and connecting the
  • the method includes partially filling the through openings with a damping material
  • the advantage here is that the transducer assembly can be cost-optimized and easily manufactured.
  • Figure 2 shows a second embodiment of the invention
  • Figure 3 shows a process for the preparation of the inventive
  • FIG. 1 shows a sectional illustration in the xz plane of a first embodiment of the sound transducer arrangement 100.
  • the sound transducer arrangement 100 shows, by way of example, three sound transducer elements or bending transducer elements 115 which are arranged parallel to one another and spaced apart from one another.
  • a bending transducer element 115 in this case comprises a piezoelement 104, a membrane 114 which uses a
  • Finishing layer 103 is formed, a perforated plate support 101 and
  • the perforated plate carrier 101 comprises several
  • Duchgangsö réelleen 111 and holes and has an upper side and a lower side, which are arranged opposite one another.
  • On the top webs 102 are arranged, which are arranged concentrically around the through holes 111.
  • the webs 102 in this case directly adjoin the passage openings 111.
  • Piezo elements 104 are likewise arranged concentrically with respect to through openings 111, wherein each through opening 111 in each case accommodates a piezoelement 104, which is introduced from the upper side into through opening 111 or terminates flush with the upper side.
  • the piezoelectric elements 104 have a smaller diameter than the passage openings 111. In other words, the piezoelement 104 is located within the passage opening 111 or the Hole.
  • Each piezo element 104 has a first electrode 105 and a second electrode 106.
  • the first electrode 105 is connected to a booster circuit by means of a wire connection, for example, and functions as
  • the second electrode 106 is by means of a
  • Finishing layer 103 is provided with an electrical ground, for example the
  • the piezo elements 104 can be electrically conductively connected via two wire connections to the electrical ground and the amplifier circuit.
  • the second electrode 106 is contacted over the edge of the piezoelectric element 104, so that on the side of the first electrode 105 there are two separate electrode regions, which can be contacted separately from one another.
  • the piezoelements 104 can be connected to the terminating layer 103 with an electrically nonconductive adhesive layer.
  • Each bending transducer element 115 has a first connection region 108, which adjusts or ensures the edge clamping of the bending transducer element 115 or the membrane 114.
  • the term "first connection region 108" is understood to mean the regions in which a mechanical connection takes place between the end layer 103 and the web 102 of the perforated plate carrier 101, which adjoins the through-opening 111 directly.
  • the first connection portions 108 are concentrically arranged around the through holes 111 and have a larger diameter than the
  • Recesses 116 have a distance of 0.1 mm -1 mm to the welds of the first connection regions 108.
  • the lateral distance between the bars 102 and the other webs 117 is 0.1 - 2 mm.
  • the depth of the recesses 116 comprises at least 0.1 mm.
  • Membranes 114 absorb vibration energy and can dissipate.
  • second connection regions 109 are arranged concentrically.
  • the second connection regions 109 have a lateral distance from the first connection regions 108.
  • These second connection regions 109 are arranged on the further webs 117 and also comprise weld seams.
  • the second connection regions 109 are arranged on the further webs 117 and also comprise weld seams.
  • Connecting areas 109 further concentrically arranged
  • the number of concentric connection regions corresponds to the concentric webs 102 and 117 around a through-opening 111.
  • a plurality of webs 117 and a plurality of recesses 116 are arranged laterally next to one another around the through-openings 111, a circular web 102 being directly adjacent to the through-openings 111 is arranged. This serves for improved decoupling between two sound transducer elements.
  • the recesses 116 may be filled, for example, with a silicone-containing damping material.
  • Punch plate carrier 101 a third connection portion 110 is provided.
  • the term edge region is understood here to mean an area with a lateral distance to the outer edge of the outer layer of 0.1 mm-1 mm.
  • the piezoelectric elements 104 have a thickness of 100 ⁇ - 750 ⁇ , of 150 ⁇ - 500 ⁇ .
  • the hole plate carrier 101 has a thickness of 0.5 mm - 15 mm, preferably from 1 mm - 10 mm.
  • the final layer 103 has a thickness of 50 ⁇ - 750 ⁇ on.
  • Finishing layer 103 is overpaintable and protects the sound transducer assembly 100 against moisture, liquids and mechanical effects.
  • a plastic film may be arranged on the finishing layer 103.
  • Plastic film is preferably with an epoxy resin adhesive on the
  • the epoxy adhesive also acts as a tolerance compensation for the realization of particularly flat surfaces.
  • the epoxy adhesive can be scrape.
  • the plastic film comprises, for example, polyimide or a composite material of metal and plastic or carbon fiber fabric and resin.
  • the end layer 103 comprises metal, e.g. B.
  • Finishing layer 103 is completely electrically conductive.
  • end layer 103 plastic z. B. PES, PVDF, glass fiber composites or
  • Carbon fiber composites wherein the side of the end layer 103, which is connected to the perforated plate support 101, a metal layer.
  • the damping material is preferably silicone-containing.
  • the basic shape of the piezo elements 104, the bending transducer elements 115 and the passage openings 111 are arbitrary. Preferably, they have regular shapes, z. Square, rectangular, polygonal, circular or elliptical. In a sound transducer assembly 100, the basic shapes of the piezo elements 104, flexural transducer elements 115, and through holes 111 may be the same or different.
  • the acoustic transducer assemblies 100 may have a number of 2 - 250
  • FIG. 1b shows a plan view of the first embodiment of the sound transducer arrangement 100 according to the invention.
  • three bending transducer elements 115 are shown, which are arranged parallel to one another or in a line to one another.
  • the rectangular end layer 103 is shown, which are the three Piezo elements 104 covered.
  • the first connection region 108 which adjusts the edge stress of the respective bending transducer
  • the second connection region 109 which acts as a decoupling between the bending transducers and the third connection region 110, for example
  • FIG. 2 shows a sectional illustration in the xz plane of a second embodiment of the sound transducer arrangement 200.
  • FIG. 2 which represent the same features as in FIG. 1 have identical rear locations of the reference symbols as in FIG. In FIG. 2, the first connection regions 208, which
  • FIG. 3 shows the method for producing a sound transducer arrangement which has a perforated plate carrier with a plurality of through openings and a plurality of concentric bars, a plurality of piezoelements and a terminating layer.
  • the method 300 starts with a step 310, in the second
  • Electrodes of the piezo elements are connected to the terminating layer.
  • first electrodes of the piezoelectric elements are electrically connected or contacted by wire bonding. This is the first
  • the passage openings are at least partially with a
  • Filling material is filled, especially from the side, by the
  • the acoustic transducer assemblies 100 and 200 find in motor vehicles, moving or stationary machines, such as robots, driverless transport systems,
  • the sound transducer assembly 100 and 200 in e-bikes, electric Wheelchairs and aids are used to assist physically disabled people.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Piezo-Electric Transducers For Audible Bands (AREA)
  • Transducers For Ultrasonic Waves (AREA)

Abstract

Ensemble transducteur acoustique (100) comprenant : un support en plaque perforée (101) présentant plusieurs ouvertures de passage (111) ; plusieurs éléments piézoélectriques (104), chaque élément piézoélectrique (104) présentant une première électrode (105) et une deuxième électrode (106), la première électrode (105) étant placée en vis-à-vis de la deuxième électrode (106) et chaque élément piézoélectrique (104) étant agencé dans une ouverture de passage (111) correspondante ; ainsi qu'une couche de recouvrement (103), cette couche de recouvrement (103) étant placée au-dessus du support en plaque perforée (101) et des éléments piézoélectriques (104), les deuxièmes électrodes (106) des éléments piézoélectriques (104) étant reliées de manière électriquement conductrice à la couche de recouvrement (103). L'invention se caractérise en ce que le support en plaque perforée (101) présente latéralement entre deux ouvertures de passage (111) au moins deux éléments de jonction (102) concentriques qui présentent un centre commun avec une des deux ouvertures de passage (111), et en ce que la couche de recouvrement (103) présente une première zone de liaison (108) avec l'élément de jonction (102) qui est directement adjacent à l'ouverture de passage (111).
PCT/EP2016/074679 2015-12-10 2016-10-14 Ensemble transducteur acoustique comprenant des éléments de jonction concentriques et procédé de fabrication d'un ensemble transducteur acoustique comprenant des éléments de jonction concentriques WO2017097473A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP16781791.5A EP3386647A1 (fr) 2015-12-10 2016-10-14 Ensemble transducteur acoustique comprenant des éléments de jonction concentriques et procédé de fabrication d'un ensemble transducteur acoustique comprenant des éléments de jonction concentriques
CN201680072499.4A CN108367314A (zh) 2015-12-10 2016-10-14 具有同心接片的声换能器组件和用于制造具有同心接片的声换能器组件的方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102015224772.4A DE102015224772A1 (de) 2015-12-10 2015-12-10 Schallwandleranordnung mit konzentrischen Stegen und Verfahren zur Herstellung einer Schallwandleranordnung mit konzentrischen Stegen
DE102015224772.4 2015-12-10

Publications (1)

Publication Number Publication Date
WO2017097473A1 true WO2017097473A1 (fr) 2017-06-15

Family

ID=57136889

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2016/074679 WO2017097473A1 (fr) 2015-12-10 2016-10-14 Ensemble transducteur acoustique comprenant des éléments de jonction concentriques et procédé de fabrication d'un ensemble transducteur acoustique comprenant des éléments de jonction concentriques

Country Status (4)

Country Link
EP (1) EP3386647A1 (fr)
CN (1) CN108367314A (fr)
DE (1) DE102015224772A1 (fr)
WO (1) WO2017097473A1 (fr)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4754440A (en) * 1985-12-27 1988-06-28 Aisin Seiki Kabushikikaisha Ultrasonic transducer
DE3920872A1 (de) 1989-06-26 1991-01-03 Siemens Ag Verfahren zur herstellung von ultraschall-wandlern, insbesondere von schichtwandlern, die ausser piezoelektrischem material auch kunststoffmaterial umfassen
DE102004047814A1 (de) 2003-10-01 2005-04-21 Gen Electric Fokussierende mikrobearbeitete Ultraschalltransducerarrays und diesbezügliche Herstellungsverfahren
US20080184802A1 (en) * 2007-02-05 2008-08-07 Denso Corporation Mount structure for sensor device
GB2493101A (en) * 2011-07-22 2013-01-23 Bosch Gmbh Robert An ultrasound sensor device and an array of such devices
EP2937857A2 (fr) * 2014-04-24 2015-10-28 Robert Bosch Gmbh Membrane pour un transducteur d'ultrasons et transducteur d'ultrasons

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5220538A (en) * 1991-08-08 1993-06-15 Raytheon Company Electro-acoustic transducer insulation structure
JPH1152958A (ja) * 1997-08-05 1999-02-26 Murata Mfg Co Ltd 圧電型電気音響変換器
CN1234470C (zh) * 2002-07-17 2006-01-04 陕西师范大学 高稳定性超声换能器的制备工艺

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4754440A (en) * 1985-12-27 1988-06-28 Aisin Seiki Kabushikikaisha Ultrasonic transducer
DE3920872A1 (de) 1989-06-26 1991-01-03 Siemens Ag Verfahren zur herstellung von ultraschall-wandlern, insbesondere von schichtwandlern, die ausser piezoelektrischem material auch kunststoffmaterial umfassen
DE102004047814A1 (de) 2003-10-01 2005-04-21 Gen Electric Fokussierende mikrobearbeitete Ultraschalltransducerarrays und diesbezügliche Herstellungsverfahren
US20080184802A1 (en) * 2007-02-05 2008-08-07 Denso Corporation Mount structure for sensor device
GB2493101A (en) * 2011-07-22 2013-01-23 Bosch Gmbh Robert An ultrasound sensor device and an array of such devices
EP2937857A2 (fr) * 2014-04-24 2015-10-28 Robert Bosch Gmbh Membrane pour un transducteur d'ultrasons et transducteur d'ultrasons

Also Published As

Publication number Publication date
EP3386647A1 (fr) 2018-10-17
CN108367314A (zh) 2018-08-03
DE102015224772A1 (de) 2017-06-14

Similar Documents

Publication Publication Date Title
EP3320694B1 (fr) Module à carte de circuit imprimé mems à structure piézoélectrique intégrée et ensemble transducteur acoustique
EP3381202B1 (fr) Unité carte de circuit imprimé mems souple et ensemble transducteur acoustique
DE19922148C2 (de) Piezoelektrisches akustisches Bauteil
WO2011073414A2 (fr) Ensemble oscillant pour transducteur ultrasonore et procédé de fabrication de cet ensemble oscillant
EP3295680A1 (fr) Module à carte de circuit imprimé muni d'un évidement traversant, ensemble transducteur acoustique associé et procédé de fabrication
DE102008027970B4 (de) Ultraschallsensor
EP3386649A1 (fr) Ensemble transducteur acoustique comprenant une couche métallique structurée et procédé de fabrication d'un ensemble transducteur acoustique comprenant une couche métallique structurée
WO2018141544A1 (fr) Transducteur planar dynamique
WO2013120754A2 (fr) Ensemble transducteur acoustique
DE102011052767B4 (de) Ultraschalltransducer für einen Näherungssensor
EP3386650B1 (fr) Ensemble transducteur acoustique comprenant deux éléments de jonction disposés parallèlement et procédé de fabrication d'un ensemble transducteur acoustique comprenant deux éléments de jonction disposés parallèlement
WO2017097474A1 (fr) Ensemble transducteur acoustique comprenant des zones de liaison annulaires et procédé de fabrication d'un ensemble transducteur acoustique comprenant des zones de liaison annulaires
EP3600698A1 (fr) Transducteur acoustique comprenant un élément transducteur piézocéramique intégré dans une membrane oscillante
EP3386647A1 (fr) Ensemble transducteur acoustique comprenant des éléments de jonction concentriques et procédé de fabrication d'un ensemble transducteur acoustique comprenant des éléments de jonction concentriques
DE102018105501B4 (de) Abschirmvorrichtung für eine Ultraschallsensorvorrichtung und Verfahren zur Herstellung einer Ultraschallsensorvorrichtung
DE102015110939B4 (de) Ultraschallsensor für ein Kraftfahrzeug, Kraftfahrzeug sowie Verfahren zum Herstellen eines Ultraschallsensors
WO2020011956A1 (fr) Capteur tactile à résolution spatiale et procédé de fabrication d'un capteur tactile à résolution spatiale
EP3101441A1 (fr) Convertisseur d'ultrasons
EP3853915B1 (fr) Convertisseur électromécanique à structure stratifiée
WO2016128090A1 (fr) Système de transducteurs acoustiques
WO2021078589A1 (fr) Transducteur diélectrique, son procédé de fabrication et actionneur, capteur ou générateur
EP3386646A1 (fr) Ensemble transducteur acoustique comprenant des éléments flexibles et procédé de fabrication d'un ensemble transducteur acoustique comprenant des éléments flexibles
EP3374235B1 (fr) Sonde acoustique pour l'émission et/ou la réception de signaux acoustiques
DE102010000968A1 (de) Sonotrode für eine Ultraschall-Schweißanlage
DE202022100478U1 (de) MEMS-Schallwandler mit Elektronikeinheit

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 16781791

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE