WO2017095005A1 - Film adhésif pour dispositif électronique organique et matériau organique d'encapsulation d'un dispositif électronique organique le comprenant - Google Patents

Film adhésif pour dispositif électronique organique et matériau organique d'encapsulation d'un dispositif électronique organique le comprenant Download PDF

Info

Publication number
WO2017095005A1
WO2017095005A1 PCT/KR2016/010884 KR2016010884W WO2017095005A1 WO 2017095005 A1 WO2017095005 A1 WO 2017095005A1 KR 2016010884 W KR2016010884 W KR 2016010884W WO 2017095005 A1 WO2017095005 A1 WO 2017095005A1
Authority
WO
WIPO (PCT)
Prior art keywords
adhesive
organic electronic
electronic device
resin
weight
Prior art date
Application number
PCT/KR2016/010884
Other languages
English (en)
Korean (ko)
Inventor
김준호
이휘용
구본수
박정민
박순천
Original Assignee
주식회사 이녹스
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 이녹스 filed Critical 주식회사 이녹스
Priority to CN201680071100.0A priority Critical patent/CN108368398B/zh
Publication of WO2017095005A1 publication Critical patent/WO2017095005A1/fr

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers

Definitions

  • the present invention relates to an adhesive film for an organic electronic device and an encapsulant for an organic electronic device including the same, and more particularly, to remove and block a substance that is a defective source such as moisture and impurities to the organic electronic device, and to prevent moisture.
  • the present invention relates to an adhesive film for an organic electronic device having an excellent effect of moisture resistance and heat resistance, and an interlayer peeling phenomenon that may occur when removed, and an encapsulant for an organic electronic device including the same.
  • An organic light emitting diode is a light emitting diode in which a light emitting layer is formed of a thin organic compound.
  • the organic light emitting diode (OLED) uses an electroluminescence phenomenon that generates light by passing a current through a fluorescent organic compound.
  • Such organic light emitting diodes generally implement main colors in three colors (Red, Green, Blue) independent pixel method, bioconversion method (CCM), and Curly filter method, and the amount of organic materials included in the light emitting material used Therefore, it is divided into low molecular organic light emitting diode and high molecular organic light emitting diode.
  • the driving method may be classified into a passive driving method and an active driving method.
  • Such an organic light emitting diode has characteristics such as high efficiency, low voltage driving, and simple driving by self-emission, and has an advantage of expressing a high quality video.
  • applications for flexible displays and organic electronic devices using flexible properties of organic materials are also expected.
  • the organic light emitting diode is manufactured by stacking an organic compound, which is a light emitting layer, on a substrate in the form of a thin film.
  • organic compounds used in organic light emitting diodes are very sensitive to impurities, oxygen, and moisture, and thus have a problem in that their properties are easily deteriorated by external exposure or moisture and oxygen penetration. Such deterioration of organic matters affects the luminescence properties of the organic light emitting diode and shortens its lifespan.
  • a thin film encapsulation is required to prevent oxygen, moisture, and the like from flowing into the organic electronic device.
  • a metal can or glass is processed into a cap shape to have a groove, and a desiccant for moisture absorption is mounted in a powder form in the groove, and Korean Patent Publication No. 2006-0030718 is a bag that absorbs moisture in this manner.
  • the method is disclosed, such a method is to remove the encapsulated organic electronic device to the desired level, and to prevent access to substances that are defective sources such as moisture and impurities to the organic electronic device, and may occur when moisture is removed.
  • the interlayer peeling phenomenon does not occur and it is difficult to simultaneously have an excellent effect of moisture resistance and heat resistance.
  • the present invention has been made in order to solve the above problems, the problem to be solved of the present invention is to remove and block to prevent the access to the material, such as moisture, impurities, etc. to the organic electronic device, may occur when the water is removed It is to provide an excellent effect of moisture resistance and heat resistance at the same time does not occur interlayer peeling phenomenon.
  • the present invention includes a first adhesive layer including a moisture absorbent and a first adhesive resin and a second adhesive layer formed on one surface of the first adhesive layer, wherein the second adhesive layer includes an adhesive resin and a second adhesive resin.
  • the second adhesive resin comprises a polymer of a repeating unit represented by the following formula (1), wherein the polymer is a glycidyl group, an isocyanate group, a hydroxyl group at the end.
  • the present invention provides an adhesive film for an organic electronic device, comprising at least one functional group selected from among a carboxyl group, an alkenyl group, an alkynyl group, an epoxy group, and an acrylate group.
  • R 1 is C1 ⁇ C100 linear alkylene group or C3 ⁇ C300 Crushed alkylene group or C6 ⁇ C20 aromatic group
  • R 2 is or X and y are rational numbers satisfying x ⁇ 0, y> 0 or y ⁇ 0, x> 0, and x and y are or Is a rational number satisfying the weight average molecular weight of 300 ⁇ 100,000
  • R 3 and R 4 are each independently a hydrogen atom or or Is a substituent containing k and z are rational numbers satisfying 0 ⁇ k and 0 ⁇ z, and k and z are or Is the ratio of the weight average molecular weight of 0 to 30,000, n is the ratio of the compound to satisfy the weight average molecular weight of 500 to 300,000 of the compound.
  • the adhesive resin includes at least one selected from hydrogenated petroleum resin, hydrogenated rosin resin, hydrogenated rosin ester resin, hydrogenated terpene resin, hydrogenated terpene phenol resin, polymerized rosin resin and polymerized rosin ester resin. can do.
  • the mixed resin may include a second adhesive resin and an adhesive resin in a weight ratio of 1: 1 to 3.
  • the moisture absorbent of the first adhesive layer may include at least one selected from hollow silica and calcium oxide, and the moisture absorbent of the second adhesive layer may include calcium oxide.
  • the first adhesive layer may include a moisture absorbent of 5 to 50 parts by weight based on 100 parts by weight of the first adhesive resin
  • the second adhesive layer is based on 100 parts by weight of the mixed resin
  • the moisture absorbent may include 40 to 150 parts by weight.
  • the first adhesive layer may further include 0.5 to 5 parts by weight of carbon black having an average particle diameter of 1 to 500 nm based on 100 parts by weight of the first adhesive resin.
  • the first adhesive resin may include at least one selected from a silicone modified liquid epoxy compound, a DCPD-type solid epoxy compound, and a phenoxy compound.
  • the second adhesive layer may further comprise 0.1 to 5 parts by weight of UV initiator based on 100 parts by weight of the mixed resin.
  • the UV initiator is a mono acyl phosphine (Mono Acyl Phosphine), Bis Acyl Phosphine (Bis Acyl Phosphine), ⁇ -Hydroxyketone ( ⁇ -Hydroxyketone), ⁇ -amino It may include one or more selected from ketone ( ⁇ -Aminoketone), phenylglyoxylate (Bhenylglyoxylate) and benzyldimethyl-ketal (Benzyldimethyl-ketal).
  • the thickness of the first adhesive layer or the second adhesive layer is at least twice the average particle diameter of the moisture absorbent included in each layer, the thickness ratio of the first adhesive layer and the second adhesive layer is 1 : May be 0.5 to 2.
  • Another object of the present invention to provide an encapsulant for an organic electronic device comprising the adhesive film for an organic electronic device of any one of the above-described adhesive film for an organic electronic device.
  • Still another object of the present invention is to provide a light emitting device including a substrate, an organic electronic device formed on at least one surface of the substrate, and an organic electronic device encapsulation material of any one of the above-described organic electronic device encapsulation materials for packaging the organic electronic device. Provide the device.
  • hygroscopic agent used in the present invention may adsorb moisture by physical or chemical bonding such as the interface of the moisture absorber and van der Waals force, and the moisture adsorption substance and chemical reaction in which the components of the substance do not change due to the adsorption of moisture. It includes all of the water-absorbing materials that absorb moisture through and change into new materials.
  • the adhesive film for organic electronic devices of the present invention can effectively prevent moisture from reaching the organic electronic device by blocking oxygen, impurities, and moisture and effectively removing moisture that is permeated, thereby significantly reducing the life and durability of the organic electronic device. Can be improved.
  • the interlayer peeling phenomenon which may occur when water is removed, does not occur and at the same time has excellent effects of moisture resistance and heat resistance.
  • FIG. 1 is a cross-sectional view of an adhesive film for an organic electronic device according to an embodiment of the present invention.
  • Figure 2 is a TEM picture of the hollow silica contained in the pressure-sensitive adhesive film according to an embodiment of the present invention.
  • Figure 3 is a schematic cross-sectional view of the hollow silica contained in the first adhesive layer of the adhesive film according to an embodiment of the present invention.
  • FIG. 4 is a schematic cross-sectional view of a light emitting device according to an embodiment of the present invention.
  • glass substrates which have recently been used to encapsulate organic electronic devices, have tended to be replaced with substrates of metal materials due to their low strength. There is a problem that the organic electronic device is blocked from access to the defective materials such as moisture and impurities, and does not have an interlayer peeling phenomenon that may occur when water is removed, and it is difficult to simultaneously have an excellent effect of moisture resistance and heat resistance.
  • the present invention includes a first adhesive layer including a moisture absorbent and a first adhesive resin, and a second adhesive layer formed on one surface of the first adhesive layer, wherein the second adhesive layer includes a mixed resin and a moisture absorbent including an adhesive resin and a second adhesive resin.
  • the second adhesive resin includes a polymer of a repeating unit represented by Formula 1 below, and the polymer has a glycidyl group, an isocyanate group, a hydroxyl group, a carboxyl group, and an alkenyl at the terminal.
  • an adhesive film for an organic electronic device is provided, wherein the adhesive film comprises at least one functional group selected from an (alkenyl) group, an alkynyl group, an epoxy group, and an acrylate group.
  • R 1 may be C1 to C100 linear alkylene group or C3 to C300 crushed alkylene group or C6 to C20 aromatic group, preferably R 1 is C2 to C50 linear alkylene group Or a C3 to C150 crushed alkylene group or a C6 to C10 aromatic group.
  • R 2 is or X and y are rational numbers satisfying x ⁇ 0, y> 0 or y ⁇ 0, x> 0,
  • x and y are or It may be a rational number satisfying the weight average molecular weight of 300 to 100,000, preferably a rational number to satisfy the 500 to 50,000.
  • R 3 and R 4 are each independently a hydrogen atom or or Is a substituent containing k and z are rational numbers satisfying 0 ⁇ k and 0 ⁇ z, and k and z are or
  • the weight average molecular weight of may be a rational number satisfying 0 to 30,000, preferably may be a rational number satisfying 5,000 to 20,000.
  • n may be a rational number satisfying the weight average molecular weight of the compound of 500 to 300,000, preferably may be a rational number to satisfy 2,000 to 200,000.
  • Figure 1 is a cross-sectional view of an adhesive film for an organic electronic device according to an embodiment of the present invention
  • the adhesive film 10 for an organic electronic device is on the first adhesive layer 11 and one surface of the first adhesive layer (11).
  • a base film 13 or 14 such as a release film for supporting and protecting the first adhesive layer 11 and the second adhesive layer 12, wherein the second adhesive layer 12 is formed. It may be further included in the lower portion or the upper portion of the second adhesive layer 12.
  • the first adhesive layer 11 is a layer in direct contact with an organic electronic device (not shown), and includes a moisture absorbent 11a and a first adhesive resin 11b
  • the second adhesive layer 12 includes a moisture absorbent 12a
  • the adhesive resin and the second adhesive resin 12b are included.
  • the first adhesive layer 11 including the moisture absorbent 11a and the first adhesive resin 11b will be described as a layer in direct contact with the organic light emitting device.
  • the moisture absorbent 11a of the first adhesive layer 11 included in the adhesive film according to the present invention may include at least one selected from hollow silica and calcium oxide, preferably hollow silica may be used alone. have. Meanwhile, when the hollow silica and calcium oxide are mixed and used as the hygroscopic agent, the hollow silica may include 50 wt% or more, preferably 80 wt% or more, and more preferably 95 wt% or more. . If the moisture absorbent contains less than 50% by weight of hollow silica, the desired moisture removal performance may not be achieved, or even if the moisture removal performance is achieved, due to volume expansion, heat generation, and by-products of the moisture absorbent generated by moisture removal. Separation, thin film, crack, etc. of the organic electronic device and the encapsulant may occur, and there is a problem that the durability of the organic electronic device may be significantly reduced due to physical / chemical damage of the organic electronic device.
  • the moisture absorbent (11a) comprising a hollow silica included in the first adhesive layer may be included in 5 to 50 parts by weight with respect to the first adhesive resin, preferably 10 ⁇ 45 parts by weight may be included. If the moisture absorbent 11a is included in less than 5 parts by weight, there is a problem in that durability of the organic electronic device may be lowered because the moisture removal effect of the first adhesive layer may not be achieved, and if the moisture absorbent exceeds 50 parts by weight, If included, there may be a problem that the reliability of the organic electronic device is lowered due to poor adhesion, such as adhesion between the adhesive film and the organic electronic device, adhesion due to lack of wettability.
  • Hollow silica has no problem such as heat generation or gas generation due to the adsorption of moisture as moisture is absorbed through the hollow part so that the volume of hollow silica is expanded even if moisture is adsorbed. Since a problem does not occur and a large amount is included in a layer in direct contact with the organic electronic device, physical and chemical damage that may be applied to the organic electronic device may be prevented.
  • Figure 2 is a TEM picture of the hollow silica contained in the first adhesive layer of the adhesive film according to an embodiment of the present invention
  • Figure 3 is a schematic cross-sectional view of the hollow silica according to Figure 2
  • hollow silica ( 11a) may include a shell portion 11a 'and a hollow portion 11a ′′ that is hollow in a hollow state within the shell portion 11a'.
  • the average particle diameter of the hollow silica 11a may be 10 to 800 nm, and more preferably 50 to 500 nm.
  • the particle diameter means the diameter when the shape of the hollow silica is spherical, and the maximum distance of the straight line from any one point to the other point of the hollow silica surface when the shape of the hollow silica is not spherical. If the diameter is less than 10 nm, as the capacity to support water decreases, the water adsorption performance may decrease, and thus, a problem may arise in that the content of the moisture absorbent needs to be increased to remove the desired water. If it exceeds 800 nm, there is a problem that a direct physical damage occurs to the organic electronic device due to the absorbent, resulting in a dark spot.
  • the hollow portion 11a ′′ included in the hollow silica 11 a is a space in which moisture adsorbed and moved through the shell portion 11 a ′ is supported.
  • the hollow diameter may be 3 to 790 nm. Preferably 40 to 490 nm. If the hollow diameter is less than 3 nm, there is a problem that the amount of water to be supported decreases, so that the water removal effect is lowered. If the hollow diameter exceeds 790 nm, the particle size of the hollow silica exceeds the desired range. As the thickness of the shell portion 11a 'is increased or the thickness of the shell portion 11a' is reduced, there is a problem that the hollow silica does not have a moisture absorption function.
  • the hollow silica 11a may have a spherical shape.
  • the hollow silica 11a included in the first adhesive layer 11 according to the present invention should be evenly dispersed in the first adhesive resin, which will be described later.
  • the hollow silica 11a has a spherical shape than that of a needle or a polyhedron. When the dispersibility is better it can implement an adhesive film for organic electronic devices expressing the desired physical properties.
  • the first adhesive resin (11b) can be used without limitation in the case of the adhesive resin used in the packaging of the conventional organic electronic device, it is easy to adhere to the organic electronic device, excellent adhesion and does not peel off after adhesion, organic electronic It can be preferably used in the case of the adhesive resin which has no problem in compatibility with the hollow silica without physically and chemically affecting the apparatus.
  • the epoxy component may vary in kind and blending ratio included depending on the purpose, and is not particularly limited in the present invention.
  • the epoxy component is a silicone-modified liquid epoxy compound, DCPD type, in order to achieve the desired physical properties by expressing excellent heat resistance, chemical resistance and hygroscopicity of the cured product and at the same time, excellent adhesion to an excellent organic electronic device.
  • One or more types selected from solid epoxy compounds and phenoxy compounds may be used.
  • the total chlorine content may be a total chlorine content of 500 ppm or less in each of the adhesive components, and more preferably, a total chlorine content of the total adhesive components may be 500 ppm or less.
  • the first adhesive resin 11b included in the first adhesive layer 11 according to the present invention may further include a film forming component.
  • the film forming component is a component that improves the film formability, and exhibits mechanical properties that are not easily torn, broken, or stuck together when formed into a film. When handling as a film is easy in normal conditions (for example, room temperature), it can be said that film formation property is favorable, and the film formation component which can play such a role can be used without limitation.
  • the film forming component include, but are not limited to, polyester component, polyether component, polyamide component, polyamideimide component, polyimide component, polyvinyl butyral component, polyvinyl formal component, phenoxy component, A polyhydroxy polyether component, an acrylic component, a polystyrene component, a butadiene component, an acrylonitrile butadiene copolymer, an acrylonitrile butadiene styrene component, a styrene butadiene copolymer, and an acryl-type component can be used, or it can mix and use.
  • the film forming component may be a polymer polymer having an epoxy group, may be a polymer polymer having an epoxy group at the terminal and / or side chain (pendant position), non-limiting example, epoxy group-containing acrylic rubber, epoxy group-containing butadiene Single or 2 types or more of rubber
  • a phenoxy component having a small amount of damaging ionic impurities such as corroding the organic electronic device, high heat resistance, and ensuring the reliability of the organic electronic device is preferable.
  • the film forming component may be included in an amount of 80 to 350 parts by weight based on 100 parts by weight of the above-mentioned curable adhesive component, preferably 100 to 300 parts by weight. If included in less than 80 parts by weight, there is a problem that the film formability is lowered, and when included in excess of 350 parts by weight, there is a problem that the fluidity is lowered and the adhesion to the organic electronic device is lowered.
  • the first adhesive layer may further include a curing agent, a curing accelerator, and the like for curing the first adhesive resin 11b described above.
  • the curing agent may include 0.3 to 25 parts by weight based on 100 parts by weight of the first adhesive resin
  • the curing accelerator may include 0.5 to 25 parts by weight based on 100 parts by weight of the first adhesive resin. It may include 0.5 to 20 parts by weight based on 100 parts by weight of one adhesive resin, the curing accelerator may be included in 1 to 20 parts by weight based on 100 parts by weight of the first adhesive resin.
  • the content of the curing agent or curing accelerator may be changed depending on the type and ratio of the functional group of the curable adhesive resin, or the crosslinking density to be implemented.
  • the curing agent may be selected and used according to the type of the functional group contained in the above-mentioned curable adhesive resin, it can be used in the art known curing agents.
  • a curing agent that can be used therein includes, but is not limited to, aliphatic amines such as diethylenetriamine and triethylenetetramine, metaphenylenediamine, diaminodiphenylmethane, Aromatic amines such as diaminodiphenyl sulfone and azomethylphenol, polyhydric hydroxy compounds such as phenol novolak resin, orthocresol novolak resin, naphthol novolak resin and phenol aralkyl resin, and modified substances thereof, phthalic anhydride, Acidic anhydride curing agents such as maleic anhydride, hexahydrophthalic anhydride, pyromellitic anhydride, latent curing agents such as dicyandiamide, imidazole, BF3-amine
  • the curing accelerator serves to adjust the curing rate, the properties of the cured product, etc.
  • the curing accelerator used in the film for the packaging of the conventional organic electronic device as the curing accelerator can be used without limitation, non-limiting examples As an imidazole series hardening accelerator, a tertiary amine type hardening accelerator, etc. are mentioned, Especially, an imidazole series hardening accelerator is preferable from the point which is easy to control the reaction system for adjusting the physical property of a hardening rate, hardened
  • imidazole series hardening accelerator For example, 1-cyanoethyl- 2-phenylimidazole which protected the 1 position of imidazole by the cyano ethyl group, or isocyanuric acid, The protected brand name "2MA-0K” (made by Shikoku Chemical Co., Ltd.) etc. is mentioned.
  • These imidazole series hardening accelerators can be used individually or in combination of 2 or more types.
  • curing agent and hardening accelerators such as an imidazole series hardening accelerator
  • curing agent and hardening accelerators such as imidazole series hardening accelerators together, for example, it is preferable to make the addition amount of an amine hardening
  • the thickness of the first adhesive layer may be twice the thickness of the average particle diameter of the absorbent (11a) containing the hollow silica. If the thickness is less than twice the average particle size of the moisture absorbent, the moisture absorbent protrudes on the surface of the first adhesive layer to reduce the adhesive force with the second adhesive layer to be described later formed on the first adhesive layer, or the first adhesive layer is in direct contact with the substrate. It is not preferable because the adhesive force of the adhesive can be lowered and the possibility of physically damaging the organic electronic device increases.
  • the first adhesive layer may further include 0.5 to 5 parts by weight of carbon black having an average particle diameter of 1 to 500nm with respect to 100 parts by weight of the first adhesive resin, preferably Preferably it may further include 1 to 4 parts by weight of carbon black of 1 to 500nm.
  • the carbon black has a function of improving heat resistance and curing density, but if the carbon black is included in less than 0.5 parts by weight, problems of poor heat resistance and curing density may occur. If the carbon black is included in an amount exceeding 5 parts by weight, the curing density is excessive. This can cause problems.
  • the mixed resin included in the second adhesive layer 12 of the present invention may include the second adhesive resin 12b and the adhesive resin in a weight ratio of 1: 1 to 3, and preferably 1: 1 to 2.5. It may be included in the weight ratio. If the second adhesive resin and the adhesive resin is included in less than the weight ratio of 1: 1 may cause a problem of poor moisture resistance, and if included in excess of the weight ratio of 1: 3 to reduce the elasticity of the adhesive layer (Brittle) The durability and moisture resistance may be reduced.
  • the adhesive resin may be used without limitation as long as the adhesive resin is usually used in the adhesive film for organic electronic devices, preferably hydrogenated petroleum resin, hydrogenated rosin resin, hydrogenated rosin ester resin, hydrogenated terpene resin, hydrogenated terpene phenol resin, polymerization
  • One or more types selected from rosin resins and polymerized rosin ester resins can be used.
  • the hydrogenated petroleum resin may be a hydrogenated petroleum resin of C6 ⁇ C20, preferably a hydrogenated petroleum resin of C6 ⁇ C10.
  • the hydrogenated petroleum resin may have a softening point of 80 to 150 ° C, preferably 85 to 145 ° C.
  • the moisture absorbent 12a may be a moisture absorbent included in an encapsulant used in the packaging of a conventional organic electronic device.
  • the moisture absorbent 12a includes a silica, zeolite, titania, zirconia, montmorillonite, and the like including hollow silica.
  • Metal salts, metal oxides, and the like may be used alone or in combination of two or more thereof. More preferably, metal oxides may be used, and more preferably calcium oxide in the metal oxides may be used.
  • the metal oxide may be a metal oxide such as lithium oxide (Li 2 O), sodium oxide (Na 2 O), barium oxide (BaO), calcium oxide (CaO), or magnesium oxide (MgO), or an organic metal oxide or phosphorus pentoxide ( P 2 O 5 ) and the like may be used alone or in combination of two or more thereof.
  • a metal oxide such as lithium oxide (Li 2 O), sodium oxide (Na 2 O), barium oxide (BaO), calcium oxide (CaO), or magnesium oxide (MgO), or an organic metal oxide or phosphorus pentoxide ( P 2 O 5 ) and the like may be used alone or in combination of two or more thereof.
  • the metal salt is lithium sulfate (Li 2 SO 4 ), sodium sulfate (Na 2 SO 4 ), calcium sulfate (CaSO 4 ), magnesium sulfate (MgSO 4 ), cobalt sulfate (CoSO 4 ), gallium sulfate (Ga 2 (SO 4 ) 3 ), sulfates such as titanium sulfate (Ti (SO 4 ) 2 ) or nickel sulfate (NiSO 4 ), calcium chloride (CaCl 2 ), magnesium chloride (MgCl 2 ), strontium chloride (SrCl 2 ), yttrium chloride (YCl) 3 ), copper chloride (CuCl 2 ), cesium fluoride (CsF), tantalum fluoride (TaF 5 ), niobium fluoride (NbF 5 ), lithium bromide (LiBr), calcium bromide (CaBr 2 ), cesium bromine (
  • the moisture absorbent 12a has a purity of 95% or more. If the purity is less than 95%, the moisture absorption function is lowered, and a material included in the moisture absorbent may act as an impurity to cause a defect of the adhesive film. Since it may affect electronic devices, it is preferable to use an absorbent having a purity of 95% or more.
  • the moisture absorbent included in the second adhesive layer as described above may be included in an amount of 40 to 150 parts by weight with respect to 100 parts by weight of the mixed resin, and preferably 50 to 140 parts by weight, if the moisture absorbent is included in 100 parts by weight of the mixed resin. If less than 40 parts by weight, there may be a problem that can not implement the desired adhesive film, such as the water removal effect is significantly reduced, and if the moisture absorbent is included in excess of 150 parts by weight, the adhesive performance of the second adhesive layer is significantly reduced.
  • the adhesive layer including the first adhesive layer, the second adhesive layer, and / or the second adhesive layer and the first adhesive layer enters the organic electronic device, and moisture rapidly penetrates therebetween, thereby extending the life of the organic electronic device. There may be a problem of shortening.
  • the shape and particle size of the moisture absorbent 12a included in the second adhesive layer 12 according to the present invention is not limited, but preferably in order to improve dispersibility in the second adhesive layer, the average particle diameter of 5 nm ⁇ 8 ⁇ m It may be spherical, and preferably may be spherical with an average particle diameter of 10 nm to 6 ⁇ m. This is desirable to thin the adhesive film while having a desired water removal function.
  • the moisture absorbent 12a included in the second adhesive layer may be the same as or different from the moisture absorbent included in the first adhesive layer.
  • the second adhesive resin 12b includes a polymer of a repeating unit represented by Chemical Formula 1.
  • the second adhesive resin 12b may have a weight average molecular weight of 500 to 300,000, a viscosity of 1 ⁇ 10 to 1 ⁇ 10 12 Pa ⁇ s (25 ° C.), Preferably, the weight average molecular weight is 2,000 to 200,000, and the viscosity may be 5 ⁇ 10 to 5 ⁇ 10 11 Pa ⁇ s (25 ° C.). If the weight average molecular weight of the second adhesive resin 12b is less than 500, a problem may occur in that the film formability is lowered. If the weight average molecular weight is more than 300,000, the fluidity is lowered and the adhesion with the organic electronic device is lowered. Can cause problems.
  • the processability may not be good due to an increase in the tack, which may cause a problem that the release film cannot be peeled off, and the viscosity is 1 ⁇ 10 12 Pa ⁇ s when exceeding (25 °C), may cause a problem that the adhesive strength of the substrate decreases as the tack (tack) decreases.
  • the second adhesive layer 12 may further include 0.1 to 5 parts by weight of a UV initiator with respect to 100 parts by weight of the mixed resin, preferably 100 parts by weight of the mixed resin.
  • the UV initiator may further comprise 0.5 to 3 parts by weight. If the UV initiator is included in an amount of less than 0.1 part by weight with respect to 100 parts by weight of the mixed resin, a problem may occur that the heat resistance due to UV curing is poor, and when the UV initiator is included in an amount exceeding 5 parts by weight, the heat resistance may be reduced due to the decrease in the curing density. This bad problem can occur.
  • the UV initiator may be used without limitation as long as it is typically used as a UV initiator, mono acyl phosphine, bis acyl phosphine, ⁇ -hydroxy ketone, ⁇ -Hydroxyketone, ⁇ One or more selected from -amino ketone ( ⁇ -Aminoketone), phenylglyoxylate and benzyldimethyl-ketal can be used.
  • the thickness of the second adhesive layer may be more than twice the average particle diameter of the moisture absorbent (12a). If the thickness of the second adhesive layer is less than twice the average particle size of the moisture absorbent, the moisture absorbent included in the second adhesive layer protrudes from the surface of the second adhesive layer 12 to lower the adhesive strength with the first adhesive layer 11 to the interface between the adhesive layers. Peeling may occur, and the penetration of moisture may be accelerated between the peelings, thereby significantly lowering the durability of the organic electronic device, and the moisture absorbent 12a itself may physically invade the first adhesive layer 11 to damage the organic electronic device. It can be undesirable.
  • the thickness ratio of the first adhesive layer 11 and the second adhesive layer 12 may be 1: 0.5 to 2, preferably 1: 0.6 to 1.8. If the thickness ratio of the first adhesive layer 11 and the second adhesive layer 12 is less than 1: 0.5, there may be a problem that the moisture resistance (reliability) is lowered, and that the first adhesive layer 11 and the second adhesive layer 12 When the thickness ratio exceeds 1: 2, problems of poor adhesion may occur.
  • the present invention includes an encapsulant for an organic electronic device including an adhesive film for an organic electronic device, and includes a light emitting device including the encapsulant for an organic electronic device.
  • the light emitting device includes a substrate, an organic electronic device formed on at least one surface of the substrate, and an encapsulant for an organic electronic device according to the present invention for packaging the organic electronic device.
  • the organic electronic device 102 is formed on at least one surface of the substrate 101, and the encapsulants 111 and 112 for the organic electronic device are formed on the substrate 101 and the organic electronic device 102.
  • the organic electronic device encapsulant includes: a first adhesive layer 111 including a hygroscopic agent 111a including hollow silica and a first adhesive resin 111b; And a second adhesive layer 112 including a mixed resin including an adhesive resin and a second adhesive resin 112b and a moisture absorbent 112a.
  • the substrate 101 may be preferably any one of a glass substrate, a quartz substrate, a sapphire substrate, a plastic substrate, and a flexible polymer film that can be bent.
  • the organic electronic device encapsulation material (111, 112) according to the present invention for packaging the organic electronic device 102 the specific method of the packaging may be by a known conventional method,
  • the first adhesive layer 111 of the encapsulants 111 and 112 for organic electronic devices is formed directly on the organic electronic device 102 in the organic electronic device 102 formed on the substrate 101. It may be performed by applying heat and / or pressure using a vacuum press or a vacuum laminator or the like in contact. In addition, heat may be applied to cure the adhesive layer, and in the case of an adhesive including a photocurable adhesive component, the adhesive may be moved to a chamber to which light is irradiated, thereby further hardening the curing process.
  • XFR-8628 50% by weight of high purity (500 ppm or less of total chlorine content) silicone-modified liquid epoxy (XFR-8628) and 50% by weight of DCPD-type solid epoxy (HP-7200L, DIC) substituted with a silicon intermediate containing a phenyl group to form the first adhesive layer.
  • 100 parts by weight of phenoxy resin (PKHH, Inchem) was added to 100 parts by weight of the epoxy resin containing to prepare a first adhesive resin.
  • 150 parts by weight of methyl ethyl ketone was included as a solvent based on 100 parts by weight of the first adhesive resin, followed by stirring at room temperature for 2 hours.
  • the viscosity was adjusted to 400 cps at 20 ° C.
  • the filter was passed through the capsule filter to remove foreign substances, and then applied to a 75 ⁇ m thick antistatic release PET (RT81AS, SKCHass) using a slot die coater, followed by 120 ° C. After drying to remove the solvent to prepare a first adhesive layer having a final thickness of 28 ⁇ m.
  • a polymer having a weight average molecular weight of 40,000 and a viscosity of 10 3 Pa.s (25 ° C.) is added to prepare a second adhesive resin, and then the second adhesive resin is prepared.
  • Adhesive resin and hydrogenated petroleum resin (SUKOREZ, Kolon Industries) was mixed to 1: 1.5 parts by weight to prepare a mixed resin.
  • toluene 150 parts by weight was included as a solvent based on 100 parts by weight of the mixed resin, followed by stirring at room temperature for 2 hours.
  • a UV initiator irgacure TPO, Ciba
  • the viscosity was adjusted to 800 cps at 20 ° C.
  • the filter was passed through the capsule filter to remove foreign substances, and then applied to the light release mold PET (RF02, SKCHass) having a thickness of 38 ⁇ m using a slot die coater, followed by drying at 120 ° C. After removing the solvent to prepare a second adhesive layer having a final thickness of 21 ⁇ m.
  • An adhesive film was prepared by laminating a second adhesive layer to face the first adhesive layer prepared above, and passing the 70 ° C. laminating rolls. After the lamination was completed, using an ultraviolet curing device equipped with a medium-pressure metal lamp UV cured at a speed of 8m / min at a light amount of 600 mJ / cm2 to prepare an adhesive film as shown in Table 1.
  • Example 3 Manufactured in the same manner as in Example 1, except for the composition of the encapsulant for the organic electronic device or the type of the moisture absorbent contained in the first adhesive layer and / or the second adhesive layer as shown in Table 3, the adhesive film as shown in Table 3 below was prepared.
  • the specimen was cut to a size of 50 mm x 80 mm, the protective film was removed, and then attached to a 60 mm x 150 mm 0.08T Ni alloy using a roll laminator under conditions of 80, Gap 1 mm, and Speed 1.
  • After removing the liner film of the attached specimen attach it to a 30mm ⁇ 70mm 5T alkali-free glass using a roll laminator at 80 ° C, Gap 1mm, and Speed 1 and then cure at 100 ° C in a heating oven for 3 hours.
  • (circle) it showed with x when it flowed even a little.
  • An organic light emitting device (hole transport layer NPD / thickness 800 ⁇ , light emitting layer Alq3 / thickness 300 ⁇ , electron injection layer LiF / thickness 10 ⁇ , cathode Al + Liq / thickness 1,000 ⁇ ) was deposited on the substrate with ITO pattern, and then deposited on the fabricated device. After laminating the adhesive films according to Examples and Comparative Examples at room temperature, the OLED unit specimens were fabricated by covering the top glass and curing at 100 ° C. for 3 hours in a heating oven. After the evaluation of the physical properties of the specimens are shown in Table 5.
  • Specimens were observed for 1,000 hours at 100-hour intervals in a reliability chamber set at 85 ° C and 85% relative humidity, and then subjected to optical microscopy for interfacial separation between organic electronic devices and adhesive films, foaming in cracks or adhesive films, and separation between adhesive layers. Observed through to evaluate the physical damage. In the case where there was no abnormality as a result of the evaluation, any abnormality among the ⁇ , interfacial separation, crack or bubble generation in the adhesive film, separation between the adhesive layers, and the like was indicated by ⁇ .
  • Example 1 having a hollow silica content of 100% by weight of the moisture absorbent included in the first adhesive layer is more efficient than water removal and blocking as compared with Example 2 having a hollow silica content of 45% by weight and less than 50% by weight.
  • Example 2 having a hollow silica content of 45% by weight and less than 50% by weight As a result, the moisture penetration length was short, the volume expansion of the adhesive film was little, the durability evaluation result of the organic light emitting device was good, and the adhesive film was excellent in durability.
  • Example 1 containing 25 parts by weight of the moisture absorbent with respect to 100 parts by weight of the first adhesive resin, compared with Example 3 containing 3 parts by weight of the moisture absorbent, the moisture removal and blocking is more efficient, the moisture penetration length was short, There was little volume expansion of the film, the durability evaluation result of the organic light emitting device was good and the durability of the adhesive film was excellent.
  • Example 4 compared to Example 4 containing 55 parts by weight of the moisture absorbent, water removal and blocking are more efficient, so that the moisture penetration length is shorter, there is little volume expansion of the adhesive film, and the durability evaluation result of the organic light emitting device is good. The durability of the film was excellent.
  • Example 1 containing 1.1 parts by weight of carbon black with respect to 100 parts by weight of the first adhesive resin, compared with Example 5 containing 6 parts by weight, water removal and blocking was more efficient, the moisture penetration length was shorter, The durability evaluation result of the light emitting device was good, and the durability of the adhesive film was excellent.
  • Example 6 Compared with Example 6 using calcium oxide as the moisture absorbent of the second adhesive layer, compared with Example 6 using hollow silica as the moisture absorbent, moisture removal and blocking were more efficient, and the moisture penetration length was shorter, and the durability evaluation of the organic light emitting device was evaluated. The result was good and the durability of the adhesive film was excellent.
  • Example 7 Compared to Example 7 in which 55 parts by weight of calcium oxide was used with respect to 100 parts by weight of the mixed resin as the moisture absorbent of the second adhesive layer, moisture removal and blocking were more efficient than in Example 7, which contained 35 parts by weight of calcium oxide. was short, the durability evaluation result of the organic light emitting device was good, and the durability of the adhesive film was excellent.
  • Example 8 compared with Example 8 using 155 parts by weight of calcium oxide, there was little volume expansion of the adhesive film, the durability evaluation result of the organic light emitting device was good, and the durability of the adhesive film was excellent.
  • Example 1 using acrylate as a functional group of the polymer contained in the second adhesive resin was more efficient in removing and blocking moisture than Example 9 using a carboxyl group as a functional group, and thus the moisture permeation length was shorter, and the heat resistance and organic luminescence were reduced.
  • the durability evaluation result of the element was good.
  • Example 10 compared to Example 10 using a polymer having a weight average molecular weight of 40,000 as the second adhesive resin, compared to Example 10 using a polymer having a weight average molecular weight of 454, moisture removal and blocking were more efficient, resulting in a shorter moisture penetration length. There was little volume expansion of the film, the heat resistance and the durability of the organic light emitting device was excellent, the durability of the adhesive film was excellent. In addition, compared to Example 11 using a polymer having a weight average molecular weight of 310,000, water removal and blocking were more efficient, resulting in a shorter water penetration length, almost no volume expansion of the adhesive film, and good durability evaluation results of the organic light emitting device. The durability of the film was excellent.
  • Example 1 containing 1 part by weight of the UV initiator of the second adhesive layer with respect to 100 parts by weight of the mixed resin compared with Example 12 containing 0.05 parts by weight, water removal and blocking is more efficient, the moisture penetration length was shorter, Almost no volume expansion of the adhesive film, excellent heat resistance and durability of the organic light-emitting device, excellent durability of the adhesive film, compared to Example 13 containing 8 parts by weight of water removal and blocking more efficient moisture penetration length was short, there was little volume expansion of the adhesive film, the heat resistance and the durability of the organic light emitting device was excellent, the durability of the adhesive film was excellent.
  • Example 14 compared to Example 14 in which the weight ratio of the second adhesive resin and the adhesive resin of the second adhesive layer was 1: 1.5, the moisture removal and blocking was more efficient than in Example 14, where the weight ratio was 1: 0.5, and the moisture penetration length was short.
  • the durability evaluation result of the organic light emitting device was good, the durability of the adhesive film was excellent, and moisture removal and blocking was more efficient as compared to Example 15 having a weight ratio of 1: 3.5, so that the moisture penetration length was short. It was short, there was little volume expansion of the adhesive film, the durability evaluation result of the organic light emitting device was good and the durability of the adhesive film was excellent.
  • Example 1 including the first adhesive layer and the second adhesive layer the moisture removal and blocking is more efficient than the comparative example 1 including only the first adhesive layer, the moisture penetration length was much shorter, the durability evaluation results of the organic light emitting device was good and the durability of the adhesive film was excellent.
  • Example 1 including the functional group in the second adhesive resin compared with Comparative Example 2 without the functional group, the moisture removal and blocking is more efficient, the moisture penetration length was short, there was little volume expansion of the adhesive film , Heat resistance and durability of the organic light emitting device were good and the adhesive film was excellent in durability.
  • adhesive film 11 the first adhesive layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

La présente invention concerne un film adhésif pour dispositif électronique organique et un matériau d'encapsulation d'un dispositif électronique organique le comprenant et, plus précisément : un film adhésif pour dispositif électronique organique présentant des effets d'élimination et de blocage des matériaux provoquant des défauts tels que l'eau et les impuretés, de sorte que les matériaux ne peuvent pas approcher un dispositif électronique organique, empêchant un phénomène de décollement des couches intermédiaires, qui peut se produire lorsque de l'eau est éliminée, et, simultanément, présentant une excellente résistance à l'humidité et à la chaleur ; un matériau d'encapsulation d'un dispositif électronique organique.
PCT/KR2016/010884 2015-12-04 2016-09-29 Film adhésif pour dispositif électronique organique et matériau organique d'encapsulation d'un dispositif électronique organique le comprenant WO2017095005A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201680071100.0A CN108368398B (zh) 2015-12-04 2016-09-29 有机电子器件用黏合膜及包括其的有机电子器件用封装材料

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2015-0172700 2015-12-04
KR1020150172700A KR101665593B1 (ko) 2015-12-04 2015-12-04 유기전자장치용 접착필름 및 이를 포함하는 유기전자장치용 봉지재

Publications (1)

Publication Number Publication Date
WO2017095005A1 true WO2017095005A1 (fr) 2017-06-08

Family

ID=57157101

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2016/010884 WO2017095005A1 (fr) 2015-12-04 2016-09-29 Film adhésif pour dispositif électronique organique et matériau organique d'encapsulation d'un dispositif électronique organique le comprenant

Country Status (3)

Country Link
KR (1) KR101665593B1 (fr)
CN (1) CN108368398B (fr)
WO (1) WO2017095005A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111129336A (zh) * 2018-10-30 2020-05-08 利诺士尖端材料有限公司 有机电子装置用密封材料

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102602159B1 (ko) * 2016-11-22 2023-11-14 (주)이녹스첨단소재 유기전자장치용 접착필름 및 이를 포함하는 유기전자장치용 봉지재
KR102041934B1 (ko) * 2018-05-23 2019-11-07 신화인터텍 주식회사 접합 필름 및 이를 포함하는 유기전자장치
WO2019150433A1 (fr) * 2018-01-30 2019-08-08 日立化成株式会社 Composition de résine thermodurcissable, adhésif sous forme de film, feuille adhésive, et procédé de production de dispositif à semi-conducteur
CN109309172A (zh) * 2018-10-11 2019-02-05 信利半导体有限公司 柔性oled器件及其制造方法、显示装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11290444A (ja) * 1998-04-10 1999-10-26 Teijin Ltd ポリエーテルウレタン型医療用粘着剤
KR20070041896A (ko) * 2005-10-17 2007-04-20 재단법인서울대학교산학협력재단 핫멜트형 점착제 성분이 포함된 자외선 경화형 핫멜트점착제조성물 및 점착테이프
KR20150033582A (ko) * 2013-09-24 2015-04-01 주식회사 엘지화학 점착성 조성물
KR101561103B1 (ko) * 2014-12-17 2015-10-19 주식회사 이녹스 유기전자장치용 접착필름 및 이를 포함하는 유기전자장치용 봉지재
KR20150135478A (ko) * 2013-03-29 2015-12-02 후루카와 덴키 고교 가부시키가이샤 유기 전자 디바이스용 소자 밀봉용 수지 조성물, 유기 전자 디바이스용 소자 밀봉용 수지 시트, 유기 일렉트로루미네센스 소자, 및 화상 표시 장치

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7915319B2 (en) * 2005-12-19 2011-03-29 Henkel Corporation Visible light curing systems, methods for reducing health risks to individuals exposed to systems designed to cure curable compositions by exposure to radiation, methods for bonding substrates and visible light curing compositions
CN102842683A (zh) * 2011-06-21 2012-12-26 海洋王照明科技股份有限公司 有机电致发光器件及其制作方法
WO2014093014A1 (fr) * 2012-12-10 2014-06-19 3M Innovative Properties Company Compositions adhésives liquides utilisées dans des applications optiques
JP5778304B2 (ja) * 2014-02-28 2015-09-16 古河電気工業株式会社 電子デバイス封止用樹脂組成物および電子デバイス

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11290444A (ja) * 1998-04-10 1999-10-26 Teijin Ltd ポリエーテルウレタン型医療用粘着剤
KR20070041896A (ko) * 2005-10-17 2007-04-20 재단법인서울대학교산학협력재단 핫멜트형 점착제 성분이 포함된 자외선 경화형 핫멜트점착제조성물 및 점착테이프
KR20150135478A (ko) * 2013-03-29 2015-12-02 후루카와 덴키 고교 가부시키가이샤 유기 전자 디바이스용 소자 밀봉용 수지 조성물, 유기 전자 디바이스용 소자 밀봉용 수지 시트, 유기 일렉트로루미네센스 소자, 및 화상 표시 장치
KR20150033582A (ko) * 2013-09-24 2015-04-01 주식회사 엘지화학 점착성 조성물
KR101561103B1 (ko) * 2014-12-17 2015-10-19 주식회사 이녹스 유기전자장치용 접착필름 및 이를 포함하는 유기전자장치용 봉지재

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111129336A (zh) * 2018-10-30 2020-05-08 利诺士尖端材料有限公司 有机电子装置用密封材料
CN111129336B (zh) * 2018-10-30 2022-08-02 利诺士尖端材料有限公司 有机电子装置用密封材料

Also Published As

Publication number Publication date
CN108368398A (zh) 2018-08-03
CN108368398B (zh) 2021-05-25
KR101665593B1 (ko) 2016-10-14

Similar Documents

Publication Publication Date Title
WO2016003026A1 (fr) Film adhésif pour dispositif électronique organique et matériau d'étanchéité pour dispositif électronique organique le contenant
WO2017095005A1 (fr) Film adhésif pour dispositif électronique organique et matériau organique d'encapsulation d'un dispositif électronique organique le comprenant
WO2019009485A1 (fr) Film adhésif destiné à un dispositif électronique organique et matériau d'encapsulation destiné à un dispositif électronique organique comprenant ce dernier
WO2016126131A1 (fr) Film d'encapsulation
WO2015009129A1 (fr) Composition de scellement
WO2012060621A2 (fr) Film adhésif et procédé d'encapsulation d'un dispositif électronique organique l'utilisant
WO2015020408A1 (fr) Composition adhésive, film adhésif et procédé de fabrication d'un dispositif électronique organique l'utilisant
WO2013103282A1 (fr) Film d'encapsulation
WO2013073846A1 (fr) Film adhésif et procédé d'encapsulation d'un dispositif électronique organique au moyen d'un tel film
WO2014189291A1 (fr) Film d'encapsulation et procédé d'encapsulation d'un dispositif électronique organique au moyen dudit film
WO2018135866A1 (fr) Film de protection de fond de panneau à oled, et dispositif d'affichage électroluminescent organique le comprenant
WO2016133361A1 (fr) Film d'encapsulation
WO2016153296A1 (fr) Composition adhésive
WO2016153298A1 (fr) Composition adhésive
WO2016200180A1 (fr) Film adhésif, et dispositif électronique organique le comprenant
WO2016153297A1 (fr) Composition adhésive
WO2017179906A1 (fr) Pellicule d'encapsulation
WO2016153294A1 (fr) Composition adhésive
WO2011046238A1 (fr) Couche mince de fixation de puce
WO2018135864A1 (fr) Film de protection inférieur de panneau à delo et dispositif d'affichage électroluminescent organique comprenant un tel film de protection
WO2018056776A2 (fr) Composition adhésive
WO2016153292A1 (fr) Composition adhésive
WO2019124923A1 (fr) Dispositif électronique organique
WO2017078488A1 (fr) Composition adhésive optique et film adhésif optique
WO2019124934A1 (fr) Film d'encapsulation

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 16870901

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 16870901

Country of ref document: EP

Kind code of ref document: A1