WO2017086583A1 - Light sintering apparatus having inclined conveyor unit for removing smoke - Google Patents

Light sintering apparatus having inclined conveyor unit for removing smoke Download PDF

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Publication number
WO2017086583A1
WO2017086583A1 PCT/KR2016/009913 KR2016009913W WO2017086583A1 WO 2017086583 A1 WO2017086583 A1 WO 2017086583A1 KR 2016009913 W KR2016009913 W KR 2016009913W WO 2017086583 A1 WO2017086583 A1 WO 2017086583A1
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Prior art keywords
substrate
light
light output
output unit
transfer unit
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PCT/KR2016/009913
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French (fr)
Korean (ko)
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이순종
우봉주
정재훈
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(주)쎄미시스코
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Publication of WO2017086583A1 publication Critical patent/WO2017086583A1/en

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/435Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns

Definitions

  • the present invention relates to an optical sintering apparatus having an inclined transfer unit for removing smoke, and more particularly, combustion or chemical reaction of ink during printing of an electrically conductive ink printed on a substrate using light emitted from an optical output unit.
  • an optical sintering apparatus having an inclined conveying portion for preventing smoke.
  • Printing technology is a technology that uses ink to embed text or drawings drawn on a plate onto paper or cloth. Recently, various technologies such as inkjet printing, flexo printing, gravure printing, and screen printing have been used. . Since these technologies are applied to high value-added products such as RFID systems, large display devices, thin-film solar cells, thin-film batteries, and the like, the demand for the technology is gradually increasing.
  • the direct patterning technology through inkjet is a technique of forming a wiring by directly discharging a predetermined amount of ink to an accurate position through an inkjet head.
  • This technology has the advantage of shortening the manufacturing process and time as well as material costs.
  • conductive metal inks for direct patterning use nano inks using at least one of gold, silver or copper.
  • a key technology in inkjet printing is the method of sintering conductive inks. Until now, high temperature heat sintering processes have been mainly used to sinter various particles.
  • Heat sintering is a method of heating to a temperature of about 200 to 350 in an inert gas state in order to sinter the metal nanoparticles, in addition to the laser sintering method that can be sintered at room temperature and atmospheric pressure is widely used.
  • the laser sintering method has only a sintering ability to a very small area, which causes a problem of poor practicality.
  • the light sintering method is a method of sintering an electrically conductive ink printed on a substrate by irradiating light of a short pulse using a light output unit for irradiating light such as white light.
  • the above-mentioned sintering methods including the light sintering method are mostly methods of sintering the electrically conductive ink printed on the substrate by applying high temperature heat or light to the substrate, as shown in FIG. 1, the light output unit 100.
  • smoke is generated by the combustion or chemical reaction of the ink.
  • the smoke When the smoke is generated, the smoke rises to the top to block the path of light irradiated from the light output unit 100 to block the light, or the light is irradiated from the light output unit 100 by the diffuse reflection of the substrate 300 ) Is not smoothly irradiated, there is a problem that the light efficiency is lowered.
  • the present invention is to solve the conventional problem, and separates the smoke generated by the combustion or chemical reaction of the ink during printing the electrically conductive ink printed on the substrate using the light irradiated from the light output unit Without using, the inclined transfer portion for removing smoke that can prevent the smoke from blocking or suppressing the irradiation of light irradiated from the light output by inclining the substrate transfer portion for transporting the substrate using the principle that the hot smoke rises It is an object to provide an optical sintering apparatus provided.
  • the optical sintering apparatus having an inclined transfer unit for removing smoke for achieving the object of the present invention as described above is a light output for sintering the electrically conductive ink printed on the substrate by irradiating light onto the substrate printed with the electrically conductive ink. And a lower portion of the light output unit to transfer the substrate to a position corresponding to the light output unit, and smoke generated when sintering the electrically conductive ink printed on the substrate is irradiated from the light output unit. It includes a substrate transfer unit provided to be inclined at a predetermined angle so as not to block or suppress the irradiation path of light.
  • the substrate transfer unit may be provided to adjust the inclination angle.
  • the light output unit may be rotatable or repositioned to adjust an irradiation angle of light that is changed according to an inclination angle of the substrate transfer unit.
  • the substrate transfer part may be further provided with a substrate fixing member on one surface facing the substrate in order to stably fix the substrate, and to prevent wrinkles of the substrate generated during sintering through the light output unit.
  • the substrate fixing member may be an adhesive pad having one surface facing the substrate.
  • the substrate fixing member may be partially provided on one side of the substrate transfer part.
  • the substrate fixing member may be an adsorption device having an adsorption hole formed on one surface facing the substrate.
  • the optical sintering apparatus having an inclined conveying unit for removing smoke of the present invention has the following effects.
  • the smoke generated during the sintering of the electrically conductive ink printed on the substrate is irradiated from the rising path of the smoke and the light output part by forming the substrate conveying part at an inclined angle without using a separate device by using the principle that the high temperature smoke rises. There is an effect that the irradiation path of the light is not matched.
  • the effect of lowering the light efficiency such as the conversion of the irradiation path of light due to the smoke and the decrease of the light transmittance is reduced, thereby enabling smooth sintering of the substrate There is.
  • the substrate fixing member fixes the substrate by a method such as adhesion or adsorption, thereby preventing and preventing occurrence of damage such as wrinkles of the substrate due to heat generated by light or light irradiated to the substrate during optical sintering. There is.
  • 1 is a cross-sectional view showing a general light sintered state
  • FIG. 2 is a cross-sectional view of an optical sintering apparatus having an inclined feeder for removing smoke according to a first embodiment of the present invention
  • FIG. 3 is a cross-sectional view showing a use mode of an optical sintering apparatus having an inclined conveying unit for removing smoke according to a first embodiment of the present invention
  • FIG. 4 is a cross-sectional view of an optical sintering apparatus having an inclined feeder for removing smoke according to a second embodiment of the present invention
  • FIG. 5 is a cross-sectional view of an optical sintering apparatus having an inclined feeder for removing smoke according to a modification of the second embodiment of the present invention.
  • FIG. 6 is a perspective view of the substrate transfer part and the substrate fixing member according to the third embodiment of the present invention.
  • FIG. 2 is a cross-sectional view of an optical sintering apparatus having an inclined feeder for removing smoke according to a first embodiment of the present invention.
  • the optical sintering apparatus 10 including the inclined conveying unit for removing smoke according to the first embodiment of the present invention is largely composed of the light output unit 100 and the substrate conveying unit 200.
  • the light output unit 100 is configured to irradiate light for sintering electrically conductive ink such as micrometal particles or precursors patterned on a substrate 300 such as a PI film (Polyimide Film).
  • the light output unit 100 includes a lamp unit 110, and may further include a reflecting plate 120 and an optical wavelength filter 130, depending on the usage.
  • the lamp unit 110 is a device for irradiating light for sintering the patterned electrically conductive ink on the substrate 300.
  • the lamp unit 110 may be any device as long as it is a device for irradiating light capable of sintering an electrically conductive ink.
  • a Xenon flash lamp Irradiation in the form is preferable.
  • the xenon flash lamp consists of a configuration comprising xenon gas injected into a cylindrical sealed quartz quartz tube. Xenon gas outputs light energy from input electric energy, and has an energy conversion rate of more than 50%.
  • xenon flash lamps are formed with metal electrodes such as tungsten to form anodes and cathodes on both sides thereof.
  • the xenon gas injected therein is ionized, and sparks are generated between the anode and the cathode.
  • the current flows for about 1000 Adml current for 1 ms to 10 ms through the spark generated in the lamp unit 110, and an arc plasma shape is generated in the lamp unit 110.
  • Light is generated.
  • the generated light appears to be white light because it contains a broad spectrum of wavelengths from 160 nm to 2.5 mm from ultraviolet to infrared.
  • any kind of lamp unit 110 may be used as long as the lamp unit 110 can achieve this object.
  • the reflector 120 is provided on the upper portion of the lamp unit 110 to reflect the light radiated upward from the lamp unit 110 and output the light toward the lower side.
  • the optical wavelength filter 130 is disposed below the lamp unit 110 to filter only the microwave white light having the predetermined wavelength band.
  • ultraviolet light emitted from the lamp unit 110 using the xenon flash lamp may damage the substrate 300 made of a polymer material, light of the ultraviolet band should be blocked, and according to the type of the substrate 300. It selectively blocks the wavelength band of the irradiated light.
  • the substrate transfer unit 200 is an apparatus for transferring at least one substrate 300 in one or both directions.
  • the substrate transfer unit 200 is disposed to pass through the lower portion of the light output unit 100, the width of the substrate transfer unit 200 is provided to correspond to the width of the substrate 300 and the light output unit 100, the length is
  • the substrate 300 may be selectively determined in consideration of the number of the substrate 300 to be seated and the transport distance of the substrate 300.
  • the substrate transfer unit 200 may be any device that transfers the substrate 300 through the light output unit 100 so as to sinter the electrically conductive ink printed on the substrate 300.
  • FIG. 3 is a cross-sectional view showing a use mode of an optical sintering apparatus having an inclined feeder for removing smoke according to a first embodiment of the present invention.
  • smoke F generated due to the combustion or chemical reaction of the electrically conductive ink during light sintering remains on the irradiation path of the light, thereby improving the irradiation efficiency of the light.
  • it is provided with a predetermined angle compared to the horizontal plane.
  • the inclination angle of the substrate transfer part 200 is the smoke (F) generated during the sintering of the substrate 300 in consideration of the amount of smoke (F) generated when the substrate 300 is sintered, the size of the substrate 300 and the working environment. ) Can optionally determine the angle at which the residence time in the irradiation path of light can be minimized.
  • the substrate transfer unit 200 may be provided to adjust the inclination angle according to the use mode.
  • a linear actuator such as a hydraulic cylinder may be connected to one side of the substrate transfer unit 200, and the inclination angle of the substrate transfer unit 200 may be adjusted by driving the linear actuator.
  • a linear actuator is used to adjust the inclination angle of the substrate transfer unit 200.
  • any device and method may be used as long as the device or method can adjust the inclination angle of the substrate transfer unit 200. FIG. .
  • the angle of the substrate transfer unit 200 since the irradiation angle of light irradiated from the light output unit 100 to the substrate transfer unit 200 may be changed, the efficiency of light may be lowered. It is preferred that the rotation or the position can be changed.
  • the substrate transfer unit 200 and the light output unit 100 are integrally formed, irradiated angles of the light output unit 100 do not change regardless of the change of the inclination angle of the substrate transfer unit 200, but are configured separately.
  • the light output unit 100 rotates or changes its position as the irradiation angle of light irradiated from the light output unit 100 is changed.
  • the configuration for rotating or changing the position of the light output unit 100 is not limited, the light output unit 100 to an angle and position that can maximize the light irradiation efficiency according to the inclination angle of the substrate transfer unit 200. Any device and method may be used as long as the device and method can change the angle and position of the device.
  • the smoke F generated during sintering by the light output unit 100 rises to the upper portion because it is hotter than air in the atmosphere.
  • the light output unit 100 is provided at a position inclined by a predetermined angle relative to the gravity direction at the position where the substrate 300 is cured, the smoke F remaining and flowing on the light irradiation path is minimized.
  • Light irradiated from the output unit 100 is hardly affected by the smoke (F). Therefore, even if a separate device for removing the smoke (F) or the operator does not blow the wind at regular intervals to maximize the light efficiency irradiated from the light output unit 100 to maximize the sintering efficiency of the substrate 300 can do.
  • FIG. 4 is a cross-sectional view of an optical sintering apparatus having an inclined feeder for removing smoke according to a second embodiment of the present invention.
  • the optical sintering apparatus 10 including the inclined conveying unit for removing smoke according to the second embodiment of the present invention has a configuration similar to that of the first embodiment described above.
  • a substrate fixing member 210 is further provided on one side of the substrate transfer part 200 to stably fix the substrate 300 and suppress damage such as deformation of the substrate 300.
  • the substrate holding member 210 which is different from the first embodiment described above.
  • the substrate fixing member 210 is provided so as to surround at least a portion of the substrate transfer part 200, and may be arbitrarily positioned such as slipping of the substrate 300 transferred to the inclined substrate transfer part 200 by sticking or adsorbing the substrate 300. It is a device which can prevent a change and can suppress deformation, such as wrinkles or curvature of the board
  • the substrate fixing member 210 may be any device as long as it can suppress and prevent damage such as any position change or deformation of the substrate 300, but preferably faces the substrate 300. It is good to use an adhesive pad having one side to be adhesive.
  • the substrate fixing member 210 formed of the adhesive pad may be provided to surround the entire surface of the substrate transfer part 200 such as a conveyor belt, or may include a belt constituting the substrate transfer part 200. It may alternatively be provided.
  • the substrate fixing member 210 having the above-described configuration transfers the substrate 300 according to the driving direction of the substrate transfer unit 200 while the substrate 300 is adhered and fixed by driving the substrate transfer unit 200. As described above, even when the substrate 300 is transported along the inclined substrate transfer unit 200 in the adhered state, the substrate 300 may be stably transported without positional changes such as slippage and positional deformation. .
  • the substrate 300 may be damaged or deformed due to heat generated during sintering through the light output unit 100, or may be bent or wrinkled. Since the entire surface of the 300 is adhered and fixed, it is possible to suppress or prevent occurrence of damage or deformation of the substrate 300.
  • FIG. 5 is a cross-sectional view of an optical sintering apparatus having an inclined conveying unit for removing smoke according to a modification of the second embodiment of the present invention.
  • the substrate fixing member 210 does not completely surround the substrate conveying unit 200, and thus the substrate 300.
  • a plurality of sizes may be provided to correspond to the size of).
  • the area of the substrate fixing member 210 may be the same as or larger than the area of the substrate 300.
  • the separation distance from the adjacent substrate holding member 210 may be adjusted to correspond to it in consideration of the supply speed of the substrate 300 continuously supplied.
  • FIG. 6 is a perspective view of the substrate transfer part and the substrate fixing member according to the third embodiment of the present invention.
  • the optical sintering apparatus 10 having the inclined conveying unit for removing smoke according to the third embodiment of the present invention has a configuration similar to the above-described embodiments. However, as shown in FIG. 6, as the configuration of the substrate transfer part 200 and the substrate fixing member 210 is modified, this will be described with reference to the center.
  • the substrate fixing member 210 may be configured as an adsorption device in which a plurality of adsorption holes are formed on one surface facing the substrate 300 so as to adsorb and fix the substrate 300 using vacuum adsorption unlike the above-described embodiments. Can be.
  • Such an adsorption device may be any device as long as it can adsorb the substrate 300 by using vacuum adsorption to fix the substrate 300 and to suppress and prevent deformation of the substrate 300.
  • the substrate fixing member 210 may correspond to the area of the substrate 300 or may be formed relatively large so that at least one substrate 300 may be seated thereon.
  • the substrate transfer part 200 may be made of any configuration as long as it can transfer the substrate fixing member 210 made of an adsorption device to one or both sides so that the substrate 300 can move through the light output part 100. Do. Preferably, as shown in Figure 6, it is preferable to use a substrate transfer unit 200 that can drive the substrate holding member 210 by sliding movement using a hydraulic or pneumatic cylinder or the like.

Abstract

A light sintering apparatus having an inclined conveyor unit for removing smoke, according to the present invention, comprises: a light output unit for irradiating light on a substrate, on which electrically conductive ink is printed, and sintering the electrically conductive ink printed on the substrate; and a substrate conveyor unit provided below the light output unit, so as to convey the substrate to a location corresponding to the light output unit, and inclined at a predetermined angle such that the smoke generated during the sintering of the electrically conductive ink printed on the substrate does not block or inhibit the irradiation path of the light irradiated from the light output unit.

Description

연기 제거를 위한 경사 이송부를 구비한 광 소결장치Optical sintering device with inclined feeder for smoke removal
본 발명은 연기 제거를 위한 경사 이송부를 구비한 광 소결장치에 관한 것으로서, 보다 상세하게는 광 출력부에서 조사되는 광을 이용하여 기판에 인쇄된 전기 전도성 잉크를 인쇄하는 중 잉크의 연소 또는 화학적 반응에 의해 발생하는 연기를 별도의 제거장치를 사용하지 않고, 고온의 연기가 상승하는 원리를 이용하여 기판을 이송하는 기판 이송부를 경사지게 함으로써 연기가 광 출력부에서 조사되는 광의 조사를 차단 또는 억제하는 것을 방지할 수 있는 연기 제거를 위한 경사 이송부를 구비한 광 소결장치에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical sintering apparatus having an inclined transfer unit for removing smoke, and more particularly, combustion or chemical reaction of ink during printing of an electrically conductive ink printed on a substrate using light emitted from an optical output unit. To prevent the smoke from blocking or suppressing the irradiation of light emitted from the light output unit by inclining the substrate transfer unit for transporting the substrate using a principle of rising the high temperature smoke without using a separate removal device. The present invention relates to an optical sintering apparatus having an inclined conveying portion for preventing smoke.
인쇄기술이라 함은 잉크를 사용하여 판면에 그려져 있는 글이나 그림 따위를 종이, 천 따위에 박아내는 기술로서, 최근에는 잉크젯 프린팅, 플렉소 프린팅, 그라뷰어 프린팅 및 스크린 프린팅과 같은 다양한 기술이 사용되고 있다. 이러한 기술은 RFID 시스템, 대면적의 디스플레이 장치, 박판형 태양전지, 박판형 배터리 등과 같은 고부가 가치 상품에 적용되므로, 기술의 수요가 점차 증가하고 있다.Printing technology is a technology that uses ink to embed text or drawings drawn on a plate onto paper or cloth. Recently, various technologies such as inkjet printing, flexo printing, gravure printing, and screen printing have been used. . Since these technologies are applied to high value-added products such as RFID systems, large display devices, thin-film solar cells, thin-film batteries, and the like, the demand for the technology is gradually increasing.
특히, 잉크젯을 통한 다이렉트 패터닝 기술(Direct Patterning Technology)은 잉크젯 헤드를 통해 정량의 잉크를 정확한 위치에 직접 토출시켜 배선을 형성하는 기술이다. 이러한 기술은 재료비 절감뿐만 아니라 제조공정 및 시간을 단축할 수 있는 장점이 있다. 현재, 다이렉트 패터닝을 위한 도전성 금속 잉크로는 금, 은 또는 구리 중 적어도 어느 하나를 사용하는 나노 잉크를 사용한다. 잉크젯 프린팅에서 핵심기술은 전도성 잉크의 소결 방법인데 현재까지는 주로 다양한 입자들을 소결하기 위하여 고온의 열소결 공정이 사용되어 왔다. 열소결 공정은 금속 나노 입자를 소결시키기 위하여 비활성 기체 상태에서 약 200 내지 350의 온도로 가열하는 방식이며, 이 밖에도 상온 및 대기압 상태에서의 소결이 가능한 레이저 소결법이 많이 사용되고 있다. In particular, the direct patterning technology through inkjet is a technique of forming a wiring by directly discharging a predetermined amount of ink to an accurate position through an inkjet head. This technology has the advantage of shortening the manufacturing process and time as well as material costs. At present, conductive metal inks for direct patterning use nano inks using at least one of gold, silver or copper. A key technology in inkjet printing is the method of sintering conductive inks. Until now, high temperature heat sintering processes have been mainly used to sinter various particles. Heat sintering is a method of heating to a temperature of about 200 to 350 in an inert gas state in order to sinter the metal nanoparticles, in addition to the laser sintering method that can be sintered at room temperature and atmospheric pressure is widely used.
그러나 최근 플랙시블 저온 폴리머 또는 종이 위에 전자 패턴을 제작하려는 시도가 이루어지면서 고온 소결 방법은 인쇄 전자 산업 및 기술에 있어서 적용이 어려운 문제점이 있다. 또한, 구리는 열화학적 평형에 의하여 그 표면에 산화층이 형성되어 있어 소결이 매우 어렵고 소결 후에도 전도성이 감소하는 것으로 알려져 있다. However, as recent attempts have been made to fabricate electronic patterns on flexible low temperature polymers or paper, high temperature sintering methods have difficulty in application in the printed electronics industry and technology. In addition, copper is known to have an oxide layer formed on its surface due to thermochemical equilibrium, which is very difficult to sinter and decreases conductivity after sintering.
또한, 레이저 소결법은 극소면적에 대한 소결만이 가능하여 실용성이 떨어지는 문제점이 있다. In addition, the laser sintering method has only a sintering ability to a very small area, which causes a problem of poor practicality.
이러한 문제점들을 해결하기 위하여 광 소결방법을 이용한 소결법의 사용이 증대되고 있다. 광 소결방법은 백색광 등의 광을 조사하는 광 출력부를 이용하여 단펄스의 광을 조사하여 기판에 인쇄된 전기 전도성 잉크를 소결시키는 방법이다. In order to solve these problems, the use of the sintering method using the optical sintering method is increasing. The light sintering method is a method of sintering an electrically conductive ink printed on a substrate by irradiating light of a short pulse using a light output unit for irradiating light such as white light.
도 1은 일반적인 광 소결 상태를 나타내는 단면도이다. 하지만, 광 소결방법을 포함하는 전술한 소결 방법들은 대부분 고온의 열 또는 광을 기판에 조사하여 기판에 인쇄된 전기 전도성 잉크를 소결하는 방법으로서, 도 1에 도시된 바와 같이, 광 출력부(100)를 이용한 기판(300)에 인쇄된 전기 전도성 잉크의 소결 시 잉크의 연소 또는 화학적 반응에 의해 연기가 발생하게 된다. 1 is a cross-sectional view showing a general light sintered state. However, the above-mentioned sintering methods including the light sintering method are mostly methods of sintering the electrically conductive ink printed on the substrate by applying high temperature heat or light to the substrate, as shown in FIG. 1, the light output unit 100. In the sintering of the electrically conductive ink printed on the substrate 300 using the smoke, smoke is generated by the combustion or chemical reaction of the ink.
이처럼 연기가 발생하게 되면, 연기는 상부로 상승하게 되어 광 출력부(100)에서 조사되는 광의 경로를 막아 광을 차단하거나, 광을 난반사 시킴으로써 광 출력부(100)에서 조사되는 광이 기판(300)으로 원활하게 조사되지 않아 광 효율이 저하되는 문제점이 있다.When the smoke is generated, the smoke rises to the top to block the path of light irradiated from the light output unit 100 to block the light, or the light is irradiated from the light output unit 100 by the diffuse reflection of the substrate 300 ) Is not smoothly irradiated, there is a problem that the light efficiency is lowered.
본 발명은 종래의 문제를 해결하기 위한 것으로서, 광 출력부에서 조사되는 광을 이용하여 기판에 인쇄된 전기 전도성 잉크를 인쇄하는 중 잉크의 연소 또는 화학적 반응에 의해 발생하는 연기를 별도의 제거장치를 사용하지 않고, 고온의 연기가 상승하는 원리를 이용하여 기판을 이송하는 기판 이송부를 경사지게 함으로써 연기가 광 출력부에서 조사되는 광의 조사를 차단 또는 억제하는 것을 방지할 수 있는 연기 제거를 위한 경사 이송부를 구비한 광 소결장치를 제공하는데 그 목적이 있다.Disclosure of Invention The present invention is to solve the conventional problem, and separates the smoke generated by the combustion or chemical reaction of the ink during printing the electrically conductive ink printed on the substrate using the light irradiated from the light output unit Without using, the inclined transfer portion for removing smoke that can prevent the smoke from blocking or suppressing the irradiation of light irradiated from the light output by inclining the substrate transfer portion for transporting the substrate using the principle that the hot smoke rises It is an object to provide an optical sintering apparatus provided.
본 발명의 목적은 여기에 제한되지 않으며, 언급되지 않은 또 다른 목적들은 아래의 기재로부터 당업자에게 명확하게 이해될 수 있을 것이다.The object of the present invention is not limited thereto, and other objects not mentioned will be clearly understood by those skilled in the art from the following description.
상기와 같은 본 발명의 목적을 달성하기 위한 연기 제거를 위한 경사 이송부를 구비한 광 소결장치는 전기 전도성 잉크가 인쇄된 기판에 광을 조사하여 상기 기판에 인쇄된 상기 전기 전도성 잉크를 소결하는 광 출력부 및 상기 광 출력부의 하부에 상기 광 출력부와 대응되는 위치로 상기 기판을 이송시킬 수 있도록 구비되고, 상기 기판에 인쇄된 상기 전기 전도성 잉크를 소결 시 발생하는 연기가 상기 광 출력부에서 조사되는 광의 조사 경로를 차단 또는 억제하지 않도록 소정각도 경사지게 구비되는 기판 이송부를 포함한다.The optical sintering apparatus having an inclined transfer unit for removing smoke for achieving the object of the present invention as described above is a light output for sintering the electrically conductive ink printed on the substrate by irradiating light onto the substrate printed with the electrically conductive ink. And a lower portion of the light output unit to transfer the substrate to a position corresponding to the light output unit, and smoke generated when sintering the electrically conductive ink printed on the substrate is irradiated from the light output unit. It includes a substrate transfer unit provided to be inclined at a predetermined angle so as not to block or suppress the irradiation path of light.
이때, 상기 기판 이송부는 경사 각도가 조절 가능하게 구비될 수 있다. In this case, the substrate transfer unit may be provided to adjust the inclination angle.
또한, 상기 광 출력부는 상기 기판 이송부의 경사 각도에 따라 변경되는 광의 조사 각도를 조절하기 위하여 회전 또는 위치 변경이 가능하게 구비될 수 있다. The light output unit may be rotatable or repositioned to adjust an irradiation angle of light that is changed according to an inclination angle of the substrate transfer unit.
또한, 상기 기판 이송부에는 상기 기판을 안정적으로 고정하고, 상기 광 출력부를 통한 소결 시 발생하는 상기 기판의 구겨짐을 방지하기 위하여 상기 기판과 대면하는 일면에 기판 고정부재가 더 구비될 수 있다. In addition, the substrate transfer part may be further provided with a substrate fixing member on one surface facing the substrate in order to stably fix the substrate, and to prevent wrinkles of the substrate generated during sintering through the light output unit.
또한, 상기 기판 고정부재는 상기 기판과 대면하는 일면이 점착성을 갖는 점착패드일 수 있다.In addition, the substrate fixing member may be an adhesive pad having one surface facing the substrate.
또한, 상기 기판 고정부재는 상기 기판 이송부의 일측에 부분적으로 구비될 수 있다.In addition, the substrate fixing member may be partially provided on one side of the substrate transfer part.
또한, 상기 기판 고정부재는 상기 기판과 대면하는 일면에 흡착홀이 형성된 흡착장치일 수 있다.In addition, the substrate fixing member may be an adsorption device having an adsorption hole formed on one surface facing the substrate.
본 발명의 연기 제거를 위한 경사 이송부를 구비한 광 소결장치는 다음과 같은 효과가 있다.The optical sintering apparatus having an inclined conveying unit for removing smoke of the present invention has the following effects.
첫째, 기판에 인쇄된 전기 전도성 잉크의 소결 시 발생하는 연기를 고온의 연기가 상승하는 원리를 이용하여 별도의 장치를 사용하지 않고, 기판 이송부를 경사지게 형성함으로써 연기의 상승 경로와 광 출력부에서 조사되는 광의 조사경로가 일치 되지 않도록 할 수 있는 효과가 있다. First, the smoke generated during the sintering of the electrically conductive ink printed on the substrate is irradiated from the rising path of the smoke and the light output part by forming the substrate conveying part at an inclined angle without using a separate device by using the principle that the high temperature smoke rises. There is an effect that the irradiation path of the light is not matched.
둘째, 경사진 기판 이송부를 통해 연기가 광 출력부에서 조사되는 광의 경로와 어긋남에 따라, 연기로 인한 광의 조사 경로 변환, 광 투과율 저하 등과 같은 광 효율 저하 요인을 감소하여 원활한 기판의 소결이 가능한 효과가 있다. Second, as the smoke deviates from the path of the light irradiated from the light output part through the inclined substrate transfer part, the effect of lowering the light efficiency such as the conversion of the irradiation path of light due to the smoke and the decrease of the light transmittance is reduced, thereby enabling smooth sintering of the substrate There is.
셋째, 경사진 기판 이송부에 안착되는 기판을 기판 고정부재를 통해 안정적으로 이송할 수 있는 효과가 있다. Third, there is an effect that can be stably transferred to the substrate seated on the inclined substrate transfer unit through the substrate fixing member.
넷째, 기판 고정부재는 점착 또는 흡착 등의 방법을 통해 기판을 고정함으로써 광 소결 시 기판에 조사되는 광 또는 광에 의한 발열에 의해 기판의 구겨짐과 같은 손상이 발생하는 것을 억제 및 방지할 수 있는 효과가 있다. Fourth, the substrate fixing member fixes the substrate by a method such as adhesion or adsorption, thereby preventing and preventing occurrence of damage such as wrinkles of the substrate due to heat generated by light or light irradiated to the substrate during optical sintering. There is.
본 발명의 효과들은 상기 언급한 효과에 제한되지 않으며, 언급되지 않은 또 다른 효과들은 청구범위의 기재로부터 당업자에게 명확하게 이해될 수 있을 것이다.The effects of the present invention are not limited to the above-mentioned effects, and other effects not mentioned will be clearly understood by those skilled in the art from the description of the claims.
본 명세서에서 첨부되는 다음의 도면들은 본 발명의 바람직한 실시예를 예시하는 것이며, 발명의 상세한 설명과 함께 본 발명의 기술사상을 더욱 이해시키는 역할을 하는 것이므로, 본 발명은 그러한 도면에 기재된 사항에만 한정되어 해석되어서는 아니 된다.The following drawings, which are attached in this specification, illustrate the preferred embodiments of the present invention, and together with the detailed description thereof, serve to further understand the technical spirit of the present invention, and therefore, the present invention is limited only to the matters described in the drawings. It should not be interpreted.
도 1은 일반적인 광 소결 상태를 나타내는 단면도;1 is a cross-sectional view showing a general light sintered state;
도 2는 본 발명의 제1실시예에 따른 연기 제거를 위한 경사 이송부를 구비한 광 소결장치의 단면도;2 is a cross-sectional view of an optical sintering apparatus having an inclined feeder for removing smoke according to a first embodiment of the present invention;
도 3은 본 발명의 제1실시예에 따른 연기 제거를 위한 경사 이송부를 구비한 광 소결장치의 사용양태를 나타내는 단면도;3 is a cross-sectional view showing a use mode of an optical sintering apparatus having an inclined conveying unit for removing smoke according to a first embodiment of the present invention;
도 4는 본 발명의 제2실시예에 따른 연기 제거를 위한 경사 이송부를 구비한 광 소결장치의 단면도;4 is a cross-sectional view of an optical sintering apparatus having an inclined feeder for removing smoke according to a second embodiment of the present invention;
도 5는 본 발명의 제2실시예의 변형예에 따른 연기 제거를 위한 경사 이송부를 구비한 광 소결장치의 단면도; 및5 is a cross-sectional view of an optical sintering apparatus having an inclined feeder for removing smoke according to a modification of the second embodiment of the present invention; And
도 6은 본 발명의 제3실시예에 따른 기판 이송부 및 기판 고정부재의 사시도이다.6 is a perspective view of the substrate transfer part and the substrate fixing member according to the third embodiment of the present invention.
이하, 첨부된 도면을 참조하여 본 발명의 바람직한 실시예를 상세하게 설명한다.Hereinafter, with reference to the accompanying drawings will be described in detail a preferred embodiment of the present invention.
제1실시예First embodiment
도 2는 본 발명의 제1실시예에 따른 연기 제거를 위한 경사 이송부를 구비한 광 소결장치의 단면도이다. 본 발명의 제1실시예에 따른 연기 제거를 위한 경사 이송부를 구비한 광 소결장치(10)는 크게 광 출력부(100) 및 기판 이송부(200)로 구성된다. 2 is a cross-sectional view of an optical sintering apparatus having an inclined feeder for removing smoke according to a first embodiment of the present invention. The optical sintering apparatus 10 including the inclined conveying unit for removing smoke according to the first embodiment of the present invention is largely composed of the light output unit 100 and the substrate conveying unit 200.
광 출력부(100)는 도 2에 도시된 바와 같이, PI필름(Polyimide Film) 등의 기판(300) 상에 패터닝된 미세금속입자 또는 전구체와 같은 전기 전도성 잉크를 소결하기 위한 광을 조사하기 위한 장치이다. 이러한 광 출력부(100)는 램프 유닛(110)을 포함하며, 사용양태에 따라서는 반사판(120) 및 광파장 필터(130)를 더 포함하여 구성될 수 있다. As shown in FIG. 2, the light output unit 100 is configured to irradiate light for sintering electrically conductive ink such as micrometal particles or precursors patterned on a substrate 300 such as a PI film (Polyimide Film). Device. The light output unit 100 includes a lamp unit 110, and may further include a reflecting plate 120 and an optical wavelength filter 130, depending on the usage.
램프 유닛(110)은 기판(300)에 패터닝된 전기 전도성 잉크를 소결하기 위한 광을 조사하는 장치이다. 이러한 램프 유닛(110)은 전기 전도성 잉크를 소결할 수 있는 광을 조사하는 장치라면 어떠한 장치를 사용하여도 무방하지만, 바람직하게는 제논 플래시 램프(Xenon Flash Lamp)를 사용하는 것이 좋으며, 백색광을 면 형태로 조사하는 것이 바람직하다. 제논 플래시 램프는 실린더 형상의 밀봉된 석영 석영튜브 안에 주입된 제논가스를 포함하는 구성으로 이루어진다. 제논가스는 입력 받은 전기에너지로부터 광 에너지를 출력하여, 50%가 넘는 에너지 변환율을 갖는다. 또한, 제논 플래시 램프는 내부 양쪽에 양극 및 음극 형성을 위해 텅스텐과 같은 금속전극이 형성된다. 이러한 구성으로 이루어진 램프 유닛(110)에 후술하는 높은 전원 및 전류를 인가 받으면, 내부에 주입된 제논가스가 이온화되고, 양극과 음극 사이로 스파크가 발생된다. 이때, 축전부에서 집적된 전하가 인가되면 램프 유닛(110) 내부에서 발생한 스파크를 통해 약 1000Adml 전류가 1ms 내지 10ms 동안 전류가 흐르면서 램프 유닛(110) 내부에는 아크 플라즈마 형상이 발생하고, 강한 세기의 광이 발생된다. 여기서 발생된 광은 160nm 내지 2.5mm 사이의 자외선부터 적외선까지의 넓은 파장대역의 광 스펙트럼을 내장하고 있기 때문에 백색광으로 보인다. 본 발명에서는 일실시예로서, 제논 플래시 램프를 기재하였지만, 이러한 목적을 달성할 수 있는 램프 유닛(110)이라면 어떠한 종류를 사용하더라도 무방하다.The lamp unit 110 is a device for irradiating light for sintering the patterned electrically conductive ink on the substrate 300. The lamp unit 110 may be any device as long as it is a device for irradiating light capable of sintering an electrically conductive ink. However, it is preferable to use a Xenon flash lamp. Irradiation in the form is preferable. The xenon flash lamp consists of a configuration comprising xenon gas injected into a cylindrical sealed quartz quartz tube. Xenon gas outputs light energy from input electric energy, and has an energy conversion rate of more than 50%. In addition, xenon flash lamps are formed with metal electrodes such as tungsten to form anodes and cathodes on both sides thereof. When the high power and current described later are applied to the lamp unit 110 having the above-described configuration, the xenon gas injected therein is ionized, and sparks are generated between the anode and the cathode. At this time, when the electric charge integrated in the power storage unit is applied, the current flows for about 1000 Adml current for 1 ms to 10 ms through the spark generated in the lamp unit 110, and an arc plasma shape is generated in the lamp unit 110. Light is generated. The generated light appears to be white light because it contains a broad spectrum of wavelengths from 160 nm to 2.5 mm from ultraviolet to infrared. Although the xenon flash lamp has been described as an embodiment in the present invention, any kind of lamp unit 110 may be used as long as the lamp unit 110 can achieve this object.
반사판(120)은 도 2에 도시된 바와 같이, 램프 유닛(110)의 상부에 구비되어 램프 유닛(110)으로부터 상부로 조사되는 광을 반사시켜 하부 방향으로 출력하도록 하는 장치이다. As shown in FIG. 2, the reflector 120 is provided on the upper portion of the lamp unit 110 to reflect the light radiated upward from the lamp unit 110 and output the light toward the lower side.
광파장 필터(130)는 도 2에 도시된 바와 같이, 램프 유닛(110)의 하부에 구비되어 기 설정된 파장대역을 갖는 극단파 백색광만을 필터링한다. 특히, 제논 플래시 램프를 사용하는 램프 유닛(110)에서 조사되는 자외선광이 폴리머 재질로 이루어진 기판(300)을 손상시킬 수 있기 때문에 자외선 대역의 광을 차단하여야 하며, 기판(300)의 종류에 따라 조사되는 광의 파장대역을 선택적으로 차단한다.As shown in FIG. 2, the optical wavelength filter 130 is disposed below the lamp unit 110 to filter only the microwave white light having the predetermined wavelength band. In particular, since ultraviolet light emitted from the lamp unit 110 using the xenon flash lamp may damage the substrate 300 made of a polymer material, light of the ultraviolet band should be blocked, and according to the type of the substrate 300. It selectively blocks the wavelength band of the irradiated light.
기판 이송부(200)는 적어도 하나 이상의 기판(300)을 일방 또는 양방으로 이송하는 장치이다. 이러한 기판 이송부(200)는 광 출력부(100)의 하부를 통과하도록 배치되며, 기판 이송부(200)의 폭은 기판(300) 및 광 출력부(100)의 폭과 대응되도록 구비되고, 길이는 안착되는 기판(300)의 개수 및 기판(300) 이송 거리 등을 고려하여 선택적으로 결정될 수 있다. 이처럼, 기판 이송부(200)는 기판(300)을 광 출력부(100)를 통과하며 기판(300)에 인쇄된 전기 전도성 잉크를 소결할 수 있도록 이송하는 장치라면 어떠한 장치를 사용하여도 무방하지만, 바람직하게는 컨베이어벨트, 복수의 롤러로 구성된 롤러 이송부 또는 상호 이격된 롤러를 벨트 등으로 감싸도록 구비되는 이송부 등을 사용하는 것이 좋다. The substrate transfer unit 200 is an apparatus for transferring at least one substrate 300 in one or both directions. The substrate transfer unit 200 is disposed to pass through the lower portion of the light output unit 100, the width of the substrate transfer unit 200 is provided to correspond to the width of the substrate 300 and the light output unit 100, the length is The substrate 300 may be selectively determined in consideration of the number of the substrate 300 to be seated and the transport distance of the substrate 300. As such, the substrate transfer unit 200 may be any device that transfers the substrate 300 through the light output unit 100 so as to sinter the electrically conductive ink printed on the substrate 300. Preferably, it is preferable to use a conveyor belt, a roller conveying portion composed of a plurality of rollers, or a conveying portion provided to surround rollers spaced apart from each other with a belt or the like.
도 3은 본 발명의 제1실시예에 따른 연기 제거를 위한 경사 이송부를 구비한 광 소결장치의 사용양태를 나타내는 단면도이다. 전술한 구성으로 이루어지는 기판 이송부(200)는 도 3에 도시된 바와 같이, 광 소결 시 전기 전도성 잉크의 연소 또는 화학적 반응으로 인해 발생하는 연기(F)가 광의 조사 경로 상에 잔류하여 광의 조사효율을 감소하는 것을 방지하기 위하여 도 2 및 도 3에 도시된 바와 같이, 수평면과 비교하여 소정각도 경사지게 구비된다. 여기서, 기판 이송부(200)의 경사 각도는 기판(300) 소결 시 발생하는 연기(F)의 양, 기판(300)의 크기 및 작업 환경 등을 고려하여 기판(300) 소결 시 발생하는 연기(F)가 광의 조사 경로에 잔류 시간이 최소화될 수 있는 각도를 선택적으로 결정할 수 있다.3 is a cross-sectional view showing a use mode of an optical sintering apparatus having an inclined feeder for removing smoke according to a first embodiment of the present invention. As shown in FIG. 3, in the substrate transfer part 200 having the above-described configuration, smoke F generated due to the combustion or chemical reaction of the electrically conductive ink during light sintering remains on the irradiation path of the light, thereby improving the irradiation efficiency of the light. In order to prevent the decrease as shown in Figures 2 and 3, it is provided with a predetermined angle compared to the horizontal plane. Here, the inclination angle of the substrate transfer part 200 is the smoke (F) generated during the sintering of the substrate 300 in consideration of the amount of smoke (F) generated when the substrate 300 is sintered, the size of the substrate 300 and the working environment. ) Can optionally determine the angle at which the residence time in the irradiation path of light can be minimized.
이때, 기판 이송부(200)는 사용양태에 따라서 그 경사 각도를 조절할 수 있도록 구비될 수 있다. 일예로, 기판 이송부(200)의 일측에 유압 실린더와 같은 리니어 액추에이터가 연결되고, 리니어 액추에이터의 구동을 통해 기판 이송부(200)의 경사 각도를 조절할 수 있다. 일실시예로 리니어 액추에이터를 이용하여 기판 이송부(200)의 경사 각도를 조절하도록 설명하고 있으나, 기판 이송부(200)의 경사각도를 조절할 수 있는 장치 또는 방법이라면 어떠한 장치 및 방법을 이용하여도 무방하다. At this time, the substrate transfer unit 200 may be provided to adjust the inclination angle according to the use mode. For example, a linear actuator such as a hydraulic cylinder may be connected to one side of the substrate transfer unit 200, and the inclination angle of the substrate transfer unit 200 may be adjusted by driving the linear actuator. In an embodiment, a linear actuator is used to adjust the inclination angle of the substrate transfer unit 200. However, any device and method may be used as long as the device or method can adjust the inclination angle of the substrate transfer unit 200. FIG. .
이와 같이, 기판 이송부(200)의 각도가 변경되면 광 출력부(100)에서 기판 이송부(200)로 조사되는 광의 조사 각도가 변경되어 광의 효율이 저하될 수 있기 때문에, 광 출력부(100) 역시 회전 또는 위치 변경이 가능하게 구비되는 것이 좋다. 기판 이송부(200)와 광 출력부(100)가 일체로 이루어지는 경우에는 기판 이송부(200)의 경사 각도 변화와 무관하게 광 출력부(100)의 조사 각도 등이 변화하지 않지만, 각각 별도로 구성되는 경우에는 기판 이송부(200)의 경사 각도에 따라 광 출력부(100)에서 조사되는 광의 조사 각도가 변경됨에 따라 광 출력부(100)가 회전 또는 위치가 변경되는 것이 좋다. 이때, 광 출력부(100)의 회전 또는 위치 변경을 위한 구성은 한정적인 것이 아니며, 기판 이송부(200)의 경사 각도에 따라 광 조사 효율을 극대화 시킬 수 있는 각도 및 위치로 광 출력부(100)의 각도 및 위치를 변경할 수 있는 장치 및 방법이라면 어떠한 장치 및 방법을 사용하여도 무방하다. As such, when the angle of the substrate transfer unit 200 is changed, since the irradiation angle of light irradiated from the light output unit 100 to the substrate transfer unit 200 may be changed, the efficiency of light may be lowered. It is preferred that the rotation or the position can be changed. When the substrate transfer unit 200 and the light output unit 100 are integrally formed, irradiated angles of the light output unit 100 do not change regardless of the change of the inclination angle of the substrate transfer unit 200, but are configured separately. In accordance with the inclination angle of the substrate transfer unit 200, it is preferable that the light output unit 100 rotates or changes its position as the irradiation angle of light irradiated from the light output unit 100 is changed. At this time, the configuration for rotating or changing the position of the light output unit 100 is not limited, the light output unit 100 to an angle and position that can maximize the light irradiation efficiency according to the inclination angle of the substrate transfer unit 200. Any device and method may be used as long as the device and method can change the angle and position of the device.
도 3에 도시된 바와 같이, 광 출력부(100)에 의해 소결 시 발생하는 연기(F)는 대기 중의 공기보다 고온이기 때문에 상부로 상승하게 된다. 이때, 광 출력부(100)는 기판(300)이 경화되는 위치에서 중력방향을 기준으로 소정 각도 기울어진 위치에 구비되기 때문에 광의 조사경로상에 잔류 및 유동하는 연기(F)가 최소화 됨에 따라 광 출력부(100)에서 조사되는 광은 연기(F)의 영향을 거의 받지 않는다. 이로 인해, 연기(F)를 제거하기 위한 별도의 장치를 사용하거나, 작업자가 일정 주기로 바람을 불어주지 않더라도 광 출력부(100)에서 조사되는 광 효율을 극대화하여 기판(300)의 소결 효율을 극대화할 수 있다. As shown in FIG. 3, the smoke F generated during sintering by the light output unit 100 rises to the upper portion because it is hotter than air in the atmosphere. At this time, since the light output unit 100 is provided at a position inclined by a predetermined angle relative to the gravity direction at the position where the substrate 300 is cured, the smoke F remaining and flowing on the light irradiation path is minimized. Light irradiated from the output unit 100 is hardly affected by the smoke (F). Therefore, even if a separate device for removing the smoke (F) or the operator does not blow the wind at regular intervals to maximize the light efficiency irradiated from the light output unit 100 to maximize the sintering efficiency of the substrate 300 can do.
제2실시예Second embodiment
도 4는 본 발명의 제2실시예에 따른 연기 제거를 위한 경사 이송부를 구비한 광 소결장치의 단면도이다. 본 발명의 제2실시예에 따른 연기 제거를 위한 경사 이송부를 구비한 광 소결장치(10)는 도 4에 도시된 바와 같이, 전체적으로 전술한 제1실시예와 유사한 구성으로 이루어진다. 하지만, 기판 이송부(200)의 일측에 기판(300)을 안정적으로 고정하고, 기판(300)의 변형과 같은 손상을 억제하기 위한 기판 고정부재(210)가 더 구비된다. 본 실시예에서는 전술한 제1실시예와 차이가 있는 기판 고정부재(210)를 중심으로 설명하기로 한다. 4 is a cross-sectional view of an optical sintering apparatus having an inclined feeder for removing smoke according to a second embodiment of the present invention. As shown in FIG. 4, the optical sintering apparatus 10 including the inclined conveying unit for removing smoke according to the second embodiment of the present invention has a configuration similar to that of the first embodiment described above. However, a substrate fixing member 210 is further provided on one side of the substrate transfer part 200 to stably fix the substrate 300 and suppress damage such as deformation of the substrate 300. In the present embodiment will be described based on the substrate holding member 210 which is different from the first embodiment described above.
기판 고정부재(210)는 기판 이송부(200)의 적어도 일부를 감싸도록 구비되어 기판(300)을 점착 또는 흡착하여 경사진 기판 이송부(200)로 이송되는 기판(300)의 미끄러짐 등과 같이 임의로 위치가 변경되는 것을 방지하고, 기판(300)의 구겨짐 또는 휨 등의 변형을 억제할 수 있는 장치이다. 이와 같이, 기판 고정부재(210)는 기판(300)의 임의의 위치 변경 또는 변형 등의 손상을 억제 및 방지할 수 있는 것이라면 어떠한 장치를 사용하여도 무방하지만, 바람직하게는 기판(300)과 대면하는 일면이 점착성을 갖는 점착패드를 사용하는 것이 좋다. The substrate fixing member 210 is provided so as to surround at least a portion of the substrate transfer part 200, and may be arbitrarily positioned such as slipping of the substrate 300 transferred to the inclined substrate transfer part 200 by sticking or adsorbing the substrate 300. It is a device which can prevent a change and can suppress deformation, such as wrinkles or curvature of the board | substrate 300. FIG. As such, the substrate fixing member 210 may be any device as long as it can suppress and prevent damage such as any position change or deformation of the substrate 300, but preferably faces the substrate 300. It is good to use an adhesive pad having one side to be adhesive.
이와 같이, 점착패드로 구성된 기판 고정부재(210)는 도 4에 도시된 바와 같이, 컨베이어벨트 등과 같은 기판 이송부(200)의 전면적을 감싸도록 구비되거나, 기판 이송부(200)를 구성하는 벨트 등을 대체하여 구비될 수 있다. As such, the substrate fixing member 210 formed of the adhesive pad may be provided to surround the entire surface of the substrate transfer part 200 such as a conveyor belt, or may include a belt constituting the substrate transfer part 200. It may alternatively be provided.
전술한 구성으로 이루어진 기판 고정부재(210)는 기판 이송부(200)의 구동을 통해 기판(300)이 점착되어 고정된 상태로 기판 이송부(200)의 구동방향에 따라 기판(300)을 이송시킨다. 이처럼 기판 고정부재(210)를 통해 기판(300)은 점착된 상태로 경사진 기판 이송부(200)를 따라 이송되더라도 미끄러짐 등과 같은 위치 변경 및 틀어짐과 같은 위치 변형이 발생되지 않고 안정적으로 이송될 수 있다. The substrate fixing member 210 having the above-described configuration transfers the substrate 300 according to the driving direction of the substrate transfer unit 200 while the substrate 300 is adhered and fixed by driving the substrate transfer unit 200. As described above, even when the substrate 300 is transported along the inclined substrate transfer unit 200 in the adhered state, the substrate 300 may be stably transported without positional changes such as slippage and positional deformation. .
또한, 광 출력부(100)를 통한 소결 시 발생하는 발열 등에 의해 기판(300)이 뜨거나, 휘어지거나, 구겨지는 등의 손상 또는 변형이 발생하는 것을 기판 고정부재(210)의 점착력에 의해 기판(300)의 전면을 점착하여 고정하고 있기 때문에 기판(300)의 손상 또는 변형이 발생하는 것을 억제 또는 방지할 수 있다. In addition, the substrate 300 may be damaged or deformed due to heat generated during sintering through the light output unit 100, or may be bent or wrinkled. Since the entire surface of the 300 is adhered and fixed, it is possible to suppress or prevent occurrence of damage or deformation of the substrate 300.
(( 변형예Variant ))
도 5는 본 발명의 제2실시예의 변형예에 따른 연기 제거를 위한 경사 이송부를 구비한 광 소결장치의 단면도이다. 제2실시예에 따른 연기 제거를 위한 경사 이송부를 구비한 광 소결장치(10)는 도 5에 도시된 바와 같이, 기판 고정부재(210)가 기판 이송부(200)를 전체적으로 감싸지 않고, 기판(300)의 크기와 대응되는 크기로 복수 구비될 수 있다.5 is a cross-sectional view of an optical sintering apparatus having an inclined conveying unit for removing smoke according to a modification of the second embodiment of the present invention. In the optical sintering apparatus 10 having the inclined conveying unit for removing smoke according to the second embodiment, as shown in FIG. 5, the substrate fixing member 210 does not completely surround the substrate conveying unit 200, and thus the substrate 300. A plurality of sizes may be provided to correspond to the size of).
이때, 기판 고정부재(210)의 면적은 기판(300)의 면적과 동일하거나, 상대적으로 크게 형성될 수 있다. 또한, 상호 인접한 기판 고정부재(210)와의 이격거리는 연속적으로 공급되는 기판(300)의 공급속도 등을 고려하여 그와 대응되도록 조절할 수 있다. In this case, the area of the substrate fixing member 210 may be the same as or larger than the area of the substrate 300. In addition, the separation distance from the adjacent substrate holding member 210 may be adjusted to correspond to it in consideration of the supply speed of the substrate 300 continuously supplied.
제3실시예Third embodiment
도 6은 본 발명의 제3실시예에 따른 기판 이송부 및 기판 고정부재의 사시도이다. 본 발명의 제3실시예에 따른 연기 제거를 위한 경사 이송부를 구비한 광 소결장치(10)는 전술한 실시예들과 유사한 구성으로 이루어진다. 하지만, 도 6에 도시된 바와 같이, 기판 이송부(200) 및 기판 고정부재(210)의 구성이 변형됨에 따라 이를 중심으로 설명하기로 한다. 6 is a perspective view of the substrate transfer part and the substrate fixing member according to the third embodiment of the present invention. The optical sintering apparatus 10 having the inclined conveying unit for removing smoke according to the third embodiment of the present invention has a configuration similar to the above-described embodiments. However, as shown in FIG. 6, as the configuration of the substrate transfer part 200 and the substrate fixing member 210 is modified, this will be described with reference to the center.
기판 고정부재(210)는 전술한 실시예들과 달리 진공흡착을 이용하여 기판(300)을 흡착하여 고정시킬 수 있도록 기판(300)과 대면하는 일면에 복수의 흡착홀이 형성된 흡착장치로 구성될 수 있다. 이러한 흡착장치는 진공 흡착을 이용하여 기판(300)을 흡착하여 기판(300)을 고정하고, 기판(300)의 변형을 억제 및 방지할 수 있는 장치라면 어떠한 장치를 사용하여도 무방하다. 이때, 기판 고정부재(210)는 적어도 하나 이상의 기판(300)이 안착될 수 있도록, 기판(300)의 면적과 대응되거나, 상대적으로 크게 형성되는 것이 좋다. The substrate fixing member 210 may be configured as an adsorption device in which a plurality of adsorption holes are formed on one surface facing the substrate 300 so as to adsorb and fix the substrate 300 using vacuum adsorption unlike the above-described embodiments. Can be. Such an adsorption device may be any device as long as it can adsorb the substrate 300 by using vacuum adsorption to fix the substrate 300 and to suppress and prevent deformation of the substrate 300. In this case, the substrate fixing member 210 may correspond to the area of the substrate 300 or may be formed relatively large so that at least one substrate 300 may be seated thereon.
기판 이송부(200)는 기판(300)이 광 출력부(100)를 통과하여 이동할 수 있도록 흡착장치로 이루어진 기판 고정부재(210)를 일방 또는 양방으로 이송시킬 수 있는 장치라면 어떠한 구성으로 이루어져도 무방하다. 바람직하게는 도 6에 도시된 바와 같이, 유압 또는 공압 실린더 등을 이용하여 기판 고정부재(210)를 슬라이딩 이동을 통해 구동시킬 수 있는 기판 이송부(200)를 사용하는 것이 좋다. The substrate transfer part 200 may be made of any configuration as long as it can transfer the substrate fixing member 210 made of an adsorption device to one or both sides so that the substrate 300 can move through the light output part 100. Do. Preferably, as shown in Figure 6, it is preferable to use a substrate transfer unit 200 that can drive the substrate holding member 210 by sliding movement using a hydraulic or pneumatic cylinder or the like.
이상에서 설명한 바와 같이, 본 발명이 속하는 기술분야의 당업자는 본 발명이 그 기술적 사상이나 필수적 특징을 변경하지 않고서 다른 구체적인 형태로 실시될 수 있다는 것을 이해할 수 있을 것이다. 그러므로 상술한 실시예들은 모든 면에 예시적인 것이며 한정적인 것이 아닌 것으로서 이해해야만 한다. 본 발명의 범위는 상세한 설명보다는 후술하는 특허청구범위에 의하여 나타내어지며, 특허청구범위의 의미 및 범위 그리고 등가 개념으로부터 도출되는 모든 변경 또는 변형된 형태가 본 발명의 범위에 포함되는 것으로 해석되어야 한다.As described above, those skilled in the art will understand that the present invention can be implemented in other specific forms without changing the technical spirit or essential features. Therefore, the above-described embodiments are to be understood in all respects as illustrative and not restrictive. The scope of the present invention is shown by the following claims rather than the detailed description, and all changes or modifications derived from the meaning and scope of the claims and equivalent concepts should be construed as being included in the scope of the present invention.

Claims (7)

  1. 전기 전도성 잉크가 인쇄된 기판에 광을 조사하여 상기 기판에 인쇄된 상기 전기 전도성 잉크를 소결하는 광 출력부; 및A light output unit to sinter the electrically conductive ink printed on the substrate by irradiating light onto a substrate on which the electrically conductive ink is printed; And
    상기 광 출력부의 하부에 상기 광 출력부와 대응되는 위치로 상기 기판을 이송시킬 수 있도록 구비되고, 상기 기판에 인쇄된 상기 전기 전도성 잉크를 소결 시 발생하는 연기가 상기 광 출력부에서 조사되는 광의 조사 경로를 차단 또는 억제하지 않도록 소정각도 경사지게 구비되는 기판 이송부;Irradiation of light irradiated from the light output unit with smoke generated when sintering the electrically conductive ink printed on the substrate is provided to transfer the substrate to a position corresponding to the light output unit under the light output unit. A substrate transfer part provided to be inclined at a predetermined angle so as not to block or suppress a path;
    를 포함하는 연기 제거를 위한 경사 이송부를 구비한 광 소결장치.Optical sintering apparatus provided with an inclined transfer for removing smoke comprising a.
  2. 제1항에 있어서,The method of claim 1,
    상기 기판 이송부는 경사 각도가 조절 가능하게 구비되는 연기 제거를 위한 경사 이송부를 구비한 광 소결장치.The substrate transfer unit is an optical sintering apparatus having an inclined transfer unit for removing smoke that the inclination angle is adjustable.
  3. 제 2항에 있어서,The method of claim 2,
    상기 광 출력부는 상기 기판 이송부의 경사 각도에 따라 변경되는 광의 조사 각도를 조절하기 위하여 회전 또는 위치 변경이 가능하게 구비되는 연기 제거를 위한 경사 이송부를 구비한 광 소결장치.And the light output unit includes an inclined transfer unit for removing smoke that is rotatable or changed in position to adjust an irradiation angle of light that is changed according to an inclination angle of the substrate transfer unit.
  4. 제1항에 있어서,The method of claim 1,
    상기 기판 이송부에는 상기 기판을 안정적으로 고정하고, 상기 광 출력부를 통한 소결 시 발생하는 상기 기판의 구겨짐을 방지하기 위하여 상기 기판과 대면하는 일면에 기판 고정부재가 더 구비되는 연기 제거를 위한 경사 이송부를 구비한 광 소결장치.The inclined transfer unit for stably fixing the substrate to the substrate transfer unit, and the substrate fixing member is further provided on one surface facing the substrate in order to prevent wrinkles of the substrate generated during sintering through the light output unit. Optical sintering apparatus provided.
  5. 제4항에 있어서,The method of claim 4, wherein
    상기 기판 고정부재는 상기 기판과 대면하는 일면이 점착성을 갖는 점착패드인 연기 제거를 위한 경사 이송부를 구비한 광 소결장치.The substrate holding member is an optical sintering apparatus having an inclined transfer portion for removing smoke which is one side facing the substrate is a pressure-sensitive adhesive pad.
  6. 제5항에 있어서,The method of claim 5,
    상기 기판 고정부재는 상기 기판 이송부의 일측에 부분적으로 구비되는 연기 제거를 위한 경사 이송부를 구비한 광 소결장치.The substrate holding member is an optical sintering apparatus having an inclined transfer unit for removing smoke partially provided on one side of the substrate transfer unit.
  7. 제4항에 있어서,The method of claim 4, wherein
    상기 기판 고정부재는 상기 기판과 대면하는 일면에 흡착홀이 형성된 흡착장치인 연기 제거를 위한 경사 이송부를 구비한 광 소결장치.The substrate holding member is an optical sintering apparatus having an inclined transfer unit for removing smoke which is an adsorption device formed with an adsorption hole on one surface facing the substrate.
PCT/KR2016/009913 2015-11-18 2016-09-05 Light sintering apparatus having inclined conveyor unit for removing smoke WO2017086583A1 (en)

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