WO2017086582A1 - Substrate damage preventing light sintering apparatus - Google Patents

Substrate damage preventing light sintering apparatus Download PDF

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Publication number
WO2017086582A1
WO2017086582A1 PCT/KR2016/009911 KR2016009911W WO2017086582A1 WO 2017086582 A1 WO2017086582 A1 WO 2017086582A1 KR 2016009911 W KR2016009911 W KR 2016009911W WO 2017086582 A1 WO2017086582 A1 WO 2017086582A1
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WO
WIPO (PCT)
Prior art keywords
substrate
reinforcing member
unit
transfer part
light output
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PCT/KR2016/009911
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French (fr)
Korean (ko)
Inventor
이순종
우봉주
정재훈
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(주)쎄미시스코
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Publication of WO2017086582A1 publication Critical patent/WO2017086582A1/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns

Definitions

  • the present invention relates to an optical sintering apparatus for preventing substrate damage, and more particularly, to prevent damage such as wrinkles of a substrate due to light or heat generated during optical sintering by adhering, adsorbing or compressing the substrate through a reinforcing member. And a substrate damage preventing optical sintering apparatus that can be suppressed.
  • Printing technology is a technology that uses ink to embed text or drawings drawn on a plate onto paper or cloth. Recently, various technologies such as inkjet printing, flexo printing, gravure printing, and screen printing have been used. . Since these technologies are applied to high value-added products such as RFID systems, large display devices, thin-film solar cells, thin-film batteries, and the like, the demand for the technology is gradually increasing.
  • the direct patterning technology through inkjet is a technique of forming a wiring by directly discharging a predetermined amount of ink to an accurate position through an inkjet head.
  • This technology has the advantage of shortening the manufacturing process and time as well as material costs.
  • conductive metal inks for direct patterning use nano inks using at least one of gold, silver or copper.
  • a key technology in inkjet printing is the method of sintering conductive inks. Until now, high temperature heat sintering processes have been mainly used to sinter various particles.
  • the heat sintering process is a method of heating to a temperature of about 200 °C to 350 °C in an inert gas state in order to sinter the metal nanoparticles, in addition to the laser sintering method that can be sintered at room temperature and atmospheric pressure.
  • the laser sintering method has only a sintering ability to a very small area, which causes a problem of poor practicality.
  • FIG. 1 is a photograph of a substrate in which damage is caused by light sintering.
  • the optical sintering method also uses a thin substrate made of a polymer such as a PI (Polyimide) film or the like, as shown in FIG. 1, the substrate is wrinkled or bent by the invention according to the intensity of the irradiated light and the irradiation of the light.
  • damage to the substrate such as.
  • the present invention is to solve the conventional problem, it is possible to prevent and suppress the occurrence of damage, such as wrinkles of the substrate by the light or heat generated during the light sintering by sticking, adsorbing or compressing the substrate through the reinforcing member It is an object of the present invention to provide an optical sintering apparatus for preventing substrate damage.
  • the substrate damage prevention optical sintering apparatus for achieving the object of the present invention as described above is to prevent the wrinkles generated during the sintering through the light output unit and the light output unit for sintering the electrically conductive ink printed on the substrate It includes a first reinforcing member provided on any one of the upper surface and the lower surface of the substrate.
  • the first reinforcing member may be an adhesive pad having one surface facing the substrate.
  • a substrate transfer unit which is provided under the light output unit to transfer the substrate may be further provided.
  • the substrate transfer unit is composed of a conveyor belt or a roller transfer unit using a plurality of rollers
  • the first reinforcing member may be provided to surround at least a portion of the substrate transfer unit.
  • the substrate transfer unit is provided at a position corresponding to the light output unit, the adhesive transfer portion and the front or rear of the adhesive transfer portion is provided to cover the area of the substrate and the first reinforcing member is provided. It may include a first auxiliary transfer unit provided on either side.
  • the substrate transfer part may further include a second auxiliary transfer part provided on the other side facing the first auxiliary transfer part based on the adhesive transfer part.
  • the apparatus may further include a second reinforcing member provided on the other surface of the substrate on which the first reinforcing member is provided.
  • a second reinforcing member driving unit for driving the second reinforcing member may be further provided.
  • the second reinforcing member driving unit may be configured as a roller conveying unit using a conveyor belt or a plurality of rollers, and the second reinforcing member may be provided to surround at least a part of the second reinforcing member driving unit.
  • the first reinforcing member may be an adsorption device having adsorption holes formed on one surface facing the substrate.
  • the substrate transfer unit for transferring the first reinforcing member may be further provided.
  • the substrate damage preventing optical sintering apparatus of the present invention has the following effects.
  • the substrate is fixed by at least one of adhesion, adsorption, or compression through a reinforcing member provided on at least one of the upper and lower surfaces of the substrate, thereby generating heat by light or light irradiated onto the substrate during optical sintering.
  • a reinforcing member provided on at least one of the upper and lower surfaces of the substrate, thereby generating heat by light or light irradiated onto the substrate during optical sintering.
  • the reinforcing member can be generally installed on the substrate transfer part, or only partially installed, so that the reinforcing member installation cost can be minimized according to the use mode.
  • 1 is a photograph of a substrate in which damage is caused by light sintering
  • FIG. 2 is a cross-sectional view of a substrate damage preventing optical sintering apparatus according to a first embodiment of the present invention
  • FIG. 3 is a perspective view of a substrate damage preventing optical sintering apparatus according to a second embodiment of the present invention.
  • FIG. 4 is a cross-sectional view of a substrate damage preventing optical sintering apparatus according to a second embodiment of the present invention.
  • FIG. 5 is a cross-sectional view showing a modification of the substrate damage preventing optical sintering apparatus according to the second embodiment of the present invention.
  • FIG. 6 is a cross-sectional view of a substrate damage preventing optical sintering apparatus according to a third embodiment of the present invention.
  • FIG. 7 is a cross-sectional view of a substrate damage preventing optical sintering apparatus according to a fourth embodiment of the present invention.
  • FIG. 8 is a perspective view of a first reinforcing member and a substrate transfer unit according to a fifth embodiment of the present invention.
  • FIG. 9 is a photograph of a substrate sintered by the substrate damage preventing optical sintering apparatus according to the present invention.
  • FIG. 2 is a cross-sectional view of a substrate damage preventing optical sintering apparatus according to a first embodiment of the present invention.
  • the substrate damage preventing optical sintering apparatus 10 according to the first embodiment of the present invention, as shown in FIG. 2, the light output unit 100, the first reinforcing member 210, and the second reinforcing member 220 are large. It consists of.
  • the light output unit 100 is configured to irradiate light for sintering electrically conductive ink such as micrometallic particles or precursors patterned on a substrate 500 such as a PI film.
  • the light output unit 100 includes a lamp unit 110, and may further include a reflecting plate 120 and an optical wavelength filter 130, depending on the usage.
  • the lamp unit 110 is a device for irradiating light for sintering the patterned electrically conductive ink on the substrate 500.
  • the lamp unit 110 may be any device as long as it is a device for irradiating light capable of sintering an electrically conductive ink.
  • a Xenon flash lamp Irradiation in the form is preferable.
  • the xenon flash lamp consists of a configuration comprising xenon gas injected into a cylindrical sealed quartz quartz tube. Xenon gas outputs light energy from input electric energy, and has an energy conversion rate of more than 50%.
  • xenon flash lamps are formed with metal electrodes such as tungsten to form anodes and cathodes on both sides thereof.
  • the xenon gas injected therein is ionized, and sparks are generated between the anode and the cathode.
  • the current flows for about 1000 Adml current for 1 ms to 10 ms through the spark generated in the lamp unit 110, and an arc plasma shape is generated in the lamp unit 110.
  • Light is generated.
  • the generated light appears to be white light because it contains a broad spectrum of wavelengths from 160 nm to 2.5 mm from ultraviolet to infrared.
  • any kind of lamp unit 110 may be used as long as the lamp unit 110 can achieve this object.
  • the reflector 120 is provided on the upper portion of the lamp unit 110 to reflect the light radiated upward from the lamp unit 110 and output the light toward the lower side.
  • the optical wavelength filter 130 is provided below the lamp unit 110 to filter only the microwave white light having a predetermined wavelength band.
  • the ultraviolet light emitted from the lamp unit 110 using the xenon flash lamp may damage the substrate 500 made of a polymer material, light of the ultraviolet band should be blocked, and according to the type of the substrate 500. It selectively blocks the wavelength band of the irradiated light.
  • the first reinforcing member 210 is provided on the lower surface of the substrate 500 to correspond to the area of the substrate 500 and is wrinkled on the substrate 500 made of a polymer material by light emitted from the light output unit 100. It is a device for preventing damage to the back.
  • the first reinforcing member 210 is preferably made of an area corresponding to the area of the substrate 500 or has a relatively larger area than the area of the substrate 500.
  • the first reinforcing member 210 having an area smaller than the area of the substrate 500 and smaller than the area of the substrate 500 may be formed. It is obvious that a plurality can be provided over.
  • the first reinforcing member 210 may be used as long as it can be adsorbed or adhered to the substrate 500 in order to prevent the substrate 500 from being deformed at the lower surface of the substrate 500.
  • the lower surface of the substrate 500 may be composed of an adhesive pad for adhering at least a portion of the substrate 500 to suppress deformation of the substrate 500.
  • the first reinforcing member 210 may use a pressure-sensitive adhesive pad having one side or both sides facing the substrate 500 and an adhesive pad, and the substrate may be provided to face the first reinforcing member 210 according to the use mode.
  • the material 500 may be made of any material as long as the material can be fixed so as not to be separated or floated from the first reinforcing member 210. For example, a rubber pad having a high friction force may be used.
  • the second reinforcing member 220 has an area corresponding to the area of the substrate 500 on the upper surface of the substrate 500, and the overall configuration is similar to that of the first reinforcing member 210. However, as the second reinforcing member 220 is provided between the light output unit 100 and the substrate 500, the second reinforcing member 220 may be transparent or semitransparent so as to transmit at least a portion of the light emitted from the light output unit 100. It is good to use a pad.
  • first reinforcing member 210 and the second reinforcing member 220 are respectively formed larger than the area of the substrate 500, only one of the first and second reinforcing members 210 and 220 is adhered. It may consist of pads. Even if either one is tacky, the substrate 500 provided between the first reinforcing member 210 and the second reinforcing member 220 is adhered to each other by any one of the remaining portions except for the area of the substrate 500. This is because it can stick and press.
  • the first and second reinforcing members 210 and 220 are provided on the bottom and the top of the substrate 500, respectively. And only one of the first reinforcing member 210 may be provided.
  • the first and second reinforcing members 210 and 220 are coupled to the lower and upper surfaces of the substrate 500, respectively, and then provided in the output direction of light emitted from the light output unit 100. It is seated on the supported support, or is mounted on the substrate transfer unit 300 for transporting the substrate 500.
  • the electrically conductive ink printed on the substrate 500 may be sintered.
  • the substrate 500 since the first reinforcing member 210 and the second reinforcing member 220 fix the substrate 500 by adhesive force, the substrate 500 may be deformed even when light is irradiated from the light output unit 100. Otherwise, deformation of the substrate 500 can be suppressed as much as possible.
  • FIG. 3 is a perspective view of a substrate damage preventing optical sintering apparatus according to a second embodiment of the present invention
  • Figure 4 is a cross-sectional view of a substrate damage preventing optical sintering apparatus according to a second embodiment of the present invention.
  • the substrate damage prevention optical sintering apparatus 10 according to the second embodiment of the present invention is composed of a light output unit 100, the substrate transfer unit 300 and the first reinforcing member 210 as shown in FIG. do.
  • the light output unit 100 has a similar configuration to that of the first embodiment, a detailed description thereof will be omitted.
  • the substrate transfer part 300 is an apparatus for transferring one or more substrates 500 in one or both directions.
  • the substrate transfer unit 300 is disposed to pass through the lower portion of the light output unit 100, the width of the substrate transfer unit 300 is provided to correspond to the width of the substrate 500 and the light output unit 100, the length is
  • the substrate 500 may be selectively determined in consideration of the number of substrates 500 to be seated and the transport distance of the substrate 500.
  • the substrate transfer unit 300 may be any device that transfers the substrate 500 through the light output unit 100 so as to sinter the electrically conductive ink printed on the substrate 500.
  • the first reinforcing member 210 is provided to surround at least a portion of the substrate transfer part 300, and may be used as long as the first reinforcing member 210 is able to suppress deformation of the substrate 500 by adhering or adsorbing the substrate 500. . However, it is preferable to use a pressure-sensitive adhesive pad having one surface facing the substrate 500. As such, the first reinforcing member 210 formed of an adhesive pad is provided to surround the entire surface of the substrate transfer part 300 such as a conveyor belt, or constitute the substrate transfer part 300 as shown in FIGS. 3 and 4. It can be provided to replace the belt or the like.
  • the first reinforcing member 210 having the above-described configuration transfers the substrate 500 in the driving direction of the substrate transfer unit 300 while the substrate 500 is adhered by driving the substrate transfer unit 300. At this time, since the substrate 500 is transferred to the first reinforcing member 210 made of an adhesive pad, the substrate 500 may float or crumple due to heat generated during sintering through the light output unit 100. Since the first reinforcing member 210 is fixed by the adhesive force, damage such as wrinkles of the substrate 500 is suppressed or prevented.
  • the first reinforcing member 210 does not completely cover the substrate transfer part 300, and corresponds to the size of the substrate 500. It may be provided with a plurality of sizes. In this case, the area of the first reinforcing member 210 may be the same as or larger than the area of the substrate 500, and the separation distance between the adjacent first reinforcing members 210 may be continuously supplied. Can be adjusted in consideration of the feed rate.
  • FIG. 6 is a cross-sectional view of a substrate damage preventing optical sintering apparatus according to a third embodiment of the present invention.
  • the substrate damage preventing optical sintering apparatus 10 according to the third embodiment of the present invention has a configuration similar to that of the second embodiment described above, as shown in FIG. 6. Therefore, only the substrate transfer part 300 and the first reinforcing member 210 which are different from the above-described second embodiment will be described in detail.
  • the substrate transfer part 300 includes an adhesive transfer part 310, a first auxiliary transfer part 320, and a second auxiliary transfer part 330.
  • the adhesive transfer unit 310 is provided such that the first reinforcing member 210 completely or partially encloses the adhesive transfer unit 310 similarly to the substrate transfer unit 300 of the second or second embodiment described above. . Consists of the configuration. However, the length of the adhesive transfer part 310 corresponds to one substrate 500 or is formed relatively large. The adhesive transfer unit 310 is preferably provided at a position corresponding to the light output unit 100 has a length that can pass only during the light sintering of one substrate 500.
  • the first auxiliary transfer unit 320 and the second auxiliary transfer unit 330 are respectively installed at the front and the rear of the adhesive transfer unit 310 along the transfer direction of the substrate 500.
  • the first auxiliary transfer unit 320 and the second auxiliary transfer unit 330 is generally composed of a conveyor belt or a roller transfer unit without the first reinforcing member 210 is provided.
  • the first auxiliary transfer unit 320 and the second auxiliary transfer unit 330 may be provided with only one or both.
  • the substrate 500 may be continuously supplied through the first auxiliary transfer part 320.
  • the first auxiliary transfer part 320 is not provided with the first reinforcing member 210 having adhesiveness or adsorption property, the substrate 500 is simply transferred on the first auxiliary transfer part 320.
  • the first substrate 500 passing from the first auxiliary transfer part 320 to the adhesive transfer part 310 is sequentially provided from the one side to which the adhesive transfer part 310 is attached to the adhesive transfer part 310. It is conveyed in the adhered state by the adhesive force of).
  • Light sintering is performed while the substrate 500 passes through the adhesive transfer part 310, and since the substrate 500 is adhered through the first reinforcing member 210 provided in the adhesive transfer part 310, the light is sintered. By sintering, damage such as wrinkles of the substrate 500 is suppressed and prevented.
  • the substrate 500 which has completed the optical sintering, passes through the adhesive transfer part 310 and moves to the second auxiliary transfer part 330.
  • the substrate 500 since the second auxiliary transfer part 330 is not provided with the first reinforcing member 210 having the adhesive force similarly to the first auxiliary transfer part 320, the substrate 500 is the second auxiliary transfer part from the adhesive transfer part 310.
  • the adhesive force is sequentially lost from one side moved to 330, and is simply transferred to the second auxiliary transfer part 330.
  • the substrate transfer part 300 has a first reinforcing member 210 provided only in the adhesive transfer part 310 having a shorter length than the second embodiment, thereby increasing the installation cost of the first reinforcement member 210. May decrease.
  • the substrate damage preventing optical sintering apparatus 10 includes a light output unit 100, a substrate transfer unit 300, a first reinforcing member 210, and a first substrate.
  • the second reinforcing member 220 and the second reinforcing member driving unit 400 is composed.
  • the substrate transfer unit 300 and the first reinforcing member 210 since the light output unit 100, the substrate transfer unit 300 and the first reinforcing member 210 is configured in a similar configuration to the above-described embodiments will not be described in detail. That is, the substrate transfer part 300 and the first reinforcement member 210 may adopt any one of the above-described second and third embodiments. Accordingly, the second reinforcing member 220 and the second reinforcing member driving unit 400 which are different from the above-described configuration will be described.
  • the second reinforcing member 220 is provided on the other surface of the substrate 500 that faces the first reinforcing member 210, that is, on the upper surface of the substrate 500. Along with 210, the substrate 500 is adhered and compressed at the top and bottom.
  • the second reinforcing member 220 may be formed of a pressure-sensitive adhesive pad having one surface facing the substrate 500.
  • the second reinforcing member driving unit 400 may be formed of a roller conveying unit using a conveyor belt or a plurality of rollers similarly to the substrate conveying unit 300, and the second reinforcing member 220 may be at least a part of the second reinforcing member driving unit 400. It may be provided to surround.
  • first reinforcing members 210 are partially provided on one side of the substrate transfer part 300, and the second reinforcing members 220 are also provided with the second reinforcing member driving part 400.
  • a plurality of partially provided on one side of the first reinforcing member 210 and the second reinforcing member 220 may be configured to be disposed in a position corresponding to each other.
  • the second reinforcing member 220 and the second reinforcing member driving unit 400 may have the same configuration as the first reinforcing member 210 and the substrate transfer unit 300 described above.
  • the second reinforcing member 220 is provided on the upper surface of the substrate 500, that is, one surface of the substrate 500 on which the electrically conductive ink is printed, at least a portion of the light emitted from the light output unit 100 may pass through. It is preferable to be made of a transparent or translucent material.
  • the second reinforcing member driving unit 400 may include a light output unit such that the second reinforcing member 220 may pass only one layer between the light output unit 100 and the substrate 500. 100) is preferably provided to surround.
  • the second reinforcing member driving unit is because the transmittance of light may be reduced to sinter the electrically conductive ink. 400 is formed in a shape surrounding the light output unit 100, it is preferable that the second reinforcing member 220 passes between the light output unit 100 and the substrate 500 by only one layer.
  • the second reinforcing member 220 may be driven separately using the substrate transfer unit 300 and a separate driving device, and depending on the use mode, the second reinforcing member 220 may be driven in conjunction with the driving force of the substrate transfer unit 300. It can also be configured to be.
  • the second reinforcing member driving unit 400 is provided with the second reinforcing member 220 inclined at a predetermined angle along the supply direction of the substrate 500 at one side to which the substrate 500 is supplied. It is preferable that the second reinforcing member 220 may be sequentially contacted from one side of the supply direction of the substrate 500 to the other side. As described above, when the second reinforcing member 220 sequentially contacts from one side to the other side according to the supply of the substrate 500, it is possible to more reliably prevent the unsintered electrically conductive ink from randomly spreading or spreading.
  • the substrate reinforcing member 300 is described with reference to the state in which the first reinforcing member 210 is provided, but the substrate reinforcing member 300 is not provided with the first reinforcing member 210 according to the usage.
  • the conveyor belt or the roller conveying unit may be used, and the substrate 500 may be used to fix the substrate 500 only through the second reinforcing member 220.
  • first reinforcing member 210 and the second reinforcing member 220 may be provided to have only one of the two adhesives.
  • FIG. 8 is a perspective view of a first reinforcing member and a substrate transfer unit according to a fifth embodiment of the present invention.
  • the substrate damage preventing optical sintering apparatus 10 according to the fifth embodiment of the present invention has a configuration similar to the above-described embodiments. However, as the configuration of the first reinforcing member 210 and the substrate transfer unit 300 is modified, it will be described below.
  • the first reinforcing member 210 includes an adsorption device having a plurality of adsorption holes formed on one surface facing the substrate 500 so as to adsorb and fix the substrate 500 by using vacuum adsorption.
  • an adsorption device may be any device as long as the device can adsorb the substrate 500 using vacuum adsorption to suppress and prevent deformation of the substrate 500.
  • the first reinforcing member 210 may correspond to the area of the substrate 500 or may be formed relatively large so that at least one or more substrates 500 may be seated thereon.
  • the substrate transfer part 300 is made of any configuration as long as it can transfer the first reinforcing member 210 made of an adsorption device to one or both sides so that the substrate 500 can move through the light output part 100. It is okay.
  • a substrate transfer unit 300 that can slide the first reinforcing member 210 using a hydraulic or pneumatic cylinder or the like.
  • the second reinforcing member 220 may be configured to be provided together with the first reinforcing member 210.
  • one of the first reinforcing member 210 and the second reinforcing member 220 may be provided to be elevated so as to compress the substrate 500 from the top and the bottom of at least the substrate 500. Any configuration may be used as long as it can be adhered, adsorbed, and pressed on one surface.
  • the first reinforcing member 210 and the second reinforcing member 220 may be disposed on at least one of the upper and lower surfaces of the substrate 500. Since the light sintering is performed in a state in which adhesion, adsorption, and compression are performed through the substrate, as illustrated in FIG. 9, the wrinkles of the substrate 500 may be compared with those of the substrate 500 in which the conventional light sintering is performed. It can be seen that the damage of the substrate 500 is significantly reduced.

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  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

A substrate damage preventing light sintering apparatus, according to the present invention, comprises: a light output unit for sintering electrically conductive ink printed on a substrate; and a first reinforcing member provided on any one of the upper surface and the lower surface of the substrate so as to prevent substrate warpage that occurs during sintering by means of the light output unit.

Description

기판 손상 방지 광 소결장치Substrate Damage Prevention Optical Sintering Equipment
본 발명은 기판 손상 방지 광 소결장치에 관한 것으로서, 보다 상세하게는 기판을 보강부재를 통해 점착, 흡착 또는 압착하여 광 소결 시 발생하는 광 또는 발열에 의해 기판의 구겨짐 등과 같은 손상이 발생하는 것을 방지 및 억제할 수 있는 기판 손상 방지 광 소결장치에 관한 것이다.The present invention relates to an optical sintering apparatus for preventing substrate damage, and more particularly, to prevent damage such as wrinkles of a substrate due to light or heat generated during optical sintering by adhering, adsorbing or compressing the substrate through a reinforcing member. And a substrate damage preventing optical sintering apparatus that can be suppressed.
인쇄기술이라 함은 잉크를 사용하여 판면에 그려져 있는 글이나 그림 따위를 종이, 천 따위에 박아내는 기술로서, 최근에는 잉크젯 프린팅, 플렉소 프린팅, 그라뷰어 프린팅 및 스크린 프린팅과 같은 다양한 기술이 사용되고 있다. 이러한 기술은 RFID 시스템, 대면적의 디스플레이 장치, 박판형 태양전지, 박판형 배터리 등과 같은 고부가 가치 상품에 적용되므로, 기술의 수요가 점차 증가하고 있다.Printing technology is a technology that uses ink to embed text or drawings drawn on a plate onto paper or cloth. Recently, various technologies such as inkjet printing, flexo printing, gravure printing, and screen printing have been used. . Since these technologies are applied to high value-added products such as RFID systems, large display devices, thin-film solar cells, thin-film batteries, and the like, the demand for the technology is gradually increasing.
특히, 잉크젯을 통한 다이렉트 패터닝 기술(Direct Patterning Technology)은 잉크젯 헤드를 통해 정량의 잉크를 정확한 위치에 직접 토출시켜 배선을 형성하는 기술이다. 이러한 기술은 재료비 절감뿐만 아니라 제조공정 및 시간을 단축할 수 있는 장점이 있다. 현재, 다이렉트 패터닝을 위한 도전성 금속 잉크로는 금, 은 또는 구리 중 적어도 어느 하나를 사용하는 나노 잉크를 사용한다. 잉크젯 프린팅에서 핵심기술은 전도성 잉크의 소결 방법인데 현재까지는 주로 다양한 입자들을 소결하기 위하여 고온의 열소결 공정이 사용되어 왔다. 열소결 공정은 금속 나노 입자를 소결시키기 위하여 비활성 기체 상태에서 약 200℃ 내지 350℃의 온도로 가열하는 방식이며, 이 밖에도 상온 및 대기압 상태에서의 소결이 가능한 레이저 소결법이 많이 사용되고 있다. In particular, the direct patterning technology through inkjet is a technique of forming a wiring by directly discharging a predetermined amount of ink to an accurate position through an inkjet head. This technology has the advantage of shortening the manufacturing process and time as well as material costs. At present, conductive metal inks for direct patterning use nano inks using at least one of gold, silver or copper. A key technology in inkjet printing is the method of sintering conductive inks. Until now, high temperature heat sintering processes have been mainly used to sinter various particles. The heat sintering process is a method of heating to a temperature of about 200 ℃ to 350 ℃ in an inert gas state in order to sinter the metal nanoparticles, in addition to the laser sintering method that can be sintered at room temperature and atmospheric pressure.
그러나 최근 플랙시블 저온 폴리머 또는 종이 위에 전자 패턴을 제작하려는 시도가 이루어지면서 고온 소결 방법은 인쇄 전자 산업 및 기술에 있어서 적용이 어려운 문제점이 있다. 또한, 구리는 열화학적 평형에 의하여 그 표면에 산화층이 형성되어 있어 소결이 매우 어렵고 소결 후에도 전도성이 감소하는 것으로 알려져 있다. However, as recent attempts have been made to fabricate electronic patterns on flexible low temperature polymers or paper, high temperature sintering methods have difficulty in application in the printed electronics industry and technology. In addition, copper is known to have an oxide layer formed on its surface due to thermochemical equilibrium, which is very difficult to sinter and decreases conductivity after sintering.
또한, 레이저 소결법은 극소면적에 대한 소결만이 가능하여 실용성이 떨어지는 문제점이 있다. In addition, the laser sintering method has only a sintering ability to a very small area, which causes a problem of poor practicality.
이러한 문제점들을 해결하기 위하여 광 소결방법을 이용한 소결법의 사용이 증대되고 있다. In order to solve these problems, the use of the sintering method using the optical sintering method is increasing.
도 1은 광 소결에 의해 손상이 발생된 기판의 사진이다. 하지만, 이러한 광 소결 방법 역시 PI(Polyimide)필름 등과 같이 폴리머 재질의 얇은 기판을 사용하는 경우에 도 1에 도시된 바와 같이, 조사되는 광의 강도 및 광의 조사에 따른 발명에 의해 기판이 구겨지거나, 휘어지는 등의 기판 손상이 발생하는 문제점이 있다. 1 is a photograph of a substrate in which damage is caused by light sintering. However, when the optical sintering method also uses a thin substrate made of a polymer such as a PI (Polyimide) film or the like, as shown in FIG. 1, the substrate is wrinkled or bent by the invention according to the intensity of the irradiated light and the irradiation of the light. There is a problem that damage to the substrate, such as.
본 발명은 종래의 문제를 해결하기 위한 것으로서, 기판을 보강부재를 통해 점착, 흡착 또는 압착하여 광 소결 시 발생하는 광 또는 발열에 의해 기판의 구겨짐 등과 같은 손상이 발생하는 것을 방지 및 억제할 수 있는 기판 손상 방지 광 소결장치를 제공하는데 그 목적이 있다.The present invention is to solve the conventional problem, it is possible to prevent and suppress the occurrence of damage, such as wrinkles of the substrate by the light or heat generated during the light sintering by sticking, adsorbing or compressing the substrate through the reinforcing member It is an object of the present invention to provide an optical sintering apparatus for preventing substrate damage.
본 발명의 목적은 여기에 제한되지 않으며, 언급되지 않은 또 다른 목적들은 아래의 기재로부터 당업자에게 명확하게 이해될 수 있을 것이다.The object of the present invention is not limited thereto, and other objects not mentioned will be clearly understood by those skilled in the art from the following description.
상기와 같은 본 발명의 목적을 달성하기 위한 기판 손상 방지 광 소결장치는 기판에 인쇄된 전기 전도성 잉크를 소결시키는 광 출력부 및 상기 광 출력부를 통한 소결 시 발생하는 상기 기판의 구겨짐을 방지하기 위하여 상기 기판의 상면 및 하면 중 어느 일면에 구비되는 제1보강부재를 포함한다.The substrate damage prevention optical sintering apparatus for achieving the object of the present invention as described above is to prevent the wrinkles generated during the sintering through the light output unit and the light output unit for sintering the electrically conductive ink printed on the substrate It includes a first reinforcing member provided on any one of the upper surface and the lower surface of the substrate.
이때, 상기 제1보강부재는 상기 기판과 대면하는 일면이 점착성을 갖는 점착패드일 수 있다. In this case, the first reinforcing member may be an adhesive pad having one surface facing the substrate.
또한, 상기 광 출력부의 하부에 구비되어 상기 기판을 이송시키는 기판 이송부가 더 구비될 수 있다. In addition, a substrate transfer unit which is provided under the light output unit to transfer the substrate may be further provided.
또한, 상기 기판 이송부는 컨베이어벨트 또는 복수의 롤러를 이용한 롤러 이송부로 구성되고, 상기 제1보강부재는 상기 기판 이송부의 적어도 일부를 감싸도록 구비될 수 있다. In addition, the substrate transfer unit is composed of a conveyor belt or a roller transfer unit using a plurality of rollers, the first reinforcing member may be provided to surround at least a portion of the substrate transfer unit.
또한, 상기 기판 이송부는, 상기 광 출력부와 대응되는 위치에 구비되고, 상기 기판의 면적과 대응되는 면적으로 이루어져 상기 제1보강부재가 감싸지도록 구비되는 점착 이송부 및 상기 점착 이송부의 전방 또는 후방 중 어느 일측에 구비되는 제1보조 이송부를 포함할 수 있다. In addition, the substrate transfer unit is provided at a position corresponding to the light output unit, the adhesive transfer portion and the front or rear of the adhesive transfer portion is provided to cover the area of the substrate and the first reinforcing member is provided. It may include a first auxiliary transfer unit provided on either side.
또한, 상기 기판 이송부는 상기 점착 이송부를 기준으로 상기 제1보조 이송부와 대향되는 타측에 구비되는 제2보조 이송부가 더 구비될 수 있다. The substrate transfer part may further include a second auxiliary transfer part provided on the other side facing the first auxiliary transfer part based on the adhesive transfer part.
또한, 상기 제1보강부재가 구비되는 상기 기판의 일면과 대향되는 타면에 구비되는 제2보강부재를 더 포함할 수 있다. The apparatus may further include a second reinforcing member provided on the other surface of the substrate on which the first reinforcing member is provided.
또한, 상기 제2보강부재를 구동시키는 제2보강부재 구동부가 더 구비될 수 있다. In addition, a second reinforcing member driving unit for driving the second reinforcing member may be further provided.
또한, 상기 제2보강부재 구동부는 컨베이어벨트 또는 복수의 롤러를 이용한 롤러 이송부로 구성되고, 상기 제2보강부재는 상기 제2보강부재 구동부의 적어도 일부를 감싸도록 구비될 수 있다. In addition, the second reinforcing member driving unit may be configured as a roller conveying unit using a conveyor belt or a plurality of rollers, and the second reinforcing member may be provided to surround at least a part of the second reinforcing member driving unit.
또한, 상기 제1보강부재는 상기 기판과 대면하는 일면에 흡착홀이 형성된 흡착장치일 수 있다. In addition, the first reinforcing member may be an adsorption device having adsorption holes formed on one surface facing the substrate.
또한, 상기 제1보강부재를 이송시키는 기판 이송부가 더 구비될 수 있다. In addition, the substrate transfer unit for transferring the first reinforcing member may be further provided.
본 발명의 기판 손상 방지 광 소결장치는 다음과 같은 효과가 있다.The substrate damage preventing optical sintering apparatus of the present invention has the following effects.
첫째, 기판의 상면 또는 하면 중 적어도 어느 일면에 구비되는 보강부재를 통해 기판을 점착, 흡착 또는 압착 중 적어도 어느 하나의 방법을 통해 고정함으로써 광 소결 시 기판에 조사되는 광 또는 광에 의한 발열에 의해 기판의 구겨짐과 같은 손상이 발생하는 것을 억제 및 방지할 수 있는 효과가 있다. First, the substrate is fixed by at least one of adhesion, adsorption, or compression through a reinforcing member provided on at least one of the upper and lower surfaces of the substrate, thereby generating heat by light or light irradiated onto the substrate during optical sintering. There is an effect that can suppress and prevent the occurrence of damage such as wrinkles of the substrate.
둘째, 보강부재를 기판 이송부 상에 구비함으로써 복수의 기판을 연속적으로 소결하더라도 모든 기판의 손상을 억제 및 방지할 수 있는 효과가 있다. Second, by providing the reinforcing member on the substrate transfer portion, even if the plurality of substrates are sintered continuously, there is an effect of preventing and preventing damage to all the substrates.
셋째, 보강부재를 기판 이송부 상에 전반적으로 설치하거나, 부분적으로만 설치 가능하여 사용양태에 따라 보강부재 설치 비용을 최소화할 수 있는 효과가 있다. Third, the reinforcing member can be generally installed on the substrate transfer part, or only partially installed, so that the reinforcing member installation cost can be minimized according to the use mode.
넷째, 기존의 광 소결장치에 보강부재만을 추가하여 설치함으로써 장치의 교체 없이 기존의 광 소결장치에 호환이 가능한 효과가 있다. Fourth, by installing only the reinforcing member to the existing optical sintering apparatus there is an effect compatible with the existing optical sintering apparatus without replacing the device.
본 발명의 효과들은 상기 언급한 효과에 제한되지 않으며, 언급되지 않은 또 다른 효과들은 청구범위의 기재로부터 당업자에게 명확하게 이해될 수 있을 것이다.The effects of the present invention are not limited to the above-mentioned effects, and other effects not mentioned will be clearly understood by those skilled in the art from the description of the claims.
본 명세서에서 첨부되는 다음의 도면들은 본 발명의 바람직한 실시예를 예시하는 것이며, 발명의 상세한 설명과 함께 본 발명의 기술사상을 더욱 이해시키는 역할을 하는 것이므로, 본 발명은 그러한 도면에 기재된 사항에만 한정되어 해석되어서는 아니 된다.The following drawings, which are attached in this specification, illustrate the preferred embodiments of the present invention, and together with the detailed description thereof, serve to further understand the technical spirit of the present invention, and therefore, the present invention is limited only to the matters described in the drawings. It should not be interpreted.
도 1은 광 소결에 의해 손상이 발생된 기판의 사진;1 is a photograph of a substrate in which damage is caused by light sintering;
도 2는 본 발명의 제1실시예에 따른 기판 손상 방지 광 소결장치의 단면도;2 is a cross-sectional view of a substrate damage preventing optical sintering apparatus according to a first embodiment of the present invention;
도 3은 본 발명의 제2실시예에 따른 기판 손상 방지 광 소결장치의 사시도;3 is a perspective view of a substrate damage preventing optical sintering apparatus according to a second embodiment of the present invention;
도 4는 본 발명의 제2실시예에 따른 기판 손상 방지 광 소결장치의 단면도;4 is a cross-sectional view of a substrate damage preventing optical sintering apparatus according to a second embodiment of the present invention;
도 5는 본 발명의 제2실시예에 따른 기판 손상 방지 광 소결장치의 변형예를 나타내는 단면도;5 is a cross-sectional view showing a modification of the substrate damage preventing optical sintering apparatus according to the second embodiment of the present invention;
도 6은 본 발명의 제3실시예에 따른 기판 손상 방지 광 소결장치의 단면도;6 is a cross-sectional view of a substrate damage preventing optical sintering apparatus according to a third embodiment of the present invention;
도 7은 본 발명의 제4실시예에 따른 기판 손상 방지 광 소결장치의 단면도; 7 is a cross-sectional view of a substrate damage preventing optical sintering apparatus according to a fourth embodiment of the present invention;
도 8은 본 발명의 제5실시예에 따른 제1보강부재 및 기판 이송부의 사시도; 및8 is a perspective view of a first reinforcing member and a substrate transfer unit according to a fifth embodiment of the present invention; And
도 9는 본 발명에 따른 기판 손상 방지 광 소결장치를 통해 소결된 기판의 사진이다. 9 is a photograph of a substrate sintered by the substrate damage preventing optical sintering apparatus according to the present invention.
이하, 첨부된 도면을 참조하여 본 발명의 바람직한 실시예를 상세하게 설명한다.Hereinafter, with reference to the accompanying drawings will be described in detail a preferred embodiment of the present invention.
제1실시예First embodiment
도 2는 본 발명의 제1실시예에 따른 기판 손상 방지 광 소결장치의 단면도이다. 본 발명의 제1실시예에 따른 기판 손상 방지 광 소결장치(10)는 도 2에 도시된 바와 같이, 크게 광 출력부(100), 제1보강부재(210) 및 제2보강부재(220)로 구성된다. 2 is a cross-sectional view of a substrate damage preventing optical sintering apparatus according to a first embodiment of the present invention. In the substrate damage preventing optical sintering apparatus 10 according to the first embodiment of the present invention, as shown in FIG. 2, the light output unit 100, the first reinforcing member 210, and the second reinforcing member 220 are large. It consists of.
광 출력부(100)는 도 2에 도시된 바와 같이, PI필름(Polyimide Film) 등의 기판(500) 상에 패터닝된 미세금속입자 또는 전구체와 같은 전기 전도성 잉크를 소결하기 위한 광을 조사하기 위한 장치이다. 이러한 광 출력부(100)는 램프 유닛(110)을 포함하며, 사용양태에 따라서는 반사판(120) 및 광파장 필터(130)를 더 포함하여 구성될 수 있다. As shown in FIG. 2, the light output unit 100 is configured to irradiate light for sintering electrically conductive ink such as micrometallic particles or precursors patterned on a substrate 500 such as a PI film. Device. The light output unit 100 includes a lamp unit 110, and may further include a reflecting plate 120 and an optical wavelength filter 130, depending on the usage.
램프 유닛(110)은 기판(500)에 패터닝된 전기 전도성 잉크를 소결하기 위한 광을 조사하는 장치이다. 이러한 램프 유닛(110)은 전기 전도성 잉크를 소결할 수 있는 광을 조사하는 장치라면 어떠한 장치를 사용하여도 무방하지만, 바람직하게는 제논 플래시 램프(Xenon Flash Lamp)를 사용하는 것이 좋으며, 백색광을 면 형태로 조사하는 것이 바람직하다. 제논 플래시 램프는 실린더 형상의 밀봉된 석영 석영튜브 안에 주입된 제논가스를 포함하는 구성으로 이루어진다. 제논가스는 입력 받은 전기에너지로부터 광 에너지를 출력하여, 50%가 넘는 에너지 변환율을 갖는다. 또한, 제논 플래시 램프는 내부 양쪽에 양극 및 음극 형성을 위해 텅스텐과 같은 금속전극이 형성된다. 이러한 구성으로 이루어진 램프 유닛(110)에 후술하는 높은 전원 및 전류를 인가 받으면, 내부에 주입된 제논가스가 이온화되고, 양극과 음극 사이로 스파크가 발생된다. 이때, 축전부에서 집적된 전하가 인가되면 램프 유닛(110) 내부에서 발생한 스파크를 통해 약 1000Adml 전류가 1ms 내지 10ms 동안 전류가 흐르면서 램프 유닛(110) 내부에는 아크 플라즈마 형상이 발생하고, 강한 세기의 광이 발생된다. 여기서 발생된 광은 160nm 내지 2.5mm 사이의 자외선부터 적외선까지의 넓은 파장대역의 광 스펙트럼을 내장하고 있기 때문에 백색광으로 보인다. 본 발명에서는 일실시예로서, 제논 플래시 램프를 기재하였지만, 이러한 목적을 달성할 수 있는 램프 유닛(110)이라면 어떠한 종류를 사용하더라도 무방하다.The lamp unit 110 is a device for irradiating light for sintering the patterned electrically conductive ink on the substrate 500. The lamp unit 110 may be any device as long as it is a device for irradiating light capable of sintering an electrically conductive ink. However, it is preferable to use a Xenon flash lamp. Irradiation in the form is preferable. The xenon flash lamp consists of a configuration comprising xenon gas injected into a cylindrical sealed quartz quartz tube. Xenon gas outputs light energy from input electric energy, and has an energy conversion rate of more than 50%. In addition, xenon flash lamps are formed with metal electrodes such as tungsten to form anodes and cathodes on both sides thereof. When the high power and current described later are applied to the lamp unit 110 having the above-described configuration, the xenon gas injected therein is ionized, and sparks are generated between the anode and the cathode. At this time, when the electric charge integrated in the power storage unit is applied, the current flows for about 1000 Adml current for 1 ms to 10 ms through the spark generated in the lamp unit 110, and an arc plasma shape is generated in the lamp unit 110. Light is generated. The generated light appears to be white light because it contains a broad spectrum of wavelengths from 160 nm to 2.5 mm from ultraviolet to infrared. Although the xenon flash lamp has been described as an embodiment in the present invention, any kind of lamp unit 110 may be used as long as the lamp unit 110 can achieve this object.
반사판(120)은 도 2에 도시된 바와 같이, 램프 유닛(110)의 상부에 구비되어 램프 유닛(110)으로부터 상부로 조사되는 광을 반사시켜 하부 방향으로 출력하도록 하는 장치이다. As shown in FIG. 2, the reflector 120 is provided on the upper portion of the lamp unit 110 to reflect the light radiated upward from the lamp unit 110 and output the light toward the lower side.
광파장 필터(130)는 도 2에 도시된 바와 같이, 램프 유닛(110)의 하부에 구비되어 기설정된 파장대역을 갖는 극단파 백색광만을 필터링한다. 특히, 제논 플래시 램프를 사용하는 램프 유닛(110)에서 조사되는 자외선광이 폴리머 재질로 이루어진 기판(500)을 손상시킬 수 있기 때문에 자외선 대역의 광을 차단하여야 하며, 기판(500)의 종류에 따라 조사되는 광의 파장대역을 선택적으로 차단한다.As shown in FIG. 2, the optical wavelength filter 130 is provided below the lamp unit 110 to filter only the microwave white light having a predetermined wavelength band. In particular, since the ultraviolet light emitted from the lamp unit 110 using the xenon flash lamp may damage the substrate 500 made of a polymer material, light of the ultraviolet band should be blocked, and according to the type of the substrate 500. It selectively blocks the wavelength band of the irradiated light.
제1보강부재(210)는 기판(500)의 하면에 기판(500)의 면적과 대응되는 면적으로 구비되어 광 출력부(100)에서 조사되는 광에 의해 폴리머 재질로 이루어진 기판(500)에 구겨짐 등의 손상이 발생하는 것을 방지하기 위한 장치이다. 이러한 제1보강부재(210)는 기판(500)의 면적과 대응되는 면적으로 이루어지거나, 기판(500)의 면적보다 상대적으로 큰 면적을 갖는 것이 바람직하다. 물론, 사용양태에 따라서는 기판(500)의 면적보다 상대적으로 작은 면적을 갖도록 형성할 수 있으며, 기판(500)의 면적보다 작은 면적을 갖는 제1보강부재(210)를 기판(500)의 전면적에 걸쳐 복수 구비할 수 있음은 자명한 것이다. 이와 같은 제1보강부재(210)는 기판(500)의 하면에서 기판(500)이 변형되는 것을 방지하기 위하여, 기판(500)의 흡착 또는 점착할 수 있는 것이라면 어떠한 장치를 사용하여도 무방하지만, 바람직하게는 기판(500)의 하부에서 기판(500)의 변형을 억제하도록 기판(500)의 적어도 일부를 점착하는 점착패드로 구성되는 것이 좋다. 이러한 제1보강부재(210)는 기판(500)과 대면하는 일면 또는 양측면에 점착제가 구비되어 있는 점착패드를 사용할 수 있으며, 사용양태에 따라서는 제1보강부재(210)와 대면하도록 구비되는 기판(500)이 제1보강부재(210)에서 이탈되거나 뜨지 않도록 고정할 수 있는 재질이라면 어떠한 재질로 이루어져도 무방하다. 일예로, 마찰력이 높은 고무패드 등을 사용할 수도 있다. The first reinforcing member 210 is provided on the lower surface of the substrate 500 to correspond to the area of the substrate 500 and is wrinkled on the substrate 500 made of a polymer material by light emitted from the light output unit 100. It is a device for preventing damage to the back. The first reinforcing member 210 is preferably made of an area corresponding to the area of the substrate 500 or has a relatively larger area than the area of the substrate 500. Of course, according to the use mode, the first reinforcing member 210 having an area smaller than the area of the substrate 500 and smaller than the area of the substrate 500 may be formed. It is obvious that a plurality can be provided over. The first reinforcing member 210 may be used as long as it can be adsorbed or adhered to the substrate 500 in order to prevent the substrate 500 from being deformed at the lower surface of the substrate 500. Preferably, the lower surface of the substrate 500 may be composed of an adhesive pad for adhering at least a portion of the substrate 500 to suppress deformation of the substrate 500. The first reinforcing member 210 may use a pressure-sensitive adhesive pad having one side or both sides facing the substrate 500 and an adhesive pad, and the substrate may be provided to face the first reinforcing member 210 according to the use mode. The material 500 may be made of any material as long as the material can be fixed so as not to be separated or floated from the first reinforcing member 210. For example, a rubber pad having a high friction force may be used.
제2보강부재(220)는 기판(500)의 상면에 기판(500)의 면적과 대응되는 면적으로 구비되고, 전체적은 구성은 제1보강부재(210)와 유사한 구성으로 이루어진다. 하지만, 제2보강부재(220)는 광 출력부(100)와 기판(500) 사이에 구비됨에 따라, 광 출력부(100)에서 조사되는 광의 적어도 일부가 투과될 수 있도록 투명 또는 반투명재질의 점착패드를 사용하는 것이 좋다. The second reinforcing member 220 has an area corresponding to the area of the substrate 500 on the upper surface of the substrate 500, and the overall configuration is similar to that of the first reinforcing member 210. However, as the second reinforcing member 220 is provided between the light output unit 100 and the substrate 500, the second reinforcing member 220 may be transparent or semitransparent so as to transmit at least a portion of the light emitted from the light output unit 100. It is good to use a pad.
만약, 제1보강부재(210) 및 제2보강부재(220)가 각각 기판(500)의 면적보다 크게 형성되는 경우에는 제1보강부재(210) 및 제2보강부재(220) 중 어느 하나만 점착패드로 이루어져도 무방하다. 둘 중 어느 하나만 점착성이 있더라도, 기판(500)의 면적을 제외한 나머지 부분이 어느 하나의 점착성에 의해 상호 점착되어 제1보강부재(210) 및 제2보강부재(220) 사이에 구비된 기판(500)을 점착 및 압착할 수 있기 때문이다. If the first reinforcing member 210 and the second reinforcing member 220 are respectively formed larger than the area of the substrate 500, only one of the first and second reinforcing members 210 and 220 is adhered. It may consist of pads. Even if either one is tacky, the substrate 500 provided between the first reinforcing member 210 and the second reinforcing member 220 is adhered to each other by any one of the remaining portions except for the area of the substrate 500. This is because it can stick and press.
본 실시예에서는 기판(500)의 하면 및 상면에 각각 제1보강부재(210) 및 제2보강부재(220)가 구비되는 것을 기준으로 설명하고 있으나, 사용양태에 따라서는 제1보강부재(210) 및 제1보강부재(210) 중 어느 하나만 구비되어도 무방하다. In the present exemplary embodiment, the first and second reinforcing members 210 and 220 are provided on the bottom and the top of the substrate 500, respectively. And only one of the first reinforcing member 210 may be provided.
전술한 구성과 같이, 기판(500)의 하면 및 상면에 각각 제1보강부재(210) 및 제2보강부재(220)를 결합 시킨 후, 광 출력부(100)에서 조사되는 광의 출력방향에 구비된 지지대에 안착시키거나, 기판(500)을 이송하는 기판 이송부(300) 상에 안착시킨다. As described above, the first and second reinforcing members 210 and 220 are coupled to the lower and upper surfaces of the substrate 500, respectively, and then provided in the output direction of light emitted from the light output unit 100. It is seated on the supported support, or is mounted on the substrate transfer unit 300 for transporting the substrate 500.
이후, 광 출력부(100)에서 조사되는 광을 이용하여 기판(500)에 광을 조사함으로써, 기판(500)상에 인쇄된 전기 전도성 잉크를 소결시킬 수 있다. 이때, 제1보강부재(210) 및 제2보강부재(220)가 점착력에 의해 기판(500)을 고정하고 있기 때문에, 광 출력부(100)에서 광이 조사되더라도 기판(500)은 변형이 발생하지 않거나, 기판(500)의 변형을 최대한 억제할 수 있다.Thereafter, by irradiating light onto the substrate 500 using the light emitted from the light output unit 100, the electrically conductive ink printed on the substrate 500 may be sintered. At this time, since the first reinforcing member 210 and the second reinforcing member 220 fix the substrate 500 by adhesive force, the substrate 500 may be deformed even when light is irradiated from the light output unit 100. Otherwise, deformation of the substrate 500 can be suppressed as much as possible.
제2실시예Second embodiment
도 3은 본 발명의 제2실시예에 따른 기판 손상 방지 광 소결장치의 사시도이고, 도 4는 본 발명의 제2실시예에 따른 기판 손상 방지 광 소결장치의 단면도이다. 본 발명의 제2실시예에 따른 기판 손상 방지 광 소결장치(10)는 도 3에 도시된 바와 같이, 크게 광 출력부(100), 기판 이송부(300) 및 제1보강부재(210)로 구성된다. 3 is a perspective view of a substrate damage preventing optical sintering apparatus according to a second embodiment of the present invention, Figure 4 is a cross-sectional view of a substrate damage preventing optical sintering apparatus according to a second embodiment of the present invention. The substrate damage prevention optical sintering apparatus 10 according to the second embodiment of the present invention is composed of a light output unit 100, the substrate transfer unit 300 and the first reinforcing member 210 as shown in FIG. do.
광 출력부(100)는 전술한 제1실시예와 유사한 구성으로 이루어지기 때문에 상세한 설명은 생략하기로 한다. Since the light output unit 100 has a similar configuration to that of the first embodiment, a detailed description thereof will be omitted.
기판 이송부(300)는 적어도 하나 이상의 기판(500)을 일방 또는 양방으로 이송하는 장치이다. 이러한 기판 이송부(300)는 광 출력부(100)의 하부를 통과하도록 배치되며, 기판 이송부(300)의 폭은 기판(500) 및 광 출력부(100)의 폭과 대응되도록 구비되고, 길이는 안착되는 기판(500)의 개수 및 기판(500) 이송 거리 등을 고려하여 선택적으로 결정될 수 있다. 이처럼 기판 이송부(300)는 기판(500)을 광 출력부(100)를 통과하며 기판(500)에 인쇄된 전기 전도성 잉크를 소결할 수 있도록 이송하는 장치라면 어떠한 장치를 사용하여도 무방하지만, 바람직하게는 컨베이어벨트, 복수의 롤러로 구성된 롤러 이송부 또는 상호 이격된 롤러를 벨트 등으로 감싸도록 구비되는 이송부 등을 사용하는 것이 좋다. The substrate transfer part 300 is an apparatus for transferring one or more substrates 500 in one or both directions. The substrate transfer unit 300 is disposed to pass through the lower portion of the light output unit 100, the width of the substrate transfer unit 300 is provided to correspond to the width of the substrate 500 and the light output unit 100, the length is The substrate 500 may be selectively determined in consideration of the number of substrates 500 to be seated and the transport distance of the substrate 500. As such, the substrate transfer unit 300 may be any device that transfers the substrate 500 through the light output unit 100 so as to sinter the electrically conductive ink printed on the substrate 500. Preferably, it is preferable to use a conveyor belt, a roller conveying part consisting of a plurality of rollers, or a conveying part provided to surround rollers spaced apart from each other with a belt or the like.
제1보강부재(210)는 기판 이송부(300)의 적어도 일부를 감싸도록 구비되어, 기판(500)을 점착 또는 흡착하여 기판(500)의 변형을 억제할 수 있는 것이라면 어떠한 것을 사용하여도 무방하다. 하지만, 바람직하게는 기판(500)과 대면하는 일면이 점착성을 갖는 점착패드를 사용하는 것이 좋다. 이와 같이, 점착패드로 구성된 제1보강부재(210)는 도 3 및 도 4에 도시된 바와 같이, 컨베이어벨트 등과 같은 기판 이송부(300)의 전면적을 감싸도록 구비되거나, 기판 이송부(300)를 구성하는 벨트 등을 대체하여 구비될 수 있다. 전술한 구성으로 이루어진 제1보강부재(210)는 기판 이송부(300)의 구동을 통해 기판(500)이 점착된 상태로 기판 이송부(300)의 구동방향에 따라 기판(500)을 이송시킨다. 이때, 기판(500)은 점착패드로 이루어진 제1보강부재(210)에 점착된 상태로 이송되기 때문에 광 출력부(100)를 통한 소결 시 발생하는 발열 등에 의해 기판(500)이 뜨거나 구겨지는 것을 제1보강부재(210)가 점착력에 의해 고정하기 때문에 기판(500)의 구겨짐과 같은 손상이 억제 또는 방지된다. The first reinforcing member 210 is provided to surround at least a portion of the substrate transfer part 300, and may be used as long as the first reinforcing member 210 is able to suppress deformation of the substrate 500 by adhering or adsorbing the substrate 500. . However, it is preferable to use a pressure-sensitive adhesive pad having one surface facing the substrate 500. As such, the first reinforcing member 210 formed of an adhesive pad is provided to surround the entire surface of the substrate transfer part 300 such as a conveyor belt, or constitute the substrate transfer part 300 as shown in FIGS. 3 and 4. It can be provided to replace the belt or the like. The first reinforcing member 210 having the above-described configuration transfers the substrate 500 in the driving direction of the substrate transfer unit 300 while the substrate 500 is adhered by driving the substrate transfer unit 300. At this time, since the substrate 500 is transferred to the first reinforcing member 210 made of an adhesive pad, the substrate 500 may float or crumple due to heat generated during sintering through the light output unit 100. Since the first reinforcing member 210 is fixed by the adhesive force, damage such as wrinkles of the substrate 500 is suppressed or prevented.
(( 변형예Variant ))
도 5는 본 발명의 제2실시예에 따른 기판 손상 방지 광 소결장치의 변형예를 나타내는 단면도이다. 제2실시예에 따른 기판 손상 방지 광 소결장치(10)는 도 5에 도시된 바와 같이, 제1보강부재(210)가 기판 이송부(300)를 전체적으로 감싸지 않고, 기판(500)의 크기와 대응되는 크기로 복수 구비될 수 있다. 이때, 제1보강부재(210)의 면적은 기판(500)의 면적과 동일하거나, 상대적으로 크게 형성될 수 있으며, 상호 인접한 제1보강부재(210)의 이격거리는 연속적으로 공급되는 기판(500)의 공급속도 등을 고려하여 조절할 수 있다. 5 is a cross-sectional view showing a modification of the substrate damage preventing optical sintering apparatus according to the second embodiment of the present invention. In the substrate damage preventing optical sintering apparatus 10 according to the second embodiment, as shown in FIG. 5, the first reinforcing member 210 does not completely cover the substrate transfer part 300, and corresponds to the size of the substrate 500. It may be provided with a plurality of sizes. In this case, the area of the first reinforcing member 210 may be the same as or larger than the area of the substrate 500, and the separation distance between the adjacent first reinforcing members 210 may be continuously supplied. Can be adjusted in consideration of the feed rate.
제3실시예Third embodiment
도 6은 본 발명의 제3실시예에 따른 기판 손상 방지 광 소결장치의 단면도이다. 본 발명의 제3실시예에 따른 기판 손상 방지 광 소결장치(10)는 도 6에 도시된 바와 같이, 전체적으로 전술한 제2실시예와 유사한 구성으로 이루어진다. 따라서, 전술한 제2실시예와 차이가 있는 기판 이송부(300) 및 제1보강부재(210)에 대해서만 상세하게 설명하기로 한다. 6 is a cross-sectional view of a substrate damage preventing optical sintering apparatus according to a third embodiment of the present invention. The substrate damage preventing optical sintering apparatus 10 according to the third embodiment of the present invention has a configuration similar to that of the second embodiment described above, as shown in FIG. 6. Therefore, only the substrate transfer part 300 and the first reinforcing member 210 which are different from the above-described second embodiment will be described in detail.
본 발명의 제3실시예에 따른 기판 이송부(300)는 도 6에 도시된 바와 같이, 점착 이송부(310), 제1보조 이송부(320) 및 제2보조 이송부(330)로 구성된다. As shown in FIG. 6, the substrate transfer part 300 according to the third embodiment of the present invention includes an adhesive transfer part 310, a first auxiliary transfer part 320, and a second auxiliary transfer part 330.
점착 이송부(310)는 전술한 제2실시예 또는 제2실시예의 변형예의 기판 이송부(300)와 마찬가지로 제1보강부재(210)가 점착 이송부(310)를 전체적으로 감싸거나, 부분적으로 감싸도록 구비된다. 구성으로 이루어진다. 하지만, 점착 이송부(310)의 길이는 하나의 기판(500)과 대응되거나, 상대적으로 조금 크게 형성된다. 이러한 점착 이송부(310)는 광 출력부(100)와 대응되는 위치에 구비되어 하나의 기판(500)의 광 소결이 이루어지는 동안만 통과할 수 있는 길이를 갖는 것이 바람직하다. The adhesive transfer unit 310 is provided such that the first reinforcing member 210 completely or partially encloses the adhesive transfer unit 310 similarly to the substrate transfer unit 300 of the second or second embodiment described above. . Consists of the configuration. However, the length of the adhesive transfer part 310 corresponds to one substrate 500 or is formed relatively large. The adhesive transfer unit 310 is preferably provided at a position corresponding to the light output unit 100 has a length that can pass only during the light sintering of one substrate 500.
제1보조 이송부(320) 및 제2보조 이송부(330)는 각각 기판(500)의 이송방향을 따라 점착 이송부(310)의 전방 및 후방에 설치된다. 이때, 제1보조 이송부(320) 및 제2보조 이송부(330)는 제1보강부재(210)가 구비되지 않은 일반적은 컨베이어벨트 또는 롤러 이송부 등으로 구성된다. 사용양태에 따라서 제1보조 이송부(320) 및 제2보조 이송부(330)는 둘 중 하나만 구비되거나, 둘 모두 구비되지 않아도 무방하다. The first auxiliary transfer unit 320 and the second auxiliary transfer unit 330 are respectively installed at the front and the rear of the adhesive transfer unit 310 along the transfer direction of the substrate 500. In this case, the first auxiliary transfer unit 320 and the second auxiliary transfer unit 330 is generally composed of a conveyor belt or a roller transfer unit without the first reinforcing member 210 is provided. Depending on the use mode, the first auxiliary transfer unit 320 and the second auxiliary transfer unit 330 may be provided with only one or both.
전술한 구성으로 이루어지는 제3실시예에 따른 기판 이송부(300)의 사용양태를 설명하면 다음과 같다. The usage mode of the substrate transfer part 300 according to the third embodiment having the above-described configuration will be described below.
도 6에 도시된 바와 같이, 기판(500)은 제1보조 이송부(320)를 통해 연속적으로 공급될 수 있다. 이때, 제1보조 이송부(320)는 점착성 또는 흡착성을 갖는 제1보강부재(210)가 구비되지 않기 때문에 기판(500)은 단순히 제1보조 이송부(320) 상에 안착된 상태로 이송된다. As shown in FIG. 6, the substrate 500 may be continuously supplied through the first auxiliary transfer part 320. At this time, since the first auxiliary transfer part 320 is not provided with the first reinforcing member 210 having adhesiveness or adsorption property, the substrate 500 is simply transferred on the first auxiliary transfer part 320.
이 후, 제1보조 이송부(320)에서 점착 이송부(310)로 넘어가는 기판(500)은 점착 이송부(310)와 접착하는 일측부터 순차적으로 점착 이송부(310)에 구비된 제1보강부재(210)의 점착력에 의해 점착된 상태로 이송된다. Subsequently, the first substrate 500 passing from the first auxiliary transfer part 320 to the adhesive transfer part 310 is sequentially provided from the one side to which the adhesive transfer part 310 is attached to the adhesive transfer part 310. It is conveyed in the adhered state by the adhesive force of).
기판(500)은 점착 이송부(310)를 통과하는 동안 광 소결이 이루어지고, 광 소결 시 기판(500)은 점착 이송부(310)에 구비된 제1보강부재(210)를 통해 점착되어 있기 때문에 광 소결에 의해 기판(500)의 구겨짐 등과 같은 손상이 억제 및 방지된다. Light sintering is performed while the substrate 500 passes through the adhesive transfer part 310, and since the substrate 500 is adhered through the first reinforcing member 210 provided in the adhesive transfer part 310, the light is sintered. By sintering, damage such as wrinkles of the substrate 500 is suppressed and prevented.
다음으로, 광 소결이 완료된 기판(500)은 점착 이송부(310)를 통과하여 제2보조 이송부(330)로 이동한다. 이때, 제2보조 이송부(330)는 제1보조 이송부(320)와 마찬가지로 점착력을 갖는 제1보강부재(210)가 구비되어 있지 않기 때문에 기판(500)은 점착 이송부(310)에서 제2보조 이송부(330)로 이동되는 일측부터 순차적으로 점착력을 잃고, 단순히 제2보조 이송부(330) 상에 안착된 상태로 이송된다. Next, the substrate 500, which has completed the optical sintering, passes through the adhesive transfer part 310 and moves to the second auxiliary transfer part 330. At this time, since the second auxiliary transfer part 330 is not provided with the first reinforcing member 210 having the adhesive force similarly to the first auxiliary transfer part 320, the substrate 500 is the second auxiliary transfer part from the adhesive transfer part 310. The adhesive force is sequentially lost from one side moved to 330, and is simply transferred to the second auxiliary transfer part 330.
이처럼, 제3실시예에 따른 기판 이송부(300)는 제2실시예보다 짧은 길이의 점착 이송부(310)에만 제1보강부재(210)가 구비됨에 따라 제1보강부재(210)의 설치비용을 감소할 수 있다. As such, the substrate transfer part 300 according to the third embodiment has a first reinforcing member 210 provided only in the adhesive transfer part 310 having a shorter length than the second embodiment, thereby increasing the installation cost of the first reinforcement member 210. May decrease.
제4실시예Fourth embodiment
도 7은 본 발명의 제4실시예에 따른 기판 손상 방지 광 소결장치의 단면도이다. 본 발명의 제4실시예에 따른 기판 손상 방지 광 소결장치(10)는 도 7에 도시된 바와 같이, 크게 광 출력부(100), 기판 이송부(300), 제1보강부재(210), 제2보강부재(220) 및 제2보강부재 구동부(400)로 구성된다. 7 is a cross-sectional view of a substrate damage preventing optical sintering apparatus according to a fourth embodiment of the present invention. As shown in FIG. 7, the substrate damage preventing optical sintering apparatus 10 according to the fourth embodiment of the present invention includes a light output unit 100, a substrate transfer unit 300, a first reinforcing member 210, and a first substrate. The second reinforcing member 220 and the second reinforcing member driving unit 400 is composed.
여기서, 광 출력부(100), 기판 이송부(300) 및 제1보강부재(210)는 전술한 실시예들과 유사한 구성으로 이루어지기 때문에 상세한 설명은 생략하기로 한다. 즉, 기판 이송부(300) 및 제1보강부재(210)는 전술한 제2실시예 및 제3실시예 중 어느 하나의 구성을 채택하여 사용할 수 있다. 이에 따라, 전술한 구성들과 차이가 있는 제2보강부재(220) 및 제2보강부재 구동부(400)를 중심으로 설명하기로 한다. Here, since the light output unit 100, the substrate transfer unit 300 and the first reinforcing member 210 is configured in a similar configuration to the above-described embodiments will not be described in detail. That is, the substrate transfer part 300 and the first reinforcement member 210 may adopt any one of the above-described second and third embodiments. Accordingly, the second reinforcing member 220 and the second reinforcing member driving unit 400 which are different from the above-described configuration will be described.
제2보강부재(220)는 제1실시예와 마찬가지로 제1보강부재(210)와 대면하는 기판(500)의 일면과 대향되는 타면, 즉, 기판(500)의 상면에 구비되어 제1보강부재(210)와 함께 기판(500)을 상부 및 하부에서 점착 및 압착한다. 이때, 제2보강부재(220)는 기판(500)과 대면하는 일면이 점착력을 갖는 점착패드로 이루어질 수 있다. As in the first embodiment, the second reinforcing member 220 is provided on the other surface of the substrate 500 that faces the first reinforcing member 210, that is, on the upper surface of the substrate 500. Along with 210, the substrate 500 is adhered and compressed at the top and bottom. In this case, the second reinforcing member 220 may be formed of a pressure-sensitive adhesive pad having one surface facing the substrate 500.
제2보강부재 구동부(400)는 기판 이송부(300)와 마찬가지로 컨베이어벨트 또는 복수의 롤러를 이용한 롤러 이송부로 이루어질 수 있으며, 제2보강부재(220)는 제2보강부재 구동부(400)의 적어도 일부를 감싸도록 구비될 수 있다. The second reinforcing member driving unit 400 may be formed of a roller conveying unit using a conveyor belt or a plurality of rollers similarly to the substrate conveying unit 300, and the second reinforcing member 220 may be at least a part of the second reinforcing member driving unit 400. It may be provided to surround.
만약, 제1보강부재(210)가 제2실시예의 변형예와 같이, 기판 이송부(300)의 일측에 부분적으로 복수 구비되고, 제2보강부재(220)가 역시 제2보강부재 구동부(400)의 일측에 부분적으로 복수 구비되는 경우에는 제1보강부재(210) 및 제2보강부재(220)가 상호 대응되는 위치에 배치되도록 구성하는 것이 좋다. If, as in the modification of the second embodiment, a plurality of first reinforcing members 210 are partially provided on one side of the substrate transfer part 300, and the second reinforcing members 220 are also provided with the second reinforcing member driving part 400. When a plurality of partially provided on one side of the first reinforcing member 210 and the second reinforcing member 220 may be configured to be disposed in a position corresponding to each other.
즉, 제2보강부재(220) 및 제2보강부재 구동부(400)는 전술한 제1보강부재(210) 및 기판 이송부(300)와 동일한 구성을 갖도록 이루어질 수 있다. That is, the second reinforcing member 220 and the second reinforcing member driving unit 400 may have the same configuration as the first reinforcing member 210 and the substrate transfer unit 300 described above.
하지만, 제2보강부재(220)는 기판(500)의 상면, 즉, 전기 전도성 잉크가 인쇄된 기판(500)의 일면에 구비됨에 따라 광 출력부(100)에서 조사되는 광의 적어도 일부가 통과할 수 있도록 투명 또는 반투명재질로 이루어지는 것이 좋다. However, as the second reinforcing member 220 is provided on the upper surface of the substrate 500, that is, one surface of the substrate 500 on which the electrically conductive ink is printed, at least a portion of the light emitted from the light output unit 100 may pass through. It is preferable to be made of a transparent or translucent material.
또한, 제2보강부재 구동부(400)는 도 7에 도시된 바와 같이, 제2보강부재(220)가 광 출력부(100)와 기판(500) 사이에 한 겹만 통과할 수 있도록 광 출력부(100)를 감싸도록 구비되는 것이 좋다. 광 출력부(100)와 기판(500) 사이에 제2보강부재(220)가 두 겹 이상 통과하는 경우에는 광의 투과율이 감소되어 전기 전도성 잉크의 소결이 용이하지 않을 수 있기 때문에 제2보강부재 구동부(400)가 광 출력부(100)를 감싸는 형상으로 이루어져 광 출력부(100)와 기판(500) 사이에 제2보강부재(220)가 한 겹만 통과하도록 구비되는 것이 좋다. In addition, as shown in FIG. 7, the second reinforcing member driving unit 400 may include a light output unit such that the second reinforcing member 220 may pass only one layer between the light output unit 100 and the substrate 500. 100) is preferably provided to surround. When the second reinforcing member 220 passes through two or more layers between the light output unit 100 and the substrate 500, the second reinforcing member driving unit is because the transmittance of light may be reduced to sinter the electrically conductive ink. 400 is formed in a shape surrounding the light output unit 100, it is preferable that the second reinforcing member 220 passes between the light output unit 100 and the substrate 500 by only one layer.
또한, 제2보강부재(220)는 기판 이송부(300)와 별도의 구동장치를 이용하여 개별적으로 구동될 수 있으며, 사용양태에 따라서는 기판 이송부(300)의 구동력을 이용하여 그에 따라 연동되어 구동될 수 있도록 구성할 수도 있다. In addition, the second reinforcing member 220 may be driven separately using the substrate transfer unit 300 and a separate driving device, and depending on the use mode, the second reinforcing member 220 may be driven in conjunction with the driving force of the substrate transfer unit 300. It can also be configured to be.
또한, 제2보강부재 구동부(400)는 도 7에 도시된 바와 같이, 기판(500)이 공급되는 일측에서는 제2보강부재(220)가 기판(500)의 공급방향을 따라 소정각도 경사지게 구비되어 기판(500)의 공급방향의 일측에서부터 타측으로 순차적으로 제2보강부재(220)가 접촉할 수 있도록 구비되는 것이 좋다. 이처럼, 제2보강부재(220)가 기판(500)의 공급에 따라 일측에서 타측으로 순차적으로 접촉하면 소결되지 않은 전기 전도성 잉크가 임의로 확산되거나 번지는 것을 보다 확실하게 방지할 수 있기 때문이다. In addition, as shown in FIG. 7, the second reinforcing member driving unit 400 is provided with the second reinforcing member 220 inclined at a predetermined angle along the supply direction of the substrate 500 at one side to which the substrate 500 is supplied. It is preferable that the second reinforcing member 220 may be sequentially contacted from one side of the supply direction of the substrate 500 to the other side. As described above, when the second reinforcing member 220 sequentially contacts from one side to the other side according to the supply of the substrate 500, it is possible to more reliably prevent the unsintered electrically conductive ink from randomly spreading or spreading.
본 실시예에서는 기판 이송부(300)에 제1보강부재(210)가 구비된 상태를 기준으로 설명하고 있지만, 사용양태에 따라서 기판 이송부(300)에는 제1보강부재(210)가 구비되지 않는 일반적이 컨베이어벨트 또는 롤러 이송부를 사용하고, 제2보강부재(220)만을 통해 기판(500)을 고정하도록 사용할 수도 있다. In the present embodiment, the substrate reinforcing member 300 is described with reference to the state in which the first reinforcing member 210 is provided, but the substrate reinforcing member 300 is not provided with the first reinforcing member 210 according to the usage. The conveyor belt or the roller conveying unit may be used, and the substrate 500 may be used to fix the substrate 500 only through the second reinforcing member 220.
또한, 제1보강부재(210) 및 제2보강부재(220)는 제1실시예에서 설명한 바와 같이, 둘 중 어느 하나만 점착성을 갖도록 구비될 수도 있다. In addition, as described in the first embodiment, the first reinforcing member 210 and the second reinforcing member 220 may be provided to have only one of the two adhesives.
제5실시예Fifth Embodiment
도 8은 본 발명의 제5실시예에 따른 제1보강부재 및 기판 이송부의 사시도이다. 본 발명의 제5실시예에 따른 기판 손상 방지 광 소결장치(10)는 전술한 실시예들과 유사한 구성으로 이루어진다. 하지만, 제1보강부재(210) 및 기판 이송부(300)의 구성이 변형됨에 따라 이를 중심으로 설명하기로 한다. 8 is a perspective view of a first reinforcing member and a substrate transfer unit according to a fifth embodiment of the present invention. The substrate damage preventing optical sintering apparatus 10 according to the fifth embodiment of the present invention has a configuration similar to the above-described embodiments. However, as the configuration of the first reinforcing member 210 and the substrate transfer unit 300 is modified, it will be described below.
제1보강부재(210)는 전술한 실시예들과 달리 진공흡착을 이용하여 기판(500)을 흡착하여 고정시킬 수 있도록 기판(500)과 대면하는 일면에 복수의 흡착홀이 형성된 흡착장치로 구성될 수 있다. 이러한 흡착장치는 진공 흡착을 이용하여 기판(500)을 흡착하여 기판(500)의 변형을 억제 및 방지할 수 있는 장치라면 어떠한 장치를 사용하여도 무방하다. 이때, 제1보강부재(210)는 적어도 하나 이상의 기판(500)이 안착될 수 있도록, 기판(500)의 면적과 대응되거나, 상대적으로 크게 형성되는 것이 좋다.Unlike the above-described embodiments, the first reinforcing member 210 includes an adsorption device having a plurality of adsorption holes formed on one surface facing the substrate 500 so as to adsorb and fix the substrate 500 by using vacuum adsorption. Can be. Such an adsorption device may be any device as long as the device can adsorb the substrate 500 using vacuum adsorption to suppress and prevent deformation of the substrate 500. In this case, the first reinforcing member 210 may correspond to the area of the substrate 500 or may be formed relatively large so that at least one or more substrates 500 may be seated thereon.
기판 이송부(300)는 기판(500)이 광 출력부(100)를 통과하여 이동할 수 있도록, 흡착장치로 이루어진 제1보강부재(210)를 일방 또는 양방으로 이송시킬 수 있는 장치라면 어떠한 구성으로 이루어져도 무방하다. 바람직하게는 도 8에 도시된 바와 같이, 유압 또는 공압 실린더 등을 이용하여 제1보강부재(210)를 슬라이딩 시킬 수 있는 기판 이송부(300)를 사용하는 것이 좋다. The substrate transfer part 300 is made of any configuration as long as it can transfer the first reinforcing member 210 made of an adsorption device to one or both sides so that the substrate 500 can move through the light output part 100. It is okay. Preferably, as shown in Figure 8, it is preferable to use a substrate transfer unit 300 that can slide the first reinforcing member 210 using a hydraulic or pneumatic cylinder or the like.
본 실시예에서는 제1실시예 또는 제4실시예와 같이, 제2보강부재(220)가 제1보강부재(210)와 함께 구비되도록 구성될 수 있음은 자명하다. In this embodiment, as in the first embodiment or the fourth embodiment, it is apparent that the second reinforcing member 220 may be configured to be provided together with the first reinforcing member 210.
전술한 실시예들 외에 제1보강부재(210) 및 제2보강부재(220) 중 하나가 승강 가능하게 구비되어 기판(500)을 상부 및 하부에서 압착할 수 있는 구성 등 기판(500)의 적어도 일면을 점착, 흡착 및 압착할 수 있는 구성이라면 어떠한 구성을 사용하여도 무방하다. In addition to the above-described embodiments, one of the first reinforcing member 210 and the second reinforcing member 220 may be provided to be elevated so as to compress the substrate 500 from the top and the bottom of at least the substrate 500. Any configuration may be used as long as it can be adhered, adsorbed, and pressed on one surface.
도 9는 본 발명에 따른 기판 손상 방지 광 소결장치를 통해 소결된 기판의 사진이다. 전술한 실시예들 중 어느 하나의 구성으로 이루어진 기판 손상 방지 광 소결장치(10)는 기판(500)의 상면 및 하면 중 적어도 어느 일면을 제1보강부재(210) 및 제2보강부재(220)를 통해 점착, 흡착 및 압착한 상태로 광 소결이 이루어지기 때문에 도 9에 도시된 바와 같이, 도 1에 도시된 기존의 광 소결이 이루어진 기판(500)과 비교하여 기판(500)의 구겨짐 등과 같은 기판(500)의 손상이 현저하게 감소된 상태를 확인할 수 있다. 9 is a photograph of a substrate sintered by the substrate damage preventing optical sintering apparatus according to the present invention. In the substrate damage preventing optical sintering apparatus 10 having any one of the above-described embodiments, the first reinforcing member 210 and the second reinforcing member 220 may be disposed on at least one of the upper and lower surfaces of the substrate 500. Since the light sintering is performed in a state in which adhesion, adsorption, and compression are performed through the substrate, as illustrated in FIG. 9, the wrinkles of the substrate 500 may be compared with those of the substrate 500 in which the conventional light sintering is performed. It can be seen that the damage of the substrate 500 is significantly reduced.
이상에서 설명한 바와 같이, 본 발명이 속하는 기술분야의 당업자는 본 발명이 그 기술적 사상이나 필수적 특징을 변경하지 않고서 다른 구체적인 형태로 실시될 수 있다는 것을 이해할 수 있을 것이다. 그러므로 상술한 실시예들은 모든 면에 예시적인 것이며 한정적인 것이 아닌 것으로서 이해해야만 한다. 본 발명의 범위는 상세한 설명보다는 후술하는 특허청구범위에 의하여 나타내어지며, 특허청구범위의 의미 및 범위 그리고 등가 개념으로부터 도출되는 모든 변경 또는 변형된 형태가 본 발명의 범위에 포함되는 것으로 해석되어야 한다.As described above, those skilled in the art will understand that the present invention can be implemented in other specific forms without changing the technical spirit or essential features. Therefore, the above-described embodiments are to be understood in all respects as illustrative and not restrictive. The scope of the present invention is shown by the following claims rather than the detailed description, and all changes or modifications derived from the meaning and scope of the claims and equivalent concepts should be construed as being included in the scope of the present invention.

Claims (11)

  1. 기판에 인쇄된 전기 전도성 잉크를 소결시키는 광 출력부; 및A light output unit for sintering the electrically conductive ink printed on the substrate; And
    상기 광 출력부를 통한 소결 시 발생하는 상기 기판의 구겨짐을 방지하기 위하여 상기 기판의 상면 및 하면 중 어느 일면에 구비되는 제1보강부재;A first reinforcing member provided on any one of an upper surface and a lower surface of the substrate to prevent wrinkles of the substrate generated during sintering through the light output unit;
    를 포함하는 기판 손상 방지 광 소결장치. Substrate damage prevention optical sintering apparatus comprising a.
  2. 제1항에 있어서,The method of claim 1,
    상기 제1보강부재는 상기 기판과 대면하는 일면이 점착성을 갖는 점착패드인 기판 손상 방지 광 소결장치. And the first reinforcing member is a pressure-sensitive adhesive pad having one surface facing the substrate.
  3. 제2항에 있어서,The method of claim 2,
    상기 광 출력부의 하부에 구비되어 상기 기판을 이송시키는 기판 이송부가 더 구비되는 기판 손상 방지 광 소결장치. The substrate damage prevention optical sintering apparatus is provided in the lower portion of the light output unit for transferring the substrate.
  4. 제3항에 있어서,The method of claim 3,
    상기 기판 이송부는 컨베이어벨트 또는 복수의 롤러를 이용한 롤러 이송부로 구성되고, 상기 제1보강부재는 상기 기판 이송부의 적어도 일부를 감싸도록 구비되는 기판 손상 방지 광 소결장치. The substrate transfer unit comprises a conveyor belt or a roller transfer unit using a plurality of rollers, wherein the first reinforcing member is provided to surround at least a portion of the substrate transfer unit optical damage prevention apparatus.
  5. 제3항에 있어서,The method of claim 3,
    상기 기판 이송부는,The substrate transfer unit,
    상기 광 출력부와 대응되는 위치에 구비되고, 상기 기판의 면적과 대응되는 면적으로 이루어져 상기 제1보강부재가 감싸지도록 구비되는 점착 이송부; 및An adhesive transfer part provided at a position corresponding to the light output part and formed to have an area corresponding to the area of the substrate to surround the first reinforcing member; And
    상기 점착 이송부의 전방 또는 후방 중 어느 일측에 구비되는 제1보조 이송부;A first auxiliary transfer part provided on one side of the front or rear side of the adhesive transfer part;
    를 포함하는 기판 손상 방지 광 소결장치.Substrate damage prevention optical sintering apparatus comprising a.
  6. 제5항에 있어서,The method of claim 5,
    상기 기판 이송부는 상기 점착 이송부를 기준으로 상기 제1보조 이송부와 대향되는 타측에 구비되는 제2보조 이송부가 더 구비되는 기판 손상 방지 광 소결장치. And the substrate transfer part further comprises a second auxiliary transfer part provided on the other side facing the first auxiliary transfer part based on the adhesive transfer part.
  7. 제2항에 있어서,The method of claim 2,
    상기 제1보강부재가 구비되는 상기 기판의 일면과 대향되는 타면에 구비되는 제2보강부재를 더 포함하는 기판 손상 방지 광 소결장치. And a second reinforcing member provided on the other surface of the substrate on which the first reinforcing member is provided.
  8. 제7항에 있어서,The method of claim 7, wherein
    상기 제2보강부재를 구동시키는 제2보강부재 구동부가 더 구비되는 기판 손상 방지 광 소결장치. And a second reinforcing member driving unit for driving the second reinforcing member.
  9. 제8항에 있어서,The method of claim 8,
    상기 제2보강부재 구동부는 컨베이어벨트 또는 복수의 롤러를 이용한 롤러 이송부로 구성되고, 상기 제2보강부재는 상기 제2보강부재 구동부의 적어도 일부를 감싸도록 구비되는 기판 손상 방지 광 소결장치. The second reinforcement member driving unit is composed of a roller conveying unit using a conveyor belt or a plurality of rollers, wherein the second reinforcing member is provided to surround at least a portion of the second reinforcing member driving unit.
  10. 제1항에 있어서,The method of claim 1,
    상기 제1보강부재는 상기 기판과 대면하는 일면에 흡착홀이 형성된 흡착장치인 기판 손상 방지 광 소결장치.And the first reinforcing member is an adsorption device having an adsorption hole formed on one surface facing the substrate.
  11. 제10항에 있어서,The method of claim 10,
    상기 제1보강부재를 이송시키는 기판 이송부가 더 구비되는 기판 손상 방지 광 소결장치. The substrate damage preventing optical sintering apparatus further comprises a substrate transfer unit for transferring the first reinforcing member.
PCT/KR2016/009911 2015-11-18 2016-09-05 Substrate damage preventing light sintering apparatus WO2017086582A1 (en)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63211644A (en) * 1987-05-12 1988-09-02 Nec Home Electronics Ltd Manufacture of semiconductor pellet
US5288526A (en) * 1993-02-11 1994-02-22 Nordson Corporation Ventilated curing oven and preheat flash zone system for curing coatings on circuit boards
JPH10235487A (en) * 1997-02-24 1998-09-08 Fuji Print Kogyo Kk Direct plotting device for printed board
JP2009226692A (en) * 2008-03-21 2009-10-08 Mimaki Engineering Co Ltd Inkjet printer
KR20130035841A (en) * 2011-09-30 2013-04-09 세메스 주식회사 Apparatus and method for treating substrate

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63211644A (en) * 1987-05-12 1988-09-02 Nec Home Electronics Ltd Manufacture of semiconductor pellet
US5288526A (en) * 1993-02-11 1994-02-22 Nordson Corporation Ventilated curing oven and preheat flash zone system for curing coatings on circuit boards
JPH10235487A (en) * 1997-02-24 1998-09-08 Fuji Print Kogyo Kk Direct plotting device for printed board
JP2009226692A (en) * 2008-03-21 2009-10-08 Mimaki Engineering Co Ltd Inkjet printer
KR20130035841A (en) * 2011-09-30 2013-04-09 세메스 주식회사 Apparatus and method for treating substrate

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