KR20170058180A - Light Sintering Apparatus for Protecting Damage to Substrate - Google Patents

Abstract

According to the present invention, a light sintering apparatus for preventing a substrate from being damaged comprises: a light output unit for sintering electric conductive ink printed on a substrate; and a first stiffener provided on any one surface of upper and lower surfaces of the substrate to prevent the substrate from being wrinkled caused by sintering through the light output unit.

Description

Technical Field [0001] The present invention relates to a light sintering apparatus for protecting a substrate from damage,

The present invention relates to a photo-sintering apparatus for preventing substrate damage, and more particularly, to a photo-sintering apparatus for preventing damage to a substrate, and more particularly, to a method for preventing a substrate from being damaged by adhesion or adsorption or pressure bonding through a reinforcing member to prevent damage such as wrinkling, And a light sintering apparatus capable of suppressing substrate damage.

The printing technique is a technique of putting a letter or a figure drawn on a sheet surface using ink into a paper or cloth. Recently, various techniques such as inkjet printing, flexographic printing, gravure printing and screen printing have been used . These technologies are applied to high value-added products such as RFID systems, large-area display devices, thin-plate solar cells, and thin-plate batteries, and the demand for technology is increasing.

Particularly, direct patterning technology through inkjet is a technique of forming a wiring by discharging a predetermined amount of ink directly to an accurate position through an inkjet head. Such a technique has the advantage of not only reducing the material cost but also shortening the manufacturing process and time. At present, nano ink using at least one of gold, silver and copper is used as the conductive metal ink for direct patterning. The key technology in inkjet printing is sintering of conductive ink. Up to now, high temperature sintering processes have been used to sinter various particles. In the thermal sintering process, the metal nanoparticles are heated to a temperature of about 200 to 350 ° C. in an inert gas state in order to sinter the metal nanoparticles. In addition, a laser sintering method capable of sintering at room temperature and atmospheric pressure is widely used.

However, recently, attempts have been made to fabricate electronic patterns on flexible low-temperature polymers or paper, and therefore, the high-temperature sintering method has a problem that it is difficult to apply to the printing electronic industry and technology. In addition, copper is known to have a very difficult sintering due to the formation of an oxide layer on its surface due to thermochemical equilibrium, and also to decrease the conductivity after sintering.

In addition, the laser sintering method can only be sintered to a very small area, resulting in poor practicality.

In order to solve these problems, the sintering method using a light sintering method is increasingly used.

1 is a photograph of a substrate on which damage is caused by light sintering. However, in the case of using a thin substrate made of a polymer material such as a PI (polyimide) film, such a light sintering method also causes the substrate to be wrinkled or warped by the invention according to the intensity and the irradiation of light, And the like.

SUMMARY OF THE INVENTION The present invention has been made to solve the conventional problems, and it is an object of the present invention to provide a method and apparatus for preventing or suppressing damage such as wrinkling of a substrate due to light or heat generated during light sintering by sticking, And it is an object of the present invention to provide a light sintering apparatus for preventing substrate damage.

The objects of the present invention are not limited thereto, and other objects not mentioned can be clearly understood by those skilled in the art from the following description.

To achieve the above object, the present invention provides a light sintering apparatus for preventing damage to a substrate, comprising: a light output unit for sintering an electroconductive ink printed on a substrate; and a light output unit for preventing wrinkles of the substrate generated during sintering through the light output unit. And a first reinforcing member provided on either one of the upper surface and the lower surface of the substrate.

At this time, the first reinforcing member may be a pressure-sensitive adhesive pad having one side thereof facing the substrate.

The substrate transfer unit may further include a substrate transfer unit provided below the light output unit to transfer the substrate.

The substrate transferring unit may include a roller conveying unit using a conveyor belt or a plurality of rollers, and the first reinforcing member may be provided to surround at least a part of the substrate transferring unit.

The substrate transferring unit may include an adhesive transferring unit provided at a position corresponding to the optical output unit and having an area corresponding to the area of the substrate to enclose the first reinforcing member, And may include a first auxiliary transfer unit provided at one side.

The substrate transfer unit may further include a second auxiliary transfer unit provided on the other side opposite to the first auxiliary transfer unit with respect to the adhesive transfer unit.

The apparatus may further include a second reinforcing member provided on the other surface opposite to the first surface of the substrate on which the first reinforcing member is provided.

In addition, a second reinforcement member driving unit for driving the second reinforcement member may be further provided.

The second reinforcing member driving unit may include a roller conveying unit using a conveyor belt or a plurality of rollers, and the second reinforcing member may surround at least a part of the second reinforcing member driving unit.

Also, the first reinforcing member may be an adsorption device having a suction hole formed on one surface facing the substrate.

In addition, a substrate transfer unit for transferring the first reinforcing member may be further provided.

The substrate damage preventing light sintering apparatus of the present invention has the following effects.

First, the substrate is fixed through at least one of the adhesive, adsorption, or pressing methods through the reinforcing member provided on at least one of the upper surface and the lower surface of the substrate, whereby heat is generated by the light or light emitted to the substrate during the light sintering It is possible to suppress and prevent damage such as wrinkling of the substrate.

Second, since the reinforcing member is provided on the substrate transferring portion, even if a plurality of substrates are continuously sintered, damage to all the substrates can be suppressed and prevented.

Third, the reinforcing member can be installed entirely on the substrate transferring portion, or can be installed only partially, so that the cost of installing the reinforcing member can be minimized according to the use mode.

Fourth, there is an effect that the existing optical sintering apparatus can be compatible with the conventional optical sintering apparatus without replacing the apparatus by adding only the reinforcing member to the existing optical sintering apparatus.

The effects of the present invention are not limited to the above-mentioned effects, and other effects not mentioned can be clearly understood by those skilled in the art from the description of the claims.

BRIEF DESCRIPTION OF THE DRAWINGS The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate preferred embodiments of the invention and, together with the description, serve to further the understanding of the technical idea of the invention, And shall not be interpreted.
1 is a photograph of a substrate on which damage is caused by light sintering;
2 is a sectional view of a substrate damage preventing light sintering apparatus according to a first embodiment of the present invention;
3 is a perspective view of a substrate damage preventing light sintering apparatus according to a second embodiment of the present invention;
4 is a sectional view of a substrate damage preventing light sintering apparatus according to a second embodiment of the present invention;
5 is a sectional view showing a modification of the substrate damage preventing light sintering apparatus according to the second embodiment of the present invention;
6 is a sectional view of a substrate damage preventing light sintering apparatus according to a third embodiment of the present invention;
7 is a sectional view of a substrate damage preventing light sintering apparatus according to a fourth embodiment of the present invention;
8 is a perspective view of a first reinforcing member and a substrate transferring unit according to a fifth embodiment of the present invention; And
FIG. 9 is a photograph of a substrate sintered through a substrate damage preventing light sintering apparatus according to the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

First Embodiment

2 is a cross-sectional view of a substrate damage preventing light sintering apparatus according to a first embodiment of the present invention. 2, the optical damage preventing sintering apparatus 10 according to the first embodiment of the present invention includes a light output unit 100, a first reinforcing member 210 and a second reinforcing member 220, .

As shown in FIG. 2, the light output unit 100 may include a light emitting diode (OLED) for irradiating light for sintering an electroconductive ink such as a fine metal particle or a precursor patterned on a substrate 500 such as a PI film Device. The optical output unit 100 may include a lamp unit 110 and may further include a reflection plate 120 and a light wavelength filter 130 depending on the usage.

The lamp unit 110 is a device for irradiating light for sintering the electroconductive ink patterned on the substrate 500. The lamp unit 110 may be any device as long as it can irradiate light capable of sintering the electroconductive ink. Preferably, a xenon flash lamp is used. It is preferable to irradiate the sample in the form of The xenon flash lamp consists of a configuration comprising a xenon gas injected into a cylinder-shaped, sealed quartz quartz tube. Xenon gas outputs light energy from input electrical energy, and has an energy conversion rate of more than 50%. In addition, a xenon flash lamp has metal electrodes such as tungsten formed on both sides thereof for anode and cathode formation. When a high power source and a current to be described later are applied to the lamp unit 110 having such a configuration, the injected xenon gas is ionized and a spark is generated between the anode and the cathode. At this time, when the electric charge accumulated in the power storage unit is applied, an arc plasma shape is generated in the lamp unit 110 with a current of about 1000 Adm current for 1 ms to 10 ms through the spark generated in the lamp unit 110, Light is generated. The light generated here is seen as white light since it contains a light spectrum of a wide wavelength band from ultraviolet rays ranging from 160 nm to 2.5 mm to infrared rays. In the present invention, a xenon flash lamp is described as an embodiment, but any type of lamp unit 110 may be used as long as it can achieve such a purpose.

As shown in FIG. 2, the reflection plate 120 is provided at an upper portion of the lamp unit 110, and reflects light radiated upward from the lamp unit 110 to output the reflected light in a downward direction.

As shown in FIG. 2, the light wavelength filter 130 is provided at a lower portion of the lamp unit 110 to filter only extreme ultraviolet light having a predetermined wavelength band. In particular, ultraviolet light emitted from the lamp unit 110 using the xenon flash lamp may damage the substrate 500 made of a polymer material, so that light in the ultraviolet band should be blocked. Depending on the type of the substrate 500 Thereby selectively blocking the wavelength band of the irradiated light.

The first reinforcing member 210 is provided on the lower surface of the substrate 500 in an area corresponding to the area of the substrate 500 and is wrinkled by the light emitted from the light output unit 100 on the substrate 500 made of a polymer material And the like. It is preferable that the first reinforcing member 210 has an area corresponding to the area of the substrate 500 or an area relatively larger than the area of the substrate 500. [ The first reinforcing member 210 having an area smaller than the area of the substrate 500 may be formed on the entire surface of the substrate 500, It is obvious that a plurality of the apparatuses may be provided. In order to prevent the substrate 500 from being deformed from the lower surface of the substrate 500, the first reinforcing member 210 may be any device as long as it can adsorb or adhere to the substrate 500, It is preferable that it is composed of an adhesive pad which adheres at least a part of the substrate 500 so as to suppress the deformation of the substrate 500 in the lower part of the substrate 500. The first reinforcing member 210 may be a pressure-sensitive adhesive pad having a pressure-sensitive adhesive on one side or both sides thereof facing the substrate 500. Depending on the mode of use, The first reinforcing member 210 may be made of any material as long as it can be fixed to prevent the first reinforcing member 500 from being detached from the first reinforcing member 210. For example, a rubber pad having high frictional force may be used.

The second reinforcing member 220 has an area corresponding to the area of the substrate 500 on the upper surface of the substrate 500, and the overall structure thereof is similar to that of the first reinforcing member 210. The second reinforcing member 220 may be disposed between the light output unit 100 and the substrate 500 so that the second reinforcing member 220 may be transparent or translucent so that at least a portion of the light emitted from the light output unit 100 can be transmitted. It is better to use a pad.

If the first reinforcing member 210 and the second reinforcing member 220 are each formed larger than the area of the substrate 500, only one of the first reinforcing member 210 and the second reinforcing member 220 is adhered It may be made of pads. The remaining portions except for the area of the substrate 500 are adhered to each other by any one of the adhesives so that the substrate 500 provided between the first reinforcing member 210 and the second reinforcing member 220 ) Can be adhered and pressed.

The first reinforcing member 210 and the second reinforcing member 220 are provided on the lower surface and the upper surface of the substrate 500. However, depending on the usage, the first reinforcing member 210 And the first reinforcing member 210 may be provided.

After the first reinforcing member 210 and the second reinforcing member 220 are coupled to the lower surface and the upper surface of the substrate 500 as described above, Or placed on a substrate transferring part 300 for transferring the substrate 500. The substrate transferring part 300 is a substrate transferring part.

Thereafter, the electroconductive ink printed on the substrate 500 can be sintered by irradiating the substrate 500 with light using the light emitted from the light output unit 100. At this time, since the first reinforcing member 210 and the second reinforcing member 220 fix the substrate 500 by the adhesive force, even if the light is irradiated from the light output portion 100, the substrate 500 is deformed Or the deformation of the substrate 500 can be suppressed as much as possible.

Second Embodiment

FIG. 3 is a perspective view of a substrate damage preventing light sintering apparatus according to a second embodiment of the present invention, and FIG. 4 is a sectional view of a substrate damage preventing light sintering apparatus according to a second embodiment of the present invention. As shown in FIG. 3, the substrate damage preventive light sintering apparatus 10 according to the second embodiment of the present invention includes a light output unit 100, a substrate transfer unit 300, and a first reinforcing member 210 do.

Since the optical output unit 100 has a configuration similar to that of the first embodiment, a detailed description thereof will be omitted.

The substrate transferring part 300 is a device for transferring at least one substrate 500 to one or both sides. The width of the substrate transferring part 300 corresponds to the width of the substrate 500 and the optical output part 100, and the length of the substrate transferring part 300 is May be selectively determined in consideration of the number of the substrates 500 to be mounted and the distance to which the substrate 500 is transferred. As described above, the substrate transferring unit 300 may be any device that transfers the substrate 500 through the light output unit 100 and is capable of sintering the electroconductive ink printed on the substrate 500, It is preferable to use a conveyor belt, a roller conveying portion composed of a plurality of rollers, or a conveying portion provided so as to enclose the mutually spaced rollers with a belt or the like.

The first reinforcing member 210 may be provided to cover at least a part of the substrate transferring part 300 so as to suppress deformation of the substrate 500 by sticking or sucking the substrate 500 . However, it is preferable to use a pressure-sensitive adhesive pad having a tackiness on one surface facing the substrate 500. As shown in FIGS. 3 and 4, the first reinforcing member 210, which is formed of a pressure-sensitive adhesive pad, may be provided to cover the entire surface of the substrate transferring part 300 such as a conveyor belt, And the like. The first reinforcing member 210 having the above-described structure transports the substrate 500 according to the driving direction of the substrate transfer unit 300 while the substrate 500 is adhered through the driving of the substrate transfer unit 300. At this time, since the substrate 500 is transferred in a state of being adhered to the first reinforcing member 210 made of a pressure-sensitive adhesive pad, the substrate 500 is opened or crumpled due to heat generated during sintering through the optical output portion 100 Damage such as wrinkling of the substrate 500 is suppressed or prevented because the first reinforcing member 210 fixes the first reinforcing member 210 by the adhesive force.

(Modified example)

5 is a cross-sectional view showing a modification of the substrate damage preventing light sintering apparatus according to the second embodiment of the present invention. 5, the first reinforcing member 210 does not entirely cover the substrate transferring part 300, but does not cover the entire substrate transferring part 300 and corresponds to the size of the substrate 500 As shown in FIG. At this time, the area of the first reinforcing member 210 may be the same as or larger than the area of the substrate 500, and the distance of the first reinforcing member 210 adjacent to the first reinforcing member 210 may be continuously increased, And the like.

Third Embodiment

6 is a cross-sectional view of a substrate damage preventing light sintering apparatus according to a third embodiment of the present invention. As shown in FIG. 6, the substrate damage preventive light sintering apparatus 10 according to the third embodiment of the present invention generally has a configuration similar to that of the second embodiment described above. Therefore, only the substrate transferring part 300 and the first reinforcing member 210, which differ from the second embodiment described above, will be described in detail.

6, the substrate transferring unit 300 according to the third embodiment of the present invention includes an adhesive transferring unit 310, a first auxiliary transferring unit 320, and a second auxiliary transferring unit 330. As shown in FIG.

The adhesive transferring part 310 is provided so that the first reinforcing member 210 covers the adhesive transferring part 310 as a whole or partially surrounds the adhesive transferring part 310 like the substrate transferring part 300 of the modification example of the second embodiment or the second embodiment . . However, the length of the adhesive transferring part 310 corresponds to one substrate 500 or is formed relatively large. It is preferable that the adhesive transferring unit 310 is disposed at a position corresponding to the optical output unit 100 and has a length that allows the adhesive transferring unit 310 to pass through only during the optical sintering of one substrate 500.

The first auxiliary transferring part 320 and the second auxiliary transferring part 330 are installed in front of and behind the adhesive transferring part 310 along the transfer direction of the substrate 500, respectively. The first auxiliary transfer unit 320 and the second auxiliary transfer unit 330 may include a general conveyor belt or a roller transfer unit having no first reinforcement member 210. Only one of the first auxiliary transfer unit 320 and the second auxiliary transfer unit 330 may be provided, or both of them may not be provided.

The use of the substrate transfer unit 300 according to the third embodiment having the above-described configuration will be described as follows.

As shown in FIG. 6, the substrate 500 may be continuously supplied through the first auxiliary transfer part 320. At this time, since the first auxiliary transfer unit 320 is not provided with the first reinforcing member 210 having adhesiveness or adsorptivity, the substrate 500 is simply transferred on the first auxiliary transfer unit 320.

Subsequently, the substrate 500 transferred from the first auxiliary transferring unit 320 to the adhesive transferring unit 310 is sequentially transferred from the one side of the adhesive transferring unit 310 to the first reinforcing member 210 ), As shown in Fig.

Since the substrate 500 is subjected to photo-sintering while passing through the adhesive transferring part 310 and the substrate 500 is adhered through the first reinforcing member 210 provided in the adhesive transferring part 310 during photo- Damage such as wrinkling of the substrate 500 is suppressed and prevented by sintering.

Next, the photo-sintered substrate 500 is transferred to the second auxiliary transfer part 330 through the adhesive transfer part 310. In this case, since the second auxiliary transfer unit 330 does not include the first reinforcing member 210 having the adhesive force like the first auxiliary transfer unit 320, the substrate 500 is transferred from the adhesive transfer unit 310 to the second auxiliary transfer unit 310, The adhesive force is sequentially lost from one side moved to the second auxiliary transfer unit 330 and is simply transferred to the second auxiliary transfer unit 330.

As described above, the substrate transfer unit 300 according to the third embodiment is provided with the first reinforcing member 210 only in the adhesive transferring unit 310 having a shorter length than the second embodiment, so that the installation cost of the first reinforcing member 210 is reduced .

Fourth Embodiment

7 is a cross-sectional view of a substrate damage preventing light sintering apparatus according to a fourth embodiment of the present invention. As shown in FIG. 7, the substrate damage preventing light sintering apparatus 10 according to the fourth embodiment of the present invention roughly includes a light output unit 100, a substrate transfer unit 300, a first reinforcing member 210, A second reinforcing member 220 and a second reinforcing member driving unit 400.

Here, since the optical output unit 100, the substrate transfer unit 300, and the first reinforcing member 210 are configured in a similar manner to the above-described embodiments, a detailed description thereof will be omitted. That is, the substrate transferring part 300 and the first reinforcing member 210 can be used by adopting any one of the configurations of the second and third embodiments described above. Accordingly, the second reinforcing member 220 and the second reinforcing member driving unit 400, which are different from the above-described configurations, will be mainly described.

The second reinforcing member 220 is provided on the other surface opposite to the first surface of the substrate 500 facing the first reinforcing member 210, that is, on the upper surface of the substrate 500, The substrate 500 is adhered and pressed together at the top and the bottom together with the substrate 210. At this time, the second reinforcing member 220 may be composed of a pressure-sensitive adhesive pad having an adhesive force on one side facing the substrate 500.

The second reinforcing member driving unit 400 may be a roller conveying unit using a conveyor belt or a plurality of rollers and the second reinforcing member 220 may include at least a part of the second reinforcing member driving unit 400 As shown in FIG.

If the first reinforcing member 210 is partially provided on one side of the substrate transferring part 300 and the second reinforcing member 220 is also mounted on the second reinforcing member driving part 400 as in the modified example of the second embodiment, The first reinforcing member 210 and the second reinforcing member 220 may be disposed at positions corresponding to each other.

That is, the second reinforcing member 220 and the second reinforcing member driving unit 400 may have the same configuration as the first reinforcing member 210 and the substrate transferring unit 300 described above.

However, since the second reinforcing member 220 is provided on the upper surface of the substrate 500, that is, on one side of the substrate 500 on which the electro-conductive ink is printed, at least a part of the light irradiated from the light- It may be made of a transparent or semi-transparent material.

7, the second stiffening member driving unit 400 may include a light output unit (not shown) so that the second stiffening member 220 can pass through only one fold between the optical output unit 100 and the substrate 500 100). In the case where the second reinforcing member 220 passes two or more layers between the light output portion 100 and the substrate 500, the light transmittance is reduced and the sintering of the electroconductive ink may not be easy. The first and second reinforcing members 220 and 400 may be formed to surround the optical output unit 100 so that the second reinforcing member 220 passes through only one layer between the optical output unit 100 and the substrate 500.

The second reinforcing member 220 may be driven separately using a driving device separate from the substrate transferring part 300. Depending on the usage mode, the second reinforcing member 220 may be interlocked and driven by the driving force of the substrate transferring part 300, Or the like.

7, the second reinforcing member driving unit 400 includes a second reinforcing member 220 on one side to which the substrate 500 is supplied with a predetermined angle inclination along the feeding direction of the substrate 500 It is preferable that the second reinforcing member 220 can be in contact with the other side of the substrate 500 in the feeding direction. If the second reinforcing member 220 sequentially contacts the other side in accordance with the supply of the substrate 500, it is possible to more reliably prevent the non-sintered electroconductive ink from diffusing or spreading arbitrarily.

Although the first reinforcing member 210 is provided on the substrate transferring part 300 in this embodiment, the substrate transferring part 300 may be provided with the first reinforcing member 210, It is also possible to use the conveyor belt or roller conveyance portion and to fix the substrate 500 through the second reinforcing member 220 only.

Also, as described in the first embodiment, the first reinforcing member 210 and the second reinforcing member 220 may be provided so that only either one of them is tacky.

Fifth Embodiment

8 is a perspective view of a first reinforcing member and a substrate transferring unit according to a fifth embodiment of the present invention. The substrate damage preventing light sintering apparatus 10 according to the fifth embodiment of the present invention has a configuration similar to that of the above-described embodiments. However, the structure of the first reinforcing member 210 and the substrate transferring unit 300 will be described with the modification thereof.

The first reinforcing member 210 is configured by an adsorption device having a plurality of adsorption holes formed on one surface thereof facing the substrate 500 so that the substrate 500 can be adsorbed and fixed using vacuum adsorption . Such an adsorption apparatus may be any apparatus as long as it can adsorb the substrate 500 using vacuum adsorption to suppress and prevent deformation of the substrate 500. The first reinforcing member 210 may be formed to correspond to the area of the substrate 500 or may be relatively large so that at least one substrate 500 can be placed thereon.

The substrate transfer unit 300 may have any structure as long as it can transfer the first reinforcement member 210 made of an adsorption device to one or both sides so that the substrate 500 can move through the optical output unit 100 Also, Preferably, as shown in FIG. 8, it is preferable to use a substrate transferring part 300 capable of sliding the first reinforcing member 210 using a hydraulic or pneumatic cylinder or the like.

It is apparent that the second reinforcing member 220 may be provided together with the first reinforcing member 210 as in the first or fourth embodiment.

It is preferable that at least one of the first reinforcing member 210 and the second reinforcing member 220 is provided so as to be able to be lifted and lowered so that the substrate 500 can be squeezed from above and below, Any structure may be used as long as it can adhere, adhere, and compress the one surface.

FIG. 9 is a photograph of a substrate sintered through a substrate damage preventing light sintering apparatus according to the present invention. The substrate damage preventing light sintering apparatus 10 having any one of the above-described embodiments is characterized in that at least one of the upper surface and the lower surface of the substrate 500 is connected to the first reinforcing member 210 and the second reinforcing member 220, As shown in FIG. 9, the light is sintered in a state of being adhered, adsorbed, and pressed through the substrate 500, It can be seen that the damage of the substrate 500 is remarkably reduced.

As described above, those skilled in the art will understand that the present invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. It is therefore to be understood that the above-described embodiments are to be considered in all respects as illustrative and not restrictive. The scope of the present invention is defined by the appended claims rather than the detailed description and all changes or modifications derived from the meaning and scope of the claims and their equivalents should be construed as being included within the scope of the present invention.

10: Light sintering apparatus
100: light output section
110: lamp unit
120: reflector
130: Optical wavelength filter
210: first reinforcing member
220: second reinforcing member
300: substrate transfer section
310: Adhesive transfer part
320: First auxiliary transport unit
330: Second auxiliary conveyance part
400: second reinforcing member driving part
500: substrate

Claims (11)

A light output section for sintering the electroconductive ink printed on the substrate; And
A first reinforcing member provided on at least one of an upper surface and a lower surface of the substrate to prevent wobbling of the substrate during sintering through the light output unit;
Wherein the substrate is made of glass. The method according to claim 1,
Wherein the first reinforcing member is a pressure-sensitive adhesive pad having a tacky surface on one side facing the substrate. 3. The method of claim 2,
And a substrate transfer unit provided below the light output unit for transferring the substrate. The method of claim 3,
Wherein the substrate transferring portion is constituted by a conveyor belt or a roller conveying portion using a plurality of rollers, and the first reinforcing member is provided to surround at least a part of the substrate transferring portion. The method of claim 3,
Wherein,
An adhesive transferring unit provided at a position corresponding to the light output unit and having an area corresponding to an area of the substrate and enclosing the first reinforcing member; And
A first auxiliary transfer unit provided at one side of the front side or the rear side of the adhesive transfer unit;
Wherein the substrate is made of glass. 6. The method of claim 5,
Wherein the substrate transferring part further comprises a second auxiliary transfer part provided on the other side opposite to the first auxiliary transfer part with respect to the adhesive transfer part. 3. The method of claim 2,
And a second reinforcing member provided on the other surface opposite to the one surface of the substrate on which the first reinforcing member is provided. 8. The method of claim 7,
And a second reinforcing member driving unit for driving the second reinforcing member. 9. The method of claim 8,
Wherein the second reinforcing member driving unit comprises a roller conveying unit using a conveyor belt or a plurality of rollers and the second reinforcing member is provided to surround at least a part of the second reinforcing member driving unit. The method according to claim 1,
Wherein the first reinforcing member is an adsorption device having a suction hole formed on one surface thereof facing the substrate. 11. The method of claim 10,
Further comprising a substrate transferring unit for transferring the first reinforcing member.

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