WO2017085218A1 - Carte de circuit imprimé, module de capteur et semelle - Google Patents

Carte de circuit imprimé, module de capteur et semelle Download PDF

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Publication number
WO2017085218A1
WO2017085218A1 PCT/EP2016/078066 EP2016078066W WO2017085218A1 WO 2017085218 A1 WO2017085218 A1 WO 2017085218A1 EP 2016078066 W EP2016078066 W EP 2016078066W WO 2017085218 A1 WO2017085218 A1 WO 2017085218A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
printed circuit
contact
contacts
sole
Prior art date
Application number
PCT/EP2016/078066
Other languages
German (de)
English (en)
Inventor
Maximilian Müller
Robert Vilzmann
Florian Zierer
Original Assignee
Moticon Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Moticon Gmbh filed Critical Moticon Gmbh
Publication of WO2017085218A1 publication Critical patent/WO2017085218A1/fr

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/14—Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators
    • G01L1/142—Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators using capacitors
    • A—HUMAN NECESSITIES
    • A43—FOOTWEAR
    • A43B—CHARACTERISTIC FEATURES OF FOOTWEAR; PARTS OF FOOTWEAR
    • A43B3/00—Footwear characterised by the shape or the use
    • A43B3/34—Footwear characterised by the shape or the use with electrical or electronic arrangements
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00—Measuring for diagnostic purposes; Identification of persons
    • A61B5/103—Detecting, measuring or recording devices for testing the shape, pattern, colour, size or movement of the body or parts thereof, for diagnostic purposes
    • A61B5/1036—Measuring load distribution, e.g. podologic studies
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00—Measuring for diagnostic purposes; Identification of persons
    • A61B5/68—Arrangements of detecting, measuring or recording means, e.g. sensors, in relation to patient
    • A61B5/6801—Arrangements of detecting, measuring or recording means, e.g. sensors, in relation to patient specially adapted to be attached to or worn on the body surface
    • A61B5/6802—Sensor mounted on worn items
    • A61B5/6804—Garments; Clothes
    • A61B5/6807—Footwear
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/14—Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators
    • G01L1/142—Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators using capacitors
    • G01L1/146—Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators using capacitors for measuring force distributions, e.g. using force arrays
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B2562/00—Details of sensors; Constructional details of sensor housings or probes; Accessories for sensors
    • A61B2562/02—Details of sensors specially adapted for in-vivo measurements
    • A61B2562/0247—Pressure sensors
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B2562/00—Details of sensors; Constructional details of sensor housings or probes; Accessories for sensors
    • A61B2562/04—Arrangements of multiple sensors of the same type
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B2562/00—Details of sensors; Constructional details of sensor housings or probes; Accessories for sensors
    • A61B2562/16—Details of sensor housings or probes; Details of structural supports for sensors
    • A61B2562/166—Details of sensor housings or probes; Details of structural supports for sensors the sensor is mounted on a specially adapted printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09027—Non-rectangular flat PCB, e.g. circular
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09081—Tongue or tail integrated in planar structure, e.g. obtained by cutting from the planar structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits

Definitions

  • the present application relates generally to a circuit board, a sensor component with the circuit board and a sole with the sensor component.
  • the application relates to a printed circuit board for a sensor component and / or for a sole, a sensor component with the printed circuit board and / or for a sole and a sole with the sensor component.
  • Method for measuring a pressure on the human sole in particular a pressure acting on the human sole, are known. They are used, among others, in medical research for gait analysis. As part of a training system, they offer the opportunity to give the wearer an objective feedback about his movement parameters.
  • a circuit board in accordance with one aspect of the present disclosure, includes a flexible circuit board part and a contact arrangement formed on the flexible circuit board part.
  • the contact arrangement comprises a plurality of contacts, wherein preferably the plurality of contacts are configured to be contacted with a conductive structure.
  • a circuit board comprises a flexible circuit board part and at least two rigid circuit board parts, which are arranged at a distance from each other.
  • a sensor component comprises a printed circuit board with a flexible printed circuit board part and a contact arrangement, which is formed on the flexible printed circuit board part, and at least one sensor element.
  • the contact arrangement comprises a plurality of contacts, wherein preferably the plurality of contacts are configured to be contacted with a conductive structure.
  • a sensor component is provided.
  • the sensor component comprises a printed circuit board having a flexible printed circuit board part and a contact arrangement formed on the flexible printed circuit board part, and at least one sensor element having at least one contact point which is laminated on a contact of the contact arrangement of the printed circuit board.
  • a sole is provided.
  • the sole may be configured to measure a pressure on a foot sole, in particular a pressure acting on the human foot sole, and comprises a sensor component integrated in the sole.
  • the sensor component comprises a printed circuit board with a flexible printed circuit board part and a contact arrangement, which is formed on the flexible printed circuit board part, and at least one sensor element.
  • the contact arrangement includes a plurality of contacts, wherein preferably the plurality of contacts are configured to be contacted with a conductive structure.
  • a sole is provided.
  • the sole may be configured to measure a pressure on a sole of the foot, in particular a pressure acting on the human foot sole, and comprises a sensor component integrated in the sole.
  • the sensor component comprises a circuit board having a flexible circuit board part and a contact arrangement formed on the flexible circuit board part, and at least one sensor element having at least one contact point laminated on a contact of the contact arrangement of the circuit board.
  • a glove is provided.
  • the glove may be configured to measure a pressure on a palm, in particular a pressure applied to the human palm, and includes a sensor component integrated into the glove.
  • the sensor component comprises a printed circuit board having a flexible printed circuit board part and a contact arrangement formed on the flexible printed circuit board part, and at least one sensor element having at least one contact point which is laminated on a contact of the contact arrangement of the printed circuit board.
  • Examples are also directed to an apparatus for carrying out the disclosed methods and also include apparatus parts for carrying out the described process blocks. These process blocks may be performed by hardware components, a computer programmed by suitable software, by a suitable combination of these two or some other means.
  • examples according to the application are also directed to methods of operating the described apparatus. These include method steps for performing the function of the device.
  • Figure 2 is a schematic diagram of a printed circuit board having at least one rigid printed circuit board part according to examples described herein.
  • Figure 3 is a schematic diagram of a molded circuit board according to examples herein.
  • FIG. 4 is a schematic drawing of another molded circuit board according to examples described herein;
  • FIG. 5 shows a cross-sectional drawing through a printed circuit board according to examples described herein.
  • FIG. 6A is an exploded view of a sensor component according to examples described herein;
  • FIG. 6B shows a schematic drawing of a sensor component according to examples described herein
  • FIG. 6C shows an exploded view of a sensor component according to examples described herein
  • FIG. 6D is a schematic diagram of a sensor component according to examples described herein;
  • FIG. 7 shows a schematic drawing of a sensor component according to examples described herein, FIG.
  • FIGS. 8A to 8C are schematic views of sensor components according to examples described herein.
  • FIG. 9 is a schematic drawing of a sole according to examples described herein.
  • FIG. 10 shows a schematic drawing of a sole with sensor component according to examples described herein.
  • Figure 11 is a cross-sectional drawing of a sole according to examples described herein.
  • Examples of the present disclosure described herein relate, inter alia, to: a printed circuit board, a sensor element in particular with a printed circuit board and a sole, in particular with a sensor component.
  • a circuit board comprises a flexible circuit board part and a contact arrangement formed on the flexible circuit board part.
  • the contact arrangement has a plurality of contacts, which are in particular configured to be contacted with a conductive structure.
  • Fig. 1 shows a printed circuit board 100 according to examples described herein.
  • the printed circuit board 100 shown in FIG. 1 comprises a flexible printed circuit board part 110.
  • a contact arrangement 130 may be formed or arranged on the flexible printed circuit board part 110.
  • the contact arrangement 130 may include a plurality of contacts, such as first contacts 132 and second contacts 134.
  • the plurality of contacts 132, 134 may be configured to be contacted with a conductive structure.
  • a "flexible" board part or “flexible board part” such as the flexible board part 110, may be a board or part of a board having elastic properties.
  • the property of a body or material can be understood to be able to change its shape under the action of force and to be able to return to the original form when the acting force ceases.
  • the "flexible printed circuit board part” can be bent under the influence of external forces, for example become.
  • a "flexible printed circuit board part” is particularly thin, in particular, flexible printed circuit boards based on polyimide films, polyester films or PET films can be used, in which connection a "flex circuit board” can also be used.
  • Such flexplates or flexible circuit boards are used, for example, in printers and cell phones.
  • the contact arrangement 130 shown in FIG. 1 has the plurality of contacts 132, 134.
  • the plurality of contacts 132, 134 and / or the contact arrangement 130 may be circular or annular.
  • the contact arrangement 130 may have different types of contacts.
  • a plurality of first contacts 132 and a second contact 134 may be formed.
  • the plurality of first contacts 132 may be arranged in a circle.
  • the plurality of first contacts 132 may be finger-shaped.
  • the parasitic capacitance of the first contacts 132 can be reduced.
  • the second contact 134 may be formed centrally with respect to the plurality of first contacts 132.
  • the plurality of first contacts 132 may thus surround the second contact 134.
  • the second contact 134 may be formed, for example, circular or round.
  • the plurality of contacts 132, 134 and / or the contact arrangement 130 may also have a different arrangement.
  • the plurality of contacts 132, 134 may be arranged in a row and / or have different sizes.
  • the plurality of contacts 132, 134 may be square, circular, or any other suitable shape, particularly as required by the contacts.
  • more than one second contact 134 may be provided. Any suitable number of second contacts 134 may be provided, for example two, three or more.
  • the printed circuit board 100 in particular the flexible printed circuit board part 110, may have extensions.
  • the extensions may include, and / or form, for example, positioning holes, an antenna lead, an antenna, and / or battery terminal contact pads.
  • the positioning holes may serve to align the circuit board 100 relative to other layers.
  • forces such as bending and / or shear forces can act on the circuit board 100.
  • the flexible circuit board part 110 can yield and / or follow the forces acting on it.
  • the contacts 132, 134 of the contact arrangement 130 and / or the contact arrangement can thus be protected from the outside acting on or by elements to be contacted on the transmitted forces.
  • the forces can be absorbed and / or intercepted by the flexible printed circuit board part 110.
  • a high mechanical stability can thus be provided.
  • the flexible circuit board part 100 may be mechanically connected to the elements to be contacted, in particular adhesively bonded, sewn and / or laminated to the elements to be contacted. A mechanical stability can thus be further increased. As shown in FIG.
  • the printed circuit board 100 may have at least one rigid printed circuit board part 120.
  • the at least one rigid printed circuit board part 120 can be arranged or applied on the flexible printed circuit board part 110.
  • a "rigid" circuit board part or “rigid circuit board part” such as the rigid circuit board part 120, may be a printed circuit board or part of a printed circuit board that is rigid, in particular in comparison to the flexible circuit board part 110, ie no or has no significant flexibility.
  • the at least one rigid printed circuit board part 120 may comprise materials such as glass fiber mats, FR4, kraft paper, Teflon, alumina or ceramic.
  • the circuit board 100 may include at least two rigid circuit board parts 120.
  • the circuit board 100 when the circuit board 100 includes the flexible circuit board portion 110 and the at least one rigid circuit board portion 120, it may be referred to as a "rigid flex board.” Rigid-flex boards or rigid-flex circuit boards may be used in particular for systems that provide a permanent or rigid circuit board [0026]
  • the orifice plate 100 has vias or vertical interconnect access (VIAs) (not shown).
  • the flexible printed circuit board part 110 and 10 may be of a conventional type / or the rigid printed circuit board part 120 Have VIAs.
  • the at least one rigid printed circuit board part 120 may be electrically connected to the flexible printed circuit board part 110 via VIAs.
  • the at least one rigid printed circuit board part 120 may be arranged in a circular or annular manner.
  • a plurality of rigid printed circuit board parts 120 for example at least two rigid printed circuit board parts 120, may be arranged in a circular or annular manner.
  • the plurality of rigid circuit board parts 120 may be interrupted in particular in the circumferential direction of the circular or ring arrangement. In the areas where the plurality of rigid circuit board parts 120 are not formed, parts or portions of the flexible circuit board part 110 may be exposed.
  • the circuit board 100 may have any suitable number of rigid circuit board parts 120.
  • the at least one rigid printed circuit board part 120 may also be arranged in other suitable forms.
  • the at least one rigid printed circuit board part 120 may be arranged like a cloverleaf.
  • electronic components 140 such as chips 140 or integrated circuits 140, may be disposed on the at least one rigid circuit board portion 120.
  • the electronic components 140 or chips 140 or integrated circuits 140 may be electrically connected to the at least one rigid printed circuit board part 120.
  • the electronic components 140 may be distributed to the plurality of rigid circuit board parts 120.
  • an electronic component may be arranged on some rigid printed circuit board parts 120 and more than one electronic component, for example two, may be arranged on other rigid printed circuit board parts 120.
  • any suitable number of electronic components such as none, one, two, three or more, may be disposed on each of the at least one rigid circuit board portions 120, depending on which circuit is to be constructed.
  • an underfill material may be disposed between the at least one rigid circuit board part 120 and one, some or all of the electronic components 140.
  • the underfill material can be an elastic, temperature-resistant plastic.
  • the underfill material may be introduced between the electronic component 140 and the at least one rigid printed circuit board part 120.
  • the underfill material may be injected in a liquid state between the electronic component 140 and the rigid circuit board portion 120, or may be drawn or introduced into the gap between the electronic component 140 and the at least one rigid circuit board portion 120 by capillary forces.
  • the electronic component 140 may be supported flat on the at least one rigid printed circuit board part 120.
  • the electronic component 140 may not only be supported by the contact points to the rigid printed circuit board parts 120.
  • a mechanical stability of the connection between electronic component 140 and substrate 120 can be improved, in particular against forces acting from the outside, such as bending and / or shear forces.
  • the contact assembly 130 may be disposed within the ring formed by the at least one rigid circuit board portion 120.
  • the contact arrangement 130 can therefore be arranged centrally relative to the at least one rigid printed circuit board part 120.
  • forces such as bending and / or shear forces can act on the circuit board 100.
  • the flexible printed circuit board part 110 can yield and / or follow the acting forces.
  • the at least one rigid printed circuit board part 120 does not or hardly gives in to the acting forces. Act that For example, forces from the outside, ie from one side, which is on the opposite side of the contact arrangement 130 as viewed from the at least one rigid printed circuit board part 120, can act on the outside of the at least one rigid printed circuit board part 120.
  • the contact arrangement 130 can be protected from the acting forces.
  • the forces acting on the contact arrangement 130 can thus be lower than the forces acting on the outside of the at least one rigid printed circuit board part 120.
  • the at least one rigid printed circuit board part 120 and / or parts of the flexible printed circuit board part 110 can be cast.
  • the at least one rigid printed circuit board part 120 and / or parts of the flexible printed circuit board part 110 can be cast with a potting material, such as hot melt adhesive or hot glue.
  • hotmelt adhesive can be understood as meaning solvent-free products which are solid at room temperature and which are applied to an adhesive surface when hot and produce a solid compound on cooling, for example, polyethylenes or other polymers, epoxy resins, silicones, casting resins, amorphous polyalphaolefins, hydrocarbon resins, etc. be used.
  • the contact arrangement 130 are exposed, so not shed.
  • the contacts 132, 134 may thus be exposed, in particular to allow electrical contacting of the contacts 132, 134 and / or the contact arrangement 130.
  • an annular encapsulation 150 is shown.
  • more than one potting 150 may be provided, for example, four potting 150.
  • a potting 150 may be provided for each of the at least one rigid circuit board parts 120.
  • the number of at least one potting 150 may correspond to the number of the at least one rigid printed circuit board part 120.
  • the at least one encapsulation 150 can simulate or correspond to the shape or structure of the at least one rigid printed circuit board part 120.
  • the potting 150 can further increase the mechanical stability.
  • a detachment of the at least one rigid circuit board portion 120 of the flexible circuit board portion 110 and a detachment of the electronic components 140 of the at least one rigid circuit board parts 120 prevents or reduce the likelihood thereof.
  • any suitable number of encapsulants 150 may be provided, for example two or more encapsulants 150.
  • the individual encapsulants 150 may also take different forms.
  • a potting 150 of the plurality of potting 150 may be formed larger or smaller than another potting 150 of the plurality of potting 150.
  • FIG 5 shows an example of a cross section through the printed circuit board 100 along the drawn in Figure 4 line V-V.
  • the encapsulation 150 covers the at least one rigid printed circuit board part 120.
  • the potting 150 may also cover the electronic component (s) 140.
  • the at least one potting 150 in particular, the at least one rigid printed circuit board part 120 and, in particular, the elements arranged thereon are potted.
  • the potting 150 may also shed or cover portions of the flexible circuit board portion 110.
  • the at least one encapsulation 150 can be formed to be the same size or larger than the at least one rigid printed circuit board part 120.
  • the at least one encapsulation 150 does not cover the contact arrangement 130.
  • the at least one potting 150 may be formed with a height to cover and / or shed the electronic component (s) 140.
  • a sensor component comprises a printed circuit board having a flexible circuit board part and a contact arrangement formed on the flexible circuit board part and having a plurality of contacts, which are in particular configured to be contacted with a conductive structure , and at least one sensor element.
  • FIG. 6A shows an exploded view of a sensor component 200 according to examples described herein.
  • a sensor component 200 includes a circuit board 100 and at least one sensor element 210.
  • the circuit board 100 may be the circuit board 100 described herein.
  • the at least one sensor element 210 can build or form a sensor matrix.
  • the at least one sensor element 210 may have a contact point 230.
  • each of the at least one sensor elements 210 may include a pad 230.
  • the contact points 230 of the sensor matrix can form a sensor contact arrangement.
  • the sensor contact order may be electrically connected to the contact arrangement 130 of the printed circuit board 100.
  • the at least one pad 230 may be laminated to one of the plurality of contacts 132, 134, particularly one of the plurality of first contacts 132, the contact assembly 130 of the circuit board 100.
  • a stable connection can be formed between the contacts of the contact arrangement 130 and the at least one contact pad 230.
  • an electrical contact between the contacts of the contact arrangement 130 and the at least one contact point 230 can have a high mechanical stability to acting forces, such as bending and shearing forces.
  • the at least one sensor element 210 may be provided or arranged on one side of the printed circuit board 100, which faces away from the side of the printed circuit board 100, on which the at least one optionally cast, rigid printed circuit board part 120 is trained.
  • the at least one contact point 230 of the at least one sensor element 210 can be aligned with the contacts 132, 134, in particular the first contacts 132, of the contact arrangement 130.
  • the number of sensor elements 210 may correspond to the number of first contacts 132 of the contact arrangement 130.
  • a first contact 132 of the contact arrangement 130 can be provided for each sensor element 210.
  • a first laminating film 240a On a side facing away from the at least one sensor element 210 side of the circuit board 100, a first laminating film 240a may be provided. On a side facing away from the circuit board 100 side of the at least one sensor element 210 or the sensor matrix, a second laminating film 240 b may be provided.
  • the first laminating film 240 a and the second laminating film 240 b may have a shape corresponding to the shape of the contact assembly 130.
  • the first laminating film 240 a and the second laminating film 240 b may cover the contact arrangement 130.
  • the first laminating film 240a and the second laminating film 240b may be formed as disks or disk-shaped.
  • the first laminating film 240a and the second laminating film 240b may cover the surface spanned by the contact arrangement 130.
  • a stable bond can be formed between the first laminating film 240a and the second laminating film 240b.
  • a mechanically stable connection between the contact arrangement 130 and the at least one contact point 230 of the at least one sensor element 210 may be formed.
  • a stable connection can be formed in that the first laminating film 240a and the second laminating film 240b are glued together in areas where the contact arrangement 130 and the at least one contact point 230 of the at least one sensor element 210 are not formed, and the contact - Include arrangement 130 and the at least one contact point 230 of the at least one sensor element 210 in the areas or gluing over, in which the contact arrangement 130 and the at least one contact point 230 of the at least one sensor element 210 are formed.
  • the first laminating film 240a and the second laminating film 240b may comprise a thermoplastic such as polypropylene, and / or as biaxially oriented polypropylene ("oriented polypropylene") oriented or BOPP ("biaxially oriented polypropylene") Polypropylene) films are executed. Further, the first laminating film 240a and the second laminating film 240b may be adhesive-coated carrier films, or films of another hot or cold laminating method. According to examples described herein, the contact arrangement 130 and / or the contacts of the contact arrangement 130 can be connected and / or attached to the at least one contact point 230 of the at least one sensor element 210 by means of a hook-and-loop fastener.
  • the first laminating film 240a and the second laminating film 240b could be formed as a chafer or loop tape.
  • the first laminating film 240a could be configured as a chopping belt and the second laminating film 240b as a loop tape.
  • the first laminating film 240a could be formed as a loop tape and the second laminating film 240b as a chopping belt.
  • the contact assembly 130 and / or the Contacts of the contact arrangement 130 and the at least one contact point 230 of the at least one sensor element 210 are held together by a Velcro effect.
  • the at least one sensor element 210 may include a sensor surface and a lead.
  • the supply line can electrically connect the sensor surface with the at least one contact point.
  • the feed line can be made thinner than the sensor surface and / or have a smaller cross section than the sensor surface.
  • the at least one sensor element 210 may comprise a textile material.
  • the sensor element 210 may comprise a textile conductor.
  • a "textile material” for the sensor element 210 or a “textile conductor” can be understood as a, in particular woven or knitted, textile material which has electrically conductive threads or fibers.
  • a metal such as nickel, silver, zinc, copper, aluminum, or alloys of such metals may be applied to fibers or filaments to impart electrical conductivity thereto.
  • the sensor element 210 may not be a conductive fabric according to examples described herein.
  • the sensor element 210 may be a conductive structure or layer produced by a printing process.
  • the printing method may be, in particular, a screen printing, letterpress or gravure printing method, transfer printing method, or a non-contact printing method similar to an inkjet or SD printing method.
  • the conductive structure may be provided by an electrically conductive, in particular elastic, printing material ("ink” or "ink”).
  • the elasticity, especially in the cured state, can in practice offer the advantage that a stable conductivity is achieved over many dynamic load changes and bending movements.
  • the conductive printing material can be applied to an already existing layer of the sensor sole or have its own carrier material (substrate). If a separate carrier material is present, the carrier material may in particular be a textile, for example a polyester-based textile, an elastic polymer film, or another flexible carrier material. In practice, it may be advantageous if both sensor surfaces as Also sensor leads are printed, since then no contacting of sensor surfaces and leads is necessary.
  • the sensor surfaces may be printed with recesses in order to save printed material compared to a completely printed sensor.
  • the recesses can be designed such that a resulting grid structure results in an electric field of the capacitive sensors that differs only insignificantly from the electric field of fully printed sensors (without recesses), and thus in particular despite saving of printing material no significant impairment of the performance of the sensors is caused in practice.
  • FIG. 6B shows, by way of example, a section of a sensor element 210, in which a sensor 410 with latticed recesses 420 and a sensor supply line 430 and contact point 230 associated with the sensor are illustrated. All elements shown have the printing material, while a possibly used carrier material is not shown.
  • FIG. 6C shows an exploded view of a sensor component 200 according to further examples described herein.
  • the second laminating film 240b may be annular.
  • the second laminating film 240 b may be formed to correspond to the first contacts 132 of the contact arrangement 130.
  • the second laminating film 240b may therefore be designed to cover some, but not all, of the contacts of the contact arrangement 130.
  • the second contact 134 of the contact arrangement 130 may be exposed.
  • the sensor component 200 may further include an Abstandshalter layer 260 and / or a ground layer 270.
  • the Ab standhalter layer 260 may be an insulating layer and / or having an insulating material.
  • the spacer layer 260 may be formed on one side of the at least one sensor element 210, which faces away from the printed circuit board 100.
  • the spacer layer 260 may have a height to provide a distance between the at least one sensor element 210 and the ground layer 270. The distance provided by the spacer layer 260 between the at least one sensor element 210 and the ground layer 270 may be variable.
  • the distance provided by the spacer layer 260 between the at least one sensor element 210 and the ground layer 270 may be below the Influence of external forces be changeable.
  • the height of the spacer layer 260 may decrease under the action of a mechanical force or pressure.
  • the spacer layer may, for example, comprise a foam having preferably a high mechanical restoring force.
  • the ground layer 270 may be a conductive layer and / or may include a conductive material.
  • the ground layer 270 may comprise a textile conductor or a metal.
  • the ground layer 270 may be formed to correspond to the at least one sensor element 210. In the event that more than one sensor element 210 is provided, which in particular form the sensor matrix, the ground layer 270 may be formed to correspond to an area spanned by the sensor matrix.
  • the ground layer 270 may include a plurality of conductive areas that may be insulated from each other.
  • the ground layer 270 may, for example, have a matrix structure like the sensor matrix.
  • the ground layer 270 may have a matrix structure of conductive regions that intersects with a structure of the sensor matrix of the at least one sensor element 210 to provide multiple intersection points between the matrix structure of the conductive regions of the ground layer 270 and the sensor matrix form.
  • the ground layer 270 may include conductive regions arranged in a row structure, and a plurality of sensor elements 210 arranged with a columnar structure may be provided.
  • capacitive pressure sensors could be formed on intersecting intersections between the conductive regions of the ground layer with the plurality of sensor elements 230.
  • the ground layer 270 may be electrically connected to the contact arrangement 130 of the circuit board 100.
  • the ground layer 270 may be electrically connected to the second contact 134 of the contact arrangement 130.
  • the spacer layer 260 may have an opening or hole corresponding to an opening or hole of the second laminating film 240b.
  • a conductive foam may be provided in the opening of the spacer layer 260.
  • the conductive foam may be provided to provide an electrically conductive connection between the contact arrangement 130, in particular the second contact 134, and form the ground layer 270.
  • the second contact 134 may also be referred to as ground contact 134.
  • a plurality of second contacts 134 may be provided.
  • a number of conductive regions of the ground layer 270 may correspond to a number of second contacts 134.
  • the one or more second contacts 134 of the contact assembly 130 may be laminated with one or more contact elements of the conductive regions of the ground layer 270.
  • a third laminating film may be provided to laminate and / or electrically connect the one or more second contacts 134 of the contact assembly 130 to the one or more contact elements of the conductive regions of the ground layer 270.
  • the contacting of layers 270 may also be formed outside the contact arrangement and / or may serve for contacting in both directions (ie up and down), as shown in FIG. 6D.
  • some layers of the sensor sole are shown by way of example. In particular, not all insulating layers are shown.
  • an electrically conductive portion of the sensor element 210 may be connected via an electrically conductive contact 280 to the contact 134 of the electronic board. Via further electrically conductive contacts 281 and 282, further layers may be electrically connected to the contact 134.
  • the ground layer 270 and / or a further ground layer 271 may be electrically connected to the contact 134 via further electrically conductive contacts 281 and / or 282.
  • the at least one sensor element 210, the spacer layer 260, and the ground layer 270 may form a capacitive pressure sensor.
  • the capacitive pressure sensor can react to pressure changes with a changed measurement signal. For example, by the action of a mechanical force or a mechanical pressure, the distance between the at least one sensor element 210 and the ground layer 270 can be changed. If more than one sensor element 210 is provided, a spatial resolution of the measurement signal can be achieved.
  • FIG. 7 shows a schematic drawing of a sensor component according to examples described herein. In particular, FIG. 7 shows a detailed view of the sensor component 200 in the region of the contact arrangement 130.
  • the contact arrangement 130 and / or the contacts of the contact arrangement 130 can be sewn to the at least one contact point 230 of the at least one sensor element 210 (not shown in FIG. 7).
  • one contact of the contact arrangement 130 can be sewn to a contact point.
  • seams 250 may be provided for sewing the contact arrangement 130 and the at least one contact point of the at least one sensor element 110.
  • the seams 250 may be provided in a suitable number to achieve a mechanically stable connection.
  • a sewing thread made of cotton, silk, polyester, polyamide, elastane and / or Teflon can be used.
  • the seams 250 may be set, for example, by hand or with a CNC sewing machine.
  • the contact arrangement 130 and / or the contacts of the contact arrangement 130 may be potted with the at least one contact point 230 of the at least one sensor element 210.
  • a potting of the contact arrangement 130 and / or the contacts of the contact arrangement 130 with the at least one contact point 230 of the at least one sensor element 210 can also take place together with the at least one potting 150.
  • the annular encapsulation 150 shown in the examples of FIG. 3 can be formed as a disk or disk-shaped.
  • the potting 150 may in particular cover the contact arrangement 130 or the contacts of the contact arrangement.
  • the encapsulation 150 can only take place after the contact arrangement 130 has been connected to the at least one contact point 230 of the at least one sensor element 210.
  • the at least one contact pad 230 of the at least one sensor element 210 may be connected to the contact arrangement 130 or the Contacts of the contact arrangement 130 are connected and / or with or on the contact arrangement 130 or the contacts of the contact arrangement 130 are attached.
  • detachment of the at least one contact pad 230 from the contact assembly 130 can be prevented.
  • potting material may be prevented from entering between the at least one pad 230 and the contact assembly 130.
  • a portion of the at least one pad 230 may be laminated to a portion of at least one of the plurality of first contacts 132 of the contact assembly 130 of the circuit board 100.
  • one end of the at least one pad 230 may be laminated to an end of one of the plurality of first contacts 132.
  • fixing laminating films such as, for example, the first laminating film 240a and the second laminating film 240b could be used, which in particular covers only one end of one or more of the plurality of first contacts 132.
  • the Fixer laminating films could be discs or disk-shaped, in particular having a smaller radius such as the first laminating film 240a and the second laminating film 240b.
  • the area of the contact arrangement not covered by the fixing laminating films can be potted.
  • a first fixation of the at least one contact point 210 with the contact arrangement 130 or contacts of the contact arrangement 130 can take place before a particularly permanent connection between the at least one contact point 210 and the contact arrangement 130 is formed.
  • any suitable type of attachment or fixation can be selected.
  • a part of the at least one contact point 210 can be glued to the contact arrangement 130 or to contacts of the contact arrangement 130, in particular with an electrically conductive adhesive.
  • the encapsulation formed here may differ from the encapsulation 150 of the at least one rigid printed circuit board part 120.
  • the encapsulation of the contact arrangement 130 or of contacts of the contact arrangement 130 may be made thinner than the encapsulation 150 of the at least one rigid circuit board portion 120.
  • the Potting the contact to order 130 or contacts of the contact arrangement 130 during the casting of the at least one rigid printed circuit board part 120 is covered or poured over.
  • FIGS. 8A to 8C show a potting of the contact arrangement 130 that is thinner than the encapsulation 150.
  • the figures show an example in which the encapsulation of the contact arrangement 130 is not ring-shaped, but in particular is clover-shaped in four areas.
  • the orientation of the subdivision of the potting of the contact arrangement 130 may correspond to the subdivision of the encapsulation 150 of the electronics (see FIG. 8A).
  • a sole in particular for measuring a pressure on a foot sole, in particular a pressure acting on the human foot sole, comprises a sensor component integrated in the sole.
  • the sensor component comprises a printed circuit board having a flexible circuit board part and a contact arrangement formed on the flexible circuit board part and having a plurality of contacts, which are in particular configured to be contacted with a conductive structure, and at least one sensor element.
  • FIG. 9 shows a schematic drawing of a sole 300 according to examples described herein.
  • the sole 300 may in particular be suitable for receiving a sensor component 200.
  • the sole 300 comprises a receptacle 310 for the sensor component 200 or for parts of the sensor component 200.
  • the receptacle 310 may be configured to receive the at least one possibly cast, rigid circuit board part 120.
  • the receptacle 310 has a size such that the printed circuit board 100, in particular the possibly cast, rigid printed circuit board part 120 can be accommodated. In particular, the circuit board 100 can be received flush.
  • the printed circuit board 100 can thus be received in the receptacle 310 and / or the sole 300, so that a side remote from the sole 300 of the Circuit board 100 terminates with one of the circuit board 100 facing side of the sole 300 and / or lies in a plane.
  • a clover-shaped receptacle 310 is shown, that is to say a receptacle 310 which is configured to receive a printed circuit board 100 with a clover-shaped arrangement of the at least one rigid printed circuit board part 120. If the at least one rigid printed circuit board part 120 is formed with a different shape, for example circular or annular, then the receptacle 310 can be correspondingly configured to receive the printed circuit board 100.
  • the receptacle 310 may in particular be configured to correspond to the shape of the potting 150 or the potting 150.
  • the example of FIG. 9 may have contact receptacles 330 for the contact arrangement 130.
  • two contact receptacles 330 are shown. These can be arranged in a region which is not surrounded by the at least one rigid printed circuit board part 120.
  • the contact assembly 130 may also be disposed in the center of the at least one rigid circuit board portion 120, in particular surrounded or enclosed by the at least one rigid circuit board portion 120.
  • the receptacles 330 may be omitted and the receptacle 310 configured accordingly.
  • the receptacle 310 may be configured to receive the contact arrangement 130. As shown in the example of FIG.
  • the sole 300 may have further recesses for receiving the extensions of the printed circuit board 100 described herein.
  • a recess 322 for an antenna, a recess 324 for a battery connection and a recess 326 for a USB connection are shown in FIG.
  • the sole 300 may include alignment members 340.
  • the alignment elements 340 may in particular serve the alignment of the sensor component 200 with the sole 300.
  • the printed circuit board 100 and / or the sensor component 200 can be threaded onto the alignment elements 340 with the positioning holes described above and / or stored.
  • FIG. 10 shows an example of a sole 300 with inserted or inserted sensor component 200.
  • a sensor component 200 is shown having a ring-shaped, rigid printed circuit board part 120 and a central arrangement of the Contact arrangement 130 shows.
  • the sole 300 may be configured to measure a mechanical pressure on a sole of the foot, particularly a pressure acting on the human foot sole, and the sensor component 200 may be integrated into the sole 300.
  • the sole 300 may for example be an insole.
  • a "sole” may be understood as being opposite or facing a foot so that the "sole", e.g., sole 300, can measure forces applied to the foot.
  • the sole may also be provided or incorporated in a plaster or an orthopedic walking or running track, in particular in a running surface of an orthopedic walking or running track.
  • the sole may also be understood as something that is removable or integral part of footwear.
  • FIG. 11 shows a cross-sectional drawing of a sole 300 according to examples described herein, in particular along a line X-X of FIG. 10.
  • the sole 300 may include a receptacle 310 for the sensor component 200, wherein an inner dimension of the receptacle 310 is larger than an outer dimension of the sensor component 200.
  • an inner dimension of the receptacle 310 in an area in which the at least one rigid printed circuit board part 120 is formed may be larger than an outer dimension of the printed circuit board 100 in this area.
  • the outer dimension of the printed circuit board 100 in this area may substantially correspond to an outer dimension of the at least one potting 150.
  • a gap may be formed between the inner dimension of the receptacle 310 and the outer dimension of the sensor component 200 and / or the printed circuit board 100.
  • the gap may in particular be formed in a region of the at least one rigid printed circuit board part 120 or of the at least one potting 150.
  • no gap can be formed between the printed circuit board 100, in particular the flexible printed circuit board part 110, and the inner dimension of the receptacle 310.
  • the sole 300 may have high mechanical stability to acting forces.
  • the gap formed at least partially between the inner dimension of the receptacle 310 and the outer dimension of the sensor component 200 may be at least partially filled with a viscous material.
  • the viscous material may, for example, comprise silicone, be a silicone compound, or be formed of rubber or other deformable material.
  • the viscous material can provide cushioning.
  • an attenuation of forces acting in the transition from sole 300 and / or receptacle 310 to the sensor element 200 and or the printed circuit board 100 can be achieved.
  • shear and bending forces act on the sole 300, for example during a rolling movement of a foot.
  • the shear and bending forces may be transmitted to the circuit board 100 and / or the sensor element 200.
  • These forces can lead to a detachment of components, such as the electronic components 140, from the printed circuit board 100 and / or detachment of the at least one contact point 230 of the at least one sensor element 210 from the contact arrangement 130 and / or a breakage of the printed circuit board 100 ,
  • the measures for increasing the mechanical stability described herein can counteract these effects and contribute to a longer shelf life.
  • a printed circuit board, a sensor component and a sole can be provided which, when put into practice, have a particularly high mechanical stability against acting forces.
  • the influence of external forces on the contacts can be protected by the geometric arrangement of the contacts in the contact arrangement.
  • This protection can be further increased by a relative arrangement of the at least one rigid printed circuit board part.
  • a stable connection of the contacts with contact points of the at least one sensor element can be provided.
  • the protected arrangement of the contacts can be exposed to less mechanical stress.
  • a relative movement between the contacts and the at least one contact point of the at least one sensor element can be singled out during operation. This can increase the stability of the mechanical and electrical connection. Further, for example, by laminating the Contacts and the at least one contact point of the at least one sensor element, they are further increased stability of the connection.
  • the printed circuit board and / or the sensor component can also be used in other products or the products can the printed circuit board and / or the sensor component.
  • a glove may include the circuit board and / or the sensor component to measure a pressure applied by the human or animal hand to another object and / or to act on the human or animal hand.
  • the printed circuit board and / or the sensor component can also be used in functional clothing, often referred to as "wearable" in English, such as a functional jacket.
  • the printed circuit board and / or the sensor component can also be used for or in mattresses, in particular for determining a sleeping position and / or a sleeping behavior, and / or in carpets or floors, for example for Determining a walking movement, in particular a rolling behavior when walking, or for determining whether a person has fallen, ie in particular for emergency detection, can be used
  • the circuit board and / or the sensor component can be installed in all objects with which a person mechanically An example of this is the use of the printed circuit board and / or the sensor component s for or in a steering wheel to determine an interaction of a driver with the steering wheel can.

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  • Structure Of Printed Boards (AREA)

Abstract

La présente invention concerne une carte de circuit imprimé. La carte de circuit imprimé (100) comprend une partie carte de circuit imprimé flexible (110), et un dispositif de contact (130) formé sur la carte de circuit imprimé flexible (110). Le dispositif de contact (130) comprend plusieurs contacts (132, 134), lesquels sont de préférence configurés pour venir en contact électrique avec une structure conductrice.
PCT/EP2016/078066 2015-11-18 2016-11-17 Carte de circuit imprimé, module de capteur et semelle WO2017085218A1 (fr)

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DE102015119996.3 2015-11-18
DE102015119996.3A DE102015119996A1 (de) 2015-11-18 2015-11-18 Leiterplatte, Sensor-Bauteil und Sohle

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CN108433734A (zh) * 2018-02-08 2018-08-24 浙江大学 一种离散阈值式足底压力传感装置
CN113347899A (zh) * 2019-01-24 2021-09-03 伊科斯克有限公司 用于鞋类物品的负荷感测装置

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JP7027174B2 (ja) * 2018-01-15 2022-03-01 オムロン株式会社 血圧測定装置
DE202018100359U1 (de) * 2018-01-23 2019-04-24 automation & software Günther Tausch GmbH Schuhsohle zum Bestimmen eines Drucks sowie Schuh und ein Paar Schuhe

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US7426873B1 (en) * 2006-05-04 2008-09-23 Sandia Corporation Micro electro-mechanical system (MEMS) pressure sensor for footwear
US20110075384A1 (en) * 2009-09-29 2011-03-31 Yeates Kyle H Component mounting structures for electronic devices
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DE102013209296A1 (de) * 2013-05-21 2014-11-27 Continental Automotive Gmbh Elektronisches Modul, insbesondere Steuergerät für ein Fahrzeug und Verfahren zu dessen Herstellung

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CN108433734A (zh) * 2018-02-08 2018-08-24 浙江大学 一种离散阈值式足底压力传感装置
CN113347899A (zh) * 2019-01-24 2021-09-03 伊科斯克有限公司 用于鞋类物品的负荷感测装置
CN113347899B (zh) * 2019-01-24 2023-12-19 伊科斯克有限公司 用于鞋类物品的负荷感测装置

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