WO2017072920A1 - Organic el display device - Google Patents

Organic el display device Download PDF

Info

Publication number
WO2017072920A1
WO2017072920A1 PCT/JP2015/080604 JP2015080604W WO2017072920A1 WO 2017072920 A1 WO2017072920 A1 WO 2017072920A1 JP 2015080604 W JP2015080604 W JP 2015080604W WO 2017072920 A1 WO2017072920 A1 WO 2017072920A1
Authority
WO
WIPO (PCT)
Prior art keywords
organic
substrate
light emitting
display device
emitting element
Prior art date
Application number
PCT/JP2015/080604
Other languages
French (fr)
Japanese (ja)
Inventor
小玉 光文
恵 紺野
洋平 藤村
朋久 高山
圭介 渡辺
Original Assignee
双葉電子工業株式会社
双葉モバイルディスプレイ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 双葉電子工業株式会社, 双葉モバイルディスプレイ株式会社 filed Critical 双葉電子工業株式会社
Priority to PCT/JP2015/080604 priority Critical patent/WO2017072920A1/en
Publication of WO2017072920A1 publication Critical patent/WO2017072920A1/en

Links

Images

Classifications

    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00Electroluminescent light sources
    • H05B33/02Details
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00Electroluminescent light sources
    • H05B33/02Details
    • H05B33/04Sealing arrangements, e.g. against humidity
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00Electroluminescent light sources
    • H05B33/12Light sources with substantially two-dimensional radiating surfaces
    • H05B33/22Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of auxiliary dielectric or reflective layers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00

Definitions

  • the present invention relates to an organic EL display device.
  • Patent Document 1 describes a panel of a passive matrix organic EL display device having an image display array composed of a plurality of light emitting units. Such a panel is provided with a plurality of strip-shaped partition walls arranged side by side.
  • Patent Document 1 a plurality of light emitting portions are separated from each other by separating a conductive layer provided on the light emitting layer using a partition wall.
  • a partition wall When the conductive layer is separated using the partition wall in this way, a part of the partition wall is exposed without being covered with the conductive layer. There is a risk that moisture in the air may enter the panel from the exposed portion of the partition wall.
  • moisture enters the organic EL layer the lifetime of the organic EL layer is reduced, and the reliability of the organic EL display device is reduced.
  • the organic EL display device has been made a see-through type to improve the design.
  • a light-impermeable desiccant cannot be disposed on the light emitting layer. Therefore, in the see-through type organic EL display device having the structure of Patent Document 1, the lifetime of the organic EL layer is significantly reduced.
  • An object of one aspect of the present invention is to provide an organic EL display device capable of suppressing a reduction in lifetime.
  • An organic EL display device is provided over a first substrate, a first substrate, a first light-emitting element and a second light-emitting element each including an organic EL layer, and the first substrate.
  • the first substrate, the first light-emitting element, the second light-emitting element, the element separating portion, the second substrate, and the filler have a light-transmitting property.
  • the filler includes a light-transmitting desiccant and covers the exposed region of the element isolation portion.
  • the element isolation portion includes a strip-shaped first portion provided on the first substrate and a strip-shaped second portion provided on the first portion. In the width direction of the element isolation portion, the second portion Both sides of the part may protrude from the first part.
  • the second portion may have a taper shape in the width direction cross section.
  • the second portion may have a width direction cross-section inversely tapered shape.
  • the organic EL display device described in the above paragraph is further provided with a frame-shaped adhesive portion that is provided along the edge of the first substrate and joins the first substrate and the second substrate.
  • the region surrounded by the part may be filled.
  • first substrate and the second substrate may have flexibility.
  • an organic EL display device that can suppress a reduction in lifetime.
  • FIG. 1 is a schematic perspective view showing the organic EL display device according to the first embodiment.
  • FIG. 2 is a sectional view taken along line AA in FIG.
  • FIG. 3 is a sectional view taken along line BB in FIG.
  • FIG. 4 is a partial cross-sectional view of the organic EL display device according to the second embodiment.
  • FIG. 5A is a partial cross-sectional view of an organic EL display device according to a first modification of the second embodiment.
  • FIG. 5B is a partial cross-sectional view of an organic EL display device according to a second modification of the second embodiment.
  • FIG. 1 is a schematic perspective view showing the organic EL display device according to the first embodiment.
  • An organic EL display device 1 shown in FIG. 1 is a self-luminous passive matrix display using an organic EL.
  • the organic EL display device 1 includes an element substrate 2 (first substrate), light emitting elements 3A to 3F and element separation portions 4A and 4B provided on the element substrate 2, an element substrate 2, light emitting elements 3A to 3F, and elements
  • a sealing substrate 5 (second substrate) provided on the separation portions 4A and 4B, an external connection circuit 6, and an adhesive portion 7 for joining the element substrate 2 and the sealing substrate 5 are provided.
  • the organic EL display device 1 includes a plurality of light-emitting elements (not shown) other than the light-emitting elements 3A to 3F and a plurality of element separation parts (not shown) other than the element separation parts 4A and 4B.
  • the element substrate 2 has insulation and light transmission and has a substantially rectangular main surface 2 a facing the sealing substrate 5.
  • the light transmissive property means a function of transmitting at least part of light.
  • the element substrate 2 having light transmissivity may have a function of transmitting incident light and may absorb or reflect a part of the light.
  • a glass substrate or a plastic substrate is used as the element substrate 2.
  • a PET film polyethylene terephthalate film
  • a polyimide film is used as the element substrate 2.
  • a driving circuit for driving the light emitting element On the main surface 2a of the element substrate 2, in addition to the light emitting element and the element separating portion, a driving circuit for driving the light emitting element, wiring for connecting the driving circuit and the light emitting element, an external connection terminal, and the like are provided. .
  • the light emitting elements 3A to 3F are self-light emitting elements arranged in a matrix on the main surface 2a, and correspond to the pixels of the organic EL display device 1.
  • the light emitting elements 3A to 3F are independently controlled to a light emitting state or a non-light emitting state.
  • the organic EL display device 1 only the light emitting element 3A can be in a light emitting state, and the light emitting elements 3B to 3F can be in a non-light emitting state.
  • the light emitting elements 3A to 3F have the same structure.
  • the element separating portions 4A and 4B are members that separate adjacent light emitting elements, and extend so as to form a belt shape in a plan view. As shown in FIG. 1, when the light emitting elements 3A to 3C are arranged in order along the extending direction of one side of the main surface 2a, the element separating portion 4A is located between the adjacent light emitting elements 3A and 3B. The light emitting elements 3A and 3B are separated by extending in a direction orthogonal to the extending direction. Similarly, the element separation part 4B extends in a direction orthogonal to the extending direction between the adjacent light emitting elements 3B and 3C, and separates the light emitting elements 3B and 3C.
  • the direction orthogonal to the extending direction is not limited to a direction intersecting at right angles to the extending direction, and may be a direction intersecting substantially at right angles.
  • the sealing substrate 5 has insulation and light transmission, and has a substantially rectangular main surface 5 a facing the element substrate 2.
  • the sealing substrate 5 is a substrate that covers the region where the light emitting element is provided by bonding to the element substrate 2 through the bonding portion 7.
  • a glass substrate or a plastic substrate is used as the sealing substrate 5.
  • a PET film polyethylene terephthalate film
  • a polyimide film is used as the sealing substrate 5.
  • the external connection circuit 6 is a circuit connected to a drive circuit or the like provided on the main surface 2 a of the element substrate 2.
  • the organic EL display device 1 can be connected to an external device, a power source, and the like via an external connection circuit 6 connected to an external connection terminal provided on the element substrate 2.
  • an FPC Flexible Printed Circuit
  • the bonding portion 7 is a member that joins the element substrate 2 and the sealing substrate 5 as described above, and is a frame-like member provided along the edge of the element substrate 2.
  • the bonding portion 7 is provided so as to surround the light emitting element and the element separation portion provided on the element substrate 2.
  • FIG. 2 is a sectional view taken along line AA in FIG. As shown in FIG. 2, the bonding portion 7 accurately bonds the second insulating film 13 on the first insulating film 11 provided on the main surface 2 a of the element substrate 2 and the sealing substrate 5. Yes.
  • the bonding portion 7 includes, for example, an ultraviolet curable epoxy resin.
  • the edge of the element substrate 2 may include a region around the edge of the element substrate 2.
  • FIG. 3 is a sectional view taken along line BB in FIG.
  • separation part 4A, the filler 16, and the sealing substrate 5 are provided on the main surface 2a.
  • the light emitting element 3A first light emitting element
  • the light emitting element 3B second light emitting element
  • the first insulating film 11 is a light transmissive film provided so as to cover the main surface 2 a of the element substrate 2.
  • a silicon oxide film, a silicon nitride film, a silicon oxynitride film, or an aluminum oxide film is used as the first insulating film 11.
  • the first insulating film 11 is formed by, for example, a CVD method (chemical vapor deposition method).
  • the first electrode 12 is an electrode that functions as an anode of the light emitting elements 3A and 3B, and is provided on the first insulating film 11.
  • the first electrode 12 is composed of a transparent conductive layer patterned in a stripe shape.
  • the first electrode 12 extends in a direction orthogonal to the extending direction of the element isolation portion 4A, in other words, in a direction from the light emitting element 3A toward the light emitting element 3B.
  • ITO indium tin oxide
  • the transparent conductive layer may have a single layer structure or a multilayer structure.
  • the transparent conductive layer is formed by, for example, vapor deposition using an electron beam or the like, or PVD method (physical vapor deposition method) such as sputtering.
  • the first electrode 12 is formed by patterning the formed transparent conductive layer using, for example, a resist mask.
  • the transparent conductive layer may be a conductive layer having optical transparency, and may not be a completely transparent conductive layer.
  • the second insulating film 13 is a light transmissive film provided on the first insulating film 11 and the first electrode 12.
  • an inorganic film such as a silicon oxide film, a silicon nitride film, a silicon oxynitride film, or an aluminum oxide film, or an organic film such as a novolac resin, an acrylic resin, or a polyimide is used.
  • the thickness of the second insulating film 13 is about 1 ⁇ m, for example.
  • the second insulating film 13 is formed by, for example, a CVD method.
  • the second insulating film 13 is formed by, for example, spin coating.
  • the second insulating film 13 is provided with openings 13a and 13b. A portion of the first electrode 12 is exposed from the second insulating film 13 through the openings 13a and 13b.
  • the opening 13a is formed to provide the light emitting element 3A
  • the opening 13b is formed to provide the light emitting element 3B.
  • the openings 13a and 13b are provided by patterning using a resist mask, for example.
  • the organic EL layers 14A and 14B are layers including at least an organic compound (light emitting material) that emits light when electrons and holes are injected.
  • the organic EL layer 14 ⁇ / b> A is a light transmission layer that is in contact with the first electrode 12 in the opening 13 a and is provided on the second insulating film 13.
  • the organic EL layer 14B is a light transmission layer provided on the second insulating film 13 while being in contact with the first electrode 12 in the opening 13b.
  • the thickness of the organic EL layers 14A and 14B is, for example, not less than 100 nm and not more than 500 nm.
  • the organic EL layers 14A and 14B are formed, for example, by a dry method such as a vacuum evaporation method or a wet method such as an inkjet. In the first embodiment, a dry method is applied to form (patterned) organic EL layers 14A and 14B separated (patterned) by the element isolation unit 4A (details will be described later).
  • the light emitting material contained in the organic EL layers 14A and 14B may be a low molecular compound or a high molecular compound.
  • the light emitting material may be a fluorescent material or a phosphorescent material.
  • the organic EL layers 14A and 14B may include an electron injection layer, an electron transport layer, a hole injection layer, a hole transport layer, and the like in addition to the light emitting layer containing the light emitting material.
  • the organic EL layers 14 ⁇ / b> A and 14 ⁇ / b> B are formed by sequentially stacking a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, and an electron injection layer on the first electrode 12.
  • the light generated by the organic EL layers 14A and 14B may be monochromatic light such as red light or blue light, or may be white light.
  • each of the organic EL layers 14A and 14B may include a plurality of light emitting layers that generate different lights.
  • the second electrodes 15A and 15B are electrodes that function as cathodes of the light emitting elements 3A and 3B, respectively.
  • the second electrode 15A is provided on and in contact with the organic EL layer 14A.
  • the second electrode 15B is provided in contact with the organic EL layer 14B.
  • Each of the second electrodes 15A and 15B is composed of a patterned transparent conductive layer.
  • IZO indium zinc oxide
  • aluminum, silver, and magnesium are used as a material for the transparent conductive layer.
  • the transparent conductive layer may have a single layer structure or a multilayer structure.
  • each of the aluminum film, the silver film, and the magnesium film has a thickness of about 1 nm or less.
  • a transparent conductive layer is formed by PVD methods, such as vapor deposition using an electron beam etc., or sputtering, for example.
  • second electrodes 15A and 15B separated (patterned) by the element separation unit 4A are formed (details will be described later).
  • the element separation portion 4A provided between the light emitting elements 3A and 3B is provided on the second insulating film 13 that is not covered with the organic EL layers 14A and 14B and the second electrodes 15A and 15B.
  • the element isolation portion 4A is in contact with the second insulating film 13 and extends substantially parallel to the main surface 2a of the element substrate 2, and the top surface 4b that faces the bottom surface 4a and extends substantially parallel to the bottom surface 4a. And side surfaces 4c and 4d connecting the bottom surface 4a and the top surface 4b.
  • the length of the top surface 4b is larger than the length of the bottom surface 4a, and both sides of the top surface 4b are on the bottom surface 4a.
  • the side surface 4c is an inclined surface from one end of the bottom surface 4a on the light emitting element 3A side to one end of the top surface 4b on the light emitting element 3A side
  • the side surface 4d is the top surface from the other end of the bottom surface 4a on the light emitting element 3B side.
  • 4b is an inclined surface toward the other end of the light emitting element 3B side.
  • the element isolation portion 4A has an inversely tapered shape in the cross section in the width direction.
  • the height of the element isolation portion 4A is larger than the total thickness of the organic EL layer 14A and the second electrode 15A (or the total thickness of the organic EL layer 14B and the second electrode 15B), for example, 2 ⁇ m or more and 10 ⁇ m or less. It is.
  • the element isolation portion 4A is formed of an organic resin having light transmissivity such as a novolac resin.
  • the plurality of element isolation parts including the element isolation part 4B have substantially the same shape as the element isolation part 4A.
  • the element isolation part 4A is provided on the second insulating film 13 before the formation of the organic EL layers 14A and 14B and the second electrodes 15A and 15B. Therefore, on the top surface 4b of the element isolation portion 4A, an organic layer 17 made of the same material as the organic EL layers 14A and 14B, and a conductive layer 18 made of the same material as the second electrodes 15A and 15B, Is provided.
  • the organic layer 17 on the element separation portion 4A the organic EL layers 14A and 14B are favorably separated.
  • the conductive layer 18 on the element isolation portion 4A the second electrodes 15A and 15B are well separated.
  • the bottom surface 4 a is in contact with the second insulating film 13. Further, as described above, the top surface 4 b is covered with the organic layer 17. For this reason, the bottom surface 4a and the top surface 4b in the element isolation portion 4A are not exposed.
  • the side surfaces 4c and 4d of the element isolation portion 4A are exposed regions that are not covered by the organic layer 17 and the conductive layer 18 or the like.
  • the side surface orthogonal to the extending direction of the element isolation portion 4A may be an exposed region or not an exposed region.
  • a resin layer having a thickness of about 3 ⁇ m is formed on the second insulating film 13 by applying a resin on the second insulating film 13 by spin coating and then performing a heat treatment at 100 ° C. to 150 ° C.
  • a negative resist is used as the resin.
  • a part of the resin layer is exposed using a photomask in which a stripe-shaped opening is formed.
  • heat treatment is performed at 100 ° C. to 150 ° C., and the resin layer is developed using tetramethylammonium hydroxide (TMAH).
  • TMAH tetramethylammonium hydroxide
  • the development of the resin layer means removing an unexposed area in the resin layer.
  • TMAH tetramethylammonium hydroxide
  • the filler 16 is a member provided so as to fill a gap between the element substrate 2 and the sealing substrate 5.
  • the filler 16 includes the second insulating film 13 on the element substrate 2, the organic EL layers 14A and 14B, the second electrodes 15A and 15B, the side surfaces 4c and 4d that are exposed regions of the element isolation portion 4A, the organic layer 17, and the conductive layer. Covers layer 18.
  • the filler 16 is filled in a region surrounded by the adhesive portion 7 between the element substrate 2 and the sealing substrate 5 and is in contact with the sealing substrate 5 without a gap.
  • the filler 16 is formed of an organic resin having light transmissivity such as an epoxy resin.
  • the filler 16 is provided on the element substrate 2 by a coating method such as an inkjet method or a dispensing method.
  • the filler 16 may be in a cured state or in an uncured state.
  • the filler 16 includes a desiccant having light permeability.
  • a linear or cyclic organometallic compound is used as the filler containing a desiccant having light permeability.
  • This organometallic compound includes, for example, any of aluminum, lanthanum, yttrium, gallium, silicon, or germanium. In this embodiment, for example, OleDry (trademark) manufactured by Futaba Electronics Co., Ltd. is used.
  • the content of the desiccant in the filler 16 may be 50% by weight or more and 95% by weight or less.
  • the filler 16 can suitably absorb moisture remaining in the gap between the element substrate 2 and the sealing substrate 5 and moisture entering from the partition wall. Further, the filler 16 can satisfactorily fill the gap.
  • the filler 16 covers the side surfaces 4c and 4d, which are exposed regions of the element separation portion 4A that separates the light emitting element 3A and the light emitting element 3B. At the same time, it is provided so as to fill a gap between the element substrate 2 and the sealing substrate 5. For this reason, the air between the element substrate 2 and the sealing substrate 5 is pushed out by the filler 16, and the exposed region of the element separation portion 4A is covered with the filler 16 so as not to contact the air.
  • the filler 16 contains a desiccant, moisture around the light emitting element and the element separation portion in the organic EL display device 1 is absorbed by the desiccant in the filler 16.
  • the desiccant can come into contact with the exposed region of the element isolation portion, it is very difficult for moisture in the air to enter the organic EL layers 14A and 14B through the exposed region.
  • the filler 16 also covers the second insulating film 13 exposed from the organic EL layers 14A and 14B and the second electrodes 15A and 15B, the moisture in the air is organic through the second insulating film 13. Infiltration into the EL layers 14A and 14B can also be suppressed. Further, since the filler 16 also covers the organic EL layers 14A and 14B, it is possible to suppress moisture in the air from directly entering the organic EL layers 14A and 14B. In addition, gas can be prevented from being released from the exposed region of the element isolation portion 4A by the filler 16.
  • the filler 16 according to the first embodiment covers all the light emitting elements and the element separating portion in the organic EL display device 1, the filling material 16 is provided for the organic EL layer included in the light emitting elements other than the light emitting elements 3 ⁇ / b> A and 3 ⁇ / b> B. Infiltration of moisture can also be suppressed.
  • the desiccant is contained in the filler 16, it is not necessary to provide the desiccant outside the region where the light emitting element is provided in the element substrate 2. In this case, the area surrounded by the bonding portion 7 can be expanded.
  • the element substrate 2, the light emitting elements 3A to 3F, the element separation portions 4A and 4B, the sealing substrate 5, and the filler 16 have light transmittance.
  • the desiccant contained in the filler 16 is light transmissive. Thereby, the organic EL display device 1 can emit light to both the element substrate 2 side and the sealing substrate 5 side.
  • a see-through type organic EL display device capable of double-sided light emission and having a narrow frame. Can provide.
  • the organic EL display device 1 includes a frame-shaped adhesive portion 7 that is provided along the edge of the element substrate 2 and joins the element substrate 2 and the sealing substrate 5. May be filled in a region surrounded by the bonding portion 7. In this case, since the filler 16 is suppressed from leaking from the edges of the element substrate 2 and the sealing substrate 5, the yield of the organic EL display device 1 is improved. In addition, since the region where the filler 16 is formed is limited to the region surrounded by the bonding portion 7, the air in the region can be pushed out more favorably by the filler 16.
  • the element substrate 2 and the sealing substrate 5 may have flexibility. In this case, a flexible organic EL display device can be realized.
  • FIG. 4 is a partial cross-sectional view of the organic EL display device according to the second embodiment.
  • the organic EL display device 1 ⁇ / b> A includes an element separation unit 21 provided on the element substrate 2.
  • the element isolation unit 21 includes a first portion 22 provided in contact with the second insulating film 13 and a second portion 23 provided on the first portion 22.
  • the element isolation part 21 extends in a strip shape along one side of the main surface 2a, similarly to the element isolation part 4A of the first embodiment. Accordingly, the first portion 22 and the second portion 23 included in the element isolation portion 21 extend in a strip shape along the one side.
  • the first portion 22 is in contact with the second insulating film 13 and extends substantially parallel to the main surface 2a of the element substrate 2, and the top surface 22b that faces the bottom surface 22a and extends substantially parallel to the bottom surface 22a. And side surfaces 22c and 22d connecting the bottom surface 22a and the top surface 22b. In the width direction of the element isolation part 21, the length of the bottom surface 22a and the length of the top surface 22b are substantially the same. Each of the side surfaces 22c and 22d extends so as to be orthogonal to the bottom surface 22a and the top surface 22b, and the heights of the side surfaces 22c and 22d are substantially the same. Accordingly, the first portion 22 has a substantially rectangular shape in the cross section in the width direction.
  • the height of the first portion 22 is larger than the total thickness of the organic EL layer 14A and the second electrode 15A (or the total thickness of the organic EL layer 14B and the second electrode 15B), for example, 2 ⁇ m or more and 5 ⁇ m or less. It is.
  • the 1st part 22 is formed with organic resin (1st resin) provided with light transmittances, such as a polyimide, for example.
  • the second portion 23 is in contact with the top surface 22b of the first portion 22 and extends substantially parallel to the top surface 22b.
  • the top surface 23b faces the bottom surface 23a and extends substantially parallel to the bottom surface 23a.
  • side surfaces 23c and 23d connecting the bottom surface 23a and the top surface 23b.
  • the length of the bottom surface 23 a and the length of the top surface 23 b are substantially the same and are longer than the lengths of the bottom surface 22 a and the top surface 22 b of the first portion 22.
  • Each of the side surfaces 23c and 23d extends so as to be orthogonal to the bottom surface 23a and the top surface 23b, and the heights of the side surfaces 23c and 23d are substantially the same.
  • the second portion 23 has a substantially rectangular shape in the cross section in the width direction.
  • the height of the second portion 23 is, for example, not less than 2 ⁇ m and not more than 5 ⁇ m.
  • the second portion 23 is formed of an organic resin (second resin) having light transmissivity such as a novolac resin.
  • the side surface 23 c of the second portion 23 is located closer to the organic EL layer 14 ⁇ / b> A side (or the light emitting element 3 ⁇ / b> A (see FIG. 3) side) than the side surface 22 c of the first portion 22.
  • the side surface 23d of the second portion 23 is located closer to the organic EL layer 14B side (or the light emitting element 3B (see FIG. 3) side) than the side surface 22d of the first portion 22. . Therefore, both sides of the second portion 23 protrude from the first portion 22 in the width direction of the element isolation portion 21, and the element isolation portion 21 has a so-called overhang shape in the cross section in the width direction.
  • the distance between the side surface 22c and the side surface 23c is 1 ⁇ m or more and 10 ⁇ m or less, and the distance between the side surface 22d and the side surface 23d is 1 ⁇ m or more and 10 ⁇ m or less.
  • the organic EL layers 14A and 14B and the second electrodes 15A and 15B are satisfactorily separated by the element separation part 21, and the shape of the element separation part 21 is stably maintained.
  • a heat treatment at 100 ° C. to 150 ° C. is performed to form a first resin layer having a thickness of about 3 ⁇ m on the second insulating film 13.
  • a second resin layer having a thickness of about 3 ⁇ m is formed on the first resin layer by applying a second resin on the first resin layer by spin coating and then performing a heat treatment at 100 ° C. to 150 ° C. .
  • a non-photosensitive resin is used as the first resin
  • a negative resist is used as the second resin.
  • a part of the second resin layer is exposed using a photomask in which stripe-shaped openings are formed.
  • the second resin layer is developed using TMAH, and the first resin layer is etched.
  • TMAH development time of the second resin layer
  • the etching time of the first resin layer is shortened by selecting the second resin so that the solubility of the second resin in the etchant TMAH is lower than the solubility of the first resin in TMAH. Also good.
  • the conductive layer 18 may cover the entire surface of the element isolation portion 4A depending on the manufacturing conditions of the transparent conductive layer forming the second electrodes 15A and 15B.
  • the second electrodes 15A and 15B are not separated by the element isolation portion 4A, but become a single transparent conductive layer. Thereby, in 1st Embodiment, light emitting element 3A, 3B may short-circuit.
  • the element separating unit 21 includes the band-shaped first portion 22 provided on the element substrate 2 and the band-shaped first portion 22 provided on the first portion 22. And a second portion 23. Further, both sides of the second portion 23 protrude from the first portion 22 in the width direction of the element isolation portion 21. In this case, the second portion 23 functions as a bag for the first portion 22. For this reason, even if the manufacturing conditions are set so that the coating ratio of the transparent conductive layer to the element substrate 2 is increased, a part of the first part 22 of the element separation part 21 and one part of the second part 23 Part is exposed from the conductive layer 18.
  • a region of the first portion 22 adjacent to the second portion 23 of the side surfaces 22c and 22d and a region of the second portion 23 that is not in contact with the first portion 22 of the bottom surface 23a It becomes an exposed area.
  • the conductive layer 18 provided on the element isolation part 21 is more easily separated from the second electrodes 15A and 15B than in the first embodiment. Therefore, in the organic EL display device 1 ⁇ / b> A according to the second embodiment, even when the manufacturing conditions are changed, the light emitting elements adjacent to each other with the element isolation unit 21 interposed therebetween are favorably separated.
  • the exposed region of the element isolation part 21 of the second embodiment is covered with the filler 16.
  • FIG. 5A is a partial cross-sectional view of an organic EL display device according to a first modification of the second embodiment.
  • the second portion 23A of the element isolation portion 21A in the organic EL display device 1B has a forward tapered shape in the cross section in the width direction. That is, in the width direction of the element isolation portion 21A, the length of the bottom surface 23a is larger than the length of the top surface 23b, and both sides of the bottom surface 23a protrude from the top surface 23b.
  • the width of the element isolation portion 21A can be narrower than that of the second portion of the second embodiment. Therefore, the ratio of the light emitting elements provided on the element substrate 2 can be increased. Also in the first modified example, the same operational effects as those of the second embodiment are achieved.
  • FIG. 5B is a partial cross-sectional view of an organic EL display device according to a second modification of the second embodiment.
  • the second portion 23B of the element isolation portion 21B in the organic EL display device 1C has an inversely tapered shape in the cross section in the width direction. That is, in the width direction of the element isolation portion 21B, the length of the top surface 23b is larger than the length of the bottom surface 23a, and both sides of the top surface 23b protrude from the bottom surface 23a.
  • the filler 16 can easily flow into the side surfaces 22 c and 22 d of the first portion 22. Therefore, the exposed region of the element isolation portion 21 ⁇ / b> B is easily covered with the filler 16. Also in the second modified example, the same effects as those of the second embodiment are achieved.
  • the organic EL display device according to the present invention is not limited to the above-described embodiments and modifications, and various other modifications are possible.
  • the present invention is not applied only to the organic EL display device described above.
  • the present invention may be applied to a segment type organic EL display device.
  • the first electrode is an anode and the second electrode is a cathode.
  • the first electrode may be a cathode and the second electrode may be an anode.
  • the organic EL layer is formed without patterning, but is not limited thereto. That is, the organic EL layer may be formed by patterning so as to be provided only in the light emitting element, for example. In this case, for example, the organic EL layer is formed by patterning using a mask.
  • the element isolation portion may be a portion on which the mask is placed.
  • the height of the element separating portion may be larger than the thickness of the second electrode.

Abstract

The present disclosure relates to an organic EL display device wherein deterioration of the service life is suppressed. This organic EL display device is provided with: a first substrate; a first light emitting element and a second light emitting element, which are provided on the first substrate, and include organic EL layers, respectively; an element isolating section, which is provided on the first substrate, and separates the first light emitting element and the second light emitting element from each other; a second substrate that is provided on the first light emitting element, the second light emitting element, and the element isolating section; and a filling material that is provided such that a gap between the first substrate and the second substrate is filled with the filling material. The first substrate, first light emitting element, second light emitting element, element isolating section, second substrate, and filling material have light transmitting characteristics, and the filling material contains a desiccant having light transmitting characteristics, and covers an exposed region of the element isolating section.

Description

有機EL表示装置Organic EL display device
 本発明は、有機EL表示装置に関する。 The present invention relates to an organic EL display device.
 近年、表示装置として、有機EL層(EL:Electro-Luminescence)を発光層とする自発光型表示装置が利用されている。例えば下記特許文献1には、複数の発光部からなる画像表示配列を有している、パッシブマトリクス型有機EL表示装置のパネルが記載されている。このようなパネルには、帯状の複数の隔壁が互いに並んで設けられている。 In recent years, a self-luminous display device using an organic EL layer (EL: Electro-Luminescence) as a light emitting layer has been used as a display device. For example, Patent Document 1 described below describes a panel of a passive matrix organic EL display device having an image display array composed of a plurality of light emitting units. Such a panel is provided with a plurality of strip-shaped partition walls arranged side by side.
特開平8-315981号公報JP-A-8-315981
 上記特許文献1では、隔壁を用いて発光層上に設けられる導電層を分離することによって、複数の発光部を素子分離している。このように隔壁を用いて導電層を分離する場合、隔壁の一部が導電層によって覆われずに露出する。この隔壁の露出した部分から空気中の水分がパネル内に浸入するおそれがある。水分が有機EL層に浸入すると、有機EL層の寿命が低下し、有機EL表示装置の信頼性が低下する。 In Patent Document 1, a plurality of light emitting portions are separated from each other by separating a conductive layer provided on the light emitting layer using a partition wall. When the conductive layer is separated using the partition wall in this way, a part of the partition wall is exposed without being covered with the conductive layer. There is a risk that moisture in the air may enter the panel from the exposed portion of the partition wall. When moisture enters the organic EL layer, the lifetime of the organic EL layer is reduced, and the reliability of the organic EL display device is reduced.
 また、近年では有機EL表示装置をシースルー型とし、デザイン性の向上等が図られている。このようなシースルー型有機EL表示装置においては、光不透過性の乾燥剤を発光層上に配置することができない。したがって、上記特許文献1の構造を有するシースルー型有機EL表示装置においては、有機EL層の寿命が顕著に低下してしまう。 In recent years, the organic EL display device has been made a see-through type to improve the design. In such a see-through organic EL display device, a light-impermeable desiccant cannot be disposed on the light emitting layer. Therefore, in the see-through type organic EL display device having the structure of Patent Document 1, the lifetime of the organic EL layer is significantly reduced.
 本発明の一側面は、寿命の低下を抑制できる有機EL表示装置を提供することを目的とする。 An object of one aspect of the present invention is to provide an organic EL display device capable of suppressing a reduction in lifetime.
 本発明の一態様に係る有機EL表示装置は、第1基板と、第1基板上に設けられ、それぞれが有機EL層を含む第1発光素子及び第2発光素子と、第1基板上に設けられ、第1発光素子と第2発光素子とを分離する素子分離部と、第1発光素子上、第2発光素子上、及び素子分離部上に設けられる第2基板と、第1基板と第2基板との隙間を埋めるように設けられる充填材と、を備え、第1基板、第1発光素子、第2発光素子、素子分離部、第2基板、及び充填材は光透過性を有し、充填材は、光透過性を有する乾燥剤を含むと共に素子分離部の露出領域を覆っている。 An organic EL display device according to one embodiment of the present invention is provided over a first substrate, a first substrate, a first light-emitting element and a second light-emitting element each including an organic EL layer, and the first substrate. A first light emitting element, a second light emitting element, a second substrate provided on the second light emitting element, and the element separating section; a first substrate; The first substrate, the first light-emitting element, the second light-emitting element, the element separating portion, the second substrate, and the filler have a light-transmitting property. The filler includes a light-transmitting desiccant and covers the exposed region of the element isolation portion.
 また、素子分離部は、第1基板上に設けられる帯状の第1部分と、第1部分上に設けられる帯状の第2部分とを有しており、素子分離部の幅方向において、第2部分の両側は、第1部分から突出していてもよい。 The element isolation portion includes a strip-shaped first portion provided on the first substrate and a strip-shaped second portion provided on the first portion. In the width direction of the element isolation portion, the second portion Both sides of the part may protrude from the first part.
 また、第2部分は、幅方向断面順テーパー形状を有してもよい。 Further, the second portion may have a taper shape in the width direction cross section.
 また、第2部分は、幅方向断面逆テーパー形状を有してもよい。 Further, the second portion may have a width direction cross-section inversely tapered shape.
 また、上記段落に記載される有機EL表示装置は、第1基板の縁に沿って設けられ、第1基板と第2基板とを接合する枠状の接着部をさらに備え、充填材は、接着部によって囲まれる領域に充填されてもよい。 In addition, the organic EL display device described in the above paragraph is further provided with a frame-shaped adhesive portion that is provided along the edge of the first substrate and joins the first substrate and the second substrate. The region surrounded by the part may be filled.
 また、第1基板及び第2基板は、可撓性を有してもよい。 Further, the first substrate and the second substrate may have flexibility.
 本発明の一態様によれば、寿命の低下を抑制できる有機EL表示装置を提供できる。 According to one embodiment of the present invention, it is possible to provide an organic EL display device that can suppress a reduction in lifetime.
図1は、第1実施形態に係る有機EL表示装置を示す概略斜視図である。FIG. 1 is a schematic perspective view showing the organic EL display device according to the first embodiment. 図2は、図1のA-A線に沿った断面図である。FIG. 2 is a sectional view taken along line AA in FIG. 図3は、図1のB-B線に沿った断面図である。FIG. 3 is a sectional view taken along line BB in FIG. 図4は、第2実施形態に係る有機EL表示装置の一部の断面図である。FIG. 4 is a partial cross-sectional view of the organic EL display device according to the second embodiment. 図5(a)は、第2実施形態の第1変形例に係る有機EL表示装置の一部の断面図である。図5(b)は、第2実施形態の第2変形例に係る有機EL表示装置の一部の断面図である。FIG. 5A is a partial cross-sectional view of an organic EL display device according to a first modification of the second embodiment. FIG. 5B is a partial cross-sectional view of an organic EL display device according to a second modification of the second embodiment.
 以下、添付図面を参照して、本発明の好適な実施形態について詳細に説明する。なお、以下の説明において、同一要素又は同一機能を有する要素には、同一符号を用いることとし、重複する説明は省略する。 Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the following description, the same reference numerals are used for the same elements or elements having the same functions, and redundant description is omitted.
(第1実施形態)
 図1は、第1実施形態に係る有機EL表示装置を示す概略斜視図である。図1に示される有機EL表示装置1は、有機ELを用いた自発光型パッシブマトリックスディスプレイである。有機EL表示装置1は、素子基板2(第1基板)と、素子基板2上に設けられる発光素子3A~3F及び素子分離部4A,4Bと、素子基板2、発光素子3A~3F、及び素子分離部4A,4B上に設けられる封止基板5(第2基板)と、外部接続回路6と、素子基板2及び封止基板5を接合する接着部7とを備える。図1では省略しているが、有機EL表示装置1は、発光素子3A~3F以外の図示しない複数の発光素子と、素子分離部4A,4B以外の図示しない複数の素子分離部とを備える。
(First embodiment)
FIG. 1 is a schematic perspective view showing the organic EL display device according to the first embodiment. An organic EL display device 1 shown in FIG. 1 is a self-luminous passive matrix display using an organic EL. The organic EL display device 1 includes an element substrate 2 (first substrate), light emitting elements 3A to 3F and element separation portions 4A and 4B provided on the element substrate 2, an element substrate 2, light emitting elements 3A to 3F, and elements A sealing substrate 5 (second substrate) provided on the separation portions 4A and 4B, an external connection circuit 6, and an adhesive portion 7 for joining the element substrate 2 and the sealing substrate 5 are provided. Although omitted in FIG. 1, the organic EL display device 1 includes a plurality of light-emitting elements (not shown) other than the light-emitting elements 3A to 3F and a plurality of element separation parts (not shown) other than the element separation parts 4A and 4B.
 素子基板2は、絶縁性及び光透過性を備え、封止基板5に対向する略矩形状の主面2aを有する。光透過性とは、少なくとも一部の光を透過する機能を意味する。例えば、光透過性を備える素子基板2は、入射される光を透過する機能を有していればよく、一部の光を吸収又は反射してもよい。素子基板2としては、例えばガラス基板又はプラスチック基板等が用いられる。有機EL表示装置1が可撓性を有する場合、素子基板2として例えばPETフィルム(ポリエチレンテレフタレートフィルム)、又はポリイミドフィルム等が用いられる。なお素子基板2の主面2a上には、発光素子及び素子分離部以外に、発光素子を駆動させる駆動回路、当該駆動回路と発光素子とを接続する配線、及び外部接続用端子等が設けられる。 The element substrate 2 has insulation and light transmission and has a substantially rectangular main surface 2 a facing the sealing substrate 5. The light transmissive property means a function of transmitting at least part of light. For example, the element substrate 2 having light transmissivity may have a function of transmitting incident light and may absorb or reflect a part of the light. For example, a glass substrate or a plastic substrate is used as the element substrate 2. When the organic EL display device 1 has flexibility, for example, a PET film (polyethylene terephthalate film) or a polyimide film is used as the element substrate 2. On the main surface 2a of the element substrate 2, in addition to the light emitting element and the element separating portion, a driving circuit for driving the light emitting element, wiring for connecting the driving circuit and the light emitting element, an external connection terminal, and the like are provided. .
 発光素子3A~3Fは、主面2a上においてマトリックス状に配置される自発光素子であり、有機EL表示装置1の画素に相当する。発光素子3A~3Fは、それぞれ独立して発光状態又は非発光状態に制御される。例えば、有機EL表示装置1は、発光素子3Aのみ発光状態とし、発光素子3B~3Fを非発光状態とすることができる。発光素子3A~3Fは同一構造を有している。 The light emitting elements 3A to 3F are self-light emitting elements arranged in a matrix on the main surface 2a, and correspond to the pixels of the organic EL display device 1. The light emitting elements 3A to 3F are independently controlled to a light emitting state or a non-light emitting state. For example, in the organic EL display device 1, only the light emitting element 3A can be in a light emitting state, and the light emitting elements 3B to 3F can be in a non-light emitting state. The light emitting elements 3A to 3F have the same structure.
 素子分離部4A,4Bは、隣り合う発光素子同士を分離する部材であり、平面視にて帯状になるように延在する。図1に示されるように、主面2aの一辺の延在方向に沿って発光素子3A~3Cが順番に配列される場合、素子分離部4Aは、隣り合う発光素子3A,3Bの間にて上記延在方向と直交する方向に延在し、発光素子3A,3Bを分離する。同様に、素子分離部4Bは、隣り合う発光素子3B,3Cの間にて上記延在方向と直交する方向に延在し、発光素子3B,3Cを分離する。発光素子及び素子分離部の詳細な構成は、後述する。なお、延在方向と直交する方向とは、延在方向に対して直角に交わる方向に限定されず、略直角に交わる方向でもよい。 The element separating portions 4A and 4B are members that separate adjacent light emitting elements, and extend so as to form a belt shape in a plan view. As shown in FIG. 1, when the light emitting elements 3A to 3C are arranged in order along the extending direction of one side of the main surface 2a, the element separating portion 4A is located between the adjacent light emitting elements 3A and 3B. The light emitting elements 3A and 3B are separated by extending in a direction orthogonal to the extending direction. Similarly, the element separation part 4B extends in a direction orthogonal to the extending direction between the adjacent light emitting elements 3B and 3C, and separates the light emitting elements 3B and 3C. Detailed configurations of the light emitting element and the element separating portion will be described later. Note that the direction orthogonal to the extending direction is not limited to a direction intersecting at right angles to the extending direction, and may be a direction intersecting substantially at right angles.
 封止基板5は、絶縁性及び光透過性を備え、素子基板2に対向する略矩形状の主面5aを有する。封止基板5は、接着部7を介して素子基板2に接合することによって、発光素子が設けられた領域に蓋をする基板である。封止基板5としては、例えばガラス基板又はプラスチック基板等が用いられる。有機EL表示装置1が可撓性を有する場合、封止基板5として例えばPETフィルム(ポリエチレンテレフタレートフィルム)、又はポリイミドフィルム等が用いられる。 The sealing substrate 5 has insulation and light transmission, and has a substantially rectangular main surface 5 a facing the element substrate 2. The sealing substrate 5 is a substrate that covers the region where the light emitting element is provided by bonding to the element substrate 2 through the bonding portion 7. For example, a glass substrate or a plastic substrate is used as the sealing substrate 5. When the organic EL display device 1 has flexibility, for example, a PET film (polyethylene terephthalate film) or a polyimide film is used as the sealing substrate 5.
 外部接続回路6は、素子基板2の主面2a上に設けられる駆動回路等に接続される回路である。有機EL表示装置1は、素子基板2に設けられる外部接続端子に接続される外部接続回路6を介して、外部装置及び電源等に接続可能になっている。外部接続回路6としては、例えばFPC(Flexible Printed Circuit)が用いられる。 The external connection circuit 6 is a circuit connected to a drive circuit or the like provided on the main surface 2 a of the element substrate 2. The organic EL display device 1 can be connected to an external device, a power source, and the like via an external connection circuit 6 connected to an external connection terminal provided on the element substrate 2. As the external connection circuit 6, for example, an FPC (Flexible Printed Circuit) is used.
 接着部7は、上述したように素子基板2と封止基板5とを接合する部材であり、素子基板2の縁に沿って設けられる枠状の部材である。接着部7は、素子基板2上に設けられる発光素子及び素子分離部を囲うように設けられる。図2は、図1のA-A線に沿った断面図である。図2に示されるように、接着部7は、正確には、素子基板2の主面2aに設けられる第1絶縁膜11上の第2絶縁膜13と、封止基板5とを接着している。接着部7は、例えば紫外線硬化型のエポキシ樹脂等を含む。なお、素子基板2の縁とは、素子基板2の縁周辺の領域を含んでもよい。 The bonding portion 7 is a member that joins the element substrate 2 and the sealing substrate 5 as described above, and is a frame-like member provided along the edge of the element substrate 2. The bonding portion 7 is provided so as to surround the light emitting element and the element separation portion provided on the element substrate 2. FIG. 2 is a sectional view taken along line AA in FIG. As shown in FIG. 2, the bonding portion 7 accurately bonds the second insulating film 13 on the first insulating film 11 provided on the main surface 2 a of the element substrate 2 and the sealing substrate 5. Yes. The bonding portion 7 includes, for example, an ultraviolet curable epoxy resin. The edge of the element substrate 2 may include a region around the edge of the element substrate 2.
 図3は、図1のB-B線に沿った断面図である。図3に示されるように、素子基板2の主面2a上には、第1絶縁膜11と、第1電極12と、第2絶縁膜13と、有機EL層14A,14Bと、第2電極15A,15Bと、素子分離部4Aと、充填材16と、封止基板5とが設けられる。主面2a上において、第1電極12、有機EL層14A、及び第2電極15Aによって発光素子3A(第1発光素子)が形成される。また、第1電極12、有機EL層14B、及び第2電極15Bによって発光素子3B(第2発光素子)が形成される。 FIG. 3 is a sectional view taken along line BB in FIG. As shown in FIG. 3, on the main surface 2a of the element substrate 2, the first insulating film 11, the first electrode 12, the second insulating film 13, the organic EL layers 14A and 14B, and the second electrode 15A and 15B, the element isolation | separation part 4A, the filler 16, and the sealing substrate 5 are provided. On the main surface 2a, the light emitting element 3A (first light emitting element) is formed by the first electrode 12, the organic EL layer 14A, and the second electrode 15A. Further, the light emitting element 3B (second light emitting element) is formed by the first electrode 12, the organic EL layer 14B, and the second electrode 15B.
 第1絶縁膜11は、素子基板2の主面2aを覆うように設けられる光透過性膜である。第1絶縁膜11としては、例えば酸化ケイ素膜、窒化ケイ素膜、酸化窒化ケイ素膜、又は酸化アルミニウム膜等が用いられる。第1絶縁膜11は、例えばCVD法(化学気相蒸着法)によって形成される。 The first insulating film 11 is a light transmissive film provided so as to cover the main surface 2 a of the element substrate 2. As the first insulating film 11, for example, a silicon oxide film, a silicon nitride film, a silicon oxynitride film, or an aluminum oxide film is used. The first insulating film 11 is formed by, for example, a CVD method (chemical vapor deposition method).
 第1電極12は、発光素子3A,3Bの陽極として機能する電極であり、第1絶縁膜11上に設けられる。第1電極12は、ストライプ状にパターニングされた透明導電層から構成される。第1電極12は、素子分離部4Aの延在方向に直交する方向、換言すれば発光素子3Aから発光素子3Bに向かう方向に延在する。透明導電層の材料としては、例えばITO(酸化インジウムスズ)が用いられる。透明導電層は、単層構造でもよいし多層構造でもよい。透明導電層は、例えば電子ビーム等を用いた蒸着、又はスパッタリング等のPVD法(物理気相蒸着法)によって形成される。形成された透明導電層を例えばレジストマスクを用いてパターニングすることによって、第1電極12が形成される。なお、透明導電層とは光透過性を有する導電層であればよく、完全に透明な導電層でなくてもよい。 The first electrode 12 is an electrode that functions as an anode of the light emitting elements 3A and 3B, and is provided on the first insulating film 11. The first electrode 12 is composed of a transparent conductive layer patterned in a stripe shape. The first electrode 12 extends in a direction orthogonal to the extending direction of the element isolation portion 4A, in other words, in a direction from the light emitting element 3A toward the light emitting element 3B. As a material for the transparent conductive layer, for example, ITO (indium tin oxide) is used. The transparent conductive layer may have a single layer structure or a multilayer structure. The transparent conductive layer is formed by, for example, vapor deposition using an electron beam or the like, or PVD method (physical vapor deposition method) such as sputtering. The first electrode 12 is formed by patterning the formed transparent conductive layer using, for example, a resist mask. Note that the transparent conductive layer may be a conductive layer having optical transparency, and may not be a completely transparent conductive layer.
 第2絶縁膜13は、第1絶縁膜11上及び第1電極12上に設けられる光透過性膜である。第2絶縁膜13としては、例えば酸化ケイ素膜、窒化ケイ素膜、酸化窒化ケイ素膜、又は酸化アルミニウム膜等の無機膜、もしくはノボラック樹脂、アクリル樹脂、ポリイミド等の有機膜が用いられる。第2絶縁膜13の厚さは、例えば約1μmである。第2絶縁膜13が無機膜の場合、第2絶縁膜13は例えばCVD法によって形成される。第2絶縁膜13が有機膜の場合、第2絶縁膜13は例えばスピンコートによって形成される。第2絶縁膜13には、開口部13a,13bが設けられる。開口部13a,13bによって第1電極12の一部は第2絶縁膜13から露出する。開口部13aは発光素子3Aを設けるために形成され、開口部13bは発光素子3Bを設けるために形成される。開口部13a,13bは、例えばレジストマスクを用いたパターニングによって設けられる。 The second insulating film 13 is a light transmissive film provided on the first insulating film 11 and the first electrode 12. As the second insulating film 13, for example, an inorganic film such as a silicon oxide film, a silicon nitride film, a silicon oxynitride film, or an aluminum oxide film, or an organic film such as a novolac resin, an acrylic resin, or a polyimide is used. The thickness of the second insulating film 13 is about 1 μm, for example. When the second insulating film 13 is an inorganic film, the second insulating film 13 is formed by, for example, a CVD method. When the second insulating film 13 is an organic film, the second insulating film 13 is formed by, for example, spin coating. The second insulating film 13 is provided with openings 13a and 13b. A portion of the first electrode 12 is exposed from the second insulating film 13 through the openings 13a and 13b. The opening 13a is formed to provide the light emitting element 3A, and the opening 13b is formed to provide the light emitting element 3B. The openings 13a and 13b are provided by patterning using a resist mask, for example.
 有機EL層14A,14Bは、電子及び正孔が注入されることによって発光する有機化合物(発光材料)を少なくとも含む層である。有機EL層14Aは、開口部13aにおいて第1電極12上に接すると共に、第2絶縁膜13上に設けられる光透過層である。また、有機EL層14Bは、開口部13bにおいて第1電極12上に接すると共に、第2絶縁膜13上に設けられる光透過層である。有機EL層14A,14Bの厚さは、例えば100nm以上500nm以下である。有機EL層14A,14Bは、例えば真空蒸着法等の乾式法、又はインクジェット等の湿式法によって形成される。第1実施形態では乾式法を適用し、素子分離部4Aによって分離された(パターニングされた)有機EL層14A,14Bが形成される(詳細は後述する)。 The organic EL layers 14A and 14B are layers including at least an organic compound (light emitting material) that emits light when electrons and holes are injected. The organic EL layer 14 </ b> A is a light transmission layer that is in contact with the first electrode 12 in the opening 13 a and is provided on the second insulating film 13. The organic EL layer 14B is a light transmission layer provided on the second insulating film 13 while being in contact with the first electrode 12 in the opening 13b. The thickness of the organic EL layers 14A and 14B is, for example, not less than 100 nm and not more than 500 nm. The organic EL layers 14A and 14B are formed, for example, by a dry method such as a vacuum evaporation method or a wet method such as an inkjet. In the first embodiment, a dry method is applied to form (patterned) organic EL layers 14A and 14B separated (patterned) by the element isolation unit 4A (details will be described later).
 有機EL層14A,14Bに含まれる発光材料は、低分子化合物でもよく、高分子化合物でもよい。また、発光材料は、蛍光材料でもよく、燐光材料でもよい。有機EL層14A,14Bは、上記発光材料を含んだ発光層に加えて、電子注入層、電子輸送層、正孔注入層、及び正孔輸送層等を有してもよい。この場合、例えば正孔注入層、正孔輸送層、発光層、電子輸送層、及び電子注入層を第1電極12上に順番に積層することによって、有機EL層14A,14Bが形成される。有機EL層14A,14Bによって発生する光は、赤色光又は青色光等の単色光でもよく、白色光でもよい。有機EL層14A,14Bが白色光を呈する場合、有機EL層14A,14Bのそれぞれには互いに異なる光を発生する複数の発光層が含まれてもよい。 The light emitting material contained in the organic EL layers 14A and 14B may be a low molecular compound or a high molecular compound. The light emitting material may be a fluorescent material or a phosphorescent material. The organic EL layers 14A and 14B may include an electron injection layer, an electron transport layer, a hole injection layer, a hole transport layer, and the like in addition to the light emitting layer containing the light emitting material. In this case, for example, the organic EL layers 14 </ b> A and 14 </ b> B are formed by sequentially stacking a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, and an electron injection layer on the first electrode 12. The light generated by the organic EL layers 14A and 14B may be monochromatic light such as red light or blue light, or may be white light. When the organic EL layers 14A and 14B exhibit white light, each of the organic EL layers 14A and 14B may include a plurality of light emitting layers that generate different lights.
 第2電極15A,15Bは、それぞれ発光素子3A,3Bの陰極として機能する電極である。第2電極15Aは、有機EL層14A上に接して設けられる。第2電極15Bは、有機EL層14B上に接して設けられる。第2電極15A,15Bのそれぞれは、パターニングされた透明導電層から構成される。透明導電層の材料としては、例えばIZO(酸化インジウム亜鉛)、アルミニウム、銀、マグネシウムが用いられる。透明導電層は、単層構造でもよいし多層構造でもよい。透明導電層にアルミニウム膜、銀膜、及びマグネシウム膜のいずれか一つが含まれる場合、当該アルミニウム膜、銀膜、及びマグネシウム膜は、それぞれ約1nm以下の厚さを有する。透明導電層は、例えば電子ビーム等を用いた蒸着、又はスパッタリング等のPVD法によって形成される。第1実施形態では、素子分離部4Aによって分離された(パターニングされた)第2電極15A,15Bが形成される(詳細は後述する)。 The second electrodes 15A and 15B are electrodes that function as cathodes of the light emitting elements 3A and 3B, respectively. The second electrode 15A is provided on and in contact with the organic EL layer 14A. The second electrode 15B is provided in contact with the organic EL layer 14B. Each of the second electrodes 15A and 15B is composed of a patterned transparent conductive layer. As a material for the transparent conductive layer, for example, IZO (indium zinc oxide), aluminum, silver, and magnesium are used. The transparent conductive layer may have a single layer structure or a multilayer structure. When the transparent conductive layer includes any one of an aluminum film, a silver film, and a magnesium film, each of the aluminum film, the silver film, and the magnesium film has a thickness of about 1 nm or less. A transparent conductive layer is formed by PVD methods, such as vapor deposition using an electron beam etc., or sputtering, for example. In the first embodiment, second electrodes 15A and 15B separated (patterned) by the element separation unit 4A are formed (details will be described later).
 発光素子3A,3Bの間に設けられる素子分離部4Aは、有機EL層14A,14B及び第2電極15A,15Bに覆われていない第2絶縁膜13上に設けられる。素子分離部4Aは、第2絶縁膜13に接すると共に素子基板2の主面2aに略平行に延在する底面4aと、底面4aに対向すると共に底面4aと略平行に延在する頂面4bと、底面4a及び頂面4bをつなぐ側面4c,4dとを有する。素子分離部4Aが帯状に延在する方向と直交する方向(素子分離部4Aの幅方向)において、頂面4bの長さは底面4aの長さよりも大きく、且つ頂面4bの両側は底面4aから突出している。また、側面4cは、底面4aの発光素子3A側の一端から頂面4bの発光素子3A側の一端に向かう傾斜面であり、側面4dは、底面4aの発光素子3B側の他端から頂面4bの発光素子3B側の他端に向かう傾斜面である。したがって、素子分離部4Aは、幅方向断面において逆テーパー形状を有する。素子分離部4Aの高さは、有機EL層14Aと第2電極15Aとの合計厚さ(あるいは、有機EL層14Bと第2電極15Bとの合計厚さ)よりも大きく、例えば2μm以上10μm以下である。素子分離部4Aは、例えばノボラック樹脂等の光透過性を備える有機樹脂によって形成される。なお、素子分離部4Bを含む複数の素子分離部は、素子分離部4Aと略同一形状を有する。 The element separation portion 4A provided between the light emitting elements 3A and 3B is provided on the second insulating film 13 that is not covered with the organic EL layers 14A and 14B and the second electrodes 15A and 15B. The element isolation portion 4A is in contact with the second insulating film 13 and extends substantially parallel to the main surface 2a of the element substrate 2, and the top surface 4b that faces the bottom surface 4a and extends substantially parallel to the bottom surface 4a. And side surfaces 4c and 4d connecting the bottom surface 4a and the top surface 4b. In a direction perpendicular to the direction in which the element isolation portion 4A extends in a strip shape (the width direction of the element isolation portion 4A), the length of the top surface 4b is larger than the length of the bottom surface 4a, and both sides of the top surface 4b are on the bottom surface 4a. Protruding from. The side surface 4c is an inclined surface from one end of the bottom surface 4a on the light emitting element 3A side to one end of the top surface 4b on the light emitting element 3A side, and the side surface 4d is the top surface from the other end of the bottom surface 4a on the light emitting element 3B side. 4b is an inclined surface toward the other end of the light emitting element 3B side. Therefore, the element isolation portion 4A has an inversely tapered shape in the cross section in the width direction. The height of the element isolation portion 4A is larger than the total thickness of the organic EL layer 14A and the second electrode 15A (or the total thickness of the organic EL layer 14B and the second electrode 15B), for example, 2 μm or more and 10 μm or less. It is. The element isolation portion 4A is formed of an organic resin having light transmissivity such as a novolac resin. The plurality of element isolation parts including the element isolation part 4B have substantially the same shape as the element isolation part 4A.
 素子分離部4Aは、有機EL層14A,14B及び第2電極15A,15Bの形成前に第2絶縁膜13上に設けられる。このため、素子分離部4Aの頂面4b上には、有機EL層14A,14Bと同一材料から構成される有機層17と、第2電極15A,15Bと同一材料から構成される導電層18とが設けられる。有機層17が素子分離部4A上に設けられることにより、有機EL層14A,14Bが良好に分離する。同様に、導電層18が素子分離部4A上に設けられることにより、第2電極15A,15Bが良好に分離する。 The element isolation part 4A is provided on the second insulating film 13 before the formation of the organic EL layers 14A and 14B and the second electrodes 15A and 15B. Therefore, on the top surface 4b of the element isolation portion 4A, an organic layer 17 made of the same material as the organic EL layers 14A and 14B, and a conductive layer 18 made of the same material as the second electrodes 15A and 15B, Is provided. By providing the organic layer 17 on the element separation portion 4A, the organic EL layers 14A and 14B are favorably separated. Similarly, by providing the conductive layer 18 on the element isolation portion 4A, the second electrodes 15A and 15B are well separated.
 底面4aは、第2絶縁膜13に接している。また、上述したように頂面4bは、有機層17に覆われている。このため、素子分離部4Aにおける底面4a及び頂面4bは露出していない。一方、素子分離部4Aの側面4c、4dは、有機層17及び導電層18等によって覆われていない露出領域である。また、図示していないが、素子分離部4Aの延在方向に直交する側面は、露出領域でもよいし、露出領域ではなくてもよい。 The bottom surface 4 a is in contact with the second insulating film 13. Further, as described above, the top surface 4 b is covered with the organic layer 17. For this reason, the bottom surface 4a and the top surface 4b in the element isolation portion 4A are not exposed. On the other hand, the side surfaces 4c and 4d of the element isolation portion 4A are exposed regions that are not covered by the organic layer 17 and the conductive layer 18 or the like. Although not shown, the side surface orthogonal to the extending direction of the element isolation portion 4A may be an exposed region or not an exposed region.
 ここで、第1実施形態に係る素子分離部の形成方法の一例について説明する。まず、第2絶縁膜13上にスピンコートによって樹脂を塗布した後に100℃~150℃の熱処理を行うことによって、第2絶縁膜13上に厚さ約3μmの樹脂層を形成する。第1実施形態では、樹脂としてネガ型レジストを用いる。次に、ストライプ状の開口部が形成されたフォトマスクを用いて、樹脂層の一部を露光する。次に、100℃~150℃の熱処理を行い、水酸化テトラメチルアンモニウム(TMAH)を用いて樹脂層の現像を行う。樹脂層の現像とは、樹脂層において露光されていない領域を除去することである。そして、さらに100℃~150℃の熱処理を行うことによって、所定の方向に延在する帯状の素子分離部を複数形成する。 Here, an example of a method for forming the element isolation portion according to the first embodiment will be described. First, a resin layer having a thickness of about 3 μm is formed on the second insulating film 13 by applying a resin on the second insulating film 13 by spin coating and then performing a heat treatment at 100 ° C. to 150 ° C. In the first embodiment, a negative resist is used as the resin. Next, a part of the resin layer is exposed using a photomask in which a stripe-shaped opening is formed. Next, heat treatment is performed at 100 ° C. to 150 ° C., and the resin layer is developed using tetramethylammonium hydroxide (TMAH). The development of the resin layer means removing an unexposed area in the resin layer. Further, by performing a heat treatment at 100 ° C. to 150 ° C., a plurality of band-shaped element isolation portions extending in a predetermined direction are formed.
 充填材16は、素子基板2と封止基板5との隙間を埋めるように設けられる部材である。充填材16は、素子基板2上の第2絶縁膜13、有機EL層14A,14B、第2電極15A,15B、素子分離部4Aの露出領域である側面4c,4d、有機層17、及び導電層18を覆っている。充填材16は、素子基板2と封止基板5との間において接着部7に囲まれる領域に充填されており、封止基板5と隙間なく接している。充填材16は、例えばエポキシ樹脂等の光透過性を備える有機樹脂によって形成される。充填材16は、例えばインクジェット法又はディスペンス法等の塗布法によって素子基板2上に設けられる。充填材16は、硬化状態でもよいし、非硬化状態でもよい。 The filler 16 is a member provided so as to fill a gap between the element substrate 2 and the sealing substrate 5. The filler 16 includes the second insulating film 13 on the element substrate 2, the organic EL layers 14A and 14B, the second electrodes 15A and 15B, the side surfaces 4c and 4d that are exposed regions of the element isolation portion 4A, the organic layer 17, and the conductive layer. Covers layer 18. The filler 16 is filled in a region surrounded by the adhesive portion 7 between the element substrate 2 and the sealing substrate 5 and is in contact with the sealing substrate 5 without a gap. The filler 16 is formed of an organic resin having light transmissivity such as an epoxy resin. The filler 16 is provided on the element substrate 2 by a coating method such as an inkjet method or a dispensing method. The filler 16 may be in a cured state or in an uncured state.
 充填材16は、光透過性を備える乾燥剤を含む。光透過性を備える乾燥剤を含む充填材としては、直鎖状又は環状の有機金属化合物が用いられる。この有機金属化合物は、例えばアルミニウム、ランタン、イットリウム、ガリウム、シリコン、又はゲルマニウムのいずれかを含む。本実施形態では、例えば双葉電子工業株式会社製のOleDry(商標)が用いられる。充填材16内の乾燥剤の含有量は、50重量%以上95重量%以下であればよい。この場合、充填材16は、素子基板2と封止基板5との隙間内に残存する水分及び隔壁から浸入する水分を好適に吸収できる。また、充填材16は、当該隙間内を良好に埋めることができる。 The filler 16 includes a desiccant having light permeability. A linear or cyclic organometallic compound is used as the filler containing a desiccant having light permeability. This organometallic compound includes, for example, any of aluminum, lanthanum, yttrium, gallium, silicon, or germanium. In this embodiment, for example, OleDry (trademark) manufactured by Futaba Electronics Co., Ltd. is used. The content of the desiccant in the filler 16 may be 50% by weight or more and 95% by weight or less. In this case, the filler 16 can suitably absorb moisture remaining in the gap between the element substrate 2 and the sealing substrate 5 and moisture entering from the partition wall. Further, the filler 16 can satisfactorily fill the gap.
 以上に説明した第1実施形態に係る有機EL表示装置1によれば、充填材16は、発光素子3Aと発光素子3Bとを分離する素子分離部4Aの露出領域である側面4c,4dを覆うと共に、素子基板2と封止基板5との隙間を埋めるように設けられる。このため、素子基板2と封止基板5との間の空気が充填材16によって押し出されると共に、素子分離部4Aの露出領域が空気に接しないように充填材16によって覆われる。これにより、空気中の水分が素子分離部4Aの露出領域を介して、素子分離部4Aに近接する発光素子3Aの有機EL層14A及び発光素子3Bの有機EL層14Bに浸入することを抑制できる。ここで充填材16は乾燥剤を含んでいるので、有機EL表示装置1における発光素子及び素子分離部の周囲の水分が、充填材16中の乾燥剤によって吸収される。加えて、乾燥剤が素子分離部の露出領域に接触可能になるので、空気中の水分が当該露出領域を介して有機EL層14A,14Bに極めて浸入しにくくなっている。 According to the organic EL display device 1 according to the first embodiment described above, the filler 16 covers the side surfaces 4c and 4d, which are exposed regions of the element separation portion 4A that separates the light emitting element 3A and the light emitting element 3B. At the same time, it is provided so as to fill a gap between the element substrate 2 and the sealing substrate 5. For this reason, the air between the element substrate 2 and the sealing substrate 5 is pushed out by the filler 16, and the exposed region of the element separation portion 4A is covered with the filler 16 so as not to contact the air. Thereby, it can suppress that the water | moisture content in air permeates into the organic EL layer 14A of the light emitting element 3A and the organic EL layer 14B of the light emitting element 3B adjacent to the element separating part 4A through the exposed region of the element separating part 4A. . Here, since the filler 16 contains a desiccant, moisture around the light emitting element and the element separation portion in the organic EL display device 1 is absorbed by the desiccant in the filler 16. In addition, since the desiccant can come into contact with the exposed region of the element isolation portion, it is very difficult for moisture in the air to enter the organic EL layers 14A and 14B through the exposed region.
 このような充填材16は、有機EL層14A,14B及び第2電極15A,15Bから露出した第2絶縁膜13も覆っているので、空気中の水分が当該第2絶縁膜13を介して有機EL層14A,14Bに浸入することも抑制できる。また、充填材16は有機EL層14A,14Bも覆っているので、空気中の水分が有機EL層14A,14Bに直接浸入することも抑制できる。加えて、充填材16により素子分離部4Aの露出領域等からガスが放出されることも抑制できる。さらには、第1実施形態に係る充填材16は、有機EL表示装置1における全ての発光素子及び素子分離部を覆っているので、発光素子3A,3B以外の発光素子に含まれる有機EL層に対する水分の浸入も抑制できる。 Since the filler 16 also covers the second insulating film 13 exposed from the organic EL layers 14A and 14B and the second electrodes 15A and 15B, the moisture in the air is organic through the second insulating film 13. Infiltration into the EL layers 14A and 14B can also be suppressed. Further, since the filler 16 also covers the organic EL layers 14A and 14B, it is possible to suppress moisture in the air from directly entering the organic EL layers 14A and 14B. In addition, gas can be prevented from being released from the exposed region of the element isolation portion 4A by the filler 16. Furthermore, since the filler 16 according to the first embodiment covers all the light emitting elements and the element separating portion in the organic EL display device 1, the filling material 16 is provided for the organic EL layer included in the light emitting elements other than the light emitting elements 3 </ b> A and 3 </ b> B. Infiltration of moisture can also be suppressed.
 また、第1実施形態に係る有機EL表示装置1によれば、充填材16に乾燥剤が含まれるので、素子基板2において発光素子が設けられる領域外に乾燥剤を設けなくてもよい。この場合、接着部7に囲まれる領域を拡張できる。 Moreover, according to the organic EL display device 1 according to the first embodiment, since the desiccant is contained in the filler 16, it is not necessary to provide the desiccant outside the region where the light emitting element is provided in the element substrate 2. In this case, the area surrounded by the bonding portion 7 can be expanded.
 加えて第1実施形態に係る有機EL表示装置1によれば、素子基板2、発光素子3A~3F、素子分離部4A,4B、封止基板5、及び充填材16は光透過性を有しており、且つ、充填材16に含まれる乾燥剤は光透過性を有する。これにより、有機EL表示装置1は、素子基板2側及び封止基板5側の両方に光を出射できる。 In addition, according to the organic EL display device 1 according to the first embodiment, the element substrate 2, the light emitting elements 3A to 3F, the element separation portions 4A and 4B, the sealing substrate 5, and the filler 16 have light transmittance. The desiccant contained in the filler 16 is light transmissive. Thereby, the organic EL display device 1 can emit light to both the element substrate 2 side and the sealing substrate 5 side.
 以上を纏めると、第1実施形態によれば、有機EL表示装置1の寿命の低下を抑制することができることに加えて、両面発光が可能であって狭額縁化されたシースルー型有機EL表示装置を提供できる。 In summary, according to the first embodiment, in addition to being able to suppress a decrease in the lifetime of the organic EL display device 1, a see-through type organic EL display device capable of double-sided light emission and having a narrow frame. Can provide.
 また、第1実施形態に係る有機EL表示装置1は、素子基板2の縁に沿って設けられ、素子基板2と封止基板5とを接合する枠状の接着部7を備え、充填材16は、接着部7によって囲まれる領域に充填されてもよい。この場合、充填材16が素子基板2及び封止基板5の縁から漏れることが抑制されるので、有機EL表示装置1の歩留まりが向上する。また、充填材16の形成領域が接着部7によって囲まれる領域に制限されることにより、当該領域内の空気を充填材16により良好に押し出すことができる。 The organic EL display device 1 according to the first embodiment includes a frame-shaped adhesive portion 7 that is provided along the edge of the element substrate 2 and joins the element substrate 2 and the sealing substrate 5. May be filled in a region surrounded by the bonding portion 7. In this case, since the filler 16 is suppressed from leaking from the edges of the element substrate 2 and the sealing substrate 5, the yield of the organic EL display device 1 is improved. In addition, since the region where the filler 16 is formed is limited to the region surrounded by the bonding portion 7, the air in the region can be pushed out more favorably by the filler 16.
 また、素子基板2及び封止基板5は、可撓性を有してもよい。この場合、フレキシブル有機EL表示装置を実現できる。 Further, the element substrate 2 and the sealing substrate 5 may have flexibility. In this case, a flexible organic EL display device can be realized.
(第2実施形態)
 以下では、第2実施形態に係る有機EL表示装置について説明する。第2実施形態においては、技術的に可能な範囲において第1実施形態の構成を適宜用いてもよい。
(Second Embodiment)
Hereinafter, an organic EL display device according to the second embodiment will be described. In the second embodiment, the configuration of the first embodiment may be used as appropriate within the technically possible range.
 図4は、第2実施形態に係る有機EL表示装置の一部の断面図である。図4に示されるように、有機EL表示装置1Aは、素子基板2上に設けられる素子分離部21を備える。素子分離部21は、第2絶縁膜13上に接して設けられる第1部分22と、第1部分22上に設けられる第2部分23とを有する。素子分離部21は、第1実施形態の素子分離部4Aと同様に、主面2aの一辺に沿って帯状に延在する。したがって、素子分離部21に含まれる第1部分22及び第2部分23は、上記一辺に沿って帯状に延在する。 FIG. 4 is a partial cross-sectional view of the organic EL display device according to the second embodiment. As shown in FIG. 4, the organic EL display device 1 </ b> A includes an element separation unit 21 provided on the element substrate 2. The element isolation unit 21 includes a first portion 22 provided in contact with the second insulating film 13 and a second portion 23 provided on the first portion 22. The element isolation part 21 extends in a strip shape along one side of the main surface 2a, similarly to the element isolation part 4A of the first embodiment. Accordingly, the first portion 22 and the second portion 23 included in the element isolation portion 21 extend in a strip shape along the one side.
 第1部分22は、第2絶縁膜13に接すると共に素子基板2の主面2aと略平行に延在する底面22aと、底面22aに対向すると共に底面22aに略平行に延在する頂面22bと、底面22a及び頂面22bをつなぐ側面22c,22dとを有する。素子分離部21の幅方向において、底面22aの長さと頂面22bとの長さは略同一である。また、側面22c,22dのそれぞれは底面22a及び頂面22bに対して直交するように延在し、側面22c,22dの高さは略同一である。したがって、第1部分22は、幅方向断面において略矩形状を有する。第1部分22の高さは、有機EL層14Aと第2電極15Aとの合計厚さ(あるいは、有機EL層14Bと第2電極15Bとの合計厚さ)よりも大きく、例えば2μm以上5μm以下である。第1部分22は、例えばポリイミド等の光透過性を備える有機樹脂(第1の樹脂)によって形成される。 The first portion 22 is in contact with the second insulating film 13 and extends substantially parallel to the main surface 2a of the element substrate 2, and the top surface 22b that faces the bottom surface 22a and extends substantially parallel to the bottom surface 22a. And side surfaces 22c and 22d connecting the bottom surface 22a and the top surface 22b. In the width direction of the element isolation part 21, the length of the bottom surface 22a and the length of the top surface 22b are substantially the same. Each of the side surfaces 22c and 22d extends so as to be orthogonal to the bottom surface 22a and the top surface 22b, and the heights of the side surfaces 22c and 22d are substantially the same. Accordingly, the first portion 22 has a substantially rectangular shape in the cross section in the width direction. The height of the first portion 22 is larger than the total thickness of the organic EL layer 14A and the second electrode 15A (or the total thickness of the organic EL layer 14B and the second electrode 15B), for example, 2 μm or more and 5 μm or less. It is. The 1st part 22 is formed with organic resin (1st resin) provided with light transmittances, such as a polyimide, for example.
 第2部分23は、第1部分22の頂面22bに接すると共に当該頂面22bと略平行に延在する底面23aと、底面23aに対向すると共に底面23aに略平行に延在する頂面23bと、底面23a及び頂面23bをつなぐ側面23c,23dとを有する。素子分離部21の幅方向において、底面23aの長さと頂面23bとの長さは略同一であり、第1部分22の底面22a及び頂面22bの長さよりも大きい。また、側面23c,23dのそれぞれは底面23a及び頂面23bに対して直交するように延在し、側面23c,23dの高さは略同一である。したがって、第2部分23は、幅方向断面において略矩形状を有する。第2部分23の高さは、例えば2μm以上5μm以下である。第2部分23は、例えばノボラック樹脂等の光透過性を備える有機樹脂(第2の樹脂)によって形成される。 The second portion 23 is in contact with the top surface 22b of the first portion 22 and extends substantially parallel to the top surface 22b. The top surface 23b faces the bottom surface 23a and extends substantially parallel to the bottom surface 23a. And side surfaces 23c and 23d connecting the bottom surface 23a and the top surface 23b. In the width direction of the element isolation part 21, the length of the bottom surface 23 a and the length of the top surface 23 b are substantially the same and are longer than the lengths of the bottom surface 22 a and the top surface 22 b of the first portion 22. Each of the side surfaces 23c and 23d extends so as to be orthogonal to the bottom surface 23a and the top surface 23b, and the heights of the side surfaces 23c and 23d are substantially the same. Accordingly, the second portion 23 has a substantially rectangular shape in the cross section in the width direction. The height of the second portion 23 is, for example, not less than 2 μm and not more than 5 μm. The second portion 23 is formed of an organic resin (second resin) having light transmissivity such as a novolac resin.
 素子分離部21の幅方向において、第2部分23の側面23cは第1部分22の側面22cよりも有機EL層14A側(若しくは、発光素子3A(図3参照)側)に位置する。同様に、素子分離部21の幅方向において、第2部分23の側面23dは第1部分22の側面22dよりも有機EL層14B側(若しくは、発光素子3B(図3参照)側)に位置する。したがって、素子分離部21の幅方向において、第2部分23の両側は第1部分22から突出しており、素子分離部21は、幅方向断面においていわゆるオーバーハング形状を有する。なお、素子分離部21の幅方向において、側面22cと側面23cとの間の距離は、1μm以上10μm以下であり、側面22dと側面23dとの間の距離は、1μm以上10μm以下である。この場合、有機EL層14A,14B、及び第2電極15A,15Bが素子分離部21によって良好に分離されると共に、素子分離部21の形状が安定して保持される。 In the width direction of the element isolation portion 21, the side surface 23 c of the second portion 23 is located closer to the organic EL layer 14 </ b> A side (or the light emitting element 3 </ b> A (see FIG. 3) side) than the side surface 22 c of the first portion 22. Similarly, in the width direction of the element isolation portion 21, the side surface 23d of the second portion 23 is located closer to the organic EL layer 14B side (or the light emitting element 3B (see FIG. 3) side) than the side surface 22d of the first portion 22. . Therefore, both sides of the second portion 23 protrude from the first portion 22 in the width direction of the element isolation portion 21, and the element isolation portion 21 has a so-called overhang shape in the cross section in the width direction. In the width direction of the element isolation part 21, the distance between the side surface 22c and the side surface 23c is 1 μm or more and 10 μm or less, and the distance between the side surface 22d and the side surface 23d is 1 μm or more and 10 μm or less. In this case, the organic EL layers 14A and 14B and the second electrodes 15A and 15B are satisfactorily separated by the element separation part 21, and the shape of the element separation part 21 is stably maintained.
 ここで、第2実施形態に係る素子分離部の形成方法の一例について説明する。まず、第2絶縁膜13上にスピンコートによって第1の樹脂を塗布した後に100℃~150℃の熱処理を行うことによって、第2絶縁膜13上に厚さ約3μmの第1樹脂層を形成する。次に、第1樹脂層上にスピンコートによって第2の樹脂を塗布した後に100℃~150℃の熱処理を行うことによって、第1樹脂層上に厚さ約3μmの第2樹脂層を形成する。第2実施形態では、第1の樹脂として非感光性樹脂を用い、第2の樹脂としてネガ型レジストを用いる。次に、ストライプ状の開口部が形成されたフォトマスクを用いて、第2樹脂層の一部を露光する。次に、100℃~150℃の熱処理を行った後に、TMAHを用いて第2樹脂層の現像を行うと共に、第1樹脂層のエッチングを行う。第2樹脂層の現像時間及び第1樹脂層のエッチング時間を調整することにより、溶解され難い第2樹脂層の露光領域に重なる第1樹脂層の一部をTMAHによって除去する。そして、さらに100℃~150℃の熱処理を行うことによって、オーバーハング形状を有すると共に所定の方向に延在する帯状の素子分離部21を複数形成する。なお、第2の樹脂においてエッチャントであるTMAHに対する溶解度が、第1の樹脂のTMAHに対する溶解度よりも低くするように第2の樹脂を選択することによって、第1樹脂層のエッチング時間を短縮してもよい。 Here, an example of a method for forming the element isolation portion according to the second embodiment will be described. First, after applying a first resin on the second insulating film 13 by spin coating, a heat treatment at 100 ° C. to 150 ° C. is performed to form a first resin layer having a thickness of about 3 μm on the second insulating film 13. To do. Next, a second resin layer having a thickness of about 3 μm is formed on the first resin layer by applying a second resin on the first resin layer by spin coating and then performing a heat treatment at 100 ° C. to 150 ° C. . In the second embodiment, a non-photosensitive resin is used as the first resin, and a negative resist is used as the second resin. Next, a part of the second resin layer is exposed using a photomask in which stripe-shaped openings are formed. Next, after heat treatment at 100 ° C. to 150 ° C., the second resin layer is developed using TMAH, and the first resin layer is etched. By adjusting the development time of the second resin layer and the etching time of the first resin layer, a part of the first resin layer that overlaps the exposed region of the second resin layer that is difficult to be dissolved is removed by TMAH. Further, by performing heat treatment at 100 ° C. to 150 ° C., a plurality of strip-shaped element isolation portions 21 having an overhang shape and extending in a predetermined direction are formed. In addition, the etching time of the first resin layer is shortened by selecting the second resin so that the solubility of the second resin in the etchant TMAH is lower than the solubility of the first resin in TMAH. Also good.
 次に、第1実施形態と比較しながら第2実施形態の作用効果について説明する。第1実施形態において、第2電極15A,15Bを形成する透明導電層の製造条件によっては、導電層18が素子分離部4Aの全面を被覆することがある。この場合、第1実施形態においては第2電極15A,15Bが素子分離部4Aによって分離されずに連続した一つの透明導電層となる。これにより、第1実施形態では発光素子3A,3Bが短絡することがある。 Next, the operational effects of the second embodiment will be described in comparison with the first embodiment. In the first embodiment, the conductive layer 18 may cover the entire surface of the element isolation portion 4A depending on the manufacturing conditions of the transparent conductive layer forming the second electrodes 15A and 15B. In this case, in the first embodiment, the second electrodes 15A and 15B are not separated by the element isolation portion 4A, but become a single transparent conductive layer. Thereby, in 1st Embodiment, light emitting element 3A, 3B may short-circuit.
 これに対して第2実施形態に係る有機EL表示装置1Aによれば、素子分離部21は、素子基板2上に設けられる帯状の第1部分22と、第1部分22上に設けられる帯状の第2部分23とを有する。また、素子分離部21の幅方向において、第2部分23の両側は、第1部分22から突出している。この場合、第2部分23は第1部分22に対する庇として機能する。このため、素子基板2に対する透明導電層の被膜率が高くなるように製造条件が設定された場合であっても、素子分離部21の第1部分22の一部と、第2部分23の一部とが導電層18から露出する。具体的には、第1部分22における側面22c,22dの第2部分23に近傍する領域と、第2部分23における底面23aの第1部分22と接していない領域とが、素子分離部21の露出領域となる。これにより、素子分離部21上に設けられる導電層18が、第1実施形態よりも第2電極15A,15Bと分離しやすくなる。したがって、第2実施形態に係る有機EL表示装置1Aでは、製造条件が変更された場合であっても、素子分離部21を挟んで隣接する発光素子同士が良好に素子分離する。 On the other hand, according to the organic EL display device 1 </ b> A according to the second embodiment, the element separating unit 21 includes the band-shaped first portion 22 provided on the element substrate 2 and the band-shaped first portion 22 provided on the first portion 22. And a second portion 23. Further, both sides of the second portion 23 protrude from the first portion 22 in the width direction of the element isolation portion 21. In this case, the second portion 23 functions as a bag for the first portion 22. For this reason, even if the manufacturing conditions are set so that the coating ratio of the transparent conductive layer to the element substrate 2 is increased, a part of the first part 22 of the element separation part 21 and one part of the second part 23 Part is exposed from the conductive layer 18. Specifically, a region of the first portion 22 adjacent to the second portion 23 of the side surfaces 22c and 22d and a region of the second portion 23 that is not in contact with the first portion 22 of the bottom surface 23a It becomes an exposed area. Thereby, the conductive layer 18 provided on the element isolation part 21 is more easily separated from the second electrodes 15A and 15B than in the first embodiment. Therefore, in the organic EL display device 1 </ b> A according to the second embodiment, even when the manufacturing conditions are changed, the light emitting elements adjacent to each other with the element isolation unit 21 interposed therebetween are favorably separated.
 また、第2実施形態の素子分離部21の露出領域は、充填材16によって覆われる。このため、第2実施形態に係る有機EL表示装置1Aによれば、第1実施形態と同様の作用効果が奏される。 Further, the exposed region of the element isolation part 21 of the second embodiment is covered with the filler 16. For this reason, according to the organic EL display device 1 </ b> A according to the second embodiment, the same operational effects as those of the first embodiment are exhibited.
 次に、図5(a),(b)を用いながら第2実施形態の変形例に係る有機EL表示装置について説明する。図5(a)は、第2実施形態の第1変形例に係る有機EL表示装置の一部の断面図である。図5(a)に示されるように、有機EL表示装置1Bにおける素子分離部21Aの第2部分23Aは、幅方向断面において順テーパー形状を有する。すなわち、素子分離部21Aの幅方向において、底面23aの長さは頂面23bの長さよりも大きく、且つ底面23aの両側は頂面23bから突出している。この場合、第2実施形態の第2部分と比較して素子分離部21Aの幅を狭くすることができる。したがって、素子基板2上に設けられる発光素子の割合を大きくできる。また、第1変形例においても、第2実施形態と同様の作用効果が奏される。 Next, an organic EL display device according to a modification of the second embodiment will be described with reference to FIGS. 5 (a) and 5 (b). FIG. 5A is a partial cross-sectional view of an organic EL display device according to a first modification of the second embodiment. As shown in FIG. 5A, the second portion 23A of the element isolation portion 21A in the organic EL display device 1B has a forward tapered shape in the cross section in the width direction. That is, in the width direction of the element isolation portion 21A, the length of the bottom surface 23a is larger than the length of the top surface 23b, and both sides of the bottom surface 23a protrude from the top surface 23b. In this case, the width of the element isolation portion 21A can be narrower than that of the second portion of the second embodiment. Therefore, the ratio of the light emitting elements provided on the element substrate 2 can be increased. Also in the first modified example, the same operational effects as those of the second embodiment are achieved.
 図5(b)は、第2実施形態の第2変形例に係る有機EL表示装置の一部の断面図である。図5(b)に示されるように、有機EL表示装置1Cにおける素子分離部21Bの第2部分23Bは、幅方向断面において逆テーパー形状を有する。すなわち、素子分離部21Bの幅方向において、頂面23bの長さは底面23aの長さよりも大きく、且つ頂面23bの両側は底面23aから突出している。この場合、充填材16が第1部分22の側面22c,22dに流れ込みやすくなる。したがって、素子分離部21Bの露出領域が充填材16によって覆われやすくなる。また、第2変形例においても、第2実施形態と同様の作用効果が奏される。 FIG. 5B is a partial cross-sectional view of an organic EL display device according to a second modification of the second embodiment. As shown in FIG. 5B, the second portion 23B of the element isolation portion 21B in the organic EL display device 1C has an inversely tapered shape in the cross section in the width direction. That is, in the width direction of the element isolation portion 21B, the length of the top surface 23b is larger than the length of the bottom surface 23a, and both sides of the top surface 23b protrude from the bottom surface 23a. In this case, the filler 16 can easily flow into the side surfaces 22 c and 22 d of the first portion 22. Therefore, the exposed region of the element isolation portion 21 </ b> B is easily covered with the filler 16. Also in the second modified example, the same effects as those of the second embodiment are achieved.
 本発明による有機EL表示装置は、上述した実施形態及び変形例に限られるものではなく、他に様々な変形が可能である。例えば、本発明は、上述した有機EL表示装置のみに適用されるものではない。例えば、セグメント型有機EL表示装置に適用してもよい。 The organic EL display device according to the present invention is not limited to the above-described embodiments and modifications, and various other modifications are possible. For example, the present invention is not applied only to the organic EL display device described above. For example, the present invention may be applied to a segment type organic EL display device.
 また、上記実施形態及び変形例において第1電極は陽極であり、第2電極は陰極であるが、第1電極を陰極とし、第2電極を陽極としてもよい。 In the embodiment and the modification, the first electrode is an anode and the second electrode is a cathode. However, the first electrode may be a cathode and the second electrode may be an anode.
 また、上記実施形態及び変形例において、有機EL層はパターニングされずに形成されるが、これに限定されない。つまり、有機EL層は、例えば発光素子内のみに設けられるようにパターニング形成されてもよい。この場合、例えばマスクを用いて有機EL層をパターニング形成する。マスクを用いて有機EL層を形成する際に、素子分離部を、該マスクが載置される部分としてもよい。なお、上記実施形態において、有機EL層が発光素子外に設けられない場合、素子分離部の高さは、第2電極の厚さよりも大きければよい。 In the embodiment and the modification, the organic EL layer is formed without patterning, but is not limited thereto. That is, the organic EL layer may be formed by patterning so as to be provided only in the light emitting element, for example. In this case, for example, the organic EL layer is formed by patterning using a mask. When the organic EL layer is formed using a mask, the element isolation portion may be a portion on which the mask is placed. In the above embodiment, when the organic EL layer is not provided outside the light emitting element, the height of the element separating portion may be larger than the thickness of the second electrode.
 1,1A~1C…有機EL表示装置、2…素子基板、3A~3F…発光素子、4A、4B,21,21A,21B…素子分離部、5…封止基板、7…接着部、11…第1絶縁膜、12…第1電極、13…第2絶縁膜、14A,14B…有機EL層、15A,15B…第2電極、16…充填材、22…第1部分、23,23A,23B…第2部分。 DESCRIPTION OF SYMBOLS 1,1A-1C ... Organic EL display device, 2 ... Element substrate, 3A-3F ... Light emitting element, 4A, 4B, 21, 21A, 21B ... Element separation part, 5 ... Sealing substrate, 7 ... Adhesion part, 11 ... 1st insulating film, 12 ... 1st electrode, 13 ... 2nd insulating film, 14A, 14B ... Organic EL layer, 15A, 15B ... 2nd electrode, 16 ... Filler, 22 ... 1st part, 23, 23A, 23B ... the second part.

Claims (6)

  1.  第1基板と、
     前記第1基板上に設けられ、それぞれが有機EL層を含む第1発光素子及び第2発光素子と、
     前記第1基板上に設けられ、前記第1発光素子と前記第2発光素子とを分離する素子分離部と、
     前記第1発光素子上、前記第2発光素子上、及び前記素子分離部上に設けられる第2基板と、
     前記第1基板と前記第2基板との隙間を埋めるように設けられる充填材と、
    を備え、
     前記第1基板、前記第1発光素子、前記第2発光素子、前記素子分離部、前記第2基板、及び前記充填材は光透過性を有し、
     前記充填材は、光透過性を有する乾燥剤を含むと共に前記素子分離部の露出領域を覆っている、
    有機EL表示装置。
    A first substrate;
    A first light emitting device and a second light emitting device each provided on the first substrate, each including an organic EL layer;
    An element separation unit provided on the first substrate and separating the first light emitting element and the second light emitting element;
    A second substrate provided on the first light emitting element, on the second light emitting element, and on the element separating portion;
    A filler provided so as to fill a gap between the first substrate and the second substrate;
    With
    The first substrate, the first light emitting element, the second light emitting element, the element separating portion, the second substrate, and the filler have light transmittance,
    The filler includes a light-transmitting desiccant and covers an exposed region of the element isolation part.
    Organic EL display device.
  2.  前記素子分離部は、前記第1基板上に設けられる帯状の第1部分と、前記第1部分上に設けられる帯状の第2部分とを有しており、
     前記素子分離部の幅方向において、前記第2部分の両側は、前記第1部分から突出している、請求項1に記載の有機EL表示装置。
    The element isolation portion has a strip-shaped first portion provided on the first substrate and a strip-shaped second portion provided on the first portion;
    The organic EL display device according to claim 1, wherein both sides of the second portion protrude from the first portion in a width direction of the element isolation portion.
  3.  前記第2部分は、幅方向断面順テーパー形状を有している、請求項2に記載の有機EL表示装置。 The organic EL display device according to claim 2, wherein the second portion has a cross-sectional forward taper shape in the width direction.
  4.  前記第2部分は、幅方向断面逆テーパー形状を有している、請求項2に記載の有機EL表示装置。 The organic EL display device according to claim 2, wherein the second portion has a cross-section inversely tapered shape in the width direction.
  5.  前記第1基板の縁に沿って設けられ、前記第1基板と前記第2基板とを接合する枠状の接着部をさらに備え、
     前記充填材は、前記接着部によって囲まれる領域に充填される、請求項1~4のいずれか一項に記載の有機EL表示装置。
    A frame-like adhesive portion that is provided along an edge of the first substrate and that joins the first substrate and the second substrate;
    The organic EL display device according to any one of claims 1 to 4, wherein the filler is filled in a region surrounded by the adhesive portion.
  6.  前記第1基板及び前記第2基板は、可撓性を有する、請求項1~5のいずれか一項に記載の有機EL表示装置。 The organic EL display device according to any one of claims 1 to 5, wherein the first substrate and the second substrate have flexibility.
PCT/JP2015/080604 2015-10-29 2015-10-29 Organic el display device WO2017072920A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/JP2015/080604 WO2017072920A1 (en) 2015-10-29 2015-10-29 Organic el display device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2015/080604 WO2017072920A1 (en) 2015-10-29 2015-10-29 Organic el display device

Publications (1)

Publication Number Publication Date
WO2017072920A1 true WO2017072920A1 (en) 2017-05-04

Family

ID=58629929

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2015/080604 WO2017072920A1 (en) 2015-10-29 2015-10-29 Organic el display device

Country Status (1)

Country Link
WO (1) WO2017072920A1 (en)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004014532A (en) * 1995-03-13 2004-01-15 Pioneer Electronic Corp Organic electroluminescent display panel and its manufacturing process
JP2004535053A (en) * 2001-07-11 2004-11-18 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング Organic, color, electroluminescent displays and their manufacture
JP2005209633A (en) * 2003-12-26 2005-08-04 Semiconductor Energy Lab Co Ltd Display device and method for manufacturing display device
JP2006228519A (en) * 2005-02-16 2006-08-31 Canon Inc Organic electroluminescent element and its manufacturing method
JP2008140735A (en) * 2006-12-05 2008-06-19 Fuji Electric Holdings Co Ltd Organic electroluminescent display, and manufacturing method thereof
JP2011216317A (en) * 2010-03-31 2011-10-27 Dainippon Printing Co Ltd Organic electroluminescent element and manufacturing method therefor
JP2012215885A (en) * 1999-10-29 2012-11-08 Semiconductor Energy Lab Co Ltd Electronic device
JP2015111506A (en) * 2013-12-06 2015-06-18 双葉電子工業株式会社 Organic electroluminescent device and method of manufacturing the same

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004014532A (en) * 1995-03-13 2004-01-15 Pioneer Electronic Corp Organic electroluminescent display panel and its manufacturing process
JP2012215885A (en) * 1999-10-29 2012-11-08 Semiconductor Energy Lab Co Ltd Electronic device
JP2004535053A (en) * 2001-07-11 2004-11-18 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング Organic, color, electroluminescent displays and their manufacture
JP2005209633A (en) * 2003-12-26 2005-08-04 Semiconductor Energy Lab Co Ltd Display device and method for manufacturing display device
JP2006228519A (en) * 2005-02-16 2006-08-31 Canon Inc Organic electroluminescent element and its manufacturing method
JP2008140735A (en) * 2006-12-05 2008-06-19 Fuji Electric Holdings Co Ltd Organic electroluminescent display, and manufacturing method thereof
JP2011216317A (en) * 2010-03-31 2011-10-27 Dainippon Printing Co Ltd Organic electroluminescent element and manufacturing method therefor
JP2015111506A (en) * 2013-12-06 2015-06-18 双葉電子工業株式会社 Organic electroluminescent device and method of manufacturing the same

Similar Documents

Publication Publication Date Title
JP6733203B2 (en) Electro-optical device, electronic equipment
JP2008177169A (en) Organic electroluminescent display device and its manufacturing method
JP6329795B2 (en) EL display device and method of manufacturing EL display device
WO2006064715A1 (en) Display device and display device manufacturing method
JP2009076437A (en) Display device
KR100879857B1 (en) Organic Light Emitting Display Device and Manufacturing Method of The Same
EP2728640B1 (en) Organic light emitting diode display device and method of fabricating the same
TW201734592A (en) Display device
JP5461096B2 (en) Organic EL display device
JP6175644B2 (en) Display device and electronic device
KR102395919B1 (en) Organic light emitting diode display
WO2014162395A1 (en) Light-emitting device
WO2018042960A1 (en) Organic el display device
JP2007323953A (en) Organic led element
WO2017072920A1 (en) Organic el display device
WO2013168290A1 (en) Light emitting apparatus
JP2007005047A (en) Organic el display device and manufacturing method of the same
WO2015146904A1 (en) Display device
JP2011029081A (en) Organic el device
JP2007059302A (en) Light emitting device
KR101096719B1 (en) Organic Electroluminescence Display Device And Method For Fabricating The Same
JP6792577B2 (en) Light emitting device
KR100739650B1 (en) Organic light emitting display and method for fabricating thereof
JP2007323889A (en) Organic led element, and its manufacturing method
KR100778413B1 (en) Passive matrix type organic light emitting display and method for manufacturing thereof

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 15907284

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 15907284

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: JP