WO2017070891A1 - Color filter substrate and fabrication method thereof, oled structure, related display panel, and related display device - Google Patents

Color filter substrate and fabrication method thereof, oled structure, related display panel, and related display device Download PDF

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Publication number
WO2017070891A1
WO2017070891A1 PCT/CN2015/093194 CN2015093194W WO2017070891A1 WO 2017070891 A1 WO2017070891 A1 WO 2017070891A1 CN 2015093194 W CN2015093194 W CN 2015093194W WO 2017070891 A1 WO2017070891 A1 WO 2017070891A1
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Prior art keywords
color filter
reflective
filter substrate
pixel units
metallic matrix
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PCT/CN2015/093194
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English (en)
French (fr)
Inventor
Wenbin Jia
Xinwei Gao
Guangcai Yuan
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Boe Technology Group Co., Ltd.
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Application filed by Boe Technology Group Co., Ltd. filed Critical Boe Technology Group Co., Ltd.
Priority to US15/325,262 priority Critical patent/US9960377B2/en
Priority to PCT/CN2015/093194 priority patent/WO2017070891A1/en
Priority to CN201580002684.1A priority patent/CN105765450A/zh
Publication of WO2017070891A1 publication Critical patent/WO2017070891A1/en

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/11—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/133509—Filters, e.g. light shielding masks
    • G02F1/133514—Colour filters
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/133553—Reflecting elements
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133603—Direct backlight with LEDs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/85—Arrangements for extracting light from the devices
    • H10K50/854—Arrangements for extracting light from the devices comprising scattering means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/86—Arrangements for improving contrast, e.g. preventing reflection of ambient light
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30—Devices specially adapted for multicolour light emission
    • H10K59/38—Devices specially adapted for multicolour light emission comprising colour filters or colour changing media [CCM]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/8791—Arrangements for improving contrast, e.g. preventing reflection of ambient light
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/875—Arrangements for extracting light from the devices
    • H10K59/877—Arrangements for extracting light from the devices comprising scattering means

Definitions

  • the present invention generally relates to the display technologies and, more particularly, relates to a color filter substrate, and a fabrication method thereof, OLED structure, related display panels, and related display devices.
  • OLED display devices with advantages such as low energy consumption, high luminance, fast response time, wide viewing angle, and light weight, have been broadly used in devices such as mobile communication terminals, personal digital assistants (PDAs) and tablet computers.
  • OLED display devices are classified into the passive matrix type and active matrix type.
  • the active matrix type OLED display devices utilize thin film transistors (TFTs) to drive OLEDs.
  • a white organic light emitting device provides high resolution and large scale displays, and can be used in a backlight of a liquid crystal display (LCD) device or a full color display device employing color filters.
  • White OLED and other top-emitting display devices have relatively high aperture ratios, but the light output and viewing angles of these display devices are not ideal.
  • a color filter substrate is used to filter white light generated by the OLED layer.
  • the color filter substrate includes color filters and a black matrix formed on a glass substrate of the display panel. When the emitted light enters the substrate, the black matrix structure would absorb part of the light to reduce the reflection and improve the contrast ratio of the OLED display.
  • a conventional black matrix absorbs light, including the diffused light generated by many pixels, which may reduce the brightness levels of the display panels. Further, conventional black matrix is often made of heavy metals, such as chromium. Such materials pollute the environment. In addition, the processes implemented to cleanup manufacturing wastes containing heavy metals are often burdensome and costly.
  • the present disclosure provides an OLED/LC structure and fabrication method thereof, and related display panels and devices.
  • the disclosed color filter substrate By using the disclosed color filter substrate, the light output and the contrast ratio of an OLED/LC display panel can be improved. Further, the manufacturing process according to the embodiments of the present disclosure is cleaner and therefore more economical.
  • the color filter substrate includes a substrate; a color filter layer comprising a plurality of pixel units; and a reflective metallic matrix comprising a plurality of reflective metallic matrix elements surrounding each pixel unit.
  • each reflective metallic matrix element includes a reflective surface facing each adjacent pixel unit.
  • the reflective surface forms an acute angle with the substrate.
  • the reflective surface may form an acute angle of about 30° to 60° with the substrate.
  • the reflective metallic matrix elements comprise pyramid shaped metallic elements with reflective surfaces.
  • the reflective metallic elements comprise frustum shaped metallic elements with reflective surfaces.
  • the color filter layer is thinner than the reflective metallic matrix.
  • the color filter substrate includes a protection layer covering the reflective metallic matrix and the color filter layer.
  • a thickness of the protection layer is about 2um to 4um.
  • the color filter substrate includes light diffusers dispensed on the protection layer.
  • the light diffusers may be transparent.
  • the light diffusers may be light scattering particles with diameters of about 20nm to 80nm.
  • the light diffusers are selected from one or a combination of SiO2 and TiO2.
  • the pixel units include blue pixel units, red pixel units, green pixel units, and white pixel units.
  • the OLED structure includes an OLED array substrate.
  • the OLED array substrate includes a thin-film transistor (TFT) substrate with a TFT layer; and an OLED layer formed on the TFT substrate, the OLED layer emitting light.
  • the OLED structure further includes a color filter substrate.
  • the color filter substrate includes a substrate; a color filter layer comprising a plurality of pixel units; and a reflective metallic matrix comprising a plurality of reflective metallic elements surrounding each pixel unit.
  • each reflective metallic matrix element includes a reflective surface facing each adjacent pixel unit.
  • the reflective surface forms an acute angle with the substrate.
  • the reflective surface may form an acute angle of about 30° to 60° with the substrate.
  • the reflective metallic matrix elements comprise pyramid shaped metallic elements with reflective surfaces.
  • the reflective metallic elements comprise frustum shaped metallic elements with reflective surfaces.
  • the color filter layer is thinner than the reflective metallic matrix.
  • the color filter substrate includes a protection layer covering the reflective metallic matrix and the color filter layer.
  • a thickness of the protection layer is about 2um to 4um.
  • the color filter substrate includes light diffusers dispensed on the protection layer.
  • the light diffusers may be transparent.
  • the light diffusers may be light scattering particles with diameters of about 20nm to 80nm.
  • the light diffusers are selected from one or a combination of SiO2 and TiO2.
  • the pixel units include blue pixel units, red pixel units, green pixel units, and white pixel units.
  • Another aspect of the present disclosure provides a method for fabricating a color filter substrate.
  • the method for fabricating the color filter substrate includes forming a reflective metallic matrix in an active region of a cover glass, wherein each metallic matrix element is of a pyramid shape; forming pixel units in the active region of the cover glass; forming a protection layer on the pixel units and the reflective metallic matrix; and dispensing light diffusers on the protection layer.
  • each reflective metallic matrix element includes a reflective surface facing each adjacent pixel unit.
  • the reflective surface forms an acute angle with the substrate.
  • the reflective surface may form an acute angle of about 30° to 60° with the substrate.
  • the reflective metallic matrix elements comprise pyramid shaped metallic elements with reflective surfaces.
  • the reflective metallic elements comprise frustum shaped metallic elements with reflective surfaces.
  • the color filter layer is thinner than the reflective metallic matrix.
  • Another aspect of the present disclosure provides a display panel including the color filter substrate described above.
  • Another aspect of the present disclosure provides a display device including the above-mentioned display panel.
  • Figure 1a is a top view of an exemplary cover glass according to embodiments of the present disclosure
  • Figure 1b illustrates a cross sectional view of an exemplary display panel according to embodiments of the present disclosure
  • Figure 2 illustrates an exemplary process flow for fabricating the OLED/LC structure according to embodiments of the present disclosure
  • Figure 3 illustrates exemplary components described in the process flow of Figure 2.
  • Color filters in OLED/LC structures need to have a high degree of color purity, optical transmittance, and optical tolerance, with little or no discoloration or fading over time, as well as high thermal stability and chemical resistance.
  • a color filter may also be referred to as a pixel unit. The two terms are used interchangeably in the present disclosure.
  • pixel units are often interposed with a black matrix.
  • embodiments of the present disclosure provide a color filter substrate with a highly reflective metallic matrix that can be used with pixel units.
  • the metallic matrix forms a pattern of lines on the color filter substrate that shields bus lines and TFTs from the viewable area of the display. These lines distinguish red, green, or blue (RGB) pixels to prevent pixel crosstalk and light leakage, thus improving the contrast ratio.
  • RGB red, green, or blue
  • the metallic matrix is a layer only a few microns thick. Thus, it has little impact on the aperture ratio.
  • the metallic matrix may be formed by reflective metallic materials, such as certain metals including copper (Cu) , silver (Ag) , etc.
  • the metallic matrix is highly reflective also because each element of the metallic matrix is of a pyramid shape or similar shapes.
  • the shape of the metallic matrix elements further enables the metallic matrix to reflect scattered light to the adjacent pixel units, increasing the light output of the display panel.
  • the metallic matrix is thicker than the pixel units on the color filter substrate, which prevents light mixings between light going through different pixel units.
  • the color filter substrate according to embodiments of the present disclosure further includes a layer of light diffusers dispensed on top of the pixel units and the metallic matrix.
  • the light diffusers scatter light emitted by the luminescent layer. The diffused light is then reflected by the metallic matrix and transmitted out of the display panel through the pixel units.
  • One aspect of the present disclosure provides a color filter substrate that is used in an OLED/LC structure.
  • Figures 1a and 1b illustrate an exemplary OLED/LC structure100 according to various embodiments of the present disclosure.
  • the OLED/LC structure100 includes a cover glass 2 bonded with the TFT substrate 1, encapsulating a number of functional layers.
  • Figure 1a shows a top/front view of the cover glass 2.
  • the cover glass 2 includes an active region 21, in which an image is displayed on the display panel during operation.
  • the cover glass 2 also includes a peripheral region 22, in which no image is displayed during operation.
  • the OLED/LC structure 100 includes an OLED array substrate 3according to embodiments of the present disclosure.
  • the OLED array substrate 3 includes a TFT substrate1withTFTsdisposed on it and an OLED/LC layer formed over the TFTs.
  • the OLED/LC layer is a luminescent layer.
  • the OLED/LC layer may be disconnected by certain barriers.
  • the OLED/LC layer may be formed integrally in one layer.
  • the OLED/LC layer may be an OLED layer sandwiched by a cathode layer and an anode layer. The array of electrodes may be controlled by the TFT circuitry in the TFT layer.
  • the OLED/LC structure 100 further includes a color filter substrate 4.
  • the color filter substrate 4 includes a cover glass 2.
  • the cover glass 2 includes an active region21 and a peripheral region22.
  • the active region 21 may be, for example, a rectangular region in the center of the cover glass 2 in which display pixels are actively used to display images.
  • the peripheral region 22 may be devoid of active display pixels. In the example of Figure1a, the peripheral region 22 has the shape of a rectangular ring, surrounding the periphery of active region 21. Circuitry and other components may sometimes be formed in the peripheral region 22. To hide the circuitry and other components from view by a user of the display device, the peripheral region 22may sometimes be provided with an opaque mask.
  • the opaque mask can be formed from an opaque material such as a black material or may be formed from opaque masking materials of other colors.
  • the color filter substrate 4 further includes pixel units 24.
  • the pixel units 24 may be red (R) , green (G) or blue (B) .
  • the pixel units 24 may form a color filter layer.
  • the array of pixel units 24in the color filter layer may be used to provide the display panel with the ability to display color images.
  • the color filter substrate 4 further includes a reflective metallic matrix23.
  • the metallic matrix23 is interposed between the pixel units 24.
  • the metallic matrix23 masks light leaked from the space between the pixel units 24.
  • the metallic matrix23 may be made of metallic materials that have a high reflectance, such as aluminum (Al) , aluminum alloy, copper (Cu) , silver (Ag) , titanium (Ti) , etc., and/or a combination of the metallic materials.
  • metallic matrix23 may be formed from a grid of relatively thin lines.
  • the metallic matrix23 may have a pattern of openings such as an array of rectangular holes for receiving pixel units 24.
  • metallic matrix material may be used in forming a peripheral metallic matrix that serves as a black border for the display.
  • the metallic matrix in the peripheral region 22 may have a rectangular ring shape that surrounds a central rectangular active region 21.
  • black matrix material may be used in forming a peripheral black matrix that serves as a black border for the display.
  • each element of the metallic matrix23 may be pyramid shaped, as shown in Figure 1b. Compared to other shapes, the pyramid shaped metallic matrix23may reflect more light into the pixel units 24 and thus enables more light emitted by the OLED/LC layer to be transmitted through the pixel units 24.
  • the elements of metallic matrix23 may be of a right pyramid shape, a non-right pyramid shape, square pyramid shape, triangular prism, etc. In some embodiments, the metallic matrix 23 elements may be frustums. In Figure 1b, the arrows pointing down from the cover glass 2 indicate the direction of the light output of the display panel.
  • each metallic matrix 23 element provides reflective surfaces 30 that reflect light into the adjacent pixel units 24.
  • the metallic matrix 23 element may be a square pyramid with four reflective surfaces 30.
  • Each reflective surface 30 faces one pixel unit 24.
  • Each reflective surface 30 may form an acute angle with the cover glass 2.
  • each reflective surface 30 may form an angle of about 30°-60° with the cover glass 2.
  • the thickness of the pixel units 24 may be thinner than the thickness of the metallic matrix 23. In one embodiment, the thickness of the pixel units 24 may be thinner than the thickness of the metallic matrix 23 by 1um to 2 um. Such a configuration enables the metallic matrix 23 to reflect scattered light into pixel units 24, therefore increases light output of the display panel.
  • the shape of the elements of the metallic matrix 23 according to the present disclosure is not limited to those disclosed in the present disclosure.
  • the angle formed by the reflective surfaces of the metallic matrix 23 elements with the cover glass, according to the present disclosure, is not limited to those disclosed in the present disclosure.
  • Embodiments of the present disclosure provide metallic matrix 23 with elements of the metallic matrix 23 being of any shape that may improve the light transmission rate or contrast ratio of the display panel.
  • the shape of the metallic matrix 23 elements and the angles formed between the reflective surfaces 30 of the metallic matrix 23 and the cover glass 2 may be adjusted to achieve various design objectives in light transmission rate, contrast ratio, manufacturing cost, etc.
  • the size of the elements of the metallic matrix 23 according to the present disclosure is not limited to those disclosed in the present disclosure. In embodiments of the present disclosure, any size of the metallic matrix 23 elements that can be properly interposed between the pixel units 24 may be appropriate for the color filter substrate.
  • the thickness of the metallic matrix 23 elements can be adjusted to achieve different design objectives in light transmission rate, manufacturing cost, etc.
  • composition of the metallic matrix 23 may also be adjusted according to various designs and applications.
  • Embodiments of the present disclosure provide metallic matrix with elements of the metallic matrix be made of any metal or other materials, or a combination thereof, that may improve the light transmission rate or the contrast ratio of the display panel.
  • the color filter substrate 4 further includes a protection layer 25.
  • the protection layer 25 is substantially transparent and can be formed of a resin, for example.
  • the protection layer 25 encapsulates the pixel units 24 and the metallic matrix23 on the surface of the cover glass 2, protects the pixel units 24 and the metallic matrix23from the external environment, and thus limits damages caused by environmental factors such as oxygen and moisture.
  • the protection layer 25 should be of an appropriate thickness. If the protection layer 25 is too thin, it may not provide sufficient insulation to the external environment. If the protection layer25 is too thick, it may lead to increased opacity and deterioration of light transmission efficiency. In some embodiments, the protection layer 25 may be around 2um-4um thick.
  • the color filter substrate 4 further includes light diffusers 26.
  • the light diffusers 26 may be dispensed onto the protection layer 25. Light generated by the OLED/LC layer may be scattered by the light diffusers26 to reach the color filter substrate 4 and be transmitted through the pixel units 24.
  • the light diffusers 26 are another element for effectively improving the light output and viewing angle of the display panel.
  • the light diffusers 26 may be light scattering particles, each having a diameter of about 30 nm to about 80 nm.
  • the light diffusers 26 may be transparent. If light is incident to fine particles, such as the light diffusers 26, light is generally scattered. In a case where a diameter of a particle is less than 1/10 of a light wavelength, forward scattering and backward scattering similarly occur. Forward scattering refers to when light scatters in a direction in which light travels. Backward scattering refers to when light scatters in a direction in which light is reflected. This is referred to as Rayleigh scattering.
  • the light diffusers 26 need to have diameters greater than 1/10 of a corresponding light wavelength.
  • the light diffusers 26 may need to have diameters greater than 40nm-70nm.
  • the different sizes of the light diffusers 26 may cause various light scattering effect.
  • the light diffusers 26 may have diameters of about 20nm-80nm.
  • the light diffusers 26 may be made of polystyrene (PS) , silicon dioxide (SiO2) , titanium dioxide (TiO2) , etc.
  • PS polystyrene
  • SiO2 silicon dioxide
  • TiO2 titanium dioxide
  • the light diffusers 26 may be dispensed on top of the protection layer 25 by a sol-gel method or a microemulsion method.
  • the composition and diameters of the light diffusers 26 may be adjusted according to various designs and applications to achieve different light transmitting effects.
  • the OLED array substrate 3 is bonded with the color filter substrate 4 through a sealant 27.
  • the sealant 27 may be a UV-curing sealant 27.
  • the UV-curingsealant 27 may be applied in the peripheral region 22 of the cover glass 2.
  • the OLED array substrate 3 and color filter substrate 4 may subsequently be pressed together.
  • the UV-curing sealant 27 may then be cured by applying UV light to the sealant.
  • Another aspect of the present disclosure provides a method for fabricating an color filter substrate that is used in an OLED/LC structure according to various embodiments of the present disclosure.
  • Figure 2 illustrates an exemplary process for fabricating the OLED/LC structure discussed in relation to Figures 1a and 1b.
  • the process may include steps S1 to S7.
  • Figure 3 further illustrates exemplary components that are fabricated through each step of the exemplary process described in Figure 2.
  • a TFT substrate i.e., a substantially transparent substrate with a TFT layer formed on the substrate.
  • an OLED/LC layer is formed on top of the TFT layer.
  • the OLED/LC layer is a luminescent layer.
  • the OLED/LC layer may be disconnected by certain barriers.
  • the OLED/LC layer may be formed integrally in one layer.
  • a cover glass 2 is provided.
  • the cover glass 2 includes an active region 21 and a peripheral region 22.
  • step S2 areflective metallic matrix23 is formed in the active region 21 of cover glass 2.
  • a metallic matrix may be formed in the peripheral region 22.
  • a conventional black matrix may be formed in the peripheral region 22.
  • a metallic matrix23 may be formed by a photolithography process. First, a pattern comprising a metallic matrix23 is formed in the active region 21 of cover glass 2. Then, a protection layer is deposited on the cover glass. The protection layer may be, for example, silicon nitride (SiNx) or silicon oxide (SiOx) (e.g., SiN 2 or SiO 2 ) . The part of the protection layer corresponding to the metallic matrix23 is then etched by a patterning process. The metallic matrix23 is then formed over the active region 21.
  • SiNx silicon nitride
  • SiOx silicon oxide
  • the metallic matrix23 may be formed with metallic materials that has a high reflectance, such as aluminum (Al) , aluminum alloy, copper (Cu) , silver (Ag) , silver alloy, titanium (Ti) , etc.
  • each element of the metallic matrix23 may be pyramid shaped, as shown in Figure 3.
  • the pyramid shaped metallic matrix23 reflects more light into the pixel units 24 and thus enables more light emitted by the OLED/LC layer to be transmitted through the pixel units 24.
  • the shape of the elements of the metallic matrix 23 according to the present disclosure is not limited to those disclosed in the present disclosure.
  • Embodiments of the present disclosure provide a metallic matrix with elements of the metallic matrix 23 that can be of any shape that may improve the light transmission rate or contrast of the display panel.
  • the shape of the metallic matrix 23 elements may be adjusted to achieve various design objectives in light transmission rate, contrast ratio, manufacturing cost, etc.
  • step S3 pixel units 24are disposed in the active region21 of the cover glass 2.
  • the pixel units 24 may be red (R) , green (G) , blue (B) , and white (W)pixels.
  • the metallic matrix23 is interposed between the pixel units 24. The metallic matrix23 masks light leaked from spaces disposed between the pixel units 24.
  • the thickness of the pixel units 24 may be thinner than the thickness of the metallic matrix23. Such a configuration enables the metallic matrix23 to reflect more scattered light into pixel units 24, therefore increases the light output of the display panel.
  • a protection layer 25 such as a resin layer, is formed to protect the pixel units 24 and metallic matrix23 from the external environment.
  • a thickness of the protection layer 25 may be around 2um-4um.
  • the protection layer 25 may be formed using a screen printing method, a drip coating method, a lamination coating method, etc.
  • light diffusers 26 may be dispensed on top of the protection layer 25.
  • the light diffusers 26 may need to have diameters greater than 40nm-70nm. In one embodiment, the light diffusers 26 may have diameters of about 20nm-80nm.
  • the light diffusers 26 may be made of polystyrene (PS) , silicon dioxide (SiO2) , titanium dioxide (TiO2) , etc.
  • PS polystyrene
  • SiO2 silicon dioxide
  • TiO2 titanium dioxide
  • the light diffusers 26 may be dispensed on top of the protection layer 25 by a sol-gel method or a microemulsion method.
  • a sealant 27, such as a UV-curing sealant 27, is applied around the edge of the cover glass 2, in the peripheral region 22. As shown in Figure 3, the color filter substrate 4 is then pressed together with the OLED array substrate 3. In some embodiments, sealant 27 may be applied along the edges of the OLED array substrate 3 before the color filter substrate 4 and the OLED array substrate 3 are pressed together.
  • step S7 a light, such as a UV light is applied on the UV-curing adhesive 27 to cure the sealant.
  • a light such as a UV light is applied on the UV-curing adhesive 27 to cure the sealant.
  • the OLED array substrate 3 and the color filter substrate 4 are then bonded.
  • Another aspect of the present disclosure provides a display panel.
  • the disclosed color filter substrate and the related OLED/LC structure may be used in a display panel.
  • the display panel may be an LCD display panel.
  • the display panel may be an OLED display panel.
  • the display panel may include the OLED array substrate 3 and the color filter substrate 4.
  • the color filter substrate 4 may include pixel units 24 with interposed reflective metallic matrix 23.
  • Another aspect of the present disclosure provides a display device.
  • the display device may incorporate the display panel described above.
  • the display device according to the embodiments of the present disclosure may be used in any product with display functions such as a television, an LCD display, an OLED display, an electronic paper, a digital photo frame, a mobile phone, a tablet computer, a navigation device, etc.
  • any reference in this specification to “one embodiment, ” “an embodiment, ” “example embodiment, ” “some embodiments, ” etc., indicates that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the invention.
  • the appearances of such phrases throughout the specification are not necessarily all referring to the same embodiment. Further, when a particular feature, structure, or characteristic is described in connection with any embodiment, it is noted that it is within the purview of one skilled in the art to effect such feature, structure, or characteristic in connection with other embodiments.

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PCT/CN2015/093194 2015-10-29 2015-10-29 Color filter substrate and fabrication method thereof, oled structure, related display panel, and related display device WO2017070891A1 (en)

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US15/325,262 US9960377B2 (en) 2015-10-29 2015-10-29 Color filter substrate and fabrication method thereof, OLED structure, related display panel, and related display device
PCT/CN2015/093194 WO2017070891A1 (en) 2015-10-29 2015-10-29 Color filter substrate and fabrication method thereof, oled structure, related display panel, and related display device
CN201580002684.1A CN105765450A (zh) 2015-10-29 2015-10-29 彩膜基板及制备方法,oled，显示面板和显示装置

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CN107393944A (zh) * 2017-07-12 2017-11-24 武汉华星光电半导体显示技术有限公司 显示面板及制作方法
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KR102492199B1 (ko) 2018-03-09 2023-01-26 삼성디스플레이 주식회사 표시 장치
CN108957836A (zh) * 2018-07-27 2018-12-07 京东方科技集团股份有限公司 一种彩膜基板及其制作方法、显示器件
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CN110620136B (zh) 2019-10-30 2022-07-19 京东方科技集团股份有限公司 显示基板及包含其的显示面板

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