WO2017057241A1 - Élément électroluminescent (el) organique et procédé de fabrication d'élément el organique - Google Patents

Élément électroluminescent (el) organique et procédé de fabrication d'élément el organique Download PDF

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Publication number
WO2017057241A1
WO2017057241A1 PCT/JP2016/078200 JP2016078200W WO2017057241A1 WO 2017057241 A1 WO2017057241 A1 WO 2017057241A1 JP 2016078200 W JP2016078200 W JP 2016078200W WO 2017057241 A1 WO2017057241 A1 WO 2017057241A1
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WIPO (PCT)
Prior art keywords
organic
layer
adhesive
hygroscopic
sealing
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PCT/JP2016/078200
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English (en)
Japanese (ja)
Inventor
匡哉 下河原
進一 森島
真人 赤對
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住友化学株式会社
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Publication of WO2017057241A1 publication Critical patent/WO2017057241A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants

Definitions

  • the present invention relates to an organic EL element and a method for manufacturing the organic EL element.
  • organic EL elements for example, those described in Patent Document 1 and Patent Document 2 are known.
  • a first electrode layer, an organic functional layer, a second electrode layer, and a protective layer are laminated in this order on a substrate.
  • a sealing layer containing a hygroscopic material is provided so as to cover the protective layer.
  • the organic EL element described in Patent Document 2 includes a step of obtaining a sealing member in which an insulating layer and an adhesive layer are formed on a sealing substrate, a step of forming an insulating layer removing portion in the insulating layer and the adhesive layer, and an insulation
  • the step of filling the resin removal part with a resin containing a hygroscopic agent, the step of bonding the sealing member to the electronic element, and the state in which the sealing substrate and the electronic element are bonded together are irradiated with ultraviolet rays to give the resin. And a step of curing.
  • the protective layer is provided in order to suppress the chemical component of the sealing layer from entering the organic functional layer and reacting the chemical component with the organic functional layer.
  • the protective layer is formed by, for example, CVD (chemical vapor deposition).
  • CVD chemical vapor deposition
  • An object of one aspect of the present invention is to provide an organic EL element capable of improving productivity and a method for manufacturing the organic EL element in a configuration including a hygroscopic portion.
  • An organic EL device includes a support substrate, an organic EL portion that is disposed on the support substrate, and is formed by stacking a first electrode layer, an organic functional layer, and a second electrode layer,
  • An organic EL element comprising a sealing member that seals an EL portion and a hygroscopic portion having hygroscopicity, wherein the sealing member has adhesive properties and has a viscosity that covers the organic EL portion and the hygroscopic portion.
  • An adhesive portion and a sealing substrate disposed on the adhesive portion, and the moisture absorption portion is outside the organic EL portion and orthogonal to the lamination direction when viewed from the lamination direction of the organic EL portion.
  • the adhesive part is at least between the moisture absorbing part and the organic EL part, between the moisture absorbing part and the sealing substrate, and the moisture absorbing part. And the end portion in the orthogonal direction of the adhesive portion.
  • the moisture absorbing portion is spaced apart from the organic EL portion at a predetermined interval in a direction outside the organic EL portion and perpendicular to the stacking direction when viewed from the stacking direction of the organic EL portion.
  • the adhesive part is at least between the hygroscopic part and the organic EL part, between the hygroscopic part and the sealing substrate, and between the hygroscopic part and the end of the adhesive part in the orthogonal direction. Is provided.
  • the adhesive component can suppress the chemical component of the hygroscopic portion from entering the organic functional layer.
  • the organic EL element since it is not necessary to provide a protective layer between the moisture absorption part and the organic functional layer, a process for forming the protective layer is not required in the manufacturing process. Further, since the hygroscopic portion is covered, the sealing member can be bonded after the hygroscopic portion is formed on the support substrate side. Therefore, highly accurate positioning is not required when the sealing member and the organic EL part are bonded together. Therefore, this organic EL element can improve productivity in the structure provided with a moisture absorption part.
  • the support substrate may have flexibility.
  • the distance between the inner surface of the moisture absorption part and the organic EL part may be 0.5 mm or more and 10 mm or less. Thereby, the moisture absorption function of the moisture in a moisture absorption part can be effectively exhibited with respect to an organic EL part.
  • the thickness of the hygroscopic part may be 1/2 or less of the thickness of the adhesive part. If the thickness of the hygroscopic part is too thick relative to the thickness of the adhesive part, the hygroscopic part cannot be properly covered with the adhesive part. By setting the thickness of the hygroscopic part to 1 ⁇ 2 or less of the thickness of the adhesive part, the hygroscopic part can be appropriately covered with the adhesive part.
  • the organic EL element manufacturing method includes an organic EL part forming step of forming an organic EL part by laminating a first electrode layer, an organic functional layer, and a second electrode layer on a support substrate; A hygroscopic part forming step for forming a hygroscopic part having a hygroscopic property at a predetermined distance from the organic EL part in a direction perpendicular to the laminating direction outside the organic EL part as viewed from the laminating direction of the organic EL part; A sealing step of sticking a sealing member having an adhesive base having a stopping base material and adhesive properties to the organic EL portion, and covering the exposed portions of the organic EL portion and the moisture absorbing portion with the adhesive portion And including.
  • the hygroscopic portion is not formed on the sealing member, it is not necessary to perform highly accurate alignment when the sealing member is bonded to the organic EL portion. Therefore, in this manufacturing method, productivity can be improved in the configuration including the hygroscopic portion.
  • the support substrate has flexibility
  • the organic EL portion forming step, the moisture absorption portion forming step, and the sealing step are continuously supported from the support substrate wound on the unwinding roll. This is performed during the process of winding the substrate on a winding roll.
  • each process is implemented by what is called a roll-to-roll system. Therefore, each process can be performed efficiently and productivity can be improved.
  • the moisture absorption part may be formed by a printing method. Thereby, a moisture absorption part can be accurately formed in a predetermined position.
  • the sealing member and the organic EL part may be bonded together by applying pressure in a heated state.
  • the adhesion part of the sealing member which contacts an organic EL part hardens
  • the sealing substrate may be a thermoplastic resin.
  • a sealing base material can be made to follow the shape of an organic EL part by applying heat to a sealing base material.
  • productivity can be improved in a configuration including a moisture absorption part.
  • FIG. 1 is a cross-sectional view of an organic EL element according to an embodiment.
  • FIG. 2 is a cross-sectional view taken along line II-II in FIG.
  • FIG. 3 is a diagram schematically showing a method for manufacturing an organic EL element by a roll-to-roll method.
  • FIG. 4 is a diagram illustrating a manufacturing process of the sealing member.
  • FIG. 5 is a diagram illustrating a sealing process.
  • FIG. 6 is a diagram showing a sealing process by a roll-to-roll method.
  • FIG. 7 is a cross-sectional view of an organic EL element according to another embodiment.
  • the organic EL element 1 includes a support substrate 3, an anode layer (first electrode layer) 5, a light emitting layer (organic functional layer) 7, a cathode layer (second electrode layer) 9, The hygroscopic part 11, the adhesive part 13, and the sealing substrate 15 are provided.
  • the anode layer 5, the light emitting layer 7, and the cathode layer 9 constitute an organic EL unit 17.
  • the adhesive portion 13 and the sealing substrate 15 constitute a sealing member 19.
  • the support substrate 3 is made of a resin that is transparent to visible light (light having a wavelength of 400 nm to 800 nm).
  • the support substrate 3 is a film-like substrate (flexible substrate, flexible substrate).
  • the thickness of the support substrate 3 is, for example, not less than 30 ⁇ m and not more than 500 ⁇ m.
  • the support substrate 3 is, for example, a plastic film.
  • the material of the support substrate 3 is, for example, polyethersulfone (PES); polyester resin such as polyethylene terephthalate (PET) or polyethylene naphthalate (PEN); polyolefin resin such as polyethylene (PE), polypropylene (PP), or cyclic polyolefin; Polyamide resin; Polycarbonate resin; Polystyrene resin; Polyvinyl alcohol resin; Saponified ethylene-vinyl acetate copolymer; Polyacrylonitrile resin; Acetal resin; Polyimide resin;
  • the material of the support substrate 3 is preferably a polyester resin or a polyolefin resin, and particularly preferably polyethylene terephthalate or polyethylene naphthalate because of its high heat resistance, low coefficient of linear expansion and low manufacturing cost among the above resins. Moreover, these resin may be used individually by 1 type, and may be used in combination of 2 or more type.
  • a moisture barrier layer may be disposed on one main surface 3 a of the support substrate 3.
  • the other main surface 3b of the support substrate 3 is a light emitting surface.
  • the support substrate 3 may be a thin film glass.
  • the anode layer 5 is disposed on one main surface 3 a of the support substrate 3.
  • an electrode layer showing optical transparency is used.
  • a thin film of metal oxide, metal sulfide, metal or the like having high electrical conductivity can be used, and a thin film having high light transmittance is preferably used.
  • a thin film made of indium oxide, zinc oxide, tin oxide, indium tin oxide (abbreviated as ITO), indium zinc oxide (abbreviated as IZO), gold, platinum, silver, copper, or the like is used.
  • a thin film made of ITO, IZO, or tin oxide is preferably used.
  • an organic transparent conductive film such as polyaniline and derivatives thereof, polythiophene and derivatives thereof may be used.
  • the thickness of the anode layer 5 can be determined in consideration of light transmittance, electrical conductivity, and the like.
  • the thickness of the anode layer 5 is usually 10 nm to 10 ⁇ m, preferably 20 nm to 1 ⁇ m, and more preferably 50 nm to 500 nm.
  • Examples of the method for forming the anode layer 5 include a vacuum deposition method, a sputtering method, an ion plating method, a plating method, and a coating method.
  • the light emitting layer 7 is disposed on one main surface 3 a of the anode layer 5 and the support substrate 3.
  • the light emitting layer 7 is usually formed of an organic substance that mainly emits fluorescence and / or phosphorescence or the organic substance and a dopant that assists the organic substance.
  • the dopant is added, for example, in order to improve the luminous efficiency or change the emission wavelength.
  • the organic substance contained in the light emitting layer 7 may be a low molecular compound or a high molecular compound. Examples of the light emitting material constituting the light emitting layer 7 include known dye materials, metal complex materials, polymer materials, and dopant materials.
  • dye material examples include cyclopentamine and derivatives thereof, tetraphenylbutadiene and derivatives thereof, triphenylamine and derivatives thereof, oxadiazole and derivatives thereof, pyrazoloquinoline and derivatives thereof, distyrylbenzene and derivatives thereof, and distyryl.
  • Metal complex materials examples include rare earth metals such as Tb, Eu, and Dy, or Al, Zn, Be, Pt, Ir, and the like as a central metal, and an oxadiazole, thiadiazole, phenylpyridine, phenylbenzimidazole, and quinoline structure. And the like.
  • metal complexes include metal complexes having light emission from triplet excited states such as iridium complexes and platinum complexes, aluminum quinolinol complexes, benzoquinolinol beryllium complexes, benzoxazolyl zinc complexes, benzothiazole zinc complexes, azomethyl zinc complexes, A porphyrin zinc complex, a phenanthroline europium complex, etc. can be mentioned.
  • Polymer material examples include polyparaphenylene vinylene and derivatives thereof, polythiophene and derivatives thereof, polyparaphenylene and derivatives thereof, polysilane and derivatives thereof, polyacetylene and derivatives thereof, polyfluorene and derivatives thereof, polyvinylcarbazole and derivatives thereof, Examples thereof include materials obtained by polymerizing dye materials and metal complex materials.
  • Dopant material for light emitting layer examples include perylene and derivatives thereof, coumarin and derivatives thereof, rubrene and derivatives thereof, quinacridone and derivatives thereof, squalium and derivatives thereof, porphyrin and derivatives thereof, styryl dyes, tetracene and derivatives thereof, pyrazolone and derivatives thereof. Derivatives, decacyclene and its derivatives, phenoxazone and its derivatives, and the like.
  • the thickness of the light emitting layer 7 is usually about 2 nm to 200 nm.
  • the light emitting layer 7 is formed, for example, by a coating method using a coating liquid (for example, ink) containing the above light emitting material.
  • the solvent of the coating solution containing the light emitting material is not limited as long as it dissolves the light emitting material.
  • the cathode layer 9 is disposed on one main surface 3 a of the light emitting layer 7 and the support substrate 3.
  • the cathode layer 9 is electrically connected to the extraction electrode 9a.
  • the extraction electrode 9 a is disposed on one main surface 3 a of the support substrate 3.
  • the extraction electrode 9a is arranged at a predetermined interval from the anode layer 5 in the X direction.
  • the thickness of the extraction electrode 9 a is equal to the thickness of the anode layer 5. Examples of the material of the extraction electrode 9a include the same material as that of the anode layer 5.
  • an alkali metal, an alkaline earth metal, a transition metal, a Group 13 metal of the periodic table, or the like can be used.
  • the material of the cathode layer 9 include lithium, sodium, potassium, rubidium, cesium, beryllium, magnesium, calcium, strontium, barium, aluminum, scandium, vanadium, zinc, yttrium, indium, cerium, samarium, europium, terbium, ytterbium. 1 type or more of gold, silver, platinum, copper, manganese, titanium, cobalt, nickel, tungsten, tin, etc. Or an alloy thereof, graphite, or a graphite intercalation compound.
  • alloys include magnesium-silver alloys, magnesium-indium alloys, magnesium-aluminum alloys, indium-silver alloys, lithium-aluminum alloys, lithium-magnesium alloys, lithium-indium alloys, calcium-aluminum alloys, and the like. it can.
  • a transparent conductive electrode made of a conductive metal oxide, a conductive organic substance, or the like can be used.
  • examples of the conductive metal oxide include indium oxide, zinc oxide, tin oxide, ITO, and IZO
  • examples of the conductive organic substance include polyaniline and derivatives thereof, polythiophene and derivatives thereof, and the like.
  • the cathode layer 9 may be formed with nanostructures, such as silver nanoparticle or silver nanostructures, such as silver nanowire.
  • the cathode layer 9 may be comprised by the laminated body which laminated
  • the thickness of the cathode layer 9 is set in consideration of electric conductivity and durability.
  • the thickness of the cathode layer 9 is usually 10 nm to 10 ⁇ m, preferably 20 nm to 1 ⁇ m, and more preferably 50 nm to 500 nm.
  • Examples of the method for forming the cathode layer 9 include a vacuum deposition method, a sputtering method, and a laminating method and a coating method in which a metal thin film is thermocompression bonded.
  • the moisture absorption part 11 is a desiccant that captures moisture.
  • the moisture absorption part 11 may capture oxygen or the like in addition to moisture.
  • the hygroscopic portion 11 is disposed on the extraction electrode 9 a of the anode layer 5 and the cathode layer 9.
  • the hygroscopic portion 11 has a frame as viewed from the Z direction (see FIG. 1) (the stacking direction in which the anode layer 5, the light emitting layer 7 and the cathode layer 9 are stacked in the organic EL portion 17). It has a shape. That is, the hygroscopic part 11 is disposed so as to surround the organic EL part 17.
  • the hygroscopic part 11 is located outside the organic EL part 17 in the XY direction which is a direction orthogonal to the stacking direction.
  • illustration of the adhesion part 13 is abbreviate
  • the moisture absorption part 11 is arranged at a predetermined distance from the organic EL part 17. Specifically, as shown in FIG. 1, the distance D between the inner surface 11a of the hygroscopic part 11 and the organic EL part 17 is 0.5 mm or more and 10 mm or less, preferably 1 mm or more and 3 mm or less. .
  • the hygroscopic part 11 is covered with an adhesive part 13.
  • the hygroscopic part 11 is covered with an adhesive part 13 other than the surface in contact with the anode layer 5 or the extraction electrode 9a (cathode layer 9).
  • the cross section of the hygroscopic portion 11 has a rectangular shape
  • the inner side surface 11 a, the outer side surface 11 b, and the upper surface 11 c are covered with the adhesive portion 13.
  • Adhesive part 13, moisture absorbing part 11, adhesive part 13 and organic EL part 17 (light emitting layer 7, cathode layer 9), adhesive part 13, moisture absorbing part 11 and adhesive part 13 are arranged in this order.
  • the adhesive portion 13 is disposed between the moisture absorbing portion 11 and the organic EL portion 17.
  • the thickness T1 of the hygroscopic portion 11 is thinner than the thickness T2 of the adhesive portion 13.
  • the thickness T1 of the hygroscopic part 11 is 1 ⁇ 2 or less of the thickness T2 of the adhesive part 13, preferably 1/10 or less of the thickness T2 of the adhesive part 13.
  • the moisture absorbing part 11 is formed by curing a liquid getter material that is a precursor of the moisture absorbing part 11.
  • the liquid getter material contains a crosslinkable compound (curing component) having a photoreactive group.
  • the moisture absorption part 11 is formed by applying a liquid getter material to the adhesive bonding part 13, performing an ultraviolet ray (UV) irradiation process after application formation, and curing the liquid getter material.
  • Examples of the method for forming the hygroscopic portion 11 include printing methods such as an inkjet printing method and a dispenser method.
  • the liquid getter material may contain a crosslinkable compound having a thermally reactive group. In this case, the liquid getter material is cured by heat treatment.
  • the hygroscopic part 11 preferably contains at least one kind of a porous substance such as an organometallic compound, a metal oxide, or zeolite as a liquid getter material.
  • a porous substance such as an organometallic compound, a metal oxide, or zeolite as a liquid getter material.
  • the metal constituting the organometallic compound and the metal oxide preferably contains at least one of aluminum, calcium, and barium.
  • organoaluminum compounds, calcium oxide, and the like are more preferable because the water rehydration rate is high.
  • the hygroscopic part 11 may contain a binder, and in particular, may contain at least one of acrylic resin, epoxy resin, styrene resin, olefin resin, and amide resin.
  • the hygroscopic part 11 is made of a light transmissive material such as a getter material or a binder as described above, and the total light transmittance of visible light of the hygroscopic part 11 may be 50% or more. Further, the difference between the light refractive index of the moisture absorbing portion 11 and the light refractive index of the support substrate 3 may be 0.2 or less.
  • the shape of the moisture absorption part 11 may be a sheet.
  • the sheet getter material is affixed to the adhesive portion 13.
  • the sheet getter material may be a hygroscopic cured product, or may be cured by being subjected to heat treatment or UV irradiation treatment after being attached to the adhesive portion 13.
  • the moisture absorption speed of the moisture absorption part 11 is preferably 1 wt% / h or more in an environment of a humidity of 24 ° C. and a humidity of 55% RH.
  • the adhesive portion 13 is used for adhering the sealing substrate 15 to the organic EL portion 17 and the hygroscopic portion 11.
  • the adhesive portion 13 is disposed so as to cover the organic EL portion 17.
  • the adhesive portion 13 is made of a photocurable or thermosetting acrylate resin, or a photocurable or thermosetting epoxy resin.
  • a photocurable or thermosetting acrylate resin or a photocurable or thermosetting epoxy resin.
  • Other commonly used resin films that can be fused with an impulse sealer such as ethylene vinyl acetate copolymer (EVA), polypropylene (PP) film, polyethylene (PE) film, polybutadiene (PB) film, etc. You can also A thermoplastic resin can also be used.
  • the adhesion between the organic EL portion 17 and the adhesive portion 13 is high, and the organic EL portion 17 is caused by significant heat shrinkage of the adhesive and stress on the organic EL portion 17.
  • Adhesives that are highly effective in exfoliating, generating components that adversely affect the organic EL portion 17 from the adhesive portion 13, and having high barrier properties and suppressing generation / growth of dark spots are preferable.
  • the thickness of the adhesive portion 13 is preferably 1 ⁇ m to 200 ⁇ m, more preferably 10 ⁇ m to 100 ⁇ m, and even more preferably 30 ⁇ m to 60 ⁇ m. If this thickness is extremely thin, the unevenness on the surface of the organic EL portion 17 or the mixed dust cannot be embedded sufficiently, and they tend to cause mechanical stress on the organic EL material and cause dark spots. On the other hand, when this thickness is remarkably thick, it is easily affected by moisture entering from the end face of the adhesive portion 13. However, when the amount of adhesive applied is too large, tunneling, seepage, crimping, etc. may occur.
  • the moisture content of the adhesive portion 13 is preferably 300 ppm or less (weight basis).
  • Examples of the method for forming the adhesive portion 13 include a hot melt lamination method.
  • the hot melt lamination method is a method in which a hot melt adhesive is melted and an adhesive layer is coated on a support, and the thickness of the adhesive layer can be generally set in a wide range of 1 ⁇ m to 50 ⁇ m.
  • EVA ethylene ethyl acrylate copolymer
  • polyethylene butyl rubber, etc.
  • EVA ethylene ethyl acrylate copolymer
  • a tackifier, wax or the like is added as a plasticizer.
  • an extrusion laminating method is a method in which a resin melted at a high temperature is coated on a support with a die, and the thickness of the adhesive layer can generally be set in a wide range of 10 to 50 ⁇ m.
  • LDPE low density polyethylene
  • EVA EVA
  • PP polypropylene
  • the sealing substrate 15 is disposed on the uppermost portion (on the adhesive bonding portion 13) in the organic EL element 1.
  • the sealing substrate 15 may be a metal foil, a barrier film in which a barrier functional layer is formed on the front surface or back surface of a transparent plastic film, or both surfaces thereof, a thin film glass having flexibility, or a metal layer having barrier properties laminated on a plastic film. It has a gas barrier function, particularly a moisture barrier function.
  • the sealing substrate 15 is preferably a thermoplastic resin.
  • As the metal foil copper, aluminum, and stainless steel are preferable from the viewpoint of barrier properties.
  • the thickness of the metal foil is preferably as thick as possible from the viewpoint of suppressing pinholes, but is preferably 15 ⁇ m to 50 ⁇ m from the viewpoint of flexibility.
  • the organic EL unit 17 includes a step of forming the anode layer 5 on the dried support substrate 3 (anode layer forming step S02), a step of forming the light emitting layer 7 on the anode layer 5 (light emitting layer forming step S03), and light emission.
  • the step of forming the cathode layer 9 on the layer 7 is performed in this order.
  • the moisture absorbing portion 11 is formed (moisture absorbing portion forming step S05).
  • the moisture absorption part 11 can be formed by the formation method illustrated in the description of the moisture absorption part 11. And after forming the moisture absorption part 11, the organic EL part 17 and the sealing member 19 are bonded together, and the process (sealing process S06) which coat
  • a roll-to-roll method can be adopted as conceptually shown in FIG.
  • the organic EL element 1 is manufactured by the roll-to-roll method
  • the long flexible support substrate 3 stretched between the unwinding roll 30A and the winding roll 30B is continuously transported by the transport roller 31.
  • a method for forming the sealing member 19 to be bonded to the organic EL portion 17 in the sealing step S06 will be described.
  • the sealing base material 15 is a flexible base material
  • a roll-to-roll method can be adopted for forming the sealing member 19.
  • the sealing member 19 is manufactured by the roll-to-roll method, the long flexible sealing substrate 15 stretched between the unwinding roll and the winding roll is continuously conveyed by the conveying roller.
  • the adhesive portion 13 may be formed on the sealing substrate 15.
  • the adhesive portion 13 is formed on one surface of the sealing substrate 15 shown in FIG.
  • the adhesive portion 13 can be formed by the formation method exemplified in the description of the adhesive portion 13.
  • the sealing member 19 is formed.
  • the sealing member 19 formed as described above is subjected to a dehydration process before being bonded to the organic EL portion 17 formed on the support substrate 3.
  • the sealing substrate 15 of the sealing member 19 is heated.
  • an apparatus for heating the sealing substrate 15 an apparatus that irradiates the sealing substrate 15 with infrared rays, an apparatus that supplies hot air, a heating roller that contacts the sealing substrate 15, an oven, and the like can be used.
  • the dehydration treatment of the sealing substrate 15 is preferably performed in a nitrogen atmosphere.
  • the organic EL portion 17 and the sealing member 19 are bonded together as shown in FIG.
  • the exposed moisture absorbing portion 11 inner side surface 11 a, outer side surface 11 b, upper surface 11 c
  • the adhesive portion 13 of the sealing member 19 is covered with the adhesive portion 13 of the sealing member 19.
  • the organic EL portion 17 and the sealing member 19 formed on the support substrate 3 are bonded together as shown in FIG. Thereby, the support substrate 3 and the sealing member 19 pass between the heating rollers 32a and 32b. As a result, pressure is applied to the support substrate 3 and the sealing member 19 while being heated by the heating rollers 32a and 32b.
  • the adhesive portion 13 is thermally cured, and the adhesive portion 13 and the organic EL portion 17 are in close contact with each other.
  • the sealing base material 15 having thermoplasticity, it is plastically deformed by being heated, and the sealing base material 15 follows the shape of the organic EL portion 17.
  • the adhesive portion 13 is formed between the moisture absorbing portion 11 (inner side surface 11a) and the organic EL portion 17, as shown in FIG. 11 (upper surface 11 c) and the sealing substrate 15, and between the hygroscopic portion 11 and the end portions 13 a and 13 b in the X direction of the adhesive portion 13. As a result, the adhesive portion 13 covers the entire hygroscopic portion 11. Thus, as shown in FIG. 1, the organic EL element 1 is manufactured.
  • the moisture absorption unit 11 is outside the organic EL unit 17 and orthogonal to the stacking direction when viewed from the stacking direction (Z direction) of the organic EL unit 17.
  • the organic EL unit 17 is disposed at a predetermined interval.
  • the adhesive portion 13 includes the moisture absorbing portion 11 and the organic EL portion 17, the moisture absorbing portion 11 and the sealing substrate 15, and the moisture absorbing portion 11 and the end portions 13 a and 13 b of the adhesive portion 13. It is provided between.
  • the adhesive part 13 prevents the chemical component of the hygroscopic part 11 from entering the light emitting layer 7. it can. Therefore, in the organic EL element 1, since it is not necessary to provide a protective layer between the moisture absorption part 11 and the light emitting layer 7, in the manufacturing process, the process of forming a protective layer is not required. Moreover, since the moisture absorption part 11 is covered, the sealing member 19 can be bonded after the moisture absorption part 11 is formed on the support substrate 3 side. Therefore, when the sealing member 19 and the organic EL portion 17 are bonded together, high-precision positioning is not required. Therefore, the organic EL element 1 can improve productivity in the configuration including the hygroscopic portion 11.
  • the distance between the inner surface 11a of the moisture absorption part 11 and the organic EL part 17 is 0.5 mm or more and 10 mm or less.
  • the thickness T1 of the hygroscopic portion 11 is 1 ⁇ 2 or less of the thickness T2 of the adhesive portion 13. If the thickness T1 of the hygroscopic part 11 is too thick relative to the thickness T2 of the adhesive part, the hygroscopic part 11 cannot be properly covered by the adhesive part 13. By setting the thickness T1 of the hygroscopic part 11 to be equal to or less than 1 ⁇ 2 of the thickness T2 of the adhesive part 13, the hygroscopic part 11 can be appropriately covered by the adhesive part 13.
  • the present invention is not limited to the above-described embodiment, and various modifications can be made.
  • positioned between the anode layer 5 and the cathode layer 9 was illustrated.
  • the configuration of the organic functional layer is not limited to this.
  • the organic functional layer may have the following configuration.
  • Anode layer / light emitting layer / cathode layer (b) Anode layer / hole injection layer / light emitting layer / cathode layer (c) Anode layer / hole injection layer / light emitting layer / electron injection layer / cathode layer (d) Anode layer / hole injection layer / light emitting layer / electron transport layer / electron injection layer / cathode layer (e) Anode layer / hole injection layer / hole transport layer / light emitting layer / cathode layer (f) anode layer / hole Injection layer / hole transport layer / light emitting layer / electron injection layer / cathode layer (g) anode layer / hole injection layer / hole transport layer / light emitting layer / electron transport layer / electron injection layer / cathode layer (h) anode Layer / light emitting layer / electron injection layer / cathode layer (i) anode layer / light emitting layer / light
  • the hole injection layer As the materials for the hole injection layer, the hole transport layer, the electron transport layer, and the electron injection layer, known materials can be used.
  • Each of the hole injection layer, the hole transport layer, the electron transport layer, and the electron injection layer can be formed by, for example, a coating method in the same manner as the light emitting layer 7.
  • the organic EL element 1 may have a single light emitting layer 7 or may have two or more light emitting layers 7.
  • the layer structure shown to the following (j) can be mentioned, for example.
  • the two (structural unit A) layer structures may be the same or different.
  • the charge generation layer is a layer that generates holes and electrons by applying an electric field.
  • Examples of the charge generation layer include a thin film made of vanadium oxide, ITO, molybdenum oxide, or the like.
  • Examples of the configuration of the organic EL element having three or more light emitting layers include the layer configuration shown in the following (k). Can do. (K) Anode layer / (structural unit B) x / (structural unit A) / cathode layer
  • (Structural unit B) x represents a stacked body in which (Structural unit B) is stacked in x stages.
  • a plurality of (structural units B) may have the same or different layer structure.
  • the organic EL element may be configured by directly laminating a plurality of light emitting layers 7 without providing a charge generation layer.
  • an example in which the anode layer 5 is formed on the support substrate 3 by the roll-to-roll method has been described as an example.
  • the anode layer 5 is formed in advance on the support substrate 3, and the support substrate 3 on which the long anode layer 5 stretched between the unwinding roll 30A and the winding roll 30B is continuously conveyed.
  • Each process related to the manufacture of the organic EL element 1 may be performed while being conveyed by the roller 31.
  • the moisture absorbing portion 11 has a rectangular frame shape.
  • the hygroscopic portion 11 ⁇ / b> A may be provided intermittently.
  • the distance D between the inner surface 11Aa of the hygroscopic part 11A and the organic EL part 17 is 0.5 mm or more and 10 mm or less, preferably 1 mm or more and 3 mm or less.
  • the shape of the moisture absorption part is not limited to a rectangular shape.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

L'élément électroluminescent (EL) organique (1) comprend un élément d'étanchéité (19), qui comprend une partie adhésive (13) qui présente des propriétés d'adhérence et qui recouvre une partie EL organique (17) et une partie d'absorption d'humidité (11), et un substrat d'étanchéité (15) qui est disposé au-dessus de la partie adhésive (13). Vu depuis la direction de stratification de la partie EL organique (17), la partie d'absorption d'humidité (11) est agencée à l'extérieur de la partie EL organique (17) et à un intervalle prescrit depuis la partie EL organique (17) dans une direction perpendiculaire à la direction de stratification. La partie adhésive (13) est disposée au moins entre la partie d'absorption d'humidité (11) et la partie EL organique (17), entre la partie d'absorption d'humidité (11) et le substrat d'étanchéité (15), et entre la partie d'absorption d'humidité (11) et les extrémités (13a, 13b) de la partie adhésive (13) dans la direction perpendiculaire mentionnée ci-dessus.
PCT/JP2016/078200 2015-09-30 2016-09-26 Élément électroluminescent (el) organique et procédé de fabrication d'élément el organique WO2017057241A1 (fr)

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WO2019107505A1 (fr) * 2017-12-01 2019-06-06 住友化学株式会社 Procédé de fabrication d'un dispositif électronique

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JP2019082621A (ja) * 2017-10-31 2019-05-30 株式会社ブイ・テクノロジー 表示装置およびその製造方法

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