WO2017056262A1 - Component supply device - Google Patents

Component supply device Download PDF

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Publication number
WO2017056262A1
WO2017056262A1 PCT/JP2015/077828 JP2015077828W WO2017056262A1 WO 2017056262 A1 WO2017056262 A1 WO 2017056262A1 JP 2015077828 W JP2015077828 W JP 2015077828W WO 2017056262 A1 WO2017056262 A1 WO 2017056262A1
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WO
WIPO (PCT)
Prior art keywords
component
component supply
pocket
vibration
tape
Prior art date
Application number
PCT/JP2015/077828
Other languages
French (fr)
Japanese (ja)
Inventor
寧典 内藤
直己 花村
Original Assignee
ヤマハ発動機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ヤマハ発動機株式会社 filed Critical ヤマハ発動機株式会社
Priority to PCT/JP2015/077828 priority Critical patent/WO2017056262A1/en
Priority to JP2017542617A priority patent/JP6498777B2/en
Publication of WO2017056262A1 publication Critical patent/WO2017056262A1/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components

Definitions

  • the present invention relates to a component supply device that is assembled to a component mounting device or the like that mounts a component on a substrate, for example, and supplies the component.
  • the component supply device for mounting the electronic component on the board is assembled with a component supply device that supplies the component to the mounting device.
  • the component supply device sends out a component supply tape including a main body (carrier tape) having a plurality of pockets for storing components and a cover tape covering the upper surface opening of the pockets, and puts the components into a predetermined component suction position.
  • Supply The cover tape is removed from above the pocket by, for example, peeling or cutting along the feeding direction immediately before the component suction position, and the component is taken out from the pocket by the suction nozzle on the component mounting device side.
  • the size of the component is smaller than the size of the pocket, and the component is held on the component supply tape in a state where a gap exists between the component and the inner wall of the pocket.
  • the posture of the component is tilted for some reason, the phenomenon that the component is pinched by the inner wall of the pocket and locked (hereinafter referred to as “pocket lock” in this specification) will occur.
  • the component cannot be sucked by the nozzle, that is, a component sucking failure may occur.
  • Patent Document 1 discloses a technique for moving a component to the rear end of the pocket by applying vertical vibration to the component in the pocket. However, it is difficult to sufficiently eliminate the pocket lock or the like only by vibrating the component in the vertical direction.
  • a component supply apparatus conveys a component supply tape including a main body including a plurality of pockets for storing components and a cover tape covering an upper surface opening of the pockets to a predetermined component suction position. And a vibrating section that vibrates the component accommodated in the pocket both in the vertical direction and in the horizontal direction.
  • FIG. 1 is a plan view of a component mounting apparatus to which a component supply apparatus according to an embodiment of the present invention is assembled.
  • FIG. 2 is a side view of the head unit in the component mounting apparatus.
  • FIG. 3 is a schematic perspective view of the component supply apparatus.
  • FIG. 4 is a perspective view of the component supply tape.
  • FIG. 5A is a top view showing a state in which the pocket lock of the component is generated in the pocket of the component supply tape.
  • FIG. 5B is a top view showing a state in which paper fibers stay in the pocket.
  • FIG. 5C is a side sectional view showing a state in which the pocket is deformed.
  • FIG. 6 is a block diagram showing the configuration of the component supply apparatus according to the first embodiment of the present invention.
  • FIG. 6 is a block diagram showing the configuration of the component supply apparatus according to the first embodiment of the present invention.
  • FIG. 7 is a diagram for explaining the operation of the ultrasonic transducer.
  • FIG. 8A is a top view showing the behavior in the pocket of a component given vibration by the ultrasonic transducer.
  • FIG. 8B is a side view showing the behavior in the pocket of the component that is vibrated by the ultrasonic transducer.
  • FIG. 9 is a flowchart showing a component suction operation by the component mounting apparatus.
  • FIG. 10 is a block diagram showing a configuration of a component supply apparatus according to the second embodiment of the present invention.
  • FIG. 11 is a block diagram showing a configuration of a component supply apparatus according to the second embodiment of the present invention.
  • FIG. 1 is a plan view showing the overall configuration of the component mounting apparatus 1.
  • the component mounting apparatus 1 includes a substrate transport mechanism 2 that is disposed on a base 10 and transports a printed circuit board 3, a component supply unit 4 that supplies electronic components mounted on the printed circuit board 3, and a component printed circuit board. 3 and a head unit 5 for mounting on the head 3.
  • FIG. 2 is a side view of the unit support member 11 on which the head unit 5 is mounted.
  • the substrate transport mechanism 2 includes a pair of conveyors 2a and 2b that transport the printed circuit board 3 on the base 10, and a holding device such as a push-up pin (not shown).
  • the conveyors 2a and 2b receive the printed circuit board 3 from the left side of FIG. 1 and transport it to the mounting work position near the center of the base 10, and hold the printed circuit board 3 by the holding device. After the component mounting operation, the conveyors 2a and 2b carry the printed circuit board 3 to the right side of the figure.
  • the direction in which the conveyors 2a and 2b extend is indicated as the X direction
  • the direction orthogonal to the X direction on the horizontal plane is indicated as the Y direction.
  • the component supply unit 4 is disposed on both sides (Y direction both sides) of the substrate transport mechanism 2. In these component supply units 4, component supply devices 40 arranged in multiple rows in the X direction are arranged.
  • the component supply device 40 is also referred to as a tape feeder, and includes a reel on which a component supply tape that accommodates small electronic components such as ICs, transistors, and capacitors is wound.
  • the component supply device 40 supplies components to a predetermined component supply position set in the vicinity of the substrate transport mechanism 2 while intermittently feeding the tape from the reel.
  • the component supply device 40 will be described in detail later.
  • the head unit 5 takes out components from the component supply unit 4 and mounts them on the printed circuit board 3, and is disposed above the substrate transport mechanism 2 and the component supply unit 4.
  • the head unit 5 is movable in the X direction and the Y direction within a certain area by a head unit driving mechanism provided on the base 10.
  • the head unit drive mechanism includes a pair of fixed rails 7 extending parallel to each other in the Y direction, a unit support member 11 supported by the fixed rails 7 and extending in the X direction, and the unit support member 11 extending along the fixed rails 7.
  • a nut member 12 integral with the unit support member 11 is screwed onto the Y ball screw shaft 8.
  • the unit support member 11 moves in the Y direction while being guided by the fixed rail 7, whereby the head unit 5 also moves in the Y direction.
  • a fixed rail 13 that supports the head unit 5 so as to be movable in the X direction is attached to the unit support member 11.
  • An unillustrated nut member integral with the head unit 5 is screwed onto the X ball screw shaft 14.
  • the X ball screw shaft 14 is rotationally driven by the X axis servo motor 15, the head unit 5 moves in the X direction while being guided by the fixed rail 13.
  • the head unit 5 is mounted with a plurality of mounting heads 20 (four heads 20 are illustrated in FIGS. 1 and 2) for sucking components and mounting them on the printed circuit board 3.
  • Each of these mounting heads 20 is connected to a lifting mechanism using a Z-axis servomotor (not shown) as a drive source, and is connected to a rotating mechanism using an R-axis servomotor (not shown) as a drive source.
  • the head 20 can move in the vertical direction (Z-axis direction) with respect to the head unit 5 and can rotate about the Z-axis (R-axis direction) by the operations of the lifting mechanism and the rotating mechanism. Yes.
  • each nozzle 21 is connected to a pneumatic pipeline, and can communicate with any one of a negative pressure generator, a positive pressure generator, and the atmosphere via an electric switching valve.
  • a negative pressure generator By supplying negative pressure to the nozzle 21 from the negative pressure generating device, it becomes possible to suck and hold the components by the nozzle 21, and then communicate with the atmosphere or supply positive pressure from the positive pressure generating device. Thus, the suction holding of the part is released.
  • a component recognition camera 17 for recognizing an image of the suction state of the component by each mounting head 20 is provided.
  • the component recognition camera 17 is provided between the front side (lower side in FIG. 1) conveyor 2 b and the component supply unit 4.
  • the head unit 5 When the head unit 5 is disposed at a predetermined imaging position above the component recognition camera 17, the component recognition camera 17 captures the suction component by each mounting head 20 from below.
  • the general operation of the component mounting apparatus 1 having the above configuration is as follows. First, the head unit 5 is moved above the component supply unit 4, and components are taken out from the component supply device 40 by each mounting head 20. Specifically, the head 20 to which the component is to be sucked is lowered by the elevating mechanism, and the negative pressure from the negative pressure generator is supplied to the nozzle 21, so that the component is sucked to the tip of the nozzle 21. Subsequently, the head 20 is lifted in a state in which the components are attracted, whereby the components are picked up from the component supply device 40. At this time, if possible, components are picked up simultaneously by a plurality of mounting heads 20.
  • the head unit 5 When the suction of the components by all the mounting heads 20 is completed, the head unit 5 is moved to the imaging position on the component recognition camera 17, and each suction component is imaged. Based on the imaging result, the quality of the suction state of each component by the nozzle 21 is determined. Thereafter, the head unit 5 is moved onto the printed circuit board 3, and the head units 5 are sequentially moved to predetermined component mounting points, and the mounting heads 20 are moved up and down and the negative pressure of the nozzles 21 is released. Each component is mounted on the printed circuit board 3.
  • FIG. 3 is a schematic perspective view of the component supply device 40.
  • the component supply device 40 includes a box-type feeder main body 25 that is flat in the width direction (X direction), and a plate-shaped reel support portion 26 that is connected to the feeder main body 25 in the Y direction.
  • the component supply device 40 is set on the feeder mounting base 6 provided in the component supply unit 4 with the feeder main body 25 positioned on the front end side facing the conveyors 2a and 2b, and is clamped by a clamping means (not shown).
  • the mounting base 6 is detachably fixed.
  • FIG. 3 shows a state in which the side surface of the feeder main body 25 is opened, a side plate is usually attached to this portion.
  • the reel 31 around which the component supply tape 32 is wound is rotatably held at the rear end portion (left end portion in FIG. 3) of the reel support portion 26.
  • a component supply tape 32 is led out from the reel 31 to the front feeder main body 25.
  • the component supply tape 32 is a tape-like member that accommodates and holds a large number of electronic components such as the above-described ICs, transistors, and capacitors at regular intervals.
  • FIG. 4 is a perspective view of the component supply tape 32.
  • the component supply tape 32 includes a carrier tape 33 (main body portion) and a cover tape 34 attached to the carrier tape 33.
  • the carrier tape 33 is provided with a plurality of pockets 35 each having a rectangular parallelepiped cavity opened upward for individually accommodating the components P.
  • the pockets 35 are arranged in a line at regular intervals in the direction in which the carrier tape 33 extends.
  • engagement holes 36 penetrating along the edge in the tape thickness direction are provided at regular intervals.
  • the cover tape 34 is detachably bonded to the upper surface of the carrier tape 33 so as to cover the upper surface opening of the pocket 35.
  • FIG. 4 shows a state in which a part of the cover tape 34 is peeled from the carrier tape 33.
  • a guide portion 27 extending in the front-rear direction (Y direction) is provided on the upper portion of the feeder main body portion 25.
  • the front half of the upper portion of the guide portion 27 is covered with a cover member 28 that holds the component supply tape 32 from above.
  • a tape passage is formed between the guide portion 27 and the cover member 28, and the component supply tape 32 led out from the reel 31 is guided to the tape passage.
  • a component take-out portion 29 is provided at the front end portion of the feeder main body portion 25.
  • the component extraction portion 29 is a portion where the component P is picked up by the mounting head 20, and is formed by a window portion 281 formed by cutting out a part of the cover member 28.
  • the window portion 281 is a rectangular cutout that is long in the front-rear direction, and has a front edge portion on the front end side and a rear edge portion on the reel 31 side.
  • the component supply tape 32 guided along the guide unit 27 is exposed upward, and the cover tape 34 is peeled off from the component supply tape 32, and is attached to the rear edge of the window 281. It is folded along. As a result, the pocket 35 of the component supply tape 32 (carrier tape 33) is opened upward, and the component can be taken out by the mounting head 20.
  • a tape feeding mechanism (conveying unit) for conveying the component supply tape 32 to a component suction position by the nozzle 21 and a take-up mechanism for the cover tape 34 are provided.
  • the tape feeding mechanism feeds the component supply tape 32 from the reel 31 and feeds it along the guide portion 27.
  • the sprocket 50 is disposed below the component take-out portion 29, and a drive motor 41 that rotationally drives the sprocket 50. have.
  • the drive motor 41 is a power source that sends out the component supply tape 32.
  • the output shaft of the drive motor 41 is directly connected to the rotation shaft of the sprocket 50, and the drive motor 41 drives the sprocket 50 by the direct drive method.
  • the direct drive method is an example, and a drive method using a gear, a belt, or the like may be used.
  • the sprocket 50 is a disk-shaped member, and a large number of engaging teeth protrude from the outer peripheral edge at a predetermined pitch.
  • the pitch of the engaging teeth and the pitch of the engaging holes 36 of the carrier tape 33 are the same.
  • a part of the engaging teeth engages with the engaging hole 36 (a part of the main body), whereby the sprocket 50 and the component supply tape 32 are engaged.
  • the drive motor 41 rotationally drives the sprocket 50 at a predetermined rotation angle pitch so that the component supply tape 32 can be intermittently fed in units of the arrangement pitch of the pockets 35.
  • the vicinity of the upper end of the outer peripheral edge of the sprocket 50 faces the component takeout part 29 through an opening formed in the top surface (guide part 27) of the feeder body part 25. Therefore, the nozzle 21 of the head 20 can access the component supply tape 32 (the pocket 35 of the carrier tape 33) that is engaged with the sprocket 50.
  • the take-off mechanism is a mechanism for removing the cover tape 34 from the carrier tape 33 and collecting it.
  • the take-up mechanism is provided in the feeder main body 25 on the rear side of the tape feeding mechanism and takes up the take-up motor 52, take-off gear pairs 56a and 56b, and the rotational driving force of the take-up motor 52. Gears 54 and 55 are included for transmission to gear pairs 56a and 56b.
  • the take-up motor 52 is a power source for collecting the cover tape 34.
  • the drive motor 41 and the take-up motor 52 are mounted on a common motor board 400.
  • a control circuit for driving and controlling the motors 41 and 52 is also mounted on the motor board 400.
  • the cover tape 34 peeled off from the carrier tape 33 in the window 281 is guided between the take-off gear pairs 56a and 56b.
  • the take-off gear 52 is driven to rotate by the operation of the take-off motor 52, and the cover tape 34 is peeled off from the carrier tape 33 by the take-off force and the peeled cover tape is removed.
  • 34 is fed into a collection box (not shown).
  • the vibration unit 60 (FIG. 6) that vibrates the component P accommodated in the pocket 35 of the component supply tape 32 both in the vertical direction and in the horizontal direction. See).
  • the vibration unit 60 is disposed on the conveyance path of the component supply tape 32 and in the vicinity of the peeling position where the cover tape 34 is peeled from the carrier tape 33.
  • a configuration related to the vibration unit 60 will be described.
  • FIGS. 5A to 5C The manner in which these phenomena occur is illustrated in FIGS. 5A to 5C.
  • 5A is a top view showing a state where the pocket lock of the component P is generated in the pocket 35
  • FIG. 5B is a top view showing a state where fluff D such as paper fibers is staying in the pocket 35
  • FIG. FIG. 5 is a side sectional view showing a state where the pocket 35 is deformed.
  • the size of the component P is smaller than the size of the pocket 35, and the conveyance direction of the component supply tape 32 and the direction orthogonal to the conveyance direction are between the component P and the inner wall surface 35S of the pocket 35.
  • the part P is accommodated in the pocket 35 in a state where a gap is formed in any of the above. Therefore, normally, the component P can be smoothly taken out from the upper surface opening of the pocket 35.
  • the posture of the component P is inclined in the pocket 35, the corners of the component P are caught in the pocket inner wall surface 35S, and the component P is fixedly held in the pocket 35.
  • the pocket lock that is done may occur. If the degree of pocket lock is strong, the component P is attracted by the nozzle 21 and cannot be taken out.
  • FIG. 5B illustrates the fluff D that obstructs the adsorption or removal of the component P by the nozzle 21.
  • the cover tape 34 is made of paper and is affixed to the upper surface of the carrier tape 33.
  • Fluff D is generated when some paper fibers remain when the cover tape 34 is peeled off from the carrier tape 33.
  • paper scraps derived from the cover tape 34 may enter the pocket 35.
  • FIG. 5C shows an example in which the upper end portion 371 of the wall portion 37 between the adjacent pockets 35 is deformed so as to cover the pocket 35.
  • Such deformation can occur when the nozzle 21 presses the wall portion 37. Alternatively, it may also occur due to a defective shape of the carrier tape 33 itself. If a deformed upper end portion 371 or the like exists and the component P is unevenly distributed on the upper end portion 371 side in the pocket 35, the component P is caught on the portion P and the component P is taken out by the nozzle 21. May fail.
  • the control unit of the component mounting apparatus 1 recognizes that a component P take-out error has occurred, and causes the nozzle 21 to suck the component P in the next pocket 35. For this reason, the parts P that have not been picked up are not used, and the parts P are wasted.
  • the component feeding device 40 is provided with the vibration unit 60, thereby eliminating component adsorption failure due to pocket lock or the like.
  • FIG. 6 is a block diagram showing the device configuration of the component supply device 40 and the electrical configuration of the component mounting device 1 according to the first embodiment of the present invention.
  • the component supply device 40 includes the sprocket 50 and the drive motor 41 (conveyance unit) that convey the component supply tape 32 in the direction of the arrow D1 (conveyance direction D1) in the drawing, and the vibration unit 60.
  • reference signs A1 and A2 in FIG. 1 denote a peeling position where the cover tape 34 is peeled from the carrier tape 33 (a predetermined position where the cover tape is removed from above the pocket), and the component P is the head 20 (nozzle 21). ) Shows the component suction position to be picked up and taken out.
  • the peeling position A1 is located upstream of the component suction position A2 by a predetermined distance in the transport direction.
  • the cover tape 34 may be removed from above the pocket 35 by being cut along the transport direction D1.
  • the cutter that performs the cutting is disposed on the lower surface of the cover member 28 on the upstream side of the component suction position A2.
  • the position where the cutter is arranged is a “predetermined position” corresponding to the peeling position A1.
  • the vibration unit 60 is composed of an ultrasonic vibrator provided with a vibration plate that vibrates ultrasonically.
  • the vibration unit 60 is disposed on the lower surface side of the component supply tape 32 in the vicinity of the peeling position A ⁇ b> 1 and causes ultrasonic vibration to act on the component P from the lower side of the carrier tape 33.
  • the vibration unit 60 generates ultrasonic vibration, the component P vibrates both in the vertical direction and in the horizontal direction.
  • the component P to which the ultrasonic vibration is applied is directed toward the center of the pocket 35 in the transport direction D1 and the tape width direction orthogonal to the transport direction D1. Thereby, a clearance gap is formed between the circumference
  • the component mounting apparatus 1 electrically includes a motor drive unit 42, a vibrator drive unit 43, a head drive unit 44, and an overall control unit 45 (control unit). A part of these electrical configurations may be provided in the component supply device 40 as an electric circuit or the like, or all may be provided in the controller of the component mounting device 1.
  • the motor drive unit 42 is a driver that drives a drive motor 41 that rotates the sprocket 50.
  • the motor drive unit 42 operates the drive motor 41 so as to pitch-feed the component supply tape 32 in the conveyance direction D1 in units of the arrangement pitch of the pockets 35.
  • the vibrator drive unit 43 drives the vibration unit 60. Specifically, an ultrasonic vibration generation mechanism including, for example, a piezoelectric element and a high-frequency power source is operated so that the diaphragm included in the vibration unit 60 is ultrasonically vibrated.
  • an ultrasonic vibration generation mechanism including, for example, a piezoelectric element and a high-frequency power source is operated so that the diaphragm included in the vibration unit 60 is ultrasonically vibrated.
  • the head drive unit 44 is a driver that moves the head unit 5 itself and operates the mounting head 20 and the nozzle 21 provided in the head unit 5. Specifically, the head drive unit 44 drives the X-axis servo motor 15 and the Y-axis servo motor 9 that move the head unit 5 in the X direction and the Y direction. The head drive unit 44 drives a Z-axis servo motor that moves the head 20 up and down and an R-axis servo motor that rotates the head 20 around the Z axis. Further, the head driving unit 44 drives a negative pressure generating device that generates a negative pressure (component suction force) at the nozzle 21.
  • the overall control unit 45 comprehensively controls the motor drive unit 42, the vibrator drive unit 43, and the head drive unit 44, the feeding operation of the component supply tape 32, and the operation of applying ultrasonic vibration to the component P by the vibrating unit 60. Further, the moving operation of the head unit 5 and the operation of taking out the component P from the component supply tape 32 by the head 20 (nozzle 21) are controlled.
  • FIG. 7 is a diagram schematically illustrating a state in which ultrasonic waves are applied to the component P from the vibration unit 60 having an ultrasonic transducer.
  • An article can be levitated on a diaphragm that vibrates ultrasonically. If the article has a relatively flat outer shape, it is easier to float. That is, when the diaphragm of the vibration unit 60 is ultrasonically vibrated, the levitation force F1 acts on the component P due to the acoustic radiation pressure. Therefore, the component P is levitated in the pocket 35 by the operation of the vibration unit 60.
  • the acoustic viscous flow Q acts on the component P in the horizontal direction from the periphery of the component P due to the ultrasonic vibration generated by the ultrasonic vibrator of the vibration unit 60.
  • the acoustic viscous flow Q generates a holding force F2 that holds the component P above the ultrasonic transducer and holds it at the center of the ultrasonic transducer. Therefore, if the ultrasonic transducer is disposed at a position immediately below the center position in the transport direction D1 and the tape width direction of the pocket 35 at the position where the pocket 35 intermittently stops, the holding force F2 is used as the holding force F2. It can act to go to the center of 35.
  • FIG. 8A is a top view showing the behavior in the pocket of the component given vibration by the ultrasonic vibrator
  • FIG. 8B is a side view thereof.
  • the vibration unit 60 When the vibration unit 60 operates in this state and ultrasonic vibration is applied to the component P, the component P is lifted by the levitation force F1 (vibration in the vertical direction) and parallel to the conveyance direction D1 by the holding force F2. It moves in a direction D3 orthogonal to D2 and D2 on a horizontal plane (vibration in the horizontal direction).
  • the pocket lock of the part P is canceled, and the part P comes to be located at the center of the pocket 35 that is substantially evenly spaced from the mutually facing inner wall surfaces 35S. That is, a gap is formed between the part P and the inner wall surface 35S of the pocket 35 in both directions D2 and D3. Accordingly, the component P is attracted by the nozzle 21 and can be taken out from the pocket 35.
  • the fluff D as shown in FIG. 5B is removed from the top of the component P by ultrasonic vibration or falls to the bottom 35 ⁇ / b> B, and does not hinder the adsorption by the nozzle 21.
  • the part P is held at the substantially central portion of the pocket 35 by ultrasonic vibration.
  • the pocket 35 is deformed as shown in FIG. 5C, the component P is held at the substantially central portion of the pocket 35 by ultrasonic vibration, so that the interference with the deformed upper end portion 371 does not occur. be able to.
  • the overall control unit 45 controls the motor drive unit 42 to activate the drive motor 41 (step S1). Then, after rotating the sprocket 50 by a predetermined rotation angle around the axis of the rotation shaft 51 so as to feed the component supply tape 32 by one pitch of the pocket 35, the overall control unit 45 stops the drive motor 41. (Step S2). As a result, the part P1 to be picked up is positioned at the part picking position A2. In synchronization with the feeding operation of the component supply tape 32, the overall control unit 45 also causes the motor driving unit 4 to drive the take-off motor 52 and also causes the cover tape 34 to be collected.
  • the overall control unit 45 controls the head driving unit 44 to lower the head 20 at the component suction position A1 (step S3).
  • the overall control unit 45 stops the lowering of the head 20 and generates a negative pressure at the nozzle 21.
  • the overall control unit 45 controls the head driving unit 44 to raise the head 20 while continuing to apply negative pressure to the nozzle 21 (step S4).
  • the component P1 is taken out from the carrier tape 33 (pocket 35).
  • the overall control unit 45 controls the vibrator driving unit 43 to activate the ultrasonic vibrator of the vibration unit 60 (step S5). After a predetermined time has elapsed, the overall control unit 45 stops the operation of the ultrasonic transducer (step S6). That is, the overall control unit 45 controls the vibrator driving unit 43 so as to start and stop the vibration unit 60 in units of pitch feed of the pocket 35. Even if the part P2 existing in the peeling position A1 is unevenly distributed in the pocket 35 or reaches the peeling position A1 in a state where pocket lock or the like is generated by performing steps S5 and S6, Moved to the center position.
  • the component P2 is lifted once and vibrates toward the center of the pocket 35 by the levitation force F1 and the holding force F2 caused by the ultrasonic vibration.
  • the component P2 comes into contact with the bottom 35B of the pocket 35. In this case, uneven distribution in the pocket 35, pocket lock, and the like are eliminated. Therefore, when the component P2 is located at the component suction position A2, the suction operation of the component P2 by the nozzle 21 can be performed satisfactorily.
  • step S7 determines whether or not the component is attracted to the other head 20 of the head unit 5 (step S7). If no further component suction operation is performed (NO in step S7), the process proceeds to a component mounting operation on the printed circuit board 3. If the component suction operation is to be continued (YES in step S7), the process returns to step S1 to continue the process.
  • the head 20 (nozzle 21) is used in a state where the uneven distribution of the component P in the pocket 35, the pocket lock, or the like is released.
  • the part P can be taken out. Therefore, the success rate of suction of the part P from the part supply tape 32 can be improved. Further, since the component P is brought into a state suitable for suction without contact by ultrasonic vibration, the component P is not damaged.
  • the vibration unit 60 may be disposed on any position from the drawing position where the component supply tape 32 is pulled out from the reel 31 to the component suction position A2 on the conveyance path of the component supply tape 32.
  • the vibration unit 60 may be disposed on any position from the drawing position where the component supply tape 32 is pulled out from the reel 31 to the component suction position A2 on the conveyance path of the component supply tape 32.
  • the vibration unit 60 may be disposed on any position from the drawing position where the component supply tape 32 is pulled out from the reel 31 to the component suction position A2 on the conveyance path of the component supply tape 32.
  • the vibration unit 60 may be disposed on any position from the drawing position where the component supply tape 32 is pulled out from the reel 31 to the component suction position A2 on the conveyance path of the component supply tape 32.
  • the vibration unit 60 may be arranged at a position closer to the component suction position A2.
  • the flow shown in FIG. 9 shows an example in which the vibration unit 60 is started and stopped (steps S5 and S6) after the head 20 is lowered and raised (steps S3 and S4).
  • the descending and raising operations of the head 20 and the starting and stopping of the vibration unit 60 may be executed in synchronization.
  • the suction timing of the component P may be removed, and the vibration unit 60 may be operated when the head 20 is lowered or raised.
  • FIG. 10 is a block diagram showing a device configuration and an electrical configuration of a component supply device 40A according to the second embodiment of the present invention.
  • the difference between the component supply device 40A and the first embodiment is that a vibration unit that applies vibration to the component P via the sprocket 50 is employed instead of the vibration unit 60 that generates ultrasonic vibration. .
  • the motor control unit 42A of the second embodiment includes a fine movement driving unit 421 (motor control unit) that rotates the sprocket 50 in the vibration mode.
  • a fine movement driving unit 421 (motor control unit) that rotates the sprocket 50 in the vibration mode.
  • the fine movement driving unit 421 executes the vibration mode
  • the fine rotation angle of the sprocket 50 in the normal rotation direction D4 (clockwise in FIG. 10) for feeding the component supply tape 32 and the reverse rotation direction D5 (counterclockwise) is small.
  • the drive motor 41 is operated so as to be rotated alternately.
  • the overall control unit 45 controls the fine movement driving unit 421 to execute the vibration mode when applying vibration to the component P to cancel the pocket lock.
  • the sprocket 50 is engaged with the component supply tape 32. Therefore, vibration can be applied to the component P in the pocket 35 via the component supply tape 32 by finely moving the sprocket 50 so as to rotate forward and backward.
  • the vibration mode control switching between the forward rotation direction D4 and the reverse rotation direction D5 is preferably performed in the ms order.
  • the timing for executing the vibration mode can be the timing before the head 20 is lowered after the component supply tape 32 is pitch-fed or the timing at which the head 20 is lowered.
  • the vibration mode may be continuously executed while the part P is adsorbed by the nozzle after the head 20 starts to descend and then rises.
  • the pocket lock or the like of the component P can be eliminated.
  • the sprocket 50 since the sprocket 50 is used to apply vibration to the component, it is not necessary to add a new mechanism for generating vibration to the component supply device 4. Note that the sprocket 50 may be vibrated by bringing an appropriate vibrator into contact with the sprocket 50.
  • FIG. 11 is a block diagram showing a device configuration and an electrical configuration of a component supply device 40B according to the third embodiment of the present invention.
  • the difference between the component supply device 40B and the first embodiment is that the vibration units are arranged at two positions apart from each other in the conveyance direction D1 of the component supply tape 32. That is, the component supply device 40B includes a first vibrator 61 and a second vibrator 62, and a vibrator control unit 43A that drives them.
  • the first transducer 61 and the second transducer 62 the ultrasonic transducer described in the first embodiment can be used.
  • the first vibrator 61 is disposed upstream of the peeling position A1 in the transport direction D1. That is, the first vibrator 61 is disposed at a position before the cover tape 34 is peeled from the carrier tape 33.
  • the second vibrator 62 is disposed between the component suction position A2 and the peeling position A1.
  • the first vibrator 61 generates a greater vibration force than the second vibrator 62.
  • the vibration force is adjusted by selecting one having a different vibration generating ability of the vibrator itself, or adjusting the driving power given to the first vibrator 61 and the second vibrator 62 by the vibrator control unit 43A. It can be realized by means.
  • the pocket lock of the component P is released by the first vibrator 61 that generates a relatively large vibration force, and then the component P is placed in the pocket 35 by the second vibrator 62. It is possible to realize the operation of reliably moving to the center position. Since the cover tape 34 is not peeled off from the carrier tape 33 at the position where the first vibrator 61 is disposed, even if a large vibration force is applied from the first vibrator 61 to the part P, the part P It does not jump out of the pocket 35. Further, even if fluff is generated when the cover tape 34 is peeled off, the influence can be eliminated by the vibration given by the second vibrator 62.
  • a component supply apparatus conveys a component supply tape including a main body including a plurality of pockets for storing components and a cover tape covering an upper surface opening of the pockets to a predetermined component suction position. And a vibrating section that vibrates the component accommodated in the pocket both in the vertical direction and in the horizontal direction.
  • the components in the pocket are vibrated not only in the vertical direction but also in the horizontal direction by the vibration unit. As a result, even when a pocket lock or the like of the part is generated in the pocket, it can be released.
  • the component is accommodated in the pocket in a state where a gap is formed between the component supply tape and an inner wall surface of the pocket at least in a conveyance direction of the component supply tape and a direction orthogonal to the conveyance direction.
  • the vibration unit vibrates the component so that the component is directed toward the center of the pocket in a direction orthogonal to the transport direction.
  • a gap is formed between the component and the inner wall of the pocket both in the transport direction and in the orthogonal direction by the vibration unit imparting vibration to the component. Therefore, the pocket lock can be reliably eliminated.
  • the vibration unit includes an ultrasonic transducer disposed in a conveyance path of the component supply tape, and the ultrasonic transducer is placed on the component from a lower side of the main body of the component supply tape. It is desirable to apply sonic vibration.
  • the vibration part When the vibration part causes the ultrasonic vibration to act on the part, the part is levitated by the acoustic radiation pressure in the pocket. Further, the acoustic viscous flow causes a holding force to hold the component at the center position of the pocket. Therefore, a configuration for directing the component toward the center of the pocket can be realized with a simple configuration of disposing the ultrasonic transducer.
  • the vibration unit when the cover tape is removed from above the pocket at a predetermined position set upstream of the component suction position in the conveyance direction of the component supply tape, the vibration unit is configured to move the component. It is desirable that the position where the vibration is applied is in the vicinity of the predetermined position.
  • the predetermined position is slightly upstream from the component suction position.
  • the posture of the part in the pocket may be changed by removing the cover tape.
  • the vibration unit applies vibration to the component in the vicinity of the predetermined position. Accordingly, it is possible to increase the accuracy with which the component can be easily attracted at the component attracting position.
  • the component supply apparatus may further include a control unit that controls operations of the conveyance unit and the vibration unit, and the control unit pitch-feeds the component supply tape in units of the arrangement pitch of the pockets. It is desirable to control the vibration unit to start and stop in units of the pitch feed.
  • this component supply device it is possible to vibrate in a timely manner for each component accommodated in each pocket rather than operating the vibration unit at all times, and to accurately attract the component.
  • the transport unit engages with a part of the main body of the component supply tape, and rotates to spout the component supply tape, and a drive motor that rotationally drives the sprocket. It is desirable that the vibration unit applies vibration to the component via the sprocket.
  • This component supply device is configured to apply vibration to the component using the sprocket, so that it is not necessary to add a new mechanism for generating vibration to the component supply device.
  • the vibration unit includes a motor control unit that controls the drive motor, and the motor control unit has a normal rotation direction in which the component supply tape is fed out when the vibration is applied to the component. It is desirable to control the drive motor so as to alternately rotate a minute rotation angle in the reverse direction.
  • the sprocket is engaged with the component supply tape. According to the above-described component supply device, vibration can be applied to the components in the pocket via the component supply tape by finely moving the sprocket so as to rotate forward and backward.
  • the cover tape when the cover tape is removed from above the pocket at a predetermined position set upstream of the component suction position in the conveyance direction of the component supply tape, Including a first vibrator and a second vibrator that apply vibration to a component, wherein the first vibrator generates a vibration force larger than that of the second vibrator. It is desirable that the second vibrator is disposed upstream of a predetermined position, and the second vibrator is disposed between the component suction position and the predetermined position.
  • the first oscillator that generates a relatively large vibration force releases the pocket lock of the component, and then the component is reliably moved to the center position of the pocket by the second transducer. Operation can be realized. Since the cover tape is not removed from the component supply tape at the position where the first vibrator is disposed, the component does not jump out of the pocket even when a large vibration force is applied from the first vibrator. .

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

A component supply device (40) is provided with a transport unit (41, 50) and a vibration unit (60). The transport unit transports, to a component adhesion location (A2), a carrier tape (33) that is provided with a plurality of pockets (35) for housing components (P) and a cover tape (34) that covers top openings of the pockets (35). The vibration unit (60) vibrates a component (P) housed in a pocket (35) both vertically and horizontally so that the component (P), if secured within the pocket due to a pocket lock or the like, can be released.

Description

部品供給装置Parts supply device
　本発明は、例えば基板に部品を装着する部品装着装置等に組み付けられ、前記部品を供給する部品供給装置に関する。 The present invention relates to a component supply device that is assembled to a component mounting device or the like that mounts a component on a substrate, for example, and supplies the component.
　基板に電子部品を装着する部品装着装置には、該装着装置に対して前記部品を供給する部品供給装置が組み付けられる。部品供給装置は、部品を収容する複数のポケットを備えた本体部（キャリアテープ）と、該ポケットの上面開口を覆うカバーテープとを備える部品供給テープを送り出し、所定の部品吸着位置へ前記部品を供給する。前記部品吸着位置の直前で前記カバーテープは、例えば剥離、或いは送り出し方向に沿って切断されることによってポケットの上方から除かれ、部品装着装置側の吸着ノズルによって前記部品が前記ポケットから取り出される。 The component supply device for mounting the electronic component on the board is assembled with a component supply device that supplies the component to the mounting device. The component supply device sends out a component supply tape including a main body (carrier tape) having a plurality of pockets for storing components and a cover tape covering the upper surface opening of the pockets, and puts the components into a predetermined component suction position. Supply. The cover tape is removed from above the pocket by, for example, peeling or cutting along the feeding direction immediately before the component suction position, and the component is taken out from the pocket by the suction nozzle on the component mounting device side.
　しかし、ポケット内に収容された部品の取り出しエラーが、様々な理由で発生することがある。一般に、部品のサイズはポケットのサイズよりも小さく、部品とポケット内壁との間には隙間が存在する状態で、当該部品は部品供給テープに保持されている。しかし、何らかの原因で部品の姿勢が傾く等、定常ではない状態になると、部品がポケット内壁で挟持されてロックされてしまう現象（以下、本明細書では「ポケットロック」という）が発生し、吸着ノズルによって部品吸着ができない場合、すなわち、部品吸着不良が発生することがある。この他、紙製のカバーテープに由来する紙屑類又は該テープ引き剥がし時の紙繊維の毛羽による部品吸着不良や、ポケットの変形によるによる部品吸着不良などもある。 However, an error in taking out the parts contained in the pocket may occur for various reasons. In general, the size of the component is smaller than the size of the pocket, and the component is held on the component supply tape in a state where a gap exists between the component and the inner wall of the pocket. However, if the posture of the component is tilted for some reason, the phenomenon that the component is pinched by the inner wall of the pocket and locked (hereinafter referred to as “pocket lock” in this specification) will occur. When the component cannot be sucked by the nozzle, that is, a component sucking failure may occur. In addition, there are component adsorption failure due to paper scraps derived from a paper cover tape or fluff of paper fibers when the tape is peeled off, component failure failure due to pocket deformation, and the like.
　ポケットロック等によって部品吸着不良が発生すると、部品装着装置の制御部は部品の取り出しエラーが発生したと認識し、吸着ノズルに次のポケットの部品を吸着させる。このため、吸着されなかった部品は使用されないことになり、部品を無駄に消費する。従って、ポケットロックを解除する手段を部品供給装置に付設することが望ましいが、従来、実用できる解除手段は未だ提案されていない。例えば、カバーテープ剥離後部品吸着前に、押圧ピンで部品を押圧してロックを解除することも考えられる。しかしながら、部品に対して押圧ピンを当接させることは好ましくない。特許文献１には、ポケット内の部品に上下方向の振動を与えることで、部品をポケットの後端部に移動させる技術が開示されている。しかし、部品を上下方向に振動させるだけでは、ポケットロック等を十分に解消することは困難である。 When a component suction failure occurs due to pocket lock or the like, the control unit of the component mounting device recognizes that a component take-out error has occurred and causes the suction nozzle to suck the component in the next pocket. For this reason, the parts that have not been picked up are not used, and the parts are wasted. Therefore, it is desirable to attach a means for releasing the pocket lock to the component supply apparatus, but conventionally, a practically usable releasing means has not been proposed yet. For example, it is also conceivable to release the lock by pressing the component with a pressing pin after the cover tape is peeled and before the component is sucked. However, it is not preferable to bring the pressing pin into contact with the component. Patent Document 1 discloses a technique for moving a component to the rear end of the pocket by applying vertical vibration to the component in the pocket. However, it is difficult to sufficiently eliminate the pocket lock or the like only by vibrating the component in the vertical direction.
特開２０１１－４９３５０号公報JP 2011-49350 A
　本発明の目的は、ポケット内に収容された部品の取り出しエラーを可及的に減らすことのできる部品供給装置を提供することにある。 It is an object of the present invention to provide a component supply device that can reduce as much as possible the error of taking out components stored in a pocket.
　本発明の一局面に係る部品供給装置は、部品を収容する複数のポケットを備えた本体部と、該ポケットの上面開口を覆うカバーテープとを備える部品供給テープを、所定の部品吸着位置へ搬送する搬送部と、前記ポケットに収容されている前記部品を、上下方向及び水平方向の双方に振動させる振動部と、を備える。 A component supply apparatus according to one aspect of the present invention conveys a component supply tape including a main body including a plurality of pockets for storing components and a cover tape covering an upper surface opening of the pockets to a predetermined component suction position. And a vibrating section that vibrates the component accommodated in the pocket both in the vertical direction and in the horizontal direction.
　本発明の目的、特徴及び利点は、以下の詳細な説明と添付図面とによって、より明白となる。 The objects, features and advantages of the present invention will become more apparent from the following detailed description and the accompanying drawings.
図１は、本発明の実施形態に係る部品供給装置が組み付けられる部品装着装置の平面図である。FIG. 1 is a plan view of a component mounting apparatus to which a component supply apparatus according to an embodiment of the present invention is assembled. 図２は、前記部品装着装置におけるヘッドユニットの側面図である。FIG. 2 is a side view of the head unit in the component mounting apparatus. 図３は、前記部品供給装置の概略的な斜視図である。FIG. 3 is a schematic perspective view of the component supply apparatus. 図４は、部品供給テープの斜視図である。FIG. 4 is a perspective view of the component supply tape. 図５Ａは、部品供給テープのポケットにおいて、部品のポケットロックが発生している状態を示す上面図である。FIG. 5A is a top view showing a state in which the pocket lock of the component is generated in the pocket of the component supply tape. 図５Ｂは、前記ポケットに紙繊維が滞留している状態を示す上面図である。FIG. 5B is a top view showing a state in which paper fibers stay in the pocket. 図５Ｃは、前記ポケットに変形が発生している状態を示す側断面図である。FIG. 5C is a side sectional view showing a state in which the pocket is deformed. 図６は、本発明の第１実施形態に係る部品供給装置の構成を示すブロック図である。FIG. 6 is a block diagram showing the configuration of the component supply apparatus according to the first embodiment of the present invention. 図７は、超音波振動子の作用を説明するための図である。FIG. 7 is a diagram for explaining the operation of the ultrasonic transducer. 図８Ａは、超音波振動子により振動を与えられた部品のポケット内での挙動を示す上面図である。FIG. 8A is a top view showing the behavior in the pocket of a component given vibration by the ultrasonic transducer. 図８Ｂは、超音波振動子により振動を与えられた部品のポケット内での挙動を示す側面図である。FIG. 8B is a side view showing the behavior in the pocket of the component that is vibrated by the ultrasonic transducer. 図９は、前記部品装着装置による部品吸着動作を示すフローチャートである。FIG. 9 is a flowchart showing a component suction operation by the component mounting apparatus. 図１０は、本発明の第２実施形態に係る部品供給装置の構成を示すブロック図である。FIG. 10 is a block diagram showing a configuration of a component supply apparatus according to the second embodiment of the present invention. 図１１は、本発明の第２実施形態に係る部品供給装置の構成を示すブロック図である。FIG. 11 is a block diagram showing a configuration of a component supply apparatus according to the second embodiment of the present invention.
　以下、図面に基づいて、本発明の実施形態につき詳細に説明する。先ず、本発明に係る部品供給装置４０が組み付けられる部品装着装置１（表面実装機）について説明する。図１は、部品装着装置１の全体構成を示す平面図である。部品装着装置１は、基台１０上に配置された、プリント基板３の搬送を行う基板搬送機構２と、プリント基板３に搭載される電子部品を供給する部品供給部４と、部品をプリント基板３に装着するためのヘッドユニット５とを含む。図２はヘッドユニット５が搭載されたユニット支持部材１１の側面図である。 Hereinafter, embodiments of the present invention will be described in detail based on the drawings. First, the component mounting apparatus 1 (surface mounting machine) to which the component supply apparatus 40 according to the present invention is assembled will be described. FIG. 1 is a plan view showing the overall configuration of the component mounting apparatus 1. The component mounting apparatus 1 includes a substrate transport mechanism 2 that is disposed on a base 10 and transports a printed circuit board 3, a component supply unit 4 that supplies electronic components mounted on the printed circuit board 3, and a component printed circuit board. 3 and a head unit 5 for mounting on the head 3. FIG. 2 is a side view of the unit support member 11 on which the head unit 5 is mounted.
　基板搬送機構２は、基台１０上においてプリント基板３を搬送する一対のコンベア２ａ、２ｂと、図略のプッシュアップピン等の保持装置と、を含む。コンベア２ａ、２ｂは、図１の左側からプリント基板３を受け入れて基台１０の中央付近の実装作業位置に搬送し、前記保持装置により当該プリント基板３を保持する。部品の実装作業後、コンベア２ａ、２ｂはプリント基板３を同図の右側に搬出する。なお、図１では、コンベア２ａ、２ｂが延びる方向をＸ方向、水平面上でＸ方向と直交する方向をＹ方向として表示している。 The substrate transport mechanism 2 includes a pair of conveyors 2a and 2b that transport the printed circuit board 3 on the base 10, and a holding device such as a push-up pin (not shown). The conveyors 2a and 2b receive the printed circuit board 3 from the left side of FIG. 1 and transport it to the mounting work position near the center of the base 10, and hold the printed circuit board 3 by the holding device. After the component mounting operation, the conveyors 2a and 2b carry the printed circuit board 3 to the right side of the figure. In FIG. 1, the direction in which the conveyors 2a and 2b extend is indicated as the X direction, and the direction orthogonal to the X direction on the horizontal plane is indicated as the Y direction.
　部品供給部４は、基板搬送機構２の両側（Ｙ方向両側）に配置されている。これらの部品供給部４には、Ｘ方向に多数列に並ぶ部品供給装置４０が配置されている。部品供給装置４０は、テープフィーダーとも称され、ＩＣ、トランジスタ、コンデンサ等の小片状の電子部品を収容した部品供給テープが巻回されたリールを備える。部品供給装置４０は、前記リールから間欠的にテープを繰り出しながら、基板搬送機構２の近傍に設定された所定の部品供給位置に部品を供給する。この部品供給装置４０については、後記で詳述する。 The component supply unit 4 is disposed on both sides (Y direction both sides) of the substrate transport mechanism 2. In these component supply units 4, component supply devices 40 arranged in multiple rows in the X direction are arranged. The component supply device 40 is also referred to as a tape feeder, and includes a reel on which a component supply tape that accommodates small electronic components such as ICs, transistors, and capacitors is wound. The component supply device 40 supplies components to a predetermined component supply position set in the vicinity of the substrate transport mechanism 2 while intermittently feeding the tape from the reel. The component supply device 40 will be described in detail later.
　ヘッドユニット５は、部品供給部４から部品を取り出してプリント基板３上に実装するものであり、基板搬送機構２及び部品供給部４の上方に配置されている。ヘッドユニット５は、基台１０上に備えられたヘッドユニット駆動機構により、一定の領域内でＸ方向及びＹ方向に移動可能である。ヘッドユニット駆動機構は、Ｙ方向に互いに平行に延びる一対の固定レール７と、これら固定レール７に支持されてＸ方向に延びるユニット支持部材１１と、このユニット支持部材１１を固定レール７に沿ってＹ方向に移動させるためのＹボールねじ軸８と、ヘッドユニット５をＸ方向に移動させるためのＸボールねじ軸１４と、これらＹ、Ｘボールねじ軸８、１４を回転駆動するＹ軸サーボモータ９、Ｘ軸サーボモータ１５と、を含む。 The head unit 5 takes out components from the component supply unit 4 and mounts them on the printed circuit board 3, and is disposed above the substrate transport mechanism 2 and the component supply unit 4. The head unit 5 is movable in the X direction and the Y direction within a certain area by a head unit driving mechanism provided on the base 10. The head unit drive mechanism includes a pair of fixed rails 7 extending parallel to each other in the Y direction, a unit support member 11 supported by the fixed rails 7 and extending in the X direction, and the unit support member 11 extending along the fixed rails 7. A Y ball screw shaft 8 for moving in the Y direction, an X ball screw shaft 14 for moving the head unit 5 in the X direction, and a Y axis servomotor for rotationally driving the Y and X ball screw shafts 8, 14 9 and an X-axis servo motor 15.
　Ｙボールねじ軸８には、ユニット支持部材１１と一体のナット部材１２が螺合されている。Ｙ軸サーボモータ９によりＹボールねじ軸８が回転駆動されると、ユニット支持部材１１は固定レール７にガイドされつつＹ方向に移動し、これによりヘッドユニット５もＹ方向に移動する。ユニット支持部材１１には、ヘッドユニット５をＸ方向に移動可能に支持する固定レール１３が取り付けられている。Ｘボールねじ軸１４には、ヘッドユニット５と一体の図略のナット部材が螺合されている。Ｘ軸サーボモータ１５によりＸボールねじ軸１４が回転駆動されると、ヘッドユニット５は固定レール１３にガイドされつつＸ方向に移動する。 A nut member 12 integral with the unit support member 11 is screwed onto the Y ball screw shaft 8. When the Y ball screw shaft 8 is rotationally driven by the Y-axis servo motor 9, the unit support member 11 moves in the Y direction while being guided by the fixed rail 7, whereby the head unit 5 also moves in the Y direction. A fixed rail 13 that supports the head unit 5 so as to be movable in the X direction is attached to the unit support member 11. An unillustrated nut member integral with the head unit 5 is screwed onto the X ball screw shaft 14. When the X ball screw shaft 14 is rotationally driven by the X axis servo motor 15, the head unit 5 moves in the X direction while being guided by the fixed rail 13.
　ヘッドユニット５には、部品を吸着してプリント基板３に実装するための複数本の実装用ヘッド２０（図１、図２では４本のヘッド２０を例示）が搭載されている。これら実装用ヘッド２０は、各々、Ｚ軸サーボモータ（図略）を駆動源とする昇降機構に連結されるとともに、Ｒ軸サーボモータ（図略）を駆動源とする回転機構にそれぞれ連結されている。前記昇降機構及び前記回転機構の動作によって、ヘッド２０は、ヘッドユニット５に対して上下方向（Ｚ軸方向）に移動可能であり、また、Ｚ軸回り（Ｒ軸方向）に回転可能とされている。 The head unit 5 is mounted with a plurality of mounting heads 20 (four heads 20 are illustrated in FIGS. 1 and 2) for sucking components and mounting them on the printed circuit board 3. Each of these mounting heads 20 is connected to a lifting mechanism using a Z-axis servomotor (not shown) as a drive source, and is connected to a rotating mechanism using an R-axis servomotor (not shown) as a drive source. Yes. The head 20 can move in the vertical direction (Z-axis direction) with respect to the head unit 5 and can rotate about the Z-axis (R-axis direction) by the operations of the lifting mechanism and the rotating mechanism. Yes.
　各実装用ヘッド２０の先端には、部品吸着用のノズル２１が備えられている。各ノズル２１は、空圧配管路に接続されており、それぞれ電動切替弁を介して負圧発生装置、正圧発生装置及び大気の何れかに連通可能とされている。ノズル２１に前記負圧発生装置から負圧が供給されることによって、当該ノズル２１による部品の吸着保持が可能となり、その後、大気との連通又は前記正圧発生装置から正圧が供給されることによって、当該部品の吸着保持が解除される。 At the tip of each mounting head 20, a nozzle 21 for component suction is provided. Each nozzle 21 is connected to a pneumatic pipeline, and can communicate with any one of a negative pressure generator, a positive pressure generator, and the atmosphere via an electric switching valve. By supplying negative pressure to the nozzle 21 from the negative pressure generating device, it becomes possible to suck and hold the components by the nozzle 21, and then communicate with the atmosphere or supply positive pressure from the positive pressure generating device. Thus, the suction holding of the part is released.
　基台１０上には、各実装用ヘッド２０による部品の吸着状態を画像認識するための部品認識カメラ１７が設けられている。部品認識カメラ１７は、フロント側（図１では下側）のコンベア２ｂと部品供給部４との間に設けられている。ヘッドユニット５が部品認識カメラ１７上方の所定の撮像位置に配置されたときに、部品認識カメラ１７は各実装用ヘッド２０による吸着部品をその下側から撮像する。 On the base 10, a component recognition camera 17 for recognizing an image of the suction state of the component by each mounting head 20 is provided. The component recognition camera 17 is provided between the front side (lower side in FIG. 1) conveyor 2 b and the component supply unit 4. When the head unit 5 is disposed at a predetermined imaging position above the component recognition camera 17, the component recognition camera 17 captures the suction component by each mounting head 20 from below.
　以上の構成を備える部品装着装置１の概略動作は次の通りである。先ず、ヘッドユニット５が部品供給部４の上方に移動され、各実装用ヘッド２０による部品供給装置４０からの部品の取出しが行われる。具体的には、部品を吸着すべきヘッド２０が前記昇降機構によって下降されると共に、前記負圧発生装置からの負圧がノズル２１に供給されることによって、ノズル２１の先端に部品が吸着され、次いで、部品を吸着した状態でヘッド２０が上昇されることによって、部品供給装置４０から部品がピックアップされる。この際、可能な場合には、複数の実装用ヘッド２０により同時に部品がピックアップされる。 The general operation of the component mounting apparatus 1 having the above configuration is as follows. First, the head unit 5 is moved above the component supply unit 4, and components are taken out from the component supply device 40 by each mounting head 20. Specifically, the head 20 to which the component is to be sucked is lowered by the elevating mechanism, and the negative pressure from the negative pressure generator is supplied to the nozzle 21, so that the component is sucked to the tip of the nozzle 21. Subsequently, the head 20 is lifted in a state in which the components are attracted, whereby the components are picked up from the component supply device 40. At this time, if possible, components are picked up simultaneously by a plurality of mounting heads 20.
　全ての実装用ヘッド２０による部品の吸着が完了すると、ヘッドユニット５が部品認識カメラ１７上の前記撮像位置に移動され、各吸着部品の撮像が行われる。その撮像結果に基づき、各部品のノズル２１による吸着状態の良否が判定される。その後、ヘッドユニット５がプリント基板３上に移動され、所定の部品実装ポイントに順次ヘッドユニット５が移動しながら各実装用ヘッド２０の昇降及びノズル２１の負圧解除等が行われ、これに伴い各部品がプリント基板３上に実装される。 When the suction of the components by all the mounting heads 20 is completed, the head unit 5 is moved to the imaging position on the component recognition camera 17, and each suction component is imaged. Based on the imaging result, the quality of the suction state of each component by the nozzle 21 is determined. Thereafter, the head unit 5 is moved onto the printed circuit board 3, and the head units 5 are sequentially moved to predetermined component mounting points, and the mounting heads 20 are moved up and down and the negative pressure of the nozzles 21 is released. Each component is mounted on the printed circuit board 3.
　続いて、本実施形態に係る部品供給装置４０について説明する。図３は、部品供給装置４０の概略的な斜視図である。部品供給装置４０は、幅方向（Ｘ方向）に扁平なボックス型のフィーダー本体部２５と、このフィーダー本体部２５にＹ方向に連設されたプレート状のリール支持部２６とを備えている。部品供給装置４０は、先端側に位置するフィーダー本体部２５をコンベア２ａ、２ｂ側に向けた状態で、部品供給部４に具備されているフィーダー取付台６にセットされ、図外のクランプ手段によりこの取付台６に対して着脱可能に固定される。なお、図３ではフィーダー本体部２５の側面が開放された状態を示しているが、通常は、この部分に側板が装着される。 Subsequently, the component supply device 40 according to the present embodiment will be described. FIG. 3 is a schematic perspective view of the component supply device 40. The component supply device 40 includes a box-type feeder main body 25 that is flat in the width direction (X direction), and a plate-shaped reel support portion 26 that is connected to the feeder main body 25 in the Y direction. The component supply device 40 is set on the feeder mounting base 6 provided in the component supply unit 4 with the feeder main body 25 positioned on the front end side facing the conveyors 2a and 2b, and is clamped by a clamping means (not shown). The mounting base 6 is detachably fixed. Although FIG. 3 shows a state in which the side surface of the feeder main body 25 is opened, a side plate is usually attached to this portion.
　リール支持部２６の後端部（図３では左端部）には、部品供給テープ３２が巻回されたリール３１が、回転可能に保持されている。リール３１から前方のフィーダー本体部２５へ、部品供給テープ３２が導出されている。部品供給テープ３２は、上述のＩＣ、トランジスタ、コンデンサ等の電子部品の多数個を、一定間隔置きに収容、保持したテープ状の部材である。 The reel 31 around which the component supply tape 32 is wound is rotatably held at the rear end portion (left end portion in FIG. 3) of the reel support portion 26. A component supply tape 32 is led out from the reel 31 to the front feeder main body 25. The component supply tape 32 is a tape-like member that accommodates and holds a large number of electronic components such as the above-described ICs, transistors, and capacitors at regular intervals.
　図４は、部品供給テープ３２の斜視図である。部品供給テープ３２は、キャリアテープ３３（本体部）と、該キャリアテープ３３に貼着されるカバーテープ３４とを備える。キャリアテープ３３は、部品Ｐを個別に収容するための、上方に開口した直方体のキャビティからなるポケット３５を複数個備えている。ポケット３５は、キャリアテープ３３が延びる方向に、一定間隔を置いて一列に配列されている。キャリアテープ３３の一辺側には、その縁部に沿ってテープ厚み方向に貫通する係合孔３６が一定間隔で設けられている。カバーテープ３４は、ポケット３５の上面開口を覆うように、キャリアテープ３３の上面に剥離可能に接着されている。図４では、カバーテープ３４の一部がキャリアテープ３３から剥離されている状態を示している。 FIG. 4 is a perspective view of the component supply tape 32. The component supply tape 32 includes a carrier tape 33 (main body portion) and a cover tape 34 attached to the carrier tape 33. The carrier tape 33 is provided with a plurality of pockets 35 each having a rectangular parallelepiped cavity opened upward for individually accommodating the components P. The pockets 35 are arranged in a line at regular intervals in the direction in which the carrier tape 33 extends. On one side of the carrier tape 33, engagement holes 36 penetrating along the edge in the tape thickness direction are provided at regular intervals. The cover tape 34 is detachably bonded to the upper surface of the carrier tape 33 so as to cover the upper surface opening of the pocket 35. FIG. 4 shows a state in which a part of the cover tape 34 is peeled from the carrier tape 33.
　図３に戻り、フィーダー本体部２５の上部には、前後方向（Ｙ方向）に延びる案内部２７が設けられている。案内部２７の上部の前方半分は、部品供給テープ３２を上から押さえるカバー部材２８によって覆われている。案内部２７とカバー部材２８との間にはテープ通路が形成されており、リール３１から導出された部品供給テープ３２は、前記テープ通路に案内されている。 3, a guide portion 27 extending in the front-rear direction (Y direction) is provided on the upper portion of the feeder main body portion 25. The front half of the upper portion of the guide portion 27 is covered with a cover member 28 that holds the component supply tape 32 from above. A tape passage is formed between the guide portion 27 and the cover member 28, and the component supply tape 32 led out from the reel 31 is guided to the tape passage.
　フィーダー本体部２５の前端部分には、部品取出部２９が設けられている。部品取出部２９は、実装用ヘッド２０により部品Ｐをピックアップさせる部分であり、カバー部材２８の一部を切り欠いてなる窓部２８１によって形成されている。窓部２８１は前後方向に長い矩形の切り欠きであり、前端側の前縁部と、リール３１側の後縁部とを有する。部品取出部２９では、案内部２７に沿って案内される部品供給テープ３２が上方に露出していると共に、カバーテープ３４が部品供給テープ３２から引き剥がされつつ、窓部２８１の後縁部に沿って折り返されている。これによって部品供給テープ３２（キャリアテープ３３）のポケット３５が上方に開放されて、実装用ヘッド２０による部品の取出しが可能となっている。 A component take-out portion 29 is provided at the front end portion of the feeder main body portion 25. The component extraction portion 29 is a portion where the component P is picked up by the mounting head 20, and is formed by a window portion 281 formed by cutting out a part of the cover member 28. The window portion 281 is a rectangular cutout that is long in the front-rear direction, and has a front edge portion on the front end side and a rear edge portion on the reel 31 side. In the component take-out unit 29, the component supply tape 32 guided along the guide unit 27 is exposed upward, and the cover tape 34 is peeled off from the component supply tape 32, and is attached to the rear edge of the window 281. It is folded along. As a result, the pocket 35 of the component supply tape 32 (carrier tape 33) is opened upward, and the component can be taken out by the mounting head 20.
　フィーダー本体部２５の内部には、部品供給テープ３２をノズル２１による部品吸着位置へ搬送するテープ送り機構（搬送部）と、カバーテープ３４の引取り機構とが備えられている。テープ送り機構は、部品供給テープ３２をリール３１から引出しつつ案内部２７に沿って送り出すもので、部品取出部２９の下方に配置されるスプロケット５０と、このスプロケット５０を回転駆動する駆動モータ４１とを有している。駆動モータ４１は、部品供給テープ３２を送り出す動力源である。駆動モータ４１の出力軸が、スプロケット５０の回転軸に直結され、駆動モータ４１はスプロケット５０をダイレクトドライブ方式で駆動する。なお、ダイレクトドライブ方式は一例であり、ギアやベルト等を用いた駆動方式としても良い。 Inside the feeder main body 25, a tape feeding mechanism (conveying unit) for conveying the component supply tape 32 to a component suction position by the nozzle 21 and a take-up mechanism for the cover tape 34 are provided. The tape feeding mechanism feeds the component supply tape 32 from the reel 31 and feeds it along the guide portion 27. The sprocket 50 is disposed below the component take-out portion 29, and a drive motor 41 that rotationally drives the sprocket 50. have. The drive motor 41 is a power source that sends out the component supply tape 32. The output shaft of the drive motor 41 is directly connected to the rotation shaft of the sprocket 50, and the drive motor 41 drives the sprocket 50 by the direct drive method. Note that the direct drive method is an example, and a drive method using a gear, a belt, or the like may be used.
　スプロケット５０は、円盤状の部材であり、その外周縁には多数本の係合歯が所定ピッチで突設されている。前記係合歯のピッチと、前記キャリアテープ３３の係合孔３６のピッチとは同じである。前記係合歯の一部が係合孔３６（本体部の一部）に嵌合することにより、スプロケット５０と部品供給テープ３２とが係合する。駆動モータ４１によりスプロケット５０が間欠的に回転駆動されると、これに伴いリール３１から部品供給テープ３２が送り出される。駆動モータ４１は、ポケット３５の配列ピッチ単位で部品供給テープ３２を間欠送りできるよう、所定の回転角ピッチでスプロケット５０を回転駆動する。 The sprocket 50 is a disk-shaped member, and a large number of engaging teeth protrude from the outer peripheral edge at a predetermined pitch. The pitch of the engaging teeth and the pitch of the engaging holes 36 of the carrier tape 33 are the same. A part of the engaging teeth engages with the engaging hole 36 (a part of the main body), whereby the sprocket 50 and the component supply tape 32 are engaged. When the sprocket 50 is rotationally driven intermittently by the drive motor 41, the component supply tape 32 is sent out from the reel 31 accordingly. The drive motor 41 rotationally drives the sprocket 50 at a predetermined rotation angle pitch so that the component supply tape 32 can be intermittently fed in units of the arrangement pitch of the pockets 35.
　スプロケット５０の外周縁の上端付近は、フィーダー本体部２５の天面（案内部２７）に形成された開口部を介して部品取出部２９に臨んでいる。従って、ヘッド２０のノズル２１は、スプロケット５０に係合している状態の部品供給テープ３２（キャリアテープ３３のポケット３５）にアクセス可能である。 The vicinity of the upper end of the outer peripheral edge of the sprocket 50 faces the component takeout part 29 through an opening formed in the top surface (guide part 27) of the feeder body part 25. Therefore, the nozzle 21 of the head 20 can access the component supply tape 32 (the pocket 35 of the carrier tape 33) that is engaged with the sprocket 50.
　前記引取り機構は、キャリアテープ３３からカバーテープ３４を引き剥がし、回収するための機構である。引取り機構は、フィーダー本体部２５において前記テープ送り機構よりも後側に設けられており、引取りモータ５２と、引取りギア対５６ａ、５６ｂと、引取りモータ５２の回転駆動力を引取りギア対５６ａ、５６ｂに伝達するギア５４、５５を含む。引取りモータ５２は、カバーテープ３４を回収するための動力源である。上述の駆動モータ４１と、この引取りモータ５２とは、共通のモータ基板４００に搭載されている。モータ基板４００には、これらモータ４１、５２を駆動制御するための制御回路も搭載されている。 The take-off mechanism is a mechanism for removing the cover tape 34 from the carrier tape 33 and collecting it. The take-up mechanism is provided in the feeder main body 25 on the rear side of the tape feeding mechanism and takes up the take-up motor 52, take- off gear pairs 56a and 56b, and the rotational driving force of the take-up motor 52. Gears 54 and 55 are included for transmission to gear pairs 56a and 56b. The take-up motor 52 is a power source for collecting the cover tape 34. The drive motor 41 and the take-up motor 52 are mounted on a common motor board 400. A control circuit for driving and controlling the motors 41 and 52 is also mounted on the motor board 400.
　引取りギア対５６ａ、５６ｂ間には、窓部２８１においてキャリアテープ３３から引き剥がされたカバーテープ３４が案内されている。部品供給テープ３２による部品供給時には、引取りモータ５２の作動により引取りギア対５６ａ，５６ｂが回転駆動され、その引取力によってカバーテープ３４がキャリアテープ３３から引き剥がされると共に、剥がされたカバーテープ３４を図略の回収ボックスに送り込む。 The cover tape 34 peeled off from the carrier tape 33 in the window 281 is guided between the take- off gear pairs 56a and 56b. At the time of component supply by the component supply tape 32, the take-off gear 52 is driven to rotate by the operation of the take-off motor 52, and the cover tape 34 is peeled off from the carrier tape 33 by the take-off force and the peeled cover tape is removed. 34 is fed into a collection box (not shown).
　以上の通り構成された部品供給装置４０において、さらに本実施形態では、部品供給テープ３２のポケット３５に収容されている部品Ｐを、上下方向及び水平方向の双方に振動させる振動部６０（図６参照）が備えられている。振動部６０は、部品供給テープ３２の搬送経路上であって、キャリアテープ３３からカバーテープ３４が剥離される剥離位置の近傍に配設されている。以下、振動部６０に関わる構成について説明する。 In the component supply apparatus 40 configured as described above, in the present embodiment, the vibration unit 60 (FIG. 6) that vibrates the component P accommodated in the pocket 35 of the component supply tape 32 both in the vertical direction and in the horizontal direction. See). The vibration unit 60 is disposed on the conveyance path of the component supply tape 32 and in the vicinity of the peeling position where the cover tape 34 is peeled from the carrier tape 33. Hereinafter, a configuration related to the vibration unit 60 will be described.
　まず、部品供給装置４０に振動部６０を具備させる意義について説明する。既述の通り、部品供給テープ３２のポケット３５内に収容された部品Ｐのノズル２１による取り出しエラーが、ポケットロック、紙繊維等の異物の介在、ポケット３５の変形などの原因によって発生することがある。これらの現象の発生態様を、図５Ａ～図５Ｃに例示する。図５Ａは、ポケット３５において部品Ｐのポケットロックが発生している状態を示す上面図、図５Ｂは、ポケット３５に紙繊維等の毛羽Ｄが滞留している状態を示す上面図、図５Ｃは、ポケット３５に変形が発生している状態を示す側断面図である。 First, the significance of including the vibration unit 60 in the component supply device 40 will be described. As described above, an error in taking out the component P accommodated in the pocket 35 of the component supply tape 32 by the nozzle 21 may occur due to a pocket lock, the presence of foreign matters such as paper fibers, or deformation of the pocket 35. is there. The manner in which these phenomena occur is illustrated in FIGS. 5A to 5C. 5A is a top view showing a state where the pocket lock of the component P is generated in the pocket 35, FIG. 5B is a top view showing a state where fluff D such as paper fibers is staying in the pocket 35, and FIG. FIG. 5 is a side sectional view showing a state where the pocket 35 is deformed.
　図５Ａを参照して、部品Ｐのサイズはポケット３５のサイズよりも小さく、部品Ｐとポケット３５の内壁面３５Ｓとの間には、部品供給テープ３２の搬送方向及び該搬送方向と直交する方向のいずれにも隙間が形成される状態で、当該部品Ｐはポケット３５内に収容されている。従って、通常は部品Ｐをポケット３５の上面開口からスムースに取り出すことができる。しかし、図５Ａに示すように、何らかの原因で部品Ｐの姿勢がポケット３５内で傾き、部品Ｐの角部がポケット内壁面３５Ｓに喰い込んで挟持され、部品Ｐがポケット３５に固定的に保持されてしまうポケットロックが発生することがある。ポケットロックの度合が強いと、ノズル２１で部品Ｐを吸着して取り出せなくなる。 Referring to FIG. 5A, the size of the component P is smaller than the size of the pocket 35, and the conveyance direction of the component supply tape 32 and the direction orthogonal to the conveyance direction are between the component P and the inner wall surface 35S of the pocket 35. The part P is accommodated in the pocket 35 in a state where a gap is formed in any of the above. Therefore, normally, the component P can be smoothly taken out from the upper surface opening of the pocket 35. However, as shown in FIG. 5A, for some reason, the posture of the component P is inclined in the pocket 35, the corners of the component P are caught in the pocket inner wall surface 35S, and the component P is fixedly held in the pocket 35. The pocket lock that is done may occur. If the degree of pocket lock is strong, the component P is attracted by the nozzle 21 and cannot be taken out.
　図５Ｂは、ノズル２１による部品Ｐの吸着又はその取り出しを阻害する毛羽Ｄを例示している。一般にカバーテープ３４は紙製であり、キャリアテープ３３の上面に貼付されている。毛羽Ｄは、カバーテープ３４のキャリアテープ３３からの引き剥がし時に、一部の紙繊維が残存することによって発生する。或いは、カバーテープ３４に由来する紙屑類がポケット３５に侵入することもある。毛羽Ｄが部品Ｐの上面を覆っている場合には、ノズル２１による部品Ｐの吸着ができず、また、毛羽Ｄの一部が部品Ｐとポケット内壁面３５Ｓとの隙間にスペーサ的に介在して部品Ｐを固定化している場合には、ノズル２１による部品Ｐの取り出しができなくなる。 FIG. 5B illustrates the fluff D that obstructs the adsorption or removal of the component P by the nozzle 21. Generally, the cover tape 34 is made of paper and is affixed to the upper surface of the carrier tape 33. Fluff D is generated when some paper fibers remain when the cover tape 34 is peeled off from the carrier tape 33. Alternatively, paper scraps derived from the cover tape 34 may enter the pocket 35. When the fluff D covers the upper surface of the part P, the part P cannot be adsorbed by the nozzle 21, and a part of the fluff D is interposed as a spacer in the gap between the part P and the pocket inner wall surface 35S. Thus, when the component P is fixed, the component P cannot be taken out by the nozzle 21.
　図５Ｃに示すように、ポケット３５の変形が部品Ｐの取り出しを阻害する場合もある。図５Ｃでは、隣接するポケット３５間の壁部３７の上端部分３７１が、ポケット３５に覆い被さるように変形している例を示している。このような変形は、ノズル２１が壁部３７を押圧することによって発生し得る。或いは、キャリアテープ３３自体の形状不良によっても起こり得る。変形した上端部分３７１などが存在しており、且つ部品Ｐがポケット３５内において上端部分３７１の側に部品Ｐが偏在していると、当該部分に部品Ｐが引っ掛かり、ノズル２１による部品Ｐの取り出しに失敗することがある。 As shown in FIG. 5C, deformation of the pocket 35 may obstruct the removal of the part P. FIG. 5C shows an example in which the upper end portion 371 of the wall portion 37 between the adjacent pockets 35 is deformed so as to cover the pocket 35. Such deformation can occur when the nozzle 21 presses the wall portion 37. Alternatively, it may also occur due to a defective shape of the carrier tape 33 itself. If a deformed upper end portion 371 or the like exists and the component P is unevenly distributed on the upper end portion 371 side in the pocket 35, the component P is caught on the portion P and the component P is taken out by the nozzle 21. May fail.
　ポケットロック等によって一のポケット３５において部品吸着不良が発生すると、部品装着装置１の制御部は部品Ｐの取り出しエラーが発生したと認識し、ノズル２１に次のポケット３５の部品Ｐを吸着させる。このため、吸着されなかった部品Ｐは使用されないことになり、部品Ｐを無駄に消費する。本実施形態では、部品供給装置４０に振動部６０を具備させることによって、ポケットロック等による部品吸着不良を解消させる。 When a component suction failure occurs in one pocket 35 due to pocket lock or the like, the control unit of the component mounting apparatus 1 recognizes that a component P take-out error has occurred, and causes the nozzle 21 to suck the component P in the next pocket 35. For this reason, the parts P that have not been picked up are not used, and the parts P are wasted. In the present embodiment, the component feeding device 40 is provided with the vibration unit 60, thereby eliminating component adsorption failure due to pocket lock or the like.
　図６は、本発明の第１実施形態に係る部品供給装置４０の装置構成及び部品装着装置１の電気的構成を示すブロック図である。既述の通り、部品供給装置４０は、部品供給テープ３２を図中の矢印Ｄ１方向（搬送方向Ｄ１）に搬送するスプロケット５０及び駆動モータ４１（搬送部）と、振動部６０とを含む。また、図１中の符号Ａ１、Ａ２は、それぞれ、キャリアテープ３３からカバーテープ３４が剥離される剥離位置（カバーテープがポケットの上方から除かれる所定の位置）、部品Ｐがヘッド２０（ノズル２１）により吸着して取り出される部品吸着位置を示している。剥離位置Ａ１は、部品吸着位置Ａ２よりも所定距離だけ搬送方向上流側に位置している。なお、本実施形態ではカバーテープ３４を上方に剥離する例を示すが、カバーテープ３４が搬送方向Ｄ１に沿って切断されることによってポケット３５の上方から除かれる態様とすることもできる。この態様では、部品吸着位置Ａ２の上流側において、カバー部材２８の下面に前記切断を行うカッターが配置される。この場合、前記カッターが配置される位置が、剥離位置Ａ１に相当する「所定の位置」となる。 FIG. 6 is a block diagram showing the device configuration of the component supply device 40 and the electrical configuration of the component mounting device 1 according to the first embodiment of the present invention. As described above, the component supply device 40 includes the sprocket 50 and the drive motor 41 (conveyance unit) that convey the component supply tape 32 in the direction of the arrow D1 (conveyance direction D1) in the drawing, and the vibration unit 60. Further, reference signs A1 and A2 in FIG. 1 denote a peeling position where the cover tape 34 is peeled from the carrier tape 33 (a predetermined position where the cover tape is removed from above the pocket), and the component P is the head 20 (nozzle 21). ) Shows the component suction position to be picked up and taken out. The peeling position A1 is located upstream of the component suction position A2 by a predetermined distance in the transport direction. In this embodiment, an example in which the cover tape 34 is peeled upward is shown. However, the cover tape 34 may be removed from above the pocket 35 by being cut along the transport direction D1. In this aspect, the cutter that performs the cutting is disposed on the lower surface of the cover member 28 on the upstream side of the component suction position A2. In this case, the position where the cutter is arranged is a “predetermined position” corresponding to the peeling position A1.
　振動部６０は、超音波振動する振動板を備えた超音波振動子からなる。振動部６０は、剥離位置Ａ１の近傍において部品供給テープ３２の下面側に配置され、キャリアテープ３３の下方側から部品Ｐに超音波振動を作用させる。振動部６０が超音波振動を発生することで、部品Ｐは上下方向及び水平方向の双方に振動する。これにより、ポケット３５内で上述した部品Ｐのポケットロック等が発生している場合でも、これを解除することができる。さらに、超音波振動を与えられた部品Ｐは、搬送方向Ｄ１及び該搬送方向Ｄ１と直交するテープ幅方向において、ポケット３５の中心に向かうようになる。これにより、部品Ｐの周囲とポケット３５の内壁面３５Ｓとの間には隙間が形成され、ポケットロックを確実に解消することができる。この点については、図７～図８Ｂに基づき後記で詳述する。 The vibration unit 60 is composed of an ultrasonic vibrator provided with a vibration plate that vibrates ultrasonically. The vibration unit 60 is disposed on the lower surface side of the component supply tape 32 in the vicinity of the peeling position A <b> 1 and causes ultrasonic vibration to act on the component P from the lower side of the carrier tape 33. When the vibration unit 60 generates ultrasonic vibration, the component P vibrates both in the vertical direction and in the horizontal direction. As a result, even when the above-described pocket lock of the part P occurs in the pocket 35, it can be released. Furthermore, the component P to which the ultrasonic vibration is applied is directed toward the center of the pocket 35 in the transport direction D1 and the tape width direction orthogonal to the transport direction D1. Thereby, a clearance gap is formed between the circumference | surroundings of the component P and the inner wall face 35S of the pocket 35, and a pocket lock can be cancelled | released reliably. This point will be described in detail later with reference to FIGS. 7 to 8B.
　部品装着装置１は、電気的に、モータ駆動部４２、振動子駆動部４３、ヘッド駆動部４４及び全体制御部４５（制御部）を備える。これら電気的構成の一部が部品供給装置４０に電気回路等として備えられていても良く、全てが部品装着装置１のコントローラに備えられていても良い。 The component mounting apparatus 1 electrically includes a motor drive unit 42, a vibrator drive unit 43, a head drive unit 44, and an overall control unit 45 (control unit). A part of these electrical configurations may be provided in the component supply device 40 as an electric circuit or the like, or all may be provided in the controller of the component mounting device 1.
　モータ駆動部４２は、スプロケット５０を回転させる駆動モータ４１を駆動するドライバである。モータ駆動部４２は、部品供給装置４０から部品Ｐが供給されるとき、ポケット３５の配列ピッチ単位で部品供給テープ３２を搬送方向Ｄ１にピッチ送りするよう、駆動モータ４１を動作させる。 The motor drive unit 42 is a driver that drives a drive motor 41 that rotates the sprocket 50. When the component P is supplied from the component supply device 40, the motor drive unit 42 operates the drive motor 41 so as to pitch-feed the component supply tape 32 in the conveyance direction D1 in units of the arrangement pitch of the pockets 35.
　振動子駆動部４３は、振動部６０を駆動する。具体的には、振動部６０が備える前記振動板が超音波振動するよう、例えば圧電素子や高周波電源を含む超音波振動の発生機構を動作させる。 The vibrator drive unit 43 drives the vibration unit 60. Specifically, an ultrasonic vibration generation mechanism including, for example, a piezoelectric element and a high-frequency power source is operated so that the diaphragm included in the vibration unit 60 is ultrasonically vibrated.
　ヘッド駆動部４４は、ヘッドユニット５自体を移動させ、また、ヘッドユニット５が備える実装用ヘッド２０及びノズル２１を動作させるドライバである。具体的にはヘッド駆動部４４は、ヘッドユニット５をＸ方向及びＹ方向に移動させるＸ軸サーボモータ１５及びＹ軸サーボモータ９を駆動する。また、ヘッド駆動部４４は、ヘッド２０を上下動させるＺ軸サーボモータ、ヘッド２０をＺ軸回りに回転させるＲ軸サーボモータを駆動する。さらに、ヘッド駆動部４４は、ノズル２１に負圧（部品吸着力）を発生させる負圧発生装置を駆動する。 The head drive unit 44 is a driver that moves the head unit 5 itself and operates the mounting head 20 and the nozzle 21 provided in the head unit 5. Specifically, the head drive unit 44 drives the X-axis servo motor 15 and the Y-axis servo motor 9 that move the head unit 5 in the X direction and the Y direction. The head drive unit 44 drives a Z-axis servo motor that moves the head 20 up and down and an R-axis servo motor that rotates the head 20 around the Z axis. Further, the head driving unit 44 drives a negative pressure generating device that generates a negative pressure (component suction force) at the nozzle 21.
　全体制御部４５は、モータ駆動部４２、振動子駆動部４３及びヘッド駆動部４４を統括的に制御し、部品供給テープ３２の送り出し動作、振動部６０による部品Ｐへの超音波振動の印加動作、及び、ヘッドユニット５の移動動作並びにヘッド２０（ノズル２１）による部品Ｐの部品供給テープ３２からの取り出し動作を制御する。 The overall control unit 45 comprehensively controls the motor drive unit 42, the vibrator drive unit 43, and the head drive unit 44, the feeding operation of the component supply tape 32, and the operation of applying ultrasonic vibration to the component P by the vibrating unit 60. Further, the moving operation of the head unit 5 and the operation of taking out the component P from the component supply tape 32 by the head 20 (nozzle 21) are controlled.
　続いて、振動部６０の作用について説明する。図７は、超音波振動子を有する振動部６０から部品Ｐに超音波が与えられている状態を模式的に示す図である。超音波振動する振動板上においては、物品を浮揚させることができる。前記物品が比較的平坦な外形形状を備えていれば、より浮揚させ易い。すなわち、振動部６０の振動板が超音波振動すると、音響放射圧によって部品Ｐには浮揚力Ｆ１が作用する。従って、振動部６０が動作することで、部品Ｐはポケット３５内において浮揚する。 Subsequently, the operation of the vibration unit 60 will be described. FIG. 7 is a diagram schematically illustrating a state in which ultrasonic waves are applied to the component P from the vibration unit 60 having an ultrasonic transducer. An article can be levitated on a diaphragm that vibrates ultrasonically. If the article has a relatively flat outer shape, it is easier to float. That is, when the diaphragm of the vibration unit 60 is ultrasonically vibrated, the levitation force F1 acts on the component P due to the acoustic radiation pressure. Therefore, the component P is levitated in the pocket 35 by the operation of the vibration unit 60.
　さらに、振動部６０の超音波振動子が発する超音波振動によって、部品Ｐの周囲から水平方向に音響粘性流Ｑが部品Ｐに作用する。音響粘性流Ｑは、部品Ｐを超音波振動子の上方であり、超音波振動子の中央に保持する保持力Ｆ２を発生させる。従って、超音波振動子の配置位置を、ポケット３５が間欠停止する位置における当該ポケット３５の搬送方向Ｄ１及び前記テープ幅方向の中心位置の直下とすれば、この保持力Ｆ２を、部品Ｐがポケット３５の中心に向かうように作用させることができる。 Furthermore, the acoustic viscous flow Q acts on the component P in the horizontal direction from the periphery of the component P due to the ultrasonic vibration generated by the ultrasonic vibrator of the vibration unit 60. The acoustic viscous flow Q generates a holding force F2 that holds the component P above the ultrasonic transducer and holds it at the center of the ultrasonic transducer. Therefore, if the ultrasonic transducer is disposed at a position immediately below the center position in the transport direction D1 and the tape width direction of the pocket 35 at the position where the pocket 35 intermittently stops, the holding force F2 is used as the holding force F2. It can act to go to the center of 35.
　図８Ａは、超音波振動子により振動を与えられた部品のポケット内での挙動を示す上面図、図８Ｂはその側面図である。振動部６０から部品Ｐにポケット３５の底部３５Ｂを通して超音波振動が与えられると、上述の浮揚力Ｆ１及び保持力Ｆ２によって、部品Ｐはポケット３５の底部３５Ｂから浮上すると共に、ポケット３５の中央に向かうようになる。つまり、部品Ｐはポケット３５内において上下方向及び水平方向の双方に振動（移動）する。 FIG. 8A is a top view showing the behavior in the pocket of the component given vibration by the ultrasonic vibrator, and FIG. 8B is a side view thereof. When ultrasonic vibration is applied from the vibrating part 60 to the part P through the bottom part 35B of the pocket 35, the part P is lifted from the bottom part 35B of the pocket 35 by the above-described levitation force F1 and holding force F2, and at the center of the pocket 35. Come to head. That is, the component P vibrates (moves) in the vertical direction and the horizontal direction in the pocket 35.
　例えば、図８Ａに点線で示すように、部品Ｐの姿勢がポケット３５内で傾き、部品Ｐの角部がポケット内壁面３５Ｓに喰い込んでポケットロックが発生していたとする。この状態で振動部６０が動作して超音波振動が部品Ｐに与えられると、部品Ｐは浮揚力Ｆ１によって上昇する（上下方向への振動）と共に、保持力Ｆ２によって搬送方向Ｄ１と平行な方向Ｄ２及びＤ２と水平面で直交する方向Ｄ３に移動する（水平方向への振動）。 For example, as shown by a dotted line in FIG. 8A, it is assumed that the posture of the part P is inclined in the pocket 35, and the corner of the part P bites into the pocket inner wall surface 35S and the pocket lock is generated. When the vibration unit 60 operates in this state and ultrasonic vibration is applied to the component P, the component P is lifted by the levitation force F1 (vibration in the vertical direction) and parallel to the conveyance direction D1 by the holding force F2. It moves in a direction D3 orthogonal to D2 and D2 on a horizontal plane (vibration in the horizontal direction).
　これにより、部品Ｐのポケットロックは解消され、且つ、部品Ｐはポケット３５の互いに向かい合う内壁面３５Ｓから略均等に離間した中央に位置するようになる。つまり、部品Ｐとポケット３５の内壁面３５Ｓとの間には、方向Ｄ２、Ｄ３のいずれにおいても隙間が形成される。従って、部品Ｐは、ノズル２１によって吸着され、ポケット３５から取り出し可能な状態となる。図５Ｂに示したような毛羽Ｄは、概ね超音波振動によって部品Ｐの上から除かれるか、或いは底部３５Ｂに落下することとなり、ノズル２１による吸着を阻害しないようになる。また、毛羽Ｄが部品Ｐの上から除かれる、或いは落下することによって、毛羽Ｄの部品Ｐへの干渉が回避されると、部品Ｐは超音波振動によってポケット３５のほぼ中央部に保持される。図５Ｃに示したようなポケット３５の変形が生じていても、部品Ｐは超音波振動によってポケット３５のほぼ中央部に保持されるので、変形した上端部分３７１との干渉が生じない状態とすることができる。 Thereby, the pocket lock of the part P is canceled, and the part P comes to be located at the center of the pocket 35 that is substantially evenly spaced from the mutually facing inner wall surfaces 35S. That is, a gap is formed between the part P and the inner wall surface 35S of the pocket 35 in both directions D2 and D3. Accordingly, the component P is attracted by the nozzle 21 and can be taken out from the pocket 35. The fluff D as shown in FIG. 5B is removed from the top of the component P by ultrasonic vibration or falls to the bottom 35 </ b> B, and does not hinder the adsorption by the nozzle 21. Further, when the fluff D is removed from the top of the part P or dropped to prevent the fluff D from interfering with the part P, the part P is held at the substantially central portion of the pocket 35 by ultrasonic vibration. . Even if the pocket 35 is deformed as shown in FIG. 5C, the component P is held at the substantially central portion of the pocket 35 by ultrasonic vibration, so that the interference with the deformed upper end portion 371 does not occur. be able to.
　続いて、部品装着装置１による部品吸着動作を、図６に示すブロック図、及び図９に示すフローチャートに基づいて説明する。先ず全体制御部４５は、モータ駆動部４２を制御して、駆動モータ４１を起動させる（ステップＳ１）。そして、部品供給テープ３２をポケット３５の１ピッチ分だけピッチ送りするよう、スプロケット５０を回転軸５１の軸回りに所定の回転角だけ回転させた後、全体制御部４５は駆動モータ４１を停止させる（ステップＳ２）。これにより、吸着対象の部品Ｐ１が部品吸着位置Ａ２に位置決めされる。なお、この部品供給テープ３２の送り出し動作に同期して、全体制御部４５は、モータ駆動部４に引取りモータ５２も駆動させ、カバーテープ３４の回収動作も実行させる。 Subsequently, the component suction operation by the component mounting apparatus 1 will be described based on the block diagram shown in FIG. 6 and the flowchart shown in FIG. First, the overall control unit 45 controls the motor drive unit 42 to activate the drive motor 41 (step S1). Then, after rotating the sprocket 50 by a predetermined rotation angle around the axis of the rotation shaft 51 so as to feed the component supply tape 32 by one pitch of the pocket 35, the overall control unit 45 stops the drive motor 41. (Step S2). As a result, the part P1 to be picked up is positioned at the part picking position A2. In synchronization with the feeding operation of the component supply tape 32, the overall control unit 45 also causes the motor driving unit 4 to drive the take-off motor 52 and also causes the cover tape 34 to be collected.
　次に全体制御部４５は、ヘッド駆動部４４を制御して、部品吸着位置Ａ１においてヘッド２０を下降させる（ステップＳ３）。ノズル２１の先端が部品Ｐ１に近接乃至は当接したら、全体制御部４５はヘッド２０の下降を停止させると共に、ノズル２１に負圧を発生させる。しかる後、全体制御部４５は、ヘッド駆動部４４を制御して、ノズル２１への負圧の印加を継続させつつ、ヘッド２０を上昇させる（ステップＳ４）。これにより、部品Ｐ１は、キャリアテープ３３（ポケット３５）から取り出される。 Next, the overall control unit 45 controls the head driving unit 44 to lower the head 20 at the component suction position A1 (step S3). When the tip of the nozzle 21 approaches or comes into contact with the component P1, the overall control unit 45 stops the lowering of the head 20 and generates a negative pressure at the nozzle 21. Thereafter, the overall control unit 45 controls the head driving unit 44 to raise the head 20 while continuing to apply negative pressure to the nozzle 21 (step S4). Thereby, the component P1 is taken out from the carrier tape 33 (pocket 35).
　続いて、全体制御部４５は振動子駆動部４３を制御して、振動部６０の超音波振動子を起動させる（ステップＳ５）。一定時間経過後、全体制御部４５は超音波振動子の動作を停止させる（ステップＳ６）。つまり、振動部６０を、ポケット３５のピッチ送りの単位で起動及び停止するよう、全体制御部４５は振動子駆動部４３を制御する。ステップＳ５、Ｓ６の実行によって、剥離位置Ａ１に存在する部品Ｐ２は、ポケット３５内で偏在していたり、ポケットロック等が発生していたりする状態で剥離位置Ａ１に到達しても、ポケット３５の中心位置に移動される。 Subsequently, the overall control unit 45 controls the vibrator driving unit 43 to activate the ultrasonic vibrator of the vibration unit 60 (step S5). After a predetermined time has elapsed, the overall control unit 45 stops the operation of the ultrasonic transducer (step S6). That is, the overall control unit 45 controls the vibrator driving unit 43 so as to start and stop the vibration unit 60 in units of pitch feed of the pocket 35. Even if the part P2 existing in the peeling position A1 is unevenly distributed in the pocket 35 or reaches the peeling position A1 in a state where pocket lock or the like is generated by performing steps S5 and S6, Moved to the center position.
　すなわち、図８Ａ、図８Ｂに基づき説明した通り、部品Ｐ２は超音波振動による浮揚力Ｆ１及び保持力Ｆ２によって、一旦浮揚すると共にポケット３５の中央に向かうように振動する。超音波振動の印加停止により部品Ｐ２はポケット３５の底部３５Ｂに接面することになるが、その際にはポケット３５内での偏在やポケットロック等が解消されている。従って、いずれ部品Ｐ２が部品吸着位置Ａ２に位置するとき、ノズル２１による部品Ｐ２の吸着動作を良好に行わせることができる。 That is, as described based on FIGS. 8A and 8B, the component P2 is lifted once and vibrates toward the center of the pocket 35 by the levitation force F1 and the holding force F2 caused by the ultrasonic vibration. When the application of ultrasonic vibration is stopped, the component P2 comes into contact with the bottom 35B of the pocket 35. In this case, uneven distribution in the pocket 35, pocket lock, and the like are eliminated. Therefore, when the component P2 is located at the component suction position A2, the suction operation of the component P2 by the nozzle 21 can be performed satisfactorily.
　続いて全体制御部４５は、ヘッドユニット５の他のヘッド２０に部品を吸着させるか否かを判断する（ステップＳ７）。これ以上の部品吸着動作を行わない場合は（ステップＳ７でＮＯ）、部品のプリント基板３への装着動作に移行する。部品吸着動作を継続する場合は（ステップＳ７でＹＥＳ）、ステップＳ１に戻って処理を続ける。 Subsequently, the overall control unit 45 determines whether or not the component is attracted to the other head 20 of the head unit 5 (step S7). If no further component suction operation is performed (NO in step S7), the process proceeds to a component mounting operation on the printed circuit board 3. If the component suction operation is to be continued (YES in step S7), the process returns to step S1 to continue the process.
　以上説明した第１実施形態に係る部品供給装置４０を備える部品装着装置１によれば、部品Ｐのポケット３５内での偏在やポケットロック等を解除させた状態で、ヘッド２０（ノズル２１）による部品Ｐの取り出しを行わせることができる。従って、部品Ｐの部品供給テープ３２からの吸着成功率を向上させることができる。また、超音波振動によって部品Ｐを非接触で吸着に適した状態に至らせるので、部品Ｐを傷めることもない。 According to the component mounting device 1 including the component supply device 40 according to the first embodiment described above, the head 20 (nozzle 21) is used in a state where the uneven distribution of the component P in the pocket 35, the pocket lock, or the like is released. The part P can be taken out. Therefore, the success rate of suction of the part P from the part supply tape 32 can be improved. Further, since the component P is brought into a state suitable for suction without contact by ultrasonic vibration, the component P is not damaged.
　上記実施形態では、振動部６０が剥離位置Ａ１の近傍に配設される例を示した。これは一例であり、部品供給テープ３２の搬送経路上であって、リール３１から部品供給テープ３２が引き出される引き出し位置から部品吸着位置Ａ２までのいずれの位置に振動部６０を配置しても良い。例えば、カバーテープ３４が剥離される前に超音波振動を部品Ｐに与えるようにすれば、ポケット３５からの部品Ｐの飛び出しの懸念を払拭できる。しかし、カバーテープ３４の剥離によって、ポケット３５内における部品Ｐの姿勢が変わる場合もある。このため、剥離位置Ａ１の近傍において振動部６０が部品Ｐに対して振動を与えようにすれば、部品吸着位置Ａ２において部品Ｐを吸着し易い状態とする確度を高めることができる。なお、レイアウトが許容すれば、部品吸着位置Ａ２により近い位置に振動部６０を配置するようにしても良い。 In the above embodiment, an example in which the vibration unit 60 is disposed in the vicinity of the peeling position A1 has been described. This is merely an example, and the vibration unit 60 may be disposed on any position from the drawing position where the component supply tape 32 is pulled out from the reel 31 to the component suction position A2 on the conveyance path of the component supply tape 32. . For example, if the ultrasonic vibration is applied to the component P before the cover tape 34 is peeled off, the concern of the component P jumping out of the pocket 35 can be eliminated. However, the posture of the component P in the pocket 35 may change due to the peeling of the cover tape 34. For this reason, if the vibration part 60 is made to vibrate with respect to the component P in the vicinity of peeling position A1, the probability which makes the component P easy to adsorb | suck in component adsorption position A2 can be improved. If the layout permits, the vibration unit 60 may be arranged at a position closer to the component suction position A2.
　また、図９に示したフローでは、ヘッド２０の下降及び上昇動作が実行された後（ステップＳ３、Ｓ４）、振動部６０を起動及び停止（ステップＳ５、Ｓ６）させる例を示した。これに代えて、ヘッド２０の下降～上昇動作と振動部６０を起動～停止とを同期して実行させても良い。或いは、部品Ｐの吸着タイミングを外して、ヘッド２０の下降時又は上昇時に振動部６０を動作させても良い。 Further, the flow shown in FIG. 9 shows an example in which the vibration unit 60 is started and stopped (steps S5 and S6) after the head 20 is lowered and raised (steps S3 and S4). Instead of this, the descending and raising operations of the head 20 and the starting and stopping of the vibration unit 60 may be executed in synchronization. Alternatively, the suction timing of the component P may be removed, and the vibration unit 60 may be operated when the head 20 is lowered or raised.
　図１０は、本発明の第２実施形態に係る部品供給装置４０Ａの装置構成及び電気的構成を示すブロック図である。部品供給装置４０Ａが第１実施形態と相違する点は、超音波振動を発生する振動部６０ではなく、スプロケット５０を介して部品Ｐに対して振動を与える振動部が採用されている点である。 FIG. 10 is a block diagram showing a device configuration and an electrical configuration of a component supply device 40A according to the second embodiment of the present invention. The difference between the component supply device 40A and the first embodiment is that a vibration unit that applies vibration to the component P via the sprocket 50 is employed instead of the vibration unit 60 that generates ultrasonic vibration. .
　第２実施形態のモータ制御部４２Ａは、スプロケット５０を振動モードで回転させる微動駆動部４２１（モータ制御部）を備える。微動駆動部４２１は、前記振動モードを実行するとき、スプロケット５０を、部品供給テープ３２を送り出す正転方向Ｄ４（図１０の時計方向）とその逆転方向Ｄ５（反時計方向）とに微小回転角だけ交互に回転させるよう、駆動モータ４１を動作させる。全体制御部４５は、ポケットロックの解消のために部品Ｐに振動を与える際、微動駆動部４２１を制御して前記振動モードを実行させる。スプロケット５０は部品供給テープ３２と係合している。従って、スプロケット５０を正逆回転するよう微動させることによって、部品供給テープ３２を介してポケット３５内の部品Ｐに振動を与えることができる。 The motor control unit 42A of the second embodiment includes a fine movement driving unit 421 (motor control unit) that rotates the sprocket 50 in the vibration mode. When the fine movement driving unit 421 executes the vibration mode, the fine rotation angle of the sprocket 50 in the normal rotation direction D4 (clockwise in FIG. 10) for feeding the component supply tape 32 and the reverse rotation direction D5 (counterclockwise) is small. The drive motor 41 is operated so as to be rotated alternately. The overall control unit 45 controls the fine movement driving unit 421 to execute the vibration mode when applying vibration to the component P to cancel the pocket lock. The sprocket 50 is engaged with the component supply tape 32. Therefore, vibration can be applied to the component P in the pocket 35 via the component supply tape 32 by finely moving the sprocket 50 so as to rotate forward and backward.
　前記振動モードの制御において、正転方向Ｄ４と逆転方向Ｄ５との間の切り替えは、ｍｓオーダーで行うことが望ましい。また、前記振動モードを実行させるタイミングは、部品供給テープ３２がピッチ送りされた後、ヘッド２０が下降する前のタイミング、又は下降を行っているタイミングとすることができる。或いは、ヘッド２０が下降を開始してからノズルにより部品Ｐが吸着され、その後に上昇している間、前記振動モードを継続して実行させるようにしても良い。 In the vibration mode control, switching between the forward rotation direction D4 and the reverse rotation direction D5 is preferably performed in the ms order. The timing for executing the vibration mode can be the timing before the head 20 is lowered after the component supply tape 32 is pitch-fed or the timing at which the head 20 is lowered. Alternatively, the vibration mode may be continuously executed while the part P is adsorbed by the nozzle after the head 20 starts to descend and then rises.
　この第２実施形態によれば、第１実施形態と同様に、部品Ｐに少なくとも水平方向の振動を与えることによって、当該部品Ｐのポケットロック等を解消することができる。また、スプロケット５０を利用して前記部品に対して振動を与える構成であるので、振動発生のための新たな機構を部品供給装置４に追加する必要がない。なお、適宜な振動子をスプロケット５０に当接させることによって、スプロケット５０を振動させるようにしても良い。 According to the second embodiment, similarly to the first embodiment, by applying at least horizontal vibration to the component P, the pocket lock or the like of the component P can be eliminated. In addition, since the sprocket 50 is used to apply vibration to the component, it is not necessary to add a new mechanism for generating vibration to the component supply device 4. Note that the sprocket 50 may be vibrated by bringing an appropriate vibrator into contact with the sprocket 50.
　図１１は、本発明の第３実施形態に係る部品供給装置４０Ｂの装置構成及び電気的構成を示すブロック図である。部品供給装置４０Ｂが第１実施形態と相違する点は、振動部が、部品供給テープ３２の搬送方向Ｄ１に離間して２箇所に配置されている点である。すなわち、部品供給装置４０Ｂは第１振動子６１及び第２振動子６２と、これらを駆動する振動子制御部４３Ａとを備えている。第１振動子６１及び第２振動子６２としては、第１実施形態において説明した超音波振動子を用いることができる。 FIG. 11 is a block diagram showing a device configuration and an electrical configuration of a component supply device 40B according to the third embodiment of the present invention. The difference between the component supply device 40B and the first embodiment is that the vibration units are arranged at two positions apart from each other in the conveyance direction D1 of the component supply tape 32. That is, the component supply device 40B includes a first vibrator 61 and a second vibrator 62, and a vibrator control unit 43A that drives them. As the first transducer 61 and the second transducer 62, the ultrasonic transducer described in the first embodiment can be used.
　第１振動子６１は、剥離位置Ａ１よりも搬送方向Ｄ１の上流側に配置されている。つまり、第１振動子６１は、キャリアテープ３３からカバーテープ３４が剥離される前の位置に配置されている。第２振動子６２は、部品吸着位置Ａ２と剥離位置Ａ１との間に配置されている。第１振動子６１は第２振動子６２よりも大きな振動力を発生する。振動力の調整は、振動子自体の振動発生能力が異なるものを選択する、若しくは、振動子制御部４３Ａが各々第１振動子６１、第２振動子６２に与える駆動パワーを調整する、等の手段によって実現できる。 The first vibrator 61 is disposed upstream of the peeling position A1 in the transport direction D1. That is, the first vibrator 61 is disposed at a position before the cover tape 34 is peeled from the carrier tape 33. The second vibrator 62 is disposed between the component suction position A2 and the peeling position A1. The first vibrator 61 generates a greater vibration force than the second vibrator 62. The vibration force is adjusted by selecting one having a different vibration generating ability of the vibrator itself, or adjusting the driving power given to the first vibrator 61 and the second vibrator 62 by the vibrator control unit 43A. It can be realized by means.
　第３実施形態の部品供給装置４０Ｂによれば、比較的大きな振動力を発生する第１振動子６１によって、部品Ｐのポケットロックを解除し、その後、第２振動子６２によって部品Ｐをポケット３５の中心位置へ確実に移動させる、という動作を実現することができる。なお、第１振動子６１の配置位置では、キャリアテープ３３からカバーテープ３４が剥離されていない状態であるため、第１振動子６１から部品Ｐに大きな振動力が与えられても、部品Ｐはポケット３５から飛び出すことはない。また、カバーテープ３４の剥離時に毛羽が発生しても、第２振動子６２が与える振動によって、その影響を排除することができる。 According to the component supply device 40B of the third embodiment, the pocket lock of the component P is released by the first vibrator 61 that generates a relatively large vibration force, and then the component P is placed in the pocket 35 by the second vibrator 62. It is possible to realize the operation of reliably moving to the center position. Since the cover tape 34 is not peeled off from the carrier tape 33 at the position where the first vibrator 61 is disposed, even if a large vibration force is applied from the first vibrator 61 to the part P, the part P It does not jump out of the pocket 35. Further, even if fluff is generated when the cover tape 34 is peeled off, the influence can be eliminated by the vibration given by the second vibrator 62.
　なお、上述した具体的実施形態には以下の構成を有する発明が主に含まれている。 The specific embodiments described above mainly include inventions having the following configurations.
　本発明の一局面に係る部品供給装置は、部品を収容する複数のポケットを備えた本体部と、該ポケットの上面開口を覆うカバーテープとを備える部品供給テープを、所定の部品吸着位置へ搬送する搬送部と、前記ポケットに収容されている前記部品を、上下方向及び水平方向の双方に振動させる振動部と、を備える。 A component supply apparatus according to one aspect of the present invention conveys a component supply tape including a main body including a plurality of pockets for storing components and a cover tape covering an upper surface opening of the pockets to a predetermined component suction position. And a vibrating section that vibrates the component accommodated in the pocket both in the vertical direction and in the horizontal direction.
　この部品供給装置によれば、振動部によってポケット内の部品が上下方向だけでなく、水平方向にも振動させられる。これにより、前記ポケット内で前記部品のポケットロック等が発生している場合でも、これを解除することが可能となる。 According to this component supply device, the components in the pocket are vibrated not only in the vertical direction but also in the horizontal direction by the vibration unit. As a result, even when a pocket lock or the like of the part is generated in the pocket, it can be released.
　上記の部品供給装置において、前記部品は、少なくとも前記部品供給テープの搬送方向及び該搬送方向と直交する方向において、前記ポケットの内壁面との間に隙間が形成される状態で前記ポケットに収容されており、前記振動部は、前記搬送方向及び直交する方向において前記部品が前記ポケットの中心に向かうように、前記部品を振動させることが望ましい。 In the component supply apparatus, the component is accommodated in the pocket in a state where a gap is formed between the component supply tape and an inner wall surface of the pocket at least in a conveyance direction of the component supply tape and a direction orthogonal to the conveyance direction. Preferably, the vibration unit vibrates the component so that the component is directed toward the center of the pocket in a direction orthogonal to the transport direction.
　この部品供給装置によれば、振動部が部品に振動を与えることによって、当該部品とポケットの内壁との間には、前記搬送方向及び直交する方向のいずれにおいても隙間が形成される。従って、ポケットロックを確実に解消することができる。 According to this component supply device, a gap is formed between the component and the inner wall of the pocket both in the transport direction and in the orthogonal direction by the vibration unit imparting vibration to the component. Therefore, the pocket lock can be reliably eliminated.
　この場合、前記振動部は、前記部品供給テープの搬送経路に配設される超音波振動子を含み、前記超音波振動子は、前記部品供給テープの前記本体部の下方側から前記部品に超音波振動を作用させることが望ましい。 In this case, the vibration unit includes an ultrasonic transducer disposed in a conveyance path of the component supply tape, and the ultrasonic transducer is placed on the component from a lower side of the main body of the component supply tape. It is desirable to apply sonic vibration.
　前記振動部が前記超音波振動を部品に作用させることにより、当該部品はポケット内において音響放射圧によって浮揚する。さらに、音響粘性流によって、当該部品をポケットの中央位置に保持する保持力が働く。従って、前記部品を前記ポケットの中心に向かわせるための構成を、前記超音波振動子の配設という簡素な構成にて実現することができる。 When the vibration part causes the ultrasonic vibration to act on the part, the part is levitated by the acoustic radiation pressure in the pocket. Further, the acoustic viscous flow causes a holding force to hold the component at the center position of the pocket. Therefore, a configuration for directing the component toward the center of the pocket can be realized with a simple configuration of disposing the ultrasonic transducer.
　上記の部品供給装置において、前記カバーテープが、前記部品吸着位置よりも前記部品供給テープの搬送方向上流に設定された所定の位置で前記ポケットの上方から除かれる場合において、前記振動部が前記部品に対して振動を与える位置が、前記所定の位置の近傍であることが望ましい。 In the component supply apparatus, when the cover tape is removed from above the pocket at a predetermined position set upstream of the component suction position in the conveyance direction of the component supply tape, the vibration unit is configured to move the component. It is desirable that the position where the vibration is applied is in the vicinity of the predetermined position.
　一般に、前記所定の位置は前記部品吸着位置よりも僅かに上流側の位置にある。また、カバーテープの除去によって、ポケット内における部品の姿勢が変わる場合もある。上記の部品供給装置によれば、前記所定の位置の近傍において振動部が前記部品に対して振動を与える。従って、前記部品吸着位置において部品を吸着し易い状態とする確度を高めることができる。 Generally, the predetermined position is slightly upstream from the component suction position. In addition, the posture of the part in the pocket may be changed by removing the cover tape. According to the component supply apparatus, the vibration unit applies vibration to the component in the vicinity of the predetermined position. Accordingly, it is possible to increase the accuracy with which the component can be easily attracted at the component attracting position.
　上記の部品供給装置において、前記搬送部及び前記振動部の動作を制御する制御部をさらに備え、前記制御部は、前記搬送部が、前記ポケットの配列ピッチ単位で前記部品供給テープをピッチ送りするよう制御すると共に、前記振動部が、前記ピッチ送りの単位で起動及び停止を行うよう制御することが望ましい。 The component supply apparatus may further include a control unit that controls operations of the conveyance unit and the vibration unit, and the control unit pitch-feeds the component supply tape in units of the arrangement pitch of the pockets. It is desirable to control the vibration unit to start and stop in units of the pitch feed.
　この部品供給装置によれば、常時振動部を動作させるのではなく、各ポケットに収容されている部品毎に、タイムリーに振動を与え、的確な部品の吸着を行わせることが可能となる。 According to this component supply device, it is possible to vibrate in a timely manner for each component accommodated in each pocket rather than operating the vibration unit at all times, and to accurately attract the component.
　上記の部品供給装置において、前記搬送部は、前記部品供給テープの前記本体部の一部と係合し、回転されることによって該部品供給テープを送り出すスプロケットと、前記スプロケットを回転駆動する駆動モータと、を含み、前記振動部は、前記スプロケットを介して前記部品に対して振動を与えることが望ましい。 In the component supply apparatus, the transport unit engages with a part of the main body of the component supply tape, and rotates to spout the component supply tape, and a drive motor that rotationally drives the sprocket. It is desirable that the vibration unit applies vibration to the component via the sprocket.
　この部品供給装置によれば、前記スプロケットを利用して前記部品に対して振動を与える構成であるので、振動発生のための新たな機構を部品供給装置に追加する必要がない。 This component supply device is configured to apply vibration to the component using the sprocket, so that it is not necessary to add a new mechanism for generating vibration to the component supply device.
　この場合、前記振動部は、前記駆動モータを制御するモータ制御部を含み、前記モータ制御部は、前記部品に対して振動を与える際、前記スプロケットを、前記部品供給テープを送り出す正転方向とその逆転方向とに微小回転角だけ交互に回転させるよう、前記駆動モータを制御することが望ましい。 In this case, the vibration unit includes a motor control unit that controls the drive motor, and the motor control unit has a normal rotation direction in which the component supply tape is fed out when the vibration is applied to the component. It is desirable to control the drive motor so as to alternately rotate a minute rotation angle in the reverse direction.
　前記スプロケットは部品供給テープと係合している。上記の部品供給装置によれば、前記スプロケットを正逆回転するよう微動させることによって、前記部品供給テープを介してポケット内の部品に振動を与えることができる。 The sprocket is engaged with the component supply tape. According to the above-described component supply device, vibration can be applied to the components in the pocket via the component supply tape by finely moving the sprocket so as to rotate forward and backward.
　上記の部品供給装置において、前記カバーテープが、前記部品吸着位置よりも前記部品供給テープの搬送方向上流に設定された所定の位置で前記ポケットの上方から除かれる場合において、前記振動部は、前記部品に対して振動を与える第１振動子及び第２振動子を含み、前記第１振動子は前記第２振動子よりも大きな振動力を発生するものであり、前記第１振動子は、前記所定の位置よりも上流側に配置され、前記第２振動子は、前記部品吸着位置と前記所定の位置との間に配置されていることが望ましい。 In the above-described component supply apparatus, when the cover tape is removed from above the pocket at a predetermined position set upstream of the component suction position in the conveyance direction of the component supply tape, Including a first vibrator and a second vibrator that apply vibration to a component, wherein the first vibrator generates a vibration force larger than that of the second vibrator. It is desirable that the second vibrator is disposed upstream of a predetermined position, and the second vibrator is disposed between the component suction position and the predetermined position.
　この部品供給装置によれば、比較的大きな振動力を発生する第１振動子によって、部品のポケットロックを解除し、その後、第２振動子によって部品をポケットの中心位置へ確実に移動させる、という動作を実現することができる。なお、第１振動子の配置位置では、部品供給テープからカバーテープが除去されていない状態であるため、前記第１振動子から大きな振動力が与えられても、部品はポケットから飛び出すことはない。 According to this component supply device, the first oscillator that generates a relatively large vibration force releases the pocket lock of the component, and then the component is reliably moved to the center position of the pocket by the second transducer. Operation can be realized. Since the cover tape is not removed from the component supply tape at the position where the first vibrator is disposed, the component does not jump out of the pocket even when a large vibration force is applied from the first vibrator. .
　以上説明した本発明によれば、ポケット内に収容された部品の取り出しエラーを可及的に減らすことのできる部品供給装置を提供することができる。 According to the present invention described above, it is possible to provide a component supply device that can reduce as much as possible the error in taking out components stored in a pocket.

Claims (8)

  1. 　部品を収容する複数のポケットを備えた本体部と、該ポケットの上面開口を覆うカバーテープとを備える部品供給テープを、所定の部品吸着位置へ搬送する搬送部と、
    　前記ポケットに収容されている前記部品を、上下方向及び水平方向の双方に振動させる振動部と、
    を備える部品供給装置。     A transport unit that transports a component supply tape including a main body unit including a plurality of pockets for storing components and a cover tape covering an upper surface opening of the pockets to a predetermined component suction position;
    A vibrating portion that vibrates the component housed in the pocket both vertically and horizontally; and
    A component supply apparatus comprising:
  2. 　請求項１に記載の部品供給装置において、
    　前記部品は、少なくとも前記部品供給テープの搬送方向及び該搬送方向と直交する方向において、前記ポケットの内壁面との間に隙間が形成される状態で前記ポケットに収容されており、
    　前記振動部は、前記搬送方向及び直交する方向において前記部品が前記ポケットの中心に向かうように、前記部品を振動させる、部品供給装置。     The component supply apparatus according to claim 1,
    The component is accommodated in the pocket in a state in which a gap is formed between the pocket and the inner wall surface of the pocket in at least a conveyance direction of the component supply tape and a direction orthogonal to the conveyance direction.
    The said vibration part is a components supply apparatus which vibrates the said components so that the said components may go to the center of the said pocket in the direction orthogonal to the said conveyance direction.
  3. 　請求項２に記載の部品供給装置において、
    　前記振動部は、前記部品供給テープの搬送経路に配設される超音波振動子を含み、
    　前記超音波振動子は、前記部品供給テープの前記本体部の下方側から前記部品に超音波振動を作用させる、部品供給装置。     In the component supply apparatus according to claim 2,
    The vibration unit includes an ultrasonic vibrator disposed in a conveyance path of the component supply tape,
    The ultrasonic vibrator causes the ultrasonic vibration to act on the component from the lower side of the main body of the component supply tape.
  4. 　請求項１～３のいずれか１項に記載の部品供給装置において、
    　前記カバーテープが、前記部品吸着位置よりも前記部品供給テープの搬送方向上流に設定された所定の位置で前記ポケットの上方から除かれる場合において、
    　前記振動部が前記部品に対して振動を与える位置が、前記所定の位置の近傍である、部品供給装置。     The component supply apparatus according to any one of claims 1 to 3,
    In the case where the cover tape is removed from above the pocket at a predetermined position set upstream in the conveying direction of the component supply tape from the component suction position,
    The component supply apparatus, wherein a position where the vibration unit applies vibration to the component is in the vicinity of the predetermined position.
  5. 　請求項１～４のいずれか１項に記載の部品供給装置において、
    　前記搬送部及び前記振動部の動作を制御する制御部をさらに備え、
    　前記制御部は、
    　　前記搬送部が、前記ポケットの配列ピッチ単位で前記部品供給テープをピッチ送りするよう制御すると共に、
    　　前記振動部が、前記ピッチ送りの単位で起動及び停止を行うよう制御する、部品供給装置。     The component supply apparatus according to any one of claims 1 to 4,
    A control unit for controlling operations of the transport unit and the vibrating unit;
    The controller is
    The transport unit is controlled to pitch feed the component supply tape in units of the arrangement pitch of the pockets,
    The component supply apparatus which controls the said vibration part to start and stop by the unit of the said pitch feed.
  6. 　請求項１に記載の部品供給装置において、
    　前記搬送部は、
    　　前記部品供給テープの前記本体部の一部と係合し、回転されることによって該部品供給テープを送り出すスプロケットと、
    　　前記スプロケットを回転駆動する駆動モータと、を含み、
    　前記振動部は、前記スプロケットを介して前記部品に対して振動を与える、部品供給装置。     The component supply apparatus according to claim 1,
    The transport unit is
    A sprocket that engages with a part of the main body of the component supply tape and feeds the component supply tape by being rotated;
    A drive motor that rotationally drives the sprocket,
    The said vibration part is a components supply apparatus which gives a vibration with respect to the said components via the said sprocket.
  7. 　請求項６に記載の部品供給装置において、
    　前記振動部は、前記駆動モータを制御するモータ制御部を含み、
    　前記モータ制御部は、前記部品に対して振動を与える際、前記スプロケットを、前記部品供給テープを送り出す正転方向とその逆転方向とに微小回転角だけ交互に回転させるよう、前記駆動モータを制御する、部品供給装置。     In the component supply apparatus according to claim 6,
    The vibration unit includes a motor control unit that controls the drive motor,
    The motor control unit controls the drive motor so as to alternately rotate the sprocket by a minute rotation angle in a normal rotation direction and a reverse rotation direction in which the component supply tape is fed when the vibration is applied to the component. A parts supply device.
  8. 　請求項１に記載の部品供給装置において、
    　前記カバーテープが、前記部品吸着位置よりも前記部品供給テープの搬送方向上流に設定された所定の位置で前記ポケットの上方から除かれる場合において、
    　前記振動部は、前記部品に対して振動を与える第１振動子及び第２振動子を含み、前記第１振動子は前記第２振動子よりも大きな振動力を発生するものであり、
    　前記第１振動子は、前記所定の位置よりも上流側に配置され、
    　前記第２振動子は、前記部品吸着位置と前記所定の位置との間に配置されている、部品供給装置。     The component supply apparatus according to claim 1,
    In the case where the cover tape is removed from above the pocket at a predetermined position set upstream in the conveying direction of the component supply tape from the component suction position,
    The vibration unit includes a first vibrator and a second vibrator that vibrate the component, and the first vibrator generates a larger vibration force than the second vibrator,
    The first vibrator is disposed upstream of the predetermined position;
    The component feeding device, wherein the second vibrator is disposed between the component suction position and the predetermined position.
PCT/JP2015/077828 2015-09-30 2015-09-30 Component supply device WO2017056262A1 (en)

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JP2018182036A (en) * 2017-04-12 2018-11-15 ヤマハ発動機株式会社 Component supply device and component mounter
JP2021503401A (en) * 2017-11-17 2021-02-12 青▲島▼海威物▲聯▼科技有限公司 Laminating equipment for RFID electronic tags for tires
JP6836767B1 (en) * 2019-12-26 2021-03-03 日本ファインテック株式会社 Electronic component insertion device
CN113271760A (en) * 2020-02-14 2021-08-17 松下知识产权经营株式会社 Tape feeder

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JP2018182036A (en) * 2017-04-12 2018-11-15 ヤマハ発動機株式会社 Component supply device and component mounter
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