WO2017036283A1 - 一种用于循环冷却系统的半导体制冷装置 - Google Patents

一种用于循环冷却系统的半导体制冷装置 Download PDF

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WO2017036283A1
WO2017036283A1 PCT/CN2016/094310 CN2016094310W WO2017036283A1 WO 2017036283 A1 WO2017036283 A1 WO 2017036283A1 CN 2016094310 W CN2016094310 W CN 2016094310W WO 2017036283 A1 WO2017036283 A1 WO 2017036283A1
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heat
semiconductor
dissipating
semiconductor refrigerating
transfer medium
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PCT/CN2016/094310
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English (en)
French (fr)
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王桂芬
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柳熠
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B41/00—Fluid-circulation arrangements

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  • Embodiments of the present invention relate to the field of semiconductor refrigeration technologies, and in particular, to a semiconductor refrigeration device for a circulating cooling system.
  • a known semiconductor refrigerating sheet is connected by a semiconductor N-type (hereinafter referred to as N-type) and a semiconductor P-type (hereinafter referred to as a P-type) via wires, and is bonded to N by two heat-conducting bodies (generally electrically insulating ceramic sheets). Both ends of the type and P type.
  • N-type and P-type heat-dissipating surfaces are radiated to the outside through the corresponding heat-conducting body, and the heat absorbed by the N-type and P-type heat-absorbing surfaces is absorbed by the heat conductor to the outside.
  • the N-type and P-type heat absorbing surfaces have a cooling function.
  • the efficiency of the semiconductor refrigerator is low because the heat dissipation surface and the heat absorption surface of the N-type and P-type are connected to the heat conductor only by one end surface, resulting in a small heat transfer area; and the heat dissipation surfaces and suction of the N-type and P-type The hot faces are placed in the same space, which in turn causes the heat between the heat dissipating surface and the heat absorbing surface to interfere with each other.
  • a semiconductor refrigerator for a circulating cooling system generally includes a semiconductor refrigerating sheet, a water heat exchanger, a metal radiator, an axial fan, and the like.
  • the middle part of the refrigerator is a heat exchanger, the heat exchanger is on both sides of the heat absorption surface of the semiconductor refrigeration sheet, and the heat dissipation surface of the TEC cooling sheet is an aluminum alloy heat sink.
  • the cooling water in the system water tank is cooled and cooled by the circulating pump flowing through the water heat exchanger, and the heat of the heat radiating surface of the semiconductor cooling sheet is supplemented by the aluminum alloy radiator and the axial flow.
  • the fan is scattered.
  • the body refrigerator in the prior art has the following defects: the heat dissipation surface of the semiconductor refrigeration chip in the semiconductor refrigerator is cooled by the aluminum alloy radiator and the axial flow fan, and the aluminum alloy heat sink is bulky and can be in contact with the heat dissipation surface of the semiconductor refrigeration chip.
  • the area for heat exchange is limited, the number of semiconductor refrigerating sheets installed is limited, and the cooling power of the system is not suitable.
  • the aluminum alloy radiators are distributed in parallel on both sides, which is not easy to form a smooth cooling air passage, and the heat dissipation efficiency is low, thus seriously affecting the semiconductor refrigeration sheet.
  • Refrigeration efficiency (40%-60% cooling energy efficiency ratio)
  • the overall size of the refrigerator is large, and the installation position is limited by the cooling air duct, which is inconvenient to install and waste space.
  • the technical problem to be solved by the embodiments of the present invention is how to install a plurality of semiconductor refrigerating sheets in a certain space and improve the heat dissipation conditions to improve the cooling energy efficiency ratio.
  • an embodiment of the present invention provides a semiconductor refrigeration device for a circulating cooling system, comprising: a plurality of heat exchange units alternately stacked with each other;
  • the heat exchange unit includes a semiconductor refrigeration layer, a heat dissipation cycle device attached to the heat dissipation surface of the semiconductor refrigeration layer, and an endothermic circulation device attached to the heat absorption surface of the semiconductor refrigeration layer;
  • the heat absorption cycle device is connected to a heat source, and the heat dissipation cycle device is connected to the heat dissipation device.
  • the semiconductor refrigerating layer is a plurality of horizontally laid semiconductor refrigerating sheets.
  • the heat dissipation cycle device is hollow, and the heat dissipation circulation device is provided with a recyclable heat transfer medium;
  • the endothermic circulation device is hollow, and the endothermic circulation device is provided with a recyclable heat transfer medium.
  • the heat dissipation cycle device is connected to the heat dissipation device through a heat dissipation circulation pipeline, and the heat dissipation device is an air cooling heat dissipation device.
  • the heat dissipation circulation pipeline includes a heat conduction medium tank and a heat transfer medium circulation pump, and the heat conduction medium tank, the heat conduction medium circulation pump, the heat dissipation circulation device, and the heat dissipation device form a heat dissipation circulation loop in series.
  • the air-cooling heat dissipating device comprises an air-cooled heat dissipating row and a fan, the heat dissipating row is provided with a heat dissipating fin, the fan is fixed on both sides of the heat dissipating fin, and the fan on both sides is in the same direction Turn.
  • the endothermic cycle device is connected to the heat source through an endothermic circulation line.
  • the heat absorption circulation pipeline includes a heat conduction medium tank and a heat transfer medium circulation pump, and the heat conduction medium tank, the heat conduction medium circulation pump, the heat dissipation circulation device, and the heat source are connected in series to form a heat dissipation circulation loop.
  • the heat transfer medium is a heat transfer oil or water.
  • the adjacent heat exchange units share a heat dissipation cycle device or an endothermic cycle device.
  • the semiconductor refrigeration device for a circulating cooling system provided by the embodiment of the invention adopts a multi-layer cold heat cross heat exchanger structure, which breaks through the limitation of installing a plurality of semiconductor refrigeration fins in a certain space in a conventional semiconductor refrigerator; While satisfying the large cooling power output, the device has a higher cooling energy efficiency ratio; improving the heat dissipation efficiency of the heat dissipation surface of the semiconductor refrigerator, and further ensuring that the semiconductor refrigerator has a higher cooling energy efficiency ratio.
  • the semiconductor refrigeration device for the circulating cooling system provided by the embodiment of the invention not only has a compact structure, but also has a cooling energy efficiency ratio of 100%-120%, which is far higher than the refrigeration energy efficiency ratio of the conventional semiconductor refrigerator product, and has a comparative High economic and social benefits.
  • FIG. 1 is a schematic view showing the connection of a semiconductor refrigeration device according to an embodiment of the present invention
  • FIG. 2 is a schematic structural view of a heat exchange unit according to an embodiment of the present invention.
  • FIG. 3 is a schematic exploded view of the semiconductor heat exchange unit shown in FIG. 2;
  • FIG. 4 is a schematic structural view of a semiconductor refrigeration device according to an embodiment of the present invention.
  • Figure 5 is a schematic structural view of a semiconductor refrigeration layer
  • Figure 6 is a schematic diagram of the layout of the semiconductor refrigeration layer refrigeration sheet
  • Figure 7 is a schematic diagram of the layout of the semiconductor refrigeration layer refrigeration sheet
  • Figure 8 is a schematic structural view of an endothermic cycle device and a heat dissipation cycle device
  • Figure 9 is a schematic diagram of the structure of the heat absorption cycle device and the heat dissipation cycle device
  • Figure 10 is a front elevational view of the heat-dissipating cycle device shown in Figure 8.
  • FIG 11 is a schematic view showing the internal structure of the heat-dissipating cycle device shown in Figure 8;
  • Figure 12 is a front elevational view of the heat-dissipating cycle device of Figure 9;
  • Figure 13 is a schematic view showing the internal structure of the heat-dissipating cycle device shown in Figure 9;
  • FIG. 14 is a schematic structural view of an extended semiconductor heat exchange unit of a semiconductor refrigeration device according to an embodiment of the present invention.
  • FIG. 15 is a schematic structural view of a semiconductor refrigeration device using the heat absorption cycle device and the heat dissipation cycle device shown in FIG. 8 according to an embodiment of the present invention
  • FIG. 16 is a schematic structural view of a semiconductor refrigeration device using the heat absorption cycle device and the heat dissipation cycle device shown in FIG. 9 according to an embodiment of the present invention
  • 17 is a schematic view showing the connection between a semiconductor refrigeration device and an air-cooling heat dissipation device according to an embodiment of the present invention
  • FIG. 18 is a schematic view showing the connection of a heat dissipation circulation pipeline according to an embodiment of the present invention.
  • FIG. 19 is a schematic structural view of an air-cooling heat dissipating device according to an embodiment of the present invention.
  • Figure 20 is a schematic view showing the connection of the endothermic circulation line of the embodiment of the present invention.
  • an embodiment of the present invention provides a system for a circulating cooling system.
  • the semiconductor refrigeration device includes: a plurality of heat exchange units 1 alternately stacked in a forward and reverse direction; wherein the heat exchange unit 1 includes a semiconductor refrigeration layer 10, a heat dissipation cycle device 11 attached to the heat dissipation surface 101 of the semiconductor refrigeration layer 10, and The heat absorbing circulating device 12 is attached to the heat absorbing surface 102 of the semiconductor refrigerating layer 10; the heat absorbing circulating device 12 is connected to the heat source 2, and the heat venting device is connected to the heat sink 3.
  • a semiconductor refrigeration apparatus for a circulating cooling system provided by an embodiment of the present invention will be described in detail below.
  • the semiconductor refrigerating layer 10 includes a plurality of semiconductor refrigerating sheets 100, and the plurality of semiconductor refrigerating sheets 100 may be connected in series or in parallel according to power supply requirements or actual conditions.
  • the semiconductor refrigerating layer 10 composed of the multi-chip semiconductor refrigerating sheet 100 includes a heat dissipating surface 101 and a heat absorbing surface 102, and the heat dissipating surfaces of the plurality of semiconductor refrigerating sheets 100 are in the same direction (the heat absorbing surface or the heat dissipating surface of all the semiconductor refrigerating sheets are in the same The direction) is horizontally laid to form the semiconductor refrigerating layer 10 having a large heat absorbing surface and a heat dissipating surface.
  • the semiconductor cooling layer 100 can be arranged in a single row or in a plurality of rows in consideration of the space and volume of the semiconductor refrigeration device.
  • the heat dissipation cycle device 11 attached to the heat dissipation surface 101 of the semiconductor refrigeration layer 10 and the heat absorption cycle device 12 bonded to the heat absorption surface 102 of the semiconductor refrigeration layer 10 are required to be in accordance with the heat dissipation surface 101 of the semiconductor refrigeration layer 10.
  • the area or the area of the heat absorbing surface 102 is adjusted accordingly.
  • the area of the contact surface of the heat-dissipating cycle device 11 and the semiconductor refrigerating layer 10 is the same as the area of the heat-dissipating surface of the semiconductor refrigerating layer 10, and the same endothermic cycle device 12 and
  • the area of the contact surface of the semiconductor refrigerating layer 10 is the same as the area of the heat absorbing surface of the semiconductor refrigerating layer 10.
  • the contact surface between the adjacent heat exchange units 1 is further coated with a thermal grease; preferably, the contact surface of the heat dissipation surface 101 of the semiconductor refrigerating layer 10 and the heat dissipation cycle device 11 is further coated.
  • the thermal grease is preferably coated with a thermal grease on the contact surface of the heat absorbing surface 102 of the semiconductor refrigerating layer 10 and the endothermic cycle device 12.
  • the heat dissipation cycle device 11 is preferably hollow, and the heat-dissipating circulating device 11 is provided with a recyclable heat-conducting medium; the endothermic circulating device 12 is hollow, and the endothermic circulating device 12 is provided with a recyclable heat-conducting medium.
  • the heat transfer medium may be an organic heat transfer medium or an inorganic heat transfer medium.
  • the heat transfer medium is preferably a heat transfer oil or water.
  • the heat-dissipating cycle device 11 and the endothermic cycle device 12 preferably employ the same structural components. The specific structure of the heat sink 11 will be described in detail below.
  • the heat dissipating device 11 has two planes which are parallel in parallel, so that the heat dissipating device 11 can better closely fit the heat dissipating surface of the semiconductor refrigerating layer 10.
  • the heat sink 11 in order to increase the contact area of the heat transfer medium in the heat sink 11 to remove the heat as quickly as possible, the heat sink 11 is hollow, and a labyrinth 111 is disposed inside the heat sink 11 , and the adjacent labyrinth is provided. A passage 112 through which the heat transfer medium flows is formed between 111.
  • the heat dissipating device 11 can set the heat transfer medium inlet 110 and the heat transfer medium outlet 120 at the same end or both ends of the heat dissipating device 11 according to actual needs.
  • the semiconductor refrigeration device for the circulating cooling system provided by the embodiment of the present invention adopts a plurality of heat exchange units 1 to be alternately stacked in a positive and negative manner, and can increase semiconductor cooling in a limited space.
  • the number of sheets 100 increases the cooling power of the semiconductor refrigeration unit and increases the energy efficiency ratio.
  • the semiconductor refrigeration device for the circulating cooling system provided by the embodiment of the present invention can longitudinally expand the heat exchange unit 1 according to actual needs to increase the cooling power of the semiconductor refrigeration device (for example, it can be added up and down in the existing heat exchange unit 1). Thermal unit 1). Further, as shown in FIGS.
  • the adjacent heat exchange unit 1 shares the heat radiation circulation device 11 or the heat absorption cycle device 12.
  • the space saved by this method can further increase the heat exchange unit, thereby improving the cooling power of the semiconductor refrigeration device and improving the energy efficiency ratio.
  • the heat sink 11 or the heat absorbing circulating device 12 of the plurality of heat units 1 may be connected in series by a pipe. As shown in FIG. 15, if the heat transfer medium inlet 110 and the heat transfer medium outlet 120 are respectively disposed at both ends of the heat sink 11 shown in FIG. 8, FIG. 10 and FIG.
  • the heat dissipation units of the plurality of heat exchange units 1 are mounted.
  • the two heat exchange units 1 are provided with connecting pipes at both ends thereof, which may be bulky.
  • FIG. 16 if the heat dissipating medium inlet 110 and the outlet 120 of the heat transfer medium are disposed at the same end of the heat dissipating device 11 shown in FIG. 9, FIG. 12, FIG. 13, the heat dissipating device 11 or the endothermic cycle of the plurality of heat exchanging units 1
  • the connection pipes are provided only at the same end of the plurality of heat exchange units 1, and the volume of the semiconductor refrigeration device shown in Fig. 15 is small.
  • the heat dissipation cycle device is connected to the heat dissipation device through a heat dissipation circulation pipe, and the heat dissipation device is an air-cooling heat dissipation device 30.
  • the heat dissipation circulation pipeline includes a heat transfer medium tank 31 and a heat transfer medium circulation pump 32, the heat transfer medium tank 31, a heat transfer medium circulation pump 31, the heat radiation circulation device 12, and the air cooling heat sink 30 series to form a heat cycle loop.
  • FIG. 18 the heat dissipation circulation pipeline includes a heat transfer medium tank 31 and a heat transfer medium circulation pump 32, the heat transfer medium tank 31, a heat transfer medium circulation pump 31, the heat radiation circulation device 12, and the air cooling heat sink 30 series to form a heat cycle loop.
  • the air-cooling heat dissipating device includes an air-cooling heat dissipating row and a fan, and the heat dissipating row is provided with a heat dissipating fin, and the fan is fixed on both sides of the heat dissipating fin, and the fan on both sides rotates in the same direction.
  • the endothermic cycle device is connected to the heat source through an endothermic circulation line.
  • the heat absorption circulation pipeline includes a heat transfer medium tank 21 and a heat transfer medium circulation pump 22, and the heat transfer medium tank 21, the heat transfer medium circulation pump 22, the heat absorption cycle device 11, and the heat source 2 are connected in series to form a heat dissipation circulation loop.
  • the semiconductor refrigeration device for a circulating cooling system adopts a multi-layer cold heat cross heat exchanger structure, and breaks through the number of semiconductor cooling fins installed in a certain space in a conventional semiconductor refrigerator. Limiting; enabling the semiconductor refrigerator to have a higher cooling energy efficiency ratio while satisfying a larger cooling power output; improving the heat dissipation efficiency of the heat sink surface of the semiconductor refrigerator, and further ensuring that the semiconductor refrigeration device has a higher cooling energy efficiency ratio.
  • the embodiment of the invention is not only compact but also easy to install. It also has a cooling energy efficiency ratio of 100%-120%, which is much higher than the refrigeration energy efficiency ratio of traditional semiconductor refrigerator products, and has high economic and social benefits.
  • the orientation or positional relationship of the terms “upper”, “lower” and the like is based on the orientation or positional relationship shown in the drawings, and is merely for the convenience of the description of the invention and the simplified description, rather than indicating or implying that the device or component referred to must be It is to be understood that the invention is not limited by the specific orientation and construction and operation.
  • the terms “mounted,” “connected,” and “connected” are used in a broad sense, and may be, for example, a fixed connection, a detachable connection, or an integral connection; it may be a mechanical connection, It can also be an electrical connection; it can be directly connected, or it can be connected indirectly through an intermediate medium, which can be the internal connection of two components.
  • the specific meanings of the above terms in the present invention can be understood on a case-by-case basis.
  • the semiconductor refrigeration device for a circulating cooling system adopts a multi-layer cold heat cross heat exchanger structure, which breaks through the limitation of installing a plurality of semiconductor refrigeration fins in a certain space in a conventional semiconductor refrigerator; While satisfying the large cooling power output, the device has a higher cooling energy efficiency ratio; improves the heat dissipation efficiency of the heat dissipation surface of the semiconductor refrigerator, and further ensures that the semiconductor refrigeration device has a higher cooling energy efficiency ratio.
  • the embodiment of the invention is not only compact but also easy to install. It also has a cooling energy efficiency ratio of 100%-120%, which is much higher than the refrigeration energy efficiency ratio of traditional semiconductor refrigerator products, has high economic and social benefits, and has industrial applicability.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Devices That Are Associated With Refrigeration Equipment (AREA)

Abstract

提供一种用于循环冷却系统的半导体制冷装置，包括：多个正反交替叠摞的换热单元（1），其中，换热单元（1）包括半导体制冷层（10）、贴合在半导体制冷层（10）散热面的散热循环装置（11）和贴合在半导体制冷层（10）吸热面的吸热循环装置（12），吸热循环装置（12）连接热源，散热循环装置（11）连接散热装置；采用多层冷热交叉换热器结构，突破传统半导体制冷器在一定空间内安装多片半导体制冷片（100）有数量的限制，使半导体制冷器在满足较大的制冷功率输出的同时，具有较高的制冷能效比，不仅结构紧凑，安装方便，还具有较高的经济效益和社会效益。

Description

一种用于循环冷却系统的半导体制冷装置
相关申请的交叉引用
本申请应用于2015年9月2日提交的专利名称为“一种用于循环冷却系统的半导体制冷装置”的第2015105562226号中国专利申请的优先权，这些专利申请的全部内容通过引用被结合于此。上述申请在此被引做参照。
技术领域
本发明实施例涉及半导体制冷技术领域，具体涉及一种用于循环冷却系统的半导体制冷装置。
背景技术
目前，公知的半导体制冷片是由半导体N型(以下称N型)和半导体P型(以下称P型)经导线连接，用2片导热体(一般为电绝缘的陶瓷片)分别粘在N型和P型的两端面组成。半导体制冷片工作时，N型和P型的散热面所放出的热量，经相对应的导热体向外界散发，N型和P型的吸热面所需吸收的热量，经导热体向外界吸收，其N型和P型的吸热面就有了制冷的功能。但是半导体制冷器效率低，原因是：N型和P型的散热面和吸热面，仅一个端面与导热体相连接，导致热传递的面积小；而且N型和P型的散热面和吸热面被放置在同一个空间内，又导致了其散热面和吸热面之间的热量相互干扰。要想提高半导器的制冷效率，就需要尽可能使散热面温度低，散热面的热传导速度越快、散热效果越好，吸热面温度越高，吸热面的制冷效果就越好。
现有技术中，用于循环冷却系统的半导体制冷器，一般都包括：半导体制冷片、水换热器、金属散热器、轴流风机等。制冷器中间部分为换热器，换热器两面为半导体制冷片的吸热面，TEC制冷片的散热面为铝合金散热器。系统水箱中的冷却用水，经循环泵流经水换热器被降温冷却，半导体制冷片散热面的热量由铝合金散热器加轴流 风机被散掉。现有技术中的体制冷器有以下缺陷：半导体制冷器中半导体制冷片的散热面靠铝合金散热器加轴流风机散热，而铝合金散热器体积大，而与半导体制冷片散热面可接触进行热交换的面积有限，安装半导体制冷片数量受限，不宜扩展系统制冷功率；铝合金散热器位于两侧平行分布，不易形成通畅的散热风道，散热效率低，从而严重影响半导体制冷片的制冷效率(40％-60％制冷能效比)；制冷器整体体积大，且安装位置受散热风道的限制，不便安装，浪费空间。
发明内容
本发明实施例要解决的技术问题是：如何在一定空间内安装多片半导体制冷片并改善散热条件提高制冷能效比。
为实现上述的发明目的，本发明实施例提供了一种用于循环冷却系统的半导体制冷装置，包括：多个正反交替叠摞的换热单元；
其中，所述换热单元包括半导体制冷层、贴合在半导体制冷层散热面的散热循环装置和贴合在半导体制冷层吸热面的吸热循环装置；
所述吸热循环装置连接热源，所述散热循环装置连接散热装置。
可选地，所述半导体制冷层是多片水平铺设的半导体制冷片。
可选地，所述散热循环装置中空，所述散热循环装置中通有可循环的导热介质；
所述吸热循环装置中空，所述吸热循环装置中通有可循环的导热介质。
可选地，所述散热循环装置通过散热循环管路连接所述散热装置，所述散热装置是风冷散热装置。
可选地，所述散热循环管路包括导热介质箱和导热介质循环泵，所述导热介质箱、导热介质循环泵、所述散热循环装置、所述散热装置串联形成散热循环回路。
可选地，风冷散热装置包括风冷散热排和风机，所述散热排上设置有散热鳍片，所述风机固定在所述散热鳍片两侧，两侧侧风机同向 转动。
可选地，所述吸热循环装置通过吸热循环管路连接所述热源。
可选地，所述吸热循环管路包括导热介质箱和导热介质循环泵，所述导热介质箱、导热介质循环泵、所述散热循环装置、所述热源串联形成散热循环回路。
可选地，所述导热介质为导热油或水。
可选地，相邻的所述换热单元共用散热循环装置或吸热循环装置。
本发明实施例提供的用于循环冷却系统的半导体制冷装置，采用多层冷热交叉换热器结构，突破传统半导体制冷器在一定空间内安装多片半导体制冷片有数量的限制；使半导体制冷器在满足较大的制冷功率输出的同时，具有较高的制冷能效比；提高半导体制冷器散热面的散热效率，进一步保证半导体制冷器较具有高的制冷能效比。本发明实施例提供的用于循环冷却系统的半导体制冷装置，不仅结构紧凑，安装方便还具有100％－120％的制冷能效比，远远高于传统的半导体制冷器产品制冷能效比，具有较高的经济效益和社会效益。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作一简单的介绍，显而易见地，下面描述中的附图是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是本发明实施例半导体制冷装置连接示意图；
图2是本发明实施例换热单元结构示意图；
图3是图2所示的半导体换热单元结构分解示意图；
图4是本发明实施例半导体制冷装置结构示意图；
图5是半导体制冷层结构示意图；
图6是半导体制冷层制冷片布设示意图之一；
图7是半导体制冷层制冷片布设示意图之二；
图8是吸热循环装置与散热循环装置结构示意图之一；
图9是吸热循环装置与散热循环装置结构示意图之二；
图10是图8所示散热循环装置正面图；
图11是图8所示散热循环装置内部结构示意图；
图12是图9所示散热循环装置正面图；
图13是图9所示散热循环装置内部结构示意图；
图14是本发明实施例半导体制冷装置扩展半导体换热单元结构示意图；
图15是本发明实施例采用图8所示吸热循环装置与散热循环装置的半导体制冷装置结构示意图；
图16是本发明实施例采用图9所示吸热循环装置与散热循环装置的半导体制冷装置结构示意图；
图17是本发明实施例半导体制冷装置与风冷散热装置连接示意图；
图18是本发明实施例散热循环管路连接示意图；
图19是本发明实施例风冷散热装置结构示意图；
图20是本发明实施例吸热循环管路连接示意图。
具体实施方式
为使本发明实施例的目的、技术方案和优点更加清楚，下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
如图1至图4所示，本发明实施例提供一种用于循环冷却系统的 半导体制冷装置，包括：多个正反交替叠摞的换热单元1；其中，所述换热单元1包括半导体制冷层10、贴合在半导体制冷层10的散热面101的散热循环装置11和贴合在半导体制冷层10的吸热面102的吸热循环装置12；所述吸热循环装置12连接热源2，所述散热循环装置连接散热装置3。下面对本发明实施例提供的用于循环冷却系统的半导体制冷装置展开详细的说明。
如图5、图6所示，在每个换热单元1中，半导体制冷层10包括多片半导体制冷片100，多片半导体制冷片100可以根据电源要求或实际情况串联或并联。多片半导体制冷片100组成的半导体制冷层10包括一个散热面101和一个吸热面102，多片半导体制冷片100的散热面同向(所有半导体制冷片的吸热面或散热面在同一个方向)水平铺设形成具有较大吸热面和散热面的的半导体制冷层10。如图7所示，一般半导体制冷层考虑到半导体制冷装置安装的空间及体积大小，半导体制冷片100可以采用单排设置或多排设置。相应地，贴合在半导体制冷层10的散热面101的散热循环装置11和贴合在半导体制冷层10的吸热面102的吸热循环装置12，均需要根据半导体制冷层10的散热面101的面积或吸热面102的面积做相应的调整。为了绝对的提高制冷效率，增加能效比，优选将散热循环装置11与所述半导体制冷层10的接触面的面积与半导体制冷层10的散热面的面积相同，同理吸热循环装置12与所述半导体制冷层10的接触面的面积与半导体制冷层10的吸热面的面积相同。在本发明实施例中，优选相邻的换热单元1之间的接触面上还涂有导热硅脂；优选在半导体制冷层10的散热面101与散热循环装置11的接触面上还涂有导热硅脂；优选在半导体制冷层10的吸热面102与吸热循环装置12的接触面上也涂有导热硅脂。
如图8、图9所示，为了进一步保证半导体制冷装置将热源的热量及时带走，尽可能提高制冷效率，提高能效比，所述散热循环装置 11优选中空，所述散热循环装置11中通有可循环的导热介质；所述吸热循环装置12中空，所述吸热循环装置12中通有可循环的导热介质。导热介质可以是有机导热介质，也可以是无机导热介质。导热介质优选是导热油或水。为了降低加工成本，散热循环装置11和吸热循环装置12优选采用相同的结构部件。下面以散热装置11为例对其具体结构详细说明。
如图8-图10所示，散热装置11具有上下平行的两个平面，使散热装置11更好的紧密贴合半导体制冷层10的散热面。如图11图13所示，为了加大散热装置11中导热介质的接触面积尽可能快速将热量带走，散热装置11中空设置，在散热装置11内部还设置有迷宫格111，相邻的迷宫111之间形成导热介质流过的通道112。如图8至图13所示，散热装置11可以根据实际需求将导热介质入口110和导热介质的出口120设置在散热装置11的同一端或两端。
如图4、图14至图16所示，本发明实施例提供的用于循环冷却系统的半导体制冷装置采用多个换热单元1正反交替叠摞，可以在有限的空间内多增加半导体制冷片100的数量，从而提高半导体制冷装置的制冷功率，提高能效比。采用本发明实施例提供的用于循环冷却系统的半导体制冷装置可以根据实际需要纵向扩展换热单元1，以增加半导体制冷装置的制冷功率(例如可以在现有的换热单元1的上下增设换热单元1)。另外如图15、图16所示，为进一步节约半导体制冷装置在纵向方向上的高度，相邻的所述换热单元1共用散热循环装置11或吸热循环装置12。通过这种方式节约的空间还可以进一步增加换热单元，从而提高半导体制冷装置的制冷功率，提高能效比。另外如图15、图16所示，多个换热单元1正反交替叠摞时，多个热单元1的散热装置11或吸热循环装置12可以通过管路串联。如图15所示，如果采用图8、图10、图11所示的散热装置11两端分别设置导热介质入口110和导热介质的出口120，多个换热单元1的散热装 置11或吸热循环装置12串联时，多个换热单元1的两端均设置有连接管路，可能体积较大。如图16所示，如果采用图9、图12、图13所示的散热装置11同一端设置导热介质入口110和导热介质的出口120，多个换热单元1的散热装置11或吸热循环装置12串联时，仅在多个换热单元1的同一端设置有连接管路，相对于图15所示的半导体制冷装置体积较小。
如图1、图17所示，所述散热循环装置通过散热循环管路连接所述散热装置，所述散热装置是风冷散热装置30。如图18所示，所述散热循环管路包括导热介质箱31和导热介质循环泵32，所述导热介质箱31、导热介质循环泵31、所述散热循环装置12、所述风冷散热装置30串联形成散热循环回路。如图19所示，风冷散热装置包括风冷散热排和风机，所述散热排上设置有散热鳍片，所述风机固定在所述散热鳍片两侧，两侧侧风机同向转动。
如图1、图20所示所述吸热循环装置通过吸热循环管路连接所述热源。所述吸热循环管路包括导热介质箱21和导热介质循环泵22，所述导热介质箱21、导热介质循环泵22、所述吸热循环装置11、所述热源2串联形成散热循环回路。
综上所述，本发明实施例提供的用于循环冷却系统的半导体制冷装置，采用多层冷热交叉换热器结构，突破传统半导体制冷器在一定空间内安装多片半导体制冷片有数量的限制；使半导体制冷器在满足较大的制冷功率输出的同时，具有较高的制冷能效比；提高半导体制冷器散热面的散热效率，进一步保证半导体制冷装置具备较高的制冷能效比。本发明实施例不仅结构紧凑，而且安装方便。还具有100％－120％的制冷能效比，远远高于传统的半导体制冷器产品的制冷能效比，具有较高的经济效益和社会效益。
需要说明的是，在本文中，诸如第一和第二等之类的关系术语仅仅用来将一个实体或者操作与另一个实体或操作区分开来，而不一定 要求或者暗示这些实体或操作之间存在任何这种实际的关系或者顺序。而且，术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含，从而使得包括一系列要素的过程、方法、物品或者设备不仅包括那些要素，而且还包括没有明确列出的其他要素，或者是还包括为这种过程、方法、物品或者设备所固有的要素。在没有更多限制的情况下，由语句“包括一个……”限定的要素，并不排除在包括所述要素的过程、方法、物品或者设备中还存在另外的相同要素。术语“上”、“下”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本发明和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本发明的限制。除非另有明确的规定和限定，术语“安装”、“相连”、“连接”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是机械连接，也可以是电连接；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本发明中的具体含义。
本发明的说明书中，说明了大量具体细节。然而能够理解的是，本发明的实施例可以在没有这些具体细节的情况下实践。在一些实例中，并未详细示出公知的方法、结构和技术，以便不模糊对本说明书的理解。类似地，应当理解，为了精简本发明公开并帮助理解各个发明方面中的一个或多个，在上面对本发明的示例性实施例的描述中，本发明的各个特征有时被一起分组到单个实施例、图、或者对其的描述中。然而，并不应将该公开的方法解释呈反映如下意图：即所要求保护的本发明要求比在每个权利要求中所明确记载的特征更多的特征。更确切地说，如权利要求书所反映的那样，发明方面在于少于前面公开的单个实施例的所有特征。因此，遵循具体实施方式的权利要求书由此明确地并入该具体实施方式，其中每个权利要求本身都作为 本发明的单独实施例。需要说明的是，在不冲突的情况下，本申请中的实施例及实施例中的特征可以相互组合。本发明并不局限于任何单一的方面，也不局限于任何单一的实施例，也不局限于这些方面和/或实施例的任意组合和/或置换。而且，可以单独使用本发明的每个方面和/或实施例或者与一个或更多其他方面和/或其实施例结合使用。
最后应说明的是：以上各实施例仅用以说明本发明的技术方案，而非对其限制；尽管参照前述各实施例对本发明进行了详细的说明，本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分或者全部技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本发明各实施例技术方案的范围，其均应涵盖在本发明的权利要求和说明书的范围当中。
工业实用性
本发明实施例提供的用于循环冷却系统的半导体制冷装置，采用多层冷热交叉换热器结构，突破传统半导体制冷器在一定空间内安装多片半导体制冷片有数量的限制；使半导体制冷器在满足较大的制冷功率输出的同时，具有较高的制冷能效比；提高半导体制冷器散热面的散热效率，进一步保证半导体制冷装置具备较高的制冷能效比。本发明实施例不仅结构紧凑，而且安装方便。还具有100％－120％的制冷能效比，远远高于传统的半导体制冷器产品的制冷能效比，具有较高的经济效益和社会效益，具备工业实用性。

Claims (10)

  1. 一种用于循环冷却系统的半导体制冷装置，其特征在于，包括：多个正反交替叠摞的换热单元；
    其中，所述换热单元包括半导体制冷层、贴合在半导体制冷层散热面的散热循环装置和贴合在半导体制冷层吸热面的吸热循环装置；
    所述吸热循环装置连接热源，所述散热循环装置连接散热装置。
  2. 如权利要求1所述的半导体制冷装置，其特征在于，所述半导体制冷层是多片水平铺设的半导体制冷片。
  3. 如权利要求1所述的半导体制冷装置，其特征在于，所述散热循环装置中空，所述散热循环装置中通有可循环的导热介质；
    所述吸热循环装置中空，所述吸热循环装置中通有可循环的导热介质。
  4. 如权利要求3所述的半导体制冷装置，其特征在于，所述散热循环装置通过散热循环管路连接所述散热装置，所述散热装置是风冷散热装置。
  5. 如权利要求4所述的半导体制冷装置，其特征在于，所述散热循环管路包括导热介质箱和导热介质循环泵，所述导热介质箱、导热介质循环泵、所述散热循环装置、所述散热装置串联形成散热循环回路。
  6. 如权利要求4所述的半导体制冷装置，其特征在于，风冷散热装置包括风冷散热排和风机，所述散热排上设置有散热鳍片，所述风机固定在所述散热鳍片两侧，两侧侧风机同向转动。
  7. 如权利要求3所述的半导体制冷装置，其特征在于，所述吸热循环装置通过吸热循环管路连接所述热源。
  8. 如权利要求7所述的半导体制冷装置，其特征在于，所述吸热循环管路包括导热介质箱和导热介质循环泵，所述导热介质箱、导热介质循环泵、所述散热循环装置、所述热源串联形成散热循环回路。
  9. 如权利要求3所述的半导体制冷装置，其特征在于，所述导热介质为导热油或水。
  10. 如权利要求1所述的半导体制冷装置，其特征在于，相邻的所述换热单元共用散热循环装置或吸热循环装置。
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