WO2017036089A1 - 显示面板及其制作方法 - Google Patents

显示面板及其制作方法 Download PDF

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Publication number
WO2017036089A1
WO2017036089A1 PCT/CN2016/073039 CN2016073039W WO2017036089A1 WO 2017036089 A1 WO2017036089 A1 WO 2017036089A1 CN 2016073039 W CN2016073039 W CN 2016073039W WO 2017036089 A1 WO2017036089 A1 WO 2017036089A1
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WIPO (PCT)
Prior art keywords
display panel
substrate
support member
height
sealant
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2016/073039
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English (en)
French (fr)
Inventor
杨凡
郭坤
杨玉清
刘祺
张博
陈飞
承天一
李子华
吴岩
杨津
彭利满
孔超
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BOE Technology Group Co Ltd
Ordos Yuansheng Optoelectronics Co Ltd
Original Assignee
BOE Technology Group Co Ltd
Ordos Yuansheng Optoelectronics Co Ltd
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Publication date
Application filed by BOE Technology Group Co Ltd, Ordos Yuansheng Optoelectronics Co Ltd filed Critical BOE Technology Group Co Ltd
Priority to US15/321,172 priority Critical patent/US10199295B2/en
Publication of WO2017036089A1 publication Critical patent/WO2017036089A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1339—Gaskets; Spacers; Sealing of cells
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133351—Manufacturing of individual cells out of a plurality of cells, e.g. by dicing
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H10W70/692—Ceramics or glasses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/17—Containers or parts thereof characterised by their materials
    • H10W76/18—Insulating materials, e.g. resins, glasses or ceramics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
    • H10W76/42—Fillings
    • H10W76/47—Solid or gel fillings

Definitions

  • the present disclosure relates to the field of display technologies, and in particular, to a display panel and a method of fabricating the same.
  • FIG. 1 is a schematic diagram of a process of cutting a display panel into a sub-display panel according to the related art. As shown in Figure 1, Q-Glass needs to be cut into 50 small panels (labeled AA-EK). First, Q-Glass is cut into 5 lines (ie, A line, B line, C line, D line, and E line). Next, each row is cut into 10 Panels.
  • the cover glass at the position of the dotted frame needs to be cut off to expose the integrated circuit (IC) Teg area, where Teg
  • the input and IC input are two different signal giving methods. Teg is the input end of the ET lighting signal used for the yield statistics.
  • the IC is the FPC (Flexible Printed Circuit) that needs to be attached in the subsequent module process. ) the input. If the IC on the backplane glass (BP glass) is damaged, the circuit corresponding to the IC will also be scratched. Even if the FPC is attached, there will be circuit failures such as different display, split screen, X-Line or Y-Line. happened.
  • the main object of the present disclosure is to provide a display panel and a method of fabricating the same, aiming at solving the technical problem of how to reduce the reduction of glass debris during manual operation to reduce the probability of scratching the IC.
  • the present disclosure provides a display panel including a first substrate and a second substrate disposed opposite to each other, and a non-display area of the first substrate is provided with an integrated circuit (IC), the non-display A region other than the set region of the IC in the display region is further provided with a support member having a height greater than a height of the IC.
  • IC integrated circuit
  • the support member has a shape of a cylinder or a rectangular parallelepiped.
  • the diameter of the cylinder is 0.2 mm.
  • the number of the support members is two, and the edge positions of the non-display areas are distributed.
  • the support member is made of a glass glue material.
  • an edge of the display area of the first substrate is coated with a frame-shaped sealant.
  • the height of the support member is the same as the height of the sealant.
  • the distance that the support member extends from the first substrate in the first direction is greater than the distance that the IC extends from the first substrate in the first direction; wherein the first direction is perpendicular to The first substrate is directed from the first substrate to the second substrate.
  • the IC is not in contact with the second substrate.
  • the sealant is a glass glue.
  • the present disclosure also provides a method of fabricating a display panel, the method comprising: forming a first substrate and a second substrate disposed opposite to each other, wherein the step of forming the first substrate comprises: non-displaying on the first substrate
  • the area forms an integrated circuit (IC); a region other than the set area of the IC in the non-display area forms a support member, the height of the support member being greater than the height of the IC.
  • IC integrated circuit
  • the support component is a coated glass glue
  • the display area of the first substrate is further coated with a sealant
  • the height of the support component is the same as the height of the sealant
  • the support The part and the frame sealant are simultaneously coated by the same process.
  • the sealant is a glass glue.
  • the method for manufacturing the display panel further comprises: performing the laser hardening process on the coated encapsulant.
  • the display panel and the manufacturing method thereof of the present disclosure can reduce manual In addition to the possibility that the glass debris generated during the operation of the second substrate on the upper portion of the IC causes scratching of the IC, the influence on the subsequent module process is reduced, thereby reducing the undesirable ratio of the display after the completion of the module process.
  • FIG. 1 is a schematic view showing a process of cutting a display panel into a sub display panel according to the related art
  • FIG. 2 is a top plan view of a sub display panel in which a display panel is cut to provide a support member, in accordance with some embodiments of the present disclosure
  • FIG. 3 is a side view of a sub display panel in which a display panel is cut to provide a support member, in accordance with some embodiments of the present disclosure
  • FIG. 4 is a schematic flow chart of a method for fabricating a display panel according to some embodiments of the present disclosure
  • FIG. 5 is a top plan view of a sub display panel in which a display panel is cut and a support member and a sealant are cut in accordance with some embodiments of the present disclosure.
  • FIG. 6 is a side view of a sub display panel in which a display panel is cut and a support member and a sealant are cut in accordance with some embodiments of the present disclosure.
  • the main purpose of the present disclosure is to solve the problem that the manual operation itself is easy to scratch the IC in the non-display area of the panel when the IC side glass is peeled off by manual operation in the POST process, and a Frit glue is applied on both sides of the IC.
  • the design method of the glass glue causes the package glass and the back glass to be hollowed out above and around the IC, thereby achieving the technical effect of reducing the occurrence of IC scratches during the process of protecting the IC from glass peeling in the POST process.
  • some embodiments of the present disclosure provide a display panel that can be cut into a plurality of sub-display panels.
  • FIG. 2 is a schematic diagram showing the front position of the support member in the sub display panel cut by the display panel according to some embodiments of the present disclosure
  • FIG. 3 is some implementations according to the present disclosure.
  • the side of the sub display panel cut into the display panel is provided with the side of the support member Location map).
  • the display panel includes a first substrate and a second substrate disposed opposite to each other, and a non-display area of the first substrate is provided with an IC1, and an area of the non-display area other than the set area of the IC 1 is further provided
  • the support member 2 has a height greater than a height of the IC 1.
  • the support member 2 since the support member 2 is provided outside the IC 1 installation area, the support member 2 can form an effective support and cushioning function during the operation of manually removing the second substrate (cover) on the upper portion of the IC 1. The probability of scratching the IC 1 caused by the glass debris generated when the cover is removed is reduced, thereby contributing to the good effect of protecting the IC 1.
  • the shape of the support member 2 may be cylindrical or cuboid. These shapes are relatively common and are more in line with the design requirements of the substrate bonding process. Of course, in practical applications, any other feasible design shape can be adopted, as long as the support member 2 that meets the design does not surround the IC 1 or IC 1 . The signal line can be affected.
  • the shape of the support member 2 is cylindrical, because the cylindrical member occupies less space and the supporting force is sufficient to meet the needs of the substrate bonding, and the selection of the position is also flexible.
  • the diameter of the cylinder is 0.2 mm.
  • the area of the non-display area of each sub-display panel is relatively small, and the IC 1 occupies a certain area. In order not to affect the working state of the IC 1, the part of the area cannot be set.
  • a cylindrical design with a small footprint and sufficient supporting force is used here, it is still necessary to define the bottom area of the cylinder to a certain extent.
  • the value of 0.2 mm is selected from the actual process. Considering the starting point, of course, if the supporting force is sufficient to meet the design requirements, a value of less than 0.2 mm can be used as the diameter of the bottom surface of the cylinder. In this regard, some embodiments of the present disclosure are not limited.
  • the number of the support members 2 is two, and the edge positions of the non-display areas are distributed. With such a design, it is possible to form an effective support with a small footprint and a good balance.
  • the support member 2 is made of a glass glue material.
  • Glass glue is a commonly used bonding material in the substrate bonding process.
  • the glass glue has good adhesion when it is just coated, and has high toughness after hardening. Due to the advantages, the support member 2 is formed.
  • the process of coating the glass glue can be adopted to avoid the effect of increasing the complexity of the process.
  • the edge of the display area of the first substrate is coated with a frame-shaped sealant 3, for example, in some embodiments, the frame may be arranged as shown in FIGS. 5 and 6.
  • Glue 3 As is well known, for the first substrate as the back sheet, before the cutting process, the display area thereof needs to meet the requirements of cutting into a plurality of sub-display panels, and each sub-display panel necessarily has a display area (for convenience of description, Referring to the sub-display area), that is, the entire display area of the first substrate is composed of a plurality of sub-display areas, so that it is required to provide a sealing member at the edge position of each sub-display area, in the actual process.
  • the frame sealant 3 is usually used.
  • the sealant 3 is also made of glass glue, that is, the same material as the support member 2 is formed.
  • the height of the support member 2 is the same as the height of the sealant 3 .
  • the support member 2 and the sealant 3 can be made of the same material, such as glass glue, the same process is used to simultaneously form the support member 2 on the cover plate.
  • the height of the sealant 3 is naturally the same.
  • some embodiments of the present disclosure further provide a display panel manufacturing method, and the display panel manufactured by the method can be cut into a plurality of sub-display panels.
  • the display panel manufacturing method includes the steps of forming a first substrate and a second substrate disposed opposite to each other. To facilitate understanding of the steps of forming the first substrate, further description will be made below in conjunction with FIG.
  • step S402 - step S404 is a schematic flow chart of a method for fabricating a display panel according to some embodiments of the present disclosure.
  • the step of forming a first substrate includes the following steps (step S402 - step S404):
  • Step S402 the non-display area of the first substrate forms an IC
  • Step S404 forming a support member in a region other than the set region of the IC in the non-display area, the height of the support member being greater than the height of the IC.
  • the support member may be formed by applying a glass glue, and the sealant may be applied to the display area of the first substrate.
  • the support member and the cover are The sealant is simultaneously coated, so that the height of the support member and the height of the sealant can be the same. It should be noted that the coated frame sealant needs to be subjected to a laser inhardening process, and the support member is not required.
  • the specific dispensing method may be to open two circular holes with a diameter of 0.2 mm at a predetermined position on the metal screen for printing the glass glue (for example, the position corresponding to the teg), and form a rubber edge on the printing glass.
  • the glass glue is also applied at the two round holes, and then the package glass and the back are The plate glass is laminated, and finally the PAIN process is used to cut the laminated large Panel (the entire display panel) to form a small panel (ie, the above-mentioned sub-display panel), because there is a glass glue between the package glass and the back plate glass (Frit The glue is supported and the glass glue is not subjected to laser hardening, so the glass glue can act as a rubber pad, which can reduce the difficulty when peeling off the package glass above the non-display area, and the maximum possible avoidance of scratching the IC and increasing the entire backlight Module yield.

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Abstract

一种显示面板及其制作方法。其中，所述显示面板包括：相对设置的第一基板和第二基板，所述第一基板的非显示区域设置有集成电路(IC)，所述非显示区域中除所述IC的设置区域之外的区域还设置有支撑部件（2），所述支撑部件（2）的高度大于所述IC的高度。

Description

显示面板及其制作方法
相关申请的交叉引用
本申请主张在2015年8月31日在中国提交的中国专利申请号No.201510548248.6的优先权，其全部内容通过引用包含于此。
技术领域
本公开涉及显示技术领域，尤其是涉及一种显示面板及其制作方法。
背景技术
切割(POST)工艺是把一个整块的玻璃(Q-Glass)切割成多个小块玻璃(Panel)。请参考图1，图1是根据相关技术的显示面板切割成子显示面板的处理示意图。如图1所示，需要将Q-Glass切成50个小的Panel(标号分别为AA-EK)。首先，将Q-Glass切割成5行(即，A行、B行、C行、D行和E行)。接着，将每一行切割成10个Panel，对于A行来说，其包括AA-AJ，同时需要将虚线框位置处的盖板玻璃切掉，露出集成电路(IC)Teg区域位置，其中，Teg输入和IC输入是两种不同的信号给予方式，Teg是用于进行良率统计的ET点灯信号的输入端，IC是后续模组工艺中需要贴合的FPC(Flexible Printed Circuit，柔性印刷电路板)的输入端。如果背板玻璃(BP玻璃)上的IC有损伤，则对应IC的线路也就会划伤，即使贴上FPC，也会有异显、分屏、X-Line或者Y-Line等电路不良情况的发生。
现阶段的POST工艺中，需要人工进行协助，在自动将Q-Glass切割成5行之后，需要人工手动从切割设备中取出一行重新放入切割设备进行单个Panel的切割，同时需要人工手动去除图1中虚线框位置处的盖板玻璃，在该人工操作过程中产生的玻璃碎屑会对IC造成划伤。而且，目前除了人工检测方式并无其它的有效应对方案来检测IC划伤，而人工检测方式存在很大的误差导致检测成功率很低。
因此，如何控制人工操作过程中玻璃碎屑的减少以降低对IC造成划伤的概率成为亟待解决的问题。
发明内容
本公开的主要目的在于提供一种显示面板及其制作方法，旨在解决如何控制人工操作过程中玻璃碎屑的减少以降低对IC造成划伤的概率的技术问题。
为了达到上述目的，本公开提供了一种显示面板，所述显示面板包括相对设置的第一基板和第二基板，所述第一基板的非显示区域设置有集成电路(IC)，所述非显示区域中除所述IC的设置区域之外的区域还设置有支撑部件，所述支撑部件的高度大于所述IC的高度。
可选的，所述支撑部件的形状为圆柱形或长方体形。
可选的，当所述支撑部件的形状为圆柱形时，圆柱的直径为0.2mm。
可选的，所述支撑部件的个数为两个，且分布所述非显示区域的边缘位置处。
可选的，所述支撑部件为玻璃胶材料制成。
可选的，所述第一基板的显示区域的边缘涂布有边框形状的封框胶。
可选的，所述支撑部件的高度与所述封框胶的高度相同。
可选的，所述支撑部件自所述第一基板沿第一方向延伸的距离大于所述IC自所述第一基板沿所述第一方向延伸的距离；其中，所述第一方向垂直于所述第一基板并从所述第一基板指向所述第二基板。
可选的，所述IC与所述第二基板不接触。
可选的，所述封框胶为玻璃胶。
本公开还提供了一种显示面板制作方法，所述方法包括：形成相对设置的第一基板和第二基板的步骤，其中，形成第一基板的步骤包括：在所述第一基板的非显示区域形成集成电路(IC)；在所述非显示区域中除所述IC的设置区域之外的区域形成支撑部件，所述支撑部件的高度大于所述IC的高度。
可选的，所述支撑部件为涂布的玻璃胶，所述第一基板的显示区域还涂布有封框胶，所述支撑部件的高度与所述封框胶的高度相同，所述支撑部件与所述封框胶使用同一工艺同时涂布形成。
可选的，所述封框胶为玻璃胶。
可选的，所述显示面板制作方法还包括：将涂布的所述封装胶进行激光硬结工艺。
与现有技术相比，本公开所述的显示面板及其制作方法，可以降低人工去 除IC上部的第二基板的操作过程中产生的玻璃碎屑对IC造成划伤的概率，减少对后续模组工艺的影响，从而降低模组工艺完成后异显的不良比率。
附图说明
图1是根据相关技术中显示面板切割成子显示面板的处理示意图；
图2是根据本公开的一些实施例的显示面板切割成的设置支撑部件的子显示面板的俯视图；
图3是根据本公开的一些实施例的显示面板切割成的设置支撑部件的子显示面板的侧视图；
图4是根据本公开的一些实施例的显示面板制作方法流程示意图；
图5是根据本公开的一些实施例的显示面板切割成的设置支撑部件和封框胶的子显示面板的俯视图
图6是根据本公开的一些实施例的显示面板切割成的设置支撑部件和封框胶的子显示面板的侧视图。
具体实施方式
下面将结合本公开的实施例中的附图，对本公开实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本公开的一部分实施例，而不是全部的实施例。基于本公开中的实施例，本领域的普通技术人员在没有做出创造性劳动的前提下所获得的所有其他实施例，都属于本公开保护的范围。
本公开的主要目的是针对POST工艺中采用人工操作对IC侧玻璃进行剥离时，人工操作本身容易对Panel的非显示区域的IC造成划伤的问题，提出一种在IC两侧点涂Frit胶(玻璃胶)的设计方法，从而使得封装玻璃与背板玻璃在IC上方与周围产生镂空，达到保护IC在POST工艺进行玻璃剥离的过程中减少IC划伤发生的技术效果。
为达到上述目的，本公开的一些实施例提供了一种显示面板，该显示面板能够切割成多个子显示面板。
为便于理解，请同时参考图2和图3(图2是根据本公开的一些实施例的显示面板切割成的子显示面板中设置支撑部件的正面位置示意图，图3是根据本公开的一些实施例的显示面板切割成的子显示面板中设置支撑部件的侧面 位置示意图)。
所述显示面板包括相对设置的第一基板和第二基板，所述第一基板的非显示区域设置有IC1，所述非显示区域中除所述IC 1的设置区域之外的区域还设置有支撑部件2，所述支撑部件2的高度大于所述IC 1的高度。
在该显示面板中，由于IC 1设置区域之外设置有支撑部件2，在人工去除IC 1上部的第二基板(盖板)的操作过程中，支撑部件2可以形成有效的支撑和缓冲作用，降低去除盖板时产生的玻璃碎屑划伤IC 1的概率，从而起到了保护IC 1良好效果。
在本公开的一些实施例中，所述支撑部件2的形状可以为圆柱形或长方体形。这几种形状是比较常见的，比较符合基板贴合工艺的设计要求，当然在实际应用，可以采用其它任何可行的设计形状，只要满足设计的支撑部件2不会对IC 1或IC 1周围的信号线路产生影响即可。
在实际应用中，可以优选支撑部件2的形状为圆柱形，这是因为圆柱形的部件占用空间较少且形成的支撑力足够满足基板贴合的需求，设置位置的选取也较为灵活。
在本公开的一些实施例中，当所述支撑部件2的形状设计为圆柱形时，圆柱的直径为0.2mm。对于由上述显示面板切割成的多个子显示面板，每个子显示面板的非显示区域的面积比较小，IC 1占用一定区域，为了不影响IC 1的工作状态，该部分区域是无法设置所述支撑件的，虽然这里采用了占用面积较小且能形成足够支撑力的圆柱形设计方式，但仍然有必要对该圆柱的底面积作出一定程度的限定，0.2mm这一值的选取是从实际工艺出发考虑的，当然如果支撑力足够满足设计需求，完全可以使用小于0.2mm的值作为圆柱的底面直径。对此，本公开的一些实施例并不作出限定。
在使用圆柱形的设计方式时，所述支撑部件2的个数为两个，且分布所述非显示区域的边缘位置处。采用这样的设计方式，能够形成占用空间较小且平衡力较好的的有效支撑。
在本公开的一些实施例中，所述支撑部件2为玻璃胶材料制成。玻璃胶是基板贴合工艺中较为常用的粘合材料，玻璃胶在刚涂布时粘合性较好，在硬化后韧度较强，由于这些优点的存在，在形成所述支撑部件2时，可以采用涂布玻璃胶的工艺流程，达到了避免增加工艺复杂度的效果。
在本公开的一些实施例中，所述第一基板的显示区域的边缘涂布有边框形状的封框胶3，例如，在一些实施例中，可按照图5和图6所示设置封框胶3。众所周知，对于作为背板的第一基板而言，在进行切割工艺之前，其显示区域是需要满足切割成多个子显示面板的要求，每个子显示面板必然都具有一个显示区域(为了描述方便，可以称之为子显示区域)，也就是说，第一基板的整个显示区域是由多个子显示区域构成的，这样就要求在每个子显示区域的边缘位置设置有形成封闭作用的部件，在实际工艺中，通常采用上述封框胶3，实际应用中，上述封框胶3也多采用玻璃胶，即与形成所述支撑部件2的材料相同。
在本公开的一些实施例中，所述支撑部件2的高度与所述封框胶3的高度相同。显然，这样的设计方式是具有很多优点的，由于所述支撑部件2与所述封框胶3均可以采用相同的材料，例如玻璃胶，因此使用同一工艺同时在盖板上形成支撑部件2和所述封框胶3，二者的高度自然也就相同了。
对应于上述显示面板，本公开的一些实施例还提供了一种显示面板制作方法，通过该方法制作的显示面板能够切割成多个子显示面板。该显示面板制作方法包括：形成相对设置的第一基板和第二基板的步骤。为便于理解形成第一基板的步骤，以下结合图4进行进一步的描述。
图4是根据本公开的一些实施例的显示面板制作方法流程示意图，如图4所示，形成第一基板的步骤包括以下步骤(步骤S402-步骤S404)：
步骤S402、所述第一基板的非显示区域形成IC；
步骤S404、在所述非显示区域中除所述IC的设置区域之外的区域形成支撑部件，所述支撑部件的高度大于所述IC的高度。
在该显示面板制作方法中，形成所述支撑部件时可以采用涂布玻璃胶的方式，还可以在所述第一基板的显示区域涂布封框胶，当然，所述支撑部件与所述封框胶同时涂布形成，这样的话，所述支撑部件的高度与所述封框胶的高度可以相同。需要说明的是，涂布后的封框胶是需要进行激光硬结工艺的，而支撑部件并不需要。
在实际工艺中，具体点胶的方式可以是在用于印刷玻璃胶的金属网版上预定位置(例如对应teg的位置)处开两个直径为0.2mm的圆孔，在印刷玻璃胶边形成框封装的同时，在两个圆孔位置也点涂玻璃胶，然后再将封装玻璃与背 板玻璃进行贴合，最后使用POST工艺对贴合好的大Panel(整个显示面板)进行切割，最终形成小Panel(即上述子显示面板)，由于封装玻璃与背板玻璃中间有玻璃胶(Frit胶)支撑且该玻璃胶并没有经过激光硬结，因此该玻璃胶能够起一个胶垫作用，剥离非显示区域上方的封装玻璃时可以降低难度，最大可能的避免对IC的划伤，增加整个背光模组的良率。
以上所述是本公开的优选实施方式，应当指出，对于本领域的普通技术人员来说，在不脱离本公开所述原理的前提下，还可以做出若干改进和润饰，这些改进和润饰也应视为包含在本公开的保护范围之内。

Claims (14)

  1. 一种显示面板，所述显示面板包括相对设置的第一基板和第二基板，所述第一基板的非显示区域设置有集成电路(IC)，其中：
    所述非显示区域中除所述IC的设置区域之外的区域还设置有支撑部件，所述支撑部件的高度大于所述IC的高度。
  2. 根据权利要求1所述的显示面板，其中，所述支撑部件的形状为圆柱形或长方体形。
  3. 根据权利要求2所述的显示面板，其中，当所述支撑部件的形状为圆柱形时，圆柱的直径为0.2mm。
  4. 根据权利要求3所述的显示面板，其中，所述支撑部件的个数为两个，且分布所述非显示区域的边缘位置处。
  5. 根据权利要求1所述的显示面板，其中，所述支撑部件为玻璃胶材料制成。
  6. 根据权利要求5所述的显示面板，其中，所述第一基板的显示区域的边缘涂布有封框胶。
  7. 根据权利要求6所述的显示面板，其中，所述支撑部件的高度与所述封框胶的高度相同。
  8. 根据权利要求1所述的显示面板，其中，所述支撑部件自所述第一基板沿第一方向延伸的距离大于所述IC自所述第一基板沿所述第一方向延伸的距离；
    其中，所述第一方向垂直于所述第一基板并从所述第一基板朝指向所述第二基板。
  9. 根据权利要求1所述的显示面板，其中，所述IC与所述第二基板不接触。
  10. 根据权利要求6所述的显示面板，其中，所述封框胶为玻璃胶。
  11. 一种显示面板制作方法，包括：形成相对设置的第一基板和第二基板的步骤，其中，形成第一基板的步骤包括：
    在所述第一基板的非显示区域形成集成电路(IC)；
    在所述非显示区域中除所述IC的设置区域之外的区域形成支撑部件，所 述支撑部件的高度大于所述IC的高度。
  12. 根据权利要求8所述的所述显示面板制作方法，其中：
    所述支撑部件为涂布的玻璃胶，所述第一基板的显示区域还涂布有封框胶，所述支撑部件的高度与所述封框胶的高度相同，所述支撑部件与所述封框胶使用同一工艺同时涂布形成。
  13. 根据权利要求12所述的所述显示面板制作方法，其中，所述封框胶为玻璃胶。
  14. 根据权利要求13所述的所述显示面板制作方法，还包括：将涂布的所述封装胶进行激光硬结工艺。
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