WO2017033329A1 - Control board device and outdoor unit of air conditioner - Google Patents

Control board device and outdoor unit of air conditioner Download PDF

Info

Publication number
WO2017033329A1
WO2017033329A1 PCT/JP2015/074226 JP2015074226W WO2017033329A1 WO 2017033329 A1 WO2017033329 A1 WO 2017033329A1 JP 2015074226 W JP2015074226 W JP 2015074226W WO 2017033329 A1 WO2017033329 A1 WO 2017033329A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat
thermistor
control board
wiring board
board device
Prior art date
Application number
PCT/JP2015/074226
Other languages
French (fr)
Japanese (ja)
Inventor
賢太郎 米原
和穂 伊藤
竹内　裕人
Original Assignee
三菱電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三菱電機株式会社 filed Critical 三菱電機株式会社
Priority to CN201590000359.7U priority Critical patent/CN206259340U/en
Priority to PCT/JP2015/074226 priority patent/WO2017033329A1/en
Priority to JP2017536148A priority patent/JP6362787B2/en
Publication of WO2017033329A1 publication Critical patent/WO2017033329A1/en

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/32—Holders for supporting the complete device in operation, i.e. detachable fixtures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements

Definitions

  • the present invention relates to a control board device having a wiring board on which a heat generating component or the like is mounted, and an outdoor unit of an air conditioner.
  • Some outdoor units of conventional air conditioners have a control board device in which a wiring board on which a heat generating component is mounted is attached to a board holder (for example, see Patent Document 1).
  • the control board device of Patent Document 1 incorporates a heat dissipation member that dissipates heat generated from the heat generation member, and a temperature detection thermistor including a heat sensing unit is fixed to the heat dissipation member.
  • the thermistor is fixed between the wiring board and the heat dissipation member by inserting a screw into a mounting hole connected to the heat sensing unit and screwing the screw into the screw hole of the heat dissipation member.
  • the heat sensing part of the thermistor has electrical conductivity
  • the heat sensing part of the thermistor floats up and is formed on the surface of the wiring board. May come into contact.
  • the wiring board may be short-circuited.
  • the present invention has been made to solve the above-described problems, and provides a control board device and an outdoor unit of an air conditioner that prevent a heat sensing part of a thermistor from coming into contact with a wiring board. Objective.
  • a control board device includes a wiring board having a heat generating component mounted on one surface thereof, a heat dissipating member disposed opposite to one surface of the wiring board and dissipating heat generated from the heat generating component, and a heat dissipating member.
  • a thermistor that is fixed to the opposite surface opposite to one surface and detects the temperature of the heat dissipation member, and a substrate holder that fixes the wiring substrate and the heat dissipation member by keeping a certain distance between the wiring substrate and the heat dissipation member.
  • the thermistor is conductive and has a heat sensing part for sensing the heat of the heat dissipating member, and the substrate holder is insulative and contacts between the wiring board and the heat sensing part.
  • a prevention part is provided.
  • the insulating substrate holder since the insulating substrate holder includes a contact prevention unit interposed between the wiring board and the heat sensing unit, the heat sensing unit of the thermistor can be prevented from coming into contact with the wiring substrate. it can.
  • FIG. 1 It is a disassembled perspective view which shows the schematic structure which looked at the inside of the outdoor unit of the air conditioning harmony device which concerns on embodiment of this invention from the front side. It is a perspective view which shows the state which attached the control board apparatus to the electrical component box of FIG. It is a disassembled perspective view explaining the assembly of the control board apparatus of FIG. It is a schematic sectional drawing which shows the control board apparatus of FIG. It is a top view which shows the thermistor of FIG. It is a side view which shows the heat
  • FIG. 1 is an exploded perspective view showing a schematic configuration of an interior of an outdoor unit of an air conditioner according to an embodiment of the present invention as viewed from the front side.
  • FIG. 2 is a perspective view showing a state in which the control board device is attached to the electric component box of FIG.
  • FIG. 3 is an exploded perspective view illustrating assembly of the control board device of FIG.
  • FIG. 4 is a schematic cross-sectional view showing the control board device of FIG.
  • the interior of the outdoor unit 9 of the air conditioner is divided into two by a partition plate 11 erected from the back side to the front side, and the left side stores a heat exchanger 10, a blower (not shown), and the like.
  • the right side is a machine room that houses the compressor 12 and the like.
  • the outdoor unit 9 of the air conditioner has an electrical component box 15 that houses the control board device 14 at the upper part of the machine room.
  • the control board device 14 is attached to the electrical component box 15 in the state shown in FIG. It is done.
  • the compressor 12 is provided in the lower part of the machine room.
  • the outdoor unit 9 of an air conditioner has a plurality of expansion valves (not shown) made of, for example, electromagnetic valves.
  • the heat exchanger 10 is erected so as to surround the blower from the left side surface side to the back side of the outdoor unit 9.
  • a suction port (not shown) for sucking air to be cooled or heated by the heat exchanger 10 is formed.
  • the control board device 14 is made of a printed board or the like, and includes a wiring board 1 on which various parts are mounted, and a heat generating component attached to a plate surface 1 c that is one side of the wiring board 1. 3, a heat radiating member 4 made of, for example, a heat radiating fin, a thermistor 6 that detects the temperature of the heat radiating member 4, and a substrate holder 13 that is attached in a state in which the wiring board 1 and the heat radiating member 4 are kept at a constant interval.
  • a heat radiating member 4 made of, for example, a heat radiating fin
  • a thermistor 6 that detects the temperature of the heat radiating member 4
  • a substrate holder 13 that is attached in a state in which the wiring board 1 and the heat radiating member 4 are kept at a constant interval.
  • the wiring board 1 is provided with two leg mounting holes 1b for mounting the heat generating component 3 at two locations.
  • the heat generating component 3 has two mounting feet 2 and a component mounting hole 3 a for mounting to the heat radiating member 4.
  • the heat generating component 3 is attached to the wiring board 1 by inserting the two attachment feet 2 into the two foot attachment holes 1b and soldering the inserted portions. Thereby, the heat generating component 3 is electrically connected to the wiring of the wiring board 1 and the like.
  • the control board device 14 controls the operation and stop of the compressor 12, the operation and stop of the blower, and the opening and closing of each expansion valve in a state where the heat generating component 3 and the like are mounted on the wiring board 1.
  • the wiring board 1 is provided with a punched hole 1 a used when the heat generating component 3 is attached to the heat radiating member 4.
  • the through hole 1a is a through hole having a hole diameter through which the component fixture 5 made of, for example, a screw can pass.
  • the component fixture 5 is for attaching the heat generating component 3 to the heat radiating member 4, and the hole 1 a is formed so that the hole diameter is larger than the outer diameter of the component fixture 5. .
  • the hole 1a in the wiring board 1 is provided in correspondence with the position where the heat generating component 3 is attached, that is, the position of the two foot attachment holes 1b. That is, the punched hole 1a is formed in alignment with the center of the component mounting hole 3a when the heat generating component 3 is mounted on the wiring board 1.
  • the center of the punch hole 1a coincides with the center of the component mounting hole 3a, but at least the outer periphery of the component fixture 5 is the inner periphery of the punch hole 1a. As long as it fits in.
  • the heat generating component 3 is an electrical component mounted on the wiring board 1.
  • the heat generating component 3 is made of, for example, a power transistor, and generates heat when the outdoor unit 9 is operated. Since the heat generating component 3 is closely fixed to the heat radiating member 4, the heat generated from the heat generating component 3 is radiated from the heat radiating member 4.
  • the heat generating component 3 is fixed by the component fixture 5 in a state where the center of the component mounting hole 3a is aligned with the center of the first screw hole 4a of the heat radiating member 4 described later.
  • the heat dissipating member 4 is composed of a plate-like base portion 4c disposed to face the plate surface 1c of the wiring board 1 and a plurality of fin portions 4d erected on the base portion 4c.
  • the base 4 c is provided with a first screw hole 4 a corresponding to the component mounting hole 3 a of the heat generating component 3 and a second screw hole 4 b for mounting the thermistor 6.
  • the first screw hole 4 a and the second screw hole 4 b are formed on the facing surface 4 f that faces the plate surface 1 c of the wiring board 1.
  • holder mounting holes 4 e are provided at two positions on the left end portion and the right end portion of the base portion 4 c, respectively.
  • the four holder mounting holes 4 e are, for example, screw holes, and are for mounting the heat dissipation member 4 to the substrate holder 13.
  • the four holder mounting holes 4e are provided at positions corresponding to four fixing holes 13e provided in the substrate holder 13 described later. That is, the heat radiating member 4 is fixed to the substrate holder 13 with the heat radiating member fixture 8 made of screws, for example, in a state where the position of the holder mounting hole 4e and the position of the fixing hole 13e are matched.
  • the thermistor 6 is fixed to the facing surface 4f and detects the temperature of the heat dissipating member 4.
  • the thermistor 6 is electrically conductive and is connected to a heat sensing part 6a for sensing the heat of the heat radiating member 4 and one end of the heat sensing part 6a, and a thermistor mounting hole corresponding to the second screw hole 4b of the heat radiating member 4 6b.
  • the substrate holder 13 is configured to fix the wiring substrate 1 and the heat radiating member 4 while maintaining a certain distance between the wiring substrate 1 and the heat radiating member 4.
  • the substrate holder 13 is made of resin and is formed by injection molding.
  • an ABS resin is used as the resin constituting the substrate holder 13.
  • substrate holder 13 has insulation, and has the contact prevention part 13c interposed between the wiring board 1 and the heat sensing part 6a.
  • FIG. 5 is a plan view showing the thermistor 6.
  • FIG. 6 is a side view showing the heat sensing part 6a and the thermistor mounting hole 6b of the thermistor 6 of FIG. As shown in FIGS. 5 and 6, the thermistor mounting hole 6b is connected to one end of the heat sensing portion 6a.
  • the heat sensing unit 6a is made of a metal member.
  • the thermistor 6 has a long shape in which a connector 6d is attached to the tip of a lead wire 6c connected to the heat sensing portion 6a.
  • the thermistor 6 is fixed to the heat radiating member 4 through a thermistor mounting hole 6b with a thermistor fixing tool made of, for example, a screw. More specifically, the thermistor 6 is fixed by the thermistor fixture 7 in a state where the center of the thermistor mounting hole 6b is aligned with the center of the second screw hole 4b. Further, the heat sensing part 6 a of the thermistor 6 is in close contact with the heat radiating member 4. For this reason, the thermistor 6 can detect the temperature of the heat dissipation member 4.
  • FIG. 7 is a perspective view of the substrate holder 13.
  • FIG. 8 is a perspective view showing a state in which the substrate holder 13 of FIG. 7 is rotated.
  • FIG. 9 is a perspective view showing a state in which the substrate holder 13 of FIG. 8 is further rotated.
  • the substrate holder 13 has an opening 13 a having a rectangular shape in plan view at the attachment position of the heat radiating member 4.
  • the opening 13a of the substrate holder 13 around the opening 13a of the substrate holder 13, four fixing holes 13e corresponding to the four holder mounting holes 4e of the heat radiating member 4 are provided.
  • the substrate holder 13 is provided with claw portions 13b for fixing the wiring substrate 1 at a plurality of locations on the side wall.
  • the plurality of claw portions 13b are provided at five locations around the substrate holder 13, and become hooked when the wiring substrate 1 is attached.
  • the contact prevention part 13c is the shape which protruded in the bowl shape from a part of inner periphery of the opening part 13a.
  • the contact prevention part 13c is provided in the long side inside the opening part 13a which is a planar view rectangular shape.
  • FIG. 10 is an explanatory diagram showing a temporarily fixed state of the thermistor fixture 7 in the procedure for attaching the thermistor 6 to the heat dissipation member 4.
  • FIG. 11 is an explanatory diagram showing a state in which the thermistor 6 is fixed to the heat radiating member 4.
  • FIG. 12 is a plan view showing a state in which the wiring board 1 is assembled to the board holder 13. The assembly of the control board device 14 will be described with reference to FIGS. 3, 4, and 10 to 12.
  • FIG. In FIG. 12, the components mounted on the wiring board 1 are omitted.
  • the contact preventing portion 13c in the present embodiment includes a protrusion 131 extending in a direction perpendicular to the facing surface 4f, and a direction parallel to the facing surface 4f from the end of the protruding portion 131. And a translation part 132 extending. That is, the contact prevention part 13c is formed in the L-shaped cross section.
  • the center of the second screw hole 4 b of the heat dissipation member 4 and the center of the thermistor mounting hole 6 b of the thermistor 6 are aligned. . Then, the thermistor 6 is fixed to the heat dissipating member 4 by inserting the thermistor fixing tool 7 into the thermistor mounting hole 6b and the second screw hole 4b and screwing them in.
  • the procedure for fixing the thermistor 6 to the heat radiating member 4 will be described in detail with reference to FIGS. 10 and 11.
  • the thermistor 6 is disposed on the facing surface 4f in a state where the heat sensing unit 6a does not overlap the contact preventing portion 13c in a direction perpendicular to the facing surface 4f.
  • the center of the thermistor mounting hole 6b and the center of the second screw hole 4b are matched.
  • the thermistor fixture 7 is inserted into the thermistor mounting hole 6b and the second screw hole 4b, and the thermistor fixture 7 is temporarily tightened.
  • the thermistor 6 is rotated in the direction of the white arrow in FIG. 10 about the temporarily tightened thermistor fixture 7, and the heat sensing unit 6 a is slid under the translation unit 132. Thereby, the heat sensing part 6a is inserted between the heat radiation member 4 and the translation part 132. Then, the thermistor 6 is fixed to the heat radiating member 4 by finally tightening the thermistor fixture 7 in a state where the heat sensing portion 6a is in close contact with the facing surface 4f.
  • the thermistor 6 is disposed below the hook-shaped contact prevention portion 13 c and fixed to the substrate holder 13.
  • the thermistor fixture 7 since a right-hand screw is used as the thermistor fixture 7, when the thermistor fixture 7 is screwed, the thermistor 6 once inserted below the translation unit 132 is the contact prevention unit 13c. There is no slip to the other side.
  • FIG. 11 shows an example in which the thermal sensing unit 6 a is brought into contact with the protruding part 131 and the thermistor 6 is fixed to the heat radiating member 4, but the thermal sensing part 6 a is not necessarily attached to the protruding part 131. There is no need to abut. However, since the contact prevention part 13c has insulation, the wiring board 1 is not short-circuited even if the heat sensing part 6a is brought into contact with the protruding part 131. Further, the heat sensing unit 6 a may be inserted between the heat radiating member 4 and the translation unit 132 before temporarily fastening the thermistor fixture 7.
  • the wiring board 1 is attached to the board holder 13 by fitting the wiring board 1 into the board holder 13. That is, the periphery of the wiring board 1 is fixed to the board holder 13 by being hooked on the plurality of claw portions 13b.
  • the mutual position of the wiring board 1 and the heat radiating member 4 is adjusted so that the punched hole 1a and the component mounting hole 3a match the first screw hole 4a of the heat radiating member 4. This is because the heat generating component 3 is attached to the heat radiating member 4 using the component fixing tool 5.
  • the mounting of the heat generating component 3 to the heat radiating member 4 is performed by penetrating the component fixing tool 5 through the punched hole 1a from the side opposite to the plate surface 1c of the wiring board 1. That is, the center of the component mounting hole 3a is aligned with the center of the first screw hole 4a, and the component fixing tool 5 is inserted into the component mounting hole 3a of the heat generating component 3 through the punched hole 1a. By screwing into the hole 4a, the heat generating component 3 is brought into close contact with the opposing surface 4f of the heat radiating member 4 and fixed.
  • FIG. 13 is an enlarged explanatory view of the peripheral portion S of the heat sensing unit 6a shown in FIG. With reference to FIG. 13, the positional relationship between the thermistor 6 and the contact prevention part 13c in this Embodiment is demonstrated in detail.
  • the contact preventing portion 13c is formed such that a gap A is formed between the contact preventing portion 13c and the heat sensing portion 6a in a direction perpendicular to the facing surface 4f. That is, a gap A having a certain length is provided between the thermistor 6 attached to the heat radiating member 4 and the contact preventing portion 13c.
  • the contact preventing portion 13c in the present embodiment is formed so that a desired gap A is generated in consideration of the size and manufacturing error of each constituent member. Therefore, in a normal state where no external force is applied to the lead wire 6c of the thermistor 6, the surface of the heat sensing unit 6a on the wiring board 1 side does not even contact the contact preventing unit 13c, and therefore the heat sensing unit 6a and the wiring The substrate 1 does not come into contact. Moreover, when attaching the thermistor 6 to the heat radiating member 4, the heat sensing part 6a can be smoothly inserted between the opposing surface 4f and the translation part 132, and the internal space can be effectively used.
  • the contact prevention portion 13c is formed so that the gap A is 0.5 mm.
  • the contact prevention portion 13c is, for example, according to the size and manufacturing error of each component member, for example
  • the gap A may be formed to be 0.5 mm or more and 1.0 mm or less.
  • the contact prevention part 13c may be formed so that the gap A does not occur. In this way, the heat sensing part 6a can be prevented from being lifted when some force is applied to the thermistor 6. The accuracy of temperature detection by the thermistor 6 can be maintained. However, it should be noted that the distance from the heat radiation member 4 to the translation unit 132 may be shorter than the height of the heat sensing unit 6a due to manufacturing errors or the like.
  • the substrate holder 13 is formed so that the contact preventing portion 13c and the wiring substrate 1 do not contact each other.
  • the substrate holder 13 is formed such that a gap B is formed between the contact prevention portion 13c and the wiring substrate 1 in a direction perpendicular to the facing surface 4f.
  • the substrate holder 13 is formed so that the gap B is 1.0 mm in consideration of the thickness of the heat sensing unit 6a and the translation unit 132, and the like.
  • the contact prevention unit 13 c provided on the board holder 13 is arranged so as to cover the heat sensing unit 6 a. Therefore, it is possible to prevent the heat sensing unit 6a from coming into contact with the wiring board 1.
  • the substrate holder 13 in the present embodiment is formed such that a gap A is generated between the contact prevention unit 13c and the heat sensing unit 6a, and a gap B is formed between the contact prevention unit 13c and the wiring board 1. Therefore, in a normal state, the heat sensing unit 6a or the wiring board 1 does not come into contact with the contact prevention unit 13c. Even if the heat sensing unit 6a is lifted with the thermistor fixture 7 as a fulcrum and the heat sensing unit 6a approaches the wiring board 1, in the control board device 14, the contact prevention unit 13c is connected to the heat sensing unit 6a and the wiring board. 1 between them. Therefore, according to the control board device 14, it can prevent that the heat sensing part 6a and the wiring board 1 contact directly. In addition, since the substrate holder 13 is formed of an insulator such as resin, the wiring substrate 1 is not short-circuited even if the heat sensing unit 6a contacts the contact preventing unit 13c.
  • the thermistor 6 is connected to the wiring board 1 because the substrate holder 13 has the contact prevention part 13c protruding in a bowl shape. Therefore, it is possible to avoid a situation in which the heat sensing unit 6a having conductivity comes into contact with the wiring board 1 and is electrically connected.
  • the embodiments described above are preferred specific examples of the control board device and the outdoor unit of the air conditioner, and the technical scope of the present invention is not limited to these embodiments.
  • the contact preventing portion 13c may be provided on the long side on the side wall side of the opening 13a or may be provided on one of the short sides of the opening 13a depending on the arrangement of the respective constituent members.
  • the opening 13a may have an elliptical shape in a plan view. In this case, the contact prevention unit 13c only needs to be provided at a part of the periphery of the opening 13a.
  • claw parts 13b when the number, arrangement
  • the substrate holder 13 was formed by injection molding it is not limited to this, Even if the substrate holder 13 is formed by cutting using insulating members, such as resin, Good.
  • control board device 14 is applied to the outdoor unit 9 of the air conditioner.
  • the present invention is not limited to this, and the control board device 14 is applied to an arbitrary electric device or the like. May be.

Abstract

This control board device is provided with: a heat dissipating member that dissipates heat generated by a heat generating component mounted on a wiring board; a thermistor that detects the temperature of the heat dissipating member; and a board holder that is attached in a state wherein the control board and the heat dissipating member maintain a fixed interval therebetween. The board holder has insulating properties, and is provided with a contact preventing section between the wiring board and a heat sensing section of the thermistor.

Description

制御基板装置および空気調和機の室外機Control board device and air conditioner outdoor unit
　本発明は、発熱部品等が実装された配線基板を有する制御基板装置および空気調和機の室外機に関する。 The present invention relates to a control board device having a wiring board on which a heat generating component or the like is mounted, and an outdoor unit of an air conditioner.
　従来の空気調和機の室外機には、発熱部品が実装された配線基板を基板ホルダに取り付けた制御基板装置を有するものがある（例えば、特許文献１参照）。 Some outdoor units of conventional air conditioners have a control board device in which a wiring board on which a heat generating component is mounted is attached to a board holder (for example, see Patent Document 1).
　特許文献１の制御基板装置には、発熱部材から発生する熱を放熱する放熱部材が組み込まれており、放熱部材には、熱感知部を備えた温度検知用のサーミスタが固定されている。ここで、サーミスタは、熱感知部に繋がる取付穴にネジを挿入し、該ネジを放熱部材のネジ穴にねじ込むことにより、配線基板と放熱部材との間に固定される。 The control board device of Patent Document 1 incorporates a heat dissipation member that dissipates heat generated from the heat generation member, and a temperature detection thermistor including a heat sensing unit is fixed to the heat dissipation member. Here, the thermistor is fixed between the wiring board and the heat dissipation member by inserting a screw into a mounting hole connected to the heat sensing unit and screwing the screw into the screw hole of the heat dissipation member.
特開２００６－１５６６４７号公報JP 2006-156647 A
　しかしながら、サーミスタの熱感知部は導電性を有しているため、特許文献１に係る構成では、サーミスタのリード線に何らかの力が加わった場合、サーミスタの熱感知部が浮き上がり、配線基板の表面に接触することがある。そして、サーミスタの熱感知部が配線基板の表面に接触すると、配線基板を短絡させてしまう恐れがある。 However, since the heat sensing part of the thermistor has electrical conductivity, in the configuration according to Patent Document 1, when any force is applied to the lead wire of the thermistor, the heat sensing part of the thermistor floats up and is formed on the surface of the wiring board. May come into contact. When the heat sensing part of the thermistor comes into contact with the surface of the wiring board, the wiring board may be short-circuited.
　本発明は、上記のような課題を解決するためになされたものであり、サーミスタの熱感知部が配線基板に接触することを防止する制御基板装置および空気調和機の室外機を提供することを目的とする。 The present invention has been made to solve the above-described problems, and provides a control board device and an outdoor unit of an air conditioner that prevent a heat sensing part of a thermistor from coming into contact with a wiring board. Objective.
　本発明に係る制御基板装置は、一方の面に発熱部品が実装された配線基板と、配線基板の一方の面に対向配置され、発熱部品から発生する熱を放熱する放熱部材と、放熱部材の一方の面に対向する対向面に固定され、放熱部材の温度を検知するサーミスタと、配線基板と放熱部材との間に一定の間隔を保持させて、配線基板と放熱部材とを固定する基板ホルダと、を備え、サーミスタは、導電性を有し、放熱部材の熱を感知する熱感知部を備え、基板ホルダは、絶縁性を有し、配線基板と熱感知部との間に介在する接触防止部を備えたものである。 A control board device according to the present invention includes a wiring board having a heat generating component mounted on one surface thereof, a heat dissipating member disposed opposite to one surface of the wiring board and dissipating heat generated from the heat generating component, and a heat dissipating member. A thermistor that is fixed to the opposite surface opposite to one surface and detects the temperature of the heat dissipation member, and a substrate holder that fixes the wiring substrate and the heat dissipation member by keeping a certain distance between the wiring substrate and the heat dissipation member. The thermistor is conductive and has a heat sensing part for sensing the heat of the heat dissipating member, and the substrate holder is insulative and contacts between the wiring board and the heat sensing part. A prevention part is provided.
　本発明は、絶縁性を有する基板ホルダが、配線基板と熱感知部との間に介在する接触防止部を備えているため、サーミスタの熱感知部が配線基板に接触することを防止することができる。 In the present invention, since the insulating substrate holder includes a contact prevention unit interposed between the wiring board and the heat sensing unit, the heat sensing unit of the thermistor can be prevented from coming into contact with the wiring substrate. it can.
本発明の実施の形態に係る空調調和装置の室外機の内部を正面側からみた概略構成を示す分解斜視図である。It is a disassembled perspective view which shows the schematic structure which looked at the inside of the outdoor unit of the air conditioning harmony device which concerns on embodiment of this invention from the front side. 図１の電気部品箱に制御基板装置を取り付けた状態を示す斜視図である。It is a perspective view which shows the state which attached the control board apparatus to the electrical component box of FIG. 図１の制御基板装置の組立を説明する分解斜視図である。It is a disassembled perspective view explaining the assembly of the control board apparatus of FIG. 図１の制御基板装置を示す概略断面図である。It is a schematic sectional drawing which shows the control board apparatus of FIG. 図３のサーミスタを示す平面図である。It is a top view which shows the thermistor of FIG. 図５のサーミスタの熱感知部及びサーミスタ取付穴を示す側面図である。It is a side view which shows the heat | fever sensing part and thermistor attachment hole of the thermistor of FIG. 図１の基板ホルダの斜視図である。It is a perspective view of the substrate holder of FIG. 図７の基板ホルダを回転させた状態を示す斜視図である。It is a perspective view which shows the state which rotated the board | substrate holder of FIG. 図８の基板ホルダをさらに回転させた状態を示す斜視図である。It is a perspective view which shows the state which rotated further the board | substrate holder of FIG. 図３のサーミスタの放熱部材への取付手順のうち、サーミスタ固定具の仮止め状態を示す説明図である。It is explanatory drawing which shows the temporary fix | stop state of the thermistor fixing tool among the attachment procedures to the heat radiating member of the thermistor of FIG. 図１０のサーミスタを放熱部材に固定した状態を示す説明図である。It is explanatory drawing which shows the state which fixed the thermistor of FIG. 10 to the heat radiating member. 図１の基板ホルダに配線基板を組み付けた状態を示す平面図である。It is a top view which shows the state which assembled | attached the wiring board to the board | substrate holder of FIG. 図４に示す熱感知部の周辺部分を拡大した説明図である。It is explanatory drawing which expanded the peripheral part of the heat sensing part shown in FIG.
実施の形態１．
　図１は、本発明の実施の形態に係る空調調和装置の室外機の内部を正面側からみた概略構成を示す分解斜視図である。図２は、図１の電気部品箱に制御基板装置を取り付けた状態を示す斜視図である。図３は、図１の制御基板装置の組立を説明する分解斜視図である。図４は、図１の制御基板装置を示す概略断面図である。
　図１～図４を参照して、本実施の形態に係る制御基板装置および空気調和機の室外機の全体的な構成内容について説明する。 Embodiment 1 FIG.
FIG. 1 is an exploded perspective view showing a schematic configuration of an interior of an outdoor unit of an air conditioner according to an embodiment of the present invention as viewed from the front side. FIG. 2 is a perspective view showing a state in which the control board device is attached to the electric component box of FIG. FIG. 3 is an exploded perspective view illustrating assembly of the control board device of FIG. FIG. 4 is a schematic cross-sectional view showing the control board device of FIG.
With reference to FIGS. 1 to 4, the overall configuration contents of the control board device and the outdoor unit of the air conditioner according to the present embodiment will be described.
　図１に示すように、空気調和機の室外機９の内部は、背面側から前面側に立設した仕切板１１により２分され、左側が熱交換器１０および送風機（図示省略）等を収納する熱交換室であり、右側が圧縮機１２等を収納する機械室である。 As shown in FIG. 1, the interior of the outdoor unit 9 of the air conditioner is divided into two by a partition plate 11 erected from the back side to the front side, and the left side stores a heat exchanger 10, a blower (not shown), and the like. The right side is a machine room that houses the compressor 12 and the like.
　空気調和機の室外機９は、機械室の上部に、制御基板装置１４を収納する電気部品箱１５を有しており、制御基板装置１４は、図２に示す状態で電気部品箱１５に取り付けられる。圧縮機１２は、機械室の下部に設けられている。また、空気調和機の室外機９は、例えば電磁弁からなる複数の膨張弁（図示省略）を有している。 The outdoor unit 9 of the air conditioner has an electrical component box 15 that houses the control board device 14 at the upper part of the machine room. The control board device 14 is attached to the electrical component box 15 in the state shown in FIG. It is done. The compressor 12 is provided in the lower part of the machine room. Moreover, the outdoor unit 9 of an air conditioner has a plurality of expansion valves (not shown) made of, for example, electromagnetic valves.
　熱交換器１０は、室外機９の左側の側面側から背面側に渡って送風機を囲むように立設されている。熱交換器１０の後ろ側には、熱交換器１０で冷却又は加熱する空気を吸込む吸込口（図示省略）が形成されている。空気調和機の室外機９の前面には、熱交換器１０での熱交換後の空気を機外に吸出す吸出口（図示省略）が設けられている。 The heat exchanger 10 is erected so as to surround the blower from the left side surface side to the back side of the outdoor unit 9. On the back side of the heat exchanger 10, a suction port (not shown) for sucking air to be cooled or heated by the heat exchanger 10 is formed. On the front surface of the outdoor unit 9 of the air conditioner, there is provided a suction port (not shown) for sucking out the air after heat exchange in the heat exchanger 10 to the outside.
　図３及び図４に示すように、制御基板装置１４は、プリント基板等からなり、各種部品が実装された配線基板１と、配線基板１の一方の面である板面１ｃに取り付けられる発熱部品３と、例えば放熱フィンからなる放熱部材４と、放熱部材４の温度を検知するサーミスタ６と、配線基板１と放熱部材４とが一定の間隔を保持する状態で取り付けられる基板ホルダ１３と、を有している。 As shown in FIGS. 3 and 4, the control board device 14 is made of a printed board or the like, and includes a wiring board 1 on which various parts are mounted, and a heat generating component attached to a plate surface 1 c that is one side of the wiring board 1. 3, a heat radiating member 4 made of, for example, a heat radiating fin, a thermistor 6 that detects the temperature of the heat radiating member 4, and a substrate holder 13 that is attached in a state in which the wiring board 1 and the heat radiating member 4 are kept at a constant interval. Have.
　配線基板１には、発熱部品３を実装するための足取付穴１ｂが二箇所に設けられている。また、発熱部品３は、二本の取付足２および放熱部材４への取付用の部品取付穴３ａを有している。発熱部品３は、二本の取付足２がそれぞれ二つの足取付穴１ｂに挿入され、挿入された部分が半田付けされることにより、配線基板１に取付られる。これにより、発熱部品３は、配線基板１の配線等に対し電気的に接続される。 The wiring board 1 is provided with two leg mounting holes 1b for mounting the heat generating component 3 at two locations. The heat generating component 3 has two mounting feet 2 and a component mounting hole 3 a for mounting to the heat radiating member 4. The heat generating component 3 is attached to the wiring board 1 by inserting the two attachment feet 2 into the two foot attachment holes 1b and soldering the inserted portions. Thereby, the heat generating component 3 is electrically connected to the wiring of the wiring board 1 and the like.
　制御基板装置１４は、配線基板１に発熱部品３等が実装された状態で、圧縮機１２の運転および停止、送風機の運転および停止、および各膨張弁の開閉等を制御するものである。 The control board device 14 controls the operation and stop of the compressor 12, the operation and stop of the blower, and the opening and closing of each expansion valve in a state where the heat generating component 3 and the like are mounted on the wiring board 1.
　配線基板１には、発熱部品３を放熱部材４に取り付ける際に利用する抜き穴１ａが設けられている。抜き穴１ａは、例えばネジからなる部品固定具５が貫通できるような穴径を有する貫通穴である。ここで、部品固定具５は、発熱部品３を放熱部材４に取り付けるためのものであり、抜き穴１ａは、穴径が、部品固定具５の外径よりも大きくなるように形成されている。 The wiring board 1 is provided with a punched hole 1 a used when the heat generating component 3 is attached to the heat radiating member 4. The through hole 1a is a through hole having a hole diameter through which the component fixture 5 made of, for example, a screw can pass. Here, the component fixture 5 is for attaching the heat generating component 3 to the heat radiating member 4, and the hole 1 a is formed so that the hole diameter is larger than the outer diameter of the component fixture 5. .
　配線基板１の抜き穴１ａは、発熱部品３が取り付けられる位置、つまり二つの足取付穴１ｂの位置に対応づけて設けられている。すなわち、抜き穴１ａは、発熱部品３を配線基板１に取り付けたときの部品取付穴３ａの中心に合わせて形成される。もっとも、発熱部品３を配線基板１に取り付けたときに、抜き穴１ａの中心と部品取付穴３ａの中心とが合致する状態が好ましいが、少なくとも部品固定具５の外周が抜き穴１ａの内周に収まっていればよい。 The hole 1a in the wiring board 1 is provided in correspondence with the position where the heat generating component 3 is attached, that is, the position of the two foot attachment holes 1b. That is, the punched hole 1a is formed in alignment with the center of the component mounting hole 3a when the heat generating component 3 is mounted on the wiring board 1. Of course, when the heat generating component 3 is attached to the wiring board 1, it is preferable that the center of the punch hole 1a coincides with the center of the component mounting hole 3a, but at least the outer periphery of the component fixture 5 is the inner periphery of the punch hole 1a. As long as it fits in.
　発熱部品３は、配線基板１に実装される電気部品である。発熱部品３は、例えばパワートランジスタからなり、室外機９の運転時に発熱するものである。発熱部品３は、放熱部材４に密着固定されるため、発熱部品３から発生した熱は、放熱部材４から放熱される。発熱部品３は、部品取付穴３ａの中心を、後述する放熱部材４の第一ネジ穴４ａの中心に合わせた状態で、部品固定具５により固定されている。 The heat generating component 3 is an electrical component mounted on the wiring board 1. The heat generating component 3 is made of, for example, a power transistor, and generates heat when the outdoor unit 9 is operated. Since the heat generating component 3 is closely fixed to the heat radiating member 4, the heat generated from the heat generating component 3 is radiated from the heat radiating member 4. The heat generating component 3 is fixed by the component fixture 5 in a state where the center of the component mounting hole 3a is aligned with the center of the first screw hole 4a of the heat radiating member 4 described later.
　放熱部材４は、配線基板１の板面１ｃに対向配置される板状の基部４ｃと、基部４ｃに立設された複数のフィン部４ｄと、により構成されている。基部４ｃには、発熱部品３の部品取付穴３ａに対応する第一ネジ穴４ａと、サーミスタ６を取り付けるための第二ネジ穴４ｂとが設けられている。第一ネジ穴４ａおよび第二ネジ穴４ｂは、配線基板１の板面１ｃに対向する対向面４ｆに形成されている。 The heat dissipating member 4 is composed of a plate-like base portion 4c disposed to face the plate surface 1c of the wiring board 1 and a plurality of fin portions 4d erected on the base portion 4c. The base 4 c is provided with a first screw hole 4 a corresponding to the component mounting hole 3 a of the heat generating component 3 and a second screw hole 4 b for mounting the thermistor 6. The first screw hole 4 a and the second screw hole 4 b are formed on the facing surface 4 f that faces the plate surface 1 c of the wiring board 1.
　また、放熱部材４において、基部４ｃの左端部および右端部には、それぞれ、二箇所にホルダ取付穴４ｅが設けられている。四つのホルダ取付穴４ｅは、例えばネジ穴からなり、放熱部材４を基板ホルダ１３に取り付けるためのものである。四つのホルダ取付穴４ｅは、後述する基板ホルダ１３に備わる４つの固定穴１３ｅに対応する位置に設けられている。すなわち、放熱部材４は、ホルダ取付穴４ｅの位置と固定穴１３ｅの位置とを合わせた状態で、例えばネジからなる放熱部材固定具８により基板ホルダ１３に固定されている。 Further, in the heat dissipating member 4, holder mounting holes 4 e are provided at two positions on the left end portion and the right end portion of the base portion 4 c, respectively. The four holder mounting holes 4 e are, for example, screw holes, and are for mounting the heat dissipation member 4 to the substrate holder 13. The four holder mounting holes 4e are provided at positions corresponding to four fixing holes 13e provided in the substrate holder 13 described later. That is, the heat radiating member 4 is fixed to the substrate holder 13 with the heat radiating member fixture 8 made of screws, for example, in a state where the position of the holder mounting hole 4e and the position of the fixing hole 13e are matched.
　サーミスタ６は、対向面４ｆに固定され、放熱部材４の温度を検知するものである。サーミスタ６は、導電性を有し、放熱部材４の熱を感知する熱感知部６ａと、熱感知部６ａの一端部に連結され、放熱部材４の第二ネジ穴４ｂに対応するサーミスタ取付穴６ｂと、を有している。 The thermistor 6 is fixed to the facing surface 4f and detects the temperature of the heat dissipating member 4. The thermistor 6 is electrically conductive and is connected to a heat sensing part 6a for sensing the heat of the heat radiating member 4 and one end of the heat sensing part 6a, and a thermistor mounting hole corresponding to the second screw hole 4b of the heat radiating member 4 6b.
　基板ホルダ１３は、配線基板１と放熱部材４との間に一定の間隔を保持させて、配線基板１と放熱部材４とを固定するものである。基板ホルダ１３は、樹脂製であり、射出成形によって形成されている。基板ホルダ１３を構成する樹脂としては、例えばＡＢＳ樹脂が用いられる。そして、基板ホルダ１３は、絶縁性を有し、配線基板１と熱感知部６ａとの間に介在する接触防止部１３ｃを有している。 The substrate holder 13 is configured to fix the wiring substrate 1 and the heat radiating member 4 while maintaining a certain distance between the wiring substrate 1 and the heat radiating member 4. The substrate holder 13 is made of resin and is formed by injection molding. For example, an ABS resin is used as the resin constituting the substrate holder 13. And the board | substrate holder 13 has insulation, and has the contact prevention part 13c interposed between the wiring board 1 and the heat sensing part 6a.
　図５は、サーミスタ６を示す平面図である。図６は、図５のサーミスタ６の熱感知部６ａ及びサーミスタ取付穴６ｂを示す側面図である。図５および図６に示すように、サーミスタ取付穴６ｂは、熱感知部６ａの一端部に連結されている。本実施の形態において、熱感知部６ａは、金属部材で構成されている。また、サーミスタ６は、図５に示すように、熱感知部６ａに接続するリード線６ｃの先端にコネクタ６ｄが付いた長形状のものである。 FIG. 5 is a plan view showing the thermistor 6. FIG. 6 is a side view showing the heat sensing part 6a and the thermistor mounting hole 6b of the thermistor 6 of FIG. As shown in FIGS. 5 and 6, the thermistor mounting hole 6b is connected to one end of the heat sensing portion 6a. In the present embodiment, the heat sensing unit 6a is made of a metal member. Further, as shown in FIG. 5, the thermistor 6 has a long shape in which a connector 6d is attached to the tip of a lead wire 6c connected to the heat sensing portion 6a.
　サーミスタ６は、サーミスタ取付穴６ｂを通じて、例えばネジからなるサーミスタ固定具により放熱部材４に固定されている。より具体的に、サーミスタ６は、サーミスタ取付穴６ｂの中心を第二ネジ穴４ｂの中心に合わせた状態で、サーミスタ固定具７により固定されている。また、サーミスタ６の熱感知部６ａは、放熱部材４に密着した状態となっている。このため、サーミスタ６は、放熱部材４の温度を検知することができる。 The thermistor 6 is fixed to the heat radiating member 4 through a thermistor mounting hole 6b with a thermistor fixing tool made of, for example, a screw. More specifically, the thermistor 6 is fixed by the thermistor fixture 7 in a state where the center of the thermistor mounting hole 6b is aligned with the center of the second screw hole 4b. Further, the heat sensing part 6 a of the thermistor 6 is in close contact with the heat radiating member 4. For this reason, the thermistor 6 can detect the temperature of the heat dissipation member 4.
　図７は、基板ホルダ１３の斜視図である。図８は、図７の基板ホルダ１３を回転させた状態を示す斜視図である。図９は、図８の基板ホルダ１３をさらに回転させた状態を示す斜視図である。図７～図９に示すように、基板ホルダ１３は、放熱部材４の取り付け位置に、平面視長方形状の開口部１３ａが形成されている。基板ホルダ１３の開口部１３ａの周囲には、放熱部材４の四つのホルダ取付穴４ｅに対応する四つの固定穴１３ｅが設けられている。 FIG. 7 is a perspective view of the substrate holder 13. FIG. 8 is a perspective view showing a state in which the substrate holder 13 of FIG. 7 is rotated. FIG. 9 is a perspective view showing a state in which the substrate holder 13 of FIG. 8 is further rotated. As shown in FIGS. 7 to 9, the substrate holder 13 has an opening 13 a having a rectangular shape in plan view at the attachment position of the heat radiating member 4. Around the opening 13a of the substrate holder 13, four fixing holes 13e corresponding to the four holder mounting holes 4e of the heat radiating member 4 are provided.
　また、基板ホルダ１３には、側壁の複数箇所に、配線基板１を固定する爪部１３ｂが設けられている。本実施の形態において、複数の爪部１３ｂは、基板ホルダ１３の周囲の五箇所に設けられており、配線基板１が取り付けられた時に引っ掛かりとなるものである。 Further, the substrate holder 13 is provided with claw portions 13b for fixing the wiring substrate 1 at a plurality of locations on the side wall. In the present embodiment, the plurality of claw portions 13b are provided at five locations around the substrate holder 13, and become hooked when the wiring substrate 1 is attached.
　そして、接触防止部１３ｃは、開口部１３ａの内周の一部から鉤状に突起した形状である。本実施の形態において、接触防止部１３ｃは、平面視長方形状である開口部１３ａの内側の長辺に設けられている。 And the contact prevention part 13c is the shape which protruded in the bowl shape from a part of inner periphery of the opening part 13a. In this Embodiment, the contact prevention part 13c is provided in the long side inside the opening part 13a which is a planar view rectangular shape.
［制御基板装置の組立］
　図１０は、サーミスタ６の放熱部材４への取付手順のうち、サーミスタ固定具７の仮止め状態を示す説明図である。図１１は、サーミスタ６を放熱部材４に固定した状態を示す説明図である。図１２は、基板ホルダ１３に配線基板１を組み付けた状態を示す平面図である。図３、図４、および図１０～図１２を参照し、制御基板装置１４の組立について説明する。なお、図１２では、配線基板１に実装された各部品等を省略している。 [Assembly of control board device]
FIG. 10 is an explanatory diagram showing a temporarily fixed state of the thermistor fixture 7 in the procedure for attaching the thermistor 6 to the heat dissipation member 4. FIG. 11 is an explanatory diagram showing a state in which the thermistor 6 is fixed to the heat radiating member 4. FIG. 12 is a plan view showing a state in which the wiring board 1 is assembled to the board holder 13. The assembly of the control board device 14 will be described with reference to FIGS. 3, 4, and 10 to 12. FIG. In FIG. 12, the components mounted on the wiring board 1 are omitted.
（放熱部材の基板ホルダへの取り付け）
　放熱部材４を基板ホルダ１３に取り付けるときは、まず、放熱部材４の基部４ｃを、基板ホルダ１３の開口部１３ａに合わせ、四つのホルダ取付穴４ｅの中心が、それぞれ、四つの固定穴１３ｅの中心と合致するように配置する。
　次いで、固定穴１３ｅとホルダ取付穴４ｅとを連通させた４箇所の穴に、放熱部材固定具８をねじ込んで、基板ホルダ１３と放熱部材４とを固定する。 (Attaching the heat dissipation member to the board holder)
When attaching the heat dissipating member 4 to the substrate holder 13, first, the base 4c of the heat dissipating member 4 is aligned with the opening 13a of the substrate holder 13, and the centers of the four holder mounting holes 4e are respectively the four fixing holes 13e. Arrange to match the center.
Next, the heat radiating member fixture 8 is screwed into the four holes where the fixing hole 13e and the holder mounting hole 4e are communicated to fix the substrate holder 13 and the heat radiating member 4.
（サーミスタの放熱部材への取り付け）
　本実施の形態における接触防止部１３ｃは、図１０および図１１に示すように、対向面４ｆに垂直な方向に延びる突出部１３１と、突出部１３１の端部から対向面４ｆに平行な方向に延びる並進部１３２と、を有している。つまり、接触防止部１３ｃは、断面Ｌ字状に形成されている。 (Attaching the thermistor to the heat dissipation member)
As shown in FIGS. 10 and 11, the contact preventing portion 13c in the present embodiment includes a protrusion 131 extending in a direction perpendicular to the facing surface 4f, and a direction parallel to the facing surface 4f from the end of the protruding portion 131. And a translation part 132 extending. That is, the contact prevention part 13c is formed in the L-shaped cross section.
　放熱部材４を基板ホルダ１３に取り付けた後、サーミスタ６を放熱部材４に取り付けるときは、まず、放熱部材４の第二ネジ穴４ｂの中心と、サーミスタ６のサーミスタ取付穴６ｂの中心とを合わせる。
　そして、サーミスタ固定具７を、サーミスタ取付穴６ｂおよび第二ネジ穴４ｂに挿入してねじ込むことにより、サーミスタ６を放熱部材４に固定する。 When attaching the thermistor 6 to the heat dissipation member 4 after attaching the heat dissipation member 4 to the substrate holder 13, first, the center of the second screw hole 4 b of the heat dissipation member 4 and the center of the thermistor mounting hole 6 b of the thermistor 6 are aligned. .
Then, the thermistor 6 is fixed to the heat dissipating member 4 by inserting the thermistor fixing tool 7 into the thermistor mounting hole 6b and the second screw hole 4b and screwing them in.
　ここで、図１０および図１１を参照して、サーミスタ６を放熱部材４に固定する手順について詳細に説明する。
　まず、熱感知部６ａが、対向面４ｆに垂直な方向において接触防止部１３ｃと重ならない状態で、サーミスタ６を対向面４ｆ上に配置する。その際、サーミスタ取付穴６ｂの中心と第二ネジ穴４ｂの中心とを合致させる。
　次に、サーミスタ固定具７を、サーミスタ取付穴６ｂおよび第二ネジ穴４ｂに挿入し、サーミスタ固定具７を仮締めする。 Here, the procedure for fixing the thermistor 6 to the heat radiating member 4 will be described in detail with reference to FIGS. 10 and 11.
First, the thermistor 6 is disposed on the facing surface 4f in a state where the heat sensing unit 6a does not overlap the contact preventing portion 13c in a direction perpendicular to the facing surface 4f. At that time, the center of the thermistor mounting hole 6b and the center of the second screw hole 4b are matched.
Next, the thermistor fixture 7 is inserted into the thermistor mounting hole 6b and the second screw hole 4b, and the thermistor fixture 7 is temporarily tightened.
　次いで、サーミスタ６を、仮締めしたサーミスタ固定具７を軸として、図１０の白抜き矢印の方向に回転させ、熱感知部６ａを並進部１３２の下へスライドさせる。これにより、熱感知部６ａが、放熱部材４と並進部１３２との間に挿入される。
　そして、熱感知部６ａを対向面４ｆに密着させた状態で、サーミスタ固定具７を本締めすることにより、サーミスタ６が放熱部材４に固定される。 Next, the thermistor 6 is rotated in the direction of the white arrow in FIG. 10 about the temporarily tightened thermistor fixture 7, and the heat sensing unit 6 a is slid under the translation unit 132. Thereby, the heat sensing part 6a is inserted between the heat radiation member 4 and the translation part 132.
Then, the thermistor 6 is fixed to the heat radiating member 4 by finally tightening the thermistor fixture 7 in a state where the heat sensing portion 6a is in close contact with the facing surface 4f.
　このようにして、サーミスタ６が、フック状の接触防止部１３ｃの下側に配置され、基板ホルダ１３に固定される。なお、本実施の形態では、サーミスタ固定具７として右ネジを用いているため、サーミスタ固定具７をねじ込む際に、一旦並進部１３２の下へ挿入されたサーミスタ６が、接触防止部１３ｃとは反対側にずれることはない。 In this way, the thermistor 6 is disposed below the hook-shaped contact prevention portion 13 c and fixed to the substrate holder 13. In the present embodiment, since a right-hand screw is used as the thermistor fixture 7, when the thermistor fixture 7 is screwed, the thermistor 6 once inserted below the translation unit 132 is the contact prevention unit 13c. There is no slip to the other side.
　ここで、図１１では、熱感知部６ａを突出部１３１に当接させて、サーミスタ６を放熱部材４に固定している例を示しているが、熱感知部６ａは、必ずしも突出部１３１に当接させる必要はない。もっとも、接触防止部１３ｃは絶縁性を有するため、熱感知部６ａを突出部１３１に当接させたとしても、配線基板１を短絡させることはない。また、サーミスタ固定具７を仮締めする前に、熱感知部６ａを、放熱部材４と並進部１３２との間に挿入してもよい。 Here, FIG. 11 shows an example in which the thermal sensing unit 6 a is brought into contact with the protruding part 131 and the thermistor 6 is fixed to the heat radiating member 4, but the thermal sensing part 6 a is not necessarily attached to the protruding part 131. There is no need to abut. However, since the contact prevention part 13c has insulation, the wiring board 1 is not short-circuited even if the heat sensing part 6a is brought into contact with the protruding part 131. Further, the heat sensing unit 6 a may be inserted between the heat radiating member 4 and the translation unit 132 before temporarily fastening the thermistor fixture 7.
（配線基板の基板ホルダへの取り付け）
　続いて、発熱部品３等が実装された配線基板１を基板ホルダ１３へ取り付けるときは、まず、配線基板１と基板ホルダ１３とを対向させる。つまり、配線基板１の発熱部品３が取り付けられた側である板面１ｃと放熱部材４の対向面４ｆとが対向するように、配線基板１と発熱部品３とを重ね配置する。 (Attaching the wiring board to the board holder)
Subsequently, when the wiring board 1 on which the heat generating component 3 or the like is mounted is attached to the board holder 13, the wiring board 1 and the board holder 13 are first opposed to each other. That is, the wiring substrate 1 and the heat generating component 3 are arranged so that the plate surface 1c on the side of the wiring substrate 1 on which the heat generating component 3 is attached and the facing surface 4f of the heat radiating member 4 face each other.
　次いで、図１２に示すように、配線基板１を基板ホルダ１３に嵌め込むことで、配線基板１が基板ホルダ１３に取り付けられる。すなわち、配線基板１は、周囲が、複数の爪部１３ｂに引っ掛けられることにより、基板ホルダ１３に固定される。 Next, as shown in FIG. 12, the wiring board 1 is attached to the board holder 13 by fitting the wiring board 1 into the board holder 13. That is, the periphery of the wiring board 1 is fixed to the board holder 13 by being hooked on the plurality of claw portions 13b.
　このとき、抜き穴１ａおよび部品取付穴３ａが、放熱部材４の第一ネジ穴４ａに合致するように、配線基板１と放熱部材４との相互位置を調節する。部品固定具５を用いて発熱部品３を放熱部材４に取り付けるためである。 At this time, the mutual position of the wiring board 1 and the heat radiating member 4 is adjusted so that the punched hole 1a and the component mounting hole 3a match the first screw hole 4a of the heat radiating member 4. This is because the heat generating component 3 is attached to the heat radiating member 4 using the component fixing tool 5.
（発熱部品の放熱部材への取り付け）
　次に行う発熱部品３の放熱部材４への取り付けは、配線基板１の板面１ｃとは反対側から、部品固定具５を抜き穴１ａに貫通させることにより実行する。
　すなわち、部品取付穴３ａの中心と第一ネジ穴４ａの中心とを合致させ、抜き穴１ａを通じて、部品固定具５を発熱部品３の部品取付穴３ａに挿入し、放熱部材４の第一ネジ穴４ａにねじ込むことにより、発熱部品３を放熱部材４の対向面４ｆに密着させて固定する。 (Mounting heat-generating parts to heat-dissipating members)
Next, the mounting of the heat generating component 3 to the heat radiating member 4 is performed by penetrating the component fixing tool 5 through the punched hole 1a from the side opposite to the plate surface 1c of the wiring board 1.
That is, the center of the component mounting hole 3a is aligned with the center of the first screw hole 4a, and the component fixing tool 5 is inserted into the component mounting hole 3a of the heat generating component 3 through the punched hole 1a. By screwing into the hole 4a, the heat generating component 3 is brought into close contact with the opposing surface 4f of the heat radiating member 4 and fixed.
　図１３は、図４に示す熱感知部６ａの周辺部分Ｓを拡大した説明図である。図１３を参照し、本実施の形態におけるサーミスタ６と接触防止部１３ｃとの配置関係を詳細に説明する。 FIG. 13 is an enlarged explanatory view of the peripheral portion S of the heat sensing unit 6a shown in FIG. With reference to FIG. 13, the positional relationship between the thermistor 6 and the contact prevention part 13c in this Embodiment is demonstrated in detail.
　図１３に示すように、接触防止部１３ｃは、対向面４ｆに垂直な方向において、熱感知部６ａとの間に間隙Ａが生じるように形成されている。すなわち、放熱部材４に取り付けられたサーミスタ６と接触防止部１３ｃとの間には、一定の長さの間隙Ａが設けられている。 As shown in FIG. 13, the contact preventing portion 13c is formed such that a gap A is formed between the contact preventing portion 13c and the heat sensing portion 6a in a direction perpendicular to the facing surface 4f. That is, a gap A having a certain length is provided between the thermistor 6 attached to the heat radiating member 4 and the contact preventing portion 13c.
　このように、本実施の形態における接触防止部１３ｃは、各構成部材のサイズおよび製造誤差等を勘案の上、所望の間隙Ａが生じるように形成されている。したがって、サーミスタ６のリード線６ｃに外力が加わっていない通常の状態であれば、熱感知部６ａの配線基板１側の面は、接触防止部１３ｃにすら接触しないため、熱感知部６ａと配線基板１が接触することもない。また、サーミスタ６を放熱部材４に取り付ける際、対向面４ｆと並進部１３２との間に、熱感知部６ａを円滑に挿入することができ、かつ、内部スペースの有効利用を図ることができる。 As described above, the contact preventing portion 13c in the present embodiment is formed so that a desired gap A is generated in consideration of the size and manufacturing error of each constituent member. Therefore, in a normal state where no external force is applied to the lead wire 6c of the thermistor 6, the surface of the heat sensing unit 6a on the wiring board 1 side does not even contact the contact preventing unit 13c, and therefore the heat sensing unit 6a and the wiring The substrate 1 does not come into contact. Moreover, when attaching the thermistor 6 to the heat radiating member 4, the heat sensing part 6a can be smoothly inserted between the opposing surface 4f and the translation part 132, and the internal space can be effectively used.
　ここで、本実施の形態では、間隙Ａが０．５ｍｍとなるように接触防止部１３ｃを形成しているが、接触防止部１３ｃは、各構成部材のサイズおよび製造誤差等に応じて、例えば、間隙Ａが０．５ｍｍ以上１．０ｍｍ以下となるように形成してもよい。 Here, in the present embodiment, the contact prevention portion 13c is formed so that the gap A is 0.5 mm. However, the contact prevention portion 13c is, for example, according to the size and manufacturing error of each component member, for example The gap A may be formed to be 0.5 mm or more and 1.0 mm or less.
　なお、接触防止部１３ｃは、間隙Ａが生じないように形成してもよく、このようにすれば、サーミスタ６に何らかの力が加わった場合の熱感知部６ａの浮き上がりを防ぐことができるため、サーミスタ６による温度検知の精度を保持することができる。ただし、製造誤差等により、放熱部材４から並進部１３２までの距離が熱感知部６ａの高さよりも短くなることがある点に留意する必要がある。 In addition, the contact prevention part 13c may be formed so that the gap A does not occur. In this way, the heat sensing part 6a can be prevented from being lifted when some force is applied to the thermistor 6. The accuracy of temperature detection by the thermistor 6 can be maintained. However, it should be noted that the distance from the heat radiation member 4 to the translation unit 132 may be shorter than the height of the heat sensing unit 6a due to manufacturing errors or the like.
　また、基板ホルダ１３は、図１３に示すように、接触防止部１３ｃと配線基板１とが接触しないように形成されている。すなわち、基板ホルダ１３は、対向面４ｆに垂直な方向において、接触防止部１３ｃと配線基板１との間に間隙Ｂが生じるように形成されている。本実施の形態において、基板ホルダ１３は、熱感知部６ａ及び並進部１３２の厚さ等を考慮の上、間隙Ｂが１．０ｍｍとなるように形成されている。 Further, as shown in FIG. 13, the substrate holder 13 is formed so that the contact preventing portion 13c and the wiring substrate 1 do not contact each other. In other words, the substrate holder 13 is formed such that a gap B is formed between the contact prevention portion 13c and the wiring substrate 1 in a direction perpendicular to the facing surface 4f. In the present embodiment, the substrate holder 13 is formed so that the gap B is 1.0 mm in consideration of the thickness of the heat sensing unit 6a and the translation unit 132, and the like.
　以上のように、本実施の形態における制御基板装置１４および空気調和機の室外機９は、絶縁性を有する基板ホルダ１３が、配線基板１と熱感知部６ａとの間に介在する接触防止部１３ｃを備えているため、サーミスタ６の熱感知部６ａが配線基板１に接触することを防止することができる。すなわち、制御基板装置１４では、部品固定具５によって固定されたサーミスタ６に何らかの力が加わった場合でも、基板ホルダ１３に設けられた接触防止部１３ｃが熱感知部６ａを覆うように配置されているため、熱感知部６ａが配線基板１に接触することを防ぐことができる。 As described above, in the control board device 14 and the outdoor unit 9 of the air conditioner according to the present embodiment, the contact prevention unit in which the insulating substrate holder 13 is interposed between the wiring board 1 and the heat sensing unit 6a. Since 13c is provided, it can prevent that the heat | fever sensing part 6a of the thermistor 6 contacts the wiring board 1. FIG. That is, in the control board device 14, even when some force is applied to the thermistor 6 fixed by the component fixture 5, the contact prevention unit 13 c provided on the board holder 13 is arranged so as to cover the heat sensing unit 6 a. Therefore, it is possible to prevent the heat sensing unit 6a from coming into contact with the wiring board 1.
　ここで、本実施の形態における基板ホルダ１３は、接触防止部１３ｃと熱感知部６ａとの間に間隙Ａが生じ、接触防止部１３ｃと配線基板１との間に間隙Ｂが生じるように形成されているため、通常の状態では、熱感知部６ａ又は配線基板１が接触防止部１３ｃに接触することはない。そして、仮に、サーミスタ固定具７を支点として熱感知部６ａが浮き上がり、熱感知部６ａが配線基板１に近づいた場合でも、制御基板装置１４では、接触防止部１３ｃが熱感知部６ａと配線基板１との間に挟まれる状態となる。よって、制御基板装置１４によれば、熱感知部６ａと配線基板１とが直接接触することを防ぐことができる。加えて、基板ホルダ１３は、樹脂等の絶縁体で形成されているため、熱感知部６ａが接触防止部１３ｃに接触したとしても、配線基板１を短絡させることはない。 Here, the substrate holder 13 in the present embodiment is formed such that a gap A is generated between the contact prevention unit 13c and the heat sensing unit 6a, and a gap B is formed between the contact prevention unit 13c and the wiring board 1. Therefore, in a normal state, the heat sensing unit 6a or the wiring board 1 does not come into contact with the contact prevention unit 13c. Even if the heat sensing unit 6a is lifted with the thermistor fixture 7 as a fulcrum and the heat sensing unit 6a approaches the wiring board 1, in the control board device 14, the contact prevention unit 13c is connected to the heat sensing unit 6a and the wiring board. 1 between them. Therefore, according to the control board device 14, it can prevent that the heat sensing part 6a and the wiring board 1 contact directly. In addition, since the substrate holder 13 is formed of an insulator such as resin, the wiring substrate 1 is not short-circuited even if the heat sensing unit 6a contacts the contact preventing unit 13c.
　すなわち、接触防止部１３ｃを有する制御基板装置１４および空気調和機の室外機９によれば、基板ホルダ１３が鉤状に突起した接触防止部１３ｃを有しているため、サーミスタ６が配線基板１に接触しない状態を保持することができるため、導電性を有する熱感知部６ａが配線基板１に接触して電気導通するという事態を回避することができる。 That is, according to the control board device 14 having the contact prevention part 13c and the outdoor unit 9 of the air conditioner, the thermistor 6 is connected to the wiring board 1 because the substrate holder 13 has the contact prevention part 13c protruding in a bowl shape. Therefore, it is possible to avoid a situation in which the heat sensing unit 6a having conductivity comes into contact with the wiring board 1 and is electrically connected.
　上述した実施の形態は、制御基板装置および空気調和機の室外機における好適な具体例であり、本発明の技術的範囲は、これらの態様に限定されるものではない。例えば、上記各図では、接触防止部１３ｃが、開口部１３ａの内側の長辺に設けられている場合を例示しているが、これに限定されるものではない。すなわち、接触防止部１３ｃは、各構成部材の配置等に応じて、開口部１３ａの側壁側の長辺に設けられてもよく、開口部１３ａの短辺のうちの一方に設けられてもよい。なお、開口部１３ａは、平面視楕円形状等であってもよく、この場合、接触防止部１３ｃは、開口部１３ａの周囲の一部に設けられていればよい。 The embodiments described above are preferred specific examples of the control board device and the outdoor unit of the air conditioner, and the technical scope of the present invention is not limited to these embodiments. For example, in each of the above drawings, the case where the contact preventing portion 13c is provided on the inner long side of the opening portion 13a is illustrated, but the present invention is not limited to this. That is, the contact preventing portion 13c may be provided on the long side on the side wall side of the opening 13a or may be provided on one of the short sides of the opening 13a depending on the arrangement of the respective constituent members. . The opening 13a may have an elliptical shape in a plan view. In this case, the contact prevention unit 13c only needs to be provided at a part of the periphery of the opening 13a.
　また、上記実施の形態では、基板ホルダ１３が、５つの爪部１３ｂを有する場合を例示したが、爪部１３ｂの数および配置などは、配線基板１のサイズおよび形状等に応じて適宜変更するとよい。さらに、上記実施の形態では、基板ホルダ１３が射出成型によって形成される場合を例示したが、これに限定されず、基板ホルダ１３は、樹脂等の絶縁部材を用いて切削加工により形成してもよい。 Moreover, in the said embodiment, although the case where the board | substrate holder 13 had the five nail | claw parts 13b was illustrated, when the number, arrangement | positioning, etc. of the nail | claw parts 13b are changed suitably according to the size of the wiring board 1, etc. Good. Furthermore, in the said embodiment, although the case where the substrate holder 13 was formed by injection molding was illustrated, it is not limited to this, Even if the substrate holder 13 is formed by cutting using insulating members, such as resin, Good.
　なお、上記実施の形態では、制御基板装置１４が、空気調和機の室外機９に適用される場合を例示したが、これに限らず、制御基板装置１４は、任意の電気機器等に適用してもよい。 In the above embodiment, the case where the control board device 14 is applied to the outdoor unit 9 of the air conditioner has been exemplified. However, the present invention is not limited to this, and the control board device 14 is applied to an arbitrary electric device or the like. May be.
　１　配線基板、１ａ　抜き穴、１ｂ　足取付穴、１ｃ　板面、２　取付足、３　発熱部品、３ａ　部品取付穴、４　放熱部材、４ａ　第一ネジ穴、４ｂ　第二ネジ穴、４ｃ　基部、４ｄ　フィン部、４ｅ　ホルダ取付穴、４ｆ　対向面、５　部品固定具、６　サーミスタ、６ａ　熱感知部、６ｂ　サーミスタ取付穴、６ｃ　リード線、６ｄ　コネクタ、７　サーミスタ固定具、８　放熱部材固定具、９　室外機、１０　熱交換器、１１　仕切板、１２　圧縮機、１３　基板ホルダ、１３ａ　開口部、１３ｂ　爪部、１３ｃ　接触防止部、１３ｅ　固定穴、１４　制御基板装置、１５　電気部品箱、１３１　突出部、１３２　並進部。 1 wiring board, 1a punched hole, 1b foot mounting hole, 1c plate surface, 2 mounting foot, 3 heat generating component, 3a component mounting hole, 4 heat dissipation member, 4a first screw hole, 4b second screw hole, 4c base, 4d Fin, 4e Holder mounting hole, 4f Opposing surface, 5 Component fixture, 6 Thermistor, 6a Thermal sensing unit, 6b Thermistor mounting hole, 6c Lead wire, 6d connector, 7 Thermistor fixture, 8 Heat dissipation member fixture, 9 Outdoor Machine, 10 heat exchanger, 11 partition plate, 12 compressor, 13 substrate holder, 13a opening, 13b claw portion, 13c contact prevention portion, 13e fixing hole, 14 control board device, 15 electrical component box, 131 protrusion, 132 Translation Department.

Claims (8)

  1. 　一方の面に発熱部品が実装された配線基板と、
    　前記配線基板の前記一方の面に対向配置され、前記発熱部品から発生する熱を放熱する放熱部材と、
    　前記放熱部材の前記一方の面に対向する対向面に固定され、前記放熱部材の温度を検知するサーミスタと、
    　前記配線基板と前記放熱部材との間に一定の間隔を保持させて、前記配線基板と前記放熱部材とを固定する基板ホルダと、
    　を備え、
    　前記サーミスタは、導電性を有し、前記放熱部材の熱を感知する熱感知部を備え、
    　前記基板ホルダは、絶縁性を有し、前記配線基板と前記熱感知部との間に介在する接触防止部を備えた制御基板装置。     A wiring board with a heat generating component mounted on one side;
    A heat dissipating member disposed opposite to the one surface of the wiring board and dissipating heat generated from the heat generating component;
    A thermistor fixed to the opposing surface facing the one surface of the heat dissipation member and detecting the temperature of the heat dissipation member;
    A substrate holder that holds the wiring board and the heat dissipation member by holding a certain distance between the wiring board and the heat dissipation member;
    With
    The thermistor has conductivity, and includes a heat sensing unit that senses heat of the heat dissipation member,
    The said board | substrate holder has insulation, The control board apparatus provided with the contact prevention part interposed between the said wiring board and the said heat sensing part.
  2. 　前記基板ホルダは、前記放熱部材の取り付け位置に開口部が形成されており、
    　前記接触防止部は、前記開口部の内周の一部から鉤状に突起した形状である請求項１に記載の制御基板装置。     The substrate holder has an opening formed at the mounting position of the heat dissipation member,
    The control board device according to claim 1, wherein the contact prevention portion has a shape protruding in a bowl shape from a part of an inner periphery of the opening.
  3. 　前記接触防止部は、前記対向面に垂直な方向において、前記熱感知部との間に間隙が生じるように形成されている請求項１又は２に記載の制御基板装置。 3. The control board device according to claim 1, wherein the contact prevention unit is formed so that a gap is formed between the contact prevention unit and the heat sensing unit in a direction perpendicular to the facing surface.
  4. 　前記接触防止部は、前記接触防止部と前記熱感知部との間の間隙が０．５ｍｍ以上１．０ｍｍ以下となるように形成されている請求項３に記載の制御基板装置。 4. The control board device according to claim 3, wherein the contact prevention unit is formed such that a gap between the contact prevention unit and the heat sensing unit is 0.5 mm or more and 1.0 mm or less.
  5. 　前記基板ホルダは、前記接触防止部と前記配線基板との間に間隙が生じるように形成されている請求項１～４の何れか一項に記載の制御基板装置。 The control board device according to any one of claims 1 to 4, wherein the board holder is formed so that a gap is formed between the contact prevention portion and the wiring board.
  6. 　前記基板ホルダは、樹脂製であり、射出成形又は切削加工によって形成される請求項１～５の何れか一項に記載の制御基板装置。 The control board device according to any one of claims 1 to 5, wherein the board holder is made of resin and is formed by injection molding or cutting.
  7. 　前記サーミスタは、
    　前記熱感知部に連結された取付穴を有し、
    　前記取付穴を通じてサーミスタ固定具により前記放熱部材に固定されている請求項１～６の何れか一項に記載の制御基板装置。     The thermistor is
    A mounting hole connected to the heat sensing unit;
    The control board device according to any one of claims 1 to 6, wherein the control board device is fixed to the heat radiating member by a thermistor fixing tool through the mounting hole.
  8. 　熱交換器が設けられた熱交換室と、
    　圧縮機および電気部品箱が設けられた機械室と、
    　を有し、
    　前記電気部品箱に請求項１～７の何れか一項に記載の制御基板装置が設けられている空気調和機の室外機。     A heat exchange chamber provided with a heat exchanger;
    A machine room provided with a compressor and an electrical component box;
    Have
    An outdoor unit of an air conditioner, wherein the electrical component box is provided with the control board device according to any one of claims 1 to 7.
PCT/JP2015/074226 2015-08-27 2015-08-27 Control board device and outdoor unit of air conditioner WO2017033329A1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN201590000359.7U CN206259340U (en) 2015-08-27 2015-08-27 The outdoor unit of control base board device and air conditioner
PCT/JP2015/074226 WO2017033329A1 (en) 2015-08-27 2015-08-27 Control board device and outdoor unit of air conditioner
JP2017536148A JP6362787B2 (en) 2015-08-27 2015-08-27 Control board device and air conditioner outdoor unit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2015/074226 WO2017033329A1 (en) 2015-08-27 2015-08-27 Control board device and outdoor unit of air conditioner

Publications (1)

Publication Number Publication Date
WO2017033329A1 true WO2017033329A1 (en) 2017-03-02

Family

ID=58099686

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2015/074226 WO2017033329A1 (en) 2015-08-27 2015-08-27 Control board device and outdoor unit of air conditioner

Country Status (3)

Country Link
JP (1) JP6362787B2 (en)
CN (1) CN206259340U (en)
WO (1) WO2017033329A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220181532A1 (en) * 2019-03-29 2022-06-09 Kyocera Corporation Element substrate, light-emitting element module, and light-emitting device

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6232543U (en) * 1985-08-09 1987-02-26
JP2002353385A (en) * 2001-05-29 2002-12-06 Yaskawa Electric Corp Servo drive device
JP2005283149A (en) * 2004-03-26 2005-10-13 Tdk Corp Electronic component equipped with thermosensitive element
JP2006156647A (en) * 2004-11-29 2006-06-15 Mitsubishi Electric Corp Wiring board with heat dissipation component and exterior unit of air conditioner comprising electrical component box including the wiring board

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5822777B2 (en) * 2012-04-24 2015-11-24 東京特殊電線株式会社 2-core parallel lead wire and thermistor with lead wire

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6232543U (en) * 1985-08-09 1987-02-26
JP2002353385A (en) * 2001-05-29 2002-12-06 Yaskawa Electric Corp Servo drive device
JP2005283149A (en) * 2004-03-26 2005-10-13 Tdk Corp Electronic component equipped with thermosensitive element
JP2006156647A (en) * 2004-11-29 2006-06-15 Mitsubishi Electric Corp Wiring board with heat dissipation component and exterior unit of air conditioner comprising electrical component box including the wiring board

Also Published As

Publication number Publication date
CN206259340U (en) 2017-06-16
JPWO2017033329A1 (en) 2018-03-29
JP6362787B2 (en) 2018-07-25

Similar Documents

Publication Publication Date Title
JP5383336B2 (en) Electrical equipment
US8988880B2 (en) Heat transfer assembly with heat pipe brace and method for assembling a heat transfer assembly
JP2007288061A (en) Electronic equipment
JP2008070016A (en) Mounting structure for electrical equipment case body, and air conditioner equipped with the same
CN107006136B (en) Heat dissipation mechanism and electronic speed regulator and electronic device with same
JP2009099677A (en) Electric component unit
JP4656047B2 (en) Electronic device casing structure and power supply device
JP6362787B2 (en) Control board device and air conditioner outdoor unit
JP6137439B2 (en) Insulated heat radiation rubber molding
CN111712914A (en) Method for manufacturing control device and control device
JP2013016810A (en) Heat dissipation unit
JPWO2017158707A1 (en) Air conditioner outdoor unit
KR20070010942A (en) Cooling apparatus for electronic device
JP6471417B2 (en) Cooling jacket
JP2006156647A (en) Wiring board with heat dissipation component and exterior unit of air conditioner comprising electrical component box including the wiring board
JP2012119425A (en) Fan unit and electronic apparatus
JP2013153065A (en) Heat radiation structure of heater element and air conditioner including the same
WO2023157130A1 (en) Electrical equipment module
TWI537567B (en) Electronic load testing device
JP4300976B2 (en) lighting equipment
WO2023157129A1 (en) Outdoor unit
JP6807759B2 (en) Power supply and lighting
JP6878041B2 (en) Heat dissipation structure of heat generating parts
JP2001283633A (en) Illumination apparatus
WO2018185859A1 (en) Protective structure of semiconductor element and air conditioner

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 15902298

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2017536148

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 15902298

Country of ref document: EP

Kind code of ref document: A1