WO2017028427A1 - 一种基于滚压式的热塑性树脂光转换体贴合封装led的智能控制系统及控制方法 - Google Patents

一种基于滚压式的热塑性树脂光转换体贴合封装led的智能控制系统及控制方法 Download PDF

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WO2017028427A1
WO2017028427A1 PCT/CN2015/097890 CN2015097890W WO2017028427A1 WO 2017028427 A1 WO2017028427 A1 WO 2017028427A1 CN 2015097890 W CN2015097890 W CN 2015097890W WO 2017028427 A1 WO2017028427 A1 WO 2017028427A1
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sensor
roller
roll
rolling
thermoplastic resin
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PCT/CN2015/097890
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English (en)
French (fr)
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何锦华
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江苏诚睿达光电有限公司
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Publication of WO2017028427A1 publication Critical patent/WO2017028427A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements

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  • the invention belongs to the field of LED intelligent control technology for light conversion body package, and particularly relates to an intelligent control system and a control method for vacuum-packaged LED based on a rolling type thermoplastic resin light conversion body.
  • LED has the advantages of high brightness, low heat, long life, environmental protection, and renewable utilization. It is called the most promising new generation of green lighting source in the 21st century. At present, although the theoretical life of LED can reach more than 100,000 hours, in actual use, it is subject to various factors such as chip failure, package failure, thermal overstress failure, electrical overstress failure or / and assembly failure. The failure of the package is particularly prominent, which causes the LED to appear prematurely with light decay or light failure, which will hinder the advancement of LED as a new energy-saving illumination source. In order to solve these problems, many scholars in the industry have carried out related research and proposed some improvement measures that can improve LED light efficiency and actual service life.
  • the newly developed flip-chip LED has the advantages of high luminous efficiency, high reliability and easy integration compared with the traditional formal LED, and the packaging material is greatly simplified, such as the gold wire and solid crystal glue of the traditional formal LED package. Materials such as brackets are no longer needed; the packaging process is also greatly simplified. For example, the solid crystal, wire bonding, and even splitting of the traditional LED packaging process are no longer needed, making flip-chip LEDs more and more widely used;
  • most of the existing flip-chip LED packaging technologies use a casting process of a silicone resin-based light conversion body and a flip-chip LED chip, a screen printing process, an upper and lower plate mold process, and a single roll.
  • the pendulum pressing process, etc., these processes and their associated packaging equipment can not solve the pores and thickness unevenness of the silicone resin light-converting body, resulting in low yield of the light-converting packaged LED;
  • the low production efficiency makes the product cost high.
  • Chinese Patent Application No. 201010204860.9 discloses "a method for packaging a flip-chip LED chip", the steps of which include: (a) applying a light conversion body to a surface of an LED chip by screen printing, and baking and curing the light conversion body; (b) fixing the LED chip on the chip substrate to bond the LED chip electrode to the chip substrate electrode; (c) fixing the LED chip and the chip substrate to the bottom of the holder reflector cup; (d) using the wire to fix the wire
  • the positive and negative electrodes of the chip substrate are respectively connected to the positive and negative electrodes of the bracket; (e) the mold or lens is placed on the bracket on which the LED chip and the chip substrate are fixed, and is filled with the silicone; (f) the overall structure is baked and cured.
  • the method improves the light transfer by a screen printing process
  • the uniformity of the thickness of the replacement coating increases the uniformity of the distribution of the phosphor particles to achieve the purpose of improving the yield; however, there are also the following obvious disadvantages:
  • First, the screen printing prints the silicone resin-based light converter
  • the surface of the LED chip which is then affected by the thermal overstress during the baking and curing process, may cause the light conversion body coating and the coating surface layer of the LED chip to partially generate bubbles to form uneven bumps; the second is to seal the mold or the lens cover. It is filled with silica gel and LED chip package coated with light conversion body.
  • the entire LED chip packaging process is not equipped with an intelligent control system for control, which directly affects the improvement of the yield.
  • Chinese Patent Application No. 201310270747.4 discloses "LEDs coated with a light conversion body layer, a method of manufacturing the same, and an LED device", the solution comprising: an LED arrangement step of arranging LEDs on one surface in a thickness direction of a support sheet; In the method of covering the LED, a light conversion body layer is provided on one surface in the thickness direction of the support sheet, and the light conversion body layer is composed of an active energy ray-curable resin and a light conversion body which are cured by irradiation with active energy rays.
  • Forming the composition Forming the composition; curing step, irradiating the light conversion body layer with the active energy ray to cure the light conversion body layer; and cutting the light conversion body layer corresponding to the LED to obtain the light conversion body including the LED and the coated LED
  • the purpose of this method is to provide an LED device in which a light conversion body is uniformly disposed around an LED to prevent damage, thereby obtaining an LED coated with a light conversion body layer, and an LED having the light conversion body layer coated thereon;
  • the fluorescent resin composition of the light-converting body may cause the localized bubbles of the surface layer of the light-converting body to form uneven ridges due to the influence of the thermal over-stress;
  • the light-converting layer is covered.
  • the LED will still be affected by thermal overstress, resulting in a decrease in light efficiency in the use of LEDs.
  • the process in the entire packaging process is cumbersome, and the production efficiency of packaged LEDs is not high.
  • the upper and lower flat mold process will lead to flipping. The chip is displaced, and there is no intelligent control system for precise control, which will inevitably lead to a reduction in yield.
  • Chinese Patent Application No. 201380027218.X discloses a "resin sheet laminate and a method for producing a semiconductor light-emitting device using the same", wherein the resin sheet laminate is provided with a light-converting resin layer on a substrate.
  • the light-converting body-containing resin layer has a plurality of blocks, the substrate has a longitudinal direction and a width direction, and the plurality of blocks are repeatedly arranged in a row in the longitudinal direction.
  • the object of the invention is to improve the uniformity of color and brightness of the semiconductor light-emitting device to which the light-converting resin layer is attached, the ease of manufacture, the degree of freedom in design, and the like by the resin sheet laminate.
  • the light conversion body resin sheet used is cured light conversion.
  • the resin sheet will not effectively eliminate the pores, irregularities or other processing defects that may remain therein.
  • pressurizing the press tool from the side of the semiconductor light-emitting element will damage the semiconductor light.
  • the third component is a binder-bonding process in the resin layer of the light-converting body. It is difficult to remove the residue in the bonded semiconductor light-emitting device, and the bonding process is prone to generate pores, which may result in a decrease in yield.
  • the presence of the bonding layer also reduces the light-emitting efficiency of the LED element; fourth, the substrate of the light-converting resin sheet bonded to the light-emitting surface of the semiconductor light-emitting element is not peeled off, and directly affects the light-emitting effect of the semiconductor light-emitting element;
  • the light conversion body resin layer is presented in such a manner that a plurality of blocks are repeatedly arranged in a column in the longitudinal direction. However, realizing a plurality of block configurations of the light conversion body resin layer, the actual operation procedure is cumbersome, and the package efficiency of the entire component is affected.
  • the arrangement error of the plurality of block regions in the position directly affects the accuracy of the subsequent bonding with the light-emitting elements, and the size and thickness between the plurality of blocks If the surface does not meet the requirements of consistency, the product may cause serious consistency issues.
  • An object of the present invention is to provide an intelligent control system and a control method for vacuum-packaged LEDs based on a roll-type thermoplastic resin light-converting body in order to overcome the deficiencies of the prior art.
  • the present invention has the function of detecting and controlling rolling stickers.
  • the invention is a divisional technical solution of a process method for coating and packaging LEDs based on a rolling type thermoplastic resin light-converting body proposed by the applicant.
  • An intelligent control system for a packaged LED based on a roll-type thermoplastic resin light-converting body is characterized in that it comprises at least a thermoplastic resin light-converting body rolled and packaged LED a roll forming and cutting forming process, a roll bonding type forming process, a process detecting unit of a curing forming process, a central control device, and a process driving unit; wherein: the process detecting unit includes at least a detecting light converting body film Rolling shaping and cutting forming device for forming a light conversion film array composed of a grooved monolithic light conversion film by a roll forming and cutting forming process for detecting a light conversion film array and an LED
  • the flip-chip array is a roll-bonding sensing device that is a component of an LED package by a roll-on-paste process, and a temperature-lowering curing device for detecting a finished LED package component by a curing process of the LED package component
  • the central control device includes a PLC controller and signal detection circuit units and signals respectively
  • the implementation principle of the present invention is: In order to better solve the problems existing in the above existing LED packaging process, the present invention designs an intelligent control system and control method suitable for a rolling type thermoplastic resin optical converter body-fit LED process method .
  • the intelligent control principle of the invention is: detection and regulation of the rolling shaping and cutting forming process, the rolling bonding synthesis process, and the curing molding process; wherein: one is the detection of the rolling shaping and cutting forming process And regulation, that is, the vacuum sensor, the temperature sensor, the roller and the roller or the roller in the rolling and shaping cutting device are aligned with the plane conveying device to set the sensor, the roller speed sensor or/and the plane conveying device
  • the forward speed sensor, the roller pitch or the roller and the plane conveyor spacing sensor respectively collect the conditions of the roll forming and cutting process formed by the array of the light conversion diaphragms composed of the grooved single light conversion diaphragm
  • the information is transmitted to the central control device through the data line for real-time analysis and processing, and the processed information is fed back
  • the third is the detection and regulation of the curing molding process, that is, the vacuum degree sensor, the temperature sensor and the time timer in the temperature-lowering curing sensor device respectively collect the working condition information of the LED package component during the curing process, and pass
  • the data line is transmitted to the central control unit for real-time analysis and processing, and the processed information is fed back to the solidified process drive unit through the data line for real-time regulation.
  • the intelligent control principle of the invention is also applicable to the detection and regulation of other processes such as slurry mixing, twin roll rolling and stretch film expansion. Compared with the prior art, the invention has the significant advantages that: the first invention can make the unevenness of the thermoplastic resin light conversion body film by detecting and regulating the rolling of the roller in the roll forming process of the roller.
  • Plastic flow is generated and filled into the original residual low concave valley to eliminate pores, irregularities or other processing defects remaining in the diaphragm of the light conversion body, thereby improving the fine system of the thermoplastic resin light conversion diaphragm To ensure that the thermoplastic resin photoconverter diaphragm has no porosity, flatness and uniform thickness, Improve the color consistency of the finished LED package components.
  • the invention can plastically deform the rolled thermoplastic resin light-converting body film during processing by detecting and regulating the rolling of the roller in the rolling shaping and cutting forming process, so as to form the most needed for design.
  • the shape of the optimized light-converting light-emitting surface layer such as an arc shape, a semi-spherical shape or a rectangular shape, thereby improving the light-emitting efficiency and light-emitting uniformity of the finished LED package component.
  • the invention provides a guarantee for continuous production and fine processing of a rolling-type thermoplastic resin optical converter body-fitted LED new process, which is favorable for satisfying the processing conditions and ensuring the specifications of the mass-produced LED package components, thereby The quality of the finished LED package components is guaranteed.
  • the present invention provides a guarantee for continuous and refined production of a new process for rolling a thermoplastic resin light-converting body to be packaged and packaged.
  • FIG. 1 is a schematic structural view of an intelligent control system for a packaged LED based on a roll-type thermoplastic resin optical converter according to the present invention.
  • FIG. 2 is a schematic structural view of a central control device of an intelligent control system for a packaged LED based on a roll-type thermoplastic resin light-converting body according to the present invention.
  • FIG. 3 is a schematic block diagram of an intelligent control system and a control method based on a roll-type thermoplastic resin optical converter body-fitted LED according to the present invention applied to a continuous process flow.
  • Example 1 and 2 an intelligent control system for a packaged LED based on a roll-type thermoplastic resin light-converting body, which comprises at least a roll forming and cutting for a thermoplastic resin light-converting body roll-fit package LED a step process, a roll press synthesis process, a process detection unit of a curing process, a central control device, and a process drive unit; as shown in FIG. 2, wherein:
  • the process detecting unit includes at least a roll forming and cutting for detecting a light conversion film array which is formed by a grooved single-piece light conversion film by a roll shaping and cutting forming process.
  • the central control device includes a PLC controller and a signal detection circuit unit respectively connected to the PLC controller signal, a signal sorting circuit unit, a signal optimization circuit unit, and a display for displaying the analysis information and displaying the command information;
  • the process driving unit includes an electric motor, a frequency converter, a multi-axis displacement adjuster and a brake for the respective process steps;
  • the central control device is connected to each of the process detecting unit and the process driving unit, and receives the state information of each of the process detecting units in real time and processes the operation information that is controlled in real time for each process driving unit.
  • the device, component or device in the process detecting unit, the central control device and the process driving unit according to the intelligent control system of the roll-type thermoplastic resin light-converting body bonded package LED according to the present invention can be in accordance with the present invention.
  • the requirements of the specific embodiments are preferred in the field of existing mechatronics and control.
  • the process detecting unit of the present invention further includes a slurry mixing sensing device for detecting a mixed state of the thermoplastic resin and the light converting material, wherein the slurry mixing sensor device includes a vacuum sensor and stirring Speed sensor, temperature sensor, mixed slurry level sensor, discharge rate sensor.
  • the slurry mixing sensor device includes a vacuum sensor and stirring Speed sensor, temperature sensor, mixed slurry level sensor, discharge rate sensor.
  • the process detecting unit of the present invention further includes a two-roll rolling sensing device for detecting a mixed slurry of a thermoplastic resin and a light converting material by a two-roll rolling process to obtain a light converting body film, as needed;
  • the roll sensing device includes one or more combinations of a vacuum sensor, a roller speed sensor, a roller and roller spacing sensor, and a temperature sensor.
  • the process detecting unit of the present invention further includes a stretched film-expanding sensing device for detecting a finished single LED package component by stretching a film of the finished LED package component through a stretch film expanding process;
  • the stretched film expansion sensing device includes an infrared imaging sensor and a stretch film tension sensor.
  • the rolling shaping and cutting sensing device comprises a vacuum degree sensor, a temperature sensor, a roller and a roller or a roller and a plane conveying device, and a sensor for aligning with the plane conveying device, a combination of one or more of a roller speed sensor or/and a planar conveyor forward speed sensor, a roller pitch or a roller and a planar conveyor spacing sensor;
  • the rolling and fitting sensing device comprises a vacuum sensor, a temperature sensor, a roller and a roller or a roller and a plane conveying device, a facing sensor, a roller speed sensor or/and a plane conveyor forward speed sensor, Roller spacing or combination of one or more of a roller and a planar conveyor spacing sensor;
  • the temperature-lowering curing sensing device includes one or more combinations of a vacuum sensor, a temperature sensor, and a time timer.
  • the design parameters and component selection of the process detecting unit, the central control device, and the process driving unit described above can be determined according to the specific process parameters of the rolling process of the thermoplastic resin optical converter body-fit package LED process.
  • a process for bonding a packaged LED based on a roll-type thermoplastic resin light-converting body comprising: preparation by at least a light conversion film, roll forming and cutting of a light conversion body film array, and LED package components
  • the basic process of the flow-through continuous process of the roll-formed composite and the LED forming process of the LED package component includes the following steps:
  • Step 1 preparation of the light conversion film: obtaining a light conversion film composed of at least a thermoplastic resin and a light conversion material;
  • Step 2 Rolling shaping and cutting of the optical converter film array: under vacuum conditions, the light conversion film described in step 1 is passed through the oppositely aligned rolling device 1 with bump array surface Rolling device for groove array surface
  • Step 3 Rolling and bonding of the LED package components: rolling and bonding the array of the light conversion film of step 2 and the LED flip chip array with the carrier film under vacuum conditions And flipping the LED flip-chip in the LED flip chip array into the recess of the monolithic light conversion film of the light conversion film array, thereby obtaining an LED package component;
  • the LED flip chip Refers to a single LED flip chip or LED flip chip assembly; wherein the LED flip chip assembly is composed of two or more single LED flip chips;
  • Step 4 curing molding of the LED package component: curing the LED package component under vacuum condition by using a cooling curing method, so that each single light conversion film attached to the LED flip chip array shrinks Naturally wrapped to obtain the finished LED package components.
  • the preparation of the light conversion film of step 1 may be carried out by vacuum-heating a mixed slurry comprising at least a thermoplastic resin and a light conversion material through a smooth double roll to obtain a light conversion film. That is, first, the mixed slurry is roll-formed by a smooth double roll A to obtain a crude light conversion film; and then the formed crude light conversion film is rolled and formed by a smooth double roll B. Refined light conversion diaphragm.
  • the finished LED package component described in step 4 may be stretched and expanded by a stretching machine to stretch the film, so that the finished LED package component is divided along the slit after stretching. Thus, a finished single LED package component is produced.
  • Example 3 the following is a new process of applying the invention to a roll-type thermoplastic resin light-converting body to package and package LEDs, and further details the intelligent control method of the present invention, which is based on the rolling type according to the present invention.
  • the invention relates to a method for controlling an intelligent control system for a thermoplastic resin light-converting body packaged LED, which comprises the steps of: a roll forming and a cutting forming process, a rolling press forming process, and a curing forming process; wherein:
  • the detection and regulation of the rolling shaping and cutting forming process are performed by setting a vacuum sensor, a temperature sensor, a roller and a roller or a roller in a rolling and shaping cutting device to face the plane conveying device to set a sensor.
  • the roller speed sensor or / and the plane conveyor forward speed sensor, the roller pitch or the roller and the plane conveyor spacing sensor are respectively collected to form a single-plate optical converter film with a groove during the rolling and cutting process
  • the working condition information is transmitted to the central control device through the data line for real-time analysis and processing, and the processed information is fed back to the process driving unit of the rolling shaping and cutting forming by the data line for real-time regulation.
  • the detection and regulation of the rolling and laminating process comprises setting a sensor and a roller by a vacuum degree sensor, a temperature sensor, a roller and a roller or a roller and a flat conveying device in a roll-fit sensing device.
  • the speed sensor or/and the plane conveyor forward speed sensor, the roller pitch or the roller and the plane conveyor spacing sensor respectively collect the LED flip chip array embedded in the groove of the single optical converter film for rolling bonding
  • the working condition information is transmitted to the central control device through the data line for real-time analysis and processing, and the processed information is then fed back to the rolling and pressing type process driving unit through the data line for real-time regulation.
  • the vacuum condition sensor, the temperature sensor and the time timer in the temperature-lowering curing sensing device respectively collect the working condition information during the curing process of the LED package component, and transmit the data to the central control through the data line.
  • the device performs real-time analysis and processing, and the processed information is fed back to the process unit of the solidification process through the data line for real-time regulation.
  • the control method of the invention further comprises the detection and regulation of the slurry mixing process, which is used for detecting the slurry mixing sensor
  • the vacuum degree sensor, the stirring speed sensor, the temperature sensor, the mixed slurry level sensor, and the discharge rate sensor respectively collect the working condition information of the photoconverter diaphragm in the slurry mixing process, and transmit it to the center through the data line.
  • the control device performs real-time analysis and processing, and the processed information is fed back to the slurry mixing process drive unit through the data line for real-time regulation.
  • the control method of the present invention further comprises the detection and regulation of the two-roll rolling forming process, the vacuum degree sensor for detecting the double-roll rolling sensing device, the roller rotation speed sensor, the roller and the roller spacing sensor, and the temperature.
  • the sensor separately collects the working condition information of the mixed slurry to form the light conversion diaphragm in the double roller rolling process, and transmits the data to the central control device for real-time analysis and processing through the data line, and the processed information is fed back to the double roller through the data line.
  • the pressure process drive unit performs real-time regulation.
  • the control method of the invention further comprises the detection and regulation of the stretch film expanding process, and the infrared image sensor and the tensile tension sensor in the stretch film expanding sensor device respectively collect the finished LED package component and the stretchable carrier film pull
  • the working condition information in the process of stretching and expanding is transmitted to the central control device through the data line for real-time analysis and processing, and the processed information is fed back to the process driving unit of the stretched film through the data line for real-time regulation.
  • the intelligent control system and the control method thereof based on the rolling type thermoplastic resin light conversion body laminated package LED can be further used for the process including the slurry mixing process and the double roll
  • the detection and regulation of the overall process flow consisting of the roll forming process, the roll forming process, the roll forming process, the roll bonding process, the curing process, and the stretch film forming process facilitates the formation of a remarkable synergistic effect. See Figure 3.
  • the invention has been verified by trial and error and has achieved satisfactory trial results.
  • the above specific embodiments and examples are specific support for the technical idea of an intelligent control system and a control method thereof for rolling LED-based thermoplastic resin light-converting body-fitted LEDs according to the present invention, and the scope of protection of the present invention cannot be limited thereto. Any equivalent changes or equivalent modifications made on the basis of the technical solutions according to the technical idea of the present invention are still within the scope of protection of the technical solutions of the present invention.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)

Abstract

一种基于滚压式的热塑性树脂光转换体贴合封装LED的智能控制系统及控制方法，它至少包括用于热塑性树脂光转换体滚压贴合封装LED的滚压定形和裁切成型工序、滚压贴合成型工序、固化成型工序的工序检测单元、中央控制装置和工序驱动单元；该中央控制装置分别与该各工序检测单元和工序驱动单元信号连接，通过实时接收该各工序检测单元的状态信息并处理成为对各工序驱动单元进行实时调控的运行信息。具有检测和控制滚压贴合封装LED工艺及装备系统的显著优点，以满足适于热塑性树脂光转换体贴合封装LED的工艺及装备系统的需要，从而提高工业化批量LED封装的生产效率和优品率。

Description

一种基于滚压式的热塑性树脂光转换体贴合封装LED的智能控制系统及控制方法 技术领域
本发明属于光转换体封装LED智能控制技术领域，特别是涉及一种基于滚压式的热塑性树脂光转换体真空贴合封装LED的智能控制系统及控制方法。
背景技术
LED具有高亮度、低热量、长寿命、环保、可再生利用等优点，被称为21世纪最有发展前景的新一代绿色照明光源。目前，虽然LED的理论寿命可以达到100000小时以上，然而在实际使用中，因为受到芯片失效、封装失效、热过应力失效、电过应力失效或/和装配失效等多种因素的制约，其中以封装失效尤为突出，而使得LED过早地出现了光衰或光失效的现象，这将阻碍LED作为新型节能型照明光源的前进步伐。为了解决这些问题，业界许多学者已开展了相关研究，并且提出了一些能够提高LED光效和实际使用寿命的改进措施。如近几年新发展起来的倒装LED与传统的正装LED相比，具有高光效、高可靠性和易于集成的优点，并且封装材料大幅简化，如传统正装LED封装的金线、固晶胶、支架等材料都不再需要；封装工艺流程也大幅简化，如传统正装LED封装工艺的固晶、焊线，甚至是分光等都不再需要，使得倒装LED得到越来越广泛的应用；但同时也要看到，现有倒装LED封装技术大多采用的是有机硅树脂类的光转换体与倒装LED芯片贴合的流延工艺、丝网印刷工艺、上下平板模工艺、单辊摆压工艺等，这些工艺及其相配套的封装装备均不能很好地解决有机硅树脂类光转换体存在的气孔、厚薄不均等瑕疵，造成光转换体封装LED的良品率低；同时还因生产效率低，使得产品成本居高不下。
中国专利申请201010204860.9公开了“一种倒装LED芯片的封装方法”，其步骤包括：(a)通过丝网印刷把光转换体涂覆于LED芯片表面，并对光转换体进行烘烤固化；(b)把LED芯片固定在芯片基板上，使LED芯片电极与芯片基板电极键合；(c)把LED芯片和芯片基板固定在支架反射杯的杯底；(d)利用导线将已固定的芯片基板的正负电极分别与支架的正负电极连接；(e)将封模或透镜盖在固定有LED芯片和芯片基板的支架上，并充满硅胶；(f)整体结构进行烘烤固化。该方法虽然通过丝网印刷工艺来提高光转 换体涂覆厚度的均匀性，提高荧光粉颗粒分布的均匀性，以达到提高良品率的目的；但还存在以下明显不足：一是丝网印刷把有机硅树脂类的光转换体涂覆于LED芯片表面，之后在烘烤固化过程中因受热过应力影响，还是会导致光转换体涂层与LED芯片的涂覆面层局部产生气泡而形成凹凸不平的瑕疵；二是将封模或透镜盖充满硅胶与涂覆有光转换体的LED芯片封装，之后整体结构进行烘烤固化过程中因受热过应力影响，还是会导致封模或透镜盖中的硅胶面层局部产生气泡而形成凹凸不平的瑕疵。因不能解决LED芯片封装过程中受热过应力的影响，必然会导致LED光效下降；三是整个LED芯片封装工艺未配备智能控制系统进行控制，直接影响良品率的提升。
中国专利申请201310270747.4公开了“被覆有光转换体层的LED、其制造方法以及LED装置”，该方案包括：LED配置工序，在支撑片的厚度方向的一个面上配置LED；层配置工序，以被覆LED的方式在支撑片的厚度方向的一个面上配置光转换体层，所述光转换体层由含有通过活性能量射线的照射而固化的活性能量射线固化性树脂以及光转换体的荧光树脂组合物形成；固化工序，对光转换体层照射活性能量射线，使光转换体层固化；裁切工序，与LED对应地裁切光转换体层，从而得到具备LED、和被覆LED的光转换体层的被覆有光转换体层的LED；以及LED剥离工序，在裁切工序之后，将被覆有光转换体层的LED从支撑片剥离。该方法的目的在于提供光转换体均匀配置在LED的周围以防损伤，从而得到被覆有光转换体层的LED、以及具备该被覆有光转换体层的LED的LED装置；但还存在以下明显不足：一是光转换体的荧光树脂组合物在固化过程中，因受热过应力影响，还是会导致光转换体面层的局部产生气泡而形成凹凸不平的瑕疵；二是覆有光转换体层的LED，仍然会受到热过应力影响，导致LED使用中出现光效下降；三是整个封装工艺中的工序比较繁琐，封装LED的生产效率不高；四是上下平板模工艺，会导致倒装芯片发生位移，且又无智能控制系统进行精确控制，必然造成良品率降低。
中国专利申请：201380027218.X公开了“树脂片材层合体及使用其的半导体发光元件的制造方法”，该方案所述树脂片材层合体是在基材上设置有含光转换体树脂层，所述含光转换体树脂层具有多个区块，基材具有长度方向和宽度方向，所述多个区块在长度方向上重复配置成列。虽然该方案的发明目的在于，通过所述树脂片材层合体，提高贴附有含光转换体树脂层的半导体发光元件的颜色和亮度的均匀性、制造的容易性、设计的自由度等，但还存在以下明显不足：一是采用的光转换体树脂片材为固化的光转换 体树脂片材，将无法有效消除其中可能残留的气孔、凹凸不平或其它加工瑕疵等；二是在粘接工序中，将加压工具自半导体发光元件侧向进行加压，将会损伤半导体发光元件；三是采用光转换体树脂层中含粘接剂粘接工艺，较难清除被粘接后的半导体发光元件中的残留物，粘接过程易产生气孔，会造成良品率降低，同时，粘接层的存在还降低了LED元件的出光效率；四是与半导体发光元件的发光面粘接的光转换体树脂片材的基材没有被剥离，合直接影响半导体发光元件的光效；五是光转换体树脂层以多个区块在长度方向上重复配置成列的方式呈现，然而实现该光转换体树脂层的多个区块配置，实际操作程序繁琐，将影响整个元件的封装效率，多个块区在位置上的布置差错会直接影响后续与发光元件之间的贴合的精确度，而多个区块之间在大小与厚度方面如果不能满足一致性的要求，则可能会导致严重的产品一致性问题。
综上所述，如何克服现有技术所存在的不足已成为当今光转换体封装LED装备技术领域中亟待解决的重大难题之一。
发明内容 本发明的目的是为克服现有技术的不足而提供一种基于滚压式的热塑性树脂光转换体真空贴合封装LED的智能控制系统及控制方法，本发明具有检测和控制滚压贴合封装LED工艺及装备系统的显著优点，以满足适于热塑性树脂光转换体贴合封装LED的工艺及装备系统的需要，从而提高工业化批量LED封装的生产效率和优品率。
本发明是本申请人提出的一种基于滚压式的热塑性树脂光转换体贴合封装LED的工艺方法的分案技术方案。
根据本发明提出的一种基于滚压式的热塑性树脂光转换体贴合封装LED的智能控制系统，其特征在于，其特征在于，它至少包括用于热塑性树脂光转换体滚压贴合封装LED的滚压定形和裁切成型工序、滚压贴合成型工序、固化成型工序的工序检测单元、中央控制装置和工序驱动单元；其中：所述工序检测单元至少包括用于检测将光转换体膜片通过滚压定形和裁切成型工序成为由带凹槽的单块光转换膜片所组成的光转换膜片阵列的滚压定形和裁切传感装置、用于检测将光转换膜片阵列与LED倒装芯片阵列通过滚压贴合成型工序成为LED封装体元件的滚压贴合传感装置、用于检测将LED封装体元件通过固化成型工序制得成品LED封装体元件的降温固化传感装置；所述中央控制装置包括PLC控制器以及分别与PLC控制器信号连接的信号检测电路单元、信号 分选电路单元、信号优化电路单元以及显示分析信息和显示指令信息的显示器；所述工序驱动单元包括用于所述各工序步骤的电动机、变频器、多轴位移调节器和制动器；所述中央控制装置分别与所述各工序检测单元和工序驱动单元信号连接，通过实时接收所述各工序检测单元的状态信息并处理成为对各工序驱动单元进行实时调控的运行信息。本发明的实现原理是：为更好地解决上述现有LED封装工艺所存在的问题，本发明设计了适用于滚压式的热塑性树脂光转换体贴合封装LED工艺方法的智能控制系统及控制方法。本发明的智能控制原理在于：对滚压定形和裁切成型工序、滚压贴合成型工序、固化成型工序的检测和调控；其中：一是对所述滚压定形和裁切成型工序的检测和调控，即由滚压定形裁切传感装置中的真空度传感器、温度传感器、辊轮与辊轮或辊轮与平面传送装置相向对准设置传感器、辊轮转速传感器或/和平面传送装置前行速度传感器、辊轮间距或辊轮与平面传送装置间距传感器分别采集形成由带凹槽的单块光转换膜片所组成的光转换膜片阵列的滚压定形和裁切过程中的工况信息，通过数据线传输到中央控制装置进行实时分析和处理，处理后的信息再通过数据线反馈到滚压定形和裁切成型的工序驱动单元进行实时调控；二是对所述滚压贴合成型工序的检测和调控，即由滚压贴合传感装置中的真空度传感器、温度传感器、辊轮与辊轮或辊轮与平面传送装置相向对准设置传感器、辊轮转速传感器或/和平面传送装置前行速度传感器、辊轮间距或辊轮与平面传送装置间距传感器分别采集LED倒装芯片阵列嵌入所述单块光转换体膜片的凹槽进行滚压贴合的工况信息，通过数据线传输到中央控制装置进行实时分析和处理，处理后的信息再通过数据线反馈到滚压贴合成型的工序驱动单元进行实时调控；三是对所述固化成型工序的检测和调控，即由降温固化传感装置中的真空度传感器、温度传感器和时间计时器分别采集LED封装体元件固化成型过程中的工况信息，通过数据线传输到中央控制装置进行实时分析和处理，处理后的信息再通过数据线反馈到固化成型的工序驱动单元进行实时调控。本发明的智能控制原理同样适用于对浆料混合、双辊滚压成型和拉伸扩膜等其它工序的检测和调控。本发明与现有技术相比其显著的优点在于：一是本发明能够通过对辊轮滚压成型工序中辊轮滚压的检测和调控，使热塑性树脂光转换体膜片中的凹凸不平之处产生塑性流动，填入到原始残留的低凹波谷中去，以消除光转换体膜片中可能残留的气孔、凹凸不平或其它加工瑕疵等，从而提高热塑性树脂光转换体膜片的精制度，确保热塑性树脂光转换体膜片无气孔、平整以及厚薄一致，以 提高成品LED封装体元件的光色一致性。
二是本发明能够通过对滚压定形和裁切成型工序中辊轮滚压的检测和调控，使被滚压的热塑性树脂光转换体膜片在加工中可塑性变形，以致形成设计所需要的最优化的光转换体发光面层的形状，如弧形、半圆球形或矩形等，从而提高成品LED封装体元件的出光效率和出光均匀性。
三是本发明为滚压式的热塑性树脂光转换体贴合封装LED新工艺实现连续化生产和精细化加工提供保证，有利于满足批量生产LED封装体元件的加工条件和保证规格尺寸完全一致，从而保证了成品LED封装体元件的优品率。
综上所述，本发明为满足滚压式的热塑性树脂光转换体贴合封装LED新工艺实现连续化和精细化生产提供了保证。
附图说明
图1为本发明提出的一种基于滚压式的热塑性树脂光转换体贴合封装LED的智能控制系统的结构示意图。
图2为本发明提出的一种基于滚压式的热塑性树脂光转换体贴合封装LED的智能控制系统的中央控制装置的结构示意图。
图3为本发明提出的一种基于滚压式的热塑性树脂光转换体贴合封装LED的智能控制系统及控制方法应用于连续化工艺流程方框示意图。
具体实施方式 下面将结合附图和实施例对本发明的具体实施方式作进一步的
详细说明。
实施例1。结合图1和图2，一种基于滚压式的热塑性树脂光转换体贴合封装LED的智能控制系统，它至少包括用于热塑性树脂光转换体滚压贴合封装LED的滚压定形和裁切成型工序、滚压贴合成型工序、固化成型工序的工序检测单元、中央控制装置和工序驱动单元；如图2所示，其中：
所述工序检测单元至少包括用于检测将光转换体膜片通过滚压定形和裁切成型工序成为由带凹槽的单块光转换膜片所组成的光转换膜片阵列的滚压定形和裁切传感装置、用于检测将光转换膜片阵列与LED倒装芯片阵列通过滚压贴合成型工序成为LED封装体元件的滚压贴合传感装置、用于检测将LED封装体元件通过固化成型工序制得 成品LED封装体元件的降温固化传感装置；
如图1所示，所述中央控制装置包括PLC控制器以及分别与PLC控制器信号连接的信号检测电路单元、信号分选电路单元、信号优化电路单元以及显示分析信息和显示指令信息的显示器；
所述工序驱动单元包括用于所述各工序步骤的电动机、变频器、多轴位移调节器和制动器；
所述中央控制装置分别与所述各工序检测单元和工序驱动单元信号连接，通过实时接收所述各工序检测单元的状态信息并处理成为对各工序驱动单元进行实时调控的运行信息。
特别需要说明的是：
本发明提出的一种基于滚压式的热塑性树脂光转换体贴合封装LED的智能控制系统所涉及的工序检测单元、中央控制装置和工序驱动单元中的器件、部件或装置等均可按照本发明具体实施方式的要求在现有机电一体化及控制领域中择优选用。
本发明提出的一种基于滚压式的热塑性树脂光转换体贴合封装LED的智能控制系统的进一步优选方案是：
根据需要，本发明所述工序检测单元还包括用于检测热塑性树脂和光转换材料的混合状态的浆料混合工序的浆料混合传感装置；所述浆料混合传感装置包括真空度传感器、搅拌转速传感器、温度传感器、混合浆料液面高度传感器、出料速率传感器。
根据需要，本发明所述工序检测单元还包括用于检测将热塑性树脂和光转换材料的混合浆料通过双辊滚压工序得到光转换体膜片的双辊滚压传感装置；所述双辊滚压传感装置包括真空度传感器、辊轮转速传感器、辊轮与辊轮间距传感器、温度传感器中的一个或多个组合。
根据需要，本发明所述工序检测单元还包括用于检测将成品LED封装体元件可拉伸载体膜片通过拉伸扩膜工序得到成品单颗LED封装体元件的拉伸扩膜传感装置；所述拉伸扩膜传感装置包括红外摄像传感器、拉伸膜张力传感器。
本发明所述工序检测单元的具体组成部件包括如下：所述滚压定形和裁切传感装置包括真空度传感器、温度传感器、辊轮与辊轮或辊轮与平面传送装置相向对准设置传感器、辊轮转速传感器或/和平面传送装置前行速度传感器、辊轮间距或辊轮与平面传送装置间距传感器中的一个或多个组合；
所述滚压贴合传感装置包括真空度传感器、温度传感器、辊轮与辊轮或辊轮与平面传送装置相向对准设置传感器、辊轮转速传感器或/和平面传送装置前行速度传感器、辊轮间距或辊轮与平面传送装置间距传感器中的一个或多个组合；
所述降温固化传感装置包括真空度传感器、温度传感器和时间计时器中的一个或多个组合。
以上所述工序检测单元、中央控制装置和工序驱动单元的设计参数和部件选择可根据本发明应用于滚压式的热塑性树脂光转换体贴合封装LED工艺过程的具体工艺参数来确定。
实施例2。下面以本发明应用于滚压式的热塑性树脂光转换体贴合封装LED的新工艺为例，进一步详细说明本发明所应用的新工艺的具体实施方式。一种基于滚压式的热塑性树脂光转换体贴合封装LED的工艺方法，其特征在于，包括至少由光转换膜片的准备、光转换体膜片阵列的滚压定形和裁切、LED封装体元件的滚压贴合成型和LED封装元件的固化成型工序构建的流程式连续工艺，其基本步骤包括如下：
步骤1，光转换膜片的准备：获取至少包括热塑性树脂和光转换材料所组成的光转换膜片；
步骤2，光转换体膜片阵列的滚压定形和裁切：在真空条件下，将步骤1所述的光转换膜片通过相向对准的带有凸块阵列面的滚压装置1与带有凹槽阵列面的滚压装置
2，进行协同滚压定形和裁切，得到由带凹槽的单块光转换膜片所组成的光转换膜片阵列，该光转换体膜片阵列中的各单块光转换膜片相互之间带有用于分割单块光转换膜片的切缝；
步骤3，LED封装体元件的滚压贴合成型：在真空条件下，将步骤2所述光转换膜片阵列与带有载体膜片的LED倒装芯片阵列进行相向对准的滚压贴合，使所述LED倒装芯片阵列中的LED倒装芯片贴合嵌入所述光转换膜片阵列的单块光转换膜片的凹槽中，从而得到LED封装体元件；所述LED倒装芯片是指单个LED倒装芯片或LED倒装芯片组件；其中，所述LED倒装芯片组件由两个或两个以上的单个LED倒装芯片组合而成；
步骤4，LED封装体元件的固化成型：在真空条件下，采用降温固化方式，将所述LED封装体元件进行固化，使得贴合在LED倒装芯片阵列上的各单块光转换膜片收缩而自然包裹，从而得到成品LED封装体元件。
根据需要，步骤1所述光转换膜片的准备，可采用在真空加热的条件下，将至少包括热塑性树脂和光转换材料的混合浆料通过光面双辊滚压，从而得到光转换膜片，即：首先将混合浆料通过光面双辊A滚压成型，制得粗制光转换膜片；然后再将成型后的粗制光转换膜片通过光面双辊B滚压成型，制得精制光转换膜片。
根据需要，还可将步骤4所述成品LED封装体元件，再通过拉伸机对其可拉伸载体膜片进行拉伸扩膜，使得成品LED封装体元件在拉伸后即沿切缝分割，从而制得成品单颗LED封装体元件。
实施例3。结合图3，下面以本发明应用于滚压式的热塑性树脂光转换体贴合封装LED的新工艺为例，进一步详细说明本发明的智能控制方法，根据本发明提出的一种基于滚压式的热塑性树脂光转换体贴合封装LED的智能控制系统的控制方法，其特征在于，包括对滚压定形和裁切成型工序、滚压贴合成型工序、固化成型工序的检测和调控；其中：
所述滚压定形和裁切成型工序的检测和调控，由滚压定形裁切传感装置中的真空度传感器、温度传感器、辊轮与辊轮或辊轮与平面传送装置相向对准设置传感器、辊轮转速传感器或/和平面传送装置前行速度传感器、辊轮间距或辊轮与平面传送装置间距传感器分别采集形成带有凹槽的单块光转换体膜片滚压裁切过程中的工况信息，通过数据线传输到中央控制装置进行实时分析和处理，处理后的信息再通过数据线反馈到滚压定形和裁切成型的工序驱动单元进行实时调控。
所述滚压贴合成型工序的检测和调控，由滚压贴合传感装置中的真空度传感器、温度传感器、辊轮与辊轮或辊轮与平面传送装置相向对准设置传感器、辊轮转速传感器或/和平面传送装置前行速度传感器、辊轮间距或辊轮与平面传送装置间距传感器分别采集LED倒装芯片阵列嵌入所述单块光转换体膜片的凹槽进行滚压贴合的工况信息，通过数据线传输到中央控制装置进行实时分析和处理，处理后的信息再通过数据线反馈到滚压贴合成型的工序驱动单元进行实时调控。
所述固化成型工序的检测和调控，由降温固化传感装置中的真空度传感器、温度传感器和时间计时器分别采集LED封装体元件固化成型过程中的工况信息，通过数据线传输到中央控制装置进行实时分析和处理，处理后的信息再通过数据线反馈到固化成型的工序驱动单元进行实时调控。
本发明的控制方法还包括对浆料混合工序的检测和调控，由用于检测浆料混合传感 装置中的真空度传感器、搅拌转速传感器、温度传感器、混合浆料液面高度传感器、出料速率传感器分别采集光转换体膜片在浆料混合过程中的工况信息，通过数据线传输到中央控制装置进行实时分析和处理，处理后的信息再通过数据线反馈到浆料混合工序驱动单元进行实时调控。
本发明的控制方法还包括对双辊滚压成型工序的检测和调控，由用于检测双辊滚压传感装置中的真空度传感器、辊轮转速传感器、辊轮与辊轮间距传感器、温度传感器分别采集混合浆料在双辊滚压过程中形成光转换膜片的工况信息，通过数据线传输到中央控制装置进行实时分析和处理，处理后的信息再通过数据线反馈到双辊滚压的工序驱动单元进行实时调控。
本发明的控制方法还包括对拉伸扩膜工序的检测和调控，由拉伸扩膜传感装置中的红外摄像传感器、拉伸张力传感器分别采集成品LED封装体元件可拉伸载体膜片拉伸扩膜过程中的工况信息，通过数据线传输到中央控制装置进行实时分析和处理，处理后的信息再通过数据线反馈到拉伸扩膜的工序驱动单元进行实时调控。
综上所述，根据实际需要，本发明提出的一种基于滚压式的热塑性树脂光转换体贴合封装LED的智能控制系统及其控制方法还可进一步用于对包括浆料混合工序、双辊滚压成型工序、滚压定形和裁切成型工序、滚压贴合成型工序、固化成型工序和拉伸扩膜工序组成的整体工艺流程的检测和调控，以利于形成整体协同作用的显著效果。参见图3所示。
本发明的具体实施方式中凡未涉到的说明属于本领域的公知技术，可参考公知技术加以实施。
本发明经反复试验验证，取得了满意的试用效果。以上具体实施方式及实施例是对本发明提出的一种基于滚压式的热塑性树脂光转换体贴合封装LED的智能控制系统及其控制方法技术思想的具体支持，不能以此限定本发明的保护范围，凡是按照本发明提出的技术思想，在本技术方案基础上所做的任何等同变化或等效的改动，均仍属于本发明技术方案保护的范围。

Claims (12)

  1. 一种基于滚压式的热塑性树脂光转换体贴合封装LED的智能控制系统，其特征在于，它至少包括用于热塑性树脂光转换体滚压贴合封装LED的滚压定形和裁切成型工序、滚压贴合成型工序、固化成型工序的工序检测单元、中央控制装置和工序驱动单元；其中：
    所述工序检测单元至少包括用于检测将光转换体膜片通过滚压定形和裁切成型工序成为由带凹槽的单块光转换膜片所组成的光转换膜片阵列的滚压定形和裁切传感装置、用于检测将光转换膜片阵列与LED倒装芯片阵列通过滚压贴合成型工序成为LED封装体元件的滚压贴合传感装置、用于检测将LED封装体元件通过固化成型工序制得成品LED封装体元件的降温固化传感装置；
    所述中央控制装置包括PLC控制器以及分别与PLC控制器信号连接的信号检测电路单元、信号分选电路单元、信号优化电路单元以及显示分析信息和显示指令信息的显示器；
    所述工序驱动单元包括用于所述各工序步骤的电动机、变频器、多轴位移调节器和制动器；
    所述中央控制装置分别与所述各工序检测单元和工序驱动单元信号连接，通过实时接收所述各工序检测单元的状态信息并处理成为对各工序驱动单元进行实时调控的运行信息。
  2. 根据权利要求1所述的一种基于滚压式的热塑性树脂光转换体贴合封装LED的智能控制系统，其特征在于，
    所述滚压定形和裁切传感装置包括真空度传感器、温度传感器、辊轮与辊轮或辊轮与平面传送装置相向对准设置传感器、辊轮转速传感器或/和平面传送装置前行速度传感器、辊轮间距或辊轮与平面传送装置间距传感器中的一个或多个组合；
    所述滚压贴合传感装置包括真空度传感器、温度传感器、辊轮与辊轮或辊轮与平面传送装置相向对准设置传感器、辊轮转速传感器或/和平面传送装置前行速度传感器、辊轮间距或辊轮与平面传送装置间距传感器中的一个或多个组合；
    所述降温固化传感装置包括真空度传感器、温度传感器和时间计时器中的一个或多个组合。
  3. 根据权利要求1所述的一种基于滚压式的热塑性树脂光转换体贴合封装LED的智能控制系统，其特征在于，所述工序检测单元还包括用于检测热塑性树脂和光转换材 料的混合状态的浆料混合工序的浆料混合传感装置。
  4. 根据权利要求3所述的一种基于滚压式的热塑性树脂光转换体贴合封装LED的智能控制系统，其特征在于，所述浆料混合传感装置包括真空度传感器、搅拌转速传感器、温度传感器、混合浆料液面高度传感器、出料速率传感器中的一个或多个组合。
  5. 根据权利要求4所述的一种基于滚压式的热塑性树脂光转换体贴合封装LED的智能控制系统，其特征在于，所述工序检测单元还包括用于检测将热塑性树脂和光转换材料的混合浆料通过双辊滚压工序得到光转换体膜片的双辊滚压传感装置。
  6. 根据权利要求5所述的一种基于滚压式的热塑性树脂光转换体贴合封装LED的智能控制系统，其特征在于，所述双辊滚压传感装置包括真空度传感器、辊轮转速传感器、辊轮与辊轮间距传感器、温度传感器中的一个或多个组合。
  7. 根据权利要求1或6所述的一种基于滚压式的热塑性树脂光转换体贴合封装LED的智能控制系统，其特征在于，所述工序检测单元还包括用于检测将成品LED封装体元件可拉伸载体膜片通过拉伸扩膜工序得到成品单颗LED封装元件的拉伸扩膜传感装置。
  8. 根据权利要求7所述的一种基于滚压式的热塑性树脂光转换体贴合封装LED的智能控制系统，其特征在于，所述拉伸扩膜传感装置包括红外摄像传感器和拉伸张力传感器中的一个或两个组合。
  9. 根据权利要求1所述的一种基于滚压式的热塑性树脂光转换体贴合封装LED的智能控制系统的控制方法，其特征在于，包括对滚压定形和裁切成型工序、滚压贴合成型工序、固化成型工序的检测和调控；其中：
    所述对滚压定形和裁切成型工序的检测和调控，由滚压定形裁切传感装置中的真空度传感器、温度传感器、辊轮与辊轮或辊轮与平面传送装置相向对准设置传感器、辊轮转速传感器或/和平面传送装置前行速度传感器、辊轮间距或辊轮与平面传送装置间距传感器分别采集形成由带凹槽的单块光转换膜片所组成的光转换膜片阵列的滚压定形和裁切过程中的工况信息，通过数据线传输到中央控制装置进行实时分析和处理，处理后的信息再通过数据线反馈到滚压定形和裁切成型的工序驱动单元进行实时调控；
    所述对滚压贴合成型工序的检测和调控，由滚压贴合传感装置中的真空度传感器、温度传感器、辊轮与辊轮或辊轮与平面传送装置相向对准设置传感器、辊轮转速传感器或/和平面传送装置前行速度传感器、辊轮间距或辊轮与平面传送装置间距传感器分别采 集LED阵列嵌入所述单块光转换体膜片的凹槽进行滚压贴合的工况信息，通过数据线传输到中央控制装置进行实时分析和处理，处理后的信息再通过数据线反馈到滚压贴合成型的工序驱动单元进行实时调控；
    所述对固化成型工序的检测和调控，由降温固化传感装置中的真空度传感器、温度传感器和时间计时器分别采集LED封装元件固化成型过程中的工况信息，通过数据线传输到中央控制装置进行实时分析和处理，处理后的信息再通过数据线反馈到固化成型的工序驱动单元进行实时调控。
  10. 根据权利要求4所述的一种基于滚压式的热塑性树脂光转换体贴合封装LED的智能控制系统的控制方法，其特征在于，所述对浆料混合工序的检测和调控，由用于检测浆料混合传感装置中的真空度传感器、搅拌转速传感器、温度传感器、混合浆料液面高度传感器、出料速率传感器分别采集浆料混合过程中的工况信息，通过数据线传输到中央控制装置进行实时分析和处理，处理后的信息再通过数据线反馈到浆料混合工序驱动单元进行实时调控。
  11. 根据权利要求6所述的一种基于滚压式的热塑性树脂光转换体贴合封装LED的智能控制系统的控制方法，其特征在于，所述对双辊滚压成型工序的检测和调控，由用于检测双辊滚压传感装置中的真空度传感器、辊轮转速传感器、辊轮与辊轮间距传感器、温度传感器分别采集混合浆料在双辊滚压过程中形成光转换体膜片的工况信息，通过数据线传输到中央控制装置进行实时分析和处理，处理后的信息再通过数据线反馈到双辊滚压的工序驱动单元进行实时调控。
  12. 根据权利要求8所述的一种基于滚压式的热塑性树脂光转换体贴合封装LED的智能控制系统的控制方法，其特征在于，所述对拉伸扩膜工序的检测和调控，由拉伸扩膜传感装置中的红外摄像传感器、拉伸膜张力传感器分别采集成品LED封装体元件可拉伸载体膜片拉伸扩膜过程中的工况信息，通过数据线传输到中央控制装置进行实时分析和处理，处理后的信息再通过数据线反馈到拉伸扩膜的工序驱动单元进行实时调控。
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