WO2017018657A1 - Conductive adhesive tape using conductive cushion ball and method for manufacturing same - Google Patents

Conductive adhesive tape using conductive cushion ball and method for manufacturing same Download PDF

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Publication number
WO2017018657A1
WO2017018657A1 PCT/KR2016/006332 KR2016006332W WO2017018657A1 WO 2017018657 A1 WO2017018657 A1 WO 2017018657A1 KR 2016006332 W KR2016006332 W KR 2016006332W WO 2017018657 A1 WO2017018657 A1 WO 2017018657A1
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WO
WIPO (PCT)
Prior art keywords
conductive
cushion ball
conductive adhesive
adhesive tape
adhesive
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Application number
PCT/KR2016/006332
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French (fr)
Korean (ko)
Inventor
문호섭
Original Assignee
(주)트러스
문호섭
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Publication of WO2017018657A1 publication Critical patent/WO2017018657A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives

Definitions

  • the present invention relates to a conductive adhesive tape using a conductive cushion ball, and more particularly, the conductive adhesive ball coated with a conductive metal on the outer surface and a pressure-sensitive adhesive mixed with a predetermined ratio on one or both sides of the release paper by applying a conductive adhesive
  • the present invention relates to a conductive adhesive tape using a conductive cushion ball, and a method of manufacturing the same.
  • a conductive adhesive is used for mechanical and electrical connection between a flexible printed circuit (FPC) and a glass display.
  • the conductive adhesive is largely in the form of an isotropic conductive adhesive (ACF), an anisotropic conductive film (ACF), etc.
  • ACF isotropic conductive adhesive
  • ACF anisotropic conductive film
  • monodisperse conductive fine particles are dispersed in a thermosetting or thermoplastic insulating resin.
  • the adhesive tape using the conductive adhesive as described above when the thickness of the pressure-sensitive adhesive is formed thicker than 0.02mm, the electrical flowability is good only when the content of the metal powder contained in the adhesive is increased proportionally very, If it exceeds 0.04mm, it is difficult to increase the content, so the size of the metal powder must be increased.
  • the present invention has been made in order to solve the problems of the prior art, by applying a pressure-sensitive adhesive in which the conductive cushion ball and the adhesive resin coated with a conductive metal on the outer surface at a predetermined ratio to the one or both sides of the release paper to produce a conductive adhesive tape Therefore, the object of the present invention is to provide a conductive adhesive tape using a conductive cushion ball and a method of manufacturing the same, wherein the sticking material is easily adhered to a plane to be adhered to the surface to be attached by improving the protrusion through deformation and restoring characteristics of its pressing. .
  • another object of the technology according to the present invention is to apply a pressure-sensitive adhesive, a conductive cushion ball coated with a conductive metal on the outer surface and a pressure-sensitive adhesive in a predetermined ratio on one or both sides of the release paper to produce a conductive adhesive tape to its own pressing
  • the object of the present invention is to improve the electrical properties by improving the protrusion through deformation and restoring characteristics.
  • the present invention configured to achieve the above object is as follows. That is, the conductive adhesive tape using the conductive cushion ball according to the present invention has a conductive metal layer plated on the outer circumferential surface of the elastic polymer cushion ball which is formed inside the gas layer with respect to 100 parts by weight of the adhesive resin and is restored to the external magnetic poles.
  • the conductive pressure-sensitive adhesive ball is prepared by applying a conductive pressure-sensitive adhesive with a mixed composition of 0.2 to 30 parts by weight on one or both sides of the film.
  • the conductive metal layer in the configuration according to the present invention as described above is made of any one selected from the group consisting of copper (Cu), nickel (Ni), silver (Ag), tungsten (W), gold (Au) and aluminum (Al). Can be.
  • the conductive metal layer may be made of a configuration in which the plating on the outer peripheral surface of the cushion ball through electroless plating.
  • the adhesive resin in the configuration according to the invention may be composed of a single material or a mixture of two or more selected from the group consisting of acrylic, silicone, urethane, epoxy, PE, natural or synthetic rubber.
  • a release paper may be further attached to the conductive adhesive surface of the conductive adhesive tape in the configuration according to the present invention.
  • a method of manufacturing a conductive adhesive tape using a conductive cushion ball includes (a) a polymer material having elasticity which is formed inside the gas layer with respect to 100 parts by weight of the adhesive resin and is restored to an external magnetic pole. Forming a conductive pressure-sensitive adhesive by mixing 0.2 to 30 parts by weight of a conductive cushion ball plated with a conductive metal layer on an outer circumferential surface of the cushion ball; And (b) applying the conductive adhesive prepared in step (a) to one or both sides of the film to produce a conductive tape.
  • the conductive metal layer is formed of copper (Cu), nickel (Ni), silver (Ag), tungsten (W), gold (Au), and aluminum (Al). It may be made of any one selected from the group.
  • the conductive metal layer in the step (a) process of the configuration according to the present invention may be made of a configuration in which the plating on the outer peripheral surface of the cushion ball through electroless plating.
  • the adhesive resin in the step (a) of the configuration according to the present invention may be composed of a single material or a mixture of two or more selected from the group consisting of acrylic, silicone, urethane, epoxy, PE, natural or synthetic rubber.
  • the process of the release paper is further attached to the conductive pressure-sensitive adhesive surface of the conductive adhesive tape prepared in step (b) of the configuration according to the present invention may be added.
  • a pressure-sensitive adhesive by applying a pressure-sensitive adhesive, a conductive cushion coated with a conductive metal on the outer surface and a pressure-sensitive adhesive in a predetermined ratio on one or both sides of the release paper to produce a conductive adhesive tape deformation and recovery characteristics of its own pressing
  • the protrusion phenomenon can be improved, so that the adhesive material can be easily adhered to the plane to be attached.
  • the technology according to the present invention by applying a pressure-sensitive adhesive in which the conductive cushion ball and the adhesive resin coated with a conductive metal on the outer surface at a predetermined ratio to one or both sides of the release paper to produce a conductive adhesive tape deformation and its own pressing Through the restoring property, it is possible to improve the protruding phenomenon and to maintain the electrical property well.
  • FIG. 1 is a cross-sectional view showing a conductive cushion ball according to the present invention.
  • Figure 2 is a cross-sectional view showing a conductive tape using a conductive cushion ball according to the present invention.
  • Figure 3 is a cross-sectional view showing the electrical flow of the conductive cushion ball in the configuration of the conductive electrodeposition agent according to the present invention.
  • Figure 4 is an enlarged view showing the conductive pressure-sensitive adhesive containing the conductive cushion ball according to the present invention through an electron microscope.
  • Figure 5a is an enlarged photograph of a conductive pressure-sensitive adhesive mixed with a metal powder of the prior art.
  • Figure 5b is an enlarged photograph of the conductive pressure-sensitive adhesive is a conductive cushion ball mixed composition according to the present invention.
  • Figure 6 is a photograph showing a comparison of the surface of the conductive tape (a) using a conventional metal powder and the conductive tape (b) using a conductive cushion ball according to the present invention.
  • FIG. 1 is a cross-sectional view showing a conductive cushion ball according to the present invention
  • Figure 2 is a cross-sectional view showing a conductive tape using a conductive cushion ball according to the invention
  • Figure 3 is a conductive cushion in the configuration of a conductive electrodeposition agent according to the present invention
  • 4 is an enlarged view showing the conductive adhesive ball containing the conductive cushion ball according to the present invention through an electron microscope
  • FIG. 5A is a conductive adhesive mixed with a metal powder of the prior art.
  • FIG. 5b is an enlarged picture
  • Figure 5b is a picture showing an enlarged conductive adhesive mixed with a conductive cushion ball according to the present invention
  • Figure 6 is a conductive tape (a) using a metal powder of the prior art and the conductive cushion according to the present invention It is a photograph showing the surface (b) of the conductive tape which used the ball compared.
  • the conductive adhesive tape 100 using the conductive cushion ball according to the present invention has a certain ratio of the adhesive resin 130 and the conductive cushion ball 200 on one or both sides of the film paper 110.
  • the conductive pressure-sensitive adhesive 120 is mixed with a composition made of a predetermined thickness.
  • the conductive adhesive tape 100 mixes the conductive cushion ball 200 with the adhesive resin 130 at a predetermined ratio to form the conductive adhesive 120, and then forms the conductive adhesive 120.
  • the present invention relates to a conductive adhesive tape 100 for EMI shielding by applying a conductive adhesive 120 on one or both surfaces of the film paper 110 and fixing the conductive adhesive 120 on the film paper 110.
  • the conductive adhesive 120 constituting the conductive adhesive tape 100 made of a configuration in which the conductive adhesive 120 is applied to one surface or both surfaces of the film paper 110 with a predetermined thickness, the adhesive resin 130, 100 It consists of the structure which mixed 0.2-30 weight part of electroconductive cushion balls 200 with respect to a weight part.
  • the conductive cushion ball 200 is in the form of a ball, with a cushion ball 210 of a polymer material containing a gas therein to have an elastic force restored to the external pressure Made of a metal layer 220 is coated on the outer surface of the cushion ball 210 to maintain conductivity.
  • the outer shell of the polymer cushion ball 210 as described above may be formed to have a diameter of 0.01 to 1.00 mm as a whole in consideration of the thickness of the conductive final product.
  • the contained gas is to have an elastic force restored to the external pressure to maintain the spherical shape of the conductive cushion ball 210, through which the conductive cushion ball 200 is to maintain a continuous impact-resistant properties.
  • a material other than a gas may be contained, but in order to exhibit cushioning performance in a thin film product, a gas having excellent recovery rate may be used. This is also very good in terms of weight reduction.
  • any gas may be used, but a risk such as an explosion due to spillage may occur, and thus, nitrogen (N 2 ) gas, which is preferable in terms of stability, is used as shown in FIG. 1. It was.
  • the conductive cushion ball 200 described above is a polymer cushion ball 210 having a gas layer (or nitrogen gas layer) therein and having elasticity on the outside thereof, and electroless plating on the outer surface of a material having a specific gravity of 0.5 or less.
  • the metal layer 220 uses a metal material having good electrical flow such as copper (Cu), nickel (Ni), silver (Ag), tungsten (W), gold (Au), and aluminum (Al).
  • the thickness of 220 should be maintained at 2 nm or more in view of the electrical flowability.
  • the conductive cushion ball 200 is mixed with the adhesive resin 130 to manufacture the conductive shielding tape 100 for EMI shielding.
  • the size of the conductive cushion ball 200 is applied up to 0.01 ⁇ 1.00mm, the specific gravity is 0.5 or less of the polymer material and the metal layer 220 plated on the shell of the cushion ball 210 is electroless Plating takes place through plating.
  • the material of the electroless plating is applied to a material having electrical conductivity such as gold, silver, nickel, copper, aluminum and tungsten, but in order to maintain the characteristics of the cushion ball 210, 1000% or less of the weight of the cushion ball 210 Electroless plating is carried out at a specific gravity of.
  • the conductive cushion ball 200 as described above has a characteristic of being pressed and distorted when a load is applied, and has an internal structure of a gas layer for restoring when the load is removed.
  • nitrogen (N 2 ) gas may be used in terms of stability.
  • the conductive cushion ball 200 described above is made of a polymer material containing a gas therein so as to have an elastic force restored to an external pressure.
  • the contained gas may be various gases including nitrogen (N 2 ), and may be formed to have a diameter of 0.01 to 1.00 mm as a whole in consideration of the thickness of the final product.
  • the manufacturing method of the conductive cushion ball 200 at this time is as follows.
  • the polymer in which the gas is introduced is left at a predetermined temperature (high temperature) so that the outer surface of the polymer material reaches the glass transition temperature (Tg). Accordingly, the outer shell of the polymer material is expanded. The outer shell of the polymer material is then cured by cooling below the critical point at which the outer shell of the polymer material can withstand. As a result, the outer layer becomes thinner and the contained gas layer volume becomes larger.
  • the cushion ball 210 of the polymer material as described above uses a melting point of more than 90 °C material.
  • a metal layer is coated on the outer surface of the cushion ball 210 made of a polymer material expanded by heat to maintain conductivity.
  • the conductive cushion ball 200 is formed by coating the metal layer 220 on the outer surface of the cushion ball 210 provided to maintain the conductivity.
  • the outer layer of the cushion ball 210 is plated with a metal layer using electroless plating. That is, the catalyst is deposited on the outer surface of the cushion ball 210, and a single layer of metal such as copper (Cu), nickel (Ni), silver (Ag), tungsten (W), gold (Au), and aluminum (Al) is deposited.
  • the metal layer 220 is coated by electroless plating with heterogeneous multilayers.
  • the metal layer 220 uses a metal material having good electrical flow such as copper (Cu), nickel (Ni), silver (Ag), tungsten (W), gold (Au), and aluminum (Al).
  • the thickness of the metal layer 220 should be maintained at 2 nm or more in view of the electrical flowability.
  • the conductive cushion ball 200 coated with the metal layer 220 may be single or various sizes as shown in FIGS. 3 and 4.
  • the conductive cushion ball 200 prepared as described above is mixed with the adhesive resin 120 at a predetermined ratio to prepare the conductive adhesive 120.
  • the mixing ratio of the adhesive resin 130 and the conductive cushion ball 200 constituting the conductive adhesive 120 is mixed in a ratio of 0.2 to 30 parts by weight of the conductive cushion ball 200 with respect to 100 parts by weight of the adhesive resin 130. It is created.
  • the adhesive resin 130 may be adjusted according to the adhesion degree between the conductive cushion balls 200 and the size of the conductive cushion balls 200.
  • the conductive adhesive 120 prepared as described above is applied to one side or both sides of the film paper 110 as shown in FIG. 2 and adhered to a predetermined thickness to adhere to the adhesive portion of the conductive adhesive tape 100 to be manufactured in the present invention. Will form.
  • the conductive adhesive tape 100 may be rolled so as to be rolled so that the adhesive portion is positioned inside the conductive adhesive tape 100 in a structure in which the conductive adhesive 120 is applied to one surface or both surfaces of the film paper 110 at a predetermined thickness.
  • the release paper 150 may be attached to the surface of the conductive adhesive 120 of the conductive adhesive tape 100 to produce a product. The release paper 150 is separated from the surface of the conductive adhesive 120 when the conductive adhesive tape 100 is attached to the place of use.
  • the conductive cushion ball according to the pressing pressure at the time of attaching the reduced pressure when applying the adhesive resin 130 mixed with the conductive cushion ball 200 as shown in Figs. 5b and 6 (b) of the technology according to the present invention ( 200) is pressed and the entire surface is in contact with the surface to be attached, which increases the attachment area by more than 50% compared with the metal powder. Accordingly, adhesion and electrical properties are improved and appearance defects due to protrusions are solved.
  • the specific weight is very low compared to the conventional method using a thick metal conductive material as the thickness increases, it is possible to significantly reduce the overall weight. That is, while the specific gravity of the existing metal powder is 2.7 to 9.8 on average, the specific gravity of the conductive cushion ball 200 is 2.0 or less, so that the total weight can be significantly reduced.
  • the particle size can be selected according to the coating thickness, and the deformation and restoring characteristics of the pressing itself are improved.
  • the pressure-sensitive adhesive material is easily adhered to the plane to be adhered to the surface to be attached, so that the adhesive strength and the electrical properties can be maintained.

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)

Abstract

The present invention relates to a conductive adhesive tape using a conductive cushion ball and a method for manufacturing the same, and has a purpose of manufacturing a conductive adhesive tape by applying an adhesive on one side or both sides of a release paper, the adhesive formed by mixing a conductive cushion ball, on the outer surface of which a conductive metal is coated, with an adhesive resin in a certain ratio, thereby a protrusion phenomenon being improved through a property of suppression and deformation recovery whereby an adhesive material is flatly and easily adhered to a surface to be attached. The present invention, configured for the aforementioned purpose, is manufactured by applying a conductive adhesive on one side or both sides of a film paper, the conductive adhesive being composed by mixing a 0.2-30 parts by weight of the conductive cushion ball, on the outer circumferential surface of which a conductive metal layer is plated, relative to a 100 parts by weight of adhesive resin, the cushion ball being made of a polymer material having a flexibility of being recovered against an external stimulus with a gas layer formed therein.

Description

도전성 쿠션볼을 이용한 도전성 점착테이프와 이의 제조방법 Conductive Adhesive Tape Using Conductive Cushion Ball and Manufacturing Method Thereof
본 발명은 도전성 쿠션볼을 이용한 도전성 점착테이프에 관한 것으로, 더욱 상세하게는 외면에 도전성 금속이 코팅된 도전성 쿠션볼과 점착성 수지를 일정 비율로 혼합 조성한 점착제를 이형지의 일면 또는 양면에 도포하여 도전성 점착테이프를 제조할 수 있도록 한 도전성 쿠션볼을 이용한 도전성 점착테이프와 이의 제조방법에 관한 것이다.The present invention relates to a conductive adhesive tape using a conductive cushion ball, and more particularly, the conductive adhesive ball coated with a conductive metal on the outer surface and a pressure-sensitive adhesive mixed with a predetermined ratio on one or both sides of the release paper by applying a conductive adhesive The present invention relates to a conductive adhesive tape using a conductive cushion ball, and a method of manufacturing the same.
일반적으로 LCD, PDP, 유기 EL 등의 전자 패키징에서 회로의 초미세 간극화 및 접속밀도의 증가에 따라 좁은 간격을 가지는, 많은 수의 전극을 한 번에 접속시킬 필요성이 증가하고 있다.In general, in electronic packaging such as LCDs, PDPs and organic ELs, the necessity of connecting a large number of electrodes with narrow spacing at a time is increasing as the circuit becomes extremely fine and the connection density increases.
특히, 전술한 바와 같은 전자 패키징 중에서 액정디스플레이(LCD) 패키징에서는 다중 접속회로라인(FPC, Flexible Printed Circuit)과 유리 디스플레이(Glass Display)와의 기계적·전기적 접속용으로 도전성 접착제(Conductive adhesive)가 이용되고 있다.In particular, among the electronic packaging as described above, in the liquid crystal display (LCD) packaging, a conductive adhesive is used for mechanical and electrical connection between a flexible printed circuit (FPC) and a glass display. have.
한편, 도전성 점착제는 크게 등방성 도전 점착제(isotropic conductive adhesive)와 이방성 도전필름(ACF, anisotropic conductive film) 등의 형태가 있으며, 기본적으로 단분산 도전 미립자가 열경화성 또는 열가소성의 절연성 수지에 분산되어 있는 형태를 가진다.On the other hand, the conductive adhesive is largely in the form of an isotropic conductive adhesive (ACF), an anisotropic conductive film (ACF), etc. Basically, monodisperse conductive fine particles are dispersed in a thermosetting or thermoplastic insulating resin. Have
그리고, 전술한 바와 같은 도전성 점착제를 이용한 점착용 테이프는 형성되는 점착제의 두께가 0.02㎜를 넘어 두꺼워지는 경우 점착제 내에 함유되는 금속 파우더의 함량이 비례적으로 매우 증가되어야 전기 흐름성이 양호해지며, 0.04㎜를 넘어서는 경우 함량 증가로 어려움이 있어 금속파우더의 크기를 증가해야만 한다.In addition, the adhesive tape using the conductive adhesive as described above, when the thickness of the pressure-sensitive adhesive is formed thicker than 0.02mm, the electrical flowability is good only when the content of the metal powder contained in the adhesive is increased proportionally very, If it exceeds 0.04㎜, it is difficult to increase the content, so the size of the metal powder must be increased.
전술한 바와 같이 금속파우더의 크기가 증가되는 경우 점착제의 표면에 돌출되는 현상이 발생하고 이는 테이프의 외관에 돌기 형상으로 나타나 외관적 문제를 발생시키며 또한 테이프를 부착시 돌기 주변으로 밀착되지 못하는 부위가 많아져 접착 성능 및 제품의 전기적 특성에 문제를 발생시킨다.As described above, when the size of the metal powder is increased, a phenomenon that protrudes on the surface of the adhesive occurs, which appears as a protrusion on the exterior of the tape, which causes an appearance problem. This causes problems in adhesion performance and electrical properties of the product.
[선행기술문헌][Preceding technical literature]
[특허문헌][Patent Documents]
대한민국 공개특허 제10-2000-0060106호(2000.10.16.자 공개)Republic of Korea Patent Publication No. 10-2000-0060106 (published October 16, 2000)
본 발명은 종래 기술의 제반 문제점을 해결하기 위해 안출된 것으로, 외면에 도전성 금속이 코팅된 도전성 쿠션볼과 점착성 수지를 일정 비율로 혼합 조성한 점착제를 이형지의 일면 또는 양면에 도포하여 도전성 점착테이프를 제조함으로써 자체의 눌림에 대한 변형 및 복원 특성을 통해 돌출 현상이 개선되어 부착하고자 하는 면에 점착성 물질이 평면으로 쉽게 밀착되도록 한 도전성 쿠션볼을 이용한 도전성 점착테이프와 이의 제조방법을 제공함에 그 목적이 있다.The present invention has been made in order to solve the problems of the prior art, by applying a pressure-sensitive adhesive in which the conductive cushion ball and the adhesive resin coated with a conductive metal on the outer surface at a predetermined ratio to the one or both sides of the release paper to produce a conductive adhesive tape Therefore, the object of the present invention is to provide a conductive adhesive tape using a conductive cushion ball and a method of manufacturing the same, wherein the sticking material is easily adhered to a plane to be adhered to the surface to be attached by improving the protrusion through deformation and restoring characteristics of its pressing. .
아울러, 본 발명에 따른 기술의 다른 목적은 외면에 도전성 금속이 코팅된 도전성 쿠션볼과 점착성 수지를 일정 비율로 혼합 조성한 점착제를 이형지의 일면 또는 양면에 도포하여 도전성 점착테이프를 제조함으로써 자체의 눌림에 대한 변형 및 복원 특성을 통해 돌출 현상이 개선되어 전기적 특성 유지가 양호하도록 함에 그 목적이 있다.In addition, another object of the technology according to the present invention is to apply a pressure-sensitive adhesive, a conductive cushion ball coated with a conductive metal on the outer surface and a pressure-sensitive adhesive in a predetermined ratio on one or both sides of the release paper to produce a conductive adhesive tape to its own pressing The object of the present invention is to improve the electrical properties by improving the protrusion through deformation and restoring characteristics.
전술한 목적을 달성하기 위해 구성된 본 발명은 다음과 같다. 즉, 본 발명에 따른 도전성 쿠션볼을 이용한 도전성 점착테이프는 점착성 수지 100 중량부에 대하여 내부에 기체층이 형성되어 외부의 자극에 복원되는 탄력성이 있는 폴리머 재질의 쿠션볼 외주면에 도전성 금속층이 도금된 도전성 쿠션볼 0.2∼30 중량부가 혼합 조성된 도전성 점착제를 필름지의 일면 또는 양면에 일정 두께로 도포하여 제조된다.The present invention configured to achieve the above object is as follows. That is, the conductive adhesive tape using the conductive cushion ball according to the present invention has a conductive metal layer plated on the outer circumferential surface of the elastic polymer cushion ball which is formed inside the gas layer with respect to 100 parts by weight of the adhesive resin and is restored to the external magnetic poles. The conductive pressure-sensitive adhesive ball is prepared by applying a conductive pressure-sensitive adhesive with a mixed composition of 0.2 to 30 parts by weight on one or both sides of the film.
전술한 바와 같은 본 발명에 따른 구성에서 도전성 금속층은 구리(Cu), 니켈(Ni), 은(Ag), 텅스텐(W), 금(Au) 및 알루미늄(Al)으로 이루어지는 군으로부터 선택된 어느 하나로 이루어질 수 있다.The conductive metal layer in the configuration according to the present invention as described above is made of any one selected from the group consisting of copper (Cu), nickel (Ni), silver (Ag), tungsten (W), gold (Au) and aluminum (Al). Can be.
그리고, 본 발명에 따른 구성에서 도전성 금속층은 무전해 도금을 통해 쿠션볼 외주면 상에 도금이 이루어지는 구성으로 이루어질 수 있다.And, in the configuration according to the invention the conductive metal layer may be made of a configuration in which the plating on the outer peripheral surface of the cushion ball through electroless plating.
한편, 본 발명에 따른 구성에서 점착성 수지는 아크릴, 실리콘, 우레탄, 에폭시, PE, 천연 또는 합성 고무계로 이루어지는 군으로부터 선택된 단일물 또는 둘 이상의 혼합물로 이루어질 수 있다.On the other hand, the adhesive resin in the configuration according to the invention may be composed of a single material or a mixture of two or more selected from the group consisting of acrylic, silicone, urethane, epoxy, PE, natural or synthetic rubber.
아울러, 본 발명에 따란 구성에서 도전성 점착테이프의 도전성 점착제 표면에는 이형지가 더 부착될 수 있다.In addition, a release paper may be further attached to the conductive adhesive surface of the conductive adhesive tape in the configuration according to the present invention.
본 발명에 다른 기술의 다른 특징은 도전성 쿠션볼을 이용한 도전성 점착테이프의 제조방법은 (a) 점착성 수지 100 중량부에 대하여 내부에 기체층이 형성되어 외부의 자극에 복원되는 탄력성이 있는 폴리머 재질의 쿠션볼 외주면에 도전성 금속층이 도금된 도전성 쿠션볼 0.2∼30 중량부를 혼합하여 도전성 점착제를 조성하는 단계; 및 (b) 단계(a) 과정에서 조성된 도전성 점착제를 필름지의 일면 또는 양면에 일정두께로 도포하여 도전성 테이프를 제조하는 단계를 포함한 구성으로 이루어진다.According to another aspect of the present invention, a method of manufacturing a conductive adhesive tape using a conductive cushion ball includes (a) a polymer material having elasticity which is formed inside the gas layer with respect to 100 parts by weight of the adhesive resin and is restored to an external magnetic pole. Forming a conductive pressure-sensitive adhesive by mixing 0.2 to 30 parts by weight of a conductive cushion ball plated with a conductive metal layer on an outer circumferential surface of the cushion ball; And (b) applying the conductive adhesive prepared in step (a) to one or both sides of the film to produce a conductive tape.
전술한 바와 같은 본 발명에 다른 구성의 단계(a) 과정에서 도전성 금속층은 구리(Cu), 니켈(Ni), 은(Ag), 텅스텐(W), 금(Au) 및 알루미늄(Al)으로 이루어지는 군으로부터 선택된 어느 하나로 이루어질 수 있다.In the process of step (a) according to the present invention, the conductive metal layer is formed of copper (Cu), nickel (Ni), silver (Ag), tungsten (W), gold (Au), and aluminum (Al). It may be made of any one selected from the group.
그리고, 본 발명에 따른 구성의 단계(a) 과정에서 도전성 금속층은 무전해 도금을 통해 쿠션볼 외주면 상에 도금이 이루어지는 구성으로 이루어질 수 있다.Then, the conductive metal layer in the step (a) process of the configuration according to the present invention may be made of a configuration in which the plating on the outer peripheral surface of the cushion ball through electroless plating.
한편, 본 발명에 따란 구성의 단계(a) 과정에서 점착성 수지는 아크릴, 실리콘, 우레탄, 에폭시, PE, 천연 또는 합성 고무계로 이루어지는 군으로부터 선택된 단일물 또는 둘 이상의 혼합물로 이루어질 수 있다.On the other hand, the adhesive resin in the step (a) of the configuration according to the present invention may be composed of a single material or a mixture of two or more selected from the group consisting of acrylic, silicone, urethane, epoxy, PE, natural or synthetic rubber.
아울러, 본 발명에 따른 구성의 단계(b) 과정에서 제조된 도전성 점착테이프의 도전성 점착제 표면에는 이형지가 더 부착되는 과정이 추가될 수 있다.In addition, the process of the release paper is further attached to the conductive pressure-sensitive adhesive surface of the conductive adhesive tape prepared in step (b) of the configuration according to the present invention may be added.
본 발명의 기술에 따르면 외면에 도전성 금속이 코팅된 도전성 쿠션볼과 점착성 수지를 일정 비율로 혼합 조성한 점착제를 이형지의 일면 또는 양면에 도포하여 도전성 점착테이프를 제조함으로써 자체의 눌림에 대한 변형 및 복원 특성을 통해 돌출 현상이 개선되어 부착하고자 하는 면에 점착성 물질이 평면으로 쉽게 밀착되도록 할 수가 있다.According to the technology of the present invention by applying a pressure-sensitive adhesive, a conductive cushion coated with a conductive metal on the outer surface and a pressure-sensitive adhesive in a predetermined ratio on one or both sides of the release paper to produce a conductive adhesive tape deformation and recovery characteristics of its own pressing Through this, the protrusion phenomenon can be improved, so that the adhesive material can be easily adhered to the plane to be attached.
아울러, 본 발명에 따른 기술은 외면에 도전성 금속이 코팅된 도전성 쿠션볼과 점착성 수지를 일정 비율로 혼합 조성한 점착제를 이형지의 일면 또는 양면에 도포하여 도전성 점착테이프를 제조함으로써 자체의 눌림에 대한 변형 및 복원 특성을 통해 돌출 현상을 개선하여 전기적 특성 유지가 양호하도록 할 수가 있다.In addition, the technology according to the present invention by applying a pressure-sensitive adhesive in which the conductive cushion ball and the adhesive resin coated with a conductive metal on the outer surface at a predetermined ratio to one or both sides of the release paper to produce a conductive adhesive tape deformation and its own pressing Through the restoring property, it is possible to improve the protruding phenomenon and to maintain the electrical property well.
도 1 은 본 발명에 따른 도전성 쿠션볼을 보인 단면 구성도.1 is a cross-sectional view showing a conductive cushion ball according to the present invention.
도 2 는 본 발명에 따른 도전성 쿠션볼을 이용한 도전성 테이프를 보인 단면 구성도.Figure 2 is a cross-sectional view showing a conductive tape using a conductive cushion ball according to the present invention.
도 3 은 본 발명에 따른 도전성 전착제의 구성에서 도전성 쿠션볼의 전기흐름을 보인 단면 구성도.Figure 3 is a cross-sectional view showing the electrical flow of the conductive cushion ball in the configuration of the conductive electrodeposition agent according to the present invention.
도 4 는 본 발명에 따른 도전성 쿠션볼이 함유된 도전성 점착제를 전자 현미경을 통해 확대하여 보인 확대도.Figure 4 is an enlarged view showing the conductive pressure-sensitive adhesive containing the conductive cushion ball according to the present invention through an electron microscope.
도 5a 는 종래 기술의 금속파우더가 혼합 조성된 도전성 점착제를 확대하여 보인 사진.Figure 5a is an enlarged photograph of a conductive pressure-sensitive adhesive mixed with a metal powder of the prior art.
도 5b 는 본 발명에 따른 도전성 쿠션볼이 혼합 조성된 도전성 점착제를 확대하여 보인 사진.Figure 5b is an enlarged photograph of the conductive pressure-sensitive adhesive is a conductive cushion ball mixed composition according to the present invention.
도 6 은 종래 기술의 금속파우더를 이용한 도전성 테이프(a)와 본 발명에 따른 도전성 쿠션볼을 이용한 도전성 테이프(b)의 표면을 비교하여 보인 사진.Figure 6 is a photograph showing a comparison of the surface of the conductive tape (a) using a conventional metal powder and the conductive tape (b) using a conductive cushion ball according to the present invention.
이하에서는 도면을 참조하여 본 발명에 따른 도전성 쿠션볼을 이용한 도전성 점착테이프 및 이의 제조방법에 대한 양호한 실시 예를 상세하게 설명하기로 한다. Hereinafter, with reference to the drawings will be described in detail a preferred embodiment of the conductive adhesive tape using a conductive cushion ball according to the present invention and a manufacturing method thereof.
도 1 은 본 발명에 따른 도전성 쿠션볼을 보인 단면 구성도, 도 2 는 본 발명에 따른 도전성 쿠션볼을 이용한 도전성 테이프를 보인 단면 구성도, 도 3 은 본 발명에 따른 도전성 전착제의 구성에서 도전성 쿠션볼의 전기흐름을 보인 단면 구성도, 도 4 는 본 발명에 따른 도전성 쿠션볼이 함유된 도전성 점착제를 전자 현미경을 통해 확대하여 보인 확대도, 도 5a 는 종래 기술의 금속파우더가 혼합 조성된 도전성 점착제를 확대하여 보인 사진, 도 5b 는 본 발명에 따른 도전성 쿠션볼이 혼합 조성된 도전성 점착제를 확대하여 보인 사진, 도 6 은 종래 기술의 금속파우더를 이용한 도전성 테이프(a)와 본 발명에 따른 도전성 쿠션볼을 이용한 도전성 테이프의 표면(b)을 비교하여 보인 사진이다.1 is a cross-sectional view showing a conductive cushion ball according to the present invention, Figure 2 is a cross-sectional view showing a conductive tape using a conductive cushion ball according to the invention, Figure 3 is a conductive cushion in the configuration of a conductive electrodeposition agent according to the present invention 4 is an enlarged view showing the conductive adhesive ball containing the conductive cushion ball according to the present invention through an electron microscope, and FIG. 5A is a conductive adhesive mixed with a metal powder of the prior art. 5b is an enlarged picture, Figure 5b is a picture showing an enlarged conductive adhesive mixed with a conductive cushion ball according to the present invention, Figure 6 is a conductive tape (a) using a metal powder of the prior art and the conductive cushion according to the present invention It is a photograph showing the surface (b) of the conductive tape which used the ball compared.
도 1 내지 도 4 에 도시된 바와 같이 본 발명에 따른 도전성 쿠션볼을 이용한 도전성 점착테이프(100)는 필름지(110)의 일면 또는 양면에 점착성 수지(130)와 도전성 쿠션볼(200)이 일정 비율로 혼합 조성된 도전성 점착제(120)가 일정두께로 도포된 구성으로 이루어진다.1 to 4, the conductive adhesive tape 100 using the conductive cushion ball according to the present invention has a certain ratio of the adhesive resin 130 and the conductive cushion ball 200 on one or both sides of the film paper 110. The conductive pressure-sensitive adhesive 120 is mixed with a composition made of a predetermined thickness.
전술한 바와 같은 본 발명에 따른 도전성 점착테이프(100)는 도전성 구션볼(200)을 점착성 수지(130)에 일정비율로 혼합하여 도전성 점착제(120)를 조성한 다음, 조성된 도전성 점착제(120)를 필름지(110)의 일면 또는 양면에 일정두께로 도포하여 도전성 점착제(120)를 필름지(110) 상에 고착시킴으로써 EMI 차폐용 전도성 점착테이프(100)에 관한 것이다.As described above, the conductive adhesive tape 100 according to the present invention mixes the conductive cushion ball 200 with the adhesive resin 130 at a predetermined ratio to form the conductive adhesive 120, and then forms the conductive adhesive 120. The present invention relates to a conductive adhesive tape 100 for EMI shielding by applying a conductive adhesive 120 on one or both surfaces of the film paper 110 and fixing the conductive adhesive 120 on the film paper 110.
한편, 전술한 바와 같이 필름지(110)의 일면 또는 양면에 도전성 점착제(120)가 일정두께로 도포된 구성으로 이루어진 도전성 점착테이프(100)를 구성하는 도전성 점착제(120)는 점착성 수지(130) 100중량부에 대하여 도전성 쿠션볼(200) 0.2∼30 중량부를 혼합 조성한 구성으로 이루어진다.On the other hand, as described above, the conductive adhesive 120 constituting the conductive adhesive tape 100 made of a configuration in which the conductive adhesive 120 is applied to one surface or both surfaces of the film paper 110 with a predetermined thickness, the adhesive resin 130, 100 It consists of the structure which mixed 0.2-30 weight part of electroconductive cushion balls 200 with respect to a weight part.
전술한 바와 같은 도전성 점착제(120)의 구성에서 도전성 쿠션볼(200)은 볼 형태로, 외부의 압력에 복원되는 탄성력을 가질 수 있도록 내부에 기체를 함유하고 있는 폴리머 재질의 쿠션볼(210)로 이루어지며, 도전성을 유지할 수 있도록 쿠션볼(210)의 외피면에 금속층(220)이 코팅된 구성으로 이루어진다.In the configuration of the conductive adhesive 120 as described above, the conductive cushion ball 200 is in the form of a ball, with a cushion ball 210 of a polymer material containing a gas therein to have an elastic force restored to the external pressure Made of a metal layer 220 is coated on the outer surface of the cushion ball 210 to maintain conductivity.
전술한 바와 같은 폴리머 재질의 쿠션볼(210) 외피는 도전성 최종 제품의 두께를 감안하여 전체적으로 0.01∼1.00㎜ 지름을 가지도록 형성될 수 있다. 이때, 함유된 기체는 도전성 쿠션볼(210)의 구형의 형태가 유지되도록 외부의 압력에 복원되는 탄성력을 가지게 하는 것으로, 이를 통해 도전성 쿠션볼(200)이 지속적인 충격 방지 물성이 유지되도록 한다. The outer shell of the polymer cushion ball 210 as described above may be formed to have a diameter of 0.01 to 1.00 mm as a whole in consideration of the thickness of the conductive final product. At this time, the contained gas is to have an elastic force restored to the external pressure to maintain the spherical shape of the conductive cushion ball 210, through which the conductive cushion ball 200 is to maintain a continuous impact-resistant properties.
여기서, 기체가 아닌 물질이 함유될 수도 있으나, 얇은 박막의 제품에서 쿠션 성능을 발휘하기 위해서는 복원율이 뛰어난 기체를 이용하도록 한다. 이는 제품의 경량화 측면에서도 매우 뛰어나다. Here, a material other than a gas may be contained, but in order to exhibit cushioning performance in a thin film product, a gas having excellent recovery rate may be used. This is also very good in terms of weight reduction.
본 발명에 따른 기술의 실시 예에서 함유되는 기체는 모든 기체가 사용될 수 있으나, 유출에 의한 폭발 등의 위험이 발생할 수 있어 도 1 에 도시된 바와 같이 안정성 측면에서 바람직한 질소(N2) 가스를 사용하였다.In the embodiment of the technology according to the present invention, any gas may be used, but a risk such as an explosion due to spillage may occur, and thus, nitrogen (N 2 ) gas, which is preferable in terms of stability, is used as shown in FIG. 1. It was.
다시 말해서, 전술한 도전성 쿠션볼(200)은 내부에 기체층(또는 질소가스층)을 가지고 외부에 탄성을 지니는 폴리머 재질의 쿠션볼(210) 형태로, 비중 0.5 이하의 재료의 외면에 무전해 도금을 통해 금속층(220)이 코팅된 구조로 제조되어진다. 이때, 금속층(220)은 구리(Cu), 니켈(Ni), 은(Ag), 텅스텐(W), 금(Au) 및 알루미늄(Al) 등의 전기 흐름성이 좋은 금속 재료를 이용하며, 금속층(220)의 두께는 전기 흐름성을 감안하여 2㎚의 이상을 유지해야 한다.In other words, the conductive cushion ball 200 described above is a polymer cushion ball 210 having a gas layer (or nitrogen gas layer) therein and having elasticity on the outside thereof, and electroless plating on the outer surface of a material having a specific gravity of 0.5 or less. Through the metal layer 220 is manufactured in a coated structure. In this case, the metal layer 220 uses a metal material having good electrical flow such as copper (Cu), nickel (Ni), silver (Ag), tungsten (W), gold (Au), and aluminum (Al). The thickness of 220 should be maintained at 2 nm or more in view of the electrical flowability.
한편, 전술한 바와 같은 본 발명에 따른 도전성 쿠션볼을 이용한 도전성 점착테이프(100)는 앞서도 기술한 바와 같이 도전성 쿠션볼(200)을 점착성 수지(130)에 일정 비율로 혼합 조성하여 테이프를 제조하는 방식이다. 이처럼 도전성 쿠션볼(200)을 점착성 수지(130)에 혼합하여 EMI 차폐용 전도성 테이프(100)를 제조하는 것은 지금까지 시도되지 않은 방법으로 다음과 같은 특징을 부여한다.On the other hand, the conductive adhesive tape 100 using the conductive cushion ball according to the present invention as described above to produce a tape by mixing the conductive cushion ball 200 to the adhesive resin 130 in a predetermined ratio as described above That's the way. As such, the conductive cushion ball 200 is mixed with the adhesive resin 130 to manufacture the conductive shielding tape 100 for EMI shielding.
먼저, 도전성 쿠션볼(200)의 크기는 0.01∼1.00㎜ 까지를 적용하며, 비중은 0.5 이하인 폴리머 재질의 쿠션볼(210)과 쿠션볼(210)의 외피에 도금되는 금속층(220)은 무전해 도금을 통해 도금이 이루어진다. 이때, 무전해 도금의 재질은 금, 은, 니켈, 구리, 알루미늄 및 텅스텐 등 전기전도성을 가지는 재료를 적용하되 쿠션볼(210)의 특성을 유지하기 위하여 쿠션볼(210)의 무게 대비 1000% 이하의 비중으로 무전해 도금을 진행한다.First, the size of the conductive cushion ball 200 is applied up to 0.01 ~ 1.00mm, the specific gravity is 0.5 or less of the polymer material and the metal layer 220 plated on the shell of the cushion ball 210 is electroless Plating takes place through plating. At this time, the material of the electroless plating is applied to a material having electrical conductivity such as gold, silver, nickel, copper, aluminum and tungsten, but in order to maintain the characteristics of the cushion ball 210, 1000% or less of the weight of the cushion ball 210 Electroless plating is carried out at a specific gravity of.
전술한 바와 같은 도전성 쿠션볼(200)은 하중 부여시 눌림이 발생되며 찌그러지는 특성을 지니며, 하중의 제거시 복원되는 특징을 위해 내부가 기체층으로 구성된 특징을 지닌다. 이때, 안정성 측면에서 질소(N2) 가스를 사용할 수도 있다.The conductive cushion ball 200 as described above has a characteristic of being pressed and distorted when a load is applied, and has an internal structure of a gas layer for restoring when the load is removed. At this time, nitrogen (N 2 ) gas may be used in terms of stability.
디시 말해서, 전술한 도전성 쿠션볼(200)은 외부의 압력에 복원되는 탄성력을 가질 수 있도록 내부에 기체를 함유하고 있는 폴리머 재질로 이루어진다. 이때, 함유된 기체는 질소(N2)를 포함한 다양한 기체일 수 있으며, 최종 제품의 두께를 감안하여 전체적으로 0.01∼1.00㎜ 지름을 가지도록 형성될 수 있다. 참고로, 이때의 도전성 쿠션볼(200) 제조 방법은 다음과 같다. In other words, the conductive cushion ball 200 described above is made of a polymer material containing a gas therein so as to have an elastic force restored to an external pressure. In this case, the contained gas may be various gases including nitrogen (N 2 ), and may be formed to have a diameter of 0.01 to 1.00 mm as a whole in consideration of the thickness of the final product. For reference, the manufacturing method of the conductive cushion ball 200 at this time is as follows.
먼저, 폴리머 재질의 쿠션볼(210)의 제조는 폴리머 재질의 외피가 유리전이온도(Tg)에 다다르게되어 물러지게 되도록 기체가 유입된 폴리머를 일정 온도(고온)에 방치한다. 이에 따라, 폴리머 재질의 외피가 팽창하게 된다. 이어서, 폴리머 재질의 외피가 버틸 수 있는 임계점 이하에서 냉각시킴으로써 폴리머 재질의 외피가 경화되도록 한다. 이에 따라, 외피층은 얇아지고 함유된 기체층 부피가 커지게 된다. First, in the manufacture of the cushion ball 210 of the polymer material, the polymer in which the gas is introduced is left at a predetermined temperature (high temperature) so that the outer surface of the polymer material reaches the glass transition temperature (Tg). Accordingly, the outer shell of the polymer material is expanded. The outer shell of the polymer material is then cured by cooling below the critical point at which the outer shell of the polymer material can withstand. As a result, the outer layer becomes thinner and the contained gas layer volume becomes larger.
한편, 전술한 바와 같은 폴리머의 재질의 쿠션볼(210)은 녹는 점이 90℃ 이상의 재료를 사용한다. 본 발명에서는 도전성을 유지할 수 있도록 열에 의해 팽창되는 폴리머 재질의 쿠션볼(210) 외피에 아래와 같이 금속층을 코팅하였다.On the other hand, the cushion ball 210 of the polymer material as described above uses a melting point of more than 90 ℃ material. In the present invention, a metal layer is coated on the outer surface of the cushion ball 210 made of a polymer material expanded by heat to maintain conductivity.
그리고, 도전성을 유지할 수 있도록 마련된 쿠션볼(210)의 외피에 금속층(220)을 코팅함으로써 도전성 쿠션볼(200)을 형성한다. 이때, 쿠션볼(210)의 외피에 무전해 도금을 이용하여 금속층을 도금한다. 즉, 쿠션볼(210)의 외피 표면에 촉매를 침적시키고, 구리(Cu), 니켈(Ni), 은(Ag), 텅스텐(W), 금(Au) 및 알루미늄(Al) 등의 금속을 단층 또는 이종의 다층으로 무전해 도금함으로써 금속층(220)을 코팅한다.The conductive cushion ball 200 is formed by coating the metal layer 220 on the outer surface of the cushion ball 210 provided to maintain the conductivity. At this time, the outer layer of the cushion ball 210 is plated with a metal layer using electroless plating. That is, the catalyst is deposited on the outer surface of the cushion ball 210, and a single layer of metal such as copper (Cu), nickel (Ni), silver (Ag), tungsten (W), gold (Au), and aluminum (Al) is deposited. Alternatively, the metal layer 220 is coated by electroless plating with heterogeneous multilayers.
전술한 바와 같이 금속층(220)은 구리(Cu), 니켈(Ni), 은(Ag), 텅스텐(W), 금(Au) 및 알루미늄(Al) 등의 전기 흐름성이 좋은 금속 재료를 이용하며, 금속층(220)의 두께는 전기 흐름성을 감안하여 2㎚의 이상을 유지해야 한다. 이때, 금속층(220)이 코팅된 도전성 쿠션볼(200)은 도 3 및 도 4 에 도시된 바와 같이 단일 또는 여러 가지 크기일 수 있다. As described above, the metal layer 220 uses a metal material having good electrical flow such as copper (Cu), nickel (Ni), silver (Ag), tungsten (W), gold (Au), and aluminum (Al). The thickness of the metal layer 220 should be maintained at 2 nm or more in view of the electrical flowability. In this case, the conductive cushion ball 200 coated with the metal layer 220 may be single or various sizes as shown in FIGS. 3 and 4.
한편, 전술한 바와 같이 제조된 도전성 쿠션볼(200)을 점착성 수지(120)에 일정 비율로 혼합 조성하여 도전성 점착제(120)를 제조한다. 이때, 도전성 점착제(120)를 구성하는 점착성 수지(130)와 도전성 쿠션볼(200)의 혼합 비율은 점착성 수지(130) 100 중량부에 대하여 도전성 쿠션볼(200) 0.2∼30 중량부의 비율로 혼합 조성된다. 이때, 도전성 쿠션볼(200) 간의 밀착도 및 도전성 쿠션볼(200)의 크기에 따라 점착성 수지(130) 함량을 조절할 수도 있다.Meanwhile, the conductive cushion ball 200 prepared as described above is mixed with the adhesive resin 120 at a predetermined ratio to prepare the conductive adhesive 120. At this time, the mixing ratio of the adhesive resin 130 and the conductive cushion ball 200 constituting the conductive adhesive 120 is mixed in a ratio of 0.2 to 30 parts by weight of the conductive cushion ball 200 with respect to 100 parts by weight of the adhesive resin 130. It is created. In this case, the adhesive resin 130 may be adjusted according to the adhesion degree between the conductive cushion balls 200 and the size of the conductive cushion balls 200.
전술한 바와 같이 제조된 도전성 점착제(120)는 도 2 에 도시된 바와 같이 필름지(110)의 일면 또는 양면에 일정두께로 도포되어 고착됨으로써 본 발명에서 제조하고자 하는 도전성 점착테이프(100)의 점착부분을 형성하게 된다.The conductive adhesive 120 prepared as described above is applied to one side or both sides of the film paper 110 as shown in FIG. 2 and adhered to a predetermined thickness to adhere to the adhesive portion of the conductive adhesive tape 100 to be manufactured in the present invention. Will form.
아울러, 전술한 바와 같이 필름지(110)의 일면 또는 양면에 도전성 접착제(120)를 일정두께로 도포한 구성으로 도전성 접착테이프(100)는 점착부분이 내측에 위치되도록 롤 형태로 감아 제품화할 수도 있고, 도 2 에 도시된 바와 같이 도전성 점착테이프(100)의 도전성 점착제(120) 표면에 이형지(150)를 부착하여 제품화할 수도 있다. 이러한 이형지(150)는 도전성 점착테이프(100)를 사용처에 부착시키는 경우 도전성 점착제(120) 표면으로부터 분리하게 된다.In addition, as described above, the conductive adhesive tape 100 may be rolled so as to be rolled so that the adhesive portion is positioned inside the conductive adhesive tape 100 in a structure in which the conductive adhesive 120 is applied to one surface or both surfaces of the film paper 110 at a predetermined thickness. 2, the release paper 150 may be attached to the surface of the conductive adhesive 120 of the conductive adhesive tape 100 to produce a product. The release paper 150 is separated from the surface of the conductive adhesive 120 when the conductive adhesive tape 100 is attached to the place of use.
도 5a 및 도 6 의 (a) 에서와 같이 종래 기술에서는 도전성 점차테이프의 부착을 위해 형성되는 도전성 점착제의 두께가 0.02㎜를 넘어 두꺼워지는 경우 점착제 내에 함유되는 금속파우더의 함량이 비례적으로 매우 증가되어야 전기 흐름성이 양호해지며 0.04㎜를 넘어서는 경우 함량 증가로 어려움이 있어 금속파우더의 크기를 증가해야만 한다.In the prior art, as shown in FIGS. 5A and 6A, when the thickness of the conductive adhesive formed for attaching the conductive tape becomes thicker than 0.02 mm, the content of the metal powder contained in the adhesive increases proportionally. Only when the electric flow is good and if it exceeds 0.04㎜, it is difficult to increase the content, so the size of the metal powder must be increased.
그러나, 금속파우더의 크기가 증가되는 경우 점착제의 표면에 돌출되는 현상이 발생하고 이는 테이프의 외관에 돌기 형상으로 나타나 외관적 문제를 발생시키며 또한 테이프를 부착시 돌기 주변으로 밀착되지 못하는 부위가 많아져 접착 성능 및 제품의 전기적 특성에 문제를 발생 시킨다.However, when the size of the metal powder is increased, a phenomenon that protrudes on the surface of the adhesive occurs, which appears as a protrusion on the exterior of the tape, causing an appearance problem. It causes problems in adhesion performance and electrical properties of the product.
반면, 본 발명에 따른 기술의 도 5b 및 도 6의 (b) 에서와 같이 도전성 쿠션볼(200)을 혼합한 점착성 수지(130)를 적용시 감압 부착하는 시점에 눌림 압력에 따라 도전성 쿠션볼(200)이 눌려 들어가며 부착하고자 하는 면에 전면적이 접촉되어 금속파우더 투입시와 비교하여 부착면적이 50% 이상 증가하게 된다. 이에 따라, 점착력 및 전기적 특성이 개선되며 돌기에 의한 외관 불량이 해결된다.On the other hand, the conductive cushion ball according to the pressing pressure at the time of attaching the reduced pressure when applying the adhesive resin 130 mixed with the conductive cushion ball 200 as shown in Figs. 5b and 6 (b) of the technology according to the present invention ( 200) is pressed and the entire surface is in contact with the surface to be attached, which increases the attachment area by more than 50% compared with the metal powder. Accordingly, adhesion and electrical properties are improved and appearance defects due to protrusions are solved.
전술한 바와 같은 도전성 쿠션볼(200)의 추가시 두께 증가에 따라 굵은 금속 전도성 물질을 사용하는 기존 방식에 비하여 비중이 매우 낮아 전체 무게를 획기적으로 감소시킬 수가 있다. 즉, 기존 금속파우더 비중이 평균 2.7∼9.8인데 반해, 도전성 쿠션볼(200)의 비중은 2.0 이하이기 때문에 전체 무게를 획기적으로 감소시킬 수가 있다.When adding the conductive cushion ball 200 as described above, the specific weight is very low compared to the conventional method using a thick metal conductive material as the thickness increases, it is possible to significantly reduce the overall weight. That is, while the specific gravity of the existing metal powder is 2.7 to 9.8 on average, the specific gravity of the conductive cushion ball 200 is 2.0 or less, so that the total weight can be significantly reduced.
한편, 0.04㎜ 이상의 도정성 점착제(120) 두께로 제조시 동일한 크기의 전도성 물질을 투여 비교하는 경우 종래 기술에 따른 금속파우더는 입자 크기의 불균형으로 인하여 외관적 돌출이 심해지고 전체 투입되는 금속파우더의 무게가 급격히 증가하며 점착성 수지(130)와의 혼합시 침전되는 형상이 발생되기 때문에 제조 및 상품화에 어려움 있다.On the other hand, when comparing the conductive material of the same size when manufacturing a conductive adhesive 120 or more thickness of 0.04 mm or more, the metal powder according to the prior art due to the imbalance of the particle size is protruding severely and the total amount of the metal powder It is difficult to manufacture and commercialize because the weight is sharply increased and a shape that precipitates when mixed with the adhesive resin 130 occurs.
그리고, 종래 기술에 따른 금속외 무기재료에 도금한 재료를 활용하는 경우 입자의 사이즈 및 무게에 대한 개선 가능하나 외관 돌출 현상 및 감압시 눌림이 없어 파우더 주변으로 부착되지 못하고 뜨는 면적이 발생되 점착력 및 전기적 특성이 감소하는 문제가 있다.In addition, when using a material plated on an inorganic material other than the metal according to the prior art, it is possible to improve the size and weight of the particles, but there is no protruding phenomenon and no pressure during depressurization, so that the floating area is not attached to the powder, resulting in adhesion and electrical There is a problem that the characteristic is reduced.
반면, 본 발명에 따른 도전성 쿠션볼(200)을 적용하는 경우에는 코팅 두께에 따른 입자 사이즈 선택이 가능하며 자체의 눌림에 대한 변형 및 복원 특성이 있어 외관 돌츨 현상이 개선되며 도전성 점착테이프(100) 부착을 위해 감압시 외관 변형이 되어 부착하고자하는 면에 점착성 물질이 평면으로 쉽게 밀착되어 점착력 유지 및 전기적 특성 유지가 가능하다는 장점이 있다.On the other hand, in the case of applying the conductive cushion ball 200 according to the present invention, the particle size can be selected according to the coating thickness, and the deformation and restoring characteristics of the pressing itself are improved. For adhesion, the pressure-sensitive adhesive material is easily adhered to the plane to be adhered to the surface to be attached, so that the adhesive strength and the electrical properties can be maintained.
따라서, 전술한 바와 같이 그동안 도전성 점착테이프 제조에 있어 도전성 점착제의 두께에 한계가 있었으며 외관적 문제등을 감안하고 일부 적용되는 등 기술적 한계점이 있었으나 금번 본 발명에 따른 기술의 적용에 따라 두께에 대한 한계성이 해결되었다.Therefore, as described above, there have been limitations in the thickness of the conductive adhesive in the manufacture of the conductive adhesive tape, and there are technical limitations such as partial application in consideration of appearance problems, but the limitation on the thickness according to the application of the technology according to the present invention. This was fixed.
본 발명은 전술한 실시 예에 국한되지 않고 본 발명의 기술사상이 허용하는 범위 내에서 다양하게 변형하여 실시 할 수가 있다.The present invention is not limited to the above embodiments, and various modifications can be made within the scope of the technical idea of the present invention.
[부호의 설명][Description of the code]
100. 도전성 점착테이프 110. 필름지100. Conductive adhesive tape 110. Film paper
120. 도전성 점착제 130. 점착성 수지 120. Conductive adhesive 130. Adhesive resin
150. 이형지 200. 도전성 쿠션볼150. Release paper 200. Conductive cushion ball
210. 쿠션볼 220. 금속층210. Cushion Ball 220. Metallic Layer

Claims (10)

  1. 점착성 수지 100 중량부에 대하여 내부에 기체층이 형성되어 외부의 자극에 복원되는 탄력성이 있는 폴리머 재질의 쿠션볼 외주면에 도전성 금속층이 도금된 도전성 쿠션볼 0.2∼30 중량부가 혼합 조성된 도전성 점착제를 필름지의 일면 또는 양면에 일정 두께로 도포하여 제조된 도전성 쿠션볼을 이용한 도전성 점착테이프.Conductive adhesive with 0.2 to 30 parts by weight of a conductive cushion ball in which a conductive metal layer is plated on the outer circumferential surface of an elastic polymer material having a gas layer formed therein and restored to an external magnetic pole, based on 100 parts by weight of the adhesive resin Conductive adhesive tape using a conductive cushion ball prepared by applying a predetermined thickness on one or both sides of the.
  2. 제 1 항에 있어서, 상기 도전성 금속층은 구리(Cu), 니켈(Ni), 은(Ag), 텅스텐(W), 금(Au) 및 알루미늄(Al)으로 이루어지는 군으로부터 선택된 어느 하나인 것을 특징으로 하는 도전성 쿠션볼을 이용한 도전성 점착테이프.The method of claim 1, wherein the conductive metal layer is any one selected from the group consisting of copper (Cu), nickel (Ni), silver (Ag), tungsten (W), gold (Au) and aluminum (Al). Conductive adhesive tape using conductive cushion balls.
  3. 제 1 항에 있어서, 상기 도전성 금속층은 무전해 도금을 통해 상기 쿠션볼 외주면 상에 도금이 이루어지는 것을 특징으로 하는 도전성 쿠션볼을 이용한 도전성 점착테이프.The conductive adhesive tape using conductive cushion balls according to claim 1, wherein the conductive metal layer is plated on the outer peripheral surface of the cushion ball through electroless plating.
  4. 제 1 항에 있어서, 상기 점착성 수지는 아크릴, 실리콘, 우레탄, 에폭시, PE, 천연 또는 합성 고무계로 이루어지는 군으로부터 선택된 단일물 또는 둘 이상의 혼합물인 것을 특징으로 하는 도전성 쿠션볼을 이용한 도전성 점착테이프.The conductive adhesive tape using a conductive cushion ball according to claim 1, wherein the adhesive resin is a single material or a mixture of two or more selected from the group consisting of acrylic, silicone, urethane, epoxy, PE, natural or synthetic rubber.
  5. 제 1 항 내지 제 4 항 중 어느 한 항에 있어서, 상기 도전성 점착테이프의 도전성 점착제 표면에는 이형지가 더 부착된 것을 특징으로 하는 도전성 쿠션볼을 이용한 도전성 점착테이프.The conductive adhesive tape using a conductive cushion ball according to any one of claims 1 to 4, wherein a release paper is further attached to the conductive adhesive surface of the conductive adhesive tape.
  6. (a) 점착성 수지 100 중량부에 대하여 내부에 기체층이 형성되어 외부의 자극에 복원되는 탄력성이 있는 폴리머 재질의 쿠션볼 외주면에 도전성 금속층이 도금된 도전성 쿠션볼 0.2∼30 중량부를 혼합하여 도전성 점착제를 조성하는 단계; 및(a) Conductive adhesive by mixing 0.2-30 parts by weight of a conductive cushion ball plated with a conductive metal layer on the outer circumferential surface of an elastic polymer material having a gas layer formed therein and restoring to an external magnetic pole with respect to 100 parts by weight of the adhesive resin. Creating a step; And
    (b) 단계(a) 과정에서 조성된 상기 도전성 점착제를 필름지의 일면 또는 양면에 일정두께로 도포하여 도전성 테이프를 제조하는 단계를 포함한 구성으로 이루어진 것을 특징으로 하는 도전성 쿠션볼을 이용한 도전성 점착테이프의 제조방법.(b) the conductive adhesive tape using a conductive cushion ball, characterized in that consisting of the step of applying a conductive tape prepared in the step (a) to a predetermined thickness on one or both sides of the film paper to produce a conductive tape Manufacturing method.
  7. 제 6 항에 있어서, 상기 단계(a) 과정에서 상기 도전성 금속층은 구리(Cu), 니켈(Ni), 은(Ag), 텅스텐(W), 금(Au) 및 알루미늄(Al)으로 이루어지는 군으로부터 선택된 어느 하나인 것을 특징으로 하는 도전성 쿠션볼을 이용한 도전성 점착테이프의 제조방법.The method of claim 6, wherein in the step (a) the conductive metal layer is selected from the group consisting of copper (Cu), nickel (Ni), silver (Ag), tungsten (W), gold (Au) and aluminum (Al). Method for producing a conductive adhesive tape using a conductive cushion ball, characterized in that any one selected.
  8. 제 6 항에 있어서, 상기 단계(a) 과정에서 상기 도전성 금속층은 무전해 도금을 통해 상기 쿠션볼 외주면 상에 도금이 이루어지는 것을 특징으로 하는 도전성 쿠션볼을 이용한 도전성 점착테이프의 제조방법.The method of claim 6, wherein in the step (a), the conductive metal layer is plated on the outer circumferential surface of the cushion ball through electroless plating.
  9. 제 6 항에 있어서, 상기 단계(a) 과정에서 상기 점착성 수지는 아크릴, 실리콘, 우레탄, 에폭시, PE, 천연 또는 합성 고무계로 이루어지는 군으로부터 선택된 단일물 또는 둘 이상의 혼합물인 것을 특징으로 하는 도전성 쿠션볼을 이용한 도전성 점착테이프의 제조방법. The conductive cushion ball of claim 6, wherein the adhesive resin in the step (a) is a single material or a mixture of two or more selected from the group consisting of acrylic, silicone, urethane, epoxy, PE, natural or synthetic rubber. Method for producing a conductive adhesive tape used.
  10. 제 6 항 내지 제 9 항 중 어느 한 항에 있어서, 상기 단계(b) 과정에서 제조된 상기 도전성 점착테이프의 도전성 점착제 표면에는 이형지가 더 부착되는 과정이 추가되는 것을 특징으로 하는 도전성 쿠션볼을 이용한 도전성 점착테이프의 제조방법.The conductive cushion ball according to any one of claims 6 to 9, wherein a release paper is further attached to the conductive adhesive surface of the conductive adhesive tape prepared in the step (b). Method for producing a conductive adhesive tape.
PCT/KR2016/006332 2015-07-24 2016-06-15 Conductive adhesive tape using conductive cushion ball and method for manufacturing same WO2017018657A1 (en)

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KR1020150105234A KR101746062B1 (en) 2015-07-24 2015-07-24 Preparation method thereof and a conductive adhesive tape by using a conductive ball cushion
KR10-2015-0105234 2015-07-24

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CN109004107A (en) * 2018-07-02 2018-12-14 陕西科技大学 A kind of paper light emitting structure and the preparation method based on all print technique
CN109385225A (en) * 2017-08-03 2019-02-26 特乐司有限公司 Utilize the conductive paste band and its manufacturing method of the electroconductive powder of compressible deformation
CN109880540A (en) * 2017-12-06 2019-06-14 广东中晨电子科技有限公司 Conductive adhesive film

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US20030138624A1 (en) * 1997-07-18 2003-07-24 Axel Burmeister Self-adhesive tape comprising microballoons in the backing layer
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JPH0696771B2 (en) * 1988-03-24 1994-11-30 日本化学工業株式会社 Electroless plating powder, conductive filler and method for producing the same
US20030138624A1 (en) * 1997-07-18 2003-07-24 Axel Burmeister Self-adhesive tape comprising microballoons in the backing layer
KR100635210B1 (en) * 2004-06-11 2006-10-16 주식회사 엘지화학 Adhesive sheet comprising hollow parts and method for preparing the same
KR20080004021A (en) * 2006-07-04 2008-01-09 쓰리엠 이노베이티브 프로퍼티즈 캄파니 Conductive adhesive tape having different adhesion on each surface thereof and method for manufacturing the same
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Cited By (3)

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Publication number Priority date Publication date Assignee Title
CN109385225A (en) * 2017-08-03 2019-02-26 特乐司有限公司 Utilize the conductive paste band and its manufacturing method of the electroconductive powder of compressible deformation
CN109880540A (en) * 2017-12-06 2019-06-14 广东中晨电子科技有限公司 Conductive adhesive film
CN109004107A (en) * 2018-07-02 2018-12-14 陕西科技大学 A kind of paper light emitting structure and the preparation method based on all print technique

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