KR101443347B1 - Conductive particle and the manufacturing method of the same - Google Patents

Abstract

The present invention relates to a conductive particle including: a resin particle; a first plating layer provided on a surface of the resin particle; and a second plating layer provided on the first plating layer having a protrusion on an outer surface thereof, wherein the protrusion covers 93-100% of an area of the second plating layer, and includes: a first layer having a length of 100-300 nm and a second protrusion having a length less than 100 nm; the first protrusion covers 70-90% of the area of the second plating layer; and the second protrusion covers 10-30% of the area of the second plating layer. The protrusion is equally divided in a longitudinal direction into a base part, an intermediate part, and an end part; and if A is an average diameter of the base part, B is an average diameter of the intermediate part, and C is an average diameter of the end part, the relationship between A, B and C is A > B > C.

Description

TECHNICAL FIELD The present invention relates to conductive particles,

TECHNICAL FIELD The present invention relates to conductive particles, and more particularly, to conductive particles provided with protrusions used in fine pitch circuits.

The conductive particles are used in a dispersed form mixed with a curing agent, an adhesive, and a resin binder. Examples thereof include anisotropic conductive film, anisotropic conductive paste, anisotropic conductive ink, anisotropic conductive film, And is widely used as an anisotropic conductive material such as an anisotropic conductive sheet.

For example, anisotropic conductive materials are used to fabricate thin film transistors (TFTs) on substrates and to drive them on flat panel display channel assemblies such as Liquid Crystal Display (LCD), Active Matrix Organic Light Emitting Diode (AMOLED), and Plasma Display Panel And is used for electrical connection between driver integrated circuits (ICs).

Generally, the conductive particles used as the anisotropic conductive material are metal particles such as nickel, copper, silver, and gold, carbon powder such as carbon powder, carbon fiber, carbon flake, etc., And composite particle.

The metal system is mainly used for a PDP requiring a high circuit current and a high current density, rather than a field requiring fine pitch and high accuracy because the entire particle has conductivity and a wide particle size distribution.

Carbon-based particles have a lower electrical conductivity than metal-based particles, and their use is restricted where they require high electrical conductivity.

On the other hand, composite particles are conductive particles most widely used at present because their electric conductivity is about the midway between the above-mentioned metal system and carbon system, and the distribution of the fine particles can be produced very narrowly.

Composite conductive particles can be formed by forming an alloy plating layer such as nickel-phosphorus or nickel-boron or nickel-phosphorus-tungsten or nickel-boron-tungsten on a spherical resin by an electroless plating method, Precious metals such as gold or silver may be used in the outermost structure for the purpose of increasing the conductivity.

Since the complex-type conductive particles use a resin having a spherical flat surface, the surface maintains a substantially smooth shape. For example, since an oxide film of 3 to 9 nm exists on the surface of the aluminum wiring pattern, There is a problem that the resin used for the anisotropic conductive material also can not penetrate effectively, thereby increasing the contact resistance and decreasing the reliability.

For the purpose of reducing the contact resistance, conductive particles having protrusions on the surface thereof have been disclosed (JP-A-2003-234020). This manufacturing method is a method of producing a conductive electroless plating powder which uses magnetically decomposed nickel plating solution in non-conductive fine particles in an electroless nickel plating method to simultaneously form fine nickel projections and a nickel coating. However, in this manufacturing method, it is extremely difficult to control the size, shape, number and the like of the protrusion portion formed of a nickel ingot, and it is difficult to reduce the connection resistance because the protrusion can not sufficiently remove the resin have.

(JP-A-2006-228474), which is characterized in that 70 to 90% of the surface area of the conductive fine particles is covered with raised projections to facilitate the exclusion of the resin and to have high connection reliability . However, in this case, since the projections are formed only partially, there is a problem that the connection reliability is lowered at the portion where the projections are not formed.

(Japanese Patent Application Laid-Open No. 2006-302716) discloses a conductive particle having protrusions which are agglomerates of massive fine particles on the surface of the conductive layer, and the existence density of the protrusions is 25 to 50 for one conductive particle However, there is a disadvantage that the protrusion is a massive and the resin exclusion is not easy.

And the conductive metal layer has fine projections having a height of 0.02 to 0.3 mu m and substantially continuous with the outermost layer of the conductive metal layer on the surface, The number of fine projections having a height of 0.1 占 퐉 or less occupies 80% or more, and the fine projections are present in the concentric projection plane of the conductive fine particles at 15 or more in a concentric circle having a diameter r of 1/2 of the conductive fine particle diameter R (Japanese Unexamined Patent Publication (Kokai) No. 2004-296322). However, there is a problem that the fine protrusions of 0.1 占 퐉 or less occupy 80% or more of the surface, and the resin ejection of the fine protrusions of 0.1 占 퐉 or less is insufficient.

Korean Patent No. 0602726 discloses a nickel or nickel alloy coating formed on the surfaces of spherical core particles having an average particle diameter of 1 to 20 μm by electroless coating and has a microprojection of 0.05 to 4 μm on the outermost layer of the coating, Characterized in that the fine projections are formed as a substantially continuous film simultaneously with the fine projections and the nickel film.

This manufacturing method is a method for producing a conductive electroless plating powder in which non-conductive fine particles are subjected to electroless nickel plating by autolysis of a nickel plating solution to simultaneously form fine nickel projections and a nickel coating. However, in this manufacturing method, it is extremely difficult to control the shape and number of protrusions. It is difficult to control the shape of the protrusions, the number of protrusions, etc. The resin exclusion caused by the protrusions and the plating layer at the portions without protrusions are not smooth and uneven, There are disadvantages. When such a non-uniform and porous plating layer is subjected to gold plating by the replacement gold plating method, peeling of the plating layer occurs and a uniform gold plating layer can not be produced, which makes it difficult to reduce the connection resistance.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and one aspect of the present invention is to provide a conductive particle whose surface is coated with fine protrusions having a low contact resistance and a small fluctuation in conductive performance of the particles.

Another aspect of the present invention is to provide an anisotropic conductive material using the above-mentioned conductive particles.

According to one aspect of the present invention,

Resin fine particles;

A first plating layer provided on a surface of the resin fine particles; And

A second plating layer provided on a surface of the first plating layer and having a projection on an outer surface thereof,

Wherein the protrusions cover 93 to 100% of the surface area of the second plating layer and include a first protrusion having a height of 100 nm to 300 nm and a second protrusion having a thickness of less than 100 nm,

Wherein the first projection covers 70 to 90% of the surface area of the second plating layer,

The second protrusion covers 10 to 30% of the surface area of the second plating layer,

Wherein said protrusions have a base portion, a middle portion and a distal portion which are divided into three equal halves from the base to the end, wherein A is an average diameter of said base portion, B is an average diameter of said middle portion, > C.

In this case, the average diameter of the base portion is preferably 1/5 to 1/10 of the average diameter of the distal portion.

It is preferable that the protrusion is formed integrally with the second plating layer.

In addition, the average diameter of the base portion is preferably 50 to 300 nm.

The first plating layer may be at least one selected from the group consisting of gold, silver, nickel, copper, tin, zinc, titanium, tin-lead, tin-copper, tin-zinc, nickel-phosphorus, nickel- It is preferred that at least one material be used.

The second plating layer may be at least one or more of a group consisting of gold, silver, copper, nickel, titanium, bismuth, antimony, copper-zinc, copper-tin, nickel-phosphorus, nickel-tungsten, Materials are preferably used.

Another aspect of the present invention is to provide an anisotropic conductive film using conductive particles, anisotropic conductive paste, anisotropic conductive ink, anisotropic conductive sheet, anisotropic conductive film, Lt; / RTI >

According to another aspect of the present invention,

A resin fine particle providing step of producing resin fine particles to be a core with a resin;

A surface treatment step of performing surface treatment on the surface of the resin fine particles for metal electroless plating;

A first plating layer forming step of forming a conductive layer on the surface-treated conductive particles by electroless plating; And

And a second plating layer forming step of forming a second plating layer including projections on the conductive particles on which the first plating layer is formed,

Wherein the protrusion has a base portion, a middle portion, and a distal portion that are divided into three equal parts from the base to the end, and A> B> A, where A is the average diameter of the base portion, B is the average diameter of the middle portion, and C is the average diameter of the distal portion. C of the conductive particles.

The conductive particles according to one aspect of the present invention do not cause a problem of connection failure of the circuit or an abrupt increase of resistance when an external force is applied.

Further, the anisotropic conductive material according to another aspect of the present invention has a low electrical resistance, and is excellent in electric resistance and conduction reliability.

Fig. 1 is a schematic view showing an example of a conductive particle whose surface is covered with a projection according to the present invention.
Fig. 2 is a photograph of a surface of a conductive particle prepared according to Example 1 of the present invention, enlarged 15,000 times using a field emission scanning electron microscope (FE-SEM).
3 is a photograph of the product of Comparative Example 1 enlarged 7,000 times using a field emission scanning electron microscope (FE-SEM).
4 is a photograph of the product of Comparative Example 2 enlarged 7,000 times using a field emission scanning electron microscope (FE-SEM).
5 is a photograph of the surface of the conductive particles of Comparative Example 3 enlarged 5,000 times using a field emission scanning electron microscope (FE-SEM).
Figs. 6 to 9 are photographs of the surface of the conductive particles of Examples 1 to 1 of the present invention enlarged 25,000 times by using a field emission scanning electron microscope (FE-SEM).

Before describing the present invention in detail, it is to be understood that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the scope of the invention, which is defined solely by the appended claims. . All technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art unless otherwise stated.

In the present specification, the particle size of a particle means an average particle size unless otherwise specified, and the average particle size is defined as a measurement based on the longest long axis regardless of the shape of the particle, unless otherwise specified. In addition, the term "including A " in the present specification means both of" consisting of A "and" including other than A "

The conductive particles according to the embodiment of the present invention include resin fine particles, a first plating layer, and a second plating layer. The resin fine particles are composed of a polymer of a monomer. The material is preferably a copolymer obtained by polymerizing a monomer such as a styrene type, an acrylic type, a divinylbenzene type, etc., a modified monomer thereof, or a mixed monomer of the above-mentioned equivalent, without limitation. The resin fine particles have a spherical shape and an average diameter is 3 탆 to 5 탆.

In the present specification, there is a slight difference between the resin particle sizes, but the particle size of the largest number of particles can be defined as the average diameter of the particles.

The first plating layer may be formed of a single metal such as gold, silver, nickel, copper, tin, zinc, titanium and the like and a metal such as tin-lead, tin-copper, tin-zinc, nickel-phosphorus, nickel- And the like.

The thickness of the first plating layer is suitably about 10 to 300 nm. When the thickness of the plated layer is less than 10 nm, the resistance value increases. When the thickness exceeds 300 nm, the specific gravity of the conductive ball is greatly increased, which causes cohesion problems in the production of ACF. A particularly preferable thickness is 20 to 200 nm.

The second plating layer is coated on the first plating layer and has a protrusion. The thickness of the plating layer excluding the protrusions is preferably about 10 to 50 nm. When the thickness of the plating layer is less than 10 nm, the resistance value increases. When the thickness exceeds 50 nm, the specific gravity of the conductive ball is greatly increased, which causes cohesion problems in the production of ACF.

The projections are formed integrally with the second plating layer. By being integrally formed, it means that the projections are formed of the same material as the second plating layer without using a separate core material or a bonding material, and it is particularly preferable to be formed of the same material in the same process. This is because the projections can have a firm bonding force without being separated from the second plating layer.

It is preferable that the area S1 covered with the projection is formed so as to cover 93 to 100% of the surface area S of the second plating layer, preferably 95 to 100%, and substantially covers the entire surface.

When the projections cover the surface area of the second plating layer by 93 to 100%, it means that the surface of the second plating layer is composed of projections and the portion without projections is less than 7%. That is, the absence of the projection-free portion means that the projections are uniformly provided in the transfer area, so that the variation in the conductive performance of the particles is small and the reliability of the conductive layer can be secured.

On the other hand, the protrusion is preferably composed of a first protrusion having a height of 100 nm to 300 nm and a second protrusion of less than 100 nm.

The first protrusion can effectively penetrate the oxide film of 3 to 9 nm formed on the surface, and the resin can be excluded and the connection reliability can be improved. Therefore, it is preferable that the area S2 covered by the fine protrusions having a height of 100 nm to 300 nm occupies 70% to 90% of the surface area S of the second plating layer.

The second protrusion is substantially insufficient in the resin exclusion property, and if the protrusions of 100 nm or more are large, it is difficult to participate in the electrical connection. However, in the absence of these protrusions, the first protrusion may break or be deeply embedded in the substrate, . Therefore, it is preferable that the area S3 occupied by the second projection is 10 to 30% of the surface area S of the second plating layer.

On the other hand, the base diameter of the projections is preferably 80 to 300 nm. As shown in Fig. 1, the protrusion has a shape in which the diameter becomes smaller as it goes from the base to the distal end. The protrusion has a base portion, a middle portion, and a distal portion that are divided into three portions from the base to the distal end. B > C, where B is the average diameter of the portion, and C is the average diameter of the end portion. Here, the average diameter refers to the average of the diameters of the respective sections.

In particular, the average diameter of the distal end is 1/5 to 1/10 of the average diameter of the base. If the diameter of the end portion exceeds 1/5 of the diameter of the base portion, there is a problem that the resin exclusion property is not sufficient during bonding after the production of ACF to increase the resistance. If the diameter is less than 1/10, the structure of the fine protrusion it is broken and the resistance reduction effect can not be sufficiently obtained. On the other hand, since the shape of the protrusion is narrowed toward the distal end, it is possible to prevent a bridge, which is a phenomenon in which neighboring particles are energized by the shape of the ACF after bonding.

It is preferable that the projections have a degree of hardness enough to break the resin binder and the metal oxide layer in the compression bonding process when used for the anisotropic conductive material. The material of the second plating layer having such a hardness is mainly a metal, for example, a single metal such as gold, silver, copper, nickel, titanium, bismuth, antimony, or a metal such as copper-zinc, copper- Nickel-tungsten, nickel-boron, and the like. Preferred metals are nickel, gold, silver, palladium, tungsten, and the like.

An additional plating layer containing noble metals such as gold, silver, platinum, and palladium may be provided on the surface layer of the conductive particles whose surfaces are covered with the protrusions described above.

This is because the conductivity of the conductive particles is increased and the effect of preventing oxidation is also obtained.

Hereinafter, a method for producing conductive particles, which is another aspect of the present invention, will be described.

The method for producing conductive particles according to the present invention includes a step of providing resin microparticles, a step of surface treatment, a step of forming a first plating layer, and a step of forming a second plating layer.

The step of providing the resin microparticles is a step of forming a core of the conductive particles with a resin, wherein a dispersion stabilizer and a monomer are added to deionized water to prepare a suspension, and a polymerization agent is added to proceed the polymerization reaction to form microparticles.

The surface treatment step is a step of attaching an activation nucleus to the surface of the resin fine particles and includes a sensitization step of adsorbing Sn2 + ions to the surface of the resin fine particles and a catalyst treatment step of forming a catalyst nucleus of electroless plating.

The first plating layer forming step is a step of electroless plating the surface of the resin fine particles, wherein a first solution (plating solution) is prepared from a Ni salt, a complexing agent, a stabilizer, and a surfactant, the resin fine particles are put into a first solution, A second solution containing a reducing agent and a stabilizer is further added to prepare conductive particles having the first plating layer formed thereon.

The second plating layer forming step is a step of forming a second plating layer having protrusions on the surfaces of the conductive particles, wherein a third solution containing deionized water, a Ni salt, a dispersant, and a first pH adjusting agent is prepared, The conductive particles having the first plating layer formed thereon are mixed with the reducing agent and reacted to prepare the conductive particles having the second plating layer.

At this time, in the second plating layer formation step, the pH adjusting agent is used twice using the first pH adjusting agent and the second pH adjusting agent.

The first pH adjusting agent adjusts the size and height of the protrusions according to the amount of the input as well as the pH adjustment. The first pH adjuster is used in combination with an amine compound having a high boiling point (150 ° C or higher). As the amine compound, for example, monoethanolamine (boiling point: 171 ° C), diethanolamine (boiling point: 271 ° C), triethanolamine (boiling point: 335 ° C) and the like can be used.

The second pH adjuster is mainly used for pH adjustment, and for example, an aqueous solution of sodium hydroxide (NaOH) or potassium hydroxide (KOH) can be used. The amount of the second pH adjusting agent to be used is not limited, and it is sufficient that the pH is maintained at 12 or more.

The pH adjuster is preferably used in an amount of 5 to 15 parts by weight based on 100 parts by weight of the deionized water of the first solution.

On the other hand, the nickel salt may be at least one of nickel glide (NiCl2), nickel acetate (Ni (CH3COO) 2), nickel nitrate (Ni (NO3) 2) and nickel sulfate (NiSO4). The concentration to be used is not particularly limited, but it is preferable that the metal salt is used in an amount of 5 to 20 parts by weight based on 100 parts by weight of deionized water of the first solution.

Example

 [Example 1]

≪ Production step of conductive particles &

Dissolve 15 g of dispersion stabilizer PVP-30K (Polyvinylpyrrolidone, K30) in 1,600 g of deionized water. 85 g of ethylene glycol dimethacrylate monomer and 85 g of divinylbenzene monomer are added to the above solution and stirred to prepare a suspension. To the suspension, 1.5 g of Benzoyl peroxide, which is a polymerization agent, is added and mixed well by stirring. The monomer suspension is heated to 85 占 폚 to carry out the polymerization reaction, and the reaction is maintained for 12 hours until the reaction is completed. After completion of the synthesis, the fine particles in the suspension are subjected to filtration, washing, classification, and drying to obtain core resin fine particles.

On the other hand, in order to perform nickel electroless plating on the core resin particles, an activation nucleus to which the reduced metal particles adhere during plating is required. For example, sensitization is carried out with a solution obtained by dissolving hydrochloric acid (HCl) and tin chloride (SnCl2) in deionized water, and hydrochloric acid and palladium chloride (PdCl2) are added to deionized water, And the solution is heated to a temperature of -50 ° C. The sensitized is a process for the adsorption of Sn2 + ions on the insulating material surface, Exceler illustration is electroless plating reaction as shown by ^{Sn 2+ + Pd 2+ → Sn 4+} + Pd 0 catalyst to form a catalyst nucleus of the plating Treatment process.

Next, 2200 ml of deionized water, 240 g of nickel sulfate as a Ni salt, 5 g of sodium acetate as a complexing agent, 0.002 g of Pd-acetate as a stabilizer and 3 g of PEG-400 as a surfactant were sequentially dissolved in a 3 L reactor to prepare a first solution . 50 g of the resin particles having an average particle diameter of 3.7 탆, which had been subjected to the above-mentioned Pd catalyst treatment process, were placed in a plating solution and dispersed for 5 minutes using a homogenizer. After the dispersion treatment, the pH was adjusted to 6.5 using ammonia water.

300 ml of deionized water, 260 g of sodium hypophosphite as a reducing agent, and 0.001 g of Pb-acetate as a stabilizer were sequentially dissolved in a 1 L beaker to obtain a second solution (b).

The above-mentioned second solution (b) was added by a metering pump at a rate of 20 ml / min during the initial 5 minutes while the temperature of the 3 L reactor was maintained at 65 캜 and stirred at 250 rpm, and the remainder was introduced at a rate of 8 ml / min. The second solution (b) was fully charged and the reaction was maintained for 20 minutes to prepare conductive particles having a particle diameter of 4.02 탆.

≪ Process of forming protrusions >

 [Example 1]

10 g of the conductive particles prepared in the production step of conductive particles are used to prepare conductive particles having a second plating layer provided with projections. In the manufacturing process, 200 ml of deionized water, 2.789 g of nickel chloride as a Ni salt, 30 g of PVP-30K as a dispersant, 38.4 g of monomethylamine as a first pH adjusting agent and 13.7 g of citric acid as a complexing agent were dissolved in a second solution c) was prepared, and 60 g of sodium hydroxide was dissolved in 300 ml of deionized water as a second pH adjusting agent and mixed with the third solution (c). 10 g of the conductive particles prepared in Example 1 and 40 g of hydrazine as a reducing agent were sequentially added to the third solution (c), and the mixture was stirred and heated to 40 캜.

The solution containing 40 g of nickel chloride dissolved in 100 ml of deionized water was added to the plating solution kept at 40 캜 at a rate of 0.6 ml / min, and the reaction was maintained for 10 minutes after the completion of the addition, .

 [Examples 2 to 4]

The conductive particles were prepared in the same manner as in Example 1 except that the kind of the Ni salt and the primary pH adjuster of the third solution were changed in the protrusion formation step.

Ni salt Primary pH adjuster Secondary pH adjusting agent Average protrusion height * Example 1 Nickel chloride 2.789 g 38.4 g of monomethylamine Sodium hydroxide 60g 200 nm Example 2 Nickel chloride 1.7 g
Tungsten chloride 1.089 g 38.4 g of monomethylamine Sodium hydroxide 60g 250 nm Example 3 Nickel chloride 2.789 g 10.0 g of monomethylamine Sodium hydroxide 60g 130 nm Example 4 Nickel chloride 2.789 g 20.0 g of monomethylamine Sodium hydroxide 60g 150 nm

* The surface of the conductive particles was measured by a field emission scanning electron microscope (FE-SEM), and the height of the projections was measured in a square divided by 1 mu m and 1 mu m in the measurement photographs, and the average value was recorded. .

[Comparative Example 1]

As a comparative example 1, SEKISUI model: AUEYB-00375-T-S product was used.

[Comparative Example 2]

As Comparative Example 2, SEKISUI model: N2EYB-00375 was used.

[Comparative Example 3]

The conductive particles obtained in the conductive particle production step of Example 1 were evaluated as Comparative Example 3.

Experimental Example

The connection resistances were measured as follows in Examples 1 to 4 and Comparative Examples 1 to 3 as follows.

[Experimental Example 1]

Measurement of connection resistance

The conductive fine particles were blended in an epoxy binder so that the number of conductive fine particles was 250,000 / mm 2, sandwiched between flexible printed circuit boards having a bonding wiring pattern of 200 × 200 μm, and pressed at 190 ° C. under a pressing pressure of 20 N After the bonding, the electrical resistance was measured.

Conductivity (Ω) Example 1 One Example 2 3 Example 3 6 Example 4 5 Comparative Example 1 25 Comparative Example 2 12 Comparative Example 3 45

[Experimental Example 2]

The surface of the conductive particles prepared according to Example 2 was enlarged 15,000 times by using a field emission scanning electron microscope (FE-SEM), and was posted in Fig. According to this, it can be confirmed that the protrusions having sharp ends are distributed over almost the whole area of the surface.

[Experimental Example 4]

The surface of the conductive particles of Comparative Example 3 was enlarged 5,000 times by using a field emission scanning electron microscope (FE-SEM) and is shown in Fig. According to this, it can be confirmed that no protrusion is formed on the surface to have a smooth surface.

[Experimental Example 5]

The surface of the conductive particles of Comparative Example 1 was enlarged 7,000 times by using a field emission scanning electron microscope (FE-SEM) and is shown in Fig. According to this, it can be confirmed that the projections are distributed in a part of the surface, and the shape of the projections is irregular.

[Experimental Example 6]

The surface of the conductive particles of Comparative Example 2 was enlarged 7,000 times by using a field emission scanning electron microscope (FE-SEM) and is shown in Fig. According to this, although the number of projections is larger than that of Comparative Example 1, it is still distributed in a part of the surface area, and it can be confirmed that the projections have irregular shapes.

[Experimental Example 7]

The surface of Experimental Example 1 was enlarged 25,000 times by using a field emission scanning electron microscope (FE-SEM) and was posted in Fig. In the photograph shown in the photograph, it can be seen that the area occupied by protrusions of 100 nm or less (the area inside the line) is 10 to 30% in the square divided by 1 m x 1 m.

[Experimental Example 8]

The surface of Experimental Example 2 was enlarged 25,000 times by using a field emission scanning electron microscope (FE-SEM) and was posted in Fig. In the photograph shown in the photograph, it can be seen that the area occupied by protrusions of 100 nm or less (the area inside the line) is 10 to 30% in the square divided by 1 m x 1 m.

[Experimental Example 9]

The surface of Experimental Example 3 was enlarged 25,000 times by using a field emission scanning electron microscope (FE-SEM) and was posted in Fig. In the photograph shown in the photograph, it can be seen that the area occupied by protrusions of 100 nm or less (the area inside the line) is 10 to 30% in the square divided by 1 m x 1 m.

[Experimental Example 10]

The surface of Experimental Example 4 was enlarged 25,000 times by using a field emission scanning electron microscope (FE-SEM) and was posted in Fig. In the photograph shown in the photograph, it can be seen that the area occupied by protrusions of 100 nm or less (the area inside the line) is 10 to 30% in the square divided by 1 m x 1 m.

The present invention has been described with reference to the preferred embodiments. It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims. Therefore, the disclosed embodiments should be considered in an illustrative rather than a restrictive sense. The scope of the present invention is defined by the appended claims rather than by the foregoing description, and all differences within the scope of equivalents thereof should be construed as being included in the present invention.

Claims (13)

Resin fine particles;
A first plating layer provided on a surface of the resin fine particles; And
A second plating layer provided on a surface of the first plating layer and having a projection on an outer surface thereof,
Wherein the protrusions cover 93 to 100% of the surface area of the second plating layer and include a first protrusion having a height of 100 nm to 300 nm and a second protrusion having a thickness of less than 100 nm,
Wherein the first projection covers 70 to 90% of the surface area of the second plating layer,
The second protrusion covers 10 to 30% of the surface area of the second plating layer,
Wherein said protrusions have a base portion, a middle portion and a distal portion which are divided into three equal halves from the base to the end, wherein A is an average diameter of said base portion, B is an average diameter of said middle portion, > C,
And the average diameter of the base portion is 50 to 300 nm. The method according to claim 1,
Wherein the average diameter of the terminal portions is 1/5 to 1/10 of the average diameter of the base portions. 3. The method of claim 2,
And the projections are formed integrally with the second plating layer. delete The method according to claim 1,
Wherein the first plating layer is at least one member selected from the group consisting of gold, silver, nickel, copper, tin, zinc, titanium, tin-lead, tin-copper, tin-zinc, nickel-phosphorus, nickel- The conductive particles in which the above materials are used. The method according to claim 1,
Wherein the second plating layer is formed of at least one material selected from the group consisting of gold, silver, copper, nickel, titanium, bismuth, antimony, copper-zinc, copper-tin, nickel-phosphorus, nickel-tungsten and nickel- Conductive particles used. The method according to claim 1,
The conductive particle surface having a height of an average protrusion of 130 to 250 nm in a square divided by 1 占 퐉 占 1 占 퐉 in a measurement photograph after measuring the surface of the conductive particle by a field emission scanning electron microscope (FE-SEM). An anisotropic conductive material using the conductive particles according to any one of claims 1 to 3 and 5 to 7. 9. The method of claim 8,
The anisotropic conductive material may be,
Anisotropic conductive material selected from the group consisting of anisotropic conductive film, anisotropic conductive paste, anisotropic conductive ink, and anisotropic conductive sheet. A resin fine particle providing step of producing resin fine particles to be a core with a resin;
A surface treatment step of performing surface treatment on the surface of the resin fine particles for metal electroless plating;
A first plating layer forming step of forming a conductive layer on the surface-treated conductive particles by electroless plating; And
And a second plating layer forming step of forming a second plating layer including projections on the conductive particles on which the first plating layer is formed,
Wherein the protrusions cover 93 to 100% of the surface area of the second plating layer, protrusions having a height of 100 to 300 nm in the protrusions cover 70 to 99% of the area of the second plating layer,
Wherein the protrusion has a base portion, a middle portion, and a distal portion that are divided into three equal parts from the base to the end, and A>B> A, where A is the average diameter of the base portion, B is the average diameter of the middle portion, and C is the average diameter of the distal portion. C < / RTI > 11. The method of claim 10,
The second plating layer forming step
The third pH adjusting agent is added to the third solution to prepare a third solution containing deionized water, a Ni salt, a dispersing agent, and a first pH adjusting agent. The conductive particles having the first plating layer formed thereon are added together with a reducing agent to react A method for producing conductive particles. 12. The method of claim 11,
Wherein the first pH adjusting agent comprises an amine compound. 13. The method of claim 12,
The amine compound may be at least one selected from the group consisting of monoethanolamine (boiling point: 171 ° C), diethanolamine (boiling point: 271 ° C), triethanolamine (boiling point: 335 ° C) A method for producing conductive particles.

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