WO2017005462A1 - Composant semi-conducteur de puissance comprenant un dispositif de refroidissement - Google Patents

Composant semi-conducteur de puissance comprenant un dispositif de refroidissement Download PDF

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Publication number
WO2017005462A1
WO2017005462A1 PCT/EP2016/063620 EP2016063620W WO2017005462A1 WO 2017005462 A1 WO2017005462 A1 WO 2017005462A1 EP 2016063620 W EP2016063620 W EP 2016063620W WO 2017005462 A1 WO2017005462 A1 WO 2017005462A1
Authority
WO
WIPO (PCT)
Prior art keywords
fluid
power semiconductor
power output
semiconductor device
designed
Prior art date
Application number
PCT/EP2016/063620
Other languages
German (de)
English (en)
Inventor
Stefan Huehner
Adolf Dillmann
Reiner Holp
Original Assignee
Robert Bosch Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch Gmbh filed Critical Robert Bosch Gmbh
Publication of WO2017005462A1 publication Critical patent/WO2017005462A1/fr

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20927—Liquid coolant without phase change
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids

Definitions

  • the invention relates to a power semiconductor device for supplying an electrical load, in particular an inverter for an electrical machine, a solar inverter, a DC-DC converter or a step-up converter.
  • the power semiconductor device has a cooling device, wherein the cooling device has at least one or only one fluid channel.
  • the fluid channel has an inlet opening and an outlet opening for fluid.
  • the fluid channel also has a particularly flat formed heat contact wall, which is thermally conductively connected to the power semiconductor device and is designed to absorb heat from the power semiconductor device and deliver it to the fluid.
  • the power semiconductor component has at least two or three power output stages, wherein the power output stages are each designed to provide a current on the output side for supplying the load.
  • the power output stages are each connected thermally conductively with mutually different subregions of the thermal contact wall.
  • the fluid channel is arranged and designed to flow parallel to one another by means of the fluid received at the input of the power output stages.
  • the power output stages which are each connected to a portion thermally conductive, have the same temperature.
  • a power output stage has at least one or only one semiconductor switch half-bridge and are each designed to provide a current on the output side.
  • the power semiconductor component is an inverter, also called an inverter, for supplying at least three or more only three phases of an electrical consumer.
  • the power output stages are preferably each designed to energize a phase, in particular a phase of an electrical machine, or in the case of a solar inverter, to provide a phase current for feeding into an electrical supply network.
  • the cooling device preferably has a fluid distributor, which is designed to guide the fluid received at the inlet opening to the partial areas and to flow the partial areas parallel to one another with the fluid.
  • a uniform flow of the partial areas and thus a uniform cooling of the power output stages, can be effected.
  • the fluid distributor has an in particular U-shaped fluid channel, which along its longitudinal extension of the fluid channel has a cross-section, in particular a cross-sectional area, decreasing towards an end which is remote from the inlet opening.
  • the longitudinal extension of the fluid channel runs with at least one transverse component or transversely to the fluid channel, in particular a guide direction of the fluid channel.
  • the fluid can flow along the longitudinal extent of the fluid channel of the fluid distributor in the inverter and continue to flow within the power semiconductor device transverse to the longitudinal extent of the fluid channel - evenly distributed over the power output stages - up to an outlet.
  • the power semiconductor device preferably has a length dimension that is greater than a width dimension, wherein the length dimension extends along the longitudinal extent of the fluid channel.
  • the cooling device preferably has a fluid collector, which with the
  • Fluid channel is connected on the output side and is adapted to receive the fluid from the sub-areas and to lead to the outlet opening.
  • the fluid collector is formed as a fluid channel, wherein the fluid channel has a cross-section increasing along a longitudinal extension of the fluid channel to the outlet opening.
  • guide webs are formed in the fluid channel, which are thermally conductively connected to the heat contact wall and configured to absorb heat from the heat contact wall and to the
  • the guide webs preferably extend parallel to one another, more preferably transversely to the heat contact wall into a cavity formed by the fluid channel.
  • a large surface can be formed for the heat-conducting contacting of the fluid.
  • the fluid flow can be so opposed to a low flow resistance.
  • the fluid distributor is designed to divide the fluid stream received on the input side into partial streams.
  • at least one partition wall is moreover preferably formed in the fluid distributor, so that a partial area of associated fluid channel formed in the fluid distributor is designed for the partial flow for each partial area of the thermal contact wall assigned to a power end stage.
  • the fluid flow can advantageously be divided by the fluid distributor into equal partial flows, so that each power output stage can be cooled by one of the partial flows.
  • the at least one partition wall, or the partition walls may each be realized independently of the cross-sectional taper described above along the longitudinal direction of the fluid distributor.
  • the guide webs are each formed along the guide direction of the fluid channel wave-shaped.
  • the waveform is a sine waveform.
  • the fluid flow can be advantageously laminar, wherein by means of the waveform, in particular an amplitude of the waveform, a flow resistance of the fluid channel of the cooling device can be adjusted.
  • a distance between mutually adjacent guide webs on the surface portions of the heat contact wall is formed differently from each other. More preferably, the distance between the mutually adjacent guide webs along the longitudinal axis, in particular from the inlet opening repellent, formed decreasing.
  • a spacing of the guide webs within a subregion, which corresponds to a subarea is designed to decrease along the longitudinal axis with increasing distance from the inlet opening. The decrease is preferably formed exponentially in accordance with a pressure loss along the longitudinal axis. As a result, an equal fluid pressure can be formed between the guide webs along the longitudinal axis over the subregions. As a result, the power modules can advantageously be cooled uniformly.
  • the distance along the longitudinal axis between adjacent guide webs may be formed additionally or independently of the mentioned taper of the cross section of the fluid distributor.
  • a web is formed on the heat contact wall which extends in the direction of the longitudinal axis and which is designed to accumulate a fluid pressure in the fluid distributor.
  • a gap extending along the longitudinal axis is formed in the fluid distributor, through which fluid accumulated in front of the gap can flow from the fluid distributor into the fluid channel.
  • the fluid distributor can in this variant have a uniform cross section along the longitudinal axis.
  • the heat contact wall in the fluid channel projecting, transversely to the heat contact wall facing pin, wel each spaced from each other.
  • the pins are integrally formed on the heat contact wall.
  • the fluid distributor and the fluid collector are each designed to guide the fluid in mutually opposite directions.
  • the inlet opening and the outlet opening in particular to the inlet opening or the outlet opening formed nozzle for connecting a pipe or a fluid hose, facing in the same direction.
  • the invention also relates to a method for cooling a power semiconductor device, in particular an inverter, DC-DC converter or boost converter.
  • the power semiconductor component has at least three power output stages, in which a cooling fluid is conducted past the power output stages and can thereby absorb heat loss from the power output stages.
  • the fluid flow is preferably divided in the method, wherein the power output stages are each cooled with a partial flow of the partial streams parallel to each other.
  • the power output stages are preferably arranged adjacent to each other along a longitudinal axis, wherein a flow direction of the fluid flow, previously also referred to as the guide direction, extends transversely to the longitudinal axis along which the power output stages are arranged.
  • FIG. 1 shows an exemplary embodiment of a power semiconductor component, in particular an inverter, in which a cooling device has a fluid channel which extends transversely to a longitudinal axis of the power semiconductor component, wherein power output stages of the power semiconductor device are arranged adjacent to each other along the longitudinal axis;
  • FIG. 2 shows the power semiconductor component shown in FIG. 1 in a plan view
  • FIG. 3 shows a variant of that shown in FIG. 1 for a power semiconductor component in a sectional view, in which a web is formed on the heat contact wall, which is designed to accumulate a fluid pressure in the fluid distributor such that the fluid pressure is in the region of a gap formed at the web a longitudinal extent of the gap is formed constant.
  • Figure 1 shows - schematically - an embodiment of a power semiconductor device 1, for example, an inverter in a sectional view.
  • the power semiconductor component 1 has a power output stage 2, a power output stage 3 and a power output stage 4.
  • the power output stages 2, 3 and 4 are arranged alongside one another along a longitudinal axis 12.
  • the power output stages have at least one or only one semiconductor switch half-bridge and are each designed to provide a current on the output side.
  • the power output stages are each designed, for example, to energize a stator of an electrical machine, in particular an electronically commutated electric machine.
  • the power output stages 2, 3 and 4 are each connected on the input side to a processing unit 32.
  • the power output stage 2 is connected to the processing unit 32 via an electrical connection line 34.
  • the power output stage 3 is connected to the processing unit 32 via an electrical connection line 35.
  • the power output stage 4 is connected to the processing unit 32 via an electrical connection line 36.
  • the processing unit 32 is designed to control the power output stages 2, 3 and 4, in particular control inputs of the semiconductor switches of the power output stages, for generating a pulse modulation pattern, in particular pulse width modulation pattern, or block commutation pattern and to generate corresponding control signals and to send them to the power output stages 2, 3 and 4.
  • the processing unit 32 is, for example, as a microcomputer or Mikrocontrol- trained.
  • the processing unit 32 has an input 33, wherein the processing unit 32 is designed to generate the control signals in response to a control signal received at the input 33.
  • the power output stages 2, 3 and 4 of the power semiconductor device for example, an electric machine, in particular stator coils of the electric machine, which are each connected to a power output stage of the power output stages, be energized to generate a magnetic rotating field.
  • the power semiconductor device 1 also has a cooling device 40 in this exemplary embodiment.
  • the cooling device 40 is designed to guide a cooling fluid and, to this end, has a fluid channel 6-shown in detail in FIG.
  • the cooling device 40 has an inlet opening 8 through which fluid can flow into the cooling device 40 along an inlet direction 29.
  • the cooling device 40 has a fluid distributor 5, which is designed to guide the fluid received at the inlet opening 8 via partial regions 37, 38 and 39 to a thermal contact wall 10, and thus-in particular uniformly-over the partial regions 37, 38 and 39 to distribute the heat contact wall 10.
  • the fluid distributor 5 has in this embodiment, a U-shaped groove 27, which is designed for fluid guiding.
  • the power semiconductor component 1 has a length dimension 14 which is greater than a width dimension 13, wherein the length dimension 14 extends along a longitudinal axis 12 of the fluid channel 27.
  • the cooling device 40 has a housing 41, which encloses a fluid channel 6 in this embodiment.
  • the fluid channel 6 is formed in this embodiment by a cavity.
  • the fluid channel 6 is designed to pass the cooling fluid received at the inlet opening 8 past the heat contact wall 10 and to dissipate heat loss generated by the power output stages 2, 3 and 4 to the cooling fluid.
  • the power output stages 2, 3 and 4 are connected to thermally conductive means of the heat contact wall 10.
  • the thermal contact wall 10 is formed for example by a copper sheet or aluminum sheet.
  • the cooling device 40 has guide webs 9, which are each connected to the heat-contact wall 10 in a thermally conductive manner and which each extend into the fluid channel 6.
  • the guide webs 9 are formed, for example, each made of copper or aluminum sheet and are integrally formed on the heat contact wall 10 or connected to this cohesively.
  • the fluid distributor and / or the guide webs may be produced in another embodiment by means of die casting, semi-solid molding, squeeze casting, forging, or extrusion molding.
  • the guide webs 9 are formed together to guide the fluid along a Füh approximately direction 15 of the fluid channel 6 and emit heat received from the heat contact wall 10 heat loss to the cooling fluid.
  • Figure 1 also shows a variant in which a distance between mutually adjacent guide webs such as the guide web 9 in the sub-areas 37, 38 and 39, formed differently.
  • a distance 42 between mutually adjacent guide webs in the portion 37 is formed larger than a distance 43 between mutually adjacent guide webs in the portion 38.
  • the distance 43 between mutually adjacent guide webs in the subregion 38 is formed larger than a distance 44 between mutually adjacent guide webs in the subregion 39.
  • the distance between the guide webs 9 is thus formed decreasing along the longitudinal axis with increasing distance from the inlet opening 8 from partial area to partial area.
  • the spacing between adjacent guide webs within a subarea can be the same, or, in a variant thereof, also within a subarea along the longitudinal axis 12, ie transversely to a longitudinal extension of the guide webs 9, decrease.
  • FIG. 2 shows-schematically-the inverter 1 already illustrated along a longitudinal section in FIG. 1 in a plan view.
  • the power output stage 2 is assigned a portion 37 of the heat contact wall 10, so that from the power output stage 2 heat loss over the sub-range
  • the power output stage 3 is arranged adjacent to the longitudinal axis 12 adjacent.
  • the power output stage 3 is a subarea
  • a portion 39 is associated along the longitudinal axis 12, with which the power output stage 4 is thermally conductive connected.
  • the power output stage 3 is thermally connected to the portion 38. So can from the power amplifier 3
  • Loss heat are discharged via the portion 38 to a fluid flowing in the fluid channel 6 fluid.
  • the power output stage 4 can dissipate heat loss via the subregion 39 to the fluid flowing in the fluid channel 6. Shown is the flow direction 15 of the fluid flowing in the fluid channel 6.
  • FIG. 2 also shows the fluid distributor 5 already shown in FIG. 1.
  • the fluid distributor 5 has two dividing walls which are designed to divide the fluid flow received at the inlet opening 8 into partial flows and to feed each partial flow into a partial area.
  • the fluid distributor 5 has a dividing wall 19, which is designed to separate a partial channel 23 from the fluid channel 27, by allowing a portion of the fluid flow received at the inlet opening 8 to be guided over the partial region 37, so that therefrom Partial channel 23 flowing fluid loss heat of the power output stage 2 via the portion 37 of the heat contact wall 10 can be dissipated.
  • the fluid distributor 5 also has a partition wall 20, which extends in this embodiment at least on a longitudinal section, namely the longitudinal section along the longitudinal axis 12, which corresponds to the power output stage 2 and the partial region 37, parallel to the partition wall 19.
  • Partition wall 20 extends in this embodiment along the longitudinal axis 12 along the longitudinal extension of the power output stage 3 along the longitudinal axis 12.
  • a fluid passage 21 extends in which a partial flow between the outer wall and the partition wall 20 can be performed up to the portion 39, where heat loss of the power output stage 4 of a in the sub-channel 21 flowing cooling fluid can be received.
  • the dividing wall 19 extends with a longitudinal section transversely to the longitudinal axis 12, between the partial regions 37 and 38, so that the partial streams flowing through the partial regions 37 and 38 are separated from each other within the fluid channel 6, as far as a fluid collector 7.
  • the cooling device 40 also has the fluid collector 7, which is formed on a housing 41 enclosing the fluid channel 6.
  • the fluid distributor 5 is molded onto the housing 41.
  • the fluid distributor 5 and the fluid collector 7 are each formed along the longitudinal axis 12 to a tapered from the inlet opening 8 and the outlet opening 31 end.
  • the fluid collector 7 is connected to the outlet opening 31 and is designed to receive the fluid flowing in the fluid channel 6 via the partial areas 37, 38 and 39 of the thermal contact wall 10 and to lead it together to the outlet opening 31.
  • a cross-section 24 of the fluid collector 7, in the region of the power output stage 2, is designed to be larger than a cross-section 25 of the fluid collector 7 which is further spaced along the longitudinal axis 12 from the outlet opening 31 on a longitudinal section which extends along the power output stage 3, the power output stage 3 passing along The power output stage 4 is further spaced along the longitudinal axis of the output port 31 than the power output stage 3.
  • a cross section 26 of the fluid collector 7 along the longitudinal axis 12 in the region of the power output stage 4 is The cross-sections 24, 25 and 26 correspond in this embodiment, a cross-sectional area of the fluid collector 7.
  • the cross-sections 16, 17 and 18 of the fluid distributor 5 correspond in this embodiment, a cross-sectional area of the fluid distributor. 5
  • the power semiconductor device 1 can - unlike shown in Figure 2 - have no partitions 19 and 20.
  • the fluid pressure of the cooling fluid received at the inlet opening 8, which adjusts in the subregions 37, 38 and 39, is thus represented by the degree of taper of the fluid distributor 5, in particular by the degree of taper, represented by the cross sections 16 shown in FIG. 17 and 18, determined.
  • FIG. 3 shows a variant for a power semiconductor component in which a web 45, which extends in the direction of the longitudinal axis 12 and which is formed, forms a fluid pressure in the heat contact wall 10
  • a gap 49 is formed, through which fluid from the fluid distributor 5 can flow into the fluid channel 6.
  • the web 45 thus forms a barrier, in front of which a fluid pressure can accumulate in the fluid distributor, so that a fluid pressure in the region of the gap 49, in particular in the flow direction behind the web 45 along the longitudinal axis 12 is the same.
  • a web 46 which is designed to regulate the fluid flow to the fluid collector, can be formed on the heat contact wall 10 -shaped in dashed lines.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

L'invention concerne un composant semi-conducteur de puissance, en particulier un onduleur pour une machine électrique. Le composant semi-conducteur de puissance comporte un dispositif de refroidissement, qui comporte au moins un ou uniquement un canal d'écoulement d'un fluide. Le canal de fluide comporte un orifice d'admission et un orifice d'évacuation pour le fluide. Le canal de fluide comporte également une paroi de contact thermique, qui a une liaison thermoconductrice avec le composant semi-conducteur de puissance et qui est conçue pour absorber la chaleur du composant semi-conducteur de puissance et la transmettre au fluide. Selon l'invention, le composant semi-conducteur de puissance comprend au moins trois étages de puissance, qui sont formés chacun pour fournir une phase à la machine électrique. Les étages de puissance sont reliés chacun de manière thermoconductrice à des sous-zones, différentes les unes des autres, de la paroi de contact thermique. Le canal de fluide est disposé et conçu pour fournir en parallèle aux étages de puissance le fluide reçu en entrée.
PCT/EP2016/063620 2015-07-08 2016-06-14 Composant semi-conducteur de puissance comprenant un dispositif de refroidissement WO2017005462A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102015212720.6 2015-07-08
DE102015212720.6A DE102015212720A1 (de) 2015-07-08 2015-07-08 Leistungshalbleiterbauteil mit einer Kühlvorrichtung

Publications (1)

Publication Number Publication Date
WO2017005462A1 true WO2017005462A1 (fr) 2017-01-12

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WO (1) WO2017005462A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018120904A (ja) * 2017-01-24 2018-08-02 三菱電機株式会社 ヒートシンク
CN113678247A (zh) * 2019-02-22 2021-11-19 大众汽车股份公司 用于均匀冷却构件的装置和具有至少一个装置的机动车
WO2023077927A1 (fr) * 2021-11-05 2023-05-11 中车永济电机有限公司 Convertisseur de traction

Families Citing this family (2)

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Publication number Priority date Publication date Assignee Title
US20230138320A1 (en) * 2021-11-02 2023-05-04 Carrier Corporation Refrigerant cooled heat sink for power electronic modules
WO2024013548A1 (fr) * 2022-07-13 2024-01-18 Rimac Technology Llc Dispositif de refroidissement

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JP2010203694A (ja) * 2009-03-04 2010-09-16 Showa Denko Kk 液冷式冷却装置
US20120139096A1 (en) * 2009-08-10 2012-06-07 Fuji Electric Co., Ltd. Semiconductor module and cooling unit
EP2704191A1 (fr) * 2011-04-26 2014-03-05 Fuji Electric Co., Ltd. Refroidisseur pour module à semi-conducteur, et module à semi-conducteur
WO2015079643A1 (fr) * 2013-11-28 2015-06-04 富士電機株式会社 Procédé de fabrication d'un réfrigérant pour module semi-conducteur, réfrigérant pour module semi-conducteur, module semi-conducteur, et véhicule piloté électriquement

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Publication number Priority date Publication date Assignee Title
JP2010203694A (ja) * 2009-03-04 2010-09-16 Showa Denko Kk 液冷式冷却装置
US20120139096A1 (en) * 2009-08-10 2012-06-07 Fuji Electric Co., Ltd. Semiconductor module and cooling unit
EP2704191A1 (fr) * 2011-04-26 2014-03-05 Fuji Electric Co., Ltd. Refroidisseur pour module à semi-conducteur, et module à semi-conducteur
WO2015079643A1 (fr) * 2013-11-28 2015-06-04 富士電機株式会社 Procédé de fabrication d'un réfrigérant pour module semi-conducteur, réfrigérant pour module semi-conducteur, module semi-conducteur, et véhicule piloté électriquement
US20160129792A1 (en) * 2013-11-28 2016-05-12 Fuji Electric Co., Ltd. Method for manufacturing cooler for semiconductor-module, cooler for semiconductor-module, semiconductor-module and electrically-driven vehicle

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018120904A (ja) * 2017-01-24 2018-08-02 三菱電機株式会社 ヒートシンク
WO2018138936A1 (fr) * 2017-01-24 2018-08-02 三菱電機株式会社 Dissipateur thermique
CN113678247A (zh) * 2019-02-22 2021-11-19 大众汽车股份公司 用于均匀冷却构件的装置和具有至少一个装置的机动车
CN113678247B (zh) * 2019-02-22 2024-09-24 大众汽车股份公司 用于均匀冷却构件的装置和具有至少一个装置的机动车
WO2023077927A1 (fr) * 2021-11-05 2023-05-11 中车永济电机有限公司 Convertisseur de traction

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