WO2017005222A1 - 吸音材料、吸音颗粒、扬声器模组生产工艺及颗粒和模组 - Google Patents

吸音材料、吸音颗粒、扬声器模组生产工艺及颗粒和模组 Download PDF

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WO2017005222A1
WO2017005222A1 PCT/CN2016/089623 CN2016089623W WO2017005222A1 WO 2017005222 A1 WO2017005222 A1 WO 2017005222A1 CN 2016089623 W CN2016089623 W CN 2016089623W WO 2017005222 A1 WO2017005222 A1 WO 2017005222A1
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Prior art keywords
sound absorbing
speaker module
absorbing material
sound
calcination
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English (en)
French (fr)
Inventor
刘金利
曹晓东
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Goertek Inc
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Goertek Inc
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Priority to US15/574,088 priority Critical patent/US10785586B2/en
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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B32/00—Carbon; Compounds thereof
    • C01B32/30—Active carbon
    • C01B32/354—After-treatment
    • C01B32/382—Making shaped products, e.g. fibres, spheres, membranes or foam
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B32/00—Carbon; Compounds thereof
    • C01B32/30—Active carbon
    • C01B32/354—After-treatment
    • C01B32/384—Granulation
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B39/00—Compounds having molecular sieve and base-exchange properties, e.g. crystalline zeolites; Their preparation; After-treatment, e.g. ion-exchange or dealumination
    • C01B39/02—Crystalline aluminosilicate zeolites; Isomorphous compounds thereof; Direct preparation thereof; Preparation thereof starting from a reaction mixture containing a crystalline zeolite of another type, or from preformed reactants; After-treatment thereof
    • C01B39/026—After-treatment
    • G—PHYSICS
    • G10—MUSICAL INSTRUMENTS; ACOUSTICS
    • G10K—SOUND-PRODUCING DEVICES; METHODS OR DEVICES FOR PROTECTING AGAINST, OR FOR DAMPING, NOISE OR OTHER ACOUSTIC WAVES IN GENERAL; ACOUSTICS NOT OTHERWISE PROVIDED FOR
    • G10K11/00—Methods or devices for transmitting, conducting or directing sound in general; Methods or devices for protecting against, or for damping, noise or other acoustic waves in general
    • G10K11/16—Methods or devices for protecting against, or for damping, noise or other acoustic waves in general
    • G10K11/162—Selection of materials
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
    • H04R1/2803—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means for loudspeaker transducers

Definitions

  • the invention relates to the technical field of electroacoustic products, in particular to a passivation treatment process of a porous sound absorbing material and a sound absorbing particle processing technology, and a sound absorbing particle produced by the processing technology and a packaging process of a speaker module provided with the sound absorbing particle and A speaker module produced by the packaging process.
  • the speaker module is an important acoustic component of a portable electronic device for converting between an electrical signal and a sound signal, and is an energy conversion device.
  • the existing speaker module usually includes a casing, and the speaker body houses a speaker unit, and the speaker unit divides the entire module cavity into two chambers of a front sound chamber and a rear sound chamber. As the speaker module continues to be miniaturized, the volume of the sound cavity is continuously compressed.
  • the technician usually has a sound cavity in the rear cavity. Filling the porous material and utilizing the porous material to rapidly adsorb-desorb the back cavity gas, the resonant space can be virtually increased, thereby effectively reducing the medium-low frequency resonant frequency F0 of the module.
  • porous materials such as activated carbon, natural zeolite powder or mixtures prepared according to specific types and ratios.
  • the size and type match to achieve fast adsorption-desorption performance that matches the resonant frequency of the speaker module.
  • the porous material contains a heterogeneous molecule (a solvent such as ethanol or a small hydrocarbon volatile matter of an aromatic hydrocarbon)
  • the heterogeneous molecule does not match the pore size, pore structure, etc. of the porous material, or exists with the porous material.
  • the first technical problem to be solved by the present invention is to provide a treatment process for a porous sound absorbing material, which can fill the oxygen atom defects in the molecular sieve lattice, improve the pore and pore structure of the porous material, and reduce The surface activity of the material makes the porous sound absorbing material reduce the chemical adsorption of small molecules of gas.
  • the second technical problem to be solved by the present invention is to provide a processing technology for sound absorbing particles.
  • the sound absorbing particles produced by the processing technology have poor chemical adsorption to gas small molecules and have high stability, and the speaker module is The improvement effect of FO is good.
  • the third technical problem to be solved by the present invention is to provide a sound absorbing particle which has poor chemical adsorption to gas small molecules, high stability, and good improvement effect on the speaker module FO.
  • the fourth technical problem to be solved by the present invention is to provide a packaging process for a speaker module, wherein the speaker module produced by the packaging process has high reliability and good medium and low frequency performance.
  • the fifth technical problem to be solved by the present invention is to provide a packaging process for a speaker module, wherein the speaker module produced by the packaging process has high reliability and good medium and low frequency performance.
  • the sixth technical problem to be solved by the present invention is to provide a speaker module, which has high reliability and good mid-low frequency performance.
  • the technical solution of the present invention is:
  • a process for treating a sound absorbing material comprising the steps of: calcining a raw powder of a porous sound absorbing material into a heating furnace, and introducing a processing gas during the calcination process, wherein: the calcination temperature is 120 ° C to 800 ° C, The calcination time is from 6 h to 72 h.
  • the porous sound absorbing material is zeolite
  • the calcination temperature is from 120 ° C to 400 ° C
  • the calcination time is from 6 h to 72 h.
  • the calcination temperature was 300 ° C and the calcination time was 24 h.
  • the processing gas is high purity oxygen.
  • the porous sound absorbing material is activated carbon
  • the calcination temperature is 200 ° C to 800 ° C
  • the calcination time is 12 h to 72 h.
  • the oxygen is high purity nitrogen.
  • the technical solution of the present invention is:
  • the sound absorbing particle processing process comprises the following steps: S1, providing a porous sound absorbing material raw powder; S2, using the above sound absorbing material processing technology to passivate the sound absorbing original powder; S3, after the step S2 is processed
  • the raw material of the sound absorbing material is granulated to form a particulate sound absorbing material.
  • the method further includes the steps of: S4, baking the granular sound absorbing material prepared in the step S3, and performing air or inert gas purging, wherein: the processing temperature is 30 ° C to 300 ° C, and the processing time is 0.5h ⁇ 72h.
  • the technical solution of the present invention is:
  • a sound absorbing particle obtained by the above sound absorbing particle processing technology is obtained by the above sound absorbing particle processing technology.
  • the technical solution of the present invention is:
  • a packaging process of a speaker module comprising the steps of: fixing a speaker unit into a casing of the speaker module, such that a cavity of the speaker module is separated into a front sound cavity by the speaker unit; a second cavity of the rear acoustic cavity; and a sound absorbing particle to be filled into the rear acoustic cavity, the sound absorbing particle being the sound absorbing particle; SB, the speaker module semi-finished product assembled in the step S1, and the The sound absorbing particles are subjected to baking treatment, and at the same time, the speaker module semi-finished product and the sound absorbing particles are subjected to air or inert gas purging, wherein the baking temperature is 30 ° C to 300 ° C, and the processing time is 0.5 h to 72 h; SC, The sound absorbing particles after baking are filled into the rear acoustic cavity of the semi-finished product of the speaker module, and the rear acoustic cavity is sealed, that is, the packaging process of the speaker module is completed.
  • the technical solution of the present invention is:
  • a packaging process of a speaker module comprising the steps of: fixing a speaker unit into a casing of the speaker module, such that a cavity of the speaker module is separated into a front sound cavity by the speaker unit; a second cavity of the rear acoustic cavity; and a sound absorbing particle to be filled into the rear acoustic cavity, wherein the sound absorbing particle is the sound absorbing particle; Sb, the speaker module semi-finished product assembled by the step S1 is baked Processing, at the same time, the speaker module semi-finished product is subjected to air or inert gas purging, wherein the baking temperature is 30 ° C ⁇ 300 ° C, the processing time is 0.5 h ⁇ 72 h; Sc, the sound absorbing particles are filled into the baked In the rear acoustic cavity of the semi-finished product of the speaker module, the rear acoustic cavity is sealed, that is, the packaging process of the speaker module is completed.
  • the technical solution of the present invention is:
  • a speaker module is packaged by the above speaker module packaging process.
  • the processing method of the sound absorbing material of the present invention is that the raw powder of the porous sound absorbing material is put into a heating furnace for calcination, and oxygen is introduced during the calcination process, wherein: the calcination temperature is 120 ° C to 800 ° C, and the calcination time is 6 h. ⁇ 72h.
  • the calcination temperature is 120 ° C to 800 ° C
  • the calcination time is 6 h. ⁇ 72h.
  • the average F0 of No. 1 particles decreased by 120 Hz, and the average F0 of No. 2 particles decreased by 123 Hz.
  • the sound absorbing particle processing process of the present invention comprises the following steps: S1, providing a porous sound absorbing material raw powder; S2, using the above sound absorbing material processing technology to passivate the sound absorbing original powder; S3, treating the treated sound absorbing material original
  • the powder is granulated to form a particulate sound absorbing material.
  • the raw material of the sound absorbing material is treated by the passivation treatment process, which effectively reduces the chemical adsorption of the produced sound absorbing particles to the small organic molecules of the gas, thereby ensuring the smooth flow of the pores, thereby improving the rapid adsorption-desorption of the gas.
  • the improvement effect on the speaker module F0 is improved, and the reliability of the rapid adsorption-desorption of the gas is obtained. Significantly improved.
  • the packaging process of the speaker module of the present invention comprises the following steps: baking the semi-finished product of the speaker module and the sound absorbing particles, and purging the semi-finished product of the speaker module and the sound absorbing particles by air or inert gas, wherein the baking temperature is 30 °C ⁇ 300°C, the treatment time is 0.5h ⁇ 72h; SC, the sound-absorbing particles after baking are filled into the rear sound cavity of the semi-finished product of the speaker module, and the sound cavity is sealed.
  • the sound-absorbing particles and the residual molecules remaining in the speaker module are quickly volatilized, and the heterogeneous molecules can be carried out of the module cavity by air or inert gas purging, thereby effectively reducing the residual sound-absorbing particles and the cavity in the module cavity.
  • the heterogeneous molecular concentration reduces the degree of failure of the sound absorbing particles in the speaker module and improves the reliability of the speaker module.
  • Test F0 of sample No. 1 the average F0 increases about 40 Hz after the test;
  • Test F0 of sample No. 2 and the average F0 increased by about 10 Hz after the test.
  • the sound absorbing material, the sound absorbing particles, the speaker module production process, the particles and the module solve the technical problems of the sound absorbing particles in the prior art, and the surface energy of the sound absorbing material is reduced.
  • the chemical adsorption of gas organic small molecules is reduced, thereby better improving the F0 of the speaker module, and also significantly improving the reliability of the speaker module.
  • FIG. 1 is a schematic structural view of a speaker module of the present invention
  • module shell 20, speaker unit, 30, sound absorbing particles, 40, spacers, 50, seals.
  • a process for treating a sound absorbing material comprising the steps of: calcining a raw powder of a porous sound absorbing material into a heating furnace, and introducing a processing gas during the calcination process, wherein: the calcination temperature is 120 ° C to 800 ° C, The calcination time is from 6 h to 72 h.
  • Embodiment 1 is a diagrammatic representation of Embodiment 1:
  • the porous sound absorbing material is a natural zeolite, and the original powder of the natural zeolite is placed in a muffle furnace for calcination, and high purity oxygen is introduced during the calcination process, wherein: the calcination temperature is 120 ° C to 350 ° C, and the calcination time is 6 h. 72h.
  • Embodiment 2 is a diagrammatic representation of Embodiment 1:
  • This embodiment is basically the same as the first embodiment, and the difference is that:
  • the calcination temperature was 120 ° C and the calcination time was 72 h.
  • Embodiment 3 is a diagrammatic representation of Embodiment 3
  • This embodiment is basically the same as the first embodiment, and the difference is that:
  • the calcination temperature was 300 ° C and the calcination time was 24 h.
  • Embodiment 4 is a diagrammatic representation of Embodiment 4:
  • This embodiment is basically the same as the first embodiment, and the difference is that:
  • the calcination temperature was 350 ° C and the calcination time was 6 h.
  • Embodiment 5 is a diagrammatic representation of Embodiment 5:
  • the porous sound absorbing material is artificial zeolite, and the original powder of artificial zeolite is put into a muffle furnace for calcination, and high purity oxygen is introduced during the calcination process, wherein: the calcination temperature is 150 ° C to 400 ° C, and the calcination time is 6 h. 72h.
  • This embodiment is basically the same as the fifth embodiment, and the difference is that:
  • the calcination temperature was 150 ° C and the calcination time was 72 h.
  • This embodiment is basically the same as the fifth embodiment, and the difference is that:
  • the calcination temperature was 300 ° C and the calcination time was 24 h.
  • This embodiment is basically the same as the fifth embodiment, and the difference is that:
  • the calcination temperature was 400 ° C and the calcination time was 6 h.
  • the porous sound absorbing material is activated carbon, and the activated carbon powder is placed in a muffle furnace for calcination, and high purity nitrogen gas is introduced during the calcination process, wherein the calcination temperature is 200 ° C to 800 ° C, and the calcination time is 12 h to 72 h.
  • This embodiment is basically the same as the embodiment 9, and the difference is that:
  • the calcination temperature was 200 ° C and the calcination time was 72 h.
  • This embodiment is basically the same as the embodiment 9, and the difference is that:
  • the calcination temperature was 500 ° C and the calcination time was 36 h.
  • This embodiment is basically the same as the embodiment 9, and the difference is that:
  • the calcination temperature was 800 ° C and the calcination time was 12 h.
  • the oxygen atom defects in the lattice of the molecular sieve are filled, the pore and pore structure of the porous material are improved, the surface active energy of the material is reduced, and the small organic molecules are reduced.
  • the chemical adsorption enhances its improved effect on the speaker module F0.
  • a sound absorbing particle processing process comprising the following steps:
  • the sound absorbing original powder is passivated according to the treatment process of the sound absorbing material described in the first embodiment to the twelfth embodiment;
  • Embodiment 14 is a diagrammatic representation of Embodiment 14:
  • This embodiment is basically the same as the thirteenth embodiment, and the difference is that:
  • the method further includes the step S4, baking the granular sound absorbing material prepared in the step S3, and simultaneously Air or inert gas purge, wherein: the treatment temperature is 30 ° C ⁇ 300 ° C, the treatment time is 0.5 h ⁇ 72 h.
  • This embodiment is basically the same as the fourteenth embodiment, and the difference is that:
  • the treatment temperature was 30 ° C and the treatment time was 72 h.
  • This embodiment is basically the same as the fourteenth embodiment, and the difference is that:
  • the treatment temperature was 100 ° C and the treatment time was 24 h.
  • This embodiment is basically the same as the fourteenth embodiment, and the difference is that:
  • the treatment temperature was 300 ° C and the treatment time was 0.5 h.
  • a sound absorbing particle the raw material of which is a natural zeolite raw powder, an artificial zeolite raw powder or an activated carbon raw powder, which is processed into a spherical or spheroidal particle by the sound absorbing particle processing method described in the thirteenth to seventeenth embodiments, the spherical shape Or spheroidal particles are sound absorbing particles.
  • the sound absorbing particles have poor chemical adsorption to the gas organic small molecules, the channel is smooth, the gas adsorption and desorption is strong, and the reliability is high, the improvement effect on the speaker module F0 can be improved, and the speaker can be greatly enhanced. Module reliability.
  • a packaging module packaging process includes the following steps:
  • the SA is fixed in the outer casing of the speaker module, so that the inner cavity of the speaker module is divided into two chambers of the front sound chamber and the rear sound chamber by the speaker unit; and the sound absorbing particles to be filled into the sound chamber are provided.
  • the sound absorbing particles are sound absorbing particles prepared by the sound absorbing particle processing method described in Embodiment 13;
  • the speaker module semi-finished product assembled by the step SA and the sound absorbing particles are baked, and the speaker module semi-finished product and the sound absorbing particles are purged by air or inert gas, wherein the baking temperature is 30 ° C ⁇ 300 ° C, the processing time It is 0.5h ⁇ 72h;
  • the sound-absorbing particles after baking are filled into the rear sound cavity of the semi-finished product of the speaker module, and the sound cavity is sealed, that is, the packaging process of the speaker module is completed.
  • Embodiment 20 is a diagrammatic representation of Embodiment 20.
  • This embodiment is basically the same as the nineteenth embodiment, and the difference is that:
  • the treatment temperature was 30 ° C and the treatment time was 72 h.
  • This embodiment is basically the same as the nineteenth embodiment, and the difference is that:
  • the treatment temperature was 100 ° C and the treatment time was 24 h.
  • This embodiment is basically the same as the nineteenth embodiment, and the difference is that:
  • the treatment temperature was 300 ° C and the treatment time was 0.5 h.
  • a packaging module packaging process includes the following steps:
  • the sound absorbing particles are sound absorbing particles prepared by the sound absorbing particle processing processes described in the fourteenth to seventeenth embodiments;
  • the speaker module semi-finished product assembled into the step Sa is baked, and the speaker module semi-finished product is subjected to air or inert gas purging, wherein the baking temperature is 30 ° C ⁇ 300 ° C, the processing time is 0.5 h ⁇ 72 h;
  • the sound absorbing particles are filled into the rear sound cavity of the baked semi-finished speaker module, and the sound cavity is sealed, that is, the packaging process of the speaker module is completed.
  • This embodiment is basically the same as the twenty-third embodiment, and the difference is that:
  • the treatment temperature was 30 ° C and the treatment time was 72 h.
  • This embodiment is basically the same as the twenty-third embodiment, and the difference is that:
  • the treatment temperature was 100 ° C and the treatment time was 24 h.
  • This embodiment is basically the same as the twenty-third embodiment, and the difference is that:
  • the treatment temperature was 300 ° C and the treatment time was 0.5 h.
  • a speaker module is packaged by the speaker module packaging process according to any one of Embodiments 19 to 26, and includes a module housing 10 and a module housing.
  • the speaker unit 20 is accommodated therein, and the speaker unit 20 divides the entire module cavity into two chambers of a front sound chamber and a rear sound chamber, and a mesh spacer 40 is disposed at a position near the speaker unit 20 in the rear sound chamber. 40 divides the rear sound chamber into two spaces, a filled area and a non-filled area, and the speaker unit is located in the unfilled area.
  • the module housing 10 is provided with a filling hole corresponding to the filling area, and the sound absorbing particles 30 are filled into the filling area through the filling hole when the module is assembled. After the filling is completed, a sealing member 50 is covered on the outside of the filling hole. , the sound cavity of the module is sealed.
  • This speaker module has high reliability, good mid-low frequency performance and high overall acoustic performance.

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Abstract

一种吸音材料、吸音颗粒、扬声器模组生产工艺及颗粒和模组，涉及电声产品技术领域，处理工艺，包括如下步骤：将多孔性吸音材料的原粉放入加热炉内进行煅烧，且在煅烧的过程中通入处理气体，其中：煅烧温度为120℃～800℃，煅烧时间为6h～72h。

Description

吸音材料、吸音颗粒、扬声器模组生产工艺及颗粒和模组 技术领域
本发明涉及电声产品技术领域，特别涉及一种多孔性吸音材料的钝化处理工艺及吸音颗粒加工工艺和由该加工工艺生产的吸音颗粒及设有该吸音颗粒的扬声器模组的封装工艺和由该封装工艺生产的扬声器模组。
背景技术
扬声器模组是便携式电子设备的重要声学部件，用于完成电信号与声音信号之间的转换，是一种能量转换器件。现有的扬声器模组通常包括外壳，外壳内收容有扬声器单体，扬声器单体将整个模组内腔分隔成前声腔和后声腔两个腔体。随着扬声器模组的不断微型化，其后声腔体积不断被压缩，为了保证扬声器模组的F0(共振频率)足够低，以保证扬声器模组的中低频音质，技术人员通常会在后声腔内填充多孔性材料，利用多孔性材料对后声腔气体快速吸附-脱附性质，可使得谐振空间虚拟增大，从而更有效的降低模组的中低频共振频率F0。
多孔性材料的快速吸附-脱附性质是需要多孔类材料(如活性炭、天然沸石粉或按照特定种类和比例而制的混合物等)的微孔大小、孔径分布以及二级以上孔道结构与气体分子大小和种类相匹配，才能具有与扬声器模组共振频率相匹配的快速吸附-脱附性能。但如果多孔性材料的所处环境中含有异类分子(乙醇等溶剂、芳烃类小分子挥发物等)时，异类分子与多孔性材料微孔大小、孔道结构等不匹配，或与多孔性材料存在化学吸附，无法快速脱附，对孔道结构造成堵塞，导致其对气体快速吸附-脱附作用衰减或失效，从而造成对扬声器模组降低F0效果减弱或失效，超出多孔性材料对产品性能改善的设定预期。但扬声器模组在生产组装过程中，不可避免的会产生异类分子：如胶水固化过程有机溶剂的挥发，胶水缩聚固化过程中产生的小分子有机物，胶水所含有的各种助剂随固化程度增加或老化过程中不断挥发；模组注塑料老化过程中裂变产生的小分子有机物等等。由于以上情况的存在，导致了填充有多孔性吸音材料的扬声器模组中吸音材料对声学性能的改善效果不稳定，产品可靠性欠佳，阻碍 多孔性吸音材料在扬声器模组领域的应用。
发明内容
针对上述缺陷，本发明所要解决的第一个技术问题是提供一种多孔性吸音材料的处理工艺，此处理工艺能够填补分子筛晶格中氧原子缺陷，完善多孔性材料的孔道及孔道结构，降低材料表面活性，使得多孔性吸音材料减少对气体小分子的化学吸附。
基于同一个发明构思，本发明所要解决的第二个技术问题是提供一种吸音颗粒的加工工艺，此加工工艺生产的吸音颗粒对气体小分子的化学吸附性差，稳定性高，对扬声器模组FO的改善效果好。
基于同一个发明构思，本发明所要解决的第三个技术问题是提供一种吸音颗粒，此吸音颗粒对气体小分子的化学吸附性差，稳定性高，对扬声器模组FO的改善效果好。
基于同一个发明构思，本发明所要解决的第四个技术问题是提供一种扬声器模组的封装工艺，其封装工艺生产的扬声器模组可靠性高，中低频性能好。
基于同一个发明构思，本发明所要解决的第五个技术问题是提供一种扬声器模组的封装工艺，其封装工艺生产的扬声器模组可靠性高，中低频性能好。
基于同一个发明构思，本发明所要解决的第六个技术问题是提供一种扬声器模组，此扬声器模组可靠性高，中低频性能好。
为解决上述第一个技术问题，本发明的技术方案是：
一种吸音材料的处理工艺，包括如下步骤：将多孔性吸音材料的原粉放入加热炉内进行煅烧，且在煅烧的过程中通入处理气体，其中：煅烧温度为120℃～800℃，煅烧时间为6h～72h。
作为一种实施方式，所述多孔性吸音材料为沸石，所述煅烧温度为120℃～400℃，所述煅烧时间为6h～72h。
其中，所述煅烧温度为300℃，所述煅烧时间为24h。
其中，所述处理气体为高纯氧气。
作为另一种实施方式，所述多孔性吸音材料为活性炭，所述煅烧温度为200℃～800℃，所述煅烧时间为12h～72h。
其中，所述氧气为高纯氮气。
为解决上述第二个技术问题，本发明的技术方案是：
一种吸音颗粒加工工艺，包括如下步骤：S1、提供多孔性吸音材料原粉；S2、采用上述吸音材料的处理工艺对所述吸音原粉进行钝化处理；S3、对所述步骤S2处理后的所述吸音材料原粉进行造粒，形成颗粒状的吸音材料。
其中，还包括步骤：S4、对所述步骤S3制得的所述颗粒状吸音材料进行烘烤处理，同时进行空气或惰性气体吹扫，其中：处理温度为30℃～300℃，处理时间为0.5h～72h。
为解决上述第三个技术问题，本发明的技术方案是：
一种吸音颗粒，由上述吸音颗粒加工工艺制得。
为解决上述第四个技术问题，本发明的技术方案是：
一种扬声器模组的封装工艺，包括如下步骤：SA、将扬声器单体固定到所述扬声器模组的外壳内，使得所述扬声器模组的内腔被所述扬声器单体分隔为前声腔和后声腔两个腔体；并提供待向所述后声腔内填充的吸音颗粒，所述吸音颗粒为上述的吸音颗粒；SB、将所述步骤S1组装成的所述扬声器模组半成品和所述吸音颗粒进行烘烤处理，同时对所述扬声器模组半成品及所述吸音颗粒进行空气或惰性气体吹扫，其中烘烤温度为30℃～300℃，处理时间为0.5h～72h；SC、将烘烤后的所述吸音颗粒填充到所述扬声器模组半成品的所述后声腔中，密封所述后声腔，即完成了所述扬声器模组的封装工序。
为解决上述第五个技术问题，本发明的技术方案是：
一种扬声器模组的封装工艺，包括如下步骤：Sa、将扬声器单体固定到所述扬声器模组的外壳内，使得所述扬声器模组的内腔被所述扬声器单体分隔为前声腔和后声腔两个腔体；并提供待向所述后声腔内填充的吸音颗粒，所述吸音颗粒为上述的吸音颗粒；Sb、将所述步骤S1组装成的所述扬声器模组半成品进行烘烤处理，同时对所述扬声器模组半成品进行空气或惰性气体吹扫，其中烘烤温度为30℃～300℃，处理时间为0.5h～72h；Sc、将所述吸音颗粒填充到烘烤后的所述扬声器模组半成品的所述后声腔中，密封所述后声腔，即完成了所述扬声器模组的封装工序。
为了解决上述第六个技术问题，本发明的技术方案是：
一种扬声器模组，由上述扬声器模组封装工艺封装而成。
采用了上述技术方案后，本发明的有益效果是：
由于本发明吸音材料的处理工艺是将多孔性吸音材料的原粉放入加热炉内进行煅烧，且在煅烧的过程中通入氧气，其中：煅烧温度为120℃～800℃，煅烧时间为6h～72h。经过以上钝化处理，可以填补分子筛晶格中氧原子缺陷，完善多孔材料的孔道及孔道结构，降低材料表面活性能，减少对气体有机小分子的化学吸附。为验证钝化处理对颗粒降低扬声器模组F0效果的影响，我们进行了如下的对比试验：
选用同一批吸音材料原粉，1号原粉不做处理，2号原粉经过钝化处理，利用相同的造粒工艺制作成扬声器模组产品可用的1号颗粒和2号颗粒；
实验一、将1号颗粒和2号颗粒分别填充到如图1所示的扬声器模组产品中，每种填充10个单位，通过声学测试获得两种颗粒对产品降低F0数据如下：
1号颗粒平均F0降低120Hz，2号颗粒平均F0降低123Hz。
实验二、对两种产品进行可靠性试验-高温寿命(高温寿命是指模组在较高温度50℃下连续工作，测试产品可靠性的实验。吸音颗粒之所以会失效是因为模组在高温环境下会挥发更多异类分子，并且多孔性材料在高温环境下更容易吸附异类分子，再者模组连续工作，与吸音颗粒接触的气体不断振动，加速异类分子的吸附)，具体试验要求与实验一中相同，1号颗粒与2号颗粒F0升高情况为：1号颗粒升高40Hz，2号颗粒升高25Hz。
通过上述两个试验结果可以得出，钝化处理后的吸音材料对扬声器模组F0的改善有所提高，且可以更好的提高吸音颗粒的可靠性。
由于本发明一种吸音颗粒加工工艺包括如下步骤：S1、提供多孔性吸音材料原粉；S2、采用上述吸音材料的处理工艺对吸音原粉进行钝化处理；S3、对处理后的吸音材料原粉进行造粒，形成颗粒状的吸音材料。吸音材料原粉经过钝化处理工艺处理过，有效的降低了制得的吸音颗粒对气体有机小分子的化学吸附，保证了其孔道的畅通，从而提高了其对气体快速吸附-脱附作用，提高了对扬声器模组F0的改善效果，且其对气体快速吸附-脱附作用的可靠性得到了 显著提升。
由于本发明扬声器模组的封装工艺，包括如下步骤：将扬声器模组半成品和吸音颗粒进行烘烤处理，同时对扬声器模组半成品及吸音颗粒进行空气或惰性气体吹扫，其中烘烤温度为30℃～300℃，处理时间为0.5h～72h；SC、将烘烤后的吸音颗粒填充到扬声器模组半成品的后声腔中，密封后声腔。通过烘烤要使得吸音颗粒及扬声器模组中残存的异类分子快速挥发，通过空气或惰性气体吹扫可将异类分子带出模组腔体外，从而有效的减少吸音颗粒及模组腔体内残留的异类分子浓度，降低吸音颗粒在扬声器模组中的失效程度，提高了扬声器模组的可靠性。为了验证烘烤及吹扫处理对扬声器模组可靠性的影响，我们进行了如下的对比试验：
选用同一批次的如图1所示的扬声器模组各10个单位的样品分别编成1号样品和2号样品，其中1号样品未经过烘烤和吹扫处理；2号样品经过了烘烤和吹扫处理，对1号样品和2号样品进行可靠性试验-高温寿命，试验条件同为：50℃通电连续工作24小时。
1)测试1号样品的F0，试验后平均F0升高40Hz左右；
2)测试2号样品的F0，试验后平均F0升高10Hz左右。
通过上述试验结果可以得出，产品经过烘烤和吹扫处理后可以明显提高产品的可靠性。
综上所述，本发明吸音材料、吸音颗粒、扬声器模组生产工艺及颗粒和模组解决了现有技术中吸音颗粒易失效等技术问题，本发明降低了吸音材料的表面活性能，使其减少对气体有机小分子的化学吸附，从而更好的改善了扬声器模组的F0，同时还明显的提高了扬声器模组的可靠性。
附图说明
图1是本发明扬声器模组的结构示意图；
图中：10、模组外壳，20、扬声器单体，30、吸音颗粒，40、隔离件，50、密封件。
具体实施方式
下面结合附图和实施例，进一步阐述本发明。
一种吸音材料的处理工艺，包括如下步骤：将多孔性吸音材料的原粉放入加热炉内进行煅烧，且在煅烧的过程中通入处理气体，其中：煅烧温度为120℃～800℃，煅烧时间为6h～72h。
实施例一：
多孔性吸音材料为天然沸石，将天然沸石的原粉放入马弗炉内进行煅烧，在煅烧的过程中通入高纯氧气，其中：煅烧温度为120℃～350℃，煅烧时间为6h～72h。
实施例二：
本实施方式与实施例一基本相同，其不同之处在于：
煅烧温度为120℃，煅烧时间为72h。
实施例三：
本实施方式与实施例一基本相同，其不同之处在于：
煅烧温度为300℃，煅烧时间为24h。
实施例四：
本实施方式与实施例一基本相同，其不同之处在于：
煅烧温度为350℃，煅烧时间为6h。
实施例五：
多孔性吸音材料为人工沸石，将人工沸石的原粉放入马弗炉内进行煅烧，在煅烧的过程中通入高纯氧气，其中：煅烧温度为150℃～400℃，煅烧时间为6h～72h。
实施例六：
本实施方式与实施例五基本相同，其不同之处在于：
煅烧温度为150℃，煅烧时间为72h。
实施例七：
本实施方式与实施例五基本相同，其不同之处在于：
煅烧温度为300℃，煅烧时间为24h。
实施例八：
本实施方式与实施例五基本相同，其不同之处在于：
煅烧温度为400℃，煅烧时间为6h。
实施例九：
多孔性吸音材料为活性炭，将活性炭原粉放入马弗炉内进行煅烧，在煅烧的过程中通入高纯氮气，其中：煅烧温度为200℃～800℃，煅烧时间为12h～72h。
实施例十：
本实施方式与实施例九基本相同，其不同之处在于：
煅烧温度为200℃，煅烧时间为72h。
实施例十一：
本实施方式与实施例九基本相同，其不同之处在于：
煅烧温度为500℃，煅烧时间为36h。
实施例十二：
本实施方式与实施例九基本相同，其不同之处在于：
煅烧温度为800℃，煅烧时间为12h。
经过上述实施方式对多孔性吸音材料的原粉进行钝化处理后，填补了分子筛晶格中氧原子缺陷，完善多孔材料的孔道及孔道结构，降低了材料表面活性能，减少对气体有机小分子的化学吸附，从而提升了其对扬声器模组F0改善的效果。
实施例十三：
一种吸音颗粒加工工艺，包括如下步骤：
S1、提供多孔性吸音材料原粉；
S2、根据吸音材料原粉种类的不同，对应采用实施例一至实施例十二中所述的吸音材料的处理工艺对吸音原粉进行钝化处理；
S3、对步骤S2处理后的吸音材料原粉进行造粒，形成颗粒状吸音材料，即一种吸音颗粒。
实施例十四：
本实施方式与实施例十三基本相同，其不同之处在于：
还包括步骤S4、对步骤S3制得的颗粒状吸音材料进行烘烤处理，同时进 行空气或惰性气体吹扫，其中：处理温度为30℃～300℃，处理时间为0.5h～72h。
实施例十五：
本实施方式与实施例十四基本相同，其不同之处在于：
处理温度为30℃，处理时间为72h。
实施例十六：
本实施方式与实施例十四基本相同，其不同之处在于：
处理温度为100℃，处理时间为24h。
实施例十七：
本实施方式与实施例十四基本相同，其不同之处在于：
处理温度为300℃，处理时间为0.5h。
实施例十八：
一种吸音颗粒，其原料为天然沸石原粉、人工沸石原粉或活性炭原粉，由实施例十三至实施例十七所述的吸音颗粒加工工艺加工成球形或类球形的颗粒，此球形或类球形的颗粒即为吸音颗粒。
此吸音颗粒对气体有机小分子的化学吸附性差，其孔道的通畅，对气体快速吸附-脱附作用强，且可靠性高，可提高了对扬声器模组F0的改善效果，同时可大大增强扬声器模组的可靠性。
实施例十九：
一种扬声器模组的封装工艺，包括如下步骤：
SA、将扬声器单体固定到扬声器模组的外壳内，使得扬声器模组的内腔被扬声器单体分隔为前声腔和后声腔两个腔体；并提供待向后声腔内填充的吸音颗粒，吸音颗粒为由实施例十三所述的吸音颗粒加工工艺制得的吸音颗粒；
SB、将步骤SA组装成的扬声器模组半成品和吸音颗粒进行烘烤处理，同时对扬声器模组半成品及吸音颗粒进行空气或惰性气体吹扫，其中烘烤温度为30℃～300℃，处理时间为0.5h～72h；
SC、将烘烤后的吸音颗粒填充到扬声器模组半成品的后声腔中，密封后声腔，即完成了扬声器模组的封装工序。
实施例二十：
本实施方式与实施例十九基本相同，其不同之处在于：
处理温度为30℃，处理时间为72h。
实施例二十一：
本实施方式与实施例十九基本相同，其不同之处在于：
处理温度为100℃，处理时间为24h。
实施例二十二：
本实施方式与实施例十九基本相同，其不同之处在于：
处理温度为300℃，处理时间为0.5h。
实施例二十三：
一种扬声器模组的封装工艺，包括如下步骤：
Sa、将扬声器单体固定到扬声器模组的外壳内，使得扬声器模组的内腔被扬声器单体分隔为前声腔和后声腔两个腔体；并提供待向后声腔内填充的吸音颗粒，吸音颗粒为由实施例十四至实施例十七所述的吸音颗粒加工工艺制得的吸音颗粒；
Sb、将步骤Sa组装成的扬声器模组半成品进行烘烤处理，同时对扬声器模组半成品进行空气或惰性气体吹扫，其中烘烤温度为30℃～300℃，处理时间为0.5h～72h；
Sc、将吸音颗粒填充到烘烤后的扬声器模组半成品的后声腔中，密封后声腔，即完成了扬声器模组的封装工序。
实施例二十四：
本实施方式与实施例二十三基本相同，其不同之处在于：
处理温度为30℃，处理时间为72h。
实施例二十五：
本实施方式与实施例二十三基本相同，其不同之处在于：
处理温度为100℃，处理时间为24h。
实施例二十六：
本实施方式与实施例二十三基本相同，其不同之处在于：
处理温度为300℃，处理时间为0.5h。
实施例二十七：
如图1所示，一种扬声器模组，由实施例十九至实施例二十六中的任一实施例所述的扬声器模组封装工艺封装而成，包括模组外壳10，模组外壳内收容有扬声器单体20，扬声器单体20将整个模组内腔分隔为前声腔和后声腔两个腔体，后声腔内靠近扬声器单体20的位置设有一网状隔离件40，隔离件40将后声腔分为填充区和非填充区两个空间，扬声器单体位于非填充区内。模组外壳10对应填充区的位置上设有一灌装孔，在进行模组组装时通过此灌装孔向填充区内填充吸音颗粒30，填充完毕后在灌装孔的外侧覆盖一密封件50，将模组后声腔密封。
此扬声器模组可靠性高，中低频性能好，整体声学性能高。
本发明不局限于上述具体的实施方式，本领域的普通技术人员从上述构思出发，不经过创造性的劳动，所做出的种种变换，均落在本发明的保护范围之内。

Claims (14)

  1. 吸音材料的处理工艺，其特征在于，包括如下步骤：
    将多孔性吸音材料的原粉放入加热炉内进行煅烧，且在煅烧的过程中通入处理气体，其中：煅烧温度为120℃～800℃，煅烧时间为6h～72h。
  2. 根据权利要求1所述的吸音材料的处理工艺，其特征在于，所述多孔性吸音材料为沸石，所述煅烧温度为120℃～400℃，所述煅烧时间为6h～72h。
  3. 根据权利要求2所述的吸音材料的处理工艺，其特征在于，所述煅烧温度为300℃，所述煅烧时间为24h。
  4. 根据权利要求2所述的吸音材料的处理工艺，其特征在于，所述处理气体为高纯氧气。
  5. 根据权利要求1所述的吸音材料的处理工艺，其特征在于，所述多孔性吸音材料为活性炭，所述煅烧温度为200℃～800℃，所述煅烧时间为12h～72h。
  6. 根据权利要求5所述的吸音材料的处理工艺，其特征在于，所述处理气体为高纯氮气。
  7. 吸音颗粒加工工艺，其特征在于，包括如下步骤：
    S1、提供多孔性吸音材料的原粉；
    S2、采用权利要求1所述的吸音材料的处理工艺对所述多孔性吸音材料的原粉进行钝化处理；
    S3、对所述步骤S2处理后的所述多孔性吸音材料的原粉进行造粒，形成颗粒状的吸音材料。
  8. 根据权利要求7所述的吸音颗粒加工工艺，其特征在于，还包括步骤：
    S4、对所述步骤S3制得的所述颗粒状的吸音材料进行烘烤处理，同时进行空气或惰性气体吹扫，其中：处理温度为30℃～300℃，处理时间为0.5h～72h。
  9. 吸音颗粒，其特征在于，所述吸音颗粒由权利要求7所述的加工工艺制得。
  10. 吸音颗粒，其特征在于，所述吸音颗粒由权利要求8所述的加工工艺制得。
  11. 扬声器模组的封装工艺，其特征在于，包括如下步骤：
    SA、将扬声器单体固定到所述扬声器模组的外壳内，使得所述扬声器模组的内腔被所述扬声器单体分隔为前声腔和后声腔两个腔体，从而形成扬声器模组半成品；并提供待向所述后声腔内填充的吸音颗粒，所述吸音颗粒为权利要求7所述的吸音颗粒；
    SB、将所述步骤SA组装成的所述扬声器模组半成品和所述吸音颗粒进行烘烤处理，同时对所述扬声器模组半成品及所述吸音颗粒进行空气或惰性气体吹扫，其中烘烤温度为30℃～300℃，处理时间为0.5h～72h；
    SC、将烘烤后的所述吸音颗粒填充到所述扬声器模组半成品的所述后声腔中，密封所述后声腔，即完成了所述扬声器模组的封装工序。
  12. 扬声器模组的封装工艺，其特征在于，包括如下步骤：
    Sa、将扬声器单体固定到所述扬声器模组的外壳内，使得所述扬声器模组的内腔被所述扬声器单体分隔为前声腔和后声腔两个腔体，从而形成扬声器模组半成品；并提供待向所述后声腔内填充的吸音颗粒，所述吸音颗粒为权利要求8所述的吸音颗粒；
    Sb、将所述步骤Sa组装成的所述扬声器模组半成品进行烘烤处理，同时对所述扬声器模组半成品进行空气或惰性气体吹扫，其中烘烤温度为30℃～300℃，处理时间为0.5h～72h；
    Sc、将所述吸音颗粒填充到烘烤后的所述扬声器模组半成品的所述后声腔中，密封所述后声腔，即完成了所述扬声器模组的封装工序。
  13. 扬声器模组，其特征在于，由权利要求11所述的扬声器模组封装工艺封装而成。
  14. 扬声器模组，其特征在于，由权利要求12所述的扬声器模组封装工艺封装而成。
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