WO2017004222A1 - Matériaux à changement de phase pour le refroidissement de composants électroniques enfermés, y compris pour la collecte d'énergie solaire, et systèmes et procédés associés - Google Patents

Matériaux à changement de phase pour le refroidissement de composants électroniques enfermés, y compris pour la collecte d'énergie solaire, et systèmes et procédés associés Download PDF

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Publication number
WO2017004222A1
WO2017004222A1 PCT/US2016/040121 US2016040121W WO2017004222A1 WO 2017004222 A1 WO2017004222 A1 WO 2017004222A1 US 2016040121 W US2016040121 W US 2016040121W WO 2017004222 A1 WO2017004222 A1 WO 2017004222A1
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WO
WIPO (PCT)
Prior art keywords
phase change
change material
air
temperature
solar
Prior art date
Application number
PCT/US2016/040121
Other languages
English (en)
Inventor
Dylan Miller Fairbanks
Peter Emery Von Behrens
Hayden Graham BURVILL
William Durbin
Chiaki Treynor
Original Assignee
Glasspoint Solar, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Glasspoint Solar, Inc. filed Critical Glasspoint Solar, Inc.
Priority to CN201680045926.XA priority Critical patent/CN107912054B/zh
Priority to AU2016287485A priority patent/AU2016287485A1/en
Priority to EP16818700.3A priority patent/EP3295557A4/fr
Publication of WO2017004222A1 publication Critical patent/WO2017004222A1/fr

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Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02S—GENERATION OF ELECTRIC POWER BY CONVERSION OF INFRARED RADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, e.g. USING PHOTOVOLTAIC [PV] MODULES
    • H02S40/00—Components or accessories in combination with PV modules, not provided for in groups H02S10/00 - H02S30/00
    • H02S40/40—Thermal components
    • H02S40/42—Cooling means
    • H02S40/425—Cooling means using a gaseous or a liquid coolant, e.g. air flow ventilation, water circulation
    • A—HUMAN NECESSITIES
    • A01—AGRICULTURE; FORESTRY; ANIMAL HUSBANDRY; HUNTING; TRAPPING; FISHING
    • A01G—HORTICULTURE; CULTIVATION OF VEGETABLES, FLOWERS, RICE, FRUIT, VINES, HOPS OR SEAWEED; FORESTRY; WATERING
    • A01G9/00—Cultivation in receptacles, forcing-frames or greenhouses; Edging for beds, lawn or the like
    • A01G9/24—Devices or systems for heating, ventilating, regulating temperature, illuminating, or watering, in greenhouses, forcing-frames, or the like
    • A01G9/243—Collecting solar energy
    • E—FIXED CONSTRUCTIONS
    • E21—EARTH OR ROCK DRILLING; MINING
    • E21B—EARTH OR ROCK DRILLING; OBTAINING OIL, GAS, WATER, SOLUBLE OR MELTABLE MATERIALS OR A SLURRY OF MINERALS FROM WELLS
    • E21B43/00—Methods or apparatus for obtaining oil, gas, water, soluble or meltable materials or a slurry of minerals from wells
    • E21B43/16—Enhanced recovery methods for obtaining hydrocarbons
    • E21B43/24—Enhanced recovery methods for obtaining hydrocarbons using heat, e.g. steam injection
    • E21B43/2406—Steam assisted gravity drainage [SAGD]
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F5/00—Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater
    • F24F5/0007—Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater cooling apparatus specially adapted for use in air-conditioning
    • F24F5/0017—Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater cooling apparatus specially adapted for use in air-conditioning using cold storage bodies, e.g. ice
    • F24F5/0021—Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater cooling apparatus specially adapted for use in air-conditioning using cold storage bodies, e.g. ice using phase change material [PCM] for storage
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24S—SOLAR HEAT COLLECTORS; SOLAR HEAT SYSTEMS
    • F24S30/00—Arrangements for moving or orienting solar heat collector modules
    • F24S30/40—Arrangements for moving or orienting solar heat collector modules for rotary movement
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24S—SOLAR HEAT COLLECTORS; SOLAR HEAT SYSTEMS
    • F24S40/00—Safety or protection arrangements of solar heat collectors; Preventing malfunction of solar heat collectors
    • F24S40/50—Preventing overheating or overpressure
    • F24S40/55—Arrangements for cooling, e.g. by using external heat dissipating means or internal cooling circuits
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02S—GENERATION OF ELECTRIC POWER BY CONVERSION OF INFRARED RADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, e.g. USING PHOTOVOLTAIC [PV] MODULES
    • H02S40/00—Components or accessories in combination with PV modules, not provided for in groups H02S10/00 - H02S30/00
    • H02S40/40—Thermal components
    • H02S40/44—Means to utilise heat energy, e.g. hybrid systems producing warm water and electricity at the same time
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02S—GENERATION OF ELECTRIC POWER BY CONVERSION OF INFRARED RADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, e.g. USING PHOTOVOLTAIC [PV] MODULES
    • H02S50/00—Monitoring or testing of PV systems, e.g. load balancing or fault identification
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24S—SOLAR HEAT COLLECTORS; SOLAR HEAT SYSTEMS
    • F24S30/00—Arrangements for moving or orienting solar heat collector modules
    • F24S2030/10—Special components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/40—Solar thermal energy, e.g. solar towers
    • Y02E10/47—Mountings or tracking
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/60—Thermal-PV hybrids
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/14—Thermal energy storage
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E70/00—Other energy conversion or management systems reducing GHG emissions
    • Y02E70/30—Systems combining energy storage with energy generation of non-fossil origin

Definitions

  • the present technology is directed to phase change materials for cooling enclosed electronic components, including for solar energy collection, and associated systems and methods.
  • Figure 1 is a partially schematic end view of a solar collection structure with an internal electronics enclosure configured in accordance with embodiments of the present technology.
  • Figures 2A and 2B are partially schematic enlarged end views of the electronics enclosure shown in Figure 1 , configured in accordance with embodiments of the present technology.
  • Figure 3 is a partially schematic end view of an electronics enclosure configured in accordance with further embodiments of the present technology.
  • Figures 4A and Figures 4B are partially transparent, enlarged isometric views of an electronics enclosure configured in accordance with still further embodiments of the present technology.
  • Figure 5 is an end view of an electronics enclosure configured in accordance with embodiments of the present technology.
  • Figure 6 is a graph illustrating results from simulations of a system configured in accordance with embodiments of the present technology.
  • One system for collecting solar energy can include a solar collection structure.
  • a solar collection structure can in turn include a glasshouse used to house solar collection equipment such as a solar concentrator, a photovoltaic cell, and/or electronic components (e.g., an electric panel) associated with controlling and monitoring equipment in a solar field.
  • the solar collection structure can protect the solar collection equipment from wind, dust, dirt, contaminants, and/or other potentially damaging or obscuring elements that may be present in the exterior environment.
  • the solar collection structure can include transmissive surfaces (e.g., glass walls and/or roof) to allow solar radiation to pass into the interior of the solar collection structure.
  • a potential drawback with this approach is that the solar collection structure can trap heat because transmissive surfaces can behave as insulation to retain heat in the solar collection structure. Furthermore, electronic components inside the solar collection structure (and other equipment such as motors or power inverters) generate heat themselves, which can add to the challenge of maintaining a target operational temperature within the solar collection structure. For example, temperatures inside a solar collection structure can reach above 65°C (and even 75°C or higher) during the daytime in summer months.
  • Solar collection equipment and electronic components inside the solar collection structure are susceptible to damage from heat, and can be affected by the resulting high temperatures.
  • solar collection equipment and electronic components may experience performance failure or malfunction, or direct physical damage, in the presence of high temperatures.
  • the failure or malfunction of solar collection equipment and/or electronic components such as the failure of control units, electrical panels, and/or actuators that control a solar concentrator, may result in losses of solar energy collection and energy production.
  • equipment failure is costly in terms of production/profit losses and repairing or replacing the affected equipment.
  • the manufacturer may need to install more expensive (e.g., larger) equipment to overcome loss of performance, which also reduces economic efficiency.
  • the present technology is directed generally to systems and methods for cooling electronic components, and in particular embodiments, components used to control solar energy collection equipment in a protective environment.
  • the system directs warm air through an airflow path in thermal communication with a phase change material to liquefy the phase change material and cool the air.
  • the system can then direct the cooled air along the airflow path in thermal communication with electronic components inside an enclosure to cool the electronic components via conduction and/or convection.
  • the system includes an enclosure (also referred to as an "electronics enclosure").
  • the enclosure can include a structure having a first portion enclosing the electronic components and a second portion enclosing the phase change material.
  • the enclosure can also include an airflow path in thermal communication with the electronic components in the first portion and the phase change material in the second portion.
  • the enclosure can include an actuatable component (e.g., a door, vent, flap, and/or valve) to control the flow of air along the airflow path and to allow air surrounding the enclosure to enter or exit.
  • the enclosure is positioned inside a solar collection structure at a solar field.
  • the solar collection structure includes solar collection equipment (e.g. , a receiver conduit and/or a solar concentrator) and electronic components for operating and/or monitoring the solar collection equipment.
  • the electronic components are positioned inside the enclosure.
  • the temperature inside the solar collection structure will increase due to solar radiation entering the structure, heat being trapped inside the structure, and an increase in the exterior temperature of the structure.
  • the electronic components inside the enclosure will heat up because the components themselves generate heat.
  • the system can direct air into thermal communication with a phase change material (e.g., paraffin wax).
  • a phase change material e.g., paraffin wax
  • the phase change material absorbs heat as sensible heat (e.g. , by changing its temperature but not its state) until it reaches its melting point.
  • the phase change material absorbs heat as latent heat, which can be a large amount of thermal energy (e.g., 90 kJ/kg to 450 kJ/kg or more).
  • phase change material heats up until it melts; when the phase change material melts, it removes a large amount of heat from the air inside the enclosure, which cools both the air and the electronic components inside the enclosure.
  • the exterior air temperature will typically decrease.
  • the system can open the enclosure and direct relatively cool air from outside the enclosure into thermal communication with the interior of the enclosure.
  • the cooler air that is directed into thermal communication with the phase change material will solidify the phase change material.
  • the cycle of opening and closing the enclosure to direct airflow can be repeated to regulate the temperature of the air inside the enclosure and, in turn, regulate (e.g. , cool) the temperature of the electronic components.
  • the system reduces the temperature of electronics (e.g., an electrical panel and/or power converter), used to operate solar collection equipment, which reduces the risk of electronic component failure and damage.
  • electronics e.g., an electrical panel and/or power converter
  • This approach can be less expensive compared to using air conditioning or electronic components designed to withstand extremely high temperatures.
  • systems in accordance with particular embodiments can be easily maintained and/or repaired because the systems can include only a few moving parts (e.g., opening and closing doors and/or a fan).
  • the incident solar radiation is used to heat a working fluid, although in other embodiments, the radiation can impinge on solar cells (e.g., photovoltaic (PV) cells) for direct conversion to electricity.
  • solar cells e.g., photovoltaic (PV) cells
  • PV photovoltaic
  • several other embodiments of the technology can have configurations and/or components different than those described in this section.
  • the present technology can be used in other processes (e.g., chemical, recycling, and/or biomass processes).
  • Figure 1 is a partially schematic end view of a solar collection structure
  • the solar collection structure 101 having an internal electronics enclosure 1 10 configured in accordance with embodiments of the present technology. As shown in Figure 1 , the solar collection structure 101 houses the electronics enclosure 1 10, a plurality of solar concentrators
  • solar radiation 100 enters the solar collection structure 101 through light-transmissive surfaces 107.
  • the plurality of solar concentrators 102 focus incoming solar radiation 100 on corresponding receivers 103 (e.g., elongated conduits or pipes) to heat a fluid inside the receivers 103.
  • the heated fluid can be used to generate steam, or the thermal energy in the fluid can be converted to another form of energy (e.g., electrical energy).
  • the steam is used to remove underground oil in an enhanced oil recovery (EOR) operation.
  • EOR enhanced oil recovery
  • the illustrated solar concentrators 102 are line-focus reflectors that receive the solar radiation 100 and concentrate the solar radiation 100 along a focal line.
  • the receivers 103 are positioned along the focal lines to receive the concentrated solar radiation 100.
  • the actuators 104 optionally rotate the solar concentrators 102 around the corresponding focal lines to track the daily and/or seasonal movement of the sun, which increase the total amount of captured and converted energy.
  • the solar concentrators can have other configurations (e.g., point source concentrators, Fresnel concentrators, and others) as described in U.S. Patent No. 8,748,731 , incorporated herein by reference.
  • the power line 105 can provide electric power (e.g., alternating current (AC)) to the actuators 104 to move the solar concentrators 102.
  • the power line 105 may carry AC power to a power inverter (e.g., AC-DC) inside the electronics enclosure 1 10, the resulting DC power is direct to the actuators 104 via the electrical conduit 106.
  • the receiver 103 operates as a light-to-heat transducer.
  • the receiver 103 absorbs solar energy, transforming it to heat and transmitting the heat to a thermal transport medium such as water, steam, oil, or molten salt. Accordingly, the receiver 103 can be a pipe or conduit. Representative arrangements for supporting the receiver 103 and the solar concentrator 102 are described further in U.S. Patent No. 8,915,244, incorporated herein by reference.
  • the electronics enclosure 1 10 is positioned inside the solar collection structure 101 , e.g. , above the bottom of the solar collection structure 101 (in a particular embodiment 0.5 meter above the bottom).
  • the electronics enclosure 1 10 can be supported by three legs 1 19 to allow air to flow beneath the electronics enclosure 1 10.
  • An exterior 122 of the electronics enclosure 1 10 can be composed of a metal such as steel, aluminum, or a combination thereof.
  • the electronics enclosure 1 10 can include an insulation material 1 16, e.g., on the interior of the electronics enclosure 1 10.
  • the insulation material 1 16 can include fiberglass, mineral wool, cellulose, plastic, polystyrene, and/or another suitable polymer materials.
  • the insulation material 1 16 can be moisture resistant to decrease the degradation of the insulation material during operation.
  • One benefit of positioning the insulation material 1 16 on the interior of the electronics enclosure 1 10 is that it reduces the amount of moisture that comes in contact with the insulation material 1 16 as compared to placing the insulation material 1 16 on the exterior wall 122 of the electronics enclosure 1 10, as the latter environment can have a higher moisture content.
  • electronic components 1 15 can be housed inside the electronics enclosure 1 10, e.g., at first portion 1 1 1 .
  • the electronic components 1 15 can be used to operate or monitor a solar collection process.
  • Representative examples of electronic components 1 15 are controllers, microcontrollers, processors, alternating current to direct current (AC-DC) converters, computer-readable media storing algorithms for operating controllers, thermocouples, sensors (e.g. , temperature and/or humidity), electrical panels, printed circuit boards, and/or other electrical circuits.
  • the electronic components 1 15 can be used to direct the actuators 104 to rotate the solar concentrators 102.
  • the electronic components 1 15 include a controller 123 that controls the one or more actuatable components (shown as actuatable components 130-131 ) and/or other components within the solar collection structure 101 .
  • the electronic components 1 15 and/or controller 123 are shown as being inside the electronics enclosure 1 10 (e.g., in the first portion 1 1 1 ), in some embodiments, the controller 123 can be positioned outside the electronics enclosure 1 10 (e.g., attached to a leg 1 19).
  • the controller 123 can include or be coupled to a memory storing instructions for controlling the actuatable components 130-132.
  • the actuatable components 130-132 and an air duct 120 can be used to direct air into the electronics enclosure 1 10 or reduce the amount of air entering the electronics enclosure 1 10.
  • the actuatable components 130-132 can include doors, vents, valves, and/or flaps configured to move based on signals from the controller 123.
  • the actuatable components 130- 132 are closed, meaning that the actuatable components are in a position to at least reduce (e.g., hinder or block) the flow of air into the electronics enclosure 1 10.
  • the position of the actuatable components is changeable, meaning that the actuatable components can change in position, shape, and/or configuration.
  • the actuatable components 130-132 are doors, they can move between open and closed positions to increase or decrease the flow of air into or out of the electronics enclosure 1 10.
  • the actuatable components 130-132 can be configured to move between a first position that allows (e.g.
  • the actuatable components can be valves, or other devices, configured to move between open and closed configurations.
  • the air duct 120 is an optional element that can form part of an airflow path to direct air in and out of the electronics enclosure 1 10, which can be regulated the actuatable components 130-132.
  • the electronics enclosure 1 10 can include a second portion 1 12 that houses a phase change material 1 14.
  • the phase change material 1 14 is a substance that is used to cool the air inside the electronics enclosure 1 10 via a change in phase.
  • the phase change material 1 14 has a latent heat of fusion ranging from 90 kJ/kg to 450 kJ/kg (or more) and a liquid/solid transition temperature of 20°C to 95°C.
  • a representative example of the phase change material 1 14 is paraffin wax with a latent heat of fusion in the range of 190-210 kJ/kg, and a liquid/solid transition temperature of 40°C to 55°C, e.g., 54.5°C. Paraffin wax is generally inexpensive, non-toxic, stable, and is suitable for the expected temperature ranges.
  • the phase change material can include other materials, for example, eutectics, salt hydrates, and/or fatty acids.
  • phase change material 1 14 absorbs a significant amount of heat from the surrounding air when temperatures are high (e.g., daytime), e.g., as sensible and latent heat, and then heat when temperatures are low (e.g., at night), it solidifies. After the phase change material solidifies (e.g., at night), it can be used again to absorb heat as sensible and latent heat when temperatures are high again (e.g., the next time daytime occurs).
  • the phase change material 1 14 is positioned in a plurality of stacked trays 1 13. Further details of the phase change material 1 14 and trays 1 13 are described with reference to Figures 2A and 2B.
  • the electronics enclosure 1 10 can also include a fan 1 17 and an air passage 1 18 extending through a partition 121 .
  • the air passage 1 18 forms part of an airflow path from the first portion 1 1 1 to the second portion 1 12, and the fan 1 17 can be used to direct air between the first portion 1 1 1 and the second portion 1 12 via the air passage 1 18.
  • the fan 1 17 can be positioned to draw hot air to from the first portion 1 1 1 and into the second portion 1 12.
  • the partition 121 and/or the fan 1 17 can be removed (e.g. , in cases for which convection and/or other forces are sufficient to direct the air appropriately).
  • Figure 1 sets forth several embodiments of the solar collection structure 101
  • several other embodiments of the technology can have configurations and/or components different than those described in this section.
  • PV cells can be used to collect solar energy and output electrical power in addition to or in lieu of the solar concentrators 102, receivers 103, and actuators 104.
  • the electronics enclosure 1 10 may not have the first portion 1 1 1 , the second portion 1 12, and the partition 121 . Rather, in some embodiments, the electronics enclosure 1 10 may have a single cavity defined by the exterior wall 122 of the electronics enclosure 1 10 so long as the flow of air can still be controlled to pass sequentially over the phase change material 1 14 and the electronic components 1 15.
  • the actuatable components 130-132 can be positioned differently on the electronics enclosure 1 10 (e.g., on the top, bottom, or side of the electronics enclosure 1 10). Also, the number of actuatable components can be reduced (e.g., to one door) or increased (e.g., to five or more doors). Furthermore, the position of the electronics enclosure 1 10 within the solar collection structure may be different (e.g., higher or lower, including below grade).
  • the electronics enclosure 1 10 can be positioned at a location inside the solar collection structure that receives less sunlight relative to other locations inside the structure (e.g., in a shaded area, the north side of a structure located in the northern hemisphere, or the south side of a structure located in the southern hemisphere).
  • the phase change material 1 14 location can have other locations in other embodiments.
  • the phase change material 1 14 can be housed in a separate enclosure connected to the electronics enclosure 1 10 via an air passageway.
  • the phase change material 1 14 can be positioned on a moveable tray or other device that moves the phase change material 1 14 from one location to another. For example, during the night the phase change material 1 14 can be moved to the exterior of the electronics enclosure 1 10 and during the day it can be moved to the interior of the electronics enclosure 1 10.
  • One benefit of positioning the phase change material 1 14 in a different location depending on the time of day is that the heat transfer rate can be increased. Conversely, an advantage of keeping the phase change material 1 14 stationary is that a fixed location is less complex.
  • FIGs 2A and 2B are enlarged, partially schematic end views of the electronics enclosure 1 10 configured in accordance with embodiments of the present technology.
  • Figure 2A schematically illustrates the electronics enclosure 1 10 with the actuatable components 130-132 in an open position configured to increase the flow of air into the electronics enclosure 1 10.
  • Figure 2B schematically illustrates the electronics enclosure 1 10 with the actuatable components 130-132 are in a closed position to reduce or eliminate the flow of air into the electronics enclosure 1 10.
  • the electronics enclosure 1 10 can be closed during warm periods (e.g., the middle of day) and opened during cool periods (e.g., the middle of the night) to regulate the interior temperature of the enclosure 1 10.
  • the actuatable components 130-132 have been positioned to direct air into and out of the enclosure 1 10 along an airflow path indicated by letters a-f.
  • first and second actuatable components 130, 131 have been positioned to allow air into and out of the enclosure 1 10
  • a third actuatable component 132 has been positioned to direct the air entering the electronics enclosure 1 10 to pass over the phase change material 1 14 before passing over the electronic components 1 15, in an open loop.
  • the phase change material 1 14 is in a solid state, as indicated with double hatching marks, as a result of being exposed to the relatively cool flow of air from outside the enclosure 1 10.
  • a liquid-tight containment layer 201 (also referred to as a liquid-tight containment element) can be positioned around the phase change material 1 14, and can be composed of a polymer (e.g., polyurethane, high-density polyethylene, medium-density polyethylene, and/or low-density polyethylene).
  • the containment layer includes a metalized PET with heat sealing layer of PE, (see, e.g., http://sorbentsystems.com/pakvf4c4ubinq.html).
  • suitable polyethylene compounds include bi-axially oriented PET film (e.g., Mylar®), which can be aluminized by evaporating a thin film of metal onto it to reduce its permeability, and to make it reflective and opaque (MPET).
  • the containment layer can be rigid (like a box) or flexible (like a bag) depending on the embodiment. When rigid, the containment layer 201 can include metals or other suitable materials.
  • the liquid- tight containment layer 201 is filled with enough phase change material 1 14 to produce some tension on the liquid-tight containment layer 201 ; the layer is not completely filled because the phase change material 1 14 can expand and contract in volume as its phase changes.
  • the liquid-tight containment layer 201 can have a thickness (e.g., from 5 millimeters to 100 millimeters) suitable to increase its durability, provide suitable thermal exchange with the adjacent air (at a reasonable cost) and lessen the likelihood for the phase change material 1 14 to spill or spread into the electronics enclosure 1 10. This latter function is also managed by trays, as described later. [0037] Additionally, the liquid-tight containment layer 201 can function to create a large surface area for thermal contact with the air inside the electronics enclosure 1 10 when the liquid-tight containment layer 201 is filled with the phase change material 1 14. For example, the surface area can be significantly larger than the area associated with individuals electronic chips, e.g. , in a range from 0.01 m 2 to 1 m 2 .
  • the heat transfer rate between the phase change material 1 14 and the air inside the electronics enclosure 1 10 can increase. Additionally, maintenance can easily be performed on the phase change material 1 14 because a technician can simply remove an existing liquid-tight containment layer 201 (e.g. , containing a degraded phase change material 1 14) and replace it with a new liquid-tight containment layer 201 that has been pre- filled with fresh phase change material 1 14.
  • an existing liquid-tight containment layer 201 e.g. , containing a degraded phase change material 1 14
  • the phase change material 1 14 has chemical and physical properties that facilitate the transfer of heat into the material during a warm period (e.g., the middle of the day) and out of the material during a cool period (e.g. , during the night).
  • the chemical and physical properties of the phase change material 1 14 are selected at least partially based on latent heat, melting point, and thermal conductivity.
  • Latent heat is the amount of energy that causes the material to change its phase, without a corresponding change (e.g. , increase) in temperature.
  • a phase change material with a high latent heat e.g.
  • phase change material with a low latent heat (e.g., less than 50 kJ/kg) because the higher latent heat allows more heat to be transferred into the phase change material.
  • a phase change material can melt, and when cool air is in thermal contact with the phase change material, the phase change material can solidify.
  • the phase change material can undergo these cycles many times (e.g., 500 times, 1000 times, 3000 times, 10,000 times, or more), making them particularly suitable for a low-maintenance heat exchange media.
  • the phase change material 1 14 is also selected to have an appropriate melting point, e.g., based on the operating temperature of the electronics enclosure 1 10. If the melting point of the phase change material 1 14 is above the operating temperature of the electronics enclosure 1 10, then the phase change material 1 14 will not change phase during normal operation.
  • the electronic components 1 15 may have a recommended maximum operating temperature of 65°C, meaning that the electronic components may malfunction above this temperature.
  • a phase change material 1 14 with a melting temperature below the recommended operating temperature of 65°C can be selected such that the phase change material 1 14 will melt before the recommended operating temperature is reached so as to absorb a significant amount of heat as latent heat.
  • the target temperature for the phase change material 1 14 can be based on a variety of factors including the temperature range of the environment, the desired operating temperature of the electronic components, the maximum operating temperature of the electronic components, and/or a fail-safe temperature of the electronic components.
  • the phase change material 1 14 can have a target thermal conductivity.
  • Thermal conductivity is the rate at which heat passes through a material, typically expressed as the amount of heat that flows per unit time through a unit area with a temperature gradient of one degree per unit distance.
  • the target thermal conductivity of phase change material 1 14 is generally selected to be high, e.g., above 0.1 W/mK.
  • suitable phase change materials are paraffins (organic), salt hydrates (inorganic), fatty acids (organic), and/or waxes (e.g., paraffin wax, vegetable wax, and/or combination of waxes).
  • phase change material is paraffin wax, which is suitable for use in a solar structure having an internal temperature exceeding 35°C.
  • Table 1 lists the properties of suitable representative phase change materials.
  • PCM 1 -4 can be used for a solar collection operation in a warm environment (e.g., temperatures above 50 °C in an enclosure).
  • Suitable paraffin wax blends are available from IGI, Inc. of Toronto, Ontario, Canada (htt J/w ⁇ and typically include hydrocarbon molecules containing between twenty and forty carbon atoms.
  • the phase change material 1 14 is positioned in thermal communication with the airflow path, indicated by arrows a-f.
  • the controller 123 instructs the actuatable components 130-132 to move to the open position, air can flow from the right side (indicated by arrow a) into the air duct 120 and up into the electronics enclosure 1 10 second portion 1 12, as shown by arrow b.
  • the airflow path continues up and across the phase change material 1 14, carried by trays 1 13.
  • the air is in thermal communication with phase change material 1 14 when the phase change material 1 14 is in a liquid state, the air can transfer heat away from the phase change material 1 14 via conduction and/or convection.
  • This process typically occurs at night to solidify the phase change material 1 14 (e.g. , after the temperature has decreased for a few hours over night).
  • the fan 1 17 directs the air into the first portion 1 1 1 of the electronics enclosure 1 10, as shown by arrow d. Inside the first portion 1 1 1 , the air is in thermal communication with electronic components 1 15. During the night, the electronic components 1 15 are typically less active than the day, and accordingly may not transfer a significant amount of heat to the air flow. After the heat is transferred into the air, the electronics enclosure 1 10 directs the air into the air duct 120 (as shown by arrow e) and then out into the interior of the solar collection structure 101 (shown in Figure 1 ).
  • phase change material 1 14 absorbs heat from the air, which causes the phase change material 1 14 to heat (and possibly begin to liquefy), and cools the electronics components 1 15.
  • a threshold value e.g., 45°C
  • the controller 123 can be programmed to open and/or close the electronics enclosure 1 10, e.g., to move the actuatable components 130-132 between at least a first configuration and second configuration to increase or decrease the flow of air into the enclosure.
  • the instructions for moving the actuatable components 130- 132 can be based on inputs. Inputs can include time (e.g., time of day), temperature detected in the interior of the enclosure, temperature detected outside the enclosure, forecast temperatures (e.g. , based on a weather forecast), sunrise and sunset schedules, and/or related time or temperature parameters.
  • the controller 123 can open or close an actuatable component 130-132 based on time of day (e.g., 8 am), a predetermined interior temperature (e.g., 45°C) for the solar collection structure 101 , and/or after a predefined period of time (e.g., 5 min, 8 hours). In another example, the controller 123 can wait for a 10 minute period to elapse before sending a signal to move the actuatable components 130-132.
  • time of day e.g., 8 am
  • a predetermined interior temperature e.g., 45°C
  • a predefined period of time e.g., 5 min, 8 hours.
  • the controller 123 can wait for a 10 minute period to elapse before sending a signal to move the actuatable components 130-132.
  • FIG. 2B schematically illustrates the electronics enclosure 1 10 in a closed configuration with the actuatable components 130-132 closed.
  • the closed configuration prevents or significantly restricts the flow of air into the electronics enclosure 1 10.
  • the actuatable components 130-132 are closed based on an indication a target temperature has been reached or exceeded a target time has been reached or elapsed.
  • the controller 123 instructs the actuatable components 130-132 to move into the closed position, typically during a time when the air outside the enclosure 1 10 is warm or hot (e.g., mid-day or afternoon).
  • the airflow path shown by arrows b and d is reduced to a closed loop within the interior of the electronics enclosure 1 10.
  • the actuatable components 130-132 in their closed positions reduce (e.g., eliminate) airflow from the exterior into the interior of the electronics enclosure 1 10.
  • the air inside the electronics enclosure 1 10 is circulated to be in thermal contact with the phase change material 1 14 and the electronic components 1 15.
  • the phase change material 1 14 can melt (as indicated by a single hatching). Depending on the time period and temperature of air that the phase change material is contact with, the phase change material may melt partially, or melt completely.
  • the phase change material 1 14 can continue to store heat when the actuatable components 130-132 are in the closed positions. When the phase change material 1 14 is in a completely liquid state, it can continue to absorb heat as sensible heat (e.g., without changing state).
  • the electronics enclosure 1 10 can be opened to cool its interior during a cooler period of the day (e.g., nighttime) and closed to reduce the increase of temperature of interior of the electronics enclosure during a warmer period (e.g., daytime).
  • a cooler period of the day e.g., nighttime
  • a warmer period e.g., daytime
  • the electronics enclosure 1 10 is open, relatively cool air from outside the enclosure 1 10 cools and solidifies the phase change material 1 14.
  • the air flow can also cool the electronic components 1 15 at least up to a point.
  • the doors are closed, the recirculating air continues to cool the electronic components 1 15 and transfers the heat to the phase change material 1 14 to liquefy or partially liquefy it.
  • Figure 3 is a partial cross-sectional view of an electronics enclosure 1 10 configured in accordance with another embodiment of the present technology.
  • Figure 3 has many of the same elements shown in Figure 2A, but includes trays 1 13 and phase change material 1 14 positioned in a different (e.g. , different) orientation.
  • a different orientation e.g. , different
  • the trays 1 13 shown in Figure 3 also include four walls, as compared to three walls in shown Figures 2A and 2B.
  • the fourth wall provides the additional structure to potentially hold the phase change material 1 14 in a vertical orientation. As the phase change material 1 14 changes from a solid to a liquid, the liquid tends to accumulate at the bottom of the tray 1 13 in a pool.
  • the fourth wall can prevent the phase change material 1 14 from pooling at the bottom of the tray 1 13.
  • FIG 4A is an enlarged isometric view of portions of an electronics enclosure 1 10 configured in accordance with embodiments of the present technology.
  • the second portion 1 12 of the electronics enclosure includes the fan 1 17, the air passage 1 18 (in a different position than shown in Figures 1 , 2A-B, and 3), an air duct 120, trays 1 13, a partition 121 , an actuatable component 132, vents 403, a rack support structure 405, and airflow path indicated by arrows a-i.
  • the vents 403 function in the same manner as the first and second actuatable components 130-131 described above with respect to Figure 2A.
  • the rack support structure 405 is slanted, which allows the trays 1 13 to be staggered and provides for an increase in airflow between the trays as compared to a non-slanted rack.
  • air can travel along the airflow path indicated by arrows a-i to be in thermal contact the phase change material in the trays 1 13 (not visible in Figure 4A).
  • the vents 403 are shown in a first (e.g. , open) position that allows air to flow into the electronics enclosure 1 10, e.g. , to solidify the phase change material.
  • the fan 1 17 can direct air from the second portion 1 12 into the first portion 1 1 1 of the electronics enclosure 1 10 (at the rear of the enclosure 1 10) to cool the electronic components.
  • the air exits the first portion 1 1 1 through the air passage 1 18 and then exits the electronics enclosure 1 10 as indicated by arrows h and i without passing over the trays 1 13.
  • FIG 4B is an enlarged isometric view of the electronics enclosure 1 10 of Figure 4A, shown in the closed position.
  • the vents 403 and actuatable component 132 are in a second (e.g., closed) position that reduces or eliminates the flow of air into the electronics enclosure 1 10. Accordingly, air circulates in a closed loop over the trays 1 13 in the second portion 1 12, then into the first portion 1 1 1 , and back to the second portion 1 12.
  • This configuration is typically used during the daytime when exterior temperatures are the highest (e.g., above 30°C), and the phase change material is used to cool the air, as described above with reference to Figure 2B.
  • Figure 5 is an end view of a portion of the electronics enclosure 1 10 shown in Figures 4A and 4B.
  • the first portion 1 1 1 of the electronics enclosure 1 10 houses electronic components 1 15 (e.g., wires, electronic panels, memory, and related electronic equipment). Air can enter the first portion 1 1 1 via the fan 1 17, and exits through air passage 1 18.
  • electronic components 1 15 e.g., wires, electronic panels, memory, and related electronic equipment. Air can enter the first portion 1 1 1 via the fan 1 17, and exits through air passage 1 18.
  • Figure 6 is a graph illustrating results from simulations of a system configured in accordance with embodiments of the present technology.
  • the x-axis represents time in hours and minutes.
  • the y-axis represents the interior temperature of the electronics enclosure.
  • the legend on the upper right side of the graph shows the internal temperature of the electronics enclosure, with and without cooling provided by a phase change material.
  • the legend also includes a recommended operating temperature limit (approximately 65°C) for electronic components, which can be a target temperature as described above.
  • the phase change material significantly reduces the interior temperature of the enclosure by absorbing heat from the electronic components during the day and releasing it during the night. Because the phase change material is absorbing the heat during the warm period (e.g. , day time), the air temperature inside the electronics enclosure is reduced, and the electronic components are kept below the recommended operating temperature limit.
  • the temperature exterior to the electronics enclosure was held at 85°C for approximately 9.5 hours without PCM and 16.25 hours with PCM. After those time periods, the temperature exterior to the electronics enclosure was reduced to 35°C. The door was closed when the exterior was above 45°C and open when below 45° C. If the test without the PCM had been stopped before the internal temperature reached 65° C (representative electronics operation limit), then the test would have only lasted about 2 hrs. Therefore, the PCM in this simulation added 14.25 hours of thermal protection for electronic components rated to 65°C.
  • the system can include thermocouples that monitor the interior temperature of the electronics enclosure. If the system determines that the temperature has exceeded a target temperature (e.g., a fail-safe temperature of an electronic component or a recommended maximum operating temperature), the system can shut down the electronic component.
  • a target temperature e.g., a fail-safe temperature of an electronic component or a recommended maximum operating temperature
  • PV cells and solar concentrators can be used in conjunction or individually.
  • the airflow paths described above extend between the phase change material and the electronic component, and can also extend beyond either or both. Accordingly, the actuatable components can be between the electronic components and the phase change material, or upstream or downstream of either or both.
  • Additional embodiments of the present technology can have other arrangements.
  • the ground can be used as a heat sink.
  • pipes underground which remains at relatively stable and relatively low temperatures throughout the day and night
  • fans circulating air into the enclosure and/or the structure the operator can control the interior temperature without the use of active air conditioning.
  • Such underground pipes can also perform multiple functions, e.g., carrying cabling for powering/communications, as well as cooling electronics enclosures.
  • advantages associated with certain embodiments of the disclosed technology have been described in the context of those embodiments, other embodiments may also exhibit such advantages, and not all embodiments need necessarily exhibit such advantages to fall within the scope of the present technology. Accordingly, the present disclosure and associated technology can encompass other embodiments not expressly shown or described herein.
  • the word “or” refers to any possible permutation of a set of items.
  • the phrase “A, B, or C” refers to at least one of A, B, C, or any combination thereof, such as any of: A; B; C; A and B; A and C; B and C; A, B, and C; or multiples of any item such as A and A; B, B, and C; A, A, B, C, and C; etc.

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Abstract

La présente technologie se rapporte de manière générale à des matériaux à changement de phase pour le refroidissement de composants électroniques enfermés, y compris la collecte d'énergie solaire, et à des systèmes et des procédés associés. Selon des modes de réalisation particuliers, un système dirige de l'air chaud dans un chemin d'écoulement d'air en communication thermique avec un matériau à changement de phase pour liquéfier le matériau à changement de phase et refroidir l'air. Le système dirige également l'air froid en communication thermique avec des composants électroniques pour refroidir les composants électroniques par conduction et/ou convection.
PCT/US2016/040121 2015-06-30 2016-06-29 Matériaux à changement de phase pour le refroidissement de composants électroniques enfermés, y compris pour la collecte d'énergie solaire, et systèmes et procédés associés WO2017004222A1 (fr)

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CN201680045926.XA CN107912054B (zh) 2015-06-30 2016-06-29 用于冷却包括用于太阳能收集的封闭的电子部件的相变材料及相关联的系统和方法
AU2016287485A AU2016287485A1 (en) 2015-06-30 2016-06-29 Phase change materials for cooling enclosed electronic components, including for solar energy collection, and associated systems and methods
EP16818700.3A EP3295557A4 (fr) 2015-06-30 2016-06-29 Matériaux à changement de phase pour le refroidissement de composants électroniques enfermés, y compris pour la collecte d'énergie solaire, et systèmes et procédés associés

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PCT/US2016/040121 WO2017004222A1 (fr) 2015-06-30 2016-06-29 Matériaux à changement de phase pour le refroidissement de composants électroniques enfermés, y compris pour la collecte d'énergie solaire, et systèmes et procédés associés

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EP3683962A1 (fr) 2020-07-22
WO2017004225A1 (fr) 2017-01-05
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AU2016287485A1 (en) 2018-01-18
CN107912054A (zh) 2018-04-13
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EP3295091A4 (fr) 2018-10-03
US20190245483A1 (en) 2019-08-08
CN107835920A (zh) 2018-03-23
EP3295091A1 (fr) 2018-03-21
US10063186B2 (en) 2018-08-28
US20170005615A1 (en) 2017-01-05
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