WO2016208851A1 - Procédé de fabrication de verre pour diodes led - Google Patents

Procédé de fabrication de verre pour diodes led Download PDF

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Publication number
WO2016208851A1
WO2016208851A1 PCT/KR2016/003053 KR2016003053W WO2016208851A1 WO 2016208851 A1 WO2016208851 A1 WO 2016208851A1 KR 2016003053 W KR2016003053 W KR 2016003053W WO 2016208851 A1 WO2016208851 A1 WO 2016208851A1
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WO
WIPO (PCT)
Prior art keywords
glass
green sheet
high melting
glass frit
firing
Prior art date
Application number
PCT/KR2016/003053
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English (en)
Korean (ko)
Inventor
박태호
이정수
임형석
이현휘
이상근
Original Assignee
주식회사 베이스
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020150088934A external-priority patent/KR101787381B1/ko
Priority claimed from KR1020150088933A external-priority patent/KR101722464B1/ko
Priority claimed from KR1020150100055A external-priority patent/KR101835041B1/ko
Application filed by 주식회사 베이스 filed Critical 주식회사 베이스
Publication of WO2016208851A1 publication Critical patent/WO2016208851A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B19/00—Other methods of shaping glass
    • C03B19/01—Other methods of shaping glass by progressive fusion or sintering of powdered glass onto a shaping substrate, i.e. accretion, e.g. plasma oxidation deposition
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B19/00—Other methods of shaping glass
    • C03B19/02—Other methods of shaping glass by casting molten glass, e.g. injection moulding
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B19/00—Other methods of shaping glass
    • C03B19/06—Other methods of shaping glass by sintering, e.g. by cold isostatic pressing of powders and subsequent sintering, by hot pressing of powders, by sintering slurries or dispersions not undergoing a liquid phase reaction
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C4/00—Compositions for glass with special properties
    • C03C4/12—Compositions for glass with special properties for luminescent glass; for fluorescent glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements

Definitions

  • the present invention relates to a method for manufacturing a glass for LED, and more particularly, to improve the transmittance and light extraction efficiency while minimizing the crack failure by post-processing, to prevent rapid shrinkage during the firing process and to be separated from the substrate without a release agent
  • the manufacturing method of the glass for this is related.
  • LEDs Light emitting diodes
  • 'LED' are semiconductors made of gallium (Ga), phosphorus (P), arsenic (As), and the like, and have a property of emitting light when a current flows.
  • LEDs have been widely used as light sources of various display devices because they have a longer lifespan and a faster response time than conventional light bulbs, and can be miniaturized and emit bright colored light.
  • an LED package including an LED chip is used as a light emitting device in a backlight unit (BLU) that emits light behind a liquid crystal display of a liquid crystal display (LCD).
  • BLU backlight unit
  • an LED package used for a backlight unit is formed by mounting an LED chip on a printed circuit board, encapsulating with an encapsulant, and then attaching a lens.
  • the encapsulant basically serves to transmit the light from the LED chip to the outside while protecting the LED chip from heat, moisture, and external impact.
  • PAG phosphor-in-glass mixture
  • the mixture containing the glass frit may cause the glass to shrink and warp rapidly, there is also a problem that the phosphor is degraded by the firing temperature of the glass frit.
  • the edges having many pores are melted first at the temperature of the softening point or more, and the open pore channel disappears, a large amount of blocked pores are distributed therein, which causes a problem of cracking during processing after firing.
  • a release agent such as wax, liquid paraffin, silicon-based, fluorine-based.
  • the degree of separation is different depending on the composition of the glass sheet, and a process of forming a separate release agent or coating the surface of the substrate with the release agent is required.
  • the present invention aims to solve the above-mentioned problems of the prior art.
  • the present invention can improve the transmittance and light extraction efficiency while minimizing the crack failure by the post-processing, and provides a manufacturing method of the glass for LED that can minimize the occurrence of distortion by controlling the rapid shrinkage of the glass in the firing step Its purpose is to.
  • another object of the present invention is to provide a method for manufacturing a glass for an LED that can be separated from a substrate without a release agent and can increase the strength.
  • (a) molding and processing the glass slurry to which the phosphor is added and then dried to form a glass molded body may include the step of firing the glass molded body.
  • the step of firing the glass molded body may include a step of preliminarily pre-firing at a temperature below the softening point and a second firing of the pre-fired glass molded body at a temperature of 20 ° C. higher than the softening point to the softening point in a vacuum state.
  • the step of firing the glass molded body may include a step of preliminarily pre-firing at a temperature below the softening point and a second firing of the pre-fired glass molded body at a temperature of 20 ° C. higher than the softening point to the softening point in a vacuum state.
  • a method for producing glass comprises the steps of (a) forming a glass green sheet comprising a glass frit mixed with a low melting glass frit and a high melting glass frit; and (b) firing the glass green sheet. It may include the step. Here, firing is performed at or above the softening temperature of the low melting glass frit, below the softening temperature of the high melting glass frit, and the shape of the high melting glass frit may be maintained as it is during firing.
  • a method for producing a glass for LEDs comprises the steps of (a) forming a first glass green sheet comprising a high melting glass frit, (b) a second glass comprising a low melting glass frit Forming a green sheet, (c) alternately laminating the first glass green sheet and the second glass green sheet, and (d) compressing the laminated sheet and then softening the temperature of the low melting glass frit or higher, high melting glass Firing below the softening temperature of the frit.
  • the shape of the high melting glass frit may be maintained as it is baked.
  • a method for producing a glass for LEDs comprises the steps of (a) forming a high melting point glass green sheet comprising a high melting point glass frit on a substrate, (b) on a high melting point glass green sheet Stacking a plurality of glass green sheets comprising a high melting glass frit and a low melting glass frit, (c) compressing the laminated sheets and then compressing the laminated sheets at a temperature above the softening temperature of the low melting glass frit and below the softening temperature of the high melting glass frit. Firing and (d) separating the product of step (c) from the substrate.
  • the pre-firing at a temperature below the softening point when manufacturing the glass for LEDs to reduce the rate of shrinkage of the glass molded body to 1 to 5% to form an open pore channel (open pore channel) to the inside
  • vacuum firing is performed to create a uniform temperature profile in the entire area of the glass molded body to control rapid shrinkage in the edge region of the glass molded body. This can prevent the formation of closed pores in this area, thereby completely removing the pores.
  • it may have a poreless structure without pores, thereby minimizing crack defects by post-processing and maximizing transmittance and light extraction efficiency.
  • a method of forming a glass green sheet by mixing a low melting point and a high melting point glass frit and a first glass green sheet including a high melting point glass frit and a first comprising a low melting point glass frit In the method of alternately stacking the glass green sheets, the glass green sheet is baked at or above the softening temperature of the low melting glass frit and below the softening temperature of the high melting glass frit, whereby the shape of the high melting glass frit is maintained as it is. The sharp shrinkage can minimize the distortion. In addition, by maintaining the shape of the high-melting-point glass frit, it is possible to prevent curling in which the edge region of the sheet is curled.
  • the present invention by forming a high melting point glass green sheet containing a high melting point glass frit on the substrate, it is possible to easily separate the glass from the substrate without a release agent, and also, high melting point and low melting point glass By laminating the glass green sheets in which the frits are mixed, the strength of the glass can be improved.
  • 1 is a flow chart sequentially showing a manufacturing process of the glass for LEDs according to the first embodiment of the present invention.
  • FIG. 2 is a process schematic diagram illustrating a vacuum firing process according to a first embodiment of the present invention.
  • FIG. 3 is a flowchart sequentially illustrating a manufacturing process of the glass according to the second embodiment of the present invention.
  • FIG. 4 is a flowchart sequentially illustrating a manufacturing process of the glass for LEDs according to the third embodiment of the present invention.
  • the manufacturing method of the LED glass according to the present embodiment is a glass molded body forming step (S210), preliminary firing step (S220) ) And a vacuum firing step (S230).
  • the glass slurry to which the phosphor is added is molded and processed, followed by drying to form a glass molded body (S210) of forming a glass molded body such as a glass green sheet.
  • a preliminary firing step (S220) of firing the glass molded body at a temperature below the softening point is performed.
  • preliminary firing as described above, only 1 to 5% of the glass molded body is shrunk to form an open pore channel to the inside.
  • the softening point of the glass molded body varies slightly depending on the content of the glass frit, but the temperature at which the viscosity becomes 10 7.6 poise can be defined as the softening point, and preferably, preliminary firing can be performed at 500 to 750 ° C. have. This is because when the preliminary firing temperature is less than 500 ° C., the shrinkage of the glass molded body may not satisfy the target value, and when the preliminary firing temperature exceeds 750 ° C., the open pore channel may collapse due to excessive shrinkage.
  • a vacuum firing step (S230) of firing the pre-fired glass molded body at a temperature of about 20 ° C. higher than the softening point to the softening point in a vacuum state may be performed, and specifically, firing may be performed at 600 to 850 ° C. have.
  • firing temperature is less than the softening point, a large amount of bubbles may be generated in the fired glass frit, and the light transmittance and the light extraction efficiency may be lowered.
  • the firing temperature is excessively higher than 20 ° C. above the softening point, the phosphor discolors. This can happen.
  • FIG. 2 is a process schematic diagram for explaining a vacuum firing process.
  • the pre-fired glass molded body G is vacuum fired by the vacuum heating apparatus 200.
  • the pre-fired glass molded body G is mounted on the vacuum chuck 220 mounted inside the vacuum chamber 210 maintained in a vacuum state.
  • the glass molded body G is transferred into the vacuum chamber 210 through the gate valve 215 and is seated on the vacuum chuck 220.
  • a heater 240 for heating the glass molded body G to a firing temperature is mounted inside the vacuum chuck 210.
  • the heater 240 may be divided into a plurality of designs to enable local heating, but is not limited thereto.
  • a lifting unit 230 having a lift pin 235 for controlling the height of the glass molded body G is mounted below the vacuum chuck 220.
  • a vacuum pump 250 for adjusting the degree of vacuum inside the vacuum chamber 210 is installed at one lower end of the vacuum chamber 210.
  • the firing proceeds with respect to the pre-fired glass molded body G at a temperature of about 20 ° C. higher than the softening point to the softening point, that is, maintaining the temperature near the softening point or gradually raising the temperature at a temperature rising rate of 1 ° C./min or less. Therefore, it is possible to create a uniform temperature profile in the entire region of the glass molded body (G). As a result, rapid shrinkage in the edge region of the glass molded body G can be controlled, and closed pores can be prevented from being generated, thereby making it possible to completely remove the pores.
  • fusing point differs can be used, and the thing of the big difference of the melting point between glass frits can be used especially.
  • vacuum baking is performed using the glass frit in which two or more types from which melting points differ are mixed, it can prevent that melting points between glass frits differ and abruptly shrink.
  • the temperature is raised at a rate of 1 ° C./min or lower to allow the shrinkage to be slowly performed to produce closed pores. It can also be blocked to completely remove pores.
  • the glass for LEDs has a poreless structure without pores, thereby minimizing crack defects due to post-processing and maximizing transmittance and light extraction efficiency.
  • the glass slurry to which the fluorescent substance was added in the same amount to the glass frit of Table 1 was shape
  • the glass molded body was pre-baked at 620 ° C. for 30 minutes, and then vacuum-fired at a temperature of 830 ° C. for 80 minutes in a vacuum chamber maintained at 3 Torr to produce color conversion glass.
  • the glass slurry to which the fluorescent substance was added in the same amount to the glass frit of Table 1 was shape
  • the glass molded body was pre-baked at 680 ° C. for 30 minutes, and then vacuum-fired at a temperature of 820 ° C. for 80 minutes in a vacuum chamber maintained at 4 Torr to manufacture color conversion glass.
  • the glass slurry to which the fluorescent substance was added in the same amount to the glass frit of Table 1 was shape
  • the glass molded body was pre-fired at 650 ° C. for 40 minutes, and then vacuum fired at a temperature of 830 ° C. for 110 minutes in a vacuum chamber maintained at 6 Torr to manufacture color conversion glass.
  • the glass slurry to which the fluorescent substance was added in the same amount to the glass frit of Table 1 was shape
  • the glass molded body was prebaked at 710 ° C. for 50 minutes, and then vacuum baked at a temperature of 810 ° C. for 100 minutes in a vacuum chamber maintained at 7 Torr to prepare a color conversion glass.
  • the glass slurry to which the fluorescent substance was added in the same amount to the glass frit of Table 1 was shape
  • the glass molded body was pre-fired at 760 ° C. for 20 minutes, and then vacuum fired at a temperature of 830 ° C. for 90 minutes in a vacuum chamber maintained at 4 Torr to prepare a color conversion glass.
  • Table 2 shows the results of evaluation of the physical properties of the color conversion glass according to Examples 1 to 4 and Comparative Example 1, the light transmittance of 400nm ⁇ 800nm wavelength through UV / visible spectrum measurement (UV-vis meter, cary) was measured.
  • a second embodiment of the present invention relates to a method for minimizing warpage by controlling a sharp shrinkage in the firing step in the manufacture of glass.
  • the method for producing glass according to the present embodiment includes forming a glass molded body, ie, a glass green sheet, and baking the glass, similarly to the above-described method.
  • a low melting point and a high melting point glass frit are mixed to form a glass green sheet.
  • the content of the high melting glass frit is preferably 50 to 90% based on the total weight of the glass frit.
  • the content of the high melting glass frit is less than 50%, the content of the high melting glass frit is relatively low compared to the content of the low melting glass frit, and the properties of the glass are determined by the low melting glass frit. That is, as the low melting glass frit is melted in the firing step, the glass may shrink sharply and curling may occur. In contrast, when the content of the high melting glass frit exceeds 90%, densification by the low melting glass frit may be insufficient.
  • the low melting glass frit has a temperature of about 500-800 ° C. in the firing operation, and may include a glass component including alkaline earth oxides (MgO, CrO, BaO), but is not limited thereto.
  • a glass having a temperature of about 800 ° C. or more in a firing operation may be used, and more particularly, a borosilicate-based component of borosilicate is preferably used.
  • Borosilicate-based components can be applied at a high melting point, has the advantages of excellent strength and durability, calcium aluminum borosilicate, calcium sodium borosilicate and the like can be used alone or in combination of two or more.
  • the glass green sheet may further include a phosphor for use in the sealing member of the LED.
  • a phosphor for use in the sealing member of the LED.
  • various known phosphors can be used.
  • phosphors such as YAG, LuAg, TAG, silicate, SiAlON, BOS, and (oxy) nitride can be used.
  • the phosphor may be mixed in an amount of about 10 to 50 wt% with respect to 100 wt% of the slurry, but is not necessarily limited thereto and may be adjusted in consideration of the degree of color conversion.
  • the phosphor may be a diameter of 5 ⁇ 30 ⁇ m, but is not necessarily limited thereto.
  • the content distribution of the phosphor may be determined, and then the content distribution of the phosphor may be uniformly combined and stacked.
  • the distribution degree of fluorescent substance in the center part and the edge part of a glass green sheet may be nonuniform.
  • stacking may be laminated
  • the glass green sheet is formed and then fired. Firing is carried out above the softening temperature of the low melting glass frit and below the softening temperature of the high melting glass frit.
  • the firing temperature may be about 500 to 800 ° C.
  • the time for performing the firing may be about 10 to 100 minutes, but is not limited thereto.
  • the shape of the high-melting-point glass frit during firing can be maintained as it is, preventing the glass from shrinking rapidly and minimizing distortion.
  • the low melting point glass frit is melted during firing, thereby filling the pores by densification, which causes the high melting point glass frit to be invisible to the naked eye, indicating transparency of the glass.
  • the firing temperature is less than the softening temperature of the low melting glass frit, the compactness of the fired body may be insufficient, leading to a decrease in the strength and transmittance of the glass as the porosity increases. In this case, the phosphor powder may deteriorate or the glass may be warped.
  • the compacted sheet is reduced to a thickness of approximately 15% or less and is formed into one monolithic after being fired above the softening temperature of the low melting glass frit and below the softening temperature of the high melting glass frit. At this time, the monolith shrinks to about 15 to 25% in the width direction and becomes about 10% or less to shrink in the thickness direction.
  • glass green sheet including a low melting glass frit and a glass green sheet including a high melting glass frit
  • stacking the glass green sheets respectively, and then firing the glass.
  • FIG. 3 is a flowchart sequentially illustrating a process of manufacturing glass using the plurality of glass green sheets formed as described above. Referring to this, first, a first glass green sheet including a high melting glass frit is formed (S310). .
  • the first glass green sheet may be produced by a tape casting method from a slurry containing a high melting point glass frit, a binder, and a solvent, and is preferably formed to have a thickness of 100 ⁇ m or less. This may limit the number of sheets to be laminated due to the thickness of the glass when the thickness exceeds 100 ⁇ m and the transparency of the glass may be inferior.
  • the first glass green sheet may further include a phosphor for use as color conversion glass for LED. Since the phosphor may be degraded by the low melting glass frit during the sintering process described below, the phosphor is preferably mixed with the high melting glass frit. The type and weight of the phosphor are as described above.
  • a second glass green sheet including a low melting glass frit is formed (S320).
  • the second glass green sheet can be produced by a tape casting method from a slurry containing a low melting glass frit, a binder and a solvent, and the thickness thereof is preferably 1/2 or less of the thickness of the first glass green sheet. If the thickness exceeds 1/2 of the thickness of the first glass green sheet, the anti-curling effect may be lowered, and when the phosphor is mixed with the first glass green sheet, it reacts with the low melting glass frit and the phosphor during firing. The phosphor may deteriorate.
  • first glass green sheet and the second glass green sheet are formed in this way, they are alternately stacked (S330).
  • Lamination may be performed by forming a second glass green sheet on the first glass green sheet and forming a first glass green sheet on the second glass green sheet.
  • one or more first glass green sheets and one or more second glass green sheets may be alternately laminated, and the number of laminated sheets may be adjusted in consideration of thicknesses of the first and second glass green sheets.
  • firing is performed at a temperature higher than the softening temperature of the low melting glass frit and below the softening temperature of the high melting glass frit (S340).
  • a glass green sheet is formed by mixing a low melting glass frit and a high melting glass frit, or a glass green sheet including a low melting glass frit and a glass green sheet including a high melting glass frit.
  • the glass is produced by forming and laminating each one, and then firing the glass, and baking the glass below the softening temperature of the low melting glass frit and below the softening temperature of the high melting glass frit, thereby maintaining the shape of the high melting glass frit.
  • by maintaining the shape of the high-melting-point glass frit it is possible to prevent curling in which the edge region of the sheet is curled.
  • the manufacturing method of the LED glass according to the present embodiment forms a high melting point glass green sheet on a substrate.
  • a high melting point glass green sheet including a high melting point glass frit is formed on a substrate (S410).
  • the high melting point glass green sheet may be prepared by a tape casting method from a slurry containing a high melting point glass frit, a binder and a solvent, and the composition of the slurry is 40 to 50% by weight of the high melting point glass frit, 5 to 10% by weight of the binder,
  • the solvent may be 40 to 55% by weight, but is not limited thereto.
  • the slurry may further include a phosphor, in which case the phosphor may be mixed at about 5 to 30% by weight, but the content may be adjusted in consideration of the degree of color conversion.
  • the high melting point glass frit in the present embodiment is a glass having a temperature of about 900 ° C. or higher in the firing operation, and can be used without limitation as long as the glass frit can be applied to a high melting point and is excellent in strength and durability.
  • Calcium sodium borosilicate etc. can be used individually or in mixture of 2 or more types.
  • a plurality of glass green sheets including a high melting point and a low melting glass frit are laminated on the high melting glass green sheet (S420).
  • S420 can be prepared by a tape casting method from a slurry comprising a high melting point and a low melting glass frit, the composition of the slurry is 40 to 50% by weight of the high melting point and low melting glass frit, 5 to 10% by weight of the binder, 40 to solvent It may be 55% by weight, but is not limited thereto.
  • the phosphor may be further included in consideration of the degree of color conversion.
  • the low melting glass frit in the present embodiment is a glass having a temperature of about 600 to 800 ° C. in the firing operation, and may include a glass component including alkaline earth oxides (MgO, CrO, BaO), but is not limited thereto. .
  • the glass green sheet formed on the upper surface of the high melting point glass green sheet preferably contains 50% by weight or more of the high melting point glass frit based on the total weight of the high melting point and the low melting point glass frit. More preferably, the content of the high melting point glass frit includes at least 80% by weight, and the glass green sheet sequentially laminated thereon contains the content of the high melting point glass frit at least 70% by weight, and then the glass green sheet to be laminated is The content of the high melting glass frit is formed to 50% by weight or more.
  • the glass green sheet when the glass green sheet is farther from the substrate, the content of the high melting glass frit decreases, and when the glass green sheet having the high melting glass frit content of the plurality of glass green sheets to be laminated is 50% by weight or more, the substrate The glass can be easily separated from the. Moreover, the strength of glass can be improved by mixing and using a high melting point and a low melting glass frit.
  • the laminated sheets are pressed and fired (S430). Compressing the laminated sheet is reduced to a thickness of approximately 25% or less, and is formed into one single body after being fired above the softening temperature of the low melting glass frit and below the softening temperature of the high melting glass frit. At this time, the monolith shrinks to about 15-22% in the width direction, and shrinks to about 10% or less in the thickness direction.
  • the firing temperature is preferably about 600 to 800 ° C., and the time for performing the firing may be about 10 to 100 minutes, but is not limited thereto.
  • the firing temperature exceeds 900 ° C
  • the high melting point glass frit may be sintered and adhered to the substrate because it exceeds the softening temperature of the high melting point glass frit, and separation from the glass to be manufactured may be difficult.
  • the slurry includes a phosphor, there may be a problem that the phosphor is deteriorated by heat exceeding 900 ° C.
  • the substrate may be made of a ceramic or metal material having little deformation at a high temperature of 800 ° C. or higher and resistant to thermal shock, and preferably, boron nitrate or aluminum oxide may be used as the substrate.
  • the glass separated from the substrate may be used as a glass or color converting material that can be applied to the LED.
  • a low melting glass frit is formed after forming a high melting glass green sheet including a high melting glass frit on a substrate and laminating a plurality of glass green sheets including a high melting point and a low melting glass frit.
  • a high melting glass green sheet including a high melting glass frit By firing at or above the softening temperature of and below the softening temperature of the high melting glass frit, the substrate and the glass can be easily separated by the high melting glass green sheet.
  • the strength of the glass may be improved.

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Abstract

La présente invention concerne un procédé de verre pour diodes LED. Dans un mode de réalisation de l'invention peut comprendre les étapes suivantes : (a) formation et traitement d'une masse de verre à laquelle on a ajouté des corps fluorescents et séchage de celle-ci pour former un corps de verre formé; et (b) cuisson du corps de verre formé, le stade de cuisson du corps de verre formé pouvant comprend un stade de cuisson primaire et préliminaire du corps de verre formé et une température plus basse qui le point de ramollissement, et un stade de cuisson secondaire du corps de verre formé à une même température ou supérieure de 20°C au point de ramollissement dans le vide.
PCT/KR2016/003053 2015-06-23 2016-03-25 Procédé de fabrication de verre pour diodes led WO2016208851A1 (fr)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
KR1020150088934A KR101787381B1 (ko) 2015-06-23 2015-06-23 Led용 글래스 제조 방법
KR10-2015-0088934 2015-06-23
KR1020150088933A KR101722464B1 (ko) 2015-06-23 2015-06-23 포어리스 구조의 led용 색변환 유리 제조 방법
KR10-2015-0088933 2015-06-23
KR1020150100055A KR101835041B1 (ko) 2015-07-14 2015-07-14 글래스의 제조 방법
KR10-2015-0100055 2015-07-14

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TWI689474B (zh) * 2017-11-28 2020-04-01 南韓商博思有限公司 玻璃中螢光體顏色轉換元件的製造方法

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JPH084194B2 (ja) * 1987-06-23 1996-01-17 株式会社住友金属セラミックス セラミックス多層回路基板の製造方法
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