WO2016195061A1 - 保護テープ、及びこれを用いた半導体装置の製造方法 - Google Patents

保護テープ、及びこれを用いた半導体装置の製造方法 Download PDF

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Publication number
WO2016195061A1
WO2016195061A1 PCT/JP2016/066547 JP2016066547W WO2016195061A1 WO 2016195061 A1 WO2016195061 A1 WO 2016195061A1 JP 2016066547 W JP2016066547 W JP 2016066547W WO 2016195061 A1 WO2016195061 A1 WO 2016195061A1
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WIPO (PCT)
Prior art keywords
thermoplastic resin
protective tape
resin layer
layer
formula
Prior art date
Application number
PCT/JP2016/066547
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English (en)
French (fr)
Inventor
浩伸 森山
秀和 八木
朋之 石松
勝之 海老沢
慶司 本庄
金子　純一
Original Assignee
デクセリアルズ株式会社
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Publication date
Application filed by デクセリアルズ株式会社 filed Critical デクセリアルズ株式会社
Priority to CN201680028797.3A priority Critical patent/CN107960096B/zh
Priority to KR1020177030193A priority patent/KR102031529B1/ko
Priority to US15/574,729 priority patent/US10312125B2/en
Publication of WO2016195061A1 publication Critical patent/WO2016195061A1/ja

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/02—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions
    • B32B3/08—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions characterised by added members at particular parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/10—Removing layers, or parts of layers, mechanically or chemically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/08—Interconnection of layers by mechanical means
    • B32B7/09—Interconnection of layers by mechanical means by stitching, needling or sewing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/005—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C09J163/04—Epoxynovolacs
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/245—Vinyl resins, e.g. polyvinyl chloride [PVC]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/255—Polyesters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/562—Protection against mechanical damage
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/11—Manufacturing methods
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/51—Elastic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/732—Dimensional properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2405/00—Adhesive articles, e.g. adhesive tapes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/14—Semiconductor wafers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/16—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer
    • C09J2301/162—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer the carrier being a laminate constituted by plastic layers only
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/414—Additional features of adhesives in the form of films or foils characterized by the presence of essential components presence of a copolymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2423/00—Presence of polyolefin
    • C09J2423/04—Presence of homo or copolymers of ethene
    • C09J2423/046—Presence of homo or copolymers of ethene in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2431/00—Presence of polyvinyl acetate
    • C09J2431/006—Presence of polyvinyl acetate in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2467/00—Presence of polyester
    • C09J2467/006—Presence of polyester in the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H01L2221/68336—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding involving stretching of the auxiliary support post dicing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/6834—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
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Definitions

  • the present invention relates to a protective tape used for manufacturing a semiconductor device and a method for manufacturing a semiconductor device using the same.
  • the post-process of the semiconductor manufacturing process for flip chip mounting is performed as follows. First, an adhesive sheet or tape called Back Grind Tape is attached to the bump forming surface of the wafer on which a plurality of bumps (projection electrodes) are formed for the purpose of protecting the bumps. The opposite surface is ground to a predetermined thickness (see, for example, Patent Documents 1 to 3). After grinding, the back grind tape is peeled off, and the wafer is diced into individual semiconductor chips. Next, the semiconductor chip is flip-chip mounted on another semiconductor chip or a substrate. Further, the underfill is cured to reinforce the semiconductor chip.
  • Patent Document 1 a back grind tape using a laminate of a thermosetting resin layer and a thermoplastic resin layer is used, and only the thermosetting resin layer is left on the bump forming surface of the wafer and other layers are removed. How to do is being studied.
  • the wafer In the conventional back grind tape, the wafer is greatly warped after being back grinded and cannot be handled in a later process. Also, in the conventional back grind tape, when only the thermosetting resin layer is left on the wafer and the other layers are removed, the resin remains on the bumps. It will decrease.
  • the present invention has been proposed in view of such a conventional situation, and it is possible to improve the solderability and reduce the amount of wafer warpage, and a semiconductor device using the same.
  • a manufacturing method is provided.
  • the inventors of the present invention have a protective tape having an adhesive layer, a first thermoplastic resin layer, a second thermoplastic resin layer, and a base film layer in this order, which will be described later. It has been found that the above-mentioned problems can be solved by satisfying the conditions of the equations (1) to (3).
  • the protective tape according to the present invention has an adhesive layer, a first thermoplastic resin layer, a second thermoplastic resin layer, and a base film layer in this order. Satisfy the condition (3).
  • Ga is the storage shear modulus of the first thermoplastic resin layer at the application temperature for applying the protective tape
  • Gb is the second thermoplastic resin layer at the application temperature for applying the protective tape.
  • Ta is the thickness of the first thermoplastic resin layer
  • Tb is the thickness of the second thermoplastic resin layer, in formula (3), Ga and Gb. Is synonymous with Ga and Gb in formula (1), and Ta and Tb are synonymous with Ta and Tb in formula (2).
  • the method for manufacturing a semiconductor device includes a protective tape applying step of applying a protective tape having an adhesive layer to a wafer surface on which bumps are formed, and a grinding process is performed on the opposite surface of the wafer attached with the protective tape.
  • a grinding treatment step, and a protective tape peeling step for peeling off the protective tape leaving the adhesive layer and removing the other layers, the protective tape comprising an adhesive layer, a first thermoplastic resin layer, The second thermoplastic resin layer and the base film layer are provided in this order and satisfy the conditions of the above formulas (1) to (3).
  • the semiconductor device according to the present invention is obtained by the above-described method for manufacturing a semiconductor device.
  • the protective tape has an adhesive layer, a first thermoplastic resin layer, a second thermoplastic resin layer, and a base film layer in this order, and the formulas (1) to (3)
  • a layer other than the adhesive layer base film layer, first thermoplastic resin layer, and second layer
  • the elastic modulus correction value obtained by correcting the elastic modulus of the first thermoplastic resin layer and the second thermoplastic resin layer with the thickness is adjusted to an appropriate range. Therefore, the amount of warpage of the wafer after back grinding can be reduced.
  • FIG. 1 is a cross-sectional view schematically showing a protective tape.
  • FIG. 2 is a cross-sectional view showing an outline of the protective tape attaching step.
  • FIG. 3 is a cross-sectional view showing an outline of a grinding process.
  • FIG. 4 is a cross-sectional view showing an outline of the adhesive tape attaching step.
  • FIG. 5 is a cross-sectional view schematically showing the protective tape peeling step.
  • FIG. 6 is a cross-sectional view schematically showing the curing process.
  • FIG. 7 is a cross-sectional view schematically showing the dicing process.
  • FIG. 8 is a cross-sectional view showing an outline of the expanding process.
  • FIG. 9 is a cross-sectional view schematically showing the pickup process.
  • FIG. 10 is a cross-sectional view schematically showing the mounting process.
  • the protective tape according to the present embodiment has an adhesive layer, a first thermoplastic resin layer, a second thermoplastic resin layer, and a base film layer in this order. Satisfy the condition (3).
  • Ga is the storage shear modulus of the first thermoplastic resin layer at the application temperature for applying the protective tape
  • Gb is the second thermoplastic resin layer at the application temperature for applying the protective tape.
  • Ta is the thickness of the first thermoplastic resin layer
  • Tb is the thickness of the second thermoplastic resin layer, in formula (3), Ga and Gb. Is synonymous with Ga and Gb in formula (1), and Ta and Tb are synonymous with Ta and Tb in formula (2).
  • Protective tape satisfies the condition of formula (1). That is, the storage shear elastic modulus (Ga) of the first thermoplastic resin layer at the application temperature for applying the protective tape is the storage shear elastic modulus (Gb) of the second thermoplastic resin layer at the application temperature for applying the protective tape. Bigger than.
  • the surface layer of the adhesive layer that is, the first thermoplastic resin layer is harder than the second thermoplastic resin layer, so that the first thermoplastic resin layer is deformed. At this time, the second thermoplastic resin layer is unlikely to inhibit the deformation of the first thermoplastic resin layer.
  • the protective tape satisfies the condition of formula (2). That is, the thickness (Tb) of the second thermoplastic resin layer is larger than the thickness (Ta) of the first thermoplastic resin layer.
  • the protective tape satisfies the condition of formula (3). That is, the elastic modulus correction value obtained by correcting the elastic modulus of the first thermoplastic resin layer and the elastic modulus of the second thermoplastic resin layer with the thicknesses of these layers is 1.4E + 06 Pa or less. By satisfying the condition of Expression (3), the elastic modulus correction value is adjusted to an appropriate range, so that the amount of warpage of the wafer after back grinding can be reduced.
  • the value on the left side of Equation (3) that is, the lower limit value of the elastic modulus correction value is not particularly limited, but is preferably 1.0E + 05 Pa or more.
  • the protective tape has the adhesive layer, the first thermoplastic resin layer, the second thermoplastic resin layer, and the base film layer in this order, and the formulas (1) to (3)
  • a layer other than the adhesive layer base film layer, first thermoplastic resin layer, and second layer
  • the adhesive layer it is difficult for the adhesive layer to remain on the bumps, so that the solderability can be improved. Further, the amount of warpage of the wafer after back grinding can be reduced.
  • the protective tape preferably satisfies the condition of the formula (1A) in addition to the conditions of the formulas (1) to (3).
  • the storage shear elastic modulus (Ga) of the first thermoplastic resin layer at the application temperature for applying the protective tape is the largest, and the storage shear elastic modulus of the second thermoplastic resin layer at the application temperature for applying the protective tape. It is preferable that (Gb) is the second largest and the storage shear modulus (Gn) of the adhesive layer at the application temperature at which the protective tape is applied is the third largest.
  • the adhesive layer, the second thermoplastic resin layer, and the first thermoplastic resin layer are hardened in this order, so that the adhesive layer has a thickness higher than that of the first thermoplastic resin layer. Deformation and flow are very good. As a result, when the protective tape is applied to the wafer, adhesion of the adhesive layer onto the bumps of the wafer can be more effectively suppressed, and the adhesive layer is less likely to remain on the bumps. Can be made better.
  • the protective tape preferably further satisfies the condition of the formula (2A) in addition to the conditions of the formulas (1) to (3).
  • Tn ⁇ Ta ⁇ Tb
  • Tn is the thickness of the adhesive layer
  • Ta and Tb are synonymous with Ta and Tb in formula (2).
  • the thickness (Tb) of the second thermoplastic resin layer is the largest
  • the thickness (Ta) of the first thermoplastic resin layer is the second largest
  • the thickness (Tn) of the adhesive layer is the third largest. It is preferable.
  • the protective tape preferably further satisfies the condition of the following formula (4).
  • the protective tape has a storage shear elastic modulus (Gn) of the adhesive layer at the application temperature at which the protective tape is applied, and a storage shear elastic modulus (Ga) of the first thermoplastic resin layer at the application temperature at which the protective tape is applied.
  • Gn / Ga) is preferably 0.01 or less.
  • the lower limit of the value (Gn / Ga) on the left side of the formula (4) is preferably 1.0E + 03 or more.
  • FIG. 1 is a cross-sectional view schematically showing a protective tape.
  • the protective tape 10 is called a back grind tape and protects the wafer from scratches, cracks, contamination, and the like in the grinding process.
  • the protective tape 10 has an adhesive layer 11, a first thermoplastic resin layer 12, a second base film layer 13, and a base film layer 14 laminated in this order. .
  • the storage shear modulus (Gn) at 60 ° C. of the adhesive layer 11 is preferably 1.0E + 01 Pa to 5.0E + 04 Pa, and more preferably 1.0E + 02 Pa to 3.5E + 03 Pa.
  • the storage shear modulus of the adhesive layer 11 is preferably 1.0E + 01 Pa or more, it is possible to prevent the adhesive layer 11 from adhering to the bump tip while the bump penetrates the adhesive and covering the tip of the bump. Can do.
  • it can suppress that resin of the adhesive bond layer 11 flows, when the protective tape 10 is affixed on a wafer.
  • the bumps can penetrate the adhesive layer 11 more easily, and conduction can be improved.
  • the resin composition of the adhesive layer 11 is not particularly limited.
  • a thermosetting type such as a thermal anion curable type, a thermal cation curable type, a thermal radical curable type, a photo cation curable type, a photo radical curable type or the like. It is possible to use a mold, or a thermo / photo-curing type which is used in combination to substantially the same.
  • thermosetting adhesive composition containing a film-forming resin, an epoxy resin, a curing agent, and a curing aid as the adhesive layer 11 will be described.
  • the film forming resin various resins such as phenoxy resin, epoxy resin, modified epoxy resin, and urethane resin can be used. These film forming resins may be used alone or in combination of two or more. Among these, phenoxy resin is preferably used from the viewpoint of film formation state, connection reliability, and the like.
  • the epoxy resin examples include dicyclopentadiene type epoxy resin, glycidyl ether type epoxy resin, glycidyl amine type epoxy resin, bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, spiro ring type epoxy resin, Naphthalene type epoxy resin, biphenyl type epoxy resin, terpene type epoxy resin, tetrabromobisphenol A type epoxy resin, cresol novolac type epoxy resin, phenol novolac type epoxy resin, ⁇ -naphthol novolak type epoxy resin, brominated phenol novolak type epoxy resin And so on.
  • These epoxy resins may be used alone or in combination of two or more.
  • a dicyclopentadiene type epoxy resin is preferably used from the viewpoint of high adhesion and heat resistance.
  • the curing agent examples include novolak-type phenol resins, aliphatic amines, aromatic amines, acid anhydrides, and the like. These curing agents may be used alone or in combination of two or more. May be. Among these, a novolak type phenol resin is preferably used from the viewpoint of the crosslink density of the cured product.
  • Curing aids include imidazoles such as 2-methylimidazole, 2-ethylimidazole, 2-ethyl-4-methylimidazole, 1,8-diazabicyclo (5,4,0) undecene-7 salt (DBU salt) ), Tertiary amines such as 2- (dimethylaminomethyl) phenol, phosphines such as triphenylphosphine, and metal compounds such as tin octylate. Of these, 2-ethyl-4-methylimidazole is preferred.
  • an inorganic filler such as silane coupling agent, an elastomer such as acrylic rubber, and a pigment such as carbon black may be appropriately blended according to the purpose.
  • Examples of the inorganic filler include silica, aluminum nitride, and alumina.
  • An inorganic filler may be used individually by 1 type, or may use 2 or more types together.
  • the inorganic filler is preferably surface-treated, and is preferably a hydrophilic inorganic filler.
  • Examples of the hydrophilic inorganic filler include those obtained by surface-treating an inorganic filler with a hydrophilic surface treatment agent.
  • Examples of hydrophilic surface treatment agents include silane coupling agents, titanate coupling agents, aluminum coupling agents, zircoaluminate coupling agents, Al 2 O 3 , TiO 2 , ZrO 2 , silicone, and stearic acid. Aluminum etc. are mentioned, A silane coupling agent is preferable.
  • the thickness of the adhesive layer 11 is preferably 10 to 80% of the height of the bump formed on the wafer, and more preferably 10 to 60%. By making the height 10% or more of the bump height, it becomes easier to obtain the effect of reinforcing the bump. Moreover, the adhesive layer 11 can penetrate a bump more easily by setting it as 80% or less of the height of a bump. For example, when the height of the bump formed on the wafer is 100 to 200 ⁇ m, the thickness of the adhesive layer 11 is preferably 5 to 100 ⁇ m, and more preferably 5 to 30 ⁇ m.
  • the first thermoplastic resin layer 12 is made of, for example, ethylene vinyl acetate copolymer (EVA), polyethylene, polypropylene, polyamide, polyacetal, polyethylene terephthalate, polybutylene terephthalate, fluororesin, polyphenylene sulfide, polystyrene, ABS. It is a layer made of a resin such as resin, acrylic resin, polycarbonate, polyurethane, polyvinyl chloride, polyphenylene oxide. The said resin may be used individually by 1 type, and may use 2 or more types together.
  • EVA ethylene vinyl acetate copolymer
  • polyethylene polypropylene
  • polyamide polyacetal
  • polyethylene terephthalate polybutylene terephthalate
  • fluororesin polyphenylene sulfide
  • polystyrene ABS
  • It is a layer made of a resin such as resin, acrylic resin, polycarbonate, polyurethane, polyvinyl chloride, polyphenylene
  • the storage shear modulus (Ga) at 60 ° C. of the first thermoplastic resin layer 12 is preferably 1.0E + 06 Pa to 1.0E + 09 Pa, and more preferably 1.0E + 06 Pa to 1.0E + 07 Pa.
  • the thickness (Ta) of the first thermoplastic resin layer 12 is in a range satisfying the above-described formula (1), preferably 5 to 300 ⁇ m, and more preferably 5 to 200 ⁇ m.
  • the second thermoplastic resin layer 13 is a layer made of the same resin as the first thermoplastic resin layer 12.
  • the resin constituting the second thermoplastic resin layer may be used alone or in combination of two or more.
  • the storage shear modulus (Gb) at 60 ° C. of the second thermoplastic resin layer 13 is preferably 1.0E + 04 Pa to 2.0E + 06 Pa, and preferably 1.0E + 04 Pa to 8.0E + 05 Pa.
  • the thickness (Tb) of the second thermoplastic resin layer 13 is in a range satisfying the above-described formula (1), and is preferably 100 to 700 ⁇ m.
  • Base film layer 14 As the substrate film layer 14, a porous substrate made of a plastic film such as polyethylene terephthalate, polyethylene, polypropylene, or polyester, paper, cloth, nonwoven fabric, or the like can be used.
  • a plastic film such as polyethylene terephthalate, polyethylene, polypropylene, or polyester, paper, cloth, nonwoven fabric, or the like.
  • the thickness of the base film layer 14 is preferably 25 to 200 ⁇ m, and more preferably 50 to 100 ⁇ m.
  • the protective tape is not limited to the above-described configuration, and other layers may be formed on the surface of each layer or between adjacent layers.
  • the protective tape may have a third thermoplastic resin layer in addition to the first thermoplastic resin layer and the second thermoplastic resin layer.
  • the protective tape further includes a third thermoplastic resin layer different from the first thermoplastic resin layer and the second thermoplastic resin layer between the adhesive layer and the first thermoplastic resin layer. You may do it.
  • Gc storage shear modulus
  • Tc thickness of the third thermoplastic resin layer at the application temperature at which the protective tape is applied satisfy the conditions of the following formulas (1A) and (2A).
  • the protective tape according to the present embodiment includes, for example, a base film layer and a thermoplastic resin layer in which a base film layer, a first thermoplastic resin layer, and a second thermoplastic resin layer are formed in this order. It can be obtained by laminating a laminate and an adhesive layer. The laminate of the base film layer and the thermoplastic resin layer can be obtained by extruding and molding a thermoplastic resin into the base film layer.
  • the adhesive layer can be obtained, for example, by preparing the above-mentioned thermosetting adhesive composition, applying it to the peeled substrate using a bar coater, and drying it.
  • a manufacturing method of a semiconductor device includes a protective tape attaching step of attaching a protective tape having an adhesive layer to a wafer surface on which bumps are formed, and a grinding process of grinding a surface opposite to the protective tape attaching surface
  • the protective tape is a protective tape described above, which includes a process and a protective tape peeling process for peeling off the protective tape while leaving the adhesive layer and removing other layers.
  • the curing process for curing the adhesive layer may be performed before any of the grinding process, the adhesive tape application process, and the dicing process.
  • a semiconductor device manufacturing method shown as a specific example uses the protective tape mentioned above, and a hardening process is performed between an adhesive tape sticking process and a dicing process process. That is, a semiconductor device manufacturing method shown as a specific example includes a protective tape attaching step (A) for attaching a protective tape having an adhesive layer, a grinding step (B), an adhesive tape attaching step (C), and a protective tape. It has a peeling process (D), a curing process (E) for curing the adhesive layer, a dicing process (F), an expanding process (G), a pickup process (H), and a mounting process (I). .
  • FIG. 2 is a cross-sectional view showing an outline of the protective tape attaching step.
  • the protective tape 10 is attached to the surface of the wafer 21 on which the bumps 22 are formed.
  • the application temperature for applying the protective tape 10 is preferably 25 ° C. to 100 ° C., more preferably 40 ° C. to 80 ° C., from the viewpoints of reducing voids, improving wafer adhesion, and preventing wafer warpage after wafer grinding.
  • the wafer 21 has an integrated circuit formed on a semiconductor surface such as silicon and bumps 22 for connection.
  • the thickness of the wafer 21 is not particularly limited, but is preferably 200 to 1000 ⁇ m.
  • the bump 22 is not particularly limited, and examples thereof include a low melting point bump or a high melting point bump made of solder, a tin bump, a silver-tin bump, a silver-tin-copper bump, a gold bump, and a copper bump.
  • the height of the bump 22 is preferably 10 to 200 ⁇ m, for example.
  • the protective tape 10 is bonded in a state where the formation surface of the bump 22 and the adhesive layer 11 are in contact with each other. As shown in FIG. 2, the bump 22 penetrates the adhesive layer 11 and is embedded in the first thermoplastic resin layer 12. Further, the surface of the first thermoplastic resin layer 12 in contact with the second thermoplastic resin 13 is deformed so as to follow the shape of the bump 22. Further, the surface of the second thermoplastic resin layer 13 that contacts the first thermoplastic resin layer 12 is deformed so as to follow the deformation of the first thermoplastic resin layer 12.
  • FIG. 3 is a cross-sectional view showing an outline of a grinding process.
  • the opposite surface of the wafer 21 to which the protective tape 10 is attached that is, the surface opposite to the surface on which the bumps 22 are formed is fixed to a grinding apparatus for polishing. Polishing is usually performed until the thickness of the wafer 21 reaches 50 to 600 ⁇ m.
  • the bumps 22 are reinforced by the adhesive layer 11, so that the wafer 21 may be polished to a thickness of 50 ⁇ m or less.
  • FIG. 4 is a cross-sectional view showing an outline of the adhesive tape attaching step.
  • the adhesive tape 30 is attached to the grinding surface.
  • the adhesive tape 30 is called a dicing tape, and is a tape for protecting and fixing the wafer 21 in the dicing step (F) and holding it until the pickup step (H).
  • the adhesive tape 30 is not particularly limited, and a known one can be used.
  • the pressure-sensitive adhesive tape 30 includes a pressure-sensitive adhesive layer 31 and a base film layer 32.
  • the pressure-sensitive adhesive layer 31 include polyethylene-based, acrylic-based, rubber-based, and urethane-based pressure-sensitive adhesives.
  • the base film layer 32 a plastic base film made of polyethylene terephthalate, polyethylene, polypropylene, polyester, or a porous base material made of paper, cloth, nonwoven fabric, or the like can be used.
  • it does not specifically limit as an adhesive tape sticking apparatus and conditions A well-known apparatus and conditions can be used.
  • FIG. 5 is a cross-sectional view schematically showing the protective tape peeling step.
  • the protective tape peeling step the protective tape 10 is peeled off leaving the adhesive layer 11 and the other layers are removed. That is, the first thermoplastic resin layer 12, the second thermoplastic resin layer 13, and the base film layer 14 are removed, and only the adhesive layer 11 remains on the wafer 21.
  • FIG. 6 is a cross-sectional view schematically showing the curing process.
  • the adhesive layer 11 is cured.
  • a curing method and curing conditions a known method for curing a thermosetting adhesive can be used.
  • the curing conditions are preferably 100 to 200 ° C. for 1 hour or longer.
  • FIG. 7 is a cross-sectional view schematically showing the dicing process.
  • the wafer 21 to which the adhesive tape 30 is attached is diced to obtain individual semiconductor chips.
  • the dicing method is not particularly limited, and a known method such as cutting the wafer 21 with a dicing saw can be used.
  • FIG. 8 is a cross-sectional view showing an outline of the expanding process.
  • the adhesive tape 30 to which a plurality of divided semiconductor chips are attached is elongated in the horizontal direction to widen the intervals between the individual semiconductor chips.
  • FIG. 9 is a cross-sectional view schematically showing the pickup process.
  • the semiconductor chip adhered and fixed on the adhesive tape 30 is pushed up from the lower surface of the adhesive tape 30 to be peeled off, and the peeled semiconductor chip is adsorbed by a collet.
  • the picked-up semiconductor chip is stored in a chip tray or conveyed to a chip mounting nozzle of a flip chip bonder.
  • FIG. 10 is a cross-sectional view schematically showing the mounting process.
  • the semiconductor chip and the circuit board are connected using a circuit connection material such as NCF (Non Conductive Film).
  • NCF Non Conductive Film
  • plastic substrates such as a polyimide substrate and a glass epoxy substrate, a ceramic substrate, etc. can be used.
  • connection method the well-known method using a heating bonder, a reflow furnace, etc. can be used.
  • solderability can be improved, and the amount of warpage of the wafer after back grinding can be reduced.
  • the adhesive layer on the wafer surface on which the bumps are formed before the dicing treatment process is cured and the bumps are reinforced, damage to the bumps can be reduced in subsequent processes such as dicing, pickup, and mounting.
  • a semiconductor device having excellent connection reliability can be obtained with a high yield.
  • a semiconductor device obtained by a method for manufacturing a semiconductor device includes a semiconductor chip having a bump and an adhesive layer formed on the bump forming surface, and a circuit board having an electrode facing the bump, and the bump forming surface of the semiconductor chip Since the adhesive layer 11 is formed, excellent connection reliability can be obtained.
  • a protective tape was prepared by laminating an adhesive layer, a first thermoplastic resin layer, a second thermoplastic resin layer, and a base film layer.
  • protective tape protective tape application process (A), grinding process (B), adhesive tape application process (C), protective tape peeling process (D), curing process (E), and dicing process (F), the expanding process (G), the pick-up process (H), and the mounting process (I) were sequentially performed to manufacture a semiconductor device. Then, the solderability of the semiconductor device and the amount of wafer warpage were evaluated.
  • the present invention is not limited to these examples.
  • the storage shear modulus at 60 ° C. of the adhesive layer and the thermoplastic resin layer was calculated using a viscoelasticity measuring device.
  • the measurement conditions were set to a measurement temperature range of 0 to 120 ° C., a heating rate of 5 ° C./min, a frequency of 1 Hz, and a strain of 0.1%.
  • thermoplastic resin layer (film 1) A first thermoplastic resin layer (any one of the following thermoplastic resin layers A1 to A3) and / or a second thermoplastic resin layer (the following thermoplastic resin layers B1 to The thermoplastic resin was extruded and melt-molded so that any of B3) was formed in this order.
  • Thermoplastic resin layer A1 ethylene / vinyl acetate copolymer (VF120T, manufactured by Ube Maruzen Polyethylene Co., Ltd.), storage shear modulus at 60 ° C .: 3.1E + 06 Pa
  • Thermoplastic resin layer A2 (0540F, manufactured by Ube Maruzen Polyethylene Co., Ltd.), storage shear modulus at 60 ° C .: 7.1E + 06 Pa
  • Thermoplastic resin layer A3 ethylene / vinyl acetate copolymer (V319, manufactured by Ube Maruzen Polyethylene Co., Ltd.), storage shear modulus at 60 ° C .: 1.1E + 06 Pa
  • Thermoplastic resin layer B1 ethylene / vinyl acetate copolymer (EV40LX, Mitsui / DuPont Polychemical Co., Ltd.), storage shear modulus at 60 ° C .: 4.9E + 05 Pa
  • Thermoplastic resin layer B2 ethylene / vinyl acetate copolymer (EV45LX, Mitsui / DuPont Polychemical Co., Ltd.), storage shear modulus at 60 ° C .: 4.2E + 04 Pa
  • Thermoplastic resin layer B3 ethylene / vinyl acetate copolymer (EV170, manufactured by Mitsui DuPont Polychemical Co., Ltd.), storage shear modulus at 60 ° C .: 6.2E + 05 Pa
  • Adhesive layer No. 1 is an adhesive composition prepared by blending 13.0 parts by mass of a film-forming resin, 54.8 parts by mass of an epoxy resin, 32.4 parts by mass of a curing agent, and 0.3 parts by mass of a curing aid. Then, this was applied to PET (Polyethylene terephthalate) peel-treated so as to have a thickness after drying of 30 ⁇ m using a bar coater and dried in an oven. Adhesive layer No. The storage shear modulus of 1 at 60 ° C. was 3.3E + 03 Pa.
  • Adhesive layer No. 2 comprises 13.0 parts by mass of film-forming resin, 54.8 parts by mass of epoxy resin, 32.4 parts by mass of curing agent, 0.3 part by mass of curing aid, and 25.0 parts by mass of filler. Then, an adhesive composition was prepared, and this was prepared by applying it to PET, which was peel-treated so that the thickness after drying was 30 ⁇ m, using a bar coater and drying it in an oven. Adhesive layer No. The storage shear modulus of 2 at 60 ° C. was 3.6E + 04 Pa.
  • Adhesive layer No. 3 is an adhesive composition prepared by blending 2.0 parts by weight of a film-forming resin, 54.8 parts by weight of an epoxy resin, 32.4 parts by weight of a curing agent, and 0.3 parts by weight of a curing aid. Then, this was applied to PET that had been subjected to a peeling treatment so that the thickness after drying was 30 ⁇ m using a bar coater, and dried in an oven. Adhesive layer No. The storage shear modulus of No. 3 at 60 ° C. was 3.6E + 01 Pa.
  • Phenoxy resin Phenoxy resin (PKHH, manufactured by Union Carbide Corp.)
  • Epoxy resin dicyclopentadiene type epoxy resin (HP7200H, manufactured by DIC Corporation)
  • Curing agent Novolac type phenolic resin (TD-2093, manufactured by DIC Corporation)
  • Curing aid 2-ethyl-4-methylimidazole (2E4MZ)
  • Filler Silica (Aerosil RY200, manufactured by Nippon Aerosil Co., Ltd.)
  • thermoplastic resin layer (film 1) and the said adhesive bond layer (film 2) were laminated, and the protective tape was produced.
  • film 1 a film composed of a PET base material (75 ⁇ m), a thermoplastic resin layer A1 (50 ⁇ m), and a thermoplastic resin layer B1 (450 ⁇ m) was used.
  • adhesive layer No. 1 (20 ⁇ m) was used.
  • the film 1 is composed of a PET base material (75 ⁇ m), a thermoplastic resin layer A2 (50 ⁇ m), and a thermoplastic resin layer B1 (450 ⁇ m).
  • a protective tape was produced in the same manner as in Example 1 except that 2 (20 ⁇ m) was used.
  • the film 1 is composed of a PET substrate (75 ⁇ m), a thermoplastic resin layer A3 (50 ⁇ m), and a thermoplastic resin layer B1 (450 ⁇ m).
  • a protective tape was produced in the same manner as in Example 1 except that 3 (20 ⁇ m) was used.
  • the film 1 is composed of a PET base material (75 ⁇ m), a thermoplastic resin layer A1 (50 ⁇ m), and a thermoplastic resin layer B2 (450 ⁇ m).
  • a protective tape was produced in the same manner as in Example 1 except that 1 (20 ⁇ m) was used.
  • the film 1 is composed of a PET substrate (75 ⁇ m), a thermoplastic resin layer A1 (50 ⁇ m), and a thermoplastic resin layer B3 (450 ⁇ m).
  • a protective tape was produced in the same manner as in Example 1 except that 1 (20 ⁇ m) was used.
  • the film 1 is composed of a PET substrate (75 ⁇ m), a thermoplastic resin layer A1 (20 ⁇ m), and a thermoplastic resin layer B1 (450 ⁇ m).
  • a protective tape was produced in the same manner as in Example 1 except that 1 (20 ⁇ m) was used.
  • the film 1 is composed of a PET base material (75 ⁇ m), a thermoplastic resin layer A1 (200 ⁇ m), and a thermoplastic resin layer B1 (450 ⁇ m).
  • a protective tape was produced in the same manner as in Example 1 except that 1 (20 ⁇ m) was used.
  • the film 1 is composed of a PET substrate (75 ⁇ m), a thermoplastic resin layer A1 (50 ⁇ m), and a thermoplastic resin layer B1 (300 ⁇ m).
  • a protective tape was produced in the same manner as in Example 1 except that 1 (20 ⁇ m) was used.
  • the film 1 is composed of a PET base material (75 ⁇ m), a thermoplastic resin layer A1 (50 ⁇ m), and a thermoplastic resin layer B1 (600 ⁇ m).
  • a protective tape was produced in the same manner as in Example 1 except that 1 (20 ⁇ m) was used.
  • the film 1 is composed of a PET substrate (50 ⁇ m), a thermoplastic resin layer A1 (50 ⁇ m), and a thermoplastic resin layer B1 (450 ⁇ m).
  • a protective tape was produced in the same manner as in Example 1 except that 1 (20 ⁇ m) was used.
  • the film 1 is composed of a PET substrate (100 ⁇ m), a thermoplastic resin layer A1 (50 ⁇ m), and a thermoplastic resin layer B1 (450 ⁇ m).
  • a protective tape was produced in the same manner as in Example 1 except that 1 (20 ⁇ m) was used.
  • the film 1 is composed of a PET base material (75 ⁇ m), a thermoplastic resin layer A1 (5 ⁇ m), and a thermoplastic resin layer B1 (495 ⁇ m).
  • a protective tape was produced in the same manner as in Example 1 except that 1 (20 ⁇ m) was used.
  • the film 1 is composed of a PET base material (75 ⁇ m), a thermoplastic resin layer A1 (50 ⁇ m), and a thermoplastic resin layer B1 (450 ⁇ m).
  • a protective tape was produced in the same manner as in Example 1 except that 2 (20 ⁇ m) was used.
  • the film 1 is composed of a PET base material (75 ⁇ m), a thermoplastic resin layer A1 (250 ⁇ m), and a thermoplastic resin layer B1 (450 ⁇ m).
  • a protective tape was produced in the same manner as in Example 1 except that 1 (20 ⁇ m) was used.
  • the film 1 is made of a PET base material (75 ⁇ m) and a thermoplastic resin layer B1 (500 ⁇ m).
  • a protective tape was produced in the same manner as in Example 1 except that 1 (20 ⁇ m) was used.
  • the film 1 is composed of a PET base material (75 ⁇ m) and a thermoplastic resin layer A1 (500 ⁇ m).
  • a protective tape was produced in the same manner as in Example 1 except that 1 (20 ⁇ m) was used.
  • a back grind process was performed to a thickness of the wafer to 300 ⁇ m with a grinder (product name: DFG8560, manufactured by DISCO Corporation). Thereafter, the protective tape was peeled off leaving the adhesive layer, the other layers (PET base material and thermoplastic resin layer) were removed, and the adhesive layer on the wafer was cured in an oven at 130 ° C. for 2 hours. Then, the wafer was diced and separated into chips, and then mounted on a substrate (a gold electrode with flux) by a mounter, and the chip and the substrate were soldered in a reflow furnace at a maximum of 260 ° C.
  • a grinder product name: DFG8560, manufactured by DISCO Corporation
  • an adhesive layer (adhesive layers No. 1 to No. 3), a first thermoplastic resin layer (thermoplastic resin layers A1 to A3), and a second thermoplastic resin
  • a protective tape having layers (thermoplastic resin layers B1 to B3) and a base film layer (PET base material) in this order and satisfying the conditions of the above formulas (1) to (3) is used, solder It was found that the bondability was good and the amount of warpage of the wafer was small.

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  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
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  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical Kinetics & Catalysis (AREA)
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  • Mechanical Treatment Of Semiconductor (AREA)
  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)
  • Dicing (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

はんだ接合性を良好にし、ウエハの反り量を小さくできる保護テープを提供する。　保護テープは、接着剤層と、第１の熱可塑性樹脂層と、第２の熱可塑性樹脂層と、基材フィルム層とをこの順に有し、下記式（１）～（３）の条件を満たす。 （１）Ｇａ＞Ｇｂ （２）Ｔａ＜Ｔｂ （３）（Ｇａ×Ｔａ＋Ｇｂ×Ｔｂ）／（Ｔａ＋Ｔｂ）≦１．４Ｅ＋０６Ｐａ （式（１）中、Ｇａは保護テープを貼付する貼付温度における第１の熱可塑性樹脂層の貯蔵剪断弾性率であり、Ｇｂは保護テープを貼付する貼付温度における第２の熱可塑性樹脂層の貯蔵剪断弾性率である。式（２）中、Ｔａは第１の熱可塑性樹脂層の厚みであり、Ｔｂは第２の熱可塑性樹脂層の厚みである。式（３）中、Ｇａ及びＧｂは式（１）中のＧａ及びＧｂと同義であり、Ｔａ及びＴｂは式（２）中のＴａ及びＴｂと同義である。）

Description

保護テープ、及びこれを用いた半導体装置の製造方法
　本発明は、半導体装置の製造に使用される保護テープ、及びこれを用いた半導体装置の製造方法に関する。本出願は、日本国において２０１５年６月４日に出願された日本出願番号特願２０１５－１１４３３８を基礎として優先権を主張するものであり、この出願は参照されることにより、本出願に援用される。
　従来、フリップチップ実装用の半導体製造プロセスの後工程は、次のように行われている。先ず、複数のバンプ（突起電極）が形成されたウエハのバンプ形成面に、バンプの保護目的でバックグラインドテープ（Back Grind Tape）と呼ばれる粘着シート又はテープを貼り合わせ、この状態でバンプ形成面の反対面を所定の厚さにまで研削する（例えば、特許文献１～３参照。）。研削終了後、バックグラインドテープを剥離し、ウエハをダイシングして個々の半導体チップとする。次いで、半導体チップを、他の半導体チップ又は基板上にフリップチップ実装する。また、アンダーフィルを硬化して半導体チップを補強する。
　例えば、特許文献１では、バックグラインドテープとして熱硬化性樹脂層と熱可塑性樹脂層とを積層したものを使用し、熱硬化性樹脂層のみをウエハのバンプ形成面に残して他の層を除去する方法が検討されている。
特開２００５－２８７３４号公報 国際公開第２００６／１１８０３３号 国際公開第２０１２／０２６４３１号
　従来のバックグラインドテープでは、ウエハをバックグラインドした後にウエハに大きな反りが生じてしまい、後工程でハンドリングできなくなってしまう。また、従来のバックグラインドテープでは、熱硬化性樹脂層のみをウエハに残して他の層を除去した際、バンプ上に樹脂が残ってしまい、例えばリフロー時においてはんだ接合を阻害し、接続性を低下させてしまう。
　本発明は、このような従来の実情に鑑みて提案されたものであり、はんだ接合性を良好にするとともに、ウエハの反り量を低減することができる保護テープ、及びこれを用いた半導体装置の製造方法を提供する。
　本願発明者らは、鋭意検討の結果、保護テープが、接着剤層と、第１の熱可塑性樹脂層と、第２の熱可塑性樹脂層と、基材フィルム層とをこの順に有し、後述する式（１）～（３）の条件を満たすことにより、上記課題を解決できることを見出した。
　すなわち、本発明に係る保護テープは、接着剤層と、第１の熱可塑性樹脂層と、第２の熱可塑性樹脂層と、基材フィルム層とをこの順に有し、下記式（１）～（３）の条件を満たす。
（１）Ｇａ＞Ｇｂ
（２）Ｔａ＜Ｔｂ
（３）（Ｇａ×Ｔａ＋Ｇｂ×Ｔｂ）／（Ｔａ＋Ｔｂ）≦１．４Ｅ＋０６Ｐａ
（式（１）中、Ｇａは保護テープを貼付する貼付温度における第１の熱可塑性樹脂層の貯蔵剪断弾性率であり、Ｇｂは保護テープを貼付する貼付温度における第２の熱可塑性樹脂層の貯蔵剪断弾性率である。式（２）中、Ｔａは第１の熱可塑性樹脂層の厚みであり、Ｔｂは第２の熱可塑性樹脂層の厚みである。式（３）中、Ｇａ及びＧｂは式（１）中のＧａ及びＧｂと同義であり、Ｔａ及びＴｂは式（２）中のＴａ及びＴｂと同義である。）
　また、本発明に係る半導体装置の製造方法は、バンプが形成されたウエハ面に接着剤層を有する保護テープを貼付する保護テープ貼付工程と、保護テープを貼付けたウエハの反対面をグラインド処理するグラインド処理工程と、接着剤層を残して保護テープを剥離し、他の層を除去する保護テープ剥離工程とを有し、保護テープが、接着剤層と、第１の熱可塑性樹脂層と、第２の熱可塑性樹脂層と、基材フィルム層とをこの順に有し、上記式（１）～（３）の条件を満たす。
　また、本発明に係る半導体装置は、上記半導体装置の製造方法により得られる。
　本発明は、保護テープが、接着剤層と、第１の熱可塑性樹脂層と、第２の熱可塑性樹脂層と、基材フィルム層とをこの順に有し、式（１）～（３）の条件を満たすことにより、バンプが形成されたウエハに接着剤層を介して貼りつけられた保護テープから、接着剤層以外の層（基材フィルム層と第１の熱可塑性樹脂層と第２の熱可塑性樹脂層）を除去する際、バンプ上に接着剤層が残りにくくなるため、はんだ接合性を良好にすることができる。また、式（１）～（３）の条件を満たすことにより、第１の熱可塑性樹脂層と第２の熱可塑性樹脂層の弾性率を厚みで補正した弾性率補正値が適切な範囲に調整されるため、バックグラインド後のウエハの反り量を低減することができる。
図１は、保護テープの概略を示す断面図である。 図２は、保護テープ貼付工程の概略を示す断面図である。 図３は、グラインド工程の概略を示す断面図である。 図４は、粘着テープ貼付工程の概略を示す断面図である。 図５は、保護テープ剥離工程の概略を示す断面図である。 図６は、硬化工程の概略を示す断面図である。 図７は、ダイシング処理工程の概略を示す断面図である。 図８は、エキスパンド工程の概略を示す断面図である。 図９は、ピックアップ工程の概略を示す断面図である。 図１０は、実装工程の概略を示す断面図である。
　以下、本発明の実施の形態について、下記順序にて詳細に説明する。
１．保護テープ
２．半導体装置の製造方法
３．実施例
　＜１．保護テープ＞
　本実施の形態に係る保護テープは、接着剤層と、第１の熱可塑性樹脂層と、第２の熱可塑性樹脂層と、基材フィルム層とをこの順に有し、下記式（１）～（３）の条件を満たす。
（１）Ｇａ＞Ｇｂ
（２）Ｔａ＜Ｔｂ
（３）（Ｇａ×Ｔａ＋Ｇｂ×Ｔｂ）／（Ｔａ＋Ｔｂ）≦１．４Ｅ＋０６Ｐａ
（式（１）中、Ｇａは保護テープを貼付する貼付温度における第１の熱可塑性樹脂層の貯蔵剪断弾性率であり、Ｇｂは保護テープを貼付する貼付温度における第２の熱可塑性樹脂層の貯蔵剪断弾性率である。式（２）中、Ｔａは第１の熱可塑性樹脂層の厚みであり、Ｔｂは第２の熱可塑性樹脂層の厚みである。式（３）中、Ｇａ及びＧｂは式（１）中のＧａ及びＧｂと同義であり、Ｔａ及びＴｂは式（２）中のＴａ及びＴｂと同義である。）
　保護テープは、式（１）の条件を満たす。すなわち、保護テープを貼付する貼付温度における第１の熱可塑性樹脂層の貯蔵剪断弾性率（Ｇａ）が、保護テープを貼付する貼付温度における第２の熱可塑性樹脂層の貯蔵剪断弾性率（Ｇｂ）よりも大きい。式（１）の条件を満たすことにより、接着剤層の表層、すなわち、第１の熱可塑性樹脂層が第２の熱可塑性樹脂層よりも硬くなるため、第１の熱可塑性樹脂層が変形した際に、第１の熱可塑性樹脂層の変形を、第２の熱可塑性樹脂層が阻害しにくくなる。
　また、保護テープは、式（２）の条件を満たす。すなわち、第２の熱可塑性樹脂層の厚み（Ｔｂ）が、第１の熱可塑性樹脂層の厚み（Ｔａ）よりも大きい。式（１）及び式（２）の条件を満たすことにより、保護テープにおいて、第２の熱可塑性樹脂層と比較して硬い第１の熱可塑性樹脂層がより薄くなり、第１の熱可塑性樹脂層と比較して柔らかい第２の熱可塑性樹脂層がより厚くなる。
　さらに、保護テープは、式（３）の条件を満たす。すなわち、第１の熱可塑性樹脂層の弾性率と第２の熱可塑性樹脂層の弾性率をこれらの層の厚みで補正した弾性率補正値が１．４Ｅ＋０６Ｐａ以下である。式（３）の条件を満たすことにより、上記弾性率補正値が適切な範囲に調整されるため、バックグラインド後のウエハの反り量を低減することができる。
　式（３）の左辺の値、すなわち、上記弾性率補正値の下限値は、特に限定されないが、１．０Ｅ＋０５Ｐａ以上が好ましい。
　このように、保護テープは、接着剤層と、第１の熱可塑性樹脂層と、第２の熱可塑性樹脂層と、基材フィルム層とをこの順に有し、式（１）～（３）の条件を満たすことにより、バンプが形成されたウエハに接着剤層を介して貼りつけられた保護テープから、接着剤層以外の層（基材フィルム層と第１の熱可塑性樹脂層と第２の熱可塑性樹脂層）を除去する際、バンプ上に接着剤層が残りにくくなるため、はんだ接合性を良好にすることができる。また、バックグラインド後のウエハの反り量を低減することができる。
　保護テープは、式（１）～（３）の条件に加えて、さらに式（１Ａ）の条件を満たすことが好ましい。
（１Ａ）Ｇａ＞Ｇｂ＞Ｇｎ
（式（１Ａ）中、Ｇｎは保護テープを貼付する貼付温度における接着剤層の貯蔵剪断弾性率であり、Ｇａ及びＧｂは式（１）中のＧａ及びＧｂと同義である。）
　すなわち、保護テープを貼付する貼付温度における第１の熱可塑性樹脂層の貯蔵剪断弾性率（Ｇａ）が一番大きく、保護テープを貼付する貼付温度における第２の熱可塑性樹脂層の貯蔵剪断弾性率（Ｇｂ）が二番目に大きく、保護テープを貼付する貼付温度における接着剤層の貯蔵剪断弾性率（Ｇｎ）が三番目に大きいことが好ましい。式（１Ａ）の条件を満たすことにより、接着剤層、第２の熱可塑性樹脂層、第１の熱可塑性樹脂層の順に硬くなるため、第１の熱可塑性樹脂層に比べて接着剤層の変形や流動が非常に良好となる。これにより、保護テープをウエハに貼付けする際に、ウエハのバンプ上への接着剤層の付着をより効果的に抑制することができ、バンプ上に接着剤層が残りにくくなるため、はんだ接合性をより良好にすることができる。
　保護テープは、式（１）～（３）の条件に加えて、さらに式（２Ａ）の条件を満たすことが好ましい。
（２Ａ）Ｔｎ＜Ｔａ＜Ｔｂ
（式（２Ａ）中、Ｔｎは接着剤層の厚みであり、Ｔａ及びＴｂは式（２）中のＴａ及びＴｂと同義である。）
　すなわち、第２の熱可塑性樹脂層の厚み（Ｔｂ）が一番大きく、第１の熱可塑性樹脂層の厚み（Ｔａ）が二番目に大きく、接着剤層の厚み（Ｔｎ）が三番目に大きいことが好ましい。
　保護テープは、式（１）～（３）の条件に加えて、さらに下記式（４）の条件を満たすことが好ましい。
（４）Ｇｎ／Ｇａ≦０．０１
　すなわち、保護テープは、保護テープを貼付する貼付温度における接着剤層の貯蔵剪断弾性率（Ｇｎ）と、保護テープを貼付する貼付温度における第１の熱可塑性樹脂層の貯蔵剪断弾性率（Ｇａ）との比（Ｇｎ／Ｇａ）が０．０１以下であることが好ましい。式（４）の条件を満たすことにより、第１の熱可塑性樹脂層に比べて接着剤層の変形や流動が非常に良好となる。これにより、保護テープをウエハに貼付けする際に、ウエハのバンプ上への接着剤層の付着をより効果的に抑制することができ、バンプ上に接着剤層が残りにくくなるため、はんだ接合性をより良好にすることができる。
　式（４）の左辺の値（Ｇｎ／Ｇａ）の下限値は、１．０Ｅ＋０３以上が好ましい。
　図１は、保護テープの概略を示す断面図である。保護テープ１０は、バックグラインドテープと呼ばれるものであり、グラインド処理工程において、傷、割れ、汚染などからウエハを保護するものである。図１に示すように、保護テープ１０は、接着剤層１１と、第１の熱可塑性樹脂層１２と、第２基材フィルム層１３と、基材フィルム層１４とがこの順に積層されている。
　［接着剤層１１］
　接着剤層１１の６０℃での貯蔵剪断弾性率（Ｇｎ）は、１．０Ｅ＋０１Ｐａ～５．０Ｅ＋０４Ｐａであることが好ましく、１．０Ｅ＋０２Ｐａ～３．５Ｅ＋０３Ｐａであることがより好ましい。接着剤層１１の貯蔵剪断弾性率を１．０Ｅ＋０１Ｐａ以上とすることにより、バンプが接着剤を貫通する間に接着剤層１１付着してバンプ先端を接着剤層が覆ってしまうことを抑制することができる。また、保護テープ１０をウエハに貼り付けた際に接着剤層１１の樹脂が流れてしまうことを抑制することができる。接着剤層１１の貯蔵剪断弾性率を５．０Ｅ＋０４Ｐａ以下とすることにより、バンプが接着剤層１１をより容易に貫通することができ、導通をより良好にすることができる。
　接着剤層１１の樹脂組成としては、特に限定されず、例えば、熱アニオン硬化型、熱カチオン硬化型、熱ラジカル硬化型などの熱硬化型、光カチオン硬化型、光ラジカル硬化型などの光硬化型、又はこれらを併用して略同一に用いる熱／光硬化型のものを用いることができる。
　ここでは、接着剤層１１として、膜形成樹脂と、エポキシ樹脂と、硬化剤と、硬化助剤とを含有する熱硬化型の接着剤組成物について説明する。
　膜形成樹脂としては、フェノキシ樹脂、エポキシ樹脂、変性エポキシ樹脂、ウレタン樹脂等の種々の樹脂を用いることができる。これらの膜形成樹脂は、１種を単独で用いても、２種類以上を組み合わせて用いてもよい。これらの中でも、膜形成状態、接続信頼性等の観点からフェノキシ樹脂が好適に用いられる。
　エポキシ樹脂としては、例えば、ジシクロペンタジエン型エポキシ樹脂、グリシジルエーテル型エポキシ樹脂、グリシジルアミン型エポキシ樹脂、ビスフェノールＡ型エポキシ樹脂、ビスフェノールＦ型エポキシ樹脂、ビスフェノールＳ型エポキシ樹脂、スピロ環型エポキシ樹脂、ナフタレン型エポキシ樹脂、ビフェニル型エポキシ樹脂、テルペン型エポキシ樹脂、テトラブロムビスフェノールＡ型エポキシ樹脂、クレゾールノボラック型エポキシ樹脂、フェノールノボラック型エポキシ樹脂、α－ナフトールノボラック型エポキシ樹脂、臭素化フェノールノボラック型エポキシ樹脂などを挙げることができる。これらのエポキシ樹脂は、１種を単独で用いても、２種類以上を組み合わせて用いてもよい。これらの中でも、高接着性、耐熱性の点から、ジシクロペンタジエン型エポキシ樹脂が好適に用いられる。
　硬化剤としては、例えば、ノボラック型フェノール樹脂、脂肪族アミン、芳香族アミン、酸無水物などが挙げられ、これらの硬化剤は、１種を単独で用いても、２種類以上を組み合わせて用いてもよい。これらの中でも、硬化物の架橋密度の観点から、ノボラック型フェノール樹脂が好適に用いられる。
　硬化助剤としては、２－メチルイミダゾール、２－エチルイミダゾール、２－エチル－４－メチルイミダゾールなどのイミダゾ－ル類、１，８－ジアザビシクロ（５，４，０）ウンデセン－７塩（ＤＢＵ塩）、２－（ジメチルアミノメチル）フェノールなどの第３級アミン類、トリフェニルホスフィンなどのホスフィン類、オクチル酸スズなどの金属化合物などが挙げられる。これらの中でも、２－エチル－４－メチルイミダゾールが好ましい。
　また、接着剤組成物には、その他の成分として、無機フィラー、シランカップリング剤、アクリルゴムなどのエラストマー、カーボンブラックなどの顔料を、目的に応じて適宜配合するようにしてもよい。
　無機フィラーとしては、シリカ、窒化アルミニウム、アルミナ等が挙げられる。無機フィラーは、１種を単独で用いても、２種以上を併用してもよい。無機フィラーは、表面処理されていることが好ましく、親水性の無機フィラーであることが好ましい。親水性の無機フィラーとしては、無機フィラーが親水性表面処理剤で表面処理されたものが挙げられる。親水性表面処理剤としては、例えば、シランカップリング剤、チタネート系カップリング剤、アルミニウム系カップリング剤、ジルコアルミネート系カップリング剤、Ａｌ２Ｏ３、ＴｉＯ２、ＺｒＯ２、シリコーン、ステアリン酸アルミニウム等が挙げられ、シランカップリング剤が好ましい。
　接着剤層１１の厚さは、ウエハに形成されたバンプの高さの１０～８０％であることが好ましく、１０～６０％であることがより好ましい。バンプの高さの１０％以上にすることにより、バンプの補強の効果がより得やすくなる。また、バンプの高さの８０％以下にすることにより、接着剤層１１がバンプをより容易に貫通させることができる。例えば、ウエハに形成されたバンプの高さが１００～２００μｍである場合、接着剤層１１の厚みは５～１００μｍであることが好ましく、５～３０μｍであることがより好ましい。
　［第１の熱可塑性樹脂層１２］
　第１の熱可塑性樹脂層１２は、例えば、エチレン酢酸ビニル共重合体（ＥＶＡ：Ethylene Vinyl Acetate）、ポリエチレン、ポリプロピレン、ポリアミド、ポリアセタール、ポリエチレンテレフタレート、ポリブチレンテレフタレート、フッ素樹脂、ポリフェニレンサルファイド、ポリスチレン、ＡＢＳ樹脂、アクリル系樹脂、ポリカーボネート、ポリウレタン、ポリ塩化ビニル、ポリフェニレンオキサイドなどの樹脂からなる層である。上記樹脂は、１種単独で使用してもよいし、２種以上を併用してもよい。
　第１の熱可塑性樹脂層１２の６０℃での貯蔵剪断弾性率（Ｇａ）は、１．０Ｅ＋０６Ｐａ～１．０Ｅ＋０９Ｐａであることが好ましく、１．０Ｅ＋０６Ｐａ～１．０Ｅ＋０７Ｐａであることがより好ましい。
　第１の熱可塑性樹脂層１２の厚さ（Ｔａ）は、上述した式（１）を満たす範囲であり、５～３００μｍであることが好ましく、５～２００μｍであることがより好ましい。
　［第２の熱可塑性樹脂層１３］
　第２の熱可塑性樹脂層１３は、第１の熱可塑性樹脂層１２と同様の樹脂からなる層である。第２の熱可塑性樹脂層を構成する樹脂は、１種単独で使用してもよいし、２種以上を併用してもよい。
　第２の熱可塑性樹脂層１３の６０℃での貯蔵剪断弾性率（Ｇｂ）は、１．０Ｅ＋０４Ｐａ～２．０Ｅ＋０６Ｐａであることが好ましく、１．０Ｅ＋０４Ｐａ～８．０Ｅ＋０５Ｐａであることが好ましい。
　第２の熱可塑性樹脂層１３の厚さ（Ｔｂ）は、上述した式（１）を満たす範囲であり、１００～７００μｍであることが好ましい。
　［基材フィルム層１４］
　基材フィルム層１４としては、ポリエチレンテレフタレート、ポリエチレン、ポリプロピレン、ポリエステルなどのプラスチックフィルムや、紙、布、不織布等からなる多孔質基材を用いることができる。
　基材フィルム層１４の厚さは、２５～２００μｍであることが好ましく、５０～１００μｍであることがより好ましい。
　なお、保護テープは、上述した構成に限られることなく、各層の表面や隣接する層間に他の層が形成されていてもよい。例えば、保護テープは、第１の熱可塑性樹脂層及び第２の熱可塑性樹脂層の他に、第３の熱可塑性樹脂層を有していてもよい。例えば、保護テープが、接着剤層と第１の熱可塑性樹脂層との間に、第１の熱可塑性樹脂層及び第２の熱可塑性樹脂層とは異なる第３の熱可塑性樹脂層をさらに有していてもよい。この場合、保護テープを貼付する貼付温度における第３の熱可塑性樹脂層の貯蔵剪断弾性率（Ｇｃ）及び厚み（Ｔｃ）は、下記式（１Ａ）及び（２Ａ）の条件を満たすことが好ましい。このような条件を満たすことにより、はんだ接合性をより良好にすることができ、バックグラインド後のウエハの反り量をより低減することができる。
（１Ａ）Ｇｃ＞Ｇａ＞Ｇｂ
（２Ａ）Ｔｃ＜Ｔａ＜Ｔｂ
（式（１Ａ）中、Ｇｃは、保護テープを貼付する貼付温度における第３の熱可塑性樹脂層の貯蔵剪断弾性率であり、Ｇａ及びＧｂは式（１）中のＧａ及びＧｂと同義である。式（２Ａ）中、Ｔｃは第３の熱可塑性樹脂層の厚さであり、Ｔａ及びＴｂは式（２）中のＴａ及びＴｂと同義である。）
　本実施の形態に係る保護テープは、例えば、基材フィルム層と第１の熱可塑性樹脂層と第２の熱可塑性樹脂層とがこの順に形成されている基材フィルム層と熱可塑性樹脂層の積層体と、接着剤層とをラミネートすることにより得ることができる。基材フィルム層と熱可塑性樹脂層の積層体は、基材フィルム層に、熱可塑性樹脂を押し出し溶融成型することにより得ることができる。接着剤層は、例えば上述した熱硬化型の接着剤組成物を調製し、剥離処理された基材にバーコーターを用いて塗布し、乾燥させることにより得ることができる。
　＜２．半導体装置の製造方法＞
　次に、上述した保護テープを用いた半導体装置の製造方法について説明する。本実施の形態に係る半導体装置の製造方法は、バンプが形成されたウエハ面に接着剤層を有する保護テープを貼付する保護テープ貼付工程と、保護テープ貼付面の反対面をグラインド処理するグラインド処理工程と、接着剤層を残して保護テープを剥離し、他の層を除去する保護テープ剥離工程とを有し、保護テープが、上述した保護テープである。
　ここで、接着層を硬化させる硬化工程は、グラインド処理工程、粘着テープ貼付工程、及びダイシング処理工程のいずれかの工程前に行われればよい。
　以下、具体的な半導体装置の製造方法について説明する。具体例として示す半導体装置の製造方法は、上述した保護テープを用い、硬化工程が、粘着テープ貼付工程とダイシング処理工程との間に行われるものである。すなわち、具体例として示す半導体装置の製造方法は、接着剤層を有する保護テープを貼付する保護テープ貼付工程（Ａ）と、グラインド工程（Ｂ）と、粘着テープ貼付工程（Ｃ）と、保護テープ剥離工程（Ｄ）と、接着剤層を硬化させる硬化工程（Ｅ）と、ダイシング処理工程（Ｆ）と、エキスパンド工程（Ｇ）と、ピックアップ工程（Ｈ）と、実装工程（Ｉ）とを有する。
　［（Ａ）保護テープ貼付工程］
　図２は、保護テープ貼付工程の概略を示す断面図である。保護テープ貼付工程では、バンプ２２が形成されたウエハ２１面に保護テープ１０を貼り付ける。保護テープ１０を貼り付ける貼付温度は、ボイドの減少、ウエハ密着性の向上およびウエハ研削後のウエハの反り防止の観点から、２５℃～１００℃が好ましく、４０℃～８０℃がより好ましい。
　ウエハ２１は、シリコンなどの半導体表面に形成された集積回路と、接続用のバンプ２２とを有する。ウエハ２１の厚みは、特に限定されないが、２００～１０００μｍであることが好ましい。
　バンプ２２としては、特に限定はされないが、例えば、はんだによる低融点バンプ又は高融点バンプ、錫バンプ、銀－錫バンプ、銀－錫－銅バンプ、金バンプ、銅バンプなどが挙げられる。また、バンプ２２の高さは、例えば、１０～２００μｍであることが好ましい。
　保護テープ１０は、バンプ２２の形成面と接着剤層１１とが接する状態で貼り合わされる。図２に示すように、バンプ２２は、接着剤層１１を突き抜け、第１の熱可塑性樹脂層１２に埋め込まれる。また、第１の熱可塑性樹脂層１２における第２の熱可塑性樹脂１３と接する面は、バンプ２２の形状に追従するように変形する。さらに、第２の熱可塑性樹脂層１３における第１の熱可塑性樹脂層１２と接する面は、第１の熱可塑性樹脂層１２の変形に追従するように変形する。
　［（Ｂ）グラインド工程］
　図３は、グラインド工程の概略を示す断面図である。グラインド工程では、保護テープ１０を貼り付けたウエハ２１の反対面、すなわち、バンプ２２が形成されている面とは反対面を研削装置に固定して研磨する。研磨は通常、ウエハ２１の厚みが５０～６００μｍになるまで行うが、本実施の形態では、接着剤層１１によりバンプ２２が補強されるため、５０μｍ以下の厚さまで研磨してもよい。
　［（Ｃ）粘着テープ貼付工程］
　図４は、粘着テープ貼付工程の概略を示す断面図である。粘着テープ貼付工程では、グラインド処理面に粘着テープ３０を貼付する。粘着テープ３０は、ダイシングテープ（Dicing Tape）と呼ばれるものであり、ダイシング工程（Ｆ）において、ウエハ２１を保護、固定し、ピックアップ工程（Ｈ）まで保持するためのテープである。
　粘着テープ３０は、特に限定されず、公知のものを使用することができる。一般に、粘着テープ３０は、粘着剤層３１と、基材フィルム層３２とを有する。粘着剤層３１としては、例えば、ポリエチレン系、アクリル系、ゴム系、ウレタン系などの粘着剤が挙げられる。また、基材フィルム層３２としては、ポリエチレンテレフタレート、ポリエチレン、ポリプロピレン、ポリエステルなどのプラスチックフィルムや、紙、布、不織布等からなる多孔質基材を用いることができる。また、粘着テープの貼付装置及び条件としては、特に限定されず、公知の装置及び条件を用いることができる。
　［（Ｄ）保護テープ剥離工程］
　図５は、保護テープ剥離工程の概略を示す断面図である。保護テープ剥離工程では、接着剤層１１を残して保護テープ１０を剥離し、他の層を除去する。すなわち、第１の熱可塑性樹脂層１２、第２の熱可塑性樹脂層１３及び基材フィルム層１４が除去され、ウエハ２１上には接着剤層１１のみが残る。
　［（Ｅ）硬化工程］
　図６は、硬化工程の概略を示す断面図である。硬化工程では、接着剤層１１を硬化させる。硬化方法及び硬化条件としては、熱硬化型の接着剤を硬化させる公知の方法を用いることができる。例えば、硬化条件は、１００～２００℃で１時間以上が好ましい。
　［（Ｆ）ダイシング処理工程］
　図７は、ダイシング処理工程の概略を示す断面図である。ダイシング処理工程では、粘着テープ３０が貼付されたウエハ２１をダイシング処理し、個片の半導体チップを得る。ダイシング方法としては、特に限定されず、例えばダイシングソーでウエハ２１を切削して切り出すなどの公知の方法を用いることができる。
　［（Ｇ）エキスパンド工程］
　図８は、エキスパンド工程の概略を示す断面図である。エキスパンド工程では、例えば分割された複数個の半導体チップが貼着されている粘着テープ３０を水平方向に伸長させ、個々の半導体チップの間隔を広げる。
　［（Ｈ）ピックアップ工程］
　図９は、ピックアップ工程の概略を示す断面図である。ピックアップ工程では、粘着テープ３０上に貼着固定された半導体チップを、粘着テープ３０の下面より突き上げて剥離させ、この剥離された半導体チップをコレットで吸着する。ピックアップされた半導体チップは、チップトレイに収納されるか、またはフリップチップボンダーのチップ搭載ノズルへと搬送される。
　［（Ｉ）実装工程］
　図１０は、実装工程の概略を示す断面図である。実装工程では、例えば半導体チップと回路基板とをＮＣＦ（Non Conductive Film）などの回路接続材料を用いて接続する。回路基板としては、特に限定されないが、ポリイミド基板、ガラスエポキシ基板などのプラスチック基板、セラミック基板などを用いることができる。また、接続方法としては、加熱ボンダー、リフロー炉などを用いる公知の方法を用いることができる。
　上述した保護テープを用いた半導体装置の製造方法によれば、はんだ接合性を良好にすることができ、バックグラインド後のウエハの反り量を低減することができる。また、ダイシング処理工程前にバンプが形成されたウエハ面の接着剤層が硬化してバンプが補強されるため、ダイシング、ピックアップ、実装などの後工程において、バンプの破損を低減させることができる。また、優れた接続信頼性を有する半導体装置を歩留り良く得ることができる。
　半導体装置の製造方法で得られる半導体装置は、バンプとバンプ形成面に形成された接着剤層とを有する半導体チップと、バンプに対向する電極を有する回路基板とを備え、半導体チップのバンプ形成面に接着剤層１１が形成されているため、優れた接続信頼性を得ることができる。
　以下、本発明の実施例について説明する。本実施例では、接着剤層と、第１の熱可塑性樹脂層と、第２の熱可塑性樹脂層と、基材フィルム層とを積層させた保護テープを作製した。保護テープを用いて、保護テープ貼付工程（Ａ）と、グラインド工程（Ｂ）と、粘着テープ貼付工程（Ｃ）と、保護テープ剥離工程（Ｄ）と、硬化工程（Ｅ）と、ダイシング処理工程（Ｆ）と、エキスパンド工程（Ｇ）と、ピックアップ工程（Ｈ）と、実装工程（Ｉ）とを順次行い、半導体装置を作製した。そして、半導体装置のはんだ接合性、及びウエハ反り量について評価した。なお、本発明は、これらの実施例に限定されるものではない。
　［貯蔵剪断弾性率］
　接着剤層及び熱可塑性樹脂層の６０℃における貯蔵剪断弾性率は、粘弾性測定装置を用いて算出した。測定条件は、測定温度域０～１２０℃、昇温速度５℃／分、振動数１Ｈｚ、歪み０．１％に設定した。
　［保護テープの作製］
　＜熱可塑性樹脂層（フィルム１）の作製＞
　ＰＥＴ基材（厚み７５μｍ）上に、第１の熱可塑性樹脂層（下記熱可塑性樹脂層Ａ１～Ａ３のいずれか）、及び／又は、第２の熱可塑性樹脂層（下記熱可塑性樹脂層Ｂ１～Ｂ３のいずれか）がこの順に形成されるように、熱可塑性樹脂を押し出し溶融成型した。
　＜第１の熱可塑性樹脂層＞
　熱可塑性樹脂層Ａ１：エチレン・酢酸ビニル共重合体（ＶＦ１２０Ｔ、宇部丸善ポリエチレン（株）社製）、６０℃での貯蔵剪断弾性率：３．１Ｅ＋０６Ｐａ
　熱可塑性樹脂層Ａ２：（０５４０Ｆ、宇部丸善ポリエチレン（株）社製）、６０℃での貯蔵剪断弾性率：７．１Ｅ＋０６Ｐａ
　熱可塑性樹脂層Ａ３：エチレン・酢酸ビニル共重合体（Ｖ３１９、宇部丸善ポリエチレン（株）社製）、６０℃での貯蔵剪断弾性率：１．１Ｅ＋０６Ｐａ
＜第２の熱可塑性樹脂層＞
　熱可塑性樹脂層Ｂ１：エチレン・酢酸ビニル共重合体（ＥＶ４０ＬＸ、三井・デュポンポリケミカル（株）社製）、６０℃での貯蔵剪断弾性率：４．９Ｅ＋０５Ｐａ
　熱可塑性樹脂層Ｂ２：エチレン・酢酸ビニル共重合体（ＥＶ４５ＬＸ、三井・デュポンポリケミカル（株）社製）、６０℃での貯蔵剪断弾性率：４．２Ｅ＋０４Ｐａ
　熱可塑性樹脂層Ｂ３：エチレン・酢酸ビニル共重合体（ＥＶ１７０、三井・デュポンポリケミカル（株）社製）、６０℃での貯蔵剪断弾性率：６．２Ｅ＋０５Ｐａ
　＜接着剤層（フィルム２）の作製＞
　表１に示すように、接着剤層Ｎｏ．１～Ｎｏ．３を作製した。接着剤層Ｎｏ．１は、膜形成樹脂１３．０質量部と、エポキシ樹脂５４．８質量部と、硬化剤３２．４質量部と、硬化助剤０．３質量部とを配合して接着剤組成物を調製し、これを、乾燥後の厚みが３０μｍとなるように剥離処理されたＰＥＴ（Polyethylene terephthalate）にバーコーターを用いて塗布し、オーブンで乾燥させて作製した。接着剤層Ｎｏ．１の６０℃での貯蔵剪断弾性率は、３．３Ｅ＋０３Ｐａであった。
　接着剤層Ｎｏ．２は、膜形成樹脂１３．０質量部と、エポキシ樹脂５４．８質量部と、硬化剤３２．４質量部と、硬化助剤０．３質量部と、フィラー２５．０質量部とを配合して接着剤組成物を調製し、これを、乾燥後の厚みが３０μｍとなるように剥離処理されたＰＥＴにバーコーターを用いて塗布し、オーブンで乾燥させて作製した。接着剤層Ｎｏ．２の６０℃での貯蔵剪断弾性率は、３．６Ｅ＋０４Ｐａであった。
　接着剤層Ｎｏ．３は、膜形成樹脂２．０質量部と、エポキシ樹脂５４．８質量部と、硬化剤３２．４質量部と、硬化助剤０．３質量部とを配合して接着剤組成物を調製し、これを、乾燥後の厚みが３０μｍとなるように剥離処理されたＰＥＴにバーコーターを用いて塗布し、オーブンで乾燥させて作製した。接着剤層Ｎｏ．３の６０℃での貯蔵剪断弾性率は、３．６Ｅ＋０１Ｐａであった。
Figure JPOXMLDOC01-appb-T000001
　膜形成樹脂：フェノキシ樹脂（ＰＫＨＨ、ユニオンカーバイド（株）社製）
　エポキシ樹脂：ジシクロペンタジエン型エポキシ樹脂（ＨＰ７２００Ｈ、ＤＩＣ（株）社製）
　硬化剤：ノボラック型フェノール樹脂（ＴＤ－２０９３、ＤＩＣ（株）社製）
　硬化助剤：２－エチル－４－メチルイミダゾール（２Ｅ４ＭＺ）
　フィラー：シリカ（アエロジルＲＹ２００、日本アエロジル（株）社製）
　＜実施例１＞
　上記熱可塑性樹脂層（フィルム１）と、上記接着剤層（フィルム２）とをラミネートし、保護テープを作製した。フィルム１としては、ＰＥＴ基材（７５μｍ）と熱可塑性樹脂層Ａ１（５０μｍ）と熱可塑性樹脂層Ｂ１（４５０μｍ）とからなるものを用いた。フィルム２としては、接着剤層Ｎｏ．１（２０μｍ）を用いた。
　＜実施例２＞
　フィルム１として、ＰＥＴ基材（７５μｍ）と熱可塑性樹脂層Ａ２（５０μｍ）と熱可塑性樹脂層Ｂ１（４５０μｍ）とからなるものを用い、フィルム２として、接着剤層Ｎｏ．２（２０μｍ）を用いたこと以外は、実施例１と同様に保護テープを作製した。
　＜実施例３＞
　フィルム１として、ＰＥＴ基材（７５μｍ）と熱可塑性樹脂層Ａ３（５０μｍ）と熱可塑性樹脂層Ｂ１（４５０μｍ）とからなるものを用い、フィルム２として、接着剤層Ｎｏ．３（２０μｍ）を用いたこと以外は、実施例１と同様に保護テープを作製した。
　＜実施例４＞
　フィルム１として、ＰＥＴ基材（７５μｍ）と熱可塑性樹脂層Ａ１（５０μｍ）と熱可塑性樹脂層Ｂ２（４５０μｍ）とからなるものを用い、フィルム２として、接着剤層Ｎｏ．１（２０μｍ）を用いたこと以外は、実施例１と同様に保護テープを作製した。
　＜実施例５＞
　フィルム１として、ＰＥＴ基材（７５μｍ）と熱可塑性樹脂層Ａ１（５０μｍ）と熱可塑性樹脂層Ｂ３（４５０μｍ）とからなるものを用い、フィルム２として、接着剤層Ｎｏ．１（２０μｍ）を用いたこと以外は、実施例１と同様に保護テープを作製した。
　＜実施例６＞
　フィルム１として、ＰＥＴ基材（７５μｍ）と熱可塑性樹脂層Ａ１（２０μｍ）と熱可塑性樹脂層Ｂ１（４５０μｍ）とからなるものを用い、フィルム２として、接着剤層Ｎｏ．１（２０μｍ）を用いたこと以外は、実施例１と同様に保護テープを作製した。
　＜実施例７＞
　フィルム１として、ＰＥＴ基材（７５μｍ）と熱可塑性樹脂層Ａ１（２００μｍ）と熱可塑性樹脂層Ｂ１（４５０μｍ）とからなるものを用い、フィルム２として、接着剤層Ｎｏ．１（２０μｍ）を用いたこと以外は、実施例１と同様に保護テープを作製した。
　＜実施例８＞
　フィルム１として、ＰＥＴ基材（７５μｍ）と熱可塑性樹脂層Ａ１（５０μｍ）と熱可塑性樹脂層Ｂ１（３００μｍ）とからなるものを用い、フィルム２として、接着剤層Ｎｏ．１（２０μｍ）を用いたこと以外は、実施例１と同様に保護テープを作製した。
　＜実施例９＞
　フィルム１として、ＰＥＴ基材（７５μｍ）と熱可塑性樹脂層Ａ１（５０μｍ）と熱可塑性樹脂層Ｂ１（６００μｍ）とからなるものを用い、フィルム２として、接着剤層Ｎｏ．１（２０μｍ）を用いたこと以外は、実施例１と同様に保護テープを作製した。
　＜実施例１０＞
　フィルム１として、ＰＥＴ基材（５０μｍ）と熱可塑性樹脂層Ａ１（５０μｍ）と熱可塑性樹脂層Ｂ１（４５０μｍ）とからなるものを用い、フィルム２として、接着剤層Ｎｏ．１（２０μｍ）を用いたこと以外は、実施例１と同様に保護テープを作製した。
　＜実施例１１＞
　フィルム１として、ＰＥＴ基材（１００μｍ）と熱可塑性樹脂層Ａ１（５０μｍ）と熱可塑性樹脂層Ｂ１（４５０μｍ）とからなるものを用い、フィルム２として、接着剤層Ｎｏ．１（２０μｍ）を用いたこと以外は、実施例１と同様に保護テープを作製した。
　＜実施例１２＞
　フィルム１として、ＰＥＴ基材（７５μｍ）と熱可塑性樹脂層Ａ１（５μｍ）と熱可塑性樹脂層Ｂ１（４９５μｍ）とからなるものを用い、フィルム２として、接着剤層Ｎｏ．１（２０μｍ）を用いたこと以外は、実施例１と同様に保護テープを作製した。
　＜実施例１３＞
　フィルム１として、ＰＥＴ基材（７５μｍ）と熱可塑性樹脂層Ａ１（５０μｍ）と熱可塑性樹脂層Ｂ１（４５０μｍ）とからなるものを用い、フィルム２として、接着剤層Ｎｏ．２（２０μｍ）を用いたこと以外は、実施例１と同様に保護テープを作製した。
　＜実施例１４＞
　フィルム１として、ＰＥＴ基材（７５μｍ）と熱可塑性樹脂層Ａ１（２５０μｍ）と熱可塑性樹脂層Ｂ１（４５０μｍ）とからなるものを用い、フィルム２として、接着剤層Ｎｏ．１（２０μｍ）を用いたこと以外は、実施例１と同様に保護テープを作製した。
　＜比較例１＞
　フィルム１として、ＰＥＴ基材（７５μｍ）と熱可塑性樹脂層Ｂ１（５００μｍ）とからなるものを用い、フィルム２として、接着剤層Ｎｏ．１（２０μｍ）を用いたこと以外は、実施例１と同様に保護テープを作製した。
　＜比較例２＞
　フィルム１として、ＰＥＴ基材（７５μｍ）と熱可塑性樹脂層Ａ１（５００μｍ）とからなるものを用い、フィルム２として、接着剤層Ｎｏ．１（２０μｍ）を用いたこと以外は、実施例１と同様に保護テープを作製した。
　［半導体装置の作製］
　保護テープの接着剤層面を、はんだバンプ（φ＝２５０μｍ、Ｈ＝２００μｍ、ピッチ＝２５０μｍ）が形成されたウエハ（サイズ：５ｃｍ×５ｃｍ×７００μｍｔ）に貼り付け、真空式ラミネータを用いて６０℃の温度でラミネートした。
　次に、グラインダ（製品名：ＤＦＧ８５６０、（株）ディスコ社製）にてウエハの厚みを３００μｍまでバックグラインド処理した。その後、接着剤層を残して保護テープを剥離し、他の層（ＰＥＴ基材及び熱可塑性樹脂層）を除去し、ウエハ上の接着剤層を１３０℃のオーブンで２時間硬化させた。そして、ウエハをダインシングし、チップに個片化した後、マウンターにて基板（フラックス付金電極）に搭載し、最大２６０℃のリフロー炉にてチップと基板とをはんだ接合させた。
　［はんだ接合性の評価］
　基板の金電極上にフラックスを塗布し、最大２６０℃のリフロー温度ではんだ接合した際に、バンプサイズの面積を１００％として、はんだが濡れ広がった面積を計測した。はんだが濡れ広がった面積が、バンプサイズの面積に対して４０％以上の場合をはんだ接合性が良好と評価し、４０％未満の場合をはんだ接合性が良好でないと評価した。実施例及び比較例の結果を下記表２及び表３に示す。
　［ウエハ反りの評価］
　保護テープの接着剤層面を、８インチのウエハ（厚み７２５μｍ）に貼り合わせ、ウエハ厚みを３００μｍまでバックグラインド処理した際のウエハの反り量を測定した。反り量が５ｍｍ以下の場合をウエハの反り量が小さいと評価し、５ｍｍを超える場合をウエハの反り量が大きいと評価した。実施例及び比較例の結果を下記表２及び表３に示す。
Figure JPOXMLDOC01-appb-T000002
Figure JPOXMLDOC01-appb-T000003
　実施例１～１４のように、接着剤層（接着剤層Ｎｏ．１～Ｎｏ．３）と、第１の熱可塑性樹脂層（熱可塑性樹脂層Ａ１～Ａ３）と、第２の熱可塑性樹脂層（熱可塑性樹脂層Ｂ１～Ｂ３）と、基材フィルム層（ＰＥＴ基材）とをこの順に有し、上述した式（１）～（３）の条件を満たす保護テープを用いた場合、はんだ接合性が良好であり、ウエハの反り量も小さいことが分かった。
　特に、実施例１～１２、実施例１４のように、上述した式（１）～（３）の条件に加えて、上述した式（４）の条件を満たす保護テープを用いた場合、はんだ接合性がより良好であることが分かった。
　比較例１のように、第１の熱可塑性樹脂層を有しない保護テープを用いた場合、はんだ接合性が良好ではないことが分かった。これは、保護テープが、相対的に柔らかい第２の熱可塑性樹脂層（熱可塑性樹脂層Ｂ１）のみを有しており、第２の熱可塑性樹脂と比較して硬い第１の熱可塑性樹脂層を有していないため、第２の熱可塑性樹脂層がバンプに付着しやすくなった結果と考えられる。
　比較例２のように、第２の熱可塑性樹脂層を有しておらず、上述した式（３）の条件、すなわち、弾性率補正値が１．４Ｅ＋０６Ｐａを超える保護テープを用いた場合、ウエハ反り量が大きいことが分かった。これは、保護テープが、相対的に硬い第１熱可塑性樹脂層のみを有しており、第１の熱可塑性樹脂層よりも柔らかい第２の熱可塑性樹脂層を有していないため、ウエハのバックグラインド処理時にウエハ反りが生じやすくなった結果と考えられる。
　１０　保護テープ、１１　接着剤層、１２　第１の熱可塑性樹脂層、１３　第２の熱可塑性樹脂層、１４　基材フィルム層、２１　ウエハ、２２　バンプ、３０　粘着テープ、３１　粘着剤層、３２　基材フィルム層

Claims (10)

  1. 　接着剤層と、第１の熱可塑性樹脂層と、第２の熱可塑性樹脂層と、基材フィルム層とをこの順に有し、
    　下記式（１）～（３）の条件を満たす、保護テープ。
    （１）Ｇａ＞Ｇｂ
    （２）Ｔａ＜Ｔｂ
    （３）（Ｇａ×Ｔａ＋Ｇｂ×Ｔｂ）／（Ｔａ＋Ｔｂ）≦１．４Ｅ＋０６Ｐａ
    （式（１）中、Ｇａは当該保護テープを貼付する貼付温度における第１の熱可塑性樹脂層の貯蔵剪断弾性率であり、Ｇｂは当該保護テープを貼付する貼付温度における第２の熱可塑性樹脂層の貯蔵剪断弾性率である。式（２）中、Ｔａは第１の熱可塑性樹脂層の厚みであり、Ｔｂは第２の熱可塑性樹脂層の厚みである。式（３）中、Ｇａ及びＧｂは式（１）中のＧａ及びＧｂと同義であり、Ｔａ及びＴｂは式（２）中のＴａ及びＴｂと同義である。）
  2. 　下記式（４）の条件をさらに満たす、請求項１記載の保護テープ。
    （４）Ｇｎ／Ｇａ≦０．０１
    （式（４）中、Ｇｎは当該保護テープを貼付する貼付温度における上記接着剤層の貯蔵剪断弾性率であり、Ｇａは上記式（１）中のＧａと同義である。）
  3. 　上記貼付温度が、４０～８０℃である請求項１記載の保護テープ。
  4. 　上記第１の熱可塑性樹脂層の６０℃での貯蔵剪断弾性率が、１．０Ｅ＋０６Ｐａ～１．０Ｅ＋０９Ｐａであり、
    　上記第２の熱可塑性樹脂層の６０℃での貯蔵剪断弾性率が、１．０Ｅ＋０４Ｐａ～２．０Ｅ＋０６Ｐａである請求項１乃至３のいずれか１項に記載の保護テープ。
  5. 　上記接着剤層の６０℃での貯蔵剪断弾性率が、１．０Ｅ＋０１Ｐａ～５．０Ｅ＋０４Ｐａである請求項１乃至４のいずれか１項に記載の保護テープ。
  6. 　バンプが形成されたウエハ面に上記接着剤層が貼付されるものであり、
    　上記接着剤層の厚さと、上記第１の熱可塑性樹脂層の厚さと、上記第２の熱可塑性樹脂層の厚さとの合計が、上記バンプの高さ以上である、請求項１乃至５のいずれか１項に記載の保護テープ。
  7. 　上記接着剤層の厚みが、上記バンプの高さの１０～８０％である請求項６記載の保護テープ。
  8. 　バンプが形成されたウエハ面に接着剤層を有する保護テープを貼付する保護テープ貼付工程と、
    　上記保護テープを貼付けたウエハの反対面をグラインド処理するグラインド処理工程と、
    　上記接着剤層を残して上記保護テープを剥離し、他の層を除去する保護テープ剥離工程とを有し、
    　上記保護テープが、接着剤層と、第１の熱可塑性樹脂層と、第２の熱可塑性樹脂層と、基材フィルム層とをこの順に有し、下記式（１）～（３）の条件を満たす、半導体装置の製造方法。
    （１）Ｇａ＞Ｇｂ
    （２）Ｔａ＜Ｔｂ
    （３）（Ｇａ×Ｔａ＋Ｇｂ×Ｔｂ）／（Ｔａ＋Ｔｂ）≦１．４Ｅ＋０６Ｐａ
    （式（１）中、Ｇａは上記保護テープを貼付する貼付温度における第１の熱可塑性樹脂層の貯蔵剪断弾性率であり、Ｇｂは上記保護テープを貼付する貼付温度における第２の熱可塑性樹脂層の貯蔵剪断弾性率である。式（２）中、Ｔａは第１の熱可塑性樹脂層の厚みであり、Ｔｂは第２の熱可塑性樹脂層の厚みである。式（３）中、Ｇａ及びＧｂは式（１）中のＧａ及びＧｂと同義であり、Ｔａ及びＴｂは式（２）中のＴａ及びＴｂと同義である。）
  9. 　グラインド処理面に粘着テープを貼付する粘着テープ貼付工程と、
    　上記粘着テープが貼付されたウエハをダイシング処理し、個片の半導体チップを得るダイシング処理工程と、
    　上記接着剤層を硬化させる硬化工程とを有し、
    　上記硬化工程が、上記ダイシング処理工程前に行われる請求項８記載の半導体装置の製造方法。
  10. 　請求項８又は９記載の半導体装置の製造方法によって得られる半導体装置。
PCT/JP2016/066547 2015-06-04 2016-06-03 保護テープ、及びこれを用いた半導体装置の製造方法 WO2016195061A1 (ja)

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