WO2016194336A1 - Système de commande pour robot de transport équipé d'un mandrin électrostatique - Google Patents

Système de commande pour robot de transport équipé d'un mandrin électrostatique Download PDF

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Publication number
WO2016194336A1
WO2016194336A1 PCT/JP2016/002519 JP2016002519W WO2016194336A1 WO 2016194336 A1 WO2016194336 A1 WO 2016194336A1 JP 2016002519 W JP2016002519 W JP 2016002519W WO 2016194336 A1 WO2016194336 A1 WO 2016194336A1
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WO
WIPO (PCT)
Prior art keywords
control means
electrostatic chuck
robot
electrode
workpiece
Prior art date
Application number
PCT/JP2016/002519
Other languages
English (en)
Japanese (ja)
Inventor
傑之 鈴木
大輔 川久保
展史 南
和博 武者
Original Assignee
株式会社アルバック
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社アルバック filed Critical 株式会社アルバック
Priority to JP2017521682A priority Critical patent/JP6182692B2/ja
Priority to CN201680031508.5A priority patent/CN107615472B/zh
Priority to KR1020177037069A priority patent/KR102070126B1/ko
Publication of WO2016194336A1 publication Critical patent/WO2016194336A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/16—Programme controls
    • B25J9/1612—Programme controls characterised by the hand, wrist, grip control
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/07—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for semiconductor wafers Not used, see H01L21/677
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J50/00—Circuit arrangements or systems for wireless supply or distribution of electric power
    • H02J50/90—Circuit arrangements or systems for wireless supply or distribution of electric power involving detection or optimisation of position, e.g. alignment

Definitions

  • the present invention relates to a control system for a transfer robot with an electrostatic chuck.
  • a central transfer chamber A in which a transfer robot Tr is arranged is surrounded.
  • the load lock chamber B and the plurality of processing chambers C1 to C3 are arranged via the gate valve Gv, and the workpiece W put into the load lock chamber B is transferred to one of the processing chambers C1 to C3 by the transfer robot Tr,
  • a configuration (so-called cluster tool) configured to perform the above-described processing is known.
  • the transfer robot Tr includes, for example, two rotation shafts arranged concentrically and a robot arm that is connected to each rotation shaft and rotates and expands and contracts according to the rotation angle of the rotation shaft. What provided the robot hand which supports in the state which mounted the workpiece
  • Some of such transfer robots have a so-called bipolar electrostatic chuck provided with positive and negative electrodes on a robot hand (see, for example, Patent Document 1).
  • a non-contact type is known, for example, in Patent Document 2.
  • This device includes a capacitor and an electrostatic chuck control unit that has an AC power supply unit and performs on / off control (electrostatic chucking or release of the workpiece) of power feeding to both electrodes of the electrostatic chuck.
  • the capacitor is mechanically separated between a pair of electrodes arranged opposite to each other, and one of the electrodes is fixedly arranged around the rotating shaft and an output from the electrostatic chuck control means is connected to the electrode of the electrostatic chuck.
  • the other electrode to be connected is attached to the rotating shaft of the transfer robot and is connected to the load of the AC power supply unit so as to move relative to each other while maintaining the distance between the electrodes constant.
  • the vacuum pump, the transfer chamber A, the load lock chamber B, and the processing chambers C1 to C3 are usually separated in the processing chambers C1 to C3.
  • a general control means Mc including a known control device such as a sequencer, a microcomputer, a memory, etc., which controls the operation of each component such as a part that performs the above processing, and controls the operation of the transport robot Tr.
  • a robot control means Rc having a control device is separately provided.
  • the robot control means Rc is communicably connected to the overall control means Mc and controls the operation of the transfer robot in accordance with a control signal from the overall control means.
  • the electrostatic chuck control means is also connected to the overall control means Mc so as to be communicable, and electrostatic adsorption or release is performed according to a control signal from the overall control means Mc. It is conceivable to control.
  • the above control waits for communication between the overall control means, the robot control means, and the electrostatic chuck.
  • communication between the other side and the overall control means is performed, and there arises a problem that the response time for turning and expansion / contraction of the robot arm and electrostatic chucking / release of the electrostatic chuck becomes long.
  • an electrostatic chuck is to be retrofitted to an existing processing apparatus equipped with a transfer robot, a problem arises that it is necessary to make a significant change to the operation program of the overall control means itself.
  • the conveyance with an electrostatic chuck in which a workpiece is electrostatically adsorbed and conveyed between processing chambers in a processing apparatus having a plurality of processing chambers for performing predetermined processing on the workpiece.
  • the robot control system is communicatively connected to an overall control means for overall control of the operation of the processing apparatus, and controls the operation of the transfer robot in response to a control signal from the overall control means.
  • Electrostatic chuck control means for controlling electrostatic attraction or release of the workpiece, and the electrostatic chuck control means monitors communication contents between the overall control means and the robot control means, and statically based on the monitored communication contents.
  • the electrostatic chuck is configured to control electrostatic attraction or release of the workpiece with respect to the electrostatic chuck.
  • the electrostatic chuck control means monitors the communication contents between the overall control means and the robot control means, and based on the monitored communication contents, for example, between the overall control means and the robot control means.
  • a specific control signal is output in order to perform electrostatic attraction or release of the workpiece with respect to the electrostatic chuck, waiting for one communication between the overall control means, the robot control means and the electrostatic chuck control means,
  • the response time can be shortened as compared with the communication between the other side and the overall control means.
  • the electrostatic chuck control means is mechanically separated between a pair of electrodes arranged opposite to each other, and relatively moved while maintaining a constant distance between one electrode and the other electrode.
  • the other electrode is provided on the movable part of the transfer robot, the power supply circuit unit connected to one electrode, and the power receiving circuit connected between the other electrode and the chucking electrode of the electrostatic chuck.
  • a power supply circuit control unit that controls the operation of the power supply circuit unit, and communicates between the overall control means and the robot control means.
  • a configuration for monitoring contents can be adopted.
  • the figure which shows typically the structure of a vacuum processing apparatus provided with a conveyance robot.
  • the perspective view which shows the structure of a conveyance robot.
  • the schematic diagram which shows the circuit structure of a control system.
  • the transfer robot Tr is provided with an electrostatic chuck in its robot hand, and the workpiece is a silicon wafer (hereinafter referred to as “wafer W”).
  • the transfer robot Tr transfers the vacuum processing apparatus VM shown in FIG.
  • the control system RS of the transfer robot with an electrostatic chuck according to the embodiment of the present invention will be described taking the case of being provided in the chamber A as an example.
  • the detailed description beyond this is abbreviate
  • the control system RS of the transfer robot with the electrostatic chuck is communicably connected to the overall control means Mc for overall control of the operation of the vacuum processing apparatus VM, and communicates with the overall control means Mc.
  • the robot control means Rc for controlling the operation of the transfer robot Tr and the electrostatic chuck control means Cc for on / off control (electrostatic chucking or release of the workpiece) of power supply to both electrodes of the electrostatic chuck are provided.
  • the transfer robot Tr is a so-called frog-leg type, is concentrically arranged, and is connected to two rotary shafts 1a and 1b that are respectively driven to rotate by a drive source (not shown), and the rotary shafts 1a and 1b, respectively. And a robot arm 3 having a robot hand 2 at the tip.
  • the robot hand 2 is provided with suction electrodes 4a and 4b constituting an electrostatic chuck.
  • elevating means such as a linear motor or an air cylinder
  • the rotary shafts 1a and 1b and by extension the robot hand 2 can be moved up and down in the vertical direction.
  • the electrostatic chuck control means Cc is formed by mechanically separating a pair of electrodes arranged opposite to each other, and one electrode 5a integrally provided on the outer surface of the rotary shaft 1b positioned on the radially outer side, and the distance between the electrodes
  • the capacitor (so-called air gap type) 5 composed of the other electrode 5b made of a metal cylindrical member extrapolated to the rotary shaft 1b so as to move relative to the electrode 5b, and the electrode 5b
  • a power receiving circuit unit 8 connected between the one electrode 5a and the adsorption electrodes 4a and 4b via the wiring 6b.
  • the surface areas of the electrodes 5a and 5b and the distance between the electrodes 5a and 5b are appropriately selected according to the application so that the voltage applied to the capacitor 5 is equal to or lower than the discharge voltage limited by Paschen's law.
  • the opposing areas of both electrodes 5a, 5b need not be the same.
  • the power feeding circuit unit 7 is a known self-excited oscillator 71 that oscillates at the resonance frequency of the resonance circuit including the capacitor 5, a modulator 72 that applies amplitude modulation, and a microcomputer, a memory, and the like that collectively control these operations. And a power feeding circuit control unit 73.
  • a self-excited oscillator 71 and the modulator 72 an oscillator having a known structure can be used, for example, having a driving frequency of 100 kHz to several tens of MHz and including a driving frequency in a high frequency band.
  • the power receiving circuit unit 8 is housed in, for example, a metal housing 8 a attached to the lower surface of the robot arm 3, a resistor 81 provided in parallel with the attracting electrodes 4 a and 4 b, and both ends of the resistor 81 through the capacitor 5.
  • a rectifier circuit 82 that rectifies the supplied carrier wave and a known power receiving circuit control unit 83 including a microcomputer, a memory, and the like that control the operation thereof are provided.
  • a power supply carrier wave having a predetermined frequency is output from the self-excited oscillator 71 by the power feeding circuit control unit 73, amplitude modulation is applied by the modulator 72, and the carrier wave modulated to both ends of the resistor 81 through the capacitor 5. Supplied. Then, this carrier wave is rectified by the rectifier circuit 82, and a (positive) high voltage necessary for electrostatic chucking of the wafer W is applied to the chucking electrode 4 a so that the wafer W is electrostatically chucked to the robot hand 2.
  • the voltage may be boosted by a voltage doubler rectification method or the like.
  • the power supply circuit control unit 73 stops the output of the carrier wave for supplying power from the self-excited oscillator 71, the voltage application to the suction electrode 4a is stopped, and the suction of the wafer W by the robot hand 2 is released. Is done.
  • the power feeding circuit control unit 73 and the power receiving circuit control unit 83 are configured to perform wireless communication, for example.
  • One suction electrode 4b is grounded to the robot hand 2, and the resistor 81 is grounded to the housing 8a.
  • the electrostatic adsorption or release of the wafer W by turning on / off the power supply to the electrodes 4a and 4b is performed in conjunction with the operation of the transfer robot Tr.
  • the electrostatic chuck control means Cc is communicably connected to the overall control means Mc and the electrostatic adsorption or release is controlled in accordance with a control signal from the overall control means Mc. Since communication between the control means Mc, one of the robot control means Rc and the electrostatic chuck control means Cc is performed and communication between the other means and the overall control means Mc is performed, the response time can be shortened. It is desirable to configure.
  • the electrostatic chuck control means Cc monitors the communication content between the overall control means Mc and the robot control means Rc, and electrostatic chucking or release of the wafer W by the electrostatic chuck based on the monitored communication content.
  • Configured to control That is, for example, the overall control unit Mc and the robot control unit Rc are configured to communicate with each other via the power supply circuit control unit 73 of the power supply circuit unit 7, and the power supply circuit control unit 73 is configured to communicate with the robot control unit Mc and the robot.
  • the communication contents with the control means Rc are constantly monitored.
  • a power supply carrier wave having a predetermined frequency is output from the self-excited oscillator 71 by the power supply circuit control unit 73, and is used for adsorption.
  • a (positive) high voltage necessary for electrostatic attraction of the wafer W is applied to the electrode 4a, and the wafer W is electrostatically attracted to the robot hand 2.
  • control means Mc drives the rotary shafts 1a and 1b to the robot control means Rc so that the tip of the robot hand 2 is load-locked.
  • a control signal for turning to a position directed to the room B is output.
  • the robot control means Rc outputs a turning completion control signal to the overall control means Mc.
  • the overall control means Mc controls the robot control means Rc to further drive the rotary shafts 1a and 1b so that the robot arm 3 extends so that the robot hand 2 moves to a predetermined position in the load lock chamber B. Is output.
  • the robot control means Rc outputs a control signal indicating the end of extension to the overall control means Mc.
  • the overall control means Mc outputs a control signal for raising the robot hand 2 via the raising / lowering means attached to the rotary shafts 1a and 1b.
  • the robot control means Rc outputs a raising end control signal to the overall control means Mc.
  • the power feeding circuit control unit 73 that monitors the control signal for the overall control unit Mc of the robot control unit Rc is for supplying power of a predetermined frequency from the self-excited oscillator 71 based on the specific control signal of the end of the rise.
  • a carrier wave is output, and a (positive) high voltage necessary for electrostatic chucking of the wafer W is applied to the chucking electrode 4a. Thereby, the wafer W is attracted and held by the robot hand 2.
  • the overall control means Mc outputs a control signal for starting the descent of the robot hand 2 via the elevating means.
  • the power supply circuit control unit 73 stops the output of the carrier wave for power supply from the self-excited oscillator 71 based on the specific control signal of the start of lowering, the power supply circuit control unit 73 supplies the suction electrode 4a. Is stopped, and the suction of the wafer W by the robot hand 2 is released.
  • the electrostatic chuck control means Cc monitors the communication contents between the overall control means Mc and the robot control means Rc, and based on the monitored communication contents, for example, the overall control means Mc When a specific control signal is output to the robot control means Rc, the overall control means Mc, the robot control means Rc, and the electrostatic chuck are used to electrostatically attract or release the wafer W by the robot hand 2. Waiting for one communication with the control means Cc, the response time can be shortened compared to the communication with the other means and the general control means Mc. In addition, there is no need to change the operation program of the overall control unit Mc itself, which is advantageous when an electrostatic chuck is to be retrofitted to an existing processing apparatus including the transfer robot Tr.
  • the present invention is not limited to the above.
  • a so-called bipolar type has been described as an example.
  • the present invention is not limited to this, and the present invention can also be applied to a single-pole type. It is not limited to those.
  • the method of connecting the electrostatic chuck control means Cc to the overall control means Mc and the robot control means Rc is not limited to the above as long as the communication between the overall control means Mc and the robot control means Rc can be monitored. .
  • the overall control unit Mc and the robot control unit Rc The control is performed when a specific control signal resulting from the operation of the transfer robot Tr such as expansion / contraction or raising / lowering of the robot arm is output.
  • the present invention is not limited to this. An appropriate selection can be made from control signals output between the overall control means Mc and the robot control means Rc when the workpiece is conveyed.
  • the transfer robot Tr has a function of detecting the presence of a workpiece installed in the robot hand 2 and has a function of outputting a signal for detecting the presence of a wafer from the robot control means Rc to the general control means Mc.
  • the electrostatic chuck control means Cc can control the electrostatic chucking of the work by the electrostatic chuck based on the communication between the overall control means Mc and the robot control means Rc at that time.
  • the power feeding circuit control unit 73 applies the adsorption electrode 4a to the adsorption electrode 4a based on a specific control signal such as the end of ascent.
  • a specific control signal such as the end of ascent.
  • the robot control means Rc extends or contracts the robot arm 3 from the overall control means Mc. Since the time required to complete the operation is known when the output is received, the power supply circuit is controlled by timing processing from the above point using a timer, etc. without waiting for a specific control signal such as the end of the rise.
  • the unit 73 can apply a (positive) high voltage necessary for the electrostatic chucking of the wafer W to the chucking electrode 4a, or can stop the voltage application.
  • the electrostatic chuck control unit Cc supplies power to the chucking electrode of the electrostatic chuck and receives the wafer W in this state. Can be controlled.
  • the chucking electrode of the electrostatic chuck is only applied when a predetermined acceleration or more is applied to the wafer during transfer of the wafer by the transfer robot Tr. You may comprise so that it may electrically feed.
  • the feeding circuit controller 73 applies a (positive) high voltage necessary for electrostatic chucking of the wafer W to the chucking electrode 4a by timing processing from the time when a specific control signal is output, The application may be stopped.
  • the case where the (positive) high voltage necessary for electrostatic chucking of the wafer W is applied to the chucking electrode 4a or the voltage application is stopped is described as an example.
  • a control circuit for applying a reverse potential to the suction electrode 4a or grounding is provided. Even in such a case, the operation of such a control circuit can be controlled by applying the present invention.
  • VM Vacuum processing device (processing device), Tr ... Transport robot, Mc ... Overall control control means, Cc ... Electrostatic chuck control means, Rc ... Transport robot control means, 2 ... Robot hand, 4a, 4b ... Suction electrode, 5... Capacitor, 7... Power feeding circuit unit, 73... Power feeding circuit control unit (electrostatic chuck control means).

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  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Orthopedic Medicine & Surgery (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)

Abstract

Selon la présente invention, dans un appareil de traitement comprenant une pluralité de chambres de traitement pour soumettre une pièce à des processus prédéterminés, l'invention concerne un système de commande, pour un robot de transport équipé d'un mandrin électrostatique qui transporte la pièce entre les chambres de traitement au moyen d'une attraction électrostatique, configuré pour permettre au mandrin électrostatique de fonctionner avec de bonnes caractéristiques de réponse. Le système de commande de robot de transport selon la présente invention est pourvu : d'un moyen de commande de robot (Rc) qui est connecté de manière à pouvoir communiquer avec un moyen de commande central (Mc) assurant la commande centrale du fonctionnement de l'appareil de traitement, et qui commande le fonctionnement du robot de transport (Tr) conformément à un signal de commande provenant du moyen de commande central ; et d'un moyen de commande de mandrin électrostatique (Cc) qui commande l'attraction électrostatique ou la libération de la pièce (W) par rapport au mandrin électrostatique. Le moyen de commande de mandrin électrostatique est configuré pour surveiller le contenu des communications entre le moyen de commande central et le moyen de commande de robot, et pour commander l'attraction électrostatique ou la libération de la pièce par le mandrin électrostatique en fonction du contenu des communications surveillées.
PCT/JP2016/002519 2015-05-29 2016-05-24 Système de commande pour robot de transport équipé d'un mandrin électrostatique WO2016194336A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2017521682A JP6182692B2 (ja) 2015-05-29 2016-05-24 静電チャック付き搬送ロボットの制御システム
CN201680031508.5A CN107615472B (zh) 2015-05-29 2016-05-24 带静电卡盘的运输机器人的控制系统
KR1020177037069A KR102070126B1 (ko) 2015-05-29 2016-05-24 정전 척을 장착한 반송 로봇의 제어 시스템

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015110015 2015-05-29
JP2015-110015 2015-05-29

Publications (1)

Publication Number Publication Date
WO2016194336A1 true WO2016194336A1 (fr) 2016-12-08

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PCT/JP2016/002519 WO2016194336A1 (fr) 2015-05-29 2016-05-24 Système de commande pour robot de transport équipé d'un mandrin électrostatique

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JP (1) JP6182692B2 (fr)
KR (1) KR102070126B1 (fr)
CN (1) CN107615472B (fr)
TW (1) TWI609751B (fr)
WO (1) WO2016194336A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102062963B1 (ko) * 2017-12-26 2020-01-06 재단법인경북테크노파크 산업용 로봇의 회전축 선 꼬임 방지가 가능한 무선전력전송 장치
WO2022004022A1 (fr) * 2020-06-30 2022-01-06 日本電産株式会社 Dispositif d'aspiration de pièces
WO2024142605A1 (fr) * 2022-12-27 2024-07-04 株式会社クリエイティブテクノロジー Mandrin électrostatique, dispositif de robot et dispositif de préhension d'article

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