WO2016192569A2 - Verre à faible émissivité, procédé de fabrication de celui-ci et vitre de véhicule - Google Patents
Verre à faible émissivité, procédé de fabrication de celui-ci et vitre de véhicule Download PDFInfo
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- WO2016192569A2 WO2016192569A2 PCT/CN2016/083454 CN2016083454W WO2016192569A2 WO 2016192569 A2 WO2016192569 A2 WO 2016192569A2 CN 2016083454 W CN2016083454 W CN 2016083454W WO 2016192569 A2 WO2016192569 A2 WO 2016192569A2
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- Prior art keywords
- low emissivity
- emissivity glass
- openings
- layer
- infrared reflection
- Prior art date
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- 239000005344 low-emissivity glass Substances 0.000 title claims abstract description 133
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 46
- 238000000034 method Methods 0.000 title claims abstract description 36
- 229910052751 metal Inorganic materials 0.000 claims abstract description 125
- 239000002184 metal Substances 0.000 claims abstract description 125
- 239000000758 substrate Substances 0.000 claims abstract description 75
- 238000005538 encapsulation Methods 0.000 claims abstract description 4
- 229910045601 alloy Inorganic materials 0.000 claims description 15
- 239000000956 alloy Substances 0.000 claims description 15
- 229910001316 Ag alloy Inorganic materials 0.000 claims description 12
- JYMITAMFTJDTAE-UHFFFAOYSA-N aluminum zinc oxygen(2-) Chemical compound [O-2].[Al+3].[Zn+2] JYMITAMFTJDTAE-UHFFFAOYSA-N 0.000 claims description 12
- KYKLWYKWCAYAJY-UHFFFAOYSA-N oxotin;zinc Chemical compound [Zn].[Sn]=O KYKLWYKWCAYAJY-UHFFFAOYSA-N 0.000 claims description 12
- 238000009826 distribution Methods 0.000 claims description 10
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical group [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 9
- 230000015572 biosynthetic process Effects 0.000 claims description 9
- 239000004332 silver Substances 0.000 claims description 9
- 229910052709 silver Inorganic materials 0.000 claims description 8
- 239000005328 architectural glass Substances 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 6
- 238000005530 etching Methods 0.000 claims description 5
- 230000002093 peripheral effect Effects 0.000 claims description 5
- 229910017937 Ag-Ni Inorganic materials 0.000 claims description 3
- 229910017984 Ag—Ni Inorganic materials 0.000 claims description 3
- 229910002708 Au–Cu Inorganic materials 0.000 claims description 3
- 229910000599 Cr alloy Inorganic materials 0.000 claims description 3
- 229910002482 Cu–Ni Inorganic materials 0.000 claims description 3
- 229910017767 Cu—Al Inorganic materials 0.000 claims description 3
- 229910017885 Cu—Pt Inorganic materials 0.000 claims description 3
- 238000000151 deposition Methods 0.000 claims description 3
- 239000005357 flat glass Substances 0.000 claims description 3
- 238000000608 laser ablation Methods 0.000 claims description 3
- 230000008021 deposition Effects 0.000 claims description 2
- 238000002834 transmittance Methods 0.000 abstract description 26
- 230000000694 effects Effects 0.000 abstract description 5
- 230000008901 benefit Effects 0.000 abstract description 4
- 239000010410 layer Substances 0.000 description 252
- 230000005855 radiation Effects 0.000 description 30
- 239000011521 glass Substances 0.000 description 14
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 10
- 229910052581 Si3N4 Inorganic materials 0.000 description 9
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 9
- 230000009286 beneficial effect Effects 0.000 description 6
- 230000005540 biological transmission Effects 0.000 description 6
- DQIPXGFHRRCVHY-UHFFFAOYSA-N chromium zinc Chemical compound [Cr].[Zn] DQIPXGFHRRCVHY-UHFFFAOYSA-N 0.000 description 5
- 239000004408 titanium dioxide Substances 0.000 description 5
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 4
- 230000000903 blocking effect Effects 0.000 description 4
- 239000007769 metal material Substances 0.000 description 4
- 229910018487 Ni—Cr Inorganic materials 0.000 description 2
- VNNRSPGTAMTISX-UHFFFAOYSA-N chromium nickel Chemical compound [Cr].[Ni] VNNRSPGTAMTISX-UHFFFAOYSA-N 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 230000008016 vaporization Effects 0.000 description 2
- 239000011787 zinc oxide Substances 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
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Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B9/041—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material of metal
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
- C03C17/36—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal
- C03C17/3602—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer
- C03C17/3644—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer the metal being silver
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
- B32B3/266—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by an apertured layer, the apertures going through the whole thickness of the layer, e.g. expanded metal, perforated layer, slit layer regular cells B32B3/12
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B9/045—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60J—WINDOWS, WINDSCREENS, NON-FIXED ROOFS, DOORS, OR SIMILAR DEVICES FOR VEHICLES; REMOVABLE EXTERNAL PROTECTIVE COVERINGS SPECIALLY ADAPTED FOR VEHICLES
- B60J1/00—Windows; Windscreens; Accessories therefor
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
- C03C17/36—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
- C03C17/36—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal
- C03C17/3602—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer
- C03C17/3647—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer in combination with other metals, silver being more than 50%
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- C—CHEMISTRY; METALLURGY
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- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
- C03C17/36—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal
- C03C17/3602—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer
- C03C17/3649—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer made of metals other than silver
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
- C03C17/36—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal
- C03C17/3602—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer
- C03C17/3657—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer the multilayer coating having optical properties
- C03C17/366—Low-emissivity or solar control coatings
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
- C03C17/36—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal
- C03C17/3602—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer
- C03C17/3668—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer the multilayer coating having electrical properties
- C03C17/3673—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer the multilayer coating having electrical properties specially adapted for use in heating devices for rear window of vehicles
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
- C03C17/36—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal
- C03C17/38—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal at least one coating being a coating of an organic material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/71—Resistive to light or to UV
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2605/00—Vehicles
- B32B2605/08—Cars
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2218/00—Methods for coating glass
- C03C2218/30—Aspects of methods for coating glass not covered above
- C03C2218/32—After-treatment
- C03C2218/328—Partly or completely removing a coating
- C03C2218/33—Partly or completely removing a coating by etching
Definitions
- the disclosure generally relates to vehicle manufacturing field, and more particularly, to a low emissivity glass, a method for manufacturing the low emissivity glass and a vehicle window.
- Low emissivity glass has been widely applied to high-end vehicles, residences and office buildings.
- the low emissivity glass refers to a glass that can reduce the transmittance of radiation light passing through the glass.
- the low emissivity glass realizes reducing the radiation by forming a material layer on the surface of a glass substrate to block radiation, where the radiation can be absorbed or reflected by the material layer.
- the low emissivity glass may block wireless signals to a great extent, which results in it is difficult for the wireless signals to propagate through the glass.
- the glass with high blocking capability on the wireless signals may lead to a low signal intensity inside the vehicle, or even no signal surrounding the vehicle, which poses a difficult in using electronic equipments, such as mobile phones, radios etc.
- a low emissivity glass includes: a substrate; and a stacked structure film covering at least a surface of the substrate, the stacked structure film including a metal infrared reflection layer and a plurality of dielectric layers, wherein the metal infrared reflection layer has a plurality of openings.
- the plurality of openings of the metal infrared reflection layer may increase the transmittance of the wireless signals passing through the low emissivity glass.
- the metal infrared reflection layer is applied to reflect the infrared ray, and thus to reduce the transmittance of the infrared ray passing through the low emissivity glass;
- the metal infrared reflection layer may shield the wireless signals, namely, the metal infrared reflection layer may block the wireless signals from passing through the low emissivity glass;
- the plurality of openings of the metal infrared reflection layer facilitates the wireless signals going through the openings, and thus the shielding effect of the low emissivity glass on the wireless signals is reduced. Therefore, the low emissivity glass in the present disclosure can not only block the infrared ray, but also increase the transmittance of the wireless signals.
- a vehicle window includes: an encapsulation, and the aforementioned low emissivity glass.
- the vehicle window includes the aforementioned low emissivity glass. Therefore, the vehicle window can not only reduce the radiation, but also ensure the transmittance of the wireless signal through the low emissivity glass. That is, the intensity of the wireless signals inside the vehicle can be ensured.
- a method for manufacturing a low emissivity glass includes: providing a substrate; and covering at least a surface of the substrate with a stacked structure film, the stacked structure film including a metal infrared reflection layer and a plurality of dielectric layers, where covering with the stacked structure film includes: forming a plurality of openings in the metal infrared reflection layer.
- the transmittance of the wireless signals through the low emissivity glass can be increased by forming the plurality of openings in the metal infrared reflection layer.
- the metal infrared reflection layer is applied to reflect the infrared ray, and further to reduce the transmittance of the infrared ray passing through the low emissivity glass.
- the metal infrared reflection layer can shield the wireless signals, namely, the metal infrared reflection layer can block the wireless signals from passing through the low emissivity glass; forming the plurality of openings in the metal infrared reflection layer facilitates the wireless signals going through the plurality of openings, thus the shielding effect of the low emissivity glass on wireless signals is reduced. Therefore, the low emissivity glass in the present disclosure can not only block the infrared ray, but also increase the transmittance of the wireless signals passing through the low emissivity glass.
- Figure 1 and Figure 2 schematically illustrate a low emissivity glass according to a first embodiment of the present disclosure
- FIG. 3 and Figure 4 schematically illustrate a low emissivity glass according to a second embodiment of the present disclosure
- Figure 5 and Figure 6 schematically illustrate a low emissivity glass according to a third embodiment of the present disclosure
- Figure 7 schematically illustrates a low emissivity glass according to a forth embodiment of the present disclosure.
- Figure 8 schematically illustrates a flow chart of a method for manufacturing the low emissivity glass according to an embodiment of the present disclosure.
- some glass may block the wireless signals to a great extent, as a result, the wireless signals transmitting through the glass decrease.
- this kind of glass may lead to the wireless signals inside the vehicle becoming weak or even no wireless signals inside the vehicle, which may affect people using electronic equipments inside the vehicle.
- a low emissivity glass In order to solve the technical problems described above, a low emissivity glass, a method for manufacturing the low emissivity glass and a vehicle are provided in the present disclosure.
- the low emissivity glass refers to a glass that can reduce the transmittance of the radiation through the glass. That is, when the radiation irradiates one side of the low emissivity glass, the low emissivity glass can block a portion of radiation, thereby the radiation intensity on the other side of the low emissivity glass with respect to the radiation source becomes relatively lower.
- the “low emissivity” mentioned in the present disclosure refers to the radiation intensity lower than the intensity of the radiation source. For instance, the radiation intensity is lower than -110dbm.
- the low emissivity may refer to different extent in different environments or different standards. Therefore, the protection scope should not be limited by the embodiments disclosed herein.
- FIG. 1 schematically illustrates a cross-sectional view of a low emissivity glass according to an embodiment of the present disclosure.
- the low emissivity glass includes:
- the substrate 100 is a glass substrate.
- the stacked structure film includes a metal infrared reflection layer 310 and a plurality of dielectric layers; wherein the metal infrared reflection layer 310 is applied to reflect and absorb at least a portion of infrared ray, to reduce the transmittance of the infrared ray through the substrate 100, and thus to reduce the radiation intensity on the other side of the low emissivity glass with respect to the radiation source.
- the metal infrared reflection layer 310 may be a silver layer or a silver alloy layer.
- the silver layer or the silver alloy layer is well capable of blocking the infrared ray.
- the metal infrared reflection layer 310 of the silver alloy layer may include Au-Cu alloy, Ag-Ni alloy, Ag-Cr alloy, Ag-Cu-Ni alloy, Ag-Cu-Al alloy or Ag-Cu-Pt alloy.
- the stacked structure film of low emissivity further includes a plurality of dielectric layers, for instance, a silicon nitride layer, a nickel-chromium layer, a zinc oxide layer etc, to increase the binding force between the plurality of dielectric layers and the binding force between the plurality of dielectric layers and the substrate, or to serve as a seed layer or a protective layer and so on.
- some of the plurality of dielectric layers themselves can block and absorb the ultraviolet ray and other radiations (such as, solar radiation) . Therefore, the stacked structure film overall can block a great portion of radiations.
- the plurality of dielectric layers includes a first dielectric layer 320 and a second dielectric layer 330 respectively on the two sides of the metal infrared reflection layer 310, and a multi-layer structure.
- the first dielectric layer 320 and the second dielectric layer 330 have a same structure, either of which is composed of sequentially stacked layers including a titanium dioxide layer, a zinc chromium layer and a silicon nitride layer, that is, the first dielectric layer 320 includes a dielectric layer 321 of the titanium dioxide layer, a dielectric layer 322 of the zinc chromium layer, and a dielectric layer 323 of the silicon nitride layer; similarly, the second dielectric layer 330 includes a dielectric layer 331 of the titanium dioxide layer, a dielectric layer 332 of the zinc chromium layer, and a dielectric layer 333 of the silicon nitride layer.
- the first dielectric layer 320, the metal infrared reflection layer 310 and the second dielectric layer 330 together constitute the stacked structure film.
- the metal infrared reflection layer 310 has a plurality of openings 311.
- the plurality of openings may increase the transmittance of the wireless signals through the low emissivity glass.
- the metal infrared reflection layer may shield the wireless signals. That is, the metal infrared reflection layer 310 may block the wireless signals from going through the low emissivity glass. Accordingly, the plurality of openings formed in the metal infrared reflection layer 310 is beneficial for the wireless signals to pass through the openings, thereby reducing the shielding effect of the low emissivity glass on the wireless signals. Therefore, the low emissivity glass as disclosed in the embodiments can not only block the infrared ray, but also increase the transmittance of wireless signals through the low emissivity glass.
- Figure 2 schematically illustrates a distribution of the plurality of openings 311 in the metal infrared layer 310.
- the plurality of openings 311 is evenly distributed in the metal infrared layer 310.
- the metal infrared layer 310 covers the substrate 100, that is, the plurality of openings 311 is evenly distributed on the substrate 100.
- the evenly distributed plurality of openings 311 can not only simplify the production and manufacture, but also make the transmittance of the wireless signals through each part of the low emissivity glass tend to the same.
- the plurality of openings 311 is hole-shaped.
- the hole-shaped openings 311 are independent from each other, which ensures the integrality of the metal infrared reflection layer 310. Further, the hole-shaped openings 311 are not very apparent with respect to the appearance of the whole low emissivity glass, which ensures the aesthetics of the low emissivity glass in the present disclosure.
- the hole-shaped openings 311 have a circular-shaped cross-section parallel to the substrate 100, which can further simplify the production and manufacture.
- the hole-shaped openings 311 have a diameter ranging from 50 microns to 500 microns.
- the hole-shaped openings 311 within such a diameter range can allow the wireless signals to pass through, do not influence the performance of the metal infrared reflection layer 310 on lowering the infrared ray radiation , and do not influence the aesthetics of the whole low emissivity glass either.
- the plurality of openings 311 has a rectangular-shaped cross section perpendicular to the substrate 100 (referring to Figure 1) . That is, the hole-shaped openings 311 have a diameter remaining the same through the hole, which can further simplify the production and manufacturing process.
- a total area of the plurality of openings 311 in the metal infrared reflection layer 310 accounts for 1 percent to 0.001 percent of a total area of the substrate 100, which helps to achieve a balance between the performance of the metal infrared reflection layer 310 on transmitting signals and reducing the infrared ray radiation, and the aesthetics. That is, the signal intensity inside the vehicle is large enough to support the use of some basic electronic equipments (such as mobile phones and radios) , further, the aesthetics of the metal infrared reflection layer 310 and the performance of the metal infrared reflection layer 310 on reducing the radiation of will not be influenced.
- the intensity of the wireless signals received inside vehicles by electronic equipments can be calculated using the following formula:
- dBm e represents the power (Units: dB) of the wireless signals received by the equipments, the intensity of the referenced wireless signal is 1 mW; r represents the distance between the mobile phone and mobile base station; R represents the average distance between the adjacent mobile base station.
- the transmission power of the mobile base station ranges from 20 W to 40 W, assuming the transmission power is 40 W.
- the mobile base station is usually constructed in a way of arranging three base stations in a circular region with a diameter ranging from 1.5 km to 3 km.
- the lowest power density in the region covered by the wireless signals is 0.01uW/cm 2 ; and the mobile phone can be normally used when the power is larger than 130 dBme.
- the total area of the plurality of openings 311 accounts for 1 percent to 0.001 percent of the total area of the substrate 100 by dividing the power by power density.
- the low emissivity glass further includes a first base layer 210 between the stacked structure film and the substrate 100, and a second base layer 220 on a surface of the stacked structure film.
- the first base layer 210 and the second base layer 220 as a support for the stacked structure film in the production and manufacture process, can also protect the stacked structure film.
- the first base layer 210 and the second base layer 220 may be made of PET. However, the protection scope should not be limited by the embodiments disclosed herein.
- a low emissivity glass is provided according to a second embodiment of the present disclosure.
- Figure 3 schematically illustrates a cross-sectional view of the low emissivity glass.
- Figure 4 schematically illustrates a distribution of a plurality of openings 311a in a metal infrared layer 310a.
- a stacked structure film is formed between a first base layer 210a and a second base layer 220a, and the first base layer 210a is disposed on a substrate 100a;
- the stacked structure film includes a metal infrared reflect layer 310a and a multilayer of dielectric layers 321a, 322a and 323a sequentially on the first base layer 210a.
- a difference between the present embodiment and the previous embodiment lies in that: the dielectric layers 321a, 322a, and 323a are all disposed between the metal infrared reflection layer 310a and the first base layer 210a, and sequentially stacked on the first base layer 210a, the second base layer 220a lies on the metal infrared reflection layer 310a. That is, compared with the previous embodiment, there are no dielectric layers formed between the metal infrared reflection layer 310a and the second base layer 220a, which will not influence the implementation of the present disclosure.
- the plurality of dielectric layers includes a zinc tin oxide layer or a zinc aluminum oxide layer, which is beneficial to form the plurality of openings 311a in the metal infrared reflection layer 310a by laser.
- a thermal absorptivity and a thermal conductivity of the zinc tin oxide layer or the zinc aluminum oxide layer are relatively lower than a thermal absorptivity and a thermal conductivity of the silicon nitride in the previous embodiment, which can gather the heat produced by laser to the metal infrared reflection layer 310a, namely, the metal infrared reflection layer 310a can absorb heat, and then vaporize to form the plurality of openings 311a.
- the zinc tin oxide layer or the zinc aluminum oxide layer is disposed adjacent to the metal infrared reflection layer 310a. That is, the dielectric layer 323a adjacent to the metal infrared reflection layer 310a is the zinc tin oxide layer or the zinc aluminum oxide layer, which facilitates the metal infrared reflection layer 310a absorbing heat and then vaporizing.
- the plurality of openings 311a has a trapezoid-shaped (trumpet-shaped) cross section perpendicular to the substrate 100a. Specifically, one side of the plurality of openings 311a close to the substrate 100a has a smaller diameter, while the other side of the plurality of openings 311a far away from the substrate 100a has a relatively larger diameter.
- the plurality of openings 311a with this structure further facilitate for wireless signals transmitting.
- the hole-shaped openings 311a have a polygonal-shaped cross section parallel to the substrate 100a.
- the cross section is rectangular-shaped.
- the hole-shaped openings 311a are a plurality of square-shaped holes.
- the plurality of openings 311a may also have a pentagonal-shaped cross section, a hexagonal-shaped cross section or any other polygonal-shaped cross section parallel to the substrate 100a.
- the protection scope of the present disclosure should not be limited to the specific shape of the hole-shaped openings 311a.
- a distribution density of the plurality of openings 311a in a peripheral area of the metal infrared reflection layer 310a is higher than a distribution density of the plurality of openings 311a in a central area of the metal infrared reflection layer 310a.
- the plurality of openings 311a in the peripheral area of the metal infrared reflection layer 310a can increase the transmittance of wireless signals through the metal infrared reflection layer 310a, thus increase the transmittance of wireless signals through the low emissivity glass.
- Figure 5 schematically illustrates a cross-sectional view of the low emissivity glass.
- Figure 6 schematically illustrates a distribution of a plurality of openings 311b in a metal infrared layer 310b.
- a difference between the present embodiment and the second embodiment lies in that: a stacked structure film is disposed directly on a surface of the substrate 100b. That is, the first base layer 210b and the second base layer 220b in the second embodiment are not formed in the present embodiment, which will not influence the implementation of the present disclosure.
- the plurality of openings 311b in the metal infrared reflection layer 310b is slit-shaped.
- the slit-shaped openings 311b can allow the wireless signals to pass through as well.
- the slit-shaped openings 311b extend toward a first direction or a second direction in the metal infrared reflection layer 310b, and the slit-shaped openings 311b are parallel to each other, which can reduce or even avoid the diffraction of the wireless signals, thereby keeping the stability of the wireless signals.
- the slit-shaped openings 311b have a length ranging from 0.15 meters to 0.3 meters; the slit-shaped openings 311b have a width ranging from 50 microns to 500 microns. Since the typical wireless signals have a frequency ranging roughly from 900 MHz to 1800 MHz, and the aforementioned plurality of openings 311b has a size range close to the characteristic wavelength of the wireless signals, thereby facilitating the wireless signals going through the plurality of openings 311b.
- Figure 7 schematically illustrates a distribution of a plurality of openings in a metal infrared layer 310c.
- the slit-shaped openings include a plurality of first openings 311c extending along a first direction, and a plurality of second openings 312c extending along a second direction different from the first direction.
- the first direction is perpendicular to the second direction. That is, the plurality of first openings 311c and the plurality of second openings 312c form a criss-cross structure. Since the wireless signals have polarity, the criss-cross structure facilitates the wireless signals going through.
- a low emissivity glass is provided according to a fifth embodiment of the present disclosure.
- the difference between the present embodiment and the previous embodiment lies in that: the low emissivity glass is an architectural glass, namely, the substrate is an architectural glass. That is, the low emissivity glass provided in the present disclosure can not only block the infrared ray from entering rooms, but also increase the transmittance of wireless signals through the low emissivity glass, which enable indoor people to use the electronic equipments, such as mobile phones and radios etc.
- a vehicle window is also provided according to an embodiment of the present disclosure.
- the vehicle window includes an encapsulation, and the aforementioned low emissivity glass. Since the vehicle window includes the low emissivity glass, the vehicle window can reduce radiation, and can also ensure the transmittance of wireless signals through the low emissivity glass, namely, can ensure the wireless signals intensity inside the vehicle.
- Figure 8 schematically illustrates a flow chart of the method for manufacturing the low emissivity glass according to an embodiment of the present disclosure.
- the present embodiment takes a vehicle window glass applied to vehicles for example.
- the present disclosure is not limited to the vehicle fields, and the low emissivity glass can also be an architectural glass.
- the method for manufacturing the low emissivity glass includes:
- Step S1 providing a substrate 100
- the substrate 100 is a glass substrate.
- the low emissivity glass can also be an architectural glass. That is, the substrate 100 is the architectural glass.
- the low emissivity glass provided in the present disclosure can not only block the infrared ray from entering rooms, but also increase the transmittance of wireless signals through the low emissivity glass, and thus can enable indoor people to use the electric equipments, such as mobile phones and radios etc.
- the protection scope should not be limited by the embodiments disclosed herein.
- Step S2 covering at least a surface of the substrate 100 with a stacked structure film, wherein the stacked structure film includes a metal infrared reflection layer 310 and a plurality of dielectric layers, wherein covering with the stacked structure film includes forming a plurality of openings 311 in the metal infrared reflection layer 310.
- the metal infrared reflection layer 310 included in the stacked structure film is applied to reflect and absorb at least a portion of infrared ray, to reduce the transmittance of the infrared ray through the substrate 100, and thus to reduce the radiation intensity on the other side of the low emissivity glass with respect to the radiation source.
- the metal infrared reflection layer 310 can be made from silver or silver alloy.
- Silver or silver alloy has a good performance on blocking the infrared ray.
- the metal infrared reflection layer 310 made of the silver alloy layer includes Au-Cu alloy, Ag-Ni alloy, Ag-Cr alloy, Ag-Cu-Ni alloy, Ag-Cu-Al alloy or Ag-Cu-Pt alloy.
- the stacked structure film of low emissivity further includes a plurality of dielectric layers, for instance, a silicon nitride layer, a nickel-chromium layer, a zinc oxide layer etc, to increase the binding force between the plurality of dielectric layers and the binding force between the plurality of dielectric layers and the substrate, or to serve as a seed layer or a protective layer and so on.
- some of the plurality of dielectric layers themselves can block and absorb the ultraviolet ray and other radiations (such as, solar radiation) . Therefore, the stacked structure film overall can block a great portion of radiations.
- the transmittance of the wireless signals through the low emissivity glass can be increased by forming the plurality of openings 311 in the metal infrared reflection layer 310.
- the metal infrared reflection layer 310 is applied to reflect the infrared ray, and further to reduce the transmittance of the infrared ray through the low emissivity glass disclosed in the present invention.
- the metal infrared reflection layer 310 may shield the wireless signals. Namely, the metal infrared reflection layer 310 may block the wireless signals from going through the low emissivity glass.
- the plurality of openings 311 formed in the metal infrared reflection layer 310 facilitates the wireless signal going through the openings 311, thereby reducing the shielding effect of the low emissivity glass on the wireless signals. Therefore, the low emissivity glass as disclosed in the embodiments can not only block the infrared ray, but also increase the transmittance of wireless signals through the low emissivity glass.
- covering with the stacked structure film includes: the plurality of openings 311 is formed in the metal infrared reflection layer 310 after the formation of the dielectric layers; it can simplify the process sequence by forming the plurality of openings 311 after the formation of the dielectric layers.
- the method further includes:
- the first base layer 210 and the second base layer 220 can also be applied to protect the stacked structure film.
- a material of the first base layer 210 and the second base layer 220 is PET.
- the material of the first base layer 210 and the second base layer 220 in the present disclosure should not be limited by the embodiments disclosed herein.
- Covering the surface of the substrate with the stacked structure film includes:
- forming the stacked structure film includes:
- the first dielectric layer 320 includes a dielectric layer 321 of a titanium dioxide layer, a dielectric layer 322 of a zinc chromium layer and a dielectric layer 323 of a silicon nitride layer.
- the second dielectric layer 330 includes a dielectric layer 331 of a titanium dioxide layer, a dielectric layer 332 of a zinc chromium layer and a dielectric layer 333 of a silicon nitride layer sequentially formed on the metal infrared reflection layer 310.
- the first dielectric layer 320, the metal infrared reflection layer 310 and the second dielectric layer 330 together constitute the stacked structure film.
- the stacked structure film is formed by deposition.
- the metal infrared reflection layer 310 can be formed by a sputtering deposition method
- the first dielectric layer 320 and the second dielectric layer 330 can be formed by a chemical vapor deposition method.
- the first base layer 210 adhering and fixing the first base layer 210 to a surface of the substrate 100, so as to cover the surface of the substrate 100 with the stacked structure film. If two surfaces of the substrate 100 are needed to be covered with the stacked structure film, attaching two pieces of the first base layer 210 with the stacked structure film to the two surfaces of the substrate 100 respectively.
- forming the plurality of openings 311 in the metal infrared reflection layer 310 includes etching the metal infrared reflection layer 310 by laser ablation or mask-based etching.
- the dielectric layer has a low absorption on the energy produced by laser, and the energy of the laser will be focused on the metal infrared reflection layer 310, thereby enabling the portion of the metal infrared reflection layer 310 irradiated by laser to absorb heat and explode, then the irradiated portion of the silver layer (or silver alloy layer) vaporize to form the plurality of openings 311.
- a material of the metal infrared reflection layer 310 in the present embodiment is silver or silver alloy
- a laser with a wave length of 1064 nm can be used. It is easy for the laser with this wave length to be absorbed by silver or silver alloy, which facilitates forming the plurality of openings 311 in the metal infrared reflection layer 310.
- the plurality of openings 311 is hole-shaped.
- the hole-shaped openings 311 are independent from each other, which helps to ensure the integrality of the metal infrared reflection layer 310. Meanwhile, the hole-shaped openings 311 are less apparent with respect to the appearance of the whole low emissivity glass, which is beneficial to ensures the aesthetics of the low emissivity glass in the present invention.
- the hole-shaped openings 311 have a circular-shaped cross section parallel to the substrate 100. This shape is further in favor of simplifying the production and manufacture.
- the hole-shaped openings 311 have a diameter ranging from 50 microns to 500 microns.
- the hole-shaped openings 311 within such a diameter range can allow the wireless signals to pass through, do not influence the performance of the metal infrared reflection layer 310 on lowering the infrared ray radiation , and do not influence the aesthetics of the whole low emissivity glass either.
- the plurality of openings 311 has a rectangular-shaped cross section perpendicular to the substrate 100 (referring to Figure 1) . That is, the hole-shaped openings 311 have a diameter remaining the same through the hole, which can further simplify the production and manufacturing process.
- a total area of the plurality of openings 311 in the metal infrared reflection layer 310 accounts for 1 percent to 0.001 percent of a total area of the substrate 100, which helps to achieve a balance between the performance of the metal infrared reflection layer 310 on transmitting signals and reducing the infrared ray radiation, and the aesthetics. That is, a signal intensity inside the vehicle is large enough to support the use of some basic electronic equipments (such as mobile phones and radios) , further, the aesthetics of the metal infrared reflection layer 310 and the performance of the metal infrared reflection layer 310 on reducing the radiation of will not be influenced.
- the intensity of the wireless signals received inside vehicles by electronic equipments can be calculated using the following formula:
- dBm e represents the power (Units: dB) of the wireless signals received by the equipments, the intensity of the referenced wireless signal is 1 mW; r represents the distance between the mobile phone and mobile base station; R represents the average distance between the adjacent mobile base station.
- the mobile base station has a transmission power ranging from 20 W to 40 W, assuming the transmission power is 40 W.
- the mobile base station is usually constructed in a way of arranging three base stations in a circular region with a diameter ranging from 1.5 km to 3 km.
- the lowest power density in the region covered by the wireless signals is 0.01 uW/cm 2 ; and the mobile phone can be normally used when the power is larger than 130 dBme.
- the total area of the plurality of openings 311 accounts for 1 percent to 0.001 percent of the total area of the substrate 100 by dividing the power by power density.
- the plurality of openings 311 is evenly distributed in the metal infrared layer 310 (referring to Figure 2) . Since the substrate 100 is covered with the metal infrared reflection layer 310, that is, the plurality of openings 311 is evenly distributed on the surface of the substrate 100.
- the evenly distributed plurality of openings 311 can not only simplify the production and manufacture, but also make the transmittance of the wireless signals through each part of the low emissivity glass tend to the same.
- the plurality of openings 311 is formed after the first base layer 210 being adhered and fixed to a surface of the substrate 100, according to other embodiments of the present disclosure, the plurality of openings 311 can also be formed after forming the second base layer 220 on the surface of the stacked structure film, and before adhering and fixing the first base layer 210 to a surface of the substrate 100.
- a method for manufacturing the low emissivity glass is provided according to a second embodiment of the present disclosure.
- a difference between the present embodiment and the previous embodiment lies in that: a plurality of dielectric layers 321a, 322a, and 323a are all disposed between a metal infrared reflection layer 310a and a first base layer 210a, and sequentially stacked on the first base layer 210a, a second base layer 220a is disposed on the metal infrared reflection layer 310a. That is, compared with the previous embodiment, there are no dielectric layers formed between the metal infrared reflection layer 310a and the second base layer 220a, which does not influence the implementation of the present disclosure.
- the plurality of dielectric layers is comprised of a zinc tin oxide layer or a zinc aluminum oxide layer, which facilitates forming a plurality of openings 311a in the metal infrared reflection layer 310a by laser.
- a thermal absorptivity and a thermal conductivity of the zinc tin oxide layer or the zinc aluminum oxide layer are relatively lower than a thermal absorptivity and a thermal conductivity of the silicon nitride in the previous embodiment, which is beneficial to gather the heat produced by laser to the metal infrared reflection layer 310a, namely, the metal infrared reflection layer 310a can absorb heat, and then vaporize to form the plurality of openings 311a.
- the zinc tin oxide layer or the zinc aluminum oxide layer is disposed adjacent to the metal infrared reflection layer 310a. That is, the dielectric layer 323a adjacent to the metal infrared reflection layer 310a is the zinc tin oxide layer or the zinc aluminum oxide layer, which further facilitates the metal infrared reflection layer 310a absorbing heat and then vaporizing.
- the plurality of openings 311a is formed after the formation of the stacked structure film and before the formation of the second base layer 220a, which achieves the benefits that, the layers penetrated by laser irradiation is less (lacking of the second base layer 220a) , thus a more precise control on the operation of forming the openings 311a by laser may be realized, and the laser energy required can also be decreased.
- the plurality of openings 311a has a trapezoid-shaped (trumpet-shaped) cross section perpendicular to the substrate 100a. Specifically, one side of the plurality of openings 311a close to the substrate 100a has a smaller diameter, while the other side of the plurality of openings 311a far away from the substrate 100a has a relatively larger diameter.
- the plurality of openings 311a with this structure are further beneficial to receive wireless signals due to the trumpet shape.
- the hole-shaped openings 311a have a polygonal-shaped cross section parallel to the substrate 100a.
- the cross section is rectangular-shaped, which will not influence the implementation of the present disclosure.
- the plurality of openings 311a can also have a pentagonal-shaped cross section, a hexagonal-shaped cross section or any other polygonal-shaped cross section parallel to the substrate 100a.
- the present disclosure imposes no limitation on the specific shape of the hole-shaped openings 311a.
- a distribution density of the plurality of openings 311a in a peripheral area of the metal infrared reflection layer 310a is higher than a distribution density of the plurality of openings in a central area of the metal infrared reflection layer 310a.
- the plurality of openings 311a in the peripheral area of the metal infrared reflection layer 310a can increase the transmittance of wireless signals through the metal infrared reflection layer 310a, thus increase the transmittance of wireless signals through the low emissivity glass.
- a method for manufacturing the low emissivity glass is provided according to a third embodiment of the present disclosure.
- a difference between the present embodiment and the previous embodiment lies in that: covering a surface of a substrate with a stacked structure film includes: covering the substrate 100b directly with the stacked structure film, which is beneficial to simplify the production process.
- a plurality of openings 311b in a metal infrared reflection layer is formed after the formation of a metal infrared reflection layer 310b and before the formation of a plurality of dielectric layers, which can achieve the objective of the present disclosure as well.
- the plurality of openings 311b in the metal infrared reflection layer 310b is slit-shaped.
- the slit-shaped openings 311b allow the wireless signals to pass through as well.
- the slit-shaped openings 311b extend along a first direction or a second direction in the metal infrared reflection layer 310b, and the slit-shaped openings 311b are parallel to each other, which helps to avoid the diffraction of the wireless signals, and to keep the intensity of the wireless signals.
- the slit-shaped openings 311b have a length ranging from 0.15 meters to 0.3 meters, and the slit-shaped openings 311b have a width ranging from 50 microns to 500 microns. Since the typical wireless signals have a frequency ranging roughly from 900 MHz to 1800 MHz, and the aforementioned plurality of openings 311b have a size range close to the characteristic wavelength of the wireless signals, thereby facilitating the wireless signals going through the plurality of openings 311b.
- the slit-shaped openings 311b are not limited to extending along a first direction, or extending along a second direction.
- the slit-shaped openings 311b include a plurality of first openings 311c extending along a first direction, and a plurality of second openings 312c extending along a second direction different from the first direction.
- the first direction is perpendicular to the second direction. That is, the plurality of first openings 311c and the plurality of second openings 312c form a criss-cross structure. Since the wireless signals have polarity, the criss-cross structure facilitates the wireless signals going through.
- the method for manufacturing the low emissivity glass can form the aforementioned low emissivity glass, but is not limited to forming the aforementioned low emissivity glass.
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Abstract
L'invention concerne un verre à faible émissivité, un procédé de fabrication du verre à faible émissivité et une vitre de véhicule. Le verre à faible émissivité comprend : un substrat ; et un film à structure empilée qui recouvre au moins une surface du substrat, le film à structure empilée comprenant une couche de réflexion infrarouge métallique et une pluralité de couches diélectriques, la couche de réflexion infrarouge métallique ayant une pluralité d'ouvertures. La vitre de véhicule comprend une encapsulation et le verre à faible émissivité. Le procédé de fabrication du verre à faible émissivité consiste à : prévoir un substrat ; et recouvrir au moins une surface du substrat avec un film à structure empilée, le film à structure empilée comprenant une couche de réflexion infrarouge métallique et une pluralité de couches diélectriques, le recouvrement avec le film à structure empilée comprenant la formation d'une pluralité d'ouvertures dans la couche de réflexion infrarouge métallique. L'avantage de la présente invention est que la pluralité d'ouvertures favorisent le passage des signaux sans fil qui traversent ladite pluralité d'ouvertures, ce qui permet de réduire l'effet de blindage du verre à faible émissivité sur les signaux sans fil. Par conséquent, le verre à faible émissivité selon la présente invention permet non seulement de bloquer les rayons infrarouges, mais également d'augmenter la transmittance des signaux sans fil à travers le verre à faible émissivité.
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CN201510290013.1A CN106273881B (zh) | 2015-05-29 | 2015-05-29 | 低辐射玻璃及其制造方法、车窗 |
CN201510290013.1 | 2015-05-29 |
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Cited By (3)
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FR3088633A1 (fr) * | 2018-11-16 | 2020-05-22 | Saint-Gobain Glass France | Materiau traite thermiquement a proprietes mecaniques ameliorees |
US20210283884A1 (en) * | 2020-03-11 | 2021-09-16 | LabForInvention | Energy-efficient window coatings transmissible to wireless communication signals and methods of fabricating thereof |
CN115557711A (zh) * | 2022-10-18 | 2023-01-03 | 哈尔滨工业大学 | 一种5G信号增透的Low-E玻璃及其设计方法 |
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LU100018B1 (en) * | 2017-01-11 | 2018-08-14 | Luxembourg Inst Science & Tech List | Infrared reflective and electrical conductive composite film and manufacturing method thereof |
CN111409314B (zh) * | 2020-03-24 | 2021-11-19 | 福耀玻璃工业集团股份有限公司 | 一种汽车夹层玻璃 |
CN113820879A (zh) * | 2020-12-02 | 2021-12-21 | 法国圣戈班玻璃公司 | 用于玻璃的液晶投影层、玻璃、车辆以及制造玻璃的方法 |
CN113682009B (zh) * | 2021-07-06 | 2023-04-07 | 福耀玻璃工业集团股份有限公司 | 覆膜板总成及车辆 |
CN113735460B (zh) * | 2021-08-25 | 2023-04-07 | 福建省万达汽车玻璃工业有限公司 | 镀膜玻璃及其制造方法、以及车窗 |
CN116573862A (zh) * | 2023-04-06 | 2023-08-11 | 深圳大学 | 一种低辐射玻璃 |
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AU2003231310B2 (en) * | 2002-05-03 | 2007-03-29 | Vitro Flat Glass Llc | Substrate having thermal management coating for an insulating glass unit |
ITRM20060181A1 (it) * | 2006-03-31 | 2007-10-01 | Pilkington Italia Spa | Lastra di vetro rivestita |
CN101716837A (zh) * | 2008-10-09 | 2010-06-02 | 鸿富锦精密工业(深圳)有限公司 | 膜层结构及使用该膜层结构的电子装置壳体 |
PL2688852T3 (pl) * | 2011-03-24 | 2018-06-29 | Saint-Gobain Glass France | Przezroczyste podłoże wyposażone w wielowarstwową strukturę cienkowarstwową |
ES2731756T3 (es) * | 2012-08-28 | 2019-11-18 | Saint Gobain | Luna revestida con áreas parcialmente decapadas |
US8927069B1 (en) * | 2013-10-02 | 2015-01-06 | Eritek, Inc. | Method and apparatus for improving radio frequency signal transmission through low-emissivity coated glass |
CN104494237A (zh) * | 2014-12-01 | 2015-04-08 | 上海北玻镀膜技术工业有限公司 | 一种高透过低辐射的双银镀膜玻璃及其制造方法 |
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2015
- 2015-05-29 CN CN201510290013.1A patent/CN106273881B/zh active Active
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- 2016-05-26 WO PCT/CN2016/083454 patent/WO2016192569A2/fr active Application Filing
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR3088633A1 (fr) * | 2018-11-16 | 2020-05-22 | Saint-Gobain Glass France | Materiau traite thermiquement a proprietes mecaniques ameliorees |
US20210283884A1 (en) * | 2020-03-11 | 2021-09-16 | LabForInvention | Energy-efficient window coatings transmissible to wireless communication signals and methods of fabricating thereof |
US11511524B2 (en) * | 2020-03-11 | 2022-11-29 | LabForInvention | Energy-efficient window coatings transmissible to wireless communication signals and methods of fabricating thereof |
US12005678B2 (en) | 2020-03-11 | 2024-06-11 | LabForInvention | Energy-efficient window coatings transmissible to wireless communication signals and methods of fabricating thereof |
CN115557711A (zh) * | 2022-10-18 | 2023-01-03 | 哈尔滨工业大学 | 一种5G信号增透的Low-E玻璃及其设计方法 |
CN115557711B (zh) * | 2022-10-18 | 2023-10-03 | 哈尔滨工业大学 | 一种5G信号增透的Low-E玻璃及其设计方法 |
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CN106273881B (zh) | 2019-06-21 |
CN106273881A (zh) | 2017-01-04 |
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