WO2016181698A1 - Wet type surface treatment device - Google Patents
Wet type surface treatment device Download PDFInfo
- Publication number
- WO2016181698A1 WO2016181698A1 PCT/JP2016/057765 JP2016057765W WO2016181698A1 WO 2016181698 A1 WO2016181698 A1 WO 2016181698A1 JP 2016057765 W JP2016057765 W JP 2016057765W WO 2016181698 A1 WO2016181698 A1 WO 2016181698A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- surface treatment
- nozzle
- treatment apparatus
- nozzle cover
- wet surface
- Prior art date
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
- C25D5/026—Electroplating of selected surface areas using locally applied jets of electrolyte
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
- C25D17/12—Shape or form
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/10—Agitating of electrolytes; Moving of racks
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F3/00—Electrolytic etching or polishing
- C25F3/02—Etching
- C25F3/14—Etching locally
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F7/00—Constructional parts, or assemblies thereof, of cells for electrolytic removal of material from objects; Servicing or operating
Definitions
- the present invention relates to a wet surface treatment apparatus.
- General wet surface treatment represented by plating is performed by arranging a plurality of treatment tanks including water washing and front and rear surface treatments in the order of processes, and the surface treatment member moves through each treatment tank in order. Therefore, the wet surface treatment apparatus becomes long as a whole.
- the treatment tank needs to be larger than the surface treatment member for the immersion treatment, and the wet surface treatment apparatus becomes large. Furthermore, when performing a partial surface treatment, it is necessary to form a resist on the surface treatment portion.
- Patent Document 1 Japanese Patent Laid-Open No. 6-574957 discloses a cup in which a plating solution is jetted and a large number of plating solutions provided radially on the upper wall portion of the cup.
- An outflow hole, a ring-shaped rubber sheet provided on the upper surface of the cup, and an end of the rubber sheet are provided on the upper surface of the rubber sheet with a predetermined distance from the inner peripheral end of the rubber sheet.
- a plating connection terminal provided on the surface to be plated of the wafer in contact with the cathode electrode so that substantially the periphery of the surface to be plated is in close contact with the upper surface of the rubber sheet.
- Patent Document 2 Japanese Patent Laid-Open No. 2012-67362
- a single treatment tank is used to perform plating continuously in a single treatment tank.
- a plating apparatus provided with a switching valve for communicating only one or more pipes selected from the plurality of pipes with the treatment tank.
- Patent Document 3 Japanese Patent Laid-Open No.
- a plating apparatus provided with an outer casing having an exclusion port connected to a mask, a nozzle, and a suction mechanism for bringing the inner casing into a negative pressure state.
- Patent Documents 1 to 3 When a large-scale structural member or a structural member fixed on land is to be subjected to surface treatment, a portable surface treatment device that does not select the shape of the surface-treated member is required.
- Patent Documents 1 to 3 it is described in Patent Documents 1 to 3 above.
- the techniques described in Patent Documents 1 to 3 do not move and use the surface treatment apparatus itself, but are so-called inline apparatuses.
- it has a device configuration that matches the surface-treated member having a certain shape and size, and surface treatment is applied to any part of large structural members or structural members fixed on land. It is not something that can be done.
- patent document 2 is aiming at size reduction of a wet surface treatment apparatus by making a processing tank into one by a switching valve, since a surface-treated member must be installed in a processing tank, a processing tank is a surface to be treated. It is necessary to make it larger than the processing member, and a large structure or a structural member fixed on the land cannot be the target of the plating process.
- Patent Documents 1 and 3 a wafer or an IC chip is a target for plating. Patent Document 1 cannot perform a partial plating process. Moreover, in patent document 3, although partial plating is possible by spraying a plating solution from the nozzle connected with the mask, it has the apparatus structure supposing the flat board
- the present invention can perform a surface treatment on a desired location of the surface treatment member regardless of the location where the surface treatment member is installed and the shape and size of the surface treatment member. It is to provide a wet surface treatment apparatus.
- the present invention includes a tank that stores a processing liquid, a nozzle that injects the processing liquid onto a surface-treated member, and a power source that supplies a current to the nozzle.
- the nozzle includes a nozzle body having a flow path for the processing liquid, a nozzle cover having one end connected to the tip of the nozzle body and the other end contacting the surface-treated member, and the nozzle body and the There is provided a wet surface treatment apparatus comprising a power supply line for supplying current to a nozzle cover.
- FIG. 1 is a schematic diagram showing a first embodiment of a wet surface treatment apparatus according to the present invention. It is a top view of the nozzle cover of FIG. It is a bottom view of the nozzle cover of FIG. It is AA 'line sectional drawing of FIG. 2A. It is BB 'sectional view taken on the line of FIG. 2A. It is a schematic diagram which shows 2nd Embodiment of the wet surface treatment apparatus which concerns on this invention. It is a top view of the nozzle cover of FIG. It is a bottom view of the nozzle cover of FIG. It is AA 'line sectional drawing of FIG. 5A. It is BB 'sectional view taken on the line of FIG. 5A.
- FIG. 1 is a schematic view showing a first embodiment of a wet surface treatment apparatus according to the present invention.
- a wet surface processing apparatus 100 a supplies a current to the tank 11 that stores the processing liquid, the nozzle 4 that sprays the processing liquid onto the surface of the surface processing member 7, and the nozzle 4.
- a power source (DC power source) 8 to be operated.
- the wet surface treatment apparatus has a size and shape that can be carried by the nozzle 4, and even if the surface treatment member 7 is a large-sized or fixed structural member on the land, It is characterized by having a structure that can be subjected to surface treatment.
- a specific configuration will be described.
- the nozzle 4 has a nozzle body 4a and a nozzle cover 4b.
- the nozzle body 4a has a flow path for processing liquid therein.
- the nozzle cover 4b preferably has flexibility. As a result, the nozzle cover 4b can be installed in close contact with the surface-treated member 7 so that the processing liquid does not leak.
- the configurations of the nozzle body 4a and the nozzle cover 4b will be described in detail later.
- the shape and size of the nozzle 4 are not particularly limited, but it is preferable that the nozzle 4 has a shape and size that can be easily held by hand. Further, if necessary, it is preferable to provide the nozzle 4 with a processing liquid switching function, a current polarity switching function, a current amount adjusting function, and an injection amount adjusting function because the workability is improved.
- the power source 8 supplies a current to the processing liquid and the surface processing member 7 through the nozzle 4.
- a feed line is provided inside the nozzle body 4 a and the nozzle cover 4 b, and a current can be supplied through the feed line.
- a treatment liquid (surface treatment liquid used for surface treatment of the surface treatment member 7) accommodated in the tank 11 is passed through a treatment liquid circulation tube (hereinafter simply referred to as “tube”) 9 and a circulation pump 10. It is supplied to the nozzle 4. Further, among the processing liquid sprayed from the nozzle 4, the one not applied to the surface-treated member 7 (waste liquid) passes through an outflow hole, a tube 9 ′, and a circulation pump 10 ′ provided in the nozzle cover 4 b described later. Then, it is accommodated in the tank 11 again and reused.
- a treatment liquid circulation tube hereinafter simply referred to as “tube”
- circulation pump 10 ′ provided in the nozzle cover 4 b described later.
- the tank 11 may contain a plurality of types of processing liquids by dividing the interior into a plurality of rooms as necessary.
- a desired processing liquid can be selected by the switching valve 12 and fed to the nozzle 4.
- the collected processing liquid can be collected in a desired room by the switching valve 12 '. Switching ports of the switching valves 12 and 12 'are provided according to the number of rooms.
- FIG. 2A is a top view of the nozzle cover 4b of FIG. 1
- FIG. 2B is a bottom view of the nozzle cover 4b of FIG.
- the top view of the nozzle cover 4b is a drawing viewed from the nozzle body 4a in the direction of the nozzle cover 4b
- the bottom view of the nozzle cover 4b is from the surface of the nozzle cover 4b that contacts the surface treatment member 7 to the nozzle body. It is drawing seen toward the direction of 4a.
- 3A is a cross-sectional view taken along line AA ′ in FIG. 2A
- FIG. 3B is a cross-sectional view taken along line BB ′ in FIG. 2A.
- the power supply line 2 for supplying current to the surface-treated member 7 is connected to the tip end portion 4c of the nozzle body (the portion to which the nozzle cover 4b is connected). ) To the surface-treated member 7. That is, the power supply line 2 is provided from the power source 8 through the nozzle body 4a to the tip of the nozzle cover 4b so as to be supplied with current.
- the number of the power supply lines 2 is not particularly limited, but is preferably two or more in order to improve the power supply to the surface-treated member 7.
- the tip of the feeder 2 is exposed on the surface (contact surface) 4d where the nozzle cover 4b contacts the surface-treated member 7.
- the power supply line 2 inside the nozzle cover 4b, the power supply distance to the surface-treated member 7 can be shortened, and the power supply performance can be improved even with the surface-treated member 7 having a high electrical resistivity.
- surface treatment becomes possible.
- by providing a plurality of exposed surfaces of the power supply line 2 along the circumferential direction of the contact surface 4d it is possible to supply power so as to surround the surface-treated member 7 and to improve the uniformity of the current density distribution. Is possible.
- a coating film having a desired film thickness and a uniform film thickness can be obtained.
- the exposed surface of the feeder line 2 is preferably provided symmetrically on the top and bottom and the left and right of the contact surface 4d.
- the nozzle cover 4b is provided with an outflow hole 3 for discharging excess processing liquid (waste liquid) that has not been used for coating the surface-treated member 7.
- the outflow hole 3 is connected to the tube 9 'described above, and the processing liquid that has not been used is collected in the tank 11 and reused.
- an insoluble electrode 5 serving as a flow path for the treatment liquid 6 is provided inside the nozzle body 4a.
- the insoluble electrode 5 is provided along the flow direction of the processing liquid 6 and supplies the processing liquid 6 to the nozzle body tip 4c while supplying power to the processing liquid 6 sent from the tube 9.
- the nozzle cover 4b is made of a material having electrical insulation and chemical resistance, and can be in close contact with the member 7 to be processed having various shapes (to ensure followability to a non-planar surface). Use one with flexibility (high flexibility).
- a material having flexibility for example, a silicon resin or a fluorine resin is suitable.
- FIG. 9 is a cross-sectional view schematically showing another aspect of the nozzle cover of the wet surface treatment apparatus according to the present invention.
- the shape of the nozzle cover 4b is not particularly limited, but may be a multistage bellows type as shown in FIG. 9 in addition to the hemispherical type shown in FIGS. 3A and 3B.
- the flexibility of the nozzle cover 4b can be imparted by the material or shape of the nozzle cover 4b.
- the nozzle cover 4b and the surface-treated member 7 can be brought into close contact with each other regardless of the shape of the treatment surface of the surface-treated member 7.
- the power supply to the surface treatment member 7 and the alignment in the spray direction of the treatment liquid can be reliably performed.
- the means for fixing the nozzle cover 4b to the surface-treated member 7 is not particularly limited, but a chemical-resistant adhesive tape or the like can be used.
- the material of the feeder 2 is not particularly limited, but it is preferable to use a metal or metal alloy having a low electrical resistivity. More specifically, Cu (copper), Au (gold), etc. are suitable.
- the material of the insoluble electrode 5 is not particularly limited, but is preferably a material that has a small electrical resistance and is chemically and electrochemically stable.
- laminated electrodes such as Ti (titanium) / Pt (platinum) and Ti (titanium) / Ir (iridium), C (graphite), and the like are suitable.
- the material of the casing of the nozzle body 4a (the portion covering the flow path of the processing liquid) is not particularly limited, but a material having rigidity, chemical resistance and electrical insulation is preferable. Specifically, polypropylene, polycarbonate, fluorine resin, and the like are preferable.
- the material of the tubes 9 and 9 ' is not particularly limited, but is preferably chemical-resistant and flexible.
- the tubes 9 and 9 ′ between the processing liquid tank 11 and the switching valves 12 and 12 ′ are preferably provided according to the number of rooms in the processing liquid tank 11.
- the circulation pumps 10 and 10 ′ are not particularly limited, but it is desirable to provide two or more circulation pumps in order to improve the circulation of the treatment liquid 6. For example, it is preferable to provide at two places between the treatment liquid tank 11 and the nozzle 4 and between the outflow hole 3 of the nozzle cover 4 b and the treatment liquid tank 11.
- the treatment liquid tank 11 is not particularly limited, but it is desirable to accommodate the treatment liquid 6 including a cleaner, etching, and water washing used in a series of surface treatment steps. By providing a plurality of types of treatment liquids, a series of surface treatment steps can be continuously performed on the surface-treated member 7 with one apparatus, and a multilayer film can also be formed. Further, it is desirable that the capacity of the processing liquid tank 11 be a capacity corresponding to the processing area of the surface processing member 7.
- the features of the configuration of the wet surface treatment apparatus according to Example 1 are as follows. (1) By injecting the treatment liquid 6 from the nozzle 4, a partial wet surface treatment can be performed. (2) With the nozzle cover 4b having flexibility and the power supply line 2 exposed on the contact surface 4d of the nozzle cover 4b, power supply performance can be ensured even when the surface-treated member 7 has a non-planar shape. Become. (3) By unifying the liquid supply piping by the switching valves 12 and 12 ', the number of components of the wet surface treatment apparatus is reduced, and each component is connected by a flexible tube 9 and 9', so that the wet surface It becomes possible to improve the transportability of the processing apparatus.
- the wet surface treatment apparatus of the present invention even if the surface treatment member 7 is fixed on land with a large size such as a bridge girder and a power plant, for example, surface treatment is performed on a desired part.
- the surface repair can be easily performed without dismantling the large structural member.
- FIG. 4 is a schematic view showing a second embodiment of the wet surface treatment apparatus according to the present invention.
- 5A is a top view of the nozzle cover of FIG. 4
- FIG. 5B is a bottom view of the nozzle cover of FIG. 6A is a cross-sectional view taken along line AA ′ of FIG. 5A
- FIG. 6B is a cross-sectional view taken along line BB ′ of FIG. 5A.
- a difference of the present embodiment from the first embodiment is that a vacuum pump 16 is provided, a plurality of decompression holes 14 are provided in the contact surface 4d ′ of the nozzle cover 4b ′, and a part of the nozzle cover 4b ′.
- the connection part 15 of the decompression hole 14 and the vacuum pump 16 is provided. With this configuration, the decompression hole 14 is evacuated and exhausted by the vacuum pump 16, the adhesion between the nozzle cover 4 b ′ and the surface treatment member 7 is improved, and the surface member 7 having various surface shapes is formed.
- each decompression hole 14 is connected in the circumferential direction of the nozzle cover 4b ′, and is connected to the vacuum pump 16 from a part of the nozzle cover 4b ′.
- the number of the decompression holes 14 provided in the contact surface 4d ′ is not particularly limited, but it is preferable to provide three or more in order to increase the adhesion.
- the feeder lines 2 and the decompression holes 14 are alternately arranged.
- the power supply line 2 and the decompression hole 14 it is possible to ensure both power supply and adhesion even when the surface-treated member 7 has a non-planar shape.
- FIG. 7A is a top view schematically showing a nozzle cover of a third embodiment of the wet surface treatment apparatus according to the present invention
- FIG. 7B is a nozzle cover of the third embodiment of the wet surface treatment apparatus according to the present invention. It is a bottom view which shows typically.
- 8A is a cross-sectional view taken along line AA ′ in FIG. 7A
- FIG. 8B is a cross-sectional view taken along line BB ′ in FIG. 7A.
- the difference of the present embodiment from the first embodiment is that a plurality of decompression holes 14 are provided in the contact surface 4d ′′ of the nozzle cover 4b ′′ and an aspirator 20 is provided at the tip portion 4c of the nozzle body 4a.
- the decompression hole 14 and the aspirator 20 are connected inside the nozzle cover 4b ′′.
- the pressure reducing hole 14 is depressurized by the aspirator 20 using the flow (flow velocity) of the processing liquid 6 flowing inside the nozzle body 4b without providing a vacuum pump, so that the nozzle cover 4b is covered. It can be adsorbed to the surface treatment unit 7.
- the wet surface treatment apparatus As described above, by using the wet surface treatment apparatus according to the present invention, a desired surface treatment member can be obtained regardless of the location where the surface treatment member is installed, the shape and size of the surface treatment member. It was shown that the surface can be surface treated. According to the above configuration, the wet surface treatment apparatus can be easily transported, and for example, partial repair by wet surface treatment is possible for a non-planar member that is difficult to transport such as a large infrastructure facility installed outdoors. Become.
- this invention is not limited to the above-mentioned Example, Various modifications are included.
- the above-described embodiments have been described in detail for easy understanding of the present invention, and are not necessarily limited to those having all the configurations described.
- a part of the configuration of one embodiment can be replaced with the configuration of another embodiment, and the configuration of another embodiment can be added to the configuration of one embodiment.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
Description
上記ノズルは、上記処理液の流路を有するノズルボディーと、一端が上記ノズルボディーの先端に接続され、他端が上記被表面処理部材に接触するノズルカバーと、上記電源から上記ノズルボディー及び上記ノズルカバーに電流を供給する給電線と、を有することを特徴とする湿式表面処理装置を提供する。 In order to achieve the above object, the present invention includes a tank that stores a processing liquid, a nozzle that injects the processing liquid onto a surface-treated member, and a power source that supplies a current to the nozzle.
The nozzle includes a nozzle body having a flow path for the processing liquid, a nozzle cover having one end connected to the tip of the nozzle body and the other end contacting the surface-treated member, and the nozzle body and the There is provided a wet surface treatment apparatus comprising a power supply line for supplying current to a nozzle cover.
Claims (16)
- 処理液を収容するタンクと、前記処理液を被表面処理部材に噴射するノズルと、前記ノズルに電流を供給する電源と、を有し、
前記ノズルは、前記処理液の流路を有するノズルボディーと、一端が前記ノズルボディーの先端に接続され、他端が前記被表面処理部材に接触するノズルカバーと、前記電源から前記ノズルボディー及び前記ノズルカバーに電流を供給する給電線と、を有することを特徴とする湿式表面処理装置。 A tank for storing the processing liquid, a nozzle for injecting the processing liquid onto the surface processing member, and a power source for supplying current to the nozzle,
The nozzle includes a nozzle body having a flow path for the treatment liquid, a nozzle cover having one end connected to a tip of the nozzle body and the other end contacting the surface-treated member, and the nozzle body and the power source from the power source. And a power supply line for supplying a current to the nozzle cover. - 前記ノズルカバーは、可とう性を有することを特徴とする請求項1記載の湿式表面処理装置。 2. The wet surface treatment apparatus according to claim 1, wherein the nozzle cover has flexibility.
- 前記ノズルカバーは、前記被表面処理部材と接触する面に減圧孔を有することを特徴とする請求項1記載の湿式表面処理装置。 The wet surface treatment apparatus according to claim 1, wherein the nozzle cover has a decompression hole on a surface in contact with the surface treatment member.
- 前記ノズルカバーは、前記処理液の廃液を前記ノズルカバーの外部に排出する流出孔を有することを特徴とする請求項1記載の湿式表面処理装置。 The wet surface treatment apparatus according to claim 1, wherein the nozzle cover has an outflow hole for discharging the waste liquid of the treatment liquid to the outside of the nozzle cover.
- 前記給電線は、前記ノズルカバーの前記被表面処理部材と接触する面に露出しており、前記給電線が前記被表面処理部材に接触して前記被表面処理部材に電流を供給することを特徴とする請求項1記載の湿式表面処理装置。 The power supply line is exposed on a surface of the nozzle cover that contacts the surface treatment member, and the power supply line contacts the surface treatment member and supplies a current to the surface treatment member. The wet surface treatment apparatus according to claim 1.
- 前記処理液の流路は、不溶性電極からなることを特徴とする請求項1記載の湿式表面処理装置。 2. The wet surface treatment apparatus according to claim 1, wherein the flow path of the treatment liquid comprises an insoluble electrode.
- 前記ノズルは、前記ノズルカバーの内部を減圧するアスピレータを有し、前記減圧孔から吸引する構成であり、
前記アスピレータは、前記ノズルから噴射される前記処理液の流れによって減圧排気することを特徴とする請求項3記載の湿式表面処理装置。 The nozzle has an aspirator for depressurizing the inside of the nozzle cover, and is configured to suck from the depressurization hole.
The wet surface treatment apparatus according to claim 3, wherein the aspirator is evacuated under reduced pressure by the flow of the treatment liquid ejected from the nozzle. - 前記ノズルカバーは、耐薬品性を有する樹脂材料からなることを特徴とする請求項2記載の湿式表面処理装置。 The wet surface treatment apparatus according to claim 2, wherein the nozzle cover is made of a resin material having chemical resistance.
- 前記樹脂材料は、シリコン系樹脂又はフッ素系樹脂のいずれかを含むことを特徴とする請求項8記載の湿式表面処理装置。 9. The wet surface treatment apparatus according to claim 8, wherein the resin material contains either a silicon resin or a fluorine resin.
- 前記ノズルカバーは、多段ベローズ形状を有することを特徴とする請求項2記載の湿式表面処理装置。 The wet surface treatment apparatus according to claim 2, wherein the nozzle cover has a multi-stage bellows shape.
- 前記タンクと前記ノズルとを接続するチューブと、前記チューブに設けられた循環ポンプと、を有し、
前記タンクから前記ノズルに供給された前記処理液の廃液が、前記チューブ及び前記循環ポンプを介して前記タンクに回収される構成を有することを特徴とする請求項1記載の湿式表面処理装置。 A tube connecting the tank and the nozzle, and a circulation pump provided in the tube,
2. The wet surface treatment apparatus according to claim 1, wherein a waste liquid of the treatment liquid supplied from the tank to the nozzle is collected in the tank through the tube and the circulation pump. - 前記減圧孔に接続された真空ポンプを有し、前記真空ポンプで前記減圧孔を減圧排気して前記ノズルカバーと前記被表面処理部材とを密着させることを特徴とする請求項3記載の湿式表面処理装置。 The wet surface according to claim 3, further comprising a vacuum pump connected to the pressure reducing hole, wherein the pressure reducing hole is evacuated and exhausted by the vacuum pump to bring the nozzle cover and the surface treatment member into close contact with each other. Processing equipment.
- 前記処理タンクは、複数種類の処理液を収容することを特徴とする請求項1記載の湿式表面処理装置。 The wet surface treatment apparatus according to claim 1, wherein the treatment tank contains a plurality of kinds of treatment liquids.
- 前記電源によって前記不溶性電極の極性を変えられることを特徴とする請求項6記載の湿式表面処理装置。 The wet surface treatment apparatus according to claim 6, wherein the polarity of the insoluble electrode can be changed by the power source.
- 前記被表面処理部材は、土地に定着された大型構造部材であることを特徴とする請求項1記載の湿式表面処理装置。 The wet surface treatment apparatus according to claim 1, wherein the surface treatment member is a large structural member fixed on land.
- 前記大型構造部材は、橋又は発電プラントの構造部材であることを特徴とする請求項15記載の湿式表面処理装置。 The wet surface treatment apparatus according to claim 15, wherein the large structural member is a structural member of a bridge or a power plant.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US15/571,996 US20180087170A1 (en) | 2015-05-08 | 2016-03-11 | Wet Surface Treatment Apparatus |
JP2017517631A JP6496015B2 (en) | 2015-05-08 | 2016-03-11 | Wet surface treatment equipment |
CN201680026624.8A CN107532323B (en) | 2015-05-08 | 2016-03-11 | Wet type surface processing device |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015-095359 | 2015-05-08 | ||
JP2015095359 | 2015-05-08 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2016181698A1 true WO2016181698A1 (en) | 2016-11-17 |
Family
ID=57247981
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2016/057765 WO2016181698A1 (en) | 2015-05-08 | 2016-03-11 | Wet type surface treatment device |
Country Status (4)
Country | Link |
---|---|
US (1) | US20180087170A1 (en) |
JP (1) | JP6496015B2 (en) |
CN (1) | CN107532323B (en) |
WO (1) | WO2016181698A1 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018111859A (en) * | 2017-01-11 | 2018-07-19 | 三菱電機株式会社 | Plating apparatus and plating method |
JP2019014950A (en) * | 2017-07-10 | 2019-01-31 | メテック株式会社 | Plating treatment system and plating treatment method |
WO2019138818A1 (en) * | 2018-01-15 | 2019-07-18 | 株式会社 東芝 | Electroplating device, electrode for electroplating, and method for assembling stator coil |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3220470U (en) * | 2018-12-26 | 2019-03-07 | 株式会社Jcu | Resin film wet processing equipment |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5224022U (en) * | 1975-08-07 | 1977-02-19 | ||
JPS5546472B2 (en) * | 1974-03-04 | 1980-11-25 | ||
JPS6288756U (en) * | 1985-11-20 | 1987-06-06 | ||
JPS62247096A (en) * | 1986-04-08 | 1987-10-28 | ペ−テル・シユライベル | Apparatus for coating surface of metal or non-metal work |
JPS63153293A (en) * | 1986-12-17 | 1988-06-25 | Chugoku Denka Kogyo Kk | Surface treatment of work |
JPH0378068U (en) * | 1990-03-15 | 1991-08-07 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4988414A (en) * | 1988-05-02 | 1991-01-29 | The Boeing Company | In-situ surface treatment containment apparatus and method |
FR2641003B1 (en) * | 1988-12-23 | 1991-04-05 | Tech Milieu Ionisant | |
FR2714080B1 (en) * | 1993-12-16 | 1996-03-01 | Dalic | Device for the electrochemical, in particular localized, treatment of a conductive substrate. |
CN2410307Y (en) * | 1999-12-29 | 2000-12-13 | 广东工业大学 | Flexible tool for electrolytic and electrochemical compound machining |
KR100990854B1 (en) * | 2010-05-24 | 2010-10-29 | 주식회사 광성금속 | Dangler assembly for using plating barrel |
JP6129497B2 (en) * | 2011-09-29 | 2017-05-17 | アルメックスPe株式会社 | Continuous plating equipment |
CN104011269B (en) * | 2012-02-23 | 2016-11-02 | 丰田自动车株式会社 | The film formation device of metal tunicle and film build method |
CN203741448U (en) * | 2014-03-26 | 2014-07-30 | 长春市华强金属表面抗磨工艺有限公司 | Built-in flexible anode device for angle bending metal tube |
-
2016
- 2016-03-11 CN CN201680026624.8A patent/CN107532323B/en active Active
- 2016-03-11 JP JP2017517631A patent/JP6496015B2/en active Active
- 2016-03-11 WO PCT/JP2016/057765 patent/WO2016181698A1/en active Application Filing
- 2016-03-11 US US15/571,996 patent/US20180087170A1/en not_active Abandoned
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5546472B2 (en) * | 1974-03-04 | 1980-11-25 | ||
JPS5224022U (en) * | 1975-08-07 | 1977-02-19 | ||
JPS6288756U (en) * | 1985-11-20 | 1987-06-06 | ||
JPS62247096A (en) * | 1986-04-08 | 1987-10-28 | ペ−テル・シユライベル | Apparatus for coating surface of metal or non-metal work |
JPS63153293A (en) * | 1986-12-17 | 1988-06-25 | Chugoku Denka Kogyo Kk | Surface treatment of work |
JPH0378068U (en) * | 1990-03-15 | 1991-08-07 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018111859A (en) * | 2017-01-11 | 2018-07-19 | 三菱電機株式会社 | Plating apparatus and plating method |
JP2019014950A (en) * | 2017-07-10 | 2019-01-31 | メテック株式会社 | Plating treatment system and plating treatment method |
WO2019138818A1 (en) * | 2018-01-15 | 2019-07-18 | 株式会社 東芝 | Electroplating device, electrode for electroplating, and method for assembling stator coil |
Also Published As
Publication number | Publication date |
---|---|
US20180087170A1 (en) | 2018-03-29 |
JPWO2016181698A1 (en) | 2018-01-11 |
JP6496015B2 (en) | 2019-04-03 |
CN107532323B (en) | 2019-07-12 |
CN107532323A (en) | 2018-01-02 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6496015B2 (en) | Wet surface treatment equipment | |
CN102953104B (en) | For the lippacking and contact element of semi-conductor electricity coating apparatus | |
JP5469178B2 (en) | System for plating a conductive substrate and substrate holder for holding a conductive substrate during the plating | |
TW200704315A (en) | Plating apparatus, plating method, and method for manufacturing semiconductor device | |
US9534310B2 (en) | Device for vertical galvanic metal, preferably copper, deposition on a substrate and a container suitable for receiving such a device | |
US9982359B2 (en) | Surface treatment method and surface treatment device | |
US8316796B2 (en) | Film coating system and isolating device thereof | |
US20080017505A1 (en) | Anode holder | |
TWI469179B (en) | Plasma apparatus | |
JP2008184687A (en) | Electroless plating apparatus and electroless plating method | |
US11105014B2 (en) | Distribution system for chemical and/or electrolytic surface treatment | |
KR101132092B1 (en) | Apparatus to Plate Substrate | |
US10312061B2 (en) | Vacuum apparatus for vacuum treating substrate | |
US7811424B1 (en) | Reducing mechanical resonance and improved distribution of fluids in small volume processing of semiconductor materials | |
JP5915602B2 (en) | Metal film forming apparatus and film forming method | |
KR101322771B1 (en) | Etching apparatus for printed circuit board | |
KR101819382B1 (en) | Fixed-type plasma head for treatment of organic or inorganic substance | |
JP2016108598A (en) | Surface treatment apparatus, and surface treatment method | |
KR102057258B1 (en) | Apparatus for planting | |
CN109273383B (en) | Chemical liquid tank device | |
JP2006192359A (en) | Wet treatment apparatus | |
KR100674551B1 (en) | A plating device and a method for manufacturing of semiconductor device | |
CN108906351B (en) | Nozzle and chemical liquid bath device | |
KR102205172B1 (en) | Apparaus for Forming an Oxidization layer on a Inner surface of Metal Products | |
KR20200047141A (en) | Liquid electrode plasma apparatus, metal coating apparatus and liquid sterilizing apparatus using same |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 16792423 Country of ref document: EP Kind code of ref document: A1 |
|
ENP | Entry into the national phase |
Ref document number: 2017517631 Country of ref document: JP Kind code of ref document: A |
|
WWE | Wipo information: entry into national phase |
Ref document number: 15571996 Country of ref document: US |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 16792423 Country of ref document: EP Kind code of ref document: A1 |