CN109273383B - Chemical liquid tank device - Google Patents

Chemical liquid tank device Download PDF

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Publication number
CN109273383B
CN109273383B CN201810989226.7A CN201810989226A CN109273383B CN 109273383 B CN109273383 B CN 109273383B CN 201810989226 A CN201810989226 A CN 201810989226A CN 109273383 B CN109273383 B CN 109273383B
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China
Prior art keywords
nozzle
sleeve
liquid
nozzles
chemical
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CN201810989226.7A
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Chinese (zh)
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CN109273383A (en
Inventor
徐融
孙文斌
苏界
杨永刚
蒋阳波
廖昌洋
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Yangtze Memory Technologies Co Ltd
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Yangtze Memory Technologies Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/67086—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Weting (AREA)

Abstract

The invention relates to a chemical liquid bath device, comprising: the tank body is used for containing chemical liquid and wafers to be processed; the spray nozzles are long-strip-shaped, are arranged on the inner wall and the bottom of the groove body in parallel, are perpendicular to the wafer placing plane and are used for spraying chemical liquid into the groove body, and the liquid spraying direction of the spray nozzles is parallel to the wafer placing plane; the liquid ejection state of each nozzle can be controlled individually. The chemical liquid tank device has controllable solution uniformity.

Description

Chemical liquid tank device
Technical Field
The invention relates to the field of semiconductor equipment, in particular to a chemical liquid tank device.
Background
In a semiconductor process, a wafer is often required to be put into a chemical liquid tank to perform wet etching or cleaning processes. The chemical liquid tank can contain acid solution, alkaline solution or deionized water and the like, and corresponds to different treatment processes. The chemical liquid bath device has considerable necessity in the process of long processing time, high temperature and special distribution of uniformity, and has the advantages of high productivity and low cost.
The circulation direction of the chemical liquid in the chemical liquid tank determines the cleaning capability or etching uniformity of the chemical liquid tank on the wafer. The chemical liquid tank is internally provided with a nozzle, and the chemical liquid is sprayed out through the nozzle to enable the liquid in the chemical liquid tank to flow so as to improve the uniformity of the concentration distribution of the substances in the chemical liquid.
In the existing chemical liquid tank device, a nozzle with a fixed position and a fixed angle is usually arranged in a tank body, so that the flow direction of liquid in the chemical liquid tank is single, and the uniformity of the concentration distribution of the liquid is still required to be further improved.
Disclosure of Invention
The technical problem to be solved by the invention is to provide a chemical liquid tank device, which can improve the liquid distribution uniformity in the chemical liquid tank device.
The present invention provides a chemical liquid tank device, comprising: the tank body is used for containing chemical liquid and wafers to be processed; the spray nozzles are long-strip-shaped, are arranged on the inner wall of the tank body in parallel, are perpendicular to the wafer placing plane and are used for spraying chemical liquid into the tank body, and the liquid spraying direction of the spray nozzles is parallel to the wafer placing plane; the liquid ejection state of each nozzle can be controlled individually.
Optionally, at least one nozzle is disposed at the bottom of the tank bottom; the inner walls of two opposite sides of the groove body, which are vertical to the wafer placing plane, are respectively provided with the same number of nozzles.
Alternatively, each nozzle has a different liquid ejection direction.
Optionally, the nozzle has a plurality of nozzles arranged along a length direction.
Optionally, the nozzle comprises a plurality of sub-nozzles arranged along the length direction.
Optionally, the three or more nozzles are connected to the main pipeline through a branch pipeline, and each branch pipeline is provided with a valve.
Optionally, the device comprises 7 nozzles, wherein one nozzle is arranged at the bottom of the tank body, and the other six nozzles are symmetrically arranged on the inner walls of the two sides of the tank body.
Optionally, the nozzle comprises a nozzle body and a sleeve sleeved outside the nozzle body; the nozzle body is provided with a liquid outlet, the sleeve is provided with at least one group of spray holes arranged along the length direction, and the plurality of spray holes in each group face to the same direction.
Optionally, a sealed cavity is formed between the end of the sleeve and the nozzle body, and is used for containing the chemical liquid sprayed from the nozzle body.
Optionally, the sleeve has more than two groups of spray holes arranged along the length direction, and the spray holes of different groups face different directions.
Optionally, the sleeve may be rotatable around the nozzle body to adjust the direction of the nozzle holes on the sleeve.
Optionally, a motor is disposed at an end of the nozzle, and is connected to the sleeve for controlling rotation of the sleeve.
Optionally, a rotary bearing structure is arranged between the sleeve and the nozzle to support the sleeve to rotate.
Optionally, the sleeve is provided with 3-8 groups of spray holes, which face different directions respectively.
The chemical liquid tank device of the invention is provided with at least more than 3 nozzles, and the liquid spraying state of each nozzle can be independently controlled. Therefore, the nozzles in different liquid spraying directions can be freely matched to meet the process requirement.
Furthermore, each nozzle comprises a nozzle body and a sleeve, and the sleeve is provided with spray holes in different directions, so that the flow of liquid in the groove in all directions can be improved in the liquid spraying process, and the uniformity of the liquid can be improved. Furthermore, in the liquid spraying process, the sleeve can be controlled to rotate, the liquid spraying direction of the spray holes in the sleeve is continuously changed, and the liquid flow direction in the groove body meets the process requirements. According to different process requirements, the sleeve outside the nozzle body can be replaced.
Drawings
FIGS. 1a to 1c are schematic views of several liquid spraying directions of a nozzle of a conventional chemical bath device;
FIGS. 2 to 4 are schematic structural views of a chemical tank device according to an embodiment of the present invention;
FIG. 5 is a schematic view of the liquid control of the chemical bath apparatus according to one embodiment of the present invention;
FIGS. 6 to 8 are schematic structural views of a chemical tank device according to an embodiment of the present invention;
FIG. 9 is a cross-sectional view of a nozzle according to an embodiment of the present invention.
Detailed Description
The following describes in detail a specific embodiment of the chemical tank apparatus according to the present invention with reference to the accompanying drawings.
The inventors have found that the nozzles within current chemical bath apparatus are typically two to three and are fixed in position. Referring to FIGS. 1 a-1 c, respectively, a chemical bath apparatus with three nozzles is shown, where there are generally only three liquid flow directions. The nozzles are shown in FIG. 1a spraying liquid inward at 45, FIG. 1b spraying liquid outward at 45, and FIG. 1c spraying liquid upward perpendicular to the slot bottom. The nozzles in the tank body are only provided with a plurality of fixed liquid spraying directions, and the requirement of chemical liquid uniformity distribution cannot be met.
Therefore, the inventor proposes a novel chemical liquid tank device which can improve the uniformity of chemical liquid distribution.
Please refer to fig. 2 to fig. 4, which are schematic structural views of the chemical solution tank device. FIG. 2 is a front view; FIG. 3 is a schematic top view; fig. 4 is a side view schematically.
The chemical liquid groove device comprises a groove body 100 and a nozzle arranged in the groove body 100. In this embodiment, the top of the tank 100 is further provided with a cover plate 101.
The tank 100 is used for containing chemical liquid and wafers to be processed. The chemical liquid can be deionized water or acidic or alkaline etching solution such as phosphoric acid, hydrofluoric acid, KOH and the like. And soaking the wafer to be processed in chemical liquid in the tank body 100 for polar washing or etching and the like.
A schematic view of a wafer 200 placed in the tank 100 is shown in fig. 2. The wafer 200 is placed perpendicular to the bottom of the tank 100 and perpendicular to two opposite sidewalls of the tank 100, and the wafer 200 is perpendicular to the x-z plane. Multiple wafers 200 which are placed in parallel can be sequentially and simultaneously placed in the tank body 100, so that the multiple wafers 200 can be discharged at the same time, and the treatment efficiency is improved. A plurality of wafers 200 are placed in parallel and arranged along the y-axis direction. Specifically, the wafer 200 may be placed in a wafer placing rack and then placed in the tank 100 to fix the position of the wafer 200.
The chemical liquid spraying device is characterized in that a plurality of nozzles are arranged in the tank body 100 and connected with an external chemical liquid circulating pipeline for spraying chemical liquid into the tank body 100, so that the liquid in the tank body 100 flows, and the distribution uniformity of the concentration of each component in the chemical liquid is improved. The chemical liquid circulation pipeline obtains the chemical liquid from the tank body 100, and the chemical liquid is sprayed into the tank body 100 through the nozzle after being subjected to circulation filtration.
In this embodiment, 7 nozzles, namely, nozzle 1 to nozzle 7, are disposed in the tank 100. The nozzle 7 is disposed at the bottom of the tank 100, and the nozzles 1 to 6 are disposed at inner walls of two opposite sides of the tank 100 perpendicular to a plane where the wafer 200 is placed. In this embodiment, three nozzles are disposed at each side wall, and are symmetrically disposed. In other embodiments, more than three nozzles are disposed in the tank 100, preferably 5 to 7 nozzles. One skilled in the art can set an appropriate number of nozzles according to the size of the tank 100. At least one nozzle is arranged at the bottom of the tank body 100, and the other nozzles are arranged on the side wall. Preferably, the positions of the nozzles on the side walls of the two sides are symmetrically arranged.
Nozzle 1 to nozzle 7 are rectangular shape, tubulose, parallel arrangement in the inner wall and the bottom department of cell body 100 place the plane perpendicular with wafer 200, be used for to spout into chemical liquid in the cell body 100, the hydrojet direction of nozzle 1 ~ 7 is parallel with wafer 200's the plane of placing. The nozzles 1-7 are in the shape of a long strip and are tubular, and a plurality of spray holes are formed in the tube wall of each nozzle along the length direction. In other embodiments, each of the nozzles 1 to 7 may have a plurality of sub-nozzles arranged in a longitudinal direction.
A side view of a plurality of wafers 200 disposed within the tank 100 is shown in fig. 4. Since the nozzles 1 to 7 are strip-shaped, liquid can be sprayed to 200 positions of each wafer.
Referring to fig. 2, the nozzles 1 to 7 have different liquid ejecting directions, and the liquid ejecting directions of the nozzles are indicated by arrows. The spraying direction of each nozzle 1-7 can be set by those skilled in the art according to the requirement. The liquid ejection states of the respective nozzles are individually controllable, the liquid ejection states including: whether to spray liquid, the direction of the sprayed liquid, the flow rate, etc.
In this embodiment, the nozzles 1 to 7 are connected to a main pipe 8 through branch pipes, respectively, and the chemical liquid is distributed to each nozzle from the main pipe 8. In order to facilitate the individual control of the liquid spraying state of each nozzle, the branch circuits connecting each nozzle are provided with valves for controlling the on-off state of the pipeline between the main pipeline 8 and each nozzle.
The chemical liquid tank device also comprises a controller which is connected with the valves on the branch pipes and is used for controlling the states of the valves.
Since the nozzles 1 to 7 have different liquid spraying directions, the flow direction and the concentration distribution state of the liquid in the tank 100 can be controlled by different nozzle combinations.
Please refer to fig. 5, which is a schematic diagram illustrating a liquid control according to an embodiment of the present invention.
In this embodiment, when the nozzles 1 and 6 are opened or the nozzles 2 and 5 are opened, or the nozzles 1, 6, 2 and 5 are simultaneously opened, the liquid in the tank 100 flows in a ring shape around the edge of the wafer 200. In one embodiment, the wafer 200 is wet etched, and the etching liquid at the edge of the wafer 200 flows faster, so that the etching rate at the edge of the wafer 200 is higher than that at the center of the wafer 200.
In other specific embodiments, under the condition that the distribution uniformity of the chemical liquid has a high requirement, all the nozzles 1 to 7 can be opened, so that the chemical liquid in the tank body 100 flows in all directions, and the super-uniformity of the solution is realized.
The chemical liquid tank device of the embodiment of the invention is provided with at least 3 nozzles, and the liquid spraying state of each nozzle can be independently controlled. Therefore, the nozzles in different liquid spraying directions can be freely matched to meet the process requirement.
Please refer to fig. 6 to 8, which are schematic structural views of a chemical tank device according to another embodiment of the present invention. Fig. 6 is a front view, fig. 7 is a top view, and fig. 8 is a side view.
In this embodiment, three nozzles 600 are disposed in the tank body 100 of the chemical liquid tank device, and are disposed at the bottom of the tank body 100.
The nozzle 600 has a plurality of liquid spraying directions, and preferably, the number of the liquid spraying directions of a single nozzle 600 can be 3 to 8. Specifically, the nozzle 600 includes a nozzle body 601 and a sleeve 602 sleeved outside the nozzle body 601. The sleeve 602 has at least one set of nozzle holes 603 arranged along the length direction, the plurality of nozzle holes 603 in each set face the same direction, and the nozzle holes 603 in different sets face different directions.
A sealed cavity is formed between the end of the sleeve 602 and the nozzle body 601 for containing the chemical liquid sprayed from the nozzle body 601. The sleeve 602 may be made of a corrosion-resistant material such as quartz, teflon, or the like.
The sleeve 602 has more than two sets of nozzles 603 arranged along the length direction, and different sets of nozzles 603 face different directions. The orifices 603 in the same group are distributed along the length direction and arranged in a row, all facing the same direction. Preferably, the sleeve 602 has 3 to 8 sets of nozzles 603 facing different directions. Referring to fig. 9, a cross-sectional structure of the nozzle 600 is shown, in which the nozzle 600 has 8 sets of nozzles 603 with different liquid ejection directions.
Further, in this embodiment, the sleeve 602 can rotate around the nozzle body 601, so that the spraying direction of the spray holes 603 on the sleeve 602 changes.
In one embodiment, the end of the sleeve 602 is connected to the outer wall of the nozzle body 601 through a sealing ring, and a rotary bearing structure may be disposed between the sleeve 602 and the nozzle body 601 to support the sleeve 602 for rotation.
In this embodiment, a motor 700 is disposed at the end of the nozzle 600, and the motor 700 is connected to the sleeve 602 for controlling the sleeve 602 to rotate around the nozzle body 601.
The sleeve 602 of each nozzle 600 has a plurality of sets of nozzles 603 in different directions, so that the flow of the liquid in the tank 100 in all directions can be improved during the liquid spraying process, and the uniformity of the liquid can be improved. Further, in the liquid spraying process, the sleeve 602 may be controlled to rotate, and the liquid spraying direction of the nozzle 603 on the sleeve 602 is continuously changed, so that the liquid flow direction in the tank 100 meets the process requirement. The sleeve 602 outside the nozzle body 601 can also be replaced according to different process requirements.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.

Claims (11)

1. A chemical bath apparatus, comprising:
the tank body is used for containing chemical liquid and wafers to be processed;
the spray nozzles are long-strip-shaped, are arranged on the inner wall of the tank body in parallel, are perpendicular to the wafer placing plane and are used for spraying chemical liquid into the tank body, and the liquid spraying direction of the spray nozzles is parallel to the wafer placing plane;
the liquid spraying state of each nozzle can be independently controlled so as to improve the uniformity of chemical liquid distribution;
the nozzle comprises a nozzle body and a sleeve sleeved outside the nozzle body; the nozzle body is provided with a liquid outlet, the sleeve is provided with more than two groups of spray holes arranged along the length direction, the spray holes in each group face the same direction, the spray holes in different groups face different directions, and the sleeve can rotate around the nozzle body so as to adjust the directions of the spray holes in the sleeve.
2. A chemical bath arrangement according to claim 1, wherein at least one nozzle is provided at the bottom of the bath; the inner walls of two opposite sides of the groove body, which are vertical to the wafer placing plane, are respectively provided with the same number of nozzles.
3. A chemical bath arrangement according to claim 1, wherein each nozzle has a different direction of liquid spray.
4. A chemical bath arrangement according to claim 1, wherein the nozzle has a plurality of orifices arranged lengthwise.
5. A chemical bath arrangement according to claim 1, wherein the nozzle comprises a plurality of sub-nozzles arranged lengthwise.
6. A chemical bath arrangement according to claim 1, wherein the three or more nozzles are each connected to the main conduit by a branch conduit, each branch conduit being provided with a valve.
7. A chemical liquid bath device according to claim 1, comprising 7 nozzles, one of which is disposed at the bottom of the bath body and the other six of which are symmetrically disposed at the inner walls of the two sides of the bath body.
8. A chemical bath arrangement according to claim 1, wherein a sealed chamber is formed between the end of the sleeve and the nozzle body for receiving chemical liquid sprayed from the nozzle body.
9. A chemical bath arrangement according to claim 1, wherein the end of the nozzle is provided with a motor connected to the sleeve for controlling rotation of the sleeve.
10. A chemical bath arrangement according to claim 1, wherein a rotary bearing arrangement is provided between the sleeve and the nozzle to support the sleeve for rotation.
11. A chemical bath arrangement according to claim 1, wherein the sleeve is provided with 3 to 8 sets of orifices, each oriented in a different direction.
CN201810989226.7A 2018-08-28 2018-08-28 Chemical liquid tank device Active CN109273383B (en)

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Application Number Priority Date Filing Date Title
CN201810989226.7A CN109273383B (en) 2018-08-28 2018-08-28 Chemical liquid tank device

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Application Number Priority Date Filing Date Title
CN201810989226.7A CN109273383B (en) 2018-08-28 2018-08-28 Chemical liquid tank device

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CN109273383A CN109273383A (en) 2019-01-25
CN109273383B true CN109273383B (en) 2021-04-13

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Publication number Priority date Publication date Assignee Title
CN111785623B (en) * 2020-06-15 2022-11-04 上海华虹宏力半导体制造有限公司 Wet etching method

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JP2912538B2 (en) * 1993-12-08 1999-06-28 大日本スクリーン製造株式会社 Immersion type substrate processing equipment
JP3161521B2 (en) * 1998-03-13 2001-04-25 日本電気株式会社 Semiconductor device manufacturing method and cleaning device
KR100271772B1 (en) * 1998-09-29 2001-02-01 윤종용 Semiconductor Wet Etching Equipment
JP3851486B2 (en) * 2000-03-27 2006-11-29 大日本スクリーン製造株式会社 Substrate processing apparatus and substrate processing method
JP2006108512A (en) * 2004-10-07 2006-04-20 Ses Co Ltd Substrate treatment apparatus
CN101620982B (en) * 2008-07-02 2011-07-06 中芯国际集成电路制造(北京)有限公司 Method for cleaning wafer and cleaning device
CN201315314Y (en) * 2008-12-19 2009-09-23 中芯国际集成电路制造(上海)有限公司 Wafer cleaning device
CN201538818U (en) * 2009-10-22 2010-08-04 上海华虹Nec电子有限公司 Water tank device of wet oxidation film etching equipment
CN201880705U (en) * 2010-11-23 2011-06-29 浙江芯能光伏科技有限公司 Cleaning device for silicon chip
CN102437014A (en) * 2011-11-29 2012-05-02 上海宏力半导体制造有限公司 Wet etching cleaning device

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