WO2016179896A1 - 麦克风密封结构及电子设备 - Google Patents

麦克风密封结构及电子设备 Download PDF

Info

Publication number
WO2016179896A1
WO2016179896A1 PCT/CN2015/084386 CN2015084386W WO2016179896A1 WO 2016179896 A1 WO2016179896 A1 WO 2016179896A1 CN 2015084386 W CN2015084386 W CN 2015084386W WO 2016179896 A1 WO2016179896 A1 WO 2016179896A1
Authority
WO
WIPO (PCT)
Prior art keywords
microphone
circuit board
sealing structure
sound
casing
Prior art date
Application number
PCT/CN2015/084386
Other languages
English (en)
French (fr)
Inventor
孙厚鑫
Original Assignee
中兴通讯股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 中兴通讯股份有限公司 filed Critical 中兴通讯股份有限公司
Publication of WO2016179896A1 publication Critical patent/WO2016179896A1/zh

Links

Images

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/08—Mouthpieces; Microphones; Attachments therefor
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor

Definitions

  • the utility model relates to the field of electronic devices, in particular to a microphone sealing structure and an electronic device.
  • the microphone is a conventional configuration component of an electronic device that needs to be sealed with the housing of the electronic device when inputting voice.
  • the sound direction of the existing microphone is perpendicular to the sound direction of the appearance surface of the electronic device, and the sound hole of the main board and the sound hole of the rear case are connected through a silicone sleeve part, and the through hole is passed through the contact surface of the main board and the rear case. Sealed with a press fit.
  • the silicone sleeve is relatively soft, the silicone sleeve is easily deformed, and the position of contact with the main board and the rear shell is not tightly pressed, thereby resulting in poor stability of the sealing effect, and it is necessary to repeatedly test and modify to achieve a guaranteed sealing effect, which greatly wastes development. Time and developer energy.
  • the present invention is intended to provide a microphone sealing structure and an electronic device, which aims to solve the technical problem of poor stability of the microphone sealing effect of the existing electronic device.
  • the present invention provides a microphone sealing structure, the microphone is mounted on a circuit board, and a first sound hole is formed on the circuit board corresponding to the position of the microphone, and the microphone sealing structure includes a casing and is mounted on a sealing assembly in the outer casing, wherein the outer casing is formed with a second sound hole, the sealing assembly comprising a supporting skeleton and a first flexible sealing member mounted on the supporting skeleton, the first flexible sealing member and the The circuit board and the outer casing are sealingly connected to form a sound chamber, and the first sound hole and the second sound hole are both connected to the sound chamber.
  • the microphone sealing structure further includes a second flexible seal, The circuit board and the outer casing at the sound chamber are sealed and connected.
  • the outer casing includes a front casing and a rear casing that cooperates with the front casing
  • the rear casing includes a bottom plate and a plurality of side plates connected to a periphery of the bottom plate, the bottom plate and the side A receiving cavity is formed between the plates, and the circuit board is mounted in the receiving cavity.
  • the support frame is formed on a surface of the front case facing the bottom plate, and the first flexible seal is sealingly connected to the circuit board and the side plate.
  • the support frame is installed between the front case and the circuit board, and the first flexible seal is sealingly connected to the circuit board, the front case and the side plate.
  • the microphone sealing structure further includes a third flexible seal configured to sealingly connect the front case and the rear case at the sound cavity.
  • the second flexible seal is integrally formed with the third flexible seal.
  • the present invention further provides an electronic device having a microphone sealing structure, the microphone is mounted on the circuit board, and the first sound hole is formed on the circuit board corresponding to the position of the microphone.
  • the microphone sealing structure includes a housing and a sealing assembly mounted in the housing, the housing is formed with a second sound hole, the sealing assembly includes a supporting frame and a first flexible seal mounted on the supporting frame The first flexible sealing member is sealingly connected to the circuit board and the outer casing to form a sound chamber, and the first sound hole and the second sound hole are both connected to the sound chamber.
  • the electronic device further includes a dustproof net installed in the sound cavity and covering the second sound hole.
  • the microphone sealing structure further includes a second flexible seal configured to sealingly connect the circuit board and the outer casing at the sound chamber.
  • the outer casing includes a front casing and a rear casing that cooperates with the front casing
  • the rear casing includes a bottom plate and a plurality of side plates connected to a periphery of the bottom plate, the bottom plate and the side A receiving cavity is formed between the plates, and the circuit board is mounted in the receiving cavity.
  • the support frame is formed on a surface of the front case facing the bottom plate, and the first flexible seal is sealingly connected to the circuit board and the side plate.
  • the support frame is installed between the front case and the circuit board, and the first flexible seal is sealingly connected to the circuit board, the front case and the side plate.
  • the microphone sealing structure further includes a third flexible seal configured to sealingly connect the front case and the rear case at the sound cavity.
  • the microphone sealing structure and the electronic device of the utility model support the first flexible sealing member through the supporting skeleton, limit the deformation amount of the first flexible sealing member, prevent the first flexible sealing member from being excessively deformed, and further ensure the sealing effect of the lifting. stability.
  • FIG. 1 is a cross-sectional structural view showing an embodiment of a microphone sealing structure of the present invention
  • FIG. 2 is a schematic perspective view showing the front casing of the microphone sealing structure shown in FIG. 1;
  • FIG. 3 is a schematic perspective structural view of the front case of the microphone sealing structure shown in FIG. 2.
  • the present invention provides a microphone sealing structure.
  • the microphone 100 is mounted on the circuit board 200, and the first sound is formed on the circuit board 200 corresponding to the position of the microphone 100.
  • the hole sealing structure includes a housing 300 and a sealing assembly 400 mounted in the housing 300.
  • the housing 300 is formed with a second sound hole 302.
  • the sealing assembly 400 includes a supporting frame 420 and is mounted on the housing.
  • the first flexibility on the support skeleton 420 a sealing member 440, the first flexible sealing member 440 is sealingly connected to the circuit board 200 and the outer casing 300 to form a sound chamber 500, and the first sound hole 202 and the second sound hole 302 are both opposite to the sound chamber 500 connected.
  • the first flexible sealing member 440 is supported by the supporting frame 420, limiting the deformation amount of the first flexible sealing member 440, preventing the first flexible sealing member 440 from being excessively deformed, and further having Guaranteed stability of the sealing effect.
  • the outer casing 300 includes a front casing 320 and a rear casing 340 that cooperates with the front casing 320.
  • the rear casing 340 includes a bottom plate 342 and a connection and a periphery of the bottom plate 342.
  • a plurality of side plates 344 are formed, and a receiving cavity 346 is formed between the bottom plate 342 and the side plate 344.
  • the circuit board 200 is mounted in the receiving cavity 346.
  • the microphone 100 is mounted on a surface of the circuit board 200 facing the bottom plate 342, and the support frame 420 is formed on the front housing 320.
  • the first flexible sealing member 440 is sleeved on the periphery of the supporting frame 420, and is sealingly connected to the circuit board 200 and the side plate 344 adjacent to the microphone 100, thereby forming a sound chamber.
  • the second sound hole 302 is formed on the side plate 344 adjacent to the microphone 100.
  • a snap structure such as a barb 423 may be formed at a joint of the support frame 420 and the front case 320 to connect the first flexible seal 440 and the support.
  • the skeleton 420 is fixedly connected.
  • the microphone sealing structure further includes a second flexible sealing member 600 configured to sealingly connect the circuit board 200 at the sound chamber 500 with the outer casing 300;
  • the microphone sealing structure further includes a front case 320 and a rear case 340 configured to sealingly connect the sound chamber 500.
  • the first The second flexible seal 600 and the third flexible seal 700 are integrally formed of a plastic material.
  • the second flexible sealing member 600 is disposed between the circuit board 200 and the outer casing 300 (the front casing 320 or the rear casing 340), and the third flexible sealing member 700 is disposed on the front casing 320.
  • a sealed connection between the front case 320, the rear case 340, and the circuit board 200 is achieved.
  • the front housing 320 is formed with a mounting portion 322, and the mounting portion 322 is formed with a relief portion 324, and the mounting portion 322 is away from the front end of the front housing 320.
  • the third flexible sealing member 700 is disposed at a junction of the front case 320 and the rear case 340, thereby implementing the front case 320, a sealed connection between the rear case 340 and the circuit board 200.
  • the escaping portion 324 is disposed corresponding to the second sound hole 302 to realize the communication between the second sound hole 302 and the sound chamber 500, thereby ensuring the effect of voice input.
  • the support frame 420 can also be independently disposed and installed in the outer casing 300. The above technical effects can also be achieved. Specifically, the support frame 420 is mounted on the front case 320 and the Between the circuit boards 200, the first flexible sealing member 440 is sealingly connected to the circuit board 200, the front case 320, and the side plate 344.
  • first flexible sealing member 440 and the supporting frame 420 may be separately formed and fixedly mounted by being engaged, or may be integrally formed by two-color injection molding, and the above technical effects can be achieved. .
  • the present invention further provides an electronic device.
  • the electronic device has a microphone sealing structure, and the microphone sealing structure includes all the technical solutions in the foregoing embodiments shown in FIG. 1 to FIG. Reference may be made to the foregoing embodiments, and details are not described herein.
  • the electronic device further includes a dustproof net 800, and the air filter 800 is installed in the sound cavity 500 and covers the second sound hole 302. To prevent dust or the like from falling into the sound chamber 500 by the second sound hole 302.
  • the microphone sealing structure and electronic device of the present invention pass through the supporting skeleton
  • the first flexible sealing member is supported to limit the deformation amount of the first flexible sealing member, thereby preventing the first flexible sealing member from being excessively deformed, thereby ensuring the stability of the sealing effect.
  • the embodiment of the present invention supports the first flexible sealing member by the supporting skeleton, limits the deformation amount of the first flexible sealing member, prevents the first flexible sealing member from being excessively deformed, and further ensures the stability of the sealing effect.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Manufacturing & Machinery (AREA)
  • Details Of Audible-Bandwidth Transducers (AREA)

Abstract

一种麦克风密封结构及电子设备，麦克风（100）安装于电路板（200）上，所述电路板（200）上对应所述麦克风（100）的位置形成有第一音孔（202），所述麦克风密封结构包括外壳（300）及安装于所述外壳（300）内的密封组件（400），所述外壳（300）上形成有第二音孔（302），所述密封组件（400）包括支撑骨架（420）及安装于所述支撑骨架（420）上的第一柔性密封件（440），所述第一柔性密封件（440）与所述电路板（200）及所述外壳（300）密封连接，形成音腔（500），所述第一音孔（202）与第二音孔（302）均与所述音腔（500）连通。

Description

麦克风密封结构及电子设备 技术领域
本实用新型涉及电子设备领域，尤其涉及一种麦克风密封结构及电子设备。
背景技术
麦克风是电子设备的常规配置元件，在输入语音时需要与电子设备的壳体密封配置。现有的麦克风的出音方向和电子设备外观面的出音方向垂直，并通过一个硅胶套零件，将主板的音孔和后壳的音孔连通，同时在主板和后壳接触面通过过盈配合压合实现密封。然而由于硅胶套比较软，硅胶套容易变形，与主板和后壳接触的位置压合不紧，进而导致密封效果稳定性差，且要反复实验测试与修改才能达到保证的密封效果，极大地浪费开发时间和开发人员精力。
发明内容
本实用新型期望提供一种麦克风密封结构及电子设备，旨在解决现有电子设备的麦克风密封效果稳定性差的技术问题。
为实现上述目的，本实用新型提供一种麦克风密封结构，麦克风安装于电路板上，所述电路板上对应所述麦克风的位置形成有第一音孔，所述麦克风密封结构包括外壳及安装于所述外壳内的密封组件，所述外壳上形成有第二音孔，所述密封组件包括支撑骨架及安装于所述支撑骨架上的第一柔性密封件，所述第一柔性密封件与所述电路板及所述外壳密封连接，形成音腔，所述第一音孔与第二音孔均与所述音腔连通。
作为一种实施方式，所述麦克风密封结构还包括第二柔性密封件，配 置为密封连接所述音腔处的所述电路板与所述外壳。
作为一种实施方式，所述外壳包括前壳及与所述前壳相配合的后壳，所述后壳包括底板及连接与所述底板周缘的多个侧板，所述底板与所述侧板之间形成容置腔，所述电路板安装于所述容置腔内。
作为一种实施方式，所述支撑骨架形成于所述前壳朝向所述底板的表面上，所述第一柔性密封件与所述电路板及所述侧板密封连接。
作为一种实施方式，所述支撑骨架安装于所述前壳与所述电路板之间，所述第一柔性密封件与所述电路板、前壳及侧板密封连接。
作为一种实施方式，所述麦克风密封结构还包括第三柔性密封件，配置为密封连接所述音腔处的所述前壳与所述后壳。
作为一种实施方式，所述第二柔性密封件与所述第三柔性密封件一体成型制成。
此外，为实现上述目的，本实用新型还提供一种电子设备，所述电子设备具有麦克风密封结构，麦克风安装于电路板上，所述电路板上对应所述麦克风的位置形成有第一音孔，所述麦克风密封结构包括外壳及安装于所述外壳内的密封组件，所述外壳上形成有第二音孔，所述密封组件包括支撑骨架及安装于所述支撑骨架上的第一柔性密封件，所述第一柔性密封件与所述电路板及所述外壳密封连接，形成音腔，所述第一音孔与第二音孔均与所述音腔连通。
作为一种实施方式，所述电子设备还包括防尘网，所述防尘网安装于所述音腔内，并覆盖于所述第二音孔上。
作为一种实施方式，所述麦克风密封结构还包括第二柔性密封件，配置为密封连接所述音腔处的所述电路板与所述外壳。
作为一种实施方式，所述外壳包括前壳及与所述前壳相配合的后壳，所述后壳包括底板及连接与所述底板周缘的多个侧板，所述底板与所述侧 板之间形成容置腔，所述电路板安装于所述容置腔内。
作为一种实施方式，所述支撑骨架形成于所述前壳朝向所述底板的表面上，所述第一柔性密封件与所述电路板及所述侧板密封连接。
作为一种实施方式，所述支撑骨架安装于所述前壳与所述电路板之间，所述第一柔性密封件与所述电路板、前壳及侧板密封连接。
作为一种实施方式，所述麦克风密封结构还包括第三柔性密封件，配置为密封连接所述音腔处的所述前壳与所述后壳。
本实用新型的麦克风密封结构及电子设备，通过支撑骨架对第一柔性密封件进行支撑，限制第一柔性密封件的变形量，防止第一柔性密封件过度变形，进而有保证升了密封效果的稳定性。
附图说明
图1为本实用新型麦克风密封结构的一实施例的剖面结构示意图；
图2为图1所示的麦克风密封结构的前壳的立体结构示意图；
图3为图2所示的麦克风密封结构的前壳的立体剖面结构示意图。
本实用新型目的实现、功能特点及优点将结合实施例，参照附图做进一步说明。
具体实施方式
应当理解，此处所描述的具体实施例仅仅用以解释本实用新型，并不用于限定本实用新型。
本实用新型提供一种麦克风密封结构，参照图1至图3，在一实施例中，麦克风100安装于电路板200上，所述电路板200上对应所述麦克风100的位置形成有第一音孔202，所述麦克风密封结构包括外壳300及安装于所述外壳300内的密封组件400，所述外壳300上形成有第二音孔302，所述密封组件400包括支撑骨架420及安装于所述支撑骨架420上的第一柔性 密封件440，所述第一柔性密封件440与所述电路板200及所述外壳300密封连接，形成音腔500，所述第一音孔202与第二音孔302均与所述音腔500连通。在本实施例中，所述第一柔性密封件440通过所述支撑骨架420进行支撑，限制所述第一柔性密封件440的变形量，防止所述第一柔性密封件440过度变形，进而有保证升了密封效果的稳定性。
作为一种实施方式，在本实施例中，所述外壳300包括前壳320及与所述前壳320相配合的后壳340，所述后壳340包括底板342及连接与所述底板342周缘的多个侧板344，所述底板342与所述侧板344之间形成容置腔346，所述电路板200安装于所述容置腔346内。具体地，参照图2及图3，在本实施例中，所述麦克风100安装于所述电路板200面向所述底板342的表面上，所述支撑骨架420形成于所述前壳320朝向所述底板342的表面上；所述第一柔性密封件440套设于所述支撑骨架420的外围，并于所述电路板200及靠近所述麦克风100的侧板344密封连接，进而形成音腔500，所述第二音孔302形成于靠近所述麦克风100的侧板344上。当进行语音输入时，语音通过所述第一音孔202进入所述音腔500内，再通过所述第一音孔202输入至所述麦克风100。
作为一种实施方式，在本实施例中，由于所述支撑骨架420直接形成于所述前壳320上，有效简化了组装工艺，提升了组装效率。而为了组装所述第一柔性密封件440可以在所述支撑骨架420与所述前壳320的连接处形成倒钩423等卡合结构，以将所述第一柔性密封件440与所述支撑骨架420固定连接。
作为一种实施方式，在本实施例中，所述麦克风密封结构还包括第二柔性密封件600，配置为密封连接所述音腔500处的所述电路板200与所述外壳300；所述麦克风密封结构还包括，配置为密封连接所述音腔500处的所述前壳320与所述后壳340。具体地，参照图1，在本实施例中，所述第 二柔性密封件600与所述第三柔性密封件700由塑胶材料一体成型制成。组装时，所述第二柔性密封件600设于所述电路板200与所述外壳300(前壳320或后壳340)之间，所述第三柔性密封件700设于所述前壳320与所述后壳340之间，以实现前壳320、后壳340及电路板200之间的密封连接。
作为一种实施方式，在本实施例中，所述前壳320上形成有安装部322，所述安装部322上形成有避让部324，所述安装部322的远离所述前壳320的一端通过所述第二柔性密封件600抵靠于所述电路板200上，所述第三柔性密封件700设于所述前壳320与所述后壳340的连接处，进而实现所述前壳320、后壳340及电路板200之间的密封连接。所述避让部324对应所述第二音孔302设置，以实现所述第二音孔302与所述音腔500的连通，进而保证语音输入的效果。
作为一种实施方式，所述支撑骨架420还可以独立设置，再安装于所述外壳300内，同样可以实现上述技术效果，具体地，所述支撑骨架420安装于所述前壳320与所述电路板200之间，所述第一柔性密封件440与所述电路板200、前壳320及侧板344密封连接。
值得一提的是，所述第一柔性密封件440与所述支撑骨架420可以分体形成再通过卡合的方式进行固定安装，还可以通过双色注塑的方式一体成型，均可实现上述技术效果。
本实用新型还提供一种电子设备，在一实施例中，所述电子设备具有麦克风密封结构，所述麦克风密封结构包括前述图1至图3所示实施例中所有的技术方案，其详细结构可参照前述实施例，在此不做赘述。
作为一种实施方式，在本实施例中，所述电子设备还包括防尘网800，所述防尘网800安装于所述音腔500内，并覆盖于所述第二音孔302上，以避免灰尘等由所述第二音孔302落入所述音腔500内。
综上所述，本实用新型的麦克风密封结构及电子设备，通过支撑骨架 对第一柔性密封件进行支撑，限制第一柔性密封件的变形量，防止第一柔性密封件过度变形，进而有保证升了密封效果的稳定性。
以上仅为本实用新型的优选实施例，并非因此限制本实用新型的专利范围，凡是利用本实用新型说明书及附图内容所作的等效结构或等效流程变换，或直接或间接运用在其他相关的技术领域，均同理包括在本实用新型的专利保护范围内。
工业实用性
本实用新型实施例通过支撑骨架对第一柔性密封件进行支撑，限制第一柔性密封件的变形量，防止第一柔性密封件过度变形，进而有保证升了密封效果的稳定性。

Claims (14)

  1. 一种麦克风密封结构，麦克风安装于电路板上，所述电路板上对应所述麦克风的位置形成有第一音孔，所述麦克风密封结构包括外壳及安装于所述外壳内的密封组件，所述外壳上形成有第二音孔，所述密封组件包括支撑骨架及安装于所述支撑骨架上的第一柔性密封件，所述第一柔性密封件与所述电路板及所述外壳密封连接，形成音腔，所述第一音孔与第二音孔均与所述音腔连通。
  2. 如权利要求1所述的麦克风密封结构，其中，所述麦克风密封结构还包括第二柔性密封件，配置为密封连接所述音腔处的所述电路板与所述外壳。
  3. 如权利要求2所述的麦克风密封结构，其中，所述外壳包括前壳及与所述前壳相配合的后壳，所述后壳包括底板及连接与所述底板周缘的多个侧板，所述底板与所述侧板之间形成容置腔，所述电路板安装于所述容置腔内。
  4. 如权利要求3所述的麦克风密封结构，其中，所述支撑骨架形成于所述前壳朝向所述底板的表面上，所述第一柔性密封件与所述电路板及所述侧板密封连接。
  5. 如权利要求3所述的麦克风密封结构，其中，所述支撑骨架安装于所述前壳与所述电路板之间，所述第一柔性密封件与所述电路板、前壳及侧板密封连接。
  6. 如权利要求3所述的麦克风密封结构，其中，所述麦克风密封结构还包括第三柔性密封件，配置为密封连接所述音腔处的所述前壳与所述后壳。
  7. 如权利要求6所述的麦克风密封结构，其中，所述第二柔性密封件与所述第三柔性密封件一体成型制成。
  8. 一种电子设备，所述电子设备包括麦克风密封结构，麦克风安装于电路板上，所述电路板上对应所述麦克风的位置形成有第一音孔，所述麦克风密封结构包括外壳及安装于所述外壳内的密封组件，所述外壳上形成有第二音孔，所述密封组件包括支撑骨架及安装于所述支撑骨架上的第一柔性密封件，所述第一柔性密封件与所述电路板及所述外壳密封连接，形成音腔，所述第一音孔与第二音孔均与所述音腔连通。
  9. 如权利要求8所述的电子设备，其中，所述电子设备还包括防尘网，所述防尘网安装于所述音腔内，并覆盖于所述第二音孔上。
  10. 如权利要求8所述的电子设备，其中，所述麦克风密封结构还包括第二柔性密封件，配置为密封连接所述音腔处的所述电路板与所述外壳。
  11. 如权利要求10所述的麦克风密封结构，其中，所述外壳包括前壳及与所述前壳相配合的后壳，所述后壳包括底板及连接与所述底板周缘的多个侧板，所述底板与所述侧板之间形成容置腔，所述电路板安装于所述容置腔内。
  12. 如权利要求11所述的麦克风密封结构，其中，所述支撑骨架形成于所述前壳朝向所述底板的表面上，所述第一柔性密封件与所述电路板及所述侧板密封连接。
  13. 如权利要求11所述的麦克风密封结构，其中，所述支撑骨架安装于所述前壳与所述电路板之间，所述第一柔性密封件与所述电路板、前壳及侧板密封连接。
  14. 如权利要求11所述的麦克风密封结构，其中，所述麦克风密封结构还包括第三柔性密封件，配置为密封连接所述音腔处的所述前壳与所述后壳。
PCT/CN2015/084386 2015-05-08 2015-07-17 麦克风密封结构及电子设备 WO2016179896A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201520295776.0U CN204652665U (zh) 2015-05-08 2015-05-08 麦克风密封结构及电子设备
CN201520295776.0 2015-05-08

Publications (1)

Publication Number Publication Date
WO2016179896A1 true WO2016179896A1 (zh) 2016-11-17

Family

ID=54105371

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2015/084386 WO2016179896A1 (zh) 2015-05-08 2015-07-17 麦克风密封结构及电子设备

Country Status (2)

Country Link
CN (1) CN204652665U (zh)
WO (1) WO2016179896A1 (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111107454A (zh) * 2018-10-26 2020-05-05 深圳市三诺声智联股份有限公司 一种mic密封装配结构、安装方法及终端设备
CN112369000A (zh) * 2018-07-16 2021-02-12 Oppo广东移动通信有限公司 壳体组件及电子设备
CN112565950A (zh) * 2020-12-03 2021-03-26 上海闻泰信息技术有限公司 一种mic密封结构及移动终端

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6508483B2 (ja) * 2016-03-29 2019-05-08 パナソニックＩｐマネジメント株式会社 マイクロフォン
US10827618B2 (en) 2017-03-23 2020-11-03 Huawei Technologies Co., Ltd. Electronic device comprising an audio channel assembly
CN206596162U (zh) * 2017-04-06 2017-10-27 深圳市大疆创新科技有限公司 电子设备
CN107820180B (zh) * 2017-11-28 2020-09-04 Oppo广东移动通信有限公司 终端设备、扬声器组件及其组装方法
CN107995571B (zh) * 2017-12-11 2020-09-04 Oppo广东移动通信有限公司 电子装置、电声组件及其组装方法
CN108650597B (zh) * 2018-04-12 2020-06-05 Oppo广东移动通信有限公司 一种密封组件、壳体组件及电子设备
CN108513193A (zh) * 2018-04-17 2018-09-07 四川斐讯信息技术有限公司 一种基于麦克风的结构总成及音箱
CN108668186A (zh) * 2018-06-04 2018-10-16 深圳市沃特沃德股份有限公司 电子设备
CN110191607B (zh) * 2019-06-11 2021-06-18 Oppo（重庆）智能科技有限公司 电子设备
US11968488B2 (en) 2021-05-26 2024-04-23 Samsung Electronics Co., Ltd. Mic structure and electronic device including the same
CN114268683A (zh) * 2021-12-29 2022-04-01 上海创功通讯技术有限公司 一种电子设备

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007123293A1 (en) * 2006-04-21 2007-11-01 Bse Co., Ltd. Packaging structure of mems microphone
CN101296530A (zh) * 2007-04-29 2008-10-29 歌尔声学股份有限公司 硅电容传声器
CN201226592Y (zh) * 2008-06-23 2009-04-22 东莞泉声电子有限公司 软性线路板封装的硅麦克风
CN201995128U (zh) * 2011-03-28 2011-09-28 歌尔声学股份有限公司 Mems麦克风以及包含它的mems麦克风模组
CN102480538A (zh) * 2010-11-30 2012-05-30 比亚迪股份有限公司 一种具有麦克风的移动终端
US20130010988A1 (en) * 2007-11-20 2013-01-10 Otologics, Llc Implantable Electret Microphone
CN103329634A (zh) * 2011-01-12 2013-09-25 捷讯研究有限公司 具有用于麦克风的声学通道的印刷电路板
CN203775411U (zh) * 2014-03-31 2014-08-13 山东共达电声股份有限公司 一种mems麦克风
CN204131729U (zh) * 2014-09-29 2015-01-28 山东共达电声股份有限公司 一种mems麦克风

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007123293A1 (en) * 2006-04-21 2007-11-01 Bse Co., Ltd. Packaging structure of mems microphone
CN101296530A (zh) * 2007-04-29 2008-10-29 歌尔声学股份有限公司 硅电容传声器
US20130010988A1 (en) * 2007-11-20 2013-01-10 Otologics, Llc Implantable Electret Microphone
CN201226592Y (zh) * 2008-06-23 2009-04-22 东莞泉声电子有限公司 软性线路板封装的硅麦克风
CN102480538A (zh) * 2010-11-30 2012-05-30 比亚迪股份有限公司 一种具有麦克风的移动终端
CN103329634A (zh) * 2011-01-12 2013-09-25 捷讯研究有限公司 具有用于麦克风的声学通道的印刷电路板
CN201995128U (zh) * 2011-03-28 2011-09-28 歌尔声学股份有限公司 Mems麦克风以及包含它的mems麦克风模组
CN203775411U (zh) * 2014-03-31 2014-08-13 山东共达电声股份有限公司 一种mems麦克风
CN204131729U (zh) * 2014-09-29 2015-01-28 山东共达电声股份有限公司 一种mems麦克风

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112369000A (zh) * 2018-07-16 2021-02-12 Oppo广东移动通信有限公司 壳体组件及电子设备
CN112369000B (zh) * 2018-07-16 2023-08-29 Oppo广东移动通信有限公司 壳体组件及电子设备
CN111107454A (zh) * 2018-10-26 2020-05-05 深圳市三诺声智联股份有限公司 一种mic密封装配结构、安装方法及终端设备
CN112565950A (zh) * 2020-12-03 2021-03-26 上海闻泰信息技术有限公司 一种mic密封结构及移动终端

Also Published As

Publication number Publication date
CN204652665U (zh) 2015-09-16

Similar Documents

Publication Publication Date Title
WO2016179896A1 (zh) 麦克风密封结构及电子设备
US10398205B2 (en) Water resistant protective case for portable electronic device
JP5543948B2 (ja) 電子制御装置のシール構造
US8243458B2 (en) Waterproof structure for portable electronic device
US20090304221A1 (en) Loudspeaker structure of electronic device
CN203466107U (zh) 按键结构及具有按键结构的电子装置
KR20160144471A (ko) 방수 케이스
US8939284B2 (en) Cushion of folding portable electronic device and waterproof structure of folding portable electronic device
WO2014135035A1 (zh) 可拆卸式防尘网组件及采用其的电子装置
TWI554180B (zh) 電子產品防水塞
JP2012230994A (ja) 電子制御装置
SE1050723A1 (sv) Elektronikfodral
JP3194097U (ja) ケースアセンブリ
CN203984830U (zh) 电子设备
JP5766029B2 (ja) コネクタ
KR101561204B1 (ko) 전자기기용 케이스
CN205726426U (zh) 扬声器与麦克风的安装壳体及安装结构
KR102514592B1 (ko) 외부 포트를 갖는 스피커 인클로저용 먼지 보호
JP5738381B2 (ja) 電子制御装置
CN105792089A (zh) 扬声器与麦克风的安装壳体、制造方法及安装结构
CN205265905U (zh) 一种侧出音式微型扬声器模组
WO2016095107A1 (zh) 麦克风套件及电子装置
CN217088105U (zh) 一种mic麦克风的侧向安装结构及智能家居面板
CN204517888U (zh) 一种由开口式边框组接构成的手机保护结构
WO2019109416A1 (zh) 一种发声装置模组以及电子设备

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 15891599

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 15891599

Country of ref document: EP

Kind code of ref document: A1