WO2016175779A1

WO2016175779A1 - Cover for devices

Info

Publication number: WO2016175779A1
Application number: PCT/US2015/028181
Authority: WO
Inventors: Kuan-Ting Wu; Ya-Ting Yeh; Chienlung YANG
Original assignee: Hewlett Packard Development Co LP
Current assignee: Hewlett Packard Development Co LP
Priority date: 2015-04-29
Filing date: 2015-04-29
Publication date: 2016-11-03
Anticipated expiration: 2017-10-29

Abstract

Examples of a cover for a device are described herein. In an example, the cover includes a base structure having a first surface and a second surface. The first surface can face a heat source of the device and the second surface can be opposite to the first surface and can include a plurality of projected portions. Further, the cover can include a thermal radiation coating on the second surface of the base structure to achieve dissipation of heat from the heat source. In addition, the cover can include a heat insulation coating on an end surface of each of the plurality of projected portions of the second surface. The heat insulation coating is over the thermal radiation coating at the end surface of each of the projected portions.

Description

COVER FOR DEVICES BACKGROUND

[0001 ] During operation of a device, such as a laptop, a tablet personal computer (PC), and a mobile phone, the device may heat up. For example, prolonged use of the device may cause a component set of the electronic device to heat causing the device to be heated. The component set may include, for instance, a power source and a chipset of the device. Such heat generated by the device can be dissipated through the body of the device.

BRIEF DESCRIPTION OF FIGURES

[0002] The detailed description is described with reference to the accompanying figures. It should be noted that the description and figures are merely example of the present subject matter and are not meant to represent the subject matter itself.

[0003] Figure 1 illustrates a schematic of a device having a cover, in accordance with an example of the present subject matter.

[0004] Figure 2 illustrates a schematic of the cover, in accordance with an example of the present subject matter.

[0005] Figure 3A illustrates a sectional view of the cover, in accordance with an example of the present subject matter.

[0008] Figure 3B illustrates a sectional view of the cover, in accordance with another example of the present subject matter.

[0007] Figure 4A illustrates a sectional view of the cover, in accordance with yet another example of the present subject matter.

[0008] Figure 4B illustrates a sectional view of the cover, in accordance with one other example of the present subject matter.

[0009] Figure 5 illustrates a method for forming the cover, in accordance with an example of the present subject matter.

DETAILED DESCRIPTION

[0010] A component set of a device, such as a personal computer (PC), a tablet PC, and a mobile phone, may heat up during operation of the device. The heating up of the component set, such as a battery or a motherboard, may adversely affect operation of the device. Accordingly, such heat has to be carried away from the component set and dissipated into the atmosphere. Usually, the heat from the component set may be transferred to a body of the device for being carried away. Therefore, the body of the device may be designed for the purpose of dissipating the heat from the device. For instance, portions of the body in proximity of the component set, such as a cover of the device, may be designed for dissipation of the heat.

[001 1 ] Generally, the cover of the device is made of a thermally conducting material to achieve effective dissipation of the heat. However, having the cover made of such a material may cause the cover to quickly absorb considerable amount of the heat. As a result, having such a cover on the device may expose a user of the device to discomfort while handling the device and, in certain situations, may even cause heat related injuries. For example, a metallic casing of a processing unit of a PC may get heated during operation, and a toddler in the vicinity of the PC may touch the casing and may sustain heat burns.

[0012] On the other hand, to prevent discomfort or injuries to the user, the cover of the device can be fabricated from a thermally insulating material. While such a cover protects the user, it may not effectively dissipate the heat from the component set. As a result, the component set may overheat and may, in turn, affect the operation of the device.

[0013] The present subject matter describes a cover for a device, a device and a method for forming the cover, in accordance with aspects of the present subject matter. In an example, the cover can provide effective heat dissipation from the device when deployed at the device and, additionally, can prevent any discomfort to a user of the device.

[0014] According to an aspect, the cover includes a base structure, for instance, a body portion which forms the cover. The base structure can have a first surface and a second surface. In an example, when the cover is deployed, the first surface can be towards the device and can face a heat source, such as a component set, of the device. The second surface, opposite to the first surface, faces away from the heat source of the device. Further, the second surface can be responsible for dissipation of the heat from the component set of the device.

[0015] Accordingly, in an example, the second surface can include a plurality of projected portions. For instance, the second surface can have a plurality of projections protruding away from the second surface forming the projected portions. In another case, the second surface can have a plurality of depressions and the undepressed portions of the second surface can form the projected portions of the second surface. The projected portions can be provided for providing a large surface area of the second surface to enhance a surface for effective dissipation of the heat of the component set from the cover, in a deployed condition.

[0018] In addition, the second surface can be provided with a thermal radiation coating to achieve dissipation of the heat of the component set by radiation. The thermal radiation coating can complement the effect of large surface area of the second surface and further facilitate in effective heat dissipation from the cover. For example, the thermal radiation coating can provide for effective spreading of the heat along the surface of the second surface to prevent accumulation of the heat and formation of any hot spots on the second surface of the cover.

[0017] Further, on an end surface of each projected portion of the second surface, a heat insulation coating can be provided. In an example, the end surface of the projected portion can be a portion which comes in contact with or is potentially exposed to come in contact with a user, when the cover is deployed with the device and the device is being operated. Accordingly, when the device is operated or handled with the cover deployed thereon, the user comes in contact with the heat insulation coating instead of the hot second surface, for example, the thermal radiation coating on the second surface. In other words, the provision of the heat insulation coating prevents a user holding or operating the device on which the cover is deployed from coming in direct contact with the hot second surface.

[0018] In one example, the heat insulation coating can be provided over the thermal radiation coating. However, in another example, to save on material, and therefore, cost, the thermal radiation coating can be applied on few portions of the second surface and not applied on portions on which the heat insulation coating is to be provided. Accordingly, in said example, the thermal radiation coating can be applied over the second surface with the end surfaces of the projected portions, referred to as non-coated regions, left uncoated. Accordingly, at the non-coated regions, the heat insulation coating can be provided as being in direct contact with the second surface of the cover.

[0019] As is clear from the foregoing description, the cover, in accordance with the present subject matter, when deployed at the device, facilitates dissipation of heat from the device and provides suitable insulation at certain portions where the device can be held at or can come in contact of the user. Thus, in this example overheating of the component set, and therefore, of the surface of the device is minimized. As a result, in this example possible damage to the component set and occurrence of heat related injuries to the user can be prevented.

[0020] The above aspects are further described in the figures and associated description below, It should be noted that the description and figures merely illustrate the principles of the present subject matter. Therefore, various arrangements that encompass the principles of the present subject matter, although not explicitly described or shown herein, can be devised from the description and are included within its scope.

[0021 ] Figure 1 illustrates a schematic of a device 100, according to an example of the present subject matter. In an example, the device 100 can be an electronic device and can include a personal computer (PC), a laptop, a tablet PC, a mobile phone, and a charging device of the aforementioned devices. Further, the device 100 can include a component set 102 and a cover 104. The component set 102 can include, for example, a battery and a chipset, of the device 100 which can generate heat during operation of the device 100. In other- words, the component set 102 can be a heat source which can generate heat during the operation of the device 100. For example, when the device 100 is operated for long durations, the battery or power source of the device 100 can heat up and emit the heat. In another example, over prolonged use, the chipset of the device 100 can start emitting heat, for instance, due to internal resistance of various components of the chipset to passage of current through them.

[0022] Further, the cover 104 of the device 100 can be a part of a body of the device 100 and can be responsible for dissipation of the heat generated by the component set 102. In addition, the cover 104 can provide for convenience of use of the device 100 to the user without feeling any discomfort due to the heat. The cover 104 can have a first surface 1 12 to face the component set 102 and a second surface 1 14 opposite to the first surface 1 12 to dissipate the heat generated by the component set 102, for instance, to surroundings. According to an aspect, the cover 104 can be provided with certain structural features for the aforementioned purpose. For example, the cover 104 can have projected portions, for example, on the second surface 1 14, for providing a large surface area for dissipation of heat. In addition, the cover 104 can be provided with a coating to facilitate heat dissipation, and can be provided with another coating at selected portions to protect a user from coming in direct contact with a hot surface of the cover 104. The cover 104 is explained in detail with reference to Figure 2, Figure 3A, Figure 3B, Figure 4A, and Figure 4B.

[0023] Figure 2 illustrates a schematic of the cover 104, in accordance with an example of the present subject matter. As mentioned previously, the cover 104 can provide for dissipation of the heat generated by the component set 102 and prevents discomfort, due to the heat, to the user handling the device 100 during operation or operating the device 100. The cover 104 can be a detachable or non- detachable part of the body of the device 100. !n an example, the cover 104 can be a battery cover of a mobile device or a tablet PC. In another example, the cover 104 can be a bottom plate of a laptop.

[0024] In one example, the cover 104 can have a base structure 106, a thermal radiation coating 108, and a heat insulation coating 1 10. For instance, the base structure 106 can be a skeleton structure of the cover 104 over which the coatings can be applied. The base structure 108 can be comprised of a metal, a metal alloy, a polymer, carbon fiber, or a combination of such materials, to provide rigidity to the structure as well as effective heat dissipation properties. [0025] Further, the base structure 106 can be formed as having a plurality of projected portions (not shown) on a surface facing away from the component set 102 of the device 100 when deployed at the device 100. In an example, the base structure 106 can have the first surface 1 12 and the second surface 1 14, The first surface 1 12 can face the component set 102 in the deployed condition of the cover 104 at the device, and the second surface 1 14 can be opposite to the first surface 1 12. Accordingly, the second surface 1 14 can have the projected portions,

[0028] In one instance, the second surface 1 14 can be provided with a plurality of projections protruding away from the component set 102 to form the projected portions. In another instance, the second surface 1 14 can have a plurality of depressions. In such a case, the undepressed portions, or in other words, the portions of the second surface 1 14 which have not been depressed, can form the projected portions of the second surface 1 14. In another example, the second surface 1 14 can have a groove-like structure having a plurality of crests and troughs. For instance, the crests and troughs can be formed as linear or circular serrations or in the form of a honeycomb-like structure on the second surface 1 14. The projected portions on the second surface 1 14 can be formed as small structures, the size of the structures selected with the purpose of providing as large a surface area of the second surface 1 14 as possible.

[0027] In addition, the cover 104 can be provided with a coating for facilitating heat dissipation. In an example, the second surface 1 14 can be coated with the thermal radiation coating 108 to achieve dissipation of the heat generated by the component set 102 by radiation. The thermal radiation coating 108 can provide for spreading of the heat along the second surface 1 14, thereby preventing formation of hot spots on the second surface 1 14, Such prevention of formation of hot spots, in addition to facilitating in effective heat dissipation, protects the user of the device 100 from discomfort due to accumulation of heat at certain regions. In effect, the thermal radiation coating 108 can augment the provision of the projected portions on the second surface 1 14 to achieve effective heat dissipation from the cover 104 and can protect a user handling or operating the device 100 when the cover 104 is deployed at the device 100. [0028] In an example, the thermal radiation coating 108 can be a carbon- based coating. In said example, the thermal radiation coating 108 can include carbon nanotubes, graphite, and diamond. In one case, the thermal radiation coating 108 can be formed as a graphene-based coating. For instance, the thermal radiation coating 108 can be formed of suspended graphene and can have a thermal conductivity of approximately 5,300 W-m^~ -K^~1 at room temperature. In another case, the thermal radiation coating 108 can be formed of pyrolytic graphite and have a thermal conductivity of approximately 2,000 W-m^" -K^-1 at room temperature.

[0029] in addition, the cover 104 can be provided with further features to supplement the function of the thermal radiation coating 108 of preventing discomfort to the user while handling or operating the device 100. According to an aspect, the second surface 1 14 can be provided with the heat insulation coating 1 10. In an example, the heat insulation coating 1 10 can provided on a portion of the second surface 1 14 which comes in contact with or is potentially exposed to come in contact with the user, when the cover 104 is deployed with the device 100 and the device 100 is being operated.

[0030] For instance, the heat insulation coating 1 10 can be provided on an end surface (not shown) of each projected portion of the second surface 1 14. In such a case, the end surface of the projected portion can be a peripheral portion of the projected portions and can come in contact with the user when the cover 104 is deployed at the device 100. For instance, a tip portion of the protrusions forming the projected portions of the second surface 1 14 can be the end surfaces. Accordingly, when the device 100 is operated or handled with the cover 104 deployed thereon, the user does not come in direct contact with the hot second surface 1 14, for example, the thermal radiation coating 108, and instead comes in contact with the heat insulation coating 1 10.

[0031 ] In an example, the heat insulation coating 1 10 can comprise mineral-based insulators, fiber glass-based insulators, cellular glass-based insulators, cellulose-based insulators, polymeric foam-based insulators, polymeric resin-based insulators, silica-based insulators, or a combination of such insulators. For instance, the mineral-based insulators can include mineral wools, ceramic fiber, glass, and stone; the silica-based insulators can include, in portion or in entirety, silica, calcium silicate, or vermiculite; and the polymeric foam-based insulators can include eiastomeric foam, phenolic foam, polystyrene foam, and polyurethane foam,

[0032] Further, in one example, the heat insulation coating 1 10 can be provided at the end surfaces of the projected portions, over the thermal radiation coating 108. In other words, in said example, the thermal radiation coating 108 can be sandwiched between the second surface 1 14 and the heat insulation coating.

[0033] in another example, the heat insulation coating 1 10 can be provided as being in direct contact with the second surface 1 14 of the cover 104. In said example, the thermal radiation coating 108 can be selectively applied on few portions of the second surface 1 14 and not applied on portions on which the heat insulation coating 1 10 is to be coated. Such portions of the second surface 1 14 which are not coated with the thermal radiation coating 108 can be referred to as non-coated regions of the second surface 1 14. In said example, the end surfaces of the projected portions can be left devoid of the thermal radiation coating 108, or in other words, can be the non-coated regions of the second surface 1 14. Further, as mentioned above, at the non-coated regions, i.e., at the end surfaces of the projected portions, the heat insulation coating 1 10 can be coated to be in direct contact with the second surface 1 14.

[0034] Figure 3A illustrates a sectional view of the cover 104 of the device 100, in accordance with an example of the present subject matter, in said example, the projected portions 300 of the second surface 1 14 of the cover 104 are formed as a plurality of protrusions 302 extending from the second surface 1 14. In addition, the heat insulation coating 1 10 is coated over the thermal radiation coating 108, or as mentioned above, the thermal radiation coating 108 is between the end surface of the projected portions 300 and the heat radiation coating 1 10.

[0035] Further, Figure 3B illustrates the sectional view of the cover 104, in accordance with another example of the present subject matter. In said example, the second surface 1 14 has a plurality of depressions 304 formed thereon. Accordingly, in said example, the projected portions 300 of the second surface 1 14 are formed by the undepressed portions 308 of the second surface 1 14. The thermal radiation coating 108 and the heat insulation coating 1 10 are provided over the second surface 1 14 in the same manner as described with reference to Figure 3A.

[0038] Figure 4A illustrates the sectional view of the cover 104, in accordance with yet other example of the present subject matter. In said example, as explained with reference to Figure 3A, the second surface 1 14 has the plurality of protrusions 302 extending from the second surface 1 14, the plurality of protrusions 302 forming the projected portions 300 of the second surface 1 14. Further, in said example, the heat insulation coating 1 10 can be coated on the second surface 1 14 to be in direct contact with the second surface 1 14 of the cover 104. In said example, the thermal radiation coating 108 can be selectively applied on few portions of the second surface 1 14. Few portions on which the heat insulation coating 1 10 is to be coated, for example, the end surfaces of the projected portions 300, referred to as non-coated regions, can be left uncoated with the thermal radiation coating 108. As can be seen from Figure 4A, at the non- coated regions, the heat insulation coating 1 10 can be provided to be in directly on the second surface 1 14.

[0037] Figure 4B illustrates the sectional view of the cover 104, in accordance with one other example of the present subject matter, !n said example, similar to the example in Figure 3B, the second surface 1 14 is formed as having a plurality of depressions 304. Accordingly, in said example, the undepressed portions 306 of the second surface 1 14 form the projected portions 300 of the second surface 1 14. Further, the thermal radiation coating 108 is selectively provided on the second surface 1 14 and the heat insulation coating 1 10 is provided in direct contact with the second surface 1 14, in the same manner as described with reference to Figure 4A.

[0038] Figure 5 illustrates a method 500 for forming the cover 104 for the device 100, in accordance with an example of the present subject matter. The cover 104 can achieve dissipation of heat generated during the operation of the device 100, and at the same time, protect any harm or discomfort to the user handling or operating the device 100, The order in which the method 500 is described is not intended to be construed as a limitation, and any number of the described method blocks can be combined in any appropriate order to execute the method 500 or another similar method. Additionally, individual blocks may be deleted from the method 500 without departing from the spirit and scope of the subject matter described herein.

[0039] Referring to block 502, the base structure 106 of the cover 104 is formed, the base structure 106 having the first surface 1 12 and the second surface 1 14. The first surface 1 12 can face the component set 102, acting as a heat source, of the device 100 in a deployed condition of the cover 104 on the device 100. Further, the second surface 1 14 can be opposite to the first surface 1 12 and can be responsible for dissipation of the heat. Accordingly, in an example, the second surface 1 14 can include the projected portions 300. In one case, the projected portions can be formed by a plurality of projections 302 protruding from the second surface 1 14. In another case, the second surface 1 14 can have a plurality of depressions 304 and the undepressed portions of the second surface 1 14 can form the projected portions 300.

[0040] In an example, the base structure 108 can comprise a metal, a metal alloy, a polymer, carbon fiber, or a combination of such materials, to provide rigidity to the structure as well as effective heat dissipation properties. For instance, in case the base structure 106 comprises a metal or a metal alloy, the base structure 106 can be fabricated using die casting. In case the base structure 106 comprisesa plastic material, the base structure 106 can be made by injection molding or using a computer-numerical control (CMC) machine. Further, in case the base structure 106 comprises carbon fiber, the base structure 106 can be fabricated by compression molding.

[0041 ] At block 504, the thermal insulation coating 108 is selectively applied over the second surface 1 14 of the base structure 106 leaving few portions or the entire end surface of each projected portion uncoated, the uncoated portions being referred to as non-coated regions. In other words, the thermal insulation coating 108 is selectively applied over the second surface 1 14, and the end surface of the projected portions having a non-coated region after the thermal radiation coating 108 has been applied. In an example, in case the projected portions 300 are formed as protrusions 302, a tip portion of the protrusion 302 can be the end surfaces.

[0042] In another case, the thermal radiation coating 108 can be applied on the entire second surface 1 14. In such a case, the end surface of the projected portion does not have any non-coated region.

[0043] In example, the thermal radiation coating 108 can be applied using insert molding or using out-mold decoration, for instance, when the base structure 106 is made of a metal, a metal alloy, or of plastic. Further, in case the base structure 106 is made of carbon fiber, the thermal radiation coating 108 can be applied using out-mold decoration.

[0044] Further, at block 506, the heat insulation coating 1 10 is provided on the non-coated regions at the end surfaces, the heat insulation coating 1 10 being in direct contact with the end surfaces, or the second surface 1 14.

[0045] In another example, as mentioned above, where the thermal radiation coating 108 is applied over the entire second surface 1 14, the heat insulation coating 1 10 can be applied over the thermal radiation coating 108.

[0046] Although examples for the cover 104 for the device 100 and the method 500 for forming the cover 104 have been described in language specific to structural features and/or methods, it is to be understood that the appended claims are not limited to the specific features or methods described. Rather, the specific features and methods are disclosed as examples for the cover 104 and the method 500 for forming the cover 104.

Claims

What is claimed:

1 . A cover for a device, the cover comprising:

a base structure comprising,

a first surface to face a heat source of the device; and a second surface opposite the first surface, the second surface comprising a plurality of projected portions;

a thermal radiation coating on the second surface of the base structure to achieve dissipation of heat from the heat source; and

a heat insulation coating on an end surface of each of the plurality of projected portions of the second surface, wherein the heat insulation coating is disposed over the thermal radiation coating at the end surface of each of the projected portions.

2. The cover as claimed in claim 1 , wherein the second surface comprises a plurality of depressions, undepressed portions of the second surface forming the plurality of projected portions of the second surface.

3. The cover as claimed in claim 1 , wherein the thermal radiation coating is a carbon-based coating.

4. The cover as claimed in claim 1 , wherein the thermal radiation coating is a graphene-based coating.

5. The cover as claimed in claim 1 , wherein the heat insulation coating comprises one of mineral, mineral wool, fiber glass, cellular glass, cellulose, polymeric foam, polymeric resin, silica-based insulators, and a combination thereof.

6. The cover as claimed in claim 1 , wherein the base structure comprises one of a metal, a metal alloy, a polymer, carbon fiber, and a combination thereof.

7. A device comprising:

a component set generating heat during operation of the device; a cover to dissipate heat generated by the component set, the cover comprising,

a base structure comprising,

a first surface to face the component set of the device; and a second surface opposite to the first surface, the second surface comprising a plurality of projected portions; a thermal radiation coating on the second surface of the base structure to achieve dissipation, of the heat generated, wherein an end surface of each of the plurality of projected portions of the second surface has a non-coated region; and

a heat insulation coating on the non-coated region of the end surface of each of the plurality of projected portions of the second surface, to come in contact with a user to hold the device at the cover.

8. The device as claimed in claim 7, wherein the second surface comprises a plurality of depressions, undepressed portions of the second surface forming the projected portions of the second surface.

9. The device as claimed in claim 7, wherein the thermal radiation coating comprises carbon.

10. The device as claimed in claim 7, wherein the thermal radiation coating comprises graphene.

1 1 . The device as claimed in claim 7, wherein the heat insulation coating comprises one of mineral-based insulators, fiber glass-based insulators, cellular glass-based insulators, cellulose-based insulators, polymeric foam-based insulators, polymeric resin-based insulators, silica-based insulators, and a combination thereof.

12. A method comprising:

forming a base structure of a cover for a device, wherein the base structure comprises a first surface to face a heat source of the device and a second surface opposite to the first surface, the second surface comprising a plurality of projected portions; applying, selectively, a thermal radiation coating on the second surface of the base structure, wherein an end surface of each of the plurality of projected portions of the second surface has a non-coated region left uncoated; and

providing a heat insulation coating on the non-coated region of the end surface of each of the projected portions of the second surface, wherein the heat insulation coating is in direct contact with the second surface at the non-coated region of the end surface of each of the plurality of projected portions.

13. The method as claimed in claim 12, wherein the forming the base structure comprises forming the second surface having a plurality of depressions, undepressed portions of the second surface forming the projected portions of the second surface.

14. The method as claimed in claim 12, wherein the forming the base structure comprises forming the second surface having a plurality of projections protruding away from the second surface, a tip portion of each of the projections forming the end surface of the projected portions.

15. The method as claimed in claim 12, wherein the applying the thermal radiation coating is achieved by one of insert molding and out-moid decoration.